Method for the production of an adhesive structure having an electrically detachable self-adhesive compound

Abstract

Illustrated and described is a method for producing an adhesive structure (1), wherein the adhesive structure (1) has one layer or a plurality of layers which are arranged one above the other and are produced successively, wherein the layer or each of the plurality of layers is made of a self-adhesive compound, wherein the layer or each of the plurality of layers is produced in such a way that the layer or each of the plurality of layers has at least one edge portion (5) that extends peripherally around the particular layer or peripherally around a particular portion of the layer (5), wherein the layer or at least a first produced layer of the plurality of layers is made of an electrically detachable self-adhesive compound and is brought in contact with a surface (23) of a transfer unit (9) on a first side (25) of the adhesive structure (1).

Description

[0001] tesa Societas Europaea Norderstedt

[0002] Method for producing an adhesive structure with an electrically releasable adhesive compound

[0003] Description

[0004] The present invention relates to a method for producing an adhesive structure.

[0005] Methods for producing an adhesive structure are known from the prior art. For example, the adhesive structure can have one or more layers arranged one above the other and produced sequentially. The layer, or each layer of the multiple layers, can be formed from an adhesive compound. The layer, or each layer of the multiple layers, can be produced such that it has at least one edge section arranged around the corresponding layer or around a corresponding section of the layer. One or more edge sections can be created, for example, using manufacturing processes that can also be referred to as 3D printing, additive manufacturing, generative manufacturing, or rapid prototyping technologies.For example, adhesive structures can be manufactured using additive manufacturing techniques such as Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF). This involves layering the adhesive structure layer by layer to create the adhesive. Additive manufacturing allows for the creation of complex three-dimensional shapes that are either impossible or require extensive post-processing to produce using other manufacturing methods. An adhesive structure produced in this way can then be brought into contact with the surface of a transfer unit, particularly during its production, to facilitate transport to a specific location for a particular application.

[0006] In general, for methods to produce an adhesive structure, it is desirable that a sufficiently high adhesive effect can be provided between a layer of the adhesive structure and the transfer unit or between a previously produced layer of the adhesive structure and the transfer unit, and that, when using the adhesive structure, the adhesive effect is low enough to allow the adhesive structure to be removed from the transfer unit and to subject the adhesive structure to only a low mechanical stress.

[0007] It is therefore an object of the present invention that, when producing the adhesive structure, a sufficiently high adhesive effect is provided between the layer of the adhesive structure and the transfer unit or between the first produced layer of the adhesive structure and the transfer unit, and that, when using the adhesive structure, the adhesive effect is low enough to allow the adhesive structure to be removed from the transfer unit and to subject the adhesive structure to only a low mechanical stress.

[0008] According to a first aspect of the invention, the aforementioned problem is solved by a method with the features of claim 1. The method is provided for producing an adhesive structure. The adhesive structure comprises one or more layers or is built up from several layers. The several layers are arranged one above the other and are produced successively. The layer or each layer of the several layers is formed from an adhesive compound. The layer or each layer of the several layers is produced such that the layer or each layer of the several layers has at least one edge section arranged circumferentially around the corresponding layer or around a corresponding section of the layer. The layer or at least one layer produced first of the several layers is formed from an electrically releasable adhesive compound.The layer, or the first layer produced of the multiple layers, is brought into contact with a surface of a transfer unit on a first side of the adhesive structure.

[0009] As previously described, the method for producing the adhesive structure is provided. The adhesive structure is adhesive in its manufactured state. In particular, the adhesive structure has a surface that faces towards its surroundings, allowing it to come into contact with various other surfaces and then form good adhesion with them. Preferably, the adhesive structure, and especially its surface, exhibits permanent tackiness at room temperature. Preferably, the adhesive structure, and especially its surface, can form good adhesion with the other surfaces under slight pressure. In particular, the adhesive structure is an electrically releasable pressure-sensitive adhesive.As previously described, the adhesive structure comprises one or more layers, or is composed of several layers. Preferably, the adhesive structure comprises one layer, which can also be referred to as the first layer. Alternatively, and more preferably, the adhesive structure comprises several layers, or is composed of several layers. Preferably, the several layers comprise a first layer and a second layer. In the case that the adhesive structure comprises several layers, or is composed of several layers, the layers are arranged one above the other and are produced sequentially.

[0010] As previously described, the layer, or each layer of the multiple layers, is formed from an adhesive compound. In the case where the adhesive structure comprises the layer, the layer is formed from an adhesive compound. In the alternative case where the adhesive structure comprises or is composed of multiple layers, each layer of the multiple layers is formed from an adhesive compound. Preferably, each layer of the multiple layers is formed from the same adhesive compound. Preferably, the adhesive compound is first melted during the production of each layer and then solidifies again to form the corresponding layer. Preferably, the solidified state of the adhesive compound is a state in which the adhesive compound ensures the tackiness of the adhesive structure.In this case, the adhesive compound is preferably an extremely high-viscosity elastic liquid with a glass transition temperature of less than -10 °C, so that the stickiness of the adhesive structure is ensured at room temperature.

[0011] In the process according to the invention, an adhesive compound is built up as a single layer or as a sequence of superimposed layers. It is inherent in the nature of the process that, if the adhesive compound is built up as a sequence of superimposed layers, these layers are no longer necessarily recognizable as such in the final product. Rather, the individual layers can merge into one another. The result of a process according to the invention is therefore preferably a single adhesive compound that is perceived only as such and not as a multi-layered structure. The term "layers" in this context refers only to the process and the layer-by-layer construction of the adhesive compound carried out therein.

[0012] The method according to the invention is preferably a method for producing an adhesive compound (adhesive structure (1)), wherein the adhesive compound is produced by additive manufacturing through the sequential deposition of several layers on top of each other, wherein each layer of the several layers is produced in such a way that it has at least one edge section (5) arranged around the corresponding layer or around a corresponding section of the layer, and wherein the adhesive compound is an electrically releasable adhesive compound.

