Resin molded body with built-in RFID inlay and method for manufacturing same

Abstract

In the present invention, an RFID inlay (30) is constituted by: an RFIC module (10) comprising an RFIC (11) and an RF circuit (12) connected to the RFIC (11); and an antenna module (20) including antenna conductor patterns (21, 22). The RFIC module (10) and the antenna module (20) are provided on the main surface (41S) side of an individual resin layer (41). Resin injection molding is performed on the individual resin layer (41), and as a result, a resin molded body (101) with built-in RFID inlay is formed, The material of the individual resin layer (41) is a resin material of the same type as the resin of an injection-molded resin layer.

Description

RFID inlay-embedded resin molded body and its manufacturing method

[0001] The present invention relates to a resin molded article incorporating an RFID inlay and a method for manufacturing the same.

[0002] It is desirable to provide RFID inlays in resin molded containers to enable individual identification management (ID management) for each resin molded product. Such individual identification is not only useful for management by identifying resin molded products, but can also be applied to, for example, recycling waste plastics, which can reduce CO2 emissions.

[0003] Since ordinary RFID inlays are not compatible with the temperatures and / or pressures experienced during injection molding of resin molded bodies, in order to provide an RFID inlay in a resin molded body, the resin molded body must be specially designed to accommodate the RFID inlay inside.

[0004] For example, Patent Document 1 discloses that a tagged container and a tagged preform are constructed by inserting an RFID tag into a resin container or a preform thereof. The tagged container and tagged preform disclosed in Patent Document 1 are constructed by forming a gap in a cylindrical opening into which a resin cap is screwed, and attaching an RFID tag to this gap (hollow portion).

[0005] JP 2024-8709 A

[0006] When attempting to change a conventional resin molded body without an RFID tag to a resin molded body with an RFID tag (a dedicated resin molded body), as in the structure shown in Patent Document 1, various problems arise associated with changing the resin molded body.

[0007] For example, because the RFID tag is not integrally molded into the resin container, a cavity is required for the resin container to fit the RFID tag, resulting in a complex structure for the RFID tag fitting portion in the container, which increases the size of the container, increases processing costs, and creates hygiene issues.

[0008] In addition, because the design of the plastic container must be changed, the plastic container itself or the contents enclosed in the plastic container will be treated as a separate product. This will require a new design and manufacture of the plastic container cap. Furthermore, it will also require a new design and manufacture of the cardboard box that will house the plastic container.

[0009] Furthermore, for example, in the case of plastic containers for medical use, even if the contents inside remain the same, the plastic container must undergo the required certification each time it is changed. This certification takes several years, so if there are a large number of existing products, it will take a very long time to certify them all. Therefore, the introduction of built-in RFID tags into plastic containers is currently in a low state of feasibility.

[0010] To avoid integrating RFID tags into plastic containers, there is a management method in which RFID tags are attached to boxes that store multiple plastic containers, but this naturally makes it impossible to identify each plastic container individually. For example, when multiple types of vaccine-containing syringes are produced on the same production line, the vaccine type is changed for each lot, but inspection and individual management are required to check whether the syringes contain the specified vaccine, whether there is any contamination of vaccine-containing syringes, and whether the vaccine types have been properly replaced. Therefore, it is important to be able to read the RFID tags of the vaccine-containing syringes inside from outside the box during production, transportation, medical settings or over-the-counter sales, and when used by users.

[0011] Furthermore, when discarding a product containing a resin molded product after use, it is important to dispose of it in the correct way, i.e., whether to recycle the plastic or dispose of it as waste. In other words, recycling management of resin molded products, product life cycle management, responsibility management, etc. are desired.

[0012] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a resin molded product with an RFID inlay that can be manufactured using conventional resin molding methods and that facilitates embedding an RFID tag in the resin molded product, as well as a method for manufacturing the same.

[0013] An example of a resin molded body with an RFID inlay according to the present disclosure is a resin molded body with an RFID inlay built in, the resin molded body having: an RFIC module composed of an RFIC and an RF circuit connected to the RFIC, or composed of an RFIC; and an antenna module including an antenna conductor pattern; and a solid resin layer having a main surface and side surfaces, with the RFIC module and the antenna module provided on the main surface side; and an injection-molded resin layer injected and filled over the main surface side and the side surface side of the solid resin layer by resin injection molding of the solid resin layer, wherein the material of the solid resin layer is the same type of resin material as the resin of the injection-molded resin layer.

[0014] As an example of the present disclosure, a manufacturing method of a resin molded body with an RFID inlay is a manufacturing method of a resin molded body with an RFID inlay built in, the method having an RFIC module composed of an RFIC and a circuit connected to the RFIC, or composed of an RFIC, and an antenna module including an antenna conductor pattern, characterized by: adhering a solid resin layer having a main surface and a side surface, with the RFIC module and the antenna module provided on the main surface side, to the inner surface of one of a plurality of injection molding dies to be separated; and injecting and filling the injection-molded resin layer over the main surface side and the side surface side of the solid resin layer by resin injection molding of the solid resin layer.

[0015] According to the present invention, an RFID tag can be easily embedded in a resin molded product, and an RFID inlay-embedded resin molded product can be obtained that can be manufactured by a conventional resin molding method.

