Electronic device comprising terminal assembly, and manufacturing method therefor

Abstract

According to one embodiment of the present disclosure, an electronic device comprises: a housing including a side wall having an opening; a printed circuit board disposed inside the housing; a terminal disposed at one side of the printed circuit board; and a support member which is disposed between the printed circuit board and the terminal and which includes a support part in contact with the one side of the printed circuit board, wherein the terminal is at least partially disposed in the opening and includes: a rod extending to a first end part spaced apart from the one side of the printed circuit board in a first direction of going away from the printed circuit board, and to a second end part in contact with the one side of the printed circuit board in a second direction, which is opposite the first direction, from the first end part; and a wall extending in parallel with the second direction from the first end part and surrounding the rod, and the support member can include an extension part which extends from the support part in parallel with the first direction and which is disposed between the wall and the rod.

Description

Electronic device including terminal assembly and method for manufacturing the same

[0001] The present disclosure relates to electronic devices, for example, to electronic devices including terminal assemblies and methods for manufacturing the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] During the manufacturing process of a terminal assembly (or pogo pin) that connects an electronic device to an external electronic device, the bonding strength of the terminal is reduced during assembly due to other components inside the device, and when connected to an external electronic device during use, the terminal is not fixed and shakes, resulting in difficulty in ensuring stable electrical connection with the external electronic device.

[0005] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] According to one embodiment of the present disclosure, an electronic device includes a housing including a side wall having an opening formed therein; a printed circuit board disposed inside the housing; a terminal disposed on one side of the printed circuit board; and a support member including a support portion disposed between the printed circuit board and the terminal and in contact with one side of the printed circuit board, wherein the terminal includes a rod having at least a portion disposed in the opening and a first end spaced apart from one side of the printed circuit board in a first direction away from the printed circuit board, a second end extending from the first end to a second direction opposite to the first direction and in contact with one side of the printed circuit board; and a wall extending from the first end in parallel with the second direction and configured to surround the rod, wherein the support member may include an extension portion extending from the support portion in parallel with the first direction and disposed between the wall and the rod.

[0007] According to one embodiment of the present disclosure, a method of manufacturing an electronic device may include providing a terminal including a first end portion facing a first direction, a rod protruding from the first end portion in a second direction opposite to the first direction, and a wall extending in the second direction from an edge of the first end portion and surrounding the rod; filling an adhesive member between the wall and the rod; and contacting the adhesive member to surround at least a portion of the rod and extending the adhesive member in a third direction perpendicular to the first direction away from the rod from the contacted portion.

[0008] The above-described aspects or other aspects, configurations and / or advantages of various embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a perspective view illustrating an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a perspective view showing a state in which an electronic device and an external electronic device are coupled through a connecting portion according to one embodiment of the present disclosure.

[0014] FIG. 6 is a perspective view showing the front and side surfaces of an electronic device including a connecting portion according to one embodiment of the present disclosure.

[0015] FIG. 7A is an enlarged view of area S2 of the external electronic device illustrated in FIG. 5 according to one embodiment of the present disclosure.

[0016] FIG. 7b is a conceptual diagram showing cross-section B-B' shown in FIG. 7a according to one embodiment of the present disclosure.

[0017] FIG. 8A is a conceptual diagram illustrating areas S1 and S2 in which the electronic device of FIG. 5 is coupled to an external electronic device through a connecting portion according to one embodiment of the present disclosure.

[0018] FIG. 8b is a conceptual diagram illustrating an enlarged view of area S1 illustrated in FIG. 8a according to one embodiment of the present disclosure.

[0019] FIG. 9 is a conceptual diagram illustrating cross-section A-A' shown in FIG. 6 according to one embodiment of the present disclosure.

[0020] FIG. 10 is an enlarged conceptual diagram of area S3 illustrated in FIG. 9 according to one embodiment of the present disclosure.

[0021] FIG. 11a is a perspective view of a terminal according to one embodiment of the present disclosure.

[0022] FIG. 11b is a conceptual diagram showing a cross-section of a terminal according to one embodiment of the present disclosure.

[0023] FIG. 12A is a perspective view of a terminal and a support member combined according to one embodiment of the present disclosure.

[0024] FIG. 12b is a conceptual diagram showing a cross-section of a terminal and a support member combined according to one embodiment of the present disclosure.

[0025] FIG. 13a is a conceptual diagram showing a cross-section of a terminal according to one embodiment of the present disclosure.

[0026] FIG. 13b is a conceptual diagram showing a cross-section of a terminal according to one embodiment of the present disclosure.

[0027] FIG. 14 is a conceptual diagram showing a cross-section of a terminal and a support member combined according to one embodiment of the present disclosure.

[0028] FIG. 15 is a perspective view of a terminal, a support member, and a waterproof member combined according to one embodiment of the present disclosure.

[0029] FIG. 16 is a drawing of a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 17 is a drawing of a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 18 is a drawing illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0032] FIG. 19 is a drawing illustrating a method for manufacturing a terminal of an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 20 is a drawing illustrating a method for manufacturing a terminal of an electronic device according to one embodiment of the present disclosure.

[0034] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (101) (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (101) (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (101) (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (101) (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (101) (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (101) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (101) (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device (101)). According to one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and the external electronic device (101) through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (101) (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices (101) to perform the function or at least a part of the service. One or more external electronic devices (101) that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] The electronic device (101) according to various embodiments disclosed in this document may be a device of various forms. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device (101) according to the embodiments of this document is not limited to the aforementioned devices.

[0059] The various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding components from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0060] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0062] According to one embodiment, the methods according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0063] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0064] In the detailed description below, the longitudinal direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the longitudinal direction, the width direction, and / or the height direction (or thickness direction) may indicate the longitudinal direction, the width direction, and / or the height direction (or thickness direction) of the electronic device.

[0065] In one embodiment, the fact that a component is oriented in a "certain direction" may be understood to include not only that the component is oriented in a "direction identical to the certain direction" but also that the component is oriented in a "direction parallel to the certain direction." It should be noted that when a component is said to overlap (or be stacked) with another component in the following description, the description of the arrangement relationship in the height direction described above may be applied.

[0066] In describing a direction, if 'yin / yang (- / +)' is not indicated, it can be interpreted to include both the + direction and the - direction unless otherwise defined. For example, 'Z-axis direction' can be interpreted to include both the +Z direction and the -Z direction. Similarly, 'X-axis direction' can be interpreted to include both the +X direction and the -X direction, and 'Y-axis direction' can be interpreted to include both the +Y direction and the -Y direction. However, in the XYZ spatial coordinate system illustrated in the drawing, if 'yin / yang (- / +)' is not indicated for an axis, the axis can be interpreted to point in the + direction unless otherwise specified. In describing a direction, pointing toward any one of the three axes of the orthogonal coordinate system can include pointing in a direction parallel to the axis.

[0067] Hereinafter, in the description of the electronic device (e.g., 401 of FIGS. 6 to 9) described below, the 'first direction' may mean the -Z-axis direction or a direction parallel to the -Z-axis. The 'second direction' may mean the +Z-axis direction or a direction parallel to the +Z-axis direction. The 'third direction' may mean the X-axis or Y-axis direction or a direction parallel thereto. The 'third direction' may mean a direction perpendicular to the 'first direction' or the 'second direction'. It should be noted that the above description is based on the rectangular coordinate system described in the drawings for the sake of brevity of description, and the description of such directions or components does not limit the various embodiments of the present disclosure.

[0068] FIG. 2 is a perspective view illustrating an electronic device according to one embodiment of the present disclosure.

[0069] FIG. 3 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0070] The configurations described with reference to FIGS. 2 and 3 may be substantially the same as the configurations described with reference to FIG. 1. The configurations described with reference to FIGS. 2 and 3 may be substantially the same as the configurations described with reference to FIGS. 4 to 20. The embodiments of FIGS. 2 and 3 may be combined with the embodiments of FIGS. 4 to 20. Configurations not described below may be substantially the same as the configurations of FIG. 1.

[0071] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a display (220), a front plate (202), and a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and the display (220). In one embodiment (not shown), the housing (210) may also refer to a structure forming a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C).

[0072] In one embodiment, the front plate (202) may form at least a portion of the first surface (210A). In one embodiment, the front plate (202) may be a glass plate or a polymer plate, at least a portion of which is substantially transparent, and may include various coating layers. The front plate (202) may be referred to as, for example, a display (e.g., display (220) of FIG. 4), a window, and / or a window plate (e.g., window plate (221) of FIG. 4), and may form an exterior of the electronic device (101) together with the housing (210). In one embodiment, a display panel (e.g., display panel (223) of FIG. 4) may be disposed on an inner surface of the front plate (202), and, depending on the embodiment, the front plate (202) itself and / or the front plate (202) and the display panel (223) in combination may be referred to as a 'display'.

[0073] According to one embodiment, the second side (or back) (210B) of the electronic device (101) may be formed by a back plate (212) provided as part of the housing (210) (e.g., the back plate (212) of FIG. 4). The back plate (212) may be formed by a substantially opaque material, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0074] In one embodiment, the side surface (210C) of the electronic device (101) may be formed by a side structure (211) (e.g., a “bezel structure”) that at least partially surrounds a space between the front plate (202) and the back plate (212). For example, the front plate (202) may be coupled to the side structure (211) so as to face the back plate (212) with a predetermined gap therebetween. In one embodiment, the side structure (211) may be provided as a separate component from the back plate (212) and may be coupled to the back plate (212) through a separate assembly process to form the housing (210). In one embodiment, the side structure (211) may be manufactured or formed integrally with the back plate (212) and may comprise the same material (e.g., a metal material such as aluminum). In one embodiment, the back plate (212) and / or the side structure (211) may at least partially comprise an electrically conductive material, a metal material, and / or a polymer material. When the back plate (212) and / or the side structure (211) include an electrically conductive material, the housing (210) can function at least partially as a radiating conductor of an antenna that transmits and receives wireless signals, and / or can function as a ground or electromagnetic shielding structure of the electronic device (101).

