Plasma processing apparatus

Abstract

The present invention provides a plasma processing apparatus comprising: a base module having a seating unit on which an object to be processed is seated; and a processing module coupled to the base module and configured to plasma-process the object to be processed in an inner space. The processing module may comprise: a housing unit coupled to the base module to form the inner space; and an electrode unit provided with a main electrode disposed on one side of the housing unit facing the seating unit, coupled to the base module, and electrically connected to a connector unit of the base module.

Description

plasma treatment device

[0001] The present invention relates to a plasma processing device.

[0002] While implants originally referred to a substitute for lost human tissue, in dentistry they refer to artificial teeth. A dental implant is an artificial tooth root made of titanium, a material that the body does not reject, which is implanted into the bone where a tooth has fallen out. This root is then fused to the alveolar bone, and a prosthesis is then fixed to the artificial root, creating an artificial tooth structure or dental procedure.

[0003] In general, a dental implant is composed of a fixture made of titanium that is implanted into the alveolar bone, an abutment that is fixed to the fixture and supports the prosthesis, an abutment screw that fixes the abutment to the fixture, and a prosthesis that is an artificial tooth fixed to the abutment.

[0004] Since each component of these dental implants is inserted into human tissue, it is essential to maintain sterility and surface activation. Therefore, preventing contamination or damage during packaging, transportation, and opening of the packaging is a crucial task.

[0005] In particular, in the case of a specific ampoule for storing a fixture for implant, the fixture is directly implanted into the alveolar bone, and therefore, a configuration is required to maintain sterility and prevent contamination and damage when storing the fixture in the ampoule.

[0006] Meanwhile, with the recent development of the medical industry, plasma treatment is being used in various ways and is being used to increase biocompatibility in the transplantation of biomaterials such as implants.

[0007] Conventional plasma treatment presents challenges, such as removing the sterile packaging for surface treatment of fixtures and ensuring sterility when connecting to specific electrode connections. Furthermore, conventional plasma treatment methods, which generate plasma in an atmospheric environment, suffer from inconsistent plasma performance and the potential for localized, high-energy delivery, which can damage the target and degrade fixture performance.

[0008] In addition, conventional plasma surface treatment technology is limited in that it is only applicable to objects to be treated with specific shapes and materials, and thus has low compatibility and versatility.

[0009] The purpose of the present invention is to provide a plasma treatment device capable of uniformly treating the surface of an object to be treated with plasma by subjecting the internal space containing the object to be treated to plasma discharge.

[0010] In order to achieve the above object, one aspect of the present invention provides a plasma treatment device including a base module having a mounting portion on which an object to be treated is mounted, and a treatment module coupled to the base module and performing plasma treatment on the object to be treated in an internal space, wherein the treatment module has a housing portion coupled to the base module to form the internal space, and a main electrode disposed on one side of the housing portion facing the mounting portion, and an electrode portion coupled to the base module and electrically connected to a connector unit of the base module.

[0011] The plasma treatment device according to the present invention can generate a plasma discharge by forming an electric field in an internal space where an object to be treated is placed and controlling the pressure of the internal space to a preset level. This enables the plasma treatment device according to the present invention to effectively treat the object to be treated with plasma. Furthermore, the plasma treatment device according to the present invention has a detachable modular structure, allowing the user to quickly and efficiently obtain the plasma-treated object to be treated.

[0012] FIG. 1 is a block diagram schematically illustrating a plasma processing device according to one embodiment of the present invention.

[0013] Figure 2 is a conceptual diagram showing the plasma processing device of Figure 1.

[0014] Fig. 3 is a perspective view illustrating the plasma processing device of Fig. 1.

[0015] Figure 4 is a side view of the plasma processing device of Figure 3.

[0016] Fig. 5 is a cross-sectional view showing a state in which some components of the plasma processing device of Fig. 3 are disassembled.

[0017] Fig. 6 is a cross-sectional view showing a state in which some components of the plasma processing device of Fig. 3 are combined.

[0018] Figure 7 is a diagram conceptually showing the processing module and plasma processing state of Figure 5.

[0019] Figure 8 is a cross-sectional view of the processing module of Figure 7.

[0020] Figures 9 and 10 are drawings showing modified examples of the processing module of Figure 5.

[0021] Fig. 11 is an enlarged cross-sectional view of the venting unit of Fig. 5.

[0022] Fig. 12 is an enlarged perspective view of the venting unit of Fig. 5.

[0023] One aspect of the present invention provides a plasma treatment device comprising a base module having a mounting portion on which an object to be treated is mounted, and a treatment module coupled to the base module and performing plasma treatment on the object to be treated in an internal space, wherein the treatment module comprises a housing portion coupled to the base module to form the internal space, and an electrode portion having a main electrode disposed on one side of the housing portion facing the mounting portion, and coupled to the base module and electrically connected to a connector unit of the base module.

[0024] In addition, the processing module may further include a vacuum unit that forms a vacuum state by exhausting the internal space of the housing part through an exhaust hole of the base module, and a venting unit that injects external atmosphere into the internal space of the housing part through a venting hole.

[0025] In addition, the venting unit may further include a guide block disposed in the housing portion, a cover block that opens the venting hole when an external force is applied from the guide block, and an elastic member disposed between the main electrode and the cover block and providing elastic force to the cover block in a balanced state to close the venting hole.

[0026] In addition, the housing portion has a housing cap that surrounds the main electrode and has a deformation portion made of a flexible material, and the guide block is arranged in the deformation portion of the housing cap and can move according to deformation of the deformation portion and apply force to the cover block.

[0027] Additionally, the venting unit may further include an auxiliary hole penetrating the housing cap to provide a path for the external atmosphere to flow.

[0028] In addition, the venting unit may further include a filter that is positioned spaced apart from the venting hole and filters the external atmosphere injected into the internal space.

[0029] In addition, the electrode unit may further include a connection electrode that is electrically connected to the main electrode and receives electric energy from an external power source through the connector unit of the base module, and the housing unit may include a first housing that surrounds the object to be treated and is made of an insulating material, and a second housing that surrounds the connection electrode and the main electrode and is made of an insulating material.

[0030] Additionally, the first housing and the second housing may be made of a transparent material.

