Air film cooled optical chamber

Abstract

The invention provides a lighting assembly (1000) for application in a photoreactor assembly, comprising an optical chamber (200) and a light source arrangement (100); wherein: (A) the light source arrangement (100) comprises a support (120) and an array (110) of solid state light sources (10) extending from the support (120), wherein the solid state light sources (10) are configured to generate light source radiation (11); (B) the solid state light sources (10) are at least partly configured in the optical chamber (200); wherein the optical chamber (200) is at least partly defined by (i) a window element (1250) transmissive for light source radiation (11), (ii) a chamber wall (210) reflective for light source radiation (11), and (iii) a bottom part (1100) comprising the support (120); wherein the optical chamber (200) has a largest height HC, between the bottom part (1100) and the window element (1250), and defined perpendicular to the window element (1250); (C) the chamber wall (210) comprises n slit-like openings (215), wherein n≥1; wherein each slit-like opening (215) has a slit height HS selected from a range of at maximum 0.2* HC; wherein the solid state light sources (10) and the n slit-like openings (215) are configured such that a virtual line parallel to the window element (1250) and through a solid state light source (10) intersects at least one of the n slit-like openings (215).

Description

[0001] 2024PF80354

[0002] 1

[0003] Air film cooled optical chamber

[0004] FIELD OF THE INVENTION

[0005] The invention relates to a photoreactor assembly, a lighting assembly for such photoreactor assembly, and to a method for treating a fluid with light source radiation.

[0006] BACKGROUND OF THE INVENTION

[0007] Photochemical reactors are known in the art. WO2019034792, for instance describes a reactor including a vat intended for containing a mass to be treated and at least one lighting and heating device intended for promoting the treatment of said mass, characterized in that the lighting and heating device comprises: a plate including at least one groove extending longitudinally and made up of a bottom and two side walls; and lighting means in thermal contact with the bottom of the groove, so that the heat generated by the lighting means is transmitted to the mass to be treated via the bottom of the plate.

[0008] SUMMARY OF THE INVENTION

[0009] Photochemical processing or photochemistry relates to the branch of chemistry concerned with the chemical effects of light. More in general, photochemistry refers to a (chemical) reaction caused by absorption of light, such as ultraviolet light (radiation), visible light (radiation) and / or infrared radiation (light), especially a (chemical) reaction caused by absorption of ultraviolet radiation (wavelength from about 100 nm to about 400 nm), visible light / radiation (from about 400 nm to about 800 nm), or infrared radiation (from about 780 to 3000 nm). In such a (chemical) reaction, light may be absorbed by reactant (molecules) in order for a photochemical reaction to take place, thereby forming one or more reaction products. Photochemistry may for instance be used to synthesize specific products. For instance, isomerization reactions or radical reactions may be initiated by light. Other naturally occurring processes that are induced by light are e.g. photosynthesis, or the formation of vitamin D with sunlight. Photochemistry may further e.g. be used to degrade / oxidize pollutants in water or e.g. air. Photochemical reactions may be carried out in a photochemical reactor or “photoreactor”. One of the benefits of photochemistry is that 2024PF80354

[0010] 2 reactions can be performed at lower temperatures than conventional thermal chemistry and partly for that reason thermal side reactions that generate unwanted by-products are avoided.

[0011] Further, photochemical reactions may proceed differently than temperature- driven reactions. Photochemical paths may access high energy intermediates that cannot be generated thermally, thereby overcoming large activation barriers in a short period of time, and allowing reactions otherwise inaccessible by thermal processes. Commonly used light sources in photochemistry may include low or medium pressure mercury lamps or fluorescent lamps. In addition to that, some reactions may require a very specific wavelength region, and they may even be hampered by light from the source emitted at other wavelengths. In these cases, part of the spectrum may have to be filtered out, which may lead to a low efficiency and complex reactor design. In the recent years, the output of Light Emitting Diodes (LEDs), both direct LEDs with dominant wavelengths ranging for instance from UVC to IR wavelengths, and phosphor-converted LEDs, has increased drastically, making them interesting candidates for light sources for photochemistry.

[0012] High fluxes can be obtained from small surfaces, especially if the LEDs can be kept at a low temperature. However, in prior art systems temperatures of (part of) the LEDs may become higher than desired, which may result in an accelerated aging of the LEDs. Aging may especially result in a color change of part of the LEDs, in a reduced power output, and optionally in a change in the wavelength of emitted radiation. Moreover, based on a temperature difference between LEDs, aging of LEDs in the photoreactor may vary locally.

[0013] Hence, it is an aspect of the invention to provide an alternative lighting assembly for application in a photoreactor assembly, which preferably further at least partly obviates one or more of above-described drawbacks. It is a further aspect of the invention to provide an alternative photoreactor assembly, which preferably further at least partly obviates one or more of above-described drawbacks. The present invention may have as object to overcome or ameliorate at least one of the disadvantages of the prior art, or to provide a useful alternative.

[0014] According to a first aspect, the invention provides a lighting assembly. The lighting assembly especially comprises an optical chamber (also: “light chamber” or “chamber”) and a light source arrangement (also: “lighting arrangement”). Especially, in embodiments, the light source arrangement comprises a support and an array of (especially solid state) light sources extending from the support. The (solid state) light sources are especially configured to generate light source radiation (or “(light source) light”). The (solid state) light sources are in embodiments at least partly configured in the optical chamber. The 2024PF80354

[0015] 3 optical chamber may in embodiments at least partly be defined by (i) a window element transmissive for (the) light source radiation, (ii) a chamber wall reflective for (the) light source radiation and (iii) a bottom part comprising the support. The optical chamber may have a largest height (He), between the bottom part and the window element, especially defined perpendicular to the window element. In embodiments, the chamber wall comprises n slit-like openings (wherein n>l). In specific embodiments each slit-like opening has a slit height (Hs) (especially individually) selected from a range of at maximum 0.2* He. In embodiments, the (solid state) light sources and the n slit-like openings may be configured such that a virtual line parallel to the window element and through a (solid state) light source (especially at least one of the (solid state) light sources) intersects at least one of the n slitlike openings. Hence, the invention provides in embodiments, a lighting assembly comprising an optical chamber and a light source arrangement; wherein: (A) the light source arrangement comprises a support and an array of solid state light sources extending from the support, wherein the solid state light sources are configured to generate light source radiation; (B) the solid state light sources are at least partly configured in the optical chamber; wherein the optical chamber is at least partly defined by (i) a window element transmissive for (the) light source radiation, (ii) a chamber wall reflective for (the) light source radiation, and (iii) a bottom part comprising the support, wherein the optical chamber has a largest height He, between the bottom part and the window element and defined perpendicular to the window element; and (C) the chamber wall comprises n slit-like openings, wherein n>l; wherein each slit-like opening has a slit height Hs (individually) selected from a range of at maximum 0.2* He; wherein the solid state light sources and the n slit-like openings are configured such that a virtual line parallel to the window element and through a solid state light source intersects at least one of the n slit-like openings. The lighting assembly may especially be configured for application in a photoreactor assembly, e.g., a photoreactor assembly according to the invention.

[0016] When applying such lighting assembly in a photoreactor assembly, operations may be performed at high efficiency, both in terms of radiation output versus power input of the light sources, and in capturing of the radiation by reactants provided to the reactor arrangement. In specific embodiments, heat generated by the solid state light sources may be dissipated more easily than in prior art devices, allowing higher energy input. With such lighting assembly high radiation flux densities (high powers) may be generated to irradiate (to tread) chemical reactants, especially configured in a radiation-receiving relationship with the solid state light sources (e.g., arranged downstream from the window element). The 2024PF80354

[0017] 4 radiation may be more homogenously provided by the plurality of light sources in the array and may be evenly distributed over the window element (and consecutively over a reactants to be treated). The light sources may show an extended lifetime based on cooling of the solid state light sources. The optical / radiational efficiency of the light source arrangement may be improved compared to prior art arrangements. In specific embodiments of the photoreactor assembly, the photoreactor assembly may readily be provided with reactants to be treated. In further embodiments, the reactants may easily be replaced after treatment.

[0018] As indicated above, the invention provides a lighting assembly. The lighting assembly may be applied in a photoreactor assembly. The lighting assembly may in embodiments be applied in and / or comprised by the photoreactor assembly on the invention. Embodiments of the lighting assembly and embodiments of the photoreactor assembly will be further described below.

[0019] As indicated above, the lighting assembly may in embodiments especially comprise solid state light sources (also: “solid state radiation sources”, or “radiation sources”), especially configured to generate light source radiation (in an operational mode of the lighting assembly and / or in an operational mode of the photoreactor assembly). The light source arrangement may comprise the solid state light sources, configured to generate light source radiation selected from one or more of ultraviolet (UV) radiation, visible radiation, and infrared (IR) radiation.

