Embedded rolling bearing having source-end parameter acquisition system, and manufacturing method for embedded rolling bearing

Abstract

An embedded rolling bearing having a source-end parameter acquisition system. The embedded rolling bearing comprises: a bearing (6), an accommodating recess being provided on an outer peripheral surface of the bearing (6); a thin-film sensor assembly (1), which is formed in the accommodating recess and comprises a PDC-ITO strain element (12), a PDC-Pt temperature element (13), a PDC-PZT piezoelectric thin film (14) and a plurality of bonding pads (11) respectively matching the PDC-ITO strain element (12), the PDC-Pt temperature element (13) and the PDC-PZT piezoelectric thin film (14); an acquisition microstructure (3), which is arranged in the accommodating recess and comprises a PCB and a functional chip formed on the PCB and electrically connected to the plurality of bonding pads (11) by means of a plurality of electrical interconnection sockets (2); a thermal-insulation potting adhesive (4), which is poured into the accommodating recess; and a metal cover (5). Further provided is a manufacturing method for the embedded rolling bearing having a source-end parameter acquisition system. The drawbacks of restrictions on the shape and size of conventional external sensors and collectors are avoided.

Description

An embedded rolling bearing with a source-end parameter acquisition system and a manufacturing method thereof TECHNICAL FIELD

[0001] The present application belongs to the technical field of rolling bearing test, and particularly relates to an embedded rolling bearing with a source-end parameter acquisition system and a manufacturing method thereof, and particularly relates to a rolling bearing with a film sensor and a micro-system acquisition module and a manufacturing method thereof. BACKGROUND

[0002] When performing bearing performance test or evaluation test, large rolling bearings used in large engineering machinery and the like need to be tested in situ and in real time as much as possible for physical quantities such as bearing temperature and deformation due to large local load, multiple running modes, and large internal force and thermal state changes. However, most of the sensors (such as temperature and vibration sensors) installed on the existing rolling bearing test machine are on the bearing seat or outside the bearing outer ring, and the signal acquisition capability is limited, and it is difficult to obtain the temperature and deformation inside the bearing. How to improve the in-situ or as close as possible in-situ sensing test capability of the tested bearing in the rolling bearing test is a hot spot in the current rolling bearing test technical field.

[0003] At present, rolling bearings with sensor monitoring function (also known as intelligent bearings) are the research focus of many rolling bearing industry enterprises and related research institutions. Most of the existing intelligent bearing technical solutions or application products are to externally place sensors or micro-nano sensing elements on the bearing end face, that is, rolling bearings with split sensing; there are also a small number of researches on embedding sensors into bearings (even embedding signal collectors into rolling bearing body structures, such as inner and outer rings of large bearings or large-size rolling bodies). Since the externally placed sensor type bearing usually needs additional installation space, it interferes with the conventional bearing seat or sealing structure; and the bearing mode is also limited, so this type of sensor externally placed rolling bearing can only be used in some specific scenarios.

[0004] Patents of rolling bearings with sensing function and signal processing function mainly include: CN106369058B (bearing sensor assembly with wireless temperature sensor), CN109141879B (rail condition monitoring sensor and method for detecting rail bearing condition), CN201310703303.5 (intelligent bearing monitoring system based on transient speed and method thereof), CN106769039B (mounting assembly suitable for monitoring rotating parts of rolling bearings), WO2018130217A1 (bearing state online monitoring system and method based on optical fiber vibration sensing) and CN108138840B (sensor assembly for bearings and bearing devices), etc. The acquisition method of bearing source end parameters in the above patents is based on external sensor. The sensor measures the state parameters outside the bearing, and the sensing signal enters the data acquisition and processing analysis link through signal transmission. The transmission link is long, the signal-to-noise ratio is low, the measurement error is large, and it is even difficult to accurately test the actual running state of the bearing.

