Electronic device comprising heat transfer member

Abstract

An electronic device may be provided, the electronic device comprising: a housing; and a substrate assembly disposed inside the housing, wherein the substrate assembly includes a printed circuit board including a first surface and a second surface, an electronic component disposed on the first surface of the substrate assembly, a shielding unit disposed on the first surface, surrounding the electronic component, and including a first support member, which forms an accommodation space, and a shielding sheet, which covers the accommodation space, and a heat transfer member disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, and the heat transfer member includes a first base layer disposed on the electronic component, a coating layer disposed on the first base layer, a heat dissipation material disposed on the coating layer and chemically bonded to the coating layer, and a second base layer disposed on the heat dissipation material.

Description

Electronic devices including heat transfer elements

[0001] The present disclosure relates to electronic devices, and for example, to electronic devices including heat transfer members.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device can be provided. According to one embodiment, an electronic device can be provided, comprising: a housing; a substrate assembly disposed inside the housing; the substrate assembly including a printed circuit board having a first surface and a second surface; an electronic component disposed on the first surface of the substrate assembly; a shielding member disposed on the first surface and surrounding at least a portion of the electronic component and including a shielding material; the shielding member including a first support member forming an accommodation space and a shielding sheet covering at least a portion of the accommodation space; and a heat transfer member disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, the heat transfer member including: a first substrate layer disposed on the electronic component; a coating layer disposed on the first substrate layer; a heat dissipation material disposed on the coating layer and chemically bonded to the coating layer; and a second substrate layer disposed on the heat dissipation material.

[0006] According to one embodiment of the present disclosure, a heat transfer member can be provided. According to one embodiment, a heat transfer member can be provided, including a first substrate layer, a coating layer disposed on the first substrate layer, a heat dissipating material disposed on the coating layer and chemically bonded to the coating layer, and a second substrate layer disposed on the heat dissipating material.

[0007] According to one embodiment of the present disclosure, a manufacturing method can be provided. According to one embodiment, a method for manufacturing a heat transfer member can be provided, including an operation of manufacturing a first substrate layer, an operation of coating a coating layer on the first substrate layer, an operation of applying a liquid heat dissipating material to the coating layer, and an operation of combining a second substrate layer with the heat dissipating material and the coating layer, wherein the coating layer and the heat dissipating material are chemically bonded.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an exemplary electronic device within a network environment, according to various embodiments.

[0010] FIG. 2 is a perspective view of an electronic device illustrating a front side of the electronic device according to various embodiments of the present disclosure.

[0011] FIG. 3 is a perspective view of an electronic device showing a rear side of the electronic device according to various embodiments of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device showing a front side of the electronic device according to various embodiments of the present disclosure.

[0013] FIG. 5 is a cross-sectional view of a heat transfer member according to various embodiments of the present disclosure.

[0014] FIG. 6A is a cross-sectional view showing a portion of a substrate assembly of an electronic device taken along line A-A' of FIG. 4, according to various embodiments of the present disclosure.

[0015] FIG. 6b is a cross-sectional view showing a portion of a substrate assembly of an electronic device taken along line A-A' of FIG. 4, according to various embodiments of the present disclosure.

[0016] FIG. 6c is a cross-sectional view showing a portion of a substrate assembly of an electronic device taken along line A-A' of FIG. 4, according to various embodiments of the present disclosure.

[0017] FIG. 7 is a drawing showing an exemplary formation process of a heat transfer member of a bag structure according to various embodiments of the present disclosure.

[0018] FIG. 8A is a diagram illustrating a bond between a substrate layer and a coating layer according to various embodiments of the present disclosure.

[0019] FIG. 8b is a diagram showing an exemplary chemical structure of a substrate layer according to various embodiments of the present disclosure.

[0020] FIG. 9A is a drawing showing an example of a chemical composition of a coating layer according to various embodiments of the present disclosure.

[0021] FIG. 9b is a drawing showing a unit of the coating layer embodiment of FIG. 9a according to various embodiments of the present disclosure.

[0022] FIG. 10A is a diagram illustrating bonding between a coating layer and a first substrate layer and bonding of a coating layer and a heat dissipating material according to various embodiments of the present disclosure.

[0023] FIG. 10b is a diagram illustrating bonding between a coating layer and a first substrate layer and bonding between a coating layer and a heat dissipating material according to various embodiments of the present disclosure.

[0024] FIG. 11 is a drawing showing a comparative example according to various embodiments of the present disclosure.

[0025] FIG. 12 is a cross-sectional view showing a comparative example according to various embodiments of the present disclosure.

[0026] FIG. 13A is a cross-sectional view of a heat transfer member when an opening is formed according to various embodiments of the present disclosure.

[0027] FIG. 13b is a cross-sectional view of a heat transfer member when an opening is formed according to various embodiments of the present disclosure.

[0028] FIG. 14 is a cross-sectional view of a heat transfer member when filler particles are filled in a substrate layer according to various embodiments of the present disclosure.

[0029] FIG. 15A is a perspective view of a heat transfer member according to a bag structure according to various embodiments of the present disclosure.

[0030] FIG. 15b is a cross-sectional view of a heat transfer member according to a comparative example compared to a bag structure according to various embodiments of the present disclosure.

[0031] FIG. 16A is a perspective view illustrating a heat transfer member according to various embodiments of the present disclosure.

[0032] FIG. 16b is a perspective view illustrating a heat transfer member formed by spacing out a plurality of heat dissipating materials according to various embodiments of the present disclosure.

[0033] FIG. 17a is a drawing showing a process of forming a heat transfer member when the first substrate layer is flat, according to various embodiments of the present disclosure.

[0034] FIG. 17b is a drawing showing a process of forming a heat transfer member when the first substrate layer is concave, according to various embodiments of the present disclosure.

[0035] FIG. 17c is a drawing showing a process of forming a heat transfer member when the first substrate layer is convex, according to various embodiments of the present disclosure.

[0036] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0037] Electronic devices generate heat during operation, and if this heat accumulates, it can degrade performance or even cause damage. Therefore, to maintain thermal management and stability in electronic devices, the presence of heat transfer elements to maintain their temperature is essential.

[0038] As the performance of heat transfer materials improves, the performance of electronic devices can be optimized and their lifespan can be extended. Therefore, the development of better heat transfer materials is continuously underway to ensure higher performance and stability in electronic devices.

[0039] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure. While the various exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in the present disclosure may be made without departing from the scope and technical spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0040] The terms and words used in the following description and claims are not limited to their reference meanings, but can be used to clearly and consistently describe one embodiment of the present disclosure. Accordingly, it will be apparent to those skilled in the art that the descriptions of various implementations described below are for illustrative purposes only, and are not intended to limit the present disclosure.

[0041] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0042] FIG. 1 is a block diagram of an exemplary electronic device within a network environment, according to various embodiments.