[0020] Herein, the term “light source” may in especially refer to “solid state light source”. Further, the terms “light” and “radiation” are herein interchangeably used, unless clear from the context that the term “light” only refers to visible light. For instance, if it is described that an element may be “transmissive for light”, this may refer to the element being “transmissive for radiation”, especially at least for the light source radiation. Hence, the term “light transmissive” may in embodiments refer to “radiation transmissive” (unless clear from the context that the term only refers to transmissive for visible light). The terms “light” and “radiation” may thus refer to UV radiation, visible light, and IR radiation. In embodiments, the light source radiation may comprise UV radiation. The light source radiation may in further embodiments (also) comprise visible radiation. In yet further embodiments, the light source radiation may (also) comprise IR radiation. The light source radiation may comprise a combination of one or more of UV radiation, visible radiation, and IR radiation.

[0021] The term “UV radiation” is known to the person skilled in the art and relates to “ultraviolet radiation”, or “ultraviolet emission”, or “ultraviolet light”, especially having one or more wavelengths in the range of about 10-380 nm. In embodiments, UV radiation may 2024PF80354

[0022] 5 especially have one or more wavelength in the range of about 100-380 nm, such as selected from the range of 190-380 nm. Moreover, the term “UV radiation” and similar terms may also refer to one or more of UVA, UVB, and UVC radiation. UVA radiation may especially refer to having one or more wavelengths in the range of about 315-380 nm. UVB radiation may especially refer to having one or more wavelengths in the range of about 280-315 nm. UVC radiation, may further especially have one or more wavelengths in the range of about 100-280 nm. In embodiments, the light sources may be configured to provide light source radiation having wavelengths larger than about 190 nm. In embodiments, the light source radiation may include wavelengths in the 380-400 nm, which is in the art sometimes indicated as part of the UVA and in other art as part of the visible wavelength range. The terms “visible”, “visible light”, “visible emission”, or “visible radiation” and similar terms refer to light having one or more wavelengths in the range of about 380-780 nm.

[0023] The phrase “light having one or more wavelengths in a wavelength range” and similar phrases may especially indicate that the indicated light (or radiation) has a spectral power distribution with at least intensity or intensities at these one or more wavelengths in the indicate wavelength range. For instance, a blue emitting solid state light source will have a spectral power distribution with intensities at one or more wavelengths in the 440-495 nm wavelength range. The term “IR radiation” especially relates to “infrared radiation”, “infrared emission”, or “infrared light”, especially having one or more wavelengths in the range of 780 nm to 1 mm. Moreover, the term “IR radiation” and similar terms may also refer to one or more of NIR, SWIR, MWIR, LWIR, FIR radiation. NIR may especially relate to Nearinfrared radiation having one or more wavelength in the range of about 750-1400 nm, such as 780-1400 nm. SWIR may especially relate to Short-wavelength infrared having one or more wavelength in the range of about 1400-3000 nm. MWIR may especially relate to Midwavelength infrared having one or more wavelength in the range of about 3000-8000 nm. LWIR may especially relate to Long-wavelength infrared having one or more wavelength in the range of about 8-15 pm. FIR may especially relate to Far infrared having one or more wavelength in the range of about 15-1000 pm.

[0024] The light sources may especially comprise solid state light sources. The term “light source” (or “solid state light source”) may in principle relate to any solid state light source known in the art. In a specific embodiment, the light source comprises a solid state LED light source (such as a LED or laser diode (or “diode laser”)). In specific embodiments, the light source may especially be a laser diode (or “diode laser”)). The term “light source” 2024PF80354

[0025] 6 may refer in embodiments to a vertical cavity laser diode (VCSELs), an edge emitting laser, etc.

[0026] The term “light sources” such as in “solid state light sources” may refer to (a plurality) of different (solid state) light sources. The term may in further embodiments, refer to identical (solid state) light sources. Different light sources may be configured for emitting radiation with different wavelengths. For instance, a first light source may be configured to emit UV light, and a second light source may be configured to radiate infrared radiation. The different solid state light sources may further comprise one or more light sources having a shape or dimensions that differ(s) from the shape or dimensions of the other light sources.

[0027] In embodiments, the solid state light sources comprise LEDs (“light emitting diodes”). An LED may especially comprise a(n) LED top section and a(n) LED substrate. The top section and the substrate may be in direct contact to each other. The top section may especially be configured to emit the radiation (in an operational mode). The substrate may be configured to connect the LED to electronics, such as a power supply or connections to a power supply, especially via the support. The support may therefore in embodiments comprise a printed circuit board. The support may in specific embodiments be a printed circuit board (“PCB”). The printed circuit board may comprise electronics for controlling and / or driving the solid state light sources.

[0028] The support may especially be configured to support the solid state light sources. The support may in embodiments comprise a planar support. The support may in embodiments further be configured to conduct heat. The support may especially be thermally conductive. In embodiments, the printed circuit board may comprise a metal core printed circuit board. The support, especially the printed circuit board, may further, in embodiments, have a thickness selected from range of 1-5 mm, such as from the range of 2-4 mm, especially from the range of 3 ± 0.5 mm. Such thickness may provide a desired stiffness of the support. Such thickness may further provide a good thermal conductivity (for conducting heat away from the optical chamber).

[0029] In embodiments, each LED comprises an LED substrate functionally coupled to the printed circuit board, especially wherein the top section extends from the LED substrate.

[0030] The term “functionally coupled” especially refers to a connection allowing to function according to the function known in the art. As indicated above, the light source are configured to generate light source radiation. Hence, functionally coupled in relation to the light source (and a PCB) may at least refer to electrically coupled. Functionally coupled may 2024PF80354

[0031] 7 in further embodiments (also) refer to a thermally conductive coupling. For instance, the support may in embodiments be functionally coupled to remainders of the bottom part (e.g., to a thermal conductor and / or heat sink, see further below) to allow heat to be dissipated. For that, the support may in embodiments be connected to the remainder of the bottom part using a thermally conductive paste or thermally conductive glue providing the thermally conductive connection. The support may in further embodiments be connected to the remainder of the bottom part (also) using (heat conductive) fastening means, such as clips, pins, screws, etc.

[0032] The LED substrate (or “substrate”) may thus especially be configured closer to the support than the LED top section (or “top section”). The LED top section may in further embodiments extend further from the support than the LED substrate. In embodiments, the substrate may be connected to the support. The top section may in embodiments comprise a semiconductor material or, e.g., a LED chip, enclosed in (or covered by) a case, cover, or lens. The top section is especially configured to emit the light source radiation (in an operational mode). The top section may comprise a case, a cover, and / or a lens. The top section may comprise a section or portion of the solid state light source from which during operation of the light source radiation escapes. The top section is especially light transmissive, especially transmissive for the light source radiation.

[0033] The top section may further comprise various shapes known in the art. For instance, the top sections may comprise one or more of a circular flat shape, a tubular shape, a round shape, a dome shape, etc. The solid state light sources may in embodiments for instance comprise a first type of LED comprising a round, flat shaped (top section) surface and a second type of LEDs comprising a round, dome shaped (top section) surface (for emitting radiation). Additionally, or alternatively, the light emitting surface of the solid state light sources may comprise yet another type of shape, such as a triangular (flat) shape, a square and especially flat shape, or a rectangular (flat) shape. In specific embodiments, the light transmissive top sections comprise light transmissive domes.

[0034] Additionally, or alternatively, the (different) solid state light sources may comprise solids state light sources configured for emitting radiation having different wavelengths. In embodiments, the light source radiation comprises radiation having a spectral power distribution with intensities at one or more wavelengths selected in the 100 nm to 1 mm wavelength range.

[0035] Hence, the array of solid state light sources may in embodiments comprise various types and / or configurations of LEDs. In embodiments, the array may comprise LEDs 2024PF80354

[0036] 8 configured for emitting radiation ranging from UV radiation up to and including infrared radiation. In further embodiments, the LEDs in the array may (also) comprise various shapes.

[0037] The phrases “different light sources” or “a plurality of different light sources”, and similar phrases, may in embodiments refer to a plurality of solid-state light sources selected from at least two different bins. Likewise, the phrases “identical light sources” or “a plurality of same light sources”, and similar phrases, may in embodiments refer to a plurality of solid-state light sources selected from the same bin.

[0038] The light sources may be configured (or “arranged”) in a light source arrangement. The light source arrangement may comprise an array of light sources. The array may especially be a two dimensional array. The light source arrangement may comprise a 2D array of solid state light sources. The array may for instance comprise i rows of solid state light sources and j columns of solid state light sources, wherein i>l and j >1, especially wherein at least i*j >2. Moreover, in embodiments i and / or j may at least be two, such as at least be four, and in embodiments i and / or j may at least be five, such as at least ten.

[0039] In embodiments, one or more of the (j) columns and / or one or more of the (i) rows may comprise a total number of solid state light sources than differs from another one of the (j) columns and / or another one of the (i) rows. For instance, in embodiments a first row may comprise a single light source, and especially a third row may comprise three light sources, whereas a tenth row may comprise ten light sources. This way a cross sectional shape of the light source arrangement (especially parallel to the support and / or parallel to the window element) may, e.g., define a triangle. The cross sectional shape of the light source arrangement defining a specific shape , e.g., a triangle may also be indicated as “the light source arrangement may be configured in a specific shape configuration, e.g., in a “triangular configuration”. A (desired) cross sectional shape of the light source arrangement may in embodiments be configured by selecting a total number of solid state light sources individually per row and (individually) per column. In specific embodiments, for instance, the light source arrangement may be configured in a (closed) circular round configuration (the cross-sectional shape of the light source arrangement may define a (closed) circle). It will be understood that by selecting the total number of light sources in each row, the total number of light sources in each column, and a distance between neighboring light sources, the light source arrangement may be configured in any arbitrary configuration.

