Heat pipe member, three-dimensional vapor chamber module, heat dissipation apparatus, and electronic device

Abstract

Provided in the embodiments of the present application are a heat pipe member, a three-dimensional vapor chamber module, a heat dissipation apparatus, an electronic device, and a manufacturing method for the heat pipe member. The heat pipe member is applied to a three-dimensional vapor chamber module, and comprises a pipe portion and an end portion, wherein one end of the pipe portion is an open end and the inner wall of the pipe portion is provided with a first capillary structure; the end portion is hermetically connected to the other end of the pipe portion, and the end portion and the pipe portion together constitute a first inner cavity; the inner wall and the outer wall of the end portion are respectively flat surfaces; and the inner wall of the end portion is provided with a second capillary structure. The technical solutions of the embodiments of the present application can improve the heat dissipation performance of the three-dimensional vapor chamber module, thus enabling more efficient heat dissipation of electronic devices.

Description

Heat pipe component, three-dimensional vapor chamber module, heat dissipation device, and electronic device

[0001] Cross-reference to Related Applications

[0002] This application claims priority to the Chinese Patent Application No. 202411246911.2, filed on September 5, 2024, and entitled "Heat pipe component, three-dimensional vapor chamber module, heat dissipation device, and electronic device", the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Embodiments of the present application relate to the field of electronic device heat dissipation technology, and in particular to a heat pipe component, a three-dimensional vapor chamber module, a heat dissipation device, an electronic device, and a method for manufacturing a heat pipe component. BACKGROUND

[0004] With the development trend of high integration in the electronic industry, the heat generation of electronic devices has increased dramatically. A three-dimensional vapor chamber module (3DVC) is a three-dimensional heat conduction structure designed by combining a heat pipe component, a vapor chamber component (VC), and a heat dissipation fin. How to improve the heat dissipation performance of the three-dimensional vapor chamber module and thus more efficiently dissipate heat from the electronic device is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0005] Embodiments of the present application provide a heat pipe component, a three-dimensional vapor chamber module, a heat dissipation device, an electronic device, and a method for manufacturing a heat pipe component to improve the heat dissipation performance of the three-dimensional vapor chamber module.

[0006] According to an aspect of the present application, a heat pipe component is provided for use in a three-dimensional vapor chamber module, comprising a pipe portion and an end portion, wherein one end of the pipe portion is an open end and the inner wall of the pipe portion has a first capillary structure, the end portion is sealingly connected to the other end of the pipe portion and forms a first inner cavity with the pipe portion, the inner wall and the outer wall of the end portion are flat surfaces respectively, and the inner wall of the end portion has a second capillary structure.

[0007] According to the heat pipe component, the inner wall and the outer wall of the end portion are both flat surfaces, which can be understood as surfaces without significant inclination, and without obvious elevation or reduction. In this way, at least the following technical effects can be achieved: on the one hand, the heat pipe component can be in more sufficient thermal contact with the heat dissipation fins, and the heat of the heat pipe component can be more efficiently dissipated through the heat dissipation fins, and the heat pipe component basically does not have an invalid section that cannot be dissipated through the heat dissipation fins; on the other hand, the inner wall of the end portion is a flat surface, which facilitates the manufacturing of the second capillary structure, so that the inner wall of the end portion is almost free of liquid-phase working medium, and thus the liquid-phase working medium can quickly and smoothly flow back to the inner cavity of the heat spreader component of the three-dimensional heat spreader module through the second capillary structure and the first capillary structure. Therefore, the heat pipe component according to the embodiments of the present application can effectively improve the heat dissipation performance of the three-dimensional heat spreader module when applied to the three-dimensional heat spreader module, and in turn, the electronic device can be more efficiently cooled.

[0008] In some embodiments, the flat surface is a plane or a gently curved surface. Depending on the actual manufacturing process of the heat pipe component, the end portion may present a plane or a gently curved surface after manufacturing. The gently curved surface has a small curvature and is also a flat surface, and thus the above technical effects can also be achieved.

[0009] In some embodiments, the edge of the flat surface has a chamfer. The chamfer can serve as a transition structure between the end portion and the pipe portion, which facilitates the manufacturing of the heat pipe component, the assembly of the heat pipe component and the heat dissipation fins, and reduces the risk of damage to the heat pipe component. Since the inner wall of the end portion is a flat surface as a whole, the manufacturing of the capillary structure is also facilitated.

[0010] In some embodiments, the maximum dimension of the end portion along the axial direction of the pipe portion is not greater than 3 mm. When the flat surface is a plane, the maximum dimension of the end portion along the axial direction of the pipe portion can be used to represent the thickness of the end portion. Designing the thickness of the end portion to be not greater than 3 mm makes the heat pipe component relatively thin, which is more conducive to heat dissipation. When the flat surface is a gently curved surface, the maximum dimension of the end portion along the axial direction of the pipe portion can be used to represent the protrusion height of the end portion relative to the other end of the pipe portion. Designing the protrusion height to be not greater than 3 mm makes the heat pipe component relatively flat, which is conducive to the manufacturing of the second capillary structure on the inner wall of the end portion, and can make the heat pipe component basically free of an invalid section that cannot be dissipated through the heat dissipation fins.

[0011] In some embodiments, the first capillary structure is uniformly distributed on the inner wall of the pipe portion, and the second capillary structure is uniformly distributed on the inner wall of the end portion. In this way, the liquid-phase working medium can more smoothly flow back to the inner cavity of the heat spreader component through the second capillary structure and the first capillary structure.

[0012] In some embodiments, the flat surface is orthogonal to the axial direction of the tube portion. In other embodiments, the flat surface forms an angle less than 90° with the axial direction of the tube portion. In the case that the inner wall and the outer wall of the end portion are designed as flat surfaces, the end portion can be designed according to the specific assembly structure of the heat pipe component and the vapor chamber component and the heat dissipation fin.

[0013] In some embodiments, the cross section of the tube portion is circular, elliptical, polygonal, or oblong. The cross section shape of the tube portion can be flexibly selected according to the design requirements of the three-dimensional vapor chamber module. In some embodiments, the cross section size of the tube portion can remain constant at any position in the axial direction.

