Electronic device

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a housing including a front plate and a rear plate; a bracket disposed inside the housing; a first PCB disposed inside a first side surface of the housing, disposed between the bracket and the rear plate, and having a first temperature sensor mounted thereon; a second PCB disposed inside a second side surface of the housing opposite to the first side surface, and disposed between the bracket and the rear plate; a third PCB connected to the first PCB and the second PCB therebetween, disposed between the bracket and the rear plate, and having a second temperature sensor mounted thereon; and a heat dissipation member disposed between the bracket and the front plate, and disposed to at least partially overlap with the first PCB and a battery, wherein the second temperature sensor is disposed to face a portion of the heat dissipation member through a first opening of the bracket, the first opening corresponding to the battery.

Description

electronic devices

[0001] Embodiments of the present disclosure relate to an electronic device including a heat dissipation member.

[0002] Electronic devices (e.g., portable electronic devices) may include heat-generating components (e.g., application processors) that generate heat during operation and heat dissipation components to improve heat dissipation performance. For example, the heat dissipation components may include heat pipes or vapor chambers.

[0003] A heat dissipation member of an electronic device may be positioned adjacent to a heat-generating component. The heat dissipation member may serve to receive heat generated by the heat-generating component and to diffuse the heat to other areas of the electronic device where the heat-generating component is not positioned.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] Electronic devices can operate stably in an appropriate temperature environment. If the performance of the heat-dissipating component deteriorates, the heat-generating components of the electronic device (e.g., application processor) may experience a decline in performance due to self-heating. Therefore, a technology capable of detecting whether the performance of the heat-dissipating component is degraded may be required.

[0006] Embodiments of the present disclosure can provide an electronic device capable of monitoring whether the performance of a heat dissipating member is degraded.

[0007] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present invention pertains from the description below.

[0008] An electronic device according to one embodiment of the present disclosure includes a housing including a front plate and a rear plate, a bracket disposed inside the housing, a first PCB disposed on the inside of a first side of the housing, between the bracket and the rear plate, and having a first temperature sensor mounted thereon, a second PCB disposed on the inside of a second side of the housing opposite the first side, and between the bracket and the rear plate, a third PCB connected between the first PCB and the second PCB, and disposed between the bracket and the rear plate, and having a second temperature sensor mounted thereon, and a heat dissipation member disposed between the bracket and the front plate, and at least partially overlapping the first PCB and a battery, wherein the second temperature sensor may be disposed to face a portion of the heat dissipation member through a first opening of the bracket corresponding to the battery.

[0009] An electronic device according to one embodiment of the present disclosure includes a housing including a front plate and a rear plate, a bracket disposed inside the housing, a first PCB disposed inside the housing, between the bracket and the rear plate, and having a first temperature sensor mounted thereon, a second PCB connected to the first PCB and having a second temperature sensor mounted thereon, a heat dissipation member disposed between the bracket and the front plate and arranged to at least partially overlap the first PCB and a battery, and a processor configured to determine whether the heat dissipation member is abnormal based on first temperature data acquired through the first temperature sensor and second temperature data acquired through the second temperature sensor, wherein the second PCB may be disposed to at least partially overlap the battery and the heat dissipation member, and the second temperature sensor may be disposed to face a portion of the heat dissipation member corresponding to the battery.

[0010] According to embodiments of the present disclosure, a stable operating environment for an electronic device can be provided by monitoring whether the performance of a heat dissipation member is degraded.

[0011] In addition, various effects may be provided, either directly or indirectly, through this document.

[0012] Other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the accompanying drawings and the corresponding description.

[0013] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0014] FIG. 2 is a perspective view of the front of an electronic device (e.g., a mobile electronic device) according to various embodiments of the present disclosure.

[0015] FIG. 3 is a perspective view of the rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0016] FIG. 4 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0017] FIG. 5 is an exploded plan view of some components of an electronic device showing a heat dissipation member according to one embodiment.

[0018] Figure 6 is a cross-sectional view of an electronic device according to one embodiment.

[0019] FIG. 7 is a cross-sectional view showing a laminated structure of a portion of an electronic device including a middle region of a third PCB according to one embodiment.

[0020] FIG. 8 is a cross-sectional view showing a laminated structure of a portion of an electronic device having thermal grease placed on a first temperature sensor according to one embodiment.

[0021] FIG. 9 is a cross-sectional view showing a laminated structure of a portion of an electronic device having a thermal interface material (TIM) disposed on a first temperature sensor according to one embodiment.

[0022] FIG. 10 is a cross-sectional view illustrating a portion of an electronic device including a first side of the electronic device according to one embodiment.

[0023] FIG. 11 is a cross-sectional view illustrating a portion of an electronic device including a first side of the electronic device according to another embodiment.

[0024] FIG. 12 is a cross-sectional view illustrating a portion of an electronic device including a second side of the electronic device according to one embodiment.

[0025] Fig. 13 is a plan view schematically illustrating a heat dissipation member according to one embodiment.

[0026] Fig. 14 is a schematic plan view of a third PCB according to one embodiment.

[0027] FIG. 15 is a drawing illustrating a heat dissipation member according to one embodiment including a home corresponding to a first temperature sensor.

[0028] FIG. 16 is a drawing illustrating a thermocouple placed on a third PCB according to one embodiment.

[0029] Figure 17 is a flowchart illustrating the operation of an electronic device according to one embodiment.

[0030] Fig. 18 is a flowchart illustrating the operation of an electronic device according to another embodiment.

[0031] Each of the embodiments described with reference to the drawings of the present disclosure can be independently configured as a single embodiment. For example, the embodiments of FIG. 1 and FIG. 2 can each be independently configured. Each of the embodiments described with reference to the drawings of the present disclosure can operate independently as a single embodiment. For example, the embodiments of FIG. 1 and FIG. 2 can each operate independently.

[0032] At least two embodiments described with reference to the drawings of the present disclosure may be combined and configured. For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiment of FIG. 2 may be combined and configured. At least two embodiments described with reference to the drawings of the present disclosure may be combined and operated. For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiment of FIG. 2 may be combined and operated.

