Systems and methods for reducing fogging of an optical surface of an imaging device

Abstract

A system (200) comprises a resistor (210) configured to couple to an optical surface. The resistor generates heat to heat the optical surface in response to receiving a first electrical signal from a power source. The system further comprises a sensing module (220) connected to the resistor via at least two sensing wires (250, 252). The sensing module is configured to determine a resistance of the resistor in response to providing a second electrical signal to the resistor, determine a temperature of the resistor based on the resistance of the resistor, and determine a temperature of the optical surface based on the temperature of the resistor. The system further comprises at least one switch (240) electrically connected to the resistor and the sensing module. The switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

Description

SYSTEMS AND METHODS FOR REDUCING FOGGING OF AN OPTICAL SURFACE OF AN IMAGING DEVICECROSS-REFERENCED APPLICATIONS

[0001] This application claims priority to and the benefit of U.S. Provisional Application No. 63 / 677,191, filed July 30, 2024, and entitled “Systems and Methods for Reducing Fogging of an Optical Surface of an Imaging Device,” which is incorporated by reference herein in its entirety.FIELD

[0002] Examples described herein relate to imaging devices for conducting an image-guided procedure and more particularly to systems and methods for maintaining visibility while the imaging device is inserted within a patient anatomy.BACKGROUND

[0003] Minimally invasive medical techniques are intended to reduce the amount of tissue that is damaged during medical procedures, thereby reducing patient recovery time, discomfort, and harmful side effects. Such minimally invasive techniques may be performed through natural orifices in a patient anatomy or through one or more surgical incisions. Through these natural orifices or incisions, an operator may insert minimally invasive medical tools to reach a target tissue location. Minimally invasive medical tools include instruments such as therapeutic, diagnostic, biopsy, and surgical instruments. Minimally invasive medical tools may be coupled to drive systems that drive the minimally invasive medical tools. During the performance of a medical procedure, it is useful to view two-dimensional and / or three-dimensional live images of the surgical site captured by an imaging device positioned within the patient anatomy. Often the optical surface (e.g., the imaging window) of the imaging device becomes fogged due to the environmental conditions within the patient anatomy. A heating system for imaging devices is needed that reduces fogging of the optical surface to allow for recording of a clear image.SUMMARY

[0004] Various features may allow for condensation (e.g., fog) to be removed from an optical surface of an imaging device by using a heating system to heat the optical surface. The heating system is dynamically controlled to keep the optical surface free of fog or to quickly clear fog fromthe optical surface. The following presents a simplified summary of various examples described herein and is not intended to identify key or critical elements or to delineate the scope of the claims.

[0005] Consistent with some examples, a system is provided. The system includes a resistor configured to couple to an optical surface. The resistor generates heat to heat the optical surface in response to receiving a first electrical signal from a power source. The system further includes a sensing module connected to the resistor via at least two sensing wires. The sensing module is configured to determine a resistance of the resistor in response to providing a second electrical signal to the resistor; determine a temperature of the resistor based on the resistance of the resistor; and determine a temperature of the optical surface based on the temperature of the resistor. The system further includes at least one switch electrically connected to the resistor and the sensing module. The at least one switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

[0006] Consistent with other examples, a system is provided. The system includes a resistor configured to couple to an optical surface. The resistor generates heat to heat the optical surface in response to receiving a first electrical signal. The system further includes a sensing module electrically connected to the resistor. The sensing module is configured to determine a resistance of the resistor in response to a second electrical signal being received by the resistor; and determine a temperature of the optical surface based on the resistance of the resistor. The system further includes at least one switch electrically connected to the resistor and the sensing module. The at least one switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

[0007] Consistent with other examples, a system is provided. The system includes an imaging device including an optical surface. The system further includes a resistor configured to couple to the optical surface. The resistor generates heat to heat the optical surface in response to receiving a first electrical signal. The system further includes a sensing module electrically connected to the resistor. The sensing module is configured to determine a resistance of the resistor in response to providing a second electrical signal to the resistor; and determine a temperature of the optical surface based on the resistance of the resistor. The system further includes at least one switch electrically connected to the resistor and the sensing module. The at least one switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

[0008] Consistent with other examples, a method is provided. The method includes passing a current across a resistor that is coupled to an optical surface. The method further includes determining a resistance of the resistor and determining a temperature of the optical surface based on the resistance of the resistor. The method further includes controlling the current across the resistor based on the temperature of the optical surface to control a temperature of the optical surface.

[0009] Consistent with other examples, a method is provided. The method includes coupling a resistor to an optical surface. The resistor generates heat to heat the optical surface in response to receiving a first electrical signal from a power source. The method further includes forming the resistor into a pattern that causes a resistance of the resistor to be output within a threshold resistance range when the first electrical signal is received by the resistor. The method further includes connecting the resistor to a sensing module. The sensing module is configured to determine a resistance of the resistor in response to a second electrical signal being provided to the resistor; determine a temperature of the resistor based on the resistance of the resistor; and determine a temperature of the optical surface based on the temperature of the resistor.

[0010] Other examples include corresponding computer systems, apparatus, and computer programs recorded on one or more computer storage devices, each configured to perform the actions of any one or more methods described below.

[0011] It is to be understood that both the foregoing general description and the following detailed description are illustrative and explanatory in nature and are intended to provide an understanding of the various examples described herein without limiting the scope of the various examples described herein. In that regard, additional aspects, features, and advantages of the various examples described herein will be apparent to one skilled in the art from the following detailed description.BRIEF DESCRIPTIONS OF THE DRAWINGS

[0012] FIG. 1 illustrates an imaging device with an optical surface and a heating system for removing condensation from the optical surface according to some examples.

[0013] FIG. 2 illustrates a heating system for removing condensation from an optical surface of an imaging device according to some examples.

[0014] FIG. 3 A illustrates a flow path of an electrical signal when the heating system of FIG. 2 is in a heating mode according to some examples.

[0015] FIG. 3B illustrates a flow path of an electrical signal when the heating system of FIG. 2 is in a sensing mode according to some examples.

[0016] FIG. 3C illustrates an alternative heating system for removing condensation from an optical surface of an imaging device according to some examples.

[0017] FIG. 4A illustrates an exploded image of components of an imaging device according to some examples.

[0018] FIG. 4B illustrates a distal tip of an imaging device with a resistor coupled to an optical surface according to some examples.

[0019] FIG. 5 illustrates a cross-sectional side view of an imaging device according to some examples.

[0020] FIG. 6 is a flowchart illustrating a method of using a heating system to remove condensation from an optical surface of an imaging device according to some examples.

[0021] FIG. 7 is a flowchart illustrating a method of manufacturing a resistor of a heating system for removing condensation from an optical surface of an imaging device according to some examples.

[0022] FIG. 8 illustrates a front view of a distal tip of an imaging device with a resistor coupled to an optical surface of the imaging device according to some examples.

[0023] FIG. 9 is a simplified diagram of a computer-assisted, teleoperated system according to some examples.

[0024] FIG. 10 is a simplified diagram of a medical instrument system according to some examples.

[0025] FIG. 11 is a simplified diagram of a medical system according to some examples.

[0026] Various examples described herein and their advantages are described in the detailed description that follows. It should be appreciated that like reference numerals are used to identify like elements illustrated in one or more of the figures for purposes of illustrating but not limiting the various examples described herein.DETAILED DESCRIPTION

[0027] In the following description, specific details describe some examples consistent with the present disclosure. Numerous specific details are set forth in order to provide a thorough understanding of the examples. It will be apparent to one skilled in the art, however, that some examples may be practiced without some or all of these specific details. The specific examples disclosed herein are meant to be illustrative but not limiting. One skilled in the art may realize other elements that, although not specifically described, are within the scope and the spirit of this disclosure. In addition, to avoid unnecessary repetition, one or more features shown and described in association with one example may be incorporated into other examples unless specifically described otherwise or if the one or more features would make an example non-functional. In some instances, well known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the examples.

[0028] An optical surface, such as a window of an imaging device (e.g., an endoscope), may start to fog during a medical procedure. The optical surface can be heated to clear the fog. In some examples, the imaging device includes a heating system that is dynamically controlled to maintain a temperature of the optical surface within a target temperature range. Maintaining the temperature of the optical surface within the target temperature range may help keep the optical surface free of fog. If fog forms on the optical surface, maintaining the temperature of the optical surface within the target temperature range may allow the heating system to quickly clear the fog from the optical surface. In some examples, the heating system dynamically switches between a heating mode and a sensing mode to maintain the temperature of the optical surface within the target temperature range.

[0029] FIG. 1 illustrates an imaging device 100. The imaging device 100 includes a body portion 110, an optical surface 120, and a heating system 130. In some examples, the body portion 110 is an elongate body. The optical surface 120 is positioned at a distal end 112 of the body portion 110. In some examples, the optical surface 120 is a viewing window. In some examples, all components of the heating system 130 are disposed within the body portion 110 or a combination of the body portion 110 and the optical surface 120. In other examples, one or more components of the heating system 130 protrude out of and / or are positioned outside of the imaging device 100.