[0005] With the rapid development of micro-nano sensing technology, ultra-large scale integrated circuit and computer hardware technology, people have developed thin film sensors with small size and powerful function, and high-performance highly integrated signal acquisition microsystem hardware, and realized long-life high-reliability application. The thin film sensor and the acquisition microsystem are both embedded in the large rolling bearing ring body to form a sensor-embedded integrated intelligent bearing, which can realize in-situ testing of rolling bearings, greatly enhance the signal acquisition capability, and effectively acquire the internal running state physical parameters (including temperature and deformation parameters, etc.) during the running of the bearing. However, how to prepare, arrange, connect wires, and reliably install and package the sensor and the acquisition microsystem in the small size slot structure on the rolling bearing ring is a technical difficulty in the field. TECHNICAL PROBLEM

[0006] The purpose of the present application is to solve the blank in the existing test technology and provide an embedded rolling bearing with source end parameter acquisition system to meet the online monitoring requirements of the rolling bearing test process with bearing in-situ sensing running parameter source end perception and data local processing function. TECHNICAL SOLUTION

[0007] To achieve the above purpose, the technical scheme adopted by the present application is: an embedded rolling bearing with source end parameter acquisition system, comprising:

[0008] a bearing, a containing groove is formed on the outer circumferential surface of the bearing;

[0009] The thin film sensor assembly formed in the accommodating groove comprises a PDC-ITO strain element, a PDC-Pt temperature element, a PDC-PZT piezoelectric film and a plurality of pads matched with the PDC-ITO strain element, the PDC-Pt temperature element and the PDC-PZT piezoelectric film respectively;

[0010] The collection microstructure arranged in the accommodating groove comprises a PCB board and a functional chip formed on the PCB board and electrically connected with the pads through a plurality of electrical interconnection sockets;

[0011] The heat insulation potting glue is filled in the accommodating groove;

[0012] The metal cover covers the surface of the heat insulation potting glue and is sealed with the surface of the bearing.

[0013] Optimally, each of the electrical interconnection sockets comprises an alumina wafer with a through hole in the middle, a conductive microneedle fixed in the through hole and a conductive sheet fixed on the surface of the alumina wafer and in contact with the conductive microneedle.

[0014] Optimally, the PDC-PZT piezoelectric film has two sets of matched interdigital electrodes.

[0015] Optimally, the functional chip comprises an MCU chip, an ADC conversion chip, an amplification chip, a communication chip and four power supply chips, and a plurality of conductive through holes are arranged at the edges of the PCB board.

[0016] Optimally, the metal cover is a copper cover comprising a copper plate and a plurality of electrically conductive through holes formed on the copper plate.

[0017] Another object of the present application is to provide a manufacturing method of the embedded rolling bearing with the source parameter collection system.

[0018] (a) forming an accommodating groove on the outer circumferential surface of the bearing;

[0019] (b) forming the thin film sensor assembly in the accommodating groove by a liquid phase direct writing process;

[0020] (c) collecting the functional chip on the PCB board to form the collection microstructure; and electrically connecting the thin film sensor assembly and the collection microstructure by the electrical interconnection sockets;

[0021] (d) filling the heat insulation potting glue into the accommodating groove;

[0022] (e) installing the metal cover on the heat insulation packaging glue, and edge sealing the metal cover by using a laser cladding process.

[0023] Optimally, in step (b), a liquid phase direct writing device is used to deposit precursor ceramic solutions containing Pt, ITO and PZT powders respectively in the accommodating grooves to form the PDC-ITO strain element, PDC-Pt temperature element and PDC-PZT piezoelectric film.

[0024] Further, in step (b), the liquid phase direct writing device comprises a worktable, a Y-direction moving guide rail installed on the upper surface of the worktable, a Y-direction control motor installed at the end of the Y-direction moving guide rail, an X-direction sliding guide rail movably installed on the Y-direction moving guide rail, an X-direction control motor installed at the end of the X-direction sliding guide rail, a transfer plate movably installed on the X-direction sliding guide rail, a sliding plate slidably installed on the transfer plate through a sliding rail, a Z-direction moving guide rail installed on the transfer plate and connected with the sliding plate, and a direct writing nozzle installed on the sliding plate.

