Light-emitting substrate and manufacturing method therefor, and light-emitting apparatus

Abstract

Embodiments of the present application provide a light-emitting substrate and a manufacturing method therefor, and a light-emitting apparatus. The light-emitting substrate comprises a substrate, a plurality of light-emitting devices spaced apart on the substrate, at least one spacer, and a phosphor layer. The spacer is disposed on the substrate and located between two adjacent light-emitting devices, the phosphor layer is disposed on the sides of the light-emitting devices away from the substrate, and a recess is formed in the phosphor layer at the position corresponding to the at least one spacer.

Description

Light-emitting substrate, manufacturing method thereof, and light-emitting device

[0001] Cross Reference to Related Applications

[0002] This application claims priority to Chinese Patent Application No. 202411119581.0, filed on August 14, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the field of optoelectronic technology, in particular to a light-emitting substrate, a manufacturing method thereof, and a light-emitting device. BACKGROUND

[0004] The light-emitting substrate generally includes a plurality of light-emitting devices arranged in an array. By independently controlling each light-emitting device, regional light emission can be achieved to adapt to different user demand scenarios.

[0005] In related technologies, a phosphor layer is often provided on all light-emitting devices as a whole. Light emitted by the light-emitting devices can easily exit through the positions of the phosphor layer corresponding to adjacent light-emitting devices, thereby causing crosstalk. This results in poor light-emitting effect of the light-emitting substrate. When the light-emitting substrate is applied to display an image, the above-mentioned crosstalk phenomenon can cause the display quality of the image to decrease, affecting the user's viewing. SUMMARY

[0006] Embodiments of the present application aim to solve the problem of crosstalk of light emitted by adjacent light-emitting devices in related technologies.

[0007] In one aspect, the present application provides a light-emitting substrate, including a substrate, a plurality of light-emitting devices arranged at intervals on the substrate, at least one spacer, and a phosphor layer. The spacer is arranged on the substrate and located between two adjacent light-emitting devices. The phosphor layer is arranged on the side of the light-emitting device away from the substrate, and the phosphor layer forms a recess at a position corresponding to the at least one spacer.

[0008] In another aspect, the present application provides a manufacturing method of a light-emitting substrate. The manufacturing method includes: arranging a plurality of light-emitting devices at intervals on a substrate; arranging a spacer between two adjacent light-emitting devices; and manufacturing a phosphor layer on the light-emitting devices, and forming a recess in the phosphor layer at a position corresponding to the spacer.

[0009] In still another aspect, the present application provides a light-emitting device, including the light-emitting substrate of any one of the above-mentioned embodiments. ADVANTAGEOUS EFFECTS

[0010] According to the light-emitting substrate provided by the embodiments of the present application, since the phosphor layer is formed with a recess at the position corresponding to the spacer, the light emitted by the light-emitting device will change its propagation direction when passing through the recess position, avoiding directly entering the phosphor layer corresponding to the light-emitting device adjacent to the light-emitting device according to the original propagation direction, and affecting the final brightness at the position of the adjacent light-emitting device. In this way, the light crosstalk between the light-emitting devices located on both sides of the spacer can be at least improved, so as to improve the light-emitting effect of the light-emitting substrate. BRIEF DESCRIPTION OF DRAWINGS

[0011] FIG. 1 is a sectional view of a light-emitting substrate according to some embodiments of the present application;

[0012] FIG. 2 is a sectional view of a light-emitting substrate according to some other embodiments of the present application;

[0013] FIG. 3 is a sectional view of a light-emitting substrate according to yet some other embodiments of the present application;

[0014] FIG. 4 is a top view of a light-emitting substrate according to some embodiments of the present application;

[0015] FIG. 5 is a top view of a light-emitting substrate according to some other embodiments of the present application;

[0016] FIG. 6 is a flowchart of a manufacturing method of a light-emitting substrate according to some embodiments of the present application;

[0017] FIGS. 7A-7E are diagrams of manufacturing steps of a light-emitting substrate according to some embodiments of the present application;

[0018] FIG. 8 is a flowchart of step S13 according to some embodiments of the present application;

[0019] FIG. 9 is a structural diagram of a light-emitting device according to some embodiments of the present application. Embodiments of the present application

[0020] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. The described technical solutions are only used to explain and describe the ideas of the present application, and should not be regarded as limiting the protection scope of the present application.

[0021] In the description of the present application, it should be understood that the terms "first", "second" and similar words do not represent any order, number or importance, but are only used to distinguish different technical features.