[0030] The body portion 1 10 fully or partially encloses components of the imaging device 100. In examples when the imaging device 100 is an endoscopic imaging device, the body portion 110 is a shaft of the endoscopic imaging device. More generally, the body portion 110 is sufficiently small to accommodate insertion / retraction of the imaging device 100 through anatomical ports and / or anatomical passageways in a patient anatomy. The body portion 110 may be formed using a rigid tube or may be flexible. In some examples, one or more sections of the body portion 110 are rigid and one or more other sections of the body portion 110 are flexible. A cross-section of the body portion 110 may be ellipsoidal, circular, polygonal, and / or any other suitable shape. In some examples, the width and / or the shape of the body portion 110 may vary along its length. Although components of the imaging device 100 are generally disposed within the body portion 110, one or more components may protrude from the sides of the body portion 110 and / or out of the distal end 112 of the body portion 110.

[0031] In some examples, the optical surface 120 is a generally transparent window. The optical surface 120 may be mounted to the distal end 112 of the body portion 110 or may be fitted within a metal housing (not shown), which is mounted at the distal end 112 of the body portion 110. The optical surface 120 may be formed of a glass or a polymer material. In some examples, the imaging device 100 is a binocular imaging device that includes one or more optical components (not shown) that receive illumination (e.g., light and / or other electromagnetic signals) from a scene and project a pair of images onto an image sensor (not shown). The optical components may include one or more lenses, mirrors, apertures, filters, prisms, polarizers, and / or the like to achieve desired image characteristics (e.g., focal length and / or spectral characteristics).

[0032] To prevent fogging of the optical surface 120 or to remove or reduce the accumulation of condensation (e.g., fog) on the optical surface 120, the heating system 130 may apply heat to the optical surface 120. FIG. 2 illustrates a heating system 200 for removing condensation from an optical surface (e.g., the optical surface 120) of an imaging device (e.g., the imaging device 100). In some examples, the heating system 200 is the heating system 130. The heating system 200 includes a resistor 210 (e.g., a resistance temperature detector), a sensing module 220, a power source 230, at least one switch 240, at least two sensing wires 250, 252, and a switch 262. The sensing module 220 may be a circuit and / or a processing system including a circuit. When the switch 262 is in a closed position and thereby connected to the ground 260, the heating system 200 is in an active state. When the switch 262 is in an open position and thereby disconnected fromthe ground 260, the heating system 200 is in an inactive state. The switch 262 can therefore provide a redundant safety feature to deactivate the heating system 200 in certain situations, as discussed in greater detail below.

[0033] The resistor 210 includes an input portion 212 and an output portion 214. The heating system 200 also includes a wire 216 extending between the switch 240 and the input portion 212 of the resistor 210, and a wire 218 extending between the output portion 214 of the resistor 210 and a ground 260. The wire 218 extends between the output portion 214 of the resistor 210 and the switch 262, which is selectively connectable to the ground 260. The sensing wire 250 extends between the sensing module 220 and the wire 216. The sensing wire 252 extends between the sensing module 220 and the wire 218. The heating system 200 also includes a wire 232 extending between the power source 230 and a switch terminal 242. The heating system 200 also includes a wire 222 extending between the sensing module 220 and a switch terminal 244. The switch terminal 242 is a heating mode terminal, and the switch terminal 244 is a sensing mode terminal, which will be described in greater detail below. The heating system 200 also includes a wire 224 extending between the sensing module 220 and the ground 260. The wire 224 extends between the sensing module 220 and the switch 262, which is selectively connectable to the ground 260.

[0034] When the switch 240 is connected to the switch terminal 242, the heating system 200 is in a heating mode. When the switch 240 is connected to the switch terminal 244, the heating system 200 is in a sensing mode. When the heating system 200 is in the heating mode, heat is generated by the resistor 210. The heat generated by the resistor 210 heats the optical surface (e.g., the optical surface 120) to remove condensation from the optical surface. When the heating system 200 is in the sensing mode, a detectable voltage is generated by the resistor 210, but the resistor 210 does not generate enough heat to remove condensation from the optical surface. The sensing module 220 senses the voltage generated by the resistor 210 and determines a resistance of the resistor 210 based on the sensed voltage. The sensing module 220 determines a temperature of the optical surface based on the resistance of the resistor 210. In some examples, the heating system 200 is dynamically controlled to switch between the heating mode and the sensing mode to maintain the temperature of the optical surface within a target temperature range. This may result in a more efficient defogging procedure. In some examples, the dynamically controlled heating system 200 may prevent fog from forming on the optical surface altogether.

[0035] FIG. 3A illustrates a flow path of an electrical signal when the heating system 200 is in the heating mode. The electrical signal may be a current or a voltage. The electrical signal travels along a flow path 270 from the power source 230 to the ground 260. In some examples, the electrical signal is generated by the power source 230. The power source 230 may supply a constant power (e.g., lOOmW, HOmW, 120mW, or any other power) or may supply a variable power. The electrical signal then travels along or through the wire 232, the switch 240, and the wire 216. The electrical signal then travels across the resistor 210 from the input portion 212 of the resistor 210 to the output portion 214 of the resistor 210. Then, the electrical signal travels from the resistor 210 to the ground 260 along or through the wire 218 and the wire 224. The electrical signal provided by the power source 230 may be a high current or voltage. For example, the electrical signal may be a current of 30mA, 40mA, or 60mA or a voltage of 2.0V, 2.5V, 3V, or 5V. Any other suitably high current or voltage may be used. In some examples, the maximum voltage supplied to the resistor 210 is 3V. However, the maximum voltage may be another voltage depending on the procedure to be performed by the imaging device and depending on the environment in which the imaging device is located. In the following discussion, the electrical signal is referred to as a current. However, it is understood that the discussion similarly applies to examples when the electrical signal is a voltage.

[0036] When a high current is applied across the resistor 210, the resistor generates a high heat. For example, the temperature of the resistor 210 may be 35°C, 40°C, 45°C, or 50°C. The resistor 210 may be heated to any other suitably high temperature. This high temperature may reduce and / or remove fog on the optical surface. In some examples, maintaining the resistor 210 at or near the high temperature prevents fog from forming on the optical surface. The temperature of the resistor 210 is high enough to remove fog from the optical surface but low enough to allow for safe operation within a patient anatomy. In some examples, the temperature of the resistor 210 is equal to or substantially similar to the temperature of the optical surface. Thus, as the temperature of the resistor 210 increases, the temperature of the optical surface increases. The increase in temperature of the optical surface results in fog being removed from the optical surface and / or results in fog being prevented from forming on the optical surface. In some examples, when the temperature of the resistor 210 reaches a target temperature, the heating system 200 switches to the sensing mode.

[0037] In some examples, the sensing module 220 includes one or more processing components, such as one or more processors, that can cause the heating system 200 to switch between the heating mode and the sensing mode. Additionally or alternatively one or more other processing components (e.g., one or more processors of the control system 912) may cause the heating system 200 to switch between the heating mode and the sensing mode. In other examples, the power source 230 includes one or more processing components, such as one or more processors, that can cause the heating system 200 to switch between the heating mode and the sensing mode.

[0038] FIG. 3B illustrates a flow path of an electrical signal when the heating system 200 is in the sensing mode. The electrical signal may be a current or a voltage. The electrical signal travels along a flow path 275 from the sensing module 220 and back to the sensing module 220. In some examples, the electrical signal is generated by the sensing module 220. For example, the sensing module 220 may include a power source that generates the electrical signal. In some examples, the electrical signal is generated by a separate power source (not shown). The separate power source may be directly coupled to or electrically coupled to the sensing module 220. The electrical signal travels along or through the wire 222, the switch 240, and the wire 216. The electrical signal then travels across the resistor 210 from the input portion 212 of the resistor 210 to the output portion 214 of the resistor 210. A portion of the electrical signal also travels along or through the sensing wire 250 and back to the sensing module 220. The portion of the electrical signal that travels across the resistor 210 then travels along or through the wire 218 to the ground 260 and along or through the sensing wire 252 back to the sensing module 220. The electrical signal provided by the sensing module 220 may be a low current or voltage. For example, the electrical signal may be a current of 0.25mA, 0.5mA, or 1.0mA or a voltage of 0.5V, 0.75V, or 1.0V. Any other suitably low current or voltage may be used. Therefore, the electrical signal that is provided when the heating system 200 is in the sensing mode is a lower current or voltage than the current or voltage of the electrical signal that is provided when the heating system 200 is in the heating mode. In the following discussion, the electrical signal is referred to as a current. However, it is understood that the discussion similarly applies to examples when the electrical signal is a voltage.

[0039] When a low current is applied across the resistor 210, the resistor 210 generates a low heat. For example, the temperature of the resistor 210 may be 20°C, 22°C, 25°C, or 27°C. This low temperature may not be high enough to reduce and / or remove fog on the optical surface. Whenthe low current is applied across the resistor 210, the resistor 210 generates a detectable voltage across the resistor 210. The sensing module 220 detects this voltage based on receipt of the electrical signal via the sensing wires 250, 252. Based on the detected voltage, the sensing module 220 determines a temperature of the optical surface. For example, the sensing module 220 may determine a resistance of the resistor 210 based on the detected voltage across the resistor 210. Based on the determined resistance, the sensing module 220 may determine a temperature of the resistor 210. Because the temperature of the resistor 210 may equal or substantially equal the temperature of the optical surface, the sensing module 220 may determine the temperature of the optical surface based on the determined temperature of the resistor 210.