[0016] FIGS. 1A, 1B, 1C, and 1D are diagrams showing the structure of a resin molded body with an RFID inlay and a portion thereof according to the first embodiment. FIG. 2A is a cross-sectional view of a mold used in manufacturing the resin molded body with an RFID inlay 101 shown in FIG. 1D. FIGS. 2B and 2C are cross-sectional views showing the relationship between the mold and the laminate 40. FIG. 3A is a cross-sectional view showing a state in which an injection-molded resin layer 42 has been filled into a mold formed by a core 61 and a cavity 62. FIG. 3B is a cross-sectional view showing a stage in which the cavity 62 has been removed from the state shown in FIG. 3A. FIGS. 3C and 3D are cross-sectional views of the resin molded body with an RFID inlay 101 removed from the core 61. FIG. 4A is a cross-sectional view similar to the state shown in FIG. 2C in the first embodiment. FIG. 4B is a cross-sectional view showing a state in which an injection-molded resin layer 42 has been filled into a mold formed by a core 61 and a cavity 62. FIG. 4(C) is a cross-sectional view of an RFID inlay-embedded resin molded body 102 according to the second embodiment. FIG. 5(A) is a cross-sectional view of the third embodiment in a state similar to that shown in FIG. 2(C). FIG. 5(B) is a cross-sectional view of a mold formed by a core 61 and a cavity 62, with an injection-molded resin layer 42 filled in. FIG. 5(C) is a cross-sectional view of an RFID inlay-embedded resin molded body 103 according to the third embodiment. FIG. 6 is a plan view of a laminate 40, which is a part of an RFID inlay-embedded resin molded body according to a fourth embodiment. FIG. 7(A) is a perspective view of the laminate 40, and FIG. 7(B) is a perspective view of an RFID inlay-embedded resin molded body 104 incorporating the laminate 40. FIG. 8(A) is a cross-sectional view of the core 61 of the mold in the X-Y plane. FIG. 8(B) is a cross-sectional view of the laminate 40 in the X-Y plane. FIG. 8(C) is a cross-sectional view of the laminate 40 in the X-Y plane, with the laminate 40 temporarily fixed to the inner circumferential surface of the opening of the core 61. Fig. 8(D) is a partially enlarged view of Fig. 8(C). Fig. 9(A) is a cross-sectional view in the XY plane of a mold core 61 with a cavity 62 superimposed thereon. Fig. 9(B) is a cross-sectional view in the XY plane of a molded body 104 with resin injected therein. Fig. 9(C) is a cross-sectional view in the XY plane of an RFID inlay-embedded resin molded body 104. Fig. 9(D) is an enlarged view of Fig. 9(C). Fig. 10(A) is a perspective view of an RFID inlay 30, and Fig. 10(B) is a perspective view of a solid resin layer 41 made of resin in the shape of a cylindrical pedestal.FIG. 10(C) is a perspective view of a laminate 40 formed by wrapping an RFID inlay 30 around the outer surface of a solid resin layer 41. FIG. 10(D) is a perspective view of the laminate 40 and an RFID inlay-embedded resin molded product 105 incorporating the laminate 40. FIG. 11(A) is a cross-sectional view of the RFID inlay 30 in the X-Y plane, and FIG. 11(B) is a cross-sectional view of the laminate 40 in the X-Y plane. FIG. 11(C) is a cross-sectional view of the mold core 61 in the X-Y plane. FIG. 12(A) is a cross-sectional view of the mold core 61 in the X-Y plane, with the cavity 62 overlapping the mold core 61 and the laminate 40 temporarily fixed to the outer peripheral surface of the cavity 62. FIG. 12(B) is a cross-sectional view of the mold in the X-Y plane, with resin injected into the mold. FIG. 12(C) is a cross-sectional view of the RFID inlay-embedded resin molded product 105 in the X-Y plane. FIG. 12(D) is a partially enlarged view of FIG. 12(C). 13(A) and 13(B) are diagrams showing the structure of an RFID inlay-embedded resin molded product 106 according to a sixth embodiment. FIG. 14 is a perspective view showing a state in which RFID inlays embedded in multiple RFID inlay-embedded resin molded products 106P are read / written. FIG. 15 is a perspective view showing a state in which RFID inlays in multiple RFID inlay-embedded resin molded products are read / written, in a state different from that shown in FIG. 14. FIG. 16(A) is a cross-sectional view of a structure including an RFIC module 10, an antenna module 20, and a solid resin layer 41 according to an eighth embodiment. FIG. 16(B) is a cross-sectional view of an RFID inlay-embedded resin molded product 107 according to the eighth embodiment. FIG. 17(A) is a plan view of a laminate 40 according to a ninth embodiment. FIG. 17(B) is a cross-sectional view of the laminate 40 according to the ninth embodiment. FIG. 17(C) is a cross-sectional view of an RFID inlay-embedded resin molded product 108 according to the ninth embodiment. FIG. 18(A) is a plan view of a laminate 40 according to a tenth embodiment. FIG. 18B is a perspective view of the laminate 40 according to the tenth embodiment.

[0017] Hereinafter, several specific examples will be given with reference to the drawings to illustrate multiple embodiments for carrying out the present invention. The same reference numerals are used for the same parts in each drawing. For ease of explanation and understanding of the main points, the embodiments are shown divided into multiple embodiments for convenience of explanation, but partial substitution or combination of the configurations shown in different embodiments is possible. From the second embodiment onwards, a description of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0018] First Embodiment Figures 1(A), 1(B), 1(C), and 1(D) are diagrams showing the structure of a resin molded body with an RFID inlay and a portion thereof according to a first embodiment. Figure 1(A) is a plan view of a laminate 40, which is a portion of the resin molded body with an RFID inlay. Figure 1(B) is a partially enlarged view of Figure 1(A). Figure 1(C) is a cross-sectional view taken along the line X-X in Figure 1(A). Figure 1(D) is a cross-sectional view of a resin molded body with an RFID inlay 101. The directional symbols X, Y, and Z in each figure merely indicate the direction from which each figure is viewed, and do not indicate the origin of the three orthogonal axes.

[0019] 1D, the RFID inlay-embedded resin molded body 101 incorporates an RFID inlay 30. As shown in FIG. 1C, the RFID inlay 30 includes an RFIC module 10 and an antenna module 20.

[0020] The RFIC module 10 mainly comprises an RFIC 11 and an RF circuit 12 connected to the RFIC 11 .

[0021] The antenna module 20 is composed of an antenna substrate 23 and antenna conductor patterns 21 and 22. The antenna substrate 23 is, for example, a PPS (polyphenylene sulfide) film, a PET (polyethylene terephthalate) film, a PI (polyimide) film, or the like.

[0022] The antenna substrate 23 has a first main surface 23S1 and a second main surface 23S2 which are opposite sides of each other. The RFIC module 10 is mounted on the first main surface 23S1 of the antenna substrate 23.

[0023] The antenna conductor patterns 21 and 22 are provided on a first main surface 23S1 of the antenna substrate 23. The antenna conductor patterns 21 and 22 are formed by patterning an Al (aluminum) foil or a Cu (copper) foil.

[0024] 1C, the laminate 40 is formed by laminating a solid resin layer 41 on the second main surface 23S2 of the antenna substrate 23. In this example, the antenna substrate 23 is adhered to the upper surface of the solid resin layer 41 via an adhesive layer AL.

[0025] The material of the antenna substrate 23 may be the same type of resin material as the material of the solid resin layer 41 .

