Detection device

Abstract

This detection device includes: a detection region that functions as an optical sensor, in which a first substrate, a first adhesive insulating layer, an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, a second adhesive insulating layer, and a second substrate are stacked; and a non-detection region in which the first substrate, the first adhesive insulating layer, the insulating layer, the second adhesive insulating layer, and the second substrate are stacked, wherein in the non-detection region, a terminal part provided with a first terminal electrically connected to the electrode layer does not overlap the first adhesive insulating layer and the second adhesive insulating layer, the first substrate has a support part that supports the insulating layer at the periphery of the terminal part, and the support part is continuous with the first substrate provided in the detection region.

Description

Detection Device

[0001] The present invention relates to a detection device.

[0002] Optical sensors capable of detecting fingerprint patterns and vein patterns are known (see, for example, Patent Document 1). Among such optical sensors, sensors having an organic photodiode (OPD) using an organic semiconductor material as an active layer are known.

[0003] Japanese Patent Application Laid-Open No. 2022-121297

[0004] To provide flexibility to an organic photodiode, a flexible substrate on which the organic photodiode is formed and a substrate on which a circuit connected to the organic photodiode is mounted are provided separately, and terminals on each of these substrates are pressure-bonded together from the flexible substrate on which the organic photodiode is formed. In this configuration, an adhesive layer is interposed between the electrode layer of the organic photodiode included in the flexible substrate and a layer that provides rigidity to the flexible substrate. If the adhesive layer is located within the pressure-bonding range, the heat applied to the flexible substrate during pressure-bonding can soften and deform the adhesive layer, dispersing the pressure applied during pressure-bonding and resulting in insufficient pressure applied during pressure-bonding. This insufficient pressure can result in insufficient pressure-bonding between the terminals.

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a detection device that can more reliably crimp a terminal.

[0006] A detection device according to one embodiment of the present invention comprises a detection region in which a first substrate, a first adhesive insulating layer, an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, a second adhesive insulating layer, and a second substrate are stacked to function as an optical sensor, and a non-detection region in which the first substrate, the first adhesive insulating layer, the insulating layer, the second adhesive insulating layer, and the second substrate are stacked, wherein a terminal portion in the non-detection region in which a first terminal electrically connected to the electrode layer is provided does not overlap the first adhesive insulating layer and the second adhesive insulating layer, and the first substrate has a support portion that supports the insulating layer around the terminal portion, and the support portion is continuous with the first substrate provided in the detection region.

[0007] A detection device according to one embodiment of the present invention comprises a detection region in which an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, an adhesive insulating layer, and a substrate are stacked to function as an optical sensor, and a non-detection region in which the insulating layer, the adhesive insulating layer, and the substrate are stacked, wherein a terminal portion of the non-detection region in which a first terminal electrically connected to the electrode layer is provided does not overlap with the adhesive insulating layer, and the substrate has a support portion that supports the insulating layer around the terminal portion, and the support portion is continuous with the substrate provided in the detection region.

[0008] FIG. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment, when a finger is placed inside the detection device, as viewed from the side of the housing. FIG. 2 is a schematic cross-sectional view taken along the line II-II' in FIG. 1. FIG. 3 is a developed view showing an example of the optical sensor of the detection device shown in FIG. 1. FIG. 4 is a diagram showing a schematic layered structure of the base 610 side and the pressure-bonded portion side of the sensor substrate. FIG. 5 is a more enlarged plan view of the sensor substrate. FIG. 6 is a plan view showing a schematic layered structure of a non-detection region according to an embodiment. FIG. 7 is a cross-sectional view taken along line VII-VII in the "terminal portion" of FIG. 6. FIG. 8 is a cross-sectional view taken along line VIII-VIII in the "terminal portion" of FIG. 6. FIG. 9 is a cross-sectional view taken along line IX-IX in the "terminal portion" of FIG. 6. FIG. 10 is a plan view showing a schematic layered structure of a non-detection region according to a comparative example. FIG. 11 is a cross-sectional view taken along line XI-XI in the "terminal portion" of FIG. 10. FIG. 12 is a cross-sectional view taken along line XII-XII in the "terminal portion" of FIG. 10. FIG. 13 is a cross-sectional view taken along line XIII-XIII of the "terminal portion" in FIG. 10. FIG. 14 is a plan view schematically showing the layered structure of the non-detection region in Modification 1. FIG. 15 is a cross-sectional view taken along line XV-XV of the "terminal portion" in FIG. 14. FIG. 16 is a cross-sectional view taken along line XVI-XVI of the "terminal portion" in FIG. 14. FIG. 17 is a cross-sectional view taken along line XVII-XVII of the "terminal portion" in FIG. 14. FIG. 18 is a plan view schematically showing the layered structure of the non-detection region in Modification 2. FIG. 19 is a cross-sectional view taken along line XIX-XIX of the "terminal portion" in FIG. 18. FIG. 20 is a cross-sectional view taken along line XX-XX of the "terminal portion" in FIG. 18. FIG. 21 is a cross-sectional view taken along line XXI-XXI of the "terminal portion" in FIG. 18. FIG. 22 is a plan view schematically showing the layered structure of the non-detection region in Modification 3. FIG. 23 is a cross-sectional view taken along line XXIII-XXIII of the "terminal portion" in FIG. 22. Fig. 24 is a cross-sectional view taken along line XXIV-XXIV of the "terminal portion" in Fig. 22. Fig. 25 is a cross-sectional view taken along line XXV-XXV of the "terminal portion" in Fig. 22.

[0009] Modes for carrying out the invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, for clarity of explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each figure, elements similar to those described above with reference to the previous figures may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] In this specification and claims, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0011] (Embodiment) Fig. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment when a finger is placed inside the detection device as viewed from the side of the housing. Fig. 2 is a schematic cross-sectional view taken along line II-II' shown in Fig. 1. Fig. 3 is a development view showing an example of the development of the optical sensor of the detection device shown in Fig. 1.

[0012] The detection device 1 shown in FIG. 1 is a ring-shaped device that can be attached to and detached from the human body, and is worn on a finger Fg of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, little finger, etc. The human body is an individual to be authenticated, whose identity is verified by the detection device 1. The detection device 1 can detect biometric information about a living body from the finger Fg on which it is worn. The finger Fg is an example of a measurement target. The measurement target is a living body or part of a living body, and is a measurement target. The detection device 1 is made into a ring or wristband, making it easy for the user to carry. In the following description, it is assumed that the detection device 1 is used as a ring.

[0013] 2, the detection device 1 includes a housing 200, a light source 60, a first optical sensor 10A, and a second optical sensor 10B. The detection device 1 includes a battery (not shown) inside the housing 200 and is operated by power from the battery.

[0014] The housing 200 is formed in a ring shape (annular shape) that can be worn on a finger Fg and is a wearable member that is worn on a living body. In the example shown in FIG. 2 , the housing 200 includes a sealing film 210 and an exterior part 220. The sealing film 210 and the exterior part 220 are integrally formed into a ring shape. The sealing film 210 houses the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. inside. The sealing film 210 is formed in a ring shape using a housing material such as a transparent synthetic resin or silicone. The exterior part 220 has a surface of the housing 200 that covers the outer peripheral surface 210A of the sealing film 210. The exterior part 220 is formed in a ring shape using a material such as a metal or a non-transparent synthetic resin. The housing 200 houses a circuit board 70 on which the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. are mounted inside the sealing film 210. The circuit board 70 is housed inside the housing 200 by, for example, forming the housing 200 in a ring shape in a mold and filling a filling material around the circuit board 70 .

[0015] As shown in FIG. 3 , the circuit board 70 is formed in a deformable band shape, and is formed into a ring shape by connecting one end 71 and the other end 72. The circuit board 70 has a first mounting area 73 and a second mounting area 74. The first mounting area 73 is an area where the light source 60 and the like are mounted. The second mounting area 74 is an area where the control circuit 122, the power supply circuit 123, and the like are mounted. The sensor board 21 is mounted on the circuit board 70 so as to straddle the vicinity of the light source 60 in the first mounting area 73. More specifically, the circuit board 70 of the embodiment is a flexible PCB (Printed Circuit Board). Note that the circuit board 70 may be configured using a board commonly used as an FPC (Flexible Printed Circuit).

[0016] In this embodiment, the first optical sensor 10A and the second optical sensor 10B are provided so as to sandwich the light source 60 in the circumferential direction 200C. That is, the detection device 1 is arranged in the circumferential direction 200C with the first optical sensor 10A, the light source 60, and the second optical sensor 10B lined up in this order. By arranging the first optical sensor 10A and the second optical sensor 10B so as to sandwich the light source 60 in the circumferential direction 200C, the first optical sensor 10A and the second optical sensor 10B can detect light emitted by the light source 60 over a wide range of the housing 200.

[0017] The sensor substrate 21 is a deformable substrate on which the first optical sensor 10A and the second optical sensor 10B are mounted. The sensor substrate 21 can be bent in the third direction Dz. When the sensor substrate 21 is attached to the circuit board 70, the first optical sensor 10A and the second optical sensor 10B are positioned on both sides of the light source 60 in the circumferential direction 200C of the housing 200. The sensor substrate 21 has a first region 21A on which the first optical sensor 10A is mounted and a second region 21B on which the second optical sensor 10B is mounted. The sensor substrate 21 is formed as a single substrate having the first region 21A and the second region 21B.

