Radiator, heat dissipation system, and power conversion device

Abstract

Disclosed are a radiator and a power conversion device. The solution comprises: the radiator comprises a condenser and an evaporator, the condenser comprises a first manifold, a plurality of heat dissipation pipes, and a second manifold, and two ends of each of the plurality of heat dissipation pipes are in communication with the first manifold and the second manifold; the first manifold is arranged on a rear side plate of the evaporator and is in communication with a phase change cavity of the evaporator, and the phase change cavity is filled with a phase change medium; and heat dissipation mounting portions for mounting power devices are arranged on a front side plate of the evaporator. Since the condenser in the present disclosure is arranged at the rear side plate of the evaporator, and the heat dissipation mounting portions are located at the front side plate of the evaporator, the vapor flow direction when the phase change medium is vaporized is changed. On the one hand, the contact time between the vaporized phase change medium and the rear side plate can be increased, and on the other hand, the retention time of the vaporized phase change medium in the condenser can be increased. Heat exchange with the outside can be better performed, thereby further improving heat dissipation efficiency.

Description

A heat sink, a heat dissipation system and a power conversion device

[0001] The present disclosure claims priority to the following Chinese patent application, the entire contents of which are incorporated herein by reference. Application No. 2024222095949, filing date: September 09, 2024, applicant: Yangguang Power Co., Ltd., invention creation name: a heat sink, a heat dissipation system and a power conversion device. TECHNICAL FIELD

[0002] The present disclosure relates to a heat sink and a power conversion device. BACKGROUND

[0003] The existing power conversion devices such as inverters and power conversion systems (PCS) mainly use air cooling for heat dissipation. With the increase of power density of power conversion devices, the loss of power devices such as insulated gate bipolar transistors (IGBT) also increases significantly. Higher power density poses higher challenges to the heat dissipation design of power devices.

[0004] Therefore, how to improve the heat dissipation efficiency of power devices has become a technical problem to be solved by those skilled in the art. SUMMARY

[0005] The present disclosure provides a heat sink and a power conversion device to improve the heat dissipation efficiency of power devices.

[0006] In order to achieve the above-mentioned purpose, the present disclosure discloses the following technical solutions:

[0007] In a first aspect, the present disclosure provides a heat sink, wherein the heat sink comprises a condenser and an evaporator, the condenser comprises a first flow collecting cavity, a plurality of heat dissipation pipes and a second flow collecting cavity, the two ends of the plurality of heat dissipation pipes are communicated with the first flow collecting cavity and the second flow collecting cavity;

[0008] The first flow collecting cavity is arranged on the back side plate of the evaporator and is communicated with a phase change cavity of the evaporator, the phase change cavity is filled with a phase change medium; the front side plate of the evaporator is provided with a heat dissipation mounting portion configured to mount a power device.

[0009] In a second aspect, the present disclosure provides a power conversion device, comprising a box body, a power device, a magnetic device and a heat sink according to any one of the above, the power device is arranged on the heat dissipation mounting portion of the heat sink and located in the box body, and the magnetic device and the heat sink are arranged on the box body.

[0010] From the above technical solutions can be seen, the radiator of the present disclosure works, the power device is installed at the heat dissipation mounting portion, the heat generated thereby causes the phase change working medium in the phase change cavity to evaporate and absorb heat, the steam moves upward under the action of buoyancy through the first header cavity to the heat exchange pipe and the second header cavity, and releases heat and condenses in the first header cavity to the heat exchange pipe and the second header cavity, the working medium returns to the evaporator under the action of gravity, and so on. Since the condenser in the present disclosure is arranged at the rear side plate of the evaporator, and the heat dissipation mounting portion is located at the front side plate of the evaporator, the steam flow direction during vaporization of the phase change medium is changed, which can increase the contact time of the vaporized phase change medium with the rear side plate on the one hand, and increase the residence time of the vaporized phase change medium in the condenser on the other hand, so that the phase change medium can better exchange heat with the outside, thereby further improving the heat dissipation efficiency. In addition, the evaporator and the first header cavity of the condenser are directly connected, the structure is more compact, and the whole machine is arranged more flexibly and conveniently.

[0011] BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some examples or embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained from the provided drawings without creating laborious work, and the present disclosure can also be applied to other similar scenarios according to the provided drawings. Unless it is obvious from the language environment or otherwise stated, the same reference numerals in the drawings represent the same structure or operation.