[0013] As previously described, the layer, or each layer of the multiple layers, is manufactured such that it has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer. In the case where the adhesive structure comprises the layer, the layer is manufactured such that it has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer. In the alternative case where the adhesive structure comprises the multiple layers, each layer of the multiple layers is manufactured such that it has at least the corresponding edge section arranged around the corresponding layer or around a corresponding section of the corresponding layer.By manufacturing the layer, or each layer of the multiple layers, such that it has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer, it is ensured that the layer, or each layer of the multiple layers, is manufactured directly as the corresponding layer is intended to be for the adhesive structure. This applies in particular to manufacturing each layer such that it extends in the principal plane of the corresponding layer according to a predetermined extent, so that the corresponding layer does not require any further processing.This specifically excludes any change in the extent of the corresponding layer within the main extent plane of the corresponding layer during the production of the corresponding layer, which is the case, for example, when producing stamped parts using dies and which can also be referred to as stamped parts.By manufacturing the layer or each layer of the multiple layers in such a way that the layer or each layer of the multiple layers has at least the edge section arranged around the corresponding layer or around a corresponding section of the layer, it is ensured that the corresponding layer and thus also the adhesive structure can be manufactured in a particularly resource-efficient manner, since, in particular, compared to the production of die-cut parts that are punched out from a blank and thus create sections of the blank that are not die-cut parts and therefore have to be disposed of or recycled, no such sections are created, which can also be referred to as die-cut slugs.

[0014] As previously described, the layer, or at least the first layer produced among the multiple layers, is formed from the electrically releasable adhesive. In the case where the adhesive structure comprises the layer, the layer is therefore formed from the electrically releasable adhesive. In the alternative case where the adhesive structure comprises or is constructed from multiple layers, at least the first layer produced among the multiple layers is formed from the electrically releasable adhesive. Preferably, each layer of the multiple layers is formed from the electrically releasable adhesive.Because the layer, or at least the first layer of the multi-layer system, is formed from the electrically releasable pressure-sensitive adhesive, it is ensured that the adhesive strength of the layer, or of the first layer of the multi-layer system, can be reduced by applying an electrical voltage. Because the adhesive strength of the layer, or of the first layer of the multi-layer system, or of the pressure-sensitive adhesive system as a whole, can be reduced by applying an electrical voltage, the adhesive structure, after it has been produced and transferred by the transfer unit to a location where it is to be separated from the surface of the transfer unit, can be separated from the surface of the transfer unit particularly easily by applying an electrical voltage to the first layer, or of the first layer of the multi-layer system.The fact that the adhesive strength of the layer, or of the first layer produced among multiple layers, or of the adhesive compound as a whole, can be reduced by applying an electrical voltage, thus making it particularly easy to separate the adhesive compound from the surface of the transfer unit, can also be described as "debonding-on-demand." This ensures that a sufficiently high level of adhesion is present both during the production of the layer, or of the first layer produced among multiple layers, between the layer and the surface of the transfer unit, and that the adhesive strength can be selectively reduced for later use of the adhesive structure. This allows the adhesive structure to be removed from the surface of the transfer unit, and this removal is also associated with minimal mechanical stress on the adhesive structure.

[0015] The electrically releasable pressure-sensitive adhesive can be produced and configured in various ways. For example, the electrically releasable pressure-sensitive adhesive may contain an electrolyte. The electrolyte may be an ionic liquid. Alternatively, the electrolyte may be a metal salt. In the context of the present invention, an electrically releasable pressure-sensitive adhesive is preferably understood to be a pressure-sensitive adhesive in which, when the pressure-sensitive adhesive is bonded to another component and an adhesive force is defined by this bond, this adhesive force is greater than an adhesive force threshold.Furthermore, in connection with the present invention, the electrically releasable adhesive is preferably understood to be an adhesive in which, when an electrical voltage is applied between a first section of the adhesive and a second section, the adhesive force is preferably lower than the adhesive force threshold. Furthermore, in connection with the present invention, the electrically releasable adhesive is preferably understood to be an adhesive in which, when no electrical voltage is applied between the first section of the adhesive and the second section, the adhesive force is again greater than the adhesive force threshold.

[0016] As previously described, the layer, or the first layer produced among the multiple layers, is brought into contact with the surface of the transfer unit on the first side of the adhesive structure. In the case where the adhesive structure has a single layer, the layer is brought into contact with the surface of the transfer unit on the first side of the adhesive structure. Alternatively, in the case where the adhesive structure has multiple layers or is composed of multiple layers, the first layer produced among the multiple layers is brought into contact with the surface of the transfer unit on the first side of the adhesive structure.By bringing the layer or the first layer of the multiple layers on the first side of the adhesive structure into contact with the surface of the transfer unit, it is ensured that the adhesive structure, after it has been produced, can be moved by means of the transfer unit to a location where the layer or the first layer of the multiple layers on the first side of the adhesive structure can be separated from the surface of the transfer unit and the layer or the first layer of the multiple layers on the first side of the adhesive structure can be brought into contact with a surface of a component in order to produce a device that has the adhesive structure and the component.

[0017] In summary, it can be stated that the present invention provides both a sufficiently high adhesive effect between the layer of the adhesive structure and the transfer unit or between the first layer of the adhesive structure produced and the transfer unit when producing the adhesive structure, and also that the adhesive effect is low enough when using the adhesive structure to allow the adhesive structure to be removed from the transfer unit and to subject the adhesive structure to only a low mechanical stress.

