Case of electronic device, electronic device including same, and manufacturing method for case of electronic device

Abstract

According to an embodiment, the case of an electronic device may comprise: a base; a first deposition layer which is disposed on a first side of the base and is transparent or translucent; a pattern layer which is disposed on a second side of the base or the first deposition layer and has a hollow part; a second deposition layer, at least a part of which is disposed in the hollow part; and a cover layer disposed farther from the base than the second deposition layer.

Description

Case of an electronic device, an electronic device including the same, and a method for manufacturing the case of an electronic device

[0001] The disclosure below relates to a case for an electronic device, an electronic device including the same, and a method for manufacturing the case for an electronic device.

[0002] Electronic devices have evolved with technological advancements, becoming slimmer and lighter, while simultaneously enhancing their capabilities and performance to perform a variety of functions. Furthermore, recent electronic devices are appealing to consumers by embodying aesthetics in addition to functionality. Research is underway on electronic device cases and their manufacturing methods, which combine aesthetic appeal with durability by incorporating various design elements into the surface of the device.

[0003] The related art mentioned above is possessed or acquired in the process of deriving the present disclosure and cannot necessarily be said to be prior art disclosed to the general public prior to the filing of the present disclosure.

[0004] According to one embodiment, a case of an electronic device may include a base, a first deposition layer disposed on a first side of the base and being transparent or translucent, a patterned layer disposed on a second side of the base or on the first deposition layer and having a cavity, a second deposition layer having at least a portion disposed in the cavity, and a cover layer disposed on a side further from the second deposition layer from the base.

[0005] According to one embodiment, an electronic device may include a plurality of electronic components, and a housing structure surrounding at least a portion of a space in which the plurality of electronic components are provided. For example, the housing structure may include a base, a first deposition layer disposed on a first side of the base and being transparent or translucent, a patterned layer disposed on a second side of the base or on the first deposition layer and having a cavity, a second deposition layer having at least a portion disposed in the cavity, and a cover layer disposed on a side further from the second deposition layer from the base.

[0006] According to one embodiment, a method for manufacturing a case of an electronic device may include forming a transparent or translucent first deposition layer by depositing at least one first material on a first side of a base, forming a pattern layer having a hollow on a second side of the base or on the first deposition layer, forming a second deposition layer by depositing at least one second material on the first deposition layer, at least a portion of which is disposed in the hollow, and forming a cover layer so that the second deposition layer is not exposed to the outside.

[0007] The above and other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2 is a front perspective view of an electronic device according to one embodiment.

[0010] FIG. 3 is a rear perspective view of an electronic device according to one embodiment.

[0011] Figure 4 is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 5 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0013] Figure 6 is a cross-sectional view of a deposition layer according to one embodiment.

[0014] FIG. 7 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0015] FIG. 8 is a plan view showing a pattern layer formed on a first deposition layer according to one embodiment.

[0016] FIG. 9 is a cross-sectional view of a case according to one embodiment taken along the line II of FIG. 8.

[0017] FIG. 10 is a plan view showing a pattern layer formed on a first deposition layer according to one embodiment.

[0018] Fig. 11 is a plan view of a case according to one embodiment, viewed from the base side.

[0019] FIG. 12 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0020] FIG. 13A is a cross-sectional view of a portion of a case of an electronic device, according to one embodiment.

[0021] FIG. 13b is a cross-sectional view of a portion of a case of an electronic device, according to one embodiment.

[0022] FIG. 14 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0023] FIG. 15 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0024] FIG. 16 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0025] FIG. 17 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0026] FIG. 18 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0027] FIG. 19 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0028] FIG. 20 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0029] FIG. 21 is a flowchart illustrating a method for manufacturing a case of an electronic device according to one embodiment.

[0030] Figure 22 is a flowchart illustrating an operation of forming a pattern layer according to one embodiment.

[0031] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0032]

[0033] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 eB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the embodiments may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The embodiments and terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in the embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060]

[0061] FIG. 2 is a front perspective view of an electronic device according to one embodiment. FIG. 3 is a rear perspective view of an electronic device according to one embodiment. FIG. 4 is an exploded perspective view of an electronic device according to one embodiment.

[0062] Referring to FIGS. 2 to 4, an electronic device (e.g., the electronic device (101) of FIG. 1) may include a housing structure forming a first side (or front side), a second side (or back side), and a side surface surrounding a space between the first side and the second side. It should be noted that the shape of the housing structure illustrated in the drawings is exemplary.

[0063] An electronic device (201) according to one embodiment may include a housing structure (210) that forms an exterior and accommodates components therein. For example, the housing structure (210) may surround at least a portion of a space in which a plurality of electronic components (e.g., a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197)) are provided inside the electronic device (201). The housing structure (210) can form a front surface (210a) (e.g., a surface facing the +Z direction), a rear surface (210b) (e.g., a surface facing the -Z direction), and a side surface (211c) surrounding an internal space between the front surface (210a) and the rear surface (210b). In one embodiment, the housing structure (210) can form the side surface (211c) through a first side surface (211c-1) (e.g., a surface facing the -Y direction), a second side surface (211c-2) (e.g., a surface facing the +Y direction), a third side surface (211c-3) (e.g., a surface facing the +X direction), and a fourth side surface (211c-4) (e.g., a surface facing the -X direction) connecting the front surface (210a) and the rear surface (210b).

[0064] In one embodiment, the front side (210a) may be formed by a front plate (211a) that is at least partially substantially transparent. For example, the front plate (211a) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back side (210b) may be formed by a substantially opaque back plate (211b). For example, the back plate (211b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, or a combination thereof), or a combination thereof. In one embodiment, the side side (211c) may be formed by a front frame (240) that is joined to the front plate (211a) and the back plate (211b) and includes a metal and / or a polymer. In one embodiment, the back plate (211b) and the front frame (240) may be formed seamlessly as one piece. In one embodiment, the rear plate (211b) and the front frame (240) may be formed of substantially the same material (e.g., aluminum).

[0065] In one embodiment, the front plate (211a) may include a plurality of first edge regions (212a-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having rounded surfaces, a plurality of second edge regions (212a-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having rounded surfaces, and a plurality of third edge regions (212a-3) extending from at least a portion of the front surface (210a) to the back plate (211b) and having rounded surfaces, and positioned between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0066] In one embodiment, the back plate (211b) may include a plurality of fourth edge regions (212b-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, a plurality of fifth edge regions (212b-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, and a plurality of sixth edge regions (212b-3) extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface and positioned between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0067] In one embodiment, the front frame (240) may surround at least a portion of the internal space between the front (210a) and the rear (210b). In one embodiment, a display (261) may be positioned on one side (e.g., in the +Z direction) of the front frame (240), and a rear plate (211b) may be positioned on the other side (e.g., in the -Z direction) of the front frame (240). In one embodiment, the front frame (240) may include a conductive portion. For example, at least a portion of the front frame (240) may be formed of a conductive material. In one embodiment, the front frame (240) may include a first support structure (241) positioned on at least a portion of a side surface (211c), and a second support structure (242) connected to the first support structure (241) and forming a space for arranging components of the electronic device (201).

[0068] In one embodiment, the first support structure (241) may connect the edges of the front plate (211a) and the rear plate (211b) and surround the space between the front plate (211a) and the rear plate (211b) to form a side surface (211c) of the housing structure (210). In one embodiment, the second support structure (242) may be disposed inside (or a body portion) of the electronic device (201). The first support structure (241) and the second support structure (242) may be formed integrally, or may be formed separately and connected to each other. In one embodiment, the first support structure (241) and the second support structure (242) may include a conductive portion. For example, the first support structure (241) may be formed of a metal and / or a conductive polymer material. In one embodiment, the second support structure (242) may be formed of a metal and / or conductive polymer material, similar to the first support structure (241).

[0069] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be located on the front surface (210a) of the electronic device (201). In one embodiment, the display (261) may be exposed through at least a portion of the front plate (211a) (e.g., the first edge regions (212a-1), the second edge regions (212a-2), and the third edge regions (212a-3)). In one embodiment, the display (261) may have a shape substantially the same as the outer contour shape of the front plate (211a). Although not shown in the drawing, the display (261) according to one embodiment may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer (not shown) for detecting a stylus pen.

[0070] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed to the outside of the electronic device (201) and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). The sensing area (261a-1) may overlap at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (e.g., the sensor module (176) of FIG. 1). The sensing area (261a-1) may display content together with a screen display area (261a) that does not overlap with the sensing area (261a-1).

[0071] In one embodiment, the camera area (261a-2) may overlap at least a portion of the screen display area (261a). The camera area (261a-2) may expose a lens of a first camera module (280a) (e.g., the camera module (180) of FIG. 1) positioned to face the front of the electronic device (201). For example, the camera area (261a-2) may allow transmission of an optical signal (e.g., light) associated with the camera module (280a). In one embodiment, the camera area (261a-2) may display content similarly to the screen display area (261a) that does not overlap the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not operating.

[0072] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front surface (210a) of the electronic device (201). The sensor module (276) may be arranged in the electronic device (201) to correspond to a sensing area (261a-1) of a screen display area (261a). For example, the sensor module (276) may be arranged to perform its function without being visually exposed through the display (261) in an internal space of the electronic device (201). The sensor module (276) may receive an input signal penetrating the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include a signal relating to the user's biometric information (e.g., the user's fingerprint or voice).

[0073] In one embodiment, the electronic device (201) may include a camera module (280a, 280b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera modules (280a, 280b) may include a first camera module (280a) and a second camera module (280b). In one embodiment, the electronic device (201) may include a flash (280c) disposed near the first camera module (280a) and the second camera module (280b).

[0074] In one embodiment, the first camera module (280a) is disposed on the front side (210a) of the housing structure (210) such that its lens is exposed, and can receive an optical signal from the front side (e.g., +Z direction) of the electronic device (201). The second camera module (280b) is disposed on the rear side (210b) of the housing structure (210) such that its lens is exposed, and can receive an optical signal from the rear side (e.g., -Z direction) of the electronic device (201). In one embodiment, at least a portion of the first camera module (280a) may be disposed on the housing structure (210) such that it is covered by the display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2). In one embodiment, the second camera module (280b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (280c) may include a light-emitting diode or a xenon lamp.

