Display panel and preparation method therefor, and display apparatus

Abstract

Provided in the present application are a display panel and a preparation method therefor, and a display apparatus. The display panel comprises a display area and a non-display area located on at least one side of the display area. The display panel comprises a substrate, a driving circuit, an inorganic layer, an organic layer and hydrophobic particles, wherein the substrate is located in the display area and the non-display area; the driving circuit is located in the non-display area; the inorganic layer is located on the side of the driving circuit away from the substrate, is located at least in the non-display area, and covers the driving circuit; the organic layer is located on the side of the inorganic layer away from the substrate, and is located in the display area and the non-display area; the organic layer is provided with at least one groove running through the organic layer, and the groove is located in the non-display area; and the hydrophobic particles are located on the side of the driving circuit away from the substrate, and are at least some of the hydrophobic particles are filled in the groove. In this way, the speed of water vapor eroding a display panel can be slowed down, thereby prolonging the service life of the display panel.

Description

Display panel, manufacturing method thereof and display device TECHNICAL FIELD

[0001] The present application relates to the technical field of display manufacturing, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] In a display panel, water vapor transmission to a thin film transistor of a gate drive circuit located in a non-display area can cause the thin film transistor to be oxidized or deteriorated, thereby affecting the performance of the gate drive circuit. Improving the water vapor blocking performance of the display panel to prevent water vapor from invading the thin film transistor of the gate drive circuit is particularly important for improving the performance of the gate drive circuit. SUMMARY

[0003] The present application proposes a display panel, a manufacturing method thereof and a display device to solve the problem that the water vapor blocking effect of the display panel in the related art still needs to be further optimized.

[0004] Embodiments of the present application provide a display panel, which comprises a display area and at least a non-display area located on one side of the display area. The display panel comprises a substrate, a drive circuit, an inorganic layer, an organic layer and hydrophobic particles. The substrate is located in the display area and the non-display area; the drive circuit is located in the non-display area; the inorganic layer is located on the side of the drive circuit away from the substrate, at least in the non-display area, covering the drive circuit; the organic layer is located on the side of the inorganic layer away from the substrate, and in the display area and the non-display area; the organic layer is provided with at least one groove penetrating through the organic layer, the groove being located in the non-display area; and the hydrophobic particles are located on the side of the drive circuit away from the substrate, at least partially filling in the groove.

[0005] In some embodiments, the hydrophobic particles comprise inorganic nanoparticles modified with a hydrophobic functional group on the surface, and the structural formula of the hydrophobic functional group is R1, R2 and R3 are each independently selected from an alkyl group of 1 to 15 carbon atoms and a branched alkyl group having 3 to 15 carbon atoms, a fluorine group, a cycloalkyl group or a phenyl group.

[0006] In some embodiments, the display panel further comprises an encapsulation layer located on the side of the organic layer away from the substrate, and the side of the encapsulation layer close to the substrate is provided with the hydrophobic particles.

[0007] In some embodiments, the display panel further comprises an encapsulation layer on a side of the organic layer distal to the substrate, the encapsulation layer comprising a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in sequence on the organic layer, the organic encapsulation layer being located in the display region.

[0008] The hydrophobic particles are arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0009] In some embodiments, the display panel further comprises a light-emitting structure layer on a side of the inorganic layer distal to the substrate, the light-emitting structure layer comprising a light-emitting material layer, the light-emitting material layer being located in the display region only.

[0010] In some embodiments, the display panel further comprises a light-emitting structure layer on a side of the inorganic layer distal to the substrate, the light-emitting structure layer comprising a light-emitting material layer; the light-emitting material layer being located in the display region and the non-display region; wherein,

[0011] The light-emitting material layer is provided with the hydrophobic particles on a side proximal to the substrate.

[0012] In some embodiments, the display panel further comprises a light-emitting structure layer on a side of the inorganic layer distal to the substrate and an encapsulation layer on a side of the light-emitting structure layer distal to the substrate, the light-emitting structure layer comprising a light-emitting material layer; the light-emitting material layer being located in the display region and the non-display region;

[0013] The light-emitting material layer is provided with the hydrophobic particles between the light-emitting material layer and the encapsulation layer.

[0014] In some embodiments, the display panel comprises a planarization layer on a side of the driving circuit distal to the substrate, the planarization layer forming the organic layer.

[0015] And / or, the display panel comprises a pixel definition layer on a side of the driving circuit distal to the substrate, the pixel definition layer forming the organic layer.