[0018] In one embodiment, a primer is applied to the surface of the transfer unit before the layer, or the first layer of the multi-layer assembly, on the first side of the adhesive structure is brought into contact with the surface of the transfer unit. Applying the primer to the surface of the transfer unit before the layer, or the first layer of the multi-layer assembly, on the first side of the adhesive structure is brought into contact with the surface of the transfer unit ensures improved adhesion between the adhesive structure and the transfer unit, resulting in particularly strong adhesion of the layer, or the first layer of the multi-layer assembly, to the surface of the transfer unit when applied.

[0019] In one embodiment, the transfer unit is electrically conductive. The electrical conductivity of the transfer unit ensures that the layer, the first layer produced among the multiple layers, or the adhesive compound as a whole can be electrically contacted by means of the transfer unit. This allows a section of a voltage source to be connected to the transfer unit, thereby providing the electrical voltage with which the adhesive strength of the layer, or the first layer produced among the multiple layers, can be reduced by applying an electrical voltage. Preferably, within the scope of the present invention, the transfer unit is considered "electrically conductive" if its electrical conductivity is greater than 10 Ω. 5 S / m is. Preferably, the transfer unit comprises a metal and / or a metal alloy or is formed from a metal or a metal alloy.

[0020] In one embodiment, the transfer unit is a film. By using a film as the transfer unit, a particularly lightweight transfer unit is provided, allowing the adhesive structure to be transported in a particularly resource-efficient manner.

[0021] In one embodiment, a liner is brought into contact with the adhesive structure on a second side opposite the first side. By bringing the liner into contact with the adhesive structure on the second side opposite the first side, it is ensured that the adhesive structure can be protected from contamination by means of the liner. Meanwhile, after the adhesive structure has been produced, it is transferred by the transfer unit to a location where the layer, or the first layer produced of the multiple layers, on the first side of the adhesive structure can be separated from the surface of the transfer unit. The layer, or the first layer produced of the multiple layers, on the first side of the adhesive structure can then be brought into contact with a surface of a first component. After the liner has been removed,the layer, or a recently produced layer of the multiple layers on the second side of the adhesive structure, can be brought into contact with a surface of a second component to produce a device.

[0022] In one embodiment, the pressure-sensitive adhesive is at least partially meltable, wherein the adhesive is conveyed by an extruder through a heated nozzle to form the layer or each layer of the multiple layers, such that the adhesive melts and then solidifies again to form the layer or each layer of the multiple layers. The fact that the adhesive is at least partially meltable ensures that it can be melted at least partially in order to be applied to the transfer unit in its molten state.By extruding the adhesive compound through the heated nozzle in such a way that it melts and then solidifies to form the layer or each layer of the multi-layer system, it is ensured that the layer or each layer of the multi-layer system, and thus the adhesive structure, can be produced using Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF). Preferably, the adhesive structure is produced using additive manufacturing. Preferably, the solidified state of the adhesive compound is one in which the adhesive compound ensures the tackiness of the adhesive structure.In this case, the adhesive compound is preferably an extremely high-viscosity elastic liquid with a glass transition temperature of less than -10 °C, so that the stickiness of the adhesive structure is ensured at room temperature.

[0023] According to a second aspect of the invention, the aforementioned problem is solved by a method with the features of claim 7. The method is provided for manufacturing a device. The device comprises a component and an adhesive structure manufactured by a method according to the first aspect of the invention. The component and the manufactured adhesive structure are provided. An electrical voltage is applied to the layer or the first layer of the multiple layers. The layer or the first layer of the multiple layers on the first side of the adhesive structure is separated from the surface of the transfer unit. The layer or the first layer of the multiple layers is brought into contact with a surface of the component on the first side of the adhesive structure.By applying an electrical voltage to the layer or the first layer produced among the multiple layers, it is ensured that the adhesive effect between the layer or the first layer produced among the multiple layers and the transfer unit is sufficiently weak to allow the adhesive structure to be released from the transfer unit, thereby subjecting the adhesive structure to only minimal mechanical stress. The features, technical effects, and / or advantages described in connection with the method according to the first aspect of the invention also apply, at least analogously, to the method according to the second aspect of the invention, so a corresponding repetition is omitted here.

[0024] Although the steps of the method according to the first aspect of the invention and the steps of the method according to the second aspect of the invention are each described in a specific sequence, the present invention is not limited to these respective sequences. Rather, the individual steps can be carried out in any meaningful order, and in particular, at least partially in parallel with each other.

[0025] Further features, advantages, and applications of the present invention will become apparent from the following description of the exemplary embodiments and the figures. All features described and / or illustrated, individually and in any combination, constitute the subject matter of the invention, irrespective of their composition in the individual claims or their cross-references. In the figures, the same reference numerals denote identical or similar objects.

[0026] Figures 1 and 2 each show a schematic representation of an adhesive structure that has been produced using a first embodiment of a method according to the invention for producing the adhesive structure.

[0027] Figures 3 and 4 each show a schematic representation of an adhesive structure that has been produced using a second embodiment of the inventive method for producing the adhesive structure.

[0028] Figure 5 shows a schematic representation while the adhesive structure shown schematically in Figures 1 and 2 is produced using the first embodiment of the inventive method for producing the adhesive structure. Figure 6 shows a schematic representation of the first embodiment of the inventive method for producing the adhesive structure.

[0029] Figure 7 shows a schematic representation of a device equipped with a first

[0030] An embodiment of a method for manufacturing the device according to the invention has been produced.

[0031] Figure 8 shows a schematic representation of the first embodiment of the inventive method for manufacturing the device,

[0032] Figure 9 shows a schematic representation of the second embodiment of the inventive method for producing the adhesive structure,

[0033] Figure 10 shows a schematic representation of a device that has been manufactured using a second embodiment of the inventive method for manufacturing the device, and

[0034] Figure 11 shows a schematic representation of the second embodiment of the inventive method for manufacturing the device.

