Array antenna device

Abstract

This array antenna device comprises: a plurality of excitation element substrates (10) each having a plurality of excitation elements (11); and one non-excitation element substrate (20) having a plurality of non-excitation elements (21). All the excitation element substrates (10) are disposed to face the one non-excitation element substrate (20), and all the excitation element substrates (10) and the one non-excitation element substrate (20) are disposed so that one excitation element (11) and one non-excitation element (21) face each other.

Description

Array antenna device

[0001] The present disclosure relates to an array antenna device.

[0002] Patent Document 1 discloses an array antenna device having a plurality of excitation elements for transmitting and receiving radio waves. The array antenna device disclosed in Patent Document 1 includes a wiring substrate having a plurality of excitation elements integrally provided on an excitation element substrate (semiconductor substrate), and a dielectric substrate having a plurality of parasitic elements.

[0003] Patent No. 6333185

[0004] In the array antenna device disclosed in Patent Document 1, the yield of the semiconductor substrate may decrease as the number of excitation elements on one excitation element substrate increases.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to provide an array antenna device that can improve the yield of excitation element substrates.

[0006] The array antenna device according to the present disclosure comprises a plurality of excitation element substrates, each having a plurality of excitation elements, and one non-excitation element substrate having a plurality of non-excitation elements, with all of the excitation element substrates arranged opposite one non-excitation element substrate, and all of the excitation element substrates and one non-excitation element substrate being arranged such that one excitation element and one non-excitation element face each other.

[0007] According to the present disclosure, by providing multiple drive element substrates for one non-drive element substrate, the number of drive elements included in one drive element substrate can be reduced, thereby improving the yield of drive element substrates.

[0008] 10 is a plan view of an array antenna device according to a first embodiment. FIG. 11 is a cross-sectional view taken along the arrows A-A in FIG. 1. FIG. 12 is a cross-sectional view taken along the arrows B-B in FIG. 1. FIG. 13 is a plan view of an excited element substrate in the array antenna device according to the first embodiment. FIG. 14 is a plan view of a parasitic element substrate in the array antenna device according to the first embodiment. FIG. 15 is a perspective view showing a joining structure between an excited element substrate and a parasitic element substrate. FIG. 16 is a plan view of a parasitic element substrate in an array antenna device according to a second embodiment. FIG. 17 is a perspective view showing a joining structure between an excited element substrate and a parasitic element substrate. FIG. 18 is a plan view of an array antenna device according to a third embodiment. FIG. 19 is a cross-sectional view taken along the arrows C-C in FIG. 10. FIG. 19 is a plan view of an excited element substrate in the array antenna device according to the third embodiment. FIG. 19 is a plan view of a parasitic element substrate in the array antenna device according to the third embodiment. FIG. 20 is a plan view of another excited element substrate in the array antenna device according to the third embodiment. FIG. 21 is a plan view of another parasitic element substrate in the array antenna device according to the third embodiment. FIG. 10 is a plan view of an excited element substrate in an array antenna apparatus according to embodiment 4. FIG. 11 is a plan view of a parasitic element substrate in an array antenna apparatus according to embodiment 4. FIG. 12 is a plan view of another parasitic element substrate in an array antenna apparatus according to embodiment 4. FIG. 13 is a plan view of an excited element substrate in an array antenna apparatus according to embodiment 5. FIG. 14 is a plan view of a parasitic element substrate in an array antenna apparatus according to embodiment 5. FIG. 15 is a plan view of another parasitic element substrate in an array antenna apparatus according to embodiment 5. FIG. 16 is a plan view of an excited element substrate in an array antenna apparatus according to embodiment 6. FIG. 17 is a plan view of a parasitic element substrate in an array antenna apparatus according to embodiment 6. FIG. 18 is a plan view of another parasitic element substrate in an array antenna apparatus according to embodiment 6.

[0009] In order to explain the present disclosure in more detail, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0010] First Embodiment An array antenna apparatus according to a first embodiment will be described with reference to FIGS.

[0011] First, the configuration of an array antenna device according to a first embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a plan view of the array antenna device according to the first embodiment. Fig. 2 is a cross-sectional view taken along the line A-A in Fig. 1. Fig. 3 is a cross-sectional view taken along the line B-B in Fig. 1. Note that Fig. 1 is a view in which a part of the parasitic element substrate 20 is cut away in order to clarify the positions of the cross-sectional lines A-A and B-B.

[0012] 1 to 3, the array antenna apparatus according to the first embodiment includes a plurality of excitation element substrates 10, a smaller number of non-excitation element substrates 20 than the number of excitation element substrates 10, and a carrier 40 on which all of the excitation element substrates 10 are provided on the same surface. The same surface of the carrier 40 on which all of the excitation element substrates 10 are provided is, for example, the upper surface.

[0013] 1 to 3 show examples of an array antenna device including two excited element substrates 10 and one passive element substrate 20. As described above, the number of excited element substrates 10 is two, but it may be two or more. Also, the number of passive element substrates 20 is one, but it may be one less than the number of excited element substrates 10.

[0014] Next, the configuration of the excitation element substrate 10 will be described with reference to FIGS.

[0015] As shown in Figures 1 to 3, the excitation element substrate 10 has a plurality of excitation elements 11, a first ground conductor 12, a rewiring layer 13, an external connection portion 14, a resin mold 15, a radio frequency integrated circuit 16, and a plurality of power supply lines 17.

[0016] The radio frequency integrated circuit 16 is a circuit that enables the excitation element 11 to transmit and receive radio waves. The resin mold 15 is used to fix the radio frequency integrated circuit 16 to the carrier 40. Specifically, the resin mold 15 and the radio frequency integrated circuit 16 are provided on the upper surface of the carrier 40. At this time, the resin mold 15 is provided so as to closely contact the outer surface of the radio frequency integrated circuit 16 without any gaps and to cover the periphery thereof. The radio frequency integrated circuit 16 is formed on a semiconductor substrate (not shown) using, for example, semiconductor process technology.

