Silicon wafer etching and cleaning device for removing phosphorus and boron

Abstract

The present invention relates to the technical field of silicon wafer etching and cleaning devices for removing phosphorus and boron, and in particular to a silicon wafer etching and cleaning device for removing phosphorus and boron, comprising an integrated acid pickling and drying chain-type machine main body, a mechanical arm, and an electric negative-pressure suction cup assembly. Two connecting frames are fixedly connected to the outer wall of a wafer unloading end of the integrated acid pickling and drying chain-type machine main body; the bottom ends of the connecting frames and the bottom end of the integrated acid pickling and drying chain-type machine main body are located on a same horizontal plane; and a driving mechanism is fixedly connected to the outer walls of the two connecting frames. The present invention is used in a wet-etching device for a battery silicon wafer to achieve detecting functions of over-etching and incomplete etching of the battery silicon wafer, thereby improving the use reliability of the wet-etching device for a battery silicon wafer; and the wet-etching device for a battery silicon wafer also has a function of accurately re-etching a battery silicon wafer that is incompletely etched, thereby improving the processing quality of the battery silicon wafer, and also improving the convenience and efficiency of wet-etching processing of the battery silicon wafer.

Description

Phosphorus and borosilicon etching cleaning equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of phosphorus and borosilicon etching cleaning equipment, in particular to a phosphorus and borosilicon etching cleaning equipment. BACKGROUND

[0002] Battery piece wet etching is an important process in the production process of solar battery pieces, which uses acid mixed liquid to corrode the lower surface and edge of the diffused silicon wafer, and the main purpose is to remove the PN junction of the edge of the silicon wafer, avoid short circuit and reduce parallel resistance. At present, the acid pickling and drying integrated chain machine is often used in the wet etching process of battery pieces. The acid pickling and drying integrated chain machine includes the steps of feeding, wet etching, washing, drying and discharging.

[0003] At present, the acid pickling and drying integrated chain machine used for battery piece wet etching is not used, because of the difference in quality of battery silicon wafer raw materials and the uneven acid solution wet etching, the PN junction of the edge of the battery silicon wafer is not completely removed, and the PN junction is still left on the edge of part of the battery silicon wafer, which affects the qualified rate of the battery silicon wafer etching processing equipment and the reliability of the use of the battery silicon wafer wet etching equipment.

[0004] In addition, the battery silicon wafer needs to be conveyed to the battery silicon wafer detection equipment for quality inspection after being processed by the wet etching equipment. If the battery silicon wafer is not completely etched, it needs to be returned to the acid pickling and drying integrated chain machine for repair, which affects the convenience and efficiency of the battery silicon wafer wet etching process.

[0005] Therefore, we propose a phosphorus and borosilicon etching cleaning equipment to solve the above problems. SUMMARY

[0006] The purpose of the present application is to solve the above problems, and provide a phosphorus and borosilicon etching cleaning equipment.

[0007] In order to achieve the above object, the following technical scheme is adopted: a phosphorus and boron removal silicon etching cleaning equipment, comprising an acid pickling and drying integrated chain machine main body, a mechanical arm and an electric negative pressure suction disc assembly, two connecting frames are fixedly connected to the outer wall of the lower end of the acid pickling and drying integrated chain machine main body, the bottom end of the connecting frame is at the same horizontal plane as the bottom end of the acid pickling and drying integrated chain machine main body, a driving mechanism is fixedly connected to the outer wall of the two connecting frames, the bottom end of the driving mechanism is fixedly connected to the fixed end of the mechanical arm, the fixed end of the electric negative pressure suction disc assembly is fixedly connected to the movable end of the mechanical arm, a battery silicon wafer detection mechanism and an industrial computer are fixedly connected to the outer wall of the two connecting frames, a horizontal plate is fixedly connected to the outer wall of the industrial computer, a display is fixedly connected to the upper surface of the horizontal plate, a first supporting plate and a second supporting plate are fixedly connected to the outer wall of the two connecting frames and the outer wall of the acid pickling and drying integrated chain machine main body, a reprocessing tank is fixedly connected to the upper surface of the second supporting plate, a partition plate is fixedly connected to the inner wall of the reprocessing tank, a battery silicon wafer re-wet etching mechanism is fixedly connected to the outer wall of one side of the partition plate and the outer wall of the reprocessing tank, and a washing and drying mechanism is fixedly connected to the inner wall of the other side of the partition plate and the reprocessing tank.

[0008] In the phosphorus and boron removal silicon etching cleaning equipment, the driving mechanism comprises two fixed plates fixedly connected to the outer walls of the two connecting frames, opposite sides of the two fixed plates are connected with lead screws through rolling bearings, the outer wall of one of the fixed plates is fixedly connected with a servo motor, the output end of the servo motor is fixedly connected with the side end of the lead screw, the rod wall of the lead screw is threadedly sleeved with a threaded cylinder, the outer wall of the threaded cylinder is fixedly sleeved with a fixed frame, the outer wall of the fixed frame is movably connected with the outer walls of the two connecting frames, and the bottom end of the fixed frame is fixedly connected with the fixed end of the mechanical arm.

[0009] In the phosphorus and boron removal silicon etching cleaning equipment, the battery silicon wafer detection mechanism comprises two L-shaped plates fixedly connected to the outer walls of the two connecting frames, a multi-channel voltage measuring instrument is fixedly connected to the inner wall of the L-shaped plate, the output end of the multi-channel voltage measuring instrument is electrically connected with the input end of the industrial computer through wires, a group of symmetrically distributed connecting through holes are formed in the four outer walls of the vertical part of the L-shaped plate, and the hole walls of the four groups of connecting through holes are connected with contact assemblies, the outer wall of the electric negative pressure suction disc assembly is fixedly connected with a CCD vision camera, and the vertical part of the L-shaped plate is fixedly connected with a light supplementing lamp.