[0018] 2 , the circuit board 70 is housed inside the housing 200 so that the surface on which the first optical sensor 10A, the second optical sensor 10B, and the light source 60 are mounted faces the inner circumferential surface 200B of the housing 200. If the circuit board 70 is translucent, the first optical sensor 10A, the second optical sensor 10B, and the light source 60 may be mounted on the back surface opposite the front surface. In this case, the light source 60 may be disposed so that it emits light toward the circuit board 70 and the light that has passed through the circuit board 70 is emitted toward the outside of the housing 200.

[0019] As shown in Fig. 2 , the light source 60 is provided inside the sealing film 210 of the housing 200 and is configured to be able to irradiate light toward a detection object such as a finger Fg worn on the ring-shaped housing 200. The light source 60 may be, for example, an inorganic light-emitting diode (LED) or an organic light-emitting diode (OLED). The light source 60 irradiates light of a predetermined wavelength. In this embodiment, the light source 60 has a plurality of light sources capable of irradiating near-infrared light, red light, and green light.

[0020] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include pulse waves, pulse rates, and blood vessel images of the finger or palm. That is, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects vascular patterns such as veins.

[0021] Each of the first optical sensor 10A and the second optical sensor 10B detects light emitted by the light source 60 and reflected by a finger Fg or the like, directly incident light, etc. The first optical sensor 10A and the second optical sensor 10B are organic photodiodes. The first optical sensor 10A is provided on the housing 200 so as to be adjacent to one end 61 of the light source 60 in the circumferential direction 200C of the housing 200. The second optical sensor 10B is provided on the housing 200 so as to be adjacent to the other end 62 of the light source 60 in the circumferential direction 200C of the housing 200.

[0022] As shown in FIG. 3 , the first optical sensor 10A and the second optical sensor 10B each have an organic photodiode OPD (see FIG. 4 ). Each of the first optical sensor 10A and the second optical sensor 10B has two electrodes 11 aligned along the circumferential direction 200C. The first optical sensor 10A and the second optical sensor 10B are mounted on a single sensor substrate 21 and electrically connected to the circuit board 70 via the sensor substrate 21. The sensor substrate 21 has a cutout portion 22 (see FIG. 4 ) between the first optical sensor 10A and the second optical sensor 10B in the circumferential direction 200C of the housing 200. In other words, the detection device 1 is a detection device that detects light using an organic photodiode OPD.

[0023] In the following description, the first direction Dx is a direction in a plane parallel to the sensor substrate 21. The second direction Dy is a direction in a plane parallel to the sensor substrate 21 and is the same direction as the circumferential direction 200C. In the embodiment, the first direction Dx and the second direction Dy are perpendicular to each other, but the intersection angle between the first direction Dx and the second direction Dy does not necessarily have to be strictly perpendicular, and the first direction Dx and the second direction Dy may intersect without being perpendicular. The third direction Dz is a direction perpendicular to the second direction Dy and the first direction Dx. The third direction Dz is a normal direction to the sensor substrate 21. The term "planar view" refers to the positional relationship when viewed from a direction perpendicular to the sensor substrate 21. The term "lateral" refers to a direction (such as the first direction Dx or the second direction Dy) that intersects with the third direction Dz.

[0024] In the following description, the sensor substrate 21 will be described by distinguishing between the base 610 side and the pressure-bonded portion 620 side. The base 610 side is the side on which organic photodiodes OPD (see FIG. 4 ) such as the first optical sensor 10A and the second optical sensor 10B are formed. The pressure-bonded portion 620 side is the side on which terminals of wiring connected to the organic photodiodes OPD (e.g., terminals 503, 504, ..., 511, described below) are formed. The boundary between the portion of the sensor substrate 21 on the base 610 side and the portion of the sensor substrate 21 on the pressure-bonded portion 620 side is indicated as a boundary line 600.

[0025] FIG. 4 is a diagram showing a schematic stacked structure on each of the base portion 610 side and the pressure-bonded portion 620 side of the sensor substrate 21. Note that FIG. 4 is merely a schematic diagram for specifically explaining the stacked structure, and the layout, shape, size, and other aspects of each component from a planar perspective are more accurately shown in FIG. 5 , which will be described later. A stacked structure constituting an organic photodiode OPD is formed on the base portion 610 side. Specifically, the organic photodiode OPD includes an active layer 301, a hole injection layer 302, and an electron injection layer 303. More specifically, the organic photodiode OPD has a stacked structure in which the hole injection layer 302 and the electron injection layer 303 sandwich the active layer 301 in the third direction Dz.

[0026] The characteristics (e.g., voltage-current characteristics and resistance value) of the active layer 301 change depending on the light irradiated thereto. An organic material is used as the material of the active layer 301. The hole injection layer 302 is a so-called HIL (Hole Injection Layer) and corresponds to a second buffer layer. The electron injection layer 303 is a so-called EIL (Electron Injection Layer) and corresponds to a first buffer layer.

[0027] More specifically, the active layer 301 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed together. For example, low-molecular-weight organic materials such as C60 (fullerene), PCBM (phenyl C61-butylic acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (rubrene: 5,6,11,12-tetraphenyltetracene), and PDI (perylene derivative) can be used as the active layer 301.

[0028] The active layer 301 can be formed using these low-molecular-weight organic materials by a vapor deposition (dry process). In this case, the active layer 301 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 301 can also be formed by a coating (wet process). In this case, the active layer 301 is made of a material that combines the above-mentioned low-molecular-weight organic material with a high-molecular-weight organic material. Examples of high-molecular-weight organic materials that can be used include P3HT (poly(3-hexylthiophene)) and F8BT (F8-alt-benzothiadiazole). The active layer 301 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0029] Furthermore, a conductive polymer such as a composite (PEDOT:PSS) made of poly(3,4-ethylenedioxythiophene) and polystyrene sulfonic acid (PSS) is used as the material for the hole injection layer 302. Furthermore, an alkali metal with a small work function, such as lithium (Li), is used as the material for the electron injection layer 303.

[0030] Although not shown in FIG. 4 , a hole transport layer may be further formed between the hole injection layer 302 and the active layer 301. Furthermore, an electron transport layer may be further formed between the active layer 301 and the electron injection layer 303. A metal oxide layer is used as the material for the hole transport layer. Examples of such metal oxide layers include tungsten oxide (WO3) and molybdenum oxide. For example, ethoxylated polyethyleneimine (PEIE) is used as the material for the electron transport layer. Furthermore, the hole transport layer and the electron transport layer are not limited to single-layer films, and may be formed as a laminated film including an electron blocking layer or a hole blocking layer.

[0031] The hole injection layer 302 abuts against the electrode 312 that functions as an anode. Specifically, the hole injection layer 302 includes a connection portion 3021. The connection portion 3021 is a part of the hole injection layer 302, and is formed to extend from the active layer 301 in the third direction Dz on a side of the active layer 301 and the electron injection layer 303. The connection portion 3021 abuts against the electrode 312, thereby causing the hole injection layer 302 to abut against the electrode 312.

[0032] The electron injection layer 303 is in contact with the electrode 11 that functions as a cathode. The electrode 11 is disposed to face the active layer 301 in the third direction Dz, with the electron injection layer 303 sandwiched between them.

[0033] The electrode 11 and the hole injection layer 302 are each connected to a conductive material layer that functions as a wiring. Specifically, the electrode 11 is connected to the wiring 331. The hole injection layer 302 is connected to the wiring base 3300. The wiring 331 and the wiring base 3300 are the same conductive material layer. This conductive material layer is formed of a light-transmitting conductive material such as indium tin oxide (ITO), but is not limited thereto and may be formed of other conductive materials. The wiring 331 and the wiring base 3300 are separated by an insulating layer 320. More specifically, the insulating layer 320 is interposed between the electrode layer including the electrode 11 and the electrode 312 and the conductive material layer including the wiring 331 and the wiring base 3300. This electrode layer is formed of a light-transmitting conductive material such as ITO. The insulating layer 320 has a through hole 391 formed therein for electrically connecting the electrode 11 and the wiring 331. The insulating layer 320 also has a through hole 392 formed therein for electrically connecting the electrode 312 and the wiring base 3300.

[0034] 4, the wiring 331 extends to both the base 610 side and the crimped portion 620 side across the boundary line 600 so as to connect the base 610 side and the crimped portion 620 side. The insulating layer 320 also extends to both the base 610 side and the crimped portion 620 side.

[0035] A laminated structure for providing a terminal of the sensor substrate 21 is formed on the side of the crimped portion 620. Specifically, the terminal is formed on one end side in the second direction Dy of the end electrode 110 connected to the wiring 331 extending toward the crimped portion 620. The end electrode 110 is in the same layer as the electrode layer including the electrode 11 and the electrode 312. An insulating layer 320 is interposed between the end electrode 110 and the wiring 331, and a through hole 393 is provided to electrically connect the end electrode 110 and the wiring 331.

[0036] In addition, when the term wiring portion 33 is used, it refers to the laminated structure included in the sensor substrate 21, as shown in Figure 4, which is formed of a conductive material layer including wiring 331 and wiring base 3300, an insulating layer 320, and an electrode layer including electrode 11, electrode 312, and end electrode 110.