[0043] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0044] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof. Accordingly, the processor (120) may include various processing circuits and / or multiple processors. For example, as used in this specification and claims, the term “processor” may include various processing circuits including at least one processor, and one or more of the at least one processor may be configured to perform various functions described herein, either individually or in a distributed manner.When "one processor," "at least one processor," or "one or more processors" are described herein as being configured to perform various functions, this includes, by way of example and not limitation, not only cases where one processor performs some functions and another processor performs others, but also cases where a single processor performs all functions. Furthermore, at least one processor may be a combination of multiple processors that perform various functions in a distributed manner. At least one processor may execute program instructions to perform or realize various functions.

[0045] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0046] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0047] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0048] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0049] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0050] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0051] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0052] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0054] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0056] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0057] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0058] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0060] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0061] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0062] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0063] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0064] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0065] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0066] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0067] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, or a combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0068] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0069] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0070] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0071] FIG. 2 is a perspective view of an electronic device (101) illustrating a front side (210A) of the electronic device according to various embodiments of the present disclosure. FIG. 3 is a perspective view of an electronic device (101) illustrating a rear side (210B) of the electronic device according to various embodiments of the present disclosure.

[0072] In FIGS. 2 and 3 and the detailed description below, the longitudinal direction of the electronic device (100) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the longitudinal direction, the width direction, and / or the height direction (or thickness direction) may indicate the longitudinal direction, the width direction, and / or the height direction (or thickness direction) of the electronic device (100). In various embodiments, with respect to the direction in which a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. According to one embodiment, the arrangement relationship in the height direction of a certain component or another component, i.e., the reference of up / down, may follow the Z-axis direction. That is, when a component is said to be placed above another component, it can mean that the component is placed along the Z-axis with respect to the other component, and when a component is said to be placed below another component, it can mean that the component is placed in the opposite direction of the Z-axis with respect to the other component. On the other hand, it should be noted that even if a component is placed above or below another component, it does not mean that the entire component is located above or below all of the other components. For example, a part of a component may be placed above a part of another component, but another part of the component may be placed below a part of another component. It should be noted that when a component is said to overlap (or stack) another component in the following description, the description of the arrangement relationship in the height direction described above can be applied. In the description of the direction, if 'yin / yang (- / +)' is not stated, it can be interpreted as facing the + direction unless otherwise defined.For example, 'Z-axis direction' can be interpreted as pointing toward the +Z direction, 'X-axis direction' can be interpreted as pointing toward the +X-axis direction, and 'Y-axis direction' can be interpreted as pointing toward the +Y-axis direction. In describing directions, pointing toward any one of the three axes of the orthogonal coordinate system can include pointing in a direction parallel to the axis. According to one embodiment of the present disclosure, 'X-axis direction' can be referred to as a 'first direction', and 'Z-axis direction' can be referred to as a 'second direction'. This is based on the orthogonal coordinate system described in the drawings for the sake of brevity of description, and it should be noted that the description of such directions or components does not limit the various embodiments of the present disclosure.

[0073] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment of the present disclosure may include a first surface (or front surface) (210A), a second surface (or back surface) (210B), and a third surface (or side surface) (210C) surrounding a space between the first surface (210A) and the second surface (210B).

[0074] According to one embodiment of the present disclosure, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and includes a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0075] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0076] According to one embodiment of the present disclosure, the display (220) may be visible through, for example, a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visible through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (220) may be formed to be substantially identical to the adjacent outer shape of the front plate (202).

[0077] In one embodiment of the present disclosure (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment of the present disclosure (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment of the present disclosure (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0078] According to one embodiment of the present disclosure, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sounds, and in one embodiment, multiple microphones may be disposed so as to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0079] According to one embodiment of the present disclosure, the sensor modules (204, 219) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor modules (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0080] According to one embodiment of the present disclosure, the camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (101), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (219).

[0081] According to one embodiment of the present disclosure, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0082] According to one embodiment of the present disclosure, the light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0083] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0084] FIG. 4 is an exploded perspective view of an electronic device showing a front side of the electronic device (101) according to various embodiments of the present disclosure.

[0085] Referring to FIG. 4, an electronic device (101) according to one embodiment of the present disclosure may include a side structure (231), a first support member (232) (e.g., a bracket), a display (220), at least one printed circuit board (or board assembly) (240a, 240b), a battery (250), a second support member (260), an antenna, a camera assembly (214), and a back plate (211). When including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit board (240a, 240b) may include a first substrate assembly (240a) disposed on one side (e.g., upper side or Y direction) of the battery (250) and a second substrate assembly (240b) disposed on the other side (e.g., lower side or -Y direction) of the battery (250), and the first substrate assembly (240a) and the second substrate assembly (240b) may be electrically connected by a flexible printed circuit board (240c).

[0086] According to one embodiment of the present disclosure, the first support member (232) may be provided in at least a portion in a flat shape. In one embodiment, the first support member (232) may be disposed inside the electronic device (101) and connected to the side structure (231), or may be formed integrally with the side structure (231). The first support member (232) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When the first support member (232) is at least partially formed of a metallic material, the side structure (231) or a portion of the first support member (232) may function as an antenna. The first support member (232) may have a display (220) coupled to one surface (e.g., in the Z direction) and a substrate assembly (240a, 240b) coupled to the other surface (e.g., in the −Z direction). The substrate assembly (240a, 240b) may include, for example, an interposer, a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0087] According to one embodiment of the present disclosure, the front plate (202) may be coupled to the support member (232) via an adhesive member including an adhesive. The front plate (202) may be referred to as a “cover” or a “front cover.” The rear plate (211) may be referred to as a “cover” or a “rear cover.” The edge of the cover (211) may be supported by the support member (232).

[0088] According to one embodiment of the present disclosure, the first support member (232) and the side structure (231) may be combined to form a front case or housing (230). The housing (230) may also be referred to as a frame (230). According to one embodiment, the housing (230) may accommodate a substrate assembly (240a, 240b) or a battery (250).

[0089] In one embodiment of the present disclosure, the housing (230) may form at least a portion of the exterior of the electronic device (101). The housing (230) may include a side structure (231), a first support member (232), a front plate (202), and a rear plate (211). In one embodiment of the present disclosure, the 'front or rear of the housing (230)' may refer to the front plate (202) or the rear cover (211). In one embodiment, the first support member (232) is disposed between the front plate (202) and the rear plate (211), and may function as a structure for arranging electrical / electronic components, such as a substrate assembly (240a, 240b) or a camera assembly (214).

[0090] According to one embodiment of the present disclosure, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0091] According to one embodiment of the present disclosure, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround the substrate assembly (240a, 240b) (e.g., the first substrate assembly (240a)) together with a portion of the first support member (232). For example, the upper support member (260a) of the second support member (260) may be arranged to face the first support member (232) with the first substrate assembly (240a) therebetween.

[0092] In one embodiment of the present disclosure, the lower support member (260b) of the second support member (260) may be disposed to face the first support member (232) with the second substrate assembly (240b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be disposed on the printed circuit boards (240a, 240b), and according to an embodiment, the printed circuit boards (240a, 240b) may be provided with an electromagnetic shielding environment from the second support member (260). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be disposed.

[0093] In one embodiment of the present disclosure, electrical / electronic components such as a speaker module, interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). For example, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (232).

