Electronic device including heat dissipation structure

Abstract

An electronic device according to various embodiments disclosed herein may comprise: a housing having a first plate and a second plate opposite the first plate; a first heat source disposed inside the housing so as to face the first plate; a second heat source disposed inside the housing so as to face the second plate; and an active heat transport member which is located between the first plate and the second plate and thermally connected to the first plate and the second plate, and is configured to transfer heat from one of the first plate or the second plate to the other of the first plate or the second plate.

Description

Electronic device including a heat dissipating structure

[0001] Various embodiments disclosed in this document relate to electronic devices, and more particularly, to electronic devices including heat dissipation structures.

[0002] As performance demands on electronic devices such as PCs, tablet computers, and mobile phones increase, so does the heat generated by their heat sources, such as APs, GPUs, NPUs, MODEMS, DDIs, and PMICs. If the heat generated by these heat sources is not effectively dissipated outside the electronic device, the elevated temperature of the heat source can lead to thermal damage, or throttling to prevent damage can occur, degrading the performance of the electronic device.

[0003] Heat generated within an electronic device is ultimately dissipated to the exterior surfaces (e.g., the front and back) of the electronic device's housing. To dissipate heat from the heat source to the exterior and maintain a low temperature of the electronic device, various heat dissipation structures may be employed between the heat source and the exterior surface of the housing. The heat dissipation structure may thermally connect the heat source and the housing. In other words, the heat dissipation structure may form a heat transfer path between the heat source and the exterior surface of the housing. The heat dissipation structure may typically include a material (e.g., copper, aluminum, carbon fiber) or structure (e.g., heat pipes, vapor chambers) with a high heat transfer coefficient. The flow of heat in the heat transfer path may be driven by a temperature difference between the heat source and the exterior surface of the housing.

[0004] When using an electronic device, the surface temperature of the housing may become unevenly distributed. For example, if a heat source adjacent to the rear of the housing has a relatively high heat output compared to other heat sources adjacent to the front of the housing, the rear of the housing may become hotter than the front. Furthermore, changes in the surrounding heat dissipation environment may cause a temperature difference between the front and back of the housing. If heat is concentrated on a specific surface of the housing, the temperature of that surface may become excessively high, causing a sensation of heat or burns to the user's body when in contact with the electronic device. Furthermore, if heat from a heat source within the electronic device is concentrated on a specific surface of the housing, the effective heat dissipation area may be reduced, reducing the cooling efficiency of the electronic device.

[0005] According to various embodiments of the present disclosure, an electronic device having a heat transfer structure that uniformly distributes heat on a housing surface can be provided.

[0006] An electronic device according to various embodiments of the present disclosure may include a housing having a first plate and a second plate opposite the first plate. The electronic device may include a first heat source positioned within the housing so as to face the first plate. The electronic device may include a second heat source positioned within the housing so as to face the second plate. The electronic device may include an active heat transport member positioned between the first plate and the second plate, thermally connected to the first plate and the second plate, and configured to transfer heat from either the first plate or the second plate to the other of the first plate or the second plate.

[0007] An electronic device according to various embodiments of the present disclosure may include a housing having a first plate and a second plate opposite the first plate. The electronic device may include a first heat source disposed within the housing so as to face the first plate. The electronic device may include a second heat source disposed within the housing so as to face the second plate. The electronic device may include an active heat transfer member positioned between the first plate and the second plate and thermally connected to the first plate and the second plate, the active heat transfer member configured to transfer heat from one of the first plate or the second plate to the other of the first plate or the second plate. The electronic device may include a first temperature sensor disposed to sense a temperature of the first plate and a second temperature sensor disposed to sense a temperature of the second plate. The electronic device may include a processor operatively connected to the first temperature sensor, the second temperature sensor, and the active heat transfer member, and a non-transitory memory storing computer-readable instructions. The instructions, when executed by the processor, may be configured to cause the processor to control the active heat transfer member based on at least one of a temperature value measured by the first temperature sensor or a temperature value measured by the second temperature sensor.

[0008] According to embodiments of the present disclosure, an electronic device can be provided in which an active heat transport member actively transports heat between a first plate and a second plate of a housing, thereby equalizing an imbalance in heat dissipation between the first plate and the second plate and improving the cooling efficiency of the electronic device.

[0009] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0010] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described herein.

[0011] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0012] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present disclosure.

[0013] FIG. 3A is a schematic diagram showing the interior of an electronic device according to various embodiments.

[0014] Figure 3b is a schematic diagram showing an exemplary active heat transport member.

[0015] FIG. 3c is a schematic diagram showing the heat transport operation of an electronic device according to various embodiments.

[0016] FIG. 3D is a schematic diagram showing the heat transport operation of an electronic device according to various embodiments.