[0017] The rewiring layer 13 is provided on the upper surface of the resin mold 15. The plurality of excitation elements 11 and the first ground conductor 12 are provided on the upper surface of the rewiring layer 13.

[0018] The drive element 11 is, for example, circular. The shape of the drive element 11 is not limited to a circle, and may be an ellipse, a rectangle, a triangle, a star, or the like. There may be one or more drive elements 11. Note that FIG. 2 shows an example in which one drive element substrate 10 has four drive elements 11.

[0019] The first ground conductor 12 is made of a conductive material and is disposed so as to surround the periphery of the excitation element 11. That is, the excitation element 11 and the first ground conductor 12 are not in electrical contact with each other and are not electrically connected to each other. The upper surface of the redistribution layer 13 is exposed in a ring shape between the excitation element 11 and the first ground conductor 12.

[0020] The external connection part 14 relays transmission and reception of signals or power supply to the radio frequency integrated circuit 16. The external connection part 14 is provided on the upper surface of the first ground conductor 12. That is, the first ground conductor 12 and the external connection part 14 are electrically connected and conductive to each other. The external connection part 14 is connected to a power source (not shown).

[0021] A plurality of power supply lines 17 are provided across the rewiring layer 13 and the resin mold 15. The power supply lines 17 electrically connect each of the drive elements 11 and the radio frequency integrated circuit 16, and also connect the external connection portion 14 and the radio frequency integrated circuit 16. Therefore, the radio frequency integrated circuit 16 is fed with power via the external connection portion 14 and the power supply lines 17. Furthermore, the radio frequency integrated circuit 16 transmits and receives signals to and from each of the drive elements 11 via the power supply lines 17.

[0022] Here, the redistribution layer 13 has a multilayer structure in which, for example, an insulating layer and a conductor layer are stacked. The insulating layer is made of polyimide or the like. The conductor layer is made of copper, gold, or the like. In the array antenna device according to the first embodiment, the above-mentioned excitation element 11, first ground conductor 12, external connection portion 14, and feed line 17 are formed by etching copper foil on the surface of the insulating layer in the redistribution layer 13.

[0023] Therefore, in the array antenna device according to the first embodiment, the redistribution layer 13 can be provided on the radio frequency integrated circuit 16 using semiconductor process technology. Therefore, in the array antenna device according to the first embodiment, the length of the feed line 17 connecting between the drive element 11 and the radio frequency integrated circuit 16 can be shortened. As a result, the array antenna device according to the first embodiment can reduce the transmission loss of high frequencies such as millimeter waves or terahertz waves. Furthermore, in the array antenna device according to the first embodiment, the thickness of the drive element substrate 10 can be reduced by shortening the length of the feed line 17. Therefore, the array antenna device according to the first embodiment can be made smaller overall.

[0024] The arrangement of the radiated elements 11 will be described with reference to Fig. 4. Fig. 4 is a plan view of the radiated element substrate 10 in the array antenna apparatus according to the first embodiment.

[0025] As shown in Fig. 4, the plurality of excitation elements 11 are arranged in a row along a first direction D1 so that their centers or centers of gravity are aligned in a straight line. The plurality of excitation elements 11 are also arranged at equal intervals d in the first direction D1. The interval d is set appropriately depending on, for example, the application of the array antenna device, the electrical properties of the various materials constituting the array antenna device, or the frequency band to be used. The interval d is preferably equal to or shorter than half the wavelength of the frequency to be used.

[0026] Here, the two excitation element substrates 10 are arranged along the first direction D1. At this time, the two excitation element substrates 10 are arranged with their opposing ends in the first direction D1 as the boundary, and the distance between the excitation element 11 of one excitation element substrate 10 and the excitation element 11 of the other excitation element substrate 10 is also "d".

[0027] Furthermore, when the number of excitation elements 11 in the entire array antenna apparatus according to the first embodiment is constant, the array antenna apparatus according to the first embodiment can reduce the size of the radio frequency integrated circuit 16 included in one excitation element substrate 10 by reducing the number of excitation elements 11 in one excitation element substrate 10. Therefore, the array antenna apparatus according to the first embodiment can improve the yield of the excitation element substrates 10.

[0028] Next, the configuration of the parasitic element substrate 20 will be described with reference to Fig. 2, Fig. 3, and Fig. 5. Fig. 5 is a plan view of the parasitic element substrate 20 in the array antenna apparatus according to the first embodiment. Note that Fig. 5 illustrates the surface of the parasitic element substrate 20 on which the parasitic elements 21 are formed.

[0029] 2, 3, and 5, the parasitic element substrate 20 has a plurality of parasitic elements 21, a second ground conductor 22, and a dielectric 23. One parasitic element substrate 20 corresponds to two excited element substrates 10. One excited element substrate 10 and two parasitic element substrates 20 are arranged such that one excited element 11 and one parasitic element 21 face each other.

[0030] The plurality of parasitic elements 21 and the second ground conductor 22 are provided on the lower surface of the dielectric 23 .

[0031] As shown in FIG. 5 , the multiple parasitic elements 21 are arranged in a row along the first direction D1 so that their centers or centers of gravity are aligned in a straight line. The multiple parasitic elements 21 are also arranged at equal intervals d in the first direction D1. The parasitic elements 21 are, for example, circular. The shape of the parasitic elements 21 is not limited to a circle, and may be elliptical, rectangular, triangular, star-shaped, or the like. It is preferable that the shape and size of the parasitic element 11 are the same as those of the parasitic elements 21. Note that FIG. 5 shows an example of a parasitic element substrate 20 having eight parasitic elements 21. Such multiple parasitic elements 21 are formed collectively, for example, by etching copper foil on the underside of the dielectric 23.