[0016] In some embodiments, the material of the inorganic nanoparticles comprises silicon dioxide or titanium dioxide.

[0017] In some embodiments, the hydrophobic particles have a particle size ranging from 100 nm to 1000 nm.

[0018] In some embodiments, the particle size of the hydrophobic particles gradually decreases in a direction of the driving circuit pointing to the substrate.

[0019] In some embodiments, the organic layer is provided with a plurality of grooves, the plurality of grooves being arranged in a direction of the non-display region pointing to the display region, wherein,

[0020] the interval between two adjacent grooves gradually decreases in a direction from the non-display area to the display area;

[0021] and / or, the width of the grooves gradually increases in a direction from the non-display area to the display area.

[0022] The present application also provides a method for manufacturing a display panel, the display panel comprising a display area and at least a non-display area located at one side of the display area, the method comprising:

[0023] forming a driving circuit on a substrate, the driving circuit being located in the non-display area;

[0024] forming an inorganic layer on a side of the driving circuit away from the substrate, the inorganic layer being located at least in the non-display area and covering the driving circuit;

[0025] forming an organic layer on a side of the inorganic layer away from the driving circuit, the organic layer being provided with at least one groove penetrating through the organic layer, the groove being located in the non-display area;

[0026] filling at least part of the hydrophobic particles in the groove.

[0027] In some embodiments, before the step of filling at least part of the hydrophobic particles in the groove, the method further comprises:

[0028] reacting hydroxyl-containing inorganic nanoparticles with a silane compound to obtain the hydrophobic particles, the material of the inorganic nanoparticles being silicon dioxide or titanium dioxide, and the reaction equation being as follows:

[0029] wherein n is a positive integer, and R1, R2and R3are each independently selected from an alkyl group of 1 to 15 carbon atoms, a branched alkyl group of 3 to 15 carbon atoms, a fluorine group, a cycloalkyl group or a phenyl group.

[0030] The present application also provides a display device comprising the display panel as described above.

[0031] The present application has the following advantages:

[0032] The display panel provided in the embodiment is provided with the hydrophobic particles in the recess in the organic layer in the non-display area, the water vapor moves along the surface of the hydrophobic particles, so that the transmission path of the water vapor to the driving circuit is lengthened, and the hydrophobic particles can block part of the water vapor from transmitting to the driving circuit. Therefore, the time length of the external water vapor penetrating and corroding the driving circuit can be effectively lengthened, the amount of the water vapor invading the driving circuit can be reduced, the risk of the electronic elements in the driving circuit in the non-display area being oxidized or deteriorated can be reduced, the packaging reliability of the display panel is improved, and the service life of the display panel is prolonged.

[0033] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0034] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments consistent with the present application and, together with the description, further serve to explain the principles of the application.

[0035] FIG. 1 shows a cross-sectional schematic view of a display panel according to an example embodiment of the present application;

[0036] FIG. 2 shows an enlarged structure schematic view of A in the display panel shown in FIG. 1;

[0037] FIG. 3 shows a cross-sectional schematic view of a portion of a display panel located in a non-display area according to an example embodiment of the present application;

[0038] FIG. 4 shows a cross-sectional schematic view of a portion of a display panel located in a non-display area according to an example embodiment of the present application;

[0039] FIG. 5 shows a cross-sectional schematic view of a display panel according to an example embodiment of the present application;

[0040] FIG. 6 shows an enlarged structure schematic view of B in the display panel shown in FIG. 5;

[0041] FIGS. 7-12 show cross-sectional schematic views of a portion of a display panel located in a non-display area according to an example embodiment of the present application;

[0042] FIG. 13 shows a cross-sectional schematic view of a display panel according to an example embodiment of the present application;

[0043] FIG. 14 shows a cross-sectional schematic view of a display panel according to an example embodiment of the present application;

[0044] FIG. 15 shows a cross-sectional schematic view of a display panel according to an example embodiment of the present application.