[0025] Further, the direct writing nozzle comprises a micro-pipe, a discharging micro-rotating shaft penetrating through the micro-pipe and sealingly matched with the micro-pipe, a feeding pipe communicated with the discharging micro-rotating shaft, and a driving motor connected with the upper end of the discharging micro-rotating shaft for driving the operation of the discharging micro-rotating shaft.

[0026] Optimally, in step (c), when the electrical interconnection socket comprises conductive micro-needles, an alumina wafer and a conductive sheet, conductive glue is coated between the conductive sheet and the pads for bonding;

[0027] the conductive micro-needles and the alumina wafer are in interference fit,

[0028] In step (e), after edge sealing, the metal cover is further ground, polished and finished to make the outer peripheral surface of the bearing smooth. Beneficial effects

[0029] Thanks to the use of the above technical solution, the present application has the following advantages compared with the prior art: the present application has an embedded type rolling bearing of a source end parameter acquisition system, can realize highly integrated in-situ temperature, strain and vibration and other physical parameter sensing tests of a large rolling bearing and form a complete heterogeneous material combined structure with the bearing, maximally realizes normal installation of the bearing, greatly reduces the modification requirement of the surrounding structure, and avoids the shape and size constraints of the traditional external sensor and collector.

[0030] The application also lies in that the sensor can measure the bearing internal operation state parameters in situ as much as possible, reduces multiple links of signal transmission, improves the authenticity and signal-to-noise ratio of test signals, and can promote the progress of bearing test technology and intelligent bearing technology and products.

[0031] The application can realize reasonable assembly and packaging of the thin film sensor, the collection micro system and multiple components such as wires, and the performance, function and overall structure are safe and reliable. BRIEF DESCRIPTION OF DRAWINGS

[0032] Fig. 1 is a structural schematic diagram of an embedded rolling bearing with a source-end parameter collection system according to the application;

[0033] Fig. 2 is a structural schematic diagram of a liquid phase direct writing device used in manufacturing the embedded rolling bearing with the source-end parameter collection system according to the application;

[0034] Fig. 3 is a structural schematic diagram of a direct writing nozzle in the liquid phase direct writing device used in manufacturing the embedded rolling bearing with the source-end parameter collection system according to the application;

[0035] Fig. 4 is a structural schematic diagram of a thin film sensor assembly in the embedded rolling bearing with the source-end parameter collection system according to the application;

[0036] Fig. 5 is a structural schematic diagram of an electrical interconnection socket in the embedded rolling bearing with the source-end parameter collection system according to the application;

[0037] Fig. 6 is a structural schematic diagram of a collection micro structure in the embedded rolling bearing with the source-end parameter collection system according to the application;

[0038] Fig. 7 is a structural schematic diagram of the collection micro structure in the embedded rolling bearing with the source-end parameter collection system according to the application from another perspective;

[0039] Fig. 8 is a structural schematic diagram of a metal cover in the embedded rolling bearing with the source-end parameter collection system according to the application. Embodiment of the application

[0040] The application will be further described below in combination with the embodiments shown in the drawings.

[0041] The embedded rolling bearing with the source-end parameter collection system as shown in Fig. 1 mainly comprises a thin film sensor assembly 1, an electrical interconnection socket 2, a collection micro structure 3, a heat insulation potting glue 4, a metal cover 5 and a bearing 6.

[0042] The bearing 6 is a conventional rolling bearing (which can be selected according to actual needs, for example, it can be large or medium-sized) ; in order to install the thin film sensor assembly 1, the collection micro structure 3 and other structures, a receiving groove is usually formed on the outer circumferential surface of the bearing 6.