[0017] FIG. 4A is an exploded perspective view showing an electronic device according to various embodiments.

[0018] FIG. 4b is a cross-sectional view showing an electronic device according to various embodiments.

[0019] FIG. 4c is a block diagram showing a control circuit according to various embodiments.

[0020] FIG. 4d is a cross-sectional view showing an electronic device according to various embodiments.

[0021] FIG. 5 is a flowchart illustrating the operation of an active heat transport member of an electronic device according to various embodiments.

[0022] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0023] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0024] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0025] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may execute various data processes. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (l), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0026] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0027] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, display driver IC, or DPU (display processing unit)) may be configured to process an image acquired from the CPU (111), GPU (112), ISP (114), or memory (120) (e.g., volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0028] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0029] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0030] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0031] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0032] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0033] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (110)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0034] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0035] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0036] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to various embodiments of the present disclosure.

[0037] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (100) of FIG. 1 or may include various embodiments of the electronic device.

[0038] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (210C) may be formed by a side frame (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side frame (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0039] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side frame (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0040] According to one embodiment, the electronic device (200) may include at least one of a display (300), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0041] The display (300) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (300) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (300) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0042] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may include a tray member (2181) disposed through at least a portion of the side frame (218).

[0043] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (300) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0044] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0045] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (300). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (300).

[0046] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0047] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0048] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (300). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (300). In one embodiment, an area where the display (300) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (300) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (300) facing the sensor module may not require a perforated opening.

[0049] FIG. 3a is a schematic diagram showing the interior of an electronic device (400) according to various embodiments.

[0050] FIG. 3b is a schematic diagram showing an exemplary active heat transport member (440).

[0051] FIG. 3c is a schematic diagram showing the heat transport operation of an electronic device (400) according to various embodiments.

[0052] FIG. 3d is a schematic diagram showing the heat transport operation of an electronic device (400) according to various embodiments.

[0053] Referring to FIG. 3A, an electronic device (400) (e.g., the electronic device (100) of FIG. 1, the electronic device (200) of FIGS. 2A and 2B) may include a housing (410) (e.g., the housing (210) of FIGS. 2A and 2B) that includes a first plate (411) (e.g., the front plate (202) of FIG. 2A), a second plate (412) (e.g., the rear plate (211) of FIG. 2B). The electronic device (400) may include a heat source (430) positioned in an internal space of the housing (410) (e.g., a space between the first plate (411) and the second plate (412). In various embodiments, the electronic device (400) may include one or more heat sources (430) (e.g., a first heat source (431) and a second heat source (432)). The heat source (430) may include various components that actively consume power and generate heat when the electronic device (400) operates. In various embodiments, the heat source (430) may include active electrical components such as a CPU (e.g., CPU (111) of FIG. 1), a GPU (e.g., GPU (112) of FIG. 1), an NPU (e.g., NPU (113) of FIG. 1), a CP (e.g., CP (118) of FIG. 1), a DDI (e.g., display controller (115) of FIG. 1), and / or a power management IC.

[0054] In various embodiments, the heat source (430) of the electronic device (400) may be thermally connected to the housing (410). That is, the heat source (430) may be arranged to have a heat transfer path through which heat generated from the heat source (430) is transferred to the housing (410). In various embodiments, the first heat source (431) may be in direct thermal contact with the first plate (411), and the second heat source (432) may be in direct thermal contact with the second plate (412). In various embodiments, the first heat source (431) and the first plate (411) may be in indirect thermal contact through a thermal interface (433) to reduce thermal resistance. Additionally, the second heat source (432) and the second plate (412) may be indirectly thermally contacted through a thermal interface (433) to lower the thermal resistance.

[0055] In various embodiments, the electronic device (400) may include a circuit board (420) configured to have various electrical components (e.g., a first heat source (431) and a second heat source (432)) disposed thereon. In various embodiments, the circuit board (420) may be disposed between a first plate (411) and a second plate (412) within the electronic device (400). A surface of the circuit board (420) facing the first plate (411) may be defined as a first surface (420a), and a surface of the circuit board (420) facing the second plate (412) may be defined as a second surface (420b).

[0056] In various embodiments, the electronic device (400) may include active heat transfer elements (440) each thermally coupled to different faces of the housing (410). The active heat transfer elements (440) may be elements that consume power and / or electrical energy to move heat from one face of the active heat transfer element (440) to the other face. For example, the active heat transfer elements (440) may include a heat pump and / or a Peltier device (440).

