Water-cooled heat sink

Abstract

Provided is a water-cooled heat sink capable of improving the degree of freedom of an installation position. This water-cooled heat sink is for cooling a memory and has a contact part that extends linearly and is in thermal contact with the memory, which is provided to a memory module, a first bent part that is connected to one end of the contact part, and a second bent part that is connected to the other end of the contact part, wherein: the height of a connection part between the contact part and one end of the first bent part is different from the height of the other end of the first bent part, and / or the height of a connection part between the contact part and one end of the second bent part is different from the height of the other end of the second bent part; and provided to the water-cooled heat sink are a piping group which is configured from a plurality of pipes, an inlet-side manifold which is connected to the other end of the first bent part in the piping group and which supplies a refrigerant to the piping group, and an outlet-side manifold which is connected to the other end of the second bent part in the piping group and which discharges the refrigerant from the piping group.

Description

Water-cooled heat sink

[0001] The present disclosure relates to a water-cooled heat sink.

[0002] As the performance of CPUs improves, the heat generated by memory, which is a storage device that supports the CPU, also increases.

[0003] Generally, memory is cooled by ventilation using the system fan of the device in which it is installed. However, due to the high heat generated by memory, ventilation alone is often not enough to reduce the memory temperature.

[0004] Furthermore, memory is mounted in the form of memory modules on a motherboard, which serves as a substrate. Multiple memory modules are mounted upright on the motherboard with very close spacing. This makes it difficult to easily attach a heat sink to cool the memory, limiting the means for improving the memory's cooling performance through air cooling. Therefore, measures to improve memory cooling performance using a water-cooled heat sink, such as those disclosed in Patent Document 1, have been considered.

[0005] However, in a heat sink such as that disclosed in Patent Document 1, components such as a manifold that distributes refrigerant to the piping of the heat sink, a supply hose that supplies refrigerant to the manifold, and a discharge hose that discharges the refrigerant from the manifold are arranged on the board, which limits the degree of freedom in designing how the components are mounted on the board.

[0006] US Patent Application Publication No. 2024 / 237269

[0007] An object of the present disclosure is to provide a water-cooled heat sink that can improve the degree of freedom in installation position.

[0008] [1] A water-cooled heat sink for cooling memory, the water-cooled heat sink comprising: a contact portion that is in thermal contact with the memory provided in a memory module and extends linearly, a first bent portion connecting to one end of the contact portion, and a second bent portion connecting to the other end of the contact portion, wherein the height of the connecting portion between one end of the first bent portion and the contact portion is different from the height of the other end of the first bent portion and / or the height of the connecting portion between one end of the second bent portion and the contact portion is different from the height of the other end of the second bent portion, an inlet-side manifold connected to the other end of the first bent portion in the pipe group and supplies a coolant to the pipe group, and an outlet-side manifold connected to the other end of the second bent portion in the pipe group and discharges the coolant from the pipe group. [2] The water-cooled heat sink according to [1] above, wherein the first bent portion bends away from a substrate on which the water-cooled heat sink is installed. [3] The water-cooled heat sink according to [1] or [2] above, wherein the inlet-side manifold is connected to the piping group at a position away from the substrate on which the water-cooled heat sink is mounted. [4] The water-cooled heat sink according to any one of [1] to [3] above, wherein the second bend section bends away from the substrate on which the water-cooled heat sink is mounted. [5] The water-cooled heat sink according to any one of [1] to [4] above, wherein the outlet-side manifold is connected to the piping group at a position away from the substrate on which the water-cooled heat sink is mounted. [6] The water-cooled heat sink according to any one of [1] to [5] above, further comprising one or more thermally conductive sheets provided on the surface of the contact section of the piping group. [7] The water-cooled heat sink according to any one of [1] to [6] above, wherein the shortest distance M1 from the substrate on which the water-cooled heat sink is mounted to the portion of the inlet-side manifold closest to the substrate is greater than the shortest distance L1 from the substrate to the portion of the memory furthest from the substrate. [8] A water-cooled heat sink according to any one of [1] to [7] above, wherein a shortest distance M2 from a substrate on which the water-cooled heat sink is installed to a portion of the outlet manifold that is closest to the substrate is greater than a shortest distance L1 from the substrate to a portion of the memory that is farthest from the substrate.[9] The water-cooled heat sink according to any one of [1] to [8] above, wherein a minimum distance M1 from the substrate on which the water-cooled heat sink is installed to a portion of the inlet-side manifold closest to the substrate is greater than a minimum distance L2 from the substrate to a portion of the memory module farthest from the substrate.