[0031] Additionally, the width of the connecting electrode may be 0.1 times or less of the outer circumferential length of the first housing.

[0032] Additionally, the main electrode may have an exposed portion, at least part of which is exposed to the internal space of the housing portion.

[0033] Additionally, when the main electrode receives the electric energy, plasma may be formed between the exposed portion of the main electrode and the object to be treated.

[0034] Additionally, the main electrodes may be arranged symmetrically around a virtual reference line passing through the center of the housing portion.

[0035] Another aspect of the present invention provides a plasma processing device, comprising a base module having a mounting portion on which a processing object is mounted, and a main body having a power module for supplying electrical energy to the base module, wherein the base module is coupled to a processing module forming an internal space and has a first connector for electrically connecting the power module and the processing module, and a second connector for electrically connecting the power module and the mounting portion.

[0036] Additionally, the power module may include an electrode block that contacts the first connector and transmits electrical energy to the processing module.

[0037] Additionally, the first connector may include a coupling member that is in contact with the electrode block, is made of a conductive material, and is coupled to the power module, a guide electrode extending from the coupling member, and a spring electrode that is connected to the guide electrode, is made of a conductive material, and is in contact with the processing module.

[0038] Another aspect of the present invention provides a plasma treatment device including a base module having a mounting portion on which an object to be treated is mounted, a treatment module coupled to the base module and performing plasma treatment on the object to be treated in an internal space, and a main body portion on which the base module is mounted and which supplies electric energy so that an electric field is formed in the treatment module, wherein the treatment module has a housing portion coupled to the base module and forming the internal space, and a main electrode disposed on one side of the housing portion facing the mounting portion, and an electrode portion coupled to the base module and electrically connected to a connector unit of the base module.

[0039] The configuration and operation of the present invention will be described in detail with reference to embodiments of the present invention illustrated in the attached drawings below.

[0040] The present invention is capable of various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms.

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0042] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0043] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0044] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0045] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the following embodiments are not necessarily limited to those shown.

[0046] FIG. 1 is a block diagram schematically illustrating a plasma processing device (1) according to one embodiment of the present invention.

[0047] Referring to Fig. 1, a plasma treatment device (1) may include a receiving portion (10), an exhaust portion (20), and a treatment portion (30). The plasma treatment device (1) receives a workpiece (M) to be treated, and creates a low-pressure environment for plasma discharge in a certain space receiving the workpiece (M) to perform plasma treatment on the surface of the workpiece (M).

[0048] Here, the object to be treated (M) can be any object that can be sterilized through plasma treatment. Examples include biomaterials such as implant fixtures and bone grafts. Furthermore, the object to be treated (M) may be composed of a conductive material or a non-conductive material.

[0049] The receiving unit (10) can receive the object to be treated (M). At this time, the object to be treated (M) may be received in the receiving unit (10) itself, or may be received in a state of being stored in a separate container or supported by a support member.

[0050] The exhaust unit (20) is connected to the receiving unit (10) and can exhaust air from a certain space surrounding the object to be treated (M). Here, the 'certain space' is a space where plasma is formed and may be a space that seals the object to be treated (M) from the external environment.

[0051] The exhaust unit (20) can exhaust air from a certain space, thereby lowering the pressure of the certain space to a level where plasma can be formed. In addition, the exhaust unit (20) is fluidly connected to the certain space, and thus can also perform the function of injecting air to vent the interior of the certain space after plasma treatment is completed.

[0052] The exhaust unit (20) may be equipped with a pump that exhausts air from a certain space. In addition, the exhaust unit (20) may be equipped with any configuration that can be fluidly connected to a certain space.

[0053] The processing unit (30) can form an electric field for generating plasma in a certain space from which air is exhausted. For example, the plasma processing device (1) can generate plasma in a certain space through a dielectric barrier discharge (DBD). At this time, the dielectric barrier may be formed by providing a dielectric portion to the plasma processing device (1), but is not necessarily limited thereto. The dielectric barrier may also be formed by providing at least a portion of a container for storing the object to be processed (M) with a dielectric material.

[0054] The plasma processing device (1) may further include a control unit (40) and a sensor unit (50).

[0055] The control unit (40) can control the configurations of the plasma processing device (1). The control unit (40) can control the operations of the exhaust unit (20) and the processing unit (30) based on whether the receiving unit (10) receives the object to be processed (M). The method by which the plasma processing device (1) controls the operations of the exhaust unit (20) and the processing unit (30) through the control unit (40) to perform plasma processing on the object to be processed (M) will be described later.

[0056] The sensor unit (50) can detect environmental information necessary for performing the operations of the exhaust unit (20) and processing unit (30) in the control unit (40).

[0057] In one embodiment, the sensor unit (50) may include a receiving detection sensor that detects whether the object to be treated (M) is received in the receiving unit (10). For example, the receiving detection sensor may be provided with a QR code, barcode, proximity communication connection (RFID, NFC), etc. on the surface that comes into contact with the object to be treated (M) or the container containing the object to be treated (M) when the object to be treated is received in the receiving unit (10). The receiving detection sensor may obtain information on the type of container, the type of the object to be treated (M), whether it is genuine, whether the correct container is received, etc., and provide the information to the control unit (40).

[0058] The sensor unit (50) may further include a pressure gauge (not shown) that measures the internal pressure of a certain space. The pressure gauge (not shown) may provide the measured pressure value of the certain space to the control unit (40).

[0059] Hereinafter, the module units of the plasma processing device (1) according to one embodiment of the present invention will be described. Each module and other components of the plasma processing device (1) may individually perform the functions of the aforementioned receiving unit (10), exhaust unit (20), processing unit (30), etc., or may interact with each other and function.

[0060] Fig. 2 is a conceptual diagram showing a plasma processing device (1) according to one embodiment of the present invention. Fig. 3 is a perspective view exemplarily showing the plasma processing device (1) of Fig. 2, and Fig. 4 is a side view of the plasma processing device (1) of Fig. 3.

[0061] Referring to FIGS. 2 to 4, the plasma processing device (1) may include a main body (100), a base module (200), and a processing module (300).