[0033] When at least two embodiments described with reference to the drawings of the present disclosure are combined, at least some of the components and / or at least some of the operations included in each embodiment may be omitted. For example, when the embodiment of FIG. 1 and the embodiment of FIG. 2 are combined, at least some of the components and / or at least some of the operations included in the embodiment of FIG. 1 may be omitted, and at least some of the components and / or at least some of the operations included in the embodiment of FIG. 2 may be omitted.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to various embodiments disclosed in the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0057] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a perspective view of the front of an electronic device (101) (e.g., a mobile electronic device) according to various embodiments of the present disclosure. FIG. 3 is a perspective view of the rear of the electronic device (101) of FIG. 1 according to various embodiments of the present disclosure.

[0063] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment, the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 1 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (210C) may be formed by a side bezel structure (218) (or “bracket”) that is coupled to the front plate (202) and the back plate (211) and comprises a metal and / or polymer. In some embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0064] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first side (210A) toward the back plate (211), at both ends of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 2), the back plate (211) may include a second region (210E) that extends seamlessly from the second side (210B) toward the front plate (202), at both ends of the long edge. In some embodiments, the front plate (202) or the back plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second side (210B). In embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as described above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0065] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an input device (203) (e.g., the input module (150) of FIG. 1), an audio output device (207, 214) (e.g., the audio output module (155) of FIG. 1), a sensor module (204, 219) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217), an indicator, and a connector (208). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0066] The display (201) may be exposed, for example, through an upper portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms a first area (210D) of a first surface (210A) and a side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first area (210D), and / or the second area (210E).

[0067] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (101) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0068] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor can be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and / or under the display (201). The electronic device (101) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0069] The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (101), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (101).

[0070] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In other embodiments, the electronic device (101) may not include some or all of the mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0071] The indicator may be disposed, for example, on the first surface (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (101) in the form of light (e.g., a light-emitting element). In another embodiment, the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0072] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0073] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through a through-hole perforated from the internal space of the electronic device (101) to the front plate (202) of the display (201). In another embodiment, some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, an area of ​​the display (201) facing the sensor module may not require a through-hole.

[0074] FIG. 4 is an exploded perspective view of the electronic device of FIGS. 2 and 3 according to various embodiments of the present disclosure.

[0075] The electronic device (101) of FIG. 4 may be at least partially similar to the electronic device (101) of FIGS. 2 and 3, or may include other embodiments of the electronic device.

[0076] Referring to FIG. 4, the electronic device (101) (e.g., the electronic device (101) of FIGS. 2 and 3) may include a side member (310) (e.g., the side bezel structure (218) of FIGS. 2 and 3), a first support member (311) (e.g., a bracket or support structure), a front cover (320) (e.g., the front plate (202) of FIG. 2), a display (330), a substrate (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear cover (380) (e.g., the rear plate (211) of FIG. 3). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any overlapping description will be omitted below.

[0077] The first support member (311) may be disposed inside the electronic device (101) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface.

[0078] According to one embodiment, a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1) may be mounted on the substrate (340). As described below with reference to FIG. 5, the substrate (340) may include a main PCB (e.g., the first PCB (410) of FIG. 5) and at least one sub-PCB (e.g., the second PCB (420) of FIG. 5). According to one embodiment, the main PCB (e.g., the first PCB (410) of FIG. 5) may be mounted with a processor (e.g., the processor (120) of FIG. 1)), and at least one sub-PCB (e.g., the second PCB (420) of FIG. 5) may be mounted with some other components of the electronic device (101) excluding the processor (e.g., the processor (120) of FIG. 1).

[0079] Hereinafter, in the description of various embodiments of the present disclosure, it will be described that the first support member (311) is a “bracket (310)” formed integrally with the side member (310).

[0080] In one embodiment, the bracket (310) may serve to support at least some components (e.g., the display (330)) of the electronic device (101) inside the housing (e.g., the housing (210) of FIG. 2). In one embodiment, components such as the front cover (320) or the display (330) may be arranged upwardly (e.g., in the z-direction) from the bracket (310).

[0081] According to one embodiment, a heat dissipation member (335) may be disposed between the bracket (310) and the display (330). For example, the heat dissipation member (335) may be disposed in an upper direction (e.g., in the z direction) of the bracket (310), and the display (330) may be disposed in an upper direction (e.g., in the z direction) of the heat dissipation member (335). The heat dissipation member (335) may be, for example, a heat pipe or a vapor chamber. The heat dissipation member (335) may serve to transfer heat generated from a heat-generating component (e.g., the processor (120) of FIG. 1) to another area of ​​the electronic device (101) where the heat-generating component is not disposed.

[0082] According to one embodiment, components such as a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), or a rear cover (380) may be placed downward (e.g., in the -z direction) from the bracket (310).

[0083] According to one embodiment, a PCB (345) (e.g., the third PCB of FIG. 5) having a temperature sensor (346) (e.g., the second temperature sensor (346) of FIG. 5) mounted thereon may be disposed between the bracket (310) and the battery (350). For example, the PCB (345) having the temperature sensor (346) mounted thereon may be disposed in a lower direction (e.g., in the -z direction) of the bracket (310), and components such as a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), or a rear cover (380) may be disposed in a lower direction (e.g., in the -z direction) of the PCB (345). The PCB (345) may serve to electrically connect a main PCB (e.g., the first PCB (410) of FIG. 5) and a sub PCB (e.g., the second PCB (420) of FIG. 5), as described below with reference to FIG. 5. A temperature sensor (346) is arranged on the PCB (345), and the temperature sensor (346) can detect the temperature of the heat dissipation member (335) through the first opening (312) formed in at least a portion of the bracket (310). For example, the temperature sensor (346) can face a portion of the heat dissipation member (335) through the first opening (312) formed in at least a portion of the bracket (310).

[0084] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as the substrate (340), for example. The battery (350) may be integrally disposed within the electronic device (101). In another embodiment, the battery (350) may be disposed so as to be detachable from the electronic device (101).

[0085] The antenna (370) may be positioned between the rear cover (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0086] Hereinafter, in the description with reference to FIGS. 5 to 18, the upper direction (e.g., the first direction (DR1) of FIG. 6) may mean the z direction of FIG. 4, and may be the front direction of the electronic device (101) in which the display (330) of the electronic device (101) is visible through the front cover (320). For example, the upper direction of a specific component (e.g., the bracket (310)) may mean the first direction (DR1) from the specific component.

