Systems and methods for coaxial test socket and printed circuit board interfaces

Abstract

A test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB) is provided. The test socket includes a conductive body defining a plurality of cavities extending from a first surface to a second surface. The test socket further includes a signal probe disposed in a signal cavity of the plurality of cavities. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in a ground cavity of the plurality of cavities. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The test socket further includes a grounding device disposed in the ground cavity and electrically coupled between the conductive body and the ground probe.

Description

SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOARD INTERFACESCROSS-REFERENCE TO RELATED APPLICATION

[0001] The present application claims priority to Chinese Patent Application No. 202411032767.2, filed 30 July 2024, which is incorporated herein by reference in its entirety.BACKGROUND

[0002] The embodiments described herein relate generally to electrical interconnects and, more particularly, to interfaces for coaxial test sockets and printed circuit boards (PCBs).

[0003] In the electronics and semiconductor industries, systems used to test integrated circuit (IC) semiconductor chips often include test sockets. A test socket is disposed on a printed circuit board (PCB), or “load board,” and may include a socket body and one or more probes (i.e., electrical contacts or pins) that electrically connect the IC chip to the PCB. Test sockets generally must meet various electrical and mechanical performance thresholds to adequately test a given IC chip. For example, the test socket should maintain signal integrity, such as a desired error rate or signal-to-noise ratio, at a desired data transfer rate for the IC under test. Current test sockets generally maintain signal integrity up to a data transfer rate of about 30 gigabits per second. However, some applications, such as 5G telecommunications or artificial intelligence, may require higher rates of data transfer. A test socket capable of maintaining signal integrity at higher data transfer rates is therefore desirable.BRIEF SUMMARY

[0004] In one aspect, a test socket for coupling an IC chip to a PCB is provided. The test socket includes a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip. The conductive body defines a plurality of cavities extending from the first surface to the second surface. The test socket further includes a signal probe disposed in a signal cavity of the plurality ofcavities. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in a ground cavity of the plurality of cavities. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The test socket further includes a grounding device disposed in the ground cavity and electrically coupled between the conductive body and the ground probe.

[0005] In another aspect, a method for manufacturing a test socket for coupling an IC chip to a PCB is provided. The method includes forming a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip. The conductive body defines a plurality of cavities extending from the first surface to the second surface. The method further includes positioning a signal probe in a signal cavity of the plurality of cavities. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The method further includes positioning a grounding device in a ground cavity of the plurality of cavities. The method further includes positioning a ground probe in the ground cavity. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The method further includes electrically coupling the grounding device between the conductive body and the ground probe.

[0006] In another aspect, a test assembly is provided. The test assembly includes a PCB including a signal conductor and a ground conductor, an IC chip including a signal pad and a ground pad, and a test socket. The test socket includes a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip. The conductive body defines a plurality of cavities extending from the first surface to the second surface. The test socket further includes a signal probe disposed in a signal cavity of the plurality of cavities. The signal probe configured to electrically connect to the signal conductor and to the signal pad. The test socket further includes a ground probe disposed in a ground cavity of the plurality ofcavities. The ground probe is configured to electrically connect to the ground conductor and to the ground pad. The test socket further includes a grounding device disposed in the ground cavity and electrically coupled between the conductive body and the ground probe.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIGS. 1-9 show example embodiments of the systems and methods described herein.

[0008] FIG. 1 is a cross-sectional view of an example test assembly including an example test socket;

[0009] FIG. 2 is a cross-sectional view of another example test assembly;

[0010] FIG. 3 A depicts a cross-sectional view of another example test assembly;

[0011] FIG. 3B is another cross-sectional view of the example test assembly shown in FIG. 3A;

[0012] FIG. 3C is another cross-sectional view of the example test assembly shown in FIGS. 3A and 3B;

[0013] FIG. 3D is another cross-sectional view of the example test assembly shown in FIGS. 3A-3C;