[0026] As shown in Figures 1(C) and 1(D), the RFID inlay-embedded resin molded body 101 is formed by resin injection molding of a laminate 40 of an antenna module 20 and a solid resin layer 41, and an injection-molded resin layer 42 is injected and filled from the first main surface 23S1 of the antenna substrate 23 to the side surface of the solid resin layer 41.

[0027] The solid resin layer 41 is made of the same type of resin material as the injection-molded resin layer 42. The solid resin layer 41 and the injection-molded resin layer 42 are, for example, a PP (polypropylene) film or a PET (polyethylene terephthalate) film. That is, if the injection-molded resin layer 42 is made of PP, the solid resin layer 41 is made of PP, and if the injection-molded resin layer 42 is made of PET, the solid resin layer 41 is made of PET. The adhesive layer AL is an acrylic glue layer.

[0028] The thickness of the solid resin layer 41 is, for example, 0.02 mm to 0.5 mm. When the laminate 40 is made by a roll method, that is, when the solid resin layer 41 is attached to the surface of the antenna substrate 23, the antenna substrate 23 and the solid resin layer 41 can be made in the form of original film, that is, by attaching rolled films together. If the film thickness of the solid resin layer 41 is about 0.05 mm to 0.1 mm, it is easy to process, so from the standpoint of processability, it is preferable that the thickness of the solid resin layer 41 be 0.1 mm or less.

[0029] 1A and 1B, the main portions of the antenna conductor pattern 21 and the antenna conductor pattern 22 are conductor patterns that face each other via a slot SL. In this example, the antenna conductor pattern 21 and the antenna conductor pattern 22 are formed on the antenna substrate 23 so that the slot SL forms a meander line.

[0030] The antenna conductor patterns 21 and 22 form a meandering line slot antenna.

[0031] As shown in FIG. 1B, a non-conductor portion 2OP is formed in the portion where the antenna conductor pattern 21 and the antenna conductor pattern 22 face each other (the portion surrounded by the antenna conductor pattern 21 and the antenna conductor pattern 22).

[0032] An RFIC module 10 is mounted (attached) to the conductor-free portion 2OP. An RF circuit 12 is formed in this RFIC module 10. This RF circuit is a helical conductor pattern connected to two terminals of the RFIC 11. For example, it is a rectangular helical conductor pattern formed by forming loop-shaped conductor patterns on two layers and connecting these loop-shaped conductor patterns via an interlayer connection conductor.

[0033] The RF circuit 12 is formed on the substrate of the RFIC module 10, and the RFIC 11 is mounted on the surface of the substrate. For example, they are mounted by soldering or via an anisotropic conductive film. The top surfaces of the RF circuit 12 and the RFIC 11 are covered with an insulator layer, but in FIG. 1B, the insulator layer is not shown. Therefore, the RF circuit 12 and the RFIC 11 are represented by solid lines.

[0034] The RF circuit 12, which is a helical conductor pattern, is magnetically coupled to the antenna conductor patterns 21 and 22. This induces currents in opposite directions in the antenna conductor patterns 21 and 22 along the slot SL. This is equivalent to generating a potential difference across the slot SL. In other words, the RF circuit 12 acts as a power feed circuit (power feeder) for the slot antenna.

[0035] The frequency of the communication signal processed by the RFIC 11 is, for example, in the 900 MHz band (860 MHz to 960 MHz).

[0036] Fig. 2(A) is a cross-sectional view of a mold used in manufacturing the RFID inlay-embedded resin molded body 101 shown in Fig. 1(D). Fig. 2(B) and Fig. 2(C) are cross-sectional views showing the relationship between the mold and the laminate 40.

[0037] 2A, the mold used to manufacture the laminate 40 is made up of an injection molding die core 61 and a cavity 62. The cavity 62 is a die that can be separated from the core 61.

[0038] In this example, an ejector pin 61P is provided on the core 61. A resin injection port 62P is provided in the cavity 62. The resin injection port 62P may be located on the side surface of the cavity.

[0039] Fig. 3(A) is a cross-sectional view of a state in which an injection-molded resin layer 42 is filled into a mold formed by a core 61 and a cavity 62. Fig. 3(B) is a cross-sectional view of a stage in which the cavity 62 has been removed from the state of Fig. 3(A). Figs. 3(C) and 3(D) are cross-sectional views of the RFID inlay-embedded resin molded body 101 removed from the core 61.

[0040] The manufacturing process of the resin molded body with built-in RFID inlay 101 is as follows.

[0041] (1) In the state of a raw film, a solid resin layer 41 is attached to the RFID inlay 30 (FIG. 1C), thereby forming a laminate 40.

[0042] (2) As shown in FIG. 2B, the laminate 40 is temporarily fixed to the upper surface of the core 61 by adhering the laminate 40 to the upper surface of the core 61 via the temporary fixing layer FL on the upper surface of the core 61 .

[0043] (3) As shown in FIG. 2C, the cavity 62 is closed around the core 61.

[0044] (4) As shown in Fig. 3(A), resin is injected into the mold. This causes the injection-molded resin layer 42 to fill from the first main surface 23S1 of the antenna substrate 23 shown in Fig. 2(C) to the side surface of the solid resin layer 41. At this time, the solid resin layer 41 in contact with the injected resin melts, or the interface of the solid resin layer 41 with the injected resin melts, and the RFID inlay 30 is embedded in the injection-molded resin layer 42 inside the mold.

[0045] (5) As shown in Figures 3(B) and 3(C), the ejector pin 61P is protruded to remove the RFID inlay-embedded resin molded body 101 from the core 61. Then, as shown in Figure 3(D), the resin portion inside the resin injection port 62P of the cavity 62 is removed.

[0046] Through the above steps, the RFID inlay-embedded resin molded body 101 shown in FIG. 1(D) is obtained.

[0047] According to this embodiment, the following effects are achieved.

[0048] (a) Since the material of the solid resin layer laminated on the antenna substrate is the same type of resin material as the material of the injection-molded resin layer, the RFID inlay can be securely attached to the injection-molded resin during injection molding, which allows the RFID inlay to be embedded in the injection-molded resin layer.

[0049] In other words, there is no need to give the RFID inlay a special structure in order to enhance its heat resistance.