[0057] Referring to FIG. 3B, in various embodiments, the active heat transport member (440) may include a Peltier element (440). The Peltier element (440) may be referred to as a solid state heat pump or a thermoelectric cooler (TEC). The Peltier element (440) may be arranged such that materials having different electrical properties (e.g., a P-type semiconductor (P) material and an N-type semiconductor (N) material) are bonded to each other to form a thermocouple. One contact point of the thermocouple may be arranged to face a low-temperature section (442), and the other contact point may be arranged to face a high-temperature section (441). The flow of heat in the Peltier element (440) may be determined depending on the direction of the current supplied to the Peltier element (440). For example, depending on the direction of the current, one of the two sides of the Peltier element (440) may become a high-temperature section (441) and the other side may become a low-temperature section (442). In various embodiments, the Peltier element (440) may include a conductor (445) for electrically connecting a plurality of thermocouples. The Peltier element (440) has the advantage of being smaller than other active heat transport means and having a reduced risk of failure because of minimized mechanical movement. An active heat transport member (440), such as the Peltier element (440), can transfer heat from a low-temperature section (442) to a high-temperature section (441) while consuming power. In addition, an active heat transport member (440), such as the Peltier element (440), can transfer heat more quickly than a heat transfer mechanism that relies on a temperature gradient.

[0058] Referring to FIGS. 3C and 3D , in various embodiments, the active heat transport member (440) can transfer heat from one side of the housing (410) to the other side. For example, as illustrated in FIG. 3C , when the heat generation amount of the first heat source (431) is greater than that of the second heat source (432) and / or the temperature of the first plate (411) is greater than that of the second plate (412), the active heat transport member (440) can transfer heat (H) of the first plate (411) to the second plate (412). For example, the active heat transport member (440) can be driven to transfer heat from a side thermally connected to the first plate (411) to a side thermally connected to the second plate (412). Additionally, for example, as illustrated in FIG. 3d, when the heat generation amount of the second heat source (432) is greater than that of the first heat source (431) and / or the temperature of the second plate (412) is higher than that of the first plate (411), the active heat transport member (440) can transport the heat (H) of the second plate (412) to the first plate (411).

[0059] In various embodiments, the electronic device (400) may include a control circuit (401) operatively connected to an active heat transport member (440). In various embodiments, the control circuit (401) may be a control circuit (401) including a plurality of logic elements disposed on a circuit board (420) and / or an integrated circuit having a plurality of logic elements integrated within a single package. In various embodiments, the control circuit (401) may be a circuit independent of a processor (e.g., the processor (110) of FIG. 1) or may be a part of a processor (e.g., the processor (110) of FIG. 1) of the electronic device (400). In various embodiments, the control circuit (401) may be a dedicated control circuit (401) for controlling the active heat transport member (440), or may be implemented by instructions stored in a non-transitory memory (e.g., the non-volatile memory (122) of FIG. 1) being executed by a general-purpose processor.

[0060] In various embodiments, the control circuit (401) can control the operation of the active heat transport member (440). For example, the control circuit (401) can determine whether heat should be transported from either the first plate (411) or the second plate (412) to the other of the first plate (411) or the second plate (412), and operate the active heat transport member (440) accordingly.

[0061] In various embodiments, the control circuit (401) can determine whether to operate the active heat transport member (440) and the direction of heat transport based on the power consumption of the heat source (430). In various embodiments, the electronic device (400) includes a battery operatively connected to the control circuit (401), and the control circuit (401) can determine whether to operate the active heat transport member (440) based on the state of charge (SOC) of the battery. For example, when the state of charge of the battery is below a predetermined value, the control circuit (401) can reduce the power consumption due to the operation of the active heat transport member (440).

[0062] In various embodiments, the electronic device (400) may include various temperature sensors for determining whether the active heat transport member (440) is operating and the direction of heat transport. In various embodiments, the temperature sensor may be a separate member disposed on the circuit board (420). In various embodiments, the temperature sensor may be built into the heat source (430). Further details of the temperature sensor will be described below.

[0063] FIG. 4A is an exploded perspective view showing an electronic device (400) according to various embodiments.

[0064] FIG. 4b is a cross-sectional view showing an electronic device (400) according to various embodiments.

[0065] FIG. 4c is a block diagram showing a control circuit (401) according to various embodiments.

[0066] FIG. 4d is a cross-sectional view showing an electronic device (400) according to various embodiments.

[0067] Referring to FIGS. 4A and 4B, the electronic device (400) may include a circuit board (420) including a through hole (421). The through hole (421) may be formed in the circuit board (420) so as to penetrate the circuit board (420) from a first side (420a) to a second side (420b). In various embodiments, the active heat transport member (440) may be positioned at least partially within the through hole (421). For example, the active heat transport member (440) may be positioned such that one side faces the first plate (411) and the other side faces the second plate (412) through the through hole (421).