[0094] According to one embodiment of the present disclosure, a battery (250) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, a printed circuit board (240a, 240b). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0095] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (211) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (231) and / or a portion or combination of the first support member (232).

[0096] According to one embodiment of the present disclosure, the electronic device (101) may include a heat dispersion portion (V). As an example, the heat dispersion portion (V) may be disposed on the first support member (232). Heat generated inside the electronic device (101) may be dispersed through the heat dispersion portion (V) or released to the outside of the electronic device (101). For example, heat generated in the first substrate assembly (240a) may be transferred to the battery (250) through the heat dispersion portion. For example, the heat dispersion portion may include a vapor chamber or a heat pipe.

[0097] Referring to FIGS. 5 to 17 below, each component included in the electronic device (101) will be described in more detail.

[0098] FIG. 5 is a cross-sectional view of a heat transfer member (300) according to various embodiments of the present disclosure.

[0099] The heat transfer member (300) described with reference to FIGS. 5 to 16 may be included in the substrate assembly (240a) described with reference to FIG. 3.

[0100] Referring to FIG. 5, the heat transfer member (300) may include a substrate layer (310, 320) (e.g., Parraffin Wax), a coating layer (330) (e.g., Polydopamine (PDA)), and a heat dissipation material (340) (e.g., gallium (Ga)).

[0101] According to one embodiment, the heat transfer member (300) may include a first substrate layer (310) disposed on an electronic component (241) to be described later, a coating layer (330) disposed on the first substrate layer (310), a heat dissipation material (340) that chemically bonds to the coating layer (330) and is liquid at room temperature disposed on the coating layer (330), and a second substrate layer (320) disposed on the heat dissipation material (340).

[0102] According to one embodiment, room temperature means indoor temperature and may mean a temperature of about 15° C. to 25° C. However, in the present disclosure, the heat dissipation material (340) is liquid at room temperature, and the first substrate layer (310) and the second substrate layer (320) surrounding the heat dissipation material (340) are solid at room temperature. However, the heat dissipation material (340) is not limited to being liquid at room temperature, and the heat transfer member (300) may be characterized in that the heat dissipation material (340) is liquid when transferring heat and / or when manufacturing the heat transfer member (300).

[0103] In one embodiment, since the heat dissipating material (340) is liquid, the heat dissipating material (340) may be fluid. Furthermore, since the heat dissipating material (340) is liquid, the heat dissipating material (340) may leak out of the heat transfer member (300). If the heat dissipating material (340) leaks, the leaked heat dissipating material (340) may cause malfunction and / or contamination of the electronic device (101).

[0104] According to one embodiment, in order to prevent and / or reduce malfunction and / or contamination of the electronic device (101), a heat transfer member (300) may be formed in the form of a bag in which a substrate layer (310, 320) for controlling the fluidity of the heat dissipating material (340) surrounds the heat dissipating material (340).

[0105] According to one embodiment, in order to control the fluidity of the liquid heat-dissipating material (340), the base layer (310, 320) may be implemented as a heat transfer member (300) in the form of a bag surrounding the heat-dissipating material (340), and in order to further control the fluidity, the coating layer (330) and the heat-dissipating material (340) and / or the coating layer (330) and the base layer (310, 320) may be additionally chemically bonded to each other.

[0106] When the flow of the heat-dissipating material (340) is controlled through the bag structure and chemical bonding, a liquid heat-dissipating material (340) having high thermal conductivity can be used to provide an electronic device (101) having good heat-dissipating performance while preventing or reducing malfunction and / or contamination that may occur due to leakage of the heat-dissipating material (340).

[0107] The bond between the coating layer (330) and the substrate layers (310, 320) described above may be, for example, a covalent bond created by sharing electrons between atoms during chemical bonding. According to one embodiment, the bond between the coating layer (330) and the substrate layers (310, 320) may be a coordinate bond, which is a covalent bond in which only one of the two atoms that are chemically bonded provides electrons. The coordinate bond is a bond between a central metal ion and a ligand containing an electron pair, and the metal ion may receive the electron pair of the ligand to form a coordinate bond compound.

[0108] The chemical bond between the coating layer (330) and the heat dissipation material (340) may also be a covalent bond. According to one embodiment, the chemical bond between the coating layer (330) and the heat dissipation material (340) may be a hydrogen bond in which a highly electronegative atom, such as nitrogen, oxygen, or fluorine, shares an electron pair with hydrogen to form a chemical bond.

[0109] In general, hydrogen bonds are covalent bonds between highly electronegative atoms such as nitrogen, oxygen, and fluorine and highly electronegative hydrogen atoms, and thus can form stronger chemical bonds than general covalent bonds. In one embodiment, since the chemical bond between the coating layer (330) and the heat-dissipating material (340) is a hydrogen bond, the coating layer (330) can more effectively control the fluidity of the heat-dissipating material (340).

[0110] According to one embodiment, since the coating layer (330) strongly chemically bonds with the substrate layer (310, 320) and / or the heat-radiating material (340), the coating layer (330) in the heat transfer member (300) can serve to adhere the heat-radiating material (340) to the substrate layer (310, 320) and / or the coating layer (330).

[0111] The particles of the substrate layers (310, 320) may generally have weak surface bonding strength, which is a force that chemically bonds with other substances upon contact. Therefore, if a coating layer (330) having adhesive properties is placed between the first substrate layer (310) and the second substrate layer (320), the surface bonding strength between the substrate layers (310, 320) can be increased.

[0112] According to one embodiment, the coating layer (330) is disposed between the first substrate layer (310) and the second substrate layer (320) to increase the bonding strength between the first substrate layer (310) and the second substrate layer (320), and additionally, the first substrate layer (310) and the second substrate layer (320) are used to form an encapsulating structure, thereby controlling the fluidity of the heat-radiating material (340). Through this, the heat-radiating material (340) can be prevented or reduced from leaking out between the substrate layers (310, 320).

[0113] According to one embodiment, the substrate layer (310, 320) is described as being paraffin wax in the present disclosure and the following embodiments, but is not limited thereto and may be various types of substrate layer (310, 320) particles as described below.

[0114] In addition, although the present disclosure and the drawings below illustrate that the first substrate layer (310) and the second substrate layer (320) are composed of the same particles, the first substrate layer (310) and the second substrate layer (320) may use different particles among various types of substrate layer (310, 320) particles to be described below.

[0115] FIGS. 6A, 6B, and 6C are cross-sectional views of a substrate assembly (240a) according to various embodiments of the present disclosure, taken along the AA` cut line illustrated in FIG. 4.

[0116] Referring to FIGS. 6a, 6b, and 6c, a substrate assembly according to one embodiment of the present disclosure may be included in the substrate assembly (240a) described with reference to FIG. 3.

[0117] FIGS. 6A, 6B, and 6C are conceptual drawings illustrating the internal structure of a substrate assembly (240a). FIGS. 6A, 6B, and 6C may be drawings illustrating the internal structure at a moment during the assembly process of the substrate assembly (240a). The components described with reference to FIGS. 6A, 6B, and 6C may be partially or entirely identical to the components described with reference to FIGS. 1 to 5. The components described with reference to FIGS. 6A, 6B, and 6C may be partially or entirely identical to the components described with reference to FIGS. 7 to 17.

