Heating plate orientation adjustment mechanism, semiconductor component processing device, and method

Abstract

The present invention provides a heating plate orientation adjustment mechanism, a semiconductor component processing device, a semiconductor component processing method, and a storage medium. The heating plate orientation adjustment mechanism comprises an upper base, a lower base, and multiple support rods. The top of the upper base is connected to the heating plate. One surface of the upper base and / or the lower base facing the other is provided with several first motors and / or several universal shafts. The multiple support rods are disposed between the upper base and the lower base. Each support rod has disposed thereon at least one second motor, and is connected to the upper base and the lower base via at least one of the first motors. The orientation adjustment mechanism, via at least one of the first motors and / or at least one of the second motors, adjusts the deflection angle and / or length of at least one corresponding support rod, so as to adjust the orientation of the heating plate. The present invention is used to achieve multi-dimensional adjustment of the orientation of a heating plate, so as to improve film thickness uniformity in a film deposition process.

Description

Position adjusting mechanism of heating disc, processing equipment and method of semiconductor device TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor device processing, and in particular to a position adjusting mechanism of a heating disc, a processing equipment of a semiconductor device, a processing method of a semiconductor device, and a computer readable storage medium. BACKGROUND

[0002] With the continuous development of semiconductor process, the uniformity requirement of the film deposited by the PECVD equipment is more stringent, and then the position of the heating disc is often adjusted according to the film thickness distribution. The existing adjustment method mainly adopts manual or automatic adjustment method, wherein the manual adjustment method mainly uses a wrench to adjust the seat bolts at different positions of the bottom of the related heating disc, so that the heating disc is lifted in the direction. However, the same semiconductor device processing equipment needs to deposit different types of films, and when the film process parameters and film quality difference are large, the film thickness distribution is also different. For this situation, the manual horizontal method can only use the same horizontal parameters for each process, and cannot adjust each film thickness uniformity requirement, which leads to limited actual effect of horizontal adjustment and poor actual adjustment precision. Due to the limitation of algorithm and mechanism, the automatic adjustment mechanism can only realize the lifting of a single point in the two-dimensional horizontal 360° range of the heating disc, and can only be adjusted once. However, when the heating disc is still not in place, the lifting of other positions of the heating disc needs to be adjusted, which cannot continue to be adjusted, which will further reduce the film thickness uniformity. In addition, the existing manual and automatic heating disc horizontal adjustment mechanism is too single, such as when the heating disc needs to be moved a certain distance according to the requirements of a certain deposition process, the bolts of other mechanisms need to be manually adjusted, and this way of moving the heating disc will affect other processes.

[0003] In order to overcome the above-mentioned defects of the prior art, there is an urgent need in the field for an improved position adjusting mechanism of a heating disc, which is used to realize multi-dimensional adjustment of the position of the heating disc according to the actual requirements of the semiconductor processing process, so as to improve the film thickness uniformity of the film deposition process.

[0004] SUMMARY

[0005] The following gives a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an extensive overview of all contemplated aspects, and is neither intended to identify key or critical elements of all aspects nor to delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0006] In order to overcome the above-mentioned defects in the prior art, the application provides a position adjusting mechanism of a heating disc, a processing equipment of a semiconductor device, a processing method of a semiconductor device and a computer readable storage medium, which can adapt to the actual needs of semiconductor processing technology through differential movement of multiple support rods to realize multi-dimensional adjustment of the position of the heating disc, thereby improving the film thickness uniformity of the thin film deposition process.

[0007] Specifically, the position adjusting mechanism of the heating disc according to the first aspect of the application comprises an upper base, a lower base and multiple support rods. The top of the upper base is connected to the heating disc. One side of the upper base and / or the lower base facing each other is provided with multiple first motors and / or multiple universal shafts. The multiple support rods are arranged between the upper base and the lower base. At least one second motor is arranged on each of the support rods, and the upper base and the lower base are connected via at least one first motor. The position adjusting mechanism adjusts the deflection angle and / or length of at least one corresponding support rod via at least one first motor and / or at least one second motor to adjust the position of the heating disc.

[0008] Further, in some embodiments of the application, the position adjusting mechanism comprises N support rods. N is an even number greater than or equal to 6. The bottom of the upper base and the top of the lower base are respectively provided with N / 2 staggered connection points. The top of each support rod is connected to a first connection point on the bottom of the upper base. The bottom of each support rod is connected to a second connection point on the top of the lower base. At least one of the first connection points on the top of each support rod and the second connection points on the bottom of each support rod is provided with the first motor.