[0075] In the illustrated embodiment, the front plate (202) and / or the back plate (212) are substantially flat plate-shaped, but it should be noted that the embodiments disclosed herein are not limited thereto. For example, the front plate (202) and / or the back plate (212) may have a generally flat plate-shaped shape, but at least a portion of an edge may have a curved shape, and a side structure (211) connecting the edge of the front plate (202) and the back plate (212) may have a curved shape. In one embodiment, the thickness of the electronic device (101) at the center of the front plate (202), for example, the thickness measured along the Z-axis direction, may be greater than the thickness measured at the edge of the front plate (202). For example, the thickness of the electronic device (101) may gradually decrease as it approaches the edge on the first surface (210A). When the front plate (202), the rear plate (212) and / or the side structure (211) of the electronic device (101) have a curved shape, a comfortable grip can be provided to the user.

[0076] According to one embodiment, the electronic device (101) may include a display (e.g., the display (220) of FIG. 4), an audio module (213) (e.g., the audio module (170) of FIG. 1), and / or a key input device (218), and may include at least one of a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1), a light-emitting element, and a connector hole (e.g., the connection terminal (178) of FIG. 1), which are not illustrated. In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (218) or the light-emitting element) or may additionally include other components.

[0077] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0078] According to one embodiment, the display (220) may include, for example, a display panel (e.g., display panel (223) of FIG. 4) disposed on the inside of the front plate (202) and may output visual information such as characters, images, and / or videos through a significant portion of the front plate (202). In one embodiment, substantially the entire area of ​​the front plate (202) may be set as an area for outputting a screen. The area for outputting a screen may be formed to have a shape substantially identical to the edge of the front plate (202). In one embodiment (not shown), the gap between the area for outputting a screen and the outer edge of the front plate (202) may be formed to be substantially identical, thereby increasing the ratio of the area for outputting a screen to the area provided by the front plate (202).

[0079] In one embodiment, the display (220) may form a recess or opening in a portion of the screen display area, and may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element aligned with the recess or opening. In one embodiment, the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, a fingerprint sensor, and a light-emitting element arranged to face in a direction opposite to the screen output direction of the display (220). In one embodiment, the electronic device may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element arranged inside the screen display area of ​​the display (220) while facing in the same direction as the screen output direction. For example, the camera module may be arranged to overlap the screen display area, and may not be visually exposed to the outside, and may include a hidden under-display camera (UDC).

[0080] In one embodiment, the display (220) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, at least a portion of the sensor module and / or at least a portion of the key input device may be disposed inside the display.

[0081] In one embodiment, the display (220) may include a display (e.g., a flexible display) that is arranged to slide on the housing (210) to provide a screen (e.g., a screen display area). For example, the screen display area of ​​the electronic device (101) is an area that is visually exposed and capable of outputting an image, and the electronic device (101) may reduce or expand the screen display area according to the movement of a sliding plate (not shown) or the movement of the display (220). For example, the electronic device (101) may include a rollable electronic device in which at least a portion (e.g., the housing) is configured to slide at least partially to selectively expand the screen display area. For example, the display (220) may also be referred to as a slide-out display or an expandable display.

[0082] According to one embodiment, the audio module (213) may include a microphone hole and a speaker hole. The microphone hole may have a microphone positioned inside to capture external sounds, and in one embodiment, multiple microphones may be positioned to detect the direction of the sounds. The speaker hole may include an external speaker hole and a receiver hole for calls. In one embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezo speaker). In the illustrated embodiment, the audio module is illustrated in the form of a hole (213) penetrating a side surface (210C) of the electronic device, for example, a side structure (211) (e.g., the side structure (211) of FIG. 4), but it should be noted that the embodiment disclosed in this document is not limited thereto. For example, when providing a voice call function, the electronic device (101) may further include an audio module (not illustrated) in the form of a hole penetrating the front plate (202). The number and location of audio modules may be varied in consideration of the shape, function and / or actual usage environment of the electronic device (101).

[0083] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include sensors that detect the operating environment of the electronic device (101), such as a proximity sensor, an illuminance sensor, and a temperature / barometric pressure sensor, and may include sensors that obtain a user's biometric information, such as a fingerprint sensor or an HRM sensor. In addition, various other types of sensors, such as a gesture sensor, a gyro sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, or a humidity sensor, may be mounted on the electronic device (101). The arrangement of these sensor modules may be appropriately selected in consideration of the actual usage environment of the electronic device and the functions mounted on the electronic device.

[0084] According to one embodiment, a camera module (e.g., camera module (180) of FIG. 1) may be disposed on at least one of a first surface (210A), which is the front surface, and a second surface (210B), which is the rear surface, of the electronic device (101), and, depending on the embodiment, a plurality of camera modules may be disposed to face the same direction. In one embodiment, the camera module may include a flash that provides illumination toward a subject. The camera module may include, for example, one or more lenses, an image sensor, and / or an image signal processor. The flash may include, for example, a light-emitting diode or a xenon lamp.

[0085] According to one embodiment, the key input device (218) may be disposed on a side surface (210C) of the electronic device (101) and / or the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (218), and the key input devices (218) that are not included may be implemented in other forms, such as soft keys, on the display (220). The number or location of the key input devices (218) is not limited to the illustrated embodiment, and may be additionally installed on the first side (210A), the second side (210B) and / or the non-illustrated side surface (210C) of the electronic device. In one embodiment, some of the key input devices (218) of FIG. 2 may be replaced with slots or connector holes. For example, the electronic device (101) can accommodate a user identification module card or a memory card through a slot formed to penetrate the side structure (211), and can transmit and receive power, sound signals, and / or data to and from an external electronic device through a connector hole.

[0086] According to one embodiment, the light-emitting element may be disposed on the first side (210A) and / or the second side (210B) of the electronic device (101). The light-emitting element may, for example, provide status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element may, for example, provide a light source that is linked to the operation of a camera module. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0087] FIG. 4 is an exploded perspective view illustrating an electronic device (101) (e.g., the electronic device (101) of FIG. 2 and / or FIG. 3) according to one embodiment disclosed in this document.

[0088] The configurations described with reference to FIG. 4 may be substantially the same as the configurations described with reference to FIGS. 1 to 3. The configurations described with reference to FIG. 4 may be substantially the same as the configurations described with reference to FIGS. 5 to 20. The embodiments of FIG. 4 may be combined with the embodiments of FIGS. 5 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 3.

[0089] Referring to FIG. 4, the electronic device (101) may include a housing (210) (e.g., the housing (210) of FIG. 2 and / or FIG. 3), a display (220), a printed circuit board (203) (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (204), a speaker module (251), and an antenna (253). In one embodiment, the electronic device (101) may omit at least one of the components or additionally include another component (e.g., a display bracket that supports or protects the display (220). According to one embodiment, the electronic device (101) may have a structure in which housings divided into a plurality of regions are folded by including at least one hinge structure. For example, depending on the change in state of the hinge structure (e.g., folded state, intermediate state, or unfolded state), the state of the display operatively connected to the housing may change. For example, a first display corresponding to a first housing and a second display corresponding to a second housing may change to a state facing or spaced apart from each other. According to one embodiment, at least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0090] According to one embodiment, the housing (210) may include a back plate (212) (e.g., the back plate (212) of FIG. 2) and a side structure (211) (e.g., the side structure (211) of FIG. 2) extending from the back plate (212) in the thickness direction (e.g., the Z-axis direction). In one embodiment, the side structure (211) may be manufactured as a separate component from the back plate (212) and may be coupled with the back plate (212) to form the housing (210). In one embodiment, the side structure (211) and the back plate (212) may be manufactured and formed as an integral component. Although not shown, the housing (210) may further include a support member (not shown) that isolates the display (220) (e.g., the display panel (223)) from a space in which the printed circuit board (203) or the battery (204) is accommodated, and the support member may be in the form of a flat plate formed integrally with the side structure (211). In the embodiments described below, the rear plate (212) of FIG. 4 and the rear plate (212) of FIG. 3 can be interpreted as being substantially the same.

[0091] According to one embodiment, the back plate (212) and / or the side structure (211) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. For example, the housing (210) may at least partially include an electrically conductive material. In one embodiment, when the back plate (212) includes an electrically conductive material, the housing (210) may be utilized as a structure that provides an electromagnetic shielding structure at least partially. In one embodiment, when the side structure (211) includes an electrically conductive material, at least a portion of the side structure (211) may be utilized as a radiating conductor for transmitting and receiving wireless radio waves. In one embodiment, when a support member (not shown) is disposed between the printed circuit board (203) and the display panel (223), and the support member includes an electrically conductive material, the support member may provide a ground conductor or an electromagnetic shielding structure of the electronic device (101).

[0092] According to one embodiment, the display (220) may include a window plate (221) (e.g., the front plate (202) of FIG. 2 or FIG. 3) and a display panel (223). The display panel (223) is disposed on the inner surface of the window plate (221) and may output visual information by utilizing substantially the entire area of ​​the window plate (221).

[0093] According to one embodiment, the electronic device (101) may include a plurality of through holes (213, 218) formed to penetrate the side structure (211). Among the plurality of through holes (213, 218), the first through hole (213)(s) may be utilized as a path for outputting sound. For example, the audio module (213) of FIG. 2 may include the first through hole (213). In one embodiment, the electronic device (101) may include at least one speaker module (251) positioned at a position corresponding to the first through holes (213), and the speaker module (251) may output sound to the outside of the electronic device (101) through the first through hole (213)(s). Among the plurality of through holes (213, 218), the second through hole (218)(s) may provide a space for installing an input device, for example, a key input device (218) of FIG. 2. In one embodiment, some of the plurality of through holes (213, 218) may be utilized as slots or connector holes for accommodating a storage medium, and, depending on the embodiment, additional slots and / or connector holes may be formed to penetrate the side structure (211).