[0014] According to an aspect of the present application, a three-dimensional vapor chamber module is provided, which includes a vapor chamber component, a heat dissipation fin, a heat pipe component of any of the preceding embodiments, and a two-phase working medium. The vapor chamber component has a second inner cavity, and the inner wall of the second inner cavity has a capillary structure. The heat dissipation fin is arranged on one side of the vapor chamber component and has an assembly hole, and the heat dissipation fin includes a plurality of fin units, wherein the assembly hole penetrates through the plurality of fin units. The heat pipe component is arranged in the assembly hole and connected with the vapor chamber component and the heat dissipation fin, respectively, wherein the tube portion matches the shape of the assembly hole, and the open end is in sealed communication with the second inner cavity. The two-phase working medium is filled in the first inner cavity and the second inner cavity and can be converted between the vapor phase and the liquid phase.

[0015] Based on the design scheme of the heat pipe component of the preceding embodiments of the present application, on the one hand, the heat pipe component can be in more sufficient thermal contact with the heat dissipation fin, so that the heat of the heat pipe component can be more efficiently dissipated through the heat dissipation fin, and on the other hand, the liquid phase working medium can quickly and smoothly flow back to the second inner cavity through the second capillary structure and the first capillary structure, so that the heat dissipation performance of the three-dimensional vapor chamber module is better, and the electronic device can be more efficiently cooled.

[0016] In some embodiments, the heat pipe component does not protrude out of the assembly hole, and the tube portion is connected with each of the plurality of fin units. In these embodiments, the heat pipe component substantially has no invalid section that cannot be cooled through the heat dissipation fin, the heat pipe component can be in sufficient thermal conduction with the heat dissipation fin, and since the closed end of the heat pipe component does not protrude out of the heat dissipation fin, the overall size of the three-dimensional vapor chamber module is less affected, so that the three-dimensional vapor chamber module has a more compact appearance and can be applied to a more narrow installation space.

[0017] In some embodiments, the axial direction of the tube portion is orthogonal to the surface of each of the plurality of fin units. In other embodiments, the axial direction of the tube portion forms an angle less than 90° with the surface of each of the plurality of fin units. In these embodiments, the tube portion can be in sufficient contact with the heat dissipation fin in the 360° circumferential direction.

[0018] In some embodiments, the heat pipe member is assembled with the assembly hole in an interference fit, so as to achieve reliable connection and sufficient heat conduction contact between the heat pipe member and the heat dissipation fin. In other embodiments, the heat pipe member is assembled with the assembly hole by welding, so as to not only achieve reliable connection and sufficient heat conduction contact between the heat pipe member and the heat dissipation fin, but also appropriately reduce the machining precision requirement for the heat pipe member and the assembly hole, thereby reducing the production cost.

[0019] In some embodiments, the heat dissipation fin includes a plurality of assembly holes, and the three-dimensional vapor chamber module includes a plurality of heat pipe members arranged in the plurality of assembly holes in a one-to-one correspondence. These embodiments employ a plurality of heat pipe members and arrange the plurality of heat pipe members in a two-dimensional direction, so as to make the three-dimensional vapor chamber module more efficient and uniform in heat dissipation.

[0020] According to an aspect of the present application, a heat dissipation device is provided for dissipating heat from an electronic device, the heat dissipation device including the three-dimensional vapor chamber module of any of the preceding embodiments, and a mounting member for fixing the three-dimensional vapor chamber module to the electronic device. In these embodiments, the heat dissipation device and the electronic device are independent products, and the two can be assembled or disassembled and separated through the mounting member. The heat dissipation device can be used with various electronic devices. Since the three-dimensional vapor chamber module has good heat dissipation performance, the heat dissipation device can more efficiently dissipate heat from the electronic device, so that the working performance and reliability of the heat-generating electronic component of the electronic device are good.

[0021] According to an aspect of the present application, an electronic device is provided, including a heat-generating electronic component, and the three-dimensional vapor chamber module of any of the preceding embodiments, wherein the three-dimensional vapor chamber module is used for dissipating heat from the heat-generating electronic component. In these embodiments, the three-dimensional vapor chamber module is assembled in the electronic device as a heat dissipation component of the electronic device. Since the three-dimensional vapor chamber module has good heat dissipation performance, the heat-generating electronic component can be more efficiently dissipated, so that the working performance and reliability of the heat-generating electronic component are good.

[0022] According to an aspect of the present application, a method for manufacturing the heat pipe member of the preceding embodiments is provided, including:

[0023] providing a pipe member, both ends of the pipe member being open, and the inner wall of the pipe member having a first capillary structure;

[0024] performing a pipe shrinking process on one end of the pipe member to obtain a pipe shrinking section, wherein the part of the pipe member that has not been subjected to the pipe shrinking process is a pipe portion of the heat pipe member;

[0025] performing a sealing welding process on the pipe shrinking section to close one end of the pipe member and obtain a welded end portion;

[0026] a flattening process is performed on the welded end portion to obtain a flattened end portion; and

[0027] a second capillary structure is formed on the inner wall of the flattened end portion to obtain an end portion of the heat pipe member.

[0028] The manufacturing method of the base application can be used to manufacture the heat pipe member described in the foregoing embodiments, which can be applied to the three-dimensional vapor chamber module described in the foregoing embodiments to effectively improve the heat dissipation performance of the three-dimensional vapor chamber module, and thus can more efficiently dissipate heat from the electronic device.

