Power components, liquid-cooled power modules and charging systems

Abstract

This application provides a power component, a liquid-cooled power module, and a charging system, relating to the field of heat dissipation technology for electronic devices. The power component is housed within a sealed housing of the liquid-cooled power module. The sealed housing contains an insulating coolant that submerges the power component. The sealed housing has an oil inlet and an oil outlet, with the oil outlet positioned higher than the oil inlet. The power component includes a printed circuit board (PCB) and power circuitry integrated onto the PCB. The PCB has multiple temperature zones arranged sequentially along the depth of the liquid coolant, each containing various types of devices from the power circuitry. The temperature thresholds of the various devices increase from bottom to top along the depth of the liquid coolant. This application enables balanced heat dissipation for electronic devices.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more specifically, to a power component, a liquid-cooled power module, and a charging system. Background Technology

[0002] In the design of fully immersed liquid-cooled power modules, the insulating coolant is usually mineral oil or other highly insulating media. Due to the thermal expansion of oil, the heated oil will automatically flow to the upper layer of the sealed housing, while the unheated oil will sink to the bottom of the sealed housing. This results in a clear heat distribution pattern of the insulating coolant in the sealed housing, that is, the temperature of the lower layer of insulating coolant is low and the temperature of the upper layer of insulating coolant is high.

[0003] Most existing power modules are air-cooled, and their heat dissipation and the layout of electronic components in the printed circuit board are designed according to airflow. The temperature control is seriously uneven and cannot be applied to immersion liquid-cooled power modules. Utility Model Content

[0004] The purpose of this application is to address the shortcomings of the prior art by providing a power component, a liquid-cooled power module, and a charging system to achieve balanced heat dissipation of electronic devices.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0006] In a first aspect, embodiments of this application provide a power component, which is disposed within a sealed housing of a liquid-cooled power module. The sealed housing contains an insulating coolant that submerges the power component. The sealed housing is provided with an oil inlet and an oil outlet, with the oil outlet positioned higher than the oil inlet. The power component includes: a printed circuit board and a power circuit integrated on the printed circuit board.

[0007] The printed circuit board has multiple temperature zones arranged sequentially along the oil depth direction, and various types of devices in the power circuit are respectively arranged in the multiple temperature zones.

[0008] Along the oil depth direction from bottom to top, the temperature thresholds of the various types of devices increase from low to high.

[0009] Optionally, the plurality of temperature zones include at least a first temperature zone near the oil inlet and a third temperature zone near the oil outlet, wherein the first temperature zone includes at least a control device and the third temperature zone includes at least a magnetic device.

[0010] Optionally, the plurality of temperature zones include, from bottom to top, a first temperature zone, a second temperature zone, and a third temperature zone, wherein the temperature of the insulating coolant in the first temperature zone is the lowest, and the temperature of the insulating coolant in the third temperature zone is the highest.

[0011] The first temperature region includes at least a control device, the second temperature region includes at least a capacitor and a power device, and the third temperature region includes at least a magnetic device.

[0012] Optionally, at least one of the following electronic devices is placed in the first temperature zone: an ACDC controller, a DCDC controller, a grating coupler, an operational amplifier, a module chip, or a surface-mount electronic device.

[0013] Optionally, the second temperature zone contains at least one of the following electronic devices: an auxiliary power supply unit, a switching device, an aluminum electrolytic capacitor, a gold film capacitor, and a relay.

[0014] Optionally, the third temperature zone may contain at least one of the following electronic devices: a transformer, an inductor, an electromagnetic compatibility module, and a high-temperature power device.

[0015] Optionally, the power component includes: a mounting plate and a printed circuit board fixed on the mounting plate, the printed circuit board having integrated power circuitry, and the mounting plate being used to fix it within the sealed housing;

[0016] The power component includes two printed circuit boards, which are disposed on both sides of the mounting plate.

[0017] Optionally, the power circuit includes an ACCDC circuit and a DCCDC circuit, with the printed circuit boards corresponding to the ACCDC circuit and the DCCDC circuit disposed on both sides of the mounting plate.

[0018] Secondly, embodiments of this application also provide a liquid-cooled power module, the liquid-cooled power module comprising: a sealed housing, a power component as described in any of the first aspects, an oil inlet, an oil outlet, and an electrical connection terminal, the electrical connection terminal being connected to the power component;

[0019] The power component is fixedly disposed inside the sealed housing, and the sealed housing contains an insulating coolant that immerses the power component.

[0020] The oil inlet is located at a first position on the side wall of the sealing housing, and the oil outlet is located at a second position on the side wall of the sealing housing, the second position being higher than the first position;

[0021] The electrical connection terminal is located at a third position on the outer wall of the sealed housing, and the third position is higher than the second position.

[0022] Thirdly, embodiments of this application also provide a charging system, the charging system comprising: a plurality of liquid-cooled power modules, wherein the liquid-cooled power modules are as described in the second aspect.