[0013] FIG. 1 is a schematic view of a radiator according to an embodiment of the present disclosure;

[0014] FIG. 2a is a rear perspective view of the radiator shown in FIG. 1;

[0015] FIG. 2b is a front perspective view of the radiator shown in FIG. 1;

[0016] FIG. 3 is a cross-sectional view of an evaporator according to an embodiment of the present disclosure;

[0017] FIG. 4 is a schematic view of the evaporator shown in FIG. 1;

[0018] FIG. 5 is a cross-sectional view of another evaporator according to an embodiment of the present disclosure;

[0019] FIG. 6 is a perspective view of a condenser not installed in a radiator according to an embodiment of the present disclosure;

[0020] FIG. 7 is a top perspective view of the condenser shown in FIG. 1;

[0021] FIG. 8 is a cross-sectional view of a radiator according to an embodiment of the present disclosure;

[0022] Fig. 9 is a cross-sectional view of another heat sink according to an embodiment of the present disclosure;

[0023] Fig. 10 is a schematic view of a third heat sink according to an embodiment of the present disclosure;

[0024] Fig. 11 is a schematic view of a fourth heat sink according to an embodiment of the present disclosure;

[0025] Fig. 12 is a schematic view of a fifth heat sink according to an embodiment of the present disclosure;

[0026] Fig. 13 is a schematic view of a sixth heat sink according to an embodiment of the present disclosure;

[0027] Fig. 14 is a schematic view of a seventh heat sink according to an embodiment of the present disclosure;

[0028] Fig. 15 is a schematic view of an eighth heat sink according to an embodiment of the present disclosure;

[0029] Fig. 16 is a schematic view of a ninth heat sink according to an embodiment of the present disclosure;

[0030] Fig. 17 is a schematic view of a tenth heat sink according to an embodiment of the present disclosure;

[0031] Fig. 18 is a schematic view of an eleventh heat sink according to an embodiment of the present disclosure;

[0032] Fig. 19 is a schematic view of a twelfth heat sink according to an embodiment of the present disclosure;

[0033] Fig. 20 is a schematic view of a thirteenth heat sink according to an embodiment of the present disclosure;

[0034] Fig. 21 is a schematic view of a fourteenth heat sink according to an embodiment of the present disclosure;

[0035] Fig. 22 is a schematic view of a fifteenth heat sink according to an embodiment of the present disclosure;

[0036] Fig. 23 is a schematic view of a sixteenth heat sink according to an embodiment of the present disclosure;

[0037] Fig. 24 is a schematic view of a seventeenth heat sink according to an embodiment of the present disclosure;

[0038] Fig. 25 is a schematic view of a power conversion device according to an embodiment of the present disclosure;

[0039] Fig. 26 is a schematic view of another power conversion device according to an embodiment of the present disclosure;

[0040] Fig. 27 is a schematic view of a third power conversion device according to an embodiment of the present disclosure;

[0041] Fig. 28 is a schematic diagram of a fourth power conversion device according to an embodiment of the present disclosure;

[0042] Fig. 29 is a schematic diagram of a fifth power conversion device according to an embodiment of the present disclosure;

[0043] Fig. 30 is a schematic diagram of a sixth power conversion device according to an embodiment of the present disclosure;

[0044] Fig. 31 is a schematic diagram of a seventh power conversion device according to an embodiment of the present disclosure;

[0045] Fig. 32 is a schematic diagram of an eighth power conversion device according to an embodiment of the present disclosure;

[0046] Fig. 33 is a schematic diagram of a ninth power conversion device according to an embodiment of the present disclosure;

[0047] Fig. 34 is a schematic diagram of a tenth power conversion device according to an embodiment of the present disclosure;

[0048] Fig. 35 is a schematic diagram of an eleventh power conversion device according to an embodiment of the present disclosure;

[0049] Fig. 36 is a schematic diagram of a twelfth power conversion device according to an embodiment of the present disclosure;

[0050] Fig. 37 is a schematic diagram of a thirteenth power conversion device according to an embodiment of the present disclosure;

[0051] Fig. 37 is a schematic diagram of a thirteenth power conversion device according to an embodiment of the present disclosure;

[0052] 1 - condenser; 11 - first flow-collecting cavity, 11a - butt joint, 11b - jack; 12 - heat dissipation pipe; 13 - second flow-collecting cavity; 14 - fin; 15 - vent; 16 - partition plate;

[0053] 2 - evaporator, 2a - front side plate, 2b - rear side plate, 2c - plug-in part; 21 - phase-change cavity; 22 - heat dissipation mounting part; 23 - turbulence column; 24 - recessed part; 211 - first area; 212 - second area;

[0054] 3 - auxiliary pipe; 4 - compressor; 5 - electric control valve; 6 - pipeline; 7 - explosion venting guide pipe; 8 - flow guide plate; 31 - first box; 32 - second box; 51 - fan; 52 - air duct. DETAILED DESCRIPTION

[0055] The present disclosure will be further described below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related disclosure, and not to limit the disclosure. The described embodiments are only a part of the embodiments of the present disclosure, not all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present disclosure.

[0056] As described in the background, some of the heat dissipation units have low power generation efficiency.

[0057] A heat dissipation unit 10 as shown in FIG. 1, FIG. 2a and FIG. 2b, the heat dissipation unit 10 includes a condenser 1 and an evaporator 2, the condenser 1 includes a first header 11, a plurality of heat dissipation pipes 12 and a second header 13, the two ends of the plurality of heat dissipation pipes 12 are connected with the first header 11 and the second header 13; the first header 11 is arranged on the back side plate 2b of the evaporator 2 and is communicated with a phase change cavity 21 of the evaporator 2, the phase change cavity 21 is filled with phase change medium; the front side plate 2a of the evaporator 2 is provided with a heat dissipation mounting portion 22 for mounting a power device.