[0029] The specific process for forming the second capillary structure is not limited. In some embodiments, forming the second capillary structure on the inner wall of the flattened end portion includes: forming the second capillary structure on the inner wall of the flattened end portion by three-dimensional printing or powder metallurgy. BRIEF DESCRIPTION OF DRAWINGS

[0030] FIG. 1 is a schematic view of an axial cross-section structure of a heat pipe member according to some embodiments of the present application;

[0031] FIG. 2A is a schematic view of a cross-section structure of a three-dimensional vapor chamber module to which the heat pipe member according to some embodiments of the present application is applied;

[0032] FIG. 2B is a schematic view of a cross-section structure of the three-dimensional vapor chamber module according to some embodiments of the present application at B-B in FIG. 2A;

[0033] FIG. 3 is a schematic view of a cross-section structure of a three-dimensional vapor chamber module to which a heat pipe member according to some comparative examples of the present application is applied;

[0034] FIG. 4 is a schematic view of a cross-section structure of a three-dimensional vapor chamber module to which a heat pipe member according to some comparative examples of the present application is applied;

[0035] FIG. 5 is a schematic view of an axial cross-section structure of a heat pipe member according to some embodiments of the present application;

[0036] FIG. 6 is a schematic view of a cross-section structure of a three-dimensional vapor chamber module to which the heat pipe member according to some embodiments of the present application is applied;

[0037] FIG. 7 is a schematic view of a cross-section structure of the three-dimensional vapor chamber module according to some embodiments of the present application at B-B in FIG. 2A;

[0038] FIG. 8 is a schematic view of a heat dissipation device according to some embodiments of the present application applied to an electronic device;

[0039] FIG. 9 is a schematic view of an electronic device according to some embodiments of the present application;

[0040] FIG. 10 is a flowchart of a manufacturing method of a heat pipe member according to some embodiments of the present application;

[0041] Fig. 11 is a schematic view of a manufacturing process of a heat pipe component according to some embodiments of the present application.

[0042] Reference Signs:

[0043] Reference Signs of the Embodiments of the Present Application: 100 - three-dimensional vapor chamber module; 100a - evaporation side; 100b - condensation side; 10 - heat pipe component; 10a - open end; 10b - closed end; 20 - vapor chamber component; 30 - heat dissipation fin; 11 - pipe portion; 110 - first capillary structure; 12 - end portion; 13 - first inner cavity; 120 - second capillary structure; 121 - chamfer; 20a - lower cover plate; 20b - upper cover plate; 201a - recess; 21 - second inner cavity; 22 - capillary structure; 31 - assembly hole; 32 - fin unit; 33 - connecting structure; 200 - heat dissipation device; 300, 400 - electronic device; 130 - mounting member; 140 - heat generating electronic component; 410 - pipe member; 411 - shrunk tube section; 412 - welded end portion; 413 - flattened end portion; 500 - manufacturing method; S501-S505 - steps; 420 - shrunk tube mold; 421a - upper mold; 421b - lower mold.

[0044] Reference Signs of the Comparative Examples of the Present Application: 001a, 001b - three-dimensional vapor chamber module; 021a, 021b - vapor chamber component; 030a, 030b - heat dissipation fin; 010a, 010b - heat pipe component; L1, L2 - invalid section. DETAILED DESCRIPTION

[0045] In order to make the objects, technical solutions, and advantages of the present application clearer, the following will further describe the present application with reference to the accompanying drawings.

[0046] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in this specification and the appended claims, the singular forms "a," "an" and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise.

[0047] Reference to "one embodiment" or "an embodiment" or "the embodiment" or "the

[0048] With the development trend of high integration of electronic industry, the heat generation of electronic equipment increases sharply. Generally, a heat dissipation module needs to be set to dissipate heat for the electronic equipment, and a heat pipe and a vapor chamber are often used as heat dissipation components in the heat dissipation module.

[0049] The heat pipe transfers heat through evaporation and condensation of two-phase working medium in a fully enclosed vacuum pipe shell, and transfers liquid-phase working medium between the cold end and the hot end through capillary action of the capillary structure. The vapor chamber is a vacuum cavity with a capillary structure on the inner wall and filled with two-phase working medium, generally including an evaporation area and a condensation area. The liquid-phase working medium absorbs heat conducted by the heat source and is converted into vapor-phase working medium in the evaporation area, the vapor-phase working medium is condensed and dissipated in the condensation area and is converted into liquid-phase working medium, and the liquid-phase working medium is returned to the evaporation area through the capillary action of the capillary structure. Compared with the heat pipe, the vapor chamber can conduct heat in two dimensions, so it has higher heat dissipation efficiency.

[0050] The three-dimensional vapor chamber module is a heat dissipation module that combines the heat pipe component, the vapor chamber component and the heat dissipation fin to form a three-dimensional heat conduction structure. Compared with the vapor chamber, the three-dimensional vapor chamber module can conduct heat in three dimensions, so it has higher heat dissipation efficiency.

[0051] Some three-dimensional vapor chamber modules in the related art have difficulty in achieving sufficient heat conduction between the closed end of the heat pipe component and the heat dissipation fin, thereby restricting the further improvement of the heat dissipation efficiency of the three-dimensional vapor chamber module.

[0052] Therefore, the embodiments of the present application provide a heat pipe component, a three-dimensional vapor chamber module, a heat dissipation device, an electronic equipment and a manufacturing method of the heat pipe component to improve the heat dissipation performance of the three-dimensional vapor chamber module, thereby more efficiently dissipating heat for the electronic equipment.

[0053] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0054] As shown in FIGS. 1, 2A and 2B, FIG. 1 is a schematic view of an axial cross-sectional structure of a heat pipe component 10 according to some embodiments of the present application, FIG. 2A is a schematic view of a cross-sectional structure of the heat pipe component 10 applied to a three-dimensional vapor chamber module 100 according to some embodiments of the present application, and FIG. 2B is a schematic view of a cross-sectional structure of the three-dimensional vapor chamber module 100 at B-B in FIG. 2A according to some embodiments of the present application.

[0055] As shown in FIG. 1, the heat pipe member 10 is one of the components of the three-dimensional vapor chamber module 100, and its main structure includes a pipe portion 11 and an end portion 12. The pipe portion 11 has an open end 10a at one end thereof, and the inner wall of the pipe portion 11 has a first capillary structure 110. The end portion 12 is sealingly connected to the other end of the pipe portion 11, and the end portion 12, as a closed end 10b of the heat pipe member 10, together with the pipe portion 11 forms a first inner cavity 13, wherein the outer wall of the end portion 12 (hereinafter referred to as the outer wall) and the inner wall of the end portion 12 (hereinafter referred to as the inner wall) are flat surfaces, and the inner wall of the end portion 12 has a second capillary structure 120.

[0056] In the embodiments of the present application, the "flat surface" can be understood as a surface without significant inclination, and without obvious elevation or reduction, which is not limited to a plane, for example, it can also be a gently curved surface with small curvature, and can have a chamfer on the edge.

