Heat pump function assembly and heat pump module

Abstract

A heat pump function assembly (101 to 101c) into which constituent components constituting a heat pump cycle device (1, 1c) are integrated comprises a refrigerant flow path part (200, 500), a heat medium flow path part (400, 700), and a heat exchange part (300, 600). At least two of the refrigerant flow path part (200, 500), the heat medium flow path part (400, 700), and the heat exchange part (300, 600) are integrally formed by laminating a plurality of plate-like members (210,..., 640). The heat exchange part (300, 600) is disposed so as to be sandwiched between the refrigerant flow path part (200, 500) and the heat medium flow path part (400, 700). Attachment parts (218a,..., 518e) for fixing another constituent component are formed in at least one of the refrigerant flow path part (200, 500) and the heat medium flow path part (400, 700).

Description

Heat pump functional assembly and heat pump module CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is based on Japanese Patent Application No. 2024-153133 filed on September 5, 2024, the contents of which are incorporated herein by reference.

[0002] The present disclosure relates to a heat pump function assembly that integrates components that make up a heat pump cycle device, and a heat pump module that integrates components that make up a heat pump cycle device so that they can perform a predetermined function.

[0003] BACKGROUND ART Patent Document 1 discloses a heat pump function assembly in which components constituting a heat pump cycle device are integrated together.

[0004] More specifically, the heat pump functional assembly of Patent Document 1 is configured by connecting components such as a heat exchanger and a fluid control device (e.g., an expansion valve) to a rectangular parallelepiped connection module having multiple refrigerant passages formed therein. As a result, the heat pump functional assembly of Patent Document 1 can be applied to heat pump cycles with various cycle configurations by changing the components connected to the connection module.

[0005] Japanese Patent Application Laid-Open No. 2021-47000

[0006] However, in the heat pump functional assembly of Patent Document 1, each component is attached to the outer surface of the connecting module, which is the main body, in accordance with the flow paths formed inside the connecting module. As a result, areas where no components are attached become wasted space, which results in a large amount of dead space when considering the size of the package. In other words, wasted space is created when the assembly is packaged.

[0007] Furthermore, in the heat pump functional assembly of Patent Document 1, a space required for assembling the components to the connection module must also be secured. Such dead space and the space required for assembling the components hinder the heat pump functional assembly from being sufficiently compact.

[0008] In view of the above, a first object of the present disclosure is to provide a heat pump function assembly that can be made sufficiently compact.

[0009] A second object of the present disclosure is to provide a heat pump module that can be made sufficiently compact.

[0010] The heat pump functional assembly of the first aspect of the present disclosure is a heat pump functional assembly that integrates the components that make up a heat pump cycle device, and includes a refrigerant flow path section, a heat medium flow path section, and a heat exchange section.

[0011] The refrigerant flow path section has a flow path section-side refrigerant passage through which the refrigerant flows. The heat medium flow path section has a flow path section-side heat medium passage through which the heat medium flows. The heat exchange section exchanges heat between the refrigerant that has flowed through the flow path section-side refrigerant passage and the heat medium that has flowed through the flow path section-side heat medium passage.

[0012] At least two of the refrigerant flow path section, the heat medium flow path section, and the heat exchange section are formed by stacking a plurality of plate-like members. The heat exchange section is disposed between the refrigerant flow path section and the heat medium flow path section. At least one of the refrigerant flow path section and the heat medium flow path section is formed with an attachment section for fixing another component device that is not integrated with the refrigerant flow path section.

[0013] This allows at least two of the refrigerant flow path section, the heat medium flow path section, and the heat exchange section to be integrally formed by stacking multiple plate-like members, thereby eliminating the need for fastening members for assembling the at least two of the refrigerant flow path section, the heat medium flow path section, and the heat exchange section together, and eliminating the need to secure the space required for assembly.

[0014] Furthermore, the heat exchange section is arranged between the refrigerant flow path section and the heat medium flow path section, so that the refrigerant flow path section and the heat medium flow path section can be spaced apart to prevent unnecessary heat exchange between the refrigerant and the heat medium having different temperatures without increasing the size of the device.

[0015] In addition, at least one of the refrigerant flow path section and the heat medium flow path section is provided with an attachment section, so that other components that are not integrated into the refrigerant flow path section and the heat medium flow path section can be directly attached to and arranged in close proximity to the refrigerant flow path section and the heat medium flow path section.

[0016] As a result, the heat pump functional assembly of the first aspect can be made sufficiently compact.

[0017] A heat pump module according to a second aspect includes a heat pump functional assembly, a compression section, and a decompression section.

[0018] The heat pump function assembly integrates the components that make up the heat pump cycle device. The compression section compresses and discharges the refrigerant. The decompression section decompresses the refrigerant.

[0019] The heat pump functional assembly has a refrigerant flow path section, a heat medium flow path section, and a heat exchange section. The refrigerant flow path section has a flow path section-side refrigerant passage through which the refrigerant flows. The heat medium flow path section has a flow path section-side heat medium passage through which the heat medium flows. The heat exchange section exchanges heat between the refrigerant that has flowed through the flow path section-side refrigerant passage and the heat medium that has flowed through the flow path section-side heat medium passage.

[0020] At least two of the refrigerant flow path section, the heat medium flow path section, and the heat exchange section are formed by stacking a plurality of plate-like members. The heat exchange section is disposed between the refrigerant flow path section and the heat medium flow path section. The refrigerant flow path section is formed in a flat plate shape.

[0021] The compression unit is attached to the surface of the refrigerant channel portion opposite to the side where the heat exchange unit is disposed, and the decompression unit is attached to the surface of the refrigerant channel portion where the heat exchange unit is disposed.

[0022] In this case, since the heat pump functional assembly of the first aspect is provided, the heat pump functional assembly can be sufficiently miniaturized. Furthermore, the compression section and the decompression section can be directly attached to both sides of the refrigerant flow path section formed in a flat plate shape and arranged in close proximity to the heat pump functional assembly.

[0023] As a result, the heat pump module of the second aspect can be made sufficiently compact.

[0024] Here, the heat pump module differs from the heat pump functional assembly in that it can perform a predetermined function by operating the integrated components.

[0025] The above and other objects, features, and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0016] Fig. 1 is a schematic overall configuration diagram of a vehicle air conditioning system according to a first embodiment. Fig. 2 is a schematic external perspective view of a heat pump functional assembly according to the first embodiment. Fig. 3 is a schematic exploded perspective view of a heat pump functional assembly according to the first embodiment. Fig. 4 is a plan view of a refrigerant flow path outer wall plate according to the first embodiment. Fig. 5 is a plan view of a refrigerant flow path forming plate according to the first embodiment. Fig. 6 is a plan view of a refrigerant flow path partition plate according to the first embodiment. Fig. 7 is a plan view of a heat exchange section refrigerant plate according to the first embodiment. Fig. 8 is an explanatory diagram showing the positional relationship of refrigerant partition section-side liquid storage holes, refrigerant side liquid storage holes, heat medium side liquid storage holes, partition wall side liquid storage holes, etc. according to the first embodiment. Fig. 9 is a plan view of a heat exchange section heat medium plate according to the first embodiment. Fig. 10 is a plan view of a heat exchange section partition plate according to the first embodiment. Fig. 11 is an explanatory diagram showing the stacking order of plate-like members in a heat exchange section according to the first embodiment. Fig. 12 is a plan view of a heat medium flow path partition plate according to the first embodiment. Fig. 13 is a plan view of a heat medium flow path forming plate according to the first embodiment. 23 is a plan view of a heat medium flow path outer wall plate of the first embodiment. FIG. 24 is a schematic external perspective view of a heat pump module of the first embodiment. FIG. 25 is a side view of a heat pump module of the first embodiment. FIG. 26 is a top view of a heat pump module of the first embodiment. FIG. 27 is a schematic configuration diagram of an indoor air conditioning unit of the first embodiment. FIG. 28 is a schematic external perspective view of a heat pump module of the second embodiment. FIG. 29 is a schematic external perspective view of a heat pump module of the third embodiment. FIG. 29 is a schematic overall configuration diagram of a vehicle air conditioning system of the fourth embodiment. FIG. 29 is a schematic external perspective view of a heat pump functional assembly of the fourth embodiment. FIG. 29 is a cross-sectional view taken along line XXIII-XXIII of FIG. 22. FIG. 29 is a schematic external perspective view of a heat pump module of the fourth embodiment.

[0026] Hereinafter, multiple embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in the preceding embodiment will be assigned the same reference numerals, and duplicate descriptions may be omitted. In each embodiment, when only a part of the configuration is described, other previously described embodiments may be applied to the other parts of the configuration. In addition to combinations of parts that are specifically specified as being combinable in each embodiment, it is also possible to partially combine embodiments even if not specified, as long as there is no particular problem with the combination.

[0027] First Embodiment A first embodiment of the present disclosure will be described using Figures 1 to 18. In this embodiment, a heat pump module 100 including a heat pump function assembly 101 according to the present disclosure is applied to a vehicle air conditioner 1 mounted on an electric vehicle. The vehicle air conditioner 1 is a heat pump cycle device that conditions the air inside the vehicle cabin, which is the space to be air-conditioned, and adjusts the temperature of on-board equipment. Therefore, the vehicle air conditioner 1 can be called an air conditioner with an on-board equipment temperature adjustment function, or an on-board equipment temperature adjustment device with an air conditioning function.

[0028] The vehicle air conditioner 1 regulates the temperature of a battery 70, which serves as an on-board device. The battery 70 is a secondary battery that stores power to be supplied to a plurality of electrically operated on-board devices. The battery 70 is an assembled battery formed by electrically connecting a plurality of stacked battery cells in series or parallel. The battery cells in this embodiment are lithium-ion batteries.

[0029] The battery 70 generates heat during operation (i.e., during charging and discharging). The battery 70 has a characteristic that its output is likely to decrease at low temperatures and its deterioration is likely to progress at high temperatures. For this reason, the temperature of the battery 70 needs to be maintained within an appropriate temperature range (in this embodiment, 15°C or higher and 55°C or lower). Therefore, in the electric vehicle of this embodiment, the temperature of the battery 70 is adjusted using the vehicle air conditioner 1.

[0030] The vehicle air conditioner 1 includes a heat pump cycle 10, a high-temperature side heat medium circuit 20, a low-temperature side heat medium circuit 30, an interior air conditioning unit 50, a control device 60, and the like.

[0031] The heat pump functional assembly 101 is an assembly that integrates the components that make up the vehicle air conditioner 1, which is a heat pump cycle device. More specifically, the heat pump functional assembly 101 of this embodiment is an assembly that integrates the refrigerant passage, the condenser 13, the receiver 14, the subcooler 15, the chiller 18, and the heat medium passage, which are surrounded by thin dashed lines in the overall configuration diagram of FIG.

[0032] The heat pump module 100 is a functional unit that integrates components that make up the vehicle air conditioner 1 to perform predetermined functions. More specifically, the heat pump module 100 of this embodiment is a functional unit that integrates a heat pump functional assembly 101, a compressor 11, a cooling expansion valve 16a, a cooling expansion valve 16b, an evaporation pressure control valve 16c, and a hot gas flow rate control valve 16d.

[0033] The heat pump module 100 differs from the heat pump functional assembly 101 in that it can perform a predetermined function by operating the integrated components. For example, the heat pump module 100 of this embodiment can generate hot heat in the condenser 13 and cold heat in the chiller 18 by operating the compressor 11, etc. Detailed configurations of the heat pump functional assembly 101 and the heat pump module 100 will be described later.

[0034] First, a description will be given of the heat pump cycle 10. The heat pump cycle 10 is a vapor compression refrigeration cycle that adjusts the temperatures of the air blown into the vehicle cabin, the high-temperature heat medium circulating through the high-temperature heat medium circuit 20, and the low-temperature heat medium circulating through the low-temperature heat medium circuit 30. The heat pump cycle 10 is configured to be able to switch refrigerant circuits according to various operating modes described below for the purpose of air conditioning in the vehicle cabin and temperature adjustment of on-board equipment.

[0035] The heat pump cycle 10 uses an HFO refrigerant (specifically, R1234yf) as a refrigerant. The heat pump cycle 10 constitutes a subcritical refrigeration cycle in which the pressure of the high-pressure side refrigerant does not exceed the critical pressure of the refrigerant. Refrigerant oil is mixed with the refrigerant to lubricate the compressor 11. The refrigerant oil is a PAG oil that is compatible with liquid-phase refrigerants. A portion of the refrigerant oil circulates through the cycle together with the refrigerant.

[0036] The compressor 11 is a compression unit in the heat pump cycle 10 that draws in, compresses, and discharges the refrigerant. The compressor 11 is an electric compressor that uses an electric motor to drive a fixed-displacement compression mechanism with a fixed discharge capacity. The rotation speed (i.e., refrigerant discharge capacity) of the compressor 11 is controlled by a control signal output from a control device 60, which will be described later.

[0037] The discharge port of the compressor 11 is connected to a compressor side inlet 211 a of the heat pump functional assembly 101 via a discharge side connecting pipe 111 a joined to the heat pump functional assembly 101 .

[0038] The compressor-side inlet 211a is connected to an inlet of a first refrigerant three-way joint 12a of the heat pump functional assembly 101 via a refrigerant passage formed inside the heat pump functional assembly 101. The first refrigerant three-way joint 12a is a part of a three-way joint structure formed by connecting multiple refrigerant passages together.

[0039] Furthermore, the heat pump functional assembly 101 has a second refrigerant three-way joint 12b, a third refrigerant three-way joint 12c, a first heat medium three-way joint 22a, and a second heat medium three-way joint 22b. The basic configurations of these three-way joints are all similar to that of the first refrigerant three-way joint 12a.

[0040] When one of the three inlet / outlets is used as an inlet and the other two are used as outlets, these three-way joints function as a branching section that branches the flow of the refrigerant or heat medium flowing in from one inlet. When two of the three inlet / outlets are used as inlet / outlets and the other is used as an outlet, these three-way joints function as a merging section that merges the flow of the refrigerant or heat medium flowing in from the two inlet / outlets.

[0041] One outlet of the first refrigerant three-way joint 12a is connected to the inlet of the refrigerant passage of the condenser 13 of the heat pump functional assembly 101. The other outlet of the first refrigerant three-way joint 12a is connected to the hot gas outlet 235a of the heat pump functional assembly 101.

[0042] The condenser 13 has a refrigerant passage through which the high-pressure refrigerant discharged from the compressor 11 flows and a heat medium passage through which the high-temperature side heat medium flows. The condenser 13 is a condensing heat exchanger that condenses the high-pressure refrigerant discharged from the compressor 11 by exchanging heat with the high-temperature side heat medium. The condenser 13 heats the high-temperature side heat medium by dissipating heat from the high-pressure refrigerant to the high-temperature side heat medium.

[0043] The outlet of the refrigerant passage of the condenser 13 is connected to the inlet of the receiver 14 of the heat pump functional assembly 101. The receiver 14 is a liquid storage section that separates the refrigerant flowing out of the condenser 13 into gas and liquid phases and stores the separated liquid-phase refrigerant as surplus refrigerant for the cycle.

[0044] The liquid-phase refrigerant outlet of the receiver 14 is connected to the inlet of the refrigerant passage of the subcooler 15 of the heat pump functional assembly 101. The subcooler 15 has a refrigerant passage through which the liquid-phase refrigerant flowing out of the receiver 14 circulates and a heat medium passage through which a high-temperature side heat medium flows. The subcooler 15 is a subcooling heat exchanger that exchanges heat between the liquid-phase refrigerant flowing out of the receiver 14 and the high-pressure side heat medium, thereby subcooling the liquid-phase refrigerant.

[0045] An outlet of the refrigerant passage of the sub-cooler 15 is connected to an inlet of the second refrigerant three-way joint 12b. One outlet of the second refrigerant three-way joint 12b is connected to a cooling expansion valve side outlet 235b of the heat pump functional assembly 101. One outlet of the second refrigerant three-way joint 12b is connected to a cooling expansion valve side outlet 235d of the heat pump functional assembly 101.

[0046] The cooling expansion valve outlet 235b is connected to the inlet side of the cooling expansion valve 16a. The cooling expansion valve 16a is an evaporator pressure reducing unit that reduces the pressure of one of the refrigerant branches at the second refrigerant three-way joint 12b. Furthermore, the cooling expansion valve 16a is an evaporator inlet flow rate adjusting unit that adjusts the flow rate (in this embodiment, the mass flow rate) of the refrigerant flowing into the indoor evaporator 17.

[0047] The cooling expansion valve 16a is an electric variable throttle mechanism having a valve body that changes the throttle opening and an electric actuator (specifically, a stepping motor or a brushless DC motor) that acts as a drive unit that displaces the valve body. The operation of the cooling expansion valve 16a is controlled by a control signal output from the control device 60.

[0048] The cooling expansion valve 16a has a full-open function that functions as a simple refrigerant passage without exerting a pressure reducing effect by fully opening the throttle opening of the valve body, and a full-close function that closes the refrigerant passage by fully closing the throttle opening of the valve body.

[0049] The heat pump cycle 10 further includes a cooling expansion valve 16b, an evaporation pressure control valve 16c, and a hot gas flow rate control valve 16d, which have the same basic configuration as the cooling expansion valve 16a.

[0050] The cooling expansion valve 16a, the cooling expansion valve 16b, the evaporation pressure adjustment valve 16c, and the hot gas flow rate adjustment valve 16d can switch the refrigerant circuit of the heat pump cycle 10 by performing a fully closing function. Therefore, the cooling expansion valve 16a, the cooling expansion valve 16b, the evaporation pressure adjustment valve 16c, and the hot gas flow rate adjustment valve 16d function as a refrigerant circuit switching unit.

[0051] Of course, the cooling expansion valve 16 a, the cooling expansion valve 16 b, the evaporation pressure control valve 16 c, and the hot gas flow rate control valve 16 d may be formed by combining a variable throttle mechanism that does not have a full-closing function with an on-off valve that opens and closes the throttle passage. In this case, each on-off valve serves as a refrigerant circuit switching unit.