[0040] The light source arrangement may in specific embodiments especially be configured in a rectangular (including square) configuration. Especially, a total number of light sources in each of the (i) rows is identical. Further, especially the total number light 2024PF80354

[0041] 9 sources in each of the (j) columns is identical. In further embodiments, a (minimal) distance between neighboring light sources in a row (especially in all rows) may be constant (over the row). Likewise, a (minimal) distance between neighboring light sources in a column (especially in all columns) may be constant (over the column). In embodiments, the array comprises i rows * j columns of solid state light sources, especially configured in a rectangular configuration. Further, especially, i is at least 5, such as at least 10, even more especially at least 30 in embodiments, and in further embodiments, i is at least 100, such as at least 250. In further embodiments, j is at least 5, such as at least 10, even more especially at least 30 in embodiments, and in further embodiments, j is at least 100, such as at least 250. In further embodiments, the j columns are configured parallel to each other. Further especially (also) the i rows are configured parallel to each other.

[0042] Hence in embodiments, the array of light sources may comprise 25 (e.g., 5*5, or 1 *25) solid state light sources, configured in a square configuration. In other embodiments, the array may comprise for instance 25000 (e.g., 100*250 or 50*500) light sources, configured in a rectangular configuration. In other embodiments, the array may comprise 1000 (or any arbitrary number of) light sources configured in a circular round configuration.

[0043] As indicated above, the solid state light sources may at least partially be configured in the optical chamber. In embodiments at least the top sections of the solid state light sources are configured in the optical chamber. In further embodiments (also) at least part of the substrates of the solid state light sources may be configured in the optical chamber. Further, part of the substrate may be configured in (or through) the support, in embodiments. The light sources are especially configured in the optical chamber such that light source radiation emitted from the light sources is (substantially completely) emitted in the optical chamber.

[0044] The optical chamber may further be configured for allowing the light source radiation to exit the chamber via the window element (transmissive for light source radiation). Herein, the window element may also be referred to as “radiation transmissive window element”. The chamber is in embodiments configured for minimizing a loss of radiation via other locations (than the window element) of the chamber. This way a photochemical reactor arrangement arranged at the window element opposite to the chamber may be irradiated with the light source radiation, especially with a minimum of power loss. The chamber is further especially configured to guide light source radiation generated by the light sources to the window element. The light source radiation may in embodiments further 2024PF80354

[0045] 10 travel through the window element especially to irradiate a fluid in a photochemical arrangement arranged downstream from the window element, see below.

[0046] The terms “upstream” and “downstream” relate to an arrangement of items or features relative to the propagation of the light from a light generating means (here the especially the light source), wherein relative to a first position within a beam of light from the light generating means, a second position in the beam of light closer to the light generating means is “upstream”, and a third position within the beam of light further away from the light generating means is “downstream”.

[0047] As indicated above, the chamber may at least be defined by the window element, the bottom part (comprising the support), and the chamber wall. The window element may in embodiments comprise (especially be) a planar window element. The chamber wall may in embodiments bridge the bottom part to the window element. The chamber wall may further surround (a total volume or “inner space” of) the optical chamber. The chamber wall is further especially configured to reflect light source radiation. The chamber wall is (therefore) especially configured in a radiation-receiving relationship with the array of light sources.

[0048] The term “radiation-receiving relationship” (or “light-receiving relationship”) between a first element and a second element relates to being configured such that radiation (light) emitted by or coming from a first element directly or indirectly may be provided to the second element. With respect to the light sources and the chamber wall, the radiation (light) may substantially travel along a straight line (as a “ray” or “beam”)), directly from (one of) the light sources to the wall and / or the radiation (light) may travel from the light sources to the wall via (light / radiation) reflecting elements (reflective for the light source radiation). At least the chamber wall may comprise the reflective elements (such as a reflective surface, see below). Additionally, or alternatively, the radiation (light) may travel to the wall via scattering, diffusion, etc. The radiation may especially travel along an optical path (or “radiational path”) (especially from the light sources to the window element).

[0049] As indicated above, the window element is (also) configured in in a radiationreceiving relationship with the light sources. The radiation-receiving relationship may be configured directly from the light sources to the window element, or , e.g., indirectly via the chamber wall. The chamber wall (thus) may especially be configured in an optical path (or “radiational path”) from one or more of the light sources to the window element.

[0050] The chamber wall, especially elements of the chamber wall, may especially comprise a planar surface (directed to the inner space of the chamber). The surface of the 2024PF80354

[0051] 11 chamber wall directed to the inner space of the chamber may herein also be referred to as “inner surface” (of the chamber wall). The term “planar surface” may refer to a plurality of planar surfaces. The planar surface may be curved in embodiments, or may comprise defined angles. The chamber wall may in embodiments define a cylinder, or e.g., a cuboid (comprising four defined angles), see also above. Moreover, a cross-section of the chamber wall parallel to the window element may comprise a circle and / or a rectangle, in embodiments. Such configuration may effectively reflect radiation generated by the light sources to the window element.

[0052] The chamber wall may especially comprise a specular reflector (at the inner surface). The (inner surface of the) chamber wall may in embodiments comprise a reflective (polymer) material. The chamber wall may comprise a reflective polymer foil (directed to the inner space of the chamber), especially configured to reflect the light source radiation. The inner surface may comprise the reflective material. Reflective polymer material, such as reflective polymer foils are known in the art and may for instance reflect at least 95% of light in the visible spectrum. Examples of such foils may also be known as “Enhanced Specular Reflector” film or “ESR film / foil”. The chamber wall may in embodiment comprise a polymeric wall material (wherein the inner surface is) covered by a reflective film. The reflective film may protect the polymeric material from the light source light. The reflective film may further prevent the polymeric material from heat generated in the chamber. The reflective film may be configured to reflect (at least 90% of) the light source radiation (assuming perpendicular irradiation). Additionally, or alternatively, the chamber wall comprises a metallic reflector (or “metal comprising reflector”). A metallic reflector may withstand high temperatures and may provide a high efficiency. The metallic reflector may in embodiments comprise one or more metals selected from the group consisting of aluminum, silver, monel, (stainless) steel, copper, and gold. The metallic reflector may in embodiments comprise a gold plated reflector. A gold plated reflector may especially advantageously reflect infrared radiation. The reflector may further comprise glass. The inner surface of the chamber wall may comprise the glass. The surface of the chamber wall may in further embodiments be polished. The chamber wall may for instance in embodiments comprise aluminum, especially wherein the (inner) surface of the chamber wall (facing to inner space of the chamber) is polished. Additionally, or alternatively, the reflector and / or the inner surface of the chamber wall may comprise polytetrafluoroethylene (PTFE or Teflon) or, e.g., titanium dioxide, which may provide a diffuse reflection for ultraviolet radiation or visible light, respectively. 2024PF80354

[0053] 12

[0054] The chamber wall may in further embodiments be configured substantially perpendicular to the window element. In further embodiments, the chamber wall may (also) be configured substantially perpendicular to the support.

[0055] The optical chamber further especially comprises a (chamber) height defined between the bottom part and the window element in a direction perpendicular to the window element. The chamber height may in embodiments be constant over the chamber. The chamber height may in embodiments, e.g., be equal to the shortest distance between the support and the window element. In further embodiments, the chamber height may vary between different positions in the chamber. For instance, the bottom part may comprise the support only at specific locations of the bottom part. In such embodiment, the chamber height may at a location of the support differ from the chamber height at other locations in the chamber (not comprising the support). Yet, also other configurations are feasible in which the chamber height may vary over the chamber (e.g., if the window element and the support are not arranged parallel to each other, if the window element or the support is not configured as a planar window element, or e.g. the window element comprises protrusions, etc.). The optical chamber may especially be characterized by a largest (chamber) height (Hc) between the bottom part and the window element. The largest height is especially defined perpendicular to the window element.

[0056] A relevant aspect of the invention is the presence of one or more openings in the chamber wall. The chamber wall may especially comprise the one or more openings to allow providing a gas flow along the light sources during operating the lighting assembly. By providing the gas flow along the light sources, the light sources may be cooled. The (one or more) openings may especially be configured to provide a flow of gas in the optical chamber via the one or more openings, wherein the gas flow is provided along the light sources. The one or more openings may especially comprise slit-like openings. Hence, in embodiments, the chamber wall comprises (one or more, especially) n slit-like openings, especially wherein n>l, as indicated above.

[0057] The term “slit-like”, such as in “slit-like opening” especially refers to an element, such as a cut, an opening, a split, etc., having a first size in a first dimension and a second size in a second dimension perpendicular to the first dimension, wherein the second size is larger than the first size. The second size may for instance be at least three times, especially at least five times, larger than the first dimension. The second size may especially be at least ten times larger than the first dimension. The slit-like opening may thus have an elongated shape. The slit-like opening may have a slit length (Ls) defined parallel to the 2024PF80354

[0058] 13 window element (and to the chamber wall) and a slit height defined (Hs) perpendicular to the window element. In embodiments, Ls>2 Hs, such asLs>5 Hs.