[10] The water-cooled heat sink according to any one of [1] to [9] above, wherein a minimum distance M2 from the substrate on which the water-cooled heat sink is installed to a portion of the outlet-side manifold closest to the substrate is greater than a minimum distance L2 from the substrate to a portion of the memory module farthest from the substrate.

[0009] According to the present disclosure, it is possible to provide a water-cooled heat sink that allows for greater freedom in installation position.

[0010] Fig. 1 is a perspective view showing an example of a water-cooled heat sink according to an embodiment. Fig. 2 is an exploded perspective view showing an example of a water-cooled heat sink according to an embodiment. Fig. 3 is an enlarged schematic view for explaining the relationship between distances in the water-cooled heat sink according to an embodiment. Fig. 4 is another enlarged schematic view for explaining the relationship between distances in the water-cooled heat sink according to an embodiment.

[0011] Hereinafter, a detailed description will be given based on an embodiment.

[0012] As a result of extensive research into water-cooled heat sinks, the inventors discovered that by arranging the inlet and outlet manifolds of the water-cooled heat sink in predetermined positions, it is possible to improve the degree of freedom in installation location, and based on this finding, they have completed the present disclosure.

[0013] The water-cooled heat sink of the embodiment is a water-cooled heat sink for cooling memory, and is in thermal contact with the memory provided in a memory module, and has a contact portion that extends linearly, a first bent portion that connects to one end of the contact portion, and a second bent portion that connects to the other end of the contact portion, and the height of the connecting portion between one end of the first bent portion and the contact portion is different from the height of the other end of the first bent portion and / or the height of the connecting portion between one end of the second bent portion and the contact portion is different from the height of the other end of the second bent portion; a pipe group composed of multiple pipes, an inlet side manifold that connects to the other end of the first bent portion in the pipe group and supplies a refrigerant to the pipe group; and an outlet side manifold that connects to the other end of the second bent portion in the pipe group and discharges the refrigerant from the pipe group.

[0014] 1 and 2 are perspective and exploded views of an example of a water-cooled heat sink according to an embodiment of the present invention;

[0015] 1 and 2, a water-cooled heat sink 1 according to an embodiment includes a piping group 10, an inlet manifold 20, and an outlet manifold 30. The water-cooled heat sink 1 is a component for cooling a memory 71, and a refrigerant (not shown) flows through the internal space of the water-cooled heat sink 1. The water-cooled heat sink 1 is mounted on a substrate 80 such as a motherboard.

[0016] The pipe group 10 that constitutes the water-cooled heat sink 1 is made up of a plurality of pipes 11. A memory module 70 equipped with a memory 71 is provided between the plurality of pipes 11, i.e., in the gap between a pipe 11 and another adjacent pipe 11, and is inserted into a socket 81 for the memory module 70 provided on a substrate 80 so that one main surface of the memory module 70 faces the pipe 11 and the other main surface of the memory module 70 faces the other adjacent pipe 11.

[0017] The memory 71 is provided on the main surface of the memory module 70. The memory 71 on the memory module 70 is in thermal contact with the contact portion 11 a of the pipe group 10 by being in direct contact with the contact portion 11 a of the pipe 11 or by being in contact with the contact portion 11 a via a thermally conductive sheet 40 described later.

[0018] Here, an example is shown in which the memory module 70 includes a plurality of memories 71, but the number of memories 71 to be installed is not particularly limited, and for example, the memory module 70 may include one memory 71. Furthermore, the number of the plurality of pipes 11 is set appropriately depending on the number of memory modules 70 to be installed.

[0019] Each of the plurality of pipes 11 has a contact portion 11a, a first bent portion 11b, and a second bent portion 11c.

[0020] The contact portion 11a extends linearly. The contact portion 11a is in thermal contact with the memory 71 on the memory module 70 by directly contacting the memory 71 or by contacting the memory 71 via a thermally conductive sheet 40 (described later). The contact portion 11a is longer than the memory module 70. The bottom surface of the contact portion 11a is fixed to the substrate 80 via a socket 81.