[0075] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive an operation signal from a user. For example, the input module (250) may include at least one key input device that is positioned so as to be exposed on a side surface (211c) of the housing structure (210).

[0076] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on an outer surface of the housing structure (210). The electronic device (201) may be wired to an external device (e.g., another electronic device or an external power source) through the connection terminal (278).

[0077] In one embodiment, the electronic device (201) may include one or more printed circuit boards. For example, the electronic device (201) may include a first circuit board (251) (or a main circuit board) and a second circuit board (252) (or a sub-circuit board). The first circuit board (251) and the second circuit board (252) may be disposed inside the electronic device (201), for example, in a second support structure (242). At least one of the circuit boards (251, 252) may be connected to the second support structure (242) via a ground. In one embodiment, the first circuit board (251) may be accommodated in a first substrate slot (242a) of the second support structure (242). In one embodiment, the second circuit board (252) can be accommodated in the second board slot (242b) of the second support structure (242). In one embodiment, the circuit boards (251, 252) can be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB) that is at least partially bendable.

[0078] In one embodiment, the electronic device (201) may include a battery (289) disposed therein. The battery may be disposed in a battery slot formed in the second support structure (242).

[0079] Meanwhile, the embodiments can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 2 to 4.

[0080]

[0081] FIG. 5 is a cross-sectional view of a case of an electronic device according to one embodiment.

[0082] Referring to FIG. 5, a case (500) of an electronic device (e.g., the electronic device (101) of FIG. 1 or the electronic device (201) of FIG. 2) according to one embodiment may be placed on the outside of the electronic device.

[0083] According to one embodiment, the case (500) may form at least a part of a housing structure of the electronic device (e.g., the housing structure (210) of FIG. 2). For example, the case (500) may form at least a part of a rear plate of the electronic device (e.g., the rear plate (211b) of FIG. 3). Meanwhile, it should be noted that the case (500) is not limited to the rear plate of the electronic device, and the case (500) may also form at least a part of another part forming the housing structure of the electronic device, for example, the front plate (e.g., the front plate (211a) of FIG. 2).

[0084] According to one embodiment, the case (500) may be a separate accessory (e.g., a protective case) that can be attached to an electronic device. The case (500) may be formed in a shape corresponding to at least a portion of the housing structure of the electronic device, and may have a shape that surrounds at least a portion of the rear plate, the side bezel structure, and / or the front plate of the electronic device.

[0085] Hereinafter, a case (500) is exemplarily described as forming at least a part of the housing structure of an electronic device, but it should be noted that the case (500) should not necessarily be interpreted as a configuration forming a part of the electronic device.

[0086] According to one embodiment, the case (500) may enable a user to visually perceive various colors depending on the user's gaze while looking at the case (500). The case (500) (or housing structure) may include a base (510), a first deposition layer (520), a pattern layer (530), a second deposition layer (540), and a cover layer (550).

[0087] The base (510) may be a member forming one layer of the case (500) and may provide a surface on which other layers may be formed. For example, the base (510) may be a portion that is exposed to the outside and that can be visually recognized by a user. Meanwhile, it should be noted that another transparent or translucent layer (e.g., a coating layer) may be additionally formed on the outer surface of the base (510). Through the base (510), the user may visually recognize the first deposition layer (520) located on the back surface of the base (510) and / or another layer located on the back surface of the first deposition layer (520). For example, the base (510) may be formed of a transparent material. For example, the base (510) may be formed of a translucent material. It should be noted that, unless otherwise stated, the base (510) may be formed of any material that allows light to pass through. For example, the base (510) may be formed of, but is not limited to, polyethylene terephthalate (PET). For example, it should be noted that the base (510) may be formed of a synthetic resin other than PET (e.g., polycarbonate (PC) or polyurethane (PU)) or glass (e.g., reinforced glass).

[0088] The first deposition layer (520) may be disposed, for example, on the first side (e.g., in the + Z direction) of the base (510). For example, as illustrated, the first deposition layer (520) may be formed to contact the back surface of the base (510), but is not limited thereto. For example, another layer may be disposed between the first deposition layer (520) and the base (510). The first deposition layer (520) may be transparent or translucent. For example, the first deposition layer (520) may be formed to a sufficiently thin thickness (e.g., several hundred nanometers) to have transparent or translucent properties. For example, the first deposition layer (520) may absorb light corresponding to a certain range of wavelengths. Light incident on the first deposition layer (520) may be incident on another layer formed on the back surface of the first deposition layer (520) or may be reflected from a boundary surface of the other layer. For example, the first deposition layer (520) can reflect different colors depending on the angle of light incident on the first deposition layer (520) through the base (510). For example, as described later in FIG. 6, when the first deposition layer (520) is formed of a plurality of thin film layers, a portion of the light incident on the first deposition layer (520) can be reflected from the boundary surface of some of the plurality of thin film layers described above. For example, a portion of the light can be absorbed by some of the plurality of thin film layers, a portion of the light can transmit through some of the plurality of thin film layers, and a portion of the light can be reflected from the boundary surface of some of the plurality of thin film layers.

[0089] The pattern layer (530) may be disposed, for example, on the first deposition layer (520) and may have a hollow (531). For example, when the case (500) is viewed in a direction perpendicular to the case (500) (e.g., + / - Z direction), the hollow (531) may be formed in a grid pattern, a polygonal pattern, a circular pattern, a straight line pattern, and / or a curved pattern, but is not limited thereto. For example, as illustrated, the pattern layer (530) may be formed to contact the back surface of the first deposition layer (520), but is not limited thereto. For example, another layer may be disposed between the pattern layer (530) and the first deposition layer (520). For example, the pattern layer (530) may be formed of a material having a lower light transmittance than the first deposition layer (520). For example, the pattern layer (530) may be formed of an opaque material (e.g., black or red ink). The pattern layer (580) having a hollow space (531) may, together with the second deposition layer (540) at least partially positioned in the hollow space (531), allow multiple regions within the case (500) having a single continuous outer surface to be perceived by the user as having different colors.

[0090] The second deposition layer (540) may be, for example, transparent or translucent. For example, the second deposition layer (540) may be formed to a sufficiently thin thickness (e.g., tens of nanometers) so as to have transparent or translucent properties. For example, the second deposition layer (540) may absorb light corresponding to a certain range of wavelengths. For example, the range of wavelengths of light absorbed by the second deposition layer (540) may be different from the range of wavelengths of light absorbed by the first deposition layer (520). For example, as described later in FIG. 6, when the second deposition layer (540) is formed of a plurality of thin film layers, a portion of the light incident on the second deposition layer (540) may be reflected from the boundary surfaces of some of the above-described plurality of thin film layers. For example, a portion of the light may be absorbed by some of the plurality of thin film layers, a portion of the light may transmit through some of the plurality of thin film layers, and a portion of the light may be reflected from the boundary surfaces of some of the plurality of thin film layers.

[0091] According to one embodiment, the second deposition layer (540) may be formed of a material having a higher reflectivity than the first deposition layer (520). For example, the second deposition layer (540) may be opaque. For example, the second deposition layer (540) may be formed of a metal material (e.g., indium, tin, or aluminum). With such a configuration, the reflectivity of the case (500) is improved, and the user may feel a metallic texture. For example, the second deposition layer (540) may be formed through a deposition process using indium. Hereinafter, a case in which the second deposition layer (540) is transparent or translucent will be described as an example, but it should be noted that the present invention is not limited thereto.

[0092] For example, the second deposition layer (540) may have a thinner thickness than the first deposition layer (520). Through such a configuration, the overall thickness and manufacturing cost of the case (500) can be reduced. For example, the thickness of the second deposition layer (540) may be 1 / 20 to 1 / 2 times the thickness of the first deposition layer (520), but is not limited thereto.

[0093] The second deposition layer (540) may not be placed on the same plane as the first deposition layer (520). At least a portion of the second deposition layer (540) (e.g., the first portion (541)) may be positioned in the hollow (531). For example, the second deposition layer (540) may include a first portion (541) placed on the first deposition layer (520) and a second portion (542) placed on the pattern layer (530). In other words, different laminate structures may be formed in each region within the case (500) having a continuous outer surface. For example, a first region of a case (500) may have a structure in which a base (510), a first deposition layer (520), a first part (541) of a second deposition layer (540), and a cover layer (550) are sequentially laminated, and a second region may have a structure in which a base (510), a first deposition layer (520), a pattern layer (530), a second part (542) of a second deposition layer (540), and a cover layer (550) are sequentially laminated. According to this structure, in the first region, light may be incident on the base (510), the first deposition layer (520), and the second deposition layer (540) and then reflected or absorbed from the boundary surface of the cover layer (550), and in the second region, light may be incident on the base (510) and the first deposition layer (520) and then reflected or absorbed from the boundary surface of the pattern layer (530). For example, when the cover layer (550) and / or the pattern layer (530) is black, light incident on the cover layer (550) and / or the pattern layer (530) may be absorbed. For example, when the cover layer (550) and / or the pattern layer (530) is white or silver, light incident on the cover layer (550) and / or the pattern layer (530) may be reflected from the boundary of the corresponding layers. Due to the difference in the path of light generated in this way, the wavelengths of the absorbed light may be different from each other, and as a result, the user may visually perceive different colors for each area.In other words, since the user can visually perceive different colors in the first and second areas described above, the user can visually recognize a pattern distinguished by a portion made up of the first area and a portion made up of the second area.

[0094] According to one embodiment, the height from the base (510) to the end of the pattern layer (530) may be higher than the height from the base (510) to the end of the portion (541) located in the hollow (531) of the second deposition layer (540). For example, the thickness of the second deposition layer (540) may be thinner than the thickness of the pattern layer (530). For example, the second deposition layer (540) may be formed by a deposition method. According to the deposition method, the deposition thickness of the deposition material can be formed precisely and thinly. By controlling the deposition thickness, the wavelength-specific reflectivity, the length of the reflection wavelength, or the color of the second deposition layer (540) may be controlled. For example, the maximum thickness of the second deposition layer (540) may be thinner by 1 / 100 or less than the maximum thickness of the pattern layer (530). For example, it should be noted that the pattern layer (530) may be formed using a printing method, but is not limited thereto.