[0037] One end of the end electrode 110 in the second direction Dy is exposed to the outside. This exposed portion functions as a terminal. Furthermore, the wiring 331 included in the wiring portion 33 is continuous on the base portion 610 side and the crimped portion 620 side across the boundary line 600, and functions as a wiring that electrically connects the electrode 11 or the electrode 312 to the terminals (terminals 503, 504, ..., 511) provided on the crimped portion 620 side.

[0038] The wiring 331 shown in FIG. 4 is connected to the electrode 11 via a through hole 391, but a plurality of components that function as wiring, such as the wiring 331, are provided on the sensor substrate 21.

[0039] Fig. 5 is a more enlarged plan view of the sensor substrate 21. As shown in Fig. 3 and Fig. 5, four electrodes 11 are provided on the sensor substrate 21. Specifically, two electrodes 11 are provided on each of the first optical sensor 10A and the second optical sensor 10B.

[0040] As shown in FIG. 5 , one of the four electrodes 11 is connected to a wiring portion 3311 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3312 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3313 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3314 via a through hole 391. The wiring portions 3311, 3312, 3313, and 3314 are each individual wirings 331. The wiring portion 3311 is connected to the through hole 391 on the base 610 side and to the terminal 504 on the crimped portion 620 side. The wiring portion 3312 is connected to the through hole 391 on the base 610 side and to the terminal 503 on the crimped portion 620 side. The wiring portion 3313 is connected to the through hole 391 on the side of the base portion 610, and is connected to the terminal 509 on the side of the crimped portion 620. The wiring portion 3314 is connected to the through hole 391 on the side of the base portion 610, and is connected to the terminal 510 on the side of the crimped portion 620. The terminals 503, 504, 509, and 510 are each individual terminals.

[0041] The wiring base 3300 of the first optical sensor 10A is connected to the wiring portion 3310. The wiring base 3300 of the second optical sensor 10B is connected to the wiring portion 3315. The wiring portions 3310 and 3315 are each an individual wiring 331. The wiring portion 3310 is connected to the wiring base 3300 on the base portion 610 side and to the terminals 505 and 507 on the crimped portion 620 side. The wiring portion 3315 is connected to the wiring base 3300 on the base portion 610 side and to the terminal 511 on the crimped portion 620 side. The terminals 505, 507, and 511 are each an individual terminal. As described with reference to FIG. 4 , the electrode 312 abuts the wiring base 3300. Therefore, like the electrode 11, the electrode 312 is also connected to a terminal via the wiring 331.

[0042] 4 , the wiring 331, wiring base 3300, and insulating layer 320 are in contact with one surface of the insulating layer 340. The other surface of the insulating layer 340 is in contact with a first adhesive insulating layer 350. The first adhesive insulating layer 350 is interposed between the insulating layer 340 and the first substrate 360.

[0043] On one side of the first substrate 360, a first adhesive insulating layer 350, an insulating layer 340, a conductive material layer including wiring 331 and wiring base 3300, an insulating layer 320, an electrode layer including electrode 11, electrode 312 and end electrode 110, an electron injection layer 303, an active layer 301, and a hole injection layer 302 are stacked in this order, thereby forming a main stacked structure including an organic photodiode OPD and a terminal electrically connected to the organic photodiode OPD.

[0044] Furthermore, the sensor substrate 21 includes a configuration for structurally protecting and reinforcing the organic photodiode OPD. Specifically, the sensor substrate 21 includes an adhesive layer 410 and an additional structural maintaining portion 450. The adhesive layer 410 is provided at the base 610 so as to cover the organic photodiode OPD from the hole injection layer 302 side. The additional structural maintaining portion 450 has a structure in which a second adhesive insulating layer 430 and an insulating layer 420 are laminated on the second substrate 440. The second adhesive insulating layer 430 is interposed between the second substrate 440 and the insulating layer 420. The insulating layer 420 side of the additional structural maintaining portion 450 abuts against the adhesive layer 410. The structure for structurally protecting and reinforcing the organic photodiode OPD is formed by forming an adhesive layer 410 to cover the organic photodiode OPD after the formation of the main laminated structure described above, and then adhering the additional structure maintaining portion 450 to the adhesive layer 410 with the insulating layer 420 facing the adhesive layer 410 side.

[0045] Note that the term "intermediate portion 400" refers to a laminated structure formed by the organic photodiode OPD and the adhesive layer 410. Therefore, it can be said that the sensor substrate 21 has a structure in which, when viewed from the additional structure-maintaining portion 450 side, the additional structure-maintaining portion 450, intermediate portion 400, wiring portion 33, insulating layer 340, first adhesive insulating layer 350, and first substrate 360 ​​are laminated in this order.

[0046] The insulating layer 340 and the insulating layer 420 are insulating layers and are formed using, for example, colorless and transparent polyimide (CPI). The first adhesive insulating layer 350 is an adhesive layer that bonds the insulating layer 340 and the first substrate 360. The second adhesive insulating layer 430 is an adhesive layer that bonds the insulating layer 420 and the second substrate 440. The first adhesive insulating layer 350 and the second adhesive insulating layer 430 are formed using, for example, an adhesive film (OCA: Optically Clear Adhesive) that has insulating and light-transmitting properties. For example, an acrylic-based OCA is used, but a silicone-based or urethane-based OCA may also be used. The first substrate 360 ​​and the second substrate 440 are structural maintenance members and are formed using, for example, polyethylene terephthalate (PET: Poly Ethylene Terephthalate). The adhesive layer 410 is formed using, for example, an encapsulation adhesive.

[0047] Here, the region on the base 610 side where the organic photodiode OPD is formed is referred to as the detection region 680. The detection region 680 is formed by stacking a first substrate 360, a first adhesive insulating layer 350, an insulating layer 340, an electrode layer including the electrode 312 and the end electrode 110, an electron injection layer 303 corresponding to the first buffer layer, an active layer 301, a hole injection layer 302 corresponding to the second buffer layer, a second adhesive insulating layer 430, and a second substrate 440. The detection region 680 includes the organic photodiode OPD and can be said to be a region that functions as a photosensor that detects light.

[0048] 5 have the same configuration as terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511, except that they are not connected to the configuration corresponding to wiring 331 shown in FIG. Hereinafter, when referred to as terminal section 500, it refers to the portion where terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511 and unwired terminals 501, 502, and 512 are provided. Note that all of the terminals included in terminal section 500 may be connected to the configuration corresponding to wiring 331, or some of them may not be connected to the configuration corresponding to wiring 331, such as unwired terminals 501, 502, and 512. However, one or more of the terminals included in terminal section 500 are connected to the configuration corresponding to wiring 331. Terminals such as terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511 that are connected to components corresponding to the wiring 331 correspond to first terminals.

[0049] In the embodiment, the end electrode 110 functioning as the terminal of the terminal portion 500 and the electrodes 11 and 312 functioning as electrodes connected to the organic photodiode OPD are both included in the same electrode layer laminated on the insulating layer 320. That is, the conductive portions of the terminals 503, 504, ..., 511 functioning as first terminals in the embodiment are in the same layer as the electrode layer of the organic photodiode OPD.

[0050] 4, the pressure-bonded portion 620 side is composed of the wiring portion 33, the insulating layer 340, the first adhesive insulating layer 350, and the first substrate 360. In other words, the pressure-bonded portion 620 side does not include the organic photodiode OPD, the adhesive layer 410, or the additional structure-maintaining portion 450. Therefore, a step is generated across the boundary line 600 between the base portion 610 side, which includes the organic photodiode OPD, the adhesive layer 410, and the additional structure-maintaining portion 450, and the terminal, on which the organic photodiode OPD, the adhesive layer 410, and the additional structure-maintaining portion 450 are not stacked. A gap 670 indicates the presence of this step.

[0051] In addition, in the description of the embodiment, the configuration on the side of the pressure-bonded portion 620 from the reference position 630 shown in FIG. 4 will be particularly described in FIG. 6 and subsequent figures. The reference position 630 is the boundary between the portion on the base portion 610 side of the boundary line 600 that satisfies the first and second conditions and the portion that does not satisfy the first condition. The first condition is that the electrode 11, the electrode 312, and the organic photodiode OPD are not included. The second condition is that the additional structure-maintaining portion 450 and the insulating layer 340 are not included. The portion between the boundary line 600 and the reference position 630 satisfies the first and second conditions. Furthermore, most of the portion between the boundary line 600 and the reference position 630 includes the adhesive layer 410. However, even in the portion between the boundary line 600 and the reference position 630, there is a portion near the boundary line 600 that does not have the adhesive layer 410.

[0052] The organic photodiode OPD is electrically connected to the control circuit 122 and the power supply circuit 123 provided on the circuit board 70 by crimping a terminal arranged on the terminal portion 500 of the sensor substrate 21 to a terminal 720 formed on the circuit board 70 (see FIG. 7 , etc.). This crimping is performed on the crimped portion 620 side of the reference position 630. After this crimping, the sensor substrate 21 and the circuit board 70 overlap in plan view, as shown in FIG. 3 . If the circuit board 70 is considered an additional substrate, the terminal 720 corresponds to the second terminal. Furthermore, the terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511, which correspond to the first terminals, can be said to be connected to the second terminals. Furthermore, the detection region 680 in which the organic photodiode OPD is provided, such as the first optical sensor 10A and the second optical sensor 10B, overlaps the circuit board 70.