[0009] Further, in some embodiments of the application, the position adjusting mechanism comprises 6 support rods. The bottom of the upper base and the top of the lower base are respectively provided with 3 staggered connection points. Each of the second connection points on the bottom of each support rod is provided with a first motor.

[0010] Further, in some embodiments of the present application, the step of adjusting the pose of the heating disc comprises: adjusting the deflection angle of the corresponding support rod via at least one of the first motors, and / or adjusting the length of the corresponding support rod via at least one of the second motors, to adjust the height of the heating disc; and / or adjusting the deflection angle of the corresponding support rod via at least one of the first motors, and / or adjusting the length of the corresponding support rod via at least one of the second motors, to control the rotation of the heating disc; and / or adjusting the deflection angle of the corresponding support rod via at least one of the first motors, and / or adjusting the length of the corresponding support rod via at least one of the second motors, to control the translation of the heating disc; and / or adjusting the deflection angle of the corresponding support rod via at least one of the first motors, and / or adjusting the length of the corresponding support rod via at least one of the second motors, to adjust the inclination angle of the heating disc.

[0011] Further, in some embodiments of the present application, the step of adjusting the height of the heating disc via at least one of the first motors adjusting the deflection angle of the corresponding support rod, and / or via at least one of the second motors adjusting the length of the corresponding support rod, comprises: obtaining a first height value by which the heating disc needs to be raised or lowered; calculating a first control amount of at least one of the first motors and a second control amount of at least one of the second motors according to the first height value and the included angle between each of the support rods and the upper base; and adjusting the deflection angle of the corresponding support rod via the first control amount of at least one of the first motors, and adjusting the length of the corresponding support rod via the second control amount of at least one of the second motors, to control the heating disc to be raised or lowered by the first height value.

[0012] Further, in some embodiments of the present application, the step of adjusting the height of the heating disc via at least one of the first motors adjusting the deflection angle of the corresponding support rod, and / or via at least one of the second motors adjusting the length of the corresponding support rod, comprises: obtaining a first height value by which the heating disc needs to be raised or lowered; calculating a first control amount of at least one of the first motors and a second control amount of at least one of the second motors according to the first height value and the included angle between each of the support rods and the upper base; and adjusting the deflection angle of the corresponding support rod via the first control amount of at least one of the first motors, and adjusting the length of the corresponding support rod via the second control amount of at least one of the second motors, to control the heating disc to be raised or lowered by the first height value.

[0013] Further, in some embodiments of the present application, the step of adjusting the deflection angle of each support rod via at least one of the first motors and / or adjusting the length of each support rod via at least one of the second motors to control the translation of the heating disc includes: obtaining a first distance that the heating disc needs to move horizontally; calculating a fifth control amount of at least one of the first motors and a sixth control amount of at least one of the second motors according to the first distance and the included angle between each support rod and the upper base; and adjusting the deflection angle of each support rod via the fifth control amount of at least one of the first motors and adjusting the length of each support rod via the sixth control amount of at least one of the second motors to control the heating disc to move horizontally by the first distance.

[0014] Further, in some embodiments of the present application, the step of adjusting the deflection angle of each support rod via at least one of the first motors and / or adjusting the length of each support rod via at least one of the second motors to control the heating disc to tilt to a preset angle includes: obtaining a second angle value that the heating disc needs to tilt; determining a second plane after the upper base is tilted according to the second angle value; calculating a seventh control amount of at least one of the first motors and an eighth control amount of at least one of the second motors according to the first position of each support rod on the first plane before tilting and the second position of each support rod on the second plane after tilting; and adjusting the deflection angle of each support rod via the seventh control amount of at least one of the first motors and adjusting the length of each support rod via at least one of the second motors to control the heating disc to tilt by the second angle value.

[0015] Further, in some embodiments of the present application, the pose adjustment mechanism further comprises a controller. The controller is configured to: in response to a wafer transfer instruction, adjust the deflection angle of the corresponding support rod via the at least one first motor and / or adjust the length of the corresponding support rod via the at least one second motor, to raise or lower the heating disc to a preset wafer transfer position; and / or in response to a first process instruction, adjust the deflection angle of the corresponding support rod via the at least one first motor and / or adjust the length of the corresponding support rod via the at least one second motor, to lower or raise the heating disc to a preset process position, to perform a first process on the wafer to be processed; in response to a second process instruction, adjust the deflection angle of the corresponding support rod via the at least one first motor and / or adjust the length of the corresponding support rod via the at least one second motor, to rotate the heating disc by a preset angle, to perform a second process on the wafer to be processed; and / or in response to a wafer transfer instruction after completion of the process, adjust the deflection angle of the corresponding support rod via the at least one first motor and / or adjust the length of the corresponding support rod via the at least one second motor, to raise or lower the heating disc to the wafer transfer position, to output the wafer after completion of the process.