[0057] As shown in FIG. 2A, the three-dimensional vapor chamber module 100 of some embodiments of the present application mainly includes the heat pipe member 10, the vapor chamber member 20, the heat dissipation fin 30, and the two-phase working medium (not shown in the figure) of the above-mentioned embodiments. The vapor chamber member 20 has a second inner cavity 21, and the inner wall of the second inner cavity 21 has a capillary structure 22. The heat dissipation fin 30 is provided on one side of the vapor chamber member 20 and has an assembly hole 31. The heat dissipation fin 30 includes a plurality of fin units 32, and the assembly hole 31 penetrates through the plurality of fin units 32. The heat pipe member 10 is arranged in the assembly hole 31 and connected with the vapor chamber member 20 and the heat dissipation fin 30 respectively, the pipe portion 11 of the heat pipe member 10 matches the shape of the assembly hole 31, and the open end 10a of the heat pipe member 10 is sealingly communicated with the second inner cavity 21. The two-phase working medium is filled in the first inner cavity 13 and the second inner cavity 21, and can be converted between the vapor phase and the liquid phase with the change of temperature. The plurality of fin units 32 of the heat dissipation fin 30 can be kept apart from each other by a connecting structure 33. The two-phase working medium can be selected from, but not limited to, at least one of pure water, ethylene glycol, alcohol, ammonia, and the like.

[0058] Referring to FIG. 2A, the basic working principle of the three-dimensional vapor chamber module 100 is also illustrated, in which the dotted arrows are used to indicate the flow direction of the vapor-phase working medium, and the solid arrows are used to indicate the flow direction of the liquid-phase working medium. According to the phase change working condition of the two-phase working medium in the first inner cavity 13 and the second inner cavity 21, the three-dimensional vapor chamber module 100 can be divided into an evaporation side 100a and a condensation side 100b. The vapor chamber component 20 is arranged at the evaporation side 100a of the three-dimensional vapor chamber module 100, and the side of the vapor chamber component 20, on which the heat dissipation fins 30 and the heat pipe component 10 are not arranged, is used to contact an electronic device or a heat-generating electronic component (not shown in the figure) of the electronic device, so that the liquid-phase working medium is converted into the vapor-phase working medium after being evaporated and absorbing heat in the second inner cavity 21. The heat pipe component 10 and the heat dissipation fins 30 are arranged at the condensation side 100b of the three-dimensional vapor chamber module 100, in which the heat pipe component 10 dissipates heat by conducting heat to the heat dissipation fins 30, the vapor-phase working medium is converted into the liquid-phase working medium after being condensed and releasing heat in the first inner cavity 13, and the liquid-phase working medium flows back to the second inner cavity 21 through the first capillary structure 110 and the second capillary structure 120 after adhering to the wall surface of the first inner cavity 13, and then disperses in the two-dimensional direction through the capillary structure 22 of the wall surface of the second inner cavity 21.

[0059] As shown in FIG. 3, which is a sectional structure schematic diagram of a three-dimensional vapor chamber module 001a of one comparative example of the present application, in which the dotted arrows are used to indicate the flow direction of the vapor-phase working medium, and the solid arrows are used to indicate the flow direction of the liquid-phase working medium. The three-dimensional vapor chamber module 001a includes a vapor chamber component 021a, heat dissipation fins 030a, and a heat pipe component 010a. It can be seen that the heat pipe component 010a of the comparative example adopts a structure design different from the heat pipe component 10 of the above-mentioned embodiments of the present application, specifically, the closed end of the heat pipe component 010a is sealed by a press-fit process, so that the inner and outer walls thereof are not flat surfaces. In this way, on the one hand, the closed end cannot be in full contact with the heat dissipation fins 030a, resulting in an invalid section L1 of the heat pipe component 010a that cannot dissipate heat through the heat dissipation fins 030a, that is, a part of the heat dissipation area for heat conduction with the heat dissipation fins 030a is lost; on the other hand, since the inner wall of the closed end is not flat, it is difficult to manufacture a capillary structure in the process, as shown at B1 in FIG. 3, some condensed liquid-phase working medium is prone to accumulate at the closed end, so that it cannot smoothly flow back to the inner cavity of the vapor chamber component 021a through the capillary structure, and thus cannot normally perform a phase change cycle. These reasons restrict the improvement of the module heat dissipation efficiency to some extent.

[0060] As shown in FIG. 4, which is a cross-sectional structure diagram of a three-dimensional vapor chamber module 001b of another comparative example of the present application, the dashed arrows are used to roughly indicate the flow direction of the vapor-phase working medium, and the solid arrows are used to roughly indicate the flow direction of the liquid-phase working medium. Similarly, the three-dimensional vapor chamber module 001b includes a vapor chamber component 021b, a heat dissipation fin 030b, and a heat pipe component 010b. The closed end of the heat pipe component 010b is sealed by a press-fit process, so that the inner and outer walls thereof are not flat surfaces. As can be seen, there is also an ineffective section L2 that cannot be cooled by the heat dissipation fin 030b, and the liquid-phase working medium is prone to accumulate at the closed end (as shown at B2 in FIG. 4), in addition, since the closed end of the heat pipe component 010b protrudes from the heat dissipation fin 030b, it also leads to an increase in the overall size of the three-dimensional vapor chamber module 001b.

[0061] Referring back to FIG. 1, according to the heat pipe component 10 of the embodiment of the present application, the inner and outer walls of the end portion 12 are flat surfaces, so that the end portion 12 is flat. In this way, compared with the comparative examples shown in FIGS. 3 and 4, at least the following technical effects can be achieved:

[0062] On the one hand, the number of fin units 32 connected to the heat pipe component 10 is large, so that the heat pipe component 10 and the heat dissipation fin 30 can be in more sufficient thermal contact, and the heat of the heat pipe component 10 can be more efficiently dissipated through the heat dissipation fin 30. For example, compared with the comparative example shown in FIG. 3, the heat pipe component 10 can be in thermal contact with each fin unit 32 of the heat dissipation fin 30, and the heat pipe component 10 substantially does not have an ineffective section that cannot be cooled by the heat dissipation fin 30. For example, compared with the comparative example shown in FIG. 4, the heat pipe component 10 substantially does not have an ineffective section that cannot be cooled by the heat dissipation fin 30;

[0063] On the other hand, the inner wall of the end portion 12 is a flat surface, which facilitates the fabrication of the capillary structure (i.e., the second capillary structure 120), so that the liquid-phase working medium can quickly and smoothly flow back to the second inner cavity 21 through the second capillary structure 120 and the first capillary structure 110, and the inner wall of the end portion 12 is almost not prone to accumulate the liquid-phase working medium.