[0022] The use of “configured to” in this application means an open and inclusive language that does not exclude devices that are adapted to or configured to perform additional tasks or steps. In addition, the use of “based on” means open and inclusive, because the process, step, calculation or other action “based on” one or more stated conditions or values can be based on additional conditions or values beyond those stated in practice.

[0023] In this application, the word “exemplary” is used to mean “serving as an example, instance, or illustration.” Any embodiment described as “exemplary” in this application is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application.

[0024] Various embodiments of the present application are similar, and features in different embodiments and / or different examples can be combined with each other.

[0025] Some embodiments of the present application provide a light-emitting substrate, as shown in FIGS. 1-3, which includes a substrate 11, a plurality of light-emitting devices 12, at least one spacer 13, and a phosphor layer 14.

[0026] The plurality of light-emitting devices 12 are arranged at intervals on the substrate 11. For example, the substrate 11 includes a substrate and a driving circuit layer, and each light-emitting device 12 can be electrically connected to a corresponding driving circuit in the driving circuit layer, thereby achieving light-emitting control of the light-emitting device 12. In this embodiment, the light-emitting device 12 can be a light-emitting diode (LED), for example, a micro LED or μLED.

[0027] The spacer 13 is arranged on the substrate 11 and located between two adjacent light-emitting devices 12. Of course, the spacer 13 can be arranged directly on the substrate 11 or on a film layer above the substrate 11.

[0028] The phosphor layer 14 is arranged on the side of the light-emitting device 12 away from the substrate 11, and the phosphor layer 14 forms a recess K at a position corresponding to the at least one spacer 13.

[0029] In this way, since the phosphor layer 14 forms a recess at a position corresponding to the spacer 13, the light emitted by the light-emitting device 12 can change its propagation direction when passing through the recess position, avoiding directly entering the phosphor layer 14 corresponding to the adjacent light-emitting device 12 according to the original propagation direction, and affecting the final brightness at the position of the adjacent light-emitting device 12. In this way, the light crosstalk between the light-emitting devices 12 located on both sides of the spacer 13 can be at least improved, thereby improving the light-emitting effect of the light-emitting substrate 100.

[0030] In some embodiments, as shown in FIG. 1, the phosphor layer 14 does not expose the spacers 13 at the positions of the recesses K. In this case, the bottom surface of the recess K covers the spacers 13 and there is a spacing between the bottom surface of the recess K and the spacers 13.

[0031] In other embodiments, as shown in FIG. 2 and FIG. 3, the phosphor layer 14 is broken at the positions of the spacers 13 to form a plurality of phosphors 141. In this way, different phosphors 141 are independent of each other, and thus the light emitted by the light emitting device 12 located below one phosphor 141 cannot directly enter into the adjacent phosphor 141 in the propagation direction, which can further improve the mutual influence between the two adjacent light emitting devices 12 and thus improve the light emitting effect of the light emitting substrate 100.

[0032] In some examples, each phosphor 141 can correspond to one light emitting device 12, so that each light emitting device 12 is covered by a corresponding phosphor 141. Since there is a recess between the two adjacent phosphors 141 at the positions of the spacers 13, the mutual influence between the two adjacent light emitting devices 12 can be improved, and thus the light emitting effect of the light emitting substrate 100 can be improved.

[0033] As an implementation, a spacer 13 is arranged between any two light emitting devices 12, and the phosphor 141 located above the light emitting device 12 forms a recess between the adjacent phosphor 141 at the position of the spacer 13. In this way, the mutual influence between any two adjacent light emitting devices 12 can be improved, and thus the light emitting effect of the light emitting substrate 100 can be improved.

[0034] In other examples, each phosphor 141 can correspond to a plurality of light emitting devices 12, so that a plurality of light emitting devices 12 are simultaneously covered by one phosphor 141. In this case, the plurality of phosphors 141 can divide a plurality of light emitting regions. Since there is a recess between the two adjacent phosphors 141 at the positions of the spacers 13, the mutual influence between the two adjacent light emitting regions can be improved, and thus the light emitting effect of the light emitting substrate 100 can be improved.

[0035] In the case where each phosphor 141 corresponds to a plurality of light emitting devices 12, the plurality of light emitting devices 12 can be connected to the same driving circuit, so as to realize the synchronous control of the light emitting devices 12 in the corresponding light emitting region. In this way, the layout cost of the driving circuit can be reduced, while ensuring the partition control of the light emitting substrate 100. For example, the plurality of light emitting devices 12 corresponding to each phosphor 141 can also be connected to different driving circuits.