[0016] Further, the processing apparatus for semiconductor devices according to the second aspect of the present application comprises a process chamber and a robot. The process chamber comprises a heating disc and a pose adjustment mechanism for the heating disc according to the first aspect of the present application. The heating disc is used to carry and process semiconductor devices to be processed, and the pose adjustment mechanism is used to adjust the pose of the heating disc. The robot is used to place the semiconductor devices to be processed on the heating disc and / or take away the processed semiconductor devices from the heating disc.

[0017] Further, the above semiconductor device processing method according to the third aspect of the present application comprises the following steps: obtaining a semiconductor device to be processed via a robot of a semiconductor device processing apparatus according to the second aspect of the present application; lowering a heating disc to a wafer transfer position via adjusting a deflection angle of a corresponding support rod via at least one first motor and / or adjusting a length of the corresponding support rod via at least one second motor, so as to input the semiconductor device to a process chamber of the processing apparatus by the robot; in response to completing the wafer transfer, raising the heating disc to a process position via adjusting the deflection angle of the corresponding support rod via at least one first motor and / or adjusting the length of the corresponding support rod via at least one second motor, so as to perform a first process on the semiconductor device; in response to completing the first process, rotating the heating disc by a preset angle via adjusting the deflection angle of the corresponding support rod via at least one first motor and / or adjusting the length of the corresponding support rod via at least one second motor, so as to perform a second process on the semiconductor device; and in response to completing the second process, lowering the heating disc to the wafer transfer position via adjusting the deflection angle of the corresponding support rod via at least one first motor and / or adjusting the length of the corresponding support rod via at least one second motor, so as to output the semiconductor device from the process chamber by the robot.

[0018] Further, in some embodiments of the present application, before lowering the heating disc to the wafer transfer position to obtain a wafer to be processed from the robot, the above semiconductor device processing method further comprises the following steps: adjusting a tilt angle of the heating disc to 0 degrees via adjusting the deflection angle of the corresponding support rod via at least one first motor and / or adjusting the length of the corresponding support rod via at least one second motor.

[0019] Further, the above computer readable storage medium according to the fourth aspect of the present application, on which computer instructions are stored, wherein the computer instructions are executed by a processor to implement the above semiconductor device processing method according to the third aspect of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above features and advantages of the present application can be better understood by reading the detailed description of embodiments of the present application in conjunction with the following drawings, in which: the components are not necessarily drawn to scale, and components of similar or identical function or features can have the same or similar reference label.

[0021] FIG. 1 shows a structural schematic diagram of a pose adjustment mechanism of a heating disc according to some embodiments of the present application.

[0022] FIG. 2 shows a structural schematic diagram of a pose adjustment mechanism of a heating disc according to some embodiments of the present application.

[0023] Figure 3 shows a schematic flowchart of a semiconductor device fabrication method according to some embodiments of the present invention.

[0024] Figure 4A shows a schematic diagram illustrating the principle of adjusting the height of the heating plate according to some embodiments of the present invention.

[0025] Figure 4B shows a schematic diagram illustrating the principle of adjusting the height of the heating plate according to some embodiments of the present invention.

[0026] Figure 5A shows a schematic diagram illustrating the principle of controlling the tilt of the heating plate according to some embodiments of the present invention.

[0027] Figure 5B shows a schematic diagram illustrating the principle of controlling the tilt of the heating plate according to some embodiments of the present invention.

[0028] Figure 6 shows a schematic diagram illustrating the principle of controlling the translation of the heating plate according to some embodiments of the present invention.

[0029] Figure label:

[0030] 11. Upper base

[0031] 12 Lower base

[0032] 13 Support rods

[0033] 131 First Electric Machine

[0034] 132 universal joint

[0035] 133 Second Motor

[0036] 20 heating plates Detailed Implementation

[0037] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0038] In the description of the present application, it should be noted that unless specifically stated and limited otherwise, the terms "mounting", "connected", "connection" should be construed broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] In addition, "up", "down", "left", "right", "top", "bottom", "horizontal", "vertical" used in the following description should be understood as the orientation shown in the section and the related drawings. The relative terms are only for the convenience of description, and do not mean that the device described should be manufactured or operated in a particular orientation, so it should not be understood as a limitation on the present application.

