Sealing material for heating apparatus, and heating apparatus

Abstract

The purpose of the present invention is to provide a novel technology that suppresses an influence of an electromagnetic wave generated from a heating apparatus.　This technology provides a sealing material for a heating apparatus that generates an electromagnetic wave, the sealing material having an electromagnetic-wave-absorbing foam. The sealing material for the heating apparatus according to the present technology may be provided with a heat-reflecting layer that covers only a part of a surface of the electromagnetic-wave-absorbing foam. In addition, the sealing material for the heating apparatus according to the present technology may be provided with a reinforcing layer between the electromagnetic-wave-absorbing foam and the heat-reflecting layer.

Description

Sealing material for heating device, and heating device

[0001] The present technology relates to a sealing material for a heating device, and more particularly to a sealing material for a heating device that generates electromagnetic waves, and a heating device that generates electromagnetic waves and is equipped with a sealing material for a heating device.

[0002] Recently, various products have been developed to realize a ubiquitous network society and expand wearable devices. Communication problems have become a problem among these products. For example, even with Wi-Fi communication in an ordinary home, communication problems can occur when heating food using a standard household microwave oven. More specifically, because microwave heating uses 2.45 GHz, communication problems can occur with 2.4 GHz Wi-Fi communication.

[0003] Under these circumstances, technologies for suppressing the effects of electromagnetic waves are being developed. For example, Patent Document 1 discloses a technology for preventing leakage of electromagnetic waves from a microwave oven door, which includes a door screen having perforations for detecting the cooking state, a sealing surface formed on the edge of the door screen and joined to a front panel formed around the entire periphery of the entrance to the cooking chamber of the microwave oven cavity to primarily block leakage of electromagnetic waves, and a door frame having a special choke structure (choke portion) formed integrally with and extending from the sealing surface to secondarily block electromagnetic waves leaking between the sealing surface and the front panel.

[0004] Furthermore, Patent Document 2 discloses an electromagnetic wave shielding gasket that includes a rod-shaped core material made of silicone foam, a sheet-like conductive coating material that covers the periphery of the side surface of the core material, and an adhesive layer that bonds the side surface of the core material to the inner wall surface of the conductive coating material, and that is sandwiched in a gap in a conductive housing to shield electromagnetic waves.

[0005] Furthermore, Patent Document 3 discloses an electrically conductive and thermally conductive gasket that includes an elastic core having a plurality of sides, a heat spreader arranged along at least two of the plurality of sides of the elastic core, and a conductive layer that is arranged along at least a portion of the heat spreader and / or covers at least a portion of the heat spreader so that a portion of the heat spreader is between the elastic core and the conductive layer.

[0006] JP 9-79588 A JP 2013-110169 A Utility Model Registration No. 3243919

[0007] As mentioned above, various technologies for suppressing the effects of electromagnetic waves are being developed, but they are still not sufficient. For example, the microwave oven door of Patent Document 1 is not designed to be completely airtight, and there is a concern that electromagnetic waves may leak through gaps in the microwave oven door. Furthermore, the gaskets of Patent Documents 2 and 3 are electromagnetic wave blocking materials. Therefore, when the gasket is placed in a gap in the microwave oven door, for example, if the gasket completely seals the gap, an electromagnetic wave blocking effect can be expected. However, if there is even a small gap, it is impossible to block electromagnetic waves leaking through the gap.

[0008] Therefore, a main object of the present technology is to provide a novel technology for suppressing the influence of electromagnetic waves generated from a heating device.

[0009] The present inventors have found that, although conventional heating devices that generate electromagnetic waves are equipped with a structure for blocking electromagnetic waves, electromagnetic waves clearly leak out, as shown in the experimental examples shown in the examples described below, and that the leaked electromagnetic waves affect various devices, communications, etc. In other words, they have found that technology for blocking electromagnetic waves cannot completely prevent electromagnetic waves from leaking from heating devices that generate electromagnetic waves. Therefore, the present inventors have changed their approach from technology for blocking electromagnetic waves to technology for absorbing electromagnetic waves, and have succeeded in effectively preventing electromagnetic waves from leaking from heating devices that generate electromagnetic waves, thereby completing the present technology.