[0043] The thin film sensor assembly 1 is formed in the accommodating groove, including a PDC (precursor polymer ceramic)-ITO (indium tin oxide) strain element 12 (preferably a half-bridge thin film strain sensor), a PDC-Pt temperature element 13 (preferably a four-wire thin film thermal resistance temperature sensor), a PDC-PZT (lead zirconate titanate) piezoelectric thin film 14 (i.e. a thin film piezoelectric element), and a plurality of pads 11 (the aforementioned elements can also be referred to as sensors, and the pads 11 are corresponding sensor pads) corresponding to the PDC-ITO strain element 12, the PDC-Pt temperature element 13, and the PDC-PZT piezoelectric thin film 14, as shown in FIG. 4. The PDC-ITO strain element 12, the PDC-Pt temperature element 13, and the PDC-PZT piezoelectric thin film 14 are generally independent functional units (for measuring temperature, strain, and vibration physical parameters, respectively) and are connected to the acquisition microstructure 3 through corresponding pads 11. Specifically, three electrical interconnection sockets 2 (i.e. electrical interconnection sockets a, b, and c) correspond to the PDC-ITO strain element 12 (i.e. a first half-bridge thin film strain sensor); four electrical interconnection sockets 2 (i.e. electrical interconnection sockets d, e, f, and g) correspond to the PDC-Pt temperature element 13 (i.e. a first four-wire thin film thermal resistance temperature sensor); two electrical interconnection sockets 2 (i.e. electrical interconnection sockets h and i) correspond to the PDC-PZT piezoelectric thin film 14; four electrical interconnection sockets 2 (i.e. electrical interconnection sockets j, k, l, and m) correspond to the PDC-Pt temperature element 13 (i.e. a second four-wire thin film thermal resistance temperature sensor); and three electrical interconnection sockets 2 (i.e. electrical interconnection sockets n, o, and p) correspond to the PDC-ITO strain element 12 (i.e. a second half-bridge thin film strain sensor).

[0044] The acquisition microstructure 3 is also disposed in the accommodating groove, including a PCB board and functional chips formed on the PCB board and electrically connected to the pads 11 through the electrical interconnection sockets 2, so that the aforementioned functional chips are used to acquire corresponding physical parameters. The heat insulation potting glue 4 is filled in the accommodating groove, which can isolate the internal rolling body movement heat generation or external environmental heat transfer of the bearing 6, so that the electronic elements (i.e. functional chips) on the PCB board can work under the allowable temperature conditions (the required heat insulation glue thickness for the required safety temperature threshold of the bearing slotted surface to the electronic elements on the PCB can be calculated by the thermal module of the finite element analysis software). The metal cover 5 is covered on the surface of the heat insulation potting glue 4 and is sealed with the surface of the bearing 6, so as to realize the shell protection of the thin film sensor assembly 1 and the acquisition microstructure 3, and the rapid outward heat conduction of the slotted area of the bearing 6 can be realized; the edge of the metal cover 5 can be sealed by laser cladding technology, which greatly reduces the modification requirement of the surrounding structure, avoiding the shape and size constraints of traditional external sensors and collectors.

[0045] In the embodiment, each electrical interconnection socket 2, as shown in FIG. 5, comprises an alumina wafer 22 with a through hole in the middle, a conductive microneedle 21 fixed in the through hole (the conductive microneedle 21 has a contact end face away from the alumina wafer 22, which gradually decreases in diameter in the outward direction), and a conductive sheet 23 fixed on the surface of the alumina wafer 22 and in contact with the conductive microneedle 21. The conductive microneedle 21 is preferably fixed to the through hole of the alumina wafer 22 by interference fit (the alumina wafer 22 is in contact with the corresponding pad 11, and the conductive microneedle 21 is inserted into the conductive hole of the PCB board), which not only improves the electrical interconnection socket 2, but also has excellent heat conduction effect, thereby improving the reliability of the electrical connection between the thin film sensor assembly 1 and the collection microstructure 3. In the embodiment, the PDC-PZT piezoelectric film 14 has two sets of interdigital electrodes matched to improve the reliability of piezoelectric performance measurement.

