Liquid-cooled power supply
By integrating a coolant channel within the housing for direct thermal communication with components and employing heat sinks and magnetic rings, the power supply achieves efficient heat dissipation and reduced thickness.
Patent Information
- Application Number
- PCT/US2025/040671
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-08
- Filing Date
- 2025-08-05
- Publication Date
- 2026-02-12
Smart Images

Figure US2025040671_12022026_PF_FP_ABST
Abstract
Description
[0001] LIQUID-COOLED POWER SUPPLY
[0002] Cross Reference to Related Applications
[0003]
[0001] This application claims the benefit of the August 8, 2024 priority date of U.S. Application No. 63 / 680,786, the contents of which are hereby incorporated by reference in their entirety.
[0004] Background
[0005]
[0002] A power supply includes a housing having heat-generating components and a heat-disposal system. A known heat disposal system is a plate having pipes extending therethrough and to circulate coolant through the pipes. Heat from the internal components of the power supply then flows through the housing, through the plate, and into the coolant. This heat is then disposed of outside the power supply.
[0006]
[0003] A difficulty with this approach is that the plate has a thickness. As the housing has become smaller, the plate’s thickness has remained substantially the same.
[0007] Accordingly, the plate now accounts for a significant fraction of the power supply’s thickness.
[0008] Summary
[0009]
[0004] The invention remedies the foregoing difficulty by passing the coolant through the housing.
[0010]
[0005] In one aspect, the invention features a power supply that includes a housing, components disposed inside the housing, an inlet, an outlet, and a channel that extends between the inlet and outlet and that passes through the housing. The channel is in thermal communication with the components. Coolant that flows through the inlet and into the housing absorbs heat generated by the components via conduction and conveys the heat to the outlet and outside of the housing.
[0011]
[0006] Embodiments include those in which the channel is in thermal communication with an inner surface of the housing, those in which the channel is separated from an inner surface of the housing by a gap, those in which the channel comprises a portion that is separated from an inner surface of the housing by a gap and a portion that is in thermal communication with the inner surface, those in which the channel comprises a heat sink that is in thermal communication with one of the components, a first external segment that connects the heat sink to the inlet, and a second external segment that connects the heat sink to the outlet, those in which the channel comprises heat sinks in thermal communication with corresponding components and an internal segment that connects the heat sinks, and those in which the channel comprises a heat sink that is in thermal communication with one of the components, wherein the heat sink comprises a meandering path for flow of the coolant. Further embodiments include those that comprise magnets disposed around the channel at the inlet and at the outlet and those that comprise a plastic section outside the housing.
[0012]
[0007] These and other features of the invention will be apparent from the following detailed descriptions and the accompanying drawings, in which:
[0013] Description of Drawings
[0014]
[0008] FIG. 1 shows an external view of a power supply showing a coolant inlet and a coolant outlet;
[0015]
[0009] FIG. 2 shows a plan view of one embodiment of the power supply in FIG. 1 ;
[0016]
[0010] FIG. 3 shows an exploded view of the embodiment shown in FIG. 2;
[0017] [Oil] FIG. 4 shows a plan view of an alternative embodiment of the power supply in
[0018] FIG. 1;
[0019]
[0012] FIG. 5 shows a channel for use in yet another embodiment of the power supply in FIG. 1;
[0020]
[0013] FIG. 6 shows a plan view of an embodiment of the power supply of FIG. 1 that uses the channel of FIG. 5; and
[0021]
[0014] FIG. 7 shows an exploded view of the power supply of FIG. 6.
[0022] Detailed Description
[0023]
[0015] FIG. 1 shows a power supply 10 having a housing 12. The power supply 10 also includes an inlet 14 through which a cooling fluid enters the housing 12 and an outlet 16 through which the cooling fluid exits the housing after having absorbed heat generated inside the housing 12. An external pump provides energy to cause the fluid to flow through inlet 14 and out the outlet 16.
[0016] Referring now to FIG. 2 and the exploded view in FIG. 3, a channel 18 connects the inlet 14 to the outlet 16. The channel 18 lies against an inner surface 20 of the housing 12. In addition, the channel 18 contacts components 22, 24, 26 of the power supply 10. Examples of components 22, 24, 26 include capacitors and inductors.
[0024]
[0017] As a result of such contact, thermal energy flows between the components 22, 24, 26 and the channel 18 via conduction rather than convection or radiation. Such contact will be referred to herein as “thermal communication.” This “thermal communication” is direct thermal communication and excludes indirect thermal communication as well as both heat transfer that is mediated by thermally-induced movement of an intervening fluid and heat transfer that is mediated by quanta of electromagnetic radiation.