[0010] That is, the present technology first provides a sealing material for use in a heating device that generates electromagnetic waves, the sealing material for a heating device having an electromagnetic wave absorbing foam. The sealing material for a heating device according to the present technology may include a heat reflective layer that covers only a portion of the surface of the electromagnetic wave absorbing foam. Furthermore, the sealing material for a heating device according to the present technology may include a reinforcing layer between the electromagnetic wave absorbing foam and the heat reflective layer.

[0011] The present technology next provides a heating device that generates electromagnetic waves and includes the sealing material for a heating device according to the present technology. The heating device according to the present technology can include: a main body having an opening; a door that is openably and closably attached to the main body and closes the opening; and the sealing material for a heating device that is disposed in a gap between the main body and the door so that the heat reflective layer is located on the inside. In the heating device according to the present technology, the heat reflective layer may be in contact with the main body and / or the door.

[0012] 1A is a perspective view schematically illustrating a heating device 1 that can use the heating device sealant 10 according to the present technology, and FIG. 1B is a front view schematically illustrating a heating device 1 that can use the heating device sealant 10 according to the present technology. It is a cross-sectional view taken along the X-X line in FIG. 1B. It is an enlarged view of a Y-Z portion in FIG. 2. It is a conceptual enlarged view of a Y-Z portion of a heating device 1 that uses an example different from the heating device sealant 10 shown in FIG. 3. It is a conceptual enlarged view of a Y-Z portion of a heating device 1 that uses an example different from the heating device sealant 10 shown in FIGS. 3 and 4. In the examples, A is a photograph illustrating a state in which the gap in the microwave oven door is sealed with a heat / electromagnetic wave reflecting layer, B is a photograph illustrating a state in which the microwave oven door is covered from the front to the side with an electromagnetic wave absorbing foam, and C is a photograph illustrating a state in which the gap in the microwave oven door is sealed with an electromagnetic wave absorbing foam. In the examples, it is a graph illustrating measurement results when the communication speed when the microwave oven is not in use is set to "100".

[0013] Preferred embodiments for implementing the present technology will be described below with reference to the drawings. The embodiments described below are examples of typical embodiments of the present technology, and any of the embodiments can be combined. Furthermore, these embodiments should not be construed as narrowing the scope of the present technology. Note that each drawing is a conceptual diagram that emphasizes the characteristic parts in order to clearly explain the features of the present technology, and the actual dimensions of the product and the scale of each component are not uniform. For example, some thin membrane-like structures are drawn thicker than they actually are because they would appear as mere lines if drawn at the actual scale.

[0014] 1. Heating Device Sealing Material 10 Fig. 1A is a perspective conceptual diagram schematically showing a heating device 1 in which the heating device sealing material 10 according to the present technology can be used, and Fig. 1B is a front conceptual diagram schematically showing the heating device 1 in which the heating device sealing material 10 according to the present technology can be used. Fig. 2 is a conceptual cross-sectional diagram taken along line X-X of Fig. 1B. Fig. 3 is an enlarged conceptual diagram of a Y-Z portion of Fig. 2. Note that Fig. 2 omits the heating mechanism, electromagnetic wave generating mechanism, and other internal structures of the heating device 1 that are provided in the heating device 1.

[0015] The heating device sealant 10 according to the present technology is a sealant for use in a heating device 1 that generates electromagnetic waves. The location of the heating device sealant 10 in the heating device 1 that generates electromagnetic waves can be freely designed as long as the action and effect of the present technology are not impaired. As described below, the heating device sealant 10 according to the present technology is not a sealant that simply blocks electromagnetic waves, but rather absorbs them in addition to blocking them. Therefore, regardless of where the heating device sealant 10 is placed in the heating device 1 that generates electromagnetic waves, it is possible to suppress the effects of the electromagnetic waves generated from the heating device 1. In the present technology, it is particularly preferable to place the heating device sealant 10 in a location from which electromagnetic waves from the heating device 1 are likely to leak. For example, it is preferable to place the heating device sealant 10 according to the present technology in the gap between the main body 11 and the door 12 of the heating device 1. The specific structure of the heating device 1 will be described below.

[0016] The heating device sealing material 10 according to the present technology is characterized by having an electromagnetic wave absorbing foam 101. The electromagnetic wave absorbing foam 101 can efficiently shield gaps in areas where electromagnetic waves are likely to leak by taking advantage of the flexibility of the foam, and can also absorb leaked electromagnetic waves because of its electromagnetic wave absorption properties.