[0053] In Figure 4 and other figures, the position in the second direction Dy of the end of the electrode 11 closest to the boundary line 600 in this embodiment is shown as a reference position 630. Hereinafter, the configuration on the pressure-bonded portion 620 side of the reference position 630 will be described with reference to Figures 6 to 9. In the following description, the term "non-detection region 599" refers to a portion of the sensor substrate 21 on the pressure-bonded portion 620 side of the reference position 630. As shown in Figure 4, the non-detection region 599 is formed by stacking the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the second adhesive insulating layer 430, and the second substrate 440. The non-detection region 599 does not have a configuration that functions as a photosensor that detects light, such as an organic photodiode OPD, and therefore corresponds to a non-detection region that does not function as a photosensor. The non-detection region 599 can also be said to have a terminal portion 500 provided with terminals 503, 504, ..., 511 that function as first terminals electrically connected to the portions of the electrode layer that are provided on the organic photodiode OPD (electrode 11, electrode 312). The non-detection region 599 includes the entire pressure-bonded portion 620 side and a part of the base portion 610 side.

[0054] FIG. 6 is a plan view schematically illustrating the layered structure of the non-detection region 599 in the embodiment. In FIG. 6 and FIGS. 10 , 14 , 18 , and 22 described below, a “first layer,” a “second layer,” a “third layer,” a “fourth layer,” a “fifth layer,” and a “terminal portion” are illustrated side by side. The “first layer” refers to the first substrate 360 ​​in the layered structure of the sensor substrate 21 described with reference to FIG. 4 , which is closer to the pressure-bonded portion 620 than the reference position 630, from a planar perspective. The “second layer” refers to the first adhesive insulating layer 350 in the layered structure of the sensor substrate 21 described with reference to FIG. 4 , which is closer to the pressure-bonded portion 620 than the reference position 630, from a planar perspective. The “third layer” refers to the insulating layer 340 in the layered structure of the sensor substrate 21 described with reference to FIG. 4 , which is closer to the pressure-bonded portion 620 than the reference position 630, from a planar perspective. The "fourth layer" indicates, from a planar perspective, the adhesive layer 410 on the pressure-bonded portion 620 side of the reference position 630 in the laminated structure of the sensor substrate 21 described with reference to FIG. 4 . The "fifth layer" indicates, from a planar perspective, the additional structure-retaining portion 450 on the pressure-bonded portion 620 side of the reference position 630 in the laminated structure of the sensor substrate 21 described with reference to FIG. 4 . The "terminal portion" indicates, from a planar perspective, the non-detection region 599. As shown in FIG. 4 , the configuration illustrated as the "terminal portion" is a configuration in which the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the wiring portion 33, the adhesive layer 410, and the additional structure-retaining portion 450 are stacked in this order in the third direction Dz from the first substrate 360 ​​side toward the additional structure-retaining portion 450 side. Hereinafter, when referring to FIG. 6 and the like, unless otherwise specified, this refers to FIG. 6 as well as FIGS. 10, 14, 18, and 22 described below.

[0055] As shown by "first layer" in FIG. 6 , the portion of the first substrate 360 ​​of the embodiment closer to the pressure-bonded portion 620 than the reference position 630 has a squared U-shape with the reference position 630 as the bottom in a plan view. Specifically, the first substrate 360 ​​of the embodiment has a base 361 corresponding to the bottom of the squared U-shape and two extension portions 362 extending from the base 361 toward the pressure-bonded portion 620 along the second direction Dy. A notch 363 is formed between the two extension portions 362 facing each other in the first direction Dx. The notch 363 is a notch where a layer constituting the first substrate 360 ​​is removed. Using the shape of a katakana character as an example, the portion of the first substrate 360 ​​within the non-detection region 599 can be said to be U-shaped in a plan view when the reference position 630 is on the right side.

[0056] As shown by "second layer" in FIG. 6 , the portion of the first adhesive insulating layer 350 of the embodiment closer to the pressure-bonded portion 620 than the reference position 630 has the same shape as the first substrate 360 ​​in a plan view. That is, the first adhesive insulating layer 350 of the embodiment has a square U-shape with the reference position 630 as the bottom. Specifically, the first adhesive insulating layer 350 of the embodiment has a base 351 corresponding to the bottom of the square U-shape, and two extension portions 352 extending from the base 351 toward the pressure-bonded portion 620 along the second direction Dy. In addition, a notch 353 is formed between the two extension portions 352 facing each other in the first direction Dx. The notch 353 is a notch obtained by removing a layer that constitutes the first adhesive insulating layer 350. Using the shape of a katakana character as an example, the portion of the first adhesive insulating layer 350 in the non-detection area 599 of the embodiment can be said to be U-shaped when viewed from above with the reference position 630 side to the right.

[0057] 6 , the insulating layer 340 of the embodiment, on the side of the pressure-bonded portion 620 from the reference position 630, has a rectangular shape in a plan view. Regarding the part of the insulating layer 340 on the side of the pressure-bonded portion 620 from the reference position 630, the shape of the insulating layer 340 will be explained in comparison with the first substrate 360. The dimensions of the insulating layer 340 in the first direction Dx and the second direction Dy are the same as those of the first substrate 360. However, the insulating layer 340 does not have an opening corresponding to the notch 363 formed in the first substrate 360.

[0058] As shown by "fourth layer" in FIG. 6 , the adhesive layer 410 of the embodiment, closer to the pressure-bonded portion 620 than the reference position 630, has a rectangular shape in a plan view. Regarding the shape of the adhesive layer 410, the portion closer to the pressure-bonded portion 620 than the reference position 630 will be described in comparison with the insulating layer 340. The adhesive layer 410 has the same dimension in the first direction Dx as the insulating layer 340, but is shorter in the second direction Dy than the insulating layer 340. In other words, the width of the adhesive layer 410 in the second direction Dy, with the reference position 630 as one end, is smaller than that of the insulating layer 340. The width in the second direction Dy, with the reference position 630 as one end, can be said to be the degree of extension in the second direction Dy from the reference position 630 toward the pressure-bonded portion 620.

[0059] As shown by "fifth layer" in Figure 6, the portion of the additional structure-retaining portion 450 of the embodiment closer to the pressure-bonded portion 620 than the reference position 630 is rectangular in plan view. Regarding the portion closer to the pressure-bonded portion 620 than the reference position 630, the shape of the additional structure-retaining portion 450 will be described in comparison with the insulating layer 340 and the adhesive layer 410. The additional structure-retaining portion 450 has the same dimension in the first direction Dx as the insulating layer 340 and the adhesive layer 410, but is shorter than the insulating layer 340 and longer than the adhesive layer 410 in the second direction Dy. In other words, the width of the additional structure-retaining portion 450 in the second direction Dy, with one end at the reference position 630, is smaller than that of the insulating layer 340 and larger than that of the adhesive layer 410.

[0060] Furthermore, the extending portions 362 and 352 do not overlap with the adhesive layer 410 and the additional structural maintaining portion 450 in a plan view. Therefore, the adhesive layer 410 and the additional structural maintaining portion 450 are not present within the range where the cutout portions 363 and 353 are formed in a plan view. In other words, the width of the base portions 361 and 351 in the second direction Dy, with the reference position 630 as one end, is greater than that of the adhesive layer 410 and the additional structural maintaining portion 450.

[0061] As shown in "Terminal Portion" in FIG. 6, the non-detection region 599 of the embodiment has a first portion 515, a second portion 520, a third portion 530, a fourth portion 540, and a fifth portion 550.

[0062] Explaining the correspondence with Figure 4, the first portion 515 and the second portion 520 are closer to the base portion 610 than the boundary line 600. The terminal portion 500, the third portion 530, the fourth portion 540, and the fifth portion 550 are closer to the crimped portion 620 than the boundary line 600. The boundary between the second portion 520 and the third portion 530 corresponds to the boundary line 600. Note that Figure 6 and other figures schematically illustrate only the portion of the wiring extending from the terminal portion 500 toward the reference position 630, i.e., the wiring formed by the end electrode 110 and the wiring 331 described with reference to Figures 4 and 5, within the range up to the second portion 520, and the portion within the range of the first portion 515 is not illustrated.

[0063] The first portion 515 is a portion where the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the wiring portion 33, the adhesive layer 410, and the additional structural maintaining portion 450 overlap. The second portion 520 is a portion where the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the wiring portion 33, and the additional structural maintaining portion 450 overlap. That is, the second portion 520 does not include the adhesive layer 410. The third portion 530 is a portion where the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, and the wiring portion 33 overlap. That is, the third portion 530 does not include the adhesive layer 410 and the additional structural maintaining portion 450. Note that the portion of the first substrate 360 ​​included in the first portion 515, the second portion 520, and the third portion 530 is the base 361. Furthermore, the portion of the first adhesive insulating layer 350 included in the first portion 515 , the second portion 520 , and the third portion 530 is a base portion 351 .

[0064] The fourth portion 540 is an overlapping portion among the extending portion 362, the extending portion 352, and the insulating layer 340. The fifth portion 550 is an overlapping portion among the notched portion 363, the notched portion 353, the insulating layer 340, and the wiring portion 33. The terminal portion 500 is located within the fifth portion 550 in a plan view.