[0035] Figures 1 and 2 each show a schematic representation of an adhesive structure 1 produced using a first embodiment of a method according to the invention for producing the adhesive structure 1; Figures 3 and 4 each show a schematic representation of an adhesive structure 1 produced using a second embodiment of the method according to the invention for producing the adhesive structure 1; Figure 5 shows a schematic representation while the adhesive structure 1 shown schematically in Figures 1 and 2 is produced using the first embodiment of the method according to the invention for producing the adhesive structure 1; and Figure 6 shows a schematic representation of the first embodiment of the method according to the invention for producing the adhesive structure 1.

[0036] The adhesive structure 1, schematically depicted in Figures 1 and 2, has a layer, which can also be referred to as the first layer 3. This layer is formed from an adhesive compound. The layer has a circumferential edge section 5. The first layer 3 extends in a principal plane of extension of the first layer 3, and the circumferential edge section 5 also extends in the principal plane of the first layer 3. The edge section 5 extends circumferentially around a straight line perpendicular to the principal plane of extension of the first layer 3. In the principal plane of extension of the first layer 3, the edge section 5 has a surface that faces a surrounding area 7 of the adhesive structure 1. Figure 1 also shows a transfer unit 9, a liner 11, and an application unit 13. Figure 2 shows the transfer unit 9 and the application unit 13.Figure 2 is a top view, corresponding to the top-to-bottom view in Figure 1. To better illustrate the adhesive structure 1, the liner 11 is omitted in Figure 2.

[0037] The adhesive structure 1, schematically depicted in Figures 3 and 4, comprises several layers: a first layer 3 and a second layer 15. The first layer 3 and the second layer 15 are arranged one above the other. Both the first layer 3 and the second layer 15 are formed from an adhesive compound. The first layer 3 has a circumferential edge section 5. The first layer 3 extends in a principal plane of extension of the first layer 3, and the circumferential edge section 5 also extends in the principal plane of extension of the first layer 3. The edge section 5 extends circumferentially around a straight line perpendicular to the principal plane of extension of the first layer 3. In the principal plane of extension of the first layer 3, the edge section 5 has a surface that faces a surrounding area 7 of the adhesive structure 1.The second layer 15 has three sections, each of which has a circumferential edge section 5 arranged around the corresponding section of the layer. Each of the three sections of the second layer 15 extends in a principal extent plane of the second layer 15, and each circumferential edge section 5 also extends in the principal extent plane of the second layer 15. Each edge section 5 extends circumferentially around a corresponding straight line arranged perpendicular to the principal extent plane of the second layer 15. In the principal extent plane of the second layer 15, each edge section 5 has a corresponding surface that faces a surrounding area 7 of the adhesive structure 1. Figure 3 also shows a transfer unit 9, a liner 11, and an application unit 13.Figure 4 shows the transfer unit 9 and the application unit 13. Figure 4 is a top view, corresponding to the top-to-bottom view in Figure 3. To better illustrate the adhesive structure 1, the liner 11 is omitted from Figure 4.

[0038] As already described, Figure 5 shows a schematic representation of the production of the adhesive structure 1, schematically depicted in Figures 1 and 2, using the first embodiment of the method according to the invention. In addition to the adhesive structure 1, which has already been produced in sections, the transfer unit 9, and the application unit 13, Figure 5 also shows an extruder 17 and a heated nozzle 19. The extruder 17 conveys the pressure-sensitive adhesive intended for the adhesive structure 1 towards the heated nozzle 19. The heated nozzle 19, which is heated during the production of the adhesive structure 1, melts the pressure-sensitive adhesive and applies the molten adhesive to the transfer unit 9. The molten adhesive then solidifies again during application and / or after it has been applied to the transfer unit 9.To apply the pressure-sensitive adhesive to the transfer unit 9, the heated nozzle 19, which is movably mounted on a frame, is moved parallel to the main plane of the layer being produced, thus producing the layer section by section. The current direction of movement of the heated nozzle 19 is symbolized by an arrow in Figure 5. The pressure-sensitive adhesive is applied to the transfer unit 9 continuously, or, to produce individual sections of a layer, intermittently. The heated nozzle 19 is moved, for example, along a first direction parallel to the main plane of the layer and / or along a second direction perpendicular to the first direction and parallel to the main plane of the layer.Alternatively, the heated nozzle 19 can be fixedly attached to a frame, and the system unit 13 can be movably attached to a frame, so that the system unit 13 is moved parallel to the main plane of extension of the corresponding layer being produced to apply the adhesive to the transfer unit 9, thus producing the corresponding layer step by step. Each of these two described processes can also be referred to as Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF). As already described, Figure 5 shows the schematic representation during the production of the adhesive structure 1, which is schematically depicted in Figures 1 and 2, using the first embodiment of the process according to the invention.The adhesive structure 1 shown schematically in Figures 3 and 4 is produced in a similar manner using the second embodiment of the method according to the invention.

[0039] As already described, Figure 6 shows a schematic representation of the first embodiment of the inventive method for producing the adhesive structure 1. In a first process step 101 of the method, the pressure-sensitive adhesive for producing the adhesive structure 1 and the transfer unit 9 are provided. The transfer unit 9 is a film. Because the transfer unit 9 is a film, it is ensured that a transfer unit 9 with a particularly low weight is provided, so that the adhesive structure 1 can be transported with the transfer unit 9 in a particularly resource-efficient manner. The transfer unit 9 is brought into contact with a surface 21 of the application unit 13 on a first side of the transfer unit 9 and connected to it in such a way that the transfer unit 9 and the application unit 13 are firmly connected to each other during the production of the adhesive structure 1.When producing the first layer 3, either the heated nozzle 19 can be moved relative to the system unit 13, or the system unit 13 can be moved relative to the heated nozzle 19, so that the heated nozzle 19 is then also moved relative to the transfer unit 9, or the transfer unit 9 is moved relative to the heated nozzle 19.

