Data center having a liquid cooling system with submerged synthetic jet device

Abstract

A data center comprises electronic computing components and a liquid cooling system. The electronic computing components are submerged in a cooling liquid. The liquid cooling system is configured to transfer heat from the electronic computing components to the cooling liquid in which the electronic computing components are submerged to cool the electronic computing components.

Description

DATA CENTER HAVING A LIQUID COOLING SYSTEM WITH SUBMERGED SYNTHETIC JET DEVICECROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority under 35 U.S.C. § 119(e) to U.S. Provisional Application Serial No. 63 / 676,044, filed July 26, 2024, and U.S. Provisional Application Serial No. 63 / 717,917, filed November 8, 2024, which are both expressly incorporated by reference herein.BACKGROUND

[0002] The evolving data generation landscape requires faster and more efficient microprocessors, prompting innovative manufacturing methods for smaller and faster transistors. Transistor congestion and rising demand for parallel processing are pushing the thermal design power of microprocessors beyond the limit for current air cooling technologies. Consequently, transitioning towards liquid cooling is being explored.

[0003] Four major liquid cooling techniques include indirect water cooling with rear door heat exchangers, direct liquid cooling using water blocks or evaporators, single-phase, and two-phase immersion cooling. There is a need to continue exploration of liquid cooling in these systems and to improve cooling effectiveness and efficiency.SUMMARY

[0004] A data center includes electronic computing components and an immersion liquid cooling system configured to transfer heat from the electronic computing components to cool the electronic computing components. The liquid cooling system includes a central coolant distribution unit (CDU), a heat exchanger, and at least one synthetic jet. The central cooling distribution unit has a bath that contains cooling liquid in which the electronic computing components and the synthetic jet are submerged.

[0005] The central coolant distribution unit is configured to drive the cooling liquid through the heat exchanger to generate a primary immersion flow of the cooling liquid in the bath. The synthetic jet is configured to generate a cross flow in the form of an impinging, inclined, or parallel flow of the cooling liquid onto the electronic computing components. The cross flow of the cooling fluid generated by the synthetic jet enables increased heat transfer from the electronic computing components to the cooling liquid. The cooling liquid can beelectric conducting, in that case the synthetic jet device will be electrically isolated, or a dielectric liquid, no electrical isolation for the synthetic jet device is required

[0006] Detailed studies relating to modelling and implementation of liquid-submerged synthetic jets are included in this disclosure. Additional features of the present disclosure will become apparent to those skilled in the art upon consideration of the illustrative embodiments, modelling, and data in this document.BRIEF DESCRIPTIONS OF THE DRAWINGS

[0007] The detailed description particularly refers to the accompanying Fig.s in which:

[0008] Fig. 1 is a diagrammatic view of a data center including IT equipment and electronic computing components and a liquid cooling system showing the IT equipment and electronic computing components submerged in a cooling liquid and the liquid cooling system having a central coolant distribution unit (CDU), a heat exchanger, and a number of synthetic jet devices;

[0009] Fig. 2 is a partially diagrammatic perspective view of a portion of the data center from Fig. 1 showing a primary immersion flow generated by the central coolant distribution unit and heat exchanger moving over the IT equipment and electronic components, and showing a secondary coupled cross flow generated by the synthetic jet device moving on to electronic computing components to increase heat transfer away from the electronic components;

[0010] Fig. 3 is a diagrammatic perspective view of the synthetic jet device discharging the secondary coupled cross flow across the primary immersion flow onto the electrical component; and

[0011] Fig. 4A is a partial sectional view of a synthetic jet device adapted for use submerged in the liquid cooling system of Fig.s 1-3 showing that the synthetic jet device includes a body, a diaphragm made up of a piezoelectric patch coupled to a shim, and a fluid- impermeable layer;

[0012] Fig. 4B is a top perspective view of the illustrative body used in the synthetic jet of Fig. 4A;

[0013] Fig. 4C is a bottom perspective view of the illustrative body used in the synthetic jet of Fig. 4A;

[0014] Fig. 4D is a top view of the synthetic jet device of Fig. 4A showing the diaphragm made up of the piezoelectric patch and shim, and showing the diaphragm fixedaround the peripheral edge to the body with adhesive prior to application of the fluid impermeable layer over the diaphragm;