[0068] In various embodiments, multiple heat sources (430) may be arranged at different locations on the circuit board (420). For example, a first heat source (431) may be arranged in a first region of the circuit board (420), and a second heat source (432) may be arranged in a second region on the circuit board (420) that is spaced apart from the first region. By spacing the heat sources (430) apart from each other as described above, concentration of heat in a specific region of the electronic device (400) may be avoided.

[0069] In various embodiments, the active heat transport member (440) may be positioned between the first region and the second region. For example, a through hole (421) of the circuit board (420) may be formed between the first region and the second region, and the active heat transport member (440) may be positioned such that at least a portion thereof is positioned within the through hole (421). Since heat is generated and propagated from a heat source (430) (e.g., the first heat source (431) and / or the second heat source (432)) within the electronic device (400), the active heat transport member (440) may be positioned between the first heat source (431) and the second heat source (432) to minimize the length of the heat transport path within the electronic device (400), and the heat dissipation performance of the electronic device (400) may be improved.

[0070] In various embodiments, the electronic device (400) may include a plurality of temperature sensors. For example, the electronic device (400) may include a first temperature sensor (471) arranged to sense a temperature of a first plate (411) and a second temperature sensor (472) arranged to sense a temperature of a second plate (412). The first temperature sensor (471) and the second temperature sensor (472) may be operatively connected to the control circuit (401). In various embodiments, the first temperature sensor (471) may be arranged to sense a temperature of an area of ​​the first plate (411) adjacent to a first heat source (431), and the second temperature sensor (472) may be arranged to sense a temperature of an area of ​​the second plate (412) adjacent to a second heat source (432). For example, a first temperature sensor (471) may be placed adjacent to a first heat source (431) on a circuit board (420), and a second temperature sensor (472) may be placed adjacent to a second heat source (432) on a circuit board (420).

[0071] Referring to FIG. 4c, in various embodiments, the control circuit (401) may define the temperature value measured by the first temperature sensor (471) as the temperature of the first plate (411), and may define the temperature value measured by the second temperature sensor (472) as the temperature of the second plate (412).

[0072] In various embodiments, the control circuit (401) can calculate the temperature of the first plate (411) and the second plate (412) through a predetermined algorithm from the temperature values ​​measured by the first temperature sensor (471) and the second temperature sensor (472).

[0073] In various embodiments, the electronic device (400) may include a temperature sensor positioned adjacent to the active heat transport member (440). For example, the electronic device (400) may include a third temperature sensor (473) positioned to sense a temperature of an area of ​​the first plate (411) adjacent to the active heat transport member (440) and a fourth temperature sensor (474) positioned to sense a temperature of an area of ​​the second plate (412) adjacent to the active heat transport member (440). The third temperature sensor (473) and the fourth temperature sensor (474) may be operatively connected to the control circuit (401).

[0074] In various embodiments, the control circuit (401) may define the higher value among the temperature values ​​measured by the first temperature sensor (471) or the third temperature sensor (473) as the temperature of the first plate (411). Additionally, the control circuit (401) may define the higher value among the temperature values ​​measured by the second temperature sensor (472) or the fourth temperature sensor (474) as the temperature of the second plate (412).

[0075] In various embodiments, the control circuit (401) can calculate the temperature of the first plate (411) and the second plate (412) through a predetermined algorithm from the temperature values ​​measured by the first temperature sensor (471) to the fourth temperature sensor (474).

[0076] Referring again to FIG. 4B , in various embodiments, the electronic device (400) may include at least one heat transfer plate. For example, the electronic device (400) may include a first heat transfer plate (451) positioned on an inner surface of the first plate (411) and a second heat transfer plate (452) positioned on an inner surface of the second plate (412). The heat transfer plate may have a material and structure having high thermal conductivity to move and spread the heat of the heat source (430). For example, the heat transfer plate may include a material such as copper, aluminum, carbon fiber, graphite fiber, and / or graphene. The heat transfer plate may also include a material such as a heat pipe and / or a vapor chamber. In various embodiments, the heat transfer plate may be thermally connected to the heat source (430) and the active heat transfer member (440). For example, the first heat transport plate (451) may be in direct or indirect thermal contact with the first heat source (431) and the active heat transport member (440), and the second heat transport plate (452) may be in direct or indirect thermal contact with the second heat source (432) and the active heat transport member (440).

[0077] In various embodiments, the electronic device (400) may include at least one thermal interface (433). The thermal interface (433) may be a member configured to reduce the thermal resistance of a contact surface between a heat source (430) and another member in contact with it. The thermal interface (433) may include, for example, thermal paste or a thermal pad.