[0014] FIG. 4 is a cross-sectional view of an elastomer ring for use in the example test assembly shown in FIG. 2;

[0015] FIG. 5 is a cross-sectional view of an example grounding system;

[0016] FIG. 6 is a cross-sectional view of another example grounding system;

[0017] FIG. 7 is a cross-sectional view of a conductive spring for use in the example grounding system shown in FIG. 6;

[0018] FIG. 8 is a partially transparent view of another example grounding system;

[0019] FIG. 9A is a partially transparent view of another example grounding system;

[0020] FIG. 9B is another partially transparent view of the example grounding system shown in FIG. 9A;

[0021] FIG. 9C is another partially transparent view of the example grounding system shown in FIGS. 9A and 9B; and

[0022] FIG. 10 is a flowchart of an example method for manufacturing a test socket.DETAILED DESCRIPTION

[0023] In the following specification and the claims, reference will be made to a number of terms, which shall be defined to have the following meanings.

[0024] The singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise.

[0025] Approximating language, as used herein throughout the specification and claims, is applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about,” “approximately,” and “substantially,” is not to be limited to the precise value specified. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value. Here and throughout the specification and claims, range limitations are combined and interchanged, such ranges are identified and include all the sub-ranges contained therein unless context or language indicates otherwise.

[0026] The disclosed systems and methods include a test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB), for example, to facilitate testing of the IC chip using the PCB. The test socket includes a conductive body having a first surface facing the PCB and a second surface facing the IC chip. The conductive body defines one or more signal cavities and one or more ground cavities, each extending from the first surface to the second surface. The test socket further includes one or more signal probes each disposed in one of the signal cavities. The signal probes are configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip, for example, to enable a transmission of electrical signals between the PCB and the IC chip. The test socket further includes one or more ground probes each disposed in one of the ground cavities. The ground probes are configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip to enable an electrical connection of respective grounds of the PCB and IC chip. The ground probe is further electrically connected to the conductive body. The conductive body may also define one or more power cavities extending from the first surface to the second surface, and in which a power probe may be disposed. Likewise, the power probe is configured to electrically connect to a power conductor of the PCB and to a power pad of the IC chip. The ground probe is configured to be electrically connected to the conductive body, enabling the conductive body to function as a coaxial shielding for the signal probe and enabling the test socket to achieve improved electrical performance on parameters such as, for example, a higher data transfer rate.

[0027] In the example embodiment, the test socket includes a grounding device that is electrically connected between the conductive body of the test socket and the ground probe. The grounding device may include, for example, one or more elastomer rings, conductive epoxy, one or more springs, or other conductive components. The grounding device improves an electrical connection between the ground probe and the conductive body, thereby further improving the functioning of the conductive body as coaxial shielding of the probes to reduce cross talk between the probes and to enable the test socket to use higher frequencies and / or data transfer rates.

[0028] FIG. 1 is a cross-sectional view of an example test assembly 100 including a test socket 102, a PCB 104, and an integrated circuit (IC) chip 106. In some embodiments, test socket 102 is configured to enable a communicative coupling of IC chip 106 chip to PCB 104 for testing IC chip 106. As described in further detail below, test socket 102 provides for the transmission of electrical signals and electrical power between PCB 104 and IC chip 106 and a connection of respective electrical grounds of PCB 104 and IC chip 106.

[0029] Test socket 102 includes a conductive body 108, a signal probe 110, a ground probe 112, and a power probe 114. Conductive body 108 has a first surface 1 16 disposed adjacent to PCB 104 and a second surface 118 disposed adjacent to IC chip 106. Conductive body 108 is electrically conductive, and includes a conductive material such as, for example, aluminum, magnesium, titanium, zirconium, copper, iron, or an alloy including one or more thereof. Conductive body 108 includes a plurality of cavities, including a signal cavity 120 extending from a first signal opening 122 at first surface 1 16 to a second signal opening 124 at second surface 118, a ground cavity 126 extending from a first ground opening 128 at first surface 116 to a second ground opening 130 at second surface 118, and a power cavity 132 extending from a first power opening 134 at first surface 116 to a second power opening 136 at second surface 118. In some embodiments, conductive body 108 includes a plurality of signal cavities 120, ground cavities 126, and / or power cavities 132. In certain embodiments, a distance between any two of signal probe 110, ground probe 112, and power probe 1 14 is greater than about 0.5 millimeters center to center.