[0023] The beneficial effects of this application are:

[0024] The power components, liquid-cooled power modules, and charging systems provided in this application divide the printed circuit board into multiple temperature zones according to the temperature distribution of the insulating coolant. Various types of devices in the power circuit are arranged in each of these temperature zones. This allows for the arrangement of electronic devices based on their temperature thresholds, effectively balancing the heat dissipation of the electronic devices and controlling the temperature rise of each device within a small range, thus ensuring the normal operation of the power components. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A plan view of the liquid-cooled power module provided in the embodiments of this application;

[0027] Figure 2 A schematic diagram of temperature distribution provided for an embodiment of this application;

[0028] Figure 3 The circuit schematic diagram of the charging module provided in the embodiments of this application;

[0029] Figure 4 The circuit schematic diagram of the ACDC circuit provided in the embodiments of this application;

[0030] Figure 5 The circuit schematic diagram of the DC-DC circuit provided in the embodiments of this application;

[0031] Figure 6 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 1 ;

[0032] Figure 7 Installation diagram of the power component provided in the embodiments of this application Figure 1 ;

[0033] Figure 8Installation diagram of the power component provided in the embodiments of this application Figure 2 ;

[0034] Figure 9 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 2 ;

[0035] Figure 10 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 1 ;

[0036] Figure 11 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 2 ;

[0037] Figure 12 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 3 ;

[0038] Figure 13 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 4 ;

[0039] Figure 14 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 5 ;

[0040] Figure 15 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 6 . Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0042] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0043] In the description of this application, it should be noted that if the terms "upper", "lower", etc. appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in, it is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0044] Furthermore, the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0045] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0046] Figure 1 This is a plan view of the liquid-cooled power module provided in the embodiments of this application, as shown below. Figure 1 As shown, the power component 12 is disposed inside the sealed housing 11 of the liquid-cooled power module. The sealed housing 11 contains insulating coolant that immerses the power component 12. The sealed housing 11 is provided with an oil inlet 13 and an oil outlet 14, with the oil outlet 14 positioned higher than the oil inlet 13.

[0047] The power component 12 includes a printed circuit board and a power circuit integrated on the printed circuit board. The printed circuit board has multiple temperature zones arranged sequentially along the oil depth direction, and multiple types of devices in the power circuit are respectively arranged in the multiple temperature zones. The temperature thresholds of the multiple types of devices increase from low to high along the oil depth direction from bottom to top.

[0048] In this embodiment, Figure 2 A temperature distribution diagram provided for an embodiment of this application, such as... Figure 2 As shown, based on the characteristics of convection and top-to-bottom cooling of the insulating coolant when heated, the temperature of the insulating coolant in the sealed housing 11 increases from bottom to top. According to the temperature distribution of the insulating coolant, the printed circuit board can be divided into multiple temperature zones along the oil depth direction, that is, along the longitudinal direction. Each temperature zone corresponds to a temperature range of the insulating coolant.

[0049] It should be noted that the insulating coolant filling the sealed housing 11 is a single unit, and the temperature of the insulating coolant at different heights does not have a clear boundary. Therefore, the multiple temperature zones divided for the printed circuit board do not have fixed boundaries. It is only necessary to clarify that the temperature of the insulating coolant immersed in the printed circuit board from bottom to top is from low to high.

[0050] Based on the temperature threshold of the electronic devices contained in the power circuit of the printed circuit board, electronic devices with different temperature thresholds are set in different temperature regions.

[0051] Since the temperature of the insulating coolant near the oil inlet is the lowest and the temperature of the insulating coolant near the oil outlet is the highest, electronic devices can be arranged in order of increasing temperature threshold. Specifically, electronic devices with low temperature thresholds are placed in the temperature region near the oil inlet, electronic devices with high temperature thresholds are placed in the temperature region near the oil outlet, and electronic devices with medium temperature thresholds are placed in the middle temperature region.

[0052] Among them, the temperature threshold can represent the temperature resistance of an electronic device, or it can represent the heat dissipation of an electronic device. Temperature resistance is a property parameter of an electronic device, while heat dissipation is the measured temperature of an electronic device.

[0053] In some embodiments, the low-temperature resistant device is located in the temperature region near the oil inlet, the high-temperature resistant device is located in the temperature region near the oil outlet, and the medium-temperature resistant device is located in the middle temperature region.

[0054] In some embodiments, the low-temperature heat dissipation device is located in the temperature region near the oil inlet, the high-temperature heat dissipation device is located in the temperature region near the oil outlet, and the medium-temperature heat dissipation device is located in the middle temperature region.

[0055] In some embodiments, the height of the electronic device is positively correlated with its temperature threshold, wherein the lower the height of the electronic device, the lower the temperature threshold, and the higher the height of the electronic device, the higher the temperature threshold.

[0056] The power component provided in the above embodiments divides the printed circuit board into multiple temperature zones according to the temperature distribution of the insulating coolant. Multiple types of devices in the power circuit are arranged in each of the multiple temperature zones. This allows for the arrangement of electronic devices according to their temperature thresholds, effectively balancing the heat dissipation of the electronic devices and controlling the temperature rise of each electronic device within a small range, thus ensuring the normal operation of the power component.

[0057] In one possible implementation, the multiple temperature zones include at least a first temperature zone near the oil inlet and a third temperature zone near the oil outlet. The first temperature zone includes at least a control device, and the third temperature zone includes at least a magnetic device.

[0058] Specifically, the printed circuit board is divided into at least two temperature zones, namely a first temperature zone and a third temperature zone. The first temperature zone is close to the oil inlet and is used to place electronic devices with a lower temperature threshold, such as control devices. The third temperature zone is close to the oil outlet and is used to place electronic devices with a higher temperature threshold, such as magnetic devices.

[0059] Among them, the temperature threshold of electronic devices is relative. For all electronic devices contained in the power circuit, according to the number of electronic devices that can be arranged in the first temperature region and the third temperature region, the electronic devices are divided into electronic devices with smaller temperature thresholds and electronic devices with larger temperature thresholds.

[0060] The division of the first and third temperature zones can be flexibly determined. For example, the temperature zones can be divided according to the temperature variation range of the insulating coolant in the direction of oil depth. This embodiment does not impose any restrictions on this.