[0010] In the phosphorus and boron removal silicon etching cleaning equipment, the contact assembly comprises two conductive rods, the electric connection ends of the two conductive rods are electrically connected with the input end of the multi-channel voltage measuring instrument through wires, the contact ends of the two conductive rods are fixedly connected with conductive sponge blocks, the rod wall of the conductive rod is fixedly sleeved with an insulating ring, and the rod wall of the conductive rod is movably sleeved with an insulating spring.

[0011] In the phosphorus and boron removal silicon etching cleaning equipment, the battery silicon wafer re-wet etching mechanism comprises an inclined plate fixedly connected with the inner wall of the re-processing tank and the outer wall of the partition plate, the inclined plate, the partition plate and the re-processing tank jointly form an acid liquid storage area, the outer wall of the partition plate is fixedly connected with a first hollow cover, the bottom end of the first hollow cover is fixedly connected with a surrounding plate on the upper surface of the inclined plate, the inner wall of the surrounding plate is fixedly connected with a gas suction pump, the output end of the gas suction pump penetrates through the lower surface of the inclined plate and is fixedly connected with an exhaust one-way valve, the suction end of the gas suction pump is fixedly connected with a connecting pipe, the gas inlet end of the connecting pipe penetrates through the upper surface of the first hollow cover and is fixedly connected with a hollow filter tank, the outer wall of the hollow filter tank is fixedly connected with the top end outer wall of the re-processing tank, the top end of the inclined plate is fixedly embedded with a conduit, the top end of the conduit is fixedly connected with the lower surface of the first hollow cover, the upper surface of the first hollow cover is fixedly connected with four electromagnetic control valves, the top ends of the four electromagnetic control valves are fixedly connected with liquid spray nozzles, the re-processing tank is fixedly connected with a normally closed valve at the lower surface of the acid liquid storage area, the input end of the normally closed valve penetrates through the lower surface of the second supporting plate and is fixedly connected with an acid liquid conveying pipe, the lower surface of the inclined plate is fixedly connected with a sealing cover, and the bottom end of the sealing cover is fixedly embedded with a liquid level switch.

[0012] In the phosphorus and boron removal silicon etching cleaning equipment, the water washing and drying mechanism comprises a heat insulation cover and a second hollow cover fixedly connected with the outer wall of the partition plate, the inside of the heat insulation cover is provided with a semiconductor refrigerator, the refrigeration end of the semiconductor refrigerator is fixedly connected with a ceramic heat conduction strip, the side end of the ceramic heat conduction strip penetrates through the partition plate and extends into the acid liquid storage area, a plurality of heat conduction holes are formed in the outer wall of the ceramic heat conduction strip, the lower surface of the second hollow cover and the upper surface of the heat insulation cover are fixedly and continuously connected with a gas guide pipe, the upper surface of the second hollow cover is fixedly connected with a plurality of air injection nozzles, the bottom end of the second hollow cover is fixedly connected with a water inlet control valve, the input end of the water inlet control valve is fixedly connected with a water supply pipe, the bottom end of the water supply pipe penetrates through the outer wall of the re-processing tank, the bottom end of the gas inlet pipe is fixedly connected with an air inlet fan.

[0013] In the phosphorus and boron removal silicon etching cleaning equipment, the outer walls on both sides of the re-processing tank are fixedly connected with a waste liquid discharge pipe and a waste water discharge pipe, respectively.

[0014] In the phosphorus and boron-silicon etching cleaning equipment, the upper surface of the second supporting plate is provided with a rectangular mounting hole, and the hole wall of the rectangular mounting hole is movably connected with a waste collecting groove, and the bottom end of the waste collecting groove is movably connected with the upper surface of the first supporting plate.

[0015] In the phosphorus and boron-silicon etching cleaning equipment, the acid pickling and drying integrated chain machine body comprises a drying section and an acid pickling section, a water film mechanism is arranged at the inlet of the drying section, a first conveying roller is arranged below the water film mechanism, a second conveying roller is arranged in the acid pickling section, a plurality of umbrella-shaped driven gears are arranged at the two ends of the second conveying roller, a driving gear is engaged with the outer wall of each driven gear, a driving shaft is connected with the connecting end of the driving gear, a connecting plug is arranged at the two ends of the driving shaft, a PEEK bearing matched with the side end of the driving shaft is fixedly connected with the connecting hole inner wall of the connecting plug, and a supporting locking block is arranged on the outer wall of the driving shaft.

[0016] In the phosphorus and boron-silicon etching cleaning equipment, the acid pickling section is provided with a cleaning assembly on the side close to the outlet of the acid pickling and drying integrated chain machine body, and the cleaning assembly comprises a circulating water washing section and a direct supply spraying section.

[0017] Compared with the prior art, the phosphorus and boron-silicon etching cleaning equipment has the following advantages:

[0018] When the battery silicon wafer is processed by the acid pickling and drying integrated chain machine body and then discharged, the mechanical arm drives the electric negative pressure suction disc assembly to approach the upper surface of the battery silicon wafer through the industrial computer, and then the industrial computer controls the electric negative pressure suction disc assembly to stably suck the battery silicon wafer, and then the industrial computer drives the mechanical arm and the electric negative pressure suction disc assembly to move above the reprocessing tank through the driving mechanism, and then the industrial computer controls the mechanical arm to make the battery silicon wafer approach the battery silicon wafer detection mechanism, and the industrial computer controls the CCD vision camera and the fill-in light to be started at the same time, the light of the fill-in light irradiates on the battery silicon wafer, and then the CCD vision camera shoots the battery silicon wafer in the light receiving state, and the vision detection software loaded in the industrial computer is used for auxiliary detection, and the light spot on the side of the battery silicon wafer close to the CCD vision camera in the light receiving state is automatically detected, if the light spot exists, it indicates that the battery silicon wafer is over-etched and unqualified, otherwise, it indicates that the battery silicon wafer is not over-etched and is preliminarily qualified, and the mechanism has the function of battery silicon wafer over-etching detection for the battery silicon wafer wet etching equipment.