[0087] Hereinafter, in the description with reference to FIGS. 5 to 18, the downward direction (e.g., the second direction (DR2) of FIG. 6) may mean the -z direction of FIG. 4 and may be the rear direction of the electronic device (101) in which the rear cover (380) of the electronic device (101) is visible. For example, the downward direction of a specific component (e.g., the bracket (310)) may mean the second direction (DR2) from the specific component.

[0088] FIG. 5 is an exploded plan view of some components of an electronic device (101) to show a heat dissipation member (335) according to one embodiment. FIG. 6 is a cross-sectional view of an electronic device (101) according to one embodiment. The electronic device (101) illustrated in FIGS. 5 and 6 may be at least partially similar to or substantially identical to the electronic device (101) illustrated in FIG. 4.

[0089] Referring to FIGS. 5 and 6, an electronic device (101) according to one embodiment includes a housing (210) (e.g., the housing (210) of FIG. 2) that includes a front plate (e.g., the front plate (202) of FIG. 2) and a back plate (e.g., the back plate (211) of FIG. 3). According to one embodiment, a bracket (310) is disposed inside the housing (210), and the bracket (310) can support a display (330) (e.g., the display (330) of FIG. 4).

[0090] According to one embodiment, a first PCB (410) may be disposed on the lower side of the bracket (310) and disposed inside the first side (631) of the housing (210) (e.g., the first side (631) of FIG. 6). The first PCB (410) may be disposed between the bracket (310) and the rear plate (e.g., the rear plate (211) of FIG. 3). The term first PCB (410) used in various embodiments of the present disclosure refers to a substrate on which the processor (120) (e.g., the processor (120) of FIG. 1) is mounted, and may be used interchangeably with terms such as main PCB.

[0091] According to one embodiment, at least one second PCB (420) may be disposed on the lower side of the bracket (310) and disposed inside the second side (632) of the housing (210) (e.g., the second side (632) of FIG. 6). The second PCB (420) may be disposed between the bracket (310) and the rear plate (e.g., the rear plate (211) of FIG. 3). The term second PCB (420) used in various embodiments of the present disclosure refers to a board on which at least some components of the electronic device (101) excluding the processor (120) (e.g., the processor (120) of FIG. 1) are mounted, and may be used interchangeably with terms such as sub PCB.

[0092] According to one embodiment, a battery (350) (e.g., battery (350) of FIG. 4) and an antenna (370) (e.g., antenna (370) of FIG. 4) may be placed in the lower direction of the bracket (310), for example, between the bracket (310) and the rear plate (e.g., rear plate (211) of FIG. 3).

[0093] According to one embodiment, the first PCB (410) and the second PCB (420) can be electrically (or operatively) connected to each other by a third PCB (345). The third PCB (345) can connect the first PCB (410) and the second PCB (420) in a downward direction of the bracket (310). For example, the third PCB (345) can be arranged to extend from a first space (641) of the housing (210) adjacent to the first side (631) of the electronic device (101) and adjacent to the first PCB (410) (e.g., the first space (641) of FIG. 6) to a second space (642) of the housing (210) adjacent to the second side (632) of the electronic device (101) and adjacent to the second PCB (420) (e.g., the second space (642) of FIG. 6). For example, the third PCB (345) may serve to electrically (or operatively) connect some components placed in the first space (641) of the housing (210) with some components placed in the second space (642) of the housing (210).

[0094] According to one embodiment, the third PCB (345) may be positioned between the bracket (310) and the rear plate (e.g., the rear plate (211) of FIG. 3). For example, the third PCB (345) may be positioned between the battery (350) and the bracket (310).

[0095] According to one embodiment, the third PCB (345) may be positioned between the bracket (310) and the front plate (e.g., the front plate (202) of FIG. 2). In this case, the third PCB (345) may be positioned between the heat dissipation member (335) and the display (330) (e.g., the display (330) of FIG. 4).

[0096] In one embodiment, the third PCB (345) may be a flexible circuit board.

[0097] According to one embodiment, a heat dissipation member (335) may be disposed above the bracket (310), and a display (330) (e.g., the display (330) of FIG. 4) and a front cover (320) (e.g., the front cover (320) of FIG. 4) may be disposed above the heat dissipation member (335). At least one heat dissipation sheet (611, 612) may be attached to a lower surface of the display (330). The heat dissipation member (335) may be disposed between the bracket (310) and the front plate (e.g., the front plate (202) of FIG. 2), and may be disposed to at least partially overlap the first PCB (410) and the battery (350). For example, the at least one heat dissipation sheet (611, 612) may include copper (Cu) or graphite, but the present invention is not limited thereto.

[0098] According to one embodiment, the heat dissipation member (335) may serve to transfer heat generated from the processor (120) mounted on the first PCB (410) to another area of ​​the electronic device (101). For example, the heat dissipation member (335) may serve to transfer heat generated around the first side (631) of the housing (210) (e.g., the first side (631) of FIG. 6) due to the processor (120) toward the second side (632) of the housing (210) (e.g., the second side (632) of FIG. 6).

[0099] According to one embodiment, a first temperature sensor (621) (e.g., the first temperature sensor (621) of FIG. 6) may be mounted on the first PCB (410). The first temperature sensor (621) may be positioned adjacent to the processor (120) and configured to detect a temperature around the processor (120). According to one embodiment, first temperature data detected by the first temperature sensor (621) may be transmitted to the processor (120). The first temperature sensor (621) may be a thermistor, but the present invention is not limited thereto.

[0100] According to one embodiment, a third temperature sensor (622) (e.g., the third temperature sensor (622) of FIG. 6) may be mounted on the second PCB (420). The third temperature sensor (622) may be positioned adjacent to a component of the electronic device (101) mounted on the second PCB (420) (e.g., the connector (208) of FIG. 3, the battery (350) of FIG. 4, the antenna (370) of FIG. 4) and configured to detect a temperature around the component. According to one embodiment, the third temperature data detected by the first temperature sensor (621) may be transmitted to the processor (120). The third temperature sensor (622) may be a thermistor, but the present invention is not limited thereto.