[0058] When the heat dissipation unit 10 of the present disclosure works, the power device 20 is mounted at the heat dissipation mounting portion 22, the heat generated by the power device 20 causes the phase change medium in the phase change cavity 21 to evaporate and absorb heat, the steam moves upward under the action of buoyancy through the first header 11 to the heat exchange pipe and the second header 13, and releases heat and condenses in the first header 11 to the heat exchange pipe and the second header 13, the working medium returns to the evaporator 2 under the action of gravity, and so on. Since the condenser 1 in the present disclosure is arranged at the back side plate 2b of the evaporator, and the heat dissipation mounting portion is arranged at the front side plate 2a of the evaporator, the steam flow direction during the phase change medium vaporization is changed, which can increase the contact time of the vaporized phase change medium with the back side plate 2b, and increase the residence time of the vaporized phase change medium in the condenser 1, so that the heat exchange with the outside is better, thereby further improving the heat dissipation efficiency. In addition, the evaporator is directly connected with the first header 11 of the condenser 1, the structure is more compact, and the whole machine arrangement is more flexible and convenient.

[0059] Since the plurality of heat dissipation pipes are connected with the back side plate 2b of the evaporator through the first header 11, during the assembly process of the heat dissipation pipes and the evaporator, the first header 11 and the heat dissipation pipes can be assembled into a modular structure according to the needs, and the assembled first header 11 and heat dissipation pipes can be selected according to the needs, and the first header 11 is connected to the back side plate 2b of the evaporator. Compared with the separate connection arrangement mode of the heat dissipation pipes, the assembly difficulty of the evaporator and the heat dissipation pipes is reduced, and the yield of the heat dissipation unit is improved.

[0060] The heat sink 10 of the present disclosure has a height direction Z, a length direction Y and a width direction X, and the height direction, the length direction and the width direction are perpendicular to each other. Since the heat sink 10 of the present disclosure utilizes the action of gravity, the height direction of the heat sink 10 is parallel to the direction of gravity in general use. The corresponding evaporator has a height direction, a length direction and a width direction, and the height direction, the length direction and the width direction of the evaporator correspond to the height direction, the length direction and the width direction of the heat sink respectively. And the condenser 1 has an axial direction, a length direction and a width direction.

[0061] The evaporator 2 has a front side plate 2a and a rear side plate 2b, the front side plate 2a is located on the evaporator side, and the rear side plate 2b is located on the condenser 1 side, wherein the front side plate 2a is configured to provide a heat dissipation mounting portion 22, and the rear side plate 2b is configured to provide the condenser 1.

[0062] Referring to FIGS. 3 and 4, the phase change cavity 21 is provided with a turbulence column 23, which can reduce the filling amount of the phase change medium and reduce the cost. Moreover, the turbulence column 23 can also play a role in connecting the front side plate 2a and the rear side plate 2b, thereby improving the connection strength between the front side plate 2a and the rear side plate 2b. In order to balance the filling amount and the heat exchange efficiency, the area corresponding to the heat dissipation mounting portion 22 of the phase change cavity 21 is a first area 211, and the remaining area is a second area 212. The cross-sectional area of the turbulence column 23 arranged in the first area 211 is smaller than the cross-sectional area of the turbulence column 23 arranged in the second area 212. The turbulence column 23 located in the second area 212 has a larger cross-sectional area and is better welded, which can improve the full welding rate between the turbulence column 23 and the front side plate 2a and the rear side plate 2b of the phase change cavity 21. The cross-sectional area refers to the area of the projection of the turbulence column 23 on the front side plate 2a.

[0063] Four first areas 211 are shown in the figure, and a plurality of turbulence columns 23 with smaller cross-sectional areas are arranged in matrix in the first area 211. The cross section of the turbulence column 23 in the figure is circular, and of course in some examples of the present disclosure, the cross section of the turbulence column 23 can also be polygonal, such as triangular, quadrangular, pentagonal, hexagonal, etc., which is not limited in the present disclosure.

[0064] Referring to FIG. 5, the area corresponding to the heat dissipation mounting portion 22 in the phase change cavity 21 is provided with a recess 24. By providing the recess 24, the distance between the phase change cavity 21 and the heat dissipation mounting portion 22 can be thinned, which is equivalent to shortening the heat exchange path, which can accelerate the heat dissipation of the heat dissipation mounting portion 22.

[0065] In order to adapt to different heat dissipation conditions, in the case that the number of heat dissipation mounting portions 22 is multiple, in the direction of gravity, the projection shape of the heat dissipation mounting portion 22 located at the upper side on the front side plate 2a is equal to the projection shape of the corresponding recessed portion 24 on the front side plate 2a, and the areas of the two are equal or unequal, for example, the projection of the heat dissipation mounting portion 22 located at the lower side on the front side plate 2a is smaller or larger than the projection of the corresponding recessed portion 24 on the front side plate 2a; or the projection of the heat dissipation mounting portion 22 located at the lower side on the front side plate 2a partially overlaps with the projection of the corresponding recessed portion 24 on the front side plate 2a. Or, the projection area of the heat dissipation mounting portion 22 located at the upper side on the front side plate 2a is equal to the projection area of the corresponding recessed portion 24 on the front side plate 2a.