[0064] Therefore, the heat pipe component 10 of the embodiment of the present application applied to the three-dimensional vapor chamber module 100 can effectively improve the heat dissipation performance of the three-dimensional vapor chamber module 100, and in turn, can more efficiently dissipate heat from the electronic device.

[0065] In some embodiments of the present application, the first capillary structure 110 is uniformly distributed on the inner wall of the tube portion 11, and the second capillary structure 120 is uniformly distributed on the inner wall of the end portion 12, that is, the capillary structure is uniformly distributed on the wall of the first inner cavity 13. In the embodiments of the present application, the liquid-phase working medium returns to the second inner cavity 21 through the capillary action of the second capillary structure 120 and the first capillary structure 110, and is dispersed in two-dimensional directions through the capillary action of the capillary structure 22 of the second inner cavity 21.

[0066] The essence of capillary action is a surface phenomenon related to surface flow and liquid surface equilibrium shape caused by surface tension, such as the formation of a liquid drop or a curved liquid surface, the rising or falling of a liquid surface in a capillary hole, etc. When the surface tension of a liquid in a capillary structure is broken, the rising or moving can be generated by overcoming the gravity. The capillary structure is uniformly distributed on the wall of the first inner cavity 13, which is beneficial to fully exert the capillary action, and can not only avoid local accumulation of liquid-phase working medium, but also make the liquid-phase working medium return to the second inner cavity 21 more uniformly, quickly and smoothly.

[0067] In the embodiments of the present application, the main body material of the heat pipe component 10 except the first capillary structure 110 and the second capillary structure 120, that is, the outer layer material of the heat pipe component 10, is not limited in specific material type, and can be selected from copper, aluminum or other high-thermal-conductivity materials, etc. The first capillary structure 110 and the second capillary structure 120 of the heat pipe component 10, and the capillary structure of the uniform-temperature plate component 20 are not limited in specific material type, and can be selected from copper or other high-thermal-conductivity materials, etc. In addition, according to different specific processing techniques of the capillary structure, the specific structure form of the capillary structure can also have many kinds, for example, the capillary structure can be a three-dimensional printing capillary structure, a powder sintering capillary structure, a fine groove capillary structure, a multiple mesh capillary structure, etc.

[0068] In the embodiments of the present application, according to different actual manufacturing processes of the heat pipe component 10, the inner and outer walls of the end portion 12 can respectively be a plane or a gently curved surface, that is, the aforementioned "flat surface" can be a plane or a gently curved surface.

[0069] As shown in FIG. 1, in some embodiments, the inner and outer walls of the end portion 12 of the heat pipe component 10 are respectively a plane. As shown in FIG. 5, in another embodiments, the inner and outer walls of the end portion 12 of the heat pipe component 10 are respectively a gently curved surface. The curvature of the gently curved surface is small, which is also a kind of flat surface, and thus the above technical effects can also be obtained.

[0070] In some embodiments of the present application, as shown in the enlarged structure at A in FIG. 1, the edge of the inner wall and / or the outer wall of the end portion 12 can be designed with a chamfer 121 on the premise that the inner wall and the outer wall of the end portion 12 adopt a flat design, wherein the chamfer 121 can be a bevel chamfer or a round chamfer (a bevel chamfer is shown at the edge of the outer wall of the end portion 12 in FIG. 1). The chamfer can serve as a transition structure between the end portion 12 and the pipe portion 11, which not only facilitates the manufacture of the heat pipe component 10, but also facilitates the assembly of the heat pipe component 10 and the heat dissipation fins 30, and can reduce the risk of damage to the heat pipe component 10. In addition, since the inner wall of the end portion 12 is still a flat surface as a whole, the manufacture of the capillary structure is also facilitated.

[0071] In other embodiments of the present application, the flat surface of the inner wall and / or the outer wall of the end portion 12 can extend to the edge of the end portion 12, i.e., without being designed with a chamfer 121.

[0072] As shown in FIG. 1, in some embodiments of the present application, the maximum dimension c of the end portion 12 along the axial direction of the pipe portion 11 is not greater than 3 mm. In these embodiments, the maximum dimension c of the end portion 12 along the axial direction of the pipe portion 11 can be used to represent the thickness of the end portion 12, and the thickness of the end portion 12 is designed to be not greater than 3 mm, which is relatively thin and is more conducive to heat dissipation of the heat pipe component 10. In some embodiments, the thickness dimension c of the end portion 12 can be designed in combination with the thickness dimension of the pipe portion 11, and the specific value is not limited.

[0073] As shown in FIG. 5, when the flat surface is a flat arc surface, the maximum dimension of the end portion 12 along the axial direction of the pipe portion 11 can be used to represent the protrusion height of the end portion 12 relative to the end surface of the pipe portion 11, and the protrusion height is designed to be not greater than 3 mm, which is relatively flat, on the one hand facilitating the manufacture of the second capillary structure 120 on the inner wall of the end portion 12, and on the other hand, the heat pipe component 10 can basically not have an invalid section that cannot be dissipated by the heat dissipation fins 30.

[0074] In embodiments of the present application, the "axial direction of the pipe portion 11" can be understood as the extension direction of the geometric center line of the pipe portion 11, i.e., the extension direction shown by the dotted line in FIGS. 1 and 5. The heat pipe component 10 is usually made of a metal material with good thermal conductivity such as copper or aluminum, and since the outer wall of the end portion 12 is usually not in contact with the heat dissipation fins 30, a thinner thickness and a smaller protrusion height are more conducive to heat dissipation of the heat pipe component 10.