[0061] In another possible implementation, the multiple temperature zones are arranged from bottom to top as follows: a first temperature zone, a second temperature zone, and a third temperature zone, wherein the first temperature zone has the lowest temperature of the insulating coolant and the third temperature zone has the highest temperature of the insulating coolant; the first temperature zone includes at least a control device, the second temperature zone includes at least a capacitor and a power device, and the third temperature zone includes at least a magnetic field.

[0062] Specifically, the first temperature zone has the lowest insulating coolant temperature, the third temperature zone has the highest insulating coolant temperature, and the second temperature zone has a moderate insulating coolant temperature. The first, second, and third temperature zones can also be referred to as the low-temperature zone, the moderate-temperature zone, and the high-temperature zone, respectively.

[0063] Taking 1U height as an example, electronic devices with a height lower than U / 3 can be placed in the low temperature zone, electronic devices with a height of U / 3 to 2U / 3 can be placed in the suitable temperature zone, and electronic devices with a height higher than 2U / 3 can be placed in the high temperature zone.

[0064] Electronic devices on printed circuit boards are classified into three categories: control devices, capacitors and power devices, and magnetic devices. Control devices, such as microcontrollers, can be placed in low-temperature areas, capacitors and power devices in suitable-temperature areas, and magnetic devices, such as transformers, can be placed in high-temperature areas.

[0065] It should be noted that the placement of electronic components follows the principle of backward compatibility, meaning that electronic components can be placed in a temperature range lower than their own temperature threshold. For example, a transformer can be placed in a high-temperature range, but it can also be placed in a suitable temperature range with backward compatibility. However, under normal circumstances, electronic components should not be placed in a temperature range higher than their own temperature threshold.

[0066] In some implementations, at least one of the following electronic devices is placed in the first temperature zone: an AC / DC controller, a DC / DC controller, a grating coupler, an operational amplifier, a module chip, or a surface-mount electronic device.

[0067] In other embodiments, the second temperature zone contains at least one of the following electronic devices: an auxiliary power supply unit, a switching device, an aluminum electrolytic capacitor, a gold film capacitor, and a relay.

[0068] In other embodiments, at least one of the following electronic devices is placed in the third temperature zone: a transformer, an inductor, an electromagnetic compatibility module, and a high-temperature power device.

[0069] Taking a charging module as an example, this section explains the positional arrangement of various electronic components on the printed circuit board within the charging module.

[0070] For example, Table 1 is an example of the distribution of electronic devices provided in the embodiments of this application. As shown in Table 1, the electronic devices placed in each temperature zone follow the corresponding placement principles. Among them, low-temperature threshold devices with low device height and low power consumption can be placed in the low-temperature zone, medium-temperature threshold devices with moderate device height and moderate power consumption can be placed in the suitable temperature zone, and high-temperature threshold devices with high device height and high power consumption can be placed in the high-temperature zone.

[0071] Table 1 Examples of Electronic Component Distribution

[0072]

[0073] It can be seen that components with low height, such as the Digital Signal Processing (DSP) unit, Microcontroller (MCU), Field Programmable Gate Array (FPGA), optocoupler, analog chip, and various surface-mount devices in the charging module, can be placed in the low-temperature zone; auxiliary power supply unit, relay, main power transistor, aluminum electrolytic capacitor, and other components can be placed in the suitable temperature zone; magnetic components, EMC unit, and other components are placed in the high-temperature zone.

[0074] Example, Figure 3 The circuit schematic diagram of the charging module provided in the embodiments of this application is as follows: Figure 3 As shown, the charging module may include: an input electromagnetic compatibility (EMC) module, an input soft-start module, an ACDC controller, an ACDC circuit, a DCDC controller, a DCDC circuit, an auxiliary power supply, an output EMC module, and other control auxiliary circuits.

[0075] Figure 4 The circuit schematic diagram of the ACDC circuit provided in the embodiments of this application is as follows: Figure 4 As shown, the key components of an ACDC circuit may include: MOSFETs, diodes, resistors, insulated-gate bipolar transistors (IGBTs), capacitors, and resonant inductors.

[0076] Figure 5 The circuit schematic of the DCDC circuit provided in the embodiments of this application is as follows: Figure 5 As shown, the key components of a DC-DC circuit may include: transformer, diode, capacitor, and relay.

[0077] As can be seen, the electronic components in charging modules, ACDC circuits, and DCDC circuits can be categorized into the following types: transformers, inductors, switching devices, capacitors, relays, and controllers. Figure 6 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 1 ,like Figure 6 As shown, high-temperature threshold devices such as transformers and inductors are placed in the high-temperature zone, medium-temperature threshold devices such as switching devices, relays, and capacitors are placed in the suitable-temperature zone, and low-temperature threshold devices such as ACDC controllers and DCDC controllers are placed in the low-temperature zone.

[0078] The power component provided in the above embodiments places electronic devices with different temperature thresholds in the power circuit in different temperature regions. Since the temperature of the insulating coolant is different in different temperature ranges, heat dissipation is carried out separately for electronic devices with different temperature thresholds, which can effectively balance the heat dissipation of electronic devices and control the temperature rise of each electronic device within a small range, ensuring the normal operation of the power component.

[0079] In one possible implementation, Figure 7 Installation diagram of the power component provided in the embodiments of this application Figure 1 ,like Figure 7 As shown, the power assembly 12 may include a mounting plate 121 and a printed circuit board 122 fixed on the mounting plate 121. The printed circuit board 122 integrates power circuitry, and the mounting plate 121 is used to fix it inside the sealed housing 11. The mounting plate 121 may be a metal mounting plate.