[0065] Fig. 7 is a cross-sectional view taken along line VII-VII of the "terminal portion" in Fig. 6. Fig. 7 includes a Dy-Dz cross-sectional view of the fourth portion 540. Note that Figs. 7, 8, and 9 illustrate a cross section of one end 71 having a terminal 720 that is crimped to the terminal portion 500 of the sensor substrate 21, together with the sensor substrate 21. Similarly, Figs. 11, 12, 13, 15, 16, 17, 19, 20, 21, 23, 24, and 25, which will be described later, also illustrate a cross section of one end 71 having a terminal 720 that is crimped to the terminal portion 500 of the sensor substrate 21, together with the sensor substrate 21.

[0066] As described with reference to Fig. 6 , the fourth portion 540 is a portion where the extending portion 362, the extending portion 352, and the insulating layer 340 overlap. That is, the fourth portion 540 does not include the wiring portion 33, the adhesive layer 410, or the additional structure maintaining portion 450. Therefore, in Fig. 7 , a gap 670 is formed between the insulating layer 340, which faces the pressure-bonded portion 620 side of the boundary line 600 in the third direction Dz, and the one end 71.

[0067] Fig. 8 is a cross-sectional view taken along line VIII-VIII of the "terminal portion" in Fig. 6. Fig. 8 includes a Dy-Dz cross-sectional view of terminal portion 500. Note that Fig. 8 is a cross-sectional view at the position of terminal 504 in terminal portion 500, and therefore terminal 504 is illustrated as an example, but the Dy-Dz cross-sectional views of terminal portion 500 other than terminal 504 are similar to the Dy-Dz cross-sectional view of terminal 504.

[0068] As described with reference to Fig. 4 , the terminal portion 500 is formed in the wiring portion 33. Furthermore, as described with reference to Fig. 6 , the fifth portion 550 where the terminal portion 500 is located overlaps the notch portion 363, the notch portion 353, and the insulating layer 340. Therefore, within the range where the fifth portion 550 is formed in Fig. 8 , the wiring portion 33 overlaps the insulating layer 340 but does not overlap the first substrate 360 ​​or the first adhesive insulating layer 350.

[0069] The extending portion 362, the extending portion 352, and the insulating layer 340 shown in FIG. 7 are aligned in the second direction Dy from the base portion 610 toward the crimped portion 620. The shapes of the extending portion 362, the extending portion 352, and the insulating layer 340 are those before the terminal portion 500 and the terminal 720 are crimped together. On the other hand, the first substrate 360, the first adhesive insulating layer 350, and the insulating layer 340 shown in FIG. 8 are curved in a portion relatively closer to the boundary line 600 on the crimped portion 620 side, and are shaped to follow the one end 71 in a portion relatively farther from the boundary line 600. The shapes of the first substrate 360, the first adhesive insulating layer 350, and the insulating layer 340 are those during and after the terminal portion 500 and the terminal 720 are crimped together. The shapes of the extension portion 362, extension portion 352, and insulating layer 340 in the range shown in Figure 7 become the same as the shapes of the first substrate 360, first adhesive insulating layer 350, and insulating layer 340 shown in Figure 8 during and after the terminal portion 500 and terminal 720 are crimped together.

[0070] Fig. 9 is a cross-sectional view of the "terminal portion" taken along line IX-IX in Fig. 6. Fig. 9 includes a cross-sectional view of the terminal portion 500 taken along line Dx-Dz.

[0071] The one end 71 has a plurality of terminals 720. The pitch of the plurality of terminals 720 arranged in one direction (the first direction Dx shown in FIGS. 8 and 9 ) corresponds to the pitch of the plurality of terminals arranged in one direction (the first direction Dx shown in FIGS. 8 and 9 ) in the terminal section 500. In the embodiment, the terminal section 500 is provided with 12 terminals (nine of which are connected to the wiring 331), and therefore the number of terminals 720 is also 12. Note that the number of terminals in the terminal section 500 and the number of terminals 720 are not limited to 12, and may be 11 or less, or 13 or more.

[0072] The terminal 720 is electrically connected to the conductive layer 703 of the one end 71. The one end 71 has a layered structure including a conductive layer such as the conductive layer 703 and insulating layers such as the insulating layers 701 and 702 that face each other across the conductive layer. In FIG. 8 , the insulating layers 701 and 702 face each other in the third direction Dz, sandwiching one conductive layer 703, and the one end 71 has a single conductive layer. However, the specific configuration of the one end 71 is not limited to this. The one end 71 may have multiple conductive layers. An insulating layer is interposed between the multiple conductive layers. Wiring is formed in the conductive layer such as the conductive layer 703. The wiring electrically connects the terminal 720 to circuits such as the control circuit 122 and the power supply circuit 123.

[0073] In the embodiment, a recess 800 is formed around the terminal 720. The recess 800 is an insulating layer that is exposed on the sensor substrate 21 side out of the insulating layer provided at the one end 71, and is a recess in the third direction Dz that is formed in the range where the terminal 720 is formed and around this range when viewed from a plan view. In the example shown in FIGS. 8 and 9 , the insulating layer that is exposed on the sensor substrate 21 side is the insulating layer 701. It can be said that the terminal 720 protrudes in the third direction Dz towards the sensor substrate 21 side, with the Dx-Dy plane of the recess 800 as the reference.

[0074] The terminal portion 500 and the terminal 720 are pressure-bonded with an intervening layer 730 sandwiched therebetween. The intervening layer 730 is an anisotropic conductive film, for example, an anisotropic conductive film (ACF). The intervening layer 730 includes, for example, a plurality of conductive particles. The conductive particles are minute particulate conductors. When the conductive particles are considered as spheres, their diameter is, for example, about 5 μm. Note that the thickness of the intervening layer 730 in the third direction Dz before pressure-bonding is, for example, about 25 μm, but becomes about 5 μm after pressure-bonding.

[0075] In FIG. 9 , a configuration including an intervening layer 730 and an unwired terminal 501 crimped to a terminal 720 via the intervening layer 730 is shown as a crimped portion 801. The crimped portion 80n has the same configuration as the crimped portion 801, except that the unwired terminal 501 is replaced with the unwired terminal 50n or a reference symbol attached to the terminal. For example, when n = 2, the crimped portion 802 has the same configuration as the crimped portion 801, except that the unwired terminal 501 is replaced with the unwired terminal 502. In the embodiment, n is a natural number ranging from 2 to 12. The maximum value of n corresponds to the total number of terminals and unwired terminals provided in the terminal portion 500 and the number of terminals 720. In the embodiment, when n is a natural number ranging from 3 to 11, the description of the unwired terminal 50n is replaced with the description of a terminal (terminals 503, 504, ..., 511).

[0076] When crimping the terminal portion 500 and the terminals 720, the crimping head 900 is pressed against the sensor substrate 21 from the side where the terminal portion 500 on the sensor substrate 21 faces the plurality of terminals 720 on one end 71.

[0077] In this embodiment, as shown in FIGS. 8 and 9 , the crimping head 900 is a crimping head provided to fit within the fifth portion 550. The crimping head 900 is disposed opposite the terminal portion 500 with the insulating layer 340 sandwiched therebetween, and applies a pressing force 901 to the sensor substrate 21 to press the sensor substrate 21 toward the one end 71. Although not shown in FIGS. 8 and 9 , the one end 71 is placed on a work table that is aligned with the Dx-Dy plane. The one end 71 is in contact with the work table on the insulating layer 702 side, and is therefore supported so that it is aligned entirely along the Dx-Dy plane. In this state, the pressing force 901 is applied from the crimping head 900 to the sensor substrate 21 between the one end 71 and the crimping head 900, thereby crimping the terminal portion 500 and the terminal 720 together.

[0078] When crimping the terminal portion 500 and the terminal 720, the crimping head 900 is heated to a temperature significantly higher than room temperature and pressed against the sensor substrate 21. To give a specific example, the temperature of the crimping head 900 when crimping the terminal portion 500 and the terminal 720 is about 240°C. When the crimping head 900 at this temperature is pressed against the sensor substrate 21, the intervening layer 730 between the terminal portion 500 and the terminal 720 is heated to about 170°C, and the terminal portion 500 and the terminal 720 are joined together.

[0079] As an example of the thickness in the third direction Dz of each of the components included in the sensor substrate 21, the first substrate 360 ​​is approximately 20 μm. The first adhesive insulating layer 350 is approximately 20 μm. The insulating layer 340 is approximately 10 μm. The adhesive layer 410 is approximately 20 μm. That is, the thickness in the third direction Dz of the laminated structure of an insulating layer such as the insulating layer 340, an adhesive insulating layer such as the first adhesive insulating layer 350, and a substrate such as the first substrate 360 ​​is approximately 50 μm in this embodiment. The thickness in the third direction Dz of the additional structure maintaining portion 450 is also approximately 50 μm in this embodiment.

[0080] 9 , in this embodiment, the extension portion 362 and the extension portion 352 extend together with the insulating layer 340 to the tip of the sensor substrate 21 on the side of the pressure-bonded portion 620. The extension portion 362 and the extension portion 352 suppress warping of the insulating layer 340 and the wiring portion 33 on the side of the pressure-bonded portion 620 of the boundary line 600. Specifically, in the sensor substrate 21, substrates that function as structure-maintaining layers, such as the first substrate 360 ​​and the second substrate 440, have rigidity that maintains the overall shape of the sensor substrate 21 in a state that is generally along the Dx-Dy plane. Meanwhile, on the side of the sensor substrate 21 on the side of the pressure-bonded portion 620 of the boundary line 600 where the additional structure-maintaining portion 450 is not provided, the first substrate 360 ​​maintains the structure with its rigidity. More specifically, the extension portion 362 extends further toward the crimped portion 620 than the boundary line 600 so as not to overlap with the position of the terminal portion 500 against which the crimping head 900 is pressed in a plan view, thereby preventing the insulating layer 340 on the crimped portion 620 side than the boundary line 600 from warping.