[0040] In some examples, the sensing module 220 includes one or more processing components, such as one or more processors, that can determine the temperature of the resistor 210 based on the measured resistance of the resistor 210. Additionally or alternatively, the sensing module 220 may transmit the measured resistance of the resistor 210 to one or more other processing components (e.g., one or more processors of the control system 912). The other processing components may then determine the temperature of the resistor 210 based on the measured resistance of the resistor 210.

[0041] In some examples, the temperature of the optical surface may be maintained within a target temperature range. The target temperature range of the optical surface may be between 35°C and 50°C. When the temperature of the optical surface is within the target temperature range, the optical surface remains free of fog or other condensation. When the temperature of the optical surface is outside the target temperature range, fog may form on the optical surface.

[0042] In some examples, the heating system 200 dynamically switches between the heating mode and the sensing mode to maintain the temperature of the optical surface within the target temperature range. The heating system 200 may be switched from the heating mode to the sensing mode or from the sensing mode to the heating mode at regular-, periodic intervals, such one second, two second, three second, or five second intervals. Any other intervals may be used, which may be less than one second or greater than five seconds. In some examples, the heating system 200 may be switched from the heating mode to the sensing mode or from the sensing mode to the heating mode in non-periodic intervals.

[0043] In some examples, the heating system may be switched from the heating mode to the sensing mode or from the sensing mode to the heating mode as needed when the sensing module220 determines that the temperature of the optical surface is outside the target temperature range. For example, if the heating system 200 is in the sensing mode and the sensing module 220 determines that the temperature of the optical surface is outside the target temperature range or is near a lower limit of the target temperature range, the sensing module 220 may send a signal to a control system (e.g., the control system 912 in FIG. 9) indicating the temperature of the optical surface. The control system may cause the switch 240 to be switched from the switch terminal 244 to the switch terminal 242 to transition the heating system 200 from the sensing mode to the heating mode. In some examples, the sensing module 220 causes the switch 240 to be switched from the switch terminal 242 to the switch terminal 244 to transition the heating system 200 from the heating mode to the sensing mode.

[0044] When the heating system 200 is in the heating mode, the heating system 200 applies heat to the optical surface to cause the temperature of the optical surface to increase. The heating system 200 may apply heat at regular, periodic intervals, such one second, two second, three second, or five second intervals. Any other intervals may be used, which may be less than one second or greater than five seconds. In some examples, the heating system 200 may apply heat in non-periodic intervals. In some examples, after a heating interval, the heating system 200 may be transitioned to the sensing mode so the sensing module 220 can determine the temperature of the optical surface. If the sensing module 220 determines that the temperature of the optical surface is still outside the target temperature range, then the heating system 200 may transition back to the heating mode for another heating interval to increase the temperature of the optical surface. This process is repeated while the imaging device 100 is in use. By dynamically switching between the heating mode and the sensing mode, the heating system 200 may continually monitor the temperature of the optical surface during the use of the imaging device. This allows for real-time optical surface temperature adjustments with little to no lag time between sensing the temperature of the optical surface and adjusting the temperature of the optical surface. Such real-time temperature adjustments may keep the optical surface free of fog or substantially free of fog during the use of the imaging device. This may result in a more efficient imaging procedure and may reduce the time in which operation of the imaging device 100 is suspended to remove fog from the optical surface. Additionally, if fog does appeal- on the optical surface, the heating system 200 may remove the fog quicker than a heating system that does not have the ability to dynamically switch between a heating mode and a sensing mode.

[0045] FIG. 3C illustrates an alternative heating system 300 for removing condensation from an optical surface (c.g., the optical surface 120) of an imaging device (c.g., the imaging device 100). In some examples, the heating system 300 is the heating system 130. The heating system 300 includes a resistor 310 (e.g., a resistance temperature detector), a sensing module 320, a power source 330, and at least two sensing wires 322, 324. The sensing module 320 may be a circuit and / or a processing system including a circuit.

[0046] The resistor 310 includes an input portion 312 and an output portion 314. The heating system 300 also includes a wire 316 extending between the power source 330 and the input portion 312 of the resistor 310, and a wire 318 extending between the output portion 314 of the resistor 310 and a ground 340. The sensing wire 322 extends between the sensing module 320 and the wire 316. The sensing wire 324 extends between the sensing module 320 and the wire 318.

[0047] As discussed above with respect to the heating system 200, heat may be generated by the resistor 310. The heat generated by the resistor 310 heats the optical surface (e.g., the optical surface 120) to remove condensation from the optical surface. Additionally, a detectable voltage is generated by the resistor 310. The sensing module 320 senses the voltage generated by the resistor 310 and determines a resistance of the resistor 310 based on the sensed voltage. The sensing module 320 determines a temperature of the optical surface based on the resistance of the resistor 310. In some examples, the heating system 300 simultaneously heats the resistor 310 and senses the voltage generated by the resistor 310. This may result in a more efficient defogging procedure. In some examples, the heating system 300 may prevent fog from forming on the optical surface altogether.

[0048] An electrical signal travels from the power source 330 to the sensing module 320 and to the ground 340. In some examples, the electrical signal is generated by the power source 330. The power source 330 may supply a constant power (e.g., lOOmW, 1 lOmW, 120mW, or any other power) or may supply a variable power. The electrical signal then travels along or through the wire 316 and across the resistor 310 from the input portion 312 of the resistor 310 to the output portion 314 of the resistor 310. Then, the electrical signal travels from the resistor 310 to the ground 340 along or through the wire 318. A portion of the electrical signal also travels from the wire 316 along or through the sensing wire 322 to the sensing module 320. A portion of the electrical signal also travels from the wire 318 along or through the sensing wire 324 to the sensing module 320. The electrical signal provided by the power source 330 may be a current or voltage.In some examples, the maximum voltage supplied to the resistor 310 is 3 V. However, the maximum voltage may be another voltage depending on the procedure to be performed by the imaging device and depending on the environment in which the imaging device is located. In the following discussion, the electrical signal is referred to as a current. However, it is understood that the discussion similarly applies to examples when the electrical signal is a voltage.

[0049] The power source 330 may include one or more programmable current and / or voltage sources. The power source 330 may provide a high current and a low current. When a high current is applied across the resistor 310, the resistor generates a high heat. For example, the temperature of the resistor 310 may be 35°C, 40°C, 45°C, or 50°C. The resistor 310 may be heated to any other suitably high temperature. This high temperature may reduce and / or remove fog on the optical surface. In some examples, maintaining the resistor 310 at or near the high temperature prevents fog from forming on the optical surface. The temperature of the resistor 310 is high enough to remove fog from the optical surface but low enough to allow for safe operation within a patient anatomy. In some examples, the temperature of the resistor 310 is equal to or substantially similar to the temperature of the optical surface. Thus, as the temperature of the resistor 310 increases, the temperature of the optical surface increases. The increase in temperature of the optical surface results in fog being removed from the optical surface and / or results in fog being prevented from forming on the optical surface. In some examples, when the temperature of the resistor 310 reaches a target temperature, the heating system 300 switches to providing a low current.

[0050] In some examples, the sensing module 320 includes one or more processing components, such as one or more processors, that can cause the heating system 300 to switch between providing a high current and providing a low current. Additionally or alternatively one or more other processing components (e.g., one or more processors of the control system 912) may cause the heating system 300 to switch between providing a high current and providing a low current. In other examples, the power source 330 includes one or more processing components, such as one or more processors, that can cause the heating system 300 to switch between providing a high current and providing a low current.

[0051] When a low current is applied across the resistor 310, the resistor 310 generates a low heat. For example, the temperature of the resistor 310 may be 20°C, 22°C, 25°C, or 27°C. This low temperature may not be high enough to reduce and / or remove fog on the optical surface. Whenthe low current is applied across the resistor 310, the resistor 310 generates a detectable voltage across the resistor 310. The sensing module 320 detects this voltage based on receipt of the electrical signal via the sensing wires 322, 324. Based on the detected voltage, the sensing module 320 determines a temperature of the optical surface. For example, the sensing module 320 may determine a resistance of the resistor 310 based on the detected voltage across the resistor 310. Based on the determined resistance, the sensing module 320 may determine a temperature of the resistor 310. Because the temperature of the resistor 310 may equal or substantially equal the temperature of the optical surface, the sensing module 320 may determine the temperature of the optical surface based on the determined temperature of the resistor 310.

[0052] In some examples, the sensing module 320 includes one or more processing components, such as one or more processors, that can determine the temperature of the resistor 310 based on the measured resistance of the resistor 310. Additionally or alternatively, the sensing module 320 may transmit the measured resistance of the resistor 310 to one or more other processing components (e.g., one or more processors of the control system 912). The other processing components may then determine the temperature of the resistor 310 based on the measured resistance of the resistor 310.

[0053] In some examples, the temperature of the optical surface may be maintained within a target temperature range. The target temperature range of the optical surface may be between 35°C and 50°C. When the temperature of the optical surface is within the target temperature range, the optical surface remains free of fog or other condensation. When the temperature of the optical surface is outside the target temperature range, fog may form on the optical surface.

[0054] In some examples, the heating system 300 dynamically switches between providing a high current and providing a low current to maintain the temperature of the optical surface within the target temperature range. The heating system 300 may be switched between providing a high current and providing a low current at regular, periodic intervals, such one second, two second, three second, or five second intervals. Any other intervals may be used, which may be less than one second or greater than five seconds. In some examples, the heating system 300 may be switched between providing a high current and providing a low current in non-periodic intervals.