[0045] In the figure: 10 - substrate; 20 - circuit layer; 21 - active layer; 201 - driving circuit; 202 - pixel circuit; 210 - first thin film transistor; 220 - second thin film transistor; 211 - first active part; 212 - second active part; 22 - gate insulating layer; 23 - gate layer; 231 - first gate; 232 - second gate; 24 - interlayer insulating layer; 25 - source-drain layer; 251 - first source; 252 - first drain; 253 - second source; 254 - second drain; 26 - inorganic layer; 27 - planarization layer (organic layer); 30 - light-emitting structure layer; 31 - first electrode; 32 - light-emitting material layer; 33 - second electrode; 34 - pixel definition layer (organic layer); 40 - encapsulation layer; 41 - first inorganic encapsulation layer; 42 - organic encapsulation layer; 43 - second inorganic encapsulation layer; 50 - recess; 51 - protrusion; 60 - hydrophobic particles; AA - display area; NA - non-display area. DETAILED DESCRIPTION

[0046] In the display panel, water vapor is transmitted to the thin film transistor of the gate driving circuit located in the non-display area, which can cause the thin film transistor to be oxidized or deteriorated, and further affect the performance of the gate driving circuit.

[0047] The display panel, the preparation method thereof and the display device provided in the present application are aimed at solving the above technical problems in the related art.

[0048] The display panel, the preparation method thereof and the display device in the embodiments of the present application will be described in detail below with reference to the drawings. In the case of no conflict, the features in the following embodiments can be complementary or combined with each other.

[0049] As shown in FIG. 1, the present application provides a display panel, which comprises a display area AA and at least one non-display area NA located on one side of the display area AA. The display panel comprises a substrate 10, a driving circuit 201, an inorganic layer 26, an organic layer 27 / 34 and hydrophobic particles 60. The substrate 10 is located in the display area AA and the non-display area NA. The driving circuit 201 is located in the non-display area NA. The inorganic layer 26 is located on the side of the driving circuit 201 away from the substrate, and at least in the non-display area NA, covering the driving circuit 201. The organic layer 27 / 34 is located on the side of the inorganic layer 26 away from the substrate 10, and in the display area AA and the non-display area NA. The organic layer 27 / 34 is provided with at least one recess 50 penetrating the organic layer, and the recess 50 is located in the non-display area NA. The hydrophobic particles 60 are located on the side of the driving circuit 201 away from the substrate 10, and at least partially filled in the recess 50.

[0050] The display panel provided in the embodiment is provided with the hydrophobic particles 60 in the recess 50 in the organic layer 27 / 34 in the non-display area NA, the water vapor moves along the surface of the hydrophobic particles 60, so that the transmission path of the water vapor to the driving circuit 201 is lengthened, and the hydrophobic particles 60 can block part of the water vapor from transmitting to the driving circuit 201. Thus, the time length of the external water vapor penetrating and eroding the driving circuit 201 can be effectively prolonged, the amount of water vapor invading the driving circuit 201 can be reduced, the risk of oxidation or deterioration of the electronic elements in the driving circuit 201 located in the non-display area NA can be reduced, the packaging reliability of the display panel can be improved, and the service life of the display panel can be prolonged.

[0051] In some embodiments, the driving circuit 201 is located in the circuit layer 20, and the electronic elements in the driving circuit 201 include the first thin film transistor 210 and a capacitor (not shown in the figure).

[0052] In some embodiments, the driving circuit 201 located in the non-display area NA includes a gate driving circuit. The first thin film transistor 210 can include a gate driving transistor (Gate Driver TFT) in the gate driver.

[0053] In some embodiments, the first thin film transistor 210 can be an amorphous silicon thin film transistor, a polycrystalline silicon thin film transistor, or an oxide thin film transistor.

[0054] In some embodiments, in the direction of the substrate 10 pointing to the circuit layer 20, the circuit layer 20 includes the active layer 21, the gate insulating layer 22, the gate layer 23, the interlayer insulating layer 24, the source-drain layer 25, and the inorganic layer 26 which are sequentially stacked. The circuit layer 20 further includes the pixel circuit 202 located in the display area, and the pixel circuit 202 includes the second thin film transistor 220. The active layer 21 includes the first active part 211 located in the non-display area NA and the second active part 212 located in the display area AA. The gate layer 23 includes the first gate 231 located in the non-display area NA and the second gate 232 located in the display area AA, and the source-drain layer 25 includes the first source 251 and the first drain 252 located in the non-display area NA, and the second source 253 and the second drain 254 located in the display area AA. The first active part 211, the first gate 231, the first source 251, and the first drain 252 jointly constitute the first thin film transistor 210 located in the non-display area NA, and the second active part 212, the second gate 232, the second source 253, and the second drain 254 jointly constitute the second thin film transistor 220 located in the display area AA.