[0032] The second ground conductor 22 is made of a conductive material. The second ground conductor 22 is arranged to surround the multiple parasitic elements 21. That is, the parasitic elements 21 and the second ground conductor 22 are not in electrical contact with each other and are not electrically connected to each other. Specifically, the second ground conductor 22 is provided on both the left and right sides of the multiple parasitic elements 21 arranged in the first direction D1. The second ground conductor 22 has a rectangular shape that extends linearly along the first direction D1. As will be described in detail later, the second ground conductor 22 is electrically connected to the first ground conductor 12 of the excitation element substrate 10 and is electrically connected to each other.

[0033] The dielectric 23 is made of a material such as a liquid crystal polymer, PTFE, or glass substrate, which is used in high-frequency substrates. The dielectric 23 is preferably made of a material with a relatively small dielectric dissipation factor to reduce radio wave attenuation. The dielectric dissipation factor of the dielectric 23 is, for example, about 0.002. Furthermore, the dielectric 23 is preferably relatively thin to reduce radio wave attenuation. The thickness of the dielectric 23 is, for example, 100 μm.

[0034] Next, the bonding structure between the drive element substrate 10 and the parasitic element substrate 20 will be described with reference to Fig. 6. Fig. 6 is a perspective view showing the bonding structure between the drive element substrate 10 and the parasitic element substrate 20. Note that Fig. 6 only illustrates the vicinity of one drive element 11 on the drive element substrate 10 and one parasitic element 21 on the parasitic element substrate 20, which are opposed to each other.

[0035] 6, the drive element substrate 10 and the non-drive element substrate 20 are bonded to each other using a bonding material 31. At this time, all the drive element substrates 10 are arranged facing one non-drive element substrate 20. Furthermore, all the drive element substrates 10 and one non-drive element substrate 20 are arranged so that one drive element 11 and one non-drive element 21 face each other. In other words, the number of non-drive elements 21 included in one non-drive element substrate 20 is greater than the number of drive elements 11 included in one drive element substrate 10.

[0036] The bonding material 31 is interposed between the first ground conductor 12 and the second ground conductor 22. At this time, a gap is formed between the opposing excitation element 11 and the parasitic element 21. In other words, the opposing excitation element 11 and the parasitic element 21 are not in contact with each other. It is preferable that the first ground conductor 12 and the second ground conductor 22 are at the same electrical potential. The bonding material 31 is, for example, a double-sided adhesive sheet.

[0037] Here, when the thickness (conductor thickness) of the excited element 11 is the same as the thickness of the first ground conductor 12 and the thickness (conductor thickness) of the parasitic element 21 is the same as the thickness of the second ground conductor 22, the distance between the excited element 11 and the parasitic element 21 is determined only by the thickness of the bonding material 31, so that variations in antenna performance are suppressed. Also, there is a gap between the excited element 11 and the parasitic element 21 that face each other. Therefore, the array antenna device according to the first embodiment can suppress radio wave loss and obtain good antenna characteristics.

[0038] Since one parasitic element substrate 20 has all the parasitic elements 21, the relative positions of all the parasitic elements 21 can be maintained with the manufacturing precision of the parasitic element substrate 20. Furthermore, the array antenna device according to the first embodiment employs a double patch antenna structure in which the excited elements 11 and the parasitic elements 21 face each other, and radio waves are mainly emitted or incident on the parasitic element 21 side. Therefore, the array antenna device according to the first embodiment can reduce the influence of positional errors that occur when multiple excited element substrates 10 are arranged.

[0039] The bonding material 31 may have a length in the first direction equal to or less than the interval d and be provided for each drive element 11. The bonding material 31 may also have a length in the first direction equal to the length in the first direction of the drive element substrate 10 and be provided for each drive element substrate 10. Furthermore, the bonding material 31 may have a length in the first direction equal to the length in the first direction of all the drive element substrates 10 arranged along the first direction D1 and be provided across all the drive element substrates 10.

[0040] As described above, the array antenna device according to the first embodiment includes a plurality of excited element substrates 10, each having a plurality of excited elements 11, and one parasitic element substrate 20 having a plurality of parasitic elements 21. All of the excited element substrates 10 are arranged opposite one parasitic element substrate 20, and all of the excited element substrates 10 and one parasitic element substrate 20 are arranged such that one excited element 11 faces one parasitic element 21. Therefore, the array antenna device according to the first embodiment can improve the yield of the excited element substrates 10. As a result, the array antenna device according to the first embodiment can reduce manufacturing costs.

[0041] In the array antenna device according to the first embodiment, the number of parasitic elements 21 included in one parasitic element substrate 20 is greater than the number of excited elements 11 included in one excited element substrate 10. Therefore, the array antenna device according to the first embodiment can further improve the yield of the excited element substrates 10.

[0042] In the array antenna apparatus according to the first embodiment, the excited elements 11 and the parasitic elements 21 are arranged at equal intervals in the first direction D1, so that the array antenna apparatus according to the first embodiment can suppress misalignment between the excited elements 11 and the parasitic elements 21.

[0043] In the array antenna device according to the first embodiment, the excitation element substrate 10 includes a semiconductor substrate having a radio frequency integrated circuit 16 for transmitting and receiving radio waves, a resin mold 15 for fixing the semiconductor substrate, a rewiring layer 13 provided on the surface of the resin mold 15, an external connection portion 14 provided on the surface of the rewiring layer 13 for transmitting and receiving signals to and from the semiconductor substrate or relaying power supply, and a feed line 17 for connecting the excitation elements 11 and the semiconductor substrate. Therefore, in the array antenna device according to the first embodiment, the number of excitation elements 11 included in the excitation element substrate 10 is reduced, thereby enabling the semiconductor substrate and the radio frequency integrated circuit 16 to be miniaturized.