[0062] The main body (100) can be placed in the main body housing (2). The main body (100) can receive electric energy by being connected to the main body power supply (5) built into the main body housing (2) or an external power supply (not shown), and supply electric energy to the base module (200) and the processing module (300).

[0063] Additionally, the main body (100) may have a passage through which air can flow. The main body (100) may provide a passage through which air in the internal space (SP) of the processing module (300) can flow so that it is discharged to the outside of the main body housing (2).

[0064] The base module (200) can accommodate a material to be treated (M). The base module (200) can be coupled to the main body (100) to receive electrical energy and transmit electrical energy to the treatment module (300). In addition, the base module (200) can have an exhaust hole (EH) through which air can flow in the internal space (SP) of the treatment module (300) where the material to be treated (M) is accommodated.

[0065] In one embodiment, the base module (200) may be provided as an integral part inserted into the main body (100). Alternatively, the base module (200) may be provided as a detachable part so that it can be mounted or replaced on the main body (100) as needed.

[0066] The processing module (300) can accommodate a material to be processed (M). The processing module (300) can be mounted on the base module (200) to form an internal space (SP), and the material to be processed (M) can be placed in the internal space (SP).

[0067] The processing module (300) can receive electrical energy through the base module (200). In addition, the processing module (300) can exhaust the internal space (SP) and inject external atmosphere into the internal space (SP). Through this, the internal space (SP) can be set to a preset pressure so that plasma discharge can occur, and external atmosphere can be introduced after the object to be processed (M) is plasma-treated.

[0068] In one embodiment, the processing module (300) may be mounted on a base module (200) formed integrally with the main body (100). Alternatively, the processing module (300) may be mounted on the main body (100) while being coupled to the base module (200). In addition, when the plasma treatment of the object to be treated (M) is completed, the processing module (300) may be separated from the main body (100) together with or separately from the base module (200). Since the processing module (300) may be mounted on or separated from the main body (100) for plasma treatment of the object to be treated (M), the user may simply and quickly obtain the object to be treated (M) that has been subjected to plasma treatment.

[0069] In this way, the main body (100), base module (200), and processing module (300) can be combined with each other to function as the aforementioned receiving unit (10) and processing unit (30). In addition, the main body (100), base module (200), and processing module (300) can each function as an exhaust unit (20) that allows air in the internal space (SP) to flow to the outside.

[0070] In one embodiment, the plasma processing device (1) can plasma-process a plurality of objects to be processed (M). The plasma processing device (1) can be provided with a plurality of main body parts (100), base modules (200), and processing modules (300). In this case, the internal spaces (SP) are also formed in a plurality, each capable of accommodating a subject to be processed (M).

[0071] Specifically, the main body parts (100) may be arranged in plurality in the main body housing (2) and may be connected to the main body power supply part (5) or the external power supply part (not shown), respectively. In addition, the base module (200) may be mounted on each main body part (100), and the processing module (300) may be coupled to each base module (200). That is, the number of processing modules (300), base modules (200), and main body parts (100) provided in the plasma processing device (1) may correspond to each other, and the internal spaces (SP) may also be formed in plurality. Objects to be processed (M) may be arranged in each of the plurality of internal spaces (SP) of the plasma processing device (1), and the plasma processing device (1) may plasma-process the plurality of objects to be processed (M) simultaneously or with a time difference.

[0072] FIGS. 2 to 4 illustrate an embodiment in which a plasma processing device (1) has three main bodies (100A, 100B, 100C), three base modules (200A, 200B, 200C), and three processing modules (300A, 300B, 300C). In addition, FIGS. 3 and 4 illustrate an embodiment in which a workpiece (M) to be processed is placed in only two of the three processing modules (300A, 300B, 300C). Meanwhile, the number of the main bodies (100), base modules (200), and processing modules (300) provided in the plasma processing device (1) is not particularly limited, and the number or combination of workpieces (M) to be processed placed in the plasma processing device (1) can also be set in various ways.

[0073] Although not shown in the drawing, the main body (100), base module (200), and processing module (300) may each be connected to a sensor unit (50) or a control unit (40). At this time, the sensor unit (50) and the control unit (40) may be built into the main body housing (2), or may be separately provided on the outside of the main body housing (2) and connected wired / wirelessly to the receiving unit (10), processing unit (30), and exhaust unit (20).

[0074] Below, the detailed configuration of the main body (100), base module (200), and processing module (300) and the operation of the plasma processing device (1) according to the same are described in detail.

[0075] Fig. 5 is a cross-sectional view showing a state in which some components of the plasma processing device (1) of Fig. 3 are disassembled, and Fig. 6 is a cross-sectional view showing a state in which some components of the plasma processing device (1) of Fig. 3 are combined.

[0076] Referring to FIGS. 5 and 6, the main body (100) may be equipped with a power module (EM).

[0077] The power module (EM) can supply electric energy to the base module (200). As described above, the main body housing (2) may have a built-in main body power unit (5), or an external power unit (not shown) may be provided outside the main body housing (2). The power module (EM) can be connected to the main body power unit (5) or the external power unit (not shown) via a power connector (EC) to receive electric energy and supply it to the base module (200).

[0078] The power module (EM) may include an electrode block (110). The electrode block (110) is formed of a conductive material and is arranged to surround the base module (200) so as to be electrically connected to the base module (200).

[0079] Specifically, the electrode block (110) may have a power connector (EC) inserted into one side. In addition, the electrode block (110) may surround the base module (200) and have a contact portion (111) that comes into contact with a first connector (220) made of a conductive material. Accordingly, the electrode block (110) may provide high-voltage electric energy (HV) received through the power connector (EC) to the first connector (220), and through this, high-voltage electric energy (HV) may be supplied to the base module (200).

[0080] The power module (EM) can be electrically connected to the mounting portion (210) of the base module (200). Although not shown in the drawing, the power module (EM) can be equipped with a ground electrode in a ground state (GV). The ground electrode can be electrically connected to the mounting portion (210) of the base module (200) so that the mounting portion (210) can be grounded.

[0081] The main body (100) may further include a penetrating member (120).

[0082] The penetrating member (120) penetrates one side of the base module (200) and can electrically connect a ground electrode (not shown) and the second connector (230) of the base module (200). Through this, the mounting portion (210) of the base module (200) can be grounded.