[0055] It is to be noted that the first thin film transistor 210 or the second thin film transistor 220 can be formed in a top gate mode in which the gate layer 23 is located on the side of the active layer 21 away from the substrate 10, or in a bottom gate mode in which the gate layer 23 is located on the side of the active layer 21 close to the substrate 10, or in a dual gate mode in which the gate layer 23 is located on both the side of the active layer 21 close to the substrate 10 and the side of the active layer 21 away from the substrate 10. In addition, in the exemplary drawings of the present embodiment, the first thin film transistor 210 and the second thin film transistor 220 are located in the same film layer of the display panel, but it can be understood that in another embodiment, the first thin film transistor 210 and the second thin film transistor 220 can also be located in different film layers of the display panel.

[0056] In some embodiments, the inorganic layer 26 is an inorganic passivation layer, and the material of the inorganic layer 26 can be silicon dioxide, silicon nitride or other inorganic materials.

[0057] In some embodiments, the circuit layer 20 further comprises a planarization layer 27 on the side of the first thin film transistor 210 away from the substrate 10, and the planarization layer 27 forms the organic layer in the foregoing embodiments.

[0058] In some embodiments, the pixel definition layer 34 forms the organic layer in the foregoing embodiments.

[0059] In some embodiments, the planarization layer 27 on a part of the non-display area NA and the pixel definition layer 34 on a part of the non-display area NA together form the organic layer in the foregoing embodiments.

[0060] In some embodiments, the materials of the planarization layer 27 and the pixel definition layer 34 can both be organic materials, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin.

[0061] In other embodiments, the organic layer can also be formed by the same material as the materials of the planarization layer 27 and the pixel definition layer 34.

[0062] In some embodiments, the part of the display panel located in the display area AA further comprises a light-emitting structure layer 30 disposed on the side of the circuit layer 20 away from the substrate 10, and the light-emitting structure layer 30 comprises a first electrode 31, a pixel definition layer 34, a light-emitting material layer 32 and a second electrode 33 sequentially stacked on the side of the circuit layer 20 away from the substrate 10, wherein the light-emitting material layer 32 is provided with a light-emitting material unit, and the first electrode 31, the light-emitting material unit and the second electrode 33 together constitute an organic light-emitting diode, and the first electrode 31 of the organic light-emitting diode is electrically connected with the second thin film transistor 220.

[0063] In some embodiments, the first electrode 31 is an anode and the second electrode 33 is a cathode. In other embodiments, the first electrode 31 is a cathode and the second electrode 33 is an anode.

[0064] In some embodiments, the first electrode 31 can include a conductive material with high reflectivity, such as a multilayer structure of Al and Ti (Ti / Al / Ti), a multilayer structure of Al and ITO (ITO / Al / ITO). In some embodiments, the second electrode 33 can include a conductive material with high reflectivity, such as a second electrode 33 can include a light-transmissive transparent conductive material (TCO) such as ITO and IZO, or a semi-transmissive conductive material such as Mg, Ag, and an alloy of Mg and Ag.

[0065] In some embodiments, the display panel further includes an encapsulation layer 40 located on a side of the light-emitting structure layer 30 away from the substrate 10, the portion of the encapsulation layer 40 located in the display area AA includes a first inorganic encapsulation layer 41, an organic encapsulation layer 42, and a second inorganic encapsulation layer 43 stacked in sequence. The first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 extend to at least a portion of the non-display area NA of the display panel.

[0066] In some embodiments, a protrusion 51 is formed between two adjacent grooves 50, the protrusion 51 can be arranged around the outside of the display area AA to block the flow of the organic encapsulation layer 42 located in the display area AA. In addition, the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 are covered in the groove 50, and the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 can block the invasion of external moisture to a certain extent.

[0067] In some embodiments, the substrate 10 can be a rigid substrate or a flexible substrate, the rigid substrate can be made of glass or quartz, and the flexible substrate can be a polymer material such as polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or graphite.

[0068] In some embodiments, the hydrophobic particles 60 include inorganic nanoparticles surface-modified with a hydrophobic functional group, the structural formula of the hydrophobic functional group is R1, R2, and R3 are each independently selected from an alkyl group of 1 to 15 carbon atoms and a branched alkyl group having 3 to 15 carbon atoms, a fluorine group, a cycloalkyl group, or a phenyl group.

[0069] In some embodiments, R1, R2, and R3 can be the same or different.

[0070] In the embodiment, the hydrophobic particles 60 are obtained by modifying the surface of inorganic nanoparticles. When the hydrophobic particles are filled in the groove 50, the diffusion path of water vapor can be prolonged when the water vapor diffuses into the groove 50, so that the water vapor erosion resistance of the display panel is improved. The water vapor cannot enter the side of the display panel to oxidize or deteriorate the driving circuit 201 in the non-display area NA, so that the service life of the display panel is prolonged.