[0017] The heating device sealing material 10 according to the present technology may further include, as necessary, a heat reflecting layer 102, a reinforcing layer 103, a current escape mechanism (not shown), etc., in addition to the electromagnetic wave absorbing foam 101. Each of these components will be described in detail below.

[0018] (1) Electromagnetic wave absorbing foam 101 As the electromagnetic wave absorbing foam 101 that can be used in the present technology, one or more foams having electromagnetic wave absorbing properties can be freely combined and used, as long as the action and effect of the present technology are not impaired.

[0019] Examples of foams having electromagnetic wave absorption properties include foams containing conductive components and / or magnetic components. The state of the conductive components and / or magnetic components is not particularly limited as long as they are contained in the foam and do not impair the functions and effects of the present technology. Examples include a state in which the conductive components and / or magnetic components are kneaded into the foam, a state in which the conductive components and / or magnetic components are present on the foam surface (a state in which the foam skeleton surface is coated with the conductive components and / or magnetic components), and the like.

[0020] Examples of conductive components include carbon such as conductive carbon black, carbon fiber, and graphite, metal powder (iron, silver, nickel, copper, tin, or alloys thereof), and metal compounds such as copper sulfide, copper iodide, zinc sulfide, and cadmium sulfide. Examples of magnetic components include iron powder, iron alloy powder, cobalt powder, cobalt alloy powder, nickel powder, and nickel alloy powder.

[0021] In this technology, when a foam containing a magnetic component is used as a foam with electromagnetic wave absorption properties, by giving the heating device 1 a magnetic field, it is possible to easily bond the heating device 1 to the electromagnetic wave absorbing foam 101, etc.

[0022] Examples of foams that can be used in the present technology include polymer foams, such as foams made from one or more polymers selected from rubbers such as ethylene-propylene-diene rubber (EPDM), natural rubber (NR), butadiene-styrene rubber (SBR), polybutadiene rubber (BR), polyisoprene rubber (IR), chloroprene rubber (CR), acrylonitrile-butadiene rubber (NBR), butyl rubber (IIR), ethylene-propylene rubber (EPM), silicone rubber, fluororubber, epichlorohydrin rubber (CHR), acrylic rubber, urethane rubber, ethylene-vinyl acetate rubber (EVA), and ethylene-acrylic rubber; resins such as urethane resins, chlorosulfonated polyethylene (CSM), and chlorinated polyethylene (CM); and various elastomers.

[0023] In the present technology, among these, it is preferable to use various rubbers and urethane resins from the viewpoint of cushioning properties.

[0024] The shape of the electromagnetic wave absorbing foam 101 that can be used in this technology is not particularly limited, and can be freely designed according to the type and placement position of the heating device 1 used, as long as it does not impair the action and effect of this technology.

[0025] For example, when the heating apparatus sealing material 10 according to the present technology is placed in the gap between the body 11 and the door 12 of the heating apparatus 1, the lower limit of the thickness T1 of the electromagnetic wave absorbing foam 101 when cut perpendicularly to the door is, for example, 0.5 mm or more, preferably 1.0 mm or more, more preferably 1.5 mm or more, and even more preferably 2.0 mm or more. By setting the lower limit of the thickness T1 of the electromagnetic wave absorbing foam 101 within this range, the electromagnetic wave absorption performance of the heating apparatus sealing material 10 can be further improved. The upper limit of the thickness T1 of the electromagnetic wave absorbing foam 101 is, for example, 5.5 mm or less, preferably 5.0 mm or less, more preferably 4.5 mm or less, and even more preferably 4.0 mm or less. By setting the upper limit of the thickness T1 of the electromagnetic wave absorbing foam 101 within this range, the influence on the opening and closing of the door of the heating apparatus 1 can be minimized.

[0026] The physical properties of the electromagnetic wave absorbing foam 101 that can be used in the present technology are not particularly limited, but preferred physical properties will be described below.