[0044] The array antenna apparatus according to the first embodiment includes a first ground conductor 12 provided on the surface of an excited element substrate 10 and not electrically connected to the excited element 11, and a second ground conductor 22 provided on the surface of a non-excited element substrate 20 and not electrically connected to the non-excited element 21, and the first ground conductor 12 and the second ground conductor 22 are joined together. Therefore, the array antenna apparatus according to the first embodiment can form a gap between the excited element 11 and the non-excited element 21 that face each other. As a result, the array antenna apparatus according to the first embodiment can suppress radio wave loss between the excited element 11 and the non-excited element 21 that face each other, and can obtain good antenna characteristics.

[0045] In the array antenna apparatus according to the first embodiment, the first ground conductor 12 is provided so as to surround the periphery of the excited element 11, and the second ground conductor 22 is provided so as to sandwich the parasitic element 21. Therefore, in the array antenna apparatus according to the first embodiment, the excited element substrate 10 and the parasitic element substrate 20 can be joined in the vicinity of the mutually opposing excited element 11 and the parasitic element 21. As a result, the array antenna apparatus according to the first embodiment can suppress misalignment between the mutually opposing excited element 11 and the parasitic element 21.

[0046] Second Embodiment An array antenna apparatus according to a second embodiment will be described with reference to Fig. 7 to Fig. 9. Components having the same functions as those described in the first embodiment will be denoted by the same reference numerals, and descriptions thereof will be omitted.

[0047] Fig. 7 is a plan view of a parasitic element substrate 20A in an array antenna apparatus according to embodiment 2. Fig. 7 illustrates the surface of the parasitic element substrate 20A on which the parasitic elements 21 are formed.

[0048] As shown in Fig. 7, the array antenna apparatus according to the second embodiment includes a parasitic element substrate 20A instead of the parasitic element substrate 20 of the array antenna apparatus according to the first embodiment shown in Fig. 5. The number of the parasitic element substrates 20A is, for example, one, which is less than the number of the parasitic element substrates 10.

[0049] The parasitic element substrate 20A has a plurality of parasitic elements 21, a second ground conductor 22, and a dielectric 23. The excited element substrate 10 and the parasitic element substrate 20A are arranged such that one excited element 11 and one parasitic element 21 face each other.

[0050] The plurality of parasitic elements 21 and the second ground conductor 22 are provided on the lower surface of the dielectric 23. The second ground conductor 22 is provided so as to surround the periphery of each parasitic element 21. In other words, the parasitic elements 21 and the second ground conductor 22 are not in electrical contact with each other and are not conductive to each other. The lower surface of the dielectric 23 is exposed in an annular shape between the parasitic elements 21 and the second ground conductor 22.

[0051] Fig. 8 is a perspective view showing the bonding structure between the drive element substrate 10 and the non-drive element substrate 20A. As shown in Fig. 8, the drive element substrate 10 and the non-drive element substrate 20A are bonded to each other using a bonding material 32. The bonding material 32 is interposed between the first ground conductor 12 and the second ground conductor 22. The bonding material 32 is, for example, a double-sided adhesive sheet.

[0052] The bonding material 32 is provided so as to surround the periphery of the excited element 11 and the parasitic element 21. In this case, the range surrounded by the bonding material 32 extends beyond the annular gap between the excited element 11 and the first ground conductor 12 and the annular gap between the parasitic element 21 and the second ground conductor 22. In other words, the range surrounded by the bonding material 32 does not extend beyond the annular gap between the excited element 11 and the first ground conductor 12 and the annular gap between the parasitic element 21 and the second ground conductor 22.

[0053] If the thickness of the parasitic element substrate 20A is relatively thin, the parasitic element substrate 20A may bend and deform, changing the amount of gap between the excited element 11 and the parasitic element 21, which may result in degradation of antenna performance. In contrast, the array antenna device according to the second embodiment provides the bonding material 32 as close as possible to the excited element 11 and the parasitic element 21, thereby suppressing the curvature and deformation of the parasitic element substrate 20A. Therefore, the array antenna device according to the second embodiment can suppress degradation of antenna performance caused by the curvature and deformation of the parasitic element substrate 20A.

[0054] 9 is a perspective view showing another joining structure between the drive element substrate 10 and the parasitic element substrate 20A. The connection structure shown in FIG. 9 has a plurality of copper pillars 33 instead of the joining material 32. The copper pillars 33 are formed in a columnar shape from copper. The plurality of copper pillars 33 are arranged in a ring shape so as to surround the periphery of the drive element 11 and the parasitic element 21. The axial direction of the copper pillars 33 is perpendicular to the first direction D1. One end of the copper pillars 33 is connected to the first ground conductor 12. The other end of the copper pillars 33 is connected to the second ground conductor 22.

[0055] The array antenna device of embodiment 2 has copper pillars 33 as metal members for joining, but instead of the copper pillars 33, gold bumps or solder balls may be used to join the excitation element substrate 10 and the non-excitation element substrate 20A.

[0056] As described above, the array antenna device according to the second embodiment includes a plurality of excited element substrates 10 each having a plurality of excited elements 11, and one non-excited element substrate 20A having a plurality of non-excited elements 21. All of the excited element substrates 10 are arranged facing one non-excited element substrate 20A, and all of the excited element substrates 10 and one non-excited element substrate 20A are arranged such that one excited element 11 faces one non-excited element 21. Therefore, the array antenna device according to the second embodiment can improve the yield of the excited element substrates 10. As a result, the array antenna device according to the second embodiment can reduce manufacturing costs.