[0066] In addition, the shape of the above-mentioned recessed portion 24 is rectangular, circular, polygonal, which will not be described in detail here.

[0067] Referring to FIGS. 6 and 7, one end of the first flow collecting cavity 11 close to the evaporator 2 includes an abutting portion 11a abutting with the rear side plate 2b of the evaporator 2, and the other end of the first flow collecting cavity 11 close to the heat dissipation pipe 12 is provided with a plurality of insertion holes 11b, one insertion hole 11b cooperating with one heat dissipation pipe 12.

[0068] The rear side plate 2b of the evaporator 2 is provided with an insertion portion 2c cooperating with the abutting portion 11a, one of the abutting portion 11a and the insertion portion 2c is a groove, and the other is a protrusion. In the illustration, the insertion portion 2c is a groove, and the abutting portion 11a is embedded into the groove and communicates with the cavity of the condenser 1. It can be seen that the abutting portion 11a of the first flow collecting cavity 11 of the present disclosure is embedded into the insertion portion 2c, and the processing difficulty is obviously reduced.

[0069] Referring to FIG. 7, the condenser 1 shown in FIG. 7 is columnar, plate-shaped or arc-shaped as a whole. The condenser 1 includes a first flow collecting cavity 11, a plurality of heat dissipation pipes 12 and a second flow collecting cavity 13, the first flow collecting cavity 11 and the second flow collecting cavity 13 are cuboid structures, the first flow collecting cavity 11 is connected with the evaporator 2, for example, welded; the plurality of heat dissipation pipes 12 connect the first flow collecting cavity 11 and the second flow collecting cavity 13, and the plurality of heat dissipation pipes 12 are arranged along the width direction in sequence. The heat dissipation pipe 12 is a circular pipe, a rectangular pipe or a flat pipe, and in a preferred embodiment, it is a flat pipe.

[0070] In order to further increase the heat dissipation efficiency of the heat dissipation pipe 12, when it is a flat pipe, the arrangement direction of the plurality of flat pipes coincides with the width direction of the flat pipe.

[0071] In order to further increase the heat dissipation efficiency of the heat dissipation pipe 12, the condenser 1 of the present disclosure further comprises heat dissipation fins 14, wherein the heat dissipation fins 14 are connected to adjacent heat dissipation pipes 12, and the extension direction of the heat dissipation fins 14 is perpendicular to the length direction of the heat dissipation pipe 12. By arranging the heat dissipation fins 14, the heat dissipation area of the heat dissipation pipe 12 can be increased, thereby improving the heat dissipation efficiency of the heat dissipation pipe 12, that is, improving the heat dissipation efficiency of the condenser 1.

[0072] In combination with FIG. 7, referring to FIG. 8, when the condenser 1 is a cuboid structure, the condenser 1 further comprises a ventilation port 15, wherein the ventilation port 15 penetrates through the condenser 1. The ventilation port 15 can penetrate through the condenser 1 along the height direction Z, or the length direction Y, and air can flow through the ventilation port 15 to cool the condenser 1.

[0073] In combination with FIG. 7, referring to FIG. 9, the heat dissipation pipe 12 further comprises a partition plate 16 arranged inside the heat dissipation pipe 12, wherein the partition plate 16 can divide the heat dissipation pipe 12 into two parts in the up-down direction or the left-right direction. For example, the heat dissipation pipe 12 is divided into two parts in the length direction Y, or the heat dissipation pipe 12 is divided into two parts in the height direction Z. The cross-sectional areas of the two parts can be equal or unequal, which is not limited here.

[0074] In combination with FIG. 1, FIG. 2a and FIG. 2b, referring to FIG. 10, in the heat dissipation device shown in the figure, the angle between the evaporator and the condenser 1 is 90°. As described above, the heat dissipation device of the present disclosure can significantly reduce the processing difficulty. In addition, in addition to the heat dissipation device with the above structure, the angle between the evaporator 2 and the condenser 1 can be adjusted according to the needs in the present disclosure to adapt to different application scenarios. Here, the angle between the evaporator 2 and the condenser 1 can be understood as the angle between the height direction Z of the evaporator 2 and the axis O1 of the condenser 1. Further, it can be the angle between the height direction Z of the evaporator 2 and the axis of the heat dissipation pipe 12 (the axis O1 of the condenser 1).

[0075] In some examples of the present disclosure, the angle adjustment is achieved by adjusting the angle β between the heat dissipation pipe 12 and the evaporator 2. Since the heat dissipation pipe 12 is directly integrated on the first header 11 in the embodiments of the present disclosure, the angle between the heat dissipation pipe 12 and the evaporator 2 can be adjusted by adjusting the angle of the first header 11 relative to the evaporator 2. As shown in FIGS. 10 and 11, the angle β between the condenser 1 and the evaporator can be adjusted by adjusting the angle α of the abutting portion 11a relative to the axis of the first header 11, i.e. β = α. Thus, when the angle between the evaporator 2 and the condenser 1 needs to be adjusted, the present disclosure can achieve the adjustment by adjusting the angle of the abutting portion 11a relative to the axis of the abutting portion 11a. Therefore, during the assembly process, the first header 11 only needs to be cut towards one end of the back plate 2b of the evaporator 2 according to the required angle, and the cutting is performed by tilting the first header 11 relative to the axis of the first header 11 to form the abutting portion 11a (the cutting line of the abutting portion 11a is O2 in the figure), without the need to cut each heat dissipation pipe 12. Thus, the processing difficulty of the heat sink is reduced.