[0036] As an implementation, a spacer 13 is arranged at the position between any two phosphors 141, and the phosphor layer 14 is recessed at the position of the spacer 13. In this way, the mutual influence between the light emitting areas corresponding to any two adjacent phosphors 141 can be improved, and the light emitting effect of the light emitting substrate 100 can be further improved.

[0037] In some examples, when a plurality of spacers 13 are arranged, the phosphor layer 14 is broken at the positions of at least some of the spacers 13 to form a plurality of phosphors 141. When the phosphor layer 14 is broken at the positions of some of the spacers 13 to form a plurality of phosphors 141, the phosphor layer 14 is recessed at the positions of the other spacers 13, and is continuous at the positions of the other spacers 13.

[0038] In some embodiments, as shown in FIGS. 1-3, the depth H1 of the recess K is smaller than the thickness H2 of the phosphor layer 14, and the refractive index of the medium in the recess K is smaller than the refractive index of the phosphor layer 14.

[0039] For example, the medium in the recess K can be air, in which case the material of the phosphor layer 14 needs to be selected to have a refractive index greater than that of air. Of course, the medium in the recess K can also be other solid, liquid or gaseous substances, and the embodiments of the present application do not limit the same.

[0040] Since the refractive index of the medium in the recess K is relatively small, when the light emitted by the light emitting device 12 passes through the sidewall of the phosphor layer 14 located above the recess K, as shown in FIG. 2, a part of the light will be totally reflected and reflected back into the phosphor layer 14 above the light emitting device 12, thereby avoiding the influence of this part of the light on the light emitting brightness of another adjacent light emitting device 12 spaced from the recess K. Another part of the light will be refracted and deflected towards the side where the light emitting device 12 is located, which can effectively improve the interference of this part of the light on the light emitting brightness of the adjacent light emitting device 12, thereby improving the light emitting effect of the light emitting substrate 100.

[0041] In some examples, as shown in FIGS. 2 and 3, the sidewalls of the two adjacent phosphors 141 can be connected by the spacer 13, so that the sidewalls of the two adjacent phosphors 141 and the top surface of the spacer 13 can jointly define the recess K.

[0042] In some examples, the area of the opening of the recess K is greater than the area of the bottom of the recess K. The opening of the recess K refers to the area of the side of the recess K away from the substrate 11, and the bottom of the recess K refers to the area of the side of the recess K close to the substrate 11. In this case, the light emitting device 12 adjacent to the recess K is prone to reflection when the light passes through the side wall of the phosphor 141 located in the recess K during the light emitting process, which is conducive to reducing the proportion of refraction of the light passing through the side wall, and thus the light emitting effect of each light emitting device 12 can be improved.

[0043] For example, the side wall of the phosphor 141 located in the recess K can include at least one of an arc surface and a flat surface.

[0044] In some examples, the recess K is filled with an optically transparent adhesive, and the refractive index of the optically transparent adhesive is less than the refractive index of the phosphor layer 14.

[0045] By filling the optically transparent adhesive, the recessed part of the phosphor layer 14 can be compensated, which is conducive to improving the structural stability of the layer above the light emitting device 12, and also helps to avoid the external air from easily penetrating the phosphor layer 14 to contact the light emitting device 12 and adversely affect the light emitting device 12 due to the existence of the recess K, thereby ensuring the working stability of the light emitting device 12.

[0046] In some examples, the optically transparent adhesive can be ultraviolet curing adhesive. The ultraviolet curing adhesive has the advantages of safety, non-pollution, and fast curing speed, thereby being conducive to ensuring the safety and environmental protection of the light emitting substrate 100 and the production efficiency.

[0047] In some embodiments, as shown in FIG. 3, the light emitting substrate 100 further includes an isolation layer 15 located on the substrate 11 and surrounding the light emitting device 12, and the spacer 13 is arranged on the side of the isolation layer 15 away from the substrate 11.

[0048] By surrounding the light emitting device 12 with the isolation layer 15, the problem of light crosstalk between adjacent light emitting devices 12 can be further reduced, thereby improving the light emitting effect of each light emitting device 12.

[0049] In some examples, the isolation layer 15 can be made of resin or other materials.

[0050] In some embodiments, as shown in FIG. 4 and FIG. 5, the plurality of light emitting devices 12 are arranged in an array along the row direction X and the column direction Y, the row direction X and the column direction Y intersect each other, and the plurality of spacers 13 on one side of the light emitting devices 12 in the same row are connected to each other.