[0057] In the array antenna apparatus according to the second embodiment, the first ground conductor 12 is provided so as to surround the periphery of the excited element 11, and the second ground conductor 22 is provided so as to surround the periphery of the parasitic element 21. Therefore, the array antenna apparatus according to the second embodiment can suppress bending deformation of the parasitic element substrate 20A. As a result, the array antenna apparatus according to the second embodiment can suppress deterioration of antenna performance caused by bending deformation of the parasitic element substrate 20A.

[0058] In the array antenna device according to the second embodiment, the first ground conductor 12 and the second ground conductor 22 are joined together using a joining material 32, which is sandwiched between the first ground conductor 12 and the second ground conductor 22 and is provided so as to surround the periphery of the excited element 11 and the parasitic element 21. Therefore, the array antenna device according to the second embodiment can expand the joining area between the first ground conductor 12 and the second ground conductor 22. As a result, the array antenna device according to the second embodiment can suppress bending deformation of the parasitic element substrate 20A.

[0059] In the array antenna apparatus according to the second embodiment, the first ground conductor 12 and the second ground conductor 22 are joined together using a metal member, which is sandwiched between the first ground conductor 12 and the second ground conductor 22 and is provided so as to surround the periphery of the excited element 11 and the parasitic element 21. This makes it possible to suppress misalignment between the excited element 11 and the parasitic element 21.

[0060] Third Embodiment An array antenna apparatus according to a third embodiment will be described with reference to Fig. 10 to Fig. 15. Note that components having the same functions as those described in the first embodiment above will be denoted by the same reference numerals, and descriptions thereof will be omitted.

[0061] Fig. 10 is a plan view of an array antenna apparatus according to embodiment 3. Fig. 11 is a cross-sectional view taken along the line CC in Fig. 10. Fig. 12 is a plan view of an excited element substrate 10B in the array antenna apparatus according to embodiment 3. Fig. 13 is a plan view of a passive element substrate 20B in the array antenna apparatus according to embodiment 3.

[0062] The array antenna device according to the third embodiment includes an excited element substrate 10B and a non-excited element substrate 20B instead of the excited element substrate 10 and the non-excited element substrate 20 of the array antenna device according to the first embodiment. The number of non-excited element substrates 20A is smaller than the number of excited element substrates 10. Fig. 10 to Fig. 13 show an example in which the number of excited element substrates 10B is two and the number of non-excited element substrate 20B is one.

[0063] The excitation element substrate 10B has a plurality of excitation elements 11, a first ground conductor 12, a rewiring layer 13, an external connection portion 14, a resin mold 15, a radio frequency integrated circuit 16, and a plurality of feed lines 17. The parasitic element substrate 20B has a plurality of parasitic elements 21, a second ground conductor 22, and a dielectric 23.

[0064] Two excitation element substrates 10B correspond to one parasitic element substrate 20B. One excitation element substrate 10B and two parasitic element substrates 20B are arranged such that one excitation element 11 and one parasitic element 21 face each other.

[0065] As shown in FIGS. 12 and 13, the plurality of driven elements 11 and the plurality of parasitic elements 21 are arranged in a first direction D1 and a second direction D2 perpendicular to the first direction D1, respectively.

[0066] Specifically, the plurality of drive frames 11 are arranged in two rows along the first direction D1 so that their centers or centers of gravity are aligned on a straight line. The plurality of drive frames 11 are equally spaced apart at intervals d in the first direction D1. The plurality of drive frames 11 are also arranged in eight rows along the second direction D2 so that their centers or centers of gravity are aligned on a straight line. The plurality of drive frames 11 are also equally spaced apart at intervals h in the second direction D2.

[0067] Similarly, the multiple parasitic elements 21 are arranged in two rows along the first direction D1 so that their centers or centroids are aligned on a straight line. The multiple parasitic elements 21 are also arranged at equal intervals of distance d in the first direction D1. Furthermore, the multiple parasitic elements 21 are arranged in eight rows along the second direction D2 so that their centers or centroids are aligned on a straight line. The multiple parasitic elements 21 are also arranged at equal intervals of distance h in the second direction D2.

[0068] The interval h is set appropriately depending on, for example, the application of the array antenna device, the electrical characteristics of the various materials constituting the array antenna device, or the frequency band to be used. The interval h is preferably equal to or less than half the wavelength of the frequency to be used.

[0069] Therefore, in the array antenna device according to the third embodiment, if the number of drive elements 11 on one drive element substrate 10B is reduced, the radio frequency integrated circuit 16 included in one drive element substrate 10B can be made smaller. Therefore, the array antenna device according to the third embodiment can improve the yield of the drive element substrates 10B.

[0070] The distance between the excited element 11 and the parasitic element 21 is determined only by the thickness of the bonding material 31, so that variations in antenna performance are suppressed. Also, there is a gap between the excited element 11 and the parasitic element 21 that face each other. Therefore, the array antenna device according to the third embodiment can suppress radio wave loss and obtain good antenna characteristics.

[0071] Since one parasitic element substrate 20B has all the parasitic elements 21, the relative positions of all the parasitic elements 21 can be maintained with the manufacturing precision of the parasitic element substrate 20B.

[0072] In the array antenna apparatus according to the third embodiment, the arrangement of the excited element substrate 10B or the configuration of the passive element substrate 20B may be changed.