[0040] It can be understood that although the terms "first", "second", "third" and the like are used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below can be referred to as the second component, region, layer and / or part without departing from some embodiments of the present application.

[0041] As described above, the existing adjustment mode mainly adopts manual or automatic adjustment mode, wherein the manual adjustment mode mainly uses wrench to adjust the seat bolts at different positions of the heating disc bottom, so that the heating disc realizes lifting in the direction. However, the processing equipment of the same semiconductor device needs to deposit different types of thin films, and when the thin film process parameters and the thin film film quality difference are large, the thin film film thickness distribution is also different. For this situation, the manual horizontal method can only take into account the use of the same horizontal parameters for each process, and cannot adjust each thin film film thickness uniformity requirement, resulting in limited actual effect of horizontal adjustment and poor actual adjustment precision. Due to the limitation of algorithm and mechanism, the automatic adjustment mechanism can only realize the lifting of a single point in the two-dimensional horizontal 360° range of the heating disc, and can only be adjusted once. However, when the heating disc is still not in place, the lifting of other positions of the heating disc needs to be adjusted, which cannot continue to adjust, which will further reduce the film thickness uniformity. In addition, the existing manual and automatic heating disc horizontal adjustment mechanism is too single, such as when the heating disc needs to move a certain distance according to the requirements of a certain deposition process, the bolts of other mechanisms need to be manually adjusted, and this way of moving the heating disc will affect other processes.

[0042] In order to overcome the above-mentioned defects in the prior art, the application provides a position adjusting mechanism of a heating disc, a semiconductor device processing equipment, a semiconductor device processing method and a computer readable storage medium, which can adapt to the actual needs of semiconductor processing technology through differential movement of multiple support rods to achieve multi-dimensional adjustment of the position of the heating disc, thereby improving the film thickness uniformity of the thin film deposition process.

[0043] In some non-limiting embodiments, the above-mentioned position adjusting mechanism of the heating disc provided by the first aspect of the application can be configured in the above-mentioned semiconductor device processing equipment provided by the second aspect of the application. Specifically, the above-mentioned semiconductor device processing equipment provided by the second aspect of the application comprises a process chamber and a robot. Here, the process chamber comprises a heating disc 20 and a position adjusting mechanism of a heating disc as in the first aspect of the application. The heating disc 20 is used to carry and process a semiconductor device to be processed. The position adjusting mechanism is used to adjust the position of the heating disc 20. The robot is used to place the semiconductor device to be processed on the heating disc 20 and / or take away the processed semiconductor device from the heating disc 20.

[0044] In addition, in some preferred embodiments, the above-mentioned position adjusting mechanism provided by the first aspect of the application is also included in the front end module of the semiconductor processing equipment to replace the notch wafer aligner, thereby reducing the cost of the semiconductor processing equipment.

[0045] Specifically, reference is made to FIG. 1 and FIG. 2. FIG. 1 shows a structural schematic diagram of a position adjusting mechanism of a heating disc according to some embodiments of the application. FIG. 2 shows a structural schematic diagram of a position adjusting mechanism of a heating disc according to some embodiments of the application.

[0046] In the embodiments shown in FIG. 1 and FIG. 2, the above-mentioned position adjusting mechanism of a heating disc provided by the first aspect of the application comprises an upper base 11, a lower base 12 and multiple support rods 13. Here, the top of the upper base 11 is connected to the heating disc 20, and the upper base 11 and / or the lower base 12 is provided with a plurality of first motors 131 and / or a plurality of universal shafts 132 on the side facing each other. The multiple support rods 13 are arranged between the upper base 11 and the lower base 12. At least one second motor 133 is arranged on each support rod, and the upper base 11 and the lower base 12 are connected via the at least one first motor 131. The position adjusting mechanism adjusts the deflection angle and / or length of the corresponding at least one support rod 13 via the at least one first motor 131 and / or the at least one second motor 133 to adjust the position of the heating disc 20.

[0047] Specifically, the first aspect of the present application provides the above-mentioned position adjusting mechanism, which can include M support rods 13. Here, M is greater than or equal to 3, and the bottom of the upper base 11 and the top of the lower base 12 are respectively provided with M staggered connection points, for setting at least 3 support points between the upper base 11 and the lower base 12, so as to meet the necessary condition of a stable support plane. The top of each support rod 13 is connected to a first connection point on the bottom of the upper base 11, and the bottom of each support rod 13 is connected to a second connection point on the top of the lower base 12, for adjusting the position of the heating disc 20 by adjusting the deflection angle and / or length of the corresponding at least one support rod 13.