[0083] In addition, the penetrating member (120) can form a path through which gas can flow by penetrating one side of the base module (200). Accordingly, the air in the internal space (SP) can move along the path formed by the exhaust hole (EH) of the base module (200) and the penetrating member (120) and be discharged outside the main body (100).

[0084] The base module (200) may have a mounting portion (210), a first connector (220), and a second connector (230).

[0085] The mounting portion (210) can be used to mount the object to be treated (M). At this time, the object to be treated (M) may be directly placed on the mounting portion (210), or the object to be treated (M) may be supported by a separate supporting member and the supporting member may be placed on the mounting portion (210). The processing module (300) is coupled to the base module (200) and can form an internal space (SP) that accommodates the object to be treated (M) placed on the mounting portion (210).

[0086] The first connector (220) can electrically connect the power module (EM) of the main body (100) and the processing module (300). The first connector (220) can receive high-voltage electric energy (HV) through the electrode block (110) of the main body (100) and transmit it to the processing module (300).

[0087] The first connector (220) may include a joining member (221), a guide electrode (222), and a spring electrode (223).

[0088] The coupling member (221) can be coupled to the power module (EM) by making contact with the electrode block (110) of the main body (100). For example, the coupling member (221) can be provided with various parts that connect two different objects, such as a ball plunger. At this time, the coupling member (221) is formed of a conductive material and can receive electric energy by making contact with the electrode block (110). The base module (200) can be stably coupled to the main body (100) by the coupling member (221), and the base module (200) can receive high-voltage electric energy (HV).

[0089] The guide electrode (222) can extend from the connecting member (221). The guide electrode (222) is also formed of a conductive material and can transmit electrical energy.

[0090] The spring electrode (223) is connected to the guide electrode (222) and may be formed of a conductive material. That is, the guide electrode (222) may electrically connect the spring electrode (223) and the coupling member (221), and electrical energy may be transmitted from the power module (EM) of the main body (100) to the processing module (300) along the coupling member (221), the guide electrode (222), and the spring electrode (223).

[0091] The spring electrode (223) can be in contact with the connection electrode (322) of the processing module (300). When the processing module (300) is coupled to the base module (200), the spring electrode (223) and the connection electrode (322) can be in contact and electrically connected. Accordingly, the high-voltage electric energy (HV) supplied from the main body (100) to the base module (200) can be transmitted to the connection electrode (322) through the spring electrode (223). Through this, the high-voltage electric energy (HV) can be ultimately supplied to the main electrode (321) connected to the connection electrode (322).

[0092] In one embodiment, the spring electrode (223) may be positioned adjacent to the mounting portion (210). The spring electrode (223) is provided at least once, has elasticity, and is positioned adjacent to the mounting portion (210) to which the processing module (300) may be coupled. The processing module (300) may be stably fastened to the base module (200) by the spring electrode (223). That is, the spring electrode (223) may transmit electric energy to the processing module (300) and at the same time stably couple the processing module (300) and the base module (200).

[0093] The second connector (230) can electrically connect the power module (EM) of the main body (100) and the mounting portion (210). The power module (EM) has a ground electrode (not shown) in a ground state (GV), and the mounting portion (210) can be connected to the ground electrode and grounded by the second connector (230).

[0094] In one embodiment, the second connector (230) may be positioned within the sealing portion (235) of the base module (200). When the penetrating member (120) of the main body (100) penetrates the base module (200) and is inserted into the sealing portion (235), the second connector (230) may be positioned within the sealing portion (235) and come into contact with the penetrating member (120). Through this, the second connector (230) may be electrically connected to the ground electrode to ground the mounting portion (210).

[0095] Fig. 7 is a drawing conceptually showing the processing module (300) and plasma processing state of Fig. 5, and Fig. 8 is a cross-sectional view of the processing module (300) of Fig. 7. In addition, Figs. 9 and 10 are drawings showing modified examples of the processing module (300) of Fig. 5.

[0096] Referring to FIGS. 5 to 10 together, the processing module (300) may include a housing portion (310) and an electrode portion (320). The housing portion (310) may be coupled to the base module (200) to form an internal space (SP), and the electrode portion (320) may be electrically connected to the base module (200) to receive electrical energy.

[0097] The housing portion (310) may include a first housing (311), a second housing (312), and a housing cap (313). The housing portion (310) forms an internal space (SP) in which a material to be treated (M) is accommodated, and may function as an ampoule that can be coupled to the base module (200).

[0098] The first housing (311) can surround the object to be treated (M). For example, the first housing (311) can be formed as a cylindrical structure with at least a portion of the upper and lower portions open, and the object to be treated (M) can be placed inside. The exposed portion (3211) of the main electrode (321) can be exposed to the internal space (SP) through the open upper portion of the first housing (311). In addition, the open lower portion of the first housing (311) can be coupled to the base module (200).

[0099] The first housing (311) may be made of an insulating material. The processing module (300) receives high-voltage electric energy (HV) from the base module (200), and an electric field may be formed in the internal space (SP) where the object to be processed (M) is placed. Accordingly, the first housing (311) is provided with an insulating material to prevent leakage of high-voltage electric energy (HV) and safety accidents resulting therefrom.

[0100] For example, the first housing (311) may be formed of glass, plastic, etc., but is not particularly limited thereto and may be any material having insulating properties.

[0101] The second housing (312) may surround the first housing (311). For example, the second housing (312) may be formed as a cylindrical structure with at least a portion of the upper and lower portions open, and the first housing (311) may be positioned inside. A portion of a venting unit (330), which will be described later, may be inserted through the opening in the upper portion of the second housing (312). In addition, the second housing (312) may have an open lower portion that is coupled to the base module (200).

[0102] An electrode unit (320) may be placed between the second housing (312) and the first housing (311). The second housing (312) may be placed on the outside of the first housing (311), and may surround the main electrode (321) and the connection electrode (322) of the electrode unit (320).

[0103] The second housing (312) may be made of an insulating material. An electrode unit (320) may be arranged on the outside of the first housing (311), and the electrode unit (320) may receive high-voltage electric energy (HV) from the main body unit (100) through the base module (200). As a result, an electric field may be formed in the internal space (SP) where the object to be treated (M) is arranged. Accordingly, the second housing (312) surrounds the first housing (311) and the electrode unit (320) and is provided with an insulating material, so that the housing unit (310) is formed with a double cover structure, thereby improving user safety.