[0046] The functional chip, as shown in FIGS. 6 and 7, comprises a matched MCU chip 31, an ADC conversion chip 32 (i.e. a static ADC chip), an amplification chip 33, a communication chip 34, four power supply chips (i.e. power supply chip 35, power supply chip 36, power supply chip 37 and power supply chip 38), and a plurality of conductive through holes 39 arranged at intervals at the edges of the PCB board. The basic principle framework is as follows: one MCU chip 31 is built-in with a 16-bit A / D conversion module, mainly used for data collection of the thin film piezoelectric element; the electrical interconnection sockets h and i of the thin film piezoelectric element are connected to the pins of the A / D conversion module in the MCU chip 31 after signal conditioning by the amplification chip 33 (i.e. the amplification chip 33 is connected to the electrical interconnection sockets h and i, and the MCU chip 31 respectively). The ADC conversion chip 32 (24 bits) adopts ADS124S08, mainly used for data collection of the PDC-Pt temperature element 13 and the PDC-ITO strain element 12 (at this time, the ADC conversion chip 32 is connected to the PDC-Pt temperature element 13 and the PDC-ITO strain element 12 respectively). The designed collection microstructure 3 provides ±5V input through the bearing seat (with external power supply), converts 3.3V as the digital power supply and reference voltage of the MCU chip 31 through the power supply chip 35; converts 5V voltage to +2.5V as the positive reference voltage of the ADC chip 32 through the power supply chip 36; converts 2.5V voltage to -2.5V as the negative reference voltage of the ADC chip 32 through the power supply chip 37; converts 5V voltage to -5V as the reference voltage of the amplification chip 33 through the power supply chip 38. The communication module 34 is used to transmit the digital signal of the MCU chip 31 to the data collection device in the bearing seat, i.e. the communication module 34 is also connected to the MCU chip 31 to receive the digital signal of the MCU chip 31 (it can be seen that the bearing seat is built-in with a data collection device and can be connected to an external power supply).

[0047] In the embodiment, the metal cover 5 is preferably a copper cover, which comprises a copper plate 51 and a plurality of electrically conductive vias 52 (as shown in FIG. 8) formed in the copper plate 51, facilitating rapid heat conduction in the bearing slotted space to improve the heat dissipation effect of the metal cover 5.

[0048] The manufacturing method of the embedded rolling bearing with the source parameter acquisition system comprises the following steps:

[0049] (a) Forming a receiving groove on the outer circumferential surface of the bearing 6 (at a specified position of the outer circumferential surface), which is achieved by conventional numerical control milling, heat treatment and grinding processing.

[0050] (b) Forming a thin film sensor assembly (1) in the receiving groove by liquid phase direct writing process;

[0051] In step (b), the precursor ceramic solution containing Pt, ITO and PZT powders respectively is deposited in the receiving groove by the liquid phase direct writing device 1' to correspondingly form the PDC-ITO strain element 12, the PDC-Pt temperature element 13 and the PDC-PZT piezoelectric thin film 14. Specifically, Pt, ITO and PZT powders are added to the existing conventional precursor ceramic solution respectively, and the temperature, strain and piezoelectric thin film sensors of the precursor ceramic material are prepared by liquid phase direct writing technology to be deposited between the electrode leads and then the deposited precursor ceramic is rapidly cross-linked and pyrolyzed by a laser module.

[0052] The liquid phase direct writing device 1' is shown in Fig. 2, which comprises a worktable, a Y-direction moving guide rail 16' installed on the upper surface of the worktable, a Y-direction control motor 12' installed at the end of the Y-direction moving guide rail 16', an X-direction sliding guide rail 11' movably installed on the Y-direction moving guide rail 16' (when the Y-direction control motor 12' works, the X-direction sliding guide rail 11' can be moved on the Y-direction moving guide rail 16'), an X-direction control motor 15' installed at the end of the X-direction sliding guide rail 11', a transfer plate movably installed on the X-direction sliding guide rail 11' (when the X-direction control motor 15' works, the transfer plate can be moved on the X-direction sliding guide rail 11'), a sliding plate slidably installed on the transfer plate through a sliding rail, a Z-direction moving guide rail 13' installed on the transfer plate and connected with the sliding plate (the Z-direction moving guide rail 13' has a Z-direction driving mechanism (such as a pneumatic cylinder, a hydraulic cylinder or a motor, etc.), so that the sliding plate can be lifted on the sliding rail), and a direct writing nozzle 14' installed on the sliding plate. The processing of the sensor pattern is realized through the cooperation of the X-direction control motor 15', the Y-direction control motor 12' and the Z-direction moving guide rail 13'. The direct writing nozzle 14' is shown in Fig. 3, which comprises a micro-pipe 142', a discharging micro-rotating shaft 143' penetrating through the micro-pipe 142' and sealingly matched with the micro-pipe 142', a feeding pipe 144' connected with the discharging micro-rotating shaft 143', and a driving motor 141' connected with the upper end of the discharging micro-rotating shaft 143' for driving the discharging micro-rotating shaft 143' to work. In this way, the discharging micro-rotating shaft 143' is rotated at high speed by the driving motor 141', and the precursor solution stored in the micro-pipe 142' is transported to the tip of the discharging micro-rotating shaft 143' through the Weissenberg effect, and then is deposited in the accommodating groove by printing.