[0095] The cover layer (550) can cover the second deposition layer (540) so that the second deposition layer (540) is not exposed to the outside. The cover layer (550) can be positioned on the opposite side of the base (510) with respect to the first deposition layer (520). For example, when the case (500) is part of the housing structure of an electronic device, the cover layer (550) can be positioned toward a plurality of electronic components provided inside the electronic device with respect to the first deposition layer (520). The cover layer (550) can be positioned on a side farther from the second deposition layer (540) from the base (510). For example, as illustrated, the cover layer (550) can be formed to contact the back surface of the second deposition layer (540), but is not limited thereto. For example, another layer can be positioned between the second deposition layer (540) and the cover layer (550). The cover layer (550) may be formed of a material having a lower light transmittance than the second deposition layer (540). For example, the cover layer (550) may be formed of an opaque material (e.g., black or red ink). For example, the cover layer (550) may be formed of the same material as the pattern layer (530), but it should be noted that the present invention is not limited thereto.

[0096]

[0097] Figure 6 is a cross-sectional view of a deposition layer according to one embodiment.

[0098] Referring to FIG. 6, a deposition layer (600) according to one embodiment (e.g., the first deposition layer (520) or the second deposition layer (540) of FIG. 5) may include a plurality (e.g., two) of thin film layers (610, 620, 630, 640, 650, 660) having different refractive indices. Since the degree of surface reflection and / or refraction of a material varies depending on the angle of the user's gaze, the above-described plurality of thin film layers (610, 620, 630, 640, 650, 660) allows the user to visually perceive different colors depending on the angle (e.g., θ1 or θ2) of the user's gaze looking at the same point (P).

[0099] For example, when a user views a point (P) of a deposition layer (600) at a first angle (θ1), a first-first ray (R11) may be incident on the first thin film layer (610) and then reflected from the boundary surface of the second thin film layer (620) and transmitted to the user, and a first-second ray (R12) may be sequentially incident on the first thin film layer (610) and the second thin film layer (620) and then reflected from the boundary surface of the third thin film layer (630) and transmitted to the user. In this way, a plurality of light rays (e.g., R11, R12) may be incident on the user through different paths, and the user may perceive a first color that reflects the reinforcement and / or interference effect according to the difference in paths of the plurality of light rays (e.g., R11, R12) through the light ray (R1) that is ultimately transmitted to the user.

[0100] Likewise, when a user views a point (P) of the deposition layer (600) at a second angle (θ2), the second-first ray (R21) may be incident on the first thin film layer (610) and then reflected from the boundary surface of the second thin film layer (620) and transmitted to the user, and the second-second ray (R22) may be sequentially incident on the first thin film layer (610) and the second thin film layer (620) and then reflected from the boundary surface of the third thin film layer (630) and transmitted to the user. In this way, a plurality of light rays (e.g., R21, R22) may be incident on the user through different paths, and the user may perceive a second color that reflects the reinforcement and / or interference effect according to the difference in paths of the plurality of light rays (e.g., R21, R22) through the ray (R2) that is ultimately transmitted to the user.

[0101] In this way, depending on the angle of the user's gaze (e.g., θ1 or θ2) looking at the same point (P), the user can visually perceive different colors. Meanwhile, although the 1-1 light ray (R11), the 1-2 light ray (R12), the 2-1 light ray (R21), and the 2-2 light ray (R22) are exemplarily described as being reflected from the boundary surface of the first thin film layer (610) or from the boundary surface of the second thin film layer (620), it should be noted that some of the above-described light rays (R11, R12, R21, and / or R22) may be incident on any one of the third thin film layer (630) to the sixth thin film layer (660), or may be reflected from the boundary surface of any one of the third thin film layer (630) to the sixth thin film layer (660).

[0102] For example, among the plurality of thin film layers (610, 620, 630, 640, 650, 660), some of the layers (610, 630, 650) may be formed of a material having a first refractive index (e.g., SiO2), and the remaining layers (620, 640, 660) may be formed of a material having a second refractive index different from the first refractive index (e.g., TiO2). The thicknesses (t) of at least some of the plurality of thin film layers (610, 620, 630, 640, 650, 660) may be different from each other. In this way, by varying the material of multiple thin film layers (610, 620, 630, 640, 650, 660) or varying the thickness (t), the user can be enabled to recognize various colors depending on the angle (e.g., θ1 or θ2) of the user's gaze looking at the same point (P).

[0103] For example, the deposition layer (600) may include three or more layers. For example, the deposition layer (600) including three or more layers may be formed by alternately depositing two materials. With this configuration, three or more layers can be formed using only two materials, thereby reducing the volume occupied by the deposition equipment. Meanwhile, it should be noted that the deposition layer (600) does not necessarily have to include three or more layers, and even when it includes only two layers, the aforementioned light reinforcement and / or interference effect may occur.

[0104] The number of thin film layers constituting the first deposition layer (520) and the second deposition layer (540) and / or the thickness (t) of each thin film layer may be different from each other. For example, the number of thin film layers constituting the second deposition layer (540) may be less than the number of thin film layers constituting the first deposition layer (520). For example, the total thickness of the thin film layers constituting the second deposition layer (540) may be less than the total thickness of the thin film layers constituting the first deposition layer (520). According to the above-described structure, even if the second deposition layer (540) is formed sufficiently thin, light passing through the second deposition layer (540) may pass through the first deposition layer (520) and reach the second deposition layer (540). Accordingly, the user can perceive various colors depending on the angle (e.g., θ1 or θ2) of the user's gaze looking at the same point (P) by various reflection and / or refraction phenomena occurring while passing through the first deposition layer (520) and the second deposition layer (540).

[0105]

[0106] FIG. 7 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0107] Referring to FIG. 7, a case (700) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (710) (e.g., base (510) of FIG. 5), a first deposition layer (720) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (730) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (740) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), and a cover layer (750) (e.g., cover layer (550) of FIG. 5).

[0108] The second deposition layer (740) according to one embodiment may be formed continuously without interruption. The second deposition layer (740) may include a first portion (741) (e.g., the first portion (541) of FIG. 5), a second portion (742) (e.g., the second portion (542) of FIG. 5), and a connecting portion (743).

[0109] The connecting portion (743) can interconnect the first portion (741) and the second portion (742). One end of the connecting portion (743) can be connected to the first portion (741), and the other end of the connecting portion (743) can be connected to the second portion (742) which is located further away from the first portion (741) with respect to the first deposition layer (720). According to this structure, among the light incident on the first region formed by the base (710), the base (710), the first deposition layer (720), the first part (741) of the second deposition layer (740), and the cover layer (750), at least a portion of the light incident on the edge of the first region may be incident on the connecting portion (743) and may be reflected after being incident on a portion located further away from the first portion (741) (e.g., the boundary between the connecting portion (743) and the cover layer (750), or the boundary between the connecting portion (743) and the pattern layer (730), and thus may be longer than the path of light incident on the remainder of the first region. Accordingly, a user viewing the first region may visually perceive a deeper depth perception at the boundary portion of the first region than at the remainder of the first region, and as a result, the three-dimensionality felt by the user viewing the first region may be enhanced. For example, as the height difference between the first part (741) and the second part (742) increases, the three-dimensional effect described above can be improved.

[0110] According to one embodiment, the pattern layer (730) may include a portion having a different thickness depending on the region. For example, the pattern layer (730) may include a central portion (730a) having a constant height, and an inclined portion (730b) located at an edge region of the central portion (730a) and having a height that decreases as it goes toward a hollow (e.g., hollow (531) of FIG. 5). For example, the pattern layer (730) may be formed using a printing method, and in this case, the inclined portion (730b) may be formed at the edge portion of the printed pattern without performing a separate additional process. Meanwhile, it should be noted that the method of forming the pattern layer (730) is not limited to the printing method.

[0111] According to one embodiment, the first part (741) of the second deposition layer (740) may be positioned in the hollow, the second part (742) of the second deposition layer (740) may be positioned in the central part (730a), and the connecting part (743) of the second deposition layer (740) may be positioned in the inclined part (730b). For example, the connecting part (743) may be formed to be inclined with respect to the first deposition layer (720). According to this structure, when the connecting portion (743) is formed in a direction perpendicular to the first deposition layer (720) (e.g., + / - Z direction), the travel path of light can be increased by the reflection of light occurring at the boundary surface of another layer (e.g., pattern layer (730) or cover layer (750)) adjacent to the connecting portion (743) while the light passes through the connecting portion (743), so that the depth or reflectivity felt by the user with respect to the boundary portion of the first region can be improved, or the boundary portion of the first region can appear heterogeneous compared to other portions of the first region. Meanwhile, it should be noted that the connecting portion (743) does not necessarily have to be formed to be inclined with respect to the first deposition layer (720), and may be formed in a direction perpendicular to the first deposition layer (720) (e.g., + / - Z direction) to connect the first portion (741) and the second portion (742).

[0112]

[0113] Fig. 8 is a plan view showing a pattern layer formed on a first deposition layer according to one embodiment. Fig. 9 is a cross-sectional view of a case according to one embodiment taken along cut line II of Fig. 8. Fig. 8 can be understood to show a case according to one embodiment with the second deposition layer and cover layer removed.

[0114] Referring to FIGS. 8 and 9, a case (800) according to one embodiment (e.g., case (500) of FIG. 5 or case (700) of FIG. 7) includes a base (810) (e.g., base (510) of FIG. 5 or base (710) of FIG. 7), a first deposition layer (820) (e.g., first deposition layer (520) of FIG. 5, deposition layer (600) of FIG. 6 or first deposition layer (720) of FIG. 7), a pattern layer (830) (e.g., pattern layer (530) of FIG. 5 or pattern layer (730) of FIG. 7), a second deposition layer (840) (e.g., second deposition layer (540) of FIG. 5, deposition layer (600) of FIG. 6 or second deposition layer (740) of FIG. 7) and a cover layer (850) (e.g., cover layer (550) of FIG. 5 or It may include a cover layer (750).