[0059] Herein, the term “slit height (Hs)” especially refers to a maximum height of the slit in a direction perpendicular to the window element. The term “slit length (Ls)” is especially defined perpendicular to the slit height along the chamber wall.

[0060] The chamber wall may comprise n slit-like openings. The n slit-like openings may in embodiments be identical. Yet, in further embodiments, at least one of the slit-like openings may differ from another one of the slit-like openings. For instance, the slit length may be different between different slit-like openings, and / or the slit height may be different between different slit-like openings. In further embodiments, also a minimal distance to the support may vary between slit-like openings.

[0061] As indicated above, the n slit-like openings may especially be configured for providing the flow of gas along the light sources. Furthermore, (part of) the n slit-like openings may also be configured for providing a gas flow in the chamber. Also a part of the n slit-like openings may be configured to release or remove gas from the chamber. Furthermore, the n slit-like openings may further be configured for minimizing a loss of radiation from the chamber via the slit-like openings. Therefore, in embodiments, each slitlike opening may have a slit height Hs especially selected from a range of at maximum 0.2* He. The slit height Hsmay especially individually be selected for each slit-like opening. Further, the solid state light sources and the n slit-like openings may be configured such that a virtual line parallel to the window element and through a solid state light source (especially at least one of the (solid state) light sources) intersects at least one of the n slit-like openings.

[0062] In embodiments, the n slit-like opening may comprise a linear configuration.

[0063] In further embodiments, a slit-like opening may comprise a curved or, e.g., a wavy configuration. In yet further embodiments, at least one slit like opening may comprise a shaped slit, e.g., a tapered shape (in a direction perpendicular to the first dimension and to the second dimension), further facilitating to guide the gas flow along the light sources.

[0064] In further embodiments, the gas flow may especially be guided along top sections of the light sources. This may reduce aging effects such as discoloration of the top sections of the light sources. Hence, in specific embodiments, the solid state light sources may comprise LEDs; especially wherein each LED comprises a light transmissive top section from which during operation of the LED light source radiation escapes. In further embodiments, the LEDs and the n slit-like openings may be configured such that a virtual 2024PF80354

[0065] 14 line parallel to the window and through a top section of an LED intersects (the) at least one of the n slit-like openings.

[0066] The light transmissive top sections may further have a maximum top section height (Ha) (especially defined perpendicular to the window element). In further specific embodiments, the slit heights (Hs) are (individually) selected from the range of 0.5*Hd - 2*Ha. Such configuration may especially facilitate cooling of the top sections.

[0067] As indicated above, the shape of the solid state light sources may vary over the array. This may result in embodiments of the solid state light sources that may have top section heights that are less than the maximum top section height (Ha). The term “maximum top section height (Ha)” may especially refer to a maximum value for the top section heights of all solid state light sources in the array.

[0068] In embodiments it may be advantageous to provide the flow of gas in the chamber and / or to release the flow of gas from the chamber at locations directly adjacent to the support and / or to the bottom part. Each of the n slit-like openings especially comprises a slit perimeter. In specific embodiments, a segment of the slit perimeter of at least one of the n slit-like openings is defined by the bottom part.

[0069] In further embodiments, it may be advantageous to provide the flow of gas in the chamber and / or to release the flow of gas from the chamber at locations further remote from the bottom part. This may for instance facilitate flowing (substantially only) along top sections of LEDs comprising LED substrates extending from the support. Hence, in further embodiments, at least one of the n slit-like openings is configured at a non-zero minimal distance (Di) from the bottom part. Further, especially the top sections may have a shortest distance (Da) (defined perpendicular to the window element) to the support. In embodiments, the minimal distance (Di) between the bottom part and the at least one of the n slit-like openings, is selected from the range of 0.1* Da - 1.5*Da.

[0070] The term “a (the) shortest distance (Da)” especially refers to a minimum value of the shortest distances of the top sections of each of the solid state light source of the array.

[0071] As described above, in specific embodiments, the array of solid state light sources may be configured in a rectangular configuration. The array may. e.g.. comprise i rows * j columns of solid state light sources, especially wherein i>5 and j>5, such as i>20 and j>20, and especially one or more of i and j is at least 100. Peripherally located solid state light sources may define a central cross-sectional segment of the support having a smallest cross- sectional area enclosing all solid state light sources (or: “enclosing projections of all solid 2024PF80354

[0072] 15 state light sources”). The cross-sectional area may have a segment width W, defined by the i rows, and a segment length L, defined by the j columns.

[0073] The cross-section of the chamber wall (parallel to the window element) may in further embodiments be configured geometrically similar to the configuration of the array, especially to the central cross-sectional segment of the support. For instance, in embodiments comprising the array in a rectangular configuration, a cross section of the chamber wall parallel to the window element may advantageously also be configured as a rectangle.

[0074] In specific embodiments, the chamber wall may comprise four wall elements, together defining the chamber wall. Especially, two of the four wall elements may be configured parallel to the i rows and another two of the four wall elements may be configured parallel to the j columns. Further, especially, the chamber wall may comprise at least two slitlike openings (n>2). In embodiments, two of the wall elements together comprise the n slitlike openings. For instance, (the) two of the four wall elements configured parallel to the i rows, or (the) two of the four wall elements configured parallel to the j columns may each comprise at least a single slit-like opening. Said two of the four wall elements may each comprise a single slit-like opening, especially (configured as) an elongated slit like opening.

[0075] The term “elongated slit-like opening” may especially refer to a slit-like opening wherein , Ls>10 Hs, such asLs>100 Hs. The elongated slit-like opening may in embodiments have a length being approximately equal to the segment width (W) or segment length (L) (e.g., in the range of 0.95-1.05 times the segment width W or 0.95-1.05 times the segment length L) for an elongated slit-like opening parallel to the j columns or to the i rows, respectively.

[0076] Instead of having a single elongated slit-like opening in a single wall element, the elongated slit-like opening may be defined by at least two slit-like openings configured next to each other in a direction parallel to the i rows or parallel to the j columns. Adjacent slit-like openings may comprise a space distance between the adjacent slit-like openings. In embodiments, especially a total length of the at least two slit-like openings plus a total length of the space distances between adjacent slit-like openings of the at least two slit-like openings may have a total length as described in relation to the elongated slit-like opening (e.g., in the range of 0.95-1.05 times the segment width W or 0.95-1.05 times the segment length L for slit-like openings parallel to the j columns or to the i rows, respectively).

[0077] Having the slit-like openings configured in opposite wall elements may in embodiments provide the gas flow along most of the solid state light sources (when flowing the gas in the chamber at a first one of the wall elements comprising one of the (elongated) 2024PF80354

[0078] 16 slit-like opening(s) and releasing the gas from the chamber via the (elongated) slit-like opening(s) in the opposite wall element comprising the (elongated) slit-like opening(s). In further embodiments the slit-like openings may be configured in three or in four of the wall elements. This may in embodiments provide a flow path of the gas flow along predetermined solid state light sources.

[0079] Hence, in embodiments, the array comprises i rows * j columns of solid state light sources, especially configured in a rectangular configuration, wherein i>5 and j>5; wherein peripherally located solid state light sources define a central cross-sectional segment (or “central segment”) of the support having a smallest cross-sectional area enclosing (projections of) all solid state light sources and having a segment width W, defined by the i rows, and a segment length L, defined by the j columns; wherein the chamber wall comprises four wall elements, together defining the chamber wall, wherein two of the four wall elements are configured parallel to the i rows and another two of the four wall elements are configured parallel to the j columns; wherein n>2; wherein at least two of the wall elements each comprise one of the slit-like openings comprising an elongated slit-like opening; and wherein one or more of the following applies: (i) a length (Ls) of the elongated slit-like opening parallel to the i rows is selected in the range of 0.95*L - 1.05*L and (ii) a length (Ls) of the elongated slit-like opening parallel to the j rows of solid state light source is selected in the range of 0.95*W - 1.05*W.

[0080] The lighting assembly may in further embodiments comprise the window element. Light source irradiation generated by the light sources may exit the chamber via the window element. The window element may comprise a window transmissive for the light source radiation (or “radiation transmissive window”). The light source radiation may travel through the window element, especially to a photochemical reactor arrangement configured downstream from the reactor window element, especially downstream from the window. The light source radiation may be applied to treat a fluid provided in the photochemical reactor arrangement, see also further below.

[0081] The term “(radiation transmissive) window” may also refer to a plurality of (radiation transmissive) windows. The radiation transmissive window may in embodiments comprise a radiation transmissive material. The radiation transmissive material may be transmissive for at least part of the light source radiation. That is, in embodiments, the radiation transmissive window may have a transmission value for (light source radiation) of at least 50%, such as at least 70%, especially at least 90%, even more especially at least 95%. Further, the radiation transmissive material may be transmissive for (essentially) all of the 2024PF80354

[0082] 17 light source radiation. Thereby, the radiation transmissive window may be configured downstream of the solid state light sources arrangement, and especially (at least part of) a photochemical reactor arrangement may be configured downstream of the radiation transmissive window. Hence, the radiation transmissive window may facilitate irradiation of (a fluid in) the reactor arrangement by the light source arrangement while keeping the light source arrangement away from the potentially hazardous environment of the reactor chamber.