[0048] Further, in some preferred embodiments, the position adjusting mechanism includes N support rods 13. Here, N is an even number greater than or equal to 6, and the bottom of the upper base 11 and the top of the lower base 12 are respectively provided with N / 2 staggered connection points, for setting at least 3 support points between the upper base 11 and the lower base 12, so as to meet the necessary condition of a stable support plane. The top of each support rod 13 is connected to a first connection point on the bottom of the upper base 11, and the bottom of each support rod 13 is connected to a second connection point on the top of the lower base 12, for realizing accurate adjustment of the position of the heating disc 20 by differential movement between two support rods 13 connected to the same first connection point or second connection point. At least one of the first connection points on the top of each support rod 13 and the second connection points on the bottom of each support rod 13 is provided with a first motor 131.

[0049] Further, in the embodiments shown in FIG. 1 and FIG. 2, the position adjusting mechanism includes 6 support rods 13. Here, the bottom of the upper base 11 and the top of the lower base 12 are respectively provided with 3 staggered connection points, and each of the second connection points on the bottom of each support rod 13 is provided with a first motor 131, and each of the first connection points on the top of each support rod 13 is provided with a universal shaft 132, for reducing the cost of the position adjusting mechanism and reducing the overall weight.

[0050] Preferably, in the embodiment shown in FIG. 1, the first connection points on the top of each support rod 13 are provided with a universal shaft 132, and the second connection points on the bottom of each support rod 13 are provided with a first motor 131. In this way, the above-mentioned position adjusting mechanism provided by the first aspect of the present application can optimize the spatial arrangement of the first motor 131 by providing the first motor 131 at the bottom of each support rod 13, and reduce the weight at the top of the support rod 13, so as to improve the control accuracy.

[0051] Alternatively, in some alternative embodiments, the first motor 131 is arranged in both the first connecting point at the top of each support rod 13 and the second connecting point at the bottom of each support rod 13, so as to reduce the torque required by each first motor 131 and improve the control accuracy of the pose adjustment mechanism.

[0052] In addition, the pose adjustment mechanism of the heating disc provided by the first aspect of the present application further comprises a memory and a controller. In this regard, the memory includes but is not limited to the computer readable storage medium provided by the fourth aspect of the present application, and the computer instructions are stored on the computer readable storage medium. The controller is connected to the memory and is configured to execute the computer instructions stored on the memory to implement the processing method of the semiconductor device provided by the third aspect of the present application.

[0053] The working principle of the processing equipment of the semiconductor device will be described below in combination with some embodiments of the processing method of the semiconductor device. Those skilled in the art can understand that these embodiments of the processing method are only some non-limiting embodiments provided by the present application, which are intended to clearly demonstrate the main concept of the present application and provide some specific schemes for facilitating the public to implement, rather than limit the overall function or overall working mode of the processing equipment of the semiconductor device. Similarly, the processing equipment of the semiconductor device is also only a non-limiting embodiment provided by the present application, which does not limit the execution subject and execution order of each step in the processing method of the semiconductor device.

[0054] Please refer to FIG. 3-6. FIG. 3 shows a flowchart of the processing method of the semiconductor device according to some embodiments of the present application. FIG. 4A shows a schematic diagram of adjusting the height of the heating disc according to some embodiments of the present application. FIG. 4B shows a schematic diagram of adjusting the height of the heating disc according to some embodiments of the present application. FIG. 5A shows a schematic diagram of controlling the inclination of the heating disc according to some embodiments of the present application. FIG. 5B shows a schematic diagram of controlling the inclination of the heating disc according to some embodiments of the present application. FIG. 6 shows a schematic diagram of controlling the translation of the heating disc according to some embodiments of the present application.

[0055] As shown in FIG. 3, the processing equipment of the semiconductor device provided by the second aspect of the present application can first obtain the semiconductor device to be processed via the robot.

[0056] Then, in response to the wafer transfer instruction, the processing equipment can adjust the deflection angle of the corresponding support rod 12 via at least one first motor 131 of the pose adjustment mechanism, and / or adjust the length of the corresponding support rod 13 via at least one second motor 133 of the pose adjustment mechanism, so as to lower the heating disc 20 to the wafer transfer position for the robot to input the semiconductor device into the process chamber of the processing equipment.