[0101] According to one embodiment, a second temperature sensor (346) may be mounted on the third PCB (345). According to one embodiment, the second temperature sensor (346) may be positioned to face a portion of the heat dissipation member (335) through the first opening (312) of the bracket (310) corresponding to the battery (350). The second temperature sensor (346) may be configured to detect the temperature of the heat dissipation member (335). According to one embodiment, the second temperature data detected by the second temperature sensor (346) may be transmitted to the processor (120). The third temperature sensor (622) may be a thermistor, but the present invention is not limited thereto. The second temperature sensor (346) may be positioned to be spaced apart from the first PCB (410) and the second PCB (420) in order to accurately detect the temperature of the heat dissipation member (335). For example, when the second temperature sensor (346) is placed adjacent to the first PCB (410), the second temperature data obtained through the second temperature sensor (346) may be more affected by the heat generation of the processor (120) mounted on the first PCB (410) than by the temperature of the heat dissipation member (335). Or, for example, when the second temperature sensor (346) is placed adjacent to the second PCB (420), the second temperature data obtained through the second temperature sensor (346) may be more affected by the heat generation of the component mounted on the second PCB (420) than by the temperature of the heat dissipation member (335). Accordingly, the second temperature sensor (346) may be placed in the middle region (601) (e.g., 601 in FIG. 6) of the third PCB (345) that is spaced apart from the first PCB (410) and the second PCB (420) and does not overlap with the first PCB (410) and the second PCB (420).

[0102] According to one embodiment, the electronic device (101) may form a first opening (312) in a portion of the bracket (310) so that a second temperature sensor (346) disposed in a lower direction of the bracket (310) can more accurately detect the temperature of a heat dissipation member (335) disposed in an upper direction of the bracket (310). For example, the second temperature sensor (346) may be disposed to face the heat dissipation member (335) disposed in an upper direction of the bracket (310) through the first opening (312) formed in a portion of the bracket (310). The second temperature sensor (346) may detect the temperature of a portion of the heat dissipation member (335) through the first opening (312) of the bracket (310).

[0103] The symbol 711 not described in FIG. 6 may be a protective resin (711) covering the second temperature sensor (346).

[0104] FIG. 7 is a cross-sectional view illustrating a laminated structure of a portion of an electronic device (101) including a middle region (601) of a third PCB (345) according to one embodiment. For example, FIG. 7 may be a drawing schematically illustrating a laminated structure of a portion of an electronic device (101) according to one embodiment illustrated in FIG. 6.

[0105] Referring to FIG. 7, an electronic device (101) according to one embodiment may include a second temperature sensor (346) mounted in a middle region (601) of a third PCB (345) and a protective resin (711) covering the second temperature sensor (346). The protective resin (711) may serve to protect the second temperature sensor (346) from external impact. According to one embodiment, an air gap (720) may be positioned between the protective resin (711) covering the second temperature sensor (346) and a heat dissipation member (335).

[0106] Fig. 8 is a cross-sectional view illustrating a laminated structure of a portion of an electronic device (101) in which thermal grease (712) is placed on a second temperature sensor (346) according to one embodiment. For example, Fig. 7 may be a drawing schematically illustrating a laminated structure of a portion of an electronic device (101) according to one embodiment illustrated in Fig. 6.

[0107] The electronic device (101) according to the embodiment of FIG. 8 has a difference from the embodiment of FIG. 7 in that the second temperature sensor (346) is covered with thermal grease (712). For example, the electronic device (101) may include thermal grease (712) covering the second temperature sensor (346) to increase heat transfer efficiency between the heat dissipation member (335) and the second temperature sensor (346).

[0108] FIG. 9 is a cross-sectional view illustrating a laminated structure of a portion of an electronic device (101) having a heat transfer material disposed on a second temperature sensor (346) according to one embodiment. For example, FIG. 7 may be a drawing schematically illustrating a laminated structure of a portion of an electronic device (101) according to one embodiment illustrated in FIG. 6.

[0109] The electronic device (101) according to the embodiment of FIG. 9 has a difference from the embodiment of FIG. 7 in that the second temperature sensor (346) is covered with a thermal interface material (TIM) (713). For example, the electronic device (101) may include a thermal interface material (713) covering the second temperature sensor (346) to increase heat transfer efficiency between the heat dissipation member (335) and the second temperature sensor (346). In the electronic device (101) according to one embodiment, when the thermal interface material (713) is disposed on the second temperature sensor (346), an air gap (e.g., the air gap (720) of FIG. 7) may be eliminated. For example, a lower surface of the thermal interface material (713) may be in direct contact with the second temperature sensor (346), and an upper surface of the thermal interface material (713) may be in direct contact with the heat dissipation member (335).

[0110] FIG. 10 is a cross-sectional view showing a portion of an electronic device (101) including a first side (631) of the electronic device (101) according to one embodiment.

[0111] The electronic device (101) illustrated in FIG. 10 may be at least partially similar to the electronic devices (101) illustrated in FIGS. 4 to 6. Hereinafter, only the features that differ from the embodiment of FIG. 10 will be described, and features not described in relation to FIG. 10 will be replaced with a description referring to FIG. 6.

[0112] The electronic device (101) according to the embodiment of FIG. 10, unlike the embodiment of FIG. 6, further includes a fourth temperature sensor (1011) that measures the temperature of the heat dissipation member (335) in a first space (641) adjacent to the first side (631) of the housing (210). For example, the electronic device (101) according to one embodiment may further include a fourth PCB (1010) that is arranged adjacent to the first PCB (410) in the lower direction of the bracket (310).

[0113] According to one embodiment, the fourth PCB (1010) is equipped with a fourth temperature sensor (1011), and the fourth temperature sensor (1011) may be positioned to face a portion of the heat dissipation member (335) through the second opening (313) of the bracket (310). The fourth temperature sensor (1011) may serve to detect the temperature of one end of the heat dissipation member (335) adjacent to the first PCB (410), unlike the second temperature sensor (346) that detects the temperature of the middle portion of the heat dissipation member (335) adjacent to the middle region (601) of the third PCB (345).

[0114] According to one embodiment, the fourth temperature data detected by the fourth temperature sensor (1011) may be transmitted to the processor (120).