[0025]
[0018] Heat generated by the components 22, 24, 26 passes into the cooling fluid via conduction through the wall of the channel 18. The cooling fluid passes through the channel 18 and eventually exits at the outlet 16. Heat absorbed by the cooling fluid is then dissipated outside of the housing 12. To promote thermal conductivity, it is useful for the channel 18 to be made of a good heat conductor, such as a metal.
[0026]
[0019] FIG. 4 shows an alternative embodiment similar to that shown in FIG. 2 but with the channel 18 being separated from the inner surface 20 by a gap 28. This embodiment allows components 22, 24, 26 to be placed on either side of the channel 18. In some embodiments, portions of the channel 18 are in contact with the inner surface 20 whereas other portions are separated by the inner surface 20.
[0027]
[0020] FIG. 5 shows a channel 18 that is formed from joining heatsinks 32, 34, 36 to segments 38, 40, 42, 44. Among these are external segments 38, 40 that join corresponding heat sinks 32, 36 to one of the inlet 14 and outlet 16, and one or more internal segments 42, 44 that join heatsinks 32, 34, 36 to each other. FIG. 5 also shows that the cross section of the channel 18 is rectangular to permit greater surface contact area. Preferably, the channel 18 extends vertically by an amount that is comparable to the vertical extent of the housing’s inner surface 20.
[0028]
[0021] FIGS. 6 and 7 show a top view and an exploded view, respectively, of a power supply 10 that uses the channel 18 shown in FIG. 5. As is apparent from FIG. 6, the heat sinks 32, 34, 36 feature a meandering path 46 for coolant flow. This promotes greater heat transfer within the heat sink 32, 34, 36.
[0022] During the course of a power supply’s operation, there will exist time-varying currents on metal surfaces within the housing 12. These metal surfaces include that of the channel 18. These time- varying currents serve as a source for launching electromagnetic waves. To entrap these waves within the housing 12, it is useful for the housing’s walls to be made of metal.
[0029]
[0023] The inlet 14 and outlet 16 represent gaps in the housing’s wall. This creates the possibility of electromagnetic waves leaking through these gaps and causing interference in the power supply’s vicinity. In addition, nothing prevents currents induced on the channel 18 inside the housing 12 from continuing to exist in those portions of the channel 18 that are outside the housing 12. These currents will likewise launch electromagnetic waves outside the housing 12.
[0030]
[0024] One embodiment features first and second magnetic rings 48, 50. The first magnetic ring 48 is disposed around the channel 18 at a region in which the channel 18 couples to the input 14. The second magnetic ring 50 is disposed around the channel 18 at a region in which the channel couples to the output 16. Another embodiment features non-conductive sections of the channel 18 outside the housing. Suitable non-conductive sections are those made of plastic.
[0031]
[0025] Having described the invention and a preferred embodiment thereof, what we claim as new and secured by letters patent is:
Claims
CLAIMS1. An apparatus comprising a power supply, said power supply comprising a housing, components disposed inside said housing, an inlet, an outlet, and a channel that extends between said inlet and outlet and that passes through said housing, said channel being in thermal communication with said components, wherein coolant that flows through said inlet and into said housing absorbs heat generated by said components via conduction and conveys said heat to said outlet and outside of said housing.
2. The apparatus of claim 1, wherein said channel is in thermal communication with an inner surface of said housing.
3. The apparatus of claim 1 , wherein said channel is separated from an inner surface of said housing by a gap.
4. The apparatus of claim 1, wherein said channel comprises a portion that is separated from an inner surface of said housing by a gap and a portion that is in thermal communication with said inner surface.
5. The apparatus of claim 1, wherein said channel comprises a heat sink that is in thermal communication with one of said components, a first external segment that connects said heat sink to said inlet, and a second external segment that connects said heat sink to said outlet.
6. The apparatus of claim 1, wherein said channel comprises heat sinks in thermal communication with corresponding components and an internal segment that connects said heat sinks.
7. The apparatus of claim 1, wherein said channel comprises a heat sink that is in thermal communication with one of said components, wherein said heat sink comprises a meandering path for flow of said coolant.
8. The apparatus of claim 1, further comprising magnets disposed around said channel at said inlet and at said outlet.
9. The apparatus of claim 1, wherein said channel comprises a plastic section outside said housing.
Citation Information
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