[0083] The window element may in further embodiments comprise a frame configured to frame or surround the window(s). The frame may in embodiments (also) be transmissive for the light source radiation in embodiments. In alternative embodiments, the frame may not be transmissive for (at least part of) the light source radiation. Hence, at least the (radiation transmissive) window may be transmissive for the light source radiation.

[0084] The frame may be configured to minimize blocking a radiational path from the light sources to the window(s). A face of the frame directed to the inner space of the chamber may in embodiments be configured aligned with a face of the window(s) directed to the inner space of the chamber. Moreover, in embodiments, at least a segment of the window element defining the optical chamber may comprise (especially be) a planar segment. The frame may in further embodiments comprise a reflective element as described in relation to the chamber wall, and especially directed towards the chamber.

[0085] In further embodiments, the lighting assembly may (also) be configured for cooling the light sources via the support. Cooling may in embodiments be desired, especially of the central segment of the support (comprising the solid state light sources). In embodiments, less or no cooling may be desired of a peripheral part (of the support). The peripheral part (of the support) may especially be defined as a part of the support at least partially enclosing the central segment. In embodiments, the lighting assembly may further comprise a thermal conductor supporting at least part of the support, and especially heat may flow from the support to the thermal conductor. The thermal conductor may for instance be configured as a heat sink. The thermal conductor may be configured in contact with air outside the optical chamber (to dissipate heat to the ambient atmosphere). The thermal conductor may especially comprise a thermally conductive material. The thermal conductor may, e.g., comprise a metal or a thermally conductive ceramic or any thermally conductive material known to the person skilled in the art. The bottom part may comprise the thermal conductor. In embodiments, the thermal conductor may comprise thermally conductive glue or a thermally conductive paste. The support may be adhered to further parts of the bottom parts with the thermally conductive paste or glue. 2024PF80354

[0086] 18

[0087] The thermal conductor may in embodiments especially be arranged in direct contact with the central segment of the support, whereas there may be no direct contact between the peripheral part and the thermal conductor. This way, heat generated at the central segment may more easily be transferred to the thermal conductor than heat generated at the peripheral part. In embodiments a (thermal) gap may be configured between the support and the thermal conductor and / or (further parts of the) body part at locations of at least part of the peripheral part (of the support).

[0088] Hence, in embodiments, the lighting assembly further comprises a thermal conductor supporting at least part of the support; wherein the support comprises a peripheral part, at least partially enclosing the central segment; wherein at least part of the peripheral part is not in thermal contact with the thermal conductor or only in thermal contact with the thermal conductor via the central segment.

[0089] As indicated above, a distance between the array of solid state light sources and the chamber wall may in embodiments be minimized. A minimal distance between the array and the chamber wall may in embodiments be less than 5 times a pitch of the solid state light sources (in the array), such as less than 3 times a pitch of the solid state light sources. The term pitch may be known in the art and may especially refer to a minimum distance between centers (especially of the top section) of neighboring solid state light sources.

[0090] In embodiments, a distance (Dw) between the chamber wall and one or more peripherally configured solid state light sources configured closest to the chamber wall is selected from the range 0.2*P-1.5* P, especially from the range of 0.4*P-l*P, such as from the range of 0.4*P - 0.6*P. The chamber wall may in embodiments define an infinity mirror.

[0091] Hence, in embodiments, the solid state light sources have a pitch (P), wherein the central segment comprises a main central segment part and a peripheral central segment, enclosing the central segment part; wherein the peripheral central segment has a peripheral central segment width (W2), defined as shortest distance between the peripheral part and the main central segment part, wherein the peripheral central segment width (W2) is selected from the range of 0*P - 3*P, especially selected from the range of 0.5*P-3*P. W2 may in further embodiments be selected to be at least 0.1 *P, such as at least 0.2 *P, and especially 3*P, at maximum, such as 2*P at maximum.

[0092] In further embodiments, (also) at least part of the peripheral central segment is not in thermal contact with the thermal conductor or only in thermal contact with the thermal conductor via the central segment part. For instance, in embodiments, a cross-sectional area of the peripheral central segment comprising all of the peripherally configured solid state 2024PF80354

[0093] 19 light sources configured closest to the chamber wall may not in thermal contact with the thermal conductor or only in thermal contact with the thermal conductor via the central segment part.

[0094] Hence, in embodiments, the (thermal) gap may further be configured between the support and the thermal conductor and / or (parts of the) body part at locations of at least part of the peripheral central segment (of the support). The gap may in embodiments have a gap height of at least 0.05, such as at least 0.1 mm, especially at least 1 mm. In embodiments, the gap may have a gap height selected from the range of 0.05 - 50 mm, especially selected from the range of equal to or less than 30 mm, or equal to or less than 20 mm, e.g. selected from the range of 0.5-20 mm, especially selected from the range of 0.5-5 mm. It is noted that a thermal insulating effect (a reduction in heat loss via the gap) of a gap of 1 mm may already be about 70% of the effect of a gap with a 20 mm gap height. The gap height is especially defined perpendicular to the (a plane of the) support.

[0095] Especially, (dimensions of) the peripheral central segment width (W2) may be selected such that a temperature difference between solid state light sources from the main central segment part and solid state light sources from the peripheral central segment, while all solid state light sources are operating at maximum rated power, is less than 5°C, such as less than 3°C, especially less than 2°C.

[0096] In yet further embodiments, the bottom part, especially the thermal conductor may comprise elements or means to facilitate cooling of the bottom part, especially the thermal conductor. The bottom part may for instance comprise extensions or fins extending from the bottom part, configured in contact with the ambient atmosphere outside the lighting assembly. Additionally, or alternatively, the bottom part may comprise a channel configured for flowing a cooling medium through the channel. The term “channel” may in embodiments refer to a plurality of channels. In embodiments, the thermal conductor comprises a fluid channel configured for flowing a cooling medium through the channel. The (fluid) channel may especially at least be configured at locations of the light source arrangement. The cooling medium may comprise any arbitrary fluid. In embodiments, the cooling medium comprises a liquid, especially an aqueous liquid. The aqueous liquid may comprise water. The aqueous liquid may in further embodiments comprise any arbitrary cooling liquid known in the art.

[0097] According to a further aspect, the invention provides a photoreactor assembly (or “photochemical assembly”). The photoreactor assembly especially comprises a lighting assembly, for instance comprising the lighting assembly according to the invention. The 2024PF80354

[0098] 20 photoreactor assembly may in further embodiments comprise a photochemical reactor arrangement (also: “photoreactor arrangement” or “reactor arrangement”). The photoreactor assembly may further comprise a gas flow arrangement. In specific embodiments, the gas flow arrangement and the lighting assembly may be configured such that (especially in an operational mode of the photoreactor assembly) a gas flow may be provided along one or more of the solid state light sources by providing, with the gas flow arrangement, a flow of gas in the optical chamber via (the) at least one of the n slit-like openings. The photochemical reactor arrangement is especially configured in a radiation-receiving relationship with the solid state light sources via the window element.

[0099] Hence, the invention provides in embodiments, a photoreactor assembly comprising a photochemical reactor arrangement. The photoreactor arrangement may in embodiments comprise a reactor. The term “reactor” may especially relate to a (photo)chemical reactor. The term may essentially relate to an enclosed reactor chamber in which a (photochemical) reaction may take place. In embodiments, the reactor may be configured to hold a reactor fluid and facilitate a (photo)chemical reaction of (e.g., molecules in) the reactor fluid held within the reactor. The (photochemical) reaction may take place due to irradiation of the reactor fluid with the light source radiation. Therefore, at least part of the reactor may be configured in a radiation-receiving relationship with at least part of the light source arrangement (during operating the photoreactor assembly).

[0100] The term “reactor” may refer to a plurality of reactors. Each reactor may in embodiments comprise different types of reactor fluids. In further embodiments each reactor may comprise the same (type of) reactor fluid (having the same composition). Moreover, in embodiments the plurality of reactors may all be the same, whereas in further embodiments, at least one of the reactors may differ from the other reactors of the plurality of reactors. The at least one of the reactors may for instance have other dimensions relative to the other reactors.

[0101] Hence, in embodiments, the photochemical reactor comprises a reactor chamber configured to receive a reactor fluid (especially a fluid to be treated with light source radiation). The reactor chamber may comprise a reactor chamber wall enclosing a reactor volume. The reactor chamber wall is especially transmissive for the light source radiation. The reactor chamber wall may comprise a radiation transmissive material described herein, e.g., in relation to the radiation transmissive window.

[0102] In specific embodiments, (wherein the optical chamber wall comprise the four wall elements) each of a set of two wall elements selected from the four wall elements 2024PF80354

[0103] 21 configured parallel to each other, comprise one of the n elongated slit-like opening, wherein the gas flow arrangement is configured to provide the gas in the optical chamber via one of the n slit-like openings and remove the gas from the optical chamber via another one of the n slit-like openings, thereby providing the flow of gas in the optical chamber.