[0055] In some examples, the heating system 300 may be switched between providing a high current and providing a low current as needed when the sensing module 320 determines that the temperature of the optical surface is outside the target temperature range. For example, if thepower source 330 of the heating system 300 is providing a low current and the sensing module 320 determines that the temperature of the optical surface is outside the target temperature range or is near a lower limit of the target temperature range, the sensing module 320 may send a signal to a control system (e.g., the control system 912 in FIG. 9) indicating the temperature of the optical surface. The control system may cause the power source 330 of the heating system 300 to transition from providing a low current to providing a high current. In some examples, the sensing module 320 causes the power source 330 of the heating system 300 to transition from providing a low current to providing a high current.

[0056] When the power source 330 of the heating system 300 is providing a high current, the heating system 300 applies heat to the optical surface to cause the temperature of the optical surface to increase. The heating system 300 may apply heat at regular-, periodic intervals, such one second, two second, three second, or five second intervals. Any other intervals may be used, which may be less than one second or greater than five seconds. In some examples, the heating system 300 may apply heat in non-periodic intervals. In some examples, after a heating interval, the power source 330 of the heating system 300 may transition to providing a low current so the sensing module 320 can determine the temperature of the optical surface. If the sensing module 320 determines that the temperature of the optical surface is still outside the target temperature range, then the power source 330 of the heating system 300 may transition back to providing a high current for another heating interval to increase the temperature of the optical surface. This process is repeated while the imaging device 100 is in use. By dynamically switching between providing a high current and providing a low current, the heating system 300 may continually monitor the temperature of the optical surface during the use of the imaging device. This allows for real-time optical surface temperature adjustments with little to no lag time between sensing the temperature of the optical surface and adjusting the temperature of the optical surface. Such real-time temperature adjustments may keep the optical surface free of fog or substantially free of fog during the use of the imaging device. This may result in a more efficient imaging procedure and may reduce the time in which operation of the imaging device 100 is suspended to remove fog from the optical surface. Additionally, if fog does appear on the optical surface, the heating system 300 may remove the fog quicker than a heating system that does not have the ability to dynamically switch between providing a high current and providing a low current.

[0057] FIG. 4A illustrates an exploded image of components of an imaging device 400 (e.g., the imaging device 100). The imaging device 400 includes a distal tip 410 (e.g., a distal end), a flexible circuit 420, and a circuit board 430. The distal tip 410 includes an optical surface 440 (e.g., the optical surface 120). The flexible circuit 420 includes a distal end 422 and a proximal end 424. In some examples, the optical surface 440 is integral with the distal tip 410. In other examples, the optical surface 440 is coupled to the distal tip 410 (e.g., via a bonded attachment, a locked attachment, an adhesive attachment, a soldered attachment, or other types of attachment). The circuit board 430 includes a distal end 432, a proximal end (not shown), a connection member 434, a connection member 436, and a connection member 438 (see FIG. 5). The proximal end of the circuit board 430 may be connected to a power source within the imaging device 400 or external of the imaging device 400.

[0058] A resistor 450 (e.g., the resistor 210) is coupled to or embedded within the optical surface 440. In some examples, the distal end 422 of the flexible circuit 420 may be coupled to the resistor 450 (e.g., via a bonded attachment, an adhesive attachment, a soldered attachment, or other types of attachment, which are discussed in greater detail below), as shown in FIG. 4B. The resistor 450 may be a fixed value resistor, and the voltage from the power source may be a fixed value. The resistance and voltage values may be selected to provide sufficient heat to minimize fogging of the optical surface 440 while remaining at a temperature safe enough for use in contact with patient tissue for up to 30 minutes without burning or damaging the tissue. As discussed above, in various examples, the target temperature of the optical surface 440 to reduce fogging may be between 45°C and 50°C. The use of a fixed value resistor may minimize failure modes because no software or active control may fail. One failure mode could result in a broken connection between the power source and the resistor 450, which would result in a cooler, and thus safer, imaging device with a higher chance of fogging because of the lowered temperature. In other embodiments, the resistor 450 is a variable resistor. Active control of a variable resistor or other variable heat source is suitable with sufficient safeguards. In some examples, another failure mode could result in the switch 240 being stuck in the heating mode. In such examples, the switch 262 can be moved to the open position to deactivate the heating system 200.

[0059] In some examples, the flexible circuit 420 includes some of the components of the heating system 200. For example, the flexible circuit 420 may include the wires 216, and 218 and the sensing wires 250, and 252. Optionally, the flexible circuit 420 includes one or more of thewire 218, the switch 240, or the switch terminals 242, 244. Optionally, the flexible circuit 420 includes the wires 224 and 232. Optionally, the flexible circuit 420 is coupled to the power source 230 and the sensing module 220. In some alternative examples, the circuit board 430 is coupled to the power source 230 and the sensing module 220. In some examples, the circuit board 430 may include one or more of the wires 216, 218, the switch 240, the switch terminals 242, 244, the sensing wires 250, 252, the wire 224, and the wire 232.

[0060] FIG. 5 is a cross-sectional side view of the imaging device 400. The distal end 422 of the flexible circuit 420 is coupled to the resistor 450. The proximal end 424 of the flexible circuit 420 is coupled to the connection member 434 of the circuit board 430. The imaging device 400 also includes optical components 460. The optical components 460 receive illumination (i.e., light and / or other electromagnetic signals) from a scene and project images onto an image sensor 470. The optical components 460 may include one or more lenses, mirrors, apertures, filters, prisms, polarizers, and / or the like to achieve desired image characteristics (e.g., focal length and / or spectral characteristics).

[0061] The image sensor 470 generally includes any device suitable for converting the projected images (including binocular’ images) from optical components 460 into analog and / or digital electrical signals that retain at least a portion of the information contained in the projected images. According to some examples, the image sensor 470 may include a charge coupled device (CCD) sensor, active pixel sensor, complementary metal oxide semiconductor (CMOS) sensor, N- type metal oxide semiconductor (NMOS) sensor and / or the like. The image sensor 470 may include a single monolithic sensor with dual active areas, and / or may include a plurality of discrete sensors.

[0062] The image sensor 470 is electrically coupled to an image processor 480, which receives the electrical signals generated by the image sensor 470 and converts them for transmission. In some examples, the image processor 480 may include signal conditioning electronics including one or more image signal processors (ISPs), amplifiers, analog to digital (A / D) converters, image encoders, and / or the like. The image processor 480 is coupled to the distal end 432 of the circuit board 430. The output of the image processor 480 may be a digital video signal feed. The digital video signal feed (or another signal representation of captured image data) is transmitted to the circuit board 430 and out of the imaging device 400. In some examples, the circuit board 430 is configured to transmit image data and to receive power and / or control signals.

[0063] In some examples, the optical components 460 are coupled to the circuit board 430 via a connector 462 and / or a connector 466. As shown in FIG. 5, a distal end 461 of the connector 464 is coupled to the optical components 460, and a proximal end 463 of the connector 462 is coupled to the connection member 436 of the circuit board 430. A distal end 465 of the connector 466 is coupled to the optical components 460, and a proximal end 467 of the connector 466 is coupled to the connection member 438 of the circuit board 430. One or both of the connectors 462, 466 may transfer power and / or other signals to the optical components 460. While two connectors 462 and 466 are shown in FIG. 5, the optical components 460 may be coupled to the circuit board 430 with only one connector, such as the connector 462 or the connector 466, or with more than two connectors.

[0064] Additional information regarding the configuration of the components of the imaging device 400 may be found in U.S. Patent Application Publication No. 2020 / 0077878, filed on March 26, 2019, entitled “Image Capture Device with Reduced Fogging,” which is incorporated by reference herein in its entirety.

[0065] FIG. 6 is a flowchart illustrating a method 600 of using a heating system to remove fog and condensation from an optical surface of an imaging device. The method 600 is illustrated as a set of operations or processes 610 through 640. The processes illustrated in FIG. 6 may be performed in a different order than the order shown in FIG. 6, and one or more of the illustrated processes might not be performed in some examples of the method 600. Additionally, one or more processes that are not expressly illustrated in FIG. 6 may be included before, after, in between, or as pail of the illustrated processes. The following discussion will be made with reference to the heating system 200 of FIG. 2, along with reference to the heating mode of the heating system 200 and the sensing mode of the heating system 200 shown in FIGS. 3A and 3B, respectively. The discussion similarly applies to examples using the heating system 130 of the imaging device 100.

[0066] At a process 610, a current is passed across a resistor (e.g., the resistor 210). The resistor 210 is coupled to or embedded within an optical surface (e.g., the optical surface 440). When a low current is passed across the resistor 210, the resistor 210 generates a detectable voltage across the resistor 210. The sensing module 220 detects this voltage based on receipt of an electrical signal via the sensing wires 250, 252.

[0067] At a process 620, a resistance of the resistor 210 is determined. For example, the sensing module 220 may detect the voltage across the resistor 210. Based on the detected voltage acrossthe resistor 210, the sensing module 220 determines the resistance of the resistor 210. Based on the resistance of the resistor 210, the sensing module 220 may determine a temperature of the resistor 210.