[0076] In addition, another angle adjustment method is disclosed in the present application. For example, the first header 11 described above can be designed as a metal bellows, and the angle adjustment direction of the metal bellows is consistent with the angle adjustment direction between the height direction Z of the evaporator 2 and the axis (the axis O1 of the condenser 1) of the heat dissipation pipe 12.

[0077] As shown in FIGS. 12 and 13, in some embodiments, the heat sink 10 further comprises an auxiliary pipe 3, and the two ends of the auxiliary pipe 3 are connected to the phase change cavity 21 and the first header 11 or the phase change cavity 21 and the second header 13. By adding the auxiliary pipe 3, the flow of the phase change working medium is improved, and the heat dissipation effect is improved. The auxiliary pipe 3 can be a metal pipe or a plastic pipe in terms of material, and can be a flexible pipe or a rigid pipe in terms of flexibility.

[0078] The relative position between the heat dissipation mounting portion 22 for mounting the power device 20 and the condenser 1 is not required. In the direction of gravity, the heat dissipation mounting portion 22 can be lower than the position of the condenser 1, or higher than the position of the condenser 1, or in the projection of the ZY plane, the projection area of the power device 20 can also overlap with the projection area of the condenser 1.

[0079] As shown in FIG. 14, in some examples of the present disclosure, the heat sink 10 can comprise a compressor 4, and the first end of the compressor 4 is connected to the phase change cavity 21, and the second end of the compressor 4 is connected to the first header 11 or the second header 13. The compressor 4 is used to extract the phase change medium vapor from the phase change cavity 2121, and then compresses it into the first header 1111 for heat dissipation, thereby achieving forced cooling, and the cooling efficiency can be improved relative to the natural circulation.

[0080] The first end of the compressor 4 is communicated with the phase change cavity 21 through the pipeline 6, and the second end of the compressor 4 is directly communicated with the first flow collecting cavity 11 or the second flow collecting cavity 13; or the first end of the compressor 4 is directly communicated with the phase change cavity 21, and the second end of the compressor 4 is communicated with the first flow collecting cavity 11 or the second flow collecting cavity 13 through the pipeline 6.

[0081] In order to further improve the cooling efficiency of the radiator 10, a throttling valve is arranged on the auxiliary pipe 3; or a necked structure is arranged on the auxiliary pipe 3. By arranging the throttling valve or the necked structure, the gasification amount of the phase change medium can be improved, so that the cooling efficiency of the entire radiator 10 is improved.

[0082] In the case that one evaporator 2 corresponds to at least two condensers 1, one condenser 1 corresponds to one compressor 4, and the power of the at least two compressors 4 is different. For example, in the case that one evaporator 2 corresponds to two condensers 1, the radiator 10 has two compressors 4.

[0083] Alternatively, in the case that one evaporator 2 corresponds to at least two condensers 1, at least two condensers 1 correspond to one compressor 4. For example, in the case that one evaporator 2 corresponds to two condensers 1, the radiator 10 has one compressor 4, and the compressor 4 is connected to the two condensers 1 at the same time. At this time, the compressor 4 is a double-cylinder compressor 4 or a double-row double-gas compressor 4, that is, the compressor 4 has two exhaust ports.

[0084] Referring to FIG. 15, in some examples of the present disclosure, the radiator 10 can include an electrically controlled valve 5, which is arranged between the phase change cavity 21 and the first flow collecting cavity 11 and is configured to adjust the conduction state of the phase change cavity 21 and the first flow collecting cavity 11.

[0085] Specifically, the radiator 10 can simultaneously include the compressor 4 and the electrically controlled valve 5, wherein the compressor 4 communicates the phase change cavity 21 and the second flow collecting cavity 13, and the electrically controlled valve 5 communicates the phase change cavity 21 and the first flow collecting cavity 11. When the cooling demand is relatively low, the compressor 4 does not work, and the electrically controlled valve 5 is opened, so that the gaseous phase change medium flows from the evaporator 2 to the condenser 1 through the electrically controlled valve 5, is liquefied in the condenser 1, and flows back through the auxiliary pipe 3 or the electrically controlled valve 5. In the case that the cooling demand is relatively high, the electrically controlled valve 5 is closed, and the compressor 4 extracts the phase change medium vapor from the evaporator 2 and then compresses it into the condenser 1 to achieve forced cooling. Compared with the existing natural circulation, the cooling efficiency can be improved.

[0086] Referring to FIG. 16, in the width direction X of the radiator 10, the distance between the front side plate of the evaporator 2 and the outermost side of the condenser 1 is H, and the length d of the auxiliary pipe 3 satisfies: d≤H.