[0051] The light emitting devices 12 in the same row can jointly form a light emitting unit. Since the multiple spacers 13 on one side of the light emitting unit are connected to each other (i.e., the multiple spacers 13 arranged in the row direction X are connected to each other), and the phosphor layer 14 forms a recess K at the position of the spacers 13, a continuous recess can be formed at the position between the adjacent two light emitting units, thereby further improving the crosstalk between the light emitting devices 12 spaced apart from each other in different light emitting units.

[0052] As shown in FIG. 4, the first light emitting device 121 and the second light emitting device 122 are arranged in the row direction X, the third light emitting device 123 and the fourth light emitting device 124 are arranged in the row direction X, and the first light emitting device 121 and the third light emitting device 123 are arranged in the column direction Y. The multiple spacers 13 (e.g., the first spacer 131 and the second spacer 132) on the same side of the first light emitting device 121 and the second light emitting device 122 in the same row are connected to each other. Of course, only two spacers 13 connected to each other in the row direction X are shown in FIG. 4, which does not limit the number of spacers 13 connected to each other in the row direction X.

[0053] In this case, a continuous recess K is formed at the position between the two light emitting units, so that the crosstalk of the light emitted by the first light emitting device 121 into the fourth light emitting device 124 and the crosstalk of the light emitted by the fourth light emitting device 124 into the first light emitting device 121 can be improved by the spacing of the recess K; similarly, the crosstalk between the second light emitting device 122 and the third light emitting device 123 can also be effectively improved.

[0054] In some embodiments, as shown in FIG. 4 and FIG. 5, the multiple spacers 13 on one side of the light emitting devices 12 in the same column are connected to each other. In this way, the multiple spacers 13 arranged in the column direction Y are connected to each other, and since the phosphor layer 14 forms a recess K at the position of the spacers 13, a continuous recess can be formed at the position between the adjacent two light emitting devices 121 in the column direction Y, thereby reducing the crosstalk between the light emitting devices 12 spaced apart from each other in the row direction X.

[0055] As shown in FIG. 4, the spacers 13 on the right side of the first light emitting device 121 and the third light emitting device 123 are connected to each other, so that the phosphor layer 14 forms a continuous recess K in the column direction Y, and the recess K not only separates the first light emitting device 121 and the second light emitting device 122, but also separates the third light emitting device 123 and the fourth light emitting device 124. In this way, the crosstalk between the first light emitting device 121 and the fourth light emitting device 124 can be effectively improved, and the crosstalk between the second light emitting device 122 and the third light emitting device 123 can also be effectively improved.

[0056] In some embodiments, the plurality of rows of spacers 13 are parallel and spaced apart, the plurality of columns of spacers 13 are parallel and spaced apart, and the plurality of rows of spacers 13 and the plurality of columns of spacers 13 are connected to form a mesh structure.

[0057] In this way, for the light emitting device 12 surrounded by the spacers 13, the phosphor layer 14 located above the light emitting device 12 forms a recess K surrounding the light emitting device 12, which can effectively improve the crosstalk between the light emitting device 12 and the surrounding light emitting devices 12, thereby improving the light emitting effect of the light emitting substrate 100.

[0058] In some examples, the row direction X and the column direction Y can be perpendicular to each other. Of course, the included angle between the row direction X and the column direction Y can also be set to other angles other than 90°, which is not limited here.

[0059] In some embodiments, as shown in FIGS. 4 and 5, for the light emitting device 12 at the edge of the light emitting substrate 100, at least two spacers 13 located around the light emitting device 12 are connected to each other.

[0060] Since the phosphor layer 14 forms a recess K at the position of the spacer 13, a continuous recess K can be formed around the light emitting device 12, which can further improve the crosstalk of the light emitted by the light emitting device 12 to the surrounding light emitting devices 12.

[0061] In some examples, as shown in FIG. 4, two spacers 13 located on the adjacent two sides of the light emitting device 12 are connected to each other, so that a continuous recess K is formed on the two sides around the light emitting device 12. For example, the spacer 13 on the side of the first light emitting device 121 close to the second light emitting device 122 is connected to the spacer 13 on the side of the first light emitting device 121 close to the third light emitting device 123, so that a continuous recess K is formed on the side close to the second light emitting device 122 and the side close to the third light emitting device 123 of the first light emitting device 121, thereby facilitating the improvement of the crosstalk of the light emitted by the first light emitting device 121 to the fourth light emitting device 124.

[0062] In some examples, for the light emitting device 12 at the edge of the light emitting substrate 100, three spacers 13 located on three sides of the light emitting device 12 are connected to each other, so that a continuous recess K is formed on the three sides around the light emitting device 12, which facilitates the independence of the phosphor 141 above the light emitting device 12, thereby improving the light emitting effect of the light emitting device 12.