[0030] Signal probe 110 is located within signal cavity 120, and is configured to contact and electrically connect to a signal conductor 138 disposed on a substrate 140 of PCB 104 and to a signal pad 142 of IC chip 106 to enable a transmission of electrical signals between PCB 104 and IC chip 106. Signal probe 110 may include a single conductive piece or may include multiple components. For example, in some embodiments, signal probe 110 is a spring probe. Signal probe 110 is electrically insulated from conductive body 108. For example, in certain embodiments, signal probe110 or signal cavity 120 may include an electrically insulative coating (not shown). In such embodiments, the insulative coating may be, for example, an anodic film generated on the metal, a polytetrafluoroethylene (PTFE) coating, a combination thereof, or another coating or sealing material. For example, in some such embodiments, the coating includes an anodized aluminum layer having a thickness of greater than about 0.02 millimeters and a PTFE sealing layer having a thickness of greater than about 0.001 millimeters. In some embodiments, signal probe 110 includes one or more insulation members 144 disposed on signal probe 110. While two insulation members 144 are shown, there may be more or less than two insulation members 144 on signal probe 110. Insulation members 144 may be rings that wrap around a portion of a circumference of the outside surface of signal probe 110 or may wrap around the entirety of a circumference of the outside surface of signal probe 110. Accordingly, insulation members 144 may be annular in shape. In some embodiments signal cavity 120 widens at second signal opening 124 to form a signal counterbore 146. In such embodiments, signal counterbore 146 is shaped to receive at least a portion of signal pad 142 without causing signal pad 142 to contact conductive body 108.

[0031] Signal probe 110 and signal cavity 120 together form a coaxial transmission line. Accordingly, signal probe 110, signal cavity 120, insulation members 144, and signal counterbore 146 may be shaped and sized to achieve desired electrical properties such as, for example, achieving a constant impedance, reducing reflection or distortion of electrical signals, reducing insertion loss and return loss, achieving a desired characteristic impedance, and / or reducing crosstalk.

[0032] Ground probe 112 is located within ground cavity 126, and is configured to contact and electrically connect to a ground conductor 148 of PCB 104 and a ground pad 150 of IC chip 106 to electrically connect respective grounds of PCB 104 and IC chip 106. Ground probe is further electrically connected to conductive body 108. For example, as shown in FIG. 1, ground probe 1 12 may contact conductive body 108. Because no insulation separates ground probe 112 and conductive body 108, ground probe 112 and conductive body 108 are electrically connected when placed in contact.As described in further detail below, in some embodiments, test socket 102 includes additional features for improving the electrical connection between ground probe 112 and conductive body 108. Like signal probe 110, ground probe 112 may include a single conductive piece or include multiple components. For example, in some embodiments, ground probe 112 is a spring probe. In some embodiments ground cavity 126 widens at second ground opening 130 to form a ground counterbore 152, which may be similar in structure to signal counterbore 146.

[0033] Power probe 114 is located within power cavity 132, and is configured to contact and electrically connect to a power conductor 154 of PCB 104 and a power pad 156 of IC chip 106 to provide power to IC chip 106 from PCB 104. Like signal probe 110 and ground probe 112, power probe 114 may include a single conductive piece or include multiple components. For example, in some embodiments, power probe 114 is a spring probe. Like signal probe 110, power probe 114 is electrically insulated from conductive body 108. For example, in certain embodiments, power probe 114 may include an electrically insulative coating (not shown) and / or insulation members similar to insulation members 144. In some embodiments power cavity 132 widens at second power opening 136 to form a power counterbore 158, which may be similar in structure to signal counterbore 146 and / or ground counterbore 152.