[0040] In a second process step 102, a primer is applied to a surface 23 of the transfer unit 9 before the layer, i.e., the first layer 3, is brought into contact with the surface 23 of the transfer unit 9 on a first side 25 of the adhesive structure 1. Applying the primer to the surface 23 of the transfer unit 9 before the layer, i.e., the first layer 3, is brought into contact with the surface 23 of the transfer unit 9 on the first side 25 ensures that the adhesion between the adhesive structure 1 and the transfer unit 9 is improved, so that the first layer 3 adheres particularly well to the surface 23 of the transfer unit 9 when applied. Preferably, the second process step 102 is carried out before the first process step 101. Alternatively, preferably, the second process step 102 is carried out after the first process step 101.In each of these two alternatives, the second process step 102 is carried out before the third process step 103.

[0041] In a third process step 103, the first layer 3 is produced. The first layer 3 is produced in such a way that it is gradually produced and applied to the surface 23 of the transfer unit 9. In doing so, the first layer 3 is brought into contact with the surface 23 of the transfer unit 9 on the first side 25 of the adhesive structure 1.By bringing the first layer 3 on the first side 25 of the adhesive structure 1 into contact with the surface 23 of the transfer unit 9, the adhesive structure 1, once produced, can be transferred by the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and brought into contact with a surface of a component to produce a device 29. The production of the device 29 will be discussed in detail later. In the third process step 103, the first layer 3 is produced such that the first layer 3 has the edge section 5 arranged around the perimeter of the first layer 3 as already described.By manufacturing the first layer 3 such that it has the circumferential edge section 5, it is ensured that the first layer 3 is produced directly in the form required for the adhesive structure 1. This applies in particular to manufacturing the first layer 3 such that it extends in its principal plane of extent according to a predetermined extent, thus eliminating the need for further processing. This specifically prevents any changes to the extent of the first layer 3 within its principal plane of extent during its manufacture, which occurs, for example, when producing die-cut parts.By manufacturing the first layer 3 in such a way that it has the circumferential edge section 5, it is ensured that the first layer 3 and thus also the adhesive structure 1 can be manufactured in a particularly resource-efficient manner, since, in particular, compared to the production of die-cut parts that are punched out from a blank and thus create sections of the blank that are not die-cut parts and therefore have to be disposed of or recycled, no such sections are produced, which can also be referred to as die-cut slugs.

[0042] In the third process step 103, the first layer 3 is produced such that it is formed from an electrically releasable adhesive compound. The adhesive compound is therefore an electrically releasable adhesive compound. By producing the first layer 3 from this electrically releasable adhesive compound, it is ensured that the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage.Because the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage, the adhesive structure 1, after it has been manufactured and transferred by the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 is to be separated from the surface 23 of the transfer unit 9, can be separated from the surface 23 of the transfer unit 9 particularly easily by applying an electrical voltage to the first layer 3. The fact that the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage can also be referred to as "debonding-on-demand".

[0043] The transfer unit 9 is electrically conductive. Because the transfer unit 9 is electrically conductive, it ensures that the first layer 3 can be electrically contacted by means of the transfer unit 9, so that a section of a voltage source can be connected to the transfer unit 9 and thus the electrical voltage can be provided with which the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage. Preferably, within the scope of the present invention, the transfer unit 9 is considered "electrically conductive" if its electrical conductivity is greater than 10. 5 S / m is. Preferably, the transfer unit 9 comprises a metal and / or a metal alloy or is formed from a metal or a metal alloy.

[0044] Furthermore, the pressure-sensitive adhesive is at least partially meltable. This partial meltability ensures that the adhesive can be partially melted and applied to the transfer unit 9 in its molten state. To form the first layer 3, the adhesive is conveyed by the previously described extruder 17 and through the previously described heated nozzle 19, causing it to melt and then solidify again. The first layer 3, and thus the adhesive structure 1, can therefore be produced using Fused Deposition Modeling (FDM), Fused Layer Modeling (FLM), Liquid Additive Manufacturing (LAM), or Fused Granulate Fabrication (FGF).

[0045] In a fourth process step 104, a liner 11 is brought into contact with the adhesive structure 1 on one of the two opposite sides 27 of the adhesive structure 1. In the example shown, the liner 11 is brought into contact with the first layer 3 of the adhesive structure 1 on the second side 27 of the adhesive structure 1.By bringing the liner 11 into contact with the adhesive structure 1 on the second side 27 opposite the first side 25, it is ensured that the adhesive structure 1 can be protected from contamination by means of the liner 11, while the adhesive structure 1, after it has been produced, is transferred by means of the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a first component 31 and, after the liner 11 has been removed again, the first layer 3 on the second side 27 of the adhesive structure 1 can be brought into contact with a surface of a second component 33 in order to produce a device 29.The fabrication of the device 29 will be discussed in detail later. The described method is intended for the fabrication of the adhesive structure 1. In this process, the first layer 3 is brought into contact with the surface 23 of the transfer unit 9. The transfer unit 9 ensures a certain degree of dimensional stability for the transport of the adhesive structure 1, so that in its fabricated state, the adhesive structure 1, with its first layer 3, is initially in contact with the surface 23 of the transfer unit 9. For further use of the adhesive structure 1, the contact between the first layer 3 and the surface 23 of the transfer unit 9 can be broken, and the adhesive structure 1 can remain in its fabricated state. The first layer 3 is also brought into contact with the liner 11.The liner 11 provides a certain degree of protection for the adhesive structure 1 during transport, so that in its manufactured state, the adhesive structure 1 is initially in contact with the first layer 3 and the liner 11. For further use of the adhesive structure 1, the contact between the first layer 3 and the liner 11 can be broken, and the adhesive structure 1 can remain in its manufactured state. These circumstances can be considered part of the manufacturing process of the adhesive structure 1 in connection with the present invention.