[0115] FIG. 11 is a cross-sectional view showing a portion of an electronic device (101) including a first side (631) of the electronic device (101) according to another embodiment.

[0116] The electronic device (101) illustrated in FIG. 11 may be at least partially similar to the electronic device (101) illustrated in FIG. 10.

[0117] Below, only the features that are different from the embodiment of Fig. 11 are described, and features not described in relation to Fig. 11 are replaced with a description referring to Fig. 10.

[0118] The electronic device (101) according to the embodiment of FIG. 11 has a difference from the embodiment of FIG. 10 in that the fourth temperature sensor (1011) is mounted on a portion of the first PCB (410), and the fourth PCB (e.g., the fourth PCB (1010) of FIG. 10) is omitted. For example, the electronic device (101) may not include a separate fourth PCB (e.g., the fourth PCB (1010) of FIG. 10) for mounting the fourth temperature sensor (1011), and the fourth temperature sensor (1011) may be mounted on a portion of the first PCB (410). According to one embodiment, the electronic device (101) may further include a protective resin (1013) for protecting the fourth temperature sensor (1011) from external impact, and the protective resin (1013) may cover the fourth temperature sensor (1011).

[0119] FIG. 12 is a cross-sectional view showing a portion of an electronic device (101) including a second side (632) of the electronic device (101) according to one embodiment.

[0120] The electronic device (101) illustrated in FIG. 12 may be at least partially similar to the electronic devices (101) illustrated in FIGS. 4 to 6, FIG. 10, and FIG. 11.

[0121] Below, only the features that are different from the embodiment of Fig. 12 are described, and features not described in relation to Fig. 12 are replaced with a description referring to Fig. 6.

[0122] The electronic device (101) according to the embodiment of FIG. 12, unlike the embodiment of FIG. 6 or the embodiment of FIG. 10, further includes a fifth temperature sensor (1211) that measures the temperature of the heat dissipation member (335) in a second space (642) adjacent to the second side (632) of the housing (210). For example, the electronic device (101) according to one embodiment may further include a fifth PCB (1210) that is arranged adjacent to the second PCB (420) in the lower direction of the bracket (310). For example, the heat dissipation member (335) of the electronic device (101) may be arranged to extend to a portion of the second space (642) adjacent to the second PCB (420) in the upper direction of the bracket (310), and the fifth temperature sensor (1211) may serve to detect the temperature of the extended portion of the heat dissipation member (335).

[0123] According to one embodiment, the fifth PCB (1210) is equipped with a fifth temperature sensor (1211), and the fifth temperature sensor (1211) may be positioned to face a portion of the heat dissipation member (335) through the third opening (314) of the bracket (310). The fifth temperature sensor (1211) may serve to detect the temperature of the other end of the heat dissipation member (335) adjacent to the second PCB (420), unlike the second temperature sensor (346) that detects the temperature of the middle portion of the heat dissipation member (335) adjacent to the middle region (601) of the third PCB (345).

[0124] According to one embodiment, the fifth temperature data detected by the fifth temperature sensor (1211) may be transmitted to the processor (120).

[0125] Although not shown, the electronic device (101) may not include a separate fifth PCB (1210) for mounting the fifth temperature sensor (1211), and the fifth temperature sensor (1211) may be mounted on a portion of the second PCB (420).

[0126] Fig. 13 is a plan view schematically illustrating a heat dissipation member (335) according to one embodiment. For example, the heat dissipation member (335) illustrated in Fig. 13 may be at least partially similar to or substantially identical to the heat dissipation members (335) illustrated in Figs. 4 to 6 and Figs. 10 to 12.

[0127] Referring to FIG. 13, the heat dissipation member (335) may be a vapor chamber including at least one slit (1310). According to one embodiment, the heat dissipation member (335) is a vapor chamber, and a structure in which a refrigerant circulates inside the vapor chamber may be separated by the slit (1310). For example, the refrigerant inside the vapor chamber may be vaporized by absorbing heat to become a gaseous state, and may move from the heat source unit (1391) to the cooling unit (1392) through a first region located on one side of the slit (1310), as indicated by arrow 1312 in FIG. 13. The vaporized refrigerant in the vapor chamber may become a liquid state as it is cooled in the cooling unit (1392), and may move from the cooling unit (1392) to the heat source unit (1391) through a second region located on the other side of the slit (1310), as indicated by arrow 1311 in FIG. 13. By circulating this refrigerant, the vapor chamber according to one embodiment can quickly transfer heat generated from a specific component of the electronic device (101), such as the processor (120), to another area of ​​the electronic device (101).

[0128] In one embodiment, the heat dissipation member (335) is a vapor chamber, and the second temperature sensor (346) may be positioned to correspond to at least a portion of a cooling portion (1392) of the vapor chamber. For example, the second temperature sensor (346) may be configured to detect a temperature of the cooling portion (1392) of the vapor chamber.

[0129] According to one embodiment, the heat dissipation member (335) is a vapor chamber, and the second temperature sensor (346) can be positioned to correspond to at least a portion located between the heat source member (1391) and the cooling member (1392).

[0130] Fig. 14 is a schematic plan view of a third PCB (345) according to one embodiment. For example, the third PCB (345) illustrated in Fig. 13 may be at least partially similar to or substantially identical to the third PCB (345) illustrated in Figs. 4 to 6 and Figs. 10 to 12.

[0131] According to one embodiment, the third PCB (345) on which the second temperature sensor (346) is mounted may be a flexible circuit board and may include a power transmission line for supplying power to components of the electronic device (101). According to one embodiment, the second temperature sensor (346) may be positioned to be spaced apart from the power transmission line of the third PCB (345) by a specified distance or more. For example, the power transmission line of the third PCB (345) may generate heat while transmitting power. Therefore, the second temperature sensor (346) may be positioned to be spaced apart from the power transmission line of the third PCB (345) by a specified distance or more so as to be less affected by the heat generated from the power transmission line. For example, in the third PCB (345) illustrated in FIG. 14, 1420 represents a power transmission line, and the second temperature sensor (346) can be mounted on a part of the third PCB (345) that avoids the power transmission line (1420), such as 1410.