[0087] Referring to FIGS. 17-20, in FIG. 17, the evaporator 2 is arranged vertically to the condenser 1, the compressor 4 is arranged between the evaporator 2 and the condenser 1, and the compressor 4 is communicated with the phase-change cavity 21 through the pipeline 6; in FIGS. 18 and 19, the evaporator 2 is arranged parallel to the condenser 1, in which the compressor 4 is fixed at the evaporator 2 in the structure shown in FIGS. 18 and 19, and the compressor 4 is communicated with the evaporator 2 and the condenser 1 through the pipeline 6 respectively; in the structure shown in FIG. 20, the compressor 4 is fixed at the condenser 1, and the compressor 4 is communicated with the evaporator 2 and the condenser 1 through the pipeline 6 respectively; when the heat sink 10 is installed behind the power device, the fan 51 can be arranged above the heat sink 10 to form a cooling air channel between the evaporator 22 and the heat sink 101.

[0088] The number of the condensers 1 in the heat sink with the above structure can be one or more, the number of the condensers 1 in the heat sink shown in FIGS. 2a, 2b, 10, 11, 12 and 13 is one; the number of the condensers 1 in the heat sink shown in FIGS. 21-26 is more, for example, two or four, but is not limited to the two numbers; the cooling air channels are formed between the multiple condensers 1; the multiple condensers 1 are arranged along the gravity direction as shown in FIG. 21; or the multiple condensers 1 are arranged transversely as shown in FIG. 22; or part of the multiple condensers 1 are arranged transversely and the other part are arranged along the gravity direction as shown in FIG. 23.

[0089] Referring to FIG. 24, two condensers 1 are arranged transversely, two condensers 1 are arranged along the gravity direction, and four condensers 1 are arranged in total. In order to improve the cooling efficiency of the heat sink 10, the fan 51 can be arranged above or below the condenser 1, and the cooling air channel is formed between the condensers 1 under the action of the fan 51.

[0090] Further, since the cooling requirements of the four condensers 1 are different, the heat sink 10 can further include the flow guide plate 8, and the air is guided to the condenser 1 with large demand through the flow guide plate 8.

[0091] In addition, the number of the phase-change cavities 21 is one or more, the number of the phase-change cavities 21 in the heat sink shown in FIGS. 1 and 25 is one; the number of the phase-change cavities 21 in the heat sink shown in FIGS. 26 and 27 is more.

[0092] In the case that the number of phase change cavities 21 is one and the number of condensers 1 is multiple, the multiple condensers 1 are communicated with one phase change cavity 21, as shown in FIG. 25; in the case that the number of phase change cavities 21 is multiple, the condenser 1 is communicated with the corresponding phase change cavity 21, for example, two or more condensers 1 can be communicated with any phase change cavity 21, two or more phase change cavities 21 can be communicated with any condenser 1, or one phase change cavity 21 is communicated with one condenser 1. As shown in FIG. 26 and FIG. 27, FIG. 26 includes two condensers 1 and two phase change cavities 21, the two condensers 1 are arranged in the height direction, the two phase change cavities 21 are arranged in the height direction, the upper condenser 1 is communicated with the upper phase change cavity 21, and the lower condenser 1 is communicated with the lower phase change cavity 21; FIG. 27 includes one condenser 1 and two phase change cavities 21, the two phase change cavities 21 are arranged transversely and communicated with the condenser 1 respectively.

[0093] For one phase change cavity 21, in the direction of gravity, the height of the uppermost heat dissipation mounting portion is lower than the liquid level of the phase change medium in the phase change cavity 21. Thus, it is ensured that the power device mounted on the mounting portion is always corresponding to the phase change working medium, and the risk of dry burning is reduced.

[0094] Referring to FIG. 28 to FIG. 34, the present disclosure also provides a power conversion device, which comprises a box 30, a power device 20, a magnetic device 40 and a heat sink 10 according to any one of the above, the power device 20 is arranged on the heat dissipation mounting portion 22 of the heat sink 10 and located in the box 30, and the magnetic device 40 and the heat sink 10 are arranged on the box 30.

[0095] Since the heat sink 10 has the above beneficial effects, the power conversion device comprising the heat sink 10 also has the corresponding effects, which will not be described here. The heat sink 10 of the present disclosure can be configured as the heat dissipation of the power conversion device such as photovoltaic inverter, PCS, wind power converter, etc. At this time, the power conversion device contains power devices 20 such as IGBT, magnetic devices 40 such as reactors, and other electronic devices, capacitor devices, magnetic devices 40, power devices 20, etc.

[0096] It should be particularly pointed out that the power device 20 includes an insulated gate bipolar transistor (IGBT) and the like.

[0097] In order to improve the heat dissipation efficiency of the power conversion device while meeting the protection level of the power conversion device, the box 30 comprises a first box 31 and a second box 32 arranged side by side, the first box 31 is of a closed structure, and the second box 32 is of an open structure; the heat sink 10 is arranged on the box wall of the first box 31; the power device 20 is located in the first box 31, and the condenser 1 of the heat sink 10 is located in the second box 32; the magnetic device 40 is arranged on the box wall of the first box 31 and located outside the first box 31 and inside the second box 32, or located outside the first box 31 and outside the second box 32. In FIGS. 28 and 29, one magnetic device 40 is located in the second box 32, and one magnetic device 40 is located outside the second box 32; in FIGS. 30 to 21, both of the magnetic devices 40 are located in the second box 32.