[0081] 6 and 8 and 9, in the embodiment, the first adhesive insulating layer 350 and the terminal portion 500 do not overlap in plan view. In other words, the first adhesive insulating layer 350 is not within the range where the pressing force 901 is applied from the crimping head 900.

[0082] As described above, in the embodiment, the terminal portion 500 does not overlap the first adhesive insulating layer 350 and the second adhesive insulating layer 430. In addition, the first substrate 360 ​​has a portion (extension 362) that functions as a support portion that supports the insulating layer 340 around the terminal portion 500. The support portion is continuous with the first substrate 360 ​​provided in the detection region 680.

[0083] Furthermore, in the embodiment, the first substrate 360 ​​has two extending portions 362 extending from the detection region 680 side toward the non-detection region 599 side, and the first adhesive insulating layer 350 has two extending portions 352 extending from the detection region 680 side toward the non-detection region 599 side. The two extending portions 362 and the two extending portions 352 are arranged opposite each other with the terminal portion 500 interposed therebetween. The first substrate 360 ​​and the first adhesive insulating layer 350 are not provided in a fifth portion 550 corresponding to the range sandwiched between the two extending portions 362 and the two extending portions 352. The second adhesive insulating layer 430 and the second substrate 440 are not provided in the fifth portion 550 and a fourth portion 540 corresponding to the range where the two extending portions 362 and the two extending portions 352 are provided. The two extending portions 362 function as support portions.

[0084] According to this embodiment, it is possible to more reliably crimp the terminal portion 500 and the terminal 720. Hereinafter, a comparative example in which the first adhesive insulating layer 350 is located within the range in which the pressing force 901 is applied from the crimping head 900 will be described with reference to FIGS.

[0085] 10 is a plan view schematically showing the layered structure of a non-detection region 599 in a comparative example. In the comparative example, the first substrate 360 ​​of the embodiment is replaced with an overlapping portion 369. Also, in the comparative example, the first adhesive insulating layer 350 of the embodiment is replaced with an overlapping portion 359. Note that the overlapping portion 369 has the same configuration as the first substrate 360, except for its shape when viewed from a plan view. Also, the overlapping portion 359 has the same configuration as the first adhesive insulating layer 350, except for its shape when viewed from a plan view.

[0086] Specifically, in the embodiment, the first substrate 360 ​​having the base 361 and the extending portion 362 and having the cutout portion 363 formed therein is illustrated as the "first layer" in Fig. 6, but in the comparative example, a rectangular overlapping portion 369 having the same dimensions as the insulating layer 340 is illustrated as the "first layer" in Fig. 10. Also, in the embodiment, the first adhesive insulating layer 350 having the base 351 and the extending portion 352 and having the cutout portion 353 formed therein is illustrated as the "second layer" in Fig. 6, but in the comparative example, a rectangular overlapping portion 359 having the same dimensions as the insulating layer 340 is illustrated as the "second layer" in Fig. 10.

[0087] Fig. 11 is a cross-sectional view taken along line XI-XI of the "terminal portion" in Fig. 10. Fig. 12 is a cross-sectional view taken along line XII-XII of the "terminal portion" in Fig. 10. Fig. 13 is a cross-sectional view taken along line XIII-XIII of the "terminal portion" in Fig. 10. Figs. 11, 12, and 13 show the terminal portion 500 and the terminal 720 during and after crimping.

[0088] In the comparative example, as shown in the relationship between the "second layer" and the "terminal portion" in FIG. 10 and in FIGS. 12 and 13 , the overlapping portion 359 and the terminal portion 500 overlap in plan view. That is, the overlapping portion 359 is within the range where the pressing force 901 is applied from the crimping head 900. In this comparative example, the overlapping portion 359 interposed between the crimping head 900 and the terminal portion 500 softens due to the heat from the crimping head 900 and deforms under the pressing force 901. Due to this deformation of the overlapping portion 359, part of the pressing force 901 is dispersed to a vector in a direction different from the vector in the direction in which the terminal of the terminal portion 500 and the terminal 720 are crimped together. For this reason, in the comparative example, the terminal of the terminal portion 500 may not be sufficiently crimped together with the terminal 720.

[0089] In contrast, in the embodiment, as described above, the first adhesive insulating layer 350 and the terminal portion 500 do not overlap in plan view. That is, the first adhesive insulating layer 350 is not within the range where the pressing force 901 is applied from the crimping head 900. This makes it possible to achieve more reliable crimping between the terminal portion 500 and the terminal 720.

[0090] Furthermore, in the comparative example, as shown in the relationship between the "second layer" and the "terminal portion" in FIG. 10 and in FIGS. 12 and 13 , the overlapping portion 369 and the terminal portion 500 overlap in plan view. That is, the overlapping portion 369 is located within the range where the pressing force 901 is applied from the crimping head 900. In this comparative example, the overlapping portion 369 interposed between the crimping head 900 and the terminal portion 500 absorbs some of the thermal energy of the crimping head 900, so less thermal energy is transferred to the intervening layer 730 than when the overlapping portion 369 is not present. In contrast, in the embodiment, the first substrate 360 ​​and the terminal portion 500 do not overlap in plan view. That is, the first substrate 360 ​​is not located within the range where the pressing force 901 is applied from the crimping head 900. This allows the thermal energy for crimping to be applied to the intervening layer 730 more efficiently.

[0091] As described above, according to the embodiment, the detection device 1 includes a detection region 680 that functions as an optical sensor and is formed by stacking the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the electrode layer including the electrode 312 and the end electrode 110, the electron injection layer 303 corresponding to the first buffer layer, the active layer 301, the hole injection layer 302 corresponding to the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440, and a non-detection region 599 that is formed by stacking the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the second adhesive insulating layer 430, and the second substrate 440. Of the non-detection region 599, a terminal section 500 that is provided with “first terminals (terminals 503, 504, ..., 511) electrically connected to the electrode layer (electrode 11, electrode 312)” does not overlap the first adhesive insulating layer 350 and the second adhesive insulating layer 430. The first substrate 360 ​​has a support portion (e.g., extension portion 362) that supports the insulating layer 340 around the terminal portion 500. The support portion is continuous with the first substrate 360 ​​provided in the detection region 680. This allows the terminals of the terminal portion 500 and the terminals 720 to be crimped more reliably. Furthermore, the presence of the support portion prevents the insulating layer 340 from warping back when the terminals of the terminal portion 500 and the terminals 720 are aligned in the crimping process, making the alignment difficult.

[0092] Furthermore, the first substrate 360 ​​has two extending portions 362 extending from the detection region 680 side toward the non-detection region 599 side, and the first adhesive insulating layer 350 has two extending portions 352 extending from the detection region 680 side toward the non-detection region 599 side. The two extending portions 362 and the two extending portions 352 are arranged opposite each other with the terminal portion 500 interposed therebetween. The first substrate 360 ​​and the first adhesive insulating layer 350 are not provided in a fifth portion 550 corresponding to the range sandwiched between the two extending portions 362 and the two extending portions 352. The second adhesive insulating layer 430 and the second substrate 440 are not provided in a fourth portion 540 corresponding to the range where the fifth portion 550, the two extending portions 362, and the two extending portions 352 are provided. The two extending portions 362 function as support portions. This makes it possible to more reliably crimp the terminal of the terminal portion 500 and the terminal 720. Furthermore, the extension portion 362 can prevent the insulating layer 340 from warping.

[0093] Furthermore, the first terminals (terminals 503, 504, ..., 511) are connected to second terminals (terminals 720) provided on the additional board (circuit board 70), and the detection area 680 overlaps with the circuit board 70. This allows the boards provided in the detection device 1 to be made more compact in plan view.

[0094] Furthermore, the first terminals (terminals 503, 504, ..., 511) are in the same layer as the electrode layer including the electrodes 11 and 312. This allows the process of forming the first terminals to be combined with the process of forming the electrodes 11 and 312 when manufacturing the sensor substrate 21. This allows the number of manufacturing processes for the sensor substrate 21 to be reduced.

[0095] The optical sensor in the detection region 680 is an organic photodiode OPD. This makes it possible to detect multiple wavelengths of light without using a color filter. The organic photodiode OPD has advantages over other types of optical sensors in that it can be formed on a flexible substrate such as the sensor substrate 21 and it is relatively easy to enlarge the detection region 680.

[0096] (Modifications) Modifications 1, 2, and 3, which are modifications that are partially different from the embodiment, will be described below in order. In the description of the modifications, the same components as those in the embodiment will be denoted by the same reference numerals and description thereof will be omitted.

[0097] (Modification 1) Fig. 14 is a plan view schematically showing the layered structure of the non-detection region 599 in Modification 1. Fig. 15 is a cross-sectional view taken along XV-XV in the "terminal portion" of Fig. 14. Fig. 16 is a cross-sectional view taken along XVI-XVI in the "terminal portion" of Fig. 14. Fig. 17 is a cross-sectional view taken along XVII-XVII in the "terminal portion" of Fig. 14.