[0053] (c) the functional chips are integrated on the PCB board to form the collection microstructure 3; the thin film sensor assembly 1 and the collection microstructure 3 are electrically connected through the electrical interconnection sockets 2; as described above, the collection microstructure 3 comprises a PCB board and functional chips formed on the PCB board and electrically connected with the plurality of pads 11 through the plurality of electrical interconnection sockets 2. When the electrical interconnection socket 2 comprises the conductive micro-needle 21, the alumina wafer 22 and the conductive sheet 23, the conductive sheet 23 and the pad 11 are bonded by coating conductive adhesive therebetween; the conductive micro-needle 21 and the alumina wafer 22 are interference fit.

[0054] The manufacturing process of the electrical interconnection socket 2 is as follows: an alumina ceramic wafer (i.e. the alumina wafer 22) is processed by a CO2 laser to form a through hole in the middle thereof; the conductive micro-needle 21 is placed in the through hole of the alumina ceramic, and is fixed by interference fit; conductive glue is applied on the back of the conductive sheet 23 (the side away from the alumina wafer 22) to increase the electrical conduction area with the solder pad 11; conductive glue is applied on the surface of the sensor solder pad, and the alumina wafer with the conductive micro-needle is adhered to the surface of the solder pad 11; the mating structure on the surface of the PCB of the collection microstructure 3 is designed to cooperate with the conductive micro-needle 21, so as to realize the leadless electrical interconnection between the collection microstructure 3 and the thin film sensor assembly 1.

[0055] (d) pouring the heat insulation packaging glue 4 into the accommodating groove to isolate the heat generated by the rolling body inside the bearing 6 or the heat from the external environment, so that the electronic elements on the PCB can work under the allowable temperature condition;

[0056] (e) installing the metal cover 5 on the heat insulation packaging glue 4 (realizing the rapid heat conduction in the slotted space of the bearing), and the metal cover 5 is edge sealed by using the laser cladding process; after the edge sealing, the metal cover 5 is ground and polished for finishing, so that the outer circumferential surface of the bearing 6 is smooth (satisfying the geometric size and precision requirements of the bearing 6), and the rolling bearing with the source end parameter sensing and data processing functions is manufactured.

[0057] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. An embedded rolling bearing with a source-end parameter acquisition system, characterized in that, Comprise: a bearing (6) with a receiving groove on its outer circumferential surface; a thin film sensor assembly (1) formed in the receiving groove, comprising a PDC-ITO strain element (12), a PDC-Pt temperature element (13), a PDC-PZT piezoelectric film (14), and a plurality of pads (11) respectively matched with the PDC-ITO strain element (12), the PDC-Pt temperature element (13) and the PDC-PZT piezoelectric film (14); a collection microstructure (3) disposed in the receiving groove, comprising a PCB board and functional chips formed on the PCB board and electrically connected with the pads (11) through a plurality of electrical interconnection sockets (2); a heat insulation potting glue (4) filled in the receiving groove; a metal cover (5) covering the surface of the heat insulation potting glue (4) and sealing with the surface of the bearing (6).