[0046] Figure 7 shows a schematic representation of a device 29 that has been manufactured using a first embodiment of a method according to the invention for manufacturing the device 29, and Figure 8 shows a schematic representation of the first embodiment of the method according to the invention for manufacturing the device 29. The method already described for manufacturing the adhesive structure 1 can be incorporated into a method for manufacturing the device 29. The device 29 comprises the adhesive structure 1, a first component 31, which is a mobile phone, and a second component 33, which is a battery. The first component 31 and the second component 33 can be joined together using the adhesive structure 1.For example, if an old mobile phone battery is to be replaced by a new battery, i.e., by the second component 33, the old battery can first be detached from the mobile phone and the old adhesive structure that connected the old battery and the mobile phone removed. Now, the adhesive structure 1 and the second component 33, i.e., the new battery, can be prepared, and after both the adhesive structure 1 and the transfer unit 9 and the adhesive structure 1 and the liner 11 have been separated, the new battery and the mobile phone can be connected using the adhesive structure 1.

[0047] In the method for manufacturing the device 29, which produces the adhesive structure

[0048] In a first process step 101, the adhesive structure 1, the first component 31, and the second component 33 are provided. In a second process step 102, an electrical voltage is applied to the first layer 3. Applying this voltage ensures that the adhesive effect between the first layer 3 and the transfer unit 9 is low enough to allow the adhesive structure 1 to be released from the transfer unit 9 without subjecting it to only minimal mechanical stress. In a third process step 103, the first layer 3 is separated from the liner 11 on the second side 27 of the adhesive structure 1 and brought into contact with the second component 33 on the second side 27 of the adhesive structure 1.In a fourth process step 104, the first layer 3 on the first side 25 of the adhesive structure 1 is separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 is brought into contact with a surface of the first component 31.

[0049] Figure 9 shows a schematic representation of the second embodiment of the inventive method for producing the adhesive structure 1, Figure 10 shows a schematic representation of a device 29 which has been produced using a second embodiment of the inventive method for producing the device 29, and Figure 11 shows a schematic representation of the second embodiment of the inventive method for producing the device 29.

[0050] In a first process step 101 of the second embodiment of the inventive method for producing the adhesive structure 1, schematically illustrated in Figure 9, the pressure-sensitive adhesive for producing the adhesive structure 1 and the transfer unit 9 are provided. Here, too, the transfer unit 9 is a film. Because the transfer unit 9 is a film, it is ensured that a transfer unit 9 with a particularly low weight is provided, so that the adhesive structure 1 can be transported with the transfer unit 9 in a particularly resource-efficient manner. The transfer unit 9 is brought into contact with a surface 21 of the system unit 13 on a first side of the transfer unit 9 and connected to it in such a way that the transfer unit 9 and the system unit 13 are firmly connected to each other during the production of the adhesive structure 1.When producing the first layer 3, either the heated nozzle 19 can be moved relative to the system unit 13, or the system unit 13 can be moved relative to the heated nozzle 19, so that the heated nozzle 19 is then also moved relative to the transfer unit 9, or the transfer unit 9 is moved relative to the heated nozzle 19. In a second process step 102, a primer is applied to a surface 23 of the transfer unit 9 before the first layer produced of the multiple layers, i.e., the first layer 3, is brought into contact with the surface 23 of the transfer unit 9 on a first side 25 of the adhesive structure 1.By applying the primer to the surface 23 of the transfer unit 9 before the first layer 3 on the first side 25 of the adhesive structure 1 is brought into contact with the surface 23 of the transfer unit 9, the adhesion between the adhesive structure 1 and the transfer unit 9 is improved, ensuring that the first layer 3 adheres particularly well to the surface 23 of the transfer unit 9 when applied. Preferably, the second process step 102 is carried out before the first process step 101. Alternatively, preferably, the second process step 102 is carried out after the first process step 101. In each of these two alternatives, the second process step 102 is carried out before the third process step 103.

[0051] In a third process step 103, the multiple layers, i.e., the first layer 3 and the second layer 15, are produced. First, the first layer 3 is produced in such a way that it is gradually produced and applied to the surface 23 of the transfer unit 9. In doing so, the first layer 3 is brought into contact with the surface 23 of the transfer unit 9 on the first side 25 of the adhesive structure 1.By bringing the first layer 3 on the first side 25 of the adhesive structure 1 into contact with the surface 23 of the transfer unit 9, the adhesive structure 1, once produced, can be transferred by the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a component to produce a device 29. The production of the device 29 will be discussed in detail later. After the first layer 3 has been produced, the second layer 15 is produced by gradually applying it to a surface of the first layer 3 facing away from the transfer unit 9.The multiple layers, i.e., the first layer 3 and the second layer 15, are therefore produced one after the other.