[0118] According to one embodiment, the substrate assembly (240a) may include a printed circuit board (243), and the printed circuit board (243) may include a first side (243a) and a second side (243b).

[0119] According to one embodiment, the electronic components (241a, 241b, 241c, 241d) and / or the first support member (244a) may be arranged on the first surface (243a) of the printed circuit board (243).

[0120] According to one embodiment, the electronic components (241a, 241b, 241c, 241d) may include a second electronic component (241b) and a third electronic component (241c) that are main heat sources (e.g., DRAM, AP (Application Processor)) and a first electronic component (241a) and a fourth electronic component (241d) that are other heat sources (e.g., PMIC (Power Management Integrated Circuit), Charge Ic).

[0121] According to one embodiment, the second electronic component (241b) and / or the third electronic component (241c), which are the main heat sources, may have a higher heat generation amount than the first electronic component (241a) and the fourth electronic component (241d), which are the other heat sources. Accordingly, referring to FIG. 6A, a heat transfer member (300) is disposed over the third electronic component (241c), which is the main heat source, to effectively transfer heat to the outside.

[0122] According to one embodiment, the substrate assembly (240a) may include a shielding member. The shielding member may include a first support member (244a) and a shielding sheet (246). The first support member (244a) may be coupled to a printed circuit board (243a). The first support member (244a) and the shielding sheet (246) may surround electronic components (241a, 241b, 241c, 241d). The first support member (244a) and the shielding sheet (246) may shield electromagnetic waves generated from the electronic components (241a, 241b, 241c, 241d), thereby preventing or reducing malfunction of the electronic device (101) due to electromagnetic leakage.

[0123] According to one embodiment, the receiving space (242) may be a space surrounded by a first support member (244a) and a shielding sheet (246), and may be a space in which electronic components (241a, 241b, 241c, 241d) are arranged.

[0124] According to one embodiment, the second support member (244b) may be disposed on the first support member (244a). According to one embodiment, the first heat dissipation member (245) and the shielding sheet (246) may be disposed on the first support member (244a), and the second support member (244b) may be disposed on the first heat dissipation member (245).

[0125] According to one embodiment, the second support member (244b) can seal the receiving space (242) formed inside the first support member (244a). The second support member (244b) can cover the electronic components (241a, 241b, 241c, 241d) arranged inside the first support member (244a).

[0126] The second heat dissipation member (247) is placed on the second support member (244b) and can transfer heat generated from electronic components (241a, 241b, 241c, 241d) to the outside.

[0127] Referring to FIGS. 6a, 6b, and 6c, the heat transfer member (300) may be disposed on the electronic components (241a, 241b, 241c, 241d) and / or between the first surface (243a) and the second surface (243b) of the printed circuit board (243).

[0128] Referring to FIG. 6A, the heat transfer member (300-1) may be placed over the third electronic component (241c), which is the main heat source. When the heat transfer member (300) is placed over the third electronic component (241c), heat generated from the second electronic component (242b) and / or the third electronic component (241c) can be transferred to the outside of the substrate assembly (240a) through the heat transfer member (300-1). This can improve the phenomenon of the inside of the electronic device (101) being overheated due to heat generation.

[0129] Referring to FIG. 6b, in order to further improve heat dissipation of the electronic device (101), heat transfer members (300-1, 300-2) may be disposed not only on the third electronic component (241c), which is the main heat source, but also on the fourth electronic component (241d), which is another heat source. According to one embodiment, the present disclosure exemplifies the case where the heat transfer members (300-1, 300-2) are disposed on the third electronic component (241c) and the fourth electronic component (241d), but is not limited thereto, and may be disposed on all electronic components (241a, 241b, 241c, 241d) disposed inside the substrate assembly (240a).

[0130] Due to this, the heat transfer members (300-1, 300-2) can more effectively transfer heat inside the substrate assembly (240a) to the outside. According to one embodiment, the phenomenon of the inside of the electronic device (101) being overheated due to heat generation can be improved more effectively when the heat transfer members (300-1, 300-2) are disposed on the third electronic component (241c) and the fourth electronic component (241d) than when the heat transfer member (300-1) is disposed only on the third electronic component (241c), which is the main heat source.

[0131] In addition, referring to FIG. 6c, in order to increase and / or maximize the heat dissipation improvement effect of the electronic device (101), the heat transfer members (300-1, 300-2, 300-3) may be placed not only on the electronic components (241a, 241b, 241c, 241d) but also at other locations within the printed circuit board. For example, the heat transfer member (300-3) may be placed between the first surface (243a) and the second surface (243b) of the printed circuit board (243).

[0132] According to one embodiment, the arrangement of the heat transfer member (300) of the present disclosure may be determined through various embodiments disclosed in FIG. 6 or a combination thereof, depending on the heat generation performance required by the electronic device (101). The arrangement of the heat transfer member (300) is not limited to the present illustration, and the heat transfer member (300) may be arranged at a location within the electronic device (101) where heat transfer is required.

[0133] FIG. 7 is a drawing showing an exemplary formation process of a heat transfer member (300) of a bag structure according to various embodiments of the present disclosure.

[0134] Referring to FIG. 7, in order to form a heat transfer member (300), a coating layer (330) having a high surface bonding force may be placed on a first substrate layer (310), and a heat dissipation material (340) may be placed on the coating layer (330).

[0135] Even if a heat-radiating material (340) is placed on the coating layer (330), the heat-radiating material (340) can move on the coating layer (330) due to the fluidity of the heat-radiating material (340). Therefore, the heat-radiating material (340) can be placed on the coating layer (330), and the second substrate layer (320) can be placed to surround the heat-radiating material (340) before the heat-radiating material (340) flows out of the coating layer (330).

[0136] Through the above arrangement process, by arranging a coating layer (330) having a high surface bonding force between the first substrate layer (310) and the second substrate layer (320), a chemical bond can be formed between the coating layer (330) and the substrate layer (310, 320) and / or the coating layer (330) and the heat dissipation material (340).

[0137] Due to this, the bonding force between the first substrate layer (310) and the second substrate layer (320) can be stronger than when the coating layer (330) is not between the first substrate layer (310) and the second substrate layer (320), and the flow of the heat dissipation material (340) can be controlled.

[0138] According to one embodiment, a solution such as paraffin wax constituting the first substrate layer (310) may be solidified at room temperature, and then a coating layer (330) may be coated on the first substrate layer (310). After coating the coating layer (330), the coating layer (330) may be dried at room temperature for a certain period of time (e.g., 24 hours), and a heat-dissipating material (340) may be placed on the coating layer. A second substrate layer (320) may be placed on the heat-dissipating material (340), and heat may be applied to the edge of the second substrate layer (320) (e.g., a temperature of 80 to 100 degrees Celsius for about 1 minute), thereby compressing the first substrate layer (310) and the second substrate layer (320), and thereby forming a heat transfer member (300).