[0080] In this embodiment, the sealed housing 11 may be provided with a mounting groove. After the printed circuit board 122 is mounted on the mounting plate 121, the mounting plate 121 can be installed in the sealed housing 11 through the mounting groove.

[0081] By detachably fixing the printed circuit board 122 to the mounting plate 121, the printed circuit board 122 can be flexibly removed and installed in the sealed housing 11 as needed. In addition, a new printed circuit board can be replaced after the printed circuit board 122 is damaged.

[0082] In some embodiments, Figure 8 Installation diagram of the power component provided in the embodiments of this application Figure 2 ,like Figure 8 As shown, the power component 12 includes two printed circuit boards 122, which are disposed on both sides of the mounting plate 121.

[0083] Specifically, when the power circuit is integrated on multiple printed circuit boards 122, the printed circuit boards 122 can be fixed on both sides of the mounting plate 121. The two printed circuit boards 122 are PCBA1 and PCBA2, respectively. In this way, the number of mounting plates 121 can be saved, and the volume of the liquid-cooled power module can be reduced.

[0084] The power component provided in the above embodiments allows for flexible removal and installation of the printed circuit board within the housing by detachably fixing the printed circuit board to the mounting plate. Furthermore, it facilitates the replacement of a new printed circuit board after damage.

[0085] In some embodiments, the power circuit includes an ACCDC circuit and a DCCDC circuit, wherein the printed circuit boards corresponding to the ACCDC circuit and the DCCDC circuit are disposed on opposite sides of the mounting plate.

[0086] Specifically, the space available for each temperature zone on a printed circuit board is limited, as is the number of electronic components it can accommodate. Therefore, the AC / DC and DC / DC converter sections in the charging module can be separated and laid out on two separate printed circuit boards, such as... Figure 8 As shown, the electronic components of the ACDC section can be laid out on PCBA1, and the electronic components of the DCDC section can be laid out on PCBA2.

[0087] Figure 9 A schematic diagram of the partitioning of a printed circuit board provided in the embodiments of this application. Figure 2 ,like Figure 9As shown, after separating the ACDC and DCDC sections and laying them out on two separate printed circuit boards, the electronic components of the DCDC section can be partitioned on the printed circuit board as follows: high-temperature threshold devices such as transformers and inductors are placed in the high-temperature zone; medium-temperature threshold devices such as relays and diodes are placed in the suitable-temperature zone; and low-temperature threshold devices such as the DCDC controller are placed in the low-temperature zone. Since there is sufficient space for each temperature zone on the printed circuit board after separating the ACDC and DCDC sections and laying them out on two separate printed circuit boards, capacitors and switching devices can be placed in the suitable-temperature zone or the low-temperature zone as needed, based on the principle of backward compatibility. Figure 9 The circles shown represent capacitors.

[0088] The power component provided in the above embodiments places the ACDC circuit and the DCDC circuit on two printed circuit boards. The electronic components in the ACDC circuit and the DCDC circuit are arranged on the two printed circuit boards based on temperature thresholds, which can effectively balance the heat dissipation of the electronic components and control the temperature rise of each component within a small range, ensuring the normal operation of the power component.

[0089] Based on the power component described above, this application embodiment also provides a liquid-cooled power module including the power component. Figure 10 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 1 ,like Figure 10 As shown, the liquid-cooled power module may include: a sealed housing 11, a power component 12, an oil inlet 13, an oil outlet 14, and an electrical connection terminal 15, which is connected to the power component 12.

[0090] The power component 12 is fixedly disposed inside the sealed housing 11, and the sealed housing 11 contains an insulating coolant that immerses the power component 12.

[0091] The oil inlet 13 is located at a first position on the side wall of the sealing housing 11, and the oil outlet 14 is located at a second position on the side wall of the sealing housing 11, with the second position being higher than the first position.

[0092] After the insulating coolant flows out of the sealing housing 11 through the oil outlet 14 to dissipate heat, it re-enters the sealing housing 11 through the oil inlet 13.

[0093] The electrical connection terminal 15 is located at a third position on the outer wall of the sealed housing 11, and the third position is higher than the second position.

[0094] In this embodiment, the sealing housing 11 can be, for example, a metal sealing housing, and the shape of the sealing housing 11 can be a cuboid or a cube. The sealing housing 11 can be a fully sealed structure. The material of the sealing housing 11 can be sheet metal, aluminum profile, or other alloy materials, etc., and this embodiment does not limit this.

[0095] The oil inlet 13 is located below one side of the sealing housing 11, so that the insulating coolant with the lowest temperature entering the sealing housing 11 is concentrated at the bottom of the sealing housing 11, which can better cool the low temperature threshold devices at the bottom of the power assembly 12.

[0096] In some embodiments, the oil inlet 13 is located below the lowest point of the power component 12 within the sealing housing 11, such that the insulating coolant with the lowest temperature entering the sealing housing 11 is concentrated at the bottom of the sealing housing 11.

[0097] The setting height of the oil outlet 14 is related to the height of the power devices on the power assembly 12. The second position of the oil outlet 14 should be higher than the highest power device in the oil depth direction of the power assembly 12 so that the coolant can cover all the power devices.

[0098] In some embodiments, the oil outlet 14 is positioned higher than the highest point of the power component 12 within the sealed housing 11, so that the insulating coolant can completely submerge the power component 12, ensuring that all devices distributed on the power component 12 can be effectively cooled.

[0099] The electrical connection terminal 15 may include an input terminal, an output terminal, and a communication terminal. The input terminal and the output terminal can be connected to the power component 12 via cables or copper busbars, and the communication terminal can be connected to the power component 12 via cables.