[0019] When the battery silicon wafer passes through the CCD vision camera and the industrial computer for preliminary detection and is qualified, the battery silicon wafer still needs to pass through the battery silicon wafer detection mechanism for secondary detection. At this time, the multi-channel voltage measuring instrument in the battery silicon wafer detection mechanism cooperates with the four sets of contact assemblies and measures the voltage of the four side edges of the battery silicon wafer. At the same time, the multi-channel voltage measuring instrument sends the voltage detected by the contact assembly on each detection channel to the industrial computer in the form of an electrical signal. If one or more sets of voltage values are lower than the standard voltage value at the etched edge after comparison, it means that the edge of the battery silicon wafer still has a PN junction due to incomplete etching, which leads to a short circuit in the edge area of the battery silicon wafer and causes the resistance to decrease and the current to pass easily. As a result, the voltage at the side edge of the battery silicon wafer decreases. Then, the industrial computer controls the mechanical arm to move the battery silicon wafer to the battery silicon wafer wet etching mechanism. The mechanism has the function of detecting incomplete etching of the battery silicon wafer in the wet etching equipment, improving the reliability of the wet etching equipment for the battery silicon wafer.

[0020] When the battery silicon wafer side edge has incomplete etching, the industrial computer controls the mechanical arm to move the battery silicon wafer to the battery silicon wafer wet etching mechanism for targeted re-etching of the incomplete etching position. After re-etching, the water washing and drying mechanism is used for cleaning and drying. The dried battery silicon wafer is detected by the battery silicon wafer detection mechanism and transported to the next processing position if qualified. The mechanism enables the phosphorus and boron removal silicon etching and cleaning equipment to have the function of precise re-etching of incomplete etching of the battery silicon wafer, which not only improves the quality of the battery silicon wafer processing, but also improves the convenience and efficiency of the wet etching processing of the battery silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of a phosphorus and boron removal silicon etching and cleaning equipment provided by the present application;

[0022] Figure 2 is a structural schematic diagram of a connecting frame part of a phosphorus and boron removal silicon etching and cleaning equipment provided by the present application;

[0023] Figure 3 is a structural schematic diagram of a battery silicon wafer detection mechanism of a phosphorus and boron removal silicon etching and cleaning equipment provided by the present application;

[0024] Figure 4 is a structural schematic diagram of a CCD vision camera part of a phosphorus and boron removal silicon etching and cleaning equipment provided by the present application;

[0025] Figure 5 is a structural schematic diagram of an L-shaped plate from the left side of a phosphorus and boron removal silicon etching and cleaning equipment provided by the present application;

[0026] Figure 6 is a structural schematic diagram of a partial cross-section of a phosphorus and boron removal silicon etching and cleaning equipment provided by the present application;

[0027] Fig. 7 is a structure diagram of the part enlarged in Fig. 6;

[0028] Fig. 8 is a structure diagram of the part of the ceramic heat conducting strip in the phosphorus and boron removal and silicon etching cleaning equipment provided by the present application;

[0029] Fig. 9 is a structure diagram of the main body of the acid cleaning and drying integrated chain machine in the phosphorus and boron removal and silicon etching cleaning equipment provided by the present application;

[0030] Fig. 10 is a structure diagram of the part enlarged in Fig. 9;

[0031] Fig. 11 is a structure diagram of part A in the phosphorus and boron removal and silicon etching cleaning equipment provided by the present application;

[0032] Fig. 12 is a structure diagram of part B in the phosphorus and boron removal and silicon etching cleaning equipment provided by the present application;

[0033] Fig. 13 is a structure diagram of the connecting plug in the phosphorus and boron removal and silicon etching cleaning equipment provided by the present application;

[0034] Fig. 14 is a structure diagram of the part enlarged in the phosphorus and boron removal and silicon etching cleaning equipment provided by the present application;