[0063] In some examples, as shown in FIG. 5, for the light emitting device 12 at the edge of the light emitting substrate 100, all the spacers 13 located around the light emitting device 12 are connected to each other, so that a continuous recess K surrounds the light emitting device 12, thereby ensuring the independence of the phosphor 141 above the light emitting device 12 surrounded by the recess K, and effectively improving the crosstalk caused by the surrounding light emitting device 12 to the light emitting device 12 and improving the light emitting effect of the light emitting device 12.

[0064] In some embodiments, the thermal expansion rate of the spacer 13 is greater than the thermal expansion rate of the substrate 11.

[0065] Due to the difference in thermal expansion between the spacer 13 and the substrate 11, the degree of cracking of the phosphor layer 14 over the spacer 13 during formation can be increased, and the formation efficiency of the phosphor 141 can be improved.

[0066] It is worth noting that in the process of making the phosphor layer 14, an initial phosphor layer is first made above the substrate 11, which covers each light emitting device 12. Due to the spacer 13 arranged between adjacent light emitting devices 12, the thermal expansion rate of the spacer 13 is greater than the thermal expansion rate of the substrate 11, which causes the initial phosphor layer to be prone to cracking over the spacer 13, and in the subsequent curing process, each part of the initial phosphor layer shrinks to form a recess K over the spacer 13. When the initial phosphor layer is broken over the spacer 13, the phosphor layer 14 is divided into a plurality of phosphors 141.

[0067] In some examples, the spacer 13 can be made of metal, such as aluminum or gold.

[0068] In some examples, the thickness of the spacer 13 is greater than or equal to 0.15 μm and less than or equal to 0.3 μm. By setting the spacer 13 in the above range, it can avoid that the thickness of the spacer 13 is too large to affect the light of the light emitting device 12, and also avoid that the thickness of the spacer 13 is too small to contribute to the formation of cracks in the initial phosphor layer, which makes it difficult for the phosphor layer 14 to form a recess K at the position of the spacer 13. For example, the thickness of the spacer 13 can be 0.15 μm, 0.2 μm, 0.25 μm or 0.3 μm, etc. within the above range.

[0069] In some embodiments, the light emitting device 12 can be a blue semiconductor light emitting element that emits blue light.

[0070] In some examples, the phosphor layer 14 includes a fluorescent material. The fluorescent material can be a red fluorescent material capable of converting blue light into red light, a green fluorescent material capable of converting blue light into green light, or a white fluorescent material capable of converting blue light into white light. After the phosphor layer 14 converts the color of the light emitted by the light emitting device 12, the light emitting substrate 100 can be used to emit light of a specific color, such as red light, white light, etc.

[0071] For example, the red fluorescent material can be a nitride-based, sulfide-based, or fluoride-based fluorescent material. The green fluorescent material can be a silicate-based, nitride-based, or sulfide-based fluorescent material.

[0072] In some examples, the phosphor layer 14 includes Si-O-Si chemical bonds. Due to the presence of the Si-O-Si chemical bonds, the cross-linking density of the initial phosphor layer 21 can be improved, the phosphor layer 14 formed finally can be more solid; and the elasticity of the phosphor layer 14 can also be improved, the stress inside each phosphor 141 in the phosphor layer 14 can be balanced, the phosphor 141 can better withstand stress during the drying shrinkage process, and the occurrence of cracking of the phosphor 141 can be reduced.

[0073] Some embodiments of the present application provide a manufacturing method of a light emitting substrate 100, as shown in FIG. 6, which includes steps S11-S13.

[0074] S11: As shown in FIG. 7A, a plurality of light emitting devices 12 are arranged on the substrate 11 at intervals.

[0075] For example, the light emitting device 12 can be a flip chip or a vertical chip. The flip chip can avoid the risk of wire breakage; the vertical chip has the advantage of top light emission, which can improve the light intensity.

[0076] The light emitting device 12 can be fixed on the substrate 11 in a eutectic manner. For example, the light emitting device 12 can be fixed in a gold-tin eutectic manner. In a vacuum or a furnace cavity filled with protective gas, the gold-tin layer at the bottom of the chip and the driving circuit layer of the substrate 11 are linked by temperature rise to form a metal bond; or a hot-pressing eutectic machine is used for gold-tin eutectic process.

[0077] S12: As shown in FIG. 7B, a spacer 13 is arranged between two adjacent light emitting devices 12.

[0078] For example, the spacer 13 can be a metal material such as aluminum or gold, which has good thermal expansion and stability, thereby ensuring the subsequent process.