[0034] Conductive body 108 is electrically connected to ground conductor 148 of PCB 104 at least through ground probe 112. In some embodiments, conductive body 108 is directly electrically connected to ground conductor 148. For example, conductive body 108 may be configured to contact ground conductor 148 when installed, and / or test socket 102 may include additional components for electrically connecting conductive body 108 to ground conductor 148.

[0035] FIGS. 2-8 depict various example embodiments in which a grounding device is included. The grounding device is electrically coupled to conductive body 108 and to ground probe 112 to improve a grounding electrical connection between conductive body 108 and ground probe 112, thereby improving a signal integrity of test socket 102.

[0036] FIG. 2 is a cross-sectional view of another test assembly 200. Test assembly 200 includes test socket 102 and IC chip 106, which generally function as described with respect to FIG. 1. As shown in FIG. 2, in some embodiments, test socket 102 includes conductive elastomer rings 202 that are in contact with and electrically coupled between conductive body 108 and ground probe 112. In certain embodiments, ground probe 112 includes a mechanism, such as an internal spring, that, when ground probe 112 is axially compressed, causes ground probe 112 to exert an axially outward force. Conductive elastomer rings 202 are positioned at points where ground probe 112 tapers, enabling an axial force exerted by ground probe 112 to compress conductive elastomer rings 202 between conductive body 108 and ground probe 112. This compression establishes a stronger physical and electrical connection between conductive body 108 and ground probe 112. Conductive elastomer rings 202 are positioned between ground probe 112 and conductive body 108, and in some embodiments can move up and down simultaneously with ground probe 1 12 to contact and support electrical contact with the conductive body 108.

[0037] FIGS. 3A-3D are cross-sectional views of another test assembly 300 that includes a conductive elastomer ring 202 positioned on ground probe 112. In some embodiments, during manufacture, conductive elastomer ring 202 is fitted onto ground probe 112. Alternatively, in some embodiments, conductive elastomer rings 202 are first positioned within ground cavity 126 of conductive body 108, and ground probe 112 is then inserted through conductive elastomer rings 202. As shown in FIG. 3 A, ground probe 112 and conductive elastomer ring 202 positioned within ground cavity 126 of conductive body 108, when test socket 102 is positioned on PCB 104, as shown in FIG. 3B, ground probe 1 12 becomes partially compressed. When IC 106 is inserted into test socket 102, as shown in FIG. 3C, ground probe 112 is further compressed, and elastomer ring is pressed between ground probe 112 and conductive body 108 to form an electrical connection between conductive body 108 and ground probe 112. When IC 106 is removed from test socket 102, as shown in FIG. 3D, ground probe 112 decompresses partially while conductive elastomer ring 202 remains in position within ground cavity 126.

[0038] FIG. 4 is a cross-sectional view of an example conductive elastomer ring 202. Conductive elastomer ring 202 includes a top surface 402 configured to contact ground probe 112 and a bottom surface 404 configured to contact conductive body 108. In the embodiment depicted in FIG. 4, conductive elastomer ring 202 includes one or more wires 406 extending through conductive elastomer ring 202 that, when conductive elastomer ring 202 is positioned between conductive body 108 and ground probe 112, form an electrical connection between conductive body 108 and ground probe 112. While FIG. 4 depicts wires 406 as extending in an axial direction with respect to conductive elastomer ring 202, it should be appreciated that wires 406 may have any orientation that enables wires 406 to form an electrical connection between conductive body 108 and ground probe 112, including configurations in which wires 406 are curved or shaped differently (e.g., as a ring concentric with conductive elastomer ring 202). Because wires 406 are capable of improving an electrical connection between conductive body 108 and ground probe 112, an inclusion of wires 406 in conductive elastomer ring 202 may improve a signal integrity of test socket 102. In some embodiments, metal particles or other features that enhance a conductivity of conductive elastomer ring 202 are included in addition or alternatively to wires 406.