[0035] In the figure: 1, the main body of the acid washing and drying integrated chain machine, 101, the drying section, 102, the acid washing section, 103, the water film mechanism, 104, the first conveying roller, 105, the second conveying roller, 106, the driven gear, 107, the driving gear, 108, the driving shaft, 109, the connecting plug-in, 110, the support locking block, 111, the circulating water washing section, 112, the direct supply spraying section, 113, the PEEK bearing, 2, the mechanical arm, 3, the electric negative pressure suction disc assembly, 4, the connecting frame, 5, the driving mechanism, 51, the fixed plate, 52, the screw rod, 53, the servo motor, 54, the threaded cylinder, 55, the fixed frame, 6, the battery silicon wafer detection mechanism, 61, the L-shaped plate, 62, the multi-channel voltage measuring instrument, 63, the contact assembly, 631, the conductive rod, 632, the conductive sponge block, 633, the insulating ring, 634, the insulating spring, 64, the CCD vision camera, 65, the light supplementing lamp, 7, the industrial computer, 8, the battery silicon wafer re-wet etching mechanism, 81, the inclined plate, 82, the acid liquid storage area, 83, the first hollow cover, 84, the coaming, 85, the air extraction pump, 86, the exhaust one-way valve, 87, the connecting pipe, 88, the hollow filter tank, 89, the catheter, 810, the electromagnetic control valve, 811, the liquid spraying nozzle, 812, the normally closed valve, 813, the acid liquid conveying pipe, 814, the sealing cover, 815, the liquid level switch, 9, the water washing and drying mechanism, 91, the heat insulation cover, 92, the second hollow cover, 93, the semiconductor refrigerator, 94, the ceramic heat conduction strip, 95, the heat conduction hole, 96, the air guide pipe, 97, the air jet nozzle, 98, the water inlet control valve, 99, the water supply pipe, 910, the air inlet pipe, 911, the air inlet fan, 10, the cross plate, 11, the display, 12, the first support plate, 13, the second support plate, 14, the reprocessing tank, 15, the partition plate, 16, the waste liquid discharge pipe, 17, the waste water discharge pipe, 18, the waste material collection tank. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0037] As shown in Figures 1-14, a phosphorus and boron silicon etching cleaning device, comprising an acid pickling and drying integrated chain machine body 1, a mechanical arm 2 and an electric negative pressure suction disc assembly 3, two connecting frames 4 are fixedly connected to the outer wall of the lower sheet end of the acid pickling and drying integrated chain machine body 1, the bottom end of the connecting frame 4 is at the same horizontal plane as the bottom end of the acid pickling and drying integrated chain machine body 1, the outer wall of the two connecting frames 4 is fixedly connected with a driving mechanism 5, the driving mechanism 5 comprises a fixed plate 51 fixedly connected to the outer wall of the two connecting frames 4, the opposite side of the two fixed plates 51 is connected with a lead screw 52 through a rolling bearing, the outer wall of one of the fixed plates 51 is fixedly connected with a servo motor 53, the output end of the servo motor 53 is fixedly connected with the side end of the lead screw 52, the rod wall of the lead screw 52 is threadedly sleeved with a threaded cylinder 54, the outer wall of the threaded cylinder 54 is fixedly sleeved with a fixed frame 55, the outer wall of the fixed frame 55 is movably connected with the outer wall of the two connecting frames 4, and the bottom end of the fixed frame 55 is fixedly connected with the fixed end of the mechanical arm 2.

[0038] The bottom end of the driving mechanism 5 is fixedly connected with the fixed end of the mechanical arm 2, the fixed end of the electric negative pressure suction disc assembly 3 is fixedly connected with the movable end of the mechanical arm 2, the outer wall of the two connecting frames 4 is fixedly connected with a battery silicon wafer detection mechanism 6 and an industrial computer 7, the battery silicon wafer detection mechanism 6 comprises an L-shaped plate 61 fixedly connected to the outer wall of the two connecting frames 4, the inner wall of the L-shaped plate 61 is fixedly connected with a multi-channel voltage measuring instrument 62, the output end of the multi-channel voltage measuring instrument 62 is electrically connected with the input end of the industrial computer 7 through wires, a group of symmetrically distributed connecting through holes are formed in the four sides of the vertical part of the L-shaped plate 61, and the hole walls of the four groups of connecting through holes are connected with contact assemblies 63, the contact assemblies 63 comprise two conductive rods 631, the power connection ends of the two conductive rods 631 are electrically connected with the input end of the multi-channel voltage measuring instrument 62 through wires, the contact ends of the two conductive rods 631 are fixedly connected with conductive sponge blocks 632, the rod wall of the conductive rod 631 is fixedly sleeved with an insulating ring 633, the rod wall of the conductive rod 631 is movably sleeved with an insulating spring 634, the two ends of the insulating spring 634 are fixedly connected with the insulating ring 633 and the outer wall of the vertical part of the L-shaped plate 61 respectively, the conductive sponge block 632 cooperates with the insulating spring 634 to make the conductive rod 631 have a certain buffering capacity, thereby protecting the battery silicon wafer from being damaged by knocking, the outer wall of the electric negative pressure suction disc assembly 3 is fixedly connected with a CCD vision camera 64, and the vertical part of the L-shaped plate 61 is fixedly connected with a fill light 65.