[0073] 14 is a plan view of an excitation element substrate 10C in an array antenna apparatus according to the third embodiment. As shown in FIG. 14, the excitation element substrates 10C may be arranged in a first direction D1 and a second direction D2. In this case, the two rows of excitation element substrates 10C arranged in the first direction D1 are symmetrical with respect to the row midline. Therefore, the excitation element substrate 10C can have a smaller number of excitation elements 11 than the excitation element substrate 10B. As a result, the array antenna apparatus according to the third embodiment can improve the yield of the excitation element substrates 10C.

[0074] Fig. 15 is a plan view of a parasitic element substrate 20C in an array antenna apparatus according to embodiment 3. As shown in Fig. 15, the parasitic element substrate 20C has the parasitic elements 21 surrounded by the second ground conductor 22. Therefore, the array antenna according to embodiment 3 can suppress deterioration of antenna performance by suppressing bending deformation of the parasitic element substrate 20C.

[0075] As described above, the array antenna device according to the third embodiment includes a plurality of excitation element substrates 10B, 10C, each having a plurality of excitation elements 11, and one parasitic element substrate 20B, 20C having a plurality of parasitic elements 21. All of the excitation element substrates 10B, 10C are arranged to face one parasitic element substrate 20B, 20C, and all of the excitation element substrates 10B, 10C and one parasitic element substrate 20B, 20C are arranged such that one excitation element 11 faces one parasitic element 21. Therefore, the array antenna device according to the third embodiment can improve the yield of the excitation element substrates 10B, 10C. As a result, the array antenna device according to the first embodiment can reduce manufacturing costs.

[0076] In the array antenna apparatus according to the third embodiment, the excited elements 11 and the parasitic elements 21 are arranged at equal intervals in the second direction D2 that is orthogonal to the first direction D1. Therefore, the array antenna apparatus according to the third embodiment can suppress misalignment between the excited elements 11 and the parasitic elements 21.

[0077] Fourth Embodiment An array antenna apparatus according to a fourth embodiment will be described with reference to Fig. 16 to Fig. 18. Note that components having the same functions as those described in the first embodiment above will be denoted by the same reference numerals, and descriptions thereof will be omitted.

[0078] Fig. 16 is a plan view of an excited element substrate 10 in an array antenna apparatus according to embodiment 4. Fig. 17 is a plan view of a passive element substrate 20 in an array antenna apparatus according to embodiment 4.

[0079] 16 and 17 , the array antenna apparatus according to the fourth embodiment includes a first subarray 101 and a second subarray 102. The first subarray 101 and the second subarray 102 are provided on the upper surface of the carrier 40. The first subarray 101 extends along a first direction D1. The second subarray 102 extends along a second direction D2. Therefore, the first subarray 101 and the second subarray 102 are arranged so as to be orthogonal to each other.

[0080] The first subarray 101 and the second subarray 102 are each composed of a plurality of excited element substrates 10 and one parasitic element substrate 20. Figures 16 and 17 show examples in which the first subarray 101 and the second subarray 102 are each composed of three excited element substrates 10 and one parasitic element substrate 20.

[0081] The multiple excitation element substrates 10 included in the first subarray 101 are lined up in a row along the first direction D1. Therefore, all excitation elements 11 provided across all excitation element substrates 10 in the first subarray 101 are lined up in a row along the first direction D1 so that their centers or centers of gravity are aligned on a straight line. Also, all parasitic elements 21 on the parasitic element substrate 20 included in the first subarray 101 are lined up in a row along the first direction D1 so that their centers or centers of gravity are aligned on a straight line.

[0082] The multiple excitation element substrates 10 included in the second subarray 102 are lined up in a row along the second direction D2. Therefore, all excitation elements 11 provided across all excitation element substrates 10 in the second subarray 102 are lined up in a row along the second direction D2 so that their centers or centers of gravity are aligned on a straight line. Also, all parasitic elements 21 on the parasitic element substrate 20 included in the second subarray 102 are lined up in a row along the second direction D2 so that their centers or centers of gravity are aligned on a straight line.

[0083] One end of the parasitic element substrate 20 of the first subarray 101 and one end of the parasitic element substrate 20 of the second subarray 102 are connected to each other so as to be orthogonal to each other, and are electrically connected.

[0084] Here, when the polarization of the radio waves transmitted and received by the excitation elements 11 is linearly polarized, the linear polarization of the radio waves transmitted and received by the excitation elements 11 of the first subarray 101 and the linear polarization of the radio waves transmitted and received by the excitation elements 11 of the second subarray 102 are orthogonal to each other. Depending on the application of the array antenna apparatus according to the fourth embodiment, the two linear polarizations may remain orthogonal to each other, or the excitation elements 11 may be changed so that the two linear polarizations overlap each other.

[0085] Fig. 18 is a plan view of another parasitic element substrate 20 in the array antenna apparatus according to embodiment 4. When a positional error between the first subarray 101 and the second subarray 102 is tolerable, or when the mountability of the parasitic element substrate 20 is to be improved, the parasitic element substrate 20 of the first subarray 101 and the parasitic element substrate 20 of the second subarray 102 may be separated from each other on a subarray basis, as shown in Fig. 18. That is, one end of the parasitic element substrate 20 of the first subarray 101 and one end of the parasitic element substrate 20 of the second subarray 102 are not connected and are not conductive.

[0086] As described above, the array antenna apparatus according to the fourth embodiment includes a first subarray 101 and a second subarray 102, each of which is configured from a plurality of excited element substrates 10 and one parasitic element substrate 20, and which are orthogonal to each other, with the first subarray 101 extending in the first direction D1 and the second subarray 102 extending in the second direction D2. Therefore, the array antenna apparatus according to the fourth embodiment can improve the yield of the excited element substrates 10.

[0087] Fifth Embodiment An array antenna apparatus according to a fifth embodiment will be described with reference to Fig. 19 to Fig. 21. Note that components having the same functions as those described in the first and fourth embodiments above will be denoted by the same reference numerals, and descriptions thereof will be omitted.