[0094] According to one embodiment, a printed circuit board (203) disposed as a first circuit board or a main circuit board may have a processor, a memory, and / or an interface disposed thereon. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor or the communication module may be mounted on an electronic component (255), such as an integrated circuit chip, and disposed on the printed circuit board (203). For example, the electronic component (255) may be disposed on the printed circuit board (203) through a surface mount process and may perform wireless communication using an antenna (253) and / or a portion of the side structure (211). According to one embodiment, the electronic device (101) may include a storage device (e.g., memory), such as a hard disk drive (HDD) or a solid state drive (SSD).

[0095] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0096] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0097] According to one embodiment, the battery (204) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (204) may be disposed substantially on the same plane as, for example, the printed circuit board (203). The battery (204) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0098] According to one embodiment, the antenna (253) may be disposed within the housing (210) adjacent to an edge, for example, a side structure (211). In one embodiment, a plurality of antennas (253) may be arranged at appropriate locations along the edge within the housing (210). In one embodiment, the illustrated antenna (253) may perform millimeter wave (mmWave) communication using a frequency of several tens of GHz or more. In one embodiment, although not illustrated, the electronic device (101) may further include a flat antenna disposed between the back plate (212) and the battery (204). The flat antenna may include wires or printed circuit patterns arranged in a plane to form a loop structure and may function as, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the flat antenna may be capable of performing short-range communication with an external device or wirelessly transmitting and receiving power required for charging.

[0099] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (101) (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0100] FIG. 5 is a perspective view illustrating a state in which an electronic device and an external electronic device are coupled through a connecting portion according to an embodiment of the present disclosure. FIG. 6 is a perspective view illustrating a front and a side of an electronic device including a connecting portion according to an embodiment of the present disclosure. FIG. 7A is an enlarged view of an area S2 of the external electronic device illustrated in FIG. 5 according to an embodiment of the present disclosure. FIG. 7B is a conceptual diagram illustrating a cross-section B-B' illustrated in FIG. 7A according to an embodiment of the present disclosure. FIG. 8A is a conceptual diagram illustrating areas S1 and S2 in which the electronic device illustrated in FIG. 5 is coupled to an external electronic device through a connecting portion according to an embodiment of the present disclosure. FIG. 8B is an enlarged conceptual diagram illustrating an area S1 illustrated in FIG. 8A according to an embodiment of the present disclosure.

[0101] The configurations described with reference to FIGS. 5 to 8B may be substantially the same as the configurations described with reference to FIGS. 1 to 4. The configurations described with reference to FIGS. 5 to 8B may be substantially the same as the configurations described with reference to FIGS. 9 to 20. The embodiments of FIGS. 5 to 8B may be combined with the embodiments of FIGS. 9 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 4.

[0102] According to one embodiment, an electronic device (301) may be connected to an external electronic device (402). The electronic device (301) may include a terminal assembly (401). The electronic device (301) may be connected to an external electronic device (402) through the terminal assembly (401). The terminal assembly (401) of the electronic device may be coupled to an external terminal (4022) of the external electronic device. According to one embodiment, the electronic device (301) and the external electronic device (402) may be coupled through the terminal assembly (401) disposed in an area S1 and the external terminal (4022) disposed in an area S2. The external electronic device (402) may be electrically connected through the terminal assembly (401) of the electronic device (301). The electronic device (301) may be coupled to the external electronic device (402). The electronic device (301) can be coupled to an external electronic device (402) through a magnetic material (not shown).

[0103] According to one embodiment, an electronic device (301) may include a housing (310) including a first side (310A), a second side (310B) facing in an opposite direction from the first side, and a third side (310C) surrounding the first side (310A) and the second side (310B). The electronic device (301) may include a front plate (302) disposed on the first side (310A). The electronic device (301) may include a display (320) on an inner surface of the front plate (302). The electronic device (301) may include a rear cover plate (312) disposed on the second side (310B). The electronic device (301) may include a side wall (or side structure) (410) disposed on the third side (310C) and surrounding an inner space of the housing.

[0104] Referring to FIG. 6, the electronic device (301) may include a side wall (410). The side wall (410) may be substantially the same as the side structure described with reference to FIGS. 2 to 4 (e.g., the side structure (211) illustrated in FIG. 3). The side wall (410) may include at least one opening (411). A terminal (420) of the terminal assembly (401) of the electronic device may be exposed to the outside through the opening (411). The terminal (420) may be positioned closer to the interior of the electronic device (410) than the side wall (410) and may be exposed to the outside. The electronic device (301) may be coupled or electrically connected to an external electronic device (402) through the terminal (420) exposed through the opening (411). The electronic device (301) can be coupled to the external electronic device (402) by having a side wall (410) in contact with the external electronic device (402).

[0105] In one embodiment, the external electronic device (402) may include a bonding surface (4021). The bonding surface (4021) may contact a side wall (410) of the electronic device (301). The external electronic device (402) may be coupled to the electronic device (301) through the bonding surface (4021). For example, although not shown, the bonding surface (4021) may include a magnetic material and may be coupled to the side wall (410) of the electronic device (301) by magnetism. In one embodiment, the bonding surface (4021) may include a plurality of openings. The external electronic device (402) may include an external terminal (4022) protruding through the opening of the bonding surface (4021). The external electronic device (402) may include an elastic material (4023) coupled to the external terminal (4022) and disposed inside the external electronic device (402). The external electronic device (402) may include a support (4024) capable of accommodating an external terminal (4022) and an elastic body (4023). Referring to FIG. 8A, the external terminal (4022) of the external electronic device (402) may be configured such that the elastic body (4023) contracts when coupled with the electronic device (301), thereby causing the external terminal (4022) to move inwardly of the external electronic device (402). When coupled with the electronic device (301), the external terminal (4022) protruding outwardly of the external electronic device (402) may be positioned in the opening (411) of the electronic device (301) when the elastic body (4023) contracts. The external terminal (4022) may move vertically so that the terminal assembly (401) of the electronic device (301) does not move and may be electrically connected to the external electronic device (402). The external terminal (4022) can be moved vertically so that the terminal assembly (401) of the electronic device (301) can be fixedly coupled with the external electronic device (402).

[0106] According to one embodiment, the electronic device (301) may include a side wall (410) surrounding an interior space of a housing (310). The side wall (410) may include an opening (411). The electronic device (301) may include a terminal assembly (401). The terminal assembly (401) may include a terminal (420) at least partially disposed in the opening (411). The electronic device (301) may include a printed circuit board (PCB) (440) within the housing (310). The printed circuit board (PCB) (440) may include a first printed circuit board (PCB) (440) disposed in the terminal assembly and a second printed circuit board (PCB) (440) bent from the first printed circuit board and extended into the interior of the housing. The printed circuit board (PCB) (440) described in the present disclosure may include a flexible printed circuit board (FPCB). The electronic device (301) may include a support member (430) between the printed circuit board (440) and the terminal (420). The electronic device (301) may include a waterproof member (450) disposed between the support member (430) and the side wall (411) and surrounding the terminal (420). The electronic device (301) may include a bracket (460) inside the terminal (420).

[0107] According to one embodiment, the electronic device (301) may include a bracket (460) disposed inside a housing (310). The bracket (460) may be disposed inside the housing (310) and coupled with a printed circuit board (440) (PCB). The bracket (460) may be coupled to the terminal assembly (401) and may extend toward the inside of the housing (310). The bracket (460) and the printed circuit board (PCB) (440) may be coupled with another member therebetween. In the present disclosure, the coupling of the printed circuit board (PCB) (440) and the bracket (460) is not limited to direct coupling, and the printed circuit board (PCB) (440) and the bracket (460) may be coupled with another member disposed between them. For example, an adhesive material may be disposed between the bracket (460) and the printed circuit board (PCB) (440) of the terminal assembly (401). The bracket (460) mentioned in the present disclosure may mean a fixing member or fixing member that performs the role of fixing the terminal assembly (401). The bracket (460) may be named as the fixing member or substantially the same as the fixing member.

[0108] Fig. 9 is a conceptual diagram illustrating cross-section A-A' illustrated in Fig. 6 according to one embodiment of the present disclosure. Fig. 10 is an enlarged conceptual diagram of area S3 illustrated in Fig. 9 according to one embodiment of the present disclosure.

[0109] The configurations described with reference to FIGS. 9 and 10 may be substantially the same as the configurations described with reference to FIGS. 1 to 8. The configurations described with reference to FIGS. 9 and 10 may be substantially the same as the configurations described with reference to FIGS. 11A to 20. The embodiments of FIGS. 9 and 10 may be combined with the embodiments of FIGS. 11A to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 8B.

[0110] According to one embodiment, the electronic device (301) may include a housing (310). The housing (310) may include a side wall (410) enclosing an internal space. The side wall (410) may include an opening (411). The side wall (410) may include a plurality of openings (411). The side wall (410) may include a third surface (412) facing a first direction (-Z direction). The third surface (412) may form a side surface (e.g., 211 illustrated in FIG. 3) of the electronic device (301). The housing (310) may include a side wall (410) in which an opening (411) is formed. The opening (411) may be formed differently depending on the shape of the terminal (420). For example, when the terminal (420) is circular, the opening (411) may be formed in a circular shape. The side wall (410) may include a metal material. The side wall (410) may include synthetic resins.

[0111] According to one embodiment, the electronic device (301) may include a terminal assembly (401) inside a housing (310). The terminal assembly (401) may include a terminal (420). The terminal assembly (401) may include a portion of a printed circuit board (440). The terminal assembly (401) may include a support member (430). The terminal assembly (401) may include a waterproof member (450). The terminal assembly (401) may be coupled so that at least a portion of the terminal (420) is disposed in an opening (411) of a side wall (410) inside the housing (310). However, this is not limited thereto, and the components of the terminal assembly (401) may be coupled or separated as independent components.

[0112] According to one embodiment, the electronic device (301) may include a printed circuit board (PCB) (440) within a housing (310). A terminal assembly (401) may include a portion of the printed circuit board (440). The printed circuit board (440) may be disposed within the housing (310) and electrically connected to a terminal (420). The printed circuit board (440) may include a hole. The hole may include a first surface (4402) surrounding the hole. The printed circuit board (PCB) (440) may have a terminal (420) disposed in the hole (4401) and the first surface (4402) and the terminal (420) may be electrically connected by contact. The terminal assembly (401) may be electrically connected to an external electronic device (402). The terminal assembly (401) may be fixed when coupled with the external electronic device (402).