[0039] The outer wall of the industrial computer 7 is fixedly connected with a horizontal plate 10, the upper surface of the horizontal plate 10 is fixedly connected with a display 11, the outer wall of the two connecting frames 4 is fixedly connected with a first support plate 12 and a second support plate 13 on the outer wall of the pickling and drying integrated chain type machine main body 1, a rectangular mounting hole is arranged on the upper surface of the second support plate 13, a waste collecting groove 18 is movably connected with the hole wall of the rectangular mounting hole, the bottom end of the waste collecting groove 18 is movably connected with the upper surface of the first support plate 12, the waste collecting groove 18 can conveniently collect the etched battery silicon wafer, the etched battery silicon wafer is screened, the qualified rate of the wet etching equipment for processing the battery silicon wafer is improved, the upper surface of the second support plate 13 is fixedly connected with a reprocessing tank 14, the two side outer walls of the reprocessing tank 14 are respectively fixedly connected with a waste liquid discharge pipe 16 and a waste water discharge pipe 17, the waste liquid discharge pipe 16 and the waste water discharge pipe 17 can respectively discharge the used acidic solution and pure water, the inner wall of the reprocessing tank 14 is fixedly connected with a partition plate 15, the outer wall of one side of the partition plate 15 is fixedly connected with a battery silicon wafer re-wet etching mechanism 8 together with the outer wall of the reprocessing tank 14, the battery silicon wafer re-wet etching mechanism 8 comprises an inclined plate 81 fixedly connected with the inner wall of the reprocessing tank 14 and the outer wall of the partition plate 15, the inclined plate 81, the partition plate 15 and the reprocessing tank 14 together form an acid liquid storage area 82, the outer wall of the partition plate 15 is fixedly connected with a first hollow cover 83, the bottom end of the first hollow cover 83 is fixedly connected with a surrounding plate 84 on the upper surface of the inclined plate 81, the inner wall of the surrounding plate 84 is fixedly connected with a gas suction pump 85, the output end of the gas suction pump 85 penetrates through the lower surface of the inclined plate 81 and is fixedly connected with an exhaust one-way valve 86, the suction end of the gas suction pump 85 is fixedly connected with a connecting pipe 87, the gas inlet end of the connecting pipe 87 penetrates through the upper surface of the first hollow cover 83 and is fixedly connected with a hollow filter tank 88, the outer wall of the hollow filter tank 88 is fixedly connected with the top end outer wall of the reprocessing tank 14, the top end of the inclined plate 81 is fixedly embedded with a conduit 89, the top end of the conduit 89 is fixedly connected with the lower surface of the first hollow cover 83, the upper surface of the first hollow cover 83 is fixedly connected with four electromagnetic control valves 810, the top end of each of the four electromagnetic control valves 810 is fixedly connected with a liquid spraying nozzle 811, the lower surface of the reprocessing tank 14 at the acid liquid storage area 82 is fixedly connected with a normally closed valve 812, the input end of the normally closed valve 812 penetrates through the lower surface of the second support plate 13 and is fixedly connected with an acid liquid conveying pipe 813, the lower surface of the inclined plate 81 is fixedly connected with a sealing cover 814, the bottom end of the sealing cover 814 is fixedly embedded with a liquid level switch 815, when the upper surface of the acidic solution in the acid liquid storage area 82 is lower than the liquid level switch 815, the liquid level switch 815 automatically controls the normally closed valve 812 to open to supplement the acidic solution, and when the upper surface of the acidic solution is higher than the liquid level switch 815, the liquid level switch 815 automatically controls the normally closed valve 812 to be powered off, so that the acidic solution is automatically supplemented.

[0040] The outer wall on the other side of the partition plate 15 is fixedly connected with the inner wall of the reprocessing tank 14 to form a water washing and drying mechanism 9, which comprises a heat insulation cover 91 fixedly connected with the outer wall of the partition plate 15, and a second hollow cover 92, the inside of the heat insulation cover 91 is provided with a semiconductor refrigerator 93, the refrigeration end of the semiconductor refrigerator 93 is fixedly connected with a ceramic heat conducting strip 94, the side end of the ceramic heat conducting strip 94 extends into the acid liquid storage area 82 through the partition plate 15, the outer wall of the ceramic heat conducting strip 94 is provided with a plurality of heat conducting holes 95, the lower surface of the second hollow cover 92 and the upper surface of the heat insulation cover 91 are fixedly and continuously connected with an air guide pipe 96, the upper surface of the second hollow cover 92 is fixedly and continuously connected with a plurality of air injection nozzles 97, the bottom end of the second hollow cover 92 is fixedly and continuously connected with a water inlet control valve 98, the input end of the water inlet control valve 98 is fixedly and continuously connected with a water supply pipe 99, the bottom end of the water supply pipe 99 penetrates through the outer wall of the reprocessing tank 14, the bottom end of the air inlet pipe 910 of the heat insulation cover 91 penetrates through the lower surface of the second support plate 13 and is fixedly and continuously connected with an air inlet fan 911, the mechanism makes the battery silicon wafer re-wet etching mechanism 8 have the functions of water washing and drying, and guarantees the quality of battery silicon wafer processing.

[0041] The acid pickling and drying integrated chain type machine main body 1 comprises a drying section 101 and an acid pickling section 102, a water film mechanism 103 is arranged at the inlet of the drying section 101, a first conveying roller 104 is arranged below the water film mechanism 103, the inside of the acid pickling section 102 is provided with a second conveying roller 105, a plurality of umbrella-shaped driven gears 106 are arranged at the two ends of the second conveying roller 105, each driven gear 106 is meshed with a driving gear 107, the connecting end of the driving gear 107 is connected with a driving shaft 108, the driving gear 107 and the driven gear 106 cooperate to improve the stability of transportation and reduce the torque, the two ends of the driving shaft 108 are provided with a connecting plug 109, the connecting hole of the connecting plug 109 is fixedly connected with a PEEK bearing 113 matched with the side end of the driving shaft 108, the PEEK bearing 113 has the characteristics of high-speed silence, stable transmission and small overall runout of the roller shaft, which improves the stability of equipment operation, the outer wall of the driving shaft 108 is provided with a support locking block 110, which greatly improves the overall stability of transportation and has good improvement on the flexibility of horizontal adjustment, one side of the acid pickling section 102 close to the outlet of the acid pickling and drying integrated chain type machine main body 1 is provided with a cleaning assembly, and the cleaning assembly comprises a circulating water washing section 111 and a direct supply spraying section 112, the water of the direct supply spraying section 112 is reserved to the auxiliary tank and reused in the circulating water washing section 111, thereby improving the utilization rate of water resources, the cleaning assembly can complete the purpose of removing phosphorus and boron, and the cleanliness of the battery silicon wafer can be ensured by removing excess phosphorus and boron.

[0042] The multi-channel voltage measuring instrument 62 and the CCD visual camera 64 are electrically connected to the input end of the industrial computer 7 through wires, wherein the multi-channel voltage measuring instrument 62 is a voltage measuring device and has the function of measuring the voltage of the battery silicon wafer at the four peripheral sidewalls, and the multi-channel voltage measuring instrument 62 can send the measured voltage value to the industrial computer 7 in the form of an electrical signal; the mechanical arm 2, the electric negative pressure suction disc assembly 3, the servo motor 53, the air suction pump 85, the electromagnetic control valve 810, the semiconductor refrigerator 93, the water inlet control valve 98, the air inlet fan 911 and the display 11 are electrically connected to the output end of the industrial computer 7 through wires; the model of the industrial computer 7 is ECI-521P industrial computer of Lenovo; the normally closed valve 812 is electrically connected to an external power supply through the liquid level switch 815; the above-mentioned power-on devices and electrical connections are all prior art and will not be described here.