[0027] [Density] The density of the electromagnetic wave absorbing foam 101 that can be used in the present technology can be freely set as long as it does not impair the action and effect of the present technology. The lower limit of the density of the electromagnetic wave absorbing foam 101 that can be used in the present technology is, for example, 8 kg / m 3 or more, preferably 15 kg / m 3 More preferably, 25 kg / m 3 More preferably, 30 kg / m 3 The upper limit of the density of the resin foam according to the present technology is, for example, 600 kg / m 3 Preferably 500 kg / m or less 3 or less, more preferably 300 kg / m 3 More preferably, 150 kg / m or less 3 By setting the density of the electromagnetic wave absorbing foam 101 that can be used in the present technology within this range, it is possible to provide appropriate cushioning properties and efficiently shield gaps in areas where electromagnetic waves are likely to leak out. Note that in the present technology, the density of the electromagnetic wave absorbing foam 101 is a value measured using a method in accordance with JIS K6401.

[0028] [Surface Resistance] The surface resistance of the electromagnetic wave absorbing foam 101 that can be used in the present technology can be freely set depending on the type of electromagnetic wave absorbing component used, etc., as long as it does not impair the action and effect of the present technology. When a conductive component is used to exhibit electromagnetic wave absorbing performance, the lower limit of the surface resistance of the electromagnetic wave absorbing foam 101 that can be used in the present technology is, for example, 0.5×10 Ω or more, preferably 1.0×10 Ω or more, and more preferably 1.5×10 Ω or more. When a conductive component is used to exhibit electromagnetic wave absorbing performance, the upper limit of the surface resistance is, for example, 1.5×10 4 Ω or less, preferably 1.0 × 10 4 Ω or less, more preferably 0.5×10 4 In the present technology, the surface resistance of the electromagnetic wave absorbing foam 101 is a value measured by a method conforming to JIS C2139-3-2;2018.

[0029] (2) Heat Reflecting Layer 102 Figure 4 is an enlarged conceptual diagram of the Y-Z portion of a heating device 1 using an example different from the heating device sealing material 10 shown in Figure 3. The heating device sealing material 10 according to the present technology can be provided with a heat reflecting layer 102. By providing the heat reflecting layer 102, it is possible to reflect heat generated from the heating device 1 and suppress damage to the electromagnetic wave absorbing foam 101 due to heat. Furthermore, by providing the heat reflecting layer 102, it is possible to select an electromagnetic wave absorbing foam 101 with low heat resistance, which has the advantage of broadening the range of choices for the electromagnetic wave absorbing foam 101.

[0030] As long as the action and effect of the present technology are not impaired, one or a combination of two or more heat-reflecting materials can be used as the material for the heat-reflecting layer 102. In the present technology, a material that reflects electromagnetic waves in addition to heat is preferred as the material for the heat-reflecting layer.

[0031] Examples of materials used for the heat reflective layer 102 include aluminum, copper, gold, silver, rhodium, tin, and alloys of these. If there is concern that the heat reflective performance of the material used for the heat reflective layer 102 may be reduced due to oxidation or the like, it is preferable to form a coating of about 1 to several μm using, for example, a heat-resistant resin.

[0032] The heat reflective layer 102 preferably covers only a portion of the surface of the electromagnetic wave absorbing foam 101. That is, the heating device sealing material 10 according to the present technology preferably has an exposed portion of the electromagnetic wave absorbing foam 101 that is not covered by the heat reflective layer 102. When a material that also reflects electromagnetic waves is used for the heat reflective layer 102, covering the entire surface of the electromagnetic wave absorbing foam 101 may cause electromagnetic waves to leak to the outside if a gap occurs between the heating device sealing material 10 and the heating device 1. Therefore, by using a heat reflective layer 102 that covers only a portion of the surface of the electromagnetic wave absorbing foam 101, i.e., by having an exposed portion of the electromagnetic wave absorbing foam 101, the electromagnetic wave absorption performance of the heating device sealing material 10 can be fully demonstrated. Furthermore, using a heat reflective layer 102 that covers only a portion of the surface of the electromagnetic wave absorbing foam 101 also leads to a reduction in the material used for the heat reflective layer 102, which contributes to reducing material costs and ultimately to creating a sustainable society.

[0033] When the heat-reflecting layer 102 covers only a portion of the surface of the electromagnetic wave-absorbing foam 101, the coverage is not particularly limited and can be freely set depending on the type of heating device 1 used, the heat generation conditions, the placement position, etc. In the present technology, when the total surface area of ​​the electromagnetic wave-absorbing foam 101 is taken as 100%, the lower limit of the coverage by the heat-reflecting layer 102 is, for example, 5% or more, preferably 10% or more, more preferably 20% or more, and even more preferably 30% or more. By setting the lower limit of the coverage by the heat-reflecting layer 102 within this range, damage to the electromagnetic wave-absorbing foam 101 due to heat can be more reliably suppressed. The upper limit of the coverage by the heat-reflecting layer 102 is, for example, 90% or less, preferably 80% or less, more preferably 70% or less, and even more preferably 60% or less. By setting the upper limit of the coverage by the heat-reflecting layer 102 within this range, the electromagnetic wave absorption performance of the heating device sealing material 10 can be further improved.