[0100] The electrical connection terminal 15 is positioned higher than the oil outlet 14. Thus, when the insulating coolant fills the interior of the sealed housing 11, the highest liquid level of the insulating coolant is located at the oil outlet 14, and the insulating coolant will not submerge the electrical connection terminal 15. On the one hand, this can effectively prevent the insulating coolant from leaking through the part of the electrical connection terminal 15 that contacts the sealed housing 11. On the other hand, since the electrical connection terminal 15 does not contact the insulating coolant, a terminal with a lower protection level can be selected, reducing the cost of selecting the electrical connection terminal 15.

[0101] In some embodiments, such as Figure 10 As shown, the sealed housing 11 adopts a cuboid or cube structure with an open top. The liquid-cooled power module may also include an upper cover plate 16, and electrical connection terminals 15 may be disposed on the upper cover plate 16.

[0102] The upper cover plate 16 covers the upper opening of the sealing housing 11 and is fixedly connected to the sealing housing 11 by screws, so that the sealing housing 11 forms a seal.

[0103] Furthermore, since the highest liquid level of the insulating coolant reaches the height of the oil outlet 14, and the electrical connection terminal 15 is higher than the oil outlet 14, the insulating coolant will not completely fill the sealed housing 11, so the sealing design of the upper cover plate 16 does not need to be tightened.

[0104] In some embodiments, the upper cover plate 16 and the sealing housing 11 can be sealed with a sealing strip.

[0105] Furthermore, a groove is provided on the upper surface of the side wall of the sealing housing 11, and the sealing strip is disposed in the groove.

[0106] Furthermore, the diameter of the sealing strip is greater than the depth of the groove, meaning that after the sealing strip is placed in the groove, there will be a certain protrusion in the depth direction. The upper cover plate 16 covers the opening of the sealing housing 11, and the sealing strip is pressed downward to achieve a seal.

[0107] For example, an oil-resistant rubber ring made of oil-resistant fluororubber or nitrile rubber can be used for sealing.

[0108] In some embodiments, the insulating coolant may be a liquid with high insulation and high specific heat capacity, including but not limited to hydrocarbon oils, alkane oils, fluorinated liquids, silicone oils, mineral oils, etc., and this embodiment does not impose any restrictions on this.

[0109] The liquid-cooled power module provided in the above embodiments, by setting an oil inlet located below the lowest point of the power component, an oil outlet located above the highest point of the power component, and an electrical connection terminal located above the oil outlet, ensures that the insulating coolant can not only completely immerse the power component, but also effectively prevents leakage of the insulating coolant through the part in contact with the sealed housing because the insulating coolant will not come into contact with the electrical connection terminal. Furthermore, terminals with lower protection levels can be selected, reducing the cost of selecting electrical connection terminals.

[0110] In some embodiments, such as Figure 10 As shown, the power components 12 may include multiple power components 12, which are vertically arranged inside the sealed housing 11, and all power components 12 are electrically connected to the electrical connection terminals 15.

[0111] In this embodiment, the power circuit can be distributed on multiple power components 12 according to the scale of the power circuit. The multiple power components 12 can be uniformly arranged in the sealed housing 11. The multiple power components 12 are arranged vertically in the sealed housing 11 and are parallel to each other. The multiple power components 12 are electrically connected to the electrical connection terminal 15.

[0112] The fully immersion liquid-cooled power module provided in the above embodiments can accommodate multiple power components within a sealed housing to meet the scale requirements of different power circuits, thus having a wider range of applications.

[0113] As the power components dissipate heat during operation, the temperature of the insulating coolant continuously rises. To further improve the heat dissipation effect of the liquid-cooled power module, a heat dissipation unit needs to be installed for the liquid-cooled power module.

[0114] In one possible implementation, the liquid-cooled power module may further include: a heat dissipation unit; the heat dissipation unit is connected to the oil inlet 13 and the oil outlet 14 respectively, and the insulating coolant enters the heat dissipation unit through the oil outlet 14 for heat dissipation, and then enters the sealed housing 11 through the oil inlet 13.

[0115] Specifically, the heat dissipation unit can be set inside the sealed housing 11 or outside the sealed housing 11. If the heat dissipation unit is set inside the sealed housing 11, a separate cavity for the heat dissipation unit needs to be set inside the sealed housing 11. This cavity is independent of the cavity where the power component 12 is located and is only connected through the oil inlet 13 and the oil outlet 14.

[0116] After the power component operates and generates heat, the insulating coolant is heated. When the temperature of the insulating coolant rises to a certain temperature, the insulating coolant enters the heat dissipation unit through the oil outlet 14. After being dissipated in the heat dissipation unit, it re-enters the cavity where the power component 12 is located through the oil inlet 13.

[0117] In some embodiments, based on the different densities of the insulating coolant at different temperatures, and its characteristics of convection and top-heating-bottom-cooling when heated, when the power component heats the insulating coolant, the hotter insulating coolant accumulates above the sealing housing 11, and the cooler insulating coolant accumulates below the sealing housing 11. Thus, the hotter insulating coolant enters the heat dissipation unit through the oil outlet 14 located above the sealing housing 11 for heat dissipation, and the cooled insulating coolant then enters the cavity where the power component 12 is located through the oil inlet 13 located below the sealing housing 11. This can achieve circulating cooling of the insulating coolant and prevent the power component from malfunctioning due to the high temperature of the insulating coolant.

[0118] In some embodiments, the heat dissipation unit is disposed outside the sealed housing. Figure 11 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 2 ,like Figure 11 As shown, the heat dissipation unit may include: a return circulation pipe 17, a cooling circulation pump 18, a first cooling fan 19, and a radiator 20.