[0043] The operation principle of the present application is described as follows: when the battery silicon wafer is processed by the wet etching of the acid washing and drying chain body 1, at this time, the mechanical arm 2 drives the electric negative pressure suction disc assembly 3 to approach the upper surface of the battery silicon wafer through the industrial computer 7, then the industrial computer 7 controls the electric negative pressure suction disc assembly 3 to stably suck the battery silicon wafer, and then the industrial computer 7 controls the servo motor 53 to rotate forward, the forward rotating servo motor 53 moves the fixed frame 55 through the threaded cylinder 54 and the screw rod 52, the fixed frame 55 drives the mechanical arm 2 and the electric negative pressure suction disc assembly 3 to move above the reprocessing tank 14, and then the servo motor 53 stops rotating, and then the industrial computer 7 controls the mechanical arm 2 to make the battery silicon wafer approach the battery silicon wafer detection mechanism 6, at the same time, the industrial computer 7 controls the CCD visual camera 64 and the fill light 65 to start, the light of the fill light 65 irradiates on the battery silicon wafer, then the CCD visual camera 64 takes a picture of the battery silicon wafer in the light receiving state, and the visual detection software loaded in the industrial computer 7 is used for auxiliary detection, the light spot on the side of the battery silicon wafer close to the CCD visual camera 64 in the light receiving state is automatically detected, if the CCD visual camera 64 cooperates with the industrial computer 7 to automatically detect that there is a light spot on the battery silicon wafer in the light receiving state, it indicates that the battery silicon wafer has over-etching and is unqualified, then the industrial computer 7 automatically controls the servo motor 53 to reverse according to the detection result, the reversed servo motor 53 makes the fixed frame 55 move above the waste collection tank 18, then the industrial computer 7 controls the mechanical arm 2 and the electric negative pressure suction disc assembly 3 to put the over-etched battery silicon wafer into the waste collection tank 18, if the CCD visual camera 64 cooperates with the industrial computer 7 to detect that there is no light spot on the battery silicon wafer in the light receiving state, it indicates that the battery silicon wafer has no over-etching and is preliminarily qualified.

[0044] When the battery silicon wafer is preliminarily detected by the CCD vision camera 64 and the industrial computer 7, the battery silicon wafer still needs to be detected by the battery silicon wafer detection mechanism 6, at this time, the multi-channel voltage measuring instrument 62 in the battery silicon wafer detection mechanism 6 cooperates with the four sets of contact assemblies 63, and measures the voltage of the four sides of the battery silicon wafer, at the same time, the multi-channel voltage measuring instrument 62 sends the voltage detected by the contact assembly 63 on each detection channel to the industrial computer 7 in the form of an electrical signal, at this time, the four detection assemblies are labeled as A1, A2, A3 and A4 in the clockwise direction by the industrial computer 7, then the industrial computer 7 analyzes the electrical signal to obtain the voltage value, and compares the measured voltage value with the standard voltage value at the etched edge preset by the industrial computer 7, if the four sets of voltage values are consistent with the standard voltage value at the etched edge within the error range, it means that the battery silicon wafer is qualified in the wet etching process in the pickling and drying integrated chain type machine main body 1, then the industrial computer 7 automatically controls the mechanical arm 2 and the electric negative pressure suction disc assembly 3 to move the battery silicon wafer to the conveying belt of the assembly line and convey it to the next station according to the detection result of the battery silicon wafer detection mechanism 6, if one or more sets of voltage values are lower than the standard voltage value at the etched edge after comparison, it means that the edge of the battery silicon wafer still has PN junction due to incomplete etching, which leads to short circuit in the edge area of the battery silicon wafer, and the problem of reduced resistance and easy current passing, thereby reducing the voltage of the side wall of the battery silicon wafer in that direction, then the industrial computer 7 determines the side wall of the battery silicon wafer in which direction has the problem of incomplete etching according to the voltage electrical signal sent by the multi-channel voltage measuring instrument 62, then the industrial computer 7 controls the mechanical arm 2 to move the battery silicon wafer to the battery silicon wafer re-wet etching mechanism 8, at the same time, the industrial computer 7 controls the electromagnetic control valve 810 corresponding to the side wall of the battery silicon wafer with incomplete etching to be started, and the industrial computer 7 labels the four electromagnetic control valves 810 installed on the first hollow cover 83 in the clockwise direction as B1, B2, B3 and B4 in turn, which is used for the battery silicon wafer wet etching equipment with the functions of battery silicon wafer over-etching and incomplete etching detection, and improves the reliability of the battery silicon wafer wet etching equipment.