[0052] The outlet of the cooling expansion valve 16a is connected to the refrigerant inlet side of an interior evaporator 17. The interior evaporator 17 is disposed in an air conditioning case 51 of the interior air conditioning unit 50. The interior evaporator 17 is an evaporation section that evaporates the low-pressure refrigerant by exchanging heat between the low-pressure refrigerant decompressed by the cooling expansion valve 16a and the air being blown into the vehicle cabin. The interior evaporator 17 evaporates the low-pressure refrigerant, thereby absorbing heat and cooling the air being blown.

[0053] An inlet side of an evaporation pressure regulating valve 16c is connected to a refrigerant outlet of the interior evaporator 17. The evaporation pressure regulating valve 16c is a pressure reducing unit for regulating evaporation pressure, which reduces the pressure of the refrigerant flowing out from the interior evaporator 17. Furthermore, the evaporation pressure regulating valve 16c is an evaporator outlet side flow rate adjusting unit that adjusts the flow rate of refrigerant flowing out from the interior evaporator 17 so that the refrigerant evaporation pressure in the interior evaporator 17 can be maintained at or above a predetermined set pressure (in this embodiment, a saturation pressure at 1°C).

[0054] The outlet of the evaporation pressure adjustment valve 16c is connected to an evaporation pressure adjustment valve side inlet 235c of the heat pump functional assembly 101. The evaporation pressure adjustment valve side inlet 235c is connected to one inlet of the third refrigerant three-way joint portion 12c.

[0055] The cooling expansion valve-side outlet 235d is connected to the inlet side of the cooling expansion valve 16b. The cooling expansion valve 16b is a pressure reducing unit for the chiller that reduces the pressure of the other refrigerant branched at the second refrigerant three-way joint 12b. Furthermore, the cooling expansion valve 16b is a chiller flow rate adjusting unit that adjusts the flow rate of the refrigerant flowing into the chiller 18.

[0056] An outlet of the cooling expansion valve 16b is connected to one inlet side of a fourth refrigerant three-way joint 12d. As shown in Fig. 1, the fourth refrigerant three-way joint 12d is formed as a separate member from the heat pump functional assembly 101. An outlet of the fourth refrigerant three-way joint 12d is connected to a cooling expansion valve side inlet 235e side of the heat pump functional assembly 101. The cooling expansion valve side inlet 235e is connected to an inlet of a refrigerant passage of the chiller 18.

[0057] The chiller 18 has a refrigerant passage through which the low-pressure refrigerant decompressed by the cooling expansion valve 16b flows and a heat medium passage through which the low-temperature heat medium flows. The chiller 18 is an evaporation heat exchanger that exchanges heat between the low-pressure refrigerant decompressed by the cooling expansion valve 16b and the low-temperature heat medium to evaporate the low-pressure refrigerant. The chiller 18 cools the low-temperature heat medium by evaporating the low-pressure refrigerant and exerting a heat absorption effect. The refrigerant outlet of the chiller 18 is connected to the other inlet of the third refrigerant three-way joint 12c.

[0058] The inlet side of a hot gas flow rate control valve 16d is connected to a hot gas outlet 235a, which is connected to the other outlet of the first refrigerant three-way joint 12a. The hot gas flow rate control valve 16d is a hot gas pressure reduction unit that reduces the pressure of the other refrigerant branched at the first refrigerant three-way joint 12a. Furthermore, the hot gas flow rate control valve 16d is a hot gas flow rate adjustment unit that adjusts the flow rate of the refrigerant flowing into the other inlet of the fourth refrigerant three-way joint 12d.

[0059] The refrigerant outlet of the hot gas flow control valve 16d is connected to the other inlet of the fourth refrigerant three-way joint 12d. The outlet of the third refrigerant three-way joint 12c is connected to the compressor-side outlet 211b of the heat pump functional assembly 101. The compressor-side outlet 211b is connected to the suction port of the compressor 11 via a suction-side connecting pipe 111b joined to the heat pump functional assembly 101.

[0060] Next, the high-temperature side heat medium circuit 20 will be described. The high-temperature side heat medium circuit 20 is a circuit that circulates the high-temperature side heat medium. In this embodiment, an ethylene glycol aqueous solution is used as the high-temperature side heat medium. The high-temperature side heat medium circuit 20 includes a high-temperature side pump 21, a heat medium passage for the condenser 13, a heat medium passage for the subcooler 15, a high-temperature side three-way valve 23, a high-temperature side radiator 24, and a heater core 25.

[0061] The high-temperature side pump 21 is a high-temperature side heat medium pumping unit that sucks in and pumps the high-temperature side heat medium that has flowed out from the third heat medium three-way joint 22 c. The high-temperature side pump 21 is an electric pump whose rotation speed (i.e., pumping capacity) is controlled by a control voltage output from the control device 60.

[0062] The discharge port of the high-temperature side pump 21 is connected to a high-temperature side heat medium inlet 431 a of the heat pump function assembly 101 via a high-temperature side heat medium inlet pipe 112 a joined to the heat pump function assembly 101 .

[0063] The high-temperature-side heat medium inlet 431a is connected to the inlet of the first heat medium three-way joint 22a. One outlet of the first heat medium three-way joint 22a is connected to the inlet of the heat medium passage of the condenser 13. The other outlet of the first heat medium three-way joint 22a is connected to the inlet of the heat medium passage of the sub-cooler 15.

[0064] An outlet of the heat medium passage of the condenser 13 is connected to one inlet of the second heat medium three-way joint 22 b. An outlet of the heat medium passage of the sub-cooler 15 is connected to the other inlet of the second heat medium three-way joint 22 b. An outlet of the second heat medium three-way joint 22 b is connected to the high-temperature side heat medium outlet 431 b of the heat pump functional assembly 101.

[0065] The high-temperature side heat medium outlet 431b is connected to the inlet of the high-temperature side three-way valve 23 via a high-temperature side heat medium outlet pipe 112b joined to the heat pump functional assembly 101. The high-temperature side three-way valve 23 is an electric three-way flow control valve that has one inlet and two outlets and can continuously adjust the passage area ratio of the two outlets. The operation of the high-temperature side three-way valve 23 is controlled by a control signal output from the control device 60.

[0066] The heat medium inlet side of the high-temperature side radiator 24 is connected to one outlet of the high-temperature side three-way valve 23. The heat medium inlet side of the heater core 25 is connected to the other outlet of the high-temperature side three-way valve 23. Therefore, the high-temperature side three-way valve 23 is a high-temperature side heat medium flow rate ratio adjustment unit that can continuously adjust the flow rate ratio between the high-temperature side heat medium flowing into the high-temperature side radiator 24 and the high-temperature side heat medium flowing into the heater core 25.

[0067] Furthermore, the high-temperature side three-way valve 23 allows the entire flow rate of the high-temperature side heat medium flowing out from the high-temperature side heat medium outlet 431b to flow either to the high-temperature side radiator 24 side or to the heater core 25 side. Therefore, the high-temperature side three-way valve 23 serves as a high-temperature side heat medium circuit switching unit that switches the circuit configuration of the high-temperature side heat medium circuit 20.

[0068] The high-temperature side radiator 24 is a high-temperature side outside air heat exchanger that exchanges heat between the high-temperature side heat medium flowing out from one outlet of the high-temperature side three-way valve 23 and outside air. The high-temperature side radiator 24 is located at the front end of the drive unit compartment at the front of the vehicle, together with a low-temperature side radiator 34 (described later). This allows the high-temperature side radiator 24 and the low-temperature side radiator 34 to be exposed to the wind while the vehicle is traveling.

[0069] The heater core 25 is disposed in the air conditioning case 51 of the indoor air conditioning unit 50. The heater core 25 is a heating heat exchanger that exchanges heat between the high-temperature side heat medium flowing in from the high-temperature side three-way valve 23 and the blown air. The heater core 25 heats the blown air by dissipating heat from the high-temperature side heat medium to the blown air.

[0070] One inlet side of the third heat medium three-way joint 22c is connected to the heat medium outlet of the high-temperature side radiator 24. The other inlet side of the third heat medium three-way joint 22c is connected to the heat medium outlet of the heater core 25. As shown in Fig. 1, the third heat medium three-way joint 22c is formed as a separate member from the heat pump functional assembly 101. The suction side of the high-temperature side pump 21 is connected to the outlet side of the third heat medium three-way joint 22c.

[0071] In the high-temperature side heat medium circuit 20, the high-pressure refrigerant discharged from the compressor 11 is heat-exchanged with the high-temperature side heat medium in the condenser 13 and the sub-cooler 15, thereby heating the high-temperature side heat medium. Furthermore, the high-temperature side heat medium heated in the condenser 13 and the sub-cooler 15 is heat-exchanged with the blown air in the heater core 25, thereby heating the blown air.

[0072] Next, the low-temperature side heat medium circuit 30 will be described. The low-temperature side heat medium circuit 30 is a circuit that circulates the low-temperature side heat medium. In this embodiment, the same type of heat medium as the high-temperature side heat medium is used as the low-temperature side heat medium. The low-temperature side heat medium circuit 30 includes a low-temperature side pump 31, a heat medium passage of the chiller 18, a low-temperature side three-way valve 33, a low-temperature side radiator 34, and a coolant passage 70a of the battery 70.

[0073] The low-temperature side pump 31 is a low-temperature side heat medium pumping unit that sucks in and pumps out the low-temperature side heat medium that has flowed out from the fourth heat medium three-way joint 32d. The basic configuration of the low-temperature side pump 31 is similar to that of the high-temperature side pump 21.

[0074] A low-temperature side heat medium inlet 432a of the heat pump functional assembly 101 is connected to the discharge port of the low-temperature side pump 31 via a low-temperature side heat medium inlet pipe 113a joined to the heat pump functional assembly 101. The low-temperature side heat medium inlet 432a communicates with the inlet of the heat medium passage of the chiller 18. The outlet of the heat medium passage of the chiller 18 communicates with the low-temperature side heat medium outlet 432b of the heat pump functional assembly 101.

[0075] The low-temperature side heat medium outlet 432b is connected to the inlet side of the low-temperature side three-way valve 33 via a low-temperature side heat medium outlet pipe 113b joined to the heat pump functional assembly 101. The basic configuration of the low-temperature side three-way valve 33 is similar to that of the high-temperature side three-way valve 23.

[0076] The heat medium inlet side of the low-temperature side radiator 34 is connected to one outlet of the low-temperature side three-way valve 33. The inlet side of the coolant passage 70a of the battery 70 is connected to the other outlet of the low-temperature side three-way valve 33. Therefore, the low-temperature side three-way valve 33 is a low-temperature side heat medium flow ratio adjuster that can continuously adjust the flow rate ratio between the flow rate of the low-temperature side heat medium flowing into the low-temperature side radiator 34 and the flow rate of the low-temperature side heat medium flowing into the coolant passage 70a.

[0077] Furthermore, the low-temperature side three-way valve 33 allows the entire flow rate of the low-temperature side heat medium flowing out from the low-temperature side heat medium outlet 432b to flow either to the low-temperature side radiator 34 side or to the coolant passage 70a side. Therefore, the low-temperature side three-way valve 33 serves as a low-temperature side heat medium circuit switching unit that switches the circuit configuration of the low-temperature side heat medium circuit 30.

[0078] The low-temperature side radiator 34 is a low-temperature side outside air heat exchanger that exchanges heat between the low-temperature side heat medium flowing out from one outlet of the low-temperature side three-way valve 33 and outside air. One inlet side of the fourth heat medium three-way joint 32d is connected to the heat medium outlet of the low-temperature side radiator 34.

[0079] The coolant passage 70a of the battery 70 is a heat medium passage that circulates the low-temperature heat medium that flows out from one outlet of the low-temperature three-way valve 33. The coolant passage 70a is formed inside a battery case that houses a plurality of stacked battery cells. In the low-temperature heat medium circuit 30, the battery 70 is cooled by circulating a low-temperature low-temperature heat medium through the coolant passage 70a.

[0080] The cooling water passage 70a is configured with multiple passages connected in parallel inside the battery case. This allows the cooling water passage 70a to be arranged so that all battery cells can be cooled evenly. The outlet of the cooling water passage 70a is connected to the other inlet side of the fourth heat medium three-way joint 32d. The outlet of the fourth heat medium three-way joint 32d is connected to the suction side of the low-temperature side pump 31.

[0081] Next, the detailed configuration of the heat pump functional assembly 101 will be described using Figures 2 to 14. As shown in Figures 2 and 3, the heat pump functional assembly 101 is formed by stacking a plurality of plate-like members. The X direction indicated by the arrows in Figures 2 and 3 corresponds to the roughly horizontal direction when the heat pump functional assembly 101 is mounted on a vehicle. The Y direction corresponds to the roughly vertical direction. The Z direction is the stacking direction of the plate-like members.

[0082] In this embodiment, each plate-shaped member is made of an aluminum alloy with a thickness of 1 mm. Through-holes that penetrate the front and back of the flat surfaces are formed in the plate-shaped members by press working. The size and shape of the through-holes vary depending on the function of each plate-shaped member. The heat pump functional assembly 101 is formed by overlapping the flat surfaces of multiple plate-shaped members and brazing them together.

[0083] The heat pump functional assembly 101 has a refrigerant flow path section 200, a heat exchange section 300, and a heat medium flow path section 400. As shown in Figures 2 and 3, the refrigerant flow path section 200, the heat exchange section 300, and the heat medium flow path section 400 are arranged side by side in the stacking direction of the plate-like members. The heat exchange section 300 is arranged between the refrigerant flow path section 200 and the heat medium flow path section 400 so as to be sandwiched between them.

[0084] The refrigerant flow path section 200 is a section that forms a plurality of flow path section-side refrigerant passages through which the refrigerant flows. The refrigerant flow path section 200 is a section that forms the first refrigerant three-way joint 12a, the second refrigerant three-way joint 12b, and the third refrigerant three-way joint 12c of the heat pump cycle 10. The refrigerant flow path section 200 also forms a compressor-side inlet 211a, a compressor-side outlet 211b, a hot gas outlet 235a, a cooling expansion valve-side outlet 235b, an evaporation pressure control valve-side inlet 235c, a cooling expansion valve-side outlet 235d, and a cooling expansion valve-side inlet 235e.

[0085] The heat medium flow path section 400 is a section that forms a plurality of flow path-side heat medium passages through which the high-temperature side heat medium and the low-temperature side heat medium flow. The heat medium flow path section 400 is a section that forms the first heat medium three-way joint 22a and the second heat medium three-way joint 22b of the high-temperature side heat medium circuit 20. The heat medium flow path section 400 also has a high-temperature side heat medium inlet 431a, a high-temperature side heat medium outlet 431b, a low-temperature side heat medium inlet 432a, and a low-temperature side heat medium outlet 432b.

[0086] The heat exchange unit 300 is a section that exchanges heat between the refrigerant that has flowed through the flow section-side refrigerant passage of the refrigerant flow section 200 and the high-temperature side heat medium or the low-temperature side heat medium that has flowed through the flow section-side heat medium passage of the heat medium flow section 400. The heat exchange unit 300 is a section that forms the condenser 13, the sub-cooler 15, and the chiller 18.

[0087] The detailed configuration of each part will be described below. First, the refrigerant flow path part 200 is formed in a flat plate shape by stacking three types of plate-like members: a refrigerant flow path outer wall plate 210, a refrigerant flow path forming plate 220, and a refrigerant flow path partition plate 230.

[0088] As shown in the plan view of Fig. 4, the refrigerant flow path outer wall plate 210 is a plate-like member formed with mounting portions for fixing various components. Fig. 4 is a plan view of the refrigerant flow path outer wall plate 210 as viewed in the Z direction indicated by the arrows in Figs. 2 and 3. The plan views of the following plate-like members are also shown as viewed in the same direction.

[0089] The compressor-side inlet 211a is a through-hole that allows the refrigerant discharged from the compressor 11 to flow into the heat pump functional assembly 101. As shown in Figures 15 to 17, a discharge-side connecting pipe 111a is brazed to the compressor-side inlet 211a.

[0090] The compressor-side outlet 211b is a through-hole that allows the refrigerant to flow from the inside of the heat pump functional assembly 101 to the suction side of the compressor 11. The compressor-side outlet 211b forms a third refrigerant three-way joint 12c. As shown in Figures 15 to 17, the suction-side connecting pipe 111b is brazed to the compressor-side outlet 211b.

[0091] The discharge-side connecting pipe 111a and the suction-side connecting pipe 111b are joined so as to protrude in the Z direction from one of the flat surfaces of the refrigerant flow path outer wall plate 210, the flat surface opposite to the side where the heat exchange unit 300 is disposed. Therefore, the discharge-side connecting pipe 111a and the suction-side connecting pipe 111b form part of the refrigerant flow path unit 200.

[0092] A heat insulating hole 217 having an elongated hole shape extending in the Y direction is formed between the compressor side inlet 211 a and the compressor side outlet 211 b of the refrigerant flow path outer wall plate 210. The heat insulating hole 217 is a through hole that serves as a heat insulating portion that prevents heat transfer and forms a heat insulating space that suppresses unnecessary heat exchange between the high-pressure refrigerant and the low-pressure refrigerant, and unnecessary heat exchange between the high-temperature side heat medium and the low-temperature side heat medium, etc.

[0093] The insulating holes that form the insulating portion are also formed in the other plate-shaped members. The insulating holes are arranged in each plate-shaped member so as to separate the area where the high-pressure refrigerant or high-temperature heat transfer medium flows from the area where the low-pressure refrigerant or low-temperature heat transfer medium flows. Therefore, the shape and longitudinal direction of the insulating holes differ depending on the plate-shaped member.

[0094] The compressor mounting holes 218a are mounting portions for fixing the compressor 11. In the present embodiment, three compressor mounting holes 218a are formed. With respect to the insulation hole 217 as a reference, one compressor mounting hole 218a is disposed on the side where mainly high-pressure refrigerant or high-temperature heat medium flows, and two compressor mounting holes 218a are disposed on the side where mainly low-pressure refrigerant or low-temperature heat medium flows.

