Middle frame, housing assembly and electronic device

Abstract

The embodiments of the present application relate to the technical field of middle frames. Provided are a middle frame, a housing assembly and an electronic device. The middle frame comprises a frame, a middle plate and a connecting portion. The frame surrounds the middle plate and is connected to the middle plate. The middle frame is provided with a heat insulation groove, and the heat insulation groove runs through at least a part of the middle frame in the direction of the height of the middle frame. The frame comprises a first sub-frame, with at least a part of the first sub-frame being located on one side of the heat insulation groove in a first direction. The middle plate comprises a second sub-middle plate, with at least a part of the second sub-middle plate being located on the side of the heat insulation groove away from the first sub-frame in the first direction. The second sub-middle plate is electrically connected to a heating element. The connecting portion connects the first sub-frame and the second sub-middle plate. The connecting portion is made of a thermally insulating and electrically conductive material. In this way, the first sub-frame and the second sub-middle plate can be electrically connected by means of the connecting portion, and the connecting portion can prevent heat generated by the heating element from being transferred to the first sub-frame, thereby reducing the risk of local overheating of the frame. In addition, the mechanical strength of the middle frame can also be ensured.

Description

Mid-frame, housing assembly and electronic devices

[0001] This application claims priority to Chinese patent application filed on August 21, 2024, with application number 202411156138.0 and entitled "Mid-frame, housing assembly and electronic device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] Embodiments of this application provide a mid-frame, housing assembly, and electronic device, relating to the technical field of mid-frames. Background Technology

[0003] Electronic devices include a mid-frame, which comprises a border and a mid-plate. The border surrounds and is connected to the mid-plate. The mid-plate supports and protects the electronic device's components, such as the processor. Heat generated by the processor during operation can be transferred through the mid-plate to certain areas of the border, causing heat leakage and creating localized hotspots that negatively impact the user experience. Summary of the Invention

[0004] Embodiments of this application provide a mid-frame, housing assembly, and electronic device for improving the temperature uniformity of the frame.

[0005] On one hand, embodiments of this application provide a middle frame. The middle frame includes a side frame, a middle plate, and a connecting portion. The side frame surrounds and is connected to the middle plate. The middle frame has a heat insulation groove that extends through at least a portion of the middle frame along its height direction. The side frame includes a first sub-side frame, at least a portion of which is located on one side of the heat insulation groove along a first direction. The middle plate includes a second sub-middle plate, at least a portion of which is located on the side of the heat insulation groove away from the first sub-side frame along the first direction. The second sub-middle plate is electrically connected to a heating element, which is located on the side of the heat insulation groove away from the first sub-side frame along the first direction. The connecting portion connects the first sub-side frame and the second sub-middle plate. The connecting portion is made of a heat-insulating and conductive material.

[0006] In the embodiments of this application, at least a portion of the first sub-frame is located on one side of the heat insulation groove along a first direction, and the heating element is located on the side of the heat insulation groove away from the first sub-frame along the first direction, so that the heat insulation groove can prevent heat from being transferred to the first sub-frame. In this way, the risk of the first sub-frame being too hot can be reduced, the formation of local hot spots on the frame can be avoided, the heat leakage phenomenon on the frame can be alleviated, the temperature uniformity of the frame can be improved, and thus the user experience can be improved.

[0007] The connection part connects the first sub-frame and the second sub-middle plate, and the material of the connection part includes heat-insulating and conductive materials. On the one hand, this increases the mechanical strength and reliability of the middle frame. On the other hand, components (such as SOCs) electrically connected to the second sub-middle plate can be electrically connected to the first sub-frame through the connection part, enabling the first sub-frame to radiate signals to the outside world as an antenna. This also shortens the electrical connection path between the second sub-middle plate and the first sub-frame, improving the antenna performance of the electronic device.

[0008] In addition, the material of the connection includes heat-insulating and conductive materials, which enables the connection to prevent heat from being transferred to the first sub-frame, reducing the risk of the first sub-frame being too hot, avoiding the formation of local hot spots on the frame, alleviating the heat leakage phenomenon on the frame, improving the temperature uniformity of the frame, thereby improving the user experience and reducing the risk that the components near the first sub-frame will not work properly due to the excessive temperature of the first sub-frame.

[0009] In other words, by adopting the above-mentioned configuration, the impact of the heat insulation groove on the reliability of the middle frame can be reduced, and the impact of the heat insulation groove on the antenna performance of electronic devices can also be reduced.

[0010] In some possible implementations, the mid-frame includes both metal and non-metal structures arranged along its height. The heat insulation groove penetrates at least the metal structure. This arrangement enhances the heat insulation groove's ability to impede heat, reduces the risk of high temperatures in the first sub-frame, prevents localized hotspots from forming on the frame, alleviates heat leakage, and improves temperature uniformity, thereby enhancing the user experience.

[0011] In some possible implementations, the thermally insulating and electrically conductive material includes at least one of titanium alloy and magnesium alloy. This configuration allows the connecting portion to possess good thermal insulation and electrical conductivity, hindering heat transfer to the first sub-frame and enabling components electrically connected to the second sub-frame (e.g., SOC) to be electrically connected to the first sub-frame via the connecting portion. Furthermore, it ensures the mechanical strength of the frame and improves its reliability.

[0012] In some possible implementations, the first sub-frame includes a first frame body and a connecting structure, with the connecting structure located on the side of the first frame body closer to the heat insulation groove along a first direction. The connecting portion is connected to the first frame body via the connecting structure. This arrangement improves the ease of connecting the connecting portion to the first frame body.

[0013] In some possible implementations, the connecting structure includes a support leg connected to the first frame body and extending along a first direction near the heat insulation groove. The end of the connecting portion away from the second sub-middle plate is connected to the support leg. This arrangement improves the ease of connecting the connecting portion to the first frame body.

[0014] In some possible implementations, the connection structure includes a connection groove formed on the surface of the first frame body near the heat insulation groove. The end of the connecting portion away from the second sub-middle plate is embedded in the connection groove and connected to the first frame body. This configuration improves the convenience and reliability of the connection between the connecting portion and the first frame body.