[0071] In some embodiments, the material of the inorganic nanoparticles can be silicon dioxide or titanium dioxide.

[0072] In one example, the surface modification of the inorganic nanoparticles by the hydrophobic silane compound can be

[0073] In one example, the surface modification of the inorganic nanoparticles by the hydrophobic silane compound can be

[0074]

[0075]

[0076] In some embodiments, the particle size of the hydrophobic particles 60 is in the range of 100 nm to 1000 nm. Since the particle size of the hydrophobic particles 60 is small, a large surface area can be provided in a unit volume to prolong the diffusion path of water vapor. Thus, the corrosion speed of water vapor on the display panel can be slowed down, and the service life of the display panel is prolonged.

[0077] In some embodiments, the hydrophobic particles 60 are randomly distributed or uniformly distributed in the groove 50.

[0078] In some embodiments, as shown in FIGS. 1 and 2, the hydrophobic particles 60 are arranged between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43. The hydrophobic particles 60 can be covered by the inorganic material on both sides along the thickness direction of the substrate 10, so that the water vapor cannot enter and contact the first thin film transistor.

[0079] In some embodiments, as shown in FIG. 3, the encapsulation layer 40 located in the non-display area NA includes the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43. The hydrophobic particles are arranged on the side of the encapsulation layer 40 close to the substrate 10. In the embodiment, the hydrophobic particles 60 form a barrier between the first thin film transistor 210 and the encapsulation layer 40, so that the hydrogen atoms generated in the preparation process such as chemical vapor deposition cannot affect the stability of the organic material constituting the first thin film transistor 210 or cause corrosion to the metal material constituting the first thin film transistor 210.

[0080] In some embodiments, as shown in FIG. 4, the hydrophobic particles 60 are arranged on the side of the first inorganic encapsulation layer 41 close to the substrate 10 and between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43. The hydrophobic particles 60 arranged in the double-layered interlayer can further enhance the water vapor resistance of the first thin film transistor 210 in the non-display area NA.

[0081] In some embodiments, as shown in FIG. 1, the light-emitting material layer 32 in the light-emitting structure layer 30 is arranged in the display area AA. In this way, the water vapor can be prevented from being transmitted along the light-emitting material layer 32 to the display area AA to corrode the electronic elements in the display area.

[0082] It should be noted that the materials of the hydrophobic particles 60 arranged in different layers can be the same or different. The materials of the hydrophobic particles 60 arranged in the same layer can be the same or different. The materials of the hydrophobic particles 60 arranged in different grooves 50 can be the same or different.

[0083] In some embodiments, as shown in FIGS. 5 and 6, the light-emitting material layer 32 in the light-emitting structure layer 30 is arranged in the display area AA and the non-display area NA, and the light-emitting material layer 32 is arranged with the hydrophobic particles 60 on the side close to the substrate 10.

[0084] In some embodiments, as shown in FIG. 7, the encapsulation layer 40 includes the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 stacked in sequence on the light-emitting material layer 32, and the hydrophobic particles 60 are arranged between the light-emitting material layer 32 and the first inorganic encapsulation layer 41.

[0085] In some embodiments, as shown in FIG. 8, the encapsulation layer 40 includes the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 stacked in sequence on the light-emitting material layer 32, and the hydrophobic particles 60 are arranged between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43.

[0086] In some embodiments, as shown in FIG. 9, the light-emitting material layer 32 is arranged with the hydrophobic particles 60 on the side close to the substrate 10 and between the light-emitting material layer 32 and the encapsulation layer 40.

[0087] In some embodiments, as shown in FIG. 10, the encapsulation layer 40 includes the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43 stacked in sequence on the light-emitting material layer 32, and the hydrophobic particles 60 are arranged between the light-emitting material layer 32 and the first inorganic encapsulation layer 41 and between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43.

[0088] In some embodiments, as shown in FIG. 11, the encapsulation layer 40 comprises a first inorganic encapsulation layer 41 and a second inorganic encapsulation layer 43 which are sequentially stacked on the light-emitting material layer 32; the light-emitting material layer 32 is provided with the hydrophobic particles 60 on the side close to the substrate 10 and between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43.