[0021] The first bent portion 11b is connected to one end of the contact portion 11a. Here, an example in which the shape of the first bent portion 11b is curved is shown, but the shape of the first bent portion 11b is not particularly limited.

[0022] The second bent portion 11c is connected to the other end of the contact portion 11a. Here, an example in which the second bent portion 11c has a curved shape is shown, but the shape of the second bent portion 11c is not particularly limited.

[0023] In the pipe 11, the height of the connecting portion between one end of the first bend 11b and the contact portion 11a is different from the height of the other end of the first bend 11b, and / or the height of the connecting portion between one end of the second bend 11c and the contact portion 11a is different from the height of the other end of the second bend 11c.

[0024] The height from the connection between one end of the first bent portion 11b and the contact portion 11a to the other end of the first bent portion 11b is preferably 10 mm or more and 100 mm or less. The height from the connection between one end of the first bent portion 11b and the contact portion 11a to the other end of the first bent portion 11b is the height from the bottom of the connection to the other end (top end) of the first bent portion 11b. If the height is 10 mm or more, the degree of freedom in the installation position of the water-cooled heat sink 1 can be sufficiently improved. Furthermore, if the height is 100 mm or less, the water-cooled heat sink 1 can be made more compact.

[0025] The height from the connection between one end of the second bent portion 11c and the contact portion 11a to the other end of the second bent portion 11c is preferably 10 mm or more and 100 mm or less. The height from the connection between one end of the second bent portion 11c and the contact portion 11a to the other end of the second bent portion 11c is the height from the bottom of the connection to the other end (top end) of the second bent portion 11c. If the height is 10 mm or more, the degree of freedom in the installation position of the water-cooled heat sink 1 can be sufficiently improved. Furthermore, if the height is 100 mm or less, the water-cooled heat sink 1 can be made more compact.

[0026] When the height of the connecting portion between one end of the first bending portion 11b and the contact portion 11a is different from the height of the other end of the first bending portion 11b, the first bending portion 11b bends away from the substrate 80 on which the water-cooled heat sink 1 is installed. When the height of the connecting portion between one end of the second bending portion 11c and the contact portion 11a is different from the height of the other end of the second bending portion 11c, the second bending portion 11c bends away from the substrate 80 on which the water-cooled heat sink 1 is installed.

[0027] In addition, from the viewpoint of thermal conductivity, the pipe group 10 is preferably made of copper or a copper alloy.

[0028] The inlet manifold 20 constituting the water-cooled heat sink 1 is connected to the other end of the first bend 11b in the pipe group 10, and supplies refrigerant to the multiple pipes 11 in the pipe group 10. A supply hose (not shown) that supplies refrigerant to the inlet manifold 20 is connected to the inlet manifold 20. In this manner, the inlet manifold 20 is connected to the multiple pipes 11 in the pipe group 10 at a position away from the substrate 80 on which the water-cooled heat sink 1 is installed. The inlet manifold 20 is connected to all of the pipes 11 constituting the pipe group 10, as shown in FIGS. 1 and 2, for example.

[0029] In this way, the inlet-side manifold 20 constituting the water-cooled heat sink 1 is disposed at a position higher than the height of the connecting portion between one end of the first bent portion 11b and the contact portion 11a, and at a position farther from the substrate 80 than the contact portion 11a, thereby improving the degree of freedom in the installation position of the water-cooled heat sink 1. In particular, the inlet-side manifold 20 is not disposed on the substrate 80, and a space equivalent to the volume of the inlet-side manifold 20 can be secured above the substrate 80, improving the degree of freedom in the design of the inlet-side manifold.

[0030] In addition, from the viewpoint of thermal conductivity, the inlet manifold 20 is preferably made of copper or a copper alloy.

[0031] Furthermore, the pipe group 10 and the inlet side manifold 20 are preferably joined by brazing or welding, and more preferably by laser welding from the viewpoint of achieving excellent rigidity.

