Method for calculating number of real-time cleanability instances of carrier plate, method for calculating number of coating instances of carrier plate, and system

Abstract

The present invention relates to the technical field of solar cell preparation devices. Provided are a method for calculating the number of real-time cleanability instances of a carrier plate, a method for calculating the number of coating instances of a carrier plate, and a system. The method for calculating the number of real-time cleanability instances of a carrier plate in the present invention comprises: obtaining an actual size of the upper opening of each mask unit, an actual size of the lower opening of each mask unit, and the minimum size of a target object; obtaining the minimum mask amount; on the basis of the minimum mask amount, obtaining a corrosion allowance of each mask unit; on the basis of the corrosion allowance of each mask unit, obtaining the number of real-time cleanability instances of each mask unit; and on the basis of the number of real-time cleanability instances of each mask unit, obtaining the number of real-time cleanability instances of a carrier plate. The number of cleanability instances of a carrier plate is calculated by means of the solution for calculating the number of real-time cleanability instances of the carrier plate, so as to determine whether the carrier plate can continue to be used; thus, a target object is prevented from falling down due to an excessively large size of the lower opening of the carrier plate when the target object is placed on the carrier plate, which would otherwise cause damage to the target object and increase costs.

Description

Method and system for calculating real-time cleanable times and coating times of carrier plate TECHNICAL FIELD

[0001] The present application relates to the technical field of solar cell manufacturing equipment, in particular to a method and system for calculating real-time cleanable times and coating times of a carrier plate. BACKGROUND

[0002] In the HJT process flow, PVD coating is a very important process. We use a carrier plate to load the cell into the PVD equipment to deposit the TCO film layer, so that the cell can obtain the properties of anti-reflection and lateral conduction. Sputtering coating is divided into upward and downward sputtering, which can simultaneously realize the coating of the front and back surfaces of the silicon wafer. The PVD coating is a transparent conductive film, usually ITO, and it may also be another transparent conductive film. After the carrier plate is used for a period of time, a certain thickness of ITO film layer will be deposited on the surface of the carrier plate. Since ITO has super strong water absorption characteristics, it will bring too much water vapor to the coating process, resulting in a decrease in the conversion efficiency of the cell. Therefore, the carrier plate needs to be regularly removed for film treatment, usually by acid washing and sand blasting. Currently, customers use the results (conversion efficiency of the cell) and monitor the water vapor content in the process cavity (which cannot monitor individual carrier plates) to determine whether the carrier plate needs to be cleaned. This method is neither scientific nor accurate, and it cannot accurately determine whether a carrier plate has reached the cleaning time and service life, thereby increasing costs. SUMMARY

[0003] One object of the first aspect of the present application is to provide a method for calculating the real-time cleanable times of a carrier plate, which solves the problem of high bad wafer rate caused by the inability to know the cleanable times of the carrier plate in the prior art.

[0004] One object of the second aspect of the present application is to provide a method for calculating the coating times of a carrier plate, which solves the problem of high bad wafer rate caused by the inability to know the coating times before the next cleaning in the prior art.

[0005] One object of the third aspect of the present application is to provide a system capable of storing a method for calculating the real-time cleanable times of a carrier plate and a method for calculating the real-time cleanable times of a carrier plate.

[0006] In particular, the present application also provides a method for calculating the real-time cleanable times of a carrier plate, wherein the carrier plate comprises at least one mask unit, each mask unit comprises an upper opening and a lower opening, the size of the upper opening is larger than the size of the lower opening and forms a support platform, and a target object is placed on the support platform of the corresponding mask unit to mask the target object and deposit a functional layer at the bottom of the target object.

[0007] The method for calculating the cleanable times of the carrier plate comprises:

[0008] obtaining an actual size of an upper opening of each of the mask units, an actual size of a lower opening of each of the mask units, and a minimum size of the target object;

[0009] obtaining a minimum mask amount according to the actual size of the upper opening of each of the mask units, the actual size of the lower opening of each of the mask units, and the minimum size of the target object;

[0010] obtaining an etching allowance of each of the mask units according to the minimum mask amount;

[0011] obtaining a real-time cleanable number of each of the mask units according to the etching allowance of each of the mask units;

[0012] obtaining a real-time cleanable number of the carrier plate according to the real-time cleanable number of each of the mask units.

[0013] Optionally, the step of obtaining the actual size of the upper opening of each of the mask units comprises:

[0014] obtaining an original size of the upper opening of each of the mask units;

[0015] obtaining a number of times the carrier plate has been cleaned;

[0016] obtaining the actual size of the upper opening of each of the mask units according to the original size of the upper opening of each of the mask units and the number of times the carrier plate has been cleaned.

[0017] Optionally, the actual size of the upper opening of each of the mask units is obtained according to the original size of the upper opening of each of the mask units and the number of times the carrier plate has been cleaned according to the following formula (1):

[0018] A = A1 + 2 × N ×△t, (1);

[0019] wherein A is the actual size of the upper opening of each of the mask units, A1 is the original size of the upper opening of each of the mask units, N is the number of times the carrier plate has been cleaned, and△t is an etching thickness of one side of the upper opening of each of the carrier plates per cleaning.