[0132] Fig. 15 is a drawing illustrating a heat dissipation member (335) according to one embodiment including a groove corresponding to a second temperature sensor (346). For example, the heat dissipation member (335) illustrated in Fig. 15 may be at least partially similar to the heat dissipation members (335) illustrated in Figs. 4 to 6 and Figs. 10 to 12.

[0133] Below, only the features that are different from the embodiment of Fig. 15 are described, and features not described in relation to Fig. 15 are replaced with a description referring to Fig. 6.

[0134] The electronic device (101) according to the embodiment of FIG. 15, unlike the embodiment of FIG. 6, has a difference in that a groove (1501) is formed in a portion of the heat dissipation member (335) facing the second temperature sensor (346). For example, the heat dissipation member (335) according to one embodiment may include a groove (1501) facing at least a portion of the second temperature sensor (346). In this case, at least a portion of the second temperature sensor (346) may be disposed inside the groove (1501) of the heat dissipation member (335). For example, the second temperature sensor (346) may be disposed to face the heat dissipation member (335) through the first opening (312) of the bracket (310), but may be disposed such that a portion of it is inserted into the groove (1501) of the heat dissipation member (335).

[0135] An electronic device (101) according to one embodiment can reduce the thickness of the electronic device (101) by including a groove (1501) in which a heat dissipation member (335) faces a second temperature sensor (346).

[0136] According to one embodiment, the electronic device (101) can further reduce the distance between the heat dissipation member (335) and the second temperature sensor (346) compared to the embodiment of FIG. 6 by including a groove (1501) in which the heat dissipation member (335) faces the second temperature sensor (346), and thus the second temperature sensor (346) can more accurately detect the temperature change of the heat dissipation member (335).

[0137] FIG. 16 is a drawing illustrating a thermocouple placed on a third PCB (345) according to one embodiment.

[0138] Below, only the features that are different from the embodiment of Fig. 16 are described, and features not described in relation to Fig. 16 are replaced with a description referring to Fig. 6.

[0139] An electronic device (101) according to an embodiment illustrated in FIG. 16 has a difference from the embodiment of FIG. 6 in that the second temperature sensor (346) is a thermocouple formed by a plurality of metal layers. According to various embodiments, the second temperature sensor (346) is not limited to being a thermistor and may be formed by a thermocouple (1601).

[0140] According to one embodiment, the second temperature sensor (346) may be a thermocouple (1601) implemented with a plurality of metal layers included in the third PCB (345), in which case the plurality of metal layers may include different metals.

[0141] In one embodiment, the second temperature sensor (346) may be a thermocouple (1601) implemented as a sheet attached to the third PCB (345), in which case the sheet may include a plurality of metal layers comprising different metals.

[0142] Fig. 17 is a flowchart illustrating the operation of an electronic device (101) according to one embodiment.

[0143] The operations illustrated in FIG. 17 may be performed by instructions stored in a memory (130) (e.g., the memory (130) of FIG. 1). For example, when the instructions are executed by a processor (120) (e.g., the processor (120) of FIG. 1), the instructions may cause the electronic device (101) (e.g., the electronic device (101) of FIG. 1) to perform the operations illustrated in FIG. 17.

[0144] At least some of the operations illustrated in FIG. 17 may be omitted. At least some of the operations mentioned with reference to other drawings in this disclosure may be additionally inserted before or after at least some of the operations illustrated in FIG. 17.

[0145] According to one embodiment, at least some of the operations illustrated in FIG. 17 may be performed sequentially.

[0146] According to one embodiment, at least some of the operations illustrated in FIG. 17 may be performed in parallel (simultaneously).

[0147] According to one embodiment, at least some of the operations illustrated in FIG. 17 may be performed with their order changed.

[0148] Hereinafter, the operation of an electronic device (101) according to one embodiment will be described with reference to FIG. 17.

[0149] In operation 1710, an electronic device (101) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may check a change in first temperature data acquired through at least one first temperature sensor (621) (e.g., the first temperature sensor (621) of FIG. 6). For example, the electronic device (101) may obtain first temperature data related to a first space (641) of a housing (210) in which a processor (120), which is a heat-generating component, is located, through the first temperature sensor (621). The electronic device (101) may obtain the first temperature data at a specified time interval and check a change in the first temperature data.

[0150] In operation 1720, the electronic device (101) according to one embodiment can check a change in second temperature data acquired through the second temperature sensor (346) (e.g., the second temperature sensor (346) of FIG. 6). For example, the electronic device (101) can acquire second temperature data related to a middle portion of a heat dissipation member (335) in a middle region (601) of the third PCB (345) relatively spaced apart from the processor (120), which is a heat-generating component, through the second temperature sensor (346). The electronic device (101) can acquire the second temperature data at a specified time interval and check a change in the second temperature data.

[0151] In operation 1730, the electronic device (101) according to one embodiment may calculate a difference between the amount of change in the first temperature data and the amount of change in the second temperature data. For example, the electronic device (101) may compare the amount of change ΔK1 of the first temperature data and the amount of change ΔK2 of the second temperature data with each other and calculate their difference value. For example, if the first temperature data related to the first space (641) of the housing (210) where the processor (120), which is a heat-generating component, is located rises by about 10 degrees during a specified period of time, the amount of change ΔK1 of the first temperature data may be 10. For example, if the second temperature data related to the middle portion of the heat-radiating member (335) rises by about 6 degrees during a specified period of time, the amount of change ΔK3 of the second temperature data may be 6. In this case, in operation 1730, the electronic device (101) according to one embodiment may calculate 4, which is “10-6”, as the difference value.

[0152] In operation 1740, the electronic device (101) according to one embodiment may store data indicating an abnormality (or performance degradation) of the heat dissipation member (335) (e.g., the heat dissipation member (335) of FIG. 6) in the memory (130) if the calculated difference value is greater than a specified value. A large difference between the amount of change in the first temperature data and the amount of change in the second temperature data may mean that the heat dissipation member (335) does not transfer heat generated from the heat-generating component well (e.g., performance degradation of the heat dissipation member (335)). The electronic device (101) according to one embodiment may store data indicating a performance degradation of the heat dissipation member (335) in the memory (130) if the difference between the amount of change in the first temperature data and the amount of change in the second temperature data is greater than a specified value. The data stored in the memory (130) can be used by the manufacturer's staff to determine whether the electronic device (101) is in normal operation when the user visits the manufacturer's service center for purposes such as repair of the electronic device (101).