[0075] According to different assembly structure forms of the heat pipe component 10 and the vapor chamber component 20 and the heat dissipation fin 30, the inner wall and the outer wall of the end portion 12, i.e., the above-mentioned "flat surface", can be orthogonal to the axial direction of the pipe portion 11, or can be at an angle less than 90° with the axial direction of the pipe portion 11 (generally, the angle between a straight line and a plane is defined as being in the range of [0°, 90°]). As shown in FIG. 1, this embodiment illustrates the case where the flat surface is orthogonal to the axial direction of the pipe portion 11.

[0076] As shown in FIG. 2A, in some embodiments, the axial direction of the pipe portion 11 is orthogonal to the side surface of the vapor chamber component 20 close to the heat dissipation fin 30, and is also orthogonal to the surface of each fin unit 32 of the heat dissipation fin 30, so that the inner wall and the outer wall of the end portion 12 can be designed as flat surfaces orthogonal to the axial direction of the pipe portion 11.

[0077] As shown in FIG. 6, in some other embodiments of the present application, the axial direction of the pipe portion 11 is at an angle θ to the side surface of the vapor chamber component 20 close to the heat dissipation fin 30, and is also at an angle θ to the surface of each fin unit 32 of the heat dissipation fin 30, so that the inner wall and the outer wall of the end portion 12 can be designed as flat surfaces at an angle θ to the axial direction of the pipe portion 11.

[0078] It can be seen that, under the premise of designing the inner wall and the outer wall of the end portion 12 as flat surfaces, the end portion 12 can be designed correspondingly based on the specific assembly structure form of the heat pipe component 10 and the vapor chamber component 20 and the heat dissipation fin 30.

[0079] As shown in FIG. 2A and FIG. 6, in some embodiments of the present application, the plurality of fin units 32 of the heat dissipation fin 30 can be designed to be arranged in sequence in the direction away from the vapor chamber component 20. In these embodiments, the structural design of the heat pipe component 10 and the heat dissipation fin 30 is relatively simple, and it is also convenient for the processing and assembly of the components.

[0080] In the embodiments of the present application, the cross-sectional shape of the pipe portion 11 (i.e., the cross section perpendicular to the axial direction) is not limited, and can include but is not limited to a circular shape, an elliptical shape, a polygonal shape, or an oblong shape, etc. The cross-sectional size of the pipe portion 11 can remain constant at any position in the axial direction of the pipe portion 11. As shown in FIG. 2B, in some embodiments of the present application, the cross-sectional shape of the pipe portion 11 is designed as a circular shape. As shown in FIG. 7, in some other embodiments of the present application, the cross-sectional shape of the pipe portion 11 can also be designed as an oblong shape. These shapes facilitate the manufacture of the heat pipe component 10 and the heat dissipation fin 30 assembled therewith.

[0081] Referring to FIGS. 2A and 2B, some embodiments of the present application further provide a three-dimensional vapor chamber module 100, which can include the heat pipe member 10 of any of the above embodiments, and a vapor chamber member 20, a heat dissipation fin 30, and a two-phase working fluid (not shown in the figures). The vapor chamber member 20 has a second inner cavity 21, the wall of which is provided with a capillary structure 22. The heat dissipation fin 30 is arranged on one side of the vapor chamber member 20 and has an assembly hole 31, wherein the heat dissipation fin 30 includes a plurality of fin units 32, and the assembly hole 31 penetrates through the plurality of fin units 32. The heat pipe member 10 is arranged in the assembly hole 31 and connected with the vapor chamber member 20 and the heat dissipation fin 30, respectively. The pipe portion 11 of the heat pipe member 10 matches the shape of the assembly hole 31, and the open end of the heat pipe member 10 is in sealed communication with the second inner cavity 21. The two-phase working fluid is filled in the first inner cavity 13 and the second inner cavity 21, and can be converted between the vapor phase and the liquid phase with temperature change.

[0082] The basic working principle of the three-dimensional vapor chamber module 100 is as described above, and will not be repeated here. Based on the design scheme of the heat pipe member 10 of the above embodiments of the present application, on the one hand, the heat pipe member 10 can be in more sufficient thermal contact with the heat dissipation fin 30, so that the heat of the heat pipe member 10 can be more efficiently dissipated through the heat dissipation fin 30, and on the other hand, the liquid phase working fluid can quickly and smoothly flow back to the second inner cavity 21 through the second capillary structure 120 and the first capillary structure 110, so that heat conduction can be performed on the evaporation side 100a through the shell of the vapor chamber member 20 and the electronic device or the heat generating electronic component of the electronic device. Therefore, the three-dimensional vapor chamber module 100 has better heat dissipation performance and can more efficiently dissipate heat from the electronic device.

[0083] The specific structural form of the vapor chamber member 20 is not limited. As shown in FIG. 2A, it is an example of a vapor chamber member 20 that can be used in embodiments of the present application. The vapor chamber member 20 includes a lower cover plate 20a and an upper cover plate 20b connected in a sealed manner, which enclose the second inner cavity 21 of the vapor chamber member 20, and the wall of the second inner cavity 21 is uniformly distributed with the capillary structure 22. In some embodiments, as shown in FIG. 2A, the lower cover plate 20a can include a recess 201a for collecting the liquid phase working fluid.

[0084] In some embodiments of the present application, as shown in FIG. 2A, the open end of the heat pipe member 10 can be sealed and connected with the corresponding opening (not shown in the figures with lead lines and reference numerals) provided on the vapor chamber member 20, for example, by a welding process. In other embodiments of the present application, the open end of the heat pipe member can be inserted into the second inner cavity to a certain depth, which is not shown in the figures.

[0085] As shown in FIG. 2A, in some embodiments of the present application, the heat pipe member 10 does not protrude out of the assembly hole 31, and the pipe portion 11 of the heat pipe member 10 is connected with each of the plurality of fin units 32. That is, the heat pipe member 10 can be in thermal contact with each of the fin units 32 of the heat dissipation fin 30.

[0086] In these embodiments, the heat pipe member 10 has substantially no ineffective section that cannot dissipate heat through the heat dissipation fin 30, and the heat pipe member 10 can sufficiently conduct heat with the heat dissipation fin 30. Moreover, since the closed end of the heat pipe member 10 does not protrude out of the heat dissipation fin 30, the overall size of the three-dimensional vapor chamber module 100 is less affected, and thus the three-dimensional vapor chamber module 100 has a more compact profile and can be installed in a more confined space.