[0119] The return circulation pipe 17 is connected to the oil inlet 13 and the oil outlet 14 through the cooling circulation pump 18. The first cooling fan 19 and the radiator 20 are installed on the return circulation pipe 17 between the oil outlet 14 and the cooling circulation pump 18. They are used to cool down the insulating coolant drawn by the cooling circulation pump 18 from the oil outlet 14, and then flow into the sealed housing 11 through the oil inlet 13.

[0120] In this embodiment, the inlet of the cooling circulation pump 18 is connected to the oil outlet 14 through a part of the return circulation pipe 17, and the outlet of the cooling circulation pump 18 is connected to the oil inlet 13 through another part of the return circulation pipe 17. The cooling circulation pump 18 draws the high-temperature insulating coolant located in the upper layer of the sealed housing 11 from the oil outlet 14 through a part of the return circulation pipe 17 into the cooling circulation pump 18. During the drawing process, the outflowing insulating coolant exchanges heat with the air through the first cooling fan 19 and the radiator 20, and the temperature of the insulating coolant decreases. Then, it flows back into the sealed housing 11 through another part of the return circulation pipe 17.

[0121] In some embodiments, the oil outlet 14 is provided with a temperature sensor, which communicates with the cooling circulation pump 18. The cooling circulation pump 18 starts working when it detects that the temperature value of the oil outlet 14 has reached a preset temperature threshold, and extracts the high-temperature insulating coolant.

[0122] In some embodiments, such as Figure 11 As shown, the heat dissipation unit may also include an oil reservoir 21, which is also connected to the oil inlet 13 through the return circulation pipe 17. When the insulating coolant in the sealed housing 11 is insufficient, the insulating coolant can be replenished through the oil reservoir 21.

[0123] The liquid-cooled power module provided in the above embodiment uses a heat dissipation unit consisting of a cooling circulation pump, a first heat dissipation fan, a radiator, and a return circulation pipe to cool the high-temperature insulating coolant and then re-inject it into the sealed housing. This achieves circulating cooling of the insulating coolant, ensuring that the insulating coolant can dissipate heat from the power components and enable the power components to operate normally and reliably.

[0124] In another possible implementation, the heat dissipation unit can be housed within a sealed housing, and the liquid-cooled power module and the heat dissipation unit can be combined to form a self-cooling liquid-cooled power module.

[0125] Specifically, Figure 12 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 3 ,like Figure 12 As shown, the sealing housing 11 has a first cavity 22 and a second cavity 23, which are arranged adjacent to each other through a spacer sidewall 24.

[0126] The power component 12 is fixedly disposed in the first cavity 22, which contains an insulating coolant that immerses the power component 12.

[0127] The partition sidewall 24 is provided with a first return port 25 and a second return port 26. The position of the first return port 25 is lower than that of the second return port 26. The first return port 25 and the second return port 26 connect the first cavity 22 and the second cavity 23. The insulating coolant enters the second cavity 23 through the second return port 26 for heat dissipation, and then re-enters the first cavity 22 through the first return port 25.

[0128] In this embodiment, as Figure 12 As shown, the sealing housing 11 is made of aluminum profile or die-cast integral sealing housing. A first cavity 22 and a second cavity 23 are formed inside the sealing housing 11. The first cavity 22 and the second cavity 23 are separated by a partition sidewall 24. The first return port 25 is located on the partition sidewall 24 at a position lower than the lowest point of the power component 12 inside the sealing housing 11. The second return port 26 is located on the partition sidewall 24 at a position higher than the highest point of the power component 12 inside the sealing housing 11. The power component 12 is fixedly installed in the first cavity 22, and the first cavity 22 is filled with insulating coolant.

[0129] When the power component 12 starts working, the electronic devices on the power component 12 generate heat due to power consumption. Since the power component is completely immersed in the insulating coolant, the insulating coolant absorbs heat to reduce the temperature of the electronic devices. The temperature of the insulating coolant gradually rises. Due to the different densities of the insulating coolant at different temperatures and its large coefficient of expansion, the volume of the insulating coolant increases when the temperature is high. Furthermore, because the insulating coolant generates convection and has the characteristic of being hot at the top and cold at the bottom when heated, the higher-temperature insulating coolant accumulates above the first cavity 22 when the power component heats the insulating coolant. It then flows into the second cavity 23 through the second return port 26, fully contacts the second cavity 23 for heat exchange and heat dissipation, and then the lower-temperature insulating coolant flows down to the bottom of the second cavity 23 due to gravity and convection. It then enters the first cavity 22 through the first return port 25 to continue participating in heat interaction.

[0130] The liquid-cooled power module provided in the above embodiment forms a first cavity and a second cavity through a sealed housing. The first cavity is used to place the power components and is filled with insulating coolant. Utilizing the thermal expansion, convection, and top-heating-bottom-cooling characteristics of the insulating coolant, the high-temperature insulating coolant enters the second cavity through the second return port for heat dissipation, and then re-enters the first cavity through the first return port. This not only ensures the circulating heat dissipation of the insulating coolant, but also enables the self-heating of the insulating coolant based on the second cavity, allowing the power components to operate normally and reliably.

[0131] In one possible implementation, such as Figure 12 As shown, the sealing housing 11 is provided with heat dissipation teeth 27 on the outer wall corresponding to the second cavity 23.

[0132] In this embodiment, a heat dissipation tooth 27 is provided on the outer side wall adjacent to the second cavity 23. The heat dissipation tooth 27 can increase the contact area between the second cavity 23 and the environment for heat exchange. When the high-temperature insulating coolant enters the second cavity through the second return port 26, it exchanges heat with the air through the heat dissipation tooth 27, so that the insulating coolant can be cooled quickly.