[0050] (b) Because the RFID inlay 30 is embedded inside the injection-molded resin layer 42, the resin molding with the RFID inlay 30 and the resin molding without the RFID inlay 30 are identical in structure when viewed from the outside. This simplifies the certification examination for solvent resistance, chemical resistance, sterilizability, and cleanability, and significantly shortens the time required to obtain certification.

[0051] (c) The RFID inlay does not peel off during use, and the RFID inlay is kept included until the end of the product life cycle, which enables recycling management of the resin molded product, product life cycle management, responsibility management, etc.

[0052] Second Embodiment In the second embodiment, a resin molded body having a laminate structure formed by laminating an antenna module and a solid resin layer, which is different from that shown in the first embodiment, and a manufacturing method thereof will be exemplified.

[0053] Fig. 4(A) is a cross-sectional view of the first embodiment in a state similar to that shown in Fig. 2(C). Fig. 4(B) is a cross-sectional view of a state in which an injection-molded resin layer 42 is filled into a mold formed by a core 61 and a cavity 62. Fig. 4(C) is a cross-sectional view of an RFID inlay-embedded resin molded body 102 according to a second embodiment.

[0054] The structure of the laminate 40 according to the second embodiment shown in FIG. 4A is as follows.

[0055] The antenna conductor patterns 21 and 22 are formed on a first main surface 23S1 (the lower surface in the orientation shown in FIG. 4A ) of the antenna substrate 23. The antenna substrate 23 and the antenna conductor patterns 21 and 22 form an antenna module 20.

[0056] The RFIC module 10 is mounted on the first main surface 23S1 of the antenna substrate 23. The RFIC module 10 and the antenna module 20 form an RFID inlay 30.

[0057] A solid resin layer 41 is laminated on the first main surface 23S1 of the antenna substrate 23 via an adhesive layer AL, thereby forming a laminate 40. The laminate 40 is temporarily fixed to a temporary fixing layer FL formed on the upper surface of the core 61.

[0058] The materials of the solid resin layer 41, the antenna substrate 23, the adhesive layer AL, and the temporary fixing layer FL are the same as those described in the first embodiment. For example, if the container is a PP container, the solid resin layer 41 is a PP film. The antenna substrate 23 is made of, for example, PPS resin or PET resin, and the adhesive layer AL is formed by applying an acrylic adhesive to the antenna substrate 23.

[0059] In the first embodiment, in consideration of ease of application of the solid resin layer 41, the solid resin layer 41 is applied to the second main surface 23S2 of the antenna substrate 23, but in the second embodiment, the solid resin layer 41 is applied to the formation surface of the antenna conductor patterns 21, 22 (the mounting surface of the RFIC module 10). Therefore, in the second embodiment, unlike the first embodiment, the antenna conductor patterns 21, 22 are formed on the antenna substrate 23, the RFIC module 10 is mounted, and then the solid resin layer 41 is applied to the antenna substrate 23 with the adhesive layer AL.

[0060] The manufacturing process of the resin molded body with built-in RFID inlay 102 is as follows, similar to the example shown in the first embodiment.

[0061] (1) As shown in FIG. 4A, the laminate 40 is temporarily fixed to the upper surface of the core 61 by adhering the laminate 40 to the upper surface of the core 61 via the temporary fixing layer FL on the upper surface of the core 61, and then the cavity 62 is closed relative to the core 61.

[0062] (2) As shown in Fig. 4(B) , resin is injected into the mold, filling the injection-molded resin layer 42 from the second main surface 23S2 of the antenna substrate 23 to the side surface of the solid resin layer 41. At this time, the solid resin layer 41 in contact with the injected resin melts, or the interface of the solid resin layer 41 with the injected resin melts, leaving the RFID inlay 30 embedded in the injection-molded resin layer 42 inside the mold.

[0063] (3) After that, as shown in FIG. 4C, the RFID inlay-embedded resin molded body 102 is removed from the mold, and the resin portion inside the resin injection port 62P of the cavity 62 is removed.

[0064] The second embodiment has the same effects as those of the first embodiment, except that the solid resin layer 41 is attached to the antenna conductor patterns 21 and 22 on the antenna substrate 23, and therefore the antenna conductor patterns 21 and 22 and the RFIC module 10 are protected by the solid resin layer 41.

[0065] Third Embodiment In the third embodiment, a resin molded body having a laminate structure formed by laminating an antenna module and a solid resin layer, which is different from that shown in the first embodiment, and a manufacturing method thereof will be exemplified.

[0066] Fig. 5(A) is a cross-sectional view of the third embodiment in a state similar to that shown in Fig. 2(C). Fig. 5(B) is a cross-sectional view of a state in which an injection-molded resin layer 42 is filled into a mold formed by a core 61 and a cavity 62. Fig. 5(C) is a cross-sectional view of an RFID inlay-embedded resin molded body 103 according to the third embodiment.

[0067] The structure of the laminate 40 according to the third embodiment shown in FIG. 5A is as follows.

[0068] The antenna conductor patterns 21 and 22 are formed on a first main surface 23S1 (the upper surface in the orientation shown in FIG. 5A ) of the antenna substrate 23. The antenna substrate 23 and the antenna conductor patterns 21 and 22 form an antenna module 20.

[0069] The RFIC module 10 is mounted on the first main surface 23S1 of the antenna substrate 23. The RFIC module 10 and the antenna module 20 form an RFID inlay 30.

[0070] A solid resin layer 41 is laminated on each of the first main surface 23S1 and the second main surface 23S2 of the antenna substrate 23 via an adhesive layer AL, thereby forming a laminate 40. The laminate 40 is temporarily fixed to the upper surface of the core 61 via a temporary fixing layer FL.

[0071] The materials of the solid resin layer 41, the antenna substrate 23, the adhesive layer AL, and the temporary fixing layer FL are the same as those shown in the first and second embodiments.

[0072] In the third embodiment, a solid resin layer 41 is laminated on each of the first main surface 23S1 and the second main surface 23S2 of the antenna substrate 23. Therefore, in the third embodiment, the antenna conductor patterns 21 and 22 are formed on the first main surface 23S1 of the antenna substrate 23, the RFIC module 10 is mounted, and then the solid resin layer 41 is attached to the first main surface 23S1 of the antenna substrate 23, and then the solid resin layer 41 is attached to the second main surface 23S2 of the antenna substrate 23.

[0073] The manufacturing process of the resin molded body with built-in RFID inlay 103 is as follows, similar to the example shown in the first embodiment.