[0078] Referring to FIG. 4D , in various embodiments, the electronic device (400) may include at least one heat dissipation member. For example, the electronic device (400) may include a first heat dissipation member (460a) positioned between the active heat transport member (440) and the first plate (411), and a second heat dissipation member (460b) positioned between the active heat transport member (440) and the second plate (412). The heat dissipation member may be a member configured to distribute heat entering or exiting through the active heat transport member (440) to a wider area of ​​the electronic device (400). In various embodiments, the heat dissipation member may include a thermally conductive material that is the same as or similar to the thermal interface (433). In various embodiments, the heat dissipation member may be a member configured to thermally connect the active heat transport member (440) and the first plate (411) and the second plate (412), as well as to dissipate or absorb heat with respect to the airflow within the electronic device (400). For example, the heat dissipation member may be a heat sink comprising a metal material such as copper or aluminum and including a plurality of cooling fins (462).

[0079] The heat dissipation member may include a plurality of air holes (461). The air holes (461) may be perforated portions through which air may pass through the heat dissipation member. Accordingly, the heat dissipation member may effectively release or absorb heat since the area in contact with the air flow inside the electronic device (400) increases. In various embodiments, the plurality of air holes (461) may be formed in a slot shape. The area between the plurality of air holes (461) formed in a slot shape may be defined as a heat dissipation fin (462).

[0080] FIG. 5 is a flowchart illustrating the operation of an active heat transport member (440) of an electronic device (400) according to various embodiments.

[0081] Referring to FIG. 5, in various embodiments, the control circuit (401) may determine (501) whether the temperature of the first plate (411) and / or the second plate (412) is lower than or equal to a first temperature (e.g., 25 degrees Celsius) based on measurement data of temperature sensors (e.g., the first temperature sensor (471) to the fourth temperature sensor (474)). The control circuit (401) may stop (509) the operation of the active heat transport member (440) when the temperature of the first plate (411) and / or the second plate (412) is lower than or equal to the first temperature (e.g., 25 degrees Celsius).

[0082] When the temperature of the first plate (411) and / or the second plate (412) is lower than the first temperature (e.g., 25 degrees Celsius), the electronic device (400) can effectively release heat generated from the heat source (430) to the outside even without the operation of the active heat transport member (440), thereby reducing power consumption of the active heat transport member (440) and preventing additional heat generation due to the operation of the active heat transport member (440).

[0083] In various embodiments, the control circuit (401) may determine (502) whether the temperature of the first plate (411) and / or the second plate (412) is greater than or equal to a second temperature (e.g., 45 degrees Celsius) based on measurement data of temperature sensors (e.g., the first temperature sensor (471) to the fourth temperature sensor (474)). The control circuit (401) may stop (509) the operation of the active heat transport member (440) when the temperature of the first plate (411) and / or the second plate (412) is greater than or equal to the second temperature (e.g., 45 degrees Celsius).

[0084] When the temperature of the first plate (411) and / or the second plate (412) is higher than the second temperature (e.g., 45 degrees Celsius), if additional heat generation occurs due to the operation of the active heat transport member (440), there is a risk that the temperature of the electronic device (400) may rise excessively. In addition, when the temperature is higher than the second temperature, the operating efficiency (COP; coefficient of performance) of the active heat transport member (440) may decrease, and thus excessive heat generation may occur from the active heat transport member (440). Therefore, by stopping the active heat transport member (440) when the temperature of the first plate (411) and / or the second plate (412) is higher than the second temperature as described above, heat damage to the electronic device (400) and the risk of heat sensation and burns to the user can be reduced.

[0085] In various embodiments, the control circuit (401) may determine (503) whether the temperature of the first plate (411) is higher than the temperature of the second plate (412) by a predetermined temperature difference (e.g., 3 degrees Celsius) or more based on measurement data of temperature sensors (e.g., the first temperature sensor (471) to the fourth temperature sensor (474)). When the temperature of the first plate (411) is higher than the temperature of the second plate (412) by the predetermined temperature difference (e.g., 3 degrees Celsius) or more, the control circuit (401) may operate (505) the active heat transport member (440) to transport heat of the first plate (411) to the second plate (412). The control circuit (401) can determine (507) whether the temperature of the first plate (411) and the temperature of the second plate (412) have become the same as a result of the operation (505) of the active heat transport member (440), and if so, can stop (509) the operation of the active heat transport member (440).

[0086] In various embodiments, the control circuit (401) may determine (504) whether the temperature of the second plate (412) is higher than the temperature of the first plate (411) by a predetermined temperature difference (e.g., 3 degrees Celsius) or more based on measurement data of the temperature sensors (e.g., the first temperature sensor (471) to the fourth temperature sensor (474)). When the temperature of the second plate (412) is higher than the temperature of the first plate (411) by a predetermined temperature difference (e.g., 3 degrees Celsius) or more, the control circuit (401) may operate (508) the active heat transport member (440) to transport heat of the second plate (412) to the first plate (411). The control circuit (401) determines whether the temperature of the second plate (412) and the temperature of the first plate (411) have become the same as a result of the operation (508) of the active heat transport member (440), and if so, can stop (509) the operation of the active heat transport member (440).