[0133] The liquid-cooled power module provided in the above embodiment has heat dissipation teeth on the outside of the second cavity, which can improve the efficiency of cooling the insulating coolant and improve the heat dissipation effect.

[0134] In one possible implementation, Figure 13 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 4 ,like Figure 13 As shown, the heat dissipation unit may further include a second heat dissipation fan 28, which is disposed outside the sealed housing 11 and is used to dissipate heat from the heat dissipation teeth 27.

[0135] In this embodiment, the second cooling fan 28 is located on the outer side wall adjacent to the outer side wall where the cooling teeth 27 are located outside the sealed housing 11. The diameter of the second cooling fan 28 is larger than the width of the outer side wall. When the high-temperature insulating coolant enters the second cavity through the second return port 26 and exchanges heat with the air through the cooling teeth 27, the second cooling fan 28 performs air cooling on the cooling teeth 27, so that the insulating coolant can be cooled quickly.

[0136] It should be noted that the oil inlet 13 and the oil outlet 14 are located on the smooth side wall of the second cooling fan 28 of the sealed housing 11, which is not shown in the figure.

[0137] The liquid-cooled power module provided in the above embodiment has a second heat dissipation fan installed outside the sealed housing. The second heat dissipation fan performs air cooling on the heat dissipation teeth, which can improve the efficiency of cooling the insulating coolant and improve the heat dissipation effect.

[0138] In one possible implementation, Figure 14 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 5 ,like Figure 14 As shown, the second cavity 23 is provided with a heat dissipation channel formed by multiple guide plates 29. The multiple guide plates 29 are arranged along the direction between the first return port 25 and the second return port 26, and the multiple guide plates form a curved heat dissipation channel through the included angle.

[0139] In this embodiment, as Figure 14 As shown, in the second cavity 23 between the first return port 25 and the second return port 26, a plurality of guide plates 29 are arranged at equal intervals, and the plurality of guide plates 29 are arranged along the longitudinal direction between the first return port 25 and the second return port 26.

[0140] Multiple air deflectors 29 are all inclined downwards, forming an angle between each pair, with the orientation of adjacent angles being opposite, in order to form a curved heat dissipation channel.

[0141] The multiple guide plates 29 have gaps between them that allow the insulating coolant to flow downwards. The inclined guide plates 29 can change the flow rate and flow direction of the insulating coolant, so that the insulating coolant can be fully cooled in the second cavity 23.

[0142] It should be noted that the high side of the uppermost guide plate 29 needs to be positioned below the second return port 26 so that the insulating coolant flowing out from the second return port 26 can flow downward through the through hole on the uppermost guide plate 29. The low side of the lowermost guide plate 29 needs to be positioned below the first return port 25 so that the cooled insulating coolant can flow into the first return port 25 through the lowermost guide plate.

[0143] In some embodiments, Figure 15 A schematic diagram of the structure of the liquid-cooled power module provided in the embodiments of this application. Figure 6 ,like Figure 15 As shown, a notch is formed between the lower end of the plurality of guide plates 29 and the side wall of the second cavity 23 so that the insulating coolant flows through the notch to the lower guide plate 29 after flowing on each guide plate 29.

[0144] The liquid-cooled power module provided in the above embodiment, by setting up a curved heat dissipation channel formed by multiple guide plates at an angle in the second cavity, slows down the downward flow speed of the insulating coolant and changes the flow direction of the insulating coolant, so that the insulating coolant can dissipate heat fully and improve the heat dissipation effect.

[0145] In some embodiments, such as Figure 14 As shown, the guide plate 29 is provided with a through hole 30.

[0146] Specifically, the guide plate 29 is provided with through holes 30 so that the insulating coolant can flow downward through the through holes 30. When the high-temperature insulating coolant enters the second cavity through the second return port 26, it flows downward through the through holes 30 on the guide plate 29. During the flow, it is cooled by the heat dissipation teeth 27 and the second heat dissipation fan 28. The guide plate 29 can slow down the downward flow speed of the insulating coolant, so that the insulating coolant can be fully cooled.

[0147] Furthermore, the bottommost guide plate 29 may not have through holes 30.

[0148] The liquid-cooled power module provided in the above embodiments improves the heat dissipation effect by providing through holes on the guide plate to slow down the downward flow of the insulating coolant.

[0149] In one possible implementation, the number of second cavities 23 is at least two, and the at least two second cavities 23 are evenly arranged around the first cavity 22.

[0150] In this embodiment, a second cavity 23 can be provided on at least two of the four side walls of the first cavity 22. Figure 5 Taking the second cavity 23 set on the left and right side walls of the first cavity 22 as an example, if a second heat dissipation fan 28 needs to be set on one of the outer side walls, the second cavity 23 can be set on the remaining three side walls. The specific setting is based on the actual situation, and this embodiment does not limit it.

[0151] In one possible implementation, such as Figure 14 As shown, the first return port 25 includes multiple ports, which are horizontally arranged at equal intervals on the spacer sidewall 24. The second return port 26 includes multiple ports, which are horizontally arranged at equal intervals on the spacer sidewall 24. The position of the first return port 25 is lower than the lowest point of the power component 12 in the first cavity 22, and the position of the second return port 26 is higher than the highest point of the power component 12 in the first cavity 22.