[0153] Fig. 18 is a flowchart explaining the operation of an electronic device (101) according to another embodiment.

[0154] The operations illustrated in FIG. 18 may be performed by instructions stored in a memory (130) (e.g., the memory (130) of FIG. 1). For example, when the instructions are executed by a processor (120) (e.g., the processor (120) of FIG. 1), the instructions may cause the electronic device (101) (e.g., the electronic device (101) of FIG. 1) to perform the operations illustrated in FIG. 18.

[0155] At least some of the operations illustrated in FIG. 18 may be omitted. At least some of the operations mentioned with reference to other drawings in this disclosure may be additionally inserted before or after at least some of the operations illustrated in FIG. 18.

[0156] According to one embodiment, at least some of the operations illustrated in FIG. 18 may be performed sequentially.

[0157] According to one embodiment, at least some of the operations illustrated in FIG. 18 may be performed in parallel (simultaneously).

[0158] According to one embodiment, at least some of the operations illustrated in FIG. 18 may be performed with their order changed.

[0159] Hereinafter, the operation of an electronic device (101) according to one embodiment will be described with reference to FIG. 18.

[0160] In operation 1810, an electronic device (101) according to one embodiment may obtain first temperature data through a first temperature sensor (621) (e.g., the first temperature sensor (621) of FIG. 6). For example, the electronic device (101) may obtain first temperature data related to one side of a heat dissipation member (335) in a first space (641) of a housing (210) in which a processor (120), which is a heat-generating component, is located, through the first temperature sensor (621).

[0161] In operation 1810, the electronic device (101) according to one embodiment may obtain fourth temperature data through a fourth temperature sensor (1011) (e.g., the fourth temperature sensor (1011) of FIG. 10). For example, the electronic device (101) may obtain fourth temperature data related to one side of a heat dissipation member (335) in a first space (641) of a housing (210) where a processor (120), which is a heat-generating component, is located, through the fourth temperature sensor (1011).

[0162] In operation 1810, the electronic device (101) according to one embodiment may omit either one of the operation of acquiring the first temperature data and the operation of acquiring the fourth temperature data.

[0163] In operation 1820, the electronic device (101) according to one embodiment may obtain second temperature data through the second temperature sensor (346) (e.g., the second temperature sensor (346) of FIG. 3). For example, the electronic device (101) may obtain second temperature data related to a middle portion of a heat dissipation member (335) in a middle region (601) of the third PCB (345) relatively spaced apart from the processor (120), which is a heat-generating component, through the second temperature sensor (346). For example, the electronic device (101) may obtain second temperature data related to a middle portion of the heat dissipation member (335) corresponding to the battery (350).

[0164] In operation 1830, the electronic device (101) according to one embodiment may determine an abnormality of the heat dissipation member (335) (e.g., the heat dissipation member (335) of FIG. 6) if the difference between the first temperature data (or the fourth temperature data) and the second temperature data is greater than a specified value. The electronic device (101) may store data indicating the abnormality of the heat dissipation member (335) in the memory (130). The fact that the difference between the second temperature data and the first temperature data (or the fourth temperature data) is greater than the specified value may mean that the heat dissipation member (335) does not transfer heat generated from the heat-generating component well (e.g., a deterioration in the performance of the heat dissipation member (335). The electronic device (101) according to one embodiment may store data indicating a deterioration in the performance of the heat dissipation member (335) in the memory (130) if the difference between the second temperature data and the first temperature data (or the fourth temperature data) is greater than the specified value. The data stored in the memory (130) can be used by the manufacturer's staff to determine whether the electronic device (101) is in normal operation when the user visits the manufacturer's service center for purposes such as repair of the electronic device (101).

[0165] An electronic device according to one embodiment of the present disclosure includes a housing including a front plate and a rear plate, a bracket disposed inside the housing, a first PCB disposed on the inside of a first side of the housing, between the bracket and the rear plate, and having a first temperature sensor mounted thereon, a second PCB disposed on the inside of a second side of the housing opposite the first side, and between the bracket and the rear plate, a third PCB connected between the first PCB and the second PCB, and disposed between the bracket and the rear plate, and having a second temperature sensor mounted thereon, and a heat dissipation member disposed between the bracket and the front plate, and at least partially overlapping the first PCB and a battery, wherein the second temperature sensor may be disposed to face a portion of the heat dissipation member through a first opening of the bracket corresponding to the battery.

[0166] The second temperature sensor may be positioned so as not to overlap the first PCB and the second PCB.

[0167] It may further include a protective resin covering the second temperature sensor.

[0168] The second temperature sensor may further include a thermal interface material (TIM), wherein a lower surface of the thermal interface material may be in direct contact with the second temperature sensor, and an upper surface of the thermal interface material may be in direct contact with the heat dissipation member.

[0169] It may further include thermal grease covering the second temperature sensor.

[0170] The above heat dissipation member is a vapor chamber, and the second temperature sensor can be arranged to correspond to a cooling portion of the vapor chamber.

[0171] The electronic device further includes a third temperature sensor mounted on the second PCB, and a fourth PCB disposed on the inside of the first side of the housing and between the bracket and the back plate, on which a fourth temperature sensor is mounted, wherein the fourth temperature sensor can be disposed to face a portion of the heat dissipation member through a second opening of the bracket.

[0172] The heat dissipation member extends to the inside of the second side of the housing adjacent to at least a portion of the second PCB, and the electronic device is disposed on the inside of the second side of the housing, and further includes a fifth PCB disposed between the bracket and the back plate, and having a fifth temperature sensor mounted thereon, wherein the fifth temperature sensor can be disposed to face a portion of the heat dissipation member through a third opening of the bracket.

[0173] The electronic device further includes a processor and a memory storing instructions, wherein the instructions, when executed by the processor, cause the electronic device to check a change in first temperature data acquired through the first temperature sensor, check a change in second temperature data acquired through the second temperature sensor, calculate a difference between the amount of change in the first temperature data and the amount of change in the second temperature data, and, if the calculated difference is greater than a designated value, store data indicating an abnormality of the heat dissipation member in the memory.