[0087] An electronic device (400) according to various embodiments of the present disclosure (e.g., the electronic device (100) of FIG. 1, the electronic device (200) of FIGS. 2A and 2B) may include a housing (410) having a first plate (411) and a second plate (412) facing the first plate (411). The electronic device (400) may include a first heat source (431) arranged within the housing (410) to face the first plate (411). The electronic device (400) may include a second heat source (432) arranged within the housing (410) to face the second plate (412). The electronic device (400) may include an active heat transport member (440) positioned between the first plate (411) and the second plate (412), thermally connected to the first plate (411) and the second plate (412), and configured to transfer heat from either the first plate (411) or the second plate (412) to the other of the first plate (411) or the second plate (412).

[0088] In various embodiments, the electronic device (400) may further include a circuit board (420) positioned within the housing (410) and having a first surface (420a) facing the first plate (411) and a second surface (420b) facing the second plate (412). The first heat source (431) may be disposed in a first region of the circuit board (420) on the first surface (420a) of the circuit board (420), the second heat source (432) may be disposed in a second region of the circuit board (420) on the second surface (420b) of the circuit board (420), and the active heat transport member (440) may be positioned between the first region and the second region.

[0089] In various embodiments, the circuit board (420) includes a through hole (421) positioned between the first region and the second region and penetrating the circuit board (420) from the first surface (420a) to the second surface (420b), and the active heat transport member (440) can be at least partially positioned within the through hole (421).

[0090] In various embodiments, the electronic device (400) may further include a first heat transport plate (451) positioned on an inner surface of the first plate (411) and thermally connected to the active heat transport member (440) and the first heat source (431), and a second heat transport plate (452) positioned on an inner surface of the second plate (412) and thermally connected to the active heat transport member (440) and the second heat source (432).

[0091] In various embodiments, the electronic device (400) may include a first temperature sensor (471) arranged to sense a temperature of the first plate (411), a second temperature sensor (472) arranged to sense a temperature of the second plate (412), and a control circuit (401) operatively connected to the first temperature sensor (471), the second temperature sensor (472), and the active heat transport member (440).

[0092] In various embodiments, the control circuit (401) may be configured to stop operation of the active heat transport member (440) when the temperature of at least one of the first temperature sensor (471) or the second temperature sensor (472) is below the first temperature or above the second temperature.

[0093] In various embodiments, the control circuit (401) may be configured to cause the active heat transport member (440) to operate to transport heat from the first plate (411) to the second plate (412) when the temperature value measured by the first temperature sensor (471) is higher than a predetermined temperature difference or more than the temperature value measured by the second temperature sensor (472).

[0094] In various embodiments, the control circuit (401) may be configured to cause the active heat transport member (440) to operate to transport heat from the second plate (412) to the first plate (411) when the temperature value measured by the second temperature sensor (472) is higher than a predetermined temperature difference compared to the temperature value measured by the first temperature sensor (471).

[0095] In various embodiments, the electronic device (400) may further include a third temperature sensor (473) arranged to sense a temperature of an area of ​​the first plate (411) adjacent to the active heat transport member (440) and a fourth temperature sensor (474) arranged to sense a temperature of an area of ​​the second plate (412) adjacent to the active heat transport member (440). The first temperature sensor (471) may be arranged to sense a temperature of an area of ​​the first plate (411) adjacent to the first heat source (431), and the second temperature sensor (472) may be arranged to sense a temperature of an area of ​​the second plate (412) adjacent to the second heat source (432).

[0096] In various embodiments, the control circuit (401) may be configured to cause the active heat transport member (440) to operate to transport heat from the first plate (411) to the second plate (412) when a higher value among the temperature values ​​measured by the first temperature sensor (471) and the temperature values ​​measured by the third temperature sensor (473) is higher than a predetermined temperature difference or more among the temperature values ​​measured by the second temperature sensor (472) and the temperature values ​​measured by the fourth temperature sensor (474).

[0097] In various embodiments, the control circuit (401) may be configured to cause the active heat transport member (440) to operate to transport heat from the second plate (412) to the first plate (411) when a higher value among the temperature values ​​measured by the second temperature sensor (472) and the temperature values ​​measured by the fourth temperature sensor (474) is higher than a predetermined temperature difference or more among the temperature values ​​measured by the first temperature sensor (471) and the temperature values ​​measured by the third temperature sensor (473).