[0095] 16 and 17 , a cylindrical compressor boss 240 is inserted into each compressor mounting hole 218a and brazed to it. The compressor boss 240 is a connecting member with a female thread formed on the inner wall surface on the central axis side. The compressor boss 240 is joined so as to protrude in the Z direction from one of the flat surfaces of the refrigerant flow path outer wall plate 210, the flat surface opposite the side where the heat exchange section 300 is located.

[0096] The expansion valve mounting holes 218b are mounting portions for fixing various expansion valves. In this embodiment, twelve expansion valve mounting holes 218b are formed. Each expansion valve mounting hole 218b is positioned on the side of the heat insulating hole 217 where the low-pressure refrigerant or low-temperature heat medium mainly flows.

[0097] Here, the mounting portion is a through-hole for fixing other components that make up the vehicle air conditioner 1, excluding the components integrated as the heat pump functional assembly 101. Also, in Fig. 4, the reference numerals for some of the expansion valve mounting holes 218b are omitted for clarity. In the following drawings, some reference numerals may also be omitted when there are multiple through-holes with equivalent functions.

[0098] The bracket mounting holes 218c are mounting portions to which the brackets 114 are fixed for mounting the vehicle air conditioner 1 to a vehicle, which is the mounting object. In this embodiment, two bracket mounting holes 218c are formed. Both bracket mounting holes 218c are positioned on the side of the insulation hole 217 where the low-pressure refrigerant or low-temperature heat medium mainly flows.

[0099] 5, the refrigerant flow path forming plate 220 is a plate-like member having refrigerant flow path forming holes formed therein to serve as various flow path portion-side refrigerant paths. The flow path portion-side refrigerant paths can guide the refrigerant that has flowed in from the stacking direction to another location within the surface.

[0100] The compressor condenser passage hole 221a is a refrigerant passage forming hole that forms a condenser side refrigerant passage 221g that guides the refrigerant flowing in from the compressor side inlet 211a formed in the refrigerant flow path outer wall plate 210 to the condenser side outlet 221b, and also forms a hot gas side refrigerant passage 221h that guides the refrigerant to the hot gas side outlet 221c.

[0101] The condenser side outlet 221b communicates with the refrigerant inlet of the condenser 13. The hot gas side outlet 221c communicates with a hot gas outlet 235a formed in the refrigerant flow path partition plate 230. Therefore, the compressor condenser passage hole 221a forms a first refrigerant three-way joint 12a.

[0102] The condenser receiver passage hole 221d is a refrigerant passage forming hole that forms a receiver-side refrigerant passage 221i that guides the refrigerant flowing in from the condenser 13 to the inlet side of the receiver 14. In this embodiment, the condenser receiver passage hole 221d guides the refrigerant that flows out from the lower side of the refrigerant passage 311g of the condenser 13 to the refrigerant flow path-side reservoir hole 224a located at the lowest side.

[0103] The refrigerant flow path section side liquid storage hole 224a is a hole that forms the receiver 14. A plurality of the refrigerant flow path section side liquid storage hole 224a is provided, and is formed in a square shape. The plurality of refrigerant flow path section side liquid storage hole 224a are arranged side by side in the X direction and the Y direction. The internal space of the refrigerant flow path section side liquid storage hole 224a forms part of the liquid storage space of the receiver 14. Refrigerant flow path section side support portions 224b are formed between adjacent refrigerant flow path section side liquid storage holes 224a.

[0104] The receiver outlet hole 224c is a through-hole that forms an outlet portion through which the refrigerant flows out of the receiver 14. The receiver outlet hole 224c is located on the lowest side of the receiver 14. The receiver outlet hole 224c communicates with the sub-cooler side outlet hole 222a via a refrigerant passage formed in the heat exchanger 300. The sub-cooler side outlet hole 222a communicates with a refrigerant inlet of the sub-cooler 15.

[0105] The subcooler expansion valve passage hole 222b is a refrigerant passage forming hole that guides the refrigerant flowing out from the subcooler 15 to the cooling expansion valve outlet 222c and also forms an expansion valve side refrigerant passage 222g that guides the refrigerant to the cooling expansion valve outlet 222d. At least a portion of the subcooler expansion valve passage hole 222b is positioned so as to overlap with the chiller 18 when viewed from the stacking direction.

[0106] The cooling expansion valve outlet 222c communicates with a cooling expansion valve side outlet 235b formed in the refrigerant flow path partition plate 230. The cooling expansion valve outlet 222d communicates with a cooling expansion valve side outlet 235d formed in the refrigerant flow path partition plate 230. Therefore, the sub-cooler expansion valve passage hole 222b forms a second refrigerant three-way joint 12b.

[0107] The evaporation pressure control valve compressor passage hole 223a is a refrigerant passage forming hole that forms a first compressor side refrigerant passage 223g that guides the refrigerant that flows in from an evaporation pressure control valve side inlet 235c formed in the refrigerant flow path partition plate 230 to the first compressor refrigerant outlet 223b. The chiller compressor passage hole 223c is a refrigerant passage forming hole that forms a second compressor side refrigerant passage 223h that guides the refrigerant that flows out from the chiller 18 to the second compressor refrigerant outlet 223d.

[0108] The first compressor refrigerant outlet portion 223 b and the second compressor refrigerant outflow portion 223 d are in communication with a compressor side outlet 211 b formed in the refrigerant flow path outer wall plate 210 .

[0109] The cooling expansion valve inlet passage hole 223e is a refrigerant passage forming hole that forms a chiller-side refrigerant passage 223i that guides the refrigerant that flows in from a cooling expansion valve-side inlet 235e formed in the refrigerant flow path partition plate 230 to a chiller-side refrigerant outlet 223f. The chiller-side refrigerant outlet 223f is connected to the refrigerant inlet of the chiller 18. The hot gas-side refrigerant passage 221h is disposed between the expansion valve-side refrigerant passage 222g and the chiller-side refrigerant passage 223i.

[0110] The refrigerant flow path forming plate 220 is also formed with insulation holes 227 corresponding to the insulation holes 217 of the refrigerant flow path outer wall plate 210. The insulation holes 227 of the refrigerant flow path forming plate 220 include holes extending in the Y direction, as well as holes extending in the X direction along the compressor condenser passage holes 221a.

[0111] The refrigerant flow path forming plate 220 has a compressor mounting hole 228a, an expansion valve mounting hole 228b, and a bracket mounting hole 228c formed therein, which are similar to the compressor mounting hole 218a, the expansion valve mounting hole 218b, and the bracket mounting hole 218c of the refrigerant flow path outer wall plate 210.

[0112] The compressor mounting hole 228a, expansion valve mounting hole 228b, and bracket mounting hole 228c of the refrigerant flow path forming plate 220 are positioned so as to overlap with the compressor mounting hole 218a, expansion valve mounting hole 218b, and bracket mounting hole 218c, respectively, when viewed from the stacking direction.

[0113] A plurality of weight-reducing holes 229 are formed in the refrigerant flow path forming plate 220. The weight-reducing holes 229 are through holes formed to reduce the weight of the refrigerant flow path forming plate 220. The weight-reducing holes 229 are formed in rectangular shapes in areas where no refrigerant passages are formed. Therefore, joints are formed around the weight-reducing holes 229 when the refrigerant flow path forming plates 220 are brazed together.

[0114] 6 , the refrigerant flow path partition plate 230 is a plate-like member formed with mounting portions for fixing various components and with refrigerant connection holes for connecting the flow path portion-side refrigerant passages of the refrigerant flow path section 200 with the heat exchange portion-side refrigerant passages of the heat exchange portion 300. In this embodiment, the refrigerant flow path partition plate 230 is a plate-like member that forms the refrigerant flow path section 200, but the surface of the refrigerant flow path partition plate 230 facing the heat exchange portion 300 forms a heat medium passage together with the heat exchange portion 300.

[0115] The condenser refrigerant inlet hole 231a is a refrigerant connection hole that connects the compressor condenser passage hole 221a formed in the refrigerant flow path forming plate 220 with the inlet of the refrigerant passage 311g of the condenser 13. A plurality of condenser refrigerant inlet holes 231a (five in this embodiment) are formed and are arranged side by side in the X direction.

[0116] The condenser refrigerant outlet hole 231b is a refrigerant connection hole that connects the outlet of the refrigerant passage 311g of the condenser 13 with the condenser receiver passage hole 221d formed in the refrigerant flow path forming plate 220. A plurality of condenser refrigerant outlet holes 231b (five in this embodiment) are formed and are arranged side by side in the X direction.

[0117] The sub-cooler refrigerant inlet hole 232a is a refrigerant connecting hole that connects the condenser receiver passage hole 221d formed in the refrigerant flow path forming plate 220 with the inlet of the refrigerant passage 312g of the sub-cooler 15. A plurality of sub-cooler refrigerant inlet holes 232a (two in this embodiment) are formed and are arranged side by side in the X direction.

[0118] The sub-cooler refrigerant outlet hole 232b is a refrigerant connecting hole that connects the outlet of the refrigerant passage 312g of the sub-cooler 15 with the sub-cooler expansion valve passage hole 222b formed in the refrigerant flow path forming plate 220. A plurality of sub-cooler refrigerant outlet holes 232b (two in this embodiment) are formed and are arranged side by side in the X direction.

[0119] The chiller refrigerant inlet hole 233a is a refrigerant connection hole that connects the cooling expansion valve inlet passage hole 223e formed in the refrigerant flow path forming plate 220 with the inlet of the refrigerant path 313g of the chiller 18. Multiple chiller refrigerant inlet holes 233a (six in this embodiment) are formed and arranged side by side in the X direction.

[0120] The chiller refrigerant outlet hole 233b is a refrigerant connection hole that connects the outlet of the refrigerant passage 313g of the chiller 18 with the chiller compressor passage hole 223c formed in the refrigerant flow path forming plate 220. A plurality of chiller refrigerant outlet holes 233b (six in this embodiment) are formed and are arranged side by side in the X direction.

[0121] The hot gas outlet 235a is a hole that communicates with the compressor condenser passage hole 221a of the refrigerant passage forming plate 220. The cooling expansion valve side outlet 235b and the cooling expansion valve side outlet 235d are holes that communicate with the sub-cooler expansion valve passage hole 222b of the refrigerant passage forming plate 220. The evaporation pressure control valve side inlet 235c is a hole that communicates with the evaporation pressure control valve compressor passage hole 223a of the refrigerant passage forming plate 220. The cooling expansion valve side inlet 235e is a hole that communicates with the cooling expansion valve inlet passage hole 223e of the refrigerant passage forming plate 220.

[0122] In addition, the refrigerant flow path partition plate 230 is formed with a refrigerant partition side liquid storage hole 234a, a refrigerant partition side support portion 234b, and a receiver outflow hole 234c, which correspond to the refrigerant flow path side liquid storage hole 224a, the refrigerant flow path side support portion 224b, and the receiver outlet hole 224c of the refrigerant flow path forming plate 220.

[0123] Refrigerant partition section-side liquid storage hole 234a is formed in the same shape as refrigerant channel section-side liquid storage hole 224a. Multiple refrigerant partition section-side liquid storage holes 234a are provided and are arranged side by side in the X direction and the Y direction. Refrigerant partition section-side liquid storage hole 234a and refrigerant channel section-side liquid storage hole 224a are formed in positions that overlap when viewed from the stacking direction.

[0124] The refrigerant flow path partition plate 230 also has heat insulating holes 237 formed therein that correspond to the heat insulating holes 217 of the refrigerant flow path outer wall plate 210 .

[0125] The refrigerant flow path partition plate 230 is also formed with an expansion valve mounting hole 238b and a bracket mounting hole 238c similar to the expansion valve mounting hole 218b and bracket mounting hole 218c of the refrigerant flow path outer wall plate 210. The expansion valve mounting hole 238b and bracket mounting hole 238c of the refrigerant flow path partition plate 230 are positioned so as to overlap the expansion valve mounting hole 218b and bracket mounting hole 218c, respectively, when viewed from the stacking direction.

[0126] An expansion valve boss (not shown) is inserted into and brazed to the bracket mounting hole 238c of the refrigerant flow path partition plate 230. The expansion valve boss has a basic structure similar to that of the compressor boss 240.

[0127] Here, we will explain the stacking state of the refrigerant flow path outer wall plates 210, refrigerant flow path forming plates 220, and refrigerant flow path partition plates 230 in the refrigerant flow path section 200. In the refrigerant flow path section 200 of this embodiment, as shown in Fig. 3, three refrigerant flow path outer wall plates 210 are stacked in a row in the opposite direction to the Z direction, which is the stacking direction, and ten refrigerant flow path forming plates 220 are stacked in a row, and one refrigerant flow path partition plate 230 is stacked.

[0128] Next, the heat exchange unit 300 is formed by stacking three types of plate-like members: a heat exchange unit refrigerant plate 310, a heat exchange unit heat medium plate 320, and a heat exchange unit partition plate 330. The length in the X direction of the plate-like members forming the heat exchange unit 300 is shorter than that of the plate-like members forming the refrigerant flow path unit 200.

[0129] 7, the heat exchanger refrigerant plate 310 is a plate-like member having refrigerant passage forming holes formed therein, which serve as refrigerant passages for the heat exchanger. The refrigerant passages for the heat exchanger are refrigerant passages for the various heat exchangers.

[0130] The condenser refrigerant passage hole 311a is a refrigerant passage forming hole that forms the refrigerant passage 311g of the condenser 13. The upper end of the condenser refrigerant passage hole 311a communicates with a plurality of condenser refrigerant inlet holes 231a formed in the refrigerant flow path partition plate 230. The lower end of the condenser refrigerant passage hole 311a communicates with a plurality of condenser refrigerant outlet holes 231b formed in the refrigerant flow path partition plate 230.

[0131] In the refrigerant passage 311g of the condenser 13, the refrigerant flows in the direction opposite to the Y direction, i.e., from top to bottom. Therefore, the multiple condenser refrigerant inlet holes 231a and the condenser refrigerant outlet holes 231b are aligned in a direction perpendicular to the refrigerant flow direction in the refrigerant passage 311g of the condenser 13.

[0132] A condenser heat medium outlet-side communication hole 311b is formed above the condenser refrigerant passage hole 311a. A plurality of condenser heat medium outlet-side communication holes 311b (six in this embodiment) are formed and are arranged side by side in the X direction.

[0133] A condenser heat medium inlet-side communication hole 311c is formed below the condenser refrigerant passage hole 311a. A plurality of condenser heat medium inlet-side communication holes 311c (six in this embodiment) are formed and are arranged side by side in the X direction.

[0134] The receiver sub-cooler passage hole 312a is a refrigerant passage forming hole that forms a refrigerant passage that guides the refrigerant flowing out from the receiver 14 to the inlet of the refrigerant passage 312g of the sub-cooler 15. In the refrigerant passage formed by the receiver sub-cooler passage hole 312a, the refrigerant flows in the Y direction. That is, the refrigerant flows from bottom to top.

[0135] The sub-cooler refrigerant passage holes 312b are refrigerant passage forming holes that form refrigerant passages 312g of the sub-cooler 15. The upper ends of the sub-cooler refrigerant passage holes 312b communicate with a plurality of sub-cooler refrigerant inlet holes 232a formed in the refrigerant flow path partition plate 230. The lower ends of the sub-cooler refrigerant passage holes 312b communicate with a plurality of sub-cooler refrigerant outlet holes 232b formed in the refrigerant flow path partition plate 230.

[0136] In the refrigerant passage 312g of the sub-cooler 15, the refrigerant flows in the direction opposite to the Y direction. That is, the refrigerant flows from top to bottom. Therefore, the multiple sub-cooler refrigerant inlet holes 232a and the sub-cooler refrigerant outlet holes 232b are aligned in a direction perpendicular to the refrigerant flow direction in the refrigerant passage 312g of the sub-cooler 15.

[0137] A sub-cooler heat medium outlet side communication hole 312c is formed above the sub-cooler refrigerant passage hole 312b. A plurality of sub-cooler heat medium outlet side communication holes 312c (two in this embodiment) are formed and are arranged side by side in the X direction.

[0138] A sub-cooler heat medium inlet side communication hole 312d is formed below the sub-cooler refrigerant passage hole 312b. A plurality of sub-cooler heat medium inlet side communication holes 312d (two in this embodiment) are formed and are arranged side by side in the X direction.

[0139] The chiller refrigerant passage hole 313a is a refrigerant passage forming hole that forms a refrigerant passage 313g of the chiller 18. The upper end of the chiller refrigerant passage hole 313a communicates with a plurality of chiller refrigerant inlet holes 233a formed in the refrigerant flow path partition plate 230. The lower end of the chiller refrigerant passage hole 313a communicates with a plurality of chiller refrigerant outlet holes 233b formed in the refrigerant flow path partition plate 230.

[0140] In the refrigerant passage 313g of the chiller 18, the refrigerant flows in the direction opposite to the Y direction. That is, the refrigerant flows from top to bottom. Therefore, the multiple chiller refrigerant inlet holes 233a and chiller refrigerant outlet holes 233b are arranged in a direction perpendicular to the refrigerant flow direction in the refrigerant passage 312g of the sub-cooler 15.

[0141] A chiller heat medium outlet side communication hole 313b is formed above the chiller refrigerant passage hole 313a. A plurality of chiller heat medium outlet side communication holes 313b (six in this embodiment) are formed and arranged side by side in the X direction.

[0142] A chiller heat medium inlet side communication hole 313c is formed below the chiller refrigerant passage hole 313a. A plurality of chiller heat medium inlet side communication holes 313c (six in this embodiment) are formed and are arranged side by side in the X direction.

[0143] In addition, the heat exchange section refrigerant plate 310 is formed with refrigerant side liquid storage holes 314a and refrigerant side support portions 314b corresponding to the refrigerant partition section side liquid storage holes 234a and refrigerant partition section side support portions 234b of the refrigerant flow path partition plate 230.