[0068] At a process 630, a temperature of an optical surface (e.g., the optical surface 440) is determined. The temperature of the optical surface 440 is determined based on the resistance of the resistor 210. Because the temperature of the resistor 210 may equal or substantially equal the temperature of the optical surface 440, the sensing module 220 may determine the temperature of the optical surface 440 based on the determined temperature of the resistor 210.

[0069] At a process 640, the current through the resistor 210 is controlled. For example, the temperature of the optical surface 440 may be maintained within a target temperature range, as discussed above. When the temperature of the optical surface 440 is within the target temperature range, the optical surface 440 remains free of or substantially free of fog or other condensation. When the temperature of the optical surface 440 is outside the target temperature range, fog may form on the optical surface 440. In some examples, the heating system 200 dynamically switches between the heating mode and the sensing mode to maintain the temperature of the optical surface 440 within the target temperature range.

[0070] In some examples, the heating system 200 may control the current through the resistor 210 to switch the heating system 200 from the heating mode to the sensing mode or from the sensing mode to the heating mode as needed when the sensing module 220 determines that the temperature of the optical surface 440 is outside the target temperature range. For example, if the sensing module 220 determines that the temperature of the optical surface 440 is outside the target temperature range or is near a lower limit of the target temperature range, the sensing module 220 may send a signal to a control system (e.g., the control system 912 in FIG. 9) indicating the temperature of the optical surface 440. The control system may cause the heating system 200 to be transitioned from the sensing mode to the heating mode.

[0071] When the heating system 200 is in the heating mode, the heating system 200 applies heat to the optical surface 440 to cause the temperature of the optical surface 440 to increase. The heating system 200 may apply heat at regular, periodic intervals, or at non-periodic intervals. In some examples, after a heating interval, the heating system 200 may be transitioned to the sensing mode so the sensing module 220 can determine the temperature of the optical surface 440. If the sensing module 220 determines that the temperature of the optical surface 440 is still outside thetarget temperature range, then the heating system 200 may be transitioned back to the heating mode for another heating interval to increase the temperature of the optical surface 440. For example, the sensing module 220 may send a signal to a control system (e.g., the control system 912 in FIG. 9) indicating the temperature of the optical surface. The control system may cause the switch 240 to be switched from the switch terminal 244 to the switch terminal 242 to transition the heating system 200 from the sensing mode to the heating mode. In some examples, the sensing module 220 causes the switch 240 to be switched from the switch terminal 244 to the switch terminal 242 to transition the heating system 200 from the sensing mode to the heating mode.

[0072] The processes of the method 600 may be repeated while the imaging device 100 is in use. By dynamically switching between the heating mode and the sensing mode, the temperature of the optical surface 440 may be continually monitored during the use of the imaging device 100. This allows for real-time optical surface temperature adjustments with little to no lag time between sensing the temperature of the optical surface 440 and adjusting the temperature of the optical surface 440. Such real-time temperature adjustments may keep the optical surface 440 free of fog or substantially free of fog during the use of the imaging device 100. This may result in a more efficient imaging procedure and may reduce the time in which operation of the imaging device 100 is suspended to remove fog from the optical surface 440. Additionally, if fog does appear on the optical surface 440, the heating system 200 may remove the fog quicker than a heating system that does not have the ability to dynamically switch between a heating mode and a sensing mode.

[0073] FIG. 7 is a flowchart illustrating a method 700 of manufacturing a resistor of a heating system (e.g., the heating system 130 or the heating system 200). The method 700 is illustrated as a set of operations or processes 710 through 730. The processes illustrated in FIG. 7 may be performed in a different order than the order shown in FIG. 7, and one or more of the illustrated processes might not be performed in some examples of the method 700. Additionally, one or more processes that are not expressly illustrated in FIG. 7 may be included before, after, in between, or as part of the illustrated processes. The following discussion will be made with reference to the heating system 200 of FIG. 2, along with reference to the imaging device 400 in FIGS. 4A, 4B, and 5. The discussion similarly applies to examples using the heating system 130 of the imaging device 100.

[0074] At a process 710, a resistor (e.g., the resistor 210 or the resistor 450) is coupled to an optical surface (e.g., the optical surface 440). In some examples, the resistor 450 is a platinumthin film resistor that has a resistance of 100 ohms at 0°C. In some examples, the resistor 450 is a platinum thin film resistor that has a resistance of 107.79 ohms at 20°C. In some examples, the resistor 450 is a platinum thin film resistor that has a resistance of 110 ohms at 22°C. The resistor 450 may include any other resistance such that when the resistor 450 is heated, fog is sufficiently removed from the optical surface 440. In some examples, the resistor 450 has a thickness of 1 micron, 0.8 microns, 0.75 microns, or any other suitable thickness. In some examples, the resistor 450 may be bonded to the optical surface 440 using a combination of high temperature and high pressure. In other examples, the resistor 450 may be soldered to the optical surface 440 to couple the resistor 450 to the optical surface 440. Alternatively, the resistor 450 may be coupled to the optical surface 440 via a locked attachment, an adhesive attachment, or other types of attachment. The resistor 450 may be coupled to an inner surface of the optical surface 440. In some examples, the resistor 450 is embedded within the optical surface 440.

[0075] The optical surface 440 may be a sapphire window. In some examples, the optical surface 440 has a mass of 0.060 grams, 0.062 grams, 0.064 grams, or any other suitable mass. In some examples, because the resistor 450 may be a thin metal film, light may reflect off of the metal film when light passes through the optical surface 440 as it is received by the imaging device 400. To help reduce the amount of light that is reflected off of the resistor 450, a diffuser may be embedded within the optical surface 440. The received light may then pass through the diffuser before the light is reflected off of the resistor 450. The diffuser may reduce the amount of reflection that occurs when the light is received by the imaging device 400 and passes through the optical surface 440. This may result in clearer images being output by the image processor 480, which enhances the overall effectiveness of the imaging device 400.

[0076] At a process 720, the resistor 450 is formed into a pattern. The size and shape of the resistor 450 may be constrained to fit between two image capture elements (e.g., cameras) of the imaging device 400. In some examples, the resistor 450 may be constrained to fit within an area that is 2.5mm2, 2.75mm2, 3mm2, or any other area depending on the size of the optical surface 440 and the image capture elements of the imaging device 400. In some examples, the resistor 450 may be 70pm wide and 4.5mm long, resulting in a total planar area of 0.315 mm2. The resistor 450 may have any other combination of width or length, that results in a total planar area less than the area that is available between the image capture elements of the imaging device 400.

[0077] In some examples, the resistor 450 is coupled to the optical surface 440 as a thin sheet or film of metal, such as platinum. The resistor 450 may be another metal, such as gold, nichrome, tantalum nitride, or any other suitable thin metal film. The metal film may then be formed into a pattern to create the final shape of the resistor 450. The resistor 450 may be formed into any suitable shape that fits within the area between the image capture elements discussed above and that also allows for the resistor 450 to achieve a desired resistance at a certain temperature, as also discussed above.

[0078] In some examples, the resistor 450 is formed into a pattern using a photolithography process. Using this process, the excess portions of the metal film are removed, and the remaining portions of the metal film remaining on the optical surface 440 are arranged in the final shape of the resistor 450. In some examples, the resistor 450 is formed into a pattern using a laser ablation process. Using this process, the excess portions of the metal film are removed, and the remaining portions of the metal film remaining on the optical surface 440 are arranged in the final shape of the resistor 450. In other examples, the resistor 450 may be formed into a pattern using a laser etching process, a chemical etching process, or any other process used to shape thin metal films.

[0079] In some examples, the resistor 450 may be formed into a pattern before it is coupled to the optical surface 440. Then, after the resistor 450 is formed into a pattern, the formed resistor 450 may be coupled to the optical surface 440.

[0080] At a process 730, the resistor 450 is connected to a sensing module (e.g., the sensing module 220). FIG. 8 illustrates a front view of the distal tip 410 of the imaging device 400 from a viewpoint looking directly at the front of the distal tip 410. The resistor 450 includes two connection points 452, 454. The resistor 450 may be coupled to the distal end 422 of the flexible circuit 420 (see FIG. 4B) via the connection points 452, 454. For example, the distal end 422 of the flexible circuit 420 may include corresponding connection points that are in contact with the connection points 452, 454 of the resistor 450 when the imaging device 400 is fully assembled. In some examples, the connection points of the distal end 422 of the flexible circuit 420 may be coupled to the connection points 452, 454 of the resistor 450 via one or more wires or other intermediary connection member(s). As discussed above with respect to FIGS. 4A, 4B, and 5, when the resistor 450 is coupled to the flexible circuit 420, the resistor 450 may be connected to the sensing module 220.

[0081] In some examples, the components discussed above may be part of a robotic-assisted system as described in further detail below. The robotic-assistcd system may be suitable for use in, for example, surgical, robotic-assisted surgical, diagnostic, therapeutic, or biopsy procedures. While some examples are provided herein with respect to such procedures, any reference to medical or surgical instruments and medical or surgical methods is non-limiting. The systems, instruments, and methods described herein may be used for animals, human cadavers, animal cadavers, portions of human or animal anatomy, non-surgical diagnosis, as well as for industrial systems and general robotic, general robotic-assisted, or robotic medical systems.