[0139] FIG. 8A is a diagram showing a bond between a substrate layer (310, 320) and a coating layer (330) according to various embodiments of the present disclosure. FIG. 8B is a diagram showing an exemplary chemical structure of a substrate layer (310, 320) according to various embodiments of the present disclosure.

[0140] Referring to FIGS. 8a and 8b, a chemical bond may be created between a hydrogen functional group (-H) formed on the outer surface of the substrate layer (310, 320) and a hydroxyl group (-OH) of the coating layer (330). According to one embodiment, when a coating layer (330) is coated on a substrate layer (310, 320) including a hydrogen functional group (-H), a chemical bond may be induced between the hydrogen functional group (-H) of the substrate layer (310) and the hydroxyl group (-OH) of the coating layer (330), and the chemical bond may be a hydrogen bond.

[0141] In the present disclosure and the following examples, the chemical bond between the substrate layers (310, 320) and the coating layer (330) is described as a hydrogen bond, for example, when the functional group of the substrate layer (310, 320) is a hydrogen functional group (-H) and the functional group of the coating layer (330) is a hydroxyl group (-OH), but is not limited thereto. Depending on the components of the various substrate layers (310, 320) described below and the functional groups of the various coating layers (330) described below, the substrate layers (310, 320) and the coating layer (330) can form various chemical bonds. Since the coating layer (330) can include various functional groups described below, it can chemically bond to the substrate layers (310, 320).

[0142] Below, the table shows materials capable of phase change at specific temperatures that can be used in the substrate layer (310, 320), categorized by element. As disclosed in the table below, materials capable of phase change may include paraffin, chloride hydrate, etc.

[0143] Element Melting point (°C) Heat of fusion (kJ / mol) Thermal conductivity (W / (m K)) Dimethyl-sulfoxide (DMS) 16.58 5.7 N.A. Paraffin C16~C18 20-22 152 N.A. Pologlycol E600 22 127.2 0.189 ,0.187 Paraffin C13~C24 22-24 189 0.21 1-dodecanol 26 200 ,188.8 N.A. Paraffin C18 28 ,27.5 ,22.5-26.2 244 ,243.5 ,205.1 0.148 ,0.15 ,0.358 Paraffin C20~C33 48-50 189 0.21 Paraffin C22~C4558-601890.21Paraffin Wax64173.6,2660.167,0.346,0.339Pologlycol E600066190.0N.A.Paraffin C21~C5066-681890.21

[0144] The paraffin wax described in the present disclosure and the examples below has a melting point of about 64 degrees, and when heat is supplied to manufacture the heat transfer member (300), a portion of the paraffin wax may melt and become a rubber-like material. Therefore, when the coating layer (330) is coated on the paraffin wax, the coating layer (330) and the substrate layer (310, 320) may be closely adhered to each other, and the bond between the coating layer (330) and the substrate layer (310, 320) may become stronger. The following table shows materials that can undergo a phase change at a specific temperature and can be used in the substrate layer (310, 320).

[0145] PCM nameType of substanceMelting pointHeat of fusionRT20Paraffin22172ClimSel C 24N.A.24108RT26Paraffin25131STL27Salt hydrate27213AC27Salt hydrate27207RT27Paraffin28179TH29Salt hydrate29188STL47Salt hydrate47221ClimSel C 48N.A.48227STL52Salt hydrate52201RT54Paraffin55179STL52Salt hydrate55242TH58N.A.58226ClimSel C 58N.A.58259RT65Paraffin64173ClimSel C 70N.A.70194

[0146] According to one embodiment, the substrate layers (310, 320) forming the bag structure may be composed of a phase-changeable material (e.g., PCM, Phase Change Material) of the above table. According to one embodiment, the substrate layers (310, 320) may change phase from solid to rubber at a specific temperature. Due to this, the heat transfer member (300) may be more closely bonded to a heat source (e.g., a heat source such as AP, PMIC, etc.) after removing an air layer that may occur between the heat transfer member (300) and the heat source.

[0147] Therefore, the interfacial thermal resistance, which is the thermal resistance occurring at the interface where two different materials come into contact, can be reduced. Due to the reduction in the interfacial thermal resistance, the heat transfer member (300) can have an effective heat dissipation improvement effect.

[0148] In one embodiment, the phase-changeable material may lack the resilience to return to a solid state. Consequently, after the substrate layer (310, 320) has phase-changed to a rubbery state at a specific temperature, the substrate layer (310, 320) may not phase-change back to a solid state, thereby preventing or reducing surface defects that may occur during the phase-change to a solid state.

[0149] Referring to Fig. 8b, materials that can be utilized in the substrate layers (310, 320) as described above may have an atomic structure including multiple hydrogen functional groups (-H). The constituents of the substrate layers (310, 320) are not limited to the above-described components and materials, and may be other components and materials capable of chemical bonding with the coating layer (330).

[0150] FIG. 9A is a drawing showing an example of the chemical composition of a coating layer (330) according to various embodiments of the present disclosure. FIG. 9B is a drawing showing a unit of an example of the coating layer (330) of FIG. 9A according to various embodiments of the present disclosure.

[0151] Referring to FIGS. 9A and 9B , the coating layer (330) may be a polymer comprising various monomer units. In one embodiment, the coating layer (330) may be polydopamine. In one embodiment, polydopamine is a material constituting the coating layer (330) and can easily combine with paraffin wax constituting the substrate layers (310, 320).

[0152] Polydopamine is a polymer formed by self-polymerization of dopamine, and may include multiple units capable of coordinating with metal ions. In one embodiment, polydopamine may be composed of various units containing multiple functional groups, such as a hydroxyl group (-OH) and an amino group (-NH).

[0153] Due to the above-described various units, polydopamine can easily bond with phase-changeable materials (e.g., PCM (Phase Change Material)) of the aforementioned substrate layers (310, 320). Therefore, when the bonding between the substrate layers (310, 320) is weak, polydopamine containing multiple functional groups can increase the bonding strength between the substrate layers (310, 320). As the bonding strength between the substrate layers (310, 320) becomes stronger, the thickness of the heat transfer member (300) can become thinner.

[0154] According to the present invention and various embodiments below, the substrate layers (310, 320) use a material capable of phase change, and the coating layer (330) uses polydopamine as an example, but is not limited thereto, and other polymers may be used if the bonding between the substrate layers (310, 320) and the bonding between the coating layer (330) and the heat dissipation material (340) is strengthened through the coating layer (330).

[0155] FIG. 10A is a diagram illustrating a bond between a coating layer (330) and a first substrate layer (310) and a bond between a coating layer (330) and a heat dissipating material (340) according to various embodiments of the present disclosure. FIG. 10B is a diagram illustrating a bond between a coating layer (330) and a first substrate layer (310) and a bond between a coating layer (330) and a heat dissipating material (340) according to various embodiments of the present disclosure.