[0015] Fig. 4E is a top view of the synthetic jet device similar to Fig. 4D after application of the fluid impermeable layer over the diaphragm showing that the fluid impermeable layer also extends over an electrical connection to the piezoelectric patch to avoid leakage of electrical energy and enable use when a submerged in fluid; and

[0016] Fig. 5 is a partially diagrammatic side elevation view of a portion of the data center from Fig. 1 showing a controller coupled to the synthetic jet device as well as to sensors in the bath and on the electronic components for use in managing operation of the synthetic jet device.DETAILED DESCRIPTION

[0017] An illustrative data center 10 is shown in Fig. 1. The data center 10 includes IT equipment with electronic computing components 12 and a liquid cooling system 14 as shown in Figs. 1 and 2. The liquid cooling system 14 is configured to transfer heat from the IT equipment and electronic computing components 12 to manage the temperature of the IT equipment and computing components 12 during use.

[0018] The liquid cooling system 12 is an immersion cooling system as suggested in Fig. 1. The liquid cooling system 12 includes a central coolant distribution unit (CDU) 20, a heat exchanger 22, and at least one synthetic jet device 24. Illustratively two synthetic jet devices 24 are incorporated into the system 12 as shown in Fig. 1. The central cooling distribution unit 20 has a bath 26 that contains cooling liquid in which the IT equipment and electronic computing components 12 and the synthetic jet devices 24 are submerged. The cooling liquid is a dielectric liquid in the illustrative embodiment, but can also be other suitable liquids.

[0019] The central coolant distribution unit 20 is configured to generate a primary immersion flow 16 of the cooling liquid in the bath 26 as suggested in Figs. 1 and 2. The central coolant distribution unit 20 can rely upon the rising of heated cooling liquid in the bath 26 to establish a direction for the primary immersion flow 16. Additionally or alternatively, the central coolant distribution unit 20 may include a pump and / or other features configured to drive the primary immersion flow 16 in a desired direction or pattern. In the illustrative embodiment, the central coolant distribution unit 20 drives the cooling liquid through the heat exchanger 22 to remove heat from fluid in the bath 26. Since the IT equipment and electroniccomputing components 12 are submerged in the fluid in the bath 26, heat is, in turn, removed from the IT equipment and electronic computing components 12.

[0020] Incorporation of the synthetic jet devices 24 into the liquid cooling system can augment the effectiveness of the central coolant distribution unit (CDU) 20 and the heat exchanger 22. The synthetic jet devices 24 are configured to generate an impinging flow 18 of the cooling liquid onto the electronic computing components 12 as suggested in Fig. 2. The cross flow 18 of the cooling fluid generated by the synthetic jet devices 24 enables increased heat transfer from the electronic computing components 12 to the cooling liquid.

[0021] The synthetic jet devices 24 are arranged to discharge the cross flow 18 of the fluid substantially perpendicular to an overall direction of the primary immersion flow 16 as shown in Figs. 1-3. Of course it is contemplated to arrange the synthetic jet devices 24 to discharge flow 18 in various directions relative to a primary flow, the electronic computing components 12, or other components to drive heat transfer into the cooling fluid.

[0022] The electronic computing components 12 are mounted to a board 30 as shown in Figs. 1 and 2. In the illustrative embodiment, the synthetic jet devices 24 are arranged to discharge the cross flow 18 of the cooling liquid substantially perpendicular to a plane defined by the board 30. It is contemplated that the synthetic jet devices 24 can also be arranged to discharge flow 18 at various angles, including inclined or parallel to, the plane defined by the board 30.

[0023] The synthetic jet devices 24 are coupled to the board 30 by a support frame 31 to locate the synthetic jet devices 24 relative to the electronic computing component 12. In the exemplary design, the support frame 31 includes legs 33, 35 of equal lengths that extend away from the board 30 and support the synthetic jet devices 24 at a location spaced apart from a corresponding electrical component 12. In other examples, the legs 33, 35 could have different lengths so as to set the direction of discharge flow 18 relative to the primary flow 16 and / or the plane defined by the board 30.

[0024] Each illustrative synthetic jet device 24 includes a body 40, a diaphragm 42, and a fluid-impermeable layer 48 as shown in Figs. 3 and 4. The body 40 is formed to define a cavity 50 and an orifice opening 52 into the cavity 50. It is possible to form a number of orifices in the body two in able multiple flows being discharged from the synthetic jet device

[0025] The diaphragm 42, made up of a piezoelectric patch 44 coupled to a shim 46. The diaphragm 42 is fixed about the outer periphery to the body 40 to close off the cavity 50 and lave only the orifice opening 52 as an access into the cavity 50. Illustratively, the diaphragm 42 is fixed to the body 40 via an acrylic resin, though other adhesives and / or suitable fasteners. The diaphragm 42 is configured to transfer momentum to the cooling liquid inside the cavity 50 in response to electrical current applied to the piezoelectric patch 44 of the diaphragm 42.

[0026] The fluid-impermeable layer 48 cooperates with the shim 46 of the diaphragm 42 to sandwich the piezoelectric patch 44 and seal the piezoelectric patch 44 from the cooling liquid in which the synthetic jet 24 is submerged. In the illustrative embodiment, the fluid- impermeable layer 48 extends to the shim 46 around the periphery of the piezoelectric patch 44. In the illustrative embodiment, the fluid-impermeable layer 48 is made from RTV silicone. In other embodiments, the fluid-impermeable layer 48 may be made from air-dry rubber, the epoxy, an insulating soft membrane, or other suitable materials.

[0027] Each synthetic jet device 24 includes electrical contacts 56 coupled to the piezoelectric patch 44 and a wire 58 extending from the electrical contacts 56 as shown in Figs. 2-4. The electrical contacts 56 are sandwiched between the piezoelectric patch 44 and the fluid- impermeable layer 46. The fluid-impermeable layer 48 acts to seal the piezoelectric patch 44 along with the electrical contacts 56 from the cooling liquid in which the synthetic jet 24 is submerged. The wire 58 extends from the electrical contacts 56 coupled to the piezoelectric patch 44 and through the fluid-impermeable layer 48.

[0028] In operation, a controller 60 is coupled to the piezoelectric patch 44 of the synthetic jet device 24 via wire 58 as shown in Fig. 5. The controller 60 is configured to drive motion of the piezoelectric patch 44 and the diaphragm 42 via electrical energy sent to piezoelectric patch 44. By moving the diaphragm 42, the controller 60 generates discharge flows 18.

[0029] The controller 60 is illustratively in communication with sensors 61, 62 as shown in Fig. 5. The sensors 61, 62 provide information that may be used to manage frequency and / or amplitude of diaphragm 42 motion, and therefore manage characteristics of the discharge flows 18. In the exemplary embodiment, the sensor 61 is a temperature sensor configured to measure temperature of the electronic component 12 and the sensor 62 is a temperature sensor configured to measure the temperature of the cooling fluid in the bath 26.

[0030] A method of cooling electrical computer components using the foregoing system 10 can include submerging the electrical computer components 12 in a bath 26 of cooling fluid and discharging an impinging flow 18 of the cooling liquid onto the electronic computing components 12 from a synthetic jet device 24 that is also submerged in the cooling fluid. The method can also include removing heat from the cooling fluid by via a heat exchanger 22 and cooling distribution unit 20.

[0031] In some embodiments, the method includes using a controller 60 adapted to operate the synthetic jet device 24, the heat exchanger 22, and / or the cooling distribution unit 20 to manage cooling of the electrical computer components 12. The controller 60 can operate the synthetic jet device 24, the heat exchanger 22, and / or the cooling distribution unit 20 based, at least in part, on inputs from sensors 61, 62, user inputs, and / or inputs associated with operation of the electrical computer components 12 (for example, high energy operations of the electrical computer components 12).

[0032] Two-phase cooling systems can also incorporate synthetic jet devices 24 in much the same way as the above discussed single phase cooling system 10. In such two-phase cooling systems, the electrical computer components 12 are sealed inside a bath of engineered based cooling fluid in liquid form. The fluid often has a low boiling point (can be below 50°C vs. 100°C for water), heat from the electrical computer components 12 boils the surrounding fluid. The boiling of the liquid causes a phase change (from liquid to gas), which gives two- phase immersion cooling its name.

[0033] The vapor is then condensed back to the liquid form via water-cooled condenser coils, which are integrated into the top of the sealed racks. The condensed liquid drips back into the bath of fluid to be recycled through the system. In two-phase systems the synthetic jet device(s) 24 facilitate bubble departure during boiling. By encouraging bubble formation and / or direction within the fluid, the overall system thermal management can be improved over passive systems.

[0034] Thus, in dual phase systems, the synthetic jet(s) 24 can enhance both as a heat transfer at selected locations associated with electronic components 12 and can aid bubble dynamics in two phase liquid cooling scenarios. As in the shown and above-described single phase cooling system, the single phase cooling system with synthetic jet device(s) 24 can be coupled to a controller configured to direct operation of the devices 24, the condenser, etc. based on factors such as sensor inputs (i.e. thermal sensors in the fluid and associated with theelectronics), electronic component 12 operation, and / or fluid conditions (i.e. flow, viscosity, etc).

[0035] The following numbered clauses include embodiments that are contemplated and that are non-limiting:

[0036] Clause 1. A data center or high density electronics system comprising electronic computing components along with secondary electronics components, and a liquid cooling system including a bath that contains cooling liquid, in which the electronic computing components are submerged, and a synthetic jet device; the synthetic jet device submerged in the cooling liquid and configured to generate a type of impinging, inclined, or parallel flow of the cooling liquid onto the electronic computing components thereby enabling increased heat transfer from the electronic computing components to the cooling liquid.

[0037] Clause 2. The data center of clause 1, wherein the liquid cooling system includes a central coolant distribution unit configured to generate a primary immersion flow of the cooling liquid in the bath.

[0038] Clause 3. The data center of clause 2, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device is arranged to discharge the cross flow of the cooling liquid substantially perpendicular, inclined, or parallel to an overall direction of the primary immersion flow.

[0039] Clause 4. The data center of clause 1, any other suitable clause, or any other suitable combination of clauses, wherein the electronic computing components are mounted to a board.

[0040] Clause 5. The data center of clause 4, clause 5, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device is coupled to the board by a support frame to locate the synthetic jet device relative to the electronic computing component.

[0041] Clause 6. The data center of clause 4, clause 5, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device is arranged to discharge the cross flow of the cooling liquid substantially perpendicular to a plane defined by the board.

[0042] Clause 7. The data center of clause 1, any other suitable clause, or any other suitable combination of clauses, wherein the liquid cooling system includes a heat exchangerand the central coolant distribution unit drives the cooling liquid through the heat exchanger to generate the primary immersion flow.

[0043] Clause 8. The data center of clause 1, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device includes a body formed to define a cavity and an orifice opening into the cavity, a diaphragm with a piezoelectric patch coupled to a shim configured to transfer momentum to the cooling liquid inside the cavity in response to electrical current applied to the piezoelectric patch, and a fluid-impermeable layer that cooperates with the shim to sandwich the piezoelectric patch and seal the piezoelectric patch from the cooling liquid in which the synthetic jet is submerged.

[0044] Clause 9. The data center of clause 8, any other suitable clause, or any other suitable combination of clauses, wherein the fluid-impermeable layer extends to the shim around the periphery of the piezoelectric patch.

[0045] Clause 10. The data center of clause 8, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device includes electrical contacts coupled to the piezoelectric patch that are sandwiched between the piezoelectric patch and the fluid-impermeable layer.

[0046] Clause 11. The data center of clause 10, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device includes wire extending from the electrical contacts coupled to the piezoelectric patch and through the fluid- impermeable layer.

[0047] Clause 12. A liquid cooling system for electronic computer components, the system comprising a bath that contains cooling liquid adapted to receive electronic computing components therein and a synthetic jet device, the synthetic jet device submerged in the cooling liquid and configured to generate a controlled synthetic jet flow of the cooling liquid within the bath.

[0048] Clause 13. The data center of clause 12, wherein the liquid cooling system includes a central coolant distribution unit configured to generate a primary immersion flow of the cooling liquid in the bath.

[0049] Clause 14. The data center of clause 13, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device is arranged to discharge the flow of the cooling liquid substantially perpendicular to an overall direction of the primary immersion flow.

[0050] Clause 15. The data center of clause 12, any other suitable clause, or any other suitable combination of clauses, wherein the liquid cooling system includes a heat exchanger and the central coolant distribution unit drives the cooling liquid through the heat exchanger to generate the primary immersion flow.

[0051] Clause 16. The data center of clause 12, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device includes a body formed to define a cavity and at least one orifice opening into the cavity, a diaphragm with a piezoelectric patch coupled to a shim configured to transfer momentum to the cooling liquid inside the cavity in response to electrical current applied to the piezoelectric patch, and a fluid- impermeable layer that cooperates with the shim to sandwich the piezoelectric patch and seal the piezoelectric patch from the cooling liquid in which the synthetic jet is submerged.

[0052] Clause 17. The data center of clause 16, any other suitable clause, or any other suitable combination of clauses, wherein the fluid- impermeable layer extends to the shim around the periphery of the piezoelectric patch.

[0053] Clause 18. The data center of clause 17, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device includes electrical contacts coupled to the piezoelectric patch that are sandwiched between the piezoelectric patch and the fluid-impermeable layer.

[0054] Clause 19. The data center of clause 18, any other suitable clause, or any other suitable combination of clauses, wherein the synthetic jet device includes wire extending from the electrical contacts coupled to the piezoelectric patch and through the fluid- impermeable layer.

[0055] Clause 20. The system of clause 12, clause 13, clause 14, any other suitable clause, or any other suitable combination of clauses further comprising a controller configured to drive the synthetic jet device based, at least in part, based on inputs received from sensors.

[0056] Clause 21. The system of clause 20, any other suitable clause, or any other suitable combination of clauses, wherein the inputs from sensors includes temperatures associated with the electronic computing components and / or the cooling fluid.

[0057] Clause 22. The system of clause 20, 21, any other suitable clause, or any other suitable combination of clauses, further including operating a controller to drive the synthetic jet device based, at least in part, based on operation of the electronic computing components.

[0058] Clause 23. The method of clause 20, 21, 22, any other suitable clause, or any other suitable combination of clauses, further including operating a controller to drive the heat exchanger based, at least in part, based on inputs received from sensors.

[0059] Clause 24. A method of cooling electrical computer components, the method comprising one or more of

[0060] submerging the electrical computer components in a bath of cooling fluid, and

[0061] discharging an impinging flow of the cooling liquid onto the electronic computing components from a synthetic jet device that is also submerged in the cooling fluid.

[0062] Clause 25. The method of clause 24, any other suitable clause, or any other suitable combination of clauses, further including operating a controller to drive the synthetic jet device based, at least in part, based on inputs received from sensors.

[0063] Clause 26. The method of clause 25, any other suitable clause, or any other suitable combination of clauses, wherein the inputs from sensors includes temperatures associated with the electronic computing components and / or the cooling fluid.

[0064] Clause 27. The method of clause 24, 25, any other suitable clause, or any other suitable combination of clauses, further including operating a controller to drive the synthetic jet device based, at least in part, based on operation of the electronic computing components.

[0065] Clause 28. The method of clause 24, any other suitable clause, or any other suitable combination of clauses, further including operating heat exchanger to remove heat from the cooling fluid.

[0066] Clause 29. The method of clause 28, any other suitable clause, or any other suitable combination of clauses, further including operating a controller to drive the heat exchanger based, at least in part, based on inputs received from sensors.

[0067] Clause 30. The method of clause 24, wherein the synthetic jet device forms part of a cooling system according to one of clauses 12-23.

Claims

WHAT IS CLAIMED IS:

1. A data center or high density electronics system comprising electronic computing components along with secondary electronics components, and a liquid cooling system including a bath that contains cooling liquid, in which the electronic computing components are submerged, and a synthetic jet device; the synthetic jet device submerged in the cooling liquid and configured to generate a type of impinging, inclined, or parallel flow of the cooling liquid onto the electronic computing components thereby enabling increased heat transfer from the electronic computing components to the cooling liquid.

2. The data center of claim 1, wherein the liquid cooling system includes a central coolant distribution unit configured to generate a primary immersion flow of the cooling liquid in the bath.

3. The data center of claim 2, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device is arranged to discharge the cross flow of the cooling liquid substantially perpendicular, inclined, or parallel to an overall direction of the primary immersion flow.

4. The data center of claim 1, any other suitable claim, or any other suitable combination of claims, wherein the electronic computing components are mounted to a board.

5. The data center of claim 4, claim 5, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device is coupled to the board by a support frame to locate the synthetic jet device relative to the electronic computing component.

6. The data center of claim 4, claim 5, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device is arranged to discharge the cross flow of the cooling liquid substantially perpendicular to a plane defined by the board.

7. The data center of claim 1, any other suitable claim, or any other suitable combination of claims, wherein the liquid cooling system includes a heat exchanger and the central coolant distribution unit drives the cooling liquid through the heat exchanger to generate the primary immersion flow.

8. The data center of claim 1, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device includes a body formed to define a cavity and an orifice opening into the cavity, a diaphragm with a piezoelectric patch coupled to a shim configured to transfer momentum to the cooling liquid inside the cavity in response toelectrical current applied to the piezoelectric patch, and a fluid-impermeable layer that cooperates with the shim to sandwich the piezoelectric patch and seal the piezoelectric patch from the cooling liquid in which the synthetic jet is submerged.

9. The data center of claim 8, any other suitable claim, or any other suitable combination of claims, wherein the fluid-impermeable layer extends to the shim around the periphery of the piezoelectric patch.

10. The data center of claim 8, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device includes electrical contacts coupled to the piezoelectric patch that are sandwiched between the piezoelectric patch and the fluid- impermeable layer.

11. The data center of claim 10, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device includes wire extending from the electrical contacts coupled to the piezoelectric patch and through the fluid-impermeable layer.

12. A liquid cooling system for electronic computer components, the system comprising a bath that contains cooling liquid adapted to receive electronic computing components therein and a synthetic jet device, the synthetic jet device submerged in the cooling liquid and configured to generate a controlled synthetic jet flow of the cooling liquid within the bath.

13. The system of claim 12, wherein the liquid cooling system includes a central coolant distribution unit configured to generate a primary immersion flow of the cooling liquid in the bath.

14. The system of claim 13, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device is arranged to discharge the flow of the cooling liquid substantially perpendicular to an overall direction of the primary immersion flow.

15. The system of claim 12, any other suitable claim, or any other suitable combination of claims, wherein the liquid cooling system includes a heat exchanger and the central coolant distribution unit drives the cooling liquid through the heat exchanger to generate the primary immersion flow.

16. The system of claim 12, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device includes a body formed to define a cavity and at least one orifice opening into the cavity, a diaphragm with a piezoelectric patchcoupled to a shim configured to transfer momentum to the cooling liquid inside the cavity in response to electrical current applied to the piezoelectric patch, and a fluid-impermeable layer that cooperates with the shim to sandwich the piezoelectric patch and seal the piezoelectric patch from the cooling liquid in which the synthetic jet is submerged.

17. The system of claim 16, any other suitable claim, or any other suitable combination of claims, wherein the fluid-impermeable layer extends to the shim around the periphery of the piezoelectric patch.

18. The system of claim 17, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device includes electrical contacts coupled to the piezoelectric patch that are sandwiched between the piezoelectric patch and the fluid- impermeable layer.

19. The system of claim 18, any other suitable claim, or any other suitable combination of claims, wherein the synthetic jet device includes wire extending from the electrical contacts coupled to the piezoelectric patch and through the fluid-impermeable layer.

20. The system of claim 12, 13, 14, any other suitable claim, or any other suitable combination of claims further comprising a controller configured to drive the synthetic jet device based, at least in part, based on inputs received from sensors.

21. The system of claim 20, any other suitable clause, or any other suitable combination of claims, wherein the inputs from sensors includes temperatures associated with the electronic computing components and / or the cooling fluid.

22. The system of claim 20, 21, any other suitable claim, or any other suitable combination of claims, further including operating a controller to drive the synthetic jet device based, at least in part, based on operation of the electronic computing components.

23. The method of claim 20, 21, 22, any other suitable claim, or any other suitable combination of claims, further including operating a controller to drive the heat exchanger based, at least in part, based on inputs received from sensors.

24. A method of cooling electrical computer components, the method comprising one or more of submerging the electrical computer components in a bath of cooling fluid, and discharging an impinging flow of the cooling liquid onto the electronic computing components from a synthetic jet device that is also submerged in the cooling fluid.

25. The method of claim 24, any other suitable claim, or any other suitable combination of claims, further including operating a controller to drive the synthetic jet device based, at least in part, based on inputs received from sensors.

26. The method of claim 25, any other suitable claim, or any other suitable combination of claims, wherein the inputs from sensors includes temperatures associated with the electronic computing components and / or the cooling fluid.

27. The method of claim 24, 25, any other suitable claim, or any other suitable combination of claims, further including operating a controller to drive the synthetic jet device based, at least in part, based on operation of the electronic computing components.

28. The method of claim 24, any other suitable claim, or any other suitable combination of claims, further including operating heat exchanger to remove heat from the cooling fluid.

29. The method of claim 28, any other suitable claim, or any other suitable combination of claims, further including operating a controller to drive the heat exchanger based, at least in part, based on inputs received from sensors.

30. The method of claim 24, wherein the synthetic jet device forms part of a cooling system according to one of claims 12-23.

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