[0144] The refrigerant-side liquid storage hole 314a is formed in the same shape as the refrigerant-partition-side liquid storage hole 234a. A plurality of the refrigerant-side liquid storage holes 314a are provided and are arranged side by side in the X and Y directions.

[0145] However, when viewed from the stacking direction, refrigerant-side liquid storage hole 314a is not positioned to overlap with refrigerant partition-side liquid storage hole 234a. More specifically, as shown in Fig. 8, refrigerant-side liquid storage hole 314a and refrigerant partition-side liquid storage hole 234a are positioned so that when viewed from the stacking direction, some, but not all, of them overlap, and the internal spaces thereof communicate with each other.

[0146] The heat exchange portion refrigerant plate 310 is also formed with heat insulating holes 317 corresponding to the heat insulating holes 217 of the refrigerant flow path outer wall plate 210 .

[0147] As shown in the plan view of Fig. 9, the heat exchanger heat medium plate 320 is a plate-like member having heat medium passage-forming holes formed therein, which serve as heat exchanger-side heat medium passages. The heat exchanger-side heat medium passages serve as heat medium passages for the various heat exchangers.

[0148] The condenser heat medium passage holes 321a are heat medium passage forming holes that form the heat medium passages 321g of the condenser 13. The upper ends of the condenser heat medium passage holes 321a communicate with a plurality of condenser heat medium outlet communication holes 311b formed in the heat exchanger refrigerant plate 310. The lower ends of the condenser heat medium passage holes 321a communicate with a plurality of condenser heat medium inlet communication holes 311c formed in the heat exchanger refrigerant plate 310.

[0149] In the heat medium passage 321g of the condenser 13, the high-temperature side heat medium flows in the Y direction. That is, the high-temperature side heat medium flows from bottom to top. Therefore, the multiple condenser heat medium outlet side communication holes 311b and the condenser heat medium inlet side communication holes 311c are aligned in a direction perpendicular to the flow direction of the high-temperature side heat medium in the heat medium passage 321g of the condenser 13.

[0150] A condenser refrigerant inlet communication hole 321b is formed above the condenser heat medium passage hole 321a. A plurality of condenser refrigerant inlet communication holes 321b (five in this embodiment) are formed and arranged side by side in the X direction. The condenser refrigerant inlet communication holes 321b communicate with the condenser refrigerant passage holes 311a of the heat exchange portion refrigerant plate 310.

[0151] A condenser refrigerant outlet-side communication hole 321c is formed below the condenser refrigerant passage hole 311a. A plurality of condenser refrigerant outlet-side communication holes 321c (five in this embodiment) are formed and arranged side by side in the X direction. The condenser refrigerant outlet-side communication holes 321c communicate with the condenser refrigerant passage hole 311a of the heat exchange portion refrigerant plate 310.

[0152] The subcooler heat medium passage holes 322a are heat medium passage forming holes that form heat medium passages 322g of the subcooler 15. The upper ends of the subcooler heat medium passage holes 322a communicate with a plurality of subcooler heat medium outlet communication holes 312c formed in the heat exchanger refrigerant plate 310. The lower ends of the subcooler heat medium passage holes 322a communicate with a plurality of subcooler heat medium inlet communication holes 312d formed in the heat exchanger refrigerant plate 310.

[0153] In the heat medium passage 322g of the sub-cooler 15, the high-temperature heat medium flows in the Y direction. That is, the high-temperature heat medium flows from bottom to top. Therefore, the sub-cooler heat medium outlet side communication holes 312c and the sub-cooler heat medium inlet side communication holes 312d are aligned in a direction perpendicular to the flow direction of the high-temperature heat medium in the heat medium passage 322g of the sub-cooler 15.

[0154] A sub-cooler refrigerant inlet communication hole 322b is formed above the sub-cooler heat medium passage hole 322a. A plurality of sub-cooler refrigerant inlet communication holes 322b (two in this embodiment) are formed and arranged side by side in the X direction. The sub-cooler refrigerant inlet communication hole 322b communicates with the sub-cooler refrigerant passage hole 312b formed in the heat exchange portion refrigerant plate 310.

[0155] A sub-cooler refrigerant outlet side communication hole 322c is formed below the sub-cooler heat medium passage hole 322a. A plurality of sub-cooler refrigerant outlet side communication holes 322c (two in this embodiment) are formed and arranged side by side in the X direction. The sub-cooler refrigerant outlet side communication hole 322c communicates with the sub-cooler refrigerant passage hole 312b formed in the heat exchange portion refrigerant plate 310.

[0156] The chiller heat medium passage hole 323a is a heat medium passage forming hole that forms a heat medium passage 323g of the chiller 18. The upper end of the chiller heat medium passage hole 323a communicates with a plurality of chiller heat medium outlet communication holes 313b formed in the heat exchange unit refrigerant plate 310. The lower end of the chiller heat medium passage hole 323a communicates with a plurality of chiller heat medium inlet communication holes 313c formed in the heat exchange unit refrigerant plate 310.

[0157] In the heat medium passage 323g of the chiller 18, the low-temperature heat medium flows in the Y direction. That is, the low-temperature heat medium flows from bottom to top. Therefore, the multiple chiller heat medium outlet side communication holes 313b and chiller heat medium inlet side communication holes 313c are arranged in a direction perpendicular to the flow direction of the low-pressure heat medium in the heat medium passage 323g of the chiller 18.

[0158] A chiller refrigerant inlet communication hole 323b is formed above the chiller heat medium passage hole 323a. Multiple chiller refrigerant inlet communication holes 323b (six in this embodiment) are formed and arranged in a line in the X direction. The chiller refrigerant inlet communication hole 323b communicates with the chiller refrigerant passage hole 313a formed in the heat exchanger refrigerant plate 310.

[0159] A chiller refrigerant outlet-side communication hole 323c is formed below the chiller heat medium passage hole 323a. Multiple chiller refrigerant outlet-side communication holes 323c (six in this embodiment) are formed and arranged side by side in the X direction. The chiller refrigerant outlet-side communication hole 323c communicates with the chiller refrigerant passage hole 313a formed in the heat exchanger refrigerant plate 310.

[0160] The heat exchanger heat medium plate 320 is also formed with heat medium side liquid storage holes 324a and heat medium side support columns 324b that correspond to the refrigerant side liquid storage holes 314a and refrigerant side support columns 314b of the heat exchanger refrigerant plate 310.

[0161] The heat medium-side liquid storage hole 324a is formed in the same shape as the refrigerant-side liquid storage hole 314a. A plurality of the heat medium-side liquid storage holes 324a are provided and are arranged side by side in the X direction and the Y direction. The heat medium-side liquid storage hole 324a and the refrigerant-side liquid storage hole 314a are formed at positions where they overlap when viewed from the stacking direction.

[0162] In other words, the heat medium-side liquid storage hole 324a is not positioned to overlap with the refrigerant partition section-side liquid storage hole 234a when viewed from the stacking direction. That is, as indicated by the parenthesized symbols in Fig. 8, the heat medium-side liquid storage hole 324a and the refrigerant partition section-side liquid storage hole 234a are positioned so that, when viewed from the stacking direction, some but not all of the heat medium-side liquid storage hole 324a and the refrigerant partition section-side liquid storage hole 234a overlap with each other, and the internal spaces thereof communicate with each other.

[0163] The heat exchanger heat medium plate 320 also has heat insulating holes 327 formed therein that correspond to the heat insulating holes 217 in the refrigerant flow path outer wall plate 210 .

[0164] The heat exchanger partition plate 330 is a plate-like member disposed between the heat exchanger refrigerant plate 310 and the heat exchanger heat medium plate 320. The heat exchanger partition plate 330 prevents mixing of the refrigerant flowing through the heat exchanger-side refrigerant passages formed in the heat exchanger refrigerant plate 310 with the heat medium flowing through the heat exchanger-side heat medium passages formed in the heat exchanger heat medium plate 320, and allows heat exchange between the refrigerant and the heat medium. As shown in the plan view of Fig. 10, the heat exchanger partition plate 330 has a plurality of communication holes formed therein.

[0165] The condenser refrigerant inlet side communication hole 331a communicates with the condenser refrigerant inlet side communication hole 321b of the heat exchanger heat medium plate 320. The condenser heat medium outlet side communication hole 331b communicates with the condenser heat medium outlet side communication hole 311b of the heat exchanger refrigerant plate 310. The condenser refrigerant inlet side communication hole 331a and the condenser heat medium outlet side communication hole 331b are arranged alternately in the X direction.

[0166] The condenser refrigerant outlet side communication hole 331c communicates with the condenser refrigerant outlet side communication hole 321c of the heat exchanger heat medium plate 320. The condenser heat medium inlet side communication hole 331d communicates with the condenser heat medium inlet side communication hole 311c of the heat exchanger refrigerant plate 310. The condenser refrigerant outlet side communication hole 331c and the condenser heat medium inlet side communication hole 331d are arranged alternately in the X direction.

[0167] The sub-cooler refrigerant inlet communicating holes 332a communicate with the sub-cooler refrigerant inlet communicating holes 322b of the heat exchanger heat medium plate 320. The sub-cooler heat medium outlet communicating holes 332b communicate with the sub-cooler heat medium outlet communicating holes 312c of the heat exchanger refrigerant plate 310. The sub-cooler refrigerant inlet communicating holes 332a and the sub-cooler heat medium outlet communicating holes 332b are arranged alternately in the X direction.

[0168] The sub-cooler refrigerant outlet side communication holes 332c communicate with the sub-cooler refrigerant outlet side communication holes 322c of the heat exchanger heat medium plate 320. The sub-cooler heat medium inlet side communication holes 332d communicate with the sub-cooler heat medium inlet side communication holes 312d of the heat exchanger refrigerant plate 310. The sub-cooler refrigerant outlet side communication holes 332c and the sub-cooler heat medium inlet side communication holes 332d are arranged alternately in the X direction.

[0169] The chiller refrigerant inlet side communication hole 333a communicates with the chiller refrigerant inlet side communication hole 323b of the heat exchanger heat medium plate 320. The chiller heat medium outlet side communication hole 333b communicates with the chiller heat medium outlet side communication hole 313b of the heat exchanger refrigerant plate 310. The chiller refrigerant inlet side communication hole 333a and the chiller heat medium outlet side communication hole 333b are arranged alternately in the X direction.

[0170] The chiller refrigerant outlet side communication hole 333c communicates with the chiller refrigerant outlet side communication hole 323c of the heat exchanger heat medium plate 320. The chiller heat medium inlet side communication hole 333d communicates with the chiller heat medium inlet side communication hole 313c of the heat exchanger refrigerant plate 310. The chiller refrigerant outlet side communication hole 333c and the chiller heat medium inlet side communication hole 333d are arranged alternately in the X direction.

[0171] The heat exchanger partition plate 330 is formed with partition-side liquid storage holes 334a and partition-side support columns 334b ​​corresponding to the refrigerant partition-side liquid storage holes 234a and refrigerant partition-side support columns 234b of the refrigerant flow path partition plate 230.

[0172] The partition wall-side liquid storage hole 334a is formed in the same shape as the refrigerant partition wall-side liquid storage hole 234a. A plurality of partition wall-side liquid storage holes 334a are provided and are arranged side by side in the X and Y directions. The partition wall-side liquid storage hole 334a and the refrigerant partition wall-side liquid storage hole 234a are formed to overlap when viewed in the stacking direction.

[0173] In other words, when viewed from the stacking direction, the partition wall-side liquid storage hole 334a is not disposed so as to overlap with the refrigerant-side liquid storage hole 314a and the heat medium-side liquid storage hole 324a.

[0174] 8, the partition wall-side liquid storage hole 334a and the refrigerant-side liquid storage hole 314a are arranged so that their internal spaces communicate with each other by partially, but not entirely, overlapping when viewed from the stacking direction. The partition wall-side liquid storage hole 334a and the heat medium-side liquid storage hole 324a are arranged so that their internal spaces communicate with each other by partially, but not entirely, overlapping when viewed from the stacking direction.

[0175] Therefore, the spaces formed inside adjacent partition wall-side liquid storage holes 334a communicate with each other via the spaces formed inside the refrigerant-side liquid storage holes 314a adjacent to each other in the stacking direction. Similarly, the spaces formed inside adjacent partition wall-side liquid storage holes 334a communicate with each other via the spaces formed inside the heat medium-side liquid storage holes 324a adjacent to each other in the stacking direction.

[0176] As a result, the spaces formed inside the partition-side liquid storage hole 334a, the refrigerant-side liquid storage hole 314a, and the heat medium-side liquid storage hole 324a communicate with each other not only in the stacking direction but also in the horizontal and vertical directions, thereby forming a single space serving as the receiver 14.

[0177] The refrigerant-side support columns 314b, heat medium-side support columns 324b, partition wall-side support columns 334b, and refrigerant partition wall-side support columns 234b are arranged so that they partially overlap each other, as indicated by dotted hatching in Fig. 8. The overlapping portions of the refrigerant-side support columns 314b and the refrigerant channel-side support columns 224b are joined to support columns of other plate-like members to form columnar sections 340 extending in the stacking direction.

[0178] The heat exchanger partition plate 330 is also formed with receiver sub-cooler passage holes 332e corresponding to the receiver sub-cooler passage holes 312a formed in the heat exchanger refrigerant plate 310. The heat exchanger partition plate 330 is also formed with insulation holes 337 corresponding to the insulation holes 217 in the refrigerant flow path outer wall plate 210.

[0179] Here, we will explain the stacking state of the heat exchanger refrigerant plates 310, the heat exchanger heat medium plates 320, and the heat exchanger partition plates 330 in the heat exchanger unit 300. In the heat exchanger unit 300, as shown in Fig. 11, the plate-like members are arranged in the following order: two heat exchanger heat medium plates 320, one heat exchanger partition plate 330, two heat exchanger refrigerant plates 310, and one heat exchanger partition plate 330.

[0180] The heat exchanger section heat medium plate 320 is arranged adjacent to the refrigerant flow path partition plate 230. The heat exchanger section heat medium plate 320 is arranged adjacent to the heat medium flow path partition plate 410. In this embodiment, a total of 18 heat exchanger section refrigerant plates 310, a total of 20 heat exchanger section heat medium plates 320, and a total of 18 heat exchanger section partition plates 330 are stacked in the above-mentioned order.

[0181] For clarity of illustration, FIG. 11 shows a stacked state of the heat exchanger section refrigerant plates 310, the heat exchanger section heat medium plates 320, and the heat exchanger section partition plates 330, which are arranged near the refrigerant flow path partition plate 230 and the heat medium flow path partition plate 410.

[0182] The refrigerant passage 311g of the condenser 13, the refrigerant passage 312g of the sub-cooler 15, and the refrigerant passage 313g of the chiller 18, which are formed by two heat exchange section refrigerant plates 310, are provided with refrigerant side inner fins 341a that promote heat exchange between the refrigerant and the heat medium.

[0183] Similarly, heat medium side inner fins 341b for promoting heat exchange between the refrigerant and the heat medium are arranged in the heat medium passage 321g of the condenser 13, the heat medium passage 322g of the subcooler 15, and the heat medium passage 323g of the chiller 18, which are formed by the two heat exchange portion heat medium plates 320.

[0184] Next, the heat medium flow path section 400 is formed by stacking three types of plate-like members: a heat medium flow path partition plate 410, a heat medium flow path forming plate 420, and a heat medium flow path outer wall plate 430. The length in the X direction of each of the plate-like members forming the heat medium flow path section 400 is equal to the length in the X direction of the plate-like members forming the heat exchange section 300.

[0185] 12 , the heat medium flow path partition plate 410 is a plate-like member having heat medium connection holes formed therein that connect the heat exchange unit-side heat medium passages of the heat exchange unit 300 with the flow path unit-side heat medium passages of the heat medium flow path section 400. In this embodiment, the heat medium flow path partition plate 410 is a plate-like member that forms the heat medium flow path section 400, and the surface of the heat medium flow path partition plate 410 on the heat exchange unit 300 side forms the heat medium passage together with the heat exchange unit 300.

[0186] The condenser heat medium inlet hole 411a is a heat medium connecting hole that connects a high-temperature-side heat medium inlet passage hole 421a formed in the heat medium flow path forming plate 420 (described later) with the inlet of the heat medium path 321g of the condenser 13. A plurality of condenser heat medium inlet holes 411a (six in this embodiment) are formed and arranged side by side in the X direction. The condenser heat medium inlet hole 411a communicates with the condenser heat medium path hole 321a of the heat exchanger heat medium plate 320.

[0187] The condenser heat medium outlet hole 411b is a heat medium connecting hole that connects the outlet of the heat medium passage 321g of the condenser 13 with the high-temperature-side heat medium outlet passage hole 421d formed in the heat medium passage forming plate 420. A plurality of condenser heat medium outlet holes 411b (six in this embodiment) are formed and arranged side by side in the X direction. The condenser heat medium outlet hole 411b communicates with the condenser heat medium passage hole 321a of the heat exchanger heat medium plate 320.

[0188] The sub-cooler heat medium inlet hole 412a is a heat medium connecting hole that connects the high-temperature side heat medium inlet passage hole 421a formed in the heat medium flow passage forming plate 420 with the inlet of the heat medium passage 322g of the sub-cooler 15. A plurality of sub-cooler heat medium inlet holes 412a (two in this embodiment) are formed and arranged side by side in the X direction. The sub-cooler heat medium inlet hole 412a communicates with the sub-cooler heat medium passage hole 322a of the heat exchanger heat medium plate 320.

[0189] The sub-cooler heat medium outlet hole 412b is a heat medium connecting hole that connects the outlet of the heat medium passage 322g of the sub-cooler 15 with the high-temperature-side heat medium outlet passage hole 421d formed in the heat medium passage forming plate 420. A plurality of sub-cooler heat medium outlet holes 412b (two in this embodiment) are formed and arranged side by side in the X direction. The sub-cooler heat medium outlet hole 412b communicates with the sub-cooler heat medium passage hole 322a of the heat exchanger heat medium plate 320.