[0088] Fig. 19 is a plan view of an excited element substrate 10 in an array antenna apparatus according to embodiment 5. Fig. 20 is a plan view of a passive element substrate 20 in an array antenna apparatus according to embodiment 5.

[0089] 19 and 20 , the array antenna apparatus according to the fifth embodiment includes a first subarray 101, a second subarray 102, a third subarray 103, and a fourth subarray 104. These are provided on the upper surface of a carrier 40. In the array antenna apparatus according to the fifth embodiment, the first subarray 101, the second subarray 102, the third subarray 103, and the fourth subarray 104 are arranged so as to form a quadrangle as a whole.

[0090] The first subarray 101 and the third subarray 103 are arranged substantially parallel to each other and extend along the first direction D1. The first subarray 101 and the third subarray 103 are also arranged symmetrically with respect to a line extending in the first direction D1 at the center in the middle of the second direction D2 between them.

[0091] The second subarray 102 and the fourth subarray 104 are arranged substantially parallel to each other and extend along the second direction D2. The second subarray 102 and the fourth subarray 104 are arranged symmetrically with respect to a line extending in the second direction D2 at the center of the line between them in the first direction D1.

[0092] The first subarray 101, the second subarray 102, the third subarray 103, and the fourth subarray 104 are each composed of a plurality of excited element substrates 10 and one parasitic element substrate 20. Figures 19 and 20 show an example in which the subarrays 101 to 104 are each composed of three excited element substrates 10 and one parasitic element substrate 20.

[0093] The multiple excitation element substrates 10 included in the third subarray 103 are lined up in a row along the first direction D1. Therefore, all excitation elements 11 provided across all excitation element substrates 10 in the third subarray 103 are lined up in a row along the first direction D1 so that their centers or centers of gravity are aligned on a straight line. Also, all parasitic elements 21 on the parasitic element substrate 20 included in the third subarray 103 are lined up in a row along the first direction D1 so that their centers or centers of gravity are aligned on a straight line.

[0094] The multiple excitation element substrates 10 included in the fourth subarray 104 are lined up in a row along the second direction D2. Therefore, all of the excitation elements 11 provided across all of the excitation element substrates 10 in the fourth subarray 104 are lined up in a row along the second direction D2 so that their centers or centers of gravity are aligned on a straight line. Also, all of the parasitic elements 21 on the parasitic element substrate 20 included in the fourth subarray 104 are lined up in a row along the second direction D2 so that their centers or centers of gravity are aligned on a straight line.

[0095] The second ground conductor 22 arranged inside each of the subarrays 101 to 104 is common to all of the subarrays 101 to 104. The common second ground conductor 22 has a rectangular shape and is arranged in the center of the array antenna apparatus according to the fifth embodiment.

[0096] Here, when the polarization of the radio waves transmitted and received by the excitation elements 11 is linearly polarized, the linear polarization of the radio waves transmitted and received by the excitation elements 11 of the subarrays 101 and 103 is orthogonal to the linear polarization of the radio waves transmitted and received by the excitation elements 11 of the subarrays 102 and 104. Depending on the application of the array antenna device according to the fifth embodiment, the two linear polarizations may remain orthogonal to each other, or the excitation elements 11 may be changed so that the two linear polarizations overlap each other.

[0097] 21 is a plan view of another parasitic element substrate 20 in the array antenna apparatus according to embodiment 5. When positional errors between the subarrays are tolerable or when the mountability of the parasitic element substrate 20 is to be improved, the parasitic element substrates 20 may be separated from each other on a subarray basis, as shown in FIG.

[0098] As described above, the antenna apparatus according to the fifth embodiment includes a first subarray 101, a second subarray 102, a third subarray 103, and a fourth subarray 104, each of which is configured with a plurality of excited element substrates 10 and one parasitic element substrate 20, and which are arranged in a square shape, with the first subarray 101 and the third subarray 103 extending in the first direction D1 and facing each other in the second direction D2, and the second subarray 102 and the fourth subarray 104 extending in the second direction D2 and facing each other in the first direction D1. Therefore, the array antenna apparatus according to the fifth embodiment can improve the yield of the excited element substrates 10.

[0099] Sixth Embodiment An array antenna apparatus according to a sixth embodiment will be described with reference to Fig. 22 to Fig. 24. Note that components having the same functions as those described in the fifth embodiment above will be denoted by the same reference numerals, and descriptions thereof will be omitted.

[0100] Fig. 22 is a plan view of an excited element substrate 10 in an array antenna apparatus according to embodiment 6. Fig. 23 is a plan view of a passive element substrate 20 in an array antenna apparatus according to embodiment 6.

[0101] 22 and 23 , the array antenna apparatus according to the sixth embodiment includes a first subarray 101, a second subarray 102, a third subarray 103, and a fourth subarray 104. These are provided on the upper surface of a carrier 40. In the array antenna apparatus according to the sixth embodiment, the first subarray 101, the second subarray 102, the third subarray 103, and the fourth subarray 104 are arranged so as to form a cross shape as a whole.

[0102] Specifically, the array antenna apparatus according to the sixth embodiment includes subarrays 101 to 104 such that all of the excited elements 11 and parasitic elements 21 in the first subarray 101, the second subarray 102, the third subarray 103, and the fourth subarray 104 are arranged in a cross shape. The subarrays 101 and 103 extending in the second direction D2 and the subarrays 102 and 104 extending in the first direction D1 are arranged to be point-symmetric with respect to the central axis 50 of the array antenna apparatus. In this case, the inner ends of the subarrays 101 to 104 are connected to each other and are electrically conductive.