2. The inner race rolling bearing with a source-end parameter acquisition system according to claim 1, characterized in that: Each of the electrical interconnection sockets (2) comprises an alumina wafer (22) with a through hole in the middle, a conductive microneedle (21) fixed in the through hole, and a conductive sheet (23) fixed on the surface of the alumina wafer (22) and in contact with the conductive microneedle (21).

3. The inner race rolling bearing with a source-end parameter acquisition system according to claim 1, characterized in that: The PDC-PZT piezoelectric film (14) has two sets of interdigital electrodes matched.

4. The inner race rolling bearing with a source-end parameter acquisition system according to claim 1, characterized in that: The functional chip comprises an MCU chip (31), an ADC conversion chip (32), an amplification chip (33), a communication chip (34) and four power supply chips (35, 36, 37, 38) matched, and a plurality of conductive through holes (39) are arranged at the edges of the PCB board.

5. The inner race rolling bearing with a source-end parameter acquisition system according to claim 1, characterized in that: The metal cover (5) is a copper cover, which comprises a copper plate (51) and a plurality of electrically conductive through holes (52) formed on the copper plate (51).

6. The method of manufacturing an embedded rolling bearing with a source-end parameter acquisition system according to any one of claims 1 to 5, characterized in that, Comprise the following steps: (a) forming a receiving groove on the outer circumferential surface of the bearing (6); (b) forming the thin film sensor assembly (1) in the receiving groove by liquid phase direct writing process; (c) collecting functional chips on the PCB board to form the collection microstructure (3); the thin film sensor assembly (1) and the collection microstructure (3) are electrically connected by the electrical interconnection socket (2); (d) pouring the heat insulation potting glue (4) into the receiving groove; (e) installing the metal cover (5) on the heat insulation potting glue (4), and using laser cladding process to seal the edge of the metal cover (5).

7. The method of manufacturing an embedded rolling bearing with source-end parameter acquisition system according to claim 6, characterized in that: In step (b), the precursor ceramic solution containing Pt, ITO and PZT powder is deposited in the receiving groove by using a liquid phase direct writing device (1') to correspondingly form the PDC-ITO strain element (12), the PDC-Pt temperature element (13) and the PDC-PZT piezoelectric film (14).

8. The method of manufacturing an embedded rolling bearing with source-end parameter acquisition system according to claim 7, characterized in that: In step (b), the liquid-phase direct writing device (1') comprises a worktable, a Y-direction moving guide rail (16') mounted on the upper surface of the worktable, a Y-direction control motor (12') mounted at the end of the Y-direction moving guide rail (16'), an X-direction sliding guide rail (11') movably mounted on the Y-direction moving guide rail (16'), an X-direction control motor (15') mounted at the end of the X-direction sliding guide rail (11'), an adapter plate movably mounted on the X-direction sliding guide rail (11'), a sliding plate slidably mounted on the adapter plate through a sliding rail, a Z-direction moving guide rail (13') mounted on the adapter plate and connected with the sliding plate, and a direct writing nozzle (14') mounted on the sliding plate.

9. The method of manufacturing an embedded rolling bearing with source-end parameter acquisition system according to claim 8, characterized in that: The direct writing nozzle (14') comprises a micro pipe (142'), a discharging micro shaft (143') penetrating through the micro pipe (142') and sealingly matched with the micro pipe (142'), a feeding pipe (144') communicated with the discharging micro shaft (143'), and a driving motor (141') connected with the upper end of the discharging micro shaft (143') and used for driving the working of the discharging micro shaft (143').

10. The method of manufacturing an embedded rolling bearing with source-end parameter acquisition system according to claim 6, characterized in that: In step (c), when the electrical interconnection socket (2) comprises a conductive micro needle (21), an alumina wafer (22) and a conductive sheet (23), conductive adhesive is coated between the conductive sheet (23) and the pad (11) for bonding; The conductive micro needle (21) and the alumina wafer (22) are in interference fit, In step (e), after the edge sealing, the metal cover (5) is further ground and polished for finishing, so that the outer peripheral surface of the bearing (6) is smooth.

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