[0190] The chiller heat medium inlet hole 413a is a heat medium connecting hole that connects the low-temperature-side heat medium inlet passage hole 422a formed in the heat medium flow path forming plate 420 with the inlet of the heat medium passage 323g of the chiller 18. A plurality of chiller heat medium inlet holes 413a (six in this embodiment) are formed and arranged side by side in the X direction. The chiller heat medium inlet hole 413a communicates with the chiller heat medium passage hole 323a of the heat exchanger heat medium plate 320.

[0191] The chiller heat medium outlet hole 413b is a heat medium connecting hole that connects the outlet of the heat medium passage 323g of the chiller 18 to the low-temperature side heat medium outlet passage hole 422c formed in the heat medium passage forming plate 420. A plurality of chiller heat medium outlet holes 413b (six in this embodiment) are formed and arranged side by side in the X direction. The chiller heat medium outlet hole 413b communicates with the chiller heat medium passage hole 323a of the heat exchanger heat medium plate 320.

[0192] The heat medium flow path partition plate 410 also has heat insulating holes 417 formed therein that correspond to the heat insulating holes 217 of the refrigerant flow path outer wall plate 210 .

[0193] 13, the heat medium passage forming plate 420 is a plate-like member having heat medium passage forming holes formed therein to serve as various heat medium passages on the passage section side. The heat medium passages on the passage section side can guide the heat medium that has flowed in from the stacking direction to another location within the surface.

[0194] The high temperature side heat medium inlet passage hole 421a is a heat medium passage forming hole that forms the condenser side heat medium passage 421g and also forms the sub-cooler side heat medium passage 421h.

[0195] The condenser-side heat medium passage 421g guides the high-temperature heat medium flowing in from a high-temperature heat medium inlet 431a formed in the heat medium flow path outer wall plate 430 to the condenser heat medium outlet 421b. The sub-cooler-side heat medium passage 421h guides the high-temperature heat medium flowing in from the high-temperature heat medium inlet 431a formed in the heat medium flow path outer wall plate 430 to the sub-cooler heat medium outlet 421c. Therefore, the high-temperature heat medium inlet passage 421a forms the first heat medium three-way joint 22a.

[0196] The condenser heat medium outlet 421b communicates with the condenser heat medium inlet hole 411a formed in the heat medium flow path partition plate 410. The sub-cooler heat medium outlet 421c communicates with the sub-cooler heat medium inlet hole 412a formed in the heat medium flow path partition plate 410.

[0197] The high-temperature side heat medium outlet passage hole 421d is a heat medium passage forming hole that forms the first high-temperature side heat medium outlet passage 421i and also forms the second high-temperature side heat medium outlet passage 421j.

[0198] The first high-temperature-side heat medium outlet passage 421i guides the high-temperature-side heat medium that has flowed in from the condenser heat medium inlet 421e to the high-temperature-side heat medium outlet 431b formed in the heat medium flow path outer wall plate 430. The second high-temperature-side heat medium outlet passage 421j guides the high-temperature-side heat medium that has flowed in from the sub-cooler heat medium inlet 421f to the high-temperature-side heat medium outlet 431b.

[0199] The condenser heat medium inlet 421e communicates with the condenser heat medium outlet hole 411b formed in the heat medium flow path partition plate 410. The sub-cooler heat medium inlet 421f communicates with the sub-cooler heat medium outlet holes 412b formed in the heat medium flow path partition plate 410. Therefore, the high temperature side heat medium outlet passage hole 421d forms the second heat medium three-way joint 22b.

[0200] The low-temperature-side heat medium inlet passage hole 422a is a heat medium passage forming hole that forms a chiller-side heat medium passage 422g that guides the low-temperature-side heat medium that flows in from a low-temperature-side heat medium inlet 432a formed in the heat medium flow path outer wall plate 430 to a chiller heat medium outlet 422b. The chiller heat medium outlet 422b communicates with a chiller heat medium inlet hole 413a formed in the heat medium flow path partition plate 410.

[0201] The low-temperature side heat medium outlet passage hole 422c is a heat medium passage forming hole that forms a low-temperature side heat medium outlet passage 422h that guides the low-temperature side heat medium that flows in from the chiller heat medium inlet portion 422d to the low-temperature side heat medium outlet 432b formed in the heat medium flow path outer wall plate 430. The chiller heat medium inlet portion 422d is in communication with the chiller heat medium outlet hole 413b formed in the heat medium flow path partition plate 410.

[0202] The heat medium passage forming plate 420 also has heat insulating holes 427 formed therein that correspond to the heat insulating holes 217 of the refrigerant passage outer wall plate 210 .

[0203] As shown in the plan view of FIG. 14, the heat medium flow path outer wall plate 430 is a plate-like member having through holes formed therein for connecting various components.

[0204] The high-temperature side heat medium inlet 431a is a through-hole that allows the high-temperature side heat medium to flow into the heat pump functional assembly 101. The high-temperature side heat medium inlet 431a is connected to a high-temperature side heat medium inlet passage hole 421a formed in the heat medium flow path forming plate 420. As shown in FIGS. 15 to 17 , the high-temperature side heat medium inlet 431a is joined to the high-temperature side heat medium inlet pipe 112a.

[0205] The high-temperature side heat medium outlet 431b is a through-hole that allows the high-temperature side heat medium to flow out from the heat pump functional assembly 101. The high-temperature side heat medium outlet 431b is in communication with a high-temperature side heat medium outlet passage hole 421d formed in the heat medium flow path forming plate 420. As shown in FIGS. 15 to 17 , the high-temperature side heat medium outlet 431b is joined to the high-temperature side heat medium outlet pipe 112b.

[0206] The low-temperature side heat medium inlet 432a is a through-hole that allows the low-temperature side heat medium to flow into the heat pump functional assembly 101. The low-temperature side heat medium inlet 432a is in communication with a low-temperature side heat medium inlet passage hole 422a formed in the heat medium flow path forming plate 420. As shown in FIGS. 15 to 17 , the low-temperature side heat medium inlet 432a is joined to the low-temperature side heat medium inlet pipe 113a.

[0207] The low-temperature side heat medium outlet 432b is a through-hole that allows the low-temperature side heat medium to flow out from the heat pump functional assembly 101. The low-temperature side heat medium outlet 432b is in communication with a low-temperature side heat medium outlet passage hole 422c formed in the heat medium flow path forming plate 420. As shown in FIGS. 15 to 17 , the low-temperature side heat medium outlet 432b is joined to the low-temperature side heat medium outlet pipe 113b.

[0208] The high-temperature side heat medium inlet pipe 112a, the high-temperature side heat medium outlet pipe 112b, the low-temperature side heat medium inlet pipe 113a, and the low-temperature side heat medium outlet pipe 113b are joined so as to protrude in the opposite Z direction from one of the flat surfaces of the heat medium flow path outer wall plate 430, the flat surface opposite the side where the heat exchange unit 300 is located. Therefore, the high-temperature side heat medium inlet pipe 112a, the high-temperature side heat medium outlet pipe 112b, the low-temperature side heat medium inlet pipe 113a, and the low-temperature side heat medium outlet pipe 113b form part of the heat medium flow path unit 400.

[0209] Furthermore, the heat medium passage outer wall plate 430 has heat insulating holes 437 formed therein that correspond to the heat insulating holes 217 of the refrigerant passage outer wall plate 210 .

[0210] Here, we will explain the stacking state of the heat medium channel partition plates 410, the heat medium channel forming plates 420, and the heat medium channel outer wall plates 430 in the heat medium channel section 400. In the heat medium channel section 400 of this embodiment, as shown in Fig. 3 , two heat medium channel partition plates 410 are stacked in a row, six heat medium channel forming plates 420 are stacked in a row, and two heat medium channel outer wall plates 430 are stacked in a row in the opposite direction to the Z direction, which is the stacking direction.

[0211] Next, a description will be given of the heat pump module 100. The heat pump module 100 is formed by attaching the components that make up the vehicle air conditioner 1 to a heat pump functional assembly 101, as shown in Figures 15 to 17.

[0212] Specifically, the compressor 11 and the bracket 114 are attached to a flat surface of the refrigerant flow path section 200 opposite to the side where the heat exchange section 300 is disposed. The compressor 11 is fixed by bolts to a compressor boss section 240 joined to the refrigerant flow path section 200.

[0213] A flange of a discharge-side connecting pipe 111a joined to the refrigerant flow path 200 is fixed by bolts to the discharge port of the compressor 11. A sealing member (not shown) to prevent refrigerant leakage is arranged between the discharge port of the compressor 11 and the flange of the discharge-side connecting pipe 111a. A discharge refrigerant temperature and pressure sensor 62a that detects the temperature and pressure of the refrigerant discharged from the compressor 11 is attached to the discharge-side connecting pipe 111a.

[0214] A flange of a suction-side connecting pipe 111b joined to the refrigerant flow path 200 is fixed by bolts to the suction port of the compressor 11. A sealing member (not shown) to prevent refrigerant leakage is arranged between the suction port of the compressor 11 and the flange of the suction-side connecting pipe 111b. A suction refrigerant temperature and pressure sensor 62b is attached to the suction-side connecting pipe 111b to detect the pressure of the suction refrigerant being sucked into the compressor 11.

[0215] The bracket 114 is fixed by bolts to bracket mounting holes 218c formed in the refrigerant flow path portion 200. The bracket 114 is formed in a bent shape when viewed from the Y direction, and has a portion that extends in the X direction and a portion that extends in the Z direction. The bracket 114 is attached to the vehicle via a vibration-isolating member 114a.

[0216] In addition, a cooling expansion valve 16a, a cooling expansion valve 16b, an evaporation pressure adjustment valve 16c, and a hot gas flow rate adjustment valve 16d are attached to the flat surface of the refrigerant flow path section 200 on the side where the heat exchange section 300 is located.

[0217] In this embodiment, an expansion valve unit that houses the cooling expansion valve 16a and the evaporation pressure adjustment valve 16c in a single housing is fixed by bolts to an expansion valve boss portion that is joined to the refrigerant flow path portion 200. In addition, an expansion valve unit that houses the cooling expansion valve 16b and the hot gas flow rate adjustment valve 16d in a single housing is fixed by bolts to an expansion valve boss portion that is joined to the refrigerant flow path portion 200.

[0218] A sealing member (not shown) for preventing leakage of refrigerant is disposed between each expansion valve unit and the flat surface of the refrigerant flow path section 200 on the side where the heat exchange section 300 is disposed.

[0219] Next, the interior air conditioning unit 50 will be described. The interior air conditioning unit 50 is a unit that integrates multiple components to blow air adjusted to an appropriate temperature to appropriate locations within the vehicle cabin for air conditioning. The interior air conditioning unit 50 is located inside the instrument panel at the front of the vehicle cabin.

[0220] 18, the indoor air conditioning unit 50 is formed by accommodating an indoor blower 52, an indoor evaporator 17, a heater core 25, etc. in an air conditioning case 51 that forms an air passage for blown air. The air conditioning case 51 is molded from a resin (e.g., polypropylene) that has a certain degree of elasticity and excellent strength.

[0221] An inside / outside air switching device 53 is disposed on the most upstream side of the blown air flow of the air conditioning case 51. The inside / outside air switching device 53 switches between introducing inside air (i.e., air inside the vehicle cabin) and outside air (i.e., air outside the vehicle cabin) into the air conditioning case 51. The operation of the inside / outside air switching device 53 is controlled by a control signal output from the control device 60.

[0222] An interior blower 52 is disposed downstream of the inside / outside air switching device 53 in the flow of blown air. The interior blower 52 blows the air drawn in through the inside / outside air switching device 53 toward the vehicle interior. The rotation speed (i.e., blowing capacity) of the interior blower 52 is controlled by a control voltage output from the control device 60.

[0223] The interior evaporator 17 and the heater core 25 are disposed downstream in the flow of air blown by the interior blower 52. The interior evaporator 17 is disposed upstream in the flow of air blown from the heater core 25. A cool air bypass passage 55 is formed in the air conditioning case 51, allowing the air blown after passing through the interior evaporator 17 to bypass the heater core 25.

[0224] An air mix door 54 is disposed downstream of the interior evaporator 17 in the air conditioning case 51 in the direction of the blown air flow, and upstream of the heater core 25 and the cool air bypass passage 55 in the direction of the blown air flow.

[0225] The air mix door 54 adjusts the ratio of the volume of the blown air that passes through the heater core 25 side to the volume of the blown air that passes through the cool air bypass passage 55 after passing through the interior evaporator 17. The operation of the actuator for driving the air mix door 54 is controlled by a control signal output from the control device 60.

[0226] A mixing space 56 is disposed downstream of the heater core 25 and the cold air bypass passage 55 in the flow direction of the blown air. The mixing space 56 is a space where the blown air heated by the heater core 25 mixes with the blown air that has passed through the cold air bypass passage 55 and is not heated.

[0227] Therefore, in the interior air conditioning unit 50, the temperature of the blown air (i.e., conditioned air) mixed in the mixing space 56 and blown into the vehicle interior can be adjusted by adjusting the opening degree of the air mix door 54.

[0228] A plurality of openings (not shown) for blowing conditioned air toward various locations in the vehicle cabin are formed at the most downstream portion of the airflow of the air-conditioning case 51. Blowing mode doors (not shown) for opening and closing the respective openings are disposed in the plurality of openings. The operation of the actuators for driving the blowing mode doors is controlled by a control signal output from the control device 60.

[0229] Therefore, in the interior air conditioning unit 50, by switching the opening holes that the blow-out mode door opens and closes, conditioned air that has been adjusted to an appropriate temperature can be blown out to an appropriate location in the vehicle interior.

[0230] Next, the electrical control unit of the vehicle air conditioner 1 will be described. The control device 60 has a well-known microcomputer including a CPU, ROM, RAM, etc., and its peripheral circuits. The control device 60 performs various calculations and processes based on control programs stored in the ROM. The control device 60 then controls the operation of various control target devices connected to the output side based on the results of the calculations and processes.

[0231] A group of various control sensors is connected to the input side of the control device 60. The control sensors include a discharge refrigerant temperature and pressure sensor 62a, a suction refrigerant temperature and pressure sensor 62b, an evaporator temperature sensor, a chiller refrigerant temperature sensor, a high-temperature side heat medium temperature sensor, a low-temperature side heat medium temperature sensor, a battery temperature sensor, an air conditioning air temperature sensor, etc. Detection signals from these control sensors are input to the control device 60.

[0232] The evaporator temperature sensor is an evaporator temperature detection unit that detects the refrigerant evaporation temperature (evaporator temperature) Tefin in the indoor evaporator 17. Specifically, the evaporator temperature sensor detects the temperature of the heat exchange fins of the indoor evaporator 17. The chiller refrigerant temperature sensor detects the chiller-side refrigerant temperature Tc of the refrigerant flowing out from the refrigerant passage of the chiller 18.

[0233] The high-temperature-side heat medium temperature sensor is a high-temperature-side heat medium temperature detector that detects a high-temperature-side heat medium temperature TWH of the high-temperature-side heat medium flowing into the heater core 25. The low-temperature-side heat medium temperature sensor is a low-temperature-side heat medium temperature detector that detects a low-temperature-side heat medium temperature TWL of the heat medium flowing out from the coolant passage 70a of the battery 70.

[0234] The battery temperature sensor is a battery temperature detection unit that detects the battery temperature TB, which is the temperature of the battery 70. The battery temperature sensor has multiple temperature sensors and detects the temperature at multiple locations on the battery 70. This allows the control device 60 to detect the temperature difference and temperature distribution among the battery cells that make up the battery 70. Furthermore, the average value of the detection values ​​of the multiple temperature sensors is used as the battery temperature TB.

[0235] The air conditioning air temperature sensor is an air conditioning air temperature detection unit that detects the temperature TAV of the air blown from the mixing space 56 into the vehicle interior.

[0236] The control device 60 is an integrated unit that controls various controlled devices connected to the output side. Therefore, the components (hardware and software) that control the operation of each controlled device constitute the control unit that controls the operation of each controlled device. For example, the component of the control device 60 that controls the refrigerant discharge capacity of the compressor 11 constitutes a discharge capacity control unit.

[0237] Here, in Figure 1, for clarity of illustration, some of the power lines electrically connecting the control device 60 to the controlled devices and signal lines electrically connecting the control device 60 to the group of control sensors are omitted.

[0238] Next, the operation of the vehicle air conditioner 1 of this embodiment configured as described above will be described. The vehicle air conditioner 1 of this embodiment switches between various operating modes to condition the air in the vehicle cabin and regulate the temperature of the battery 70. Specifically, the vehicle air conditioner 1 of this embodiment can execute a cooling mode, a heating mode, a dehumidifying heating mode, a cooling and cooling mode, a single cooling mode, a hot gas heating mode, etc.

[0239] In the cooling mode, the refrigerant is evaporated in the interior evaporator 17 of the heat pump cycle 10. Then, the interior air conditioning unit 50 blows the blown air cooled by the interior evaporator 17 into the vehicle compartment, thereby cooling the vehicle compartment.

[0240] In the heating mode, the high-temperature side heat medium heated by the condenser 13 and the subcooler 15 of the heat pump cycle 10 flows into the heater core 25 of the high-temperature side heat medium circuit 20. The interior air conditioning unit 50 then blows the air heated by the heater core 25 into the vehicle compartment, thereby heating the vehicle compartment.

[0241] In the dehumidifying and heating mode, the refrigerant is evaporated in the interior evaporator 17 of the heat pump cycle 10. Furthermore, the high-temperature side heat medium heated in the condenser 13 and the subcooler 15 of the heat pump cycle 10 is caused to flow into the heater core 25 of the high-temperature side heat medium circuit 20. The interior air conditioning unit 50 then reheats the blown air cooled and dehumidified in the interior evaporator 17 in the heater core 25 and blows it into the vehicle compartment, thereby realizing dehumidifying and heating the vehicle compartment.