[0098] In various embodiments, the electronic device (400) may further include a battery operatively connected to the control circuit (401). The control circuit (401) may be configured to control the active heat transport member (440) not to operate when the state of charge (SOC) of the battery is below a predetermined level, based on the state of charge (SOC) of the battery.

[0099] In various embodiments, the electronic device (400) may further include a first heat dissipation member (460a) positioned between the active heat transport member (440) and the first plate (411) and thermally connected to the active heat transport member (440) and the first plate (411), respectively, and a second heat dissipation member (460b) positioned between the active heat transport member (440) and the second plate (412) and thermally connected to the active heat transport member (440) and the second plate (412), respectively.

[0100] In various embodiments, the first heat dissipation member (460a) and the second heat dissipation member (460b) may include a plurality of ventilation holes (461) formed to allow air to pass through.

[0101] In various embodiments, the first heat dissipation member (460a) and the second heat dissipation member (460b) may further include heat dissipation fins (462).

[0102] An electronic device (400) according to various embodiments of the present disclosure (e.g., the electronic device (100) of FIG. 1, the electronic device (200) of FIGS. 2A and 2B) may include a housing (410) having a first plate (411) and a second plate (412) facing the first plate (411). The electronic device (400) may include a first heat source (431) arranged within the housing (410) to face the first plate (411). The electronic device (400) may include a second heat source (432) arranged within the housing (410) to face the second plate (412). The electronic device (400) may include an active heat transfer member (440) positioned between the first plate (411) and the second plate (412) and thermally connected to the first plate (411) and the second plate (412), and configured to transfer heat from either the first plate (411) or the second plate (412) to the other of the first plate (411) or the second plate (412). The electronic device (400) may include a first temperature sensor (471) arranged to detect a temperature of the first plate (411) and a second temperature sensor (472) arranged to detect a temperature of the second plate (412). The electronic device (400) may include a processor operatively connected to the first temperature sensor (471), the second temperature sensor (472), and the active heat transport member (440), and a non-transitory memory storing computer-readable instructions. The instructions, when executed by the processor, may be configured to cause the processor to control the active heat transport member (440) based on at least one of a temperature value measured by the first temperature sensor (471) or a temperature value measured by the second temperature sensor (472).

[0103] In various embodiments, the instructions, when executed by the processor, may be configured to cause the processor to stop operation of the active heat transport member (440) when a temperature of at least one of the first temperature sensor (471) or the second temperature sensor (472) is below a first temperature or above a second temperature.

[0104] In various embodiments, the instructions, when executed by the processor, may be configured to cause the active heat transport member (440) to transport heat from the first plate (411) to the second plate (412) when a temperature value measured by the first temperature sensor (471) is at least 3 degrees Celsius higher than a temperature value measured by the second temperature sensor (472).

[0105] In various embodiments, the instructions, when executed by the processor, may be configured to cause the active heat transport member (440) to transport heat from the second plate (412) to the first plate (411) when a temperature value measured by the second temperature sensor (472) is at least 3 degrees Celsius higher than a temperature value measured by the first temperature sensor (471).

[0106] In various embodiments, the electronic device (400) further includes a battery operatively connected to the processor, and the instructions, when executed by the processor, may be configured to cause the processor to control the active heat transport member (440) not to operate when the state of charge (SOC) of the battery is below a predetermined level.

[0107] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (400), A housing (410) having a first plate (411) and a second plate (412) facing the first plate (411); A first heat source (431) arranged so as to face the first plate (411) within the housing (410); A second heat source (432) arranged so as to face the second plate (412) within the housing (410); and An electronic device (400) comprising an active heat transport member (440) positioned between the first plate (411) and the second plate (412), thermally connected to the first plate (411) and the second plate (412), and configured to transfer heat from either the first plate (411) or the second plate (412) to the other of the first plate (411) or the second plate (412).

2. In paragraph 1, Further comprising a circuit board (420) positioned within the housing (410) and having a first surface (420a) facing the first plate (411) and a second surface (420b) facing the second plate (412), The above first heat source (431) is arranged in the first area of ​​the circuit board (420) on the first surface (420a) of the circuit board (420), The second heat source (432) is arranged in the second area of ​​the circuit board (420) on the second surface (420b) of the circuit board (420), The above active heat transport member (440) is an electronic device (400) located between the first region and the second region.

3. In paragraph 2, The circuit board (420) is positioned between the first region and the second region and includes a through hole (421) penetrating the circuit board (420) from the first surface (420a) to the second surface (420b), The above active heat transport member (440) is an electronic device (400) located at least partially within the through hole (421).

4. In paragraph 1, A first heat transport plate (451) positioned on the inner surface of the first plate (411) and thermally connected to the active heat transport member (440) and the first heat source (431); and An electronic device (400) further comprising a second heat transport plate (452) positioned on the inner surface of the second plate (412) and thermally connected to the active heat transport member (440) and the second heat source (432).