[0034] The thickness T2 of the heat-reflecting layer 102 is also not particularly limited and can be freely set depending on the type of heating device 1 used, the heat generation conditions, the placement position, etc. In the present technology, the lower limit of the thickness T2 of the heat-reflecting layer 102 is, for example, 1 μm or more, preferably 2 μm or more, more preferably 3 μm or more, even more preferably 4 μm or more, even more preferably 7 μm or more, and particularly preferably 12 μm or more. By setting the lower limit of the thickness T2 of the heat-reflecting layer 102 within this range, damage to the electromagnetic wave absorbing foam 101 due to heat can be more reliably suppressed. The upper limit of the thickness T2 of the heat-reflecting layer 102 is, for example, 50 μm or less, preferably 30 μm or less, more preferably 20 μm or less, even more preferably 18 μm or less, even more preferably 16 μm or less, and particularly preferably 15 μm or less. By setting the upper limit of the thickness T2 of the heat-reflecting layer 102 within this range, a decrease in the flexibility of the heating device sealing material 10 can be prevented.

[0035] The thickness T2 of the heat-reflecting layer 102 relative to the thickness T1 of the electromagnetic wave-absorbing foam 101 is not particularly limited, and can be freely designed according to the type of heating device 1 used, the heat generation conditions, the placement position, etc., as long as it does not impair the action and effect of the present technology.

[0036] (3) Reinforcing Layer 103 Figure 5 is an enlarged conceptual diagram of the Y-Z portion of a heating device 1 using an example different from the heating device sealing material 10 shown in Figures 3 and 4. The heating device sealing material 10 according to the present technology can be provided with a reinforcing layer 103 between the electromagnetic wave absorbing foam 101 and the heat reflective layer 102. While this reinforcing layer 103 is not essential for the heating device sealing material 10 according to the present technology, providing the reinforcing layer 103 can improve the resistance to repeated compression strain of the heat reflective layer 102 and improve the durability of the heating device sealing material 10.

[0037] As the material used for the reinforcing layer 103, one or a combination of two or more materials capable of reinforcing the heat reflective layer 102 can be used as long as the action and effect of the present technology are not impaired. Examples of materials used for the reinforcing layer 103 include silicone-based resins, acrylic-based resins, polyolefin-based resins, polyester-based resins, polyurethane-based resins, and polyamide-based resins. Among these, in the present technology, it is preferable to bond a polyolefin-based resin with a polyester-based resin, and linear low-density polyethylene (LLDPE) or medium-density polyethylene (MDPE) is preferred as the polyolefin-based resin from the viewpoint of heat resistance.

[0038] The thickness T3 of the reinforcing layer 103 is also not particularly limited and can be freely set depending on the type of heating device 1 used, the heat generation conditions, the placement position, etc. In the present technology, the lower limit of the thickness T3 of the reinforcing layer 103 is, for example, 15 μm or more, preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more. By setting the lower limit of the thickness T3 of the reinforcing layer 103 within this range, the repeated compression strain resistance of the heat reflective layer 102 can be further improved, and the durability of the heating device sealing material 10 can be further improved. The upper limit of the thickness T3 of the reinforcing layer 103 is, for example, 200 μm or less, preferably 150 μm or less, more preferably 120 μm or less, and even more preferably 100 μm or less. By setting the upper limit of the thickness T3 of the reinforcing layer 103 within this range, the thickness of the heating device sealing material 10 can be prevented from becoming too thick.

[0039] The thickness T3 of the reinforcing layer 103 relative to the thickness T2 of the heat-reflecting layer 102 is not particularly limited, and can be freely designed according to the type of heating device 1 used, the heat generation conditions, the placement position, etc., as long as it does not impair the action and effect of the present technology.