[0104] The gas flow arrangement may in embodiments comprise a gas transport device configured to provide the flow of gas in the optical chamber via at least one of the n slit-like openings. The gas transport device may for instance comprise a pump or a ventilator. In embodiments, the gas provided by the transport device may comprise ambient air. In further embodiments, the gas may comprise filtered air. Alternatively, the gas may comprise nitrogen gas, or e.g., carbon dioxide gas, helium gas, or neon gas. Helium gas and argon gas may for instance have a higher thermal conductivity than air, which may facilitate cooling of the light sources. In embodiments, the gas may be supplied from a gas bottle.

[0105] The gas device may supply the gas at ambient conditions (pressure and temperature). Yet, in further embodiments, the gas may be cooled and / or pressurized upstream of optical chamber. In embodiments, the gas may, e.g., be supplied from a (pressurized) gas bottle. In further embodiments, the photoreactor assembly may be configured to be operated at a pressure (especially in the optical chamber) above ambient pressure, e.g., at a pressure selected from the range of 2-15 bar (absolute), such as selected from the range of 5-10 bar (absolute). The photoreactor assembly, especially the gas flow arrangement, may in embodiments for instance comprise a pressure control system configured for maintaining a predetermined pressure inside the optical chamber.

[0106] In further embodiments, the gas flow arrangement may comprise a closed loop gas flow arrangement. Especially, gas being discharged from the optical chamber (via one or more of the n slit-like openings) may be recirculated to the gas transport device. Using a closed loop system and / or filtered gas may prevent ingress of dirt. In embodiments, a gas cooling device may be configured upstream of the gas transport device and / or upstream of the optical chamber.

[0107] In further embodiments the gas may be pressurized by the gas transport device. Compressed gas may facilitate an improved cooling of the light sources. The gas transport device may for instance be configured for providing the flow of gas at a pressure being higher than the pressure configured in the optical chamber to overcome any pressure drop, especially in the closed loop of the flow of gas. In embodiments, the flow of the gas provided by the gas transport device may be configured about 1-2 bar higher than the pressure configured in the optical chamber. Compressed gas may facilitate an improved 2024PF80354

[0108] 22 cooling of the light sources compared to gas at ambient pressure. Compressed air may have a higher thermal conductivity than ambient air. Furthermore, using compressed gas may allow lower gas flows along the solid state light sources and through the chamber which may make fewer demands on strength of the optical chamber.

[0109] Hence, in embodiments, the gas flow arrangement may be configured for providing the gas to the optical chamber at a temperature selected from the range < 40 °C, especially < 20 °C, and in embodiments < 10 °C. In further embodiments, the gas flow arrangement may (also) be configured for providing the gas to the optical chamber, wherein the gas has a thermal conductivity higher than a thermal conductivity of ambient air.

[0110] The gas flow arrangement may in further embodiments comprise a gas chamber configured downstream from the gas transport device and upstream of the optical chamber. The optical chamber may especially be configured to provide an even distribution of the flow of gas through the slit-like opening(s). The gas transport device may for instance provide the gas via one or more inlet openings in the chamber, wherein the gas may be homogenously distributed over the chamber before the gas enters the optical chamber via one or more of the n slit-like openings. The gas chamber is especially comprised by the photoreactor assembly.

[0111] Hence, in embodiments the gas flow arrangement comprises a gas chamber, wherein the gas chamber is configured in fluid communication with the optical chamber via at least one of the n slit-like openings; wherein the gas chamber is configured for receiving gas via the gas transport device and to evenly provide the flow of gas in the optical chamber via at least one of the n slit-like openings.

[0112] In specific embodiments, the gas chamber comprises gas inlet openings for receiving the gas from the gas transport device; wherein at least one of the n slit-like openings, especially an elongated slit-like opening, is configured directly downstream of at least two gas inlet openings. Especially, gas may be introduced via the at least one of the n slit-like openings downstream of gas inlet openings.

[0113] The photochemical reactor arrangement may in further embodiments comprise a reactor receiving element configured for receiving the reactor. The reactor receiving may be configured for arranging at the window element, wherein the reactor is configured in a radiation-receiving relationship with at least part of the light source arrangement (during operating the photoreactor assembly). Therefore, the reactor receiving element may (also) comprise radiation transmissive material, e.g., as described in relation to the radiation transmissive window. The radiation transmissive material (of the reactor receiving element) 2024PF80354

[0114] 23 may at least be configured to provide a radiation-receiving relationship between the reactor and the light source arrangement. The reactor receiving element may further especially be configured for positioning the reactor in the radiation-receiving relationship with the light source arrangement. In embodiments, the frame of the window element may at least partly comprise the reactor receiving element.

[0115] In embodiments, the reactor receiving element may facilitate changing the reactor(s) after treating the reactor fluids with the light source radiation. The reactor receiving element may in embodiments comprise a detachable element, that for instance may be detached after treatment, and be attached again after changing the reactor(s) and / or the reactor fluid(s) in the reactor(s).

[0116] Hence, in embodiments radiation traveling from one of the light sources to a reactor fluid in the reactor may at least travel through the window element (especially through (one of the window(s)) and through the reactor wall configured downstream from the window element. In further embodiments, the radiation may travel through the window element (especially through (one of the window(s)), through the reactor receiving element configured downstream from the window element, and through the reactor wall configured downstream from the reactor receiving element. It will be understood that optionally some further, especially radiation transmissive, elements may be configured in the reactor arrangement (and / or in the photoreactor assembly), upstream of the reactor(s).

[0117] In embodiments, the reactor receiving element may comprise a multi-well plate. In embodiments, the multi-well plat may in embodiments comprise a plurality of reactor receiving chambers configured (each) for receiving a plurality of reactors (comprising the reactor fluid to be treated (in the reactor chamber)). In further embodiments, the multiwell plate may comprise a plurality of reactor chambers, (each) for hosting the rector fluid. The reactor chambers may especially be configured in a radiation-receiving relationship with the optical chamber via the window element (during operating the photoreactor assembly).

[0118] In further specific embodiments the gas flow arrangement may (further) be configured for providing a flow of the gas along the frame and / or along the reactor receiving element, especially for cooling the frame and / or the reactor receiving element. For instance in embodiments a channel may be configured from the gas inlet chamber towards the frame (and / or reactor receiving element). The frame (and / or reactor receiving element) may in embodiments comprise a slit for guiding the flow of gas along the frame (and / or reactor receiving element). 2024PF80354

[0119] 24

[0120] In further specific embodiments, the photoreactor assembly may comprise (the lighting assembly wherein) the slit heights (Hs) that are (individually) selected from the range of 0.5*Ha -2*Ha; wherein the photochemical reactor arrangement comprises a multi -well plate comprising a plurality of reactor chambers configured in a radiation-receiving relationship with the optical chamber via the window element; and especially wherein the gas flow arrangement comprises a gas transport device configured to provide the flow of gas in the optical chamber via at least one of the n slit-like openings.

[0121] In further specific embodiments, the photoreactor assembly, especially the array of solid state light sources, may be configured for treating the reactor fluid with radiation having a broad spectrum, e.g., ranging from UV radiation to infrared radiation. The spectrum may in embodiments have a width of at least 50 nm, such as selected from the range of 100 nm to over 1000 nm. Alternatively, the photoreactor assembly, may be configured for treating the reactor fluid with a radiation having a single wavelength (especially selected from the spectrum ranging from UV radiation to infrared radiation).

[0122] The photoreactor assembly may further comprise an (outer) assembly wall. The assembly wall may comprise a closed wall, especially enclosing or be part of the lighting assembly. The assembly wall may further enclose or be part of the gas chamber. In embodiments, the assembly wall comprises at least part of the bottom part. In further embodiments, the assembly wall may comprise the thermal conductor. The assembly wall may in further embodiments comprise the window element. In yet further embodiments, the assembly wall may (also) comprise the reactor receiving element.

[0123] In a further aspect, the invention also provides a method for treating a fluid with light source radiation. The method especially comprises providing the fluid to be treated with the light source radiation in the photochemical reactor arrangement of the photoreactor assembly described herein; and irradiating the fluid with the light source radiation while providing the flow of gas in the optical chamber via at least one of the n slit-like openings.

[0124] Providing the fluid in the photochemical reactor arrangement may especially comprise providing the fluid in the reactor chamber of the reactor.

[0125] In further specific embodiments, the method further comprises providing the cooling medium to the fluid channel.

[0126] The term “controlling” and similar terms especially refer at least to determining the behavior or supervising the running of an element. Hence, herein “controlling” and similar terms may e.g. refer to imposing behavior to the element (determining the behavior or supervising the running of an element), etc., such as e.g. 2024PF80354

[0127] 25 measuring, displaying, actuating, opening, shifting, changing temperature, etc.. Beyond that, the term “controlling” and similar terms may additionally include monitoring. Hence, the term “controlling” and similar terms may include imposing behavior on an element and also imposing behavior on an element and monitoring the element. The controlling of the element can be done with a control system, which may also be indicated as “controller”. The control system and the element may thus at least temporarily, or permanently, functionally be coupled. The element may comprise the control system. In embodiments, the control system and element may not be physically coupled. Control can be done via wired and / or wireless control. The term “control system” may also refer to a plurality of different control systems, which especially are functionally coupled, and of which e.g. one control system may be a master control system and one or more others may be slave control systems. A control system may comprise or may be functionally coupled to a user interface.