[0079] S13: As shown in FIG. 7E, a phosphor layer 14 is disposed on the light emitting devices 12, and the phosphor layer 14 is formed with recesses at positions corresponding to the spacers 13, thereby forming a light emitting substrate 100.

[0080] For the light emitting substrate 100 manufactured by the above method, the phosphor layer 14 is formed with recesses at positions corresponding to the spacers 13, and the light emitted by the light emitting devices 12 can change its propagation direction when passing through the recess positions, thereby avoiding directly entering into the phosphor layer 14 corresponding to the light emitting device 12 adjacent to the light emitting device 12 in the original propagation direction, and affecting the final brightness at the position of the adjacent light emitting device 12. In this way, the light crosstalk between the light emitting devices 12 located on both sides of the spacer 13 can be at least improved, thereby improving the light emitting effect of the light emitting substrate 100. In addition, the light emitting substrate 100 manufactured by the above method has a relatively simple process and low cost.

[0081] In some embodiments, as shown in FIG. 8, step S13 includes steps S131-S136.

[0082] S131: As shown in FIG. 7C, an initial phosphor layer 21 is formed on the light emitting devices 12.

[0083] For example, the initial phosphor layer 21 can be formed on the light emitting devices 12 and the spacers 13 by coating. After the initial phosphor layer 21 is coated, it can be pre-baked to be substantially shaped.

[0084] The initial phosphor layer 21 can be manufactured by a sol-gel method, which is a common technical means in the art and will not be described in detail here.

[0085] The initial phosphor layer 21 can contain fluorescent materials, thereby converting the color of the light emitted by the light emitting devices 12 to emit light of a specific color.

[0086] S132: A photoresist layer 22 is formed on the initial phosphor layer 21.

[0087] S133: As shown in FIG. 7D, openings 220 are formed in the photoresist layer 22 at positions corresponding to each of the light emitting devices 12.

[0088] S134: A cross-linking agent is disposed in the openings 220, thereby forming a phosphor fusion layer by the action of the cross-linking agent and the initial phosphor layer 21.

[0089] The cross-linking agent can be disposed by coating, and penetrates into the initial phosphor layer 21 through the openings 220 and acts with the initial phosphor layer 21, thereby forming the phosphor fusion layer.

[0090] The cross-linking agent can be selected from a material that does not react with the phosphor material in the initial phosphor layer 21.

[0091] In some examples, the cross-linking agent includes N,N'-Dicyclohexylcarbodiimide (DCC).

[0092] DCC is a commonly used dehydrating agent that can facilitate esterification and amidation reactions, thereby enhancing the mechanical strength and structural integrity of the thin film.

[0093] By using DCC, on one hand, DCC can react with the functional groups in the initial phosphor layer 21 to form more cross-linking points, thereby increasing the cross-linking density of the initial phosphor layer 21 and making the final phosphor layer 14 more robust. On the other hand, through the cross-linking reaction, DCC helps to increase the elasticity of the phosphor layer 14 and make the stress distribution inside the parts (e.g., phosphor 141) at the positions corresponding to each light emitting device 12 uniform, so that the phosphor layer 14 can better withstand stress during the drying and shrinking process of the phosphor layer 14 and reduce the occurrence of phosphor 141 cracking.

[0094] In other examples, the cross-linking agent can include Tetraethyl Orthosilicate (TEOS). TEOS generates Si-O-Si chemical bonds through hydrolysis and condensation reactions.

[0095] For example, TEOS generates silicon dioxide or other silicon-based materials after the hydrolysis and condensation reactions. The hydrolysis reaction includes an initial hydrolysis reaction: Si(OEt)4+ H2O → Si(OEt)3(OH) + EtOH, i.e., TEOS reacts with water to generate monosilanol and ethanol. Then, the remaining silanol groups undergo successive hydrolysis reactions to gradually form Si-OH chemical bonds, which are: Si(OEt)3+ H2O → Si(OEt)2(OH)2+ EtOH, Si(OEt)2+ H2O → Si(OEt)1(OH) + EtOH, and Si(OEt)1+ H2O → Si(OEt)(OH)3+ EtOH. Therefore, the hydrolysis reaction of TEOS can be expressed as: Si(OEt)4+ 4H2O → Si(OH)4+ 4EtOH. Here, OEt is an ethoxy group with a molecular formula of OC2H5. In addition, the condensation reaction includes: 2Si(OH)4→ SiO2+ 2H2O. Therefore, the silanol molecules undergo condensation reactions to form Si-O-Si chemical bonds through dehydration, and finally form a silicon dioxide network structure.