[0020] Optionally, the step of obtaining the actual size of the lower opening of each of the mask units comprises:

[0021] obtaining an original size of the lower opening of each of the mask units;

[0022] obtaining a number of times the carrier plate has been cleaned;

[0023] The actual size of the lower opening of each mask unit is obtained according to the original size of the lower opening of each mask unit and the number of times the carrier plate has been cleaned.

[0024] Optionally, the actual size of the lower opening of each mask unit is obtained according to the original size of the lower opening of each mask unit and the number of times the carrier plate has been cleaned according to the following formula:

[0025] B = B1 + 2 × N ×△t, (2);

[0026] wherein B is the actual size of the lower opening of each mask unit, B1 is the original size of the lower opening of each mask unit, N is the number of times the carrier plate has been cleaned, and△t is the corrosion thickness of the lower opening of each carrier plate for each cleaning.

[0027] Optionally, the minimum mask amount is obtained according to the actual size of the upper opening of each mask unit, the actual size of the lower opening of each mask unit, and the minimum size of the target object according to the following formula:

[0028] M = (A - B) / 2 - (A - Cmin), (3);

[0029] wherein M is the minimum mask amount, and Cmin is the minimum size of the target object.

[0030] Optionally, the step of obtaining the corrosion allowance of each mask unit according to the minimum mask amount comprises calculating by using formula (4), and the formula (4) is:

[0031] △M = M - Mmin, (4);

[0032] wherein△M is the corrosion allowance, and Mmin is the limit mask amount.

[0033] Optionally, the step of obtaining the real-time cleanable number of times of each mask unit according to the corrosion allowance of each mask unit is obtained according to the following formula (5), wherein the formula (5) is:

[0034] Y =△M / 2△t, (5);

[0035] wherein Y is the real-time cleanable number of times of the mask unit.

[0036] Optionally, the step of obtaining the real-time cleanable number of times of the carrier plate according to the real-time cleanable number of times of each mask unit comprises:

[0037] comparing the real-time cleanable number of times of all the mask units;

[0038] The real-time cleanable number of times is obtained, which is the real-time cleanable number of times of the carrier plate.

[0039] In particular, the application further provides a method for calculating the coating number of times of a carrier plate, comprising:

[0040] The real-time cleanable number of times of the carrier plate is calculated according to the above method for calculating the real-time cleanable number of times of a carrier plate.

[0041] It is judged whether the real-time cleanable number of times of the carrier plate is greater than or equal to 1.

[0042] If yes, the coating number of times of the carrier plate before the next cleaning is calculated.

[0043] Optionally, the step of calculating the coating number of times of the carrier plate before the next cleaning comprises:

[0044] The film releasing allowance of the upper opening of each mask unit and the thickness of each deposition of the functional layer are obtained.

[0045] The coating number of times of each mask unit before the next cleaning is obtained according to the film releasing allowance and the thickness.

[0046] The coating number of times of the carrier plate before the next cleaning is obtained according to the coating number of times of each mask unit.

[0047] Optionally, the step of obtaining the film releasing allowance of the upper opening of each mask unit comprises:

[0048] The actual size of the upper opening of each mask unit and the size of a corresponding target object located at the upper opening of the mask unit are obtained.

[0049] The film releasing allowance is obtained according to the actual size and the size of the target object.

[0050] Optionally, the step of obtaining the actual size of the upper opening of each mask unit comprises:

[0051] The original size of the upper opening of each mask unit is obtained.

[0052] The number of times of cleaning of the carrier plate is obtained.

[0053] The actual size of the upper opening of each mask unit is obtained according to the original size of the upper opening of each mask unit and the number of times of cleaning of the carrier plate.

[0054] Optionally, the actual size of the upper opening of each mask unit is obtained according to the original size of the upper opening of each mask unit and the number of times of cleaning of the carrier plate according to the following formula (1):

[0055] A = A1+2× N×△t, (1);

[0056] Wherein, A is the actual size of the upper opening of each mask unit, A1 is the original size of the upper opening of each mask unit, N is the number of times of cleaning the carrier plate,△t is the corrosion thickness of the upper opening of each carrier plate per cleaning.

[0057] Optionally, the step of obtaining the film releasing allowance according to the actual size and the size of the target object comprises calculating according to the following formula (6):

[0058] X = A-Cmax, (6);

[0059] Wherein, X is the film releasing allowance, and Cmax is the maximum size of the target object.

[0060] Optionally, the step of obtaining the number of times of coating each mask unit according to the film releasing allowance and the thickness comprises calculating according to the following formula (7):

[0061] T = X / 2D, (7);

[0062] Wherein, T is the number of times of coating each mask unit; and D is the thickness of the functional layer deposited each time.

[0063] Optionally, the step of obtaining the number of times of coating the carrier plate according to the number of times of coating each mask unit comprises:

[0064] Comparing the number of times of coating all the mask units;

[0065] Obtaining the minimum value of the number of times of coating, which is the number of times of coating the carrier plate.

[0066] In particular, the present application also provides a system comprising a memory and a processor, wherein the memory stores a calculation program, and the calculation program is executed by the processor to implement the above-mentioned calculation method of the real-time cleanable times of the carrier plate and the calculation method of the number of times of coating the carrier plate.