[0115] According to one embodiment, the pattern layer (830) may include a portion having a different thickness for each region. For example, the pattern layer (830) may include a hollow (831) (e.g., the hollow (531) of FIG. 5), a first pattern portion (832), and a second pattern portion (833). For example, the hollow (831) of the pattern layer (830) may be positioned in a first region of the case (800), either the first pattern portion (832) or the second pattern portion (833) of the pattern layer (830) may be positioned in a second region, and both the first pattern portion (832) and the second pattern portion (833) of the pattern layer (830) may be positioned in a third region. For example, when the pattern layer (830) is formed by a printing method, the above-described structure may be formed by varying the number of printing operations for each region of the case (800). Unless otherwise stated, the description of either the first pattern portion (832) or the second pattern portion (833) may be applied to the other. The following description exemplifies a case where the first pattern portion (832) is positioned at the same height as the second pattern portion (833), or where the first pattern portion (832) is positioned closer to the first deposition layer (820) than the second pattern portion (833), but it should be noted that the reverse is also possible.

[0116] According to one embodiment, the first pattern portion (832) may be formed on the first deposition layer (820). For example, either the first pattern portion (832) or the second pattern portion (833) (e.g., the first pattern portion (832)) may include a plurality of pattern lines (832-1, 832-2). For example, the plurality of pattern lines (832-1, 832-2) may include portions formed parallel to each other. For example, the plurality of pattern lines (832-1, 832-2) may be formed to be mutually separated.

[0117] For example, the width (w1) of the plurality of pattern lines (832-1, 832-2) may become narrower as it goes in the setting direction (e.g., - Y direction) parallel to the first deposition layer (820). According to this structure, since an area (e.g., the lower area of ​​FIG. 8) with a relatively low density of pattern lines (832-1, 832-2) has higher light transmittance than other areas (e.g., the upper area of ​​FIG. 8), the user can perceive that the case (800) has a gradient effect in which light becomes brighter as it goes in the setting direction (e.g., - Y direction).

[0118] For example, the spacing (w3) of the plurality of pattern lines (832-1, 832-2) may become wider as they go in the setting direction (e.g., - Y direction) parallel to the first deposition layer (820). According to this structure, since an area (e.g., the lower area of ​​FIG. 8) with a relatively low density of pattern lines (832-1, 832-2) has higher light transmittance than other areas (e.g., the upper area of ​​FIG. 8), the user can perceive that the case (800) has a gradient effect in which light becomes brighter as it goes in the setting direction (e.g., - Y direction).

[0119] According to one embodiment, the second pattern portion (833) may be formed in a direction (e.g., a direction perpendicular to, + / - Y direction) intersecting the longitudinal direction (e.g., + / - X direction) of the first pattern portion (832). For example, at least a portion of the second pattern portion (833) may be formed on the first pattern portion (832). For example, the remaining portion of the second pattern portion (833) may be formed on the first deposition layer (820).

[0120] For example, at least one of the first pattern portion (832) and the second pattern portion (833) (e.g., the second pattern portion (833)) may have a shape in which the width (w2) becomes narrower in the setting direction (e.g., the - Y direction) parallel to the first deposition layer (820). According to this structure, since the area where the density of the second pattern portion (833) is relatively low (e.g., the lower area of ​​FIG. 8) has higher light transmittance than other areas (e.g., the upper area of ​​FIG. 8), the user can perceive that the case (800) has a gradient effect in which light becomes brighter as it moves in the setting direction (e.g., the - Y direction).

[0121] As shown in FIG. 9, according to one embodiment, the second deposition layer (840) may include a first portion (841) (e.g., the first portion (541) of FIG. 5 or the first portion (741) of FIG. 7), a second portion (842) (e.g., the second portion (542) of FIG. 5 or the second portion (742) of FIG. 7), and a third portion (844).

[0122] The first part (841) of the second deposition layer (840) may be positioned in a hollow (e.g., hollow (531) of FIG. 5), the second part (842) of the second deposition layer (840) may be positioned in a first pattern portion (832) or a second pattern portion (833) formed on the first deposition layer (820) among the pattern layers (830), and the third part (844) of the second deposition layer (840) may be positioned in a portion where the first pattern portion (832) and the second pattern portion (833) are formed to overlap in a vertical direction (e.g., + / - Z direction).

[0123] The embodiments of each drawing can be combined with embodiments of other drawings. For example, the embodiments of FIGS. 8 and 9 are not inextricably linked to the embodiment of FIG. 7. For example, it will be readily apparent to those skilled in the art that the second deposition layer (840) may include a connecting portion (e.g., connecting portion (743) of FIG. 7) that interconnects a pair of portions among the first portion (841), the second portion (842), and the third portion (844).

[0124]

[0125] Fig. 10 is a plan view showing a pattern layer formed on a first deposition layer according to one embodiment. Fig. 10 can be understood to show a case according to one embodiment with the second deposition layer and cover layer removed.

[0126] Referring to FIG. 10, a case (1000) according to one embodiment (e.g., case (500) of FIG. 5, case (700) of FIG. 7, or case (800) of FIG. 8) comprises a base (1010) (e.g., base (510) of FIG. 5, base (710) of FIG. 7, or base (810) of FIG. 8), a first deposition layer (1020) (e.g., first deposition layer (520) of FIG. 5, deposition layer (600) of FIG. 6, first deposition layer (720) of FIG. 7, or first deposition layer (820) of FIG. 8), a pattern layer (1030) (e.g., pattern layer (530) of FIG. 5, pattern layer (730) of FIG. 7, or pattern layer (830) of FIG. 8), a second deposition layer (not shown) (e.g., second deposition layer (540) of FIG. 5, deposition layer (600) of FIG. 6) It may include a layer (600), a second deposition layer (740) of FIG. 7 or a second deposition layer (840) of FIG. 9) and a cover layer (not shown) (e.g., a cover layer (550) of FIG. 5, a cover layer (750) of FIG. 7 or a cover layer (850) of FIG. 9).

[0127] According to one embodiment, the pattern layer (1030) may include a hollow (1031) (e.g., hollow (531) of FIG. 5 or hollow (831) of FIG. 8), a first pattern portion (1032) (e.g., first pattern portion (832) of FIG. 8), and a second pattern portion (1033) (e.g., second pattern portion (833) of FIG. 8).

[0128] According to one embodiment, at least one of the first pattern portion (1032) and the second pattern portion (1033) (e.g., the first pattern portion (1032)) may have a shape in which the width (w1) becomes narrower in the setting direction (e.g., - Y direction) parallel to the first deposition layer (1020). With this structure, a region with a relatively low density of the first pattern portion (1032) (e.g., the lower region of FIG. 10) has higher light transmittance than other regions (e.g., the upper region of FIG. 10), so that the user can perceive that the case (1000) has a gradient effect in which light becomes brighter as it moves in the setting direction (e.g., - Y direction).

[0129] According to one embodiment, the other of the first pattern portion (1032) and the second pattern portion (1033) (e.g., the second pattern portion (1033)) may have a shape in which the width (w2) becomes narrower in the direction (e.g., the vertical direction, + X direction) intersecting the above-described set direction (e.g., - Y direction). According to this structure, since a region with a relatively low density of the second pattern portion (1033) (e.g., the + X direction region) has higher light transmittance than other regions (e.g., the - X direction region), the user can perceive that the case (1000) has a gradient effect in which light becomes brighter as it goes in the direction (e.g., the vertical direction, + X direction) intersecting the set direction (e.g., - Y direction).

[0130] For example, when the first pattern portion (1032) and the second pattern portion (1033) are formed in a long manner in a direction intersecting each other and their widths are changed, a gradient effect formed in the middle direction of the direction in which each pattern portion (1032, 1033) is arranged (e.g., the diagonal direction of FIG. 10, the middle direction of the + X direction and the - Y direction) can be perceived by the user.

[0131]

[0132] Fig. 11 is a plan view of a case according to one embodiment, viewed from the base side.

[0133] Referring to FIG. 11, a case (1100) according to one embodiment (e.g., case (500) of FIG. 5, case (700) of FIG. 7, case (800) of FIG. 8, or case (1000) of FIG. 10) may include a first region (A1) and a second region (A2) having different colors.

[0134] For example, the first region (A1) may include a base (e.g., a base (510) of FIG. 5, a base (710) of FIG. 7, a base (810) of FIG. 8, or a base (1010) of FIG. 10), a first deposition layer (e.g., a first deposition layer (520) of FIG. 5, a deposition layer (600) of FIG. 6, a first deposition layer (720) of FIG. 7, a first deposition layer (820) of FIG. 8, or a first deposition layer (1020) of FIG. 10), a second deposition layer (e.g., a second deposition layer (540) of FIG. 5, a deposition layer (600) of FIG. 6, a second deposition layer (740) of FIG. 7, or a second deposition layer (840) of FIG. 9)), and a cover layer (e.g., a cover layer (550) of FIG. 5, a cover layer (750) of FIG. 7, or a cover layer (850) of FIG. 9).

[0135] For example, the second region (A2) may include a base, a first deposition layer, a pattern layer (e.g., a pattern layer (530) of FIG. 5, a pattern layer (730) of FIG. 7, a pattern layer (830) of FIG. 8, or a pattern layer (1030) of FIG. 10), a second deposition layer, and a cover layer.

[0136] According to this structure, for each of the first area (A1) and the second area (A2), the user can visually perceive different colors depending on the angle of the user's gaze looking at them.

[0137] In the first region (A1), the second deposition layer may be laminated on the back surface of the first deposition layer, and in the second region (A2), the second deposition layer may be laminated on the back surface of the pattern layer. For example, the first region (A1) may be understood as an region overlapping the first part (541) of the second deposition layer (540) of FIG. 5, and the second region (A2) may be understood as an region overlapping the second part (542) of the second deposition layer (540) of FIG. 5. With this structure, since the paths of light passing through the first region (A1) and the second region (A2) become different, the user may perceive the two regions (A1, A2) as having different colors.

[0138] As illustrated in Fig. 11, multiple areas (A1, A2) can have distinct colors, allowing the user to recognize a certain pattern. Furthermore, as described in the above-described embodiment, each area (A1, A2) can display a color that changes depending on the angle of the user's gaze, thereby providing the user with a variety of aesthetic sensations.

[0139]

[0140] In the following embodiments, components that have common functions will be described using the same names. Even if not explicitly described, unless otherwise stated, the description described in one embodiment may also apply to other embodiments, and specific descriptions will be omitted to the extent of overlap. For example, an embodiment of any one of the drawings in FIGS. 12 to 20 can be combined with an embodiment of another drawing, including FIGS. 12 to 20.