[0045] When the contact assembly 63 at A1 position detects that the battery wafer side edge etching is not complete and needs to be trimmed, at this time the battery wafer is moved by the mechanical arm 2 to above the liquid jet nozzle 811 in the battery wafer re-wet etching mechanism 8, and the industrial computer 7 controls the electromagnetic control valve 810 at B1 position to open, and the industrial computer 7 controls the time of the electromagnetic control valve 810 at B1 position to open in proportion to the voltage value detected by the contact assembly 63 at A1 position, that is, the smaller the battery wafer side edge measurement voltage value, the more PN junctions in the battery wafer side wall area, that is, the higher the degree of incomplete etching, and then the more acid solution sprayed by the electromagnetic control valve 810 and the liquid jet nozzle 811, thereby ensuring that the battery wafer etching incomplete side has sufficient time to complete the re-wet etching process, improving the quality of battery wafer etching process, at this time the industrial computer 7 also controls the start of the air pump 85, the air pump 85 transports air to the acid liquid storage area 82 through the exhaust one-way valve 86, and the air pushes the acid solution in the acid liquid storage area 82 along the conduit 89 to the first hollow cover 83, then the acid solution enters the liquid jet nozzle 811 through the opened electromagnetic control valve 810, and then the acid solution in the liquid jet nozzle 811 sprays to the battery wafer etching incomplete side to complete the re-wet etching, after the battery wafer re-wet etching process is completed, the industrial computer 7 controls the air pump 85 and the corresponding position electromagnetic control valve 810 to be powered off, then the industrial computer 7 controls the mechanical arm 2 to move the battery wafer to above the second hollow cover 92 of the water washing and drying mechanism 9, and the same applies to the contact assembly 63 at A2, A3 and A4 positions detecting that the battery wafer side edge etching is not complete and needs to be trimmed, the industrial computer 7 controls the electromagnetic control valve 810 at B2, B3 and B4 positions to open;

[0046] At this time, the industrial computer 7 controls the air inlet control valve to be powered on for 30 seconds, and during the 30 seconds, the water supply pipe 99 delivers pure water to the inside of the second hollow cover 92. Finally, the pure water is sprayed to the battery silicon wafer through the water nozzle for water washing. When the battery silicon wafer wet etching equipment is working, the industrial computer 7 also controls the semiconductor refrigerator 93 to work. The semiconductor refrigerator 93 lowers the temperature of the ceramic heat conduction bar 94 on the refrigeration side. The low-temperature ceramic heat conduction bar 94 maintains the temperature of the acid solution in the acid solution storage area 82 at 8 degrees Celsius. When the temperature is high, the etching acid solution will be unstable during the etching process, which will affect the precision of the battery silicon wafer etching process. The etching acid solution temperature generally should not exceed 10 degrees Celsius for a long time. In addition, the heat on the heat dissipation side of the semiconductor refrigerator 93 is carried by the air delivered by the air inlet fan 911. The air carrying heat can increase the water temperature of the water washing, and the high water temperature can improve the flushing of the residual acid solution on the surface of the battery silicon wafer, speed up the dissolution of the residual acid solution, and improve the effect of the water washing. After 30 seconds, the water inlet control valve 98 is controlled to be powered off and closed by the industrial computer 7, and no pure water enters the second hollow cover 92. At this time, the second hollow cover 92 delivers air with a higher temperature, which facilitates the drying of the battery silicon wafer after water washing. The dried battery silicon wafer is detected by the battery silicon wafer detection mechanism 6, and is transported to the next processing position after passing the detection. The mechanism enables the etching incomplete battery silicon wafer precise re-etching processing function of the phosphorus removal and boron removal silicon etching and cleaning equipment. It can not only improve the quality of the battery silicon wafer processing, but also improve the convenience and efficiency of the battery silicon wafer wet etching processing.

[0047] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A phosphorus and boron silicon etching cleaning device comprising an acid washing and drying integrated chain machine body (1), a mechanical arm (2) and an electric negative pressure suction disc assembly (3), characterized in that, The lower sheet end outer wall of the pickling and drying integrated chain type machine body (1) is fixedly connected with two connecting frames (4), the bottom end of the connecting frame (4) is in the same horizontal plane as the bottom end of the pickling and drying integrated chain type machine body (1), the outer wall of the two connecting frames (4) is fixedly connected with a driving mechanism (5), the bottom end of the driving mechanism (5) is fixedly connected with the fixed end of the mechanical arm (2), the fixed end of the electric negative pressure suction disc assembly (3) is fixedly connected with the movable end of the mechanical arm (2), the outer wall of the two connecting frames (4) is fixedly connected with a battery silicon wafer detection mechanism (6) and an industrial computer (7), the outer wall of the industrial computer (7) is fixedly connected with a horizontal plate (10), the upper surface of the horizontal plate (10) is fixedly connected with a display (11), the outer wall of the two connecting frames (4) and the outer wall of the pickling and drying integrated chain type machine body (1) are fixedly connected with a first supporting plate (12) and a second supporting plate (13), the upper surface of the second supporting plate (13) is fixedly connected with a reprocessing tank (14), the inner wall of the reprocessing tank (14) is fixedly connected with a partition plate (15), one side of the outer wall of the partition plate (15) and the outer wall of the reprocessing tank (14) are fixedly connected with a battery silicon wafer re-wet etching mechanism (8), the other side of the outer wall of the partition plate (15) and the inner wall of the reprocessing tank (14) are fixedly connected with a washing and drying mechanism (9).

2. The phosphorus and boron removal and silicon etching cleaning apparatus according to claim 1, wherein The driving mechanism (5) comprises a fixed plate (51) fixedly connected with the outer wall of the two connecting frames (4), the opposite side of the two fixed plates (51) is connected with a lead screw (52) through a rolling bearing, the outer wall of one of the fixed plates (51) is fixedly connected with a servo motor (53), the output end of the servo motor (53) is fixedly connected with the side end of the lead screw (52), the rod wall of the lead screw (52) is threadedly sleeved with a threaded cylinder (54), the outer wall of the threaded cylinder (54) is fixedly sleeved with a fixed frame (55), the outer wall of the fixed frame (55) is movably connected with the outer wall of the two connecting frames (4), and the bottom end of the fixed frame (55) is fixedly connected with the fixed end of the mechanical arm (2).

3. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 1, wherein The battery silicon wafer detection mechanism (6) comprises an L-shaped plate (61) fixedly connected with the outer wall of the two connecting frames (4), the inner wall of the L-shaped plate (61) is fixedly connected with a multi-channel voltage measuring instrument (62), the output end of the multi-channel voltage measuring instrument (62) is electrically connected with the input end of the industrial computer (7) through a wire, the four side outer walls of the vertical part of the L-shaped plate (61) are each provided with a group of symmetrically distributed connecting through holes, and the hole walls of the four groups of connecting through holes are each connected with a contact assembly (63), the outer wall of the electric negative pressure suction disc assembly (3) is fixedly connected with a CCD vision camera (64), and the vertical part of the L-shaped plate (61) is fixedly connected with a light supplementing lamp (65).

4. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 3, wherein The contact assembly (63) includes two conductive rods (631), and the contact ends of the two conductive rods (631) are electrically connected with the input end of the multi-channel voltage measuring instrument (62) through wires.

5. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 1, wherein The battery silicon wafer re-wet etching mechanism (8) includes an inclined plate (81) fixedly connected with the inner wall of the re-processing tank (14) and the outer wall of the partition plate (15), the inclined plate (81), the partition plate (15) and the re-processing tank (14) together form an acid liquid storage area (82), the outer wall of the partition plate (15) is fixedly connected with a first hollow cover (83), the bottom end of the first hollow cover (83) is fixedly connected with a surrounding plate (84) on the upper surface of the inclined plate (81), the inner wall of the surrounding plate (84) is fixedly connected with a gas suction pump (85), the output end of the gas suction pump (85) penetrates through the lower surface of the inclined plate (81) and is fixedly connected with an exhaust one-way valve (86), the suction end of the gas suction pump (85) is fixedly connected with a connecting pipe (87), the gas inlet end of the connecting pipe (87) penetrates through the upper surface of the first hollow cover (83) and is fixedly connected with a hollow filter tank (88), the outer wall of the hollow filter tank (88) is fixedly connected with the top end outer wall of the re-processing tank (14), the top end of the inclined plate (81) is fixedly embedded with a conduit (89), the top end of the conduit (89) is fixedly connected with the lower surface of the first hollow cover (83), the upper surface of the first hollow cover (83) is fixedly connected with four electromagnetic control valves (810), the top ends of the four electromagnetic control valves (810) are fixedly connected with liquid spray nozzles (811), the lower surface of the re-processing tank (14) at the acid liquid storage area is fixedly connected with a normally closed valve (812), the input end of the normally closed valve (812) penetrates through the lower surface of the second supporting plate (13) and is fixedly connected with an acid liquid conveying pipe (813), the lower surface of the inclined plate (81) is fixedly connected with a sealing cover (814), and the bottom end of the sealing cover (814) is fixedly embedded with a liquid level switch (815).

6. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 5, wherein The water washing and drying mechanism (9) comprises a heat insulation cover (91) fixedly connected with the outer wall of the partition plate (15) and a second hollow cover (92), the inside of the heat insulation cover (91) is provided with a semiconductor refrigerator (93), the refrigeration end of the semiconductor refrigerator (93) is fixedly connected with a ceramic heat conducting strip (94), the side end of the ceramic heat conducting strip (94) extends into the acid liquid storage area (82) through the partition plate (15), a plurality of heat conducting holes (95) are formed in the outer wall of the ceramic heat conducting strip (94), the lower surface of the second hollow cover (92) and the upper surface of the heat insulation cover (91) are fixedly and communicatively connected with an air guide pipe (96), the upper surface of the second hollow cover (92) is fixedly and communicatively connected with a plurality of air injection nozzles (97), the bottom end of the second hollow cover (92) is fixedly and communicatively connected with a water inlet control valve (98), the input end of the water inlet control valve (98) is fixedly and communicatively connected with a water supply pipe (99), the bottom end of the water supply pipe (99) penetrates through the outer wall of the reprocessing tank (14), the bottom end of the air guide pipe (910) penetrates through the lower surface of the second support plate (13) and is fixedly and communicatively connected with an air inlet fan (911).

7. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 1, wherein The outer walls on the two sides of the reprocessing tank (14) are fixedly and communicatively connected with a waste liquid discharge pipe (16) and a waste water discharge pipe (17) respectively.

8. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 1, wherein The upper surface of the second support plate (13) is provided with a rectangular mounting hole, and the hole wall of the rectangular mounting hole is movably connected with a waste material collecting tank (18), and the bottom end of the waste material collecting tank (18) is movably in contact with the upper surface of the first support plate (12).

9. The apparatus for removing phosphorus and boron from silicon etching residues according to claim 1, wherein The pickling and drying integrated chain machine main body (1) comprises a drying section (101) and a pickling section (102), a water film mechanism (103) is arranged at the inlet of the drying section (101), a first conveying roller (104) is arranged directly below the water film mechanism (103), the inside of the pickling section (102) is provided with a second conveying roller (105), a plurality of umbrella-shaped driven gears (106) are arranged at the two ends of the second conveying roller (105) respectively, a driving gear (107) is engaged with the outer wall of each driven gear (106), the connecting end of the driving gear (107) is connected with a driving shaft (108), the two ends of the driving shaft (108) are provided with a connecting plug (109), the connecting hole inner wall of the connecting plug (109) is fixedly connected with a PEEK bearing (113) matched with the side end of the driving shaft (108), and the outer wall of the driving shaft (108) is provided with a support locking block (110).

10. The apparatus for removing phosphorus and boron from a silicon etching solution according to claim 1, wherein The pickling section (102) is provided with a cleaning assembly on one side close to the outlet of the pickling and drying integrated chain machine main body (1), and the cleaning assembly comprises a circulating water washing section (111) and a direct supply spraying section (112).

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