[0039] FIG. 5 is a cross-sectional view of an example grounding system 500 that may be used in certain example embodiments of test socket 102. Grounding system 500 includes a conductive epoxy 502 in contact with and forming an electrical connection between conductive body 108 and ground probe 112. During manufacture, conductive epoxy 502 is poured into a bottom of and cured within ground cavity 126, after which ground probe 112 is positioned within ground cavity 126. Conductive epoxy 502 is pressed between conductive body 108 and ground probe 112 to form a strong electrical connection between conductive body 108 and ground probe 112.

[0040] FIG. 6 is a cross-sectional view of an example grounding system 600 that may be used in certain example embodiments of test socket 102. Grounding system 600 includes a conductive spring 602 in contact with and forming an electrical connection between conductive body 108 and ground probe 112. Conductive spring 602causes ground prove 112 to press against conductive body 108 (e.g., at its top end) to form an electrical connection between conductive body 108 and ground probe 112. FIG.7 depicts a cross-sectional view of conductive spring 602. During manufacture, conductive spring 602 is within ground cavity 126, and ground probe 112 is then positioned within ground cavity 126 to compress conductive spring 602 between conductive body 108 and ground probe 112 as shown in FIG. 6. Conductive spring 602 is shaped such that, when conductive spring 602 is pressed between conductive body 108 and ground probe 112, conductive spring forms a strong physical and electrical connection between conductive body 108 and ground probe 112. For example, as shown in FIGS. 6 and 7, in some embodiments, a diameter of conductive spring 602 varies along a length of conductive spring 602 to accommodate the shapes of ground probe 1 12 and ground cavity 126. In some alternative embodiments, a non-conductive spring may be used in place of conductive spring 602.

[0041] FIG. 8 is a partially transparent view of an example grounding system 800 that may be used in certain example embodiments of test socket 102. Grounding system 800 includes a conductive spring 802, which is crimped onto or otherwise attached to ground probe 112. When ground probe 112 is inserted into ground cavity 126 of conductive body 108, conductive spring 802 causes ground prove 112 to press against conductive body 108 (e.g., at its top end) to form an electrical connection between conductive body 108 and ground probe 112. In some alternative embodiments, a non-conductive spring may be used in place of conductive spring 802.

[0042] FIGS. 9A, 9B, and 9C depict an example grounding system 900 that may be used in certain example embodiments of test socket 102. In this example embodiment, ground probe 112 includes a top plunger 902, a bottom plunger 904, a barrel 906, a first spring 908, and a second spring 910. First spring 908 is positioned between top plunger 902 and bottom plunger 904, and second spring 910 is positioned between bottom plunger 904 and an internal ridge 912 of barrel 906. Accordingly, first spring 908 and second spring 910 provide resistance to axial compression of ground probe 112.

[0043] FIG. 9A shows ground probe 112 in a free state, in which no axial force is applied to ground probe 112 and first spring 908 and second spring 910 are slightly compressed. As shown in FIG. 9B, when a sufficient force is applied to bottom plunger 904, such as by pressing ground probe 112 to PCB 104, second spring 910, by catching internal ridge 912, cause barrel 906 to contact a shoulder 914 of ground cavity 126, thereby creating an electrical connection between conductive body 108 and ground probe 112. As shown in FIG. 9C, when a force is applied to top plunger 902, such as by pressing IC 106 to ground probe 112, first spring 908 is compressed while barrel 906 remains in contact with shoulder 914 due to second spring 910 applying a force to internal ridge 912, allowing the electrical connection between conductive body 108 and ground probe 112 to be maintained.

[0044] FIG. 10 is a flowchart of an example method 1000 for manufacturing a test socket (such as test socket 102). In the example embodiment, method 1000 includes forming 1002 a conductive body (such as conductive body 108) having a first surface (such as first surface 116) configured to face a PCB (such as PCB 104) and a second surface (such as second surface 118) configured to face an IC chip (such as IC chip 106). The conductive body defines a plurality of cavities (such as signal cavity 120, ground cavity 126, and / or power cavity 132) extending from the first surface to the second surface.