[0040] (4) Current Dissipation Mechanism The heating device sealing material 10 according to the present technology may be provided with a current dissipation mechanism that dissipates current generated in the heat reflective layer 102 to the outside of the heating device 1. This current dissipation mechanism is not essential for the heating device sealing material 10 according to the present technology, but providing the current dissipation mechanism can prevent the heat reflective layer 102 from becoming charged due to electromagnetic waves emitted from the heating device 1.

[0041] The specific form of the discharge mechanism is not particularly limited as long as it does not impair the action and effect of the present technology, and any form that allows electricity to be discharged to the outside can be freely adopted. For example, a method of attaching a ground wire, a structure in which the heat reflective layer 102 contacts the electrically conductive part of the heating device 1, or a method of running a conductor from the heat reflective layer 102 to the electrically conductive part of the heating device 1 can be used.

[0042] 2. Heating Device 1 The heating device 1 according to the present technology is a heating device 1 that generates electromagnetic waves and includes the sealing material 10 for a heating device according to the present technology described above. The configuration of the heating device 1 according to the present technology can be freely designed as long as it does not impair the functions and effects of the present technology. For example, as shown in Figures 1 and 2, the heating device 1 according to the present technology can be configured to include a main body 11 having an opening 111 and a door 12 that is attached to the main body 11 in an openable and closable manner and closes the opening 111. Inside the opening 111 of the main body 11 is a heating chamber 13 for placing an object to be heated.

[0043] The location of the heating device sealant 10 in the heating device 1 can be freely designed as long as it does not impair the functions and effects of the present technology. As described above, the heating device sealant 10 of the present technology is not a sealant that simply blocks electromagnetic waves, but rather absorbs them in addition to blocking them. Therefore, regardless of where the heating device sealant 10 is placed in the heating device 1 that generates electromagnetic waves, it is possible to suppress the effects of the electromagnetic waves generated from the heating device 1. In the present technology, it is particularly preferable to place the heating device sealant 10 in a location from which electromagnetic waves from the heating device 1 are likely to leak. For example, it is preferable to place the heating device sealant 10 according to the present technology in the gap between the main body 11 and the door 12 of the heating device 1.

[0044] Furthermore, when the heating device sealant 10 according to the present technology is disposed in the gap between the body 11 and the door 12 of the heating device 1, the heating device sealant 10 preferably includes a heat-reflecting layer 102 in order to suppress damage to the electromagnetic wave-absorbing foam 101 caused by heat generated in the heating chamber 13. When the heating device sealant 10 includes the heat-reflecting layer 102, the heating device sealant 10 is preferably disposed so that the heat-reflecting layer 102 is located on the inner side, i.e., so that the heat-reflecting layer 102 is located on the heating chamber 13 side. By disposing the heating device sealant 10 so that the heat-reflecting layer 102 is located on the inner side, i.e., so that the heat-reflecting layer 102 is located on the heating chamber 13 side, damage to the electromagnetic wave-absorbing foam 101 caused by heat generated in the heating chamber 13 can be more reliably suppressed.

[0045] Furthermore, when the sealing material 10 for a heating device is positioned so that the heat reflective layer 102 is located on the inside, i.e., so that the heat reflective layer 102 is located on the heating chamber 13 side, it is preferable that the heat reflective layer 102 has an extending portion 1021 that extends from the inside of the heating device 1, i.e., the heating chamber 13 side, to the opposite side of the heating chamber 13 while surrounding the electromagnetic wave absorbing foam 101 (see FIG. 4). By providing the heat reflective layer 102 with the extending portion 1021, damage to the electromagnetic wave absorbing foam 101 caused by heat generated in the heating chamber 13 can be more reliably suppressed.

[0046] When the heat reflecting layer 102 is provided with a wrapping extension portion 1021, the length L from the end of the wrapping extension portion 1021 to the end of the electromagnetic wave absorbing foam 101 on the side opposite the heating chamber 13 (the length L of the exposed portion of the electromagnetic wave absorbing foam 101) can be freely set according to the configuration of the heating device 1. In the present technology, the lower limit of the length L is, for example, 5.0 mm or more, preferably 5.5 mm or more, more preferably 6.0 mm or more, and even more preferably 6.5 mm or more. By setting the lower limit of the length L within this range, electromagnetic waves generated from the heating chamber 13 can be more reliably absorbed. The upper limit of the length L is not particularly limited, and can be freely designed according to the configuration of the heating device 1 to be used.