[0015] In some possible implementations, along the first direction, the surface of the first sub-frame closest to the heat insulation groove is the connecting surface. The end of the connecting portion away from the second sub-middle plate is connected to the connecting surface. This configuration eliminates the need for a connecting structure, simplifying the structure of the first sub-frame.

[0016] In some possible implementations, the middle plate further includes a first sub-middle plate, at least a portion of which is located on the side of the first sub-frame near the heat insulation groove and connected to the first sub-frame along a first direction. The end of the connecting portion away from the second sub-middle plate is connected to the first sub-middle plate. This arrangement allows the connecting portion to be connected to the first sub-frame via the first sub-middle plate, improving the ease of connection between the connecting portion and the first sub-frame.

[0017] In some possible implementations, there are multiple connecting parts, at least one of which is adjacent to the edge of the first sub-frame along the extension direction of the first sub-frame. This arrangement allows the feed point of the first sub-frame to be close to the edge of the first sub-frame along the extension direction of the first sub-frame, improving the performance of the first sub-frame in radiating signals to the outside, thereby improving the antenna performance of the electronic device.

[0018] In some possible implementations, the connecting part and the first sub-frame are connected by at least one of welding and riveting. The connecting part and the second sub-middle plate are connected by at least one of welding and riveting. This arrangement improves the convenience and reliability of the connection between the connecting part and the first sub-frame and the second sub-middle plate.

[0019] In some possible implementations, the connecting portion extends across the heat insulation groove along a first direction and connects the first sub-frame and the second sub-middle plate. This arrangement improves the convenience and reliability of connecting the connecting portion to the first sub-frame and the second middle plate.

[0020] In some possible implementations, the connecting part includes a first connecting part and a second connecting part. The first connecting part is connected to one of the first sub-frame and the second sub-middle plate, and the second connecting part is connected to the other of the first sub-frame and the second middle plate. The first connecting part and the second connecting part are connected. This arrangement allows the connecting part to connect first sub-frames and second middle plates of different shapes, improving the applicability of the connecting part.

[0021] In some possible implementations, the first connecting portion includes a first connecting body, and the second connecting portion includes a second connecting body. Along the height direction of the mid-frame, the first and second connecting bodies are staggered, and the orthographic projections of the first and second connecting bodies on the reference plane at least partially overlap. The reference plane intersects the height direction of the mid-frame. The first and second connecting bodies are connected. This arrangement improves the ease of connection between the first and second connecting bodies, thereby improving the ease of connection between the first and second connecting portions.

[0022] In some possible implementations, the first connecting part and the second connecting part are connected by at least one of welding and riveting. This arrangement improves the flexibility and reliability of the connection between the first connecting part and the second connecting part.

[0023] In some possible implementations, at least a portion of the connecting part is embedded in the heat insulation groove and connects the first sub-frame and the second sub-middle plate. This configuration reduces the space occupied by the middle frame, which is beneficial for the miniaturization and lightness of electronic devices.

[0024] In some possible implementations, there are multiple first sub-frames, spaced apart. This arrangement allows the electronic device to radiate signals of different frequency bands to the outside world through different first sub-frames, thereby improving the antenna performance of the electronic device.

[0025] In some possible implementations, the middle frame also includes a first insulating portion located between any two adjacent first sub-frames. This arrangement allows the first insulating portion to insulate the two adjacent first sub-frames, reducing the risk of short circuits between them.

[0026] In some possible implementations, the length of the heat insulation groove along the second direction is greater than or equal to the length of the heating element along the second direction. The second direction intersects with the first direction. This arrangement ensures the heat insulation groove's effectiveness in blocking heat, reduces the risk of excessively high temperatures in the first sub-frame, prevents the formation of localized hot spots on the frame, alleviates heat leakage, and improves the temperature uniformity of the frame, thereby enhancing the user experience. Furthermore, it reduces the risk of components near the first sub-frame malfunctioning due to excessively high temperatures.

[0027] On the other hand, embodiments of this application provide a housing assembly including a rear shell and a middle frame as described above. The rear shell is located on one side of the middle frame along the height direction of the middle frame and is connected to the middle frame.

[0028] The housing assembly provided in the embodiments of this application includes the middle frame as described above, and therefore has all the aforementioned beneficial effects, which will not be repeated here.

[0029] In another aspect, embodiments of this application provide an electronic device. The electronic device includes a heating element and a mid-frame as described above, wherein a second sub-plate of the mid-frame is electrically connected to the heating element.

[0030] The electronic device provided by the embodiments of this application includes the mid-frame as described above, and therefore has all the above-described beneficial effects, which will not be repeated here.

[0031] In some possible implementations, the electronic device also includes a motherboard electrically connected to a second sub-middle board. The heating element is electrically connected to the motherboard. This arrangement allows the heating element to be electrically connected via the motherboard and the second sub-middle board.

[0032] In some possible implementations, the electronic device also includes a camera assembly positioned along a first direction on the side of the heat-generating element away from the heat insulation groove. This arrangement reduces the mutual interference between the heat insulation groove and the camera assembly. Attached Figure Description

[0033] Figure 1 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0034] Figure 2 is a schematic diagram of the exploded structure of the electronic device in Figure 1 in some embodiments;

[0035] Figure 3 is a schematic diagram of the structure of an electronic device provided in some other embodiments of this application;

[0036] Figure 4 is a partial cross-sectional view of Figure 3 along the A1-A1 direction in some embodiments;

[0037] Figure 5 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0038] Figure 6 is a partial cross-sectional view of Figure 5 along the A2-A2 direction in some embodiments;

[0039] Figure 7 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application;

[0040] Figure 8 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some embodiments;

[0041] Figure 9 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments;

[0042] Figure 10 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments;

[0043] Figure 11 is a cross-sectional schematic diagram of the first sub-border provided in some embodiments of this application;

[0044] Figure 12 is a cross-sectional schematic diagram of the first sub-frame provided in some other embodiments of this application;

[0045] Figure 13 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments;

[0046] Figure 14 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments;

[0047] Figure 15 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments;

[0048] Figure 16 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments. Detailed Implementation

[0049] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the protection scope of this application.