[0098] The power device 20 such as IGBT is located in the first box 31 with a higher protection level, and the magnetic device 40 such as reactor is located in the second box 32. The internal arrangement of the power conversion device is arranged according to the protection level, and the heat dissipation efficiency can be improved.

[0099] Referring to FIGS. 31 to 33, in order to further improve the heat dissipation efficiency of the power conversion device, the power conversion device further comprises a forced air cooling system 50 to dissipate heat from the condenser 1 and the magnetic device 40.

[0100] Specifically, the forced air cooling system 50 can comprise a fan 51 and an air duct opening 52, the air duct opening 52 is formed on the box wall of the second box 32, and the fan 51 can be arranged at the air duct opening 52 as needed.

[0101] In the illustration, the first box 31 and the second box 32 are arranged side by side in the length direction, the surface of the first box 31 in contact with the second box 32 is the back surface, and the surface opposite to the back surface is the front surface of the first box 31; the surface of the second box 32 in contact with the first box 31 is the front surface, and the surface opposite to the front surface is the back surface; in the height direction, the top surface and the bottom surface of the first box 31 are arranged opposite to each other, and the top surface and the bottom surface of the second box 32 are arranged opposite to each other.

[0102] The air cooling system 50 can adopt a bottom air inlet structure as shown in FIGS. 29-32, in which the air duct opening 52 is located at the bottom surface of the second cabinet 32, the air outlet of the bottom air inlet structure is located at the top surface of the second cabinet 32, and the fan 51 is arranged at the air duct opening 52 to form a heat dissipation airflow in the direction from the air duct opening 52 to the air outlet, so as to take out the heat of the condenser 1 and the condensation side of the evaporator 2 to the second cabinet 32; or a back air inlet structure as shown in FIGS. 33-34, in which the air duct opening 52 is located at the back surface of the second cabinet, the air outlet of the back air inlet structure is located at the bottom surface and the top surface of the second cabinet 32, and the fan 51 is arranged at the air duct opening 52 to form two heat dissipation airflows in the direction from the air duct opening 52 to the two air outlets, so as to take out the heat of the condenser 1 and the condensation side of the evaporator to the second cabinet 32.

[0103] Referring to FIGS. 35-37, the power conversion device has a high protection side and a low protection side, in which the first cabinet 31 corresponds to the high protection side, and the second cabinet 32 corresponds to the low protection side. In order to improve the safety performance of the power conversion device, the heat sink 10 further comprises an explosion venting guide pipe 8, a first end of the explosion venting guide pipe 8 is in communication with the phase change cavity 21, and a second end of the explosion venting guide pipe 8 is provided with a weak area, and the second end is located at the low protection side of the heat sink 10. By arranging the explosion venting guide pipe 8, the pressure can be released in time, and the safety performance is improved.

[0104] In the above, the second end of the explosion venting guide pipe 8 is located below the condenser 1 as shown in FIGS. 35 and 36, or the second end of the explosion venting guide pipe 8 is located above the condenser 1 as shown in FIG. 37.

[0105] In the above, the terms “first” and “second” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with “first” and “second” can explicitly or implicitly include one or more of the features.

[0106] In the description of the embodiments of the present disclosure, unless otherwise specified, “ / ” represents or, for example, A / B can represent A or B; “and / or” herein only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone.

[0107] For the convenience of description, only parts related to the disclosure are shown in the drawings. The embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0108] The above description is merely illustrative of the exemplary embodiments and principles of the application and is not intended to limit the application. The application can be modified and varied greatly without departing from the underlying principles. The scope of the application is not limited to the specific embodiments described herein, but only by the claims that follow, expressing the principles of the application.

Claims

1. A heat spreader, wherein, The heat sink comprises a condenser (1) and an evaporator (2), the condenser (1) comprises a first header (11), a plurality of heat dissipation pipes (12) and a second header (13), two ends of the plurality of heat dissipation pipes (12) are communicated with the first header (11) and the second header (13); The first header (11) is arranged on the rear side plate (2b) of the evaporator (2) and communicated with the phase change cavity (21) of the evaporator (2), the phase change cavity (21) is filled with phase change medium; the front side plate (2a) of the evaporator (2) is provided with a heat dissipation mounting portion (22) configured to mount a power device.

2. The heat spreader of claim 1, wherein, The first header (11) comprises a butt joint portion butted with the rear side plate (2b) of the evaporator (2) at one end close to the evaporator (2), and a plurality of insertion holes are arranged at one end of the first header (11) close to the heat dissipation pipes (12), one insertion hole is matched with one heat dissipation pipe (12).

3. The heat spreader of claim 2, wherein, The included angle between the butt joint portion and the axis of the first header (11) is α; the included angle between the condenser (1) and the evaporator (2) is β, and β is equal to α.