[0067] In the actual use process of the carrier plate, the lower opening of the carrier plate is continuously enlarged due to continuous cleaning, and when the number of times of cleaning is sufficient to cause the size of the lower opening to be large enough, the target object cannot be placed on the carrier plate, at which time the carrier plate cannot be used any more. Therefore, the present application provides a calculation method of the real-time cleanable times of the carrier plate, which calculates the cleanable times of the carrier plate to determine whether the carrier plate can be used continuously, thereby avoiding the target object from falling off due to the large size of the lower opening of the carrier plate when the target object is placed on the carrier plate, thereby avoiding damage to the target object and increasing the cost.

[0068] The calculation method of the real-time cleanable times of the carrier plate considers the size influence of cleaning on the upper opening of the carrier plate, the size influence on the lower opening, the limit condition when the target object is placed on the support platform, and the production tolerance of the target object, thereby increasing the accuracy of the calculation and further improving the yield rate of the carrier plate during the use process for preparing the target object.

[0069] The calculation method of the film coating times of the carrier plate can clean the carrier plate in time after the film coating times reach a certain number, avoids excessive film coating times of the carrier plate, and causes the target object to be unable to be placed, thereby causing film coating abnormalities or automatic wafer picking abnormalities, and further causing a low yield rate.

[0070] The calculation method of the film coating times of the carrier plate can accurately determine whether the carrier plate reaches the cleaning time and the final service life of the carrier plate, minimizes some production abnormalities (automatic wafer placing deviation, card clamping, wafer dropping, wrap coating, and conductive film coating abnormalities caused by an excessively small upper opening), intelligently controls the carrier plate, maximizes the value of the carrier plate, and finally realizes cost reduction and benefit increase.

[0071] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, when considered in conjunction with the attached drawings. BRIEF DESCRIPTION OF DRAWINGS

[0072] Some specific embodiments of the present application will be described in detail below with reference to the attached drawings, which are presented by way of illustration and not of limitation. The same reference numbers in different drawings refer to the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0073] FIG. 1 is a schematic structural diagram of a carrier plate according to one specific embodiment of the present application;

[0074] FIG. 2 is a schematic structural diagram of a film coating unit according to one specific embodiment of the present application;

[0075] FIG. 3 is a partially enlarged schematic diagram of a film coating unit according to one specific embodiment of the present application;

[0076] FIG. 4 is a partially enlarged schematic diagram of a cross section of a carrier plate according to one specific embodiment of the present application;

[0077] FIG. 5 is a schematic flowchart of a calculation method of real-time cleanable times of a carrier plate according to one specific embodiment of the present application;

[0078] FIG. 6 is a schematic flowchart of a step of obtaining an actual size of an upper opening of each mask unit according to one specific embodiment of the present application;

[0079] Fig. 7 is a schematic flow chart of a step of obtaining the actual size of the lower opening of each mask unit according to one embodiment of the present application;

[0080] Fig. 8 is a schematic flow chart of a step of obtaining the real-time cleanable times of the carrier according to the real-time cleanable times of each mask unit according to one embodiment of the present application;

[0081] Fig. 9 is a schematic flow chart of a method of calculating the plating times of the carrier according to one embodiment of the present application;

[0082] Fig. 10 is a schematic flow chart of a step of obtaining the plating times of the carrier before the next cleaning according to one embodiment of the present application;

[0083] Fig. 11 is a schematic flow chart of a step of obtaining the wafering allowance of the upper opening of each mask unit according to one embodiment of the present application;

[0084] Fig. 12 is a schematic flow chart of a step of obtaining the plating times of the carrier before the next cleaning according to the plating times of each mask unit before the next cleaning according to one embodiment of the present application.

[0085] BRIEF DESCRIPTION OF DRAWINGS Carrier - 100 Mask unit - 110 Upper opening - 111 Lower opening - 112 Support platform - 113 DETAILED DESCRIPTION

[0086] In the description of the present embodiments, it is to be understood that the orientations or positional relationships indicated by the terms "length", "width", "height", "upper", "lower", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0087] As a specific embodiment of the present application, the embodiment provides a calculation method of real-time cleanable times of a carrier plate. Specifically, as shown in FIGS. 1-4, the carrier plate 100 of the embodiment can include at least one mask unit 110, each mask unit 110 can include an upper opening 111 and a lower opening 112, the size of the upper opening 111 is larger than the size of the lower opening 112 and forms a support platform 113, and a target object is placed on the support platform 113 of the corresponding mask unit 110 to mask the target object, so as to deposit a functional layer at the bottom of the target object. Specifically, the target object of the embodiment can be a silicon wafer or other objects that need to be coated, and the functional layer can be a TCO transparent conductive thin film or other coating layer. Specifically, the embodiment takes the target object as a silicon wafer and the functional layer as a TCO layer as an example for specific description. Specifically, the thickness of the functional layer deposited in the embodiment is known.

[0088] Specifically, as shown in FIG. 5, the calculation method of real-time cleanable times of the carrier plate 100 of the embodiment can include:

[0089] Step S100, obtaining the actual size of the upper opening 111 of each mask unit 110, the actual size of the lower opening 112 of each mask unit 110, and the minimum size of the target object;

[0090] Step S200, obtaining a minimum mask amount by the actual size of the upper opening 111 of each mask unit 110, the actual size of the lower opening 112 of each mask unit 110, and the minimum size of the target object;

[0091] Step S300, obtaining an etching allowance of each mask unit 110 by the minimum mask amount;

[0092] Step S400, obtaining real-time cleanable times of each mask unit 110 according to the etching allowance of each mask unit 110;

[0093] Step S500, obtaining real-time cleanable times of the carrier plate 100 according to the real-time cleanable times of each mask unit 110.