[0074] (1) As shown in FIG. 5A, the laminate 40 is temporarily fixed to the upper surface of the core 61 by adhering the laminate 40 to the upper surface of the core 61 via a temporary fixing layer FL formed on the upper surface of the core 61, and then the cavity 62 is closed relative to the core 61.

[0075] (2) As shown in Fig. 5(B) , resin is injected into the mold. This causes the injection-molded resin layer 42 to fill from the second main surface 23S2 of the antenna substrate 23 to the side surface of the lower solid resin layer 41. At this time, the solid resin layer 41 in contact with the injected resin melts, or the interface of the solid resin layer 41 with the injected resin melts, and the RFID inlay 30 is embedded in the injection-molded resin layer 42 inside the mold.

[0076] (3) After that, as shown in FIG. 5C, the RFID inlay-embedded resin molded body 103 is removed from the mold, and the resin portion inside the resin injection port 62P of the cavity 62 is removed.

[0077] According to the third embodiment, the same effects as those shown in the first and second embodiments are achieved.

[0078] Fourth Embodiment In a fourth embodiment, a resin molded body housed in a cylindrical resin container such as a syringe cap will be exemplified.

[0079] 6 is a plan view of a laminate 40 which is a part of a resin molded product with an RFID inlay according to a fourth embodiment. The structure of the laminate 40 according to the fourth embodiment is the same as that of the laminate shown in FIG. 1A according to the first embodiment.

[0080] The antenna conductor pattern 21 and the antenna conductor pattern 22 have main portions that face each other via a slot SL. In this example, the antenna conductor pattern 21 and the antenna conductor pattern 22 are formed on the antenna substrate 23 so that the slot SL forms a meander line.

[0081] A meandering line slot antenna is formed by the antenna conductor patterns 21 and 22. A conductor-free portion is formed in the portion where the antenna conductor patterns 21 and 22 face each other (the portion surrounded by the antenna conductor patterns 21 and 22). An RFIC module 10 is mounted (attached) on this conductor-free portion. An RF circuit 12 is formed in this RFIC module 10. An insulator layer is coated on the top surfaces of the RF circuit 12 and the RFIC 11.

[0082] Fig. 7(A) is a perspective view of the laminate 40, and Fig. 7(B) is a perspective view of an RFID inlay-embedded resin molded body 104 that incorporates the laminate 40. In Fig. 7(B), since the resin container 74 is transparent, the laminate 40 is shown in a see-through state.

[0083] The laminate 40 shown in Fig. 6 is a laminate formed by laminating an antenna module and a solid resin layer. The resin container 74 shown in Fig. 7(B) is a cylindrical container such as a syringe cap. When the laminate 40 is to be housed in such a cylindrical container, it is deformed into a cylindrical shape.

[0084] Fig. 8(A) is a cross-sectional view of a core 61 of a mold in the XY plane. This core 61 is a female mold. Fig. 8(B) is a cross-sectional view of the laminate 40 in the XY plane. Fig. 8(C) is a cross-sectional view of the laminate 40 in the XY plane in a state in which the laminate 40 is temporarily fixed to the inner peripheral surface of the opening of the core 61. Fig. 8(D) is a partially enlarged view of Fig. 8(C). In Figs. 8(B), 8(C), and 8(D), the antenna conductor pattern is omitted from the illustration.

[0085] 9A is a cross-sectional view of a mold core 61 with a cavity 62 superimposed on it, taken along the XY plane. The cavity 62 has cylindrical and conical protrusions that protrude into the circular hole of the core 61. The cavity 62 is a male mold.

[0086] Fig. 9(B) is a cross-sectional view in the XY plane of the state in which resin has been injected into the mold. Fig. 9(C) is a cross-sectional view in the XY plane of the resin molded body 104 with built-in RFID inlay. Fig. 9(D) is an enlarged view of Fig. 9(C). In Figs. 9(A), 9(B), 9(C), and 9(D), the antenna conductor pattern is omitted.

[0087] The manufacturing process of the resin molded body with built-in RFID inlay 104 is as follows.

[0088] (1) The laminate 40 shown in Fig. 6 is placed in a heated cylindrical mold to deform it into a cylindrical shape, and then removed from the mold and cooled. This forms the substantially cylindrical laminate 40 shown in Fig. 7(A). Both ends of this substantially cylindrical laminate 40 are close to each other, but are spaced apart by, for example, about 1 mm.

[0089] (2) As shown in Fig. 8A, the laminate 40 is temporarily fixed by being brought into close contact with the inner circumferential surface of the opening of the core 61. In this state, the longitudinal length of the laminate 40, which is substantially cylindrical, is determined so that both ends of the laminate 40 do not abut against each other. Thereafter, the cavity 62 is closed relative to the core 61.

[0090] (3) As shown in Figures 8(A), 8(B), 8(C), and 8(D), the laminate 40 is placed on the inner surface of the opening of the core 61. At this time, the solid resin layer 41 adheres to the inner surface of the opening of the core 61.

[0091] (4) The cavity 62 is closed in the core 61. As a result, the protruding portion of the cavity 62 is inserted into the opening of the core 61, as shown in FIG.

[0092] (5) As shown in Fig. 9(B), resin is injected into the mold, so that the RFID inlay 30 is embedded in the injection-molded resin layer 42 inside the mold.

[0093] (4) After that, as shown in FIG. 9(C) and FIG. 9(D), the RFID inlay-embedded resin molded body 104 is removed from the mold.

[0094] According to the fourth embodiment, the material of the solid resin layer 41 is the same type of resin as the injection-molded resin layer 42, so that the laminate 40 can be easily formed into a cylindrical shape before being placed in an injection molding mold, as shown in Fig. 7(A). This allows the laminate 40 to be easily temporarily fixed to the mold, facilitating injection molding. In particular, if the diameter of the approximately cylindrical shape is set slightly larger than the inner diameter of the mold in step (1) above, the elasticity of the laminate 40 allows the laminate 40 to be easily temporarily fixed to the mold.

[0095] Fifth Embodiment In a fifth embodiment, a resin molded body using a pedestal will be exemplified.