[0045] In the example embodiment, method 1000 further includes positioning 1004 a signal probe (such as signal probe 110) in a signal cavity (such as signal cavity 120) of the plurality of cavities. The signal probe is configured to electrically connect to a signal conductor (such as signal conductor 138) of the PCB and to a signal pad 142) of the IC chip.

[0046] In the example embodiment, method 1000 further includes positioning 1006 a grounding device (such as conductive elastomer ring 202, conductive epoxy 502, conductive spring 602, and / or conductive spring 802) in a ground cavity (such as ground cavity 126) of the plurality of cavities.

[0047] In the example embodiment, method 1000 further includes positioning 1008 a ground probe (such as ground probe 112) in the ground cavity. The ground probe is configured to electrically connect to a ground conductor (such as ground conductor 148) of the PCB and to a ground pad (such as ground pad 150) of the IC chip.

[0048] In the example embodiment, method 1000 further includes electrically coupling 1010 the grounding device between the conductive body and the ground probe.

[0049] In some embodiments, positioning 1006 the grounding device in the ground cavity includes positioning at least one elastomer ring (such as conductive elastomer ring 202) with an inner surface (such as top surface 402) of the at least one elastomer ring in contact with the ground probe and an outer surface (such as bottom surface 404) of the at least one elastomer ring in contact with the conductive body. In some such embodiments, the ground probe is configured to exert an axial force that compresses the at least one elastomer ring between the ground probe and the conductive body. In certain such embodiments, the elastomer ring includes at least one wire (such as wire 406) extending through the elastomer ring between the ground conductor and the conductive body.

[0050] In some embodiments, positioning 1006 the grounding device in the ground cavity includes inserting a conductive epoxy (such as conductive epoxy 502) into the ground cavity. The conductive epoxy is configured to contact the ground probe and the conductive body when the ground probe is inserted into the ground cavity. In some such embodiments, the ground probe is configured to exert an axial force that compresses the conductive epoxy between the ground probe and the conductive body.

[0051] In some embodiments, positioning 1006 the grounding device in the ground cavity includes positioning a conductive spring (such as conductive spring 602 and / or conductive spring 802) in the ground cavity. The conductive spring is configured to contact the ground probe and the conductive body when the ground probe is inserted into the ground cavity. In some such embodiments, the ground probe isconfigured to exert an axial force that compresses the conductive spring between the ground probe and the conductive body. In certain such embodiments, method 1000 further includes attaching the conductive spring to the ground probe (as shown with respect to conductive spring 802 shown in FIG. 8).

[0052] Example embodiments of methods and systems for coaxial test socket and PCB interfaces are described above in detail. The methods and systems are not limited to the specific embodiments described herein, but rather, components of systems and / or steps of the methods may be used independently and separately from other components and / or steps described herein. Accordingly, the example embodiments can be implemented and used in connection with many other applications not specifically described herein.

[0053] Technical effects of the systems and methods described herein include at least one of: (a) improved signal integrity for a coaxial test socket by improving electrical coupling between a conductive body of the test socket and an electrical ground; and (b) increased data transfer rates for a coaxial test socket by improving electrical coupling between a conductive body of the test socket and an electrical ground.

[0054] Although specific features of various embodiments of the disclosure may be shown in some drawings and not in others, this is for convenience only. In accordance with the principles of the disclosure, any feature of a drawing may be referenced and / or claimed in combination with any feature of any other drawing.