[0087] As shown in FIG. 2A, in some embodiments of the present application, the axial direction of the pipe portion 11 is orthogonal to the side surface of the vapor chamber member 20 close to the heat dissipation fin 30, which facilitates the assembly and connection of the pipe portion 11 and the vapor chamber member 20. As shown in FIG. 2A, in these embodiments, the axial direction of the pipe portion 11 is also orthogonal to the surface of each of the fin units 32 of the heat dissipation fin 30, and thus the pipe portion 11 can be in sufficient contact with the heat dissipation fin 30 in a 360° circumferential direction.

[0088] As shown in FIG. 6, in some other embodiments of the present application, the axial direction of the pipe portion 11 forms an angle θ of less than 90° with the side surface of the vapor chamber member 20 close to the heat dissipation fin 30, and thus the axial dimension of the pipe portion 11 can be increased compared to the orthogonal arrangement, and thus the contact area with the heat dissipation fin 30 can be increased. As shown in FIG. 6, in these embodiments, the axial direction of the pipe portion 11 also forms an angle of less than 90° with the surface of each of the fin units 32 of the heat dissipation fin 30, and thus the pipe portion 11 can be in sufficient contact with the heat dissipation fin 30 in a 360° circumferential direction.

[0089] In some embodiments of the present application, the heat pipe member 10 and the assembly hole 31 can be assembled with interference, so as to achieve reliable connection and sufficient thermal contact of the heat pipe member 10 and the heat dissipation fin 30.

[0090] In some other embodiments of the present application, the heat pipe member 10 and the assembly hole 31 can also be assembled by welding, which not only can achieve reliable connection and sufficient thermal contact of the heat pipe member 10 and the heat dissipation fin 30, but also can appropriately reduce the requirement for the machining precision of the heat pipe member 10 and the assembly hole 31, and thus reduce the production cost.

[0091] The number of heat pipe members 10 included in the three-dimensional vapor chamber module 100 is not limited in the embodiments. For example, the number of heat pipe members 10 can be one or more. In order to make the three-dimensional vapor chamber module 100 more efficient and uniform in heat dissipation, a plurality of heat pipe members 10 can be used, and the plurality of heat pipe members 10 can be arranged uniformly in a two-dimensional direction. As shown in FIGS. 2A and 2B, in some embodiments of the present application, the three-dimensional vapor chamber module 100 includes a plurality of heat pipe members 10, and the heat dissipation fin 30 includes a plurality of assembly holes 31, and the plurality of heat pipe members 10 are arranged one by one in the plurality of assembly holes 31.

[0092] The specific arrangement of the plurality of fin units 32 of the heat dissipation fin 30 is not limited. As shown in FIG. 2A, in some embodiments of the present application, the plurality of fin units 32 are arranged in sequence in a direction away from the vapor chamber member 20. The heat dissipation fin 30, as one of the assembly members of the three-dimensional vapor chamber module 100, can be integrally manufactured and assembled with the heat pipe member 10 and the vapor chamber member 20.

[0093] As shown in FIG. 8, the embodiments of the present application also provide a heat dissipation device 200 for dissipating heat of an electronic device 300, which includes the three-dimensional vapor chamber module 100 of any of the foregoing embodiments, and a mounting member 130 for fixing the three-dimensional vapor chamber module 100 to the electronic device 300.

[0094] The specific product type of the electronic device 300 is not limited, for example, it can be a mobile phone, a tablet computer, a notebook computer, a smart wearable device, a vehicle-mounted computer, a medical electronic device, a server, a router, a switch, etc., which usually includes a heat generating electronic component, such as a processor chip or a memory chip, etc.

[0095] The specific structure of the mounting member 130 is not limited, for example, it can be a paste glue (as shown in FIG. 8) for pasting and fixing the three-dimensional vapor chamber module 100 to the electronic device 300, a spring clamp (not shown in the drawings) for clamping and fixing the three-dimensional vapor chamber module 100 to the electronic device 300, or a magnetic member (not shown in the drawings) for magnetically attracting and fixing the three-dimensional vapor chamber module 100 to the electronic device 300, etc.

[0096] In these embodiments, the heat dissipation device 200 and the electronic device 300 are independent products, and can be assembled or separated by the mounting member 130, and the heat dissipation device 200 can be used with various electronic devices 300. Since the three-dimensional vapor chamber module 100 has good heat dissipation performance, the heat dissipation device 200 can more efficiently dissipate heat of the electronic device 300, so that the working performance and reliability of the heat generating electronic component of the electronic device 300 are better.

[0097] As shown in FIG. 9, the embodiments of the present application further provide an electronic device 400, which comprises a heat-generating electronic component 140, and the three-dimensional vapor chamber module 100 of any one of the preceding embodiments, wherein the three-dimensional vapor chamber module 100 is used to dissipate heat from the heat-generating electronic component 140.

[0098] The specific product type of the electronic device 400 is not limited, for example, the electronic device 400 can be a mobile phone, a tablet computer, a notebook computer, a smart wearable device, a vehicle-mounted computer, a medical electronic device, a server, a router, a switch, etc., which generally comprises a heat-generating electronic component, such as a processor chip or a memory chip, etc.

[0099] In these embodiments, the three-dimensional vapor chamber module 100 is assembled in the electronic device 400 as a heat dissipation component of the electronic device 400. Since the three-dimensional vapor chamber module 100 has better heat dissipation performance, the heat-generating electronic component 140 can be more efficiently dissipated, so that the working performance and reliability of the heat-generating electronic component 140 are better.

[0100] As shown in FIGS. 10 and 11, the embodiments of the present application further provide a manufacturing method 500 of a heat pipe component 10, wherein the heat pipe component 10 can be the heat pipe component 10 described in the preceding embodiments. The manufacturing method 500 comprises the following steps S501 to S505.

[0101] In step S501, a pipe 410 is provided, which is open at both ends and has a first capillary structure 110 on the inner wall.

[0102] In this step, the applicable pipe 410 is selected based on the specific structural design of the manufactured heat pipe component. For example, based on the specific structural design of the manufactured heat pipe component, the cross section of the pipe 410 can be circular, oval, polygonal, or oblong, etc. In the embodiment shown in FIG. 11, the cross section of the pipe 410 is circular, and a straight circular tube can be selected.