[0096] Fig. 10(A) is a perspective view of the RFID inlay 30, and Fig. 10(B) is a perspective view of a cylindrical pedestal-shaped solid resin layer 41 made of resin. Fig. 10(C) is a perspective view of a laminate 40 formed by wrapping the RFID inlay 30 around the outer surface of the solid resin layer 41. Fig. 10(D) is a perspective view of the laminate 40 and an RFID inlay-embedded resin molded body 105 that incorporates the laminate 40. In Fig. 10(D), since the resin container 75 is transparent, the laminate 40 is shown in a see-through state.

[0097] Fig. 11(A) is a cross-sectional view of the RFID inlay 30 in the XY plane, and Fig. 11(B) is a cross-sectional view of the laminate 40 in the XY plane. Fig. 11(C) is a cross-sectional view of the die core 61 in the XY plane. In Fig. 11(A) and Fig. 11(B), the antenna conductor pattern is omitted.

[0098] Fig. 12(A) is a cross-sectional view in the XY plane of a state in which a cavity 62 is placed on a core 61 of a mold and the laminate 40 is temporarily fixed to the outer peripheral surface of the cavity 62. Fig. 12(B) is a cross-sectional view in the XY plane of a state in which resin has been injected into the mold. Fig. 12(C) is a cross-sectional view in the XY plane of an RFID inlay-embedded resin molded product 105. Fig. 12(D) is a partially enlarged view of Fig. 12(C). The antenna conductor pattern is omitted from Figs. 12(A), 12(B), 12(C), and 12(D).

[0099] The manufacturing process of the resin molded body with built-in RFID inlay 105 is as follows.

[0100] (1) As shown in FIGS. 10B and 10C, the RFID inlay 30 is adhered to the outer peripheral surface of a cylindrical solid resin layer 41 with an adhesive layer AL to form a laminate 40.

[0101] (2) As shown in FIG. 12A, the laminate 40 is temporarily fixed to the columnar portion of the cavity 62.

[0102] (3) As shown in Fig. 12(B), resin is injected into the mold, resulting in a state in which the RFID inlay 30 is embedded in the injection-molded resin layer 42 inside the mold.

[0103] (4) After that, as shown in FIGS. 12(C) and 12(D), the RFID inlay-embedded resin molded body 104 is removed from the mold.

[0104] Similar to the resin molded body 102 shown in the second embodiment, the resin molded body 105 according to the fifth embodiment has a structure in which a solid resin layer 41 is provided on the formation surface of the antenna conductor patterns 21 and 22 relative to the antenna substrate 23 and on the mounting surface of the RFIC module 10. Therefore, the antenna conductor patterns 21 and 22 and the RFIC module 10 are protected by this solid resin layer 41.

[0105] Sixth Embodiment In the sixth embodiment, an RFID inlay-embedded resin molded article used as a syringe cap will be exemplified.

[0106] 13A and 13B are diagrams showing the structure of an RFID inlay-embedded resin molded body 106 according to a sixth embodiment. Fig. 13A is an exploded view of the RFID inlay-embedded resin molded body 106, and Fig. 13B is a front view of the RFID inlay-embedded resin molded body 106 and a syringe 80.

[0107] The RFID inlay-embedded resin molded product 106 has an RFID inlay embedded in a resin cap 76 that covers a needle 91 provided on a syringe 80. The syringe 80 is composed of a cylinder 82, a needle holding part 81 attached to the tip of the cylinder 82, and a piston 83. The needle holding part 81 holds the needle 91. A drug is enclosed inside the syringe 80. More specifically, the drug is filled inside the cylinder 82, and the drug inside the cylinder 82 is sealed with a rubber stopper. The piston 83 pushes the rubber stopper in, thereby pushing the drug toward the front of the cylinder 82.

[0108] The RFID inlay-embedded resin molded body 106 is constructed by embedding the RFID inlay 30 in a resin cap 76 .

[0109] Seventh Embodiment In the seventh embodiment, the read / write state of an RFID inlay incorporated in a resin molded article with an RFID inlay is illustrated. FIG. 14 is a perspective view showing the state when reading and writing RFID inlays incorporated in multiple resin molded articles 106P with an RFID inlay. In this example, multiple resin molded articles 106P with an RFID inlay are housed in a syringe container 200, and an RFID reader / writer 300 is brought close to the syringe container 200 to read and write the RFID inlays of the multiple resin molded articles 106P with an RFID inlay incorporated in the syringe container 200. These resin molded articles 106P with an RFID inlay are in the state shown in FIG. 13(B). That is, each cylinder 82 is filled with a medicinal solution, a piston 83 is inserted, and the cylinders are sealed with rubber stoppers.

[0110] Fig. 15 is a perspective view showing a state in which RFID inlays in multiple RFID inlay-embedded resin molded bodies are read or written, in a state different from that shown in Fig. 14. In this example, a packaging box 201 containing multiple RFID inlay-embedded resin molded bodies is transported on a belt conveyor, and when the packaging box 201 passes near an RFID reader / writer 301, the RFID inlays of the multiple RFID inlay-embedded resin molded bodies contained in the packaging box 201 are read or written.

[0111] Eighth Embodiment In the eighth embodiment, a resin molded body having a structure including an RFIC module, an antenna module, and a solid resin layer different from that shown in the first embodiment will be exemplified.

[0112] Fig. 16(A) is a cross-sectional view of a structure including an RFIC module 10, an antenna module 20, and a solid resin layer 41 according to the eighth embodiment. Fig. 16(B) is a cross-sectional view of an RFID inlay-embedded resin molded body 107 according to the eighth embodiment.

[0113] 16A , the antenna module 20 includes antenna conductor patterns 21 and 22 but does not include an antenna substrate. The RFIC module 10 and the antenna module 20 are provided on the main surface 41S side of the solid resin layer 41. Specifically, the RFIC module 10 and the antenna module 20 are adhered to the main surface 41S of the solid resin layer 41 via an adhesive layer AL.

[0114] As shown in Figures 16(A) and 16(B), the RFID inlay-embedded resin molded body 107 is formed by resin injection molding of the solid resin layer 41, and an injection-molded resin layer is injected and filled over the main surface 41S and side surfaces of the solid resin layer 41.

[0115] According to the eighth embodiment, the main surface 41S of the solid resin layer 41 comes into contact with the injected resin during resin injection molding, thereby improving adhesion between the solid resin layer 41 and the injected resin.

[0116] Ninth Embodiment In the ninth embodiment, a resin molded body having a laminate structure formed by laminating an antenna module and a solid resin layer, which is different from that shown in the first embodiment, will be exemplified.