[0104] For example, the second housing (312) may be formed of glass, plastic, etc., but is not particularly limited thereto and may be any material having insulating properties.

[0105] In one embodiment, the first housing (311) and the second housing (312) may be made of a transparent material. This allows the user to visually check the internal space (SP) and the object to be processed (M) placed therein.

[0106] The housing cap (313) can be coupled to the second housing (312). The second housing (312) can have a predetermined opening in the upper portion into which a part of the venting unit (330) is inserted. At this time, the housing cap (313) is coupled to surround the second housing (312), so that the housing portion (310) can have a lower opening that can be coupled to the base module (200) and an upper portion formed as a sealed ampoule structure.

[0107] The housing cap (313) is formed of an insulating material and can cover the electrode portion (320). The electrode portion (320) can receive high-voltage electric energy (HV) from the main body portion (100) through the base module (200). Therefore, the housing cap (313) is coupled to the second housing (312) and covers the electrode portion (320) with an insulating material, thereby protecting the user from high-voltage electric energy (HV).

[0108] To summarize, the housing part (310) has a first housing (311), a second housing (312), and a housing cap (313) made of insulating material, and the first housing (311) forms an internal space (SP), and the second housing (312) and the housing cap (313) can sequentially cover the electrode part (320). Through this, the plasma processing device (1) can prevent multiple current leakage to the outside of the processing module (300) and safety accidents resulting therefrom even when high-voltage electric energy (HV) flows through the electrode part (320), thereby improving user safety.

[0109] In one embodiment, the housing cap (313) may include a deformation portion (3131). The deformation portion (3131) of the housing cap (313) is made of a flexible material and can be elastically deformed by an external force. When a user or an external device applies force to the deformation portion (3131) of the housing cap (313), the venting unit (330), which will be described later, operates according to the elastic deformation of the deformation portion (3131) and can vent the internal space (SP).

[0110] In one embodiment, the housing cap (313) may have auxiliary holes (not shown). Although not shown in the drawing, the housing cap (313) may have one or more auxiliary holes (not shown) through which external atmosphere may flow. When the venting unit (330) operates, external atmosphere may sequentially pass through the auxiliary holes (not shown) of the housing cap (313) and the venting holes (VH) described below and then flow into the internal space (SP).

[0111] The electrode unit (320) may be equipped with a main electrode (321) and a connection electrode (322). The main electrode (321) is connected to the base module (200) through the connection electrode (322) and may receive high voltage electric energy (HV).

[0112] The main electrode (321) may be arranged on one side of the housing portion (310). Specifically, the housing portion (310) has an opening at the bottom so that it can be coupled with the base module (200), and the object to be treated (M) may be mounted on the mounting portion (210) of the base module (200). The main electrode (321) may be arranged and coupled on one side of the housing portion (310) facing the mounting portion (210), for example, the upper portion of the first housing (311). That is, the main electrode (321) may be coupled to the housing portion (310) so as to face the base module (200).

[0113] At this time, the main electrode (321) can be electrically connected to the base module (200) by the connection electrode (322). Therefore, even if the main electrode (321) is spaced apart from the base module (200), it can receive high-voltage electric energy (HV) by the connection electrode (322) to form an electric field in the internal space (SP).

[0114] The main electrode (321) may be arranged symmetrically with respect to a virtual reference line (CL). The main electrode (321) may be arranged on one side of the housing portion (310), and may be provided in a symmetrical shape or arrangement with respect to a virtual reference line (CL) passing through the center of the housing portion (310). Through this, the main electrode (321) may form a uniform electric field in an area adjacent to the object to be processed (M) in the internal space (SP).

[0115] For example, if the first housing (311) is provided in a roughly cylindrical shape but has an open upper surface, the main electrode (321) may be coupled and arranged on the open upper surface of the first housing (311). Alternatively, if the first housing (311') has a predetermined opening in the edge area of ​​the upper surface (3111') as shown in FIG. 9, the main electrode (3211) may be coupled and arranged on the opening in the edge area. Alternatively, if the first housing (311'') has a predetermined opening in the central area of ​​the upper surface (3111'') as shown in FIG. 10, the main electrode (321'') may be coupled and arranged on the opening in the central area.

[0116] The main electrode (321) may have an exposed portion (3211). As described above, at least a portion of the upper portion of the first housing (311) may be open. The exposed portion (3211) of the main electrode (321) is exposed to the internal space (SP) through the opening of the first housing (311), so that plasma discharge can occur directly between the object to be treated (M) and the main electrode (321).

[0117] In one embodiment, a portion of the exposed portion (3211) of the main electrode (321) may protrude toward the object to be treated (M). Through this, the processing module (300) can efficiently generate plasma (P) in an area adjacent to the object to be treated (M) by controlling the distance between the exposed portion (3211) of the main electrode (321) and the object to be treated (M).

[0118] The connecting electrode (322) can connect the base module (200) and the main electrode (321). One end of the connecting electrode (322) can be connected to the base module (200) by a first fixing member (F1), and the other end can be connected to the main electrode (321) by a second fixing member (F2). Through this, the connecting electrode (322) can provide electric energy received from the base module (200) to the main electrode (321).

[0119] The connecting electrode (322) can be placed between the first housing (311) and the second housing (312). The connecting electrode (322) can extend between the first housing (311) and the second housing (312) to connect the base module (200) and the main electrode (321).

[0120] In one embodiment, the connecting electrode (322) may be a single electrode that is arranged on one side between the first housing (311) and the second housing (312) and extends linearly. Alternatively, the connecting electrode (322) may be a single electrode that is arranged between the first housing (311) and the second housing (312) and is formed in a plate shape that surrounds the first housing (311).

[0121] In another embodiment, the connecting electrode (322) may be a plurality of electrodes that are arranged and extend at different locations between the first housing (311) and the second housing (312). In this case, the plurality of connecting electrodes (322) may be arranged symmetrically with respect to an imaginary reference line (CL) passing through the center of the housing portion (310). Through this, the main electrode (321) may receive high-voltage electric energy (HV) from the connecting electrode (322) to form a uniform electric field in the internal space (SP).