[0156] Referring to FIGS. 10A and 10B, the coating layer (330) is disposed between the first substrate layer (310) and the heat-dissipating material (340), and can be bonded to the first substrate layer (310) and / or the heat-dissipating material (340). According to one embodiment, when the heat-dissipating material (340) is applied on the substrate layers (310, 320) on which the coating layer (330) is disposed, the main metal atoms (Ga, Bi, In, etc.) constituting the heat-dissipating material (340) and the functional groups (e.g., amino group (-NH), hydroxyl group (-OH)) of the coating layer (330) can form a secondary chemical bond (e.g., coordinate bond). Through this, a chemical bond is formed between the coating layer (330) and the heat-dissipating material (340), and the fluidity of the heat-dissipating material (340) can be controlled by the coating layer (330).

[0157] According to one embodiment, hydrogen atoms are arranged on the outer surface of the substrate layer (310, 320), and atoms having high electronegativity, such as oxygen, nitrogen, and fluorine, among the atoms of the unit forming the coating layer (330) are arranged on the outer surface, so that hydrogen bonds can be formed between the hydrogen arranged on the outer surface and the coating layer (330).

[0158] After a hydrogen bond is formed between the substrate layer (310, 320) and the coating layer (330), a heat dissipating material (340) is placed on the coating layer (330), so that a covalent bond can be formed between the coating layer (330) and the heat dissipating material (340).

[0159] In the present invention and various embodiments below, the functional group of the coating layer (330) is an amino group (-NH) and is exemplified as being coordinately bonded with a metal atom of the heat-dissipating material (340), but the invention is not limited thereto, and if a chemical bond is formed between the coating layer (330) and the heat-dissipating material (340), and thus the fluidity of the heat-dissipating material (340) is controlled, the bond between the coating layer (330) and the heat-dissipating material (340) may be a covalent bond.

[0160] FIG. 11 is a drawing showing a comparative example according to various embodiments of the present disclosure. FIG. 12 is a cross-sectional view showing a comparative example according to various embodiments of the present disclosure.

[0161] Referring to Fig. 11, there may be a comparative example in the form of filling a polymer resin with solid metal particles and / or liquid metal particles as a comparative example. According to the comparative example of Fig. 11, when a solid heat-dissipating material is used, contamination and / or malfunction due to leakage of the heat-dissipating material can be prevented or reduced due to low fluidity of the heat-dissipating material, but a heat-transfer member in the form of filling a solid heat-dissipating material with metal particles may have lower thermal conductivity than the heat-transfer member (300) of the present disclosure.

[0162] In addition, when manufacturing a heat transfer member (300) including a liquid heat dissipating material (340), the fluidity of the liquid heat dissipating material (340) is not controlled, so the liquid heat dissipating material (340) may easily leak out due to external pressure, and even if a solid combination is used together with the liquid heat dissipating material (340), there may be difficulty in fluidity control.

[0163] Referring to Fig. 11, after a heat-radiating material (340a) is placed on a substrate layer (310a), the substrate layer (310a) may be placed thereon to protect the heat-radiating material (340a). According to a comparative example, if the substrate layer (310a) does not form a sealing structure surrounding the heat-radiating material (340a), the heat-radiating material (340a) may be prevented from leaking upward or downward or may be reduced in leakage, but the heat-radiating material (340a) may be exposed laterally. This may cause the heat-radiating material (340a) to leak in the direction of the exposed side, resulting in malfunction and / or contamination of the electronic device (101).

[0164] In the comparative example, the substrate layer (310a) used to protect the heat-radiating material (340a) may have a lower thermal conductivity (e.g., 0.5 W / mK) than the liquid heat-radiating material (340a), and as a result, when the heat-transfer member (300a) transfers heat in a vertical direction, a high thermal resistance may occur, which may reduce the heat transfer efficiency.

[0165] According to one embodiment of the present disclosure, a sealing structure capable of controlling the lateral outflow of the heat-dissipating material (340) may be applied, while a chemical bond may be formed between the heat-dissipating material (340) and the coating layer (330) for fluidity control. In addition, a heat-conducting member (300) having high heat transfer efficiency may be provided by using a liquid heat-dissipating material (340) having good thermal conductivity.

[0166] FIG. 13a is a cross-sectional view of a heat transfer member (300) when an opening (O) is formed according to various embodiments of the present disclosure. FIG. 13b is a cross-sectional view of a heat transfer member (300) when an opening (O) is formed according to various embodiments of the present disclosure.

[0167] Referring to FIGS. 13a and 13b, when a sealing structure is implemented in the heat transfer member (300), an internal space (S) (e.g., a space between the second substrate layer (320) and the heat dissipation material (340)) may be formed. When an internal space (S) containing air with low heat transfer efficiency is formed inside the heat transfer member (300), the heat transfer efficiency of the heat transfer member (300) to the outside may be reduced.

[0168] According to one embodiment, in order to eliminate the internal space (S) of the bag structure and increase the heat transfer efficiency of the heat transfer member (300), an opening (O) may be additionally formed at one end of the substrate layer (310, 320). When the opening (O) is formed at one end of the substrate layer (310, 320) to eliminate the internal space (S), the heat dissipation material (340) may leak out together with the air due to the fluidity of the heat dissipation material (340).

[0169] According to one embodiment, in order to prevent and / or reduce the leakage of the heat dissipation material (340) through the opening (O), the heat transfer member (300) may further include an insertion member (I). The insertion member (I) may be inserted into and fixed to the opening (O) through a pressure member (P). For example, the pressure member (P) may apply heat and pressure to the insertion member (I), and through the heat and pressure, the insertion member (I) may be fixed between the substrate layers (310, 320), thereby preventing or reducing leakage of the heat dissipation material (340).

[0170] According to one embodiment, the insert member (I) may be made of the same material (e.g., paraffin wax) as the substrate layer (310, 320). Since the material constituting the substrate layer (310, 320) is a material capable of phase change under specific conditions, the insert member (I) may undergo phase change above the glass transition temperature.

[0171] Accordingly, by the heat and pressure of the pressure member (P), the insertion member (I) is deformed into a rubber form, and the insertion member (I) deformed into a rubber form can be tightly bonded to the base layer (310, 320). As a result, the insertion member (I) can be bonded to the base layer (310, 320) with a high bonding force.

[0172] According to one embodiment, due to the formation of the opening (O) and the combination of the insertion member (I), the internal space (S) of the heat transfer member (300) can be effectively removed without leakage of the heat dissipating material (340).

[0173] FIG. 14 is a cross-sectional view of a heat transfer member (300) when filling particles (350) are filled in a substrate layer (310, 320) according to various embodiments of the present disclosure.

[0174] Referring to Fig. 14, the substrate layers (310, 320) for controlling the fluidity of the heat-radiating material (340) can generally use materials with low thermal conductivity. Since the substrate layers (310, 320) with low thermal conductivity exist on the path through which heat is transferred to the outside for heat dissipation, the heat transfer efficiency of the heat transfer member (300) may decrease when the substrate layers (310, 302) with low thermal conductivity are used.

[0175] According to one embodiment, the heat transfer member (300) may further include filler particles (350) having good heat dissipation efficiency in the base layer (310, 320). As a result, a base layer (310, 320) having higher thermal conductivity can be formed compared to a case where the filler particles (350) are not further included in the base layer (310, 320).