[0152] In this embodiment, the first return port 25 is located on the spacer sidewall 24 at a position lower than the lowest point of the power component 12 in the first cavity 22, and the second return port 26 is located on the spacer sidewall 24 at a position higher than the highest point of the power component 12 in the first cavity 22. The spacer sidewall 24 is parallel to the power component 12, and the arrangement direction of the first return port 25 and the second return port 26 is also parallel and horizontal to the power component 12.

[0153] Multiple first return ports 25 and second return ports 26 are provided to accelerate the speed at which the high-temperature insulating coolant enters the second cavity 23 for heat dissipation, and to accelerate the speed at which the cooled insulating coolant flows back into the first cavity 22.

[0154] The first return port 25 is lower than the lowest point of the power component 12 in the first cavity 22, which allows the insulating coolant with the lowest temperature after cooling to enter the bottom of the first cavity 22 first. The second return port 26 is higher than the highest point of the power component 12 in the first cavity 22, which allows the insulating coolant with the highest temperature after absorbing heat to enter the second cavity 23 first for cooling. This fully utilizes the characteristics of the insulating coolant's thermal expansion and the fact that it is colder at the top and hotter at the bottom to cool the insulating coolant.

[0155] The fully immersion liquid-cooled power module provided in the above embodiments, by setting the first return port and the second return port parallel to the power components and arranging them horizontally, can improve the flow rate and efficiency of the insulating coolant between the first cavity and the second cavity, thereby improving the heat dissipation effect.

[0156] In one possible implementation, such as Figure 14 As shown, the diameter of the second reflux port 26 is larger than the diameter of the first reflux port 25.

[0157] In this embodiment, since the density of the insulating coolant increases and its volume increases after being heated, the second return port 26 needs to be a large-diameter cavity in order to facilitate the rapid flow of the insulating coolant into the second cavity 23. Similarly, after the insulating coolant is cooled by heat dissipation, its density decreases and its volume decreases, so the first return port 25 can be a small-diameter cavity.

[0158] In the liquid-cooled power module provided in the above embodiment, the diameter of the second return port is larger than that of the first return port, so that the insulating coolant can flow better based on the characteristics of different temperatures and densities, and the first cavity is prevented from bearing pressure due to the thermal expansion of the insulating coolant, so that the insulating coolant can flow better between the first cavity and the second cavity for sufficient heat exchange.

[0159] Based on the liquid-cooled power module provided in the above embodiments, this application also provides a charging system, which may include multiple liquid-cooled power modules.

[0160] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power component, characterized in that, The power component is disposed within a sealed housing of a liquid-cooled power module. The sealed housing contains an insulating coolant that submerges the power component. The sealed housing is provided with an oil inlet and an oil outlet. The oil outlet is positioned higher than the oil inlet. The power component includes: a printed circuit board and a power circuit integrated on the printed circuit board. The printed circuit board has multiple temperature zones arranged sequentially along the oil depth direction, and various types of devices in the power circuit are respectively arranged in the multiple temperature zones. Along the oil depth direction from bottom to top, the temperature thresholds of the various types of devices increase from low to high.

2. The power component as described in claim 1, characterized in that, The plurality of temperature zones include at least a first temperature zone near the oil inlet and a third temperature zone near the oil outlet, wherein the first temperature zone includes at least a control device and the third temperature zone includes at least a magnetic device.

3. The power component as described in claim 1, characterized in that, The multiple temperature zones are arranged sequentially from bottom to top as follows: a first temperature zone, a second temperature zone, and a third temperature zone, wherein the temperature of the insulating coolant in the first temperature zone is the lowest, and the temperature of the insulating coolant in the third temperature zone is the highest. The first temperature region includes at least a control device, the second temperature region includes at least a capacitor and a power device, and the third temperature region includes at least a magnetic device.

4. The power component as described in claim 3, characterized in that, The first temperature zone contains at least one of the following electronic devices: an ACDC controller, a DCDC controller, a grating coupler, an operational amplifier, a module chip, or a surface-mount electronic device.

5. The power component as described in claim 3, characterized in that, The second temperature zone contains at least one of the following electronic devices: an auxiliary power supply unit, a switching device, an aluminum electrolytic capacitor, a gold film capacitor, and a relay.

6. The power component as claimed in claim 3, characterized in that, The third temperature zone contains at least one of the following electronic devices: a transformer, an inductor, an electromagnetic compatibility module, and a high-temperature power device.

7. The power component as claimed in claim 1, characterized in that, The power component includes: a mounting plate and a printed circuit board fixed on the mounting plate, wherein the printed circuit board integrates a power circuit, and the mounting plate is used to fix it inside the sealed housing; The power component includes two printed circuit boards, which are disposed on both sides of the mounting plate.

8. The power component as claimed in claim 7, characterized in that, The power circuit includes an AC-CDC circuit and a DC-CDC circuit, with the printed circuit boards corresponding to the AC-CDC circuit and the DC-CDC circuit disposed on both sides of the mounting plate.

9. A liquid-cooled power module, characterized in that, The liquid-cooled power module includes: a sealed housing, a power component as described in any one of claims 1 to 8, an oil inlet, an oil outlet, and an electrical connection terminal, wherein the electrical connection terminal is connected to the power component; The power component is fixedly disposed inside the sealed housing, and the sealed housing contains an insulating coolant that immerses the power component. The oil inlet is located at a first position on the side wall of the sealing housing, and the oil outlet is located at a second position on the side wall of the sealing housing, the second position being higher than the first position; The electrical connection terminal is located at a third position on the outer wall of the sealed housing, and the third position is higher than the second position.

10. A charging system, characterized in that, The charging system includes: a plurality of liquid-cooled power modules, wherein the liquid-cooled power modules are as described in claim 9.

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