[0174] The above instructions, when executed by the processor, may cause the electronic device to obtain second temperature data through the second temperature sensor, obtain fourth temperature data through the fourth temperature sensor, and store data indicating an abnormality of the heat dissipation member in the memory when a difference value between the first temperature data and the fourth temperature data is greater than a specified value.

[0175] The second temperature sensor may include a thermocouple formed by a plurality of metal layers included in the third PCB.

[0176] The second temperature sensor may include a thermistor.

[0177] The heat dissipation member includes a groove facing at least a portion of the second temperature sensor, and at least a portion of the second temperature sensor can be disposed inside the groove of the heat dissipation member.

[0178] The heat dissipation member may be a vapor chamber including at least one slit.

[0179] The third PCB is a flexible circuit board including a power transmission line for transmitting power, and the second temperature sensor can be positioned so as to be spaced apart from the power transmission line by a specified distance or more.

[0180] An electronic device according to one embodiment of the present disclosure includes a housing including a front plate and a rear plate, a bracket disposed inside the housing, a first PCB disposed inside the housing, between the bracket and the rear plate, and having a first temperature sensor mounted thereon, a second PCB connected to the first PCB and having a second temperature sensor mounted thereon, a heat dissipation member disposed between the bracket and the front plate and arranged to at least partially overlap the first PCB and a battery, and a processor configured to determine whether the heat dissipation member is abnormal based on first temperature data acquired through the first temperature sensor and second temperature data acquired through the second temperature sensor, wherein the second PCB may be disposed to at least partially overlap the battery and the heat dissipation member, and the second temperature sensor may be disposed to face a portion of the heat dissipation member corresponding to the battery.

[0181] The processor may be configured to check a change in the first temperature data, check a change in the second temperature data, calculate a difference between the amount of change in the first temperature data and the amount of change in the second temperature data, and if the calculated difference is greater than a specified value, store data indicating an abnormality in the heat dissipation member in the memory.

[0182] The processor may calculate a difference between the first temperature data and the second temperature data, and if the calculated difference is greater than a specified value, store data indicating an abnormality of the heat dissipation member in the memory.

[0183] The above heat dissipation member is a vapor chamber, and the second temperature sensor can be arranged to correspond to a cooling portion of the vapor chamber.

[0184] The second temperature sensor may be positioned so as to face the portion of the heat dissipation member through the first opening of the bracket corresponding to the battery.

Claims

1. In electronic devices, A housing including a front plate and a back plate; A bracket placed inside the housing; A first PCB disposed on the inside of the first side of the housing, between the bracket and the back plate, and having a first temperature sensor mounted thereon; A second PCB disposed on the inside of the second side of the housing opposite to the first side, and disposed between the bracket and the back plate; A third PCB connected between the first PCB and the second PCB, positioned between the bracket and the back plate, and having a second temperature sensor mounted thereon; and A heat dissipation member is disposed between the bracket and the front plate, and is disposed to at least partially overlap the first PCB and the battery. The second temperature sensor is positioned so as to face a portion of the heat dissipation member through the first opening of the bracket corresponding to the battery. Electronic devices.

2. In paragraph 1, The second temperature sensor is positioned so as not to overlap the first PCB and the second PCB. Electronic devices.

3. In paragraph 1, Further comprising a protective resin covering the second temperature sensor; Electronic devices.

4. In paragraph 1, Further comprising a thermal interface material (TIM) covering the second temperature sensor, The lower surface of the heat transfer material is in direct contact with the second temperature sensor, The upper surface of the above heat transfer material is in direct contact with the heat dissipation member, Electronic devices.

5. In paragraph 1, Further comprising thermal grease covering the second temperature sensor, Electronic devices.

6. In paragraph 1, The above heat dissipation member is a vapor chamber, The second temperature sensor is arranged to correspond to the cooling section of the vapor chamber. Electronic devices.

7. In paragraph 1, The above electronic device, a third temperature sensor mounted on the second PCB; and Further comprising a fourth PCB disposed on the inside of the first side of the housing, disposed between the bracket and the rear plate, and having a fourth temperature sensor mounted thereon; The fourth temperature sensor is positioned so as to face a portion of the heat dissipation member through the second opening of the bracket. Electronic devices.

8. In paragraph 1, The heat dissipation member extends to the inside of the second side of the housing adjacent to at least a portion of the second PCB, The electronic device is disposed on the inside of the second side of the housing, and further includes a fifth PCB disposed between the bracket and the back plate, and having a fifth temperature sensor mounted thereon. The fifth temperature sensor is positioned so as to face a portion of the heat dissipation member through the third opening of the bracket. Electronic devices.

9. In paragraph 7, The electronic device further includes a processor and a memory for storing instructions, The above instructions, when executed by the processor, cause the electronic device to: Check the change in the first temperature data obtained through the first temperature sensor, Check the change in the second temperature data obtained through the second temperature sensor, Calculate the difference between the change amount of the first temperature data and the change amount of the second temperature data, and If the calculated difference value is greater than a specified value, data indicating an abnormality of the heat dissipation member is stored in the memory. Electronic devices.

10. In paragraph 9, The above instructions, when executed by the processor, cause the electronic device to: Obtaining second temperature data through the second temperature sensor, Obtaining fourth temperature data through the fourth temperature sensor, and If the difference between the first temperature data and the fourth temperature data is greater than a specified value, data indicating an abnormality of the heat dissipation member is stored in the memory. Electronic devices.

11. In paragraph 1, The second temperature sensor includes a thermocouple formed by a plurality of metal layers included in the third PCB. Electronic devices.

12. In paragraph 1, The second temperature sensor includes a thermistor, Electronic devices.

13. In paragraph 1, The heat dissipation member includes a groove facing at least a portion of the second temperature sensor, At least a portion of the second temperature sensor is disposed inside the groove of the heat dissipation member, Electronic devices.

14. In paragraph 1, The above heat dissipation member is a vapor chamber including at least one slit, Electronic devices.

15. In paragraph 1, The above third PCB is a flexible circuit board including a power transmission line for transmitting power, The second temperature sensor is positioned so as to be spaced apart from the power transmission line by a specified distance or more. Electronic devices.

Images