5. In paragraph 1, A first temperature sensor (471) arranged to detect the temperature of the first plate (411); A second temperature sensor (472) arranged to detect the temperature of the second plate (412); and An electronic device (400) comprising a control circuit (401) operatively connected to the first temperature sensor (471), the second temperature sensor (472) and the active heat transport member (440).

6. In paragraph 5, The above control circuit (401) An electronic device (400) configured to stop the operation of the active heat transport member (440) when the temperature of at least one of the first temperature sensor (471) or the second temperature sensor (472) is lower than or equal to the first temperature or higher than or equal to the second temperature.

7. In paragraph 6, The above control circuit (401) When the temperature value measured by the first temperature sensor (471) is higher than the temperature value measured by the second temperature sensor (472) by a predetermined temperature difference or more, the active heat transport member (440) is configured to perform an operation of transporting heat from the first plate (411) to the second plate (412). An electronic device (400) configured to cause the active heat transport member (440) to transport heat from the second plate (412) to the first plate (411) when the temperature value measured by the second temperature sensor (472) is higher than a predetermined temperature difference compared to the temperature value measured by the first temperature sensor (471).

8. In paragraph 5, A third temperature sensor (473) arranged to detect the temperature of an area of ​​the first plate (411) adjacent to the active heat transport member (440); and Further comprising a fourth temperature sensor (474) arranged to detect the temperature of an area of ​​the second plate (412) adjacent to the active heat transport member (440); The first temperature sensor (471) is arranged to detect the temperature of an area of ​​the first plate (411) adjacent to the first heat source (431), An electronic device (400) wherein the second temperature sensor (472) is arranged to detect the temperature of an area of ​​the second plate (412) adjacent to the second heat source (432).

9. In paragraph 8, The above control circuit (401) An electronic device (400) configured to cause the active heat transport member (440) to perform an operation of transporting heat from the first plate (411) to the second plate (412) when a higher value among the temperature values ​​measured by the first temperature sensor (471) and the temperature values ​​measured by the third temperature sensor (473) is higher than a predetermined temperature difference or more among the temperature values ​​measured by the second temperature sensor (472) and the temperature values ​​measured by the fourth temperature sensor (474).

10. In paragraph 8, The above control circuit (401) An electronic device (400) configured to cause the active heat transport member (440) to perform an operation of transporting heat from the second plate (412) to the first plate (411) when a higher value among the temperature values ​​measured by the second temperature sensor (472) and the temperature values ​​measured by the fourth temperature sensor (474) is higher than a predetermined temperature difference or more among the temperature values ​​measured by the first temperature sensor (471) and the temperature values ​​measured by the third temperature sensor (473).

11. In paragraph 5, Further comprising a battery operatively connected to the above control circuit (401), The above control circuit (401) is an electronic device (400) configured to control the active heat transport member (440) not to operate when the state of charge of the battery is below a predetermined level based on the state of charge (SOC) of the battery.

12. In paragraph 1, A first heat dissipation member (460a) positioned between the active heat transport member (440) and the first plate (411), and thermally connected to the active heat transport member (440) and the first plate (411), respectively; and An electronic device (400) further comprising a second heat dissipation member (460b) positioned between the active heat transport member (440) and the second plate (412), and thermally connected to the active heat transport member (440) and the second plate (412), respectively.

13. In paragraph 12, An electronic device (400) in which the first heat dissipation member (460a) and the second heat dissipation member (460b) include a plurality of ventilation holes (461) formed to allow air to pass through.

14. In paragraph 12, An electronic device (400) wherein the first heat dissipation member (460a) and the second heat dissipation member (460b) further include a heat dissipation fin (462).

15. In the electronic device (400), A housing (410) having a first plate (411) and a second plate (412) facing the first plate (411); A first heat source (431) arranged so as to face the first plate (411) within the housing (410); A second heat source (432) arranged so as to face the second plate (412) within the housing (410); An active heat transport member (440) positioned between the first plate (411) and the second plate (412), thermally connected to the first plate (411) and the second plate (412), and configured to transfer heat from either the first plate (411) or the second plate (412) to the other of the first plate (411) or the second plate (412); A first temperature sensor (471) arranged to detect the temperature of the first plate (411); A second temperature sensor (472) arranged to detect the temperature of the second plate (412); a processor operatively connected to the first temperature sensor (471), the second temperature sensor (472) and the active heat transport member (440); and Contains non-transitory memory that stores computer-readable instructions, An electronic device (400) configured such that when the instructions are executed by the processor, the processor controls the active heat transport member (440) based on at least one of a temperature value measured by the first temperature sensor (471) or a temperature value measured by the second temperature sensor (472).

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