[0122] Meanwhile, for convenience of explanation, the following description focuses on an embodiment in which a pair of connecting electrodes (322) are provided and placed between the first housing (311) and the second housing (312), but are symmetrically placed on both sides of the first housing (311) as in FIG. 5.

[0123] In one embodiment, the width (W) of the connecting electrode (322) may be 0.1 times or less of the outer circumference of the first housing (311). As described above, the main electrode (321) has an exposed portion (3211) exposed to the inner space (SP), so that an electric field may be formed by targeting an area adjacent to the object to be processed (M) in the inner space (SP). Meanwhile, the connecting electrode (322) is arranged on the outer side of the first housing (311) made of an insulating material, but is electrically connected to the main electrode (321), so that it may minutely affect the electric field of the inner space (SP). Therefore, by setting the width (W) of the connecting electrode (322) to 0.1 times or less of the outer circumference of the first housing (311), the influence of the electric field of the inner space (SP) on the connecting electrode (322) may be minimized.

[0124] In one embodiment, the distance (H) between the exposed portion (3211) of the main electrode (321) and the object to be treated (M) may be smaller than the distance (D) between the connection electrode (322) and the object to be treated (M). The exposed portion (3211) of the main electrode (321) is positioned closer to the object to be treated (M) than the connection electrode (322), so that the main electrode (321) can have a major influence on the electric field formed in the internal space (SP). This allows plasma (P) to be uniformly generated in the target area adjacent to the object to be treated (M).

[0125] In one embodiment, the distance (D) between the inner surface of the first housing (311) and the object to be treated (M), the thickness (T) or material of the first housing (311), and the distance (H) between the exposed portion (3211) of the main electrode (321) and the object to be treated (M) can be selected according to the target area for forming an electric field to generate plasma (P).

[0126] In particular, the influence of the connection electrode (322) on the electric field of the internal space (SP) may vary depending on the material of the insulating first housing (311) as well as the distance between the first housing (311) and the object to be treated (M). Therefore, by multiplying the distance (D) between the inner surface of the first housing (311) and the object to be treated (M) by the dielectric constant of the first housing (311) and then comparing it with the distance (H) between the exposed portion (3211) and the object to be treated (M), the electric field formation area by the main electrode (321) and the connection electrode (322) can be set.

[0127] Specifically, the distance (H) between the exposed portion (3211) and the object to be treated (M) may be set to be smaller than the product of the thickness (T) of the first housing (311) and the dielectric constant of the first housing (311) plus the distance (D) between the inner surface of the first housing (311) and the object to be treated (M).

[0128] In this case, the connecting electrode (322) can be positioned relatively farther from the object to be treated (M) than the main electrode (321). As a result, as described above, the main electrode (321) has the main influence on the electric field formed in the internal space (SP), and the connecting electrode (322) can minimize the influence on the electric field of the internal space (SP) while transmitting high-voltage electric energy (HV) from the base module (200) to the main electrode (321).

[0129] On the other hand, the distance (H) between the exposed portion (3211) and the object to be treated (M) can be set to substantially correspond to the value obtained by adding the distance (D) between the inner surface of the first housing (311) and the object to be treated (M) to the product of the thickness (T) of the first housing (311) and the dielectric constant of the first housing (311). In this case, the main electrode (321) has a major influence on the electric field formed in the internal space (SP), but the electric field of the internal space (SP) can be modified by the connection electrode (322).

[0130] In this way, the distance, arrangement relationship, material, etc. between the main electrode (321), the first housing (311), and the connection electrode (322) can be appropriately selected according to the strength of the electric field formed in the internal space (SP), the target area where plasma (P) is generated for plasma processing, etc. Through this, the plasma processing device (1) can efficiently generate plasma (P) in an area adjacent to the object to be processed (M), and the processing module (300) can be miniaturized and made lightweight.

[0131] The processing module (300) may further include a vacuum unit (not shown) and a venting unit (330). The processing module (300) may exhaust the internal space (SP) or inject air into the internal space (SP) through the vacuum unit (not shown) and the venting unit (330).

[0132] A vacuum unit (not shown) can exhaust the internal space (SP) of the housing portion (310) to form a vacuum state. Although not specifically shown in the drawing, the vacuum unit (not shown) can have various configurations that can exhaust air in the internal space (SP) by being connected to the exhaust hole (EH) of the base module (200), and can be connected to a device such as a vacuum pump of the main body portion (100) as needed.

[0133] Specifically, an electric field is formed in the internal space (SP) of the processing module (300), and plasma (P) can be generated at a preset pressure level. To this end, the processing module (300) can adjust the pressure of the internal space (SP) by injecting or exhausting gas into the internal space (SP). In particular, a vacuum unit (not shown) can form a vacuum state by exhausting the internal space (SP) through an exhaust hole (EH) of the base module (200) to be described later, and as a result, plasma (P) can be effectively generated in the internal space (SP).

[0134] The venting unit (330) may have a venting hole (VH). The venting unit (330) can open and close the venting hole (VH) to control whether air is injected into the internal space (SP).

[0135] Specifically, the processing module (300) can discharge plasma by adjusting the internal space (SP) to a preset low pressure. When the object to be processed (M) is subjected to plasma treatment under this pressure, when the venting hole (VH) is opened, external atmosphere can be injected into the internal space (SP) through the venting hole (VH) due to the pressure difference.

[0136] In one embodiment, the venting hole (VH) may be arranged in the main electrode (321). As shown in FIG. 7, when the upper surface of the first housing (311) is open and the main electrode (321) is arranged in combination with the open upper surface, the venting hole (VH) may penetrate one side of the main electrode (321) to provide a path for air to flow into the internal space (SP).

[0137] In another embodiment, the venting hole (VH) may be arranged in the first housing (311). As in FIGS. 9 and 10, when the upper portion of the first housing (311) is not completely open and has an opening on one side of the upper surface (3111), the venting hole (VH) may be arranged to penetrate the upper surface (3111) of the first housing (311), thereby providing a path for air to flow into the internal space (SP).