[0050] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0051] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0052] As used herein, “perpendicular” and “parallel” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can be 5%.

[0053] Figure 1 is a schematic diagram of the structure of an electronic device provided in some embodiments of this application. Figure 2 is an exploded view of the electronic device in Figure 1 in some embodiments.

[0054] This application provides an electronic device 300. The electronic device 300 can be a mobile phone, tablet computer, smart bracelet, smartwatch, or other terminal device. This application does not further limit the type of electronic device 300.

[0055] As shown in Figures 1 and 2, the electronic device 300 may include a display screen 304 and a housing assembly 200. The display screen 304 is located on one side of the housing assembly 200 along the height direction of the housing assembly 200 and is connected to the housing assembly 200. For example, the display screen 304 may be connected to the housing assembly 200 by adhesive bonding. Alternatively, the display screen 304 may be connected to the housing assembly 200 by other means.

[0056] Display screen 304 is capable of displaying image information. For example, display screen 304 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a sub-millimeter light-emitting diode (Mini LED) display, a micro light-emitting diode (Micro LED) display, a quantum dot light-emitting diode (QLED) display, etc.

[0057] In some examples, as shown in Figure 2, the housing assembly 200 includes a middle frame 100 and a rear shell 201. The rear shell 201 is located on one side of the middle frame 100 and connected to the middle frame 100 along the height direction Z. Understandably, the height direction Z of the middle frame 100 and the height direction of the housing assembly 200 are in the same direction. The rear shell 201 and the middle frame 100 can be connected by adhesive bonding, or they can be connected by snap-fit ​​or other methods.

[0058] In some examples, as shown in Figure 2, the middle frame 100 includes a frame 101 and a middle plate 102, with the frame 101 surrounding and connected to the middle plate 102. For example, the frame 101 and the middle plate 102 can be a single-piece structure to improve the reliability of their connection. The materials of the frame 101 and the middle plate 102 may include metal, enabling them to conduct electricity.

[0059] For example, as shown in Figure 2, the display screen 304 can be located on one side of the middle frame 100 along the height direction Z of the middle frame 100 and connected to the middle plate 102. The rear cover 201 can be located on the side of the middle frame 100 away from the display screen 304 along the height direction Z of the middle frame 100 and connected to the frame 101.

[0060] In some examples, the mid-frame 100 may have at least one receiving compartment. The electronic device 300 may also include a motherboard 302 (not shown in Figures 1 and 2), a sub-board, a battery, and a camera assembly 303 (not shown in Figures 1 and 2), etc. The motherboard 302, sub-board, battery, and camera assembly 303 are located within the receiving compartment, so that the mid-frame 100 can support and protect the motherboard 302, sub-board, battery, and camera assembly 303. In some examples, the rear cover 201 can close the opening of at least one receiving compartment.

[0061] Figure 3 is a structural schematic diagram of an electronic device provided in some other embodiments of this application. Figure 4 is a partial cross-sectional schematic diagram of Figure 3 along the A1-A1 direction in some embodiments.

[0062] In some examples, as shown in Figures 3 and 4, electronic device 300 may include a heat-generating element 301, which, understandably, dissipates a significant amount of heat during operation. The heat-generating element 301 may include a processor, such as a system-on-a-chip (SOC) or a central processing unit (CPU). Alternatively, the heat-generating element 301 may also include other devices with high heat dissipation besides a processor.

[0063] For example, there can be multiple heating elements 301, which are spaced apart. The types of heating elements 301 can be the same or different.

[0064] For example, as shown in Figures 3 and 4, the heating element 301 can be electrically connected to the motherboard 302, enabling the heating element 301 to function normally. In some examples, the heating element 301 can be closer to the display screen 304 relative to the motherboard 302. In other examples, the heating element 301 can be further away from the display screen 304 relative to the motherboard 302. The embodiments of this application do not further limit the placement of the heating element 301. The following example, where the heating element 301 is closer to the display screen 304 relative to the motherboard 302, will be used for further illustration.

[0065] Understandably, in some of the accompanying drawings of this application, taking Figure 3 as an example, the rear cover 201 of the electronic device 300 is not shown. Furthermore, to illustrate the positional relationship between the heating element 301 and the motherboard 302, the heating element 301 is shown located on the side of the motherboard 302 closer to the display screen 304.

[0066] For example, as shown in Figure 4, the motherboard 302 can be electrically connected to the middle board 102. This allows the heating element 301 to be electrically connected to the middle board 102, and thus to the frame 101 via the middle board 102. Taking the heating element 301 as a SOC (System-on-a-Chip), the SOC's electrical connection to the frame 101 enables the SOC to use the frame 101 as an antenna to radiate signals to the outside world.

[0067] In some examples, as shown in Figure 4, a through-hole M is provided on the middle plate 102. The through-hole M penetrates the middle plate 102 along the height direction (i.e., the height direction Z of the middle frame 100) and exposes the heat-generating element 301. The electronic device 300 may also include a heat dissipation component 305. For example, the heat dissipation component 305 may be a vacuum chamber (VC) or heat-dissipating graphite. The heat dissipation component 305 is located on one side of the middle plate 102 along the height direction Z of the middle frame 100 and is in contact with the heat-generating element 301 exposed by the through-hole M, thereby dissipating heat from the heat-generating element 301 and reducing the risk of the heat-generating element 301 malfunctioning due to excessive temperature.

[0068] For example, as shown in Figure 4, the display screen 304 is located on the side of the heat dissipation component 305 away from the heat-generating element 301 and is in contact with the heat dissipation component 305. In this way, the heat emitted by the heat-generating element 301 can be dissipated to the outside through the heat dissipation component 305 and the display screen 304.

[0069] In some examples, as shown in Figure 3, the camera assembly 303 is located on one side of the heating element 301 along the first direction X. For example, the camera assembly 303 can be electrically connected to the motherboard 302. Understandably, the camera assembly 303 is capable of acquiring image information, enabling the electronic device 300 to perform image acquisition.

[0070] Understandably, the heat dissipated by the heating element 301 will be transferred to a portion of the frame 101 via the middle plate 102. For example, the heat dissipated by the heating element 301 will be transferred via the middle plate 102 to the frame 101 adjacent to the heating element 301 along the first direction X. For example, this portion of the frame 101 can be referred to as the first sub-frame 111 (see Figure 3).