[0098] While the embodiment includes the first substrate 360 ​​and the first adhesive insulating layer 350, the first substrate 360 ​​and the first adhesive insulating layer 350 are not provided in Modification 1. Note that Modification 1 and Modification 3 described below do not include the first substrate 360 ​​and the first adhesive insulating layer 350 (see FIG. 4 ) of the embodiment, as well as the non-detection region 599. That is, in Modifications 1 and 3, what is exposed to the outside on the opposite side of the wiring portion 33 from the organic photodiode OPD is the insulating layer 340, as shown in FIGS. The detection devices according to the configurations of Modifications 1 and 3 include a detection region 680 that functions as an optical sensor and is formed by stacking an insulating layer 340, an electrode layer including an electrode 312 and an end electrode 110, an electron injection layer 303 corresponding to a first buffer layer, an active layer 301, a hole injection layer 302 corresponding to a second buffer layer, a second adhesive insulating layer 430, and a second substrate 440, and a non-detection region 599 that is formed by stacking the insulating layer 340, the second adhesive insulating layer 430, and the second substrate 440. Of the non-detection region 599, a terminal section 500 that includes first terminals (terminals 503, 504, ..., 511) electrically connected to the electrode layer (electrode 11, electrode 312) does not overlap the second adhesive insulating layer 430. The second substrate 440 has a support section that supports the insulating layer 340 around the terminal section 500.

[0099] In the "first layer" of Fig. 14, the absence of the first substrate 360 ​​is indicated by a dashed rectangle 368. In the "second layer" of Fig. 14, the absence of the first adhesive insulating layer 350 is indicated by a dashed rectangle 358.

[0100] Furthermore, as shown by "fourth layer" in FIG. 14 , the adhesive layer 410 of Modification 1 has two extension portions 418. The two extension portions 418 extend from the adhesive layer 410 toward the pressure-bonded portion 620 along the second direction Dy. A notch 414 is formed between the two extension portions 418 that face each other in the first direction Dx. The extension portion 418 is a notch where a layer constituting the adhesive layer 410 is removed. Therefore, the adhesive layer 410 of Modification 1, on the pressure-bonded portion 620 side relative to the reference position 630, can be said to have an angular U-shape with the reference position 630 side as the base in a plan view. Using the shape of a katakana character as an example, the portion of the adhesive layer 410 of Modification 1 within the non-detection region 599 can be said to have a U-shape in a plan view when the reference position 630 side is to the right.

[0101] 14 , the additional structure-retaining portion 450 of Modification 1 is provided with two extending portions 458. The two extending portions 458 extend from the additional structure-retaining portion 450 toward the pressure-bonded portion 620 along the second direction Dy. Like the additional structure-retaining portion 450, the extending portion 458 is formed by laminating an insulating layer 420, a second adhesive insulating layer 430, and a second substrate 440. A notch 454 is formed between the two extending portions 458 that face each other in the first direction Dx. The notch 454 is a notch that eliminates the layers that constitute the additional structure-retaining portion 450, i.e., the insulating layer 420, the second adhesive insulating layer 430, and the second substrate 440. Therefore, it can be said that the portion of additional structure maintaining portion 450 of modified example 1 closer to crimped portion 620 than reference position 630 has an angular U-shape in plan view with the reference position 630 side as the base. Using the shape of a katakana character as an example, the portion of additional structure maintaining portion 450 of modified example 1 within non-detection region 599 can be said to be U-shaped in plan view when reference position 630 side is to the right.

[0102] 17 , the extending portions 418 and the extending portions 458 are accommodated within the recessed portion 808. The recessed portion 808 is a recessed portion 800 formed to accommodate the two extending portions 418 facing each other in the first direction Dx and the two extending portions 458 facing each other in the first direction Dx.

[0103] As shown in the “terminal portion” of FIG. 14 , the non-detection region 599 of the first modification example has a first portion 518 , a second portion 528 , a third portion 538 , and a fourth portion 548 .

[0104] The first portion 518 is a portion where the insulating layer 340, the wiring portion 33, the adhesive layer 410, and the additional structural support portion 450 overlap. The second portion 528 is a portion where the insulating layer 340, the wiring portion 33, and the additional structural support portion 450 overlap. The third portion 538 is a portion where the insulating layer 340, the wiring portion 33, the extending portion 418, and the extending portion 458 overlap. That is, the third portion 538 does not include the first substrate 360, the first adhesive insulating layer 350, the adhesive layer 410, and the additional structural support portion 450. The terminal portion 500 is located within the third portion 538 in a plan view. The fourth portion 548 is a portion where the insulating layer 340, the extending portion 418, and the extending portion 458 overlap.

[0105] In this modified example 1, the second substrate 440 included in the additional structure-retaining portion 450 has a support portion (extending portion 458) that supports the insulating layer 340 around the terminal portion 500. The portion of the second substrate 440 that functions as the support portion is continuous with the second substrate 440 of the additional structure-retaining portion 450 that is provided in the detection region 680. Also, in modified example 1, the second adhesive insulating layer 430 and the second substrate 440 included in the additional structure-retaining portion 450 have two extending portions 458 that extend from the detection region 680 side to the non-detection region 599 side. The two extending portions 458 are arranged opposite each other with the terminal portion 500 interposed therebetween. The second adhesive insulating layer 430 and the second substrate 440 are not provided in a third portion 538 that corresponds to the range sandwiched between the two extending portions 458. The first substrate 360 ​​and the first adhesive insulating layer 350 are not provided in the third portion 538 and the fourth portion 548 corresponding to the range where the two extending portions 458 are provided. Of the laminated structures constituting the two extending portions 458, the second substrate 440 is disposed to face each other in the first direction Dx with the terminal portion 500 interposed therebetween, and functions as a support portion that supports the insulating layer 340.

[0106] As described above, except for the points noted above, Modification 1 is the same as the embodiment. Modification 1 allows the terminals of terminal portion 500 to be more reliably crimped to terminal 720. Furthermore, the portion of second substrate 440 included in extension portion 458 can suppress warping of insulating layer 340.

[0107] (Modification 2) Fig. 18 is a plan view schematically showing the layered structure of the non-detection region 599 in Modification 2. Fig. 19 is a cross-sectional view taken along XIX-XIX in the "terminal portion" of Fig. 18. Fig. 20 is a cross-sectional view taken along XX-XX in the "terminal portion" of Fig. 18. Fig. 21 is a cross-sectional view taken along XXI-XXI in the "terminal portion" of Fig. 18.

[0108] As shown by "first layer" in Fig. 18 , the portion of first substrate 360 ​​in the embodiment that is within non-detection region 599 is replaced with substrate end portion 367 in Modification 2. Except for this, Modification 2 is similar to the embodiment, as shown by "second layer," "third layer," "fourth layer," and "fifth layer" in Fig. 18 .

[0109] Unlike the first substrate 360, the substrate end 367 does not have the extending portion 362, nor does it have the notched portion 363 sandwiched between the extending portions 362 facing each other in the first direction Dx. The shape of the substrate end 367 in the non-detection region 599 is rectangular, similar to the insulating layer 340 that overlaps it in the non-detection region 599.

[0110] As shown by "terminal portion" in FIG. 18 , the third portion 530 in the embodiment is replaced with a third portion 537 in Modification 2. The third portion 537 is a portion where the substrate end portion 367, the first adhesive insulating layer 350, the insulating layer 340, and the wiring portion 33 overlap. Furthermore, the fourth portion 540 in the embodiment is replaced with a fourth portion 547 in Modification 2. The fourth portion 547 is a portion where the substrate end portion 367, the extension portion 352, and the insulating layer 340 overlap. Furthermore, the fifth portion 550 in the embodiment is replaced with a fifth portion 557 in Modification 2. The fifth portion 557 is a portion where the substrate end portion 367, the cutout portion 353, the insulating layer 340, and the wiring portion 33 overlap.

[0111] In this second modification, the first adhesive insulating layer 350 has two extending portions 352 extending from the detection region 680 side to the non-detection region 599 side. The two extending portions 352 are arranged opposite each other with the terminal portion 500 in between. The first adhesive insulating layer 350 is not provided in a fifth portion 557 corresponding to the range sandwiched between the two extending portions 352. A substrate end portion 367 functioning as a support portion is provided in the fifth portion 557 and in a fourth portion 547 corresponding to the range where the two extending portions 352 are provided, and the second adhesive insulating layer 430 and the second substrate 440 are not provided.

[0112] In Figures 20 and 21, a gap is formed between the substrate end 367 and the insulating layer 340 due to the cutout portion 353, but when a pressing force 901 is applied from the crimping head 900, the gap is crushed and the substrate end 367 and the insulating layer 340 come into contact with each other, and the pressing force 901 is transmitted to the insulating layer 340 as a pressing force that crimps the terminal of the terminal portion 500 and the terminal 720 together.

[0113] As described above, except for the points noted above, the second modification is the same as the embodiment. According to the second modification, the terminal of the terminal portion 500 can be more reliably crimped to the terminal 720. Furthermore, the substrate end portion 367 can suppress warping of the insulating layer 340.

[0114] (Modification 3) Fig. 22 is a plan view schematically showing the layered structure of the non-detection region 599 in Modification 3. Fig. 23 is a cross-sectional view taken along line XXIII-XXIII of the "terminal portion" in Fig. 22. Fig. 24 is a cross-sectional view taken along line XXIV-XXIV of the "terminal portion" in Fig. 22. Fig. 25 is a cross-sectional view taken along line XXV-XXV of the "terminal portion" in Fig. 22.