[0141]

[0142] FIG. 12 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0143] Referring to FIG. 12, a case (1200) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (1210) (e.g., base (510) of FIG. 5), a first deposition layer (1220) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1230) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (1240) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), and a cover layer (1250) (e.g., cover layer (550) of FIG. 5). For example, the second deposition layer (1240) may include a first portion (1241) (e.g., the first portion (541) of FIG. 5) and a second portion (1242) (e.g., the second portion (542) of FIG. 5).

[0144] According to one embodiment, the pattern layer (1230) may be formed of a transparent or translucent material. With this configuration, light passing through the pattern layer (1230) may be reflected from the boundary surface of the second portion (1242), or may be incident on the second portion (1242) and reflected from the boundary surface of the cover layer (1250) before being transmitted to the user. With this configuration, a difference occurs between the path of the light passing through the first portion (1241) and the path of the light passing through the second portion (1242), and as a result, the user may visually perceive different colors for each area. For example, the pattern layer (1230) may be formed by printing transparent or translucent ink on the first deposition layer (1220), but is not limited thereto.

[0145] When the pattern layer (1230) is formed of a transparent or translucent material, at least a portion of the cover layer (1250) (e.g., a portion of the cover layer (1250) positioned adjacent to the pattern layer (1230)) may be visually recognized by the user through the pattern layer (1230). For example, depending on the angle at which the user views the case (1200), a portion of the cover layer (1250) positioned between the first portion (1241) and the second portion (1242) may be visually recognized by the user. For example, when a user looks at the case (1200) in a downward slanted direction from right to left with reference to FIG. 12 (e.g., in the middle of the - X direction and + Z direction), the right side (1250R) of the cover layer (1250) positioned adjacent to the pattern layer (1230) with reference to FIG. 12 may be visually recognized by the user, and the left side (1250L) positioned on the opposite side may not be visually recognized by the user. In other words, since the visual exposure of the cover layer (1250) varies depending on the line of sight from which the user looks at the case (1200), the user may feel various aesthetic sensations regarding the case (1200).

[0146] According to one embodiment, the cover layer (1250) may be formed of a material having a different color (e.g., red) from the pattern layer (1230). For example, the height from the first deposition layer (1220) to the end of the first portion (1241) may be lower than the height from the first deposition layer (1220) to the end of the pattern layer (1230). In other words, at least a portion of the cover layer (1250) may be visually recognized from the outside through the transparent or translucent pattern layer (1230), the first deposition layer (1220), and the base (1210). With this configuration, the color of the cover layer (1250) at the boundary of the second portion (1242) may be visually recognized by the user, so that the user may visually recognize the boundary between the first portion (12411) and the second portion (1242). For example, the cover layer (1250) may be formed by printing ink containing color on the second deposition layer (1240), but is not limited thereto.

[0147]

[0148] FIG. 13A is a cross-sectional view of a portion of a case of an electronic device, according to one embodiment.

[0149] Referring to FIG. 13A, a case (1300) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (1310) (e.g., base (510) of FIG. 5), a first deposition layer (1320) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1330) (e.g., pattern layer (530) of FIG. 5 or pattern layer (1230) of FIG. 12), a second deposition layer (1340) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), and a cover layer (1350) (e.g., cover layer (550) of FIG. 5). For example, the second deposition layer (1340) may include a first portion (1341) (e.g., the first portion (541) of FIG. 5) and a second portion (1342) (e.g., the second portion (542) of FIG. 5).

[0150] According to one embodiment, the pattern layer (1330) may be formed of a transparent or translucent material. With this configuration, the visual exposure of the cover layer (1350) varies depending on the user's perspective on the case (1300), allowing the user to experience a variety of aesthetic sensations regarding the case (1300).

[0151] According to one embodiment, the cover layer (1350) may be formed of a material having a higher reflectivity than the first deposition layer (1320) and the second deposition layer (1340). For example, the cover layer (1350) may be formed of a metal material (e.g., indium, tin, or aluminum). With such a configuration, the reflectivity of the case (1300) is improved, and the user may feel a metallic texture. For example, the cover layer (1350) may be formed by printing ink containing a metal pigment on the second deposition layer (1340), but is not limited thereto.

[0152]

[0153] FIG. 13b is a cross-sectional view of a portion of a case of an electronic device, according to one embodiment.

[0154] Referring to FIG. 13B, a case (1300') of an electronic device according to an embodiment (e.g., case (1300) of FIG. 13A) may include a base (1310') (e.g., base (1310) of FIG. 13A), a first deposition layer (1320') (e.g., first deposition layer (1320) of FIG. 13), a pattern layer (1330') (e.g., pattern layer (730) of FIG. 7 or pattern layer (1330) of FIG. 13A), a second deposition layer (1340') (e.g., second deposition layer (740) of FIG. 7 or second deposition layer (1340) of FIG. 13A), and a cover layer (1350') (e.g., cover layer (1350) of FIG. 13A).

[0155] According to one embodiment, the pattern layer (1330') may be formed of a transparent or translucent material. According to one embodiment, the pattern layer (1330') may include portions having different thicknesses depending on the region. For example, the pattern layer (1330') may include a central portion (1330'a) (e.g., the central portion (730a) of FIG. 7) and an inclined portion (1330b) (e.g., the inclined portion (730b) of FIG. 7).

[0156] According to one embodiment, the cover layer (1350') may be formed of a material having a higher reflectivity than the first deposition layer (1320') and the second deposition layer (1340').

[0157] According to one embodiment, the second deposition layer (1340') may include a first portion (1341') ​​(e.g., the first portion (741) of FIG. 7 or the first portion (1341) of FIG. 13), a second portion (1342') (e.g., the second portion (742) of FIG. 7 or the second portion (1342) of FIG. 13) and a connecting portion (1343') (e.g., the connecting portion (743) of FIG. 7).

[0158] According to one embodiment, the connecting portion (1343') can interconnect the first portion (1341') ​​and the second portion (1342'). For example, the connecting portion (1343') can be formed to be inclined with respect to the first deposition layer (1320'). With this structure, when a user looks at the case (1300') in a direction perpendicular to the connecting portion (1343'), the user can visually perceive light reflected with high brightness at the boundary between the connecting portion (1343') and the cover layer (1350'). On the other hand, when the user looks at the case (1300') in a direction parallel to the connecting portion (1343'), the phenomenon described above can be reduced. Therefore, since the area where high brightness reflection occurs changes depending on the user's gaze at the case (1300'), the user can experience various aesthetic sensations.

[0159]

[0160] FIG. 14 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0161] Referring to FIG. 14, a case (1400) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (1410) (e.g., base (510) of FIG. 5), a first deposition layer (1420) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1430) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (1440) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), a cover layer (1450) (e.g., cover layer (550) of FIG. 5), and a protection layer (1460). For example, the second deposition layer (1440) may include a first portion (1441) (e.g., the first portion (541) of FIG. 5) and a second portion (1442) (e.g., the second portion (542) of FIG. 5).

[0162] According to one embodiment, the cover layer (1450) may be formed of a transparent or translucent material. A protective layer (1460) may be formed on the outer surface of the cover layer (1450). The protective layer (1460) may cover the cover layer (1450) so that the cover layer (1450) is not exposed to the outside. For example, the protective layer (1460) may be formed of a metal material (e.g., aluminum). With such a configuration, the reflectivity of the case (1400) is improved, and the user may feel a metallic texture. For example, the protective layer (1460) may be formed by depositing a metal (e.g., indium) on the cover layer (1450), but is not limited thereto. The protective layer (1460) formed by the deposition method may have improved reflectivity compared to a protective layer formed by the printing method.

[0163]

[0164] FIG. 15 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0165] Referring to FIG. 15, a case (1500) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (1510) (e.g., base (510) of FIG. 5), a first deposition layer (1520) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1530) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (1540) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), and a cover layer (1550) (e.g., cover layer (550) of FIG. 5). For example, the second deposition layer (1540) may include a first portion (1541) (e.g., the first portion (541) of FIG. 5) and a second portion (1542) (e.g., the second portion (542) of FIG. 5).

[0166] According to one embodiment, at least one of the pattern layer (1530) and the cover layer (1550) may be formed of a material (e.g., a metal material) having a higher reflectivity than the first deposition layer (1520) and the second deposition layer (1540). With such a configuration, the reflectivity of the case (1500) is improved, and the user may feel a metallic texture. For example, the pattern layer (1530) and / or the cover layer (1550) may be formed by, but is not limited to, printing ink containing a metal pigment.

[0167]

[0168] FIG. 16 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0169] Referring to FIG. 16, a case (1600) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (1610) (e.g., base (510) of FIG. 5), a barrier layer (1670), a first deposition layer (1620) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1630) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (1640) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), and a cover layer (1650) (e.g., cover layer (550) of FIG. 5). For example, the second deposition layer (1640) may include a first portion (1641) (e.g., the first portion (541) of FIG. 5) and a second portion (1642) (e.g., the second portion (542) of FIG. 5).

[0170] According to one embodiment, the base (1610) may be formed of glass (e.g., tempered glass). For example, by forming the base (1610) of tempered glass, high-brightness reflectivity and color sensation can be realized.

[0171] According to one embodiment, a barrier layer (1670) may be disposed between the base (1610) and the first deposition layer (1620). The barrier layer (1670) may be formed of a material capable of preventing annealing of the stress of the tempered glass that may occur during the deposition process. For example, the barrier layer (1670) may be formed of a material containing an organic material. For example, the barrier layer (1670) may be formed of polysilazane, silicon oxide, silicon nitride, or silane. For example, the barrier layer (1670) may be formed to a thickness of 70 nm or more. The barrier layer (1670) may reduce the risk of the base (1610) being damaged during the manufacturing process or use process.

[0172]

[0173] FIG. 17 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0174] Referring to FIG. 17, a case (1700) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (1710) (e.g., base (510) of FIG. 5), a first deposition layer (1720) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1730) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (1740) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), a cover layer (1750) (e.g., cover layer (550) of FIG. 5), and a coating layer (1780). For example, the second deposition layer (1740) may include a first portion (1741) (e.g., the first portion (541) of FIG. 5) and a second portion (1742) (e.g., the second portion (542) of FIG. 5).