[0057] Specifically, as shown in FIG. 4A and FIG. 4B, in the process of adjusting the height of the heating plate 20, the pose adjustment mechanism can first obtain a first height value d (e.g., 2mm, 10mm) that the heating plate 20 needs to rise or fall, and calculate a first control amount of at least one first motor 131 and a second control amount of at least one second motor 133 according to the first height value d and the angle between each support rod 13 and the upper base 11. Then, the pose adjustment mechanism can adjust the deflection angle of the corresponding support rod 13 via the first control amount of at least one first motor 131, and adjust the length of the corresponding support rod 13 via the second control amount of at least one second motor 133, to control the heating plate 20 to rise or fall by the first height value d.

[0058] Afterwards, in response to a first process instruction after the semiconductor device is transported, the processing equipment can adjust the deflection angle of the corresponding support rod 13 via at least one first motor 131 of the pose adjustment mechanism, and / or adjust the length of the corresponding support rod 13 via at least one second motor 133 of the pose adjustment mechanism, to raise the heating plate 20 to a process position to perform a first process on the semiconductor device.

[0059] Afterwards, in response to a second process instruction after the first process is completed, the processing equipment can adjust the deflection angle of the corresponding support rod 13 via at least one first motor 131 of the pose adjustment mechanism, and / or adjust the length of the corresponding support rod 13 via at least one second motor 133 of the pose adjustment mechanism, to rotate the heating plate 20 by a preset angle (e.g., 30°, 60°, 180°) to perform a second process on the semiconductor device.

[0060] Specifically, in the process of controlling the rotation of the heating plate 20, the pose adjustment mechanism can first obtain a first angle value that the heating plate 20 needs to rotate clockwise or counterclockwise, and calculate a third control amount of at least one first motor 131 and a fourth control amount of at least one second motor 133 according to the first angle value and the distance between the connection point of each support rod 13 and the center of the upper base 11. Then, the pose adjustment mechanism can adjust the deflection angle of the corresponding support rod 13 via the third control amount of at least one first motor 131, and adjust the length of the corresponding support rod 13 via at least one second motor 133, to control the heating plate 20 to rotate clockwise or counterclockwise by the first angle value.

[0061] Afterwards, in response to a wafer transport instruction after the second process is completed, the processing equipment can adjust the deflection angle of the corresponding support rod 13 via at least one first motor 131, and / or adjust the length of the corresponding support rod 13 via at least one second motor 133, to lower the heating plate 20 to a wafer transport position for the robot to output the semiconductor device from the process chamber.

[0062] In addition, in the embodiments shown in FIGS. 5A and 5B, the processing apparatus can further adjust the deflection angle of the corresponding support rod 13 via the at least one first motor 131 and / or adjust the length of the corresponding support rod 13 via the at least one second motor 133 to control the heating disc 20 to tilt to a preset angle (e.g., 0°, 80°).

[0063] Specifically, before the heating disc 20 is lowered to the wafer transfer position to pick up the wafer to be processed from the robot, the deflection angle of the corresponding support rod 13 is adjusted via the at least one first motor 131 of the pose adjustment mechanism and / or the length of the corresponding support rod 13 is adjusted via the at least one second motor 133 of the pose adjustment mechanism to adjust the tilt angle of the heating disc 20 to 0°, thereby leveling the heating disc 20.

[0064] Further, in the process of controlling the heating disc 20 to tilt to a preset angle, the pose adjustment mechanism can first obtain a second angle value at which the heating disc 20 needs to be tilted, and determine a second plane on which the upper base 11 tilts according to the second angle value. Then, the pose adjustment mechanism can calculate a seventh control amount of the at least one first motor 131 and an eighth control amount of the at least one second motor 133 according to the first positions of the support rods 13 on the first plane before tilting and the second positions of the support rods 13 on the second plane. After that, the pose adjustment mechanism can adjust the deflection angle of the corresponding support rod 13 via the seventh control amount of the at least one first motor 131 and adjust the length of the corresponding support rod 13 via the at least one second motor 133 to control the heating disc 20 to tilt by the second angle value.

[0065] In addition, in the embodiment shown in FIG. 6, the processing apparatus can further control the heating disc 20 to translate via the pose adjustment mechanism. Specifically, in the process of controlling the heating disc 20 to translate, the pose adjustment mechanism can obtain a first distance by which the heating disc 20 needs to be horizontally moved, and calculate a fifth control amount of the at least one first motor 131 and a sixth control amount of the at least one second motor 133 according to the first distance and the included angle between the support rods 13 and the upper base 11. Then, the pose adjustment mechanism can adjust the deflection angle of the corresponding support rod 13 via the fifth control amount of the at least one first motor 131 and adjust the length of the corresponding support rod 13 via the sixth control amount of the at least one second motor 133 to control the heating disc 20 to horizontally move by the first distance.