[0113] According to one embodiment, the electronic device (301) may include a terminal (420). The terminal assembly (401) may include the terminal (420). The terminal (420) may be disposed on one side of a printed circuit board (PCB) (440). The terminal (420) may be disposed on one side of the printed circuit board (PCB) (440) and may be in contact with the printed circuit board (PCB) (440). The terminal (420) may be electrically connected to the printed circuit board (PCB) (440). The terminal (420) may include a first end portion (421) facing in a first direction (-Z direction). The first end portion (421) may be disposed in an opening (411) of a side wall (410). The first end portion (421) may be disposed facing away from the printed circuit board. The first end (421) may be circular or square.

[0114] According to one embodiment, the terminal (420) may include a rod (422) extending from a first end in a second direction (+Z direction) opposite to a first direction (-Z direction). The rod (422) may be electrically connected to a printed circuit board (440). At least a portion of the rod (422) may be disposed in a hole (4401) of the printed circuit board (440). At least a portion of the rod (422) may be in contact with a first surface (4402) surrounding the hole of the printed circuit board. The rod (422) may be a cylinder or a square cylinder. The first end (421) may be disposed in the opening (411) and exposed to the outside. The first end portion (421) may be placed in the opening (411) spaced apart from the third side (412) of the side wall (410) forming the side surface (not shown) of the electronic device (301) in the direction inward of the housing (310) by a first separation distance (D1).

[0115] According to one embodiment, the terminal (420) may include a wall (423) extending in a second direction (+Z direction) from the first end portion (421). The wall (423) may surround the rod (422). The wall (423) may extend in the second direction (+Z direction) from an edge of the first end portion (421). The extended length of the wall (423) may be less than the extended length of the rod (422). The wall (423) may extend apart from the rod (422) to form a concave portion in the terminal (420). The wall (423) may be cylindrical or box-shaped. The space between the wall (423) and the rod (422) may lengthen a path of movement of external substances introduced through the opening (411) to prevent them from entering the interior of the device.

[0116] According to one embodiment, the electronic device (301) may include a support member (430). The terminal assembly (401) may include the support member (430). The support member (430) may be disposed between a printed circuit board (PCB) (440) and a terminal (420). The support member (430) may be disposed between the printed circuit board (PCB) (440) and a side wall (410). The support member (430) may fill a space between a wall (423) of the terminal (420) and a rod (422). A portion of the support member (430) disposed between the printed circuit board (PCB) (440) and the side wall (410) may surround a portion of the wall (423). Another portion of the support member (430) disposed between the printed circuit board (PCB) (440) and the terminal (420) can surround the rod (422). Another portion of the support member (430) disposed between the wall (423) and the rod (422) can surround the rod (422). The support member (430) can secure the terminal (420).

[0117] According to one embodiment, the support member (430) may include support portions (431, 433). The support portions (431, 433) may form a portion of the support member (430). A portion (431) of the support portion may be disposed between a printed circuit board (PCB) (440) and a terminal (420). A portion (431) of the support portion may be referred to as a first support portion (431). Another portion (433) of the support portion may extend from the portion (431) of the support portion and be disposed between the printed circuit board (PCB) (440) and the side wall (410). The support member (430) may be a bonding member that joins the terminal (420) and the printed circuit board (PCB) (440). The support member (430) may be a bonding member that bonds the printed circuit board (440) and the terminal (420) by injection molding. The support member (430) may include an adhesive material. The support member (430) may be an adhesive. Another portion (433) of the support member may be referred to as a second support member (433). The support members (431, 433) may include a first support member (431) and a second support member (433). The first support member (431) may be referred to as a portion (431) of the support member disposed between a printed circuit board (PCB) (440) and a terminal (420). The second support member (433) may be referred to as another portion (433) of the support member disposed between the printed circuit board (PCB) and the side wall (410). Hereinafter, for convenience of explanation, they will be described as the first support member (431) and the second support member (433).

[0118] According to one embodiment, the electronic device (301) may include a waterproof member (450). The terminal assembly (401) may include the waterproof member (450). The waterproof member (450) may be disposed between a printed circuit board (PCB) (440) and a side wall (410). The waterproof member (450) may be disposed between a support member (430) and the side wall (410). The waterproof member (450) may be in contact with the support member (430). The waterproof member (450) may be disposed between a second support member (433) and the side wall (410). The waterproof member (450) may be in contact with the second support member (433). The waterproof member (450) may surround the terminal (420). The waterproof member (450) may surround the wall (423) of the terminal (420). The waterproofing member (450) can be in contact with at least a portion of the wall (423). The waterproofing member (450) can be in contact with the inner surface (413) of the side wall (410). The waterproofing member (450) can have an annular structure. The waterproofing member (450) can have a plurality of annular structures connected. The waterproofing member (450) can have a structure including a hole. The waterproofing member (450) can prevent substances from flowing into the interior through the opening (411).

[0119] Hereinafter, the configurations of the terminal assembly (401) and side wall (410) not described may be substantially the same as the configurations described with reference to FIGS. 1 to 8b.

[0120] FIG. 11a is a perspective view of a terminal according to one embodiment of the present disclosure. FIG. 11b is a conceptual diagram illustrating a cross-section of a terminal according to one embodiment of the present disclosure.

[0121] The configurations described with reference to FIGS. 11A and 11B may be substantially the same as the configurations described with reference to FIGS. 1 to 10. The configurations described with reference to FIGS. 11A and 11B may be substantially the same as the configurations described with reference to FIGS. 12 to 20. The embodiments of FIGS. 11A and 11B may be combined with the embodiments of FIGS. 12 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 10.

[0122] According to one embodiment, an electronic device (e.g., 301 as shown in FIG. 5) may include a terminal assembly (401). The terminal assembly (e.g., 401 as shown in FIG. 9) may include a terminal (420). At least a portion of the terminal (420) may be disposed in an opening (e.g., 411 as shown in FIG. 9) of a side wall (e.g., 410 as shown in FIG. 9) and may be electrically connected to an external electronic device (e.g., 402 as shown in FIG. 9). The terminal (420) may be referred to as a conductive pin.

[0123] According to one embodiment, the terminal (420) may include a first end portion (421). The first end portion (421) may face in a first direction (-Z direction) and be positioned in an opening (e.g., 411 illustrated in FIG. 9). The first end portion (421) may form a bottom of the terminal (420). The first end portion (421) may include a bottom surface (4212) facing in a second direction (+Z direction). The first end portion (421) may include a second surface (4211) of the first end portion (421) facing in the first direction (-Z direction). The second surface (4211) may contact an external electronic device (e.g., 402 illustrated in FIG. 5). The first end portion (421) may be circular. The first end portion (421) may be square. The first end portion (421) may refer to a portion that comes into contact with an external electronic device through the opening (411). The first end portion (421) may be referred to as a first wall of the terminal or a first wall or bottom wall disposed in the opening. The first end portion (421) may be referred to as a part of a pin head or a pin head plate.

[0124] According to one embodiment, the terminal (420) may include a rod (422). The rod (422) may extend in a second direction (+Z direction) from a first end portion (421). The rod (422) may extend toward a printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9). The rod (422) may extend by a first extension distance (L1). The rod (422) may include a fourth surface (4221) facing a third direction (Y-axis direction) that is perpendicular to the Z-axis direction. The fourth surface (4221) may extend from a bottom surface (4212) of the first end portion (421). The fourth surface (4221) may form a curved surface at a portion where it is connected to the bottom surface (4212) of the first end portion (421). The bottom surface (4212) may form a curved surface at a portion connected to the fourth surface (4221). At least a portion of the rod (422) may be in contact with a printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9). At least a portion of the fourth surface (4221) may be in contact with a printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9). At least a portion of the rod (422) may contact a first surface (e.g., 4402 as shown in FIG. 9) surrounding a hole (e.g., 4401 as shown in FIG. 9) of a printed circuit board (PCB) (e.g., 440 as shown in FIG. 9). At least a portion of the fourth surface (4221) may contact a first surface (e.g., 4402 as shown in FIG. 9) surrounding a hole (e.g., 4401 as shown in FIG. 9) of a printed circuit board (PCB) (e.g., 440 as shown in FIG. 9). The rod may extend from a first end (421) to a second end that contacts the printed circuit board (440). The rod may include a second end that contacts the printed circuit board (440) from the first end (421). The second end may be formed on the printed circuit board (440). You can contact.The second end portion may be arranged in a hole (4401) of a printed circuit board (440) and may contact the first surface (4402). The rod (422) may include a protruding surface (4222) facing in the second direction (-Z direction). The protruding surface (4222) may be an end surface of the rod (422) extending from the first end portion (421). The protruding surface (4222) may be circular or rectangular. The protruding surface (4222) may be aligned with an inner surface (e.g., 4403 as shown in FIG. 9) of a printed circuit board (PCB) (e.g., 440 as shown in FIG. 9) facing in the first direction. The protruding surface (4222) may be positioned to correspond to an inner surface (e.g., 4403 as shown in FIG. 9) of a printed circuit board (PCB) (e.g., 440 as shown in FIG. 9) facing the first direction. The protruding surface (4222) may be positioned on the same plane as the inner surface (e.g., 4403 as shown in FIG. 9) of the printed circuit board (PCB) (e.g., 440 as shown in FIG. 9) facing the first direction. The protruding surface (4222) may be in contact with a bracket (e.g., 460 as shown in FIG. 8b). The rod (422) may be electrically connected to the printed circuit board (PCB) (e.g., 440 as shown in FIG. 9). The rod (422) may include a recess (e.g., see 13b described below). The rod may be named as a protrusion of the terminal, a protrusion extending from the first end, or substantially the same as the protrusion.