[0175] According to one embodiment, the coating layer (1780) may be formed of a synthetic resin. For example, the synthetic resin may include a fluorinated polymer and / or silicon dioxide. Such a configuration may reduce the user's fingerprints on the surface of the case (1700) or reduce static electricity generated on the surface of the case (1700).

[0176] According to one embodiment, the coating layer (1780) may be formed of a material having a higher hardness than the base (1710). This configuration may reduce scratches on the surface of the base (1710). For example, the coating layer (1780) may be formed of silicon nitride (Si3N4) or titanium dioxide (TiO2). For example, the coating layer (1780) may be formed by a deposition method, but is not limited thereto.

[0177] According to one embodiment, the coating layer (1780) may be formed of a material more flexible than the base (1710). This configuration may reduce the scattering of fragments when the base (1710) is broken. For example, the coating layer (1780) may be formed of polyethylene terephthalate (PET), but is not limited thereto.

[0178] For example, another layer may be added on top of the coating layer (1780). For example, it should be noted that an organic or inorganic hard coating layer having an acrylic or polysilazane material may be added separately.

[0179]

[0180] FIG. 18 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0181] Referring to FIG. 18, a case (1800) (e.g., case (500) of FIG. 5 or case (1700) of FIG. 17) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment comprises a base (1810) (e.g., base (510) of FIG. 5 or base (1710) of FIG. 17), a first deposition layer (1820) (e.g., first deposition layer (520) of FIG. 5, deposition layer (600) of FIG. 6, or first deposition layer (1720) of FIG. 17), a pattern layer (1830) (e.g., pattern layer (530) of FIG. 5 or pattern layer (1730) of FIG. 17), a second deposition layer (1840) (e.g., second deposition layer (540) of FIG. 5, deposition layer (600) of FIG. 6, or The second deposition layer (1740) of Fig. 17 may include a cover layer (1850) (e.g., the cover layer (550) of Fig. 5 or the cover layer (1750) of Fig. 17) and a coating layer (1880) (e.g., the coating layer (1780) of Fig. 17). For example, the second deposition layer (1840) may include a first portion (1841) (e.g., the first portion (541) of Fig. 5) and a second portion (1842) (e.g., the second portion (542) of Fig. 5).

[0182] According to one embodiment, the base (1810) may be formed of multiple layers. For example, the base (1810) may include a first base (1811), a second base (1812), and an adhesive layer (1813).

[0183] The first base (1811) may provide a surface on which the first deposition layer (1820) may be deposited. For example, the first base (1811) may be formed of, but is not limited to, polyethylene terephthalate (PET).

[0184] The second base (1812) may be formed of, for example, a different material from the first base (1811). For example, the second base (1812) may be formed of, but is not limited to, a material having a harder material than the first base (1811), such as tempered glass.

[0185] The adhesive layer (1813) may be formed of an adhesive material (e.g., an optically clear adhesive (OCA)) to adhere the first base (1811) and the second base (1812). For example, in a state where at least one layer among the first deposition layer (1820), the pattern layer (1830), the second deposition layer (1840), and the cover layer (1850) is formed on the first base (1811), the second base (1812) manufactured separately from the first base (1811) may be adhered. For example, in a state where the coating layer (1880) is formed on the second base (1812), the case (1800) may also be formed by adhering the first base (1811) and the second base (1812). For example, the adhesive layer (1813) may be formed of a material more flexible than the first base (1811) and the second base (1812), thereby reducing the scattering of fragments when the first base (1811) or the second base (1812) is broken.

[0186]

[0187] FIG. 19 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0188] Referring to FIG. 19, a case (1900) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment comprises a base (1910) (e.g., base (510) of FIG. 5), a first deposition layer (1920) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (1930) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (1940) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), a cover layer (1950) (e.g., cover layer (550) of FIG. 5), and a coating layer (1980) (e.g., coating layer (1780) of FIG. 17 or coating layer (18) of FIG. A second deposition layer (1940) may include a first portion (1941) (e.g., the first portion (541) of FIG. 5) and a second portion (1942) (e.g., the second portion (542) of FIG. 5).

[0189] According to one embodiment, the first deposition layer (1920) may be disposed on a first side (e.g., in the - Z direction) of the base (1910), and the pattern layer (1930) may be disposed on a second side (e.g., in the + Z direction) of the base (1910). For example, a cavity (e.g., a cavity (531) of FIG. 5, a cavity (831) of FIG. 8, or a cavity (1031) of FIG. 10) of the pattern layer (1930) may be formed on the base (1910) rather than on the first deposition layer (1920).

[0190] According to one embodiment, the second deposition layer (1940) may be formed on the opposite side of the first deposition layer (1920) with respect to the base (1910). For example, the second deposition layer (1940) may be formed on a surface of the base (1910) that is exposed to the hollow portion of the pattern layer (1930) and on the surface of the pattern layer (1930).

[0191] According to one embodiment, the coating layer (1980) may be formed on the first deposition layer (1920), thereby reducing damage to the first deposition layer (1920). For example, the coating layer (1980) may be formed of a material having a higher hardness than the first deposition layer (1920), but is not limited thereto.

[0192]

[0193] FIG. 20 is a cross-sectional view of a portion of a case of an electronic device according to one embodiment.

[0194] Referring to FIG. 20, a case (2000) (e.g., case (500) of FIG. 5) of an electronic device (e.g., electronic device (101) of FIG. 1 or electronic device (201) of FIG. 2) according to one embodiment may include a base (2010) (e.g., base (510) of FIG. 5), a first deposition layer (2020) (e.g., first deposition layer (520) of FIG. 5 or deposition layer (600) of FIG. 6), a pattern layer (2030) (e.g., pattern layer (530) of FIG. 5), a second deposition layer (2040) (e.g., second deposition layer (540) of FIG. 5 or deposition layer (600) of FIG. 6), a cover layer (2050) (e.g., cover layer (550) of FIG. 5), and an additional layer (2090). For example, the second deposition layer (2040) may include a first portion (2041) (e.g., the first portion (541) of FIG. 5) and a second portion (2042) (e.g., the second portion (542) of FIG. 5).

[0195] According to one embodiment, the first deposition layer (2020), the pattern layer (2030), the second deposition layer (2040), and the cover layer (2050) may be formed on the opposite side (e.g., in the -Z direction) of the area where the electronic components of the electronic device are located, with respect to the base (2010).

[0196] According to one embodiment, the cover layer (2050) may be formed on the second deposition layer (2040), thereby reducing damage to the second deposition layer (2040). The cover layer (2050) may be formed of a transparent material. For example, the cover layer (2050) may be formed of a translucent material. Unless otherwise stated, it should be noted that the cover layer (2050) may be formed of any material that is transparent to light. For example, the coating layer (1980) may be formed of a material having a higher hardness than the second deposition layer (2040), but is not limited thereto. For example, the cover layer (2050) may be formed of the same material as the coating layer (1780) of FIG. 17 described above. For example, the cover layer (2050) may be formed by, but is not limited to, a deposition or coating method.

[0197] According to one embodiment, the additional layer (2090) may be formed on the opposite side (e.g., in the +Z direction) of the first deposition layer (2020) with respect to the base (2010). For example, when the case (2000) is a part of a housing structure of an electronic device (e.g., the housing structure (210) of FIG. 2), the additional layer (2090) may be positioned toward a plurality of electronic components provided inside the electronic device with respect to the base (2010). For example, the additional layer (2090) may be formed of a material having lower light transmittance than the base (2010). For example, the additional layer (2090) may be formed of an opaque material (e.g., black or red ink). For example, the additional layer (2090) may be formed of the same material as the pattern layer (2030), but it should be noted that the present invention is not limited thereto. For example, it should be noted that the additional layer (2090) may be formed using a printing method, but is not limited thereto. Furthermore, it should be noted that instead of the additional layer (2090) being provided separately, the base (2010) may be formed of an opaque material.

[0198]

[0199] FIG. 21 is a flowchart illustrating a method for manufacturing a case of an electronic device according to one embodiment.

[0200] Referring to FIG. 21, a method for manufacturing a case of an electronic device (e.g., a case (500) of FIG. 5, a case (700) of FIG. 7, a case (800) of FIG. 8, a case (1000) of FIG. 10, a case (1100) of FIG. 11, a case (1200) of FIG. 12, a case (1300) of FIG. 13a, a case (1300') of FIG. 13b, a case (1400) of FIG. 14, a case (1500) of FIG. 15, a case (1600) of FIG. 16, a case (1700) of FIG. 17, a case (1800) of FIG. 18, a case (1900) of FIG. 19, or a case (2000) of FIG. 20)) according to one embodiment comprises an operation (2110) of forming a first deposition layer (e.g., a first deposition layer (520) of FIG. 5), a pattern layer (e.g., a pattern of FIG. 5) It may include an operation (2120) of forming a layer (530), an operation (2130) of forming a second deposition layer (e.g., the second deposition layer (540) of FIG. 5), and an operation (2140) of forming a cover layer (e.g., the cover layer (550) of FIG. 5).

[0201] In operation 2110, a transparent or translucent first deposition layer may be formed by depositing at least one first material on a first side (e.g., in the +Z direction of FIG. 5 or in the -Z direction of FIG. 19) of a base (e.g., the base (510) of FIG. 5). For example, the first material may include a plurality of materials (e.g., SiO2, TiO2). The first deposition layer may be formed as a plurality of thin film layers as illustrated in FIG. 6, but is not limited thereto. For example, operation 2110 may be performed using a vacuum deposition method. The vacuum deposition method may include a resistance heating evaporation method, an electron beam evaporation method, an arc evaporation method, a laser ablation deposition method, and / or a sputtering deposition method.

[0202] For example, sputtering deposition methods may include inductively coupled plasma sputtering (ICP sputtering). ICP sputtering is a technology that generates plasma through high-frequency induction and uses it to sputter a target material, allowing the deposition layer to have high hardness. For example, when forming a base with tempered glass, ICP sputtering deposition can improve the durability of the product.

[0203] For example, electron beam deposition (EBD) uses a high-energy electron beam to heat and vaporize a target material, allowing the vaporized atoms to condense on the substrate, thereby forming a deposition layer. For example, when forming a base from synthetic resin, the cost of manufacturing the case can be reduced by utilizing the less expensive EBD method compared to sputtering deposition.

