Housing, electronic device and preparation method for housing
By employing a metallurgical interface design that combines metal alloys and metal matrix composites in the electronic device housing, the problem of poor overall housing performance has been solved, achieving high strength, lightweight, and thinner middle plate, thus supporting the lightweight design and long battery life of electronic devices.
WO2026045290A9PCT designated stage Publication Date: 2026-06-04HUAWEI TECH CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-04-07
- Publication Date
- 2026-06-04
AI Technical Summary
Technical Problem
Existing electronic device housings have poor overall performance, making it difficult to meet diverse requirements such as reliable mechanical properties, lightweight design, and thinner mid-plate.
Method used
The design employs a metallurgical interface combining metal alloys and metal matrix composites. The frame and middle plate are made of different materials and are joined by isostatic pressing sintering to form a metallurgical interface, which meets the structural material requirements of different parts.
Benefits of technology
It improves the overall performance of the casing, achieving high strength and lightweight, and can reduce the thickness of the middle plate, supporting the thinner and lighter design of electronic devices and long battery life.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN2025087555_04062026_PF_FP_ABST
Abstract
Provided in the present application are a housing, an electronic device, and a preparation method for the housing. The housing is provided with a middle plate and a frame, the frame surrounding and being connected to the outer peripheral side of the middle plate. The housing comprises a first part and a second part, and the first part is connected to the second part. The material of the first part is a metal alloy, the material of the second part is a metal matrix composite material, and the connection interface between the first part and the second part is a metallurgical bonding interface. The metal matrix of the metal alloy in the first part is the same as the metal matrix of the metal matrix composite material in the second part, or the metal matrix of the metal alloy in the first part and the metal matrix of the metal matrix composite material in the second part are respectively any two of an aluminum matrix, a titanium matrix, and a magnesium matrix. The housing provided in the present application has strong comprehensive performance, and can take into account diversified requirements such as reliable strength, light weight, and thinning of the middle plate.
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