[0242] In the air-conditioning cooling mode, the refrigerant is evaporated in the interior evaporator 17 and chiller 18 of the heat pump cycle 10. The interior air-conditioning unit 50 then blows the blown air cooled by the interior evaporator 17 into the vehicle compartment, thereby cooling the vehicle compartment. Furthermore, the low-temperature side heat medium cooled by the chiller 18 is caused to flow into the coolant passage 70a of the battery 70 in the high-temperature side heat medium circuit 20, thereby cooling the battery 70.

[0243] In the single cooling mode, the refrigerant is evaporated in the chiller 18 of the heat pump cycle 10. The low-temperature side heat medium cooled in the chiller 18 is then caused to flow into the coolant passage 70a of the battery 70 in the high-temperature side heat medium circuit 20, thereby cooling the battery 70.

[0244] The hot gas heating mode is a heating mode selected when the outside air temperature is extremely low (for example, −10° C. or lower). In the hot gas heating mode, the high-temperature side heat medium heated by the condenser 13 and the subcooler 15 of the heat pump cycle 10 is caused to flow into the heater core 25 of the high-temperature side heat medium circuit 20. Furthermore, the refrigerant flowing out of the subcooler 15 and the refrigerant flowing out of the hot gas flow control valve 16d are mixed and then drawn into the compressor 11.

[0245] The interior air conditioning unit 50 blows the air heated by the heater core 25 into the vehicle interior, thereby realizing heating of the vehicle interior even when the outside air temperature is extremely low.

[0246] As described above, the vehicle air conditioner 1 of this embodiment can provide comfortable air conditioning for the vehicle interior and appropriately adjust the temperature of the battery 70, which is an on-board device, by switching the operation mode.

[0247] Furthermore, the heat pump module 100 including the heat pump functional assembly 101 of this embodiment can be made sufficiently compact, which results in a reduction in the size of the vehicle air conditioner 1, which is a heat pump cycle device, and improves the mountability of the vehicle air conditioner 1 in a vehicle.

[0248] More specifically, in the heat pump functional assembly 101 of this embodiment, the refrigerant channel section 200, the heat medium channel section 400, and the heat exchange section 300 are integrally formed by stacking a plurality of plate-like members. Therefore, there is no need to use fastening members for assembling the refrigerant channel section 200, the heat medium channel section 400, and the heat exchange section 300 together, or to secure the space required for assembly.

[0249] Furthermore, the heat exchanger 300 is disposed between the refrigerant flow path 200 and the heat medium flow path 400. Therefore, the refrigerant flow path 200 and the heat medium flow path 400 can be disposed apart from each other so that unnecessary heat exchange between the heat medium and the refrigerant at different temperatures can be suppressed without increasing the size of the heat pump functional assembly.

[0250] In addition, mounting portions such as a compressor mounting hole 218a and an expansion valve mounting hole 218b are formed in the refrigerant flow path portion 200. Therefore, other components such as the compressor 11, the cooling expansion valve 16a, the cooling expansion valve 16b, the evaporation pressure control valve 16c, and the hot gas flow control valve 16d can be directly mounted and arranged close to the refrigerant flow path portion 200. Therefore, the heat pump functional assembly 101 of this embodiment can be made sufficiently compact.

[0251] In the heat pump functional assembly 101 of this embodiment, the refrigerant flow path section 200, the heat exchange section 300, and the heat medium flow path section 400 are arranged side by side in the stacking direction. By stacking the plate-like members, it is possible to easily realize an arrangement in which the heat exchange section 300 is sandwiched between the refrigerant flow path section 200 and the heat medium flow path section 400.

[0252] In the heat exchange unit 300 of the heat pump functional assembly 101 of this embodiment, the refrigerant connection holes formed in the refrigerant flow path unit 200, which connect the flow path unit-side refrigerant passages with the heat exchange unit-side refrigerant passages, are aligned in a direction perpendicular to the refrigerant flow direction in the heat exchange unit-side refrigerant passages. Similarly, the heat medium connection holes connecting the flow path unit-side heat medium passages with the heat exchange unit-side heat medium passages are aligned in a direction perpendicular to the refrigerant flow direction in the heat exchange unit-side heat medium passages.

[0253] Specifically, a plurality of condenser refrigerant inlet holes 231a and a plurality of condenser refrigerant outlet holes 231b are arranged side by side in a direction perpendicular to the refrigerant flow direction in refrigerant passage 311g of condenser 13. Similarly, a plurality of condenser heat medium inlet holes 411a and a plurality of condenser heat medium outlet holes 411b are arranged side by side in a direction perpendicular to the refrigerant flow direction in heat medium passage 321g of condenser 13.

[0254] This allows the refrigerant to flow evenly in the width direction (i.e., X direction) of the refrigerant passage 311g of the condenser 13. Similarly, the heat medium to flow evenly in the width direction (i.e., X direction) of the heat medium passage 321g of the condenser 13. Therefore, the heat exchange performance of the condenser 13 can be improved.

[0255] The same applies to the subcooler 15 and the chiller 18. Therefore, in the heat exchange unit 300 of this embodiment, the heat exchange performance of the condenser 13, the subcooler 15, and the chiller 18 is improved, thereby making it possible to reduce the size of the condenser 13, the subcooler 15, and the chiller 18. As a result, it is possible to further reduce the size of the heat pump functional assembly 101.

[0256] Furthermore, since condenser 13 and subcooler 15 have a plurality of refrigerant connection holes, a brazing joint surface can be formed around the refrigerant connection holes, thereby improving the pressure resistance of condenser 13 and subcooler 15.

[0257] In the condenser 13 of the heat exchange unit 300 of this embodiment, the flow direction of the refrigerant through the refrigerant passage and the flow direction of the heat medium through the heat medium passage are opposite to each other. That is, the condenser 13 is configured as a so-called counterflow heat exchanger. Therefore, the heat exchange performance of the condenser 13 can be improved.

[0258] The same applies to the subcooler 15 and the chiller 18. Therefore, in the heat exchanger 300 of this embodiment, it is possible to reduce the size of the condenser 13, the subcooler 15, and the chiller 18. As a result, it is possible to further reduce the size of the heat pump functional assembly 101.

[0259] Furthermore, in the condenser 13, the refrigerant flows from top to bottom, so that the effect of gravity can prevent uneven flow of the condensed refrigerant. In the chiller 18, the refrigerant flows from top to bottom, so that the effect of gravity can prevent refrigeration oil from accumulating inside the chiller 18.

[0260] Furthermore, in the condenser 13, the high-temperature side heat medium and the low-temperature side heat medium flow from bottom to top, so that it is possible to prevent air bubbles from remaining in the heat medium passage 321g of the condenser 13, the heat medium passage 322g of the subcooler 15, and the heat medium passage 323g of the chiller 18.

[0261] In the heat exchange unit 300 of this embodiment, when viewed in the Z direction, the condenser 13, receiver 14, subcooler 15, and chiller 18 are arranged in this order in the X direction. In other words, the components are arranged in the X direction in descending order of the temperature of the refrigerant circulating therethrough.

[0262] This reduces the temperature difference between adjacent components and suppresses unnecessary heat exchange between a high-temperature refrigerant and a low-temperature refrigerant, thereby avoiding the need to increase the size of the condenser 13, sub-cooler 15, and chiller 18, and further reducing the size of the heat pump functional assembly 101.

[0263] Furthermore, in the heat exchange unit 300 of this embodiment, insulating holes 317 to 337 are formed between the portion through which the high-pressure refrigerant flows and the portion through which the low-pressure refrigerant flows. Specifically, in the heat exchange unit 300 of this embodiment, the insulating holes 317 to 337 are formed in the portion between the sub-cooler 15 and the chiller 18. This makes it possible to effectively suppress unnecessary heat exchange between a high-temperature refrigerant and a low-temperature refrigerant.

[0264] In the heat exchange unit 300 of this embodiment, at least a portion of the expansion valve side refrigerant passage 222g is arranged to overlap with the chiller 18 when viewed in the stacking direction. This allows the refrigerant flowing out of the sub-cooler 15 to be cooled by the refrigerant or heat transfer medium flowing through the chiller 18, thereby reducing enthalpy. As a result, the refrigeration capacity of the heat pump cycle 10 can be increased.

[0265] In the heat exchange unit 300 of this embodiment, when viewed from the stacking direction, the refrigerant-side liquid storage holes 314a and the partition-side liquid storage holes 334a are arranged so as to overlap and communicate with each other partially. Similarly, when viewed from the stacking direction, the heat medium-side liquid storage holes 324a and the partition-side liquid storage holes 334a are arranged so as to overlap and communicate with each other partially.

[0266] This allows the space formed inside the refrigerant-side liquid storage hole 314a, the space formed inside the heat medium-side liquid storage hole 324a, and the space formed inside the partition wall-side liquid storage hole 334a to be connected to each other, thereby forming a single space for storing liquid-phase refrigerant.

[0267] In this case, the space formed inside the refrigerant-side liquid storage hole 314a, the space formed inside the heat medium-side liquid storage hole 324a, and the space formed inside the partition-side liquid storage hole 334a are connected in the stacking direction, horizontal direction, and vertical direction. Therefore, even if the vehicle tilts, the liquid refrigerant is not unevenly concentrated in any one space, and the liquid refrigerant can be appropriately stored. As a result, the space for storing excess refrigerant can be reduced, further reducing the size of the heat pump functional assembly 101.

[0268] In the heat exchange unit 300 of this embodiment, when viewed from the stacking direction, the refrigerant-side support columns 314b, the heat medium-side support columns 324b, and the partition-wall-side support columns 334b ​​are arranged so as to partially overlap one another to form the columnar section 340. This improves the pressure resistance of the receiver 14.

[0269] Furthermore, the refrigerant flow path section 200 of this embodiment is provided with a refrigerant flow path section-side reservoir hole 224a and a refrigerant partition section-side reservoir hole 234a, which allows the volume of the receiver 14 to be increased without increasing the size of the heat pump functional assembly 101.

[0270] In the refrigerant flow path section 200 of this embodiment, a hot gas side refrigerant passage 221h is disposed between the expansion valve side refrigerant passage 222g and the chiller side refrigerant passage 223i. In operation modes other than the hot gas heating mode, high-pressure refrigerant does not flow through the hot gas side refrigerant passage 221h.

[0271] Therefore, in operating modes other than the hot gas heating mode, the hot gas side refrigerant passage 221h can suppress unnecessary heat exchange between the high-pressure refrigerant flowing through the sub-cooler expansion valve passage hole 222b and the low-pressure refrigerant flowing through the cooling expansion valve inlet passage hole 223e.

[0272] In addition, in the refrigerant flow path portion 200 of this embodiment, a plurality of refrigerant flow path forming plates 220, each having the same shaped refrigerant flow path forming holes, are stacked in series when viewed in the stacking direction. This makes it possible to adjust the passage cross-sectional area of ​​the flow path portion-side refrigerant passages formed by the refrigerant flow path forming holes by changing the number of stacked refrigerant flow path forming plates 220.

[0273] Furthermore, a relatively thin metal plate of about 1 mm can be used as the plate-shaped member, which makes it possible to form a relatively thin through-hole in the plate-shaped member, such as the heat insulating hole 327. This also applies to other plate-shaped members.

[0274] Similarly, in the heat exchanger 300 of this embodiment, when viewed from the stacking direction, a plurality of heat exchanger refrigerant plates 310, each having the same shaped refrigerant passage-forming holes formed therein, are stacked in series. Furthermore, a plurality of heat exchanger heat medium plates 320, each having the same shaped heat medium passage-forming holes formed therein, are stacked in series.

[0275] This allows the cross-sectional area of ​​the heat exchange section side refrigerant passage to be adjusted by changing the number of stacked heat exchange section refrigerant plates 310. Furthermore, the cross-sectional area of ​​the heat exchange section side heat medium passage can be adjusted by changing the number of stacked heat exchange section heat medium plates 320. Therefore, it is possible to form the heat exchange section side refrigerant passage and the heat exchange section side heat medium passage with appropriate cross-sectional areas for the heat exchange section partition plate 330.

[0276] As described above, the heat pump module 100 of this embodiment allows for a sufficient reduction in size of the heat pump functional assembly 101. Furthermore, the compression section 11, the cooling expansion valve 16a, the cooling expansion valve 16b, the evaporation pressure control valve 16c, and the hot gas flow rate control valve 16d can be directly attached to both sides of the refrigerant flow path section 200 and disposed in close proximity to the heat pump functional assembly 101.

[0277] In the heat pump module 100 of this embodiment, the heat exchange unit 300 is disposed between the refrigerant flow path unit 200 and the heat medium flow path unit 400, and the compressor 11 is attached to the refrigerant flow path unit 200 side. This improves the degree of freedom in arranging the high-temperature side heat medium inlet pipe 112a, the high-temperature side heat medium outlet pipe 112b, the low-temperature side heat medium inlet pipe 113a, and the low-temperature side heat medium outlet pipe 113b in the heat medium flow path unit 400.

[0278] Therefore, the heat pump module 100 of this embodiment can be sufficiently miniaturized, which results in a miniaturized vehicle air conditioner 1 and improves the mountability of the vehicle air conditioner 1 in a vehicle.

[0279] Second Embodiment In this embodiment, a heat pump module 100a including a heat pump function assembly 101a will be described.

[0280] In the heat pump function assembly 101a, as shown in FIG. 19, the positions of the pressure reducing sections such as the air conditioning expansion valve 16a, the cooling expansion valve 16b, the evaporation pressure control valve 16c, and the hot gas flow rate control valve 16d, as well as the chiller 18, which is the evaporation heat exchange section, are changed compared to the heat pump function assembly 101 described in the first embodiment.

[0281] More specifically, the insulating holes formed in each plate-like member are enlarged to form a space for disposing a pressure reducing section inside the insulating holes. Figure 19 illustrates the insulating holes 437a formed in the heat medium flow path outer wall plate 430, among the insulating holes formed in each plate-like member.

[0282] In the heat pump functional assembly 101a of this embodiment, when viewed in the Z direction, the condenser 13, receiver 14, sub-cooler 15, pressure reducing section, and chiller 18 are arranged in this order in the X direction.

[0283] The rest of the configuration and operation of the vehicle air conditioner 1 are the same as those of the first embodiment. Therefore, the heat pump module 100a of this embodiment can also achieve the same effects as those of the first embodiment. That is, the heat pump module 100a can be sufficiently miniaturized, and the vehicle air conditioner 1 can be easily installed in a vehicle.

[0284] Furthermore, in the heat pump functional assembly 101a of this embodiment, when viewed in the Z direction, the condenser 13, receiver 14, subcooler 15, pressure reducing section, and chiller 18 are arranged in this order in the X direction. This increases the distance between the subcooler 15 and the chiller 18, effectively suppressing unnecessary heat exchange between a high-temperature refrigerant and a low-temperature refrigerant.

[0285] Third Embodiment In this embodiment, a heat pump module 100b including a heat pump function assembly 101b will be described.

[0286] In the heat pump functional assembly 101b, as compared with the heat pump functional assembly 101 described in the first embodiment, the heat medium flow path forming plate 420 and the heat medium flow path outer wall plate 430 of the heat medium flow path section 400 are eliminated, as shown in FIG.

[0287] Furthermore, in the heat pump function assembly 101b, a condenser inlet side pipe 441a, a condenser outlet side pipe 441b, a subcooler inlet side pipe 442a, a subcooler outlet side pipe 442b, a chiller inlet side pipe 443a, and a chiller outlet side pipe 443b are added.

[0288] The condenser inlet pipe 441a is a pipe that allows the high-temperature heat medium to flow into the heat pump functional assembly 101b. The condenser inlet pipe 441a is joined to the heat medium flow path partition plate 410 so as to communicate with a plurality of condenser heat medium inlet holes 411a formed in the heat medium flow path partition plate 410.

[0289] The condenser outlet pipe 441b is a pipe for discharging the high-temperature side heat medium from the heat pump functional assembly 101b, and is joined to the heat medium flow path partition plate 410 so as to communicate with the plurality of condenser heat medium outlet holes 411b formed in the heat medium flow path partition plate 410.

[0290] The subcooler inlet pipe 442a is a pipe that allows the high-temperature side heat medium to flow into the heat pump function assembly 101b. The subcooler inlet pipe 442a is joined to the heat medium flow path partition plate 410 so as to communicate with a plurality of subcooler heat medium inlet holes 412a formed in the heat medium flow path partition plate 410.

[0291] The subcooler outlet pipe 442b is a pipe through which the high-temperature side heat medium flows out from the heat pump functional assembly 101b, and is joined to the heat medium flow path partition plate 410 so as to communicate with the subcooler heat medium outlet holes 412b formed in the heat medium flow path partition plate 410.

[0292] The chiller inlet pipe 443a is a pipe that allows the low-temperature heat medium to flow into the heat pump function assembly 101b. The chiller inlet pipe 443a is joined to the heat medium flow path partition plate 410 so as to communicate with a plurality of chiller heat medium inlet holes 413a formed in the heat medium flow path partition plate 410.

[0293] The chiller outlet pipe 443b is a pipe through which the low-temperature heat medium flows out from the heat pump functional assembly 101b. The chiller outlet pipe 443b is joined to the heat medium flow path partition plate 410 so as to communicate with a plurality of chiller heat medium outlet holes 413b formed in the heat medium flow path partition plate 410.

[0294] Therefore, in the heat pump functional assembly 101b, the refrigerant channel section 200 and the heat exchange section 300 are formed by stacking plate-like members, while the heat medium channel section 400 is not formed by stacking plate-like members. The condenser inlet side pipe 441a, the condenser outlet side pipe 441b, the subcooler inlet side pipe 442a, the subcooler outlet side pipe 442b, the chiller inlet side pipe 443a, and the chiller outlet side pipe 443b form part of the heat medium channel section 400.

[0295] The rest of the configuration and operation of the vehicle air conditioner 1 are the same as those of the first embodiment. The heat pump module 100b of this embodiment can also achieve the same effects as those of the first embodiment. That is, the heat pump module 100b can be sufficiently miniaturized, and the vehicle air conditioner 1 can be easily installed in a vehicle.