[0204] In operation 2120, a pattern layer having a hollow (e.g., hollow (531) in FIG. 5) may be formed on the second side of the base (e.g., +Z direction in FIG. 19) or on the first deposition layer. For example, operation 2120 may be performed using a printing method or a photo process method, but is not limited thereto.

[0205] For example, the printing method may include an operation of printing a printing material on a first deposition layer. The thickness of the pattern layer formed by the printing material may continuously decrease as it approaches the hollow. In other words, according to the printing method, an inclined portion (730b) whose height decreases as it approaches the hollow, such as the pattern layer (730) of FIG. 7, may be formed. Therefore, by performing a deposition process on the pattern layer (730) formed by the printing method without performing a separate additional process, a first portion (e.g., the first portion (741) of FIG. 7), a second portion (e.g., the second portion (742) of FIG. 7), and a connection portion (e.g., the connection portion (743) of FIG. 7) of the first deposition layer may be formed. The connection portion formed on the inclined portion (730b) may have an inclined shape with respect to the first deposition layer. For example, the printing method may include digital thermal transfer, offset printing, inkjet, or silk screen printing.

[0206] For example, according to the photo process method, a hollow (531) in a direction perpendicular to the first deposition layer (e.g., + / - Z direction) can be formed, such as the pattern layer (530) of FIG. 5, or a hollow (no sign) having an inclined shape can be formed, such as the pattern layer (730) of FIG. 7, with respect to the first deposition layer. The photo process method is a method using a photosensitive material and a mask, and this will be exemplarily described with reference to FIG. 18.

[0207] In operation 2130, a second deposition layer, at least a portion of which is disposed in the cavity, may be formed by depositing at least one second material on a second side of the base (e.g., in the +Z direction of FIG. 19) or on the first deposition layer. For example, the second material may include a plurality of materials. For example, the second material may include an oxide (e.g., SiO2, TiO2). For example, the second material may include a metal (e.g., indium, tin, or aluminum). The second deposition layer may be formed as a plurality of thin film layers as illustrated in FIG. 6, but is not limited thereto. For example, operation 2130 may be performed using a vacuum deposition method. The vacuum deposition method may include a resistance heating evaporation method, an electron beam evaporation method, an arc evaporation method, a laser ablation deposition method, and / or a sputtering deposition method. Unless otherwise stated, the description of operation 2110 may apply to operation 2130. Operations 2110 and / or 2130 may include, for example, an operation of alternately depositing two materials having different refractive indices (e.g., SiO2, TiO2). For example, a deposition layer formed of three or more layers may be formed by alternately depositing two materials. This method may reduce the volume occupied by the deposition equipment.

[0208] Operation 2130 may be performed after operation (2120) of forming a pattern layer. In this manner, a second deposition layer may be formed on (i) a surface exposed to the hollow of the base or the first deposition layer, and (ii) the surface of the pattern layer, using the same deposition process. In this manner, in the first region of the case, light may be incident on the base (510), the first deposition layer (520), and the second deposition layer (540) and then reflected from the boundary surface of the cover layer (550), and in the second region, light may be incident on the base (510) and the first deposition layer (520) and then reflected from the boundary surface of the pattern layer (530). Due to the difference in the path of light generated in this manner, the wavelengths of the absorbed light may be different from each other, and as a result, a user may be able to visually perceive different colors in each region.

[0209] Meanwhile, instead of depositing the second deposition layer on the first deposition layer through operations 2110 to 2130, operations 2120 and 2130 are omitted, and the thickness of the first deposition layer is manufactured to vary by region in operation 2110, thereby generating a difference in the path of light for each region of the case. However, in order to manufacture the layer so that its thickness varies by region through deposition, the amount of evaporation material arriving at each region must vary, and since it is difficult to control the amount of evaporation material arriving at each region, it is difficult to repeatedly reproduce a uniform color using such a manufacturing method. On the other hand, according to the manufacturing method according to the embodiment, even if the first deposition layer having a uniform first thickness is formed in operation 2110 and the second deposition layer having a uniform second thickness is formed in operation 2130, a difference in the path of light for each region of the case can be generated, thereby reducing management costs and work hours, reducing the deviation in color for each final product, and expecting uniform quality of the product.

[0210] In operation 2140, a cover layer may be formed to prevent the second deposition layer from being exposed to the outside. For example, operation 2140 may be performed using a printing method, but is not limited thereto. Unless otherwise stated, the description of operation 2120 applies to operation 2140.

[0211] According to a method for manufacturing a case of an electronic device according to one embodiment, it is possible to implement not only a cell deposition method of directly depositing on existing glass, but also a method of depositing in sheets on a decorative film, so that high production efficiency can be achieved at low cost.

[0212]

[0213] Figure 22 is a flowchart illustrating an operation of forming a pattern layer according to one embodiment.

[0214] Referring to FIGS. 21 and 22, an operation (2200) of forming a pattern layer according to one embodiment (e.g., operation 2120 of FIG. 21) may be performed after operation 2110 and before operation 2130. Operation 2200 may include an operation (2210) of forming a deposition layer for a pattern (not shown), an operation (2220) of forming a photosensitive layer (not shown), an exposure operation (2230), a development operation (2240), an etching operation (2250), and an operation (2260) of removing a residual photosensitive layer (not shown).

[0215] In operation 2210, a pattern deposition layer may be formed by depositing a deposition material on a first deposition layer (e.g., the first deposition layer (520) of FIG. 5). The pattern deposition layer is a layer before a cavity (e.g., the cavity (531) of FIG. 5) is formed, and the entire area of ​​the pattern deposition layer may have the same height with respect to the first deposition layer.

[0216] In operation 2220, a photosensitive layer may be formed by applying a photoresist material to the pattern deposition layer. For example, if the photosensitive layer is formed of a positive photoresist material, the area exposed to light may be removed through a development process described below. For example, if the photosensitive layer is formed of a negative photoresist material, the area not exposed to light may be removed through a development process.

[0217] In operation 2230, a photosensitive layer may be exposed to light corresponding to the shape of the hollow. In operation 2230, a mask corresponding to the shape of the hollow may be placed. The mask may be a reflective mask that transmits light, or a reflective mask that includes a light reflecting region and a light absorbing region. For example, when the photosensitive layer is formed of a positive photoresist material, a hole having the same shape as the hollow may be formed in the mask. For example, when the photosensitive layer is formed of a negative photoresist material, an empty space corresponding to a shape excluding the hollow may be formed in the mask.

[0218] In operation 2240, by applying a developer to the exposed photosensitive layer, a portion of the photosensitive layer corresponding to the hollow portion may be removed. The portion of the photosensitive layer not corresponding to the hollow portion may remain, thereby reducing the contact of the etching material used in the subsequent operation 2250 with the pattern deposition layer.

[0219] In operation 2250, a cavity may be formed in the pattern deposition layer through an etching process. For example, the etching process may be performed using an anisotropic etching method or an isotropic etching method. For example, using an anisotropic etching method, a cavity (531) may be formed in a direction perpendicular to the first deposition layer (e.g., + / - Z direction) as shown in FIG. 5. For example, using an isotropic etching method, a cavity (no sign) having a shape inclined with respect to the first deposition layer may be formed as shown in FIG. 7. As described above, a pattern layer in which a cavity is formed may be formed through operations 2210 to 2250.

[0220] In operation 2260, a remaining portion of the photosensitive layer may be removed. Through operation 2260, the photosensitive layer remaining in the pattern layer in which the cavity is formed is removed, and subsequently, operation (2130) of forming a second deposition layer may be performed.

[0221]

[0222] According to one embodiment, a case (210; 211a; 211b; 500; 700; 800; 1000; 1100; 1200; 1300; 1300'; 1400; 1500; 1600; 1700; 1800; 1900; 2000) of an electronic device (101; 201) comprises a base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010), a first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020), a pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) having a hollow (531; 831; 1031) disposed on the second side of the base or the first deposition layer, a second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040), and a cover layer (550; 750; 850, 1250; 1350; 1350'; 1450; 1550; 1650; 1750; 1850; 1950; 2050) disposed further from the base than the second deposition layer.

[0223] According to one embodiment, at least one of the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) and the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) may include a plurality of thin film layers (610, 620, 630, 640, 650, 660) having different refractive indices.

[0224] According to one embodiment, the height from the base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010) to the end of the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) is equal to or greater than the height from the base to the end of the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; The height may be higher than the end of the part (541; 741; 841; 1241; 1341; 1341'; 1441; 1541; 1641; 1741; 1841; 1941; 2041) located in the hollow (531; 831; 1031) among the parts (1640; 1740; 1840; 1940; 2040).

[0225] According to one embodiment, the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) is disposed on the first portion (541; 741; 841; 1241; 1341; 1341'; 1441; 1541;) 1641; 1741; 1841; 1941; 2041), and a second portion (542; 742; 842; 1242; 1342; 1342'; 1442; 1542; 1642; 1742; 1842; 1942; 2042) disposed on the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030).

[0226] According to one embodiment, the second deposition layer (740; 1340') may include a connecting portion (743; 1343') interconnecting the first portion (741; 1341') ​​and the second portion (742; 1342').

[0227] According to one embodiment, the connecting portion (743; 1343') may be formed at an angle with respect to the first deposition layer (720; 1320').

[0228] In one embodiment, the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) may not be located on the same plane as the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020).

[0229] According to one embodiment, the pattern layer (830; 1030) may include portions having different thicknesses depending on the region.

[0230] According to one embodiment, the pattern layer (830; 1030) may include a first pattern portion (832; 1032) formed on the first deposition layer (820; 1020), and a second pattern portion (833; 1033) at least partially formed on the first pattern portion. For example, at least one (833; 1032) of the first pattern portion and the second pattern portion may have a width (w2; w1) that becomes narrower in a setting direction parallel to the first deposition layer (820; 1020).

[0231] According to one embodiment, the remaining one (832) of the first pattern portion (832) and the second pattern portion (833) may include a plurality of pattern lines (832-1, 832-2). For example, the spacing (w3) between the plurality of pattern lines (832-1, 832-2) may become wider as they go in the setting direction.