[0128] The system, or apparatus, or device may execute an action in a “mode” or “operation mode” or “mode of operation” or “operational mode”. The term “operational mode may also be indicated as “controlling mode”. Likewise, in a method an action or stage, or step may be executed in a “mode” or “operation mode” or “mode of operation” or “operational mode”. This does not exclude that the system, or apparatus, or device may also be adapted for providing another controlling mode, or a plurality of other controlling modes. Likewise, this may not exclude that before executing the mode and / or after executing the mode one or more other modes may be executed.

[0129] However, in embodiments a control system may be available, that is adapted to provide at least the controlling mode. Would other modes be available, the choice of such modes may especially be executed via a user interface, though other options, like executing a mode in dependence of a sensor signal or a (time) scheme, may also be possible. The operation mode may in embodiments also refer to a system, or apparatus, or device, that can only operate in a single operation mode (i.e. “on”, without further tunability).

[0130] Hence, in embodiments, the control system may control in dependence of one or more of an input signal of a user interface, a sensor signal (of a sensor), and a timer. The term “timer” may refer to a clock and / or a predetermined time scheme.

[0131] BRIEF DESCRIPTION OF THE DRAWINGS

[0132] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which 2024PF80354

[0133] 26

[0134] Fig. 1 schematically depicts an embodiment of the photoreactor assembly and Figs. 2 to 3 schematically depict some further aspects of the photoreactor assembly and / or the lighting assembly.

[0135] The schematic drawings are not necessarily to scale.

[0136] DETAILED DESCRIPTION OF THE EMBODIMENTS

[0137] Fig. 1 schematically depicts an embodiment of the photoreactor assembly 2000 of the invention. Fig. 1 also depicts an embodiment of the lighting assembly 1000 (comprised by the photoreactor assembly 2000). Moreover, Fig. 1 may further be used to explain embodiments of the method of the invention. The (embodiment of the) photoreactor assembly 2000 comprises the lighting assembly 1000, a photochemical reactor arrangement 400, and a gas flow arrangement 500. The lighting assembly 1000 comprises an optical chamber 200 and a light source arrangement 100 and is (at least partly) defined by the window element 1250, the chamber wall 210 and the bottom part 1100. The light source arrangement 100 comprises a support 120 and an array 110 of solid state light sources 10.

[0138] The figure further depicts the bottom part 1100. The bottom part 1100 comprises the support 120. The largest height of the optical chamber 200 is depicted with reference He and is defined perpendicular to the window element 1250 between the bottom part 1100 (here the support 120) and the window element 1250. It is further schematically depicted with some rays or beams of light source radiation 11 (generated by the solid state light sources 10) that that the chamber wall 210 is reflective for light source radiation 11 and that the window element 1250 is transmissive for light source radiation 11. This further depicts that the photochemical reactor arrangement 400 is configured in a radiation-receiving relationship with the solid state light sources 10 via the window element 1250. Herein, the window element 1250 may also be indicated as radiation transmissive window element 1250.

[0139] In the embodiment, the solid state light sources 10 are configured in the optical chamber 200, extending from the support 120. The figure further depicts at least two slit-like openings 215 in the chamber wall 210 (at the right hand side and left hand side). The slit-like opening 215 at the right hand side is configured at a non-zero minimal distance Di from the bottom part 1100. The slit-like opening 215 at the left had side is configured at a “zero distance” from the bottom part 1100, see also Fig. 2 depicting a similar slit-like opening 215 at the right hand side. Moreover, the slit-like openings 215 may comprise a slit perimeter 216 (see Fig. 2). The slit-like opening 215 at the left hand side is an embodiment of a slit-like opening 215 wherein a segment 217 of the slit perimeter 216 of at least one of the n 2024PF80354

[0140] 27 slit-like openings 215 is defined by the bottom part 1100, see for instance Fig. 2, more clearly depicting such embodiment (also at the left hand side).

[0141] Each slit-like opening 215 may have a slit height Hs, especially individually, selected from a range of at maximum 0.2* He. The figure further depicts an embodiment wherein the solid state light sources 10 and the two slit-like openings 215 are configured such that a virtual line parallel to the window element 1250 and through a solid state light source 10 intersects at least both slit-like openings 215.

[0142] Further, the gas flow arrangement 500 and the lighting assembly 1000 are configured such that, in an operational mode of the photoreactor assembly 2000, a gas flow may be provided along one or more of the solid state light sources 10. A gas flow may be provided along the solid state light sources 10 by providing a flow of gas 510 in the optical chamber 200 via at least one of the n slit-like openings 215 (in Fig. 1 the slit-like opening 215 at the left hand side) with the gas flow arrangement 500.

[0143] In the embodiment of Fig. 1, the support 120 comprises a printed circuit board 121 and the solid state light sources 10 comprise LEDs 12. The LEDs 12 comprise a light transmissive top section 13 extending from an LED substrate 14 that is functionally coupled to the printed circuit board 121. Since especially the top sections 13 may become heated during operation, the LEDs 12 and the slit-like openings 215 may be configured such that a virtual line parallel to the window element 1250 and through a top section 13 of an LED 12 intersects at least one of the n slit-like openings 215. The light transmissive top sections 13 may in embodiments comprise light transmissive domes 17 as is depicted in the figures. Yet alternatively the top sections 13 may comprise other dimensions.

[0144] It is further schematically depicted that the light transmissive top sections 13 have maximum top section height Ha. The top section height Ha is especially defined as a largest distance between the top section 13 and the support 120 (measured) perpendicular to the support 120. It is noted that in the embodiments all LEDs 12 are identical. Yet, in other embodiments, top section height of different LEDs 12 may be different. Ha especially refers to a maximum value of the top section heights of all LEDs 12. For this maximum top section height Ha, it may be advantageous to select this value from the range of 0.5*Ha - 2*Ha.

[0145] In Fig. 1, further the pitch P and the characteristic size Dss, of the solid state light sources 10, and the center C of the support 120 is indicated. The pitch P may be defined as a distance between tops or centers of the top section 13 of two neighboring solid state light sources 10. The characteristic size Dss, may e.g. refer to a (largest) diameter of the top section 13 (closest to the substrate 14). Furthermore, in Fig. 1 the distance between the chamber wall 2024PF80354

[0146] 28

[0147] 200 and one or more peripherally configured solid state light sources 10 configured closest to the chamber wall 200 is depicted with reference Dw. In embodiments Dw is in the range 0 4*p - 0.6*P. Especially this way, the chamber wall 210 may function as an infinity mirror.

[0148] The lighting assembly 1000 In Fig. 1 further depicts the thermal conductor 2105. The thermal conductor 2105 supports part of the support 120. The thermal conductor 2105 is comprised by the (outer) assembly wall 2100 of the photoreactor assembly 2000 in the embodiments. Furthermore, also the window element 1250 and some elements bridging the window element 1250 to the bottom part 1100 are comprised by the assembly wall 2100. In the embodiment, the bottom part 1100 comprises the thermal conductor 2105.

[0149] The support 120 comprises the central segment 128 (see also Fig. 3) and the peripheral part 126 at least partially enclosing the central segment 128 (indicated at the left hand side and right hand side in Fig. 1). At the left hand side and at the right hand side it may be observed that the peripheral part 126 is not in direct (thermal) contact with the thermal conductor 2105. Especially, based on the depicted (thermal) gap 1150 below the peripheral part 126 between the support 120 and the thermal conductor 2105 there is no direct thermal contact between the peripheral part 126 and the thermal conductor 2105. The height of the gap may e.g., be at least 0.05 mm, such as at least 0.1 mm (and e.g. up to about 10 mm, such as up to about 5 mm). The gap 1150 may be filled with air and may especially prevent a direct heat transport from the peripheral part 126 of the support 120 to the thermal conductor 2105 via the gap 1150. The peripheral part 126 may be in thermal contact with the thermal conductor 2105 via the central segment 128. In further embodiments, also part of the support 120 comprising one or two outermost solid state light sources 10 may not be in direct contact with the thermal conductor 2105 as is schematically indicated with dotted lines indicating the gap 1150 being extended to under the two outer most solid state light sources 10 at the left hand side (indicated with reference 1150').