[0094] In actual use, as the carrier plate 100 is cleaned continuously, the lower opening 112 of the carrier plate 100 is continuously enlarged due to corrosion. When the size of the lower opening 112 is large enough due to enough cleaning times, the target object cannot be placed on the carrier plate 100, and at this time, the carrier plate 100 cannot be used any more. Therefore, by calculating the cleanable times of the carrier plate 100, it is determined whether the carrier plate 100 can be used continuously, so as to avoid the target object from falling off the carrier plate 100 due to the too large size of the lower opening 112 of the carrier plate 100 when the target object is placed on the carrier plate 100, and thus the target object is damaged and the cost is increased.

[0095] Specifically, the actual size of the upper opening 111 and the actual size of the lower opening 112 of the mask unit 110 are constantly changing during the use of the carrier plate 100, and the actual size after each cleaning is different, because a certain thickness of the carrier plate 100 is corroded each time the carrier plate 100 is cleaned. In addition, because there is an error in the production of the target object, the minimum size of the target object is the minimum size of the target object within the error range.

[0096] In the art, the target object is a silicon wafer, and the silicon wafer has a tolerance, so the size of the silicon wafer directly affects the corrosion allowance of each mask unit 110, i.e., the real-time cleanable times of each mask unit 110. The larger the size of the target object, the greater the corrosion allowance of each mask unit 110 corresponding to the target object, so the corrosion allowance of each mask unit 110 should be calculated according to the minimum size of the target object. Specifically, in the present embodiment, the corrosion allowance of the carrier plate 100 is obtained by the actual size of the upper opening 111 of each mask unit 110, the actual size of the lower opening 112, and the minimum size of the target object, and then the cleaning times are obtained by the corrosion allowance. The minimum value of the cleaning times of each mask unit 110 is the cleaning times of the carrier plate 100.

[0097] As a specific embodiment of the present application, as shown in FIG. 6, in step S100 of the present embodiment, the step of obtaining the actual size of the upper opening 111 of each mask unit 110 can include:

[0098] Step S110, obtaining the original size of the upper opening 111 of each mask unit 110;

[0099] Step S120, obtaining the number of times the carrier plate 100 has been cleaned;

[0100] Step S130, obtaining the actual size of the upper opening 111 of each mask unit 110 according to the original size of the upper opening 111 of each mask unit 110 and the number of times the carrier plate 100 has been cleaned.

[0101] Specifically, in the present embodiment, the original size of the upper opening 111 of each mask unit 110 is fixed and unchanged when the carrier plate 100 is completed, i.e., it is a known number. By the original size of the upper opening 111 and the number of times it has been cleaned, the actual size of the upper opening 111 of the mask unit 110 can be obtained.

[0102] As a specific embodiment of the present application, in step S130 of the present embodiment, the actual size of the upper opening 111 of each mask unit 110 is obtained according to the original size of the upper opening 111 of each mask unit 110 and the number of times the carrier plate 100 has been cleaned, which is calculated according to the following formula (1):

[0103] A = A1 + 2 x N x At, (1)

[0104] Wherein, A is the actual size of the upper opening 111 of each mask unit 110, A1 is the original size of the upper opening 111 of each mask unit 110, N is the number of times the carrier plate 100 has been cleaned, and At is the corrosion thickness of one side of the upper opening 111 of each carrier plate 100 after each cleaning.

[0105] Specifically, in the actual process, the corrosion thickness At of the carrier plate 100 after each cleaning is a known number, and At is generally about 0.005 mm. The inside of the upper opening 111 is increased by 2 times after each corrosion, and thus the actual size A = A1 + 2 x N x At.

[0106] Specifically, the size of A1 in the embodiment can be the size of the long side of the mask unit 110 or the size of the wide side. A1 is a known number, At is a known number, and N is a natural number and also a known number. The actual size of the upper opening 111 of each mask unit 110 of the carrier plate 100 after N cleanings can be obtained from the above formula (1).

[0107] As a specific embodiment of the present application, the step of obtaining the actual size of the lower opening 112 of each mask unit 110 in step S100 of the embodiment can include:

[0108] Step S140, obtaining the original size of the lower opening 112 of each mask unit 110;

[0109] Step S150, obtaining the number of times the carrier plate 100 has been cleaned;

[0110] Step S160, obtaining the actual size of the lower opening 112 of each mask unit 110 according to the original size of the lower opening 112 of each mask unit 110 and the number of times the carrier plate 100 has been cleaned.

[0111] Consistent with the case of the upper opening 111 described above, the size of the lower opening 112 of each mask unit 110 will also be continuously corroded in the cleaning process of the carrier plate 100, and thus the actual size of the lower opening 112 of each mask unit 110 after cleaning needs to be obtained by the original size of the lower opening 112 of each mask unit 110 and the number of cleanings.