[0089] In some embodiments, as shown in FIG. 12, the encapsulation layer 40 comprises a first inorganic encapsulation layer 41 and a second inorganic encapsulation layer 43 which are sequentially stacked on the light-emitting material layer 32; the light-emitting material layer 32 is provided with the hydrophobic particles 60 on the side close to the substrate 10, between the light-emitting material layer 32 and the first inorganic encapsulation layer 41, and between the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 43, to form a three-layer sandwiched distribution.

[0090] In some embodiments, as shown in FIG. 13, the particle size of the hydrophobic particles 60 gradually decreases in the direction from the driving circuit 201 to the substrate 10. In this way, the closer to the driving circuit 201, the smaller the gap between the adjacent hydrophobic particles 60, and the more difficult for the water vapor to corrode the driving circuit 201 in the non-display area NA.

[0091] In some embodiments, as shown in FIG. 14, the organic layer 27 / 34 is provided with a plurality of grooves 50 arranged in the direction from the non-display area NA to the display area AA, wherein the interval between the adjacent two grooves 50 gradually decreases in the direction from the non-display area NA to the display area AA. In this way, the closer to the display area AA, the smaller the width of the protrusion 51 between the adjacent two grooves 50, i.e., the path for the water vapor to diffuse along the organic material is shortened, and the water vapor is more difficult to enter the display area AA at the position closer to the display area AA, which can improve the effect of avoiding the water vapor from corroding the second thin film transistor 220 in the display area AA, slow down the corrosion speed of the water vapor, and prolong the service life of the display panel.

[0092] In some embodiments, as shown in FIG. 15, the organic layer 27 / 34 is provided with a plurality of grooves 50 arranged in the direction from the non-display area NA to the display area AA, wherein the width of each groove 50 gradually increases, i.e., the length of the hydrophobic particles 60 distributed in each groove 50 gradually increases in the direction from the non-display area NA to the display area AA, and the path for the water vapor to diffuse along the inorganic material is gradually lengthened, and the water vapor is more difficult to enter the display area AA at the position closer to the display area AA, which can improve the effect of avoiding the water vapor from corroding the second thin film transistor 220 in the display area AA, slow down the corrosion speed of the water vapor, and prolong the service life of the display panel.

[0093] In some embodiments, the organic layer 27 / 34 is provided with a plurality of grooves 50 arranged in a direction from the non-display area NA to the display area AA, wherein the spacing between two adjacent grooves 50 gradually decreases and the width of each groove 50 gradually increases in the direction from the non-display area NA to the display area AA (not shown in the figure). The closer to the display area AA, the wider the width of the hydrophobic particles laid, and the narrower the protrusions between the grooves, which can further prevent water vapor erosion.

[0094] Based on the same inventive concept, the application also provides a preparation method of a display panel, which is combined with FIG. 1 and comprises the following steps:

[0095] Step 100: forming a driving circuit 201 on the substrate 10, wherein the driving circuit 201 is located in the non-display area NA;

[0096] Step 200: forming an inorganic layer 26 on the side of the driving circuit 201 away from the substrate, wherein the inorganic layer 26 is at least located in the non-display area NA and covers the driving circuit 201;

[0097] Step 300: forming an organic layer 27 / 34 on the side of the inorganic layer 26 away from the driving circuit 201, wherein the organic layer 27 / 34 is provided with at least one groove 50 penetrating through the organic layer 27 / 34, and the groove 50 is located in the non-display area NA;

[0098] Step 300: filling at least part of the hydrophobic particles 60 in the groove 50.

[0099] In some embodiments, as shown in FIGS. 1 and 2, before step 300, the method further comprises forming a first inorganic encapsulation layer 41 on the side of the organic layer 27 / 34 away from the substrate 10. After step 300, the method further comprises forming a second inorganic encapsulation layer 43 on the side of the hydrophobic particles 60 away from the substrate 10.

[0100] In some embodiments, as shown in FIG. 3, after step 300, the method further comprises sequentially forming a first inorganic encapsulation layer 41 and a second inorganic encapsulation layer 43 on the side of the organic layer 27 / 34 away from the substrate 10.

[0101] In some embodiments, as shown in FIG. 4, after step 300, the method further comprises forming a first inorganic encapsulation layer 41 on the side of the organic layer 27 / 34 away from the substrate 10, filling a second layer of hydrophobic particles 60 in the part of the first inorganic encapsulation layer 41 away from the substrate 10 and located in the groove 50, and forming a second inorganic encapsulation layer 43 on the side of the second layer of hydrophobic particles 60 away from the first inorganic encapsulation layer 41.