[0103] In step S502, a pipe shrinking process is performed on one end of the pipe 410 to obtain a pipe shrinking section 411, wherein the part of the pipe 410 that has not been subjected to the pipe shrinking process is the pipe part 11 of the heat pipe component 10.

[0104] The pipe shrinking process can use a pipe shrinking die 420, and the depth h and the slope angle a of the notch of the pipe shrinking die 420 can be designed according to experience or multiple adjustments to accurately shrink one end of the pipe 410.

[0105] In step S503, a sealing welding process is performed on the pipe shrinking section 411 to close one end of the pipe 410 and obtain a welded end part 412.

[0106] Since the pipe reducing process on one end of the pipe 410 cannot close the opening of the end, the sealing welding process can be continued on the reduced pipe segment 411, which can close the opening of the end on one hand, and can shorten the axial dimension of the reduced pipe segment 411 by using the welding molten state on the other hand. In this step, the thickness of the welded end portion 412 can be controlled by adjusting the welding temperature, pressure, time and other parameters of the welding equipment.

[0107] In step S504, the flattened process is performed on the welded end portion 412 to obtain the flattened end portion 413.

[0108] In this step, the flattened process can use a flattened die (which is a kind of stamping die) to extrude the welded end portion 412 by the upper die 421a and the lower die 421b to make the welded end portion 412 produce plastic deformation, so as to obtain the flattened end portion 413 with the required shape and size. After completing this step, the inner wall and the outer wall of the flattened end portion 413 are flat surfaces.

[0109] The specific structure of the flattened die can be designed based on the shape and size requirements of the heat pipe component 10, combined with experience or through multiple adjustments, for example, when the inner wall and the outer wall of the end portion 12 of the heat pipe component 10 form an angle less than 90° with the axis of the pipe portion 11, the structure of the flattened die also needs to be designed accordingly.

[0110] In step S505, the second capillary structure 120 is formed on the inner wall of the flattened end portion 413 to obtain the end portion 12 of the heat pipe component 10.

[0111] In the embodiments of the present application, the first capillary structure 110 and the second capillary structure 120 can be made of copper or other high thermal conductivity materials.

[0112] In this step S505, since the inner wall of the flattened end portion 413 is a flat surface, it is convenient to make the second capillary structure 120 more uniform. The specific process for forming the second capillary structure 120 is not limited. For example, the second capillary structure 120 can be formed on the inner wall of the flattened end portion 413 by three-dimensional printing or powder metallurgy process. Three-dimensional printing is a technology for manufacturing solid parts by layer-by-layer material accumulation according to three-dimensional data. In the three-dimensional printing process, low-power laser sintering metal powder can be used to form a loose porous capillary structure. Powder metallurgy is a process technology that uses metal powder or a mixture of metal powder and non-metal powder as raw material, fills powder, forms and sinter to form products.

[0113] According to the manufacturing method 500 of the embodiment of the present application, the heat pipe component 10 described in the foregoing embodiments can be manufactured, which is applied to the three-dimensional vapor chamber module 100 of the foregoing embodiments, so that the heat dissipation performance of the three-dimensional vapor chamber module 100 can be effectively improved, and the electronic device can be more efficiently cooled.

[0114] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat pipe member applied in a three-dimensional vapor chamber module, characterized in that, The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein a cross section of the tube portion is circular, elliptical, polygonal, or oblong.

8. A three-dimensional vapor chamber module, characterized by, The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein 13. A heat dissipation device for dissipating heat from electronic equipment, characterized in that, a cross section of the tube portion is circular, elliptical, polygonal, or oblong. The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein a cross section of the tube portion is circular, elliptical, polygonal, or oblong. The heat pipe member comprises: a tube portion having an open end and a first capillary structure on an inner wall thereof; and an end portion sealingly connected to the other end of the tube portion and forming a first inner cavity with the tube portion, wherein an inner wall and an outer wall of the end portion are flat surfaces, and the inner wall of the end portion has a second capillary structure. 2.The heat pipe member according to claim 1, wherein the flat surfaces are planar or gently curved. 3.The heat pipe member according to claim 1, wherein an edge of the flat surface has a chamfer. 4.The heat pipe member according to any one of claims 1 to 3, wherein a maximum dimension of the end portion in an axial direction of the tube portion is not greater than 3 mm. 5.The heat pipe member according to any one of claims 1 to 4, wherein the first capillary structure is uniformly distributed on the inner wall of the tube portion; and the second capillary structure is uniformly distributed on the inner wall of the end portion. 6.The heat pipe member according to any one of claims 1 to 5, wherein the flat surfaces are orthogonal to the axial direction of the tube portion; or the flat surfaces form an angle of less than 90° with the axial direction of the tube portion. 7.The heat pipe member according to any one of claims 1 to 6, wherein a cross section of the tube portion is circular, elliptical, polygonal, or oblong. The heat pipe member comprises: The three-dimensional vapor chamber module according to any one of claims 8-12; and A mounting member for fixing the three-dimensional vapor chamber module to the electronic device.

14. An electronic device, comprising: Comprising: A heat-generating electronic component; And The three-dimensional vapor chamber module according to any one of claims 8-12 for dissipating heat from the heat-generating electronic component.

15. A method of manufacturing a heat pipe member according to claim 1, characterized by, Comprising: Providing a tube member, both ends of the tube member being open, and an inner wall of the tube member having a first capillary structure; Performing a tube shrinking process on one end of the tube member to obtain a shrunk tube section, wherein a portion of the tube member that is not subjected to the tube shrinking process is the tube portion of the heat pipe member; Performing a sealing welding process on the shrunk tube section to close one end of the tube member and obtain a welded end portion; Performing a flattening process on the welded end portion to obtain a flattened end portion; and Forming a second capillary structure on an inner wall of the flattened end portion to obtain the end portion of the heat pipe member.

16. The method of manufacturing according to claim 15, wherein, Forming a second capillary structure on an inner wall of the flattened end portion, comprising: Forming a second capillary structure on an inner wall of the flattened end portion by three-dimensional printing or powder metallurgy process.

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