4. The heat spreader of any one of claims 1-3, wherein, The number of the condensers (1) is multiple, and heat dissipation air ducts are formed between the multiple condensers (1); the multiple condensers (1) are arranged along the direction of gravity; or the multiple condensers (1) are arranged in the transverse direction; or part of the multiple condensers (1) are arranged in the transverse direction, and the other part are arranged along the direction of gravity.

5. The heat spreader of claim 4, wherein, The number of the phase change cavities (21) is one or multiple, in the case of one phase change cavity (21), the multiple condensers (1) are communicated with the one phase change cavity (21); in the case of multiple phase change cavities (21), the condenser (1) is communicated with the corresponding phase change cavity (21); for one phase change cavity (21), the height of the uppermost heat dissipation mounting portion (22) is lower than the liquid level of the phase change medium in the phase change cavity (21) in the direction of gravity.

6. The heat spreader of claim 1, wherein, The heat sink further comprises an auxiliary pipe (3), two ends of the auxiliary pipe (3) are communicated with the phase change cavity (21) and the first header (11), or two ends of the auxiliary pipe (3) are communicated with the phase change cavity (21) and the second header (13).

7. The heat spreader of claim 6, wherein, The heat sink further comprises a compressor (4), a first end of the compressor (4) is communicated with the phase change cavity (21), and a second end of the compressor (4) is communicated with the first header (11) or the second header (13). A throttling valve is arranged on the auxiliary pipe (3); or a necked structure is arranged on the auxiliary pipe (3).

8. The heat spreader of claim 7, wherein, In the case that one evaporator (2) corresponds to at least two condensers (1), one condenser (1) corresponds to one compressor (4), and the power of the at least two compressors (4) is different; The number of the exhaust ports of the compressor (4) is two.

9. The heat spreader of claim 7, wherein, The heat sink further comprises an electrically controlled valve (5) arranged between the phase change cavity (21) and the first flow collecting cavity (11) and configured to adjust the conduction state of the phase change cavity (21) and the first flow collecting cavity (11).

10. The heat spreader of claim 6, wherein, The distance between the front side plate (2a) of the evaporator (2) and the condenser (1) is H, and the length of the auxiliary pipe (3) is d, which satisfies d≤H.

11. The heat spreader of any one of claims 1 to 10, wherein, The heat pipe (12) is a flat tube structure, or The condenser (1) further comprises heat dissipation fins arranged on the outer periphery of the heat pipe (12); or the phase change cavity (21) is provided with a turbulence column (23). The area corresponding to the heat dissipation mounting portion (22) in the phase change cavity (21) is a first area (211), and the remaining area is a second area (212), the cross-sectional area of the turbulence column (23) arranged in the first area (211) is smaller than that of the turbulence column (23) arranged in the second area (212); or the area corresponding to the heat dissipation mounting portion (22) in the phase change cavity (21) is provided with a recess (24); Or, in the direction of gravity, the projection area of the heat dissipation mounting portion (22) above on the front side plate (2a) is equal to the projection of the corresponding recess (24) on the front side plate (2a); The projection of the heat dissipation mounting portion (22) below on the front side plate (2a) is smaller than or larger than the projection of the corresponding recess (24) on the front side plate (2a); or the projection of the heat dissipation mounting portion (22) below on the front side plate (2a) partially overlaps with the projection of the corresponding recess (24) on the front side plate (2a).

12. The heat spreader of claim 1, wherein, The first flow collecting cavity (11) is a metal bellows; Or, when the condenser (1) is a cuboid structure, the condenser (1) further comprises a ventilation port (15) penetrating through the condenser (1); or the heat pipe (12) is further provided with a partition plate (16) inside, which can divide the heat pipe (12) into two parts in the upper and lower directions or in the left and right directions.

13. A power conversion device, wherein, The heat sink (10) is arranged on the box body (30) together with a power device (20) and a magnetic device (30), the power device (20) is arranged on the heat dissipation mounting portion (22) of the heat sink (10) and located in the box body (30), and the magnetic device (30) and the heat sink are arranged on the box body (30).

14. The power conversion device of claim 13, wherein, The box body (30) comprises a first box body (31) and a second box body (32) arranged side by side, the first box body (31) is a closed structure, and the second box body (32) is an open structure; The evaporator (2) of the heat sink (10) is arranged on the box wall of the first box body (31), the power device is located in the first box body (31), and the condenser (1) of the heat sink (10) is located in the second box body (32); The evaporator (2) of the heat sink (10) is arranged on the box wall of the first box body (31), the power device is located in the first box body (31), and the condenser (1) of the heat sink (10) is located in the second box body (32); The magnetic device (30) is arranged on a box wall of the first box (30) and located outside the first box (31) and inside the second box (32), or located outside the first box (31) and outside the second box (32).

15. The power conversion device of claim 11, wherein, The heat sink (10) further comprises an explosion venting guide pipe (7), a first end of the explosion venting guide pipe (7) being in communication with the phase change cavity (21), and a second end of the explosion venting guide pipe (7) being provided with a weak area, the second end being located inside the second box (32); The second end of the explosion venting guide pipe (7) is located below or above the condenser (1).

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