[0125] According to one embodiment, the terminal (420) may include a wall (423). The wall (423) may extend in a second direction (+Z direction) from the first end portion (422). The wall (423) may extend inwardly of an electronic device (e.g., 301 illustrated in FIG. 5) or toward a printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9). The wall (423) may extend by a second extension distance (L2). The wall (423) may be configured to surround a rod (422). The wall (423) may surround the rod (422). The wall (423) may extend in the second direction (-Z direction) along an edge of the first end portion (421). The wall (423) may include an outer surface (4231) facing away from the rod (422). The outer surface (4231) may extend from the second surface (4211) of the first end portion (421). The outer surface (4231) may form a curved surface at a portion where it connects to the second surface (4211). The second surface (4211) may form a curved surface at a portion where it connects to the outer surface (4231). The outer surface (4231) may contact a waterproofing member (e.g., 450 illustrated in FIG. 9). The outer surface (4231) may contact a portion of a support member (e.g., 430 illustrated in FIG. 9). The wall (423) may include a peripheral surface (4232) facing the rod (422). The peripheral surface (4232) may face the fourth surface (4221) of the rod (422). The peripheral surface (4232) may extend from the bottom surface (4212) of the first end portion (421). The peripheral surface (4232) may form a curved surface at a portion where it is connected to the bottom surface (4212). The bottom surface (4212) may form a curved surface at a portion where it is connected to the peripheral surface (4232). At least a portion of the peripheral surface (4232) may include a recess (e.g., see 13a and 13b described below). The second extension distance (L2) of the wall (423) may be smaller than the first extension distance (L1) of the rod (422).The wall (423) may be named as a perimeter wall extending from the first end portion (421) or substantially the same as the perimeter wall.

[0126] According to one embodiment, a terminal assembly (e.g., terminal assembly (401) of FIG. 10) may include a conductive pin (420). The conductive pin (420) may include a pin head (421, 423). The pin head (421, 423) may include a head plate (421) and a pin head wall (423). The pin head plate (421) may be partially disposed in the opening (411) and may include a second side (or outer side of the pin head) (4211). The second side (or outer side of the pin head) (4211) of the pin head (421) may be exposed to the outside through the opening (411) of the side wall (410) in a state in which it is electrically connectable to an external electronic device. The pin head wall (423) may extend in a second direction (+Z direction) opposite to the first direction (-Z direction). The pin head wall (423) may be configured to surround a portion of the rod (422) (or pin body). The pin head wall (423) may be configured to surround a portion of the pin body together with the pin head wall (423) and the pin body (422) space (424). The pin head (421, 423) may mean a state in which the first end portion (421) and the wall (423) are combined or formed integrally. For example, the pin head (421, 423) may be defined to include the first end portion (421) and the wall (423). The pin head plate (421) may be substantially the same as the first end portion (421). The pin head wall (423) may be substantially identical to the wall (423).

[0127] In one embodiment, the terminal (or conductive pin) (420) may include a pin body (422). The pin body (422) may include a first end (4222) electrically connected to a printed circuit board (e.g., a printed circuit board (440) of FIG. 10). The first end (4222) may be substantially identical to a second end (4222). For example, the second end (4222) may be referred to as the first end (4222) of the pin body. The pin body (422) may extend to a second end (421) that extends toward the pin head (421, 423) in a first direction (-Z direction) opposite to the first end (4222). The pin body (422) and the pin head (421, 423) may be formed integrally. The second end (421) may be substantially identical to a portion integrally connected to a portion of the pin head (421, 423) or a portion of the pin head plate (421). For example, the second end (421) may refer to a portion connected to the pin head plate (421). However, it should be noted that the present invention is not limited thereto. The terminal (420) may include a first space (424) between a rod (422) and a wall (423). The first space (424) may be referred to as a space (424) between the rod (422) and the wall (423) or may be substantially identical thereto. The first space (424) between the rod (422) and the wall (423) may be surrounded by a fourth surface (4221) of the rod and a peripheral surface (4231) of the wall (423). The first space (424) may be composed of an outer surface (4232), a bottom surface (4212), and a fourth surface (4221), and may include a concave surface facing the first direction (-Z direction). The terminal (420) may prevent the external substance from flowing into the electronic device (e.g., 301 illustrated in FIG. 5) by riding the rod (422) due to the lengthening of the movement path of the external substance due to the first space (424).The terminal (420) can be fixed by filling the first space (424) with an adhesive member (e.g., 430 shown in FIG. 9) so that the terminal (420) receives an external force, and a portion of the adhesive member (e.g., 430 shown in FIG. 9) disposed in the first space (424) counteracts the force, thereby achieving a balance of force. (See FIGS. 12a and 12b described below.) Hereinafter, configurations of the terminal (420) that are not described may be substantially the same as the configurations described with reference to FIGS. 1 to 10.

[0128] FIG. 12a is a perspective view showing a terminal and a support member combined according to one embodiment of the present disclosure. FIG. 12b is a conceptual diagram showing a cross-section of a terminal and a support member combined according to one embodiment of the present disclosure.

[0129] The configurations described with reference to FIGS. 12a and 12b may be substantially the same as the configurations described with reference to FIGS. 1 to 11b. The configurations described with reference to FIGS. 12a and 12b may be substantially the same as the configurations described with reference to FIGS. 13a to 20. The embodiments of FIGS. 12a and 12b may be combined with the embodiments of FIGS. 13a to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 11b.

[0130] According to one embodiment, the electronic device (301) may include a support member (430). A terminal assembly (e.g., 401 illustrated in FIG. 9) may include the support member (430). The support member (430) may be disposed between the terminal (420) and a printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9). The support member (430) may be disposed between the printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9) and a housing side wall (e.g., 410 illustrated in FIG. 9). The support member (430) may surround at least a portion of the terminal (420). The support member (430) may fill a first space (424) between a wall (423) of the terminal (420) and a rod (422). The support member (430) may be formed to fill the first space (424) of the terminal (420) and surround the rod (422) that protrudes longer than the extension length of the wall (423). The support member (430) may fix the terminal (420). For example, when an external force is applied to the terminal (420), the support member (430) filled in the first space (424) of the terminal (420) may form a reaction force (or resistance force) to the external force transmitted from the terminal (420) to fix the terminal (420). The support member (430) may surround the rod (422) that protrudes longer than the wall (423) and may extend longer than the diameter or width of the terminal (420). The extended support member (430) may form a reaction force to achieve a balance of forces when an external force is applied to the terminal (420). For example, when an external force is applied to the terminal (420), a reaction force is formed on the support member (430) located in the first space (424) and the support member (430) extended to surround the rod, which can fix the terminal (420) by achieving a balance of force and torque.

[0131] According to one embodiment, the support member (430) may include a first portion (431) disposed between the terminal (420) and a printed circuit board (PCB) (e.g., 440 as shown in FIG. 9) and surrounding a portion of the rod (422). The first portion (431) may be named as a portion of the support member (431) or substantially the same as the support member (431). For convenience of description, it will be referred to as the first portion (431) below. The first portion (431) may surround a portion of the rod (422) and may be in contact with the upper surface (4233) of the wall (423). The first portion (431) may have an annular structure or a square pillar structure in which a hole is formed, depending on the shape of the rod (422). However, the first portion (431) is not limited to the shape mentioned in the present disclosure, and may be formed differently depending on the shape of the rod (422). The support member (430) may be in contact with a printed circuit board (PCB) (e.g., 440 as shown in FIG. 9). The support member (430) may be a square pillar (or plate-shaped structure) including a hole in which a rod (423) is placed. When the support member (430) is viewed from above, it may include a square pillar (or plate-shaped structure) portion (431, 433) in which a hole is formed and an extension portion (432) protruding to form a hole.

[0132] According to one embodiment, the support member (430) may include a second portion (432) extending in a first direction (-Z direction) from a first portion (431) and arranged on a wall (423) and a rod (422). The second portion (432) may be referred to as an extension portion (432). Hereinafter, for convenience of description, it is referred to as the second portion (432). The second portion (432) may be in contact with a peripheral surface (4232) of the terminal (420). The second portion (432) may be in contact with a bottom surface (4212) of the terminal (420). The second portion (432) may be in contact with a fourth surface (4221) of the rod. The second part (432) can completely fill the first space (424) by contacting the surfaces (e.g., the peripheral surface (4232)) of each of the walls surrounding the first space (424) of the terminal (420). The second part (432) can be formed to surround the rod (422). The second part (432) can be a circular structure or a square pillar with a hole formed therein, depending on the shape of the rod (422). However, the shape is not limited to the shape mentioned in the present disclosure and can be formed differently depending on the shape of the rod (422). The second part (432) can be adhered to the terminal (420) while filling the first space (424) of the terminal (420). The second part (432) can form a reaction force to an external force transmitted through the rod (422) and the wall (423).

[0133] According to one embodiment, the support member (430) may include a third portion (433) extending away from the first portion (431) in a direction away from the rod (422). The third portion (433) may be named as the support member (431, 433) or substantially the same as the support member (431, 433). Hereinafter, for convenience of description, it will be referred to as the third portion (433). The third portion (433) may extend in the first direction (-Z direction) and contact at least a portion of the outer surface (4231) of the wall (423). The third portion (433) may contact a printed circuit board (PCB) (e.g., 440 illustrated in FIG. 9). The third portion (433) may be a square column (or plate-shaped structure) or annular structure extending from the first portion (431) and including a hole.

[0134] According to one embodiment, the first supporting portion (431, 433) of the support member (430) may be substantially identical to the first portion (431) and the third portion (433). For example, the first portion (431) and the third portion (433) may be named the first supporting portion (431, 433) of the support member. The first supporting portion (431, 433) of the support member may contact a printed circuit board (e.g., printed circuit board (440) of FIG. 10) and a fourth surface (or outer surface of the pin body) (4221) of the rod (or pin body) (422). In the present disclosure, the first supporting portion (431, 433) may be named including the first portion (431) and the third portion (433). However, it should be noted that the present disclosure is not limited thereto.