[0138] In one embodiment, the venting hole (VH) may be arranged offset to one side with respect to a virtual reference line (CL) passing through the center of the housing portion (310). The venting hole (VH) may be arranged offset to one side from the center of the housing portion (310), thereby preventing the external atmosphere from directly affecting the object to be treated (M) when flowing into the internal space (SP) through the venting hole (VH).

[0139] Fig. 11 is an enlarged cross-sectional view of the venting unit (330) of Fig. 5, and Fig. 12 is an enlarged perspective view of the venting unit (330) of Fig. 5.

[0140] Referring to FIGS. 11 and 12, the venting unit (330) may include a cover block (331), an elastic member (332), a guide block (333), and a filter (334).

[0141] The cover block (331) can cover the venting hole (VH). When an external force is applied to the processing module (300), the cover block (331) receives the force and changes its position, thereby opening or covering the venting hole (VH).

[0142] The cover block (331) may have a first block portion (3311) and a second block portion (3312). The first block portion (3311) is in contact with the elastic member (332), and the second block portion (3312) is connected to the first block portion (3311) and may be positioned corresponding to the venting hole (VH).

[0143] The elastic member (332) can be placed between the main electrode (321) and the cover block (331). The elastic member (332) can be placed by being inserted into a concave portion of the main electrode (321) as shown in FIG. 11, and one end can be in contact with the first block portion (3311) of the cover block (331).

[0144] The elastic member (332) can provide elastic force to the cover block (331) in an equilibrium state, thereby allowing the venting hole (VH) to be closed. The elastic member (332) is in contact with the first block portion (3311) of the cover block (331) in an equilibrium state, and the second block portion (3312) connected to the first block portion (3311) can cover the venting hole (VH). When force is applied to the cover block (331), the elastic member (332) is elastically deformed, and the second block portion (3312) of the cover block (331) can open the venting hole (VH).

[0145] The guide block (333) is placed in the housing portion (310) and can apply force to the cover block (331) when an external force is applied.

[0146] In one embodiment, the guide block (333) may be coupled to the deformation portion (3131) of the housing cap (313). When an external force is applied to the housing cap (313), the deformation portion (3131), which is made of a flexible material, may be elastically deformed. Due to the elastic deformation of the deformation portion (3131), the guide block (333) coupled to the deformation portion (3131) may change position and apply force to the cover block (331).

[0147] Specifically, when a user or an external device presses the deformation portion (3131) of the housing cap (313), the guide block (333) is pressed together and a force is applied to the cover block (331). At this time, the elastic member (332) is elastically compressed, and the second block portion (3312) of the cover block (331) opens the venting hole (VH).

[0148] Conversely, when the external force applied to the deformation portion (3131) is removed, the elastic member (332) is restored to an equilibrium state, and the second block portion (3312) of the cover block (331) can cover the venting hole (VH) again. In this way, the venting unit (330) can simply open or cover the venting hole (VH) depending on the external force applied to the housing cap (313) by utilizing the elastic deformation of the elastic member (332).

[0149] The filter (334) can filter external air injected into the internal space (SP) through the venting hole (VH). After the plasma treatment of the object to be treated (M) in the internal space (SP) is completed, the venting unit (330) can open the venting hole (VH) to inject external air into the internal space (SP). At this time, the filter (334) filters the external air, so that air with foreign substances removed can be injected into the internal space (SP).

[0150] In one embodiment, the filter (334) may be spaced apart from the venting hole (VH) with respect to a virtual reference line (CL). When the venting hole (VH) is positioned to one side with respect to the virtual reference line (CL), the filter (334) may be positioned to the other side with respect to the virtual reference line (CL). Through this, the external atmosphere may be sufficiently filtered of foreign substances by the filter (334) and then injected into the internal space (SP) through the venting hole (VH).

[0151] Below, the principle of plasma processing of a workpiece (M) by a plasma processing device (1) is explained again with reference to FIG. 7, etc.

[0152] A plasma treatment device (1) may be configured by combining a main body (100), a base module (200), and a processing module (300). The base module (200) may be integrally provided with the main body (100) or may be detachably provided and mounted on the main body (100). In addition, the processing module (300) may be mounted on the base module (200) and may be separated from the main body (100) after the object to be treated (M) is subjected to plasma treatment.

[0153] A material to be treated (M) may be placed inside the processing module (300). The processing module (300) may receive high-voltage electric energy (HV) from the main body (100) through the base module (200). At this time, the processing module (300) is provided with a main electrode (321) spaced apart from the mounting portion (210) of the base module (200) so as to face it, and a connection electrode (322) may electrically connect the main electrode (321) to the base module (200), the main body (100), the main body power supply (5), or an external power supply (not shown). Therefore, the main electrode (321) may be supplied with high-voltage electric energy (HV) through the connection electrode (322).

[0154] Additionally, the mounting portion (210) of the base module (200) can be connected to the ground electrode of the main body (100) and grounded. Through this, an electric field can be formed in the internal space (SP) of the processing module (300).

[0155] The internal space (SP) of the processing module (300) can be exhausted by the exhaust unit (20). The base module (200) has an exhaust hole (EH) so that the air in the internal space (SP) can be exhausted to the outside of the processing module (300). Through this, the internal space (SP) of the processing module (300) can be formed in a preset low-level pressure state or vacuum state. As a result, plasma discharge occurs in the internal space (SP), and the object to be processed (M) can be subjected to plasma treatment. At this time, the control unit (40) is connected to the main body control unit (40) and the exhaust unit (20), and can control the formation of an electric field for plasma generation, pressure control, etc.

[0156] When a plasma discharge occurs in the internal space (SP) of the processing module (300) and the object to be processed (M) is subjected to plasma treatment, the venting unit (330) operates to open the venting hole (VH) so that external air can be injected into the internal space (SP). At this time, a user or an external device can simply open or cover the venting hole (VH) by applying an external force to the housing cap (313) to operate the venting unit (330). Thereafter, the user can separate the processing module (300) from the main body (100) to obtain the object to be processed (M) that has been subjected to plasma treatment.