[0176] The above-mentioned filling particles (350) may be particles such as carbon-based particles or ceramic particles, which are generally used for heat dissipation. Since the particles themselves store thermal energy and are capable of phase change, they can effectively improve the heat transfer efficiency of the base layer (310, 320).

[0177] According to one embodiment, when the substrate layer (310, 320) further includes filler particles (350) having good heat transfer efficiency, the substrate layer (310, 320) may have high thermal conductivity (e.g., 3 W / mK or more). Accordingly, the substrate layer (310, 320) including filler particles (350) can transfer heat generated in the substrate assembly (240a) to the outside more effectively than the substrate layer (310, 320) not including filler particles (350).

[0178] FIG. 15a is a perspective view of a heat transfer member (300) according to a bag structure according to various embodiments of the present disclosure. FIG. 15b is a cross-sectional view of a heat transfer member (300) according to a comparative example compared to a bag structure according to various embodiments of the present disclosure.

[0179] Referring to FIG. 15a, when a heat-radiating material (340) is applied to the surface of the substrate layer (310, 320), the heat-radiating material (340) may flow out to the outside of the heat-transfer member (300) due to the low binding energy of the surface of the substrate layer (310, 320) and the high fluidity of the liquid heat-radiating material (340). Therefore, as illustrated in FIG. 15a, the heat-transfer member (300) may have a bag-like structure.

[0180] Referring to the comparative example according to FIG. 15b, the coating layer (330) may not be disposed between the substrate layers (310, 320). If the coating layer (330) is not disposed between the substrate layers (310, 320), the bonding force between the substrate layers (310, 320) is weaker than when the coating layer (330) is disposed, and thus the sealing structure may be formed incompletely. As a result, the heat dissipation material (340) may leak between the first substrate layer (310) and the second substrate layer (320).

[0181] Therefore, in order to prevent and / or reduce leakage of the heat-dissipating material (340), the coating layer (330) can be used to increase the bonding strength between the first substrate layer (310) and the second substrate layer (320), and the increased bonding strength can be used to form a sealing structure of the heat-conducting member (300).

[0182] According to one embodiment, when a strong bonding force is formed between the first substrate layer (310) and the second substrate layer (320) using the coating layer (330), and a sealing structure is formed using the strong bonding force between the substrate layers (310, 320), the fluidity of the heat-dissipating material (340) can be more effectively controlled.

[0183] FIG. 16a is a drawing illustrating a heat transfer member (300) according to various embodiments of the present disclosure. FIG. 16b is a drawing illustrating a heat transfer member (300) formed by spacing out a plurality of heat dissipating materials (340) according to various embodiments of the present disclosure.

[0184] Referring to FIGS. 16A and 16B, the heat transfer member (300) may be formed by spacing out a plurality of heat dissipation materials (340) in various shapes. In the present disclosure, the heat dissipation material (340) is formed in a rectangular shape as an example, but is not limited thereto, and the heat dissipation material (340) may be formed in various shapes and numbers depending on the heat dissipation effect that the heat transfer member (300) is intended to achieve.

[0185] FIG. 17a is a diagram illustrating a process of forming a heat transfer member (300) when the first substrate layer (310) is flat, according to various embodiments of the present disclosure. FIG. 17b is a diagram illustrating a process of forming a heat transfer member (300) when the first substrate layer (310) is concave, according to various embodiments of the present disclosure. FIG. 17c is a diagram illustrating a process of forming a heat transfer member (300) when the first substrate layer (310) is convex, according to various embodiments of the present disclosure.

[0186] Referring to FIGS. 17a, 17b, and 17c, the shape of the first substrate layer (310) may be a flat shape, a concave shape including a recess (R), or at least a portion thereof may be a convex shape. Depending on the shape of the first substrate layer (310), the method by which the substrate layers (310, 320) form a sealing structure may vary, and the position at which the heat transfer member (300) is applied may vary.

[0187] Referring to FIG. 17a, when the first substrate layer (310) has a flat shape, a coating layer (330) may be disposed on the first substrate layer (310), a heat dissipation material (340) may be disposed on at least a portion of the coating layer (330), and a second substrate layer (320) may be disposed on the heat dissipation material (340). When the first substrate layer (310) is formed flat, the heat transfer member (300) may be formed thinner than in the embodiment of FIG. 17b or FIG. 17c, and thus, the heat transfer member (300) may be disposed at various locations within the electronic device (101).

[0188] Referring to FIG. 17b, the first substrate layer (310) may have a concave shape including a recess (R). A coating layer (330) may be disposed in the recess (R), and a heat dissipation material (340) may be disposed on the coating layer (330). In addition, the second substrate layer (320) may surround the heat dissipation material (340) and may be disposed over the entire recess (R) and / or the first substrate layer (310).

[0189] According to one embodiment, the coating layer (330) may be disposed on the recess (R), and the coating layer (330) may not be disposed on other parts of the first substrate layer (310) except for the recess (R). As a result, the coating layer (330) may not be used when bonding between the substrate layers (310, 320), and the bonding force between the substrate layers (310, 320) may be weak or may not be bonded.

[0190] Referring to FIG. 17b, since the heat dissipation material (340) is placed inside the recess (R), the fluidity of the heat dissipation material (340) can be effectively controlled even if the bonding force between the substrate layers (310, 320) is weak or not bonded.

[0191] In addition, when the first substrate layer (310) in which the recess (R) is formed is included, the heat transfer member (300) can include more heat dissipation material (340), so that a heat transfer member (300) with a better heat dissipation effect can be provided.

[0192] Referring to FIG. 17c, when the first substrate layer (310) has a convex shape, the coating layer (330) may be disposed on the first substrate layer (310), the heat dissipation material (340) may be disposed on the convex shape, and the second substrate layer (320) may be disposed to surround the heat dissipation material (340).

[0193] The embodiments of FIGS. 17a, 17b and 17c can be applied appropriately to the situation, depending on conditions such as heat dissipation efficiency and thickness required by the heat transfer member (300).

[0194] The present disclosure relates to an electronic device. In an electronic device (101), a housing (210), a substrate assembly (240a) disposed inside the housing (210), the substrate assembly (240a) including a printed circuit board (243) including a first surface (243a) and a second surface (243b), an electronic component (241) disposed on the first surface (240a) of the substrate assembly, a shielding member disposed on the first surface (243a) and surrounding the electronic component (241), the shielding member including a first support member (244a) forming an accommodation space (242) and a shielding sheet (246) covering the accommodation space (242), and a heat transfer member (300) disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, the heat transfer member (300) including a first substrate layer (310) disposed on the electronic component, the It may be an electronic device including a coating layer (330) disposed on a first substrate layer, a heat dissipating material (340) disposed on the coating layer (330) and chemically bonded to the coating layer (330), and a second substrate layer (320) disposed on the heat dissipating material (340).

[0195] According to one embodiment, the heat dissipating material (340) may be an electronic device that is liquid at room temperature.

[0196] According to one embodiment, the first substrate layer (310) and / or the second substrate layer (320) may be an electronic device that is solid at room temperature.

[0197] According to one embodiment, the chemical bond between the coating layer (330) and the heat dissipating material (340) may be a coordinated bond, which may be an electronic device.