[0071] The heat dissipated by the heat-generating element 301 is transferred to the first sub-frame 111, causing its temperature to rise and forming localized hot spots. This affects the temperature uniformity of the frame 101, thus impacting the user experience. Furthermore, the increased temperature of the first sub-frame 111 increases the risk that components near it may malfunction due to overheating. This phenomenon can be termed "frame heat leakage." Heat from the heat sink 305 and the motherboard 302 may also be transferred to the first sub-frame 111 via the middle plate 102, exacerbating the frame heat leakage problem.

[0072] As the size of the camera assembly 303 increases, the distance between the heating element 301 and the first sub-frame 111 gradually decreases along the first direction X, shortening the heat transfer path when the heat emitted by the heating element 301 is transferred to the first sub-frame 111, resulting in a more obvious heat leakage phenomenon in the frame.

[0073] Figure 5 is a structural schematic diagram of an electronic device provided in some embodiments of this application. Figure 6 is a partial cross-sectional schematic diagram of Figure 5 along the A2-A2 direction in some embodiments.

[0074] In some examples, as shown in Figures 5 and 6, the middle frame 100 has a heat insulation groove Q that penetrates at least a portion of the middle frame 100 along the height direction Z.

[0075] For example, the heat insulation groove Q can be a rectangular groove, or it can be a polygonal groove or other irregularly shaped groove. The width of the heat insulation groove Q along the first direction X can be greater than or equal to 0.5 mm (unit: millimeters), for example, the width of the heat insulation groove Q along the first direction X can be 0.6 mm, 0.8 mm, or 1 mm, etc. The embodiments of this application do not further limit the value of the width of the heat insulation groove Q along the first direction X.

[0076] As shown in Figures 5 and 6, the frame 101 may include a first sub-frame 111, at least a portion of which is located on one side of the heat insulation groove Q along the first direction X. It can be understood that the first sub-frame 111 may be entirely located on one side of the heat insulation groove Q along the first direction X, or the first sub-frame 111 may be partially located on one side of the heat insulation groove Q along the first direction X.

[0077] The middle plate 102 may include a second sub-middle plate 122, at least a portion of which is located along the first direction X on the side of the heat insulation groove Q away from the first sub-frame 111. It is understood that the second sub-middle plate 122 may be entirely located on the side of the heat insulation groove Q along the first direction X away from the first sub-frame 111, or the second sub-middle plate 122 may be partially located on the side of the heat insulation groove Q along the first direction X away from the first sub-frame 111.

[0078] For example, as shown in Figure 5, the border 101 may further include a second sub-border 121, which is connected to the second sub-middle plate 122. The first sub-border 111 may be connected to at least one of the second sub-border 121 and the second sub-middle plate 122. Alternatively, the first sub-border 111 may be spaced apart from the second sub-border 121 and the second sub-middle plate 122.

[0079] In some examples, as shown in Figures 5 and 6, the second sub-plate 122 is electrically connected to the heating element 301, which is located along the first direction X on the side of the heat insulation groove Q away from the first sub-frame 111.

[0080] In some examples, the mainboard 302 is electrically connected to the second sub-board 122, and the heating element 301 is electrically connected to the mainboard 302.

[0081] Understandably, the main board 302 and the second sub-middle board 122 can be directly electrically connected, or they can be indirectly electrically connected through other components (such as spring contacts). By configuring the main board 302 and the second sub-middle board 122 to be electrically connected, and the heating element 301 to be electrically connected to the main board 302, the heating element 301 can be electrically connected to the second sub-middle board 122 via the main board 302.

[0082] In some examples, as shown in Figures 5 and 6, the camera assembly 303 is located along the first direction X on the side of the heating element 301 away from the heat insulation groove Q. This reduces the mutual influence between the heat insulation groove Q and the camera assembly 303.

[0083] Understandably, as shown in Figures 5 and 6, along the first direction X, the heat insulation groove Q is located between the first sub-frame 111 and the heating element 301, so that the heat insulation groove Q can prevent heat from being transferred to the first sub-frame 111. In this way, the risk of high temperature of the first sub-frame 111 can be reduced, the formation of local hot spots in the frame 101 can be avoided, the heat leakage of the frame 101 can be alleviated, the temperature uniformity of the frame 101 can be improved, and thus the user experience can be improved.

[0084] In some examples, the middle frame 100 includes a metal structure and a non-metal structure disposed along the height direction Z of the middle frame 100. The metal structure and the non-metal structure can be connected. For example, the material of the metal structure may include stainless steel or aluminum alloy, and the material of the non-metal structure may include rubber or plastic.

[0085] Understandably, the thermal conductivity of a metallic structure is superior to that of a non-metallic structure. In some examples, the heat insulation groove Q penetrates at least through the metallic structure. This enhances the heat insulation groove Q's ability to impede heat, reduces the risk of high temperatures in the first sub-frame 111, prevents the formation of localized hot spots in the frame 101, alleviates heat leakage in the frame 101, improves the temperature uniformity of the frame 101, and thus enhances the user experience.

[0086] In some examples, the heat insulation groove Q extends through the middle frame 100 along the height direction Z. In this case, the heat insulation groove Q can cut off the heat transfer path between the heating element 301 and the first sub-frame 111, reducing the risk of the first sub-frame 111 having a high temperature.

[0087] In some examples, as shown in Figure 5, the length of the heat insulation groove Q along the second direction Y is greater than or equal to the length of the heating element 301 along the second direction Y.

[0088] For example, at least a portion of the heat insulation groove Q extends along the second direction Y. The second direction Y intersects the first direction X. For example, the second direction Y is perpendicular to the first direction X. The height direction Z of the middle frame 100 intersects the plane containing the first direction X and the second direction Y. For example, the height direction Z of the middle frame 100 is perpendicular to the plane containing the first direction X and the second direction Y.