[0296] In this embodiment, a heat pump module 100c including a heat pump function assembly 101c according to the present disclosure is applied to a vehicle air conditioner 1c. As shown in the overall configuration diagram of Fig. 21, the vehicle air conditioner 1c includes a heat pump cycle 10c, a high-temperature side heat medium circuit 20, a low-temperature side heat medium circuit 30, a control device 60, a cooling side heat medium circuit 80, etc.

[0297] The heat pump cycle 10c differs from the heat pump cycle 10 described in the first embodiment in that it employs a receiver 14 formed of a metal cylindrical member with a bottom. In addition, the heat pump cycle 10c does not include the first refrigerant three-way joint 12a, the fourth refrigerant three-way joint 12d, the subcooler 15, the evaporation pressure control valve 16c, the hot gas flow rate control valve 16d, and the indoor evaporator 17.

[0298] Therefore, the outlet of the cooling expansion valve 16a of the heat pump cycle 10c is connected to the inlet side of the refrigerant passage of the cooling chiller 17a. The cooling chiller 17a has a basic configuration similar to that of the chiller 18.

[0299] The cooling chiller 17a has a refrigerant passage through which the low-pressure refrigerant decompressed by the cooling expansion valve 16a flows, and a heat medium passage through which the cooling-side heat medium circulating in the cooling-side heat medium circuit 80 flows. The cooling chiller 17a is an evaporation heat exchanger that exchanges heat between the low-pressure refrigerant decompressed by the cooling expansion valve 16a and the cooling-side heat medium, thereby evaporating the low-pressure refrigerant. The cooling chiller 17a cools the cooling-side heat medium by evaporating the low-pressure refrigerant and exerting a heat absorption effect.

[0300] The refrigerant outlet of the cooling chiller 17a is connected to one inlet of the third refrigerant three-way joint 12c, and the refrigerant outlet of the chiller 18 of the heat pump cycle 10c is connected to the other inlet of the third refrigerant three-way joint 12c via a check valve 19a.

[0301] The check valve 19a allows refrigerant to flow from the refrigerant outlet side of the chiller 18 to the third refrigerant three-way joint section 12c side, and prohibits refrigerant from flowing from the third refrigerant three-way joint section 12c side to the refrigerant outlet side of the chiller 18.

[0302] The third refrigerant three-way joint 12c in this embodiment is formed by a joint block 19. The joint block 19 is a metal block member having a plurality of refrigerant passages including the third refrigerant three-way joint 12c formed therein. The check valve 19a is disposed inside the joint block 19. The suction side connecting pipe 111b is brazed to the outlet side of the third refrigerant three-way joint 12c of the joint block 19.

[0303] Next, the cooling-side heat medium circuit 80 will be described. The cooling-side heat medium circuit 80 is a circuit that circulates the cooling-side heat medium. In this embodiment, the same type of heat medium as the high-temperature side heat medium is used as the cooling-side heat medium. The cooling-side heat medium circuit 80 includes a cooling-side pump 81, a heat medium passage of the cooling chiller 17a, and a cooler core 82.

[0304] The cooling-side pump 81 is a cooling-side heat medium pumping unit that sucks in and pumps out the cooling-side heat medium flowing out from the cooler core 82. The basic configuration of the cooling-side pump 81 is similar to that of the high-temperature-side pump 21. The inlet side of the heat medium passage of the cooling chiller 17a is connected to the discharge port of the cooling-side pump 81. The heat medium inlet side of the cooler core 82 is connected to the outlet of the heat medium passage of the cooling chiller 17a.

[0305] The cooler core 82 is disposed in the air conditioning case 51 of the indoor air conditioning unit 50, similar to the indoor evaporator 17 described in the first embodiment. The cooler core 82 is a cooling heat exchanger that cools the blown air by exchanging heat between the cooling-side heat medium cooled by the cooling chiller 17a and the blown air. The heat medium outlet of the cooler core 82 is connected to the suction port side of the cooling-side pump 81.

[0306] Next, the detailed configuration of the heat pump functional assembly 101c of this embodiment will be described using Figures 22 and 23. The heat pump functional assembly 101c of this embodiment is an assembly that integrates the refrigerant passage, condenser 13, cooling chiller 17a, chiller 18, and heat medium passage, which are surrounded by thin dashed lines in the overall configuration diagram of Figure 21.

[0307] The heat pump functional assembly 101c has a refrigerant flow path section 500, a heat exchange section 600, and a heat medium flow path section 700. In the heat pump functional assembly 101c, as shown in Fig. 22, the refrigerant flow path section 500 and the heat exchange section 600 are formed by stacking a plurality of plate-shaped members. The plate-shaped members are formed of an aluminum alloy.

[0308] The refrigerant flow path section 500, the heat exchange section 600, and the heat medium flow path section 700 are arranged side by side in the stacking direction of the plate-like members. The heat exchange section 600 is arranged so as to be sandwiched between the refrigerant flow path section 500 and the heat medium flow path section 700.

[0309] 22 to 24, the refrigerant flow path section 500 is formed by bonding together the flat surfaces of a compressor-side plate 510, which is a rectangular plate-like member, and a heat exchanger-side plate 520. The compressor-side plate 510 and the heat exchanger-side plate 520 are formed to have the same area when viewed in the stacking direction.

[0310] The compressor-side plate 510 is formed by press working with a plurality of compressor-side protrusions 511 that protrude toward the compressor 11. The heat exchanger-side plate 520 is formed by press working with a plurality of heat exchanger-side protrusions 521 that protrude toward the heat exchanger 600.

[0311] Therefore, when the flat surfaces of the compressor side plate 510 and the heat exchange unit side plate 520 are bonded together, multiple flow path unit side refrigerant passages 500a are formed inside the compressor side protrusion 511 and the heat exchange unit side protrusion 521.

[0312] The refrigerant flow path section 500 also has a compressor mounting hole 518a, an expansion valve mounting hole 518b, a receiver mounting hole 518d, and a block mounting hole 518e formed as mounting portions. The receiver mounting hole 518d is a mounting portion for fixing the receiver 14. The block mounting hole 518e is a mounting portion for fixing the joint block 19. The refrigerant flow path section 500 also has a bracket mounting hole 518c formed as an object mounting portion.

[0313] The heat exchange unit 600 is divided into a plurality of sections (three in this embodiment), which respectively form the condenser 13, the cooling chiller 17a, and the chiller 18. The condenser 13, the cooling chiller 17a, and the chiller 18 are each formed by stacking a plurality of different plate-shaped members formed from separate members.

[0314] The condenser 13, the cooling chiller 17a, and the chiller 18 have the same configuration as a so-called plate stack type heat exchanger. The condenser 13, the cooling chiller 17a, and the chiller 18 are each formed as an independent heat exchange unit.

[0315] The detailed configuration of the heat exchanger 600 will be described using the cooling chiller 17a as an example. As shown in the cross-sectional view of Figure 23, the cooling chiller 17a has a refrigerant flow path partition plate 610, a plurality of first heat transfer plates 620, a plurality of second heat transfer plates 630, a heat medium partition plate 640, and the like.

[0316] The refrigerant flow path partition plate 610 is a rectangular plate-like member having an area smaller than that of the compressor-side plate 510 and the heat exchange unit-side plate 520 when viewed in the stacking direction. One flat surface of the refrigerant flow path partition plate 610 is joined to the heat exchange unit-side plate 520 of the refrigerant flow path section 500. The refrigerant flow path partition plate 610 has communication holes 610a formed therein that communicate with the flow path section-side refrigerant passages 500a formed in the refrigerant flow path section 500.

[0317] A plurality of first heat transfer plates 620 and a plurality of second heat transfer plates 630 are stacked on the other flat surface of the refrigerant flow path partition plate 610. The first heat transfer plates 620 and the second heat transfer plates 630 are rectangular plate-like members with the same area as the refrigerant flow path partition plate 610. The first heat transfer plates 620 and the second heat transfer plates 630 are stacked alternately so that their flat surfaces are parallel to each other.

[0318] The first heat transfer plate 620 and the second heat transfer plate 630 each have through holes that pass through the plate from front to back to allow the refrigerant or cooling-side heat medium to circulate therethrough. A plurality of protruding portions that protrude in the stacking direction are formed on the outer peripheries, opening edges of the through holes, flat surfaces, etc. of the first heat transfer plate 620 and the second heat transfer plate 630.

[0319] The protruding portions of the first heat transfer plate 620 and the second heat transfer plate 630 are brazed to the adjacent first heat transfer plate 620 or second heat transfer plate 630. Therefore, a gap space is formed in the area where no protruding portion is formed between the adjacent first heat transfer plate 620 and second heat transfer plate 630. The gap space serves as a refrigerant passage through which the refrigerant flows, or a heat medium passage through which the cooling-side heat medium flows.

[0320] The protruding portions of the first heat transfer plate 620 and the protruding portions of the second heat transfer plate 630 are formed in different shapes. As a result, in the cooling chiller 17a, the first heat transfer plates 620 and the second heat transfer plates 630 are alternately stacked and joined together, so that refrigerant passages and heat medium passages are formed alternately in the stacking direction.

[0321] A heat medium partition plate 640 is joined to the outermost second heat transfer plate 630 in the stacking direction (i.e., the second heat transfer plate 630 farthest from the refrigerant channel section 500). The heat medium partition plate 640 is a rectangular plate-like member having an area equivalent to that of the refrigerant channel partition plate 610.

[0322] A cooling chiller inlet pipe 644a and a cooling chiller outlet pipe 644b are connected to the heat medium partition plate 640. The cooling chiller inlet pipe 644a is a pipe that allows the cooling-side heat medium to flow into the heat medium passage of the cooling chiller 17a. The cooling chiller outlet pipe 644b is a pipe that allows the cooling-side heat medium to flow out from the heat medium passage of the cooling chiller 17a.

[0323] Therefore, the heat medium partition plate 640, the cooling chiller inlet side pipe 644a, and the cooling chiller outlet side pipe 644b form a part of the heat medium flow path section 700 for the cooling chiller 17a.

[0324] The basic configurations of the condenser 13 and chiller 18 of this embodiment are similar to those of the cooling chiller 17a. Therefore, a condenser inlet-side pipe 641a and a condenser outlet-side pipe 641b are connected to the heat medium partition plate of the condenser 13. The heat medium partition plate, condenser inlet-side pipe 641a, and condenser outlet-side pipe 641b of the condenser 13 form a part of a heat medium flow path section 700 for the condenser 13.

[0325] Furthermore, a chiller inlet-side pipe 643a and a chiller outlet-side pipe 643b are connected to the heat medium partition plate of the chiller 18. The heat medium partition plate, chiller inlet-side pipe 643a, and chiller outlet-side pipe 643b of the chiller 18 form part of a heat medium channel section 700 for the chiller 18. That is, in this embodiment, the same number of heat medium channel sections 700 as the number of heat exchange sections 600 (three in this embodiment) are provided.

[0326] Next, the heat pump module 100c will be described. As shown in Fig. 24, the heat pump module 100c is a functional body in which the compressor 11, the cooling expansion valve 16a, the cooling expansion valve 16b, and the joint block 19 are integrated into a heat pump functional assembly 101c.

[0327] Specifically, the compressor 11, the joint block 19, and the bracket 114b are attached to the flat surface of the refrigerant passage section 500 on the side opposite to the side on which the heat exchange section 600 is disposed.

[0328] The compressor 11 is fixed by bolts to a compressor mounting hole 518a in the refrigerant flow path section 500. The joint block 19 is fixed by bolts to a block mounting hole 518e in the refrigerant flow path section 500. The bracket 114b is fixed by bolts to a bracket mounting hole 518c in the refrigerant flow path section 500.

[0329] The receiver 14, the cooling expansion valve 16a, and the cooling expansion valve 16b are attached to the flat surface of the refrigerant flow path section 500 on the side where the heat exchange section 600 is disposed.

[0330] The receiver 14 is fixed by bolts to a receiver mounting hole 518d of the refrigerant flow path portion 500. In this embodiment, an expansion valve unit that houses the cooling expansion valve 16a and the cooling expansion valve 16b in a single housing is fixed by bolts to an expansion valve mounting hole 518b of the refrigerant flow path portion 500.

[0331] In addition, the control device 60 of the vehicle air conditioner 1c detects the cooling-side refrigerant temperature Tcr of the refrigerant flowing out from the refrigerant passage of the cooling chiller 17a using an evaporator temperature sensor. The rest of the configuration of the heat pump module 100c and the vehicle air conditioner 1c is similar to that of the heat pump module 100 and the vehicle air conditioner 1 described in the first embodiment.

[0332] Next, the operation of the vehicle air conditioner 1c of this embodiment with the above configuration will be described. As with the first embodiment, the vehicle air conditioner 1c of this embodiment can execute various operation modes.

[0333] In the vehicle air conditioner 1c, in the operation modes in which the cooler core 82 cools the blown air, i.e., the cooling mode, the dehumidifying heating mode, and the cooling and cooling mode, the cooling-side pump 81 is operated to exert a predetermined pumping capacity. Other operations of the vehicle air conditioner 1c are the same as those in the first embodiment.

[0334] Therefore, according to the vehicle air conditioner 1c of this embodiment, by switching the operation mode, it is possible to provide comfortable air conditioning for the vehicle interior and to appropriately adjust the temperature of the battery 70, which is an on-board device.

[0335] Furthermore, the heat pump module 100c including the heat pump function assembly 101c of this embodiment can also achieve the same effects as those of the first embodiment. That is, the heat pump module 100c can be sufficiently miniaturized, and the vehicle air conditioner 1c can be easily installed in a vehicle.

[0336] In addition, in the heat pump function assembly 101c of this embodiment, the condenser 13, the cooling chiller 17a, and the chiller 18 are separately provided as the heat exchanger 600.

[0337] Furthermore, the condenser 13, the cooling chiller 17a, and the chiller 18 are formed by stacking plate-like members formed from separate members. Each heat exchanger 600 is provided with a heat medium flow path section 700. That is, the same number of heat medium flow path sections 700 as the heat exchanger sections 600 are provided.

[0338] This allows for greater flexibility in the placement of the heat exchange sections 600 in the refrigerant flow path section 500, as the condenser 13, the cooling chiller 17a, and the chiller 18 are provided separately. For example, by placing an expansion valve unit or the like between the condenser 13 and the cooling chiller 17a, unnecessary heat exchange between the high-temperature, high-pressure refrigerant and the low-temperature, low-pressure refrigerant can be suppressed.

[0339] Furthermore, plate-like members of the same shape can be used to form each heat exchanger 600. By changing the number of plate-like members stacked, it is possible to easily vary the heat exchange performance of each heat exchanger 600. This improves the productivity of the heat pump module 100c including the heat pump functional assembly 101c.

[0340] The present disclosure is not limited to the above-described embodiments, and various modifications can be made as follows within the scope of the present disclosure.

[0341] In the above-described embodiment, an example was described in which the heat pump modules 100 to 100c according to the present disclosure are applied to vehicle air conditioners 1, 1c, but the application of the heat pump modules 100 to 100c is not limited to vehicle air conditioners.

[0342] For example, the heat pump module according to the present disclosure may be applied to a stationary hot water supply system that adjusts the temperature of air sent to a space to be air-conditioned and also adjusts the temperature of water for daily use.For example, the heat pump module according to the present disclosure may be applied to a stationary air conditioner for a data center that adjusts the temperature of air sent to a space to be air-conditioned and also adjusts the temperature of computer servers.

[0343] Furthermore, the heat pump cycle to which the heat pump module according to the present disclosure can be applied is not limited to the cycles having the configurations disclosed in the above embodiments, but may be applied to, for example, a cycle that does not perform the hot gas operation mode, such as the heat pump cycle 10c described in the fourth embodiment, in which the refrigerant flow path from the first refrigerant three-way joint 12a to the fourth refrigerant three-way joint 12d and the hot gas flow control valve 16d are eliminated.

[0344] The configurations of the heat pump functional assemblies 101 to 101c and the heat pump modules 100 to 100c according to the present disclosure are not limited to those disclosed in the above-described embodiments.

[0345] For example, the heat exchange unit 300 in the above embodiment includes the condenser 13, the subcooler 15, and the chiller 18, but it is sufficient if the heat exchange unit 300 includes at least one heat exchange unit. For example, the heat exchange unit 300 does not necessarily have to include the receiver 14.

[0346] Furthermore, the arrangement of the liquid storage holes forming the receiver 14 is not limited to the examples disclosed in the above-described embodiments.

[0347] For example, the refrigerant-side liquid storage hole 314a and the partition-side liquid storage hole 334a may be arranged so that they completely overlap when viewed from the stacking direction.Furthermore, the refrigerant-side liquid storage hole 314a and the heat medium-side liquid storage hole 324a may be arranged so that they partially overlap when viewed from the stacking direction, so that their internal spaces communicate with each other.

[0348] For example, any combination of the refrigerant-side liquid storage hole 314a, the heat medium-side liquid storage hole 324a, and the partition-side liquid storage hole 334a may be arranged so that a portion of each hole overlaps the other and the internal spaces communicate with each other.

[0349] In the above embodiment, the fourth refrigerant three-way joint 12d and the third heat medium three-way joint 22c are formed as separate members from the heat pump functional assemblies 101-101b, but this is not limiting. The fourth refrigerant three-way joint 12d and the third heat medium three-way joint 22c may be formed inside the heat pump functional assemblies 101-101b. Furthermore, the third heat medium three-way joint 22c may be disposed in an expansion valve unit that houses the cooling expansion valve 16b and the hot gas flow control valve 16d in a single housing.

[0350] In the above embodiment, the plate-shaped members constituting the heat pump functional assemblies 101 to 101b are made of an aluminum alloy, but the plate-shaped members are not limited to this. For example, the plate-shaped members may be made of copper or stainless steel.