[0112] As a specific embodiment of the present application, in step S160 of the embodiment, the actual size of the lower opening 112 of each mask unit 110 is obtained according to the original size of the lower opening 112 of each mask unit 110 and the number of times the carrier plate 100 has been cleaned, which is calculated according to the following formula:

[0113] B = B1 + 2 x N x At, (2)

[0114] Wherein, B is the actual size of the lower opening 112 of each mask unit 110, B1 is the original size of the lower opening 112 of each mask unit 110, N is the number of times the carrier plate 100 has been cleaned, and △t is the corrosion thickness of the lower opening 112 of each carrier plate 100 after each cleaning.

[0115] Specifically, as described above, the actual size of the lower opening 112 of each mask unit 110 of the present embodiment is a known constant value when the carrier plate 100 is completed. The corrosion thickness △t of the lower opening 112 of each carrier plate 100 after each cleaning is also a known number, and N is a natural number. Therefore, by bringing the known numbers into formula (2), the actual size B of the lower opening 112 of each mask unit 110 can be obtained.

[0116] Specifically, the size of the present embodiment can be the length of the lower opening 112 of the mask unit 110 or the width of the lower opening 112 of the mask unit 110. Of course, the actual size of the upper opening 111 and the actual size of the lower opening 112 should be consistent in calculation, either both being the length or both being the width.

[0117] As a specific embodiment of the present application, in step S200 of the present embodiment, the minimum mask amount is obtained by the actual size of the upper opening 111 of each mask unit 110, the actual size of the lower opening 112 of each mask unit 110, and the minimum size of the target object, which is calculated by the following formula:

[0118] M = (A-B) / 2-(A-Cmin), (3)

[0119] Wherein, M is the minimum mask amount, Cmin is the minimum size of the target object, (A-B) / 2 is half of the difference between the actual upper opening 111 and the lower opening 112, i.e. the size of the mask area on one side of the support platform 113, and (A-Cmin) is the size of the non-mask area of the support platform 113 after the maximum offset of the minimum size of the target object. The minimum mask amount M can be obtained by subtracting the above two values.

[0120] Specifically, as shown in FIG. 4, in the embodiment, to ensure that the target object will not fall when randomly placed at the mask unit 110, the target object is placed at one side (the right side in FIG. 4) close to the upper opening 111 of the mask unit 110. Then the minimum mask amount of each mask unit 110 to the target object can be obtained by the size of the upper opening 111, the size of the lower opening 112 and the size of the target object. Specifically, it is calculated according to the above formula (3). Since A and B have been calculated by formula (1) and formula (2) above, A, B are known numbers, and Cmin is the minimum size of the target object, which is also known in production, therefore, the minimum mask amount M can be directly obtained from formula (3).

[0121] As a specific embodiment of the present application, the step S300 of obtaining the etching allowance of each mask unit 110 by the minimum mask amount in the embodiment includes calculating by using formula (4), formula (4) is:

[0122] △M= M-Mmin, (4);

[0123] Wherein, △M is the etching allowance, and Mmin is the limit mask amount.

[0124] Since the target object is placed at the mask unit 110 of the carrier plate 100, the limit mask amount Mmin of the mask platform to the target object is 0.1 mm, and when the mask width is less than the limit mask amount Mmin, the defects such as plating around and leakage of the battery piece will increase sharply. Therefore, if the target object needs to be placed on the carrier plate 100 for normal use, not only whether the target object will fall from the mask unit 110 needs to be considered, but also whether the target object can still be used normally after the mask deposition function layer is placed on the mask unit 110 needs to be considered. Therefore, the etching allowance of the embodiment needs to be obtained by subtracting the limit mask amount from the minimum mask amount.

[0125] As a specific embodiment of the present application, the step S400 of obtaining the real-time cleanable times of each mask unit 110 according to the etching allowance of each mask unit 110 in the embodiment is calculated according to formula (5) as follows, wherein formula (5) is:

[0126] Y=△M / (2△t), (5);

[0127] Wherein, Y is the real-time cleanable times of the mask unit 110.

[0128] Specifically, in the embodiment, after obtaining the etching allowance, the real-time cleanable times can be obtained by the ratio of the etching allowance to the amount of corrosion of the carrier plate 100 after each cleaning.

[0129] As a specific embodiment of the present application, as shown in FIG. 8, the step S500 of obtaining the real-time cleanable times of the carrier plate 100 according to the real-time cleanable times of each mask unit 110 includes:

[0130] The step S510 of comparing the real-time cleanable times of all mask units 110;

[0131] The step S520 of obtaining the minimum value of the real-time cleanable times, i.e., the real-time cleanable times of the carrier plate 100.

[0132] Since the carrier plate 100 in the embodiment can include at least one mask unit 110, generally, a carrier plate 100 can include multiple mask units 110. The size of each mask unit 110 and the size of the target object carried by the mask unit 110 have certain errors. Therefore, the real-time cleanable times of each mask unit 110 are obtained, and then the minimum cleanable times are obtained, so that the real-time cleanable times of the carrier plate 100 can be obtained. When the cleaning reaches the number corresponding to the minimum value, the mask unit 110 corresponding to the minimum value cannot carry the target object to produce normal or successful products, at which time the entire carrier plate 100 needs to be replaced to avoid the problem of low yield.