[0135] In one embodiment, the support member (430) may include a second supporting portion (432). The second supporting portion (432) may be substantially identical to the second portion (432). For example, the second supporting portion (432) may be referred to as the second portion (432) of the support member (430). The second supporting portion (432) may extend from the first supporting portions (431, 433). The second support portion (432) may be extended into an inner space (424) of the conductive pin (or terminal) (420) defined by an outer surface (or fourth surface) (4221) of the pin body (or rod) (422) and an inner surface (4212, 4232) of the pin head (421, 423) concave in the first direction (-Z direction) to prevent the terminal (420) from being electrically separated from the printed circuit board (e.g., the printed circuit board (440) of FIG. 10) due to a repulsive force (resistance force) applied to the terminal (or conductive pin) (420) in a direction perpendicular to the first direction (-Z direction) and the direction (X-axis or Y-axis direction) when the pin head (421, 423) of the terminal assembly (e.g., the terminal assembly (401) of FIG. 10) is assembled toward the opening (411) of the side wall (410) from the inside of the housing. The inner surface (4212, 4232) of the pin head may be substantially identical to the configuration including the bottom surface (4212) and the peripheral surface (4232). For example, the bottom surface (4212) and the peripheral surface (423) may be named the inner surface (4212, 4232) of the pin head.

[0136] Hereinafter, the configurations of the support member (430) not described may be the same as the support member (430) described with reference to FIGS. 1 to 11b.

[0137] FIG. 13a is a conceptual diagram illustrating a cross-section of a terminal according to one embodiment of the present disclosure. FIG. 13b is a conceptual diagram illustrating a cross-section of a terminal according to one embodiment of the present disclosure.

[0138] The configurations described with reference to FIGS. 13a and 13b may be substantially the same as the configurations described with reference to FIGS. 1 to 12b. The configurations described with reference to FIGS. 13a and 13b may be substantially the same as the configurations described with reference to FIGS. 14 to 20. The embodiments of FIGS. 13a and 13b may be combined with the embodiments of FIGS. 14 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 12b.

[0139] According to one embodiment, the terminal (520a) may include a recess (5234a) formed in a wall (523a) surrounding a first space (e.g., 424 illustrated in FIG. 11B) of the terminal. The wall (523a) may include a first recess (5234a). The wall (523a) may include a first recess (5234a) that is recessed away from the rod (522a) and forms a portion of the peripheral surface (5232a). The first recess (5234a) may expand the first space (e.g., 424 illustrated in FIG. 11B) of the terminal (520a) in a direction away from the rod (522a). The first recess (5234a) may increase a coupling force with a support member (e.g., 532 illustrated in FIG. 14) coupled to the terminal (520a). The first recess (5234a) may be referred to as a recess.

[0140] According to one embodiment, the terminal (520b) may include a wall (523b) surrounding a first space of the terminal (e.g., 424 as shown in FIG. 11b) and a plurality of recesses (5234b, 5223b) formed in a rod (522b). The wall (523b) may include a first recess (5234b). The first recess (5234b) may include a plurality of first recesses (5234b). The plurality of first recesses (5234b) may be spaced apart from each other along a first direction (-Z direction). The rod (522b) may include a second recess (5223b). The rod (522b) may include a plurality of second recesses (5223b) that are sunken in an opposite direction to the plurality of first recesses (5234b). A support member (e.g., 530 illustrated in FIG. 14) can fill a plurality of first recesses (5234b) and second recesses (5223b) to increase the bonding force between the terminal (520b) and the support member (e.g., 530 illustrated in FIG. 14). The plurality of first recesses (5234b) and second recesses (5223b) may be referred to as a plurality of recesses (5234b, 5223b).

[0141] FIG. 14 is a conceptual diagram showing a cross-section of a terminal and a support member combined according to one embodiment of the present disclosure.

[0142] The configurations described with reference to FIG. 14 may be substantially the same as the configurations described with reference to FIGS. 1 to 13b. The configurations described with reference to FIG. 14 may be substantially the same as the configurations described with reference to FIGS. 15 to 20. The embodiments of FIG. 14 may be combined with the embodiments of FIGS. 15 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 13b.

[0143] According to one embodiment, the support member (530) can fill the first recess (5234c) in the terminal (520c). The support member (530) can fill the second recess (5223c) of the terminal (520c). The extension (or third portion) (532) of the support member (530) can fill the first recess (5234c). The extension (or third portion) (532) of the support member (530) can fill the second recess (5223c). The support member (530) can fill the plurality of recesses (5234c, 5223c) of the terminal (520c). The extension (or third portion) (523) of the support member (530) can fill a plurality of recesses (5234c, 5223c) of the terminal (520c). The support member (530) can fill a plurality of first recesses (5234c). The support member (530) can fill a plurality of second recesses (5223c). The extension (or third portion) (532) of the support member (530) can fill a plurality of first recesses (5234c). The extension (or third portion) (523) of the support member (530) can fill a plurality of second recesses (5223c). The support member (530) can fill a plurality of recesses (e.g., the first recess (5234c) and the second recess (5223c)) to enhance the bonding strength between the support member (530) and the terminal (523c).

[0144] Configurations not described below may be substantially the same as those described with reference to FIGS. 1 to 13b.

[0145] FIG. 15 is a perspective view of a terminal, a support member, and a waterproof member combined according to one embodiment of the present disclosure.

[0146] The configurations described with reference to FIG. 15 may be substantially the same as the configurations described with reference to FIGS. 1 to 14. The configurations described with reference to FIG. 15 may be substantially the same as the configurations described with reference to FIGS. 16 to 20. The embodiments of FIG. 15 may be combined with the embodiments of FIGS. 16 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 14.

[0147] According to one embodiment, an electronic device (e.g., 301 illustrated in FIG. 5) may include a support member (630). The electronic device (e.g., 301 illustrated in FIG. 5) may include a waterproof member (650). The electronic device (e.g., 301 illustrated in FIG. 5) may include a terminal (620). The terminal (620), the support member (630), and the waterproof member (650) may form a terminal assembly (e.g., 401 illustrated in FIG. 10).

[0148] According to one embodiment, the waterproofing member (650) may have a structure in which a plurality of waterproofing members (650) are connected. The waterproofing members (650) may be connected through a connection structure (652). The waterproofing member (650) may have an annular structure surrounding the terminal (620). The waterproofing member (650) may be formed to surround a wall (e.g., 423 shown in FIG. 10) of the terminal (620). The waterproofing member (650) may be in contact with at least a portion of an outer surface (e.g., 4231 shown in FIG. 11B) of the wall (e.g., 423 shown in FIG. 10). The waterproofing member (650) may be a square pillar (or plate-shaped structure) including a hole corresponding to the area of ​​the support member (630). The waterproof member (650) can be in contact with a side wall (e.g., 410 as shown in FIG. 9) to block substances from flowing in through an opening (e.g., 411 as shown in FIG. 9).

[0149] Hereinafter, the configurations of the waterproof member (650) not described may be substantially the same as the waterproof member (e.g., 450 illustrated in FIG. 9) described with reference to FIGS. 1 to 13b.

[0150] FIG. 16 is a diagram illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure. FIG. 17 is a diagram illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure. FIG. 18 is a diagram illustrating a method for manufacturing an electronic device according to one embodiment of the present disclosure.

[0151] The configurations described with reference to FIGS. 16 and 18 may be substantially the same as the configurations described with reference to FIGS. 1 to 15. The configurations described with reference to FIGS. 16 and 18 may be substantially the same as the configurations described with reference to FIGS. 19 to 20. The embodiments of FIGS. 16 and 18 may be combined with the embodiments of FIGS. 19 to 20. Configurations not described below may be substantially the same as the configurations of FIGS. 1 to 15.

[0152] According to one embodiment, a method (900, 1000) for manufacturing an electronic device (e.g., 301 as shown in FIG. 5) may include an operation (901, 1001) of providing a terminal. The operation (901, 1001) of providing a terminal may provide a terminal (920) including a first end portion (921) facing a first direction (-Z direction). The operation (901, 1001) of providing a terminal may provide a terminal including a rod (922) protruding from the first end portion (921) in a second direction (+Z direction). The operation (901, 1001) of providing a terminal may provide a terminal including a wall (923) extending from an edge of the first end portion (921) in the second direction (+Z direction) and surrounding the rod (922). The act of providing a terminal (901, 1001) may provide a terminal (920) comprising a first end (921), a rod (922) and a wall (923).

[0153] According to one embodiment, a method (900, 1000) for manufacturing an electronic device (e.g., 301 as shown in FIG. 5) may include an operation (902, 1002) of filling an adhesive member (930) into a space between a wall (923) and a rod (922). The operation (902, 1002) of filling the adhesive member (930) may be an operation of bonding the adhesive member (930) to the wall (923) and the rod (922). The operation (902, 1002) of filling the adhesive member (930) may be an operation of filling a molding liquid substantially identical thereto with a resin.

[0154] According to one embodiment, a method (900, 1000) for manufacturing an electronic device (e.g., 301 as shown in FIG. 5) may include an operation (903, 1003) of contacting an adhesive member (930) to surround at least a portion of a rod (922). The method (900, 1000) for manufacturing an electronic device (e.g., 301 as shown in FIG. 5) may include an operation (903, 1003) of extending the contacted support member (933) away from the protrusion and in a third direction (Y direction) perpendicular to the first direction (-Z direction).

[0155] According to one embodiment, a method (1000) for manufacturing an electronic device (e.g., 301 illustrated in FIG. 5) may include an operation of forming a waterproof member (950). The method (1000) for manufacturing an electronic device (e.g., 301 illustrated in FIG. 5) may include an operation (1004) of forming a waterproof member (950) that surrounds at least a portion of an outer surface (e.g., 4231 illustrated in FIG. 11B) of a wall (920) and is in contact with an adhesive member (930).

[0156] According to one embodiment, a method (1000) for manufacturing an electronic device (e.g., 301 as shown in FIG. 5) may include an operation (1005) of bonding a printed circuit board. The method (1000) for manufacturing an electronic device (e.g., 301 as shown in FIG. 5) may include an operation (1005) of arranging at least a portion of a rod (922) of a terminal in a hole of a printed circuit board (940) including a hole, and bonding or bonding the printed circuit board (940) to an adhesive member (930).