[0082] As shown in FIG. 9, a medical system 900 generally includes a manipulator assembly 902 for operating a medical instrument 904 in performing various procedures on a patient P positioned on a table T. The manipulator assembly 902 may be robotic-assisted, non-robotic- assisted, or a hybrid robotic-assisted and non-robotic-assisted assembly with select degrees of freedom of motion that may be motorized and / or robotic-assisted and select degrees of freedom of motion that may be non-motorized and / or non-robotic-assisted. The medical system 900 may further include a master assembly 906, which generally includes one or more control devices for controlling manipulator assembly 902. Manipulator assembly 902 supports medical instrument 904 and may optionally include a plurality of actuators or motors that drive inputs on medical instrument 904 in response to commands from a control system 912. The actuators may optionally include drive systems that when coupled to medical instrument 904 may advance medical instrument 904 into a naturally or surgically created anatomic orifice.

[0083] Medical system 900 also includes a display system 910 for displaying an image or representation of the surgical site and medical instrument 904 generated by sub-systems of sensor system 908. Display system 910 and master assembly 906 may be oriented so operator O can control medical instrument 904 and master assembly 906 with the perception of telepresence. Additional information regarding the medical system 900 and the medical instrument 904 may be found in International Application Publication No. WO 2018 / 195216, filed on April 18, 2018, entitled “Graphical User Interface for Monitoring an Image-Guided Procedure,” which is incorporated by reference herein in its entirety.

[0084] In some examples, medical instrument 904 may include components of an imaging system (discussed in more detail below), which may include an imaging scope assembly or imaging instrument (e.g., the imaging device 100 or the imaging device 400) that records aconcurrent or real-time image of a surgical site and provides the image to the operator or operator O through one or more displays of medical system 900, such as one or more displays of display system 910. The concurrent image may be, for example, a two or three-dimensional image captured by an imaging instrument positioned within the surgical site. In some examples, the imaging system includes endoscopic imaging instrument components that may be integrally or removably coupled to medical instrument 904. However, in some examples, a separate endoscope, attached to a separate manipulator assembly may be used with medical instrument 904 to image the surgical site. In some examples, as described in detail below, the imaging instrument alone or in combination with other components of the medical instrument 904 may include one or more mechanisms for cleaning one or more lenses of the imaging instrument when the one or more lenses become partially and / or fully obscured by fluids and / or other materials encountered by the distal end of the imaging instrument. In some examples, the one or more cleaning mechanisms may optionally include an air and / or other gas delivery system that is usable to emit a puff of air and / or other gasses to blow the one or more lenses clean. Examples of the one or more cleaning mechanisms are discussed in more detail in International Application Publication No. WO / 2016 / 025465, filed on August 11, 2016, entitled “Systems and Methods for Cleaning an Endoscopic Instrument”; U.S. Patent Application No. 15 / 508,923, filed on March 5, 2017, entitled “Devices, Systems, and Methods Using Mating Catheter Tips and Tools”; and U.S. Patent Application No. 15 / 503,589, filed February 13, 2017, entitled “Systems and Methods for Cleaning an Endoscopic Instrument,” each of which is incorporated by reference herein in its entirety. The imaging system may be implemented as hardware, firmware, software or a combination thereof which interact with or are otherwise executed by one or more computer processors, which may include the processors of the control system 912.

[0085] Control system 912 includes at least one memory and at least one computer processor (not shown) for effecting control between medical instrument 904, master assembly 906, sensor system 908, and display system 910. Control system 912 also includes programmed instructions (e.g., a non-transitory machine-readable medium storing the instructions) to implement some or all of the methods described in accordance with aspects disclosed herein, including instructions for providing information to display system 910.

[0086] FIG. 10 is a simplified diagram of a medical instrument system 1000 according to some examples. Medical instrument system 100 illustrates an exemplary embodiment of medical system900. Medical instrument system 1000 includes a flexible elongate device 1002, such as a flexible catheter (e.g., the medical instrument 904), coupled to a drive unit 1004. Elongate device 1002 includes a flexible body 1016 having proximal end 1017 and distal end or tip portion 1018. Medical instrument system 1000 further includes a tracking system 1030 for determining the position, orientation, speed, velocity, pose, and / or shape of distal end 1018 and / or of one or more segments 1024 along flexible body 1016 using one or more sensors and / or imaging devices as described in further detail below.

[0087] Tracking system 1030 may optionally track distal end 1018 and / or one or more of the segments 1024 using a shape sensor 1022. Shape sensor 1022 may optionally include an optical fiber aligned with flexible body 1016 (e.g., provided within an interior channel (not shown) or mounted externally). The optical fiber of shape sensor 1022 forms a fiber optic bend sensor for determining the shape of flexible body 1016. In one alternative, optical fibers including Fiber Bragg Gratings (FBGs) are used to provide strain measurements in structures in one or more dimensions. Various systems and methods for monitoring the shape and relative position of an optical fiber in three dimensions are described in U.S. Patent Application No. 11 / 180,389, filed on July 13, 2005, entitled “Fiber Optic Position and Shape Sensing Device and Method Relating Thereto”; U.S. Patent Application No. 12 / 047,056, filed on July 16, 2004, entitled “Fiber-Optic Shape and Relative Position Sensing”; and U.S. Patent No. 6,389,187, filed on June 17, 1998, entitled “Optical Fibre Bend Sensor”, each of which is incorporated by reference herein in its entirety. Sensors in some examples may employ other suitable strain sensing techniques, such as Rayleigh scattering, Raman scattering, Brillouin scattering, and Fluorescence scattering. In some examples, the shape of the elongate device may be determined using other techniques. For example, a history of the distal end pose of flexible body 1016 can be used to reconstruct the shape of flexible body 1016 over the interval of time. In some examples, tracking system 1030 may optionally and / or additionally track distal end 1018 using a position sensor system 1020. Position sensor system 1020 may be a component of an EM sensor system with position sensor system 1020 including one or more conductive coils that may be subjected to an externally generated electromagnetic field. Each coil of the EM sensor system then produces an induced electrical signal having characteristics that depend on the position and orientation of the coil relative to the externally generated electromagnetic field. In some examples, position sensor system 1020 may be configured and positioned to measure six degrees of freedom, e.g., three position coordinatesX, Y, Z and three orientation angles indicating pitch, yaw, and roll of a base point or five degrees of freedom, c.g., three position coordinates X, Y, Z and two orientation angles indicating pitch and yaw of a base point. Further description of a position sensor system is provided in U.S. Patent No. 6,380,732, filed on August 11, 1999, entitled “Six-Degree of Freedom Tracking System Having a Passive Transponder on the Object Being Tracked”, which is incorporated by reference herein in its entirety.

[0088] Flexible body 1016 includes a channel 1021 sized and shaped to receive a medical instrument 1026 (e.g., the imaging device 100 or the imaging device 400). Further description of a medical instrument received by a flexible body is provided in U.S. Provisional Patent Application No. 63 / 077,059, filed on September 11, 2020, entitled “Systems for Coupling and Storing an Imaging Instrument”, which is incorporated by reference herein in its entirety.

[0089] Flexible body 1016 may also house cables, linkages, or other steering controls (not shown) that extend between drive unit 1004 and distal end 1018 to controllably bend distal end 1018 as shown, for example, by broken dashed line depictions 1019 of distal end 1018. In some examples, at least four cables are used to provide independent “up-down” steering to control a pitch of distal end 1018 and “left-right” steering to control a yaw of distal end 1018. Steerable elongate devices are described in detail in U.S. Patent Application No. 13 / 274,208, filed on October 14, 2011, entitled “Catheter with Removable Vision Probe”, which is incorporated by reference herein in its entirety.

[0090] The information from tracking system 1030 may be sent to a navigation system 1032 where it is combined with information from image processing system 1031 and / or the preoperatively obtained models to provide the operator with real-time position information. In some examples, the real-time position information may be displayed on display system 910 of FIG. 9 for use in the control of medical instrument system 1000. In some examples, control system 912 of FIG. 9 may utilize the position information as feedback for positioning medical instrument system 1000. Various systems for using fiber optic sensors to register and display a surgical instrument with surgical images are provided in U.S. Patent Application No. 13 / 107,562, filed on May 13, 2011, entitled “Medical System Providing Dynamic Registration of a Model of an Anatomic Structure for Image-Guided Surgery,” which is incorporated by reference herein in its entirety.

[0091] In some examples, medical instrament system 1000 may be robotic-assisted within medical system 900 of FIG. 9. In some examples, manipulator assembly 902 of FIG. 9 may be replaced by direct operator control. In some examples, the direct operator control may include various handles and operator interfaces for hand-held operation of the instrument.

[0092] FIG. 11 illustrates an exemplary robot-assisted or computer-assisted medical system 1100 (“medical system 1100”), which may be a surgical system. Medical system 1100 illustrates an exemplary embodiment of medical system 900. As shown, medical system 1100 may include a manipulator assembly 1102 (e.g., manipulator assembly 902), a user control system 1104 (e.g., master assembly 906), and an auxiliary system 1106 communicatively coupled one to another. Auxiliary system 1106 may be or may be part of display system 910. Additionally or alternatively, auxiliary system 1106 may be or may be coupled to control system 912. Medical system 1100 may be utilized by a surgical team to perform a computer-assisted surgical procedure on a patient 1108 (e.g., patient P). As shown, the surgical team may include an operator or surgeon 1110-1, an assistant 1110-2, a nurse 1110-3, and an anesthesiologist 1110-4, all of whom may be collectively referred to as “surgical team members 1110.” Additional or alternative surgical team members may be present during a surgical session as may serve a particular implementation.