[0089] Setting the length of the heat insulation groove Q along the second direction Y to be greater than or equal to the length of the heating element 301 along the second direction Y ensures the heat insulation groove's heat-blocking effect, reduces the risk of the first sub-frame 111 having a high temperature, avoids the formation of local hot spots on the frame 101, alleviates heat leakage on the frame 101, and improves the temperature uniformity of the frame 101, thereby improving the user experience. It also reduces the risk that excessively high temperatures on the first sub-frame 111 may cause components near the first sub-frame 111 to malfunction.

[0090] However, creating a heat insulation groove Q on the middle frame 100 reduces the mechanical strength of the middle frame 100, affecting its reliability. Furthermore, creating the heat insulation groove Q on the middle frame 100 prevents components (such as a System-on-a-Chip) electrically connected to the second sub-middle plate 122 from electrically connecting to the first sub-frame 111, thus preventing the first sub-frame 111 from radiating signals to the outside as an antenna, affecting the antenna performance of the electronic device 300.

[0091] Figure 7 is a structural schematic diagram of an electronic device provided in some embodiments of this application. Figure 8 is a partial cross-sectional schematic diagram of Figure 7 along the A3-A3 direction in some embodiments.

[0092] Based on this, in the embodiments of this application, as shown in Figures 7 and 8, the middle frame 100 further includes a connecting portion 130. The connecting portion 130 connects the first sub-frame 111 and the second sub-middle plate 122. The connecting portion 130 is made of a heat-insulating and conductive material.

[0093] Understandably, thermally insulating and conductive materials have low thermal conductivity and high electrical conductivity. The connection portion 130 connects the first sub-frame 111 and the second sub-middle plate 122, and the material of the connection portion 130 includes a thermally insulating and conductive material. This increases the mechanical strength and reliability of the middle frame 100. Furthermore, components electrically connected to the second sub-middle plate 122 (e.g., a System-on-a-Chip) can be electrically connected to the first sub-frame 111 via the connection portion 130, enabling the first sub-frame 111 to radiate signals as an antenna. This also shortens the electrical connection path between the second sub-middle plate 122 and the first sub-frame 111, improving the antenna performance of the electronic device 300.

[0094] In addition, the material of the connecting part 130 includes a heat-insulating and conductive material, which enables the connecting part 130 to prevent heat from being transferred to the first sub-frame 111, reduce the risk of the first sub-frame 111 being too hot, avoid the formation of local hot spots on the frame 101, alleviate the heat leakage phenomenon of the frame 101, improve the temperature uniformity of the frame 101, thereby improving the user experience and reducing the risk that the components near the first sub-frame 111 will not work properly due to the excessive temperature of the first sub-frame 111.

[0095] In other words, by adopting the above-mentioned configuration, the impact of the heat insulation groove Q on the reliability of the middle frame 100 can be reduced, and the impact of the heat insulation groove Q on the antenna performance of the electronic device 300 can also be reduced.

[0096] In some examples, the thermally insulating and electrically conductive materials include at least one of titanium alloys and magnesium alloys.

[0097] Taking titanium alloys, a type of thermally insulating and conductive metal, as an example, titanium alloys have advantages such as low thermal conductivity, high mechanical strength, and good electrical conductivity. For instance, the thermal conductivity of titanium alloys is approximately 15.24 W / (m·K) (unit: watts / (meter × Kelvin)), while the thermal conductivity of aluminum is approximately 120 W / (m·K) to 16515.24 W / (m·K). Therefore, it is evident that the thermal conductivity of titanium alloys is lower than that of common metals such as aluminum, effectively hindering heat transfer.

[0098] The heat-insulating and conductive material includes at least one of titanium alloy and magnesium alloy, enabling the connection portion 130 to have good heat insulation and electrical conductivity, preventing heat transfer to the first sub-frame 111, and allowing components (e.g., SOCs) electrically connected to the second sub-middle plate 122 to be electrically connected to the first sub-frame 111 via the connection portion 130. Furthermore, it ensures the mechanical strength of the middle frame 100 and improves its reliability.

[0099] Understandably, thermally insulating and conductive materials can also be other metallic or non-metallic materials.

[0100] Figure 9 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments. Figure 10 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in yet another embodiment. Figure 11 is a cross-sectional view of a first sub-frame provided in some embodiments of this application. Figure 12 is a cross-sectional view of a first sub-frame provided in other embodiments of this application.

[0101] Understandably, the connection between the connecting portion 130 and the first sub-frame 111 and the second sub-middle plate 122 can be direct or indirect. In some examples, as shown in Figures 9 and 10, the first sub-frame 111 includes a first frame body 1111 and a connecting structure 1112. Along the first direction X, the connecting structure 1112 is located on the side of the first frame body 1111 near the heat insulation groove Q. The connecting portion 130 is connected to the first frame body 1111 through the connecting structure 1112.

[0102] For example, there can be multiple connecting structures 1112, and the multiple connecting structures 1112 are spaced apart along the second direction Y. The number of connecting parts 130 can be the same as the number of connecting structures 1112, and the multiple connecting parts 130 and the multiple connecting structures 1112 are connected in a one-to-one correspondence.

[0103] The connection part 130 is connected to the first frame body 1111 via the connection structure 1112, which improves the convenience of connecting the connection part 130 to the first frame body 1111.

[0104] In some examples, as shown in Figures 9 and 11, the connection structure 1112 includes a support leg 1112a, which is connected to the first frame body 1111 and extends along a first direction X near the heat insulation groove Q. For example, the support leg 1112a is located on the side of the first frame body 1111 near the heat insulation groove Q and is connected to the first frame body 1111. In some examples, the support leg 1112a and the first frame body 1111 can be an integrally formed structure to improve the reliability of the connection between them.

[0105] The end of the connecting part 130 away from the second sub-middle plate 122 is connected to the support leg 1112a, which improves the convenience of connecting the connecting part 130 to the first frame body 1111.

[0106] For example, as shown in Figure 9, the end of the connecting part 130 away from the second sub-middle plate 122 can overlap with the support leg 1112a to improve the connection reliability between the connecting part 130 and the support leg 1112a.