[0117] Fig. 17(A) is a plan view of the laminate 40 according to the ninth embodiment. Fig. 17(B) is a cross-sectional view of the laminate 40 according to the ninth embodiment. Fig. 17(C) is a cross-sectional view of the RFID inlay-embedded resin molded body 108 according to the ninth embodiment.

[0118] 17(A) and 17(B), when viewed from a direction perpendicular to the first main surface 23S1 of the antenna substrate 23, the antenna substrate 23 has an area smaller than the area of ​​the solid resin layer 41. As a result, edge portions 43, 44, 45, and 46 of the solid resin layer 41 along the four sides of the main surface 41S of the solid resin layer 41 are exposed on the top surface of the laminate 40.

[0119] It is sufficient that at least a part of the edge portions 43 to 46 of the solid resin layer 41 is exposed. For example, a part of the edge portion 43 of the solid resin layer 41 along one side of the main surface of the solid resin layer 41 may be exposed.

[0120] As shown in Figures 17(B) and 17(C), the RFID inlay-embedded resin molded body 108 is formed by resin injection molding of the laminate 40, and an injection-molded resin layer 42 is injected and filled from the top surface of the laminate 40, where the edge portions 43 to 46 of the solid resin layer 41 are exposed, to the side surface of the laminate 40.

[0121] According to the ninth embodiment, in resin injection molding, the main surface 41S of the solid resin layer 41 comes into contact with the injected resin at the edge portions 43 to 46 of the solid resin layer 41. This improves adhesion between the solid resin layer 41 and the injected resin.

[0122] Tenth Embodiment In the tenth embodiment, a resin molded body having a laminate structure formed by laminating an antenna module and a solid resin layer, which is different from that shown in the fourth embodiment, will be exemplified.

[0123] Fig. 18A is a plan view of a stacked body 40 according to the tenth embodiment. Fig. 18B is a perspective view of the stacked body 40 according to the tenth embodiment.

[0124] 18(A), the laminate 40 has overlapping portions 47, 48 at both longitudinal ends of the laminate 40. As shown in Fig. 18(B), the laminate 40 is formed into a cylindrical shape by overlapping and fixing the overlapping portions 47, 48 to each other. The overlapping portions 47, 48 are fixed to each other by a method such as adhesion using an adhesive, double-sided tape, or the like, thermocompression bonding using a laser, a heater, or the like, ultrasonic bonding, or the like.

[0125] According to the tenth embodiment, the overlapping portions 47 and 48 of the laminate 40 are overlapped and fixed to each other, which stabilizes the cylindrical shape of the laminate 40 and makes it easy to temporarily fix the laminate 40 to a mold.

[0126] Various embodiments of the present invention have been presented so far, but these are all examples and are not intended to limit the scope of the present invention. Various omissions, substitutions, and modifications can be made to the embodiments of the present invention without departing from the spirit of the invention. Embodiments with such omissions, substitutions, and modifications are included within the scope and spirit of the present invention, and are also included in the scope of the invention and its equivalents as set forth in the claims of this application.

[0127] For example, in each embodiment, the antenna conductor pattern is provided on the first or second principal surface of the antenna substrate, but the antenna conductor pattern may be provided on both the first and second principal surfaces of the antenna substrate.

[0128] In addition, in each embodiment, an example has been shown in which the RFIC module 10 includes an RF circuit 12 (coil), and this RF circuit 12 and the antenna conductor patterns 21, 22 are magnetically coupled, but the RFIC module may be composed of a single RFIC, and the terminals of this RFIC may be electrically connected to the antenna conductor patterns 21, 22 so as to straddle the slots.

[0129] Furthermore, in the first, second, and third embodiments, examples have been shown in which the solid resin layer 41 is temporarily fixed to the mold via the temporary fixing layer FL, but the temporary fixing layer FL is not essential as long as the laminate 40 can be fixed in the internal space of the mold.

[0130] Furthermore, in the first, second and third embodiments, examples are shown in which the temporary fixing layer FL does not remain in the resin molded body with an RFID inlay, but the temporary fixing layer FL may remain in the resin molded body with an RFID inlay at the time the resin molded body with an RFID inlay is formed.

[0131] 1A, 6, etc. show examples in which meander-line slots are formed in the antenna conductor pattern, but the slots do not have to be meander-line. Furthermore, the antenna conductor pattern may not be a pattern that forms a slot, but may be a pattern that forms, for example, a dipole.

[0132] Although the fourth, fifth, and sixth embodiments illustrate the substantially cylindrical RFID inlay-embedded resin molded body, the three-dimensional shape is not limited thereto. For example, the shape of the solid resin layer may be an elliptical cylinder with a thickness, an oblong cylinder with a thickness, a rectangular cylinder, or the like.

[0133] In addition, although the embodiments have been described with an example in which an RFID inlay is embedded in the cap side of a resin container, the RFID inlay may also be embedded in the container side. For example, when molding a preform, a laminate may be temporarily fixed to the screw-in portion of the cap, and injection-molded using an injection mold to manufacture a preform with an embedded RFID inlay, and then the preform may be blown up to form a container.

[0134] The resin molded article with an embedded RFID inlay and the method for manufacturing the same of the present invention may be provided in the following embodiments.

[0135] <1> A resin molded body having an RFID inlay built in, the resin molded body having: an RFIC module made up of an RFIC and an RF circuit connected to the RFIC, or made up of an RFIC; and an antenna module made up of an antenna substrate having a first main surface and a second main surface that are reverse to each other, and an antenna conductor pattern provided on the first main surface and / or the second main surface, the RFIC module being mounted on the first main surface or the second main surface, the resin molded body comprising: a solid resin layer laminated on the second main surface of the antenna substrate; and an injection-molded resin layer injected and filled from the first main surface of the antenna substrate to a side surface of the solid resin layer by resin injection molding of a laminate of the antenna module and the solid resin layer, the material of the solid resin layer being the same type of resin material as the resin of the injection-molded resin layer.

[0136] <2> The resin molded body with an embedded RFID inlay according to <1>, wherein the solid resin layer is a film-like layer.

[0137] <3> The resin molded product with an embedded RFID inlay according to <1> or <2>, wherein the solid resin layer has a shape of a thick cylinder, a thick elliptical cylinder, or a thick elongated cylinder.