[0055] This written description uses examples to disclose various embodiments, including the best mode, and also to enable any person skilled in the art to practice the disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the disclosure is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they includeequivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

WHAT IS CLAIMED IS:

1. A test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB), said test socket comprising: a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip, said conductive body defining a plurality of cavities extending from the first surface to the second surface; a signal probe disposed in a signal cavity of the plurality of cavities, said signal probe configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip; a ground probe disposed in a ground cavity of the plurality of cavities, said ground probe configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip; and a grounding device disposed in the ground cavity and electrically coupled between said conductive body and said ground probe.

2. The test socket of Claim 1, wherein said grounding device comprises at least one elastomer ring having an inner surface in contact with said ground probe and an outer surface in contact with said conductive body.

3. The test socket of Claim 2, wherein said ground probe is configured to exert an axial force that compresses said at least one elastomer ring between said ground probe and said conductive body.

4. The test socket of Claim 2, wherein said elastomer ring comprises at least one wire extending through said elastomer ring between said ground conductor and said conductive body.

5. The test socket of Claim 1, wherein said grounding device comprises a conductive epoxy in contact with said ground probe and said conductive body.

6. The test socket of Claim 5, wherein said ground probe is configured to exert an axial force that compresses said conductive epoxy between said ground probe and said conductive body.

7. The test socket of Claim 1, wherein said grounding device comprises a conductive spring in contact with said ground probe and said conductive body.

8. The test socket of Claim 7, wherein said ground probe is configured to exert an axial force that compresses said conductive spring between said ground probe and said conductive body.

9. The test socket of Claim 7, wherein said conductive spring is attached to said ground probe.

10. A method for manufacturing a test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB), said method comprising: forming a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip, the conductive body defining a plurality of cavities extending from the first surface to the second surface; positioning a signal probe in a signal cavity of the plurality of cavities, the signal probe configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip; positioning a grounding device in a ground cavity of the plurality of cavities; positioning a ground probe in the ground cavity, the ground probe configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip; and electrically coupling the grounding device between the conductive body and the ground probe.

11. The method of Claim 10, wherein positioning the grounding device in the ground cavity comprises positioning at least one elastomer ring with an inner surface of the at least one elastomer ring in contact with the ground probe and an outer surface of the at least one elastomer ring in contact with the conductive body.

12. The method of Claim 11 , wherein the ground probe is configured to exert an axial force that compresses the at least one elastomer ring between the ground probe and the conductive body.

13. The method of Claim 11 , wherein the elastomer ring includes at least one wire extending through the elastomer ring between the ground conductor and the conductive body.

14. The method of Claim 10, wherein positioning the grounding device in the ground cavity comprises inserting a conductive epoxy into the ground cavity, the conductive epoxy configured to contact the ground probe and the conductive body.

15. The method of Claim 14, wherein the ground probe is configured to exert an axial force that compresses the conductive epoxy between the ground probe and the conductive body.

16. The method of Claim 10, wherein positioning the grounding device in the ground cavity comprises positioning a conductive spring in the ground cavity, the conductive spring configured to contact the ground probe and the conductive body.

17. The method of Claim 16, wherein the ground probe is configured to exert an axial force that compresses the conductive spring between the ground probe and the conductive body.

18. The method of Claim 16, further comprising attaching the conductive spring to the ground probe.

19. A test assembly comprising: a printed circuit board (PCB) comprising a signal conductor and a ground conductor; an integrated circuit (IC) chip comprising a signal pad and a ground pad; and a test socket comprising: a conductive body having a first surface configured to face said PCB and a second surface configured to face said IC chip, said conductive body defining a plurality of cavities extending from the first surface to the second surface; a signal probe disposed in a signal cavity of the plurality of cavities, said signal probe configured to electrically connect to said signal conductor and to said signal pad; a ground probe disposed in a ground cavity of the plurality of cavities, said ground probe configured to electrically connect to said ground conductor and to said ground pad; and a grounding device disposed in the ground cavity and electrically coupled between said conductive body and said ground probe.

20. The test assembly of Claim 19, wherein said grounding device comprises at least one elastomer ring having an inner surface in contact with said ground probe and an outer surface in contact with said conductive body.

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