[0107] In some examples, as shown in Figures 10 and 12, the connection structure 1112 includes a connection groove 1112b, which is formed on the side surface of the first frame body 1111 near the heat insulation groove Q. The end of the connection portion 130 away from the second sub-middle plate 122 is embedded in the connection groove 1112b and connected to the first frame body 1111. This improves the convenience and reliability of the connection between the connection portion 130 and the first frame body 1111.

[0108] Understandably, when there are multiple connecting structures 1112, some of the multiple connecting structures 1112 can be support legs 1112a, and others can be connecting grooves 1112b. Alternatively, all of the multiple connecting structures 1112 can be support legs 1112a or all of them can be connecting grooves 1112b.

[0109] In some examples, along the first direction X, the surface of the first sub-frame 111 near the heat insulation groove Q is the connecting surface. The end of the connecting portion 130 away from the second sub-middle plate 122 is connected to the connecting surface.

[0110] For example, the connecting surface can be a plane, or it can be a curved surface. The end of the connecting part 130 away from the second sub-middle plate 122 is connected to the connecting surface, so that there is no need to set the connecting structure 1112, simplifying the structure of the first sub-frame 111.

[0111] Figure 13 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments.

[0112] In other examples, as shown in FIG13, the middle plate 102 further includes a first sub-middle plate 112, at least a portion of which is located on the side of the first sub-frame 111 near the heat insulation groove Q along the first direction X and is connected to the first sub-frame 111. The end of the connecting portion 130 away from the second sub-middle plate 122 is connected to the first sub-middle plate 112.

[0113] This allows the connecting part 130 to be connected to the first sub-middle plate 112 and the first sub-frame 111, improving the ease of connecting the connecting part 130 to the first sub-frame 111.

[0114] In some examples, there are multiple connecting portions 130, and at least one of the multiple connecting portions 130 is adjacent to the edge of the first sub-border 111 along the extending direction of the first sub-border 111.

[0115] Multiple connecting parts 130 can be connected one-to-one with multiple first sub-borders 111, or the number of connecting parts 130 can be greater than or equal to the number of first sub-borders 111, in which case at least two connecting parts 130 can also be connected to the same first sub-border 111.

[0116] The connecting portion 130 is connected to the first sub-frame 111, enabling the connecting portion 130 to power the first sub-frame 111. At least one of the multiple connecting portions 130 is positioned adjacent to the edge of the first sub-frame 111 along its extension direction, allowing the power supply point of the first sub-frame 111 to be close to its edge along its extension direction. This improves the signal radiation performance of the first sub-frame 111, thereby enhancing the antenna performance of the electronic device 300.

[0117] Figure 14 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some other embodiments.

[0118] In some examples, the connecting portion 130 and the first sub-frame 111 are connected by at least one of welding and riveting. The connecting portion 130 and the second sub-middle plate 122 are connected by at least one of welding and riveting.

[0119] For example, as shown in Figure 13, the connecting part 130 and the first sub-frame 111 can be connected by welding, or, as shown in Figure 14, the connecting part 130 and the first sub-frame 111 can also be connected by riveting. As shown in Figure 13, the connecting part 130 and the second sub-middle plate 122 can be connected by welding, or, as shown in Figure 14, the connecting part 130 and the second sub-middle plate 122 can also be connected by riveting.

[0120] Understandably, the connection method between the connecting part 130 and the first sub-frame 111 can be the same as or different from the connection method between the connecting part 130 and the second sub-middle plate 122.

[0121] By providing at least one connection between the connecting part 130 and the first sub-frame 111 and the second sub-middle plate 122 through welding and riveting, the convenience and reliability of the connection between the connecting part 130 and the first sub-frame 111 and the second sub-middle plate 122 can be improved.

[0122] Understandably, the connecting part 130 and the first sub-frame 111 and the second sub-middle plate 122 can also be connected in other ways.

[0123] In some examples, as shown in FIG14, the connecting portion 130 crosses the heat insulation groove Q along the first direction X and connects the first sub-frame 111 and the second sub-middle plate 122. In this way, the ease of connecting the connecting portion 130 to the first sub-frame 111 and the second sub-middle plate 122 can be improved.

[0124] Figure 15 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some embodiments. Figure 16 is a partial cross-sectional view of Figure 7 along the A3-A3 direction in some embodiments.

[0125] In some examples, as shown in Figures 15 and 16, the connecting portion 130 includes a first connecting portion 131 and a second connecting portion 132. The first connecting portion 131 is connected to one of the first sub-frame 111 and the second sub-middle plate 122, and the second connecting portion 132 is connected to the other of the first sub-frame 111 and the second sub-middle plate 122. The first connecting portion 131 and the second connecting portion 132 are connected.

[0126] For example, as shown in Figures 15 and 16, the first connecting part 131 can be connected to the first sub-frame 111, and the second connecting part 132 can be connected to the second sub-middle plate 122. Alternatively, the first connecting part 131 can be connected to the second sub-middle plate 122, and the second connecting part 132 can be connected to the first sub-frame 111.

[0127] Understandably, the connection part 130 is provided with a first connection part 131 and a second connection part 132, so that the connection part 130 can connect a first sub-frame 111 and a second sub-middle plate 122 of different shapes, thereby improving the applicability of the connection part 130.

[0128] In some examples, as shown in Figures 15 and 16, the first connecting part 131 includes a first connecting body 1311, and the second connecting part 132 includes a second connecting body 1312.

[0129] For example, the first connecting body 1311 can be directly connected to the first sub-frame 111, or, as shown in Figures 15 and 16, the first connecting part 131 may include a first riveting part 1313, and the first connecting part 131 can be indirectly connected to the first sub-frame 111 through the first riveting part 1313. The second connecting body 1312 can be directly connected to the second sub-middle plate 122, or, as shown in Figures 15 and 16, the second connecting part 132 may include a second riveting part 1314, and the second connecting part 132 can be indirectly connected to the second sub-middle plate 122 through the second riveting part 1314.

[0130] As shown in Figures 15 and 16, along the height direction Z of the middle frame 100, the first connecting body 1311 and the second connecting body 1312 are staggered, and the orthographic projections of the first connecting body 1311 and the second connecting body 1312 on the reference plane at least partially overlap. The reference plane intersects with the height direction Z of the middle frame 100. The first connecting body 1311 and the second connecting body 1312 are connected.