[0157] FIG. 19 is a diagram illustrating a method for manufacturing a terminal of an electronic device according to one embodiment of the present disclosure. FIG. 20 is a diagram illustrating a method for manufacturing a terminal of an electronic device according to one embodiment of the present disclosure.

[0158] Referring to FIG. 19, a method for manufacturing a terminal may be an operation for forming a terminal by etching a cylindrical or hexahedral structure (1020a). The method for manufacturing a terminal may include an operation (1101a) for providing a base material (1020a) capable of transmitting an electrical connection signal. The method for manufacturing a terminal may include a first etching operation (1102a) for etching the base material (1020a) from both sides. By etching the base material (1020a), the base material (1020a) may include a protruding portion (or rod) (1022a). The base material (1020a) may include a first etching surface (10201a) through the etching. The method for manufacturing a terminal may include a second etching operation (1103a) for etching a portion of the etching surface (10201a). A second etching operation (1103a) for etching the etching surface (10201a) may form a wall (or wall) (1023a) that is different from the rod (or uneven portion) formed in the first etching operation (1102a). The base material (1020a) may include a second etching surface (10202a) that forms the bottom of a space surrounded by a portion of the rod (1022a) formed through the first etching operation and the wall (1023a) formed through the second etching operation. The method for manufacturing a terminal may include a final etching operation (1104a). The base material (1020a) that has undergone the final etching operation (1104a) may include a first end portion (1021a), a rod (1022a) protruding from the center of the first end portion (1021a), and a wall (1023a) surrounding the rod (1022a) and connected to the first end portion (1021a) at the edge of the first end portion (1021a). A method for manufacturing a terminal may form a recess (e.g., 5234a in FIG. 13a) in the terminal by etching perpendicular to the etching directions of the first etching operation and the second etching operation.

[0159] According to one embodiment, a method for manufacturing a terminal may be formed by filling a molten metal material into a mold. Referring to FIG. 20, the method for manufacturing a terminal may include an operation (1101b) of providing a mold (1101b) having an internal space (1111b) formed therein. The method for manufacturing a terminal may include a first filling operation of filling a molten metal member (1120b) into the internal space (1111b) of the mold (1101b). The metal member (1120b) may form a first end portion (1121b) forming a bottom of the terminal in the internal space of the mold (1110b). The method for manufacturing a terminal may include a second filling operation (1103b) of filling a rod (1122b) and a wall (1123b) after forming the first end portion. By the second filling operation (1103b), the metal member (1120b) can form a terminal including a first end portion (1121b), a rod (1122b) extending and protruding from the first end portion (1121b), and a wall (1123b) formed to surround the rod (1122b) extending from an edge of the first end portion (1121b). A method for manufacturing the terminal can form a terminal in which a recess (e.g., 5234a in FIG. 13a) is formed by forming a recess in a portion of a surface surrounding an internal space of the mold (1110b).

[0160] According to one embodiment of the present disclosure, a terminal (e.g., 420 of FIG. 10) includes an internal empty space (e.g., 424 of FIG. 11b) and can be coupled to the interior of an electronic device through a supporting member (e.g., 430 of FIG. 10) filled therein.

[0161] According to one embodiment of the present disclosure, a terminal (e.g., 420 of FIG. 10) forms an empty space (e.g., 424 of FIG. 11b) in the terminal (e.g., 420 of FIG. 10) through a wall (e.g., 423 of FIG. 10), a first end (e.g., 421 of FIG. 10) and a rod (e.g., 423 of FIG. 10), thereby increasing a movement path of a substance flowing in from the outside, thereby blocking the inflow of an external substance through an opening (e.g., 411 illustrated in FIG. 9).

[0162] According to one embodiment of the present disclosure, a terminal assembly (401) can be assembled while being fixedly fixed within a housing (e.g., 310 of FIG. 6) of an electronic device, with a terminal (e.g., 420 of FIG. 10) having an internal space (e.g., 424 of FIG. 11b) secured therein.

[0163] According to one embodiment of the present disclosure, the terminal assembly (401) can be fixed when coupled with an external electronic device (e.g., 402 of FIG. 5).

[0164] According to one embodiment of the present disclosure, a terminal (e.g., 420 of FIG. 10) is fixed when coupled with an external electronic device (e.g., 402 of FIG. 5) and can transmit an electrical connection signal to a printed circuit board (e.g., 440 of FIG. 10) via a rod (e.g., 422 of FIG. 10).

[0165] According to one embodiment of the present disclosure, a terminal (e.g., 420 of FIG. 10) may include a recess (e.g., 5234a, 5223b of FIGS. 13a to 13c) in a wall (e.g., 523a of FIGS. 13a to 13c) or a rod (e.g., 522a of FIGS. 13a to 13c) of the terminal to enhance bonding strength with the support member (e.g., 430 of FIG. 10).

[0166] According to one embodiment of the present disclosure, a terminal (e.g., 420 of FIG. 10) may be fixed by offsetting an external force applied to the terminal (e.g., 420 of FIG. 10) by bonding a support member (e.g., 430 of FIG. 10) to fill a first interspace (e.g., 424 of FIG. 11b) and surrounding a portion of a rod (e.g., 422 of FIG. 10) and a wall (e.g., 423 of FIG. 10).

[0167] According to one embodiment of the present disclosure, a terminal (e.g., 420 in FIG. 10) can be fixed to increase connection stability with a printed circuit board (e.g., 440 in FIG. 10).

[0168] According to one embodiment of the present disclosure, a terminal (e.g., 420 of FIG. 10) can be fixed to increase bonding strength with a waterproof member (e.g., 450 of FIG. 10).

[0169] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0170] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may include a housing (e.g., 310 of FIG. 6) including a side wall (e.g., 410 of FIG. 6) having an opening (e.g., 411 of FIG. 9) formed therein.

[0171] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may include a printed circuit board (e.g., 440 of FIG. 10) disposed inside the housing.

[0172] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may include a terminal (e.g., 420 of FIG. 10) disposed on one side of the printed circuit board (e.g., 440 of FIG. 10).

[0173] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may include a support member (e.g., 430 of FIG. 10) disposed between the printed circuit board and the terminal and including a support portion (e.g., 431, 433 of FIG. 10) in contact with one side of the printed circuit board.

[0174] According to one embodiment of the present disclosure, the terminal (e.g., 420 of FIG. 9) of the electronic device (e.g., 301 of FIG. 6) may include a first end portion (e.g., 421 of FIG. 10) spaced apart from one side of the printed circuit board in a first direction away from the printed circuit board, at least a portion of which is disposed in the opening (e.g., 411 of FIG. 9).

[0175] According to one embodiment of the present disclosure, the terminal (e.g., 420 of FIG. 9) of the electronic device (e.g., 301 of FIG. 6) may include a rod (e.g., 422 of FIG. 10) extending from the first end to a second end that contacts one side of the printed circuit board in a second direction opposite to the first direction.

[0176] According to one embodiment of the present disclosure, the terminal (e.g., 420 of FIG. 9) of the electronic device (e.g., 301 of FIG. 6) may include a wall (e.g., 423 of FIG. 10) extending parallel to the second direction from the first end and configured to surround the rod.

[0177] According to one embodiment of the present disclosure, the support member of the electronic device (e.g., 301 of FIG. 6) may include an extension (e.g., 432 of FIG. 10) extending from the support member and positioned between the wall and the rod.

[0178] According to one embodiment of the present disclosure, a rod of an electronic device (e.g., 301 of FIG. 6) may be extended by a first extension distance and electrically connected to the printed circuit board.

[0179] According to one embodiment of the present disclosure, a wall of an electronic device (e.g., 301 of FIG. 6) may be extended by a second extension distance (L2) that is smaller than the first extension distance (L1).

[0180] According to one embodiment of the present disclosure, a support portion of an electronic device (e.g., 301 of FIG. 6) extends in a third direction that is perpendicular to the first direction and away from the rod, and at least a portion of the support portion can contact at least a portion of an outer surface of the wall (e.g., 4231 of FIG. 11b) facing the third direction.

[0181] According to one embodiment of the present disclosure, an extension of an electronic device (e.g., 301 of FIG. 6) may extend from the support in the first direction to fill a space between the wall and the rod.

[0182] According to one embodiment of the present disclosure, a printed circuit board of an electronic device (e.g., 301 of FIG. 6) includes a hole (4401 of FIG. 9) and a first surface (e.g., 4402 of FIG. 9) surrounding the hole, and at least a portion of a rod is disposed in the hole and can be in contact with the first surface.

[0183] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may further include a bracket (e.g., 460 of FIG. 8b) disposed inside the housing and coupled to the printed circuit board.

[0184] According to one embodiment of the present disclosure, a wall (e.g., 523a, 523b of FIGS. 13a and 13b) of an electronic device (e.g., 301 of FIG. 6) may include a peripheral surface facing the rod (e.g., 5232a, 5232b of FIGS. 13a and 13b) and a first recess (e.g., 5234a, 5234b of FIGS. 13a and 13b) that is recessed in a direction away from the rod and forms a part of the peripheral surface.

[0185] According to one embodiment of the present disclosure, a first recess of an electronic device (e.g., 301 of FIG. 6) may include a plurality of first recesses (e.g., 5234b of FIGS. 13a and 13b) spaced apart from each other along the first direction.

[0186] According to one embodiment of the present disclosure, a rod (e.g., 522a, 522b of FIGS. 13a and 13b) of an electronic device (e.g., 301 of FIG. 6) may include a plurality of second recesses (e.g., 5223b of FIGS. 13a and 13b) sunken in an opposite direction to the plurality of first recesses.

[0187] According to one embodiment of the present disclosure, the extension (e.g., 532 of FIG. 14) of the support member (e.g., 530 of FIG. 14) of the electronic device (e.g., 301 of FIG. 6) can fill the first recesses (e.g., 5234c of FIG. 14) and the second recesses (e.g., 5223b of FIG. 14).

[0188] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may include a waterproof member (e.g., 450 of FIG. 10) disposed between a support member and the side wall.