[0102] In some embodiments, as shown in FIGS. 5 and 6, after step 300, the method further comprises:

[0103] A light emitting material layer 32 is formed on the side of the organic layer 27 / 34 away from the substrate 10. An encapsulation layer 40 is formed on the side of the light emitting material layer 32 away from the substrate 10.

[0104] In some embodiments, as shown in FIG. 7, the method further comprises, before step 300, forming a light emitting material layer 32 on the side of the organic layer 27 / 34 away from the substrate 10, and after step 300, forming an encapsulation layer 40 on the side of the light emitting material layer 32 away from the substrate 10.

[0105] In some embodiments, as shown in FIG. 8, the method further comprises, before step 300, forming a light emitting material layer 32 on the side of the organic layer 27 / 34 away from the substrate 10, and forming a first inorganic encapsulation layer 41 on the side of the light emitting material layer 32 away from the substrate 10; and after step 300, forming a second inorganic encapsulation layer 43 on the side of the hydrophobic particles 60 away from the first inorganic encapsulation layer 41.

[0106] In some embodiments, as shown in FIG. 9, the method further comprises, after step 300, forming a light emitting material layer 32 on the side of the organic layer 27 / 34 away from the substrate 10, and filling a second layer of hydrophobic particles 60 in the portion of the recess 50 on the side of the light emitting material layer 32 away from the substrate 10. An encapsulation layer 40 is formed on the side of the second layer of hydrophobic particles 60 away from the substrate 10.

[0107] In some embodiments, as shown in FIG. 10, the method further comprises, before step 300, forming a light emitting material layer 32 on the side of the organic layer 27 / 34 away from the substrate 10, and after step 300, forming a first inorganic encapsulation layer 41 on the side of the light emitting material layer 32 away from the substrate 10, and filling a second layer of hydrophobic particles 60 in the portion of the recess 50 on the side of the first inorganic encapsulation layer 41 away from the substrate 10. A second inorganic encapsulation layer 43 is formed on the side of the second layer of hydrophobic particles 60 away from the substrate 10.

[0108] In some embodiments, as shown in FIG. 11, the method further comprises, after step 300, forming a light emitting material layer 32 on the side of the organic layer 27 / 34 away from the substrate 10, and forming a first inorganic encapsulation layer 41 on the side of the light emitting material layer 32 away from the substrate 10, and filling a second layer of hydrophobic particles 60 in the portion of the recess 50 on the side of the first inorganic encapsulation layer 41 away from the substrate 10. A second inorganic encapsulation layer 43 is formed on the side of the second layer of hydrophobic particles 60 away from the substrate 10.

[0109] In some embodiments, as shown in FIG. 12, after step 300, further comprising forming a light-emitting material layer 32 on the side of the organic layer 27 / 34 away from the substrate 10; the portion of the light-emitting material layer 32 within the groove 50 away from the substrate 10 is filled with a second layer of hydrophobic particles 60. A first inorganic encapsulation layer 41 is formed on the side of the second layer of hydrophobic particles 60 away from the substrate 10, and the portion of the first inorganic encapsulation layer 41 within the groove 50 away from the substrate 10 is filled with a third layer of hydrophobic particles 60. A second inorganic encapsulation layer 43 is formed on the side of the third layer of hydrophobic particles 60 away from the substrate 10.

[0110] In some embodiments, before filling the groove 50 with at least a portion of the hydrophobic particles 60, further comprising preparing the hydrophobic particles 60:

[0111] The hydrophobic particles 60 are prepared by reacting hydroxyl-containing inorganic nanoparticles with a silane compound, wherein the inorganic nanoparticles are made of silica or titanium dioxide, and the reaction equation is as follows:

[0112] wherein n is a positive integer, and R1, R2, and R3 are each independently selected from an alkyl group having 1-15 carbon atoms, a branched alkyl group having 3-15 carbon atoms, a fluorine group, a cycloalkyl group, or a phenyl group. R1, R2, and R3 can be the same or different. Specific examples can be found in the foregoing embodiments, which are not repeated here.

[0113] Based on the same inventive concept, the present application further provides a display device, comprising the display panel provided in the foregoing embodiments, and a housing sleeved outside the display panel.

[0114] It should be noted that the terms “first” and “second” are used only for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with “first” and “second” can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of “a plurality of” is two or more.