[0133] The calculation method of the real-time cleanable times of the carrier plate in the embodiment considers the influence of cleaning on the size of the upper opening 111 of the carrier plate 100, the size of the lower opening 112, the limit condition when the target object is placed on the support platform 113, and the production tolerance of the target object itself, thereby increasing the accuracy of the calculation and further improving the yield of the carrier plate 100 in the process of producing the target object.

[0134] As a specific embodiment of the present application, as shown in FIG. 9, the embodiment provides a calculation method of the coating times of a carrier plate 100, which can include:

[0135] The step F100 of calculating the real-time cleanable times of the carrier plate 100 according to the calculation method of the real-time cleanable times of the carrier plate 100;

[0136] The step F200 of judging whether the real-time cleanable times of the carrier plate 100 are greater than or equal to 1;

[0137] The step F300 of calculating the coating times of the carrier plate 100 before the next cleaning if yes.

[0138] Specifically, the embodiment judges whether the carrier plate 100 can be cleaned before the next cleaning and coating of the carrier plate 100. When the carrier plate 100 can still be cleaned, it means that the carrier plate 100 can still carry the target object. Only when the carrier plate 100 can carry the target object, the coating times of the target object on the carrier plate 100 can be further calculated.

[0139] Specifically, in step F200 of the embodiment, it is determined whether the real-time cleanable times of the carrier plate 100 is greater than 0. When the real-time cleanable times of the carrier plate 100 is greater than or equal to 1, it indicates that the carrier plate 100 can carry the target objects and the film coating can be performed. At this time, the film coating times before the next cleaning can be calculated. When the real-time cleanable times of the carrier plate 100 is less than 1, the carrier plate 100 at this time has been unable to carry the target objects. At this time, the film coating times need not be calculated any more.

[0140] By calculating the film coating times, the carrier plate 100 can be cleaned in time after the film coating times reach a certain number, so as to avoid that the carrier plate 100 is coated too many times, the target objects cannot be placed into the carrier plate 100, and further problems such as abnormal film coating or abnormal automatic pick-and-place of the target objects occur, and finally the yield is low.

[0141] As a specific embodiment of the present application, as shown in FIG. 10, the step of obtaining the film coating times of the carrier plate 100 before the next cleaning in the embodiment can include:

[0142] Step F310, obtaining the film placement margin of the upper opening 111 of each mask unit 110 and the thickness of each deposited functional layer;

[0143] Step F320, obtaining the film coating times of each mask unit 110 before the next cleaning according to the film placement margin and the thickness;

[0144] Step F330, obtaining the film coating times of the carrier plate 100 before the next cleaning according to the film coating times of each mask unit 110.

[0145] Specifically, the film coating times of the carrier plate 100 before the next cleaning in the embodiment can be obtained according to the film placement margin of the upper opening 111 of each mask unit 110 and the thickness of each deposited functional layer, and the film coating times of the entire carrier plate 100 are obtained according to the film coating times of each mask unit 110.

[0146] As a specific embodiment of the present application, as shown in FIG. 11, the step of obtaining the film placement margin of the upper opening 111 of each mask unit 110 in step F310 of the embodiment can include:

[0147] Step F311, obtaining the actual size of the upper opening 111 of each mask unit 110 and the size of the target object located at the upper opening 111 of the mask unit 110;

[0148] Step F312, obtaining the film placement margin according to the actual size and the size of the target object.

[0149] More specifically, in step F311, the step of obtaining the actual size of the upper opening 111 of each mask unit 110 includes:

[0150] Step F3111, obtaining the original size of the upper opening 111 of each mask unit 110;

[0151] Step F3112, obtaining the number of times the carrier plate 100 has been cleaned;

[0152] Step F3113, obtaining the actual size of the upper opening 111 of each mask unit 110 according to the original size of the upper opening 111 of each mask unit 110 and the number of times the carrier plate 100 has been cleaned.

[0153] Specifically, the step F3113 of the present embodiment obtains the actual size of the upper opening 111 of each mask unit 110 according to the original size of the upper opening 111 of each mask unit 110 and the number of times the carrier plate 100 has been cleaned is calculated according to the following formula (1):

[0154] A = A1+2× N×△t, (1);

[0155] wherein A is the actual size of the upper opening 111 of each mask unit 110, A1 is the original size of the upper opening 111 of each mask unit 110, N is the number of times the carrier plate 100 has been cleaned, and△t is the corrosion thickness of the upper opening 111 of each carrier plate 100 for each cleaning.

[0156] The steps F311 and F3111, F3112, F3113 of the present embodiment are consistent with the steps S110, S120 and S130 of the foregoing, and will not be described here again.

[0157] As a specific embodiment of the present application, the step F312 of the present embodiment of obtaining the film placement allowance according to the actual size and the size of the target object includes calculating according to the following formula (6):

[0158] X = A-Cmax, (6);

[0159] wherein X is the film placement allowance, and Cmax is the maximum size of the target object.

[0160] Specifically, in the present embodiment, since the size of the target object has a certain error range, in order to ensure that all target objects can be placed into the carrier plate 100 within the error range, the maximum size of the target object is used here, which is a certain value when the target object is made. The actual size of the upper opening 111 of each mask unit 110 has been calculated by the above formula (1), and the distance between the side of the target object and the upper opening 111 is obtained by subtracting the maximum size Cmax of the target object from the actual size A of the upper opening 111 of each mask unit 110.