[0103] Fig. 24 is a plan view of another parasitic element substrate 20 in the array antenna apparatus according to embodiment 6. When positional errors between the subarrays are tolerable, or when improving the mountability of the parasitic element substrate 20, the parasitic element substrate 20 may be separated from one another on a subarray basis, as shown in Fig. 24. That is, the inner ends of the subarrays 101 to 104 are not connected to one another and are not conductive.

[0104] As described above, the array antenna apparatus according to the sixth embodiment includes a first subarray 101, a second subarray 102, a third subarray 103, and a fourth subarray 104, each of which is configured from a plurality of excited element substrates 10 and one parasitic element substrate 20, arranged in a cross shape, with the first subarray 101 and the third subarray 103 extending in the second direction D2, the second subarray 102 and the fourth subarray 104 extending in the first direction D1, and the first subarray 101, the second subarray 102, the third subarray 103, and the fourth subarray 104 being arranged point-symmetrically with respect to the central axis 50 of the array antenna apparatus. Therefore, the array antenna apparatus according to the fifth embodiment can improve the yield of the excited element substrates 10.

[0105] It should be noted that within the scope of the present disclosure, the embodiments may be freely combined, or any component in each embodiment may be modified, or any component in each embodiment may be omitted.

[0106] The array antenna device according to the present disclosure comprises a plurality of excitation element substrates, each having a plurality of excitation elements, and one non-excitation element substrate having a plurality of non-excitation elements, thereby improving the yield of the excitation element substrates and making it suitable for use in array antenna devices, etc.

[0107] 10, 10B, 10C: excitation element substrate, 11: excitation element, 12: first ground conductor, 13: rewiring layer, 14: external connection portion, 15: resin mold, 16: radio frequency integrated circuit, 17: power supply line, 20, 20A to 20C: non-excitation element substrate, 21: non-excitation element, 22: second ground conductor, 23: dielectric, 31, 32: bonding material, 33: copper pillar, 40: carrier, 50: central axis, 101 to 104: subarray, D1: first direction, D2: second direction, d, h: spacing.

Claims

1. An array antenna device comprising: a plurality of excited element substrates, each having a plurality of excited elements; and one non-excited element substrate having a plurality of non-excited elements; all of the excited element substrates are arranged opposite the one non-excited element substrate; and all of the excited element substrates and the one non-excited element substrate are arranged so that one excited element faces one non-excited element.

2. The array antenna device according to claim 1, wherein the number of parasitic elements on one parasitic element substrate is greater than the number of excited elements on one excited element substrate.

3. An array antenna device according to claim 1 or 2, characterized in that the driven elements and the parasitic elements are arranged at equal intervals in the first direction.

4. The array antenna device according to claim 3, wherein the driven elements and the parasitic elements are arranged at equal intervals in a second direction perpendicular to the first direction.

5. An array antenna device according to any one of claims 1 to 4, characterized in that the excitation element substrate comprises: a semiconductor substrate having a circuit for transmitting and receiving radio waves; a resin mold for fixing the semiconductor substrate; a rewiring layer provided on the surface of the resin mold; an external connection portion provided on the surface of the rewiring layer for transmitting and receiving signals to and from the semiconductor substrate or relaying power supply; and a power supply line connecting the excitation element and the semiconductor substrate.

6. An array antenna device as claimed in any one of claims 1 to 5, characterized in that it comprises: a first ground conductor provided on the surface of the excited element substrate and not conductive to the excited element; and a second ground conductor provided on the surface of the non-excited element substrate and not conductive to the non-excited element, and the first ground conductor and the second ground conductor are joined together.

7. The array antenna device according to claim 6, wherein the first ground conductor is arranged to surround the periphery of the driven element, and the second ground conductor is arranged to sandwich the non-driven element.

8. The array antenna device according to claim 7, characterized in that the first ground conductor and the second ground conductor are joined using a bonding material, and the bonding material is sandwiched between the first ground conductor and the second ground conductor and is arranged to surround the periphery of the excited element and the non-excited element.

9. The array antenna device according to claim 6, characterized in that the first ground conductor is arranged to surround the periphery of the excited element, and the second ground conductor is arranged to surround the periphery of the non-excited element.

10. An array antenna device as described in claim 9, characterized in that the first ground conductor and the second ground conductor are joined using a metal member, and the metal member is sandwiched between the first ground conductor and the second ground conductor and is arranged to surround the periphery of the excited element and the non-excited element.

11. The array antenna device according to claim 10, wherein the metal member is one of a copper pillar, a gold bump, and a solder ball.

12. An array antenna device as described in any one of claims 4 to 11, characterized in that it comprises a first subarray and a second subarray, each of which is composed of the plurality of excited element substrates and the one non-excited element substrate, arranged orthogonally to each other, the first subarray extending in the first direction, and the second subarray extending in the second direction.

13. An array antenna device as described in any one of claims 4 to 11, characterized in that it has a first subarray, a second subarray, a third subarray, and a fourth subarray, each of which is composed of the plurality of excited element substrates and the one non-excited element substrate, arranged in a rectangular shape, the first subarray and the third subarray extending in the first direction and facing each other in the second direction, and the second subarray and the fourth subarray extending in the second direction and facing each other in the first direction.

14. An array antenna device as claimed in any one of claims 4 to 11, characterized in that it comprises a first subarray, a second subarray, a third subarray, and a fourth subarray, each of which is composed of the plurality of excited element substrates and the one non-excited element substrate, arranged in a cross shape, the first subarray and the third subarray extending in the second direction, the second subarray and the fourth subarray extending in the first direction, and the first subarray, the second subarray, the third subarray, and the fourth subarray being arranged point-symmetrically with respect to the central axis of the device.

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