[0096] After TEOS is formed through the above reaction, the Si-O-Si chemical bond can increase the cross-linking density of the initial phosphor layer 21, making the finally formed phosphor layer 14 more solid; and it can also improve the elasticity of the phosphor layer 14, balance the stress inside each phosphor 141 in the phosphor layer 14, so that the phosphor 141 can better withstand stress during the drying shrinkage process, reducing the occurrence of phosphor 141 cracking.

[0097] In some examples, the central projection of the opening 220 on the substrate 11 coincides with the central projection of the light emitting device 12 on the substrate 11. That is, the line between the center of the opening 220 and the center of the light emitting device 12 is parallel to the thickness direction of the substrate 11. In this way, the cross-linking agent can be mixed relatively uniformly into the part of the initial phosphor layer 21 corresponding to the light emitting device 12, thereby facilitating the formation of the subsequent phosphor layer 14 and ensuring the structural stability of the phosphor layer 14.

[0098] For example, on the side surface of the photoresist layer 22 away from the substrate 11, the opening 220 can be arranged in a rectangular shape, which can be coaxial with the rectangular light emitting device 12, which is conducive to the final phosphor layer 14 formed to well cover the light emitting device 12. As another embodiment, the opening 220 can also be circular or the like.

[0099] In some examples, the opening 220 is arranged in a staggered manner with the spacer 13, thereby effectively preventing the cross-linking agent from entering the part above the spacer 13 of the initial phosphor layer 21, thereby facilitating the formation of a recess in the part above the spacer 13.

[0100] S135: Remove the photoresist layer.

[0101] S136: Cure the phosphor fusion layer, and the phosphor fusion layer is recessed at the position corresponding to the spacer 13 to form the phosphor layer 14.

[0102] For example, the phosphor fusion layer can be baked to cure it. During the curing process, due to the greater thermal expansion of the spacer 13, the phosphor fusion layer cracks and forms a recess above the spacer 13, thereby effectively preventing light from the light emitting devices 12 on both sides of the spacer 13 from mutually interfering with each other.

[0103] In some examples, the phosphor fusion layer is recessed and disconnected at the position corresponding to the spacer 13 to form a plurality of phosphors 141, each of which is located on a corresponding light emitting device 12.

[0104] Since the phosphor 141 is formed by cracking the phosphor fusion layer, the stress uniformity in each phosphor 141 is high, thereby having good stability, which ensures the stability of the subsequent use of the light emitting substrate 100.

[0105] Some embodiments of the present application provide a light emitting device, as shown in FIG. 9, the light emitting device 200 comprises a light emitting substrate 100, the light emitting substrate 100 comprises a substrate 11, a plurality of light emitting devices 12 arranged on the substrate 11 at intervals, at least one spacer 13, and a phosphor layer 14.

[0106] The spacer 13 is arranged on the substrate 11 and located between two adjacent light emitting devices 12, the phosphor layer 14 is arranged on the side of the light emitting device 12 away from the substrate 11, and the phosphor layer 14 is formed with a recess K at a position corresponding to the at least one spacer 13.

[0107] In this way, since the phosphor layer 14 is formed with a recess at a position corresponding to the spacer 13, the light emitted by the light emitting device 12 can change its propagation direction when passing through the recess position, avoiding directly entering the phosphor layer 14 corresponding to the adjacent light emitting device 12 according to the original propagation direction, and affecting the final brightness at the position of the adjacent light emitting device 12; in this way, the light crosstalk between the light emitting devices 12 located on both sides of the spacer 13 can be improved. In addition, all the light emitting devices 12 in the light emitting substrate 100 have independent and good light emitting effects, so that the light emitting device 200 can have good resolution.

[0108] In some embodiments, the light emitting device 200 can also comprise other features of the above-mentioned light emitting substrate 100, and therefore has technical effects corresponding to the light emitting substrate 100, which will not be described here.

[0109] In some examples, as shown in FIG. 9, the light emitting device 200 can comprise a liquid crystal display panel 101 located on the light emitting side of the light emitting substrate 100, in which case the light emitting device 200 can be used for picture display.

[0110] In other examples, the light emitting device 200 can comprise a mounting bracket for fixing the light emitting substrate 100, in which case the light emitting device 200 can be used for lighting. The light emitting device 200 is, for example, a vehicle lamp.

[0111] In summary, although the present application discloses the above-mentioned preferred embodiments, the above-mentioned preferred embodiments are not used to limit the present application, and those skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application is based on the scope defined by the claims.