[0032] An outlet-side manifold 30 constituting the water-cooled heat sink 1 is connected to the other end of the second bend 11c of the pipe group 10 and discharges the refrigerant from the multiple pipes 11 of the pipe group 10. An exhaust hose (not shown) that discharges the refrigerant from the outlet-side manifold 30 is connected to the outlet-side manifold 30. In this manner, the outlet-side manifold 30 is connected to the multiple pipes 11 of the pipe group 10 at a position away from the substrate 80 on which the water-cooled heat sink 1 is mounted. The outlet-side manifold 30 is connected to all of the pipes 11 constituting the pipe group 10, as shown in FIGS. 1 and 2, for example.

[0033] In this way, the outlet-side manifold 30 constituting the water-cooled heat sink 1 is disposed at a position higher than the height of the connecting portion between one end of the second bent portion 11c and the contact portion 11a, and at a position farther from the substrate 80 than the contact portion 11a, thereby improving the degree of freedom in the installation position of the water-cooled heat sink 1. In particular, the outlet-side manifold 30 is not disposed on the substrate 80, and a space equivalent to the volume of the outlet-side manifold 30 can be secured on the substrate 80, improving the degree of freedom in the design of the outlet-side manifold.

[0034] In addition, from the viewpoint of thermal conductivity, the outlet manifold 30 is preferably made of copper or a copper alloy.

[0035] Furthermore, the pipe group 10 and the outlet side manifold 30 are preferably joined by brazing or welding, and more preferably by laser welding from the viewpoint of achieving excellent rigidity.

[0036] Furthermore, from the viewpoint of further improving the cooling performance, it is preferable that the water-cooled heat sink 1 further comprises one or more heat-conducting sheets 40 provided on the surfaces of the contact portions 11a of the pipe group 10, as shown in FIGS.

[0037] When the water-cooled heat sink 1 includes the thermally conductive sheet 40, the thermally conductive sheet 40 is in direct contact with the memory 71 of the memory module 70 and the contact portion 11a of the piping 11, and the memory 71 is in thermal contact with the contact portion 11a via the thermally conductive sheet 40. The thermally conductive sheet 40 efficiently transfers heat from the memory 71 to the piping group 10, thereby enabling the memory 71 to be cooled effectively.

[0038] From the viewpoint of further improving the cooling performance, the heat conductive sheet 40 is preferably made of silicone rubber.

[0039] The number of heat conduction sheets 40 is set appropriately depending on the number of pipes 11 .

[0040] 3 is an enlarged schematic view illustrating the relationship between distances in the water-cooled heat sink according to the embodiment. For convenience, the thermally conductive sheet 40 and other components are omitted from FIG. 3 and FIG. 4, which will be described later.

[0041] 3, the shortest distance M1 from the substrate 80 to the portion of the inlet-side manifold 20 that is closest to the substrate 80 is preferably greater than the shortest distance L1 from the substrate 80 to the portion of the scale 71 that is farthest from the substrate 80. In Fig. 3, the shortest distance M1 corresponds to the height from the surface of the substrate 80 to the bottom surface of the inlet-side manifold 20, and the shortest distance L1 corresponds to the height from the surface of the substrate 80 to the upper end of the scale 71. If the shortest distance M1 is greater than the shortest distance L1, the space secured above the substrate 80 becomes even larger, thereby further improving the degree of freedom in design above the substrate 80.

[0042] Furthermore, it is more preferable that the shortest distance M1 be greater than the shortest distance L2 from the substrate 80 to the portion of the memory module 70 that is farthest from the substrate 80. In Fig. 3, the shortest distance L2 corresponds to the height from the surface of the substrate 80 to the upper end of the memory module 70. If the shortest distance M1 is greater than the shortest distance L2, the space secured on the substrate 80 will be even larger, thereby further improving the degree of freedom in designing the substrate 80.

[0043] FIG. 4 is another enlarged schematic view illustrating the relationship between the distances in the water-cooled heat sink according to the embodiment.

[0044] 4, the shortest distance M2 from the substrate 80 to the portion of the outlet-side manifold 30 that is closest to the substrate 80 is preferably greater than the shortest distance L1 from the substrate 80 to the portion of the scale 71 that is farthest from the substrate 80. In Fig. 4, the shortest distance M2 corresponds to the height from the surface of the substrate 80 to the bottom surface of the inlet-side manifold 20. If the shortest distance M2 is greater than the shortest distance L1, the space secured above the substrate 80 becomes even larger, thereby further improving the degree of freedom in design above the substrate 80.