[0351] In the above embodiment, the through holes are formed in the plate-like members that form the heat pump functional assemblies 101 to 101b by press working, but this is not limiting. For example, the through holes may be formed in the plate-like members by machining, wire cutting, electric discharge machining, or the like.

[0352] In the above embodiment, the lightening holes 229 are formed in the refrigerant flow path forming plate 220, which is a plate-like member. However, similar lightening holes may be formed in other plate-like members as long as their functions are not impaired. Furthermore, the shape of the lightening holes is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, or a so-called oblong shape in which two parallel sides are connected by an arc.

[0353] In the above embodiment, various attachment portions are formed on the refrigerant flow path portion 200, but the present invention is not limited to this. The attachment portions may be formed on the heat medium flow path portion 400.

[0354] In the above embodiment, the bracket 114, which is the object mounting portion, is mounted in only one location. However, the bracket 114 may be mounted in multiple locations. In this case, additional bracket mounting holes may be formed in at least one of the refrigerant flow path portion 200 and the heat medium flow path portion 400.

[0355] In the first embodiment, the refrigerant flow path section 200, the heat exchange section 300, and the heat medium flow path section 400 are formed by stacking a plurality of plate-like members, but the present invention is not limited to this. As in the third embodiment, if at least two of the refrigerant flow path section 200, the heat exchange section 300, and the heat medium flow path section 400 are integrally formed by stacking a plurality of plate-like members, the effect of reducing the size of the heat pump functional assembly can be achieved.

[0356] In the fourth embodiment described above, the joint block 19 is fixed to the block mounting holes 518e of the refrigerant channel section 500 by bolting, but the present invention is not limited to this. The joint block 19 may be brazed to the refrigerant channel section 500. In the fourth embodiment described above, the refrigerant channel section 500 is provided with one refrigerant channel section 500 and multiple heat medium channel sections 700, but the refrigerant channel section 500 may be provided with one heat medium channel section 700 and multiple refrigerant channel sections 500.

[0357] In the above embodiment, the refrigerant used in the heat pump cycle 10 is R1234yf, but this is not limiting. For example, R134a, R600a, R410A, R404A, R32, R407C, R290, R744, or a mixture of these refrigerants may be used. When R744 is used, a supercritical refrigeration cycle may be configured in which the pressure of the high-pressure side refrigerant exceeds the critical pressure of the refrigerant.

[0358] In the above embodiment, an example in which an ethylene glycol aqueous solution is used as the heat medium is described, but the present invention is not limited to this. For example, a solution containing dimethylpolysiloxane or nanofluid, an antifreeze, an aqueous liquid refrigerant containing alcohol, or a liquid medium containing oil may be used.

[0359] In the above embodiment, the heat pump modules 100 to 100b are described as being capable of generating heat or cold as a certain function that can be performed, but the certain function is not limited to this. For example, the heat pump modules 100 to 100b may have a predetermined interface and be attachable to an attachment target having a corresponding interface.

[0360] The means disclosed in each of the above-described embodiments may be combined as appropriate within a practicable range. For example, in the heat pump functional assembly 101a described in the second embodiment, the heat medium flow path portion 400 may be eliminated, and the condenser inlet pipe 441a, the condenser outlet pipe 441b, etc. described in the third embodiment may be adopted.

[0361] The heat pump function assembly and heat pump module disclosed in this specification have the following features: (Item 1) A heat pump function assembly integrating components (13, 14, 15, 17a, 18) that constitute a heat pump cycle device (1), comprising: a refrigerant flow path section (200, 500) in which flow path section-side refrigerant passages (221g, 221h, 221i, 222g, 223g, 223h, 223i, 500a) are formed, through which a refrigerant flows; a heat medium flow path section (400, 700) in which flow path section-side heat medium passages (421g, 421h, 421i, 421j, 422g, 422h) are formed, through which a heat medium flows; and a heat exchange section (300, 600) that exchanges heat between the refrigerant that has flowed through the flow path section-side refrigerant passages and the heat medium that has flowed through the flow path section-side heat medium passages. at least two of the refrigerant flow path portion, the heat medium flow path portion, and the heat exchange portion are formed by stacking a plurality of plate-shaped members (210, 220, 230, 310, 320, 330, 410, 420, 430, 510, 520, 610, 620, 630, 640), the heat exchange portion is disposed so as to be sandwiched between the refrigerant flow path portion and the heat medium flow path portion, and at least one of the refrigerant flow path portion and the heat medium flow path portion is formed with an attachment portion (218a, 218b, 228a, 228b, 238b, 518a, 518b, 518d, 518e) for fixing another component device.(Item 2) The heat pump functional assembly according to item 1, wherein the heat exchanger is formed with heat exchanger-side refrigerant passages (311a, 312b, 313a) through which the refrigerant flows, and heat exchanger-side heat medium passages (321a, 322a, 323a) through which the heat medium flows, the flow path section-side refrigerant passages and the heat exchanger-side refrigerant passages are connected via a plurality of refrigerant connection holes (231a, 231b, 232a, 232b, 233a, 233b), the refrigerant connection holes are arranged side by side in a direction perpendicular to the flow direction of the refrigerant in the heat exchanger-side refrigerant passages, and the flow path section-side heat medium passages and the heat exchanger-side heat medium passages are connected via a plurality of heat medium connection holes (411a, 411b, 412a, 412b, 413a, 413b), and the heat medium connection holes are arranged side by side in a direction perpendicular to the flow direction of the refrigerant in the heat exchanger-side refrigerant passages. (Item 3) The heat pump functional assembly according to item 1 or 2, wherein the refrigerant flow path portion, the heat medium flow path portion, and the heat exchange portion are arranged side by side in the stacking direction of the plate-like members. (Item 4) The heat pump functional assembly according to any one of items 1 to 3, wherein the heat exchange portion has a condensation heat exchange portion (13) that condenses the refrigerant and an evaporation heat exchange portion (17a, 18) that evaporates the refrigerant. (Item 5) The heat pump functional assembly according to item 4, wherein the heat exchange portion has a liquid storage portion (14) that stores the refrigerant condensed in the condensation heat exchange portion.(Item 6) The heat exchange section has, as the plate-like members, a heat exchange section refrigerant plate (310) forming heat exchange section side refrigerant passages (311a, 312b, 313a) through which the refrigerant flows, a heat exchange section heat medium plate (320) forming heat exchange section side heat medium passages (321a, 322a, 323a) through which the heat medium flows, and a heat exchange section partition plate (330) arranged between the heat exchange section refrigerant plate and the heat exchange section heat medium plate, wherein the heat exchange section refrigerant plate has a plurality of refrigerant side liquid storage holes (314a) forming the liquid storage section, the heat exchange section heat medium plate has a plurality of heat medium side liquid storage holes (324a) forming the liquid storage section, and the heat exchange section partition plate has a plurality of partition side liquid storage holes (334a) forming the liquid storage section, Item 7. The heat pump functional assembly according to item 5, wherein, when viewed from the stacking direction of the plate-like members, any two of the refrigerant-side liquid storage section holes, the heat medium-side liquid storage section holes, and the partition wall-side liquid storage section holes are arranged so that internal spaces thereof communicate with each other by partially overlapping each other. (Item 8) The heat pump functional assembly according to item 6, wherein refrigerant-side support columns (314b) are formed between adjacent refrigerant-side liquid storage section holes of the heat exchanger section refrigerant plates, heat medium-side support columns (324b) are formed between adjacent heat medium-side liquid storage section holes of the heat exchanger section heat medium plates, and partition wall-side support columns (334b) are formed between adjacent partition wall-side liquid storage section holes of the heat exchanger section partition plates, and when viewed from the stacking direction, the refrigerant-side support columns, the heat medium-side support columns, and the partition wall-side support columns partially overlap each other. (Item 8) The heat pump functional assembly according to any one of Items 1 to 7, wherein at least one of the refrigerant flow path portion and the heat medium flow path portion has an object mounting portion (218c, 228c, 238c) for mounting to an object to be mounted. (Item 9) The heat pump functional assembly according to any one of Items 1 to 8, wherein the refrigerant flow path portion has a plurality of refrigerant flow path forming plates (220) continuously stacked as the plate-like members, and the refrigerant flow path plates have refrigerant passage forming holes (221a, 221d, 222b, 223c, 223e) for forming the flow path portion-side refrigerant passages.(Item 10) The heat pump functional assembly according to any one of items 1 to 9, wherein the plate-like members forming the heat exchange unit have a heat insulating portion (317, 327, 337) that prevents heat transfer, and the heat insulating portion is disposed between a portion of the heat pump cycle through which a high-pressure refrigerant flows and a portion of the heat pump cycle through which a low-pressure refrigerant flows. (Item 11) The heat pump functional assembly according to item 10, wherein the heat exchange unit has a condensation heat exchange unit (13) that condenses the refrigerant and an evaporation heat exchange unit (18) that evaporates the refrigerant, and the heat insulating portion is disposed between the condensation heat exchange unit and the evaporation heat exchange unit. (Item 12) The heat pump functional assembly according to any one of items 1 to 8, wherein a plurality of the heat exchange units are provided, and the plurality of heat exchange units are formed by stacking the plate-like members formed of separate members, and a plurality of either the refrigerant flow path portion or the heat medium flow path portion is provided.(Item 13) A heat pump cycle device (1, 1c) including a heat pump function assembly (101, 101a, 101b, 101c) that integrates components (13, 14, 15, 17a, 18) that constitute the heat pump cycle device (1, 1c), a compression section (11) that compresses and discharges a refrigerant, and decompression sections (16a to 16d) that decompress the refrigerant, the heat pump functional assembly includes a refrigerant flow path section (200, 500) in which flow path section side refrigerant passages (221g, 221h, 221i, 222g, 223g, 223h, 223i, 500a) are formed, through which the refrigerant flows; a heat medium flow path section (400, 700) in which flow path section side heat medium passages (421g, 421h, 421i, 421j, 422g, 422h) are formed, through which a heat medium flows; and a heat exchange section (300, 600) that exchanges heat between the refrigerant that has flowed through the flow path section side refrigerant passages and the heat medium that has flowed through the flow path section side heat medium passages, a heat pump module in which at least two of the refrigerant flow path section, the heat medium flow path section, and the heat exchange section are formed by stacking a plurality of plate-shaped members (210, 220, 230, 310, 320, 330, 410, 420, 430, 510, 520, 610, 620, 630, 640), the heat exchange section is arranged to be sandwiched between the refrigerant flow path section and the heat medium flow path section, the refrigerant flow path section is formed in a flat plate shape, the compression section is attached to a surface of the refrigerant flow path section opposite to the side where the heat exchange section is arranged, and the decompression section is attached to a surface of the refrigerant flow path section where the heat exchange section is arranged.

[0362] Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and equivalent modifications. In addition, various combinations and forms, including only one element, more than one element, or less than one element, are also within the scope and spirit of the present disclosure.

Claims

1. A heat pump function assembly integrating components (13, 14, 15, 17a, 18) constituting a heat pump cycle device (1, 1c), comprising: a refrigerant flow path section (200, 500) in which a flow path section-side refrigerant passage (221g, 221h, 221i, 222g, 223g, 223h, 223i, 500a) is formed, through which a refrigerant flows; a heat medium flow path section (400, 700) in which a flow path section-side heat medium passage (421g, 421h, 421i, 421j, 422g, 422h) is formed, through which a heat medium flows; and a heat exchange section (300, 600) for exchanging heat between the refrigerant flowing through the flow path section-side refrigerant passage and the heat medium flowing through the flow path section-side heat medium passage, at least two of the refrigerant flow path portion, the heat medium flow path portion, and the heat exchange portion are formed by stacking a plurality of plate-shaped members (210, 220, 230, 310, 320, 330, 410, 420, 430, 510, 520, 610, 620, 630, 640), the heat exchange portion is disposed so as to be sandwiched between the refrigerant flow path portion and the heat medium flow path portion, and at least one of the refrigerant flow path portion and the heat medium flow path portion is formed with an attachment portion (218a, 218b, 228a, 228b, 238b, 518a, 518b, 518d, 518e) for fixing another component device.

2. The heat pump functional assembly according to claim 1, wherein the heat exchanger is formed with heat exchanger-side refrigerant passages (311g, 312g, 313g) through which the refrigerant flows, and heat exchanger-side heat medium passages (321g, 322g, 323g) through which the heat medium flows, the flow path section-side refrigerant passages and the heat exchanger-side refrigerant passages are connected via a plurality of refrigerant connection holes (231a, 231b, 232a, 232b, 233a, 233b), the refrigerant connection holes are arranged side by side in a direction perpendicular to the flow direction of the refrigerant in the heat exchanger-side refrigerant passages, and the flow path section-side heat medium passages and the heat exchanger-side heat medium passages are connected via a plurality of heat medium connection holes (411a, 411b, 412a, 412b, 413a, 413b), and the heat medium connection holes are arranged side by side in a direction perpendicular to the flow direction of the refrigerant in the heat exchanger-side refrigerant passages.

3. The heat pump functional assembly according to claim 1, wherein the refrigerant flow path portion, the heat exchange portion, and the heat medium flow path portion are arranged side by side in the stacking direction of the plate-like members.

4. A heat pump functional assembly as described in claim 1, wherein the heat exchange section has a condensation heat exchange section (13) that condenses the refrigerant and an evaporation heat exchange section (17a, 18) that evaporates the refrigerant.

5. A heat pump functional assembly according to claim 4, wherein the heat exchange section has a liquid storage section (14) for storing the refrigerant condensed in the condensing heat exchange section.

6. The heat exchange section has, as the plate-like members, a heat exchange section refrigerant plate (310) forming heat exchange section side refrigerant passages (311a, 312b, 313a) through which the refrigerant flows, a heat exchange section heat medium plate (320) forming heat exchange section side heat medium passages (321a, 322a, 323a) through which the heat medium flows, and a heat exchange section partition plate (330) disposed between the heat exchange section refrigerant plate and the heat exchange section heat medium plate, wherein the heat exchange section refrigerant plate has a plurality of refrigerant side liquid storage holes (314a) forming the liquid storage section, the heat exchange section heat medium plate has a plurality of heat medium side liquid storage holes (324a) forming the liquid storage section, and the heat exchange section partition plate has a plurality of partition side liquid storage holes (334a) forming the liquid storage section, 6. A heat pump functional assembly as described in claim 5, wherein when viewed from the stacking direction of the plate-like members, any two of the refrigerant side liquid storage section hole, the heat medium side liquid storage section hole and the partition side liquid storage section hole are arranged so that they partially overlap and the internal spaces are connected to each other.

7. A heat pump functional assembly as described in claim 6, wherein refrigerant-side support columns (314b) are formed between adjacent refrigerant-side liquid storage holes of the heat exchanger refrigerant plate, heat-medium-side support columns (324b) are formed between adjacent heat-medium-side liquid storage holes of the heat exchanger heat medium plate, and partition-side support columns (334b) are formed between adjacent partition-side liquid storage holes of the heat exchanger partition plate, and when viewed from the stacking direction of the plate-like members, portions of the refrigerant-side support columns, heat-medium-side support columns and partition-side support columns overlap.

8. A heat pump functional assembly as described in claim 1, wherein at least one of the refrigerant flow path portion and the heat medium flow path portion is formed with an object mounting portion (218c, 228c, 238c, 518c) for mounting to an object to be mounted.

9. A heat pump functional assembly as described in claim 1, wherein the refrigerant flow path portion has a plurality of refrigerant flow path forming plates (220) arranged in a continuous stack as the plate-like members, and the refrigerant flow path forming plates have refrigerant flow path forming holes (221a, 221d, 222b, 223c, 223e) formed in them that form the flow path portion side refrigerant passages.

10. A heat pump functional assembly as described in claim 1, wherein the plate-like member forming the heat exchange section is formed with an insulating section (317, 327, 337) that prevents heat transfer, and the insulating section is arranged between the section through which high-pressure refrigerant of the heat pump cycle device flows and the section through which low-pressure refrigerant of the heat pump cycle device flows.

11. A heat pump functional assembly as described in claim 10, wherein the heat exchange section has a condensation heat exchange section (13) that condenses the refrigerant and an evaporation heat exchange section (18) that evaporates the refrigerant, and the heat insulating section is disposed between the condensation heat exchange section and the evaporation heat exchange section.

12. A heat pump functional assembly as described in claim 1, wherein a plurality of the heat exchange sections are provided, the plurality of heat exchange sections are formed by stacking the plate-like members formed of separate members, and a plurality of either the refrigerant flow path sections or the heat medium flow path sections are provided.

13. A heat pump cycle device (1, 1c) comprising a heat pump function assembly (101, 101a, 101b, 101c) in which components (13, 14, 15, 17a, 18) constituting the heat pump cycle device (1, 1c) are integrated, a compression section (11) that compresses and discharges a refrigerant, and a decompression section (16a to 16d) that decompresses the refrigerant, the heat pump functional assembly includes a refrigerant flow path section (200, 500) in which flow path section side refrigerant passages (221g, 221h, 221i, 222g, 223g, 223h, 223i, 500a) are formed, through which the refrigerant flows; a heat medium flow path section (400, 700) in which flow path section side heat medium passages (421g, 421h, 421i, 421j, 422g, 422h) are formed, through which a heat medium flows; and a heat exchange section (300, 600) that exchanges heat between the refrigerant that has flowed through the flow path section side refrigerant passages and the heat medium that has flowed through the flow path section side heat medium passages, a heat pump module in which at least two of the refrigerant flow path section, the heat medium flow path section, and the heat exchange section are formed by stacking a plurality of plate-shaped members (210, 220, 230, 310, 320, 330, 410, 420, 430, 510, 520, 610, 620, 630, 640), the heat exchange section is arranged to be sandwiched between the refrigerant flow path section and the heat medium flow path section, the refrigerant flow path section is formed in a flat plate shape, the compression section is attached to a surface of the refrigerant flow path section opposite to the side where the heat exchange section is arranged, and the decompression section is attached to a surface of the refrigerant flow path section where the heat exchange section is arranged.

Images