[0150] The thermal conductor 2105 may in specific embodiments be further forced cooled. In embodiments forced cooling may take place, for instance using a fan to cool optional fins or extensions at an external side of the thermal conductor (not depicted). Additionally, or alternatively, the thermal conductor 2105 may be forced cooled by flowing a cooling medium through or along the thermal conductor 2105. The depicted embodiment, for instance, comprises a fluid channel 1110 configured in the thermal conductor 2105. The fluid channel 1100 is arranged at (under) locations of the light source arrangement 100. The fluid channel 1110 is especially configured for flowing a cooling medium through the channel 1110. 2024PF80354

[0151] 29

[0152] Fig. 1 may thus depict an embodiment of the lighting assembly 1000 wherein the central segment 128 comprises a main central segment part 125 and a peripheral central segment 127, enclosing the central segment part 125 (see also Fig. 3), wherein the peripheral central segment 127 has a peripheral central segment width W2, defined as shortest distance between the peripheral part 126 and the main central segment part 125, wherein the peripheral central segment width W2 is selected from the range of 0*P - 3*P, wherein (at least part of) the peripheral central segment 127 is not in thermal contact with the thermal conductor 2105 (or only in thermal contact with the thermal conductor 2105 via the central segment part 125. In the depicted embodiment in Fig. 1, W2 is about 2*P.

[0153] It is noted that based on modeling of the lighting assembly 1000 (providing a thermal power of about 450 W) it is observed that when comparing a lighting assembly 1000 having a printed circuit board 121 directly connected to a thermal conductor 2105 and flowing a cooling medium through fluid channel 1100 , a temperature difference AT between LEDs 12 at the central part 125 and LEDs 12 at the peripheral segment 127, may meaningfully be reduced if the fluid channel 1110 is only configured at cross-sectional segment 128 (resulting in AT of about 5.3 °C) compared to having the fluid channel arranged under the entire printed circuit board 121 (resulting in AT of about 11.4 °C). A further reduction in AT was (theoretically) observed by configuring the peripheral central segment 127 not in direct thermal contact with the thermal conductor 2105 (by configuring the gap 1150 in the bottom part 1100) (resulting in AT of about 3.2 °C). Not forced cooling peripheral parts of the printed circuit board 121 may facilitate a heat flow directly from the more central LEDs 12 to the thermal conductor 1205 which may result in a more even temperature distribution over the array of LEDs 12.

[0154] The photochemical reactor arrangement 400 may in embodiments comprise a reactor receiving element 410, optionally comprising one or more reactors and / or reactor chamber 455 for hosting a reactor fluid 20 as is indicated in Fig. 1. The reactor receiving element 410 may in embodiments for instance comprise a multi -well plate 450. It is noted that many different configurations of the reactor arrangement 400 may be part of the invention. Fig. 1 for instance depicts an embodiment of the photoreactor assembly 2000 comprising a photochemical reactor arrangement 400 comprising the multi-well plate 450 with a plurality of reactor chambers 455. The reaction chambers 455 are configured in a radiation-receiving relationship with the optical chamber 200 via the window element 1250 (as is indicated by the arrow at the left hand side depicting light source light 11 entering the reactor chamber 455). The embodiment further comprises the gas flow arrangement 500 2024PF80354

[0155] 30 comprising a gas transport device 540 configured to provide the flow of gas 510 in the optical chamber 200 via at least one of the n slit-like openings 215 (see slit-like opening 215 at the left hand side).

[0156] Further, the gas flow arrangement 500 of the embodiment comprises a gas chamber 520 configured in fluid communication with the optical chamber 200 via at least the slit-like opening 215 at the left hand side. The gas chamber 520 may be configured in the gas flow arrangement 500 to evenly provide the flow of gas 510 (received via the gas transport device 540) in the optical chamber 200 via at least the depicted slit-like openings 215 at the left hand side. It is noted that a comparable chamber 521 (also comprised by the gas flow arrangement 500) is depicted at the right hand side. This chamber 521 may function as a gas outlet chamber and may in embodiments be configured like the gas chamber 520.

[0157] Fig. 1 further may further depict an embodiment of the photoreactor assembly 2000 comprising the lighting assembly 1000, wherein the slit heights Hsare selected from the range of 0.5*Hd -2*Ha; wherein the photochemical reactor arrangement 400 comprises a multi-well plate 450 comprising a plurality of reactor chambers 455 configured in a radiation-receiving relationship with the optical chamber 200 via the window element 1250; and wherein the gas flow arrangement 500 comprises a gas transport device 540 configured to provide the flow of gas 510 in the optical chamber 200 via at least one of the n slit-like openings 215.

[0158] In Fig. 2 some further aspects of the photoreactor assembly 2000 are depicted. For clarity reasons only some elements are depicted in an exploded view, wherein the window element 1250 is very schematically depicted and lifted from the chamber wall 210. The embodiment depicts two slit-like openings 215 wherein a segment 217 of the slit perimeter 216 is defined by the bottom part 1000 (at the back side of the lighting assembly 1000, and at the left hand side of the lighting assembly 1000).

[0159] In the embodiment, the array 110 (of solid state light sources 10) comprises i rows * j columns of solid state light sources 10. The peripherally located solid state light sources 10 may define a central cross-sectional segment 128 (see also Fig. 3) of the support 120 having a smallest cross-sectional area enclosing all solid state light sources 10 (see also Fig. 3) The central cross-sectional segment 128 has a segment width W, defined by the i rows, and a segment length L, defined by the j columns. The chamber wall 210 comprises four wall elements 210a, 210b, 210c, 21 Od that together define the chamber wall 210. The four wall elements 210a, 210b, 210c, 21 Od are especially connected to each other (thereby defining the complete chamber wall 210). The four wall elements 210a, 210b, 210c, 21 Od are 2024PF80354

[0160] 31 configured in a rectangular configuration. Two of the four wall elements 210a, 210b, 210c, 210d (in the figure, wall elements 210b and 210d) are configured parallel to the i rows and the other two (with reference numerals 210a and 210c) of the four wall elements 210a, 210b, 210c, 210d are configured parallel to the j columns. Two wall elements selected from the four wall elements 210a, 210b, 210c, 21 Od configured parallel to each other may herein also be indicated as a set of two wall elements.

[0161] In embodiments, at least two of the wall elements 210a, 210b, 210c, 21 Od each comprises one of the slit-like openings 215. In the depicted embodiment the slit-like openings 215 are depicted in the three wall elements indicated with reference numerals 210a, 210b, and 210c. The depicted slit-like openings 215 are all elongated slit-like opening 218 having a slit height Hs» the slit length Ls. Elongated slit-like openings 218 parallel to the i rows may especially have a length Ls of the elongated slit-like opening 218 selected in the range of 0.95 *L - 1.05*L. Likewise, elongated slit-like openings 218 configured parallel to the j rows of solid state light source 10 may have a length Ls of the elongated slit-like opening 218 selected in the range of 0.95*W - 1.05*W.

[0162] It is noted that the elongated slit-slit like openings 218 are configured as straight elongated slit-slit like openings 218. In alternative embodiments, the elongated slitslit like openings 218 may have another configuration, such as a wavy configuration. It is further noted, that in further embodiments, the chamber wall 210, especially one or more of the wall elements 210a, 210b, 210c, 21 Od may comprise at least two slit-like openings 215, especially configured parallel to the support 120.

[0163] In specific embodiments, each wall element 210a, 210b, 210c, 21 Od of a set of two wall elements may comprise one elongated slit-like opening 218 (see e.g., Fig. 1). In such embodiment the gas flow arrangement 500 may be configured to provide the gas 510 in the optical chamber 200 via one of the elongated slit-like openings 218 and to remove the gas 510 from the optical chamber 200 via the other one of the elongated slit-like openings 218 to provide the flow of gas 510 in the optical chamber 200.

[0164] Fig. 2 further depicts that the gas chamber 520 comprises a number of gas inlet openings 530 (only two are visible) for receiving the gas 510 from the gas transport device 540. This way, the gas 510 may be evenly distributed in the gas chamber 520, wherein the gas 510 may be evenly proved in the optical chamber 200 via the at least one of the n slit-like openings 215 configured directly downstream of the gas inlet openings 530.

[0165] The photoreactor assembly 2000 may be used for treating a fluid 20 with light source radiation 11 according to the method of the invention. In the method the fluid 20 to be 2024PF80354

[0166] 32 treated is provided in the photochemical reactor arrangement 400 of the photoreactor assembly 2000. Next, the fluid 20 may be irradiated with the light source radiation 11 while providing the flow of gas 510 in the optical chamber 200 via at least one of the n slit-like openings 215.

[0167] Fig. 3 schematically depicts the configuration of the array 110 of solid state light sources 10. The figure depicts the edge of the support 120 indicated with reference numeral 129, the central cross-sectional segment 128, and the peripheral part 126 enclosing the central segment 128. The central cross-sectional segment 128 is the smallest cross- sectional area enclosing (projections of) all solid state light sources 10. The figure further depicts the main central segment part 125 and a peripheral central segment 127 enclosing the central segment part 125. Then central segment part 125 may especially comprise solid state light sources 10 that during use may have approximately a same temperature. In the depicted embodiment central segment part 125 comprises twelve solid state light sources 10. In further embodiments central segment part 125 may comprise at least 150, such as for instance 100 solid state light sources. It is note that central segment part 125 especially comprises at least 1 solid state light source 10. The width of the peripheral central segment 127 is indicated with W2 and is defined as shortest distance between the peripheral part 126 and the main central segment part 125. As is schematically depicted, the peripheral central segment width W2 may have different sizes at different locations, especially at different sides of the support 120.

[0168] The term “plurality” refers to two or more. The terms “substantially” or “essentially” herein, and similar terms, will be understood by the person skilled