Claims

1. A display panel, characterized by, The display panel comprises a display area and a non-display area at least on one side of the display area, and comprises: a substrate on the display area and the non-display area; a driving circuit on the non-display area; an inorganic layer on the side of the driving circuit away from the substrate, at least on the non-display area, covering the driving circuit; an organic layer on the side of the inorganic layer away from the substrate, and on the display area and the non-display area; the organic layer is provided with at least one groove penetrating through the organic layer, and the groove is on the non-display area; hydrophobic particles on the side of the driving circuit away from the substrate, at least partially filled in the groove.

2. The display panel of claim 1, wherein, The hydrophobic particles include inorganic nanoparticles surface-modified with a hydrophobic functional group having the formula R1, R2, and R3 are each independently selected from an alkane group of 1 to 15 carbon atoms and a branched alkane group having 3 to 15 carbon atoms, a fluoro group, a cycloalkane group, or a phenyl group.

3. The display panel of claim 1, wherein, The display panel further comprises an encapsulation layer on the side of the organic layer away from the substrate, and the side of the encapsulation layer close to the substrate is provided with the hydrophobic particles.

4. The display panel of claim 1, wherein, The display panel further comprises an encapsulation layer on the side of the organic layer away from the substrate, and the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are sequentially stacked on the organic layer, and the organic encapsulation layer is on the display area; The first inorganic encapsulation layer and the second inorganic encapsulation layer are provided with the hydrophobic particles.

5. The display panel of claim 1, wherein, The display panel further comprises a light-emitting structure layer on the side of the inorganic layer away from the substrate, and the light-emitting structure layer comprises a light-emitting material layer, and the light-emitting material layer is only on the display area.

6. The display panel of claim 1, wherein, The display panel further comprises a light-emitting structure layer on the side of the inorganic layer away from the substrate, and the light-emitting structure layer comprises a light-emitting material layer; the light-emitting material layer is on the display area and the non-display area; wherein, The side of the light-emitting material layer close to the substrate is provided with the hydrophobic particles.

7. The display panel of claim 1, wherein, The display panel further comprises a light-emitting structure layer on the side of the inorganic layer away from the substrate and an encapsulation layer on the side of the light-emitting structure layer away from the substrate, and the light-emitting structure layer comprises a light-emitting material layer; the light-emitting material layer is on the display area and the non-display area; The light-emitting material layer and the encapsulation layer are provided with the hydrophobic particles.

8. The display panel of claim 1, wherein, The display panel comprises a planarization layer on the side of the driving circuit away from the substrate, and the organic layer is the planarization layer; And / or, the display panel comprises a pixel definition layer on the side of the driving circuit away from the substrate, and the organic layer is the pixel definition layer.

9. The display panel of claim 2, wherein, The material of the inorganic nanoparticles comprises silicon dioxide or titanium dioxide.

10. The display panel of claim 1, wherein, The particle size of the hydrophobic particles ranges from 100 nm to 1000 nm.

11. The display panel of claim 1, wherein, The particle size of the hydrophobic particles gradually decreases in the direction of the driving circuit pointing to the substrate.

12. The display panel according to claim 1, characterized in that The organic layer is provided with a plurality of grooves, and the plurality of grooves are arranged in the direction of the non-display area pointing to the display area, wherein, In the direction of the non-display area pointing to the display area, the distance between adjacent two grooves gradually decreases; And / or, in the direction of the non-display area pointing to the display area, the width of the groove gradually increases.

13. A method for manufacturing a display panel, characterized by, The display panel comprises a display area and a non-display area at least on one side of the display area, and the preparation method comprises: forming a driving circuit on the substrate, the driving circuit being located in the non-display region; forming an inorganic layer on a side of the driving circuit away from the substrate, the inorganic layer being located at least in the non-display region and covering the driving circuit; forming an organic layer on a side of the inorganic layer away from the driving circuit, the organic layer being provided with at least one recess penetrating through the organic layer, the recess being located in the non-display region; filling the recess with at least partially hydrophobic particles.

14. The method of manufacturing a display panel according to claim 13, wherein, Before the step of filling the recess with at least partially hydrophobic particles, the preparation method further comprises: The hydrophobic particles are obtained by reacting hydroxyl-containing inorganic nanoparticles with a silane compound, the material of the inorganic nanoparticles being silicon dioxide or titanium dioxide, and the reaction equation is as follows: wherein n is a positive integer, and R1, R2, and R3 are each independently selected from an alkane group of 1 to 15 carbon atoms, a branched alkane group of 3 to 15 carbon atoms, a fluoro group, a cycloalkane group, or a phenyl group.

15. A display device comprising: The display panel comprises the display panel as claimed in any one of claims 1 to 12.

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