[0093] While FIG. 11 illustrates an ongoing minimally invasive surgical procedure, it will be understood that medical system 1100 may similarly be used to perform open surgical procedures or other types of surgical procedures that may similarly benefit from the accuracy and convenience of medical system 1100. Additionally, it will be understood that the surgical session throughout which medical system 1100 may be employed may not only include an operative phase of a surgical procedure, as is illustrated in FIG. 11, but may also include preoperative, postoperative, and / or other suitable phases of the surgical procedure. A surgical procedure may include any procedure in which manual and / or instrumental techniques are used on a patient to investigate or treat a physical condition of the patient.

[0094] As shown in FIG. 11 , manipulator assembly 1102 may include a plurality of manipulator arms 1112 (e.g., manipulator arms 1112-1 through 1112-4) to which a plurality of medical instruments (e.g., medical instrument 904) may be coupled. Each medical instrument may be implemented by any suitable surgical tool (e.g., a tool having tissue-interaction functions), medical tool, imaging device (e.g., an endoscope or any of the medical imaging systems described herein, such as the imaging device 100 or the imaging device 400), sensing instrument (e.g., a force-sensing surgical instrument), diagnostic instrument, or the like that may be used for a computer- assisted surgical procedure on patient 1108 (c.g., by being at least partially inserted into patient 1108 and manipulated to perform a computer-assisted surgical procedure on patient 1108). While manipulator assembly 1102 is depicted and described herein as including four manipulator arms 1112, it will be recognized that manipulator assembly 1102 may include only a single manipulator arm 1112 or any other number of manipulator arms as may serve a particular implementation.

[0095] Manipulator arms 1112 and / or surgical instruments attached to manipulator arms 1112 may include one or more displacement transducers, orientational sensors, and / or positional sensors used to generate raw (i.e., uncorrected) kinematics information. One or more components of medical system 1100 may be configured to use the kinematics information to track (e.g., determine positions of) and / or control the surgical instruments.

[0096] User control system 1104 may be configured to facilitate control by surgeon 1110-1 of manipulator arms 1112 and surgical instruments attached to manipulator arms 1112. For example, surgeon 1110-1 may interact with user control system 1104 to remotely move or manipulate manipulator arms 1112 and the surgical instruments. To this end, user control system 1104 may provide surgeon 1110-1 with imagery (e.g., high-definition 3D imagery) of a surgical area associated with patient 1108 as captured by an imaging system (e.g., any of the medical imaging systems described herein). In certain examples, user control system 1104 may include a display system (e.g., display system 910) or a display device for displaying the captured imagery. For example, a display device may include a stereo viewer having two displays where stereoscopic images of a surgical area associated with patient 1108 and generated by a stereoscopic imaging system may be viewed by surgeon 1110-1. Surgeon 1110-1 may utilize the imagery to perform one or more procedures with one or more surgical instruments attached to manipulator arms 1112.

[0097] To facilitate control of surgical instruments, user control system 1104 may include a set of master controls. These master controls may be manipulated by surgeon 1110-1 to control movement of surgical instruments (e.g., by utilizing robotic and / or teleoperation technology). The master controls may be configured to detect a wide variety of hand, wrist, and finger movements by surgeon 1110-1. In this manner, surgeon 1110-1 may intuitively perform a procedure using one or more surgical instruments.

[0098] Auxiliary system 1106 may include one or more computing devices configured to perform primary processing operations of surgical system 1100. In such configurations, the oneor more computing devices included in auxiliary system 1106 may control and / or coordinate operations performed by various other components (e.g., manipulator assembly 1102 and user control system 1104) of medical system 1100. For example, the auxiliary system 1106 may include or be in communication with a control system (e.g., control system 912). In some examples, a computing device included in user control system 1104 may transmit instructions to manipulator assembly 1102 by way of the one or more computing devices included in auxiliary system 1106. As another example, auxiliary system 1106 may receive signals from manipulating system 1102 and process image data representative of imagery captured by an imaging device attached to one of manipulator arms 1112.

[0099] In some examples, auxiliary system 1106 may be configured to present visual content to surgical team members 1110 who may not have access to the images provided to surgeon 1110- 1 at user control system 1104. To this end, auxiliary system 1106 may include a display monitor 1114 (e.g., display system 910) configured to display one or more user interfaces, such as images of the surgical area, information associated with patient 1108 and / or the surgical procedure, and / or any other visual content as may serve a particular implementation. For example, display monitor 1114 may display images of the surgical area together with additional content (e.g., graphical content, contextual information, etc.) concurrently displayed with the images. In some embodiments, display monitor 1114 is implemented by a touchscreen display with which surgical team members 1110 may interact (e.g., by way of touch gestures) to provide user input to medical system 1100.

[0100] Manipulator assembly 1102, user control system 1104, and auxiliary system 1106 may be communicatively coupled one to another in any suitable manner. For example, as shown in FIG. 11, manipulator assembly 1102, user control system 1104, and auxiliary system 1106 may be communicatively coupled by way of control lines 1116, which may represent any wired or wireless communication link as may serve a particular implementation. To this end, manipulator assembly 1102, user control system 1104, and auxiliary system 1106 may each include one or more wired or wireless communication interfaces, such as one or more local area network interfaces, Wi-Fi network interfaces, cellular interfaces, etc.

[0101] The singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context indicates otherwise. And the terms “comprises,” “comprising,” “includes,” “has,” and the like specify the presence of stated features, steps, operations, elements, and / orcomponents but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Components described as coupled may be electrically or mechanically directly coupled, or they may be indirectly coupled via one or more intermediate components. Components described as coupled may be directly or indirectly communicatively coupled. The auxiliary verb “may” likewise implies that a feature, step, operation, element, or component is optional.

[0102] In the description, specific details have been set forth describing some examples. Numerous specific details are set forth in order to provide a thorough understanding of the examples. It will be apparent, however, to one skilled in the art that some examples may be practiced without some or all of these specific details. The specific examples disclosed herein are meant to be illustrative but not limiting. One skilled in the art may realize other elements that, although not specifically described here, are within the scope and the spirit of this disclosure.

[0103] Elements described in detail with reference to one example, implementation, or application optionally may be included, whenever practical, in other examples, implementations, or applications in which they are not specifically shown or described. For example, if an element is described in detail with reference to one example and is not described with reference to a second example, the element may nevertheless be claimed as included in the second example. Thus, to avoid unnecessary repetition in the following description, one or more elements shown and described in association with one example, implementation, or application may be incorporated into other examples, implementations, or aspects unless specifically described otherwise, unless the one or more elements would make an example or implementation non-functional, or unless two or more of the elements provide conflicting functions.

[0104] Any alterations and further modifications to the described devices, instruments, methods, and any further application of the principles of the present disclosure are fully contemplated as would normally occur to one skilled in the art to which the disclosure relates. In addition, dimensions provided herein are for specific examples and it is contemplated that different sizes, dimensions, and / or ratios may be utilized to implement the concepts of the present disclosure. To avoid needless descriptive repetition, one or more components or actions described in accordance with one illustrative example can be used or omitted as applicable from other illustrative examples. For the sake of brevity, the numerous iterations of these combinations willnot be described separately. For simplicity, in some instances the same reference numbers are used throughout the drawings to refer to the same or like parts.

[0105] The systems and methods described herein may be suited for navigation and treatment of anatomic tissues, via natural or surgically created connected passageways, in any of a variety of anatomic systems, including the lung, colon, the intestines, the kidneys and kidney calices, the brain, the heart, the circulatory system including vasculature, and / or the like. Although some of the examples described herein refer to surgical procedures or instruments, or medical procedures and medical instruments, the techniques disclosed apply to non-medical procedures and nonmedical instruments. For example, the instruments, systems, and methods described herein may be used for non-medical purposes including industrial uses, general robotic uses, and sensing or manipulating non-tissue work pieces. Other example applications involve cosmetic improvements, imaging of human or animal anatomy, gathering data from human or animal anatomy, and training medical or non-medical personnel. Additional example applications include use for procedures on tissue removed from human or animal anatomies (without return to a human or animal anatomy) and performing procedures on human or animal cadavers. Further, these techniques can also be used for surgical and nonsurgical medical treatment or diagnosis procedures.

[0106] Further, although some of the examples presented in this disclosure discuss robotic - assisted systems or remotely operable systems, the techniques disclosed are also applicable to computer-assisted systems that are directly and manually moved by operators, in part or in whole.

[0107] Additionally, one or more elements in examples of this disclosure may be implemented in software to execute on a processor of a computer system such as a control processing system. When implemented in software, the elements of the examples of the present disclosure are essentially the code segments to perform the necessary tasks. The program or code segments can be stored in a processor readable storage medium (e.g., a non-transitory storage medium) or device that may have been downloaded by way of a computer data signal embodied in a carrier wave over a transmission medium or a communication link. The processor readable storage device may include any medium that can store information including an optical medium, semiconductor medium, and magnetic medium. Processor readable storage device examples include an electronic circuit, a semiconductor device, a semiconductor memory device, a read only memory (ROM), a flash memory, an erasable programmable read only memory (EPROM); a floppy diskette, a CD-ROM, an optical disk, a hard disk, or other storage device. The code segments may be downloaded via computer networks such as the Internet, Intranet, etc. Any of a wide variety of centralized or distributed data processing architectures may be employed. Programmed instructions may be implemented as a number of separate programs or subroutines, or they may be integrated into a number of other aspects of the systems described herein. In some examples, the control system may support wireless communication protocols such as Bluetooth, Infrared Data Association (IrDA), HomeRF, IEEE 802.11, Digital Enhanced Cordless Telecommunications (DECT), ultra- wideband (UWB), ZigBee, and Wireless Telemetry.