[0047] When the sealing material 10 for a heating device according to the present technology is placed in the gap between the body 11 and the door 12 of the heating device 1, it is preferable that the heat reflective layer 102 be in contact with the body 11 and / or the door 12. By having the heat reflective layer 102 in contact with the body 11 and / or the door 12, it is possible to prevent electromagnetic waves generated from the heating device 1 from leaking out from the gap between the body 11 and the door 12.

[0048] The present technology can also take the following forms. [1] A sealing material for use in a heating device that generates electromagnetic waves, the sealing material for a heating device having an electromagnetic wave absorbing foam. [2] The sealing material for a heating device according to [1], having a heat reflective layer that covers only a portion of the surface of the electromagnetic wave absorbing foam. [3] The sealing material for a heating device according to [2], having a reinforcing layer between the electromagnetic wave absorbing foam and the heat reflective layer. [4] A heating device that generates electromagnetic waves, comprising the sealing material for a heating device according to any one of [1] to [3]. [5] The heating device according to [4], comprising: a main body having an opening; a door that is openably and closably attached to the main body and closes the opening; and the sealing material for a heating device arranged in a gap between the main body and the door so that the heat reflective layer is located on the inside. [6] The heating device according to [5], in which the heat reflective layer is in contact with the main body and / or the door.

[0049] The present technology will be described in more detail below based on examples. Note that the examples described below are examples of typical examples of the present technology, and the scope of the present technology should not be construed as being narrow.

[0050] (1) Method: We investigated the occurrence of communication failures due to a heating device that generates electromagnetic waves. In this experiment, a household microwave oven was used as an example of a heating device that generates electromagnetic waves. The communication speed of a Wi-Fi connection (2.4 GHz) using a commercially available laptop PC was measured when the microwave oven was not in use, when the microwave oven was in use, when the microwave oven was in use with the gaps in the microwave oven door sealed with a heat / electromagnetic wave reflective layer (see FIG. 6A), when the microwave oven was in use with the microwave oven door covered from the front to the sides with an electromagnetic wave absorbing foam (see FIG. 6B), and when the microwave oven was in use with the gaps in the microwave oven door sealed with an electromagnetic wave absorbing foam (see FIG. 6C). Carbon-containing ethylene-propylene-diene rubber (EPDM) foam was used as an example of the electromagnetic wave absorbing foam, and aluminum foil was used as an example of the heat / electromagnetic wave reflective layer.

[0051] (2) Results The graph in FIG. 7 shows the measurement results for each of the measured communication speeds, assuming that the communication speed when the microwave oven is not in use is "100."

[0052] (3) Discussion As shown in Figure 7, compared to a communication speed of 100 when the microwave oven was not in use, the communication speeds when the microwave oven was in use dropped to 26.9 for the download speed and 39.3 for the upload speed. In contrast, when the gap in the microwave oven door was sealed with a heat / electromagnetic wave reflective layer, the download speed and upload speed recovered slightly to 29.8 and 46.1, respectively. Furthermore, when the gap in the microwave oven door was sealed with electromagnetic wave absorbing foam, the download speed recovered to 66.3 and the upload speed recovered to 83.3. Furthermore, when the microwave oven door was covered from the front to the sides with electromagnetic wave absorbing foam, the download speed increased to 63.4 and the upload speed increased to 84.8, which were equivalent to when the gap in the microwave oven door was sealed with electromagnetic wave absorbing foam. This indicates that simply sealing the gap in the door is sufficient to absorb electromagnetic waves from the microwave oven.

Claims

1. A sealing material for use in a heating device that generates electromagnetic waves, the sealing material for heating devices having an electromagnetic wave absorbing foam.

2. The sealing material for heating devices according to claim 1, which has a heat reflective layer covering only a portion of the surface of the electromagnetic wave absorbing foam.

3. The sealing material for heating devices according to claim 2, which has a reinforcing layer between the electromagnetic wave absorbing foam and the heat reflecting layer.

4. A heating device that generates electromagnetic waves, comprising the sealing material for heating devices according to claim 2 or 3.

5. A heating device as described in claim 4, comprising: a main body having an opening; a door attached to said main body so as to be able to open and close and close said opening; and a sealing material for said heating device arranged in the gap between said main body and said door so that said heat-reflecting layer is positioned on the inside.

6. The heating device according to claim 5, wherein the heat reflecting layer is in contact with the body and / or the door.

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