[0157] A plasma treatment device according to one embodiment of the present invention may be modularized into a main body, a base module, and a treatment module to enable rapid and simple plasma treatment of a target object. In this case, each module may be provided in a detachable manner or provided as an integral unit, so that it may be easily mounted or separated as needed.

[0158] A plasma processing device according to one embodiment of the present invention can appropriately control the electric field and pressure state of the internal space through a high-voltage electrode unit and an exhaust unit. Furthermore, the plasma processing device according to one embodiment of the present invention can simply inject external atmosphere into the internal space through a venting unit. Through this, the plasma processing device can effectively generate plasma discharge in the internal space and quickly and efficiently obtain a plasma-treated target object.

[0159] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

[0160] The specific implementations described in the examples are exemplary and do not limit the scope of the examples in any way. Furthermore, unless specifically stated as "essential," "important," or the like, an element may not be absolutely necessary for the application of the present invention.

[0161] The use of the term "above" and similar referential terms in the specification of embodiments (especially the claims) may refer to both singular and plural. Furthermore, if a range is described in the embodiments, it is intended that the invention includes the application of individual values ​​falling within the range (unless otherwise stated), and is equivalent to describing each individual value constituting the range in the detailed description. Finally, unless the order of steps constituting a method according to an embodiment is explicitly stated or otherwise stated to the contrary, the steps may be performed in any suitable order. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., "etc.") in the embodiments is merely intended to describe the embodiments in detail, and the scope of the embodiments is not limited by the examples or exemplary terms, unless otherwise defined by the claims. Furthermore, those skilled in the art will recognize that various modifications, combinations, and variations may be made within the scope of the appended claims or their equivalents, depending on design conditions and factors.

[0162] This invention was filed with the support of the national research and development project below.

[0163] [Project ID] 2420020754

[0164] [(Agency) Detailed Project Number] 00275019

[0165] [Ministry Name] Ministry of SMEs and Startups

[0166] [Name of Project Management (Specialist) Agency] Small and Medium Business Technology Information Promotion Agency

[0167] [Research Project Name] Small and Medium Enterprise Technology Innovation Development

[0168] [Research Project Name] Development of Medical Devices Using Plasma-Based 3D Printing Manufacturing Process

[0169] [Name of Project Performing Organization] Plasmap

[0170] Research Period: January 1, 2025 - December 31, 2025

[0171]

[0172] According to one embodiment of the present invention, a plasma treatment device is provided. Furthermore, embodiments of the present invention can be applied to techniques for sterilizing a subject to be treated or treating the surface of a subject to be treated using plasma.

Claims

1. A base module having a mounting portion on which the object to be treated is mounted; and It is coupled to the base module and includes a processing module for plasma processing the object to be processed in an internal space; The above processing module, a housing portion coupled to the base module to form the internal space; and A plasma processing device comprising: a main electrode disposed on one side of the housing portion facing the mounting portion; an electrode portion coupled to the base module; and electrically connected to a connector unit of the base module.

2. In paragraph 1, The above processing module, A vacuum unit that forms a vacuum state by exhausting the internal space of the housing part through the exhaust hole of the base module; and A plasma processing device further comprising a venting unit for injecting external atmosphere into the internal space of the housing portion through a venting hole.

3. In paragraph 2, The above venting unit is, A guide block arranged in the above housing portion; When an external force is applied from the above guide block, a cover block that opens the venting hole; and A plasma processing device further comprising an elastic member disposed between the main electrode and the cover block, the elastic member providing elasticity to the cover block in a balanced state to close the venting hole.

4. In paragraph 3, The above housing part, A housing cap having a flexible material deformation portion surrounding the main electrode; The above guide block is, A plasma processing device arranged in the deformation portion of the housing cap, moving according to deformation of the deformation portion and applying force to the cover block.

5. In paragraph 4, The above venting unit is, A plasma processing device further comprising an auxiliary hole penetrating the housing cap to provide a path for the external atmosphere to flow.

6. In paragraph 2, The above venting unit is, A plasma processing device further comprising a filter disposed spaced apart from the venting hole and filtering the external atmosphere injected into the internal space.

7. In paragraph 1, The above electrode part, It further comprises a connecting electrode that is electrically connected to the main electrode and receives electric energy from an external power source through the connector unit of the base module; The above housing part, A first housing surrounding the above-mentioned object and made of an insulating material; and A plasma processing device comprising a second housing made of an insulating material, which surrounds the connecting electrode and the main electrode.

8. In paragraph 7, A plasma processing device wherein the first housing and the second housing are made of a transparent material.

9. In paragraph 7, A plasma processing device, wherein the width of the above connecting electrode is 0.1 times or less of the outer circumferential length of the first housing.

10. In paragraph 7, A plasma processing device wherein the main electrode has an exposed portion at least partially exposed to the internal space of the housing portion.

11. In paragraph 10, A plasma treatment device in which, when the main electrode receives the electric energy, plasma is formed between the exposed portion of the main electrode and the object to be treated.

12. In paragraph 1, A plasma processing device in which the main electrodes are arranged symmetrically around a virtual reference line passing through the center of the housing portion.

13. A base module having a mounting portion on which the object to be treated is mounted; and A main body having the base module mounted thereon and a power module supplying electric energy to the base module; The above base module, A plasma processing device, comprising a processing module that forms an internal space, a first connector that electrically connects the power module and the processing module, and a second connector that electrically connects the power module and the mounting portion.

14. In paragraph 13, The above power module, A plasma processing device comprising an electrode block that contacts the first connector and transmits electric energy to the processing module.

15. In paragraph 14, The above first connector, A bonding member that is in contact with the electrode block, is made of a conductive material, and is bonded to the power module; a guide electrode extending from the above-mentioned joining member; and A plasma processing device comprising a spring electrode connected to the above guide electrode, made of a conductive material, and in contact with the processing module.

16. A base module having a mounting portion on which a treatment material is mounted; A processing module coupled to the base module and performing plasma processing on the object to be processed in an internal space; and The base module is mounted thereon, and includes a main body that supplies electric energy to form an electric field in the processing module; The above processing module, a housing portion coupled to the base module to form the internal space; and A plasma processing device comprising: a main electrode disposed on one side of the housing portion facing the mounting portion; an electrode portion coupled to the base module; and electrically connected to a connector unit of the base module.

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