Claims

1. A light emitting substrate, comprising: a substrate; a plurality of light emitting devices arranged on the substrate with intervals; at least one spacer arranged on the substrate and between two adjacent light emitting devices; and a phosphor layer arranged on a side of the light emitting devices away from the substrate, the phosphor layer being formed with recesses at positions corresponding to the at least one spacer. The phosphor layer is broken at the positions of the spacers to form a plurality of phosphors.

2. The light-emitting substrate according to claim 1, wherein The depth of the recess is less than the thickness of the phosphor layer, and the refractive index of a medium in the recess is less than the refractive index of the phosphor layer.

3. The light-emitting substrate of claim 1, wherein, The area of an opening of the recess is greater than the area of a bottom of the recess.

4. The light-emitting substrate of claim 3, wherein, The medium comprises transparent optical glue.

5. The light-emitting substrate of claim 3, wherein, The plurality of light emitting devices are arranged in a row direction and a column direction, the row direction and the column direction intersecting each other, a plurality of spacers on one side of the light emitting devices in the same row being connected to each other.

6. The light-emitting substrate according to any one of claims 1-5, wherein, A plurality of spacers on one side of the light emitting devices in the same column are connected to each other; wherein a plurality of rows of spacers are arranged in parallel and with intervals, a plurality of columns of spacers are arranged in parallel and with intervals, and the plurality of rows of spacers and the plurality of columns of spacers are connected to each other to form a mesh structure.

7. The light-emitting substrate of claim 6, wherein, The thermal expansion rate of the spacer is greater than the thermal expansion rate of the substrate.

8. The light emitting substrate of any of claims 1-5, wherein, The thickness of the spacer is greater than or equal to 0.15 μm and less than or equal to 0.3 μm.

9. The light-emitting substrate of claim 8, wherein, The phosphor layer comprises Si-O-Si chemical bonds.

10. The light emitting substrate of any of claims 1-5, wherein, 11.The light emitting substrate of any one of claims 1-5, further comprising an isolation layer arranged on the substrate and surrounding the light emitting devices, and the at least one spacer is arranged on a side of the isolation layer away from the substrate. 12.A method for manufacturing a light emitting substrate, comprising: arranging a plurality of light emitting devices on a substrate with intervals; arranging a spacer between two adjacent light emitting devices; and manufacturing a phosphor layer on the light emitting devices, and forming recesses in the phosphor layer at positions corresponding to the spacer. The manufacturing of the phosphor layer on the light emitting devices and the forming of the recesses in the phosphor layer at positions corresponding to the spacer comprises: forming an initial phosphor layer on the light emitting devices; 13. The method of producing a light emitting substrate according to claim 12, wherein, forming a photoresist layer on the initial phosphor layer; opening an opening in the photoresist layer at a position corresponding to each light emitting device; arranging a crosslinking agent in the opening to form a phosphor fusion layer; removing the photoresist layer; and curing the phosphor fusion layer, and the phosphor fusion layer is recessed at positions corresponding to the spacer to form the phosphor layer. The center of the opening in the substrate is coincident with the center of the corresponding light emitting device in the substrate. The crosslinking agent comprises one of N,N'-dicyclohexyl carbodiimide and tetraethoxysilane.

14. The method of fabricating a light-emitting substrate according to claim 13, wherein, 16.A light emitting device, comprising a light emitting substrate, the light emitting substrate comprising:

15. The method of claim 13, wherein the light-emitting substrate is a light-emitting diode substrate. a substrate; a plurality of light emitting devices arranged on the substrate with intervals; at least one spacer arranged on the substrate and between two adjacent light emitting devices; and ​ ​ ​ A phosphor layer is disposed on a side of the light emitting device distal to the substrate, the phosphor layer having a recess formed therein at a location corresponding to at least one of the spacers.

17. The light emitting device of claim 16, wherein, The phosphor layer is broken at the location of the spacers to form a plurality of phosphors.

18. The light emitting device of claim 16, wherein, The recess has a depth less than a thickness of the phosphor layer, and a medium within the recess has a refractive index less than a refractive index of the phosphor layer.

19. The light emitting device according to any of claims 16-18, wherein, A plurality of the light emitting devices are arranged in rows and columns, the rows and columns intersecting each other, and a plurality of the spacers on one side of the light emitting devices in the same row are connected to each other.

20. The light emitting device of claim 19, wherein, A plurality of the spacers on one side of the light emitting devices in the same column are connected to each other; wherein a plurality of rows of the spacers are arranged in parallel and at intervals, a plurality of columns of the spacers are arranged in parallel and at intervals, and the plurality of rows of the spacers and the plurality of columns of the spacers are connected to each other to form a mesh structure.

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