[0232] According to one embodiment, the base (1610) may be tempered glass. For example, the case (1600) of the electronic device (101; 201) may include a barrier layer (1670) disposed between the base (1610) and the first deposition layer (1620).

[0233] According to one embodiment, the pattern layer (1230; 1330; 1330'; 1430) may be formed of a transparent or translucent material.

[0234] According to one embodiment, the cover layer (1450) may be formed of a transparent or translucent material. For example, the case (1400) of the electronic device (101; 201) may include a protective layer (1460) formed on the outer surface of the cover layer (1450).

[0235] According to one embodiment, at least one (1350; 1350'; 1550) of the pattern layer (1330; 1330'; 1530) and the cover layer (1350; 1350'; 1550) may be formed of a material having a higher reflectivity than the first deposition layer (1320; 1320'; 1520) and the second deposition layer (1340; 1340' 1540).

[0236] According to one embodiment, an electronic device (101; 201) may include a plurality of electronic components (120; 130; 150; 155; 160; 170; 176; 177; 178; 179; 180; 188; 189; 190; 196; 197), and a housing structure (210) surrounding at least a portion of a space in which the plurality of electronic components are provided. For example, the housing structure may include a base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010), a transparent or translucent first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) disposed on a first side of the base, a pattern layer (530; 831; 1031) disposed on a second side of the base or the first deposition layer. 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030), a second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) at least a portion of which is disposed in the hollow, and a cover layer (550; 750; 850, 1250; 1350; 1350'; 1450; 1550; 1650; 1750; It may include 1850; 1950; 2050).

[0237] According to one embodiment, a method of manufacturing a case (210; 211a; 211b; 500; 700; 800; 1000; 1100; 1200; 1300; 1300'; 1400; 1500; 1600; 1700; 1800; 1900; 2000) of an electronic device (101; 201) comprises depositing at least one first material on a first side of a base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010), thereby forming a transparent or translucent first deposition layer (520; An operation (2110) of forming a pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1720; 1820; 1920; 2020) having a hollow (531; 831; 1031) on the second side of the base or the first deposition layer, an operation (2120) of forming a pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) having a hollow (531; 831; 1031) on the second side of the base or the first deposition layer, a second deposition layer at least partially disposed in the hollow by depositing at least one second material on the first deposition layer It may include an operation (2130) of forming layers (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640), and an operation (2140) of forming a cover layer (550; 750; 850, 1250; 1350; 1350'; 1450; 1550; 1650; 1750; 1850; 1950; 2050) so that the second deposition layer is not exposed to the outside.

[0238] According to one embodiment, the operation (2130) of forming the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340' 1440; 1540; 1640; 1740; 1840; 1940; 2040)) may be performed after the operation (2120) of forming the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030). For example, the second deposition layer may be formed on a surface exposed to the hollow (531; 831; 1031) of the base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010) or the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) and the surface of the pattern layer.

[0239] According to one embodiment, the operation (2110) of forming the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) or the operation (2130) of forming the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) may include an operation of alternately depositing two materials having different refractive indices.

[0240] According to one embodiment, the operation (2120) of forming the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) may include an operation of printing a printing material on the second side of the base or the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020). For example, the thickness of the pattern layer formed by the printing material may be continuously reduced as it gets closer to the hollow (531; 831; 1031).

[0241] According to one embodiment, the operation (2120; 2200) of forming the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) comprises the operation (2210) of forming a pattern deposition layer by depositing a deposition material on the second side of the base or the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020), and forming a photosensitive layer by applying a photoresist material on the pattern deposition layer. It may include an operation (2220), an operation (2230) of exposing the photosensitive layer to light corresponding to the shape of the hollow (531; 831; 1031), an operation (2240) of removing a portion of the photosensitive layer corresponding to the hollow by applying a developer to the exposed photosensitive layer, an operation (2250) of forming the hollow in the pattern deposition layer through an etching process, and an operation (2260) of removing a remaining portion of the photosensitive layer.

[0242] According to one embodiment, the number of thin film layers constituting the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) may be less than the number of thin film layers constituting the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020).

[0243] According to one embodiment, a plurality of thin film layers (610, 620, 630, 640, 650, 660) can be formed by alternately depositing two materials.

[0244] According to one embodiment, the width (w1) of the plurality of pattern lines (832-1, 832-2) may become narrower in the setting direction parallel to the first deposition layer (820).

[0245]

[0246] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications to the details of the disclosure, including those included within the scope of the appended claims and their equivalents, may be made. Any of the embodiments described herein may be used in combination with any of the embodiments described herein.

Claims

1. In the case (210; 211a; 211b; 500; 700; 800; 1000; 1100; 1200; 1300; 1300'; 1400; 1500; 1600; 1700; 1800; 1900; 2000) of the electronic device (101; 201), Base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010); A first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) disposed on the first side of the base and being transparent or translucent; A pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) disposed on the second side of the base or on the first deposition layer and having a hollow (531; 831; 1031); A second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) at least part of which is disposed in the hollow; and From the above base, a cover layer (550; 750; 850, 1250; 1350; 1350'; 1450; 1550; 1650; 1750; 1850; 1950; 2050) disposed further away from the second deposition layer, A case for an electronic device.

2. In paragraph 1, At least one of the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) and the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) comprises a plurality of thin film layers (610, 620, 630, 640, 650, 660) having different refractive indices. A case for an electronic device.

3. In paragraph 1 or 2, The height from the base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010) to the end of the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) is equal to the height from the base to the end of the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; Higher than the height to the end of the part (541; 741; 841; 1241; 1341; 1341'; 1441; 1541; 1641; 1741; 1841; 1941; 2041) located in the hollow (531; 831; 1031) among (1740; 1840; 1940; 2040), Cases for electronic devices 4. In any one of paragraphs 1 to 3, The above second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) is A first portion (541; 741; 841; 1241; 1341; 1341'; 1441; 1541; 1641; 1741; 1841; 1941; 2041) disposed on the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020); and A second part (542; 742; 842; 1242; 1342; 1342'; 1442; 1542; 1642; 1742; 1842; 1942; 2042) disposed on the above pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030), Cases for electronic devices 5. In any one of paragraphs 1 to 4, The above second deposition layer (740; 1340') is It further includes a connecting portion (743; 1343') that interconnects the first portion (741; 1341') ​​and the second portion (742; 1342'), The above connecting portion (743; 1343') is formed to be inclined with respect to the first deposition layer (720; 1320'). A case for an electronic device.

6. In any one of paragraphs 1 to 5, The second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640; 1740; 1840; 1940; 2040) is not located on the same plane as the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020). A case for an electronic device.

7. In any one of paragraphs 1 to 6, The above pattern layer (830; 1030) includes a portion having a different thickness for each region. A case for an electronic device.

8. In any one of paragraphs 1 to 7, The above pattern layer (830; 1030) is A first pattern portion (832; 1032) formed on the first deposition layer (820; 1020); and At least a part of the second pattern portion (833; 1033) is formed on the first pattern portion, At least one of the first pattern portion and the second pattern portion (833; 1032) has a width (w2; w1) that becomes narrower as it goes in the setting direction parallel to the first deposition layer (820; 1020). A case for an electronic device.

9. In any one of paragraphs 1 to 8, The remaining one (832) of the first pattern portion (832) and the second pattern portion (833) includes a plurality of pattern lines (832-1, 832-2), The spacing (w3) of the above plurality of pattern lines (832-1, 832-2) becomes wider as it goes in the setting direction. A case for an electronic device.

10. In any one of paragraphs 1 to 9, The above pattern layer (1230; 1330; 1330'; 1430) is formed of a transparent or translucent material. A case for an electronic device.

11. In any one of paragraphs 1 to 10, The above cover layer (1450) is formed of a transparent or translucent material, The case (1400) of the above electronic device, Further comprising a protective layer (1460) formed on the outer surface of the cover layer (1450). A case for an electronic device.

12. In any one of paragraphs 1 to 11, At least one (1350; 1350'; 1550) of the pattern layer (1330; 1330'; 1530) and the cover layer (1350; 1350'; 1550) is formed of a material having a higher reflectivity than the first deposition layer (1320; 1320'; 1520) and the second deposition layer (1340; 1340' 1540). A case for an electronic device.

13. A method for manufacturing a case (210; 211a; 211b; 500; 700; 800; 1000; 1100; 1200; 1300; 1300'; 1400; 1500; 1600; 1700; 1800; 1900; 2000) of an electronic device (101; 201), An operation (2110) of forming a transparent or translucent first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1810; 1910; 2020) by depositing at least one first material on a first side of a base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010); An operation (2120) of forming a pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) having a hollow (531; 831; 1031) on the second side of the base or on the first deposition layer; An operation (2130) of forming a second deposition layer (540; 600; 740; 840, 1240; 1340; 1340'; 1440; 1540; 1640) by depositing at least one second material on the first deposition layer, at least a portion of which is disposed in the hollow; and Including an operation (2140) of forming a cover layer (550; 750; 850, 1250; 1350; 1350'; 1450; 1550; 1650; 1750; 1850; 1950; 2050) so that the second deposition layer is not exposed to the outside. A method for manufacturing a case for an electronic device.

14. In paragraph 13, The operation (2130) of forming the second deposition layer (540; 600; 740; 840, 1240; 1340; 1340' 1440; 1540; 1640; 1740; 1840; 1940; 2040)) is performed after the operation (2120) of forming the pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030). The second deposition layer is formed on the surface of the base (510; 710; 810; 1010; 1210; 1310; 1310'; 1410; 1510; 1610; 1710; 1810; 1910; 2010) or the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020) exposed to the hollow (531; 831; 1031), and on the surface of the pattern layer. A method for manufacturing a case for an electronic device.

15. In paragraph 13 or 14, The operation (2120) of forming the above pattern layer (530; 730; 830; 1030; 1230; 1330; 1330'; 1430; 1530; 1630; 1730; 1830; 1930; 2030) includes an operation of printing a printing material on the second side of the base or the first deposition layer (520; 600; 720; 820; 1020, 1220; 1320; 1320'; 1420; 1520; 1620; 1720; 1820; 1920; 2020), The thickness of the pattern layer formed by the printing material continuously decreases as it approaches the hollow (531; 831; 1031). A method for manufacturing a case for an electronic device.

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