[0131] Understandably, the reference plane is a virtual plane intersecting the height direction Z of the middle frame 100. In some examples, the reference plane is perpendicular to the height direction Z of the middle frame 100. Along the height direction Z of the middle frame 100, the first connecting body 1311 and the second connecting body 1312 are staggered, and the orthographic projection of the first connecting body 1311 on the reference plane and the orthographic projection of the second connecting body 1312 on the reference plane at least partially overlap, which can improve the convenience of connecting the first connecting body 1311 and the second connecting body 1312, thereby improving the convenience of connecting the first connecting part 131 and the second connecting part 132.

[0132] In some examples, as shown in Figures 15 and 16, the first connecting portion 131 and the second connecting portion 132 are connected by at least one of welding and riveting. This arrangement improves the flexibility and reliability of the connection between the first connecting portion 131 and the second connecting portion 132.

[0133] For example, as shown in FIG16, when the first connecting part 131 and the second connecting part 132 are riveted together, the connecting part 130 may include a third riveting part 133, and the first connecting body 1311 and the second connecting body 1312 are riveted together by the third riveting part 133.

[0134] In other examples, the connecting portion 130 may not extend across the heat insulation groove Q. In this case, at least a portion of the connecting portion 130 can be embedded within the heat insulation groove Q and connect the first sub-frame 111 and the second sub-middle plate 122. This configuration reduces the space occupied by the middle frame 100, which is beneficial for the miniaturization and lightness of the electronic device 300.

[0135] In some examples, referring again to Figure 7, there are multiple first sub-borders 111, and these multiple first sub-borders 111 are spaced apart.

[0136] Understandably, different first sub-frames 111 can radiate signals of different frequency bands to the outside. By setting the number of first sub-frames 111 to multiple, the electronic device 300 can radiate signals of different frequency bands to the outside through different first sub-frames 111, thereby improving the antenna performance of the electronic device 300.

[0137] For example, the multiple first sub-frames 111 can serve as one or more of a mobile hotspot (wireless fidelity, Wi-Fi) antenna, a cellular network antenna, or a satellite communication antenna.

[0138] In some examples, as shown in Figure 7, the middle frame 100 also includes a first insulating portion 141 located between any two adjacent first sub-frames 111. For example, the material of the first insulating portion 141 may include rubber. Alternatively, the first insulating portion 141 may also include other insulating materials.

[0139] The first insulating part 141 is located between two adjacent first sub-frames 111, so that the first insulating part 141 can insulate the two adjacent first sub-frames 111 and reduce the risk of short circuit between the two adjacent first sub-frames 111.

[0140] In some examples, as shown in Figure 7, there are multiple second sub-borders 121, and these multiple second sub-borders 121 are spaced apart.

[0141] Understandably, different second sub-frames 121 can radiate signals of different frequency bands to the outside. By setting the number of second sub-frames 121 to multiple, the electronic device 300 can radiate signals of different frequency bands to the outside through different second sub-frames 121, thereby improving the antenna performance of the electronic device 300.

[0142] For example, multiple second sub-frames 121 can serve as one or more of a mobile hotspot (wireless fidelity, Wi-Fi) antenna, a cellular network antenna, or a satellite communication antenna. Understandably, the number of second sub-frames 121 and the frequency bands of the outwardly radiated signals can be the same or different.

[0143] For example, as shown in Figure 7, the middle frame 100 may further include a second insulating portion 142, which is located between any two adjacent second sub-frames 121. For example, the material of the second insulating portion 142 may include rubber. Alternatively, the second insulating portion 142 may also include other insulating materials. The material of the second insulating portion 142 may be the same as or different from the material of the first insulating portion 141.

[0144] The second insulating part 142 is located between two adjacent second sub-frames 121, so that the second insulating part 142 can insulate the two adjacent second sub-frames 121 and reduce the risk of short circuit between the two adjacent second sub-frames 121.

[0145] In summary, the embodiments of this application have at least the following beneficial effects:

[0146] In the embodiments of this application, at least a portion of the first sub-frame 111 is positioned along the first direction X on one side of the heat insulation groove Q, and the heating element 301 is positioned along the first direction X on the side of the heat insulation groove Q away from the first sub-frame 111, so that the heat insulation groove Q hinders the transfer of heat to the first sub-frame 111. This reduces the risk of high temperatures in the first sub-frame 111, prevents the formation of localized hot spots on the frame 101, alleviates heat leakage in the frame 101, improves the temperature uniformity of the frame 101, and thus enhances the user experience.

[0147] A connecting portion 130 is provided to connect the first sub-frame 111 and the second sub-middle plate 122. The material of the connecting portion 130 includes a heat-insulating and conductive material. On the one hand, this increases the mechanical strength of the middle frame 100 and improves its reliability. On the other hand, components (such as SOCs) electrically connected to the second sub-middle plate 122 can be electrically connected to the first sub-frame 111 through the connecting portion 130, enabling the first sub-frame 111 to radiate signals to the outside as an antenna. This also shortens the electrical connection path between the second sub-middle plate 122 and the first sub-frame 111, improving the antenna performance of the electronic device 300.

[0148] In addition, the material of the connecting part 130 includes a heat-insulating and conductive material, which enables the connecting part 130 to prevent heat from being transferred to the first sub-frame 111, reduce the risk of the first sub-frame 111 being too hot, avoid the formation of local hot spots on the frame 101, alleviate the heat leakage phenomenon of the frame 101, improve the temperature uniformity of the frame 101, thereby improving the user experience and reducing the risk that the components near the first sub-frame 111 will not work properly due to the excessive temperature of the first sub-frame 111.

[0149] In other words, by adopting the above-mentioned configuration, the impact of the heat insulation groove Q on the reliability of the middle frame 100 can be reduced, and the impact of the heat insulation groove Q on the antenna performance of the electronic device 300 can also be reduced.