[0161] As a specific embodiment of the present application, the step F320 of the present embodiment, the step of obtaining the number of plating times of each mask unit 110 according to the film remaining amount and the thickness includes calculating according to the following formula (7):

[0162] T = X / (2D), (7);

[0163] wherein T is the number of plating times of each mask unit 110; and D is the thickness of each deposited functional layer.

[0164] Since the side of the upper opening 111 is increased by one layer of functional layer and the two sides are increased by two layers of functional layer after each plating, the number of plating times needs to be obtained by dividing X by 2D. The thickness of each deposited functional layer is known, so the number of plating times at this time can be directly calculated, and then the carrier 100 can be cleaned when the number of plating times reaches.

[0165] As a specific embodiment of the present application, as shown in FIG. 12, the step F330 of the present embodiment, the step of obtaining the number of plating times of the carrier 100 before the next cleaning according to the number of plating times of each mask unit 110 before the next cleaning includes:

[0166] Step F331, compare the number of plating times of all mask units 110;

[0167] Step F332, obtain the minimum value of the number of plating times, which is the number of plating times of the carrier 100.

[0168] Since the size of the upper opening 111 of each mask unit 110 and the size of the target object have differences within the error range, the number of plating times calculated by different mask units 110 may not be the same. If the minimum number of plating times is reached and plating continues, the mask unit that obtains the minimum number of plating times cannot normally pick and place the target object, and thus causes the bad piece situation. Therefore, when the minimum number of plating times is reached, the carrier 100 needs to be cleaned to reduce the bad piece rate.

[0169] The present embodiment can accurately determine whether the carrier 100 reaches the cleaning time and the final service life of the carrier 100 through the calculation of the cleaning times of the carrier 100 and the calculation of the number of plating times after each cleaning, minimize some production abnormalities (automatic film placement deviation, card jamming, film dropping, plating winding, and conductive plating abnormalities caused by too small upper opening 111), intelligently control the carrier 100, replace the phenomenon of relying on experience or cleaning or replacing the carrier after an abnormality occurs in the prior art, and thus maximize the value of the carrier 100, and ultimately achieve cost reduction and efficiency improvement.

[0170] As a specific embodiment of the present application, the embodiment provides a system which can include a memory and a processor, the memory storing a calculation program, the calculation program being executed by the processor to implement the calculation method of the real-time cleanable times of the upper carrier plate 100 and the calculation method of the film coating times of the upper carrier plate 100.

[0171] The processor can be a central processing unit (CPU) or a digital processing unit, etc. The processor transmits and receives data through the communication interface. The memory is used to store the program executed by the processor. The memory is any medium capable of carrying or storing desired program code in the form of instructions or data structures and capable of being accessed by a computer, and can also be a combination of multiple memories. The above-mentioned calculation program can be downloaded from a computer readable storage medium to the corresponding calculation / processing device or downloaded to a computer or an external storage device via a network (such as the Internet, a local area network, a wide area network and / or a wireless network).

[0172] Up to now, those skilled in the art should recognize that, although the present application has been shown and described in detail in the above embodiments, many other variations or modifications can be directly determined or deduced according to the disclosure of the present application without departing from the spirit and scope of the present application, which conform to the principles of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variations or modifications.

Claims

1. A method for calculating the number of real-time cleanable times of a carrier plate, characterized by, The carrier plate comprises at least one mask unit, each mask unit comprises an upper opening and a lower opening, the size of the upper opening is larger than the size of the lower opening and forms a support platform, the target object is placed on the support platform of the corresponding mask unit to mask the target object, and then a functional layer is deposited at the bottom of the target object. The carrier plate cleaning frequency calculation method comprises: obtaining the actual size of the upper opening of each mask unit, the actual size of the lower opening of each mask unit, and the minimum size of the target object; obtaining the minimum mask amount according to the actual size of the upper opening of each mask unit, the actual size of the lower opening of each mask unit, and the minimum size of the target object; obtaining the corrosion allowance of each mask unit according to the minimum mask amount; obtaining the real-time cleanable frequency of each mask unit according to the corrosion allowance of each mask unit; obtaining the real-time cleanable frequency of the carrier plate according to the real-time cleanable frequency of each mask unit.

2. The carrier plate real-time cleanable frequency calculation method according to claim 1, wherein the step of obtaining the actual size of the upper opening of each mask unit comprises: obtaining the original size of the upper opening of each mask unit; obtaining the number of times the carrier plate has been cleaned; obtaining the actual size of the upper opening of each mask unit according to the original size of the upper opening of each mask unit and the number of times the carrier plate has been cleaned.

3. The carrier plate real-time cleanable frequency calculation method according to claim 1, wherein the actual size of the upper opening of each mask unit is obtained according to the original size of the upper opening of each mask unit and the number of times the carrier plate has been cleaned according to the following formula (1): A = A1 + 2 × N ×△t, (1); wherein A is the actual size of the upper opening of each mask unit, A1 is the original size of the upper opening of each mask unit, N is the number of times the carrier plate has been cleaned, and△t is the corrosion thickness of one side of the upper opening of each carrier plate per cleaning.