[0115] While the embodiment includes a first substrate 360 ​​and a first adhesive insulating layer 350, in Modification 3, the first substrate 360 ​​and the first adhesive insulating layer 350 are not provided, as in Modification 1. In the "first layer" of Fig. 22, the absence of the first substrate 360 ​​is indicated by a dashed rectangle 368. In the "second layer" of Fig. 22, the absence of the first adhesive insulating layer 350 is indicated by a dashed rectangle 358.

[0116] 22 , in Modification 3, the portion of the adhesive layer 410 in the embodiment that is within the non-detection region 599 is replaced with an opening forming portion 416. The opening forming portion 416 is the adhesive layer 410 in which an opening 4163 is provided in a portion that overlaps with the terminal portion 500. The opening forming portion 416 has two edge portions 4161 that face each other in the first direction Dx with the opening 4163 sandwiched therebetween, an edge portion 4162 that connects one end of the two edge portions 4161 to each other, and an edge portion 4160 that connects the other end of the two edge portions 4161 to each other. The edge portion 4160 is continuous with the adhesive layer 410 on the detection region 680 side relative to the non-detection region 599.

[0117] 22 , in Modification 3, the additional structure-retaining portion 450 in the embodiment is replaced with an opening-forming portion 456. The opening-forming portion 456 is the additional structure-retaining portion 450 having an opening 4563 provided in a portion overlapping the terminal portion 500. The opening-forming portion 456 has two edge portions 4561 facing each other in the first direction Dx with the opening 4563 interposed therebetween, an edge portion 4562 connecting one end of the two edge portions 4561 to each other, and an edge portion 4560 connecting the other end of the two edge portions 4561 to each other. The edge portion 4560 is continuous with the additional structure-retaining portion 450 closer to the detection region 680 than the non-detection region 599. That is, like the additional structure-retaining portion 450, the opening-forming portion 456 has a configuration in which the insulating layer 420, the second adhesive insulating layer 430, and the second substrate 440 are stacked.

[0118] 24 , when the terminal of terminal portion 500 is crimped to terminal 720, edge portion 4162 and edge portion 4562 ride up onto one end 71 on the crimped portion 620 side of boundary line 600. Also, as shown in FIG. 25 , opening forming portion 416 and opening forming portion 456 are contained within recess 806. Depression 806 is recess 800 formed to accommodate two edge portions 4161 facing in the first direction Dx and two edge portions 4561 facing in the first direction Dx.

[0119] As shown by "Terminal Portion" in FIG. 22 , the non-detection region 599 of Modification Example 3 has a first portion 516, a second portion 526, a third portion 536, a fourth portion 546, and a fifth portion 556. The first portion 516 is a portion where the insulating layer 340, the wiring portion 33, the edge portion 4160, and the edge portion 4560 overlap. The second portion 526 is a portion where the insulating layer 340, the wiring portion 33, and the edge portion 4560 overlap. The third portion 536 is a portion where the insulating layer 340, the wiring portion 33, the opening 4163, and the opening 4563 overlap. In other words, the third portion 536 does not include the adhesive layer 410 or the additional structure-maintaining portion 450. Therefore, the third portion 536 does not include the second adhesive insulating layer 430 and the second substrate 440 included in the additional structure-maintaining portion 450. The terminal portion 500 is located within the third portion 536 in a plan view. The fourth portion 546 is a portion where the insulating layer 340, the edge portion 4161, and the edge portion 4561 overlap. The fifth portion 556 is a portion where the insulating layer 340, the edge portion 4162, and the edge portion 4562 overlap.

[0120] In this modified example 3, the second substrate 440 included in the additional structure-maintaining portion 450 has a support portion (opening forming portion 456) that supports the insulating layer 340 around the terminal portion 500. The portion of the second substrate 440 that functions as the support portion is continuous with the second substrate 440 of the additional structure-maintaining portion 450 provided in the detection region 680. Also, in modified example 3, an edge portion 4561 is provided in the opening forming portion 456 at a portion that overlaps with the terminal portion 500. That is, the second adhesive insulating layer 430 and the second substrate 440 are provided with the edge portion 4561 at a portion that overlaps with the terminal portion 500. The additional structure-maintaining portion 450 is not provided at the edge portion 4561. That is, the second adhesive insulating layer 430 and the second substrate 440 are not provided at the edge portion 4561. The periphery of the edge portion 4561 is bordered by the edge portion 4560, the edge portion 4561, and the edge portion 4562. The first substrate 360 ​​and the first adhesive insulating layer 350 are not provided around the opening 4563, and the edge portion 4561 of the opening forming portion 456 that borders the periphery of the edge portion 4561 is arranged to face the first direction Dx across the terminal portion 500 and functions as a support portion that supports the insulating layer 340.

[0121] As described above, except for the points noted above, Modification 3 is the same as the embodiment. According to Modification 3, the terminals of terminal portion 500 and terminal 720 can be more reliably crimped together than according to Modification 2. Furthermore, the portion of second substrate 440 included in opening forming portion 456 can suppress warping of insulating layer 340.

[0122] The form of the detection device 1 is not limited to the ring-shaped form described with reference to Figures 1 and 2, and any form of device in which light detection by an organic photodiode OPD is expected may be applied.

[0123] Furthermore, in the above-described embodiment, the first optical sensor 10A and the second optical sensor 10B are provided, but the number of organic photodiodes OPD provided in the detection device is not limited to the number exemplified in the embodiment, and may be one or more.

[0124] The components of each of the above-described embodiments can be combined as appropriate. Furthermore, other effects and advantages brought about by the aspects described in the present embodiments that are obvious from the description in this specification or that can be conceived by a person skilled in the art are naturally understood to be brought about by the present invention.

[0125] REFERENCE SIGNS LIST 1 Detector 11, 312 Electrode 21 Sensor substrate 70 Circuit substrate 110 End electrode 350 First adhesive insulating layer 360 First substrate 362, 458 Extension portion 367 Substrate end portion 430 Second adhesive insulating layer 440 Second substrate 4561 Edge portion 4563 Opening 500 Terminal portion 503, 504, 505, 506, 507, 508, 509, 510, 511 Terminal 720 Terminal OPD Organic photodiode

Claims

1. A detection device comprising: a detection area functioning as an optical sensor, where a first substrate, a first adhesive insulating layer, an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, a second adhesive insulating layer, and a second substrate are laminated; and a non-detection area, where the first substrate, the first adhesive insulating layer, the insulating layer, the second adhesive insulating layer, and the second substrate are laminated; wherein a terminal portion of the non-detection area, where a first terminal electrically connected to the electrode layer is provided, does not overlap the first adhesive insulating layer or the second adhesive insulating layer; and the first substrate has a support portion that supports the insulating layer around the terminal portion, and the support portion is continuous with the first substrate provided in the detection area.

2. The detection device described in claim 1, wherein the first substrate and the first adhesive insulating layer have two extending portions extending from the detection area side to the terminal portion side, the two extending portions are arranged opposite each other with the terminal portion in between, the first substrate and the first adhesive insulating layer are not provided in the area sandwiched between the two extending portions, the second adhesive insulating layer and the second substrate are not provided in the area where the two extending portions are provided and the area sandwiched between the two extending portions, and the two extending portions of the first substrate function as the support portion.

3. The detection device described in claim 1, wherein the first adhesive insulating layer has two extending portions extending from the detection area side to the terminal portion side, the two extending portions are arranged opposite each other with the terminal portion in between, the first adhesive insulating layer is not provided in the area sandwiched between the two extending portions, the first substrate functioning as the support portion is provided in the area where the two extending portions are provided and the area sandwiched between the two extending portions, and the second adhesive insulating layer and the second substrate are not provided.

4. A detection device comprising: a detection region where an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, an adhesive insulating layer, and a substrate are laminated together and function as an optical sensor; and a non-detection region where the insulating layer, the adhesive insulating layer, and the substrate are laminated together; wherein a terminal portion of the non-detection region where a first terminal electrically connected to the electrode layer is provided does not overlap with the adhesive insulating layer; and the substrate has a support portion that supports the insulating layer around the terminal portion, and the support portion is continuous with the substrate provided in the detection region.

5. The detection device according to claim 4, wherein the substrate and the adhesive insulating layer have two extending portions extending from the detection area side to the terminal portion side, the two extending portions are arranged opposite each other with the terminal portion in between, the substrate and the adhesive insulating layer are not provided in the area sandwiched between the two extending portions, and the two extending portions of the substrate function as the support portion.

6. A detection device as described in claim 4, wherein the substrate and the adhesive insulating layer have openings in areas that overlap with the terminal portions, the substrate and the adhesive insulating layer are not provided in the openings, the periphery of the openings is bordered by the substrate and the adhesive insulating layer, and the substrate bordering the periphery of the openings functions as the support portion.

7. A detection device according to any one of claims 1 to 6, wherein the first terminal is connected to a second terminal provided on an additional substrate, and the detection area and the additional substrate overlap.

8. A detection device according to any one of claims 1 to 6, wherein the first terminal is in the same layer as the electrode layer.

9. A detection device according to any one of claims 1 to 6, wherein the light sensor is an organic photodiode.

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