[0108] A computer is a machine that follows programmed instructions to perform mathematical or logical functions on input information to produce processed output information. A computer includes a logic unit that performs the mathematical or logical functions, and memory that stores the programmed instructions, the input information, and the output information. The term “computer” and similar terms, such as “processor” or “controller” or “control system”, are analogous.

[0109] Note that the processes and displays presented may not inherently be related to any particular’ computer or other apparatus, and various systems may be used with programs in accordance with the teachings herein. The required structure for a variety of the systems discussed above will appear as elements in the claims. In addition, the examples of the present disclosure are not described with reference to any particular programming language. It will be appreciated that a variety of programming languages may be used to implement the teachings of the present disclosure as described herein.

[0110] While certain example examples of the present disclosure have been described and shown in the accompanying drawings, it is to be understood that such examples are merely illustrative of and not restrictive to the broad disclosed concepts, and that the examples of the present disclosure not be limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those ordinarily skilled in the art.

Claims

CLAIMSWhat is claimed is:

1. A system, comprising: a resistor configured to couple to an optical surface, wherein the resistor generates heat to heat the optical surface in response to receiving a first electrical signal from a power source; a sensing module connected to the resistor via at least two sensing wires, wherein the sensing module is configured to: determine a resistance of the resistor in response to providing a second electrical signal to the resistor; determine a temperature of the resistor based on the resistance of the resistor; and determine a temperature of the optical surface based on the temperature of the resistor; and at least one switch electrically connected to the resistor and the sensing module, wherein the at least one switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

2. The system of claim 1, wherein the at least one switch is configured to switch from directing the second electrical signal to the sensing module to directing the first electrical signal to the resistor when the temperature of the optical surface is outside of a target temperature range.

3. The system of claim 2, wherein the at least one switch is configured to switch from directing the first electrical signal to the resistor to directing the second electrical signal to the sensing module when the temperature of the optical surface is within the target temperature range.

4. The system of claim 1, wherein determining the resistance of the resistor includes: determining a voltage change across the resistor, wherein the voltage change occurs in response to the resistor receiving the second electrical signal.

5. The system of claim 1 , wherein the sensing module receives the second electrical signal from the power source.

6. The system of claim 1, wherein the sensing module receives the second electrical signal from a second power source.

7. The system of claim 1, wherein the sensing module generates the second electrical signal.

8. The system of claim 1, wherein the first electrical signal is a first current, and the second electrical signal is a second current.

9. The system of claim 8, wherein the first current a higher current than the second current.

10. The system of claim 1, wherein the first electrical signal is a first voltage, and the second electrical signal is a second voltage.

11. The system of claim 10, wherein the first voltage is a higher voltage than the second voltage.

12. The system of claim 1, wherein the optical surface is a window of an imaging device.

13. The system of claim 12, wherein the imaging device is an endoscope.

14. The system of claim 1, wherein the resistor is platinum.

15. A system, comprising: a resistor configured to couple to an optical surface, wherein the resistor generates heat to heat the optical surface in response to receiving a first electrical signal; a sensing module electrically connected to the resistor, wherein the sensing module is configured to: determine a resistance of the resistor in response to a second electrical signal being received by the resistor; and determine a temperature of the optical surface based on the resistance of the resistor; and at least one switch electrically connected to the resistor and the sensing module, wherein the at least one switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

16. The system of claim 15, wherein the at least one switch is configured to switch from directing the second electrical signal to the sensing module to directing the first electrical signal to the resistor when the temperature of the optical surface is outside of a target temperature range.

17. The system of claim 16, wherein the at least one switch is configured to switch from directing the first electrical signal to the resistor to directing the second electrical signal to the sensing module when the temperature of the optical surface is within the target temperature range.

18. The system of claim 15, wherein determining the resistance of the resistor includes: determining a voltage change across the resistor, wherein the voltage change occurs in response to the resistor receiving the second electrical signal.

19. The system of claim 15, wherein the sensing module receives the second electrical signal from a second power source.

20. The system of claim 15, wherein the sensing module generates the second electrical signal.

21. The system of claim 15, wherein the first electrical signal is a first current, and the second electrical signal is a second current.

22. The system of claim 21, wherein the first current a higher current than the second current.

23. A system, comprising: an imaging device including an optical surface; a resistor configured to couple to the optical surface, wherein the resistor generates heat to heat the optical surface in response to receiving a first electrical signal; a sensing module electrically connected to the resistor, wherein the sensing module is configured to: determine a resistance of the resistor in response to providing a second electrical signal to the resistor; and determine a temperature of the optical surface based on the resistance of the resistor; and at least one switch electrically connected to the resistor and the sensing module, wherein the at least one switch is configured to selectively direct the first electrical signal to the resistor or the second electrical signal to the resistor.

24. The system of claim 23, wherein the imaging device is an endoscopic imaging device.

25. The system of claim 23, wherein the optical surface is positioned at a distal tip of the imaging device.

26. The system of claim 23, wherein the imaging device further includes at least one image capturing component positioned at a distal tip of the imaging device.

27. The system of claim 26, wherein the image capturing component is a camera.

28. The system of claim 23, wherein the at least one switch is configured to switch from directing the second electrical signal to the sensing module to directing the first electrical signal to the resistor when the temperature of the optical surface is outside of a target temperature range.

29. The system of claim 28, wherein the at least one switch is configured to switch from directing the first electrical signal to the resistor to directing the second electrical signal to the sensing module when the temperature of the optical surface is within the target temperature range.

30. The system of claim 23, wherein determining the resistance of the resistor includes: determining a voltage change across the resistor, wherein the voltage change occurs in response to the resistor receiving the second electrical signal.

31. The system of claim 23, wherein the sensing module receives the second electrical signal from a second power source.

32. The system of claim 23, wherein the sensing module generates the second electrical signal.

33. A method comprising: passing a current across a resistor, the resistor coupled to an optical surface; determining a resistance of the resistor; determining a temperature of the optical surface based on the resistance of the resistor; and controlling the current across the resistor based on the temperature of the optical surface to control a temperature of the optical surface.

34. The method of claim 33, wherein passing the current across the resistor includes actuating a switch to electrically couple the resistor to a power source.

35. The method of claim 33, wherein determining the resistance of the resistor includes detecting a voltage across the resistor.

36. The method of claim 35, wherein the voltage is determined based on the current passed across the resistor.

37. The method of claim 33, wherein controlling the temperature of the optical surface includes maintaining the temperature of the optical surface within a target temperature range.

38. The method of claim 37, wherein when the temperature of the optical surface is within the target temperature range, the optical surface remains free of fog.

39. The method of claim 33, wherein controlling the current across the resistor includes actuating a switch to electrically decouple the resistor from a first power source and to electrically couple to the resistor to a second power source.

40. The method of claim 39, wherein the first power source is configured to provide a first current, and wherein the second power source is configured to provide a second current higher than the first current.

41. The method of claim 40, further comprising: determining whether the temperature of the optical surface is outside of a target temperature range, wherein the switch is electrically coupled to the second power source based on a determination that the temperature of the optical surface is outside of the target temperature range.

42. The method of claim 39, wherein the switch is actuated to electrically couple to the resistor to the second power source at periodic intervals.

43. The method of claim 39, wherein the switch is actuated to electrically couple to the resistor to the second power source at non-periodic intervals.

44. A method comprising: coupling a resistor to an optical surface, wherein the resistor generates heat to heat the optical surface in response to receiving a first electrical signal from a power source; forming the resistor into a pattern, wherein the pattern causes a resistance of the resistor to be output within a threshold resistance range when the first electrical signal is received by the resistor; and connecting the resistor to a sensing module, wherein the sensing module is configured to: determine a resistance of the resistor in response to a second electrical signal being provided to the resistor; determine a temperature of the resistor based on the resistance of the resistor; and determine a temperature of the optical surface based on the temperature of the resistor.

45. The method of claim 44, wherein coupling the resistor to the optical surface includes bonding the resistor to the optical surface.

46. The method of claim 44, wherein coupling the resistor to the optical surface includes soldering the resistor to the optical surface.

47. The method of claim 44, wherein forming the resistor into a pattern includes removing excess portions of the resistor via photolithography.

48. The method of claim 44, wherein forming the resistor into a pattern includes removing excess portions of the resistor via laser ablation.

49. The method of claim 44, wherein the resistor is a platinum thin film.

50. The method of claim 44, wherein the optical surface is a sapphire window.51 . The method of claim 44, further comprising: embedding a diffuser within the optical surface, wherein the diffuser is configured to reduce an amount of light that is reflected off of the resistor when the light passes through the optical surface.

52. The method of claim 44, wherein the optical surface is on an imaging device, and wherein coupling the resistor to the optical surface includes positioning the resistor between two image capture components of the imaging device.

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