[0066] In summary, the pose adjustment mechanism of the heating disc, the processing apparatus of semiconductor devices, the processing method of semiconductor devices, and the computer readable storage medium provided by the present application can adapt to the actual needs of the semiconductor processing technology through the differential movement of multiple support rods to achieve multiple adjustments of the pose of the heating disc, thereby improving the film thickness uniformity of the thin film deposition process.

[0067] While the above-described methods are illustrated and described as a series of acts for simplicity, it is to be understood that the methods are not limited by the order of acts, as some acts can occur in different orders and / or concurrently with other acts from that illustrated and described herein. In addition, not all illustrated acts can be required to implement the methods in all embodiments.

[0068] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A position adjusting mechanism of a heating tray, characterized by, The application relates to a position adjusting mechanism for a heating disc, comprising: an upper base and a lower base, wherein the top of the upper base is connected with the heating disc, and one side of the upper base and / or the lower base is provided with a plurality of first motors and / or a plurality of universal shafts; and a plurality of support rods arranged between the upper base and the lower base, wherein at least one second motor is arranged on each support rod, and the upper base and the lower base are connected via at least one first motor, the position adjusting mechanism adjusts the deflection angle and / or the length of at least one corresponding support rod via at least one first motor and / or at least one second motor, so as to adjust the position of the heating disc.

2. The pose adjustment mechanism of claim 1, wherein, In the position adjusting mechanism, N support rods are arranged, wherein N is an even number greater than or equal to 6, the bottom of the upper base and the top of the lower base are respectively provided with N / 2 staggered connection points, the top of each support rod is connected with a first connection point arranged on the bottom of the upper base, the bottom of each support rod is connected with a second connection point arranged on the top of the lower base, and at least one of the first connection points arranged on the top of each support rod and the second connection points arranged on the bottom of each support rod is provided with a first motor.

3. The pose adjustment mechanism of claim 2, wherein, In the position adjusting mechanism, 6 support rods are arranged, wherein the bottom of the upper base and the top of the lower base are respectively provided with 3 staggered connection points, and each second connection point arranged on the bottom of each support rod is provided with a first motor.

4. The pose adjustment mechanism of claim 1, wherein, The step of adjusting the position of the heating disc comprises: adjusting the deflection angle of a corresponding support rod via at least one first motor, and / or adjusting the length of a corresponding support rod via at least one second motor, so as to adjust the height of the heating disc; and / or adjusting the deflection angle of a corresponding support rod via at least one first motor, and / or adjusting the length of a corresponding support rod via at least one second motor, so as to control the rotation of the heating disc; and / or adjusting the deflection angle of a corresponding support rod via at least one first motor, and / or adjusting the length of a corresponding support rod via at least one second motor, so as to control the translation of the heating disc; and / or adjusting the deflection angle of a corresponding support rod via at least one first motor, and / or adjusting the length of a corresponding support rod via at least one second motor, so as to control the inclination of the heating disc to a preset angle.

5. The pose adjustment mechanism of claim 4, wherein, The step of adjusting the height of the heating disc via at least one first motor adjusting the deflection angle of a corresponding support rod, and / or via at least one second motor adjusting the length of a corresponding support rod comprises: obtaining a first height value required for the heating disc to rise or fall; calculating a first control amount of at least one first motor and a second control amount of at least one second motor according to the first height value and the included angle between each support rod and the upper base; and adjusting the deflection angle of a corresponding support rod via the first control amount of at least one first motor, and adjusting the length of a corresponding support rod via the second control amount of at least one second motor, so as to control the heating disc to rise or fall by the first height value.

6. The pose adjustment mechanism of claim 4, wherein, The step of adjusting the deflection angle of the corresponding support rod via the at least one first motor and / or adjusting the length of the corresponding support rod via the at least one second motor to control the rotation of the heating disc includes: obtaining a first angle value at which the heating disc needs to rotate clockwise or counterclockwise; calculating a third control amount of the at least one first motor and a fourth control amount of the at least one second motor according to the first angle value and the distance between the connection point of each support rod and the center of the upper base; and adjusting the deflection angle of the corresponding support rod via the third control amount of the at least one first motor and adjusting the length of the corresponding support rod via the at least one second motor to control the heating disc to rotate clockwise or counterclockwise by the first angle value.