[0198] According to one embodiment, the coating layer (330) may be an electronic device chemically bonded to at least one of the first substrate layer (310) or the second substrate layer (320).

[0199] According to one embodiment, the electronic device may be one in which the chemical bond between the coating layer (330) and at least one of the first substrate layer (310) or the second substrate layer (320) is a hydrogen bond.

[0200] According to one embodiment, the coating layer (330) may be an electronic device including poly-dopamine.

[0201] According to one embodiment, the heat dissipating material (340) may be an electronic device including at least one of metals such as gallium (Ga), bismuth (Bi), indium (In), and tin (Sn).

[0202] According to one embodiment, the heat dissipating material (340) may include a metal, and the metal may be an electronic device including at least one of gallium (Ga), bismuth (Bi), indium (In), and tin (Sn).

[0203] According to one embodiment, the first substrate layer (310) and / or the second substrate layer (320) may be an electronic device further including an opening (O).

[0204] According to one embodiment, the first substrate layer (310) and / or the second substrate layer (320) may be an electronic device further including an insertion member (I) inserted into the opening (O).

[0205] According to one embodiment, the first substrate layer (310) and / or the second substrate layer (320) may be an electronic device further comprising at least one of a ceramic, a composite ceramic, carbon, or a metal.

[0206] According to one embodiment, the heat dissipating material (340) may be an electronic device arranged in a plurality of areas spaced apart from each other on the coating layer (330).

[0207] According to one embodiment, the first substrate layer (310) may be an electronic device including a recess (R) formed in a portion thereof.

[0208] According to one embodiment, the electronic device may be one in which the coating layer (330) is disposed on the recess (R), and the heat dissipation material (340) is disposed on the coating layer (330).

[0209] The present disclosure relates to a heat transfer member. According to one embodiment, the heat transfer member (300) may include a first substrate layer (310), a coating layer (330) disposed on the first substrate layer (310), a heat dissipating material (340) disposed on the coating layer (330) and chemically bonded to the coating layer, and a second substrate layer (320) disposed on the heat dissipating material (340).

[0210] According to one embodiment, the heat dissipating material (340) may be a heat transfer member that is liquid at room temperature.

[0211] According to one embodiment, the coating layer (330) may be a heat transfer member chemically bonded to at least one of the first substrate layer (310) or the second substrate layer (320).

[0212] The present disclosure relates to a manufacturing method. According to one embodiment of the present disclosure, a method for manufacturing a heat transfer member may include an operation of manufacturing a first substrate layer, an operation of coating a coating layer on the first substrate layer, an operation of applying a liquid heat dissipating material to the coating layer, and an operation of combining a second substrate layer with the heat dissipating material and the coating layer, wherein the coating layer and the heat dissipating material are chemically bonded.

[0213] According to one embodiment, the coating layer may be a manufacturing method in which it is chemically bonded to at least one of the first substrate layer or the second substrate layer.

[0214] According to one embodiment, a heat transfer member including a liquid heat dissipating material can be provided, thereby providing an electronic device having better heat dissipation performance than a heat transfer member not including a liquid heat dissipating material.

[0215] According to one embodiment, when a heat transfer member having a bag structure containing a liquid heat-dissipating material is placed on a main heat source (e.g., the top of an AP chip), the temperature of the main heat source can be formed to be 2.1°C or more lower than that of a heat transfer member not containing a liquid heat-dissipating material.

[0216] According to one embodiment, a sealing structure is formed on a heat transfer member including a liquid heat-dissipating material, and the fluidity of the liquid heat-dissipating material can be controlled by utilizing a chemical bond between the coating layer and the heat-dissipating material. This prevents / reduces leakage of the liquid heat-dissipating material, and provides an electronic device in which malfunction and / or contamination caused by leakage of the heat-dissipating material is prevented / reduced.

[0217] The electronic device (101) described through the various embodiments of the present disclosure described above is not limited to the aforementioned embodiments and drawings, and it will be apparent to those skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. In addition, it will be understood that any embodiment described herein can be used in combination with other embodiments.

Claims

1. In an electronic device (101), Housing (210); Includes a substrate assembly (240a) placed inside the housing (210), The above substrate assembly (240a) is; A printed circuit board (243) including a first side (243a) and a second side (243b); An electronic component (241) placed on the first surface (240a) of the above substrate assembly; A shielding member that is disposed on the first surface (243a) and surrounds at least a portion of the electronic component (241), and includes a first support member (244a) forming an accommodation space (242) and a shielding sheet (246) covering at least a portion of the accommodation space (242); and A heat transfer member (300) is disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component; The above heat transfer member (300) is A first substrate layer (310) disposed on the above electronic component; A coating layer (330) disposed on the first substrate layer; A heat dissipating material (340) disposed on the coating layer (330) and chemically bonded with the coating layer (330); and An electronic device comprising a second substrate layer (320) disposed on the heat-dissipating material (340).

2. In paragraph 1, The above heat dissipating material (340) is a liquid at room temperature, an electronic device.

3. In paragraph 1 or 2, An electronic device wherein the first substrate layer (310) and / or the second substrate layer (320) is solid at room temperature.

4. In any one of paragraphs 1 to 3, An electronic device in which the chemical bond between the coating layer (330) and the heat dissipation material (340) is a coordinate bond.

5. In any one of paragraphs 1 to 4, An electronic device in which the coating layer (330) is chemically bonded to at least one of the first substrate layer (310) or the second substrate layer (320).

6. In any one of paragraphs 1 to 5, An electronic device, wherein the chemical bond between the coating layer (330) and at least one of the first substrate layer (310) or the second substrate layer (320) is a hydrogen bond.

7. In any one of paragraphs 1 to 6, An electronic device in which the above coating layer (330) contains poly-dopamine.

8. In any one of paragraphs 1 to 7, An electronic device, wherein the first substrate layer (310) and / or the second substrate layer (320) comprises paraffin wax.

9. In any one of paragraphs 1 to 8, The above heat dissipating material (340) may include metal, An electronic device wherein the metal comprises at least one of gallium (Ga), bismuth (Bi), indium (In), and tin (Sn).

10. In any one of paragraphs 1 to 9, An electronic device, wherein the first substrate layer (310) and / or the second substrate layer (320) further includes an opening (O).

11. In any one of paragraphs 1 to 10, An electronic device, wherein the first substrate layer (310) and / or the second substrate layer (320) further includes an insertion member (I) inserted into the opening (O).

12. In any one of paragraphs 1 to 11, An electronic device, wherein the first substrate layer (310) and / or the second substrate layer (320) further includes at least one of ceramic, composite ceramic, carbon, or metal.

13. In any one of paragraphs 1 to 12, An electronic device in which the above heat dissipating material (340) is spaced apart and arranged in multiple areas on the coating layer (330).

14. In any one of paragraphs 1 to 13, An electronic device, wherein the first substrate layer (310) includes a recess (R) formed in a portion thereof.

15. In any one of paragraphs 1 to 14, The above coating layer (330) is placed on the recess (R), An electronic device in which the heat dissipating material (340) is disposed on the coating layer (330).

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