4. The carrier plate real-time cleanable frequency calculation method according to claim 3, wherein the step of obtaining the actual size of the lower opening of each mask unit comprises: obtaining the original size of the lower opening of each mask unit; obtaining the number of times the carrier plate has been cleaned; obtaining the actual size of the lower opening of each mask unit according to the original size of the lower opening of each mask unit and the number of times the carrier plate has been cleaned.

5. The carrier plate real-time cleanable frequency calculation method according to claim 4, wherein the actual size of the lower opening of each mask unit is obtained according to the original size of the lower opening of each mask unit and the number of times the carrier plate has been cleaned according to the following formula: B = B1 + 2 × N ×△t, (2); Wherein, B is the actual size of the lower opening of each mask unit, B1 is the original size of the lower opening of each mask unit, N is the number of times the carrier plate has been cleaned, and△t is the corrosion thickness of the lower opening of each carrier plate after each cleaning.

6. The method of claim 5, wherein the minimum mask amount is calculated according to the actual size of the upper opening of each mask unit, the actual size of the lower opening of each mask unit, and the minimum size of the target object. M = (A - B) / 2 - (A - Cmin), (3); Wherein, M is the minimum mask amount, and Cmin is the minimum size of the target object.

7. The method of claim 6, wherein the corrosion allowance of each mask unit is calculated according to the minimum mask amount. The corrosion allowance of each mask unit is calculated according to the minimum mask amount by using formula (4). △M = M - Mmin, (4); Wherein,△M is the corrosion allowance, and Mmin is the limit mask amount.

8. The method of claim 7, wherein the real-time cleanable times of each mask unit is calculated according to the corrosion allowance of each mask unit. The real-time cleanable times of each mask unit is calculated according to the corrosion allowance of each mask unit by using formula (5). Y =△M / (2△t), (5); Wherein, Y is the real-time cleanable times of the mask unit.

9. The method of claim 8, wherein the real-time cleanable times of the carrier plate is calculated according to the real-time cleanable times of each mask unit. The real-time cleanable times of the carrier plate is calculated according to the real-time cleanable times of each mask unit by using the following steps. Comparing the real-time cleanable times of all mask units; Obtaining the minimum value of the real-time cleanable times, which is the real-time cleanable times of the carrier plate. Including:

10. A method of calculating the number of times of plating a carrier plate, characterized by, The real-time cleanable times of the carrier plate is calculated according to the method of any one of claims 1-9; Determining whether the real-time cleanable times of the carrier plate is greater than or equal to 1; If yes, calculating the number of times of coating before the next cleaning of the carrier plate.

11. The method of claim 10, wherein the number of times of coating before the next cleaning of the carrier plate is calculated by using the following steps. Obtaining the wafering allowance of the upper opening of each mask unit and the thickness of each deposition of the functional layer; Calculating the number of times of coating before the next cleaning of each mask unit according to the wafering allowance and the thickness; Calculating the number of times of coating before the next cleaning of the carrier plate according to the number of times of coating of each mask unit.

12. The method of claim 11, wherein the wafering allowance of the upper opening of each mask unit is obtained by using the following steps. Obtaining the actual size of the upper opening of each mask unit and the size of the corresponding target object located at the upper opening of the mask unit; Calculating the wafering allowance according to the actual size and the size of the target object. ​ ​ ​ 13. The method of claim 12, wherein the step of obtaining the actual size of the upper opening of each mask unit comprises: obtaining the original size of the upper opening of each mask unit; obtaining the number of times the carrier plate has been cleaned; and obtaining the actual size of the upper opening of each mask unit according to the original size of the upper opening of each mask unit and the number of times the carrier plate has been cleaned.

14. The method of claim 13, wherein the step of obtaining the actual size of the upper opening of each mask unit according to the original size of the upper opening of each mask unit and the number of times the carrier plate has been cleaned is performed according to the following formula (1): A = A1 + 2 x N x At, (1); wherein A is the actual size of the upper opening of each mask unit, A1 is the original size of the upper opening of each mask unit, N is the number of times the carrier plate has been cleaned, and At is the corrosion thickness of the upper opening of each carrier plate per cleaning.

15. The method of claim 14, wherein the step of obtaining the film releasing allowance according to the actual size and the size of the target object is performed according to the following formula (6): X = A - Cmax, (6); wherein X is the film releasing allowance, and Cmax is the maximum size of the target object.

16. The method of claim 15, wherein the step of obtaining the number of times of film deposition of each mask unit according to the film releasing allowance and the thickness is performed according to the following formula (7): T = X / 2D, (7); wherein T is the number of times of film deposition of each mask unit, and D is the thickness of the functional layer deposited each time.

17. The method of claim 16, wherein the step of obtaining the number of times of film deposition of the carrier plate according to the number of times of film deposition of each mask unit comprises: comparing the number of times of film deposition of all mask units; and obtaining the minimum value of the number of times of film deposition, which is the number of times of film deposition of the carrier plate. A computer program product comprising a memory and a processor, wherein the memory stores a calculation program, and the calculation program, when executed by the processor, is configured to implement the method of claim 1-9.

18. A computer program product comprising a memory and a processor, wherein the memory stores a calculation program, and the calculation program, when executed by the processor, is configured to implement the method of claim 10-17. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 18. A system, comprising: ​

Images