7. The pose adjustment mechanism of claim 4, wherein, The step of adjusting the deflection angle of the corresponding support rod via the at least one first motor and / or adjusting the length of the corresponding support rod via the at least one second motor to control the translation of the heating disc includes: obtaining a first distance at which the heating disc needs to move horizontally; calculating a fifth control amount of the at least one first motor and a sixth control amount of the at least one second motor according to the first distance and the included angle between each support rod and the upper base; and adjusting the deflection angle of the corresponding support rod via the fifth control amount of the at least one first motor and adjusting the length of the corresponding support rod via the sixth control amount of the at least one second motor to control the heating disc to move horizontally by the first distance.

8. The position adjustment mechanism of claim 4, wherein, The step of adjusting the deflection angle of the corresponding support rod via the at least one first motor and / or adjusting the length of the corresponding support rod via the at least one second motor to control the heating disc to tilt to a preset angle includes: obtaining a second angle value at which the heating disc needs to tilt; determining a second plane after the upper base is tilted according to the second angle value; calculating a seventh control amount of the at least one first motor and an eighth control amount of the at least one second motor according to the first position of each support rod on the first plane before tilting and the second position of each support rod on the second plane; and adjusting the deflection angle of the corresponding support rod via the seventh control amount of the at least one first motor and adjusting the length of the corresponding support rod via the at least one second motor to control the heating disc to tilt by the second angle value.

9. The pose adjustment mechanism of claim 4, wherein, Further comprising: a controller configured to: in response to a wafer transfer instruction to be processed, adjust the deflection angle of the corresponding support rod via the at least one first motor and / or adjust the length of the corresponding support rod via the at least one second motor to raise or lower the heating disc to a preset wafer transfer position; and / or in response to a first process instruction, adjust the deflection angle of the corresponding support rod via the at least one first motor and / or adjust the length of the corresponding support rod via the at least one second motor to lower or raise the heating disc to a preset process position to perform a first process on the wafer to be processed. in response to a second process instruction, adjusting the deflection angle of the corresponding support rod via the at least one first motor and / or adjusting the length of the corresponding support rod via the at least one second motor, and rotating the heating plate by a preset angle to perform a second process on the wafer to be processed; in response to a wafer transfer instruction after the processing is completed, adjusting the deflection angle of the corresponding support rod via the at least one first motor and / or adjusting the length of the corresponding support rod via the at least one second motor, and raising or lowering the heating plate to the wafer transfer position to output the processed wafer.

10. A processing apparatus of a semiconductor device, characterized by comprising: The method comprises: a process chamber comprising a heating plate and a position adjustment mechanism of the heating plate as claimed in any one of claims 1-9, wherein the heating plate is used to carry and process a semiconductor device to be processed, and the position adjustment mechanism is used to adjust the position of the heating plate; and a robot for placing the semiconductor device to be processed on the heating plate and / or taking the processed semiconductor device away from the heating plate. The method comprises the following steps:

11. A method of processing a semiconductor device, characterized by, acquiring a semiconductor device to be processed via a robot of a semiconductor device processing apparatus as claimed in claim 10; lowering the heating plate to a wafer transfer position via the at least one first motor to adjust the deflection angle of the corresponding support rod and / or via the at least one second motor to adjust the length of the corresponding support rod, so that the robot can input the semiconductor device to a process chamber of the processing apparatus; in response to completing the transfer of the semiconductor device, raising the heating plate to a process position via the at least one first motor to adjust the deflection angle of the corresponding support rod and / or via the at least one second motor to adjust the length of the corresponding support rod, so that a first process can be performed on the semiconductor device; in response to completing the first process, rotating the heating plate by a preset angle via the at least one first motor to adjust the deflection angle of the corresponding support rod and / or via the at least one second motor to adjust the length of the corresponding support rod, so that a second process can be performed on the semiconductor device; and in response to completing the second process, lowering the heating plate to the wafer transfer position via the at least one first motor to adjust the deflection angle of the corresponding support rod and / or via the at least one second motor to adjust the length of the corresponding support rod, so that the robot can output the semiconductor device from the process chamber. Before the step of lowering the heating plate to the wafer transfer position to acquire the wafer to be processed from the robot, the method further comprises the following steps:

12. The method of claim 11, wherein the processing is performed by a computer. adjusting the tilt angle of the heating plate to 0 degrees via the at least one first motor to adjust the deflection angle of the corresponding support rod and / or via the at least one second motor to adjust the length of the corresponding support rod. The computer instructions, when executed by a processor, implement the semiconductor device processing method as claimed in claim 11 or 12.

13. A computer readable storage medium having stored thereon computer instructions, wherein, ​

Images