[0138] <4> The resin molded body with an RFID inlay described in any one of <1> to <3>, wherein, prior to the injection filling step, the solid resin layer is a resin layer that adheres to the inner surface of one of the injection molding dies that is to be divided.

[0139] <5> The resin molded body with an embedded RFID inlay according to any one of <1> to <4>, wherein the solid resin layer and the injection-molded resin layer are melted and bonded to each other.

[0140] <6> The resin molded body with an embedded RFID inlay described in any one of <1> to <5>, wherein the injection-molded resin layer has a cylindrical shape with a certain thickness, an injection molding die for molding the injection-molded resin layer has a male (inner) die and a female (outer) die surrounding the male die, and during the resin injection molding step, the solid resin layer is a resin layer that adheres to the inner surface of the female die.

[0141] <7> The resin molded body with an embedded RFID inlay described in any one of <1> to <5>, wherein the injection-molded resin layer has a cylindrical shape with a certain thickness, an injection molding die for molding the injection-molded resin layer has a male (inner) die and a female (outer) die surrounding the male die, and during the resin injection molding step, the solid resin layer is a resin layer that adheres to the outer surface of the male die.

[0142] <8> The resin molded body with an RFID inlay according to <6> or <7>, wherein the resin molded body with an RFID inlay is a part of a resin container.

[0143] <9> A method for manufacturing a resin molded product with an embedded RFID inlay, the resin molded product having: an RFIC module composed of an RFIC and a circuit connected to the RFIC, or composed of an RFIC; an antenna substrate having a first main surface and a second main surface that are reverse to each other; an antenna conductor pattern provided on the first main surface and / or the second main surface; and an antenna module having the RFIC module mounted on the first main surface or the second main surface, the method comprising: bringing a solid resin layer laminated on the second main surface of the antenna module into close contact with an inner surface of one of a plurality of injection molding dies that are to be separated; and injection-filling the injection-molded resin layer from the first main surface of the antenna module to a side surface of the solid resin layer by resin injection molding the laminate of the antenna module and the solid resin layer.

[0144] AL...adhesive layer FL...temporary fixing layer SL...slot 2OP...conductor-free portion 10...RFIC module 11...RFIC 12...RF circuit 20...antenna module 21, 22...antenna conductor pattern 23...antenna substrate 23S1...first main surface of antenna substrate 23S2...second main surface of antenna substrate 30...RFID inlay 40...laminated body 41...solid resin layer 41S...main surface of solid resin layer 42...injection-molded resin layer 43, 44, 45, 46...edge portions 47, 48...overlapping portion 61...core (injection molding die) 61P...ejector pin 62...cavity (injection molding die) 62P...resin injection port 74, 75...resin container 76...resin cap 80...syringe 81...needle holding portion 82...cylinder 83...piston 91...needle 101, 102, 103, 104, 105, 106, 106P, 107, 108... RFID inlay-embedded resin molded body 200... syringe container 201... packaging box 300, 301... lighter

Claims

1. A resin molded body incorporating an RFID inlay having an RFIC module composed of an RFIC and an RF circuit connected to the RFIC, or composed of an RFIC, and an antenna module including an antenna conductor pattern, comprising: a solid resin layer having a main surface and side surfaces, with the RFIC module and the antenna module provided on the main surface side; and an injection-molded resin layer injected and filled over the main surface side and the side surface side of the solid resin layer by resin injection molding into the solid resin layer, wherein the material of the solid resin layer is the same type of resin material as the resin of the injection-molded resin layer.

2. The resin molded body with an embedded RFID inlay according to claim 1, wherein the antenna module includes an antenna substrate having a first main surface and a second main surface which are opposite each other, the solid resin layer is laminated on the second main surface of the antenna substrate, the RFIC module is mounted on the first main surface or the second main surface, the antenna conductor pattern is provided on the first main surface and / or the second main surface, and the injection-molded resin layer is injected and filled from the first main surface of the antenna substrate to the side surface of the solid resin layer by resin injection molding of the laminate of the antenna module and the solid resin layer.

3. The resin molded product with an embedded RFID inlay according to claim 2, wherein the material of the antenna substrate is the same type of resin material as the material of the solid resin layer.

4. The resin molded body with built-in RFID inlay according to claim 1, wherein the RFIC module and the antenna conductor pattern are provided on the main surface of the solid resin layer.

5. The resin molded body with an embedded RFID inlay according to any one of claims 1 to 4, wherein the solid resin layer is a film-like layer.

6. The resin molded body with an embedded RFID inlay according to any one of claims 1 to 5, wherein the shape of the solid resin layer is a thick cylindrical shape, a thick elliptical cylindrical shape, or a thick elongated cylindrical shape.

7. A resin molded body with an embedded RFID inlay according to any one of claims 1 to 6, wherein, prior to the injection filling step, the solid resin layer is a resin layer that adheres closely to the inner surface of one of the multiple injection molding dies that are to be separated.

8. The resin molded body with an embedded RFID inlay according to any one of claims 1 to 7, wherein the solid resin layer and the injection-molded resin layer are melted and bonded to each other.

9. A resin molded product with an embedded RFID inlay according to any one of claims 1 to 8, wherein the injection-molded resin layer has a cylindrical shape with a certain thickness, the injection molding die for molding the injection-molded resin layer has a male die and a female die surrounding the male die, and during the resin injection molding step, the solid resin layer is a resin layer that adheres closely to the inner surface of the female die.

10. A resin molded body with an embedded RFID inlay according to any one of claims 1 to 8, wherein the injection-molded resin layer has a cylindrical shape with some thickness, the injection molding die for molding the injection-molded resin layer has a male die and a female die surrounding the male die, and during the resin injection molding step, the solid resin layer is a resin layer that adheres closely to the outer surface of the male die.

11. The RFID inlay-embedded resin molded body according to claim 9, wherein the RFID inlay-embedded resin molded body is part of a resin container.

12. The RFID inlay-embedded resin molded body according to claim 10, wherein the RFID inlay-embedded resin molded body is part of a resin container.

13. A method for manufacturing a resin molded product incorporating an RFID inlay, the method comprising: adhering a solid resin layer having a main surface and a side surface, with the RFIC module and the antenna module provided on the main surface side, to the inner surface of one of a plurality of injection molding dies that are to be separated; and injecting and filling the injection-molded resin layer over the main surface side and the side surface side of the solid resin layer by resin injection molding.

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