[0045] Furthermore, it is more preferable that the shortest distance M2 is greater than the shortest distance L2. If the shortest distance M2 is greater than the shortest distance L2, the space secured on the substrate 80 is further increased, thereby further improving the degree of freedom in designing on the substrate 80.

[0046] Furthermore, from the viewpoint of improving the degree of freedom in design on the substrate 80, it is preferable that at least one of the following conditions be satisfied: the shortest distance M1 is greater than the shortest distance L1, and the shortest distance M2 is greater than the shortest distance L1, and it is more preferable that both conditions be satisfied. Furthermore, from the viewpoint of further improving the degree of freedom in design on the substrate 80, it is preferable that at least one of the following conditions be satisfied: the shortest distance M1 is greater than the shortest distance L2, and the shortest distance M2 is greater than the shortest distance L2, and it is more preferable that both conditions be satisfied.

[0047] Such a water-cooled heat sink 1 can improve the degree of freedom in installation location and is therefore suitable for use in data centers, which allows for the design of even higher performance water-cooled servers.

[0048] According to the embodiment described above, the inlet manifold and the outlet manifold of the water-cooled heat sink are disposed at predetermined positions, thereby improving the degree of freedom in the installation position of the water-cooled heat sink.

[0049] Although the embodiments have been described above, the present invention is not limited to the above embodiments, but includes all aspects encompassed by the concept and scope of the claims of the present disclosure, and can be modified in various ways within the scope of the present disclosure.

[0050] REFERENCE SIGNS 1 water-cooled heat sink 10 piping group 11 piping 11a contact portion 11b first bend portion 11c second bend portion 20 inlet side manifold 30 outlet side manifold 40 heat conduction sheet 70 memory module 71 memory 80 substrate 81 socket

Claims

1. A water-cooled heat sink for cooling memory, comprising: a piping group consisting of a plurality of pipes, the piping group being in thermal contact with the memory provided in a memory module and having a contact portion extending linearly, a first bent portion connecting to one end of the contact portion, and a second bent portion connecting to the other end of the contact portion, wherein the height of the connecting portion between one end of the first bent portion and the contact portion is different from the height of the other end of the first bent portion, and / or the height of the connecting portion between one end of the second bent portion and the contact portion is different from the height of the other end of the second bent portion; an inlet-side manifold connected to the other end of the first bent portion in the piping group and supplying a refrigerant to the piping group; and an outlet-side manifold connected to the other end of the second bent portion in the piping group and discharging the refrigerant from the piping group.

2. The water-cooled heat sink according to claim 1, wherein the first bent portion bends away from a substrate on which the water-cooled heat sink is mounted.

3. The water-cooled heat sink according to claim 1, wherein the inlet manifold is connected to the group of pipes at a position away from a substrate on which the water-cooled heat sink is installed.

4. The water-cooled heat sink according to claim 1, wherein the second bent portion bends away from a substrate on which the water-cooled heat sink is mounted.

5. The water-cooled heat sink according to claim 1, wherein the outlet manifold is connected to the group of pipes at a position away from a substrate on which the water-cooled heat sink is installed.

6. The water-cooled heat sink according to claim 1, further comprising one or more thermally conductive sheets provided on the surfaces of the contact portions of the pipe group.

7. A water-cooled heat sink as described in claim 1, wherein the shortest distance M1 from the substrate on which the water-cooled heat sink is installed to the part of the inlet manifold closest to the substrate is greater than the shortest distance L1 from the substrate to the part of the memory farthest from the substrate.

8. A water-cooled heat sink as described in any one of claims 1 to 7, wherein the shortest distance M2 from the substrate on which the water-cooled heat sink is installed to the part of the outlet manifold closest to the substrate is greater than the shortest distance L1 from the substrate to the part of the memory farthest from the substrate.

9. A water-cooled heat sink as described in claim 1, wherein the shortest distance M1 from the substrate on which the water-cooled heat sink is installed to the part of the inlet manifold closest to the substrate is greater than the shortest distance L2 from the substrate to the part of the memory module farthest from the substrate.

10. A water-cooled heat sink as described in any one of claims 1 to 7 and 9, wherein the shortest distance M2 from the board on which the water-cooled heat sink is installed to the part of the outlet manifold closest to the board is greater than the shortest distance L2 from the board to the part of the memory module farthest from the board.

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