Claims

1. A middle frame (100), characterized in that, include: The frame (101) surrounds and is connected to the middle plate (102); the middle frame (100) has a heat insulation groove (Q) that extends through at least a portion of the middle frame (100) along its height direction (Z); the frame (101) includes a first sub-frame (111), at least a portion of which is located along a first direction (X) within the frame. The heat insulation groove (Q) is located on one side; the middle plate (102) includes a second sub-middle plate (122), at least a portion of which is located along the first direction (X) on the side of the heat insulation groove (Q) away from the first sub-frame (111); the second sub-middle plate (122) is electrically connected to a heating element (301), which is located along the first direction (X) on the side of the heat insulation groove (Q) away from the first sub-frame (111); A connecting part (130) connects the first sub-frame (111) and the second sub-middle plate (122); wherein the material of the connecting part (130) includes a heat-insulating and conductive material.

2. The middle frame (100) according to claim 1, characterized in that, The middle frame (100) includes a metal structure and a non-metal structure disposed along the height direction (Z) of the middle frame (100); the heat insulation groove (Q) at least penetrates the metal structure.

3. The middle frame (100) according to claim 1 or 2, characterized in that, The thermally insulating and conductive material includes at least one of titanium alloy and magnesium alloy.

4. The middle frame (100) according to any one of claims 1 to 3, characterized in that, The first sub-frame (111) includes a first frame body (1111) and a connecting structure (1112). Along the first direction (X), the connecting structure (1112) is located on the side of the first frame body (1111) close to the heat insulation groove (Q). The connecting part (130) is connected to the first frame body (1111) through the connecting structure (1112).

5. The middle frame (100) according to claim 4, characterized in that, The connection structure (1112) includes a support leg (1112a), which is connected to the first frame body (1111) and extends along the first direction (X) close to the heat insulation groove (Q). The end of the connecting part (130) away from the second sub-middle plate (122) is connected to the support leg (1112a).

6. The middle frame (100) according to claim 4, characterized in that, The connection structure (1112) includes a connection groove (1112b), which is formed on the side surface of the first frame body (1111) near the heat insulation groove (Q). The end of the connecting portion (130) away from the second sub-middle plate (122) is embedded in the connecting groove (1112b) and connected to the first frame body (1111).

7. The middle frame (100) according to any one of claims 1 to 3, characterized in that, Along the first direction (X), the surface of the first sub-frame (111) near the heat insulation groove (Q) is the connecting surface; The end of the connecting portion (130) away from the second sub-middle plate (122) is connected to the connecting surface.

8. The middle frame (100) according to any one of claims 1 to 3, characterized in that, The middle plate (102) further includes a first sub-middle plate (122), and at least a portion of the first sub-middle plate (122) is located on the side of the first sub-frame (111) near the heat insulation groove (Q) along the first direction (X) and is connected to the first sub-frame (111). The end of the connecting portion (130) away from the second sub-middle plate (122) is connected to the first sub-middle plate (122).

9. The middle frame (100) according to any one of claims 1 to 8, characterized in that, The number of the connecting portions (130) is multiple, and at least one of the multiple connecting portions (130) is adjacent to the edge of the first sub-border (111) along the extending direction of the first sub-border (111).

10. The middle frame (100) according to any one of claims 1 to 9, characterized in that, The connecting part (130) and the first sub-frame (111) are connected by at least one of welding and riveting; the connecting part (130) and the second sub-middle plate (122) are connected by at least one of welding and riveting.

11. The middle frame (100) according to any one of claims 1 to 10, characterized in that, The connecting portion (130) crosses the heat insulation groove (Q) along the first direction (X) and connects the first sub-frame (111) and the second sub-middle plate (122).

12. The middle frame (100) according to claim 11, characterized in that, The connecting part (130) includes a first connecting part (131) and a second connecting part (132). The first connecting part (131) is connected to one of the first sub-frame (111) and the second sub-middle plate (122), and the second connecting part (132) is connected to the other of the first sub-frame (111) and the second sub-middle plate (122). The first connecting part (131) and the second connecting part (132) are connected.

13. The middle frame (100) according to claim 12, characterized in that, The first connecting part (131) includes a first connecting body (1311), and the second connecting part (132) includes a second connecting body (1312); Along the height direction (Z) of the middle frame (100), the first connecting body (1311) and the second connecting body (1312) are staggered, and the orthographic projection of the first connecting body (1311) on the reference plane and the orthographic projection of the second connecting body (1312) on the reference plane at least partially overlap; the reference plane intersects the height direction (Z) of the middle frame (100); The first connecting body (1311) and the second connecting body (1312) are connected.

14. The middle frame (100) according to claim 12 or 13, characterized in that, The first connecting part (131) and the second connecting part (132) are connected by at least one of welding and riveting.

15. The middle frame (100) according to any one of claims 1 to 10, characterized in that, At least a portion of the connecting part (130) is embedded in the heat insulation groove (Q) and connects the first sub-frame (111) and the second sub-middle plate (122).

16. The middle frame (100) according to any one of claims 1 to 15, characterized in that, The number of the first sub-borders (111) is multiple, and the multiple first sub-borders (111) are set at intervals.

17. The middle frame (100) according to claim 16, characterized in that, It also includes a first insulating portion (141), which is located between any two adjacent first sub-frames (111).

18. The middle frame (100) according to any one of claims 1 to 17, characterized in that, The length of the heat insulation groove (Q) along the second direction (Y) is greater than or equal to the length of the heating element (301) along the second direction (Y); the second direction (Y) intersects with the first direction (X).

19. A housing assembly (200), characterized in that, include: Back cover (201); In any one of claims 1 to 18, the middle frame (100) has the rear shell (201) located on one side of the middle frame (100) along the height direction (Z) and connected to the middle frame (100).

20. An electronic device (300), characterized in that, include: Heating element (301); The middle frame (100) as described in any one of claims 1 to 18, wherein the second sub-middle plate (122) of the middle frame (100) is electrically connected to the heating element (301).

21. The electronic device (300) according to claim 20, characterized in that, Also includes: The main board (302) is electrically connected to the second sub-middle board (122); the heating element (301) is electrically connected to the main board (302).

22. The electronic device (300) according to claim 20 or 21, characterized in that, Also includes: The camera assembly (303) is located along the first direction (X) on the side of the heating element (301) away from the heat insulation groove (Q).

Images