[0189] According to one embodiment of the present disclosure, a waterproof member of an electronic device (e.g., 301 of FIG. 6) may be in contact with at least a portion of an outer surface of the wall (e.g., 4231 of FIG. 10b) facing away from the rod.

[0190] According to one embodiment of the present disclosure, the waterproof member of the electronic device (e.g., 301 of FIG. 6) may be in contact with at least a portion of the support member and surround the wall of the terminal.

[0191] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) includes a terminal assembly (e.g., 401 of FIG. 10) including the terminal, the printed circuit board, the support member, and the waterproof member, and the terminal assembly can be coupled to the side wall such that at least a portion of the terminal is positioned in the opening of the side wall.

[0192] According to one embodiment of the present disclosure, a side wall of an electronic device (e.g., 301 of FIG. 6) may include a plurality of openings, and the terminal may include a plurality of terminals disposed in each of the plurality of openings.

[0193] According to one embodiment of the present disclosure, a side wall of an electronic device (e.g., 301 of FIG. 6) includes a third surface (e.g., 4211 of FIG. 10b) facing outside the housing, and the first end of the terminal may be disposed in the opening at a first distance (e.g., D1 of FIG. 9) from the third surface toward the inside of the housing.

[0194] According to one embodiment of the present disclosure, a terminal of an electronic device (e.g., 301 of FIG. 6) may include a circular first end portion and a cylindrical wall extending from an edge of the first end portion and surrounding the rod.

[0195] According to one embodiment of the present disclosure, a support member of an electronic device (e.g., 301 of FIG. 6) can fill an internal space between the first end of the circle and the cylindrical wall.

[0196] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) may include an operation of providing a terminal (e.g., 901 of FIG. 16) including a first end facing a first direction, a rod protruding from the first end in a second direction opposite to the first direction, and a wall extending from an edge of the first end in the second direction and surrounding the rod.

[0197] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) may include an operation of filling an adhesive material between the wall and the rod (e.g., 902 of FIG. 16).

[0198] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) may include an operation of contacting the adhesive member to surround at least a portion of the rod, and extending the adhesive member in a third direction perpendicular to the first direction away from the contacted portion and away from the rod (e.g., 903 of FIG. 16).

[0199] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) may include an operation of forming a waterproof member (e.g., 1004 of FIG. 17) surrounding at least a portion of an outer surface of the wall facing the third direction and in contact with the adhesive member.

[0200] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) may include an operation of bonding a printed circuit board including a hole such that at least a portion of the rod is positioned in the hole and the printed circuit board is in contact with the adhesive member (e.g., 1005 of FIG. 17).

[0201] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) may include an operation of coupling a terminal assembly, in which the terminal assembly comprises a combined printed circuit board, an adhesive member, and a waterproof member, to the side wall such that at least a portion of the terminal is positioned in the opening.

[0202] According to one embodiment of the present disclosure, a method of manufacturing an electronic device (e.g., 301 of FIG. 6) (e.g., 1000 of FIG. 17) includes an operation of forming a first recess in an inner surface of the wall facing the rod, the first recess being sunken in a direction away from the rod; and an operation of forming a second recess in a first surface of the rod facing the wall, and the adhesive member may further include an operation of filling the first recess and the second recess.

[0203] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) may include a side wall (e.g., 410 of FIG. 6) having an opening (e.g., 411 of FIG. 9) formed therein, and may include a housing (e.g., 310 of FIG. 6) configured to form an exterior of the electronic device.

[0204] According to one embodiment of the present disclosure, an electronic device (e.g., 301 of FIG. 6) is an assembly (e.g., 401 of FIG. 10), comprising a printed circuit board (e.g., 440 of FIG. 10), a pin body (e.g., 422 of FIG. 11B), and a pin head (e.g., 421, 423 of FIG. 11B) disposed inside a housing, a conductive pin (e.g., 420 of FIG. 9), wherein a first end (e.g., 4222 of FIG. 11B) of the pin body is electrically connected to the printed circuit board, a second end (e.g., 421 of FIG. 11B) of the pin body faces a first direction opposite to the first end and extends to the pin head, and an outer surface (e.g., 4211 of FIG. 11B) of the pin head is electrically connectable to an external device (e.g., 402 of FIG. 5) of the side wall. An assembly including an outer surface of the conductive pin and the pin body (e.g., 4221 of FIG. 11b) exposed to the outside of the electronic device through the opening and a first support portion (e.g., 431, 433 of FIG. 10) in contact with the printed circuit board, a second support portion (e.g., 423 of FIG. 10) extending from the first support portion to an inner space of the conductive pin (e.g., 424 of FIG. 11b) defined by an outer surface of the pin body (e.g., 4221 of FIG. 11b) and an inner surface of the pin head (e.g., 4212, 4232 of FIG. 11b) concave in the first direction, in order to prevent the conductive pin from being electrically separated from the printed circuit board when the pin head is assembled toward the opening of the side wall from the inside of the housing due to a repulsive force applied to the conductive pin in a direction perpendicular to the first direction, wherein the second support portion (e.g., 423 of FIG. 10) is in contact with the outer surface of the pin body and the pin head is assembled toward the opening of the side wall from the inside of the housing. Can be.

[0205] According to one embodiment of the present disclosure, a pin head (e.g., 421, 423 of FIG. 11B) of an electronic device (e.g., 301 of FIG. 6) may include a pin head plate (e.g., 421 of FIG. 11B) disposed at least partially in the opening of the side wall and including an outer surface of the pin head, and a pin head wall (e.g., 423 of FIG. 11B) extending from the pin head plate in a second direction opposite to the first direction and configured to surround a portion of the pin body together with an inner space between the conductive pins.

[0206] According to one embodiment of the present disclosure, the pin head and the pin body of the electronic device (e.g., 301 of FIG. 6) may be formed integrally.

[0207]

Claims

1. In the electronic device (301), A housing (310) including a side wall (410) having an opening (411) formed therein; A printed circuit board (440) placed inside the housing; Terminals (420; 520a, 520b, 520c; 620, 920) arranged on one side of the printed circuit board; and A support member (430; 530; 630) is disposed between the printed circuit board and the terminal and includes a support member (431, 433; 531, 533) in contact with one side of the printed circuit board, The above terminal A first end portion (421; 521a, 521b, 521c; 921; 1021) spaced apart from one side of the printed circuit board in a first direction away from the printed circuit board, at least part of which is disposed in the opening; A rod (422; 522a, 522b, 522c; 922) extending from the first end portion to a second end portion (4222; 5222a, 5222b, 5222c; 9222) in contact with one side of the printed circuit board in a second direction opposite to the first direction, and A wall (423; 523a, 523b, 523c; 923) extending parallel to the second direction from the first end and configured to surround the rod, An electronic device in which the support member includes an extension (432; 532) extending from the support member parallel to the first direction and positioned between the wall and the rod.

2. In paragraph 1, The above rod is extended by a first extension distance (L1) and is electrically connected to the printed circuit board, An electronic device in which the wall is extended by a second extension distance (L2) that is smaller than the first extension distance (L1).

3. In paragraph 1 or 2, The support extends in a third direction that is perpendicular to the first direction and away from the rod, and at least a portion of the support contacts at least a portion of the outer surface (4231) of the wall facing the third direction. An electronic device in which the extension extends from the support in the first direction and fills a space between the wall and the rod.

4. In any one of paragraphs 1 to 3, The printed circuit board includes a hole (4401) and a first surface (4402) surrounding the hole, An electronic device wherein at least a portion of the rod is placed in the hole and is in contact with the first surface.

5. In any one of paragraphs 1 to 4, An electronic device further comprising a bracket (460) disposed inside the housing and coupled to the printed circuit board.

6. In any one of paragraphs 1 to 5, An electronic device wherein the wall comprises a peripheral surface (5232a, 5232b) facing the rod and a first recess (5234a, 5234b) recessed in a direction away from the rod and forming a part of the peripheral surface.

7. In paragraph 6, The first recess includes a plurality of first recesses (5234b) spaced apart from each other along the first direction, An electronic device in which the rod includes a plurality of second recesses (5223b) that are sunken in a direction opposite to the direction in which the plurality of first recesses are recessed.

8. In paragraph 7, An electronic device in which the extension portion (532) of the support member (530) fills the first recesses (5234c) and the second recesses (5223c).

9. In any one of paragraphs 1 to 8, The electronic device includes a waterproof member (450; 650) disposed between the support member and the side wall, An electronic device in which the waterproof member is in contact with at least a portion of the outer surface (4231: 5231a, 5231b, 5231c) of the wall facing away from the rod.

10. In paragraph 9, An electronic device wherein the waterproof member is in contact with at least a portion of the support member and surrounds the wall of the terminal.

11. In paragraph 9, The electronic device includes a terminal assembly (401) including the terminal, the printed circuit board, the support member, and the waterproof member, An electronic device wherein the terminal assembly is coupled to the side wall such that at least a portion of the terminal is positioned in the opening of the side wall.

12. In any one of paragraphs 1 to 11, The side wall includes a plurality of openings, An electronic device comprising a plurality of terminals arranged in each of the plurality of openings.

13. In any one of paragraphs 1 to 12, The side wall includes a third surface (4211; 5211a, 5211b, 5211c) facing the outside of the housing, An electronic device in which the first end of the terminal is positioned in the opening at a first distance (D1) from the third surface toward the inside of the housing.

14. In any one of paragraphs 1 to 13, The above terminal the first end of the circle; and comprising a cylindrical wall extending from the edge of the first end and surrounding the rod; An electronic device wherein the support member fills an internal space between the first end of the circle and the cylindrical wall.

15. In a method for manufacturing an electronic device (900; 1000), An operation (901) of providing a terminal including a first end facing a first direction, a rod protruding from the first end in a second direction opposite to the first direction, and a wall extending from an edge of the first end in the second direction and surrounding the rod; An operation (902) of filling an adhesive material between the wall and the rod; and A method for manufacturing an electronic device, comprising the step of contacting the adhesive member to surround at least a portion of the rod and extending the adhesive member in a third direction perpendicular to the first direction away from the contacted portion.

Images