[0052] In the third process step 103, each layer, i.e., the first layer 3 and the second layer 15, is produced such that the first layer 3 has the edge section 5 already described arranged around the first layer 3 and the second layer 15 has several sections, each section of the several sections having a corresponding edge section 5 already described arranged around the corresponding section of the second layer 15.By manufacturing each layer, i.e., the first layer 3 and the second layer 15, such that the first layer 3 has the edge section 5 already described arranged around the first layer 3 and the second layer 15 has several sections, each section of which has a corresponding edge section 5 already described arranged around the corresponding section of the second layer 15, it is ensured that the first layer 3 and the second layer 15 are manufactured directly as they are intended to be for the adhesive structure 1.This applies in particular to the production of the first layer 3 and the second layer 15 such that the first layer 3 and the second layer 15 each extend in a corresponding principal extent plane of the respective layer according to a predetermined extent, so that the first layer 3 and the second layer 15 do not subsequently require further processing. This specifically excludes any change in the extent of the first layer 3 and the second layer 15 within the corresponding principal extent plane of the respective layer during the production of the first layer 3 and the second layer 15, which is the case, for example, when producing stamped parts manufactured using dies.By manufacturing each layer, i.e., the first layer 3 and the second layer 15, such that the first layer 3 has the previously described circumferential edge section 5 arranged around the first layer 3, and the second layer 15 has several sections, each section of which has a corresponding previously described circumferential edge section 5 arranged around the corresponding section of the second layer 15, it is ensured that the first layer 3 and the second layer 15, and thus also the adhesive structure 1, can be manufactured in a particularly resource-efficient manner. This is especially true compared to the production of die-cut parts, which are punched out from a blank and thus create sections of the blank that are not die-cut parts and therefore have to be disposed of or recycled. In this case, no such sections, which can also be referred to as die-cut slugs, are produced.

[0053] In the third process step 103, the first layer produced, i.e., the first layer 3, is manufactured such that it is formed from an electrically releasable adhesive compound. The adhesive compound of the first layer 3 is therefore an electrically releasable adhesive. By manufacturing the first layer 3 from this electrically releasable adhesive compound, it is ensured that the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage.Because the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage, the adhesive structure 1, after it has been manufactured and transferred by the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 is to be separated from the surface 23 of the transfer unit 9, can be separated from the surface 23 of the transfer unit 9 particularly easily by applying an electrical voltage to the first layer 3. The fact that the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage can also be referred to as "debonding-on-demand".

[0054] In the second embodiment of the inventive method for producing the adhesive structure 1, schematically depicted in Figure 9, the transfer unit 9 is also electrically conductive. The electrical conductivity of the transfer unit 9 ensures that the first layer 3 can be electrically contacted by means of the transfer unit 9, allowing a section of a voltage source to be connected to the transfer unit 9 and thus providing the electrical voltage with which the adhesive strength of the first layer 3 can be reduced by applying an electrical voltage. Preferably, within the scope of the present invention, the transfer unit 9 is considered "electrically conductive" if its electrical conductivity is greater than 10. 5 S / m is. Preferably, the transfer unit 9 comprises a metal and / or a metal alloy or is formed from a metal or a metal alloy.

[0055] In the second embodiment of the inventive method for producing the adhesive structure 1, schematically depicted in Figure 9, the pressure-sensitive adhesive is also meltable at least in sections. This meltability ensures that the adhesive can be melted at least in sections in order to be applied to the transfer unit 9 in its molten state. To form the first layer 3 and the second layer 15, the pressure-sensitive adhesive is conveyed by the previously described extruder 17 and through the previously described heated nozzle 19 in such a way that the adhesive melts and then solidifies again to form the first layer 3 and the second layer 15.The first layer 3 and the second layer 15 can be produced, and therefore the adhesive structure 1 can be produced using Fused Deposition Modeling (FDM), Fused Layer Modelling (FLM), Liquid Additive Manufacturing (LAM) or Fused Granulate Fabrication (FGF).

[0056] In the second embodiment of the inventive method for producing the adhesive structure 1, schematically depicted in Figure 9, a liner 11 is brought into contact with the adhesive structure 1 in a fourth process step 104 on a second side 27 of the adhesive structure 1 opposite the first side 25. In the illustrated example, the liner 11 is brought into contact with the second layer 15 of the adhesive structure 1 on the second side 27 of the adhesive structure 1.By bringing the liner 11 into contact with the adhesive structure 1 on the second side 27 opposite the first side 25, it is ensured that the adhesive structure 1 can be protected from contamination by means of the liner 11, while the adhesive structure 1, after it has been produced, is moved by means of the transfer unit 9 to a location where the first layer 3 on the first side 25 of the adhesive structure 1 can be separated from the surface 23 of the transfer unit 9 and the first layer 3 on the first side 25 of the adhesive structure 1 can be brought into contact with a surface of a first component 31 and, after the liner 11 has been removed again, the second layer 15 on the second side 27 of the adhesive structure 1 can be brought into contact with a surface of a second component 33 in order to produce a device 29.The manufacture of device 29 will be discussed in detail later.

[0057] The described process is intended for producing the adhesive structure 1. The first layer 3 is brought into contact with the surface 23 of the transfer unit 9. The transfer unit 9 ensures a certain degree of dimensional stability for transporting the adhesive structure 1, so that in its manufactured state, the first layer 3 of the adhesive structure 1 is initially in contact with the surface 23 of the transfer unit 9. For further use of the adhesive structure 1, the contact between the first layer 3 and the surface 23 of the transfer unit 9 can be broken, and the adhesive structure 1 can remain in its manufactured state. In addition, the second layer 15 is brought into contact with the liner 11. The liner 11 provides a certain degree of protection for transporting the adhesive structure 1, so that in its manufactured state, the second layer 15 of the adhesive structure 1 is initially in contact with the liner 11.For further use of the adhesive structure 1, the contact between the second layer 15 and the liner 11 can be broken again, and the adhesive structure 1 can remain in its manufactured state. These circumstances can be considered part of the manufacturing process of the adhesive structure 1 in connection with the present invention.

[0058] As already described, Figure 10 shows a schematic representation of the device 29, which has been manufactured using the second embodiment of the inventive method for manufacturing the device 29, and Figure 11 shows a schematic representation of the second embodiment of the inventive method for manufacturing the device 29. The previously described method for manufacturing the adhesive structure 1 can be incorporated into a method for manufacturing the device 29. The device 29 comprises the adhesive structure 1, a first component 31, which is a mobile phone, and a second component 33, which is a battery. The first component 31 and the second component 33 can be joined together using the adhesive structure 1.For example, if an old mobile phone battery is to be replaced by a new battery, i.e., by the second component 33, the old battery can first be detached from the mobile phone and the old adhesive structure that connected the old battery and the mobile phone removed. Now, the adhesive structure 1 and the second component 33, i.e., the new battery, can be prepared, and after both the adhesive structure 1 and the transfer unit 9 and the adhesive structure 1 and the liner 11 have been separated, the new battery and the mobile phone can be connected using the adhesive structure 1.

[0059] In the method for manufacturing the device 29, which comprises the manufactured adhesive structure 1, the first component 31, and the second component 33, the adhesive structure 1, the first component 31, and the second component 33 are provided in a first process step 101. In a second process step 102, an electrical voltage is applied to the first layer of the multiple layers, i.e., to the first layer 3. Applying an electrical voltage to the first layer 3 ensures that the adhesive effect between the first layer 3 and the transfer unit 9 is sufficiently weak to allow the adhesive structure 1 to be released from the transfer unit 9, subjecting the adhesive structure 1 to only minimal mechanical stress.In a third process step 103, the second layer 15 on the second side 27 of the adhesive structure 1 is separated from the liner 11 and brought into contact with the second component 33 on the second side 27 of the adhesive structure 1. In a fourth process step 104, the first layer produced of the multiple layers, i.e., the first layer 3, is separated from the surface 23 of the transfer unit 9 on the first side 25 of the adhesive structure 1, and the first layer produced of the multiple layers, i.e., the first layer 3, is brought into contact with a surface of the first component 31 on the first side 25 of the adhesive structure 1.

[0060] It has already been described that the layer, or the first layer produced among the multiple layers, is formed from an electrically releasable pressure-sensitive adhesive. It has also already been described that an electrical voltage is applied to the layer, or the first layer produced among the multiple layers, to ensure that the adhesive effect between the layer and the transfer unit 9, or between the first layer produced and the transfer unit 9, is weak enough to allow the adhesive structure 1 to be released from the transfer unit 9, subjecting the adhesive structure 1 to only minimal mechanical stress. Once the adhesive structure 1 has been released from the transfer unit 9, the electrical voltage is no longer applied to the layer, or the first layer produced among the multiple layers.By ceasing to apply the electrical voltage to the layer or the first layer produced of the several layers, the adhesive structure 1 regains its original adhesive effect, so that the adhesive structure 1 can be connected to the first component 31 and to the second component 33 with a sufficiently high adhesive effect.

[0061] Although the steps of the described methods are presented in a specific order, the present invention is not limited to this order. Rather, the individual steps can be carried out in any meaningful order, and in particular, at least partially in parallel with one another.

[0062] It should be further noted that "having" does not exclude any other elements or steps, and "a" or "an" does not exclude a plurality. It should also be noted that features described with reference to one of the above embodiments may also be used in combination with other features of other embodiments described above. Reference numerals in the claims are not to be considered as a limitation.

[0063] Reference symbol list

[0064] 1 adhesive structure

[0065] 3 first shift

[0066] 5. Marginal section

[0067] 7 Environment of the adhesive structure

[0068] 9 transfer unit

[0069] 11 liners

[0070] 13 plant units

[0071] 15 second shift

[0072] 17 extruders

[0073] 19 heated nozzles

[0074] 21 Surface area of ​​the plant unit

[0075] 23 Surface area of ​​the transfer unit

[0076] 25 first page of the adhesive structure

[0077] 27 second side of the adhesive structure

[0078] 29 Device

[0079] 31 first component

[0080] 33 second component

[0081] 101 First procedural step

[0082] 102 second procedural step

[0083] 103 third procedural step

[0084] 104 fourth procedural step

Claims

Claims 1. Method for producing an adhesive structure (1), wherein the adhesive structure (1) comprises one or more layers arranged one above the other and produced successively, wherein the layer or each layer of the multiple layers is formed from an adhesive compound, wherein the layer or each layer of the multiple layers is produced such that the layer or each layer of the multiple layers has at least one edge section (5) arranged circumferentially around the corresponding layer or around a corresponding section of the layer, and wherein the layer or at least one layer of the multiple layers produced first is formed from an electrically releasable adhesive compound and is brought into contact on a first side (25) of the adhesive structure (1) with a surface (23) of a transfer unit (9).

2. Method according to the preceding claim, wherein a primer is applied to the surface (23) of the transfer unit (9) before the layer or the first produced layer of the multiple layers on the first side (25) of the adhesive structure (1) is brought into contact with the surface (23) of the transfer unit (9).

3. Method according to any of the preceding claims, wherein the transfer unit (9) is electrically conductive.

4. Method according to any of the preceding claims, wherein the transfer unit (9) is a film.

5. Method according to one of the preceding claims, wherein a liner (11) is brought into contact with the adhesive structure (1) on a second side (27) opposite the first side (25) of the adhesive structure (1).

6. Method according to one of the preceding claims, wherein the pressure-sensitive adhesive is at least partially meltable, wherein the pressure-sensitive adhesive is conveyed by means of an extruder (17) through a heated nozzle (19) such that the pressure-sensitive adhesive melts and solidifies again to form the layer or each layer of the multiple layers. Method for manufacturing a device (29) comprising a component and an adhesive structure (1) manufactured by a method according to one of the preceding claims, wherein the component and the manufactured adhesive structure (1) are provided, an electrical voltage is applied to the layer or the first manufactured layer of the multiple layers, the layer or the first manufactured layer of the multiple layers on the first side (25) of the adhesive structure (1) is separated from the surface (23) of the transfer unit (9), and the layer or the first manufactured layer of the multiple layers on the first side (25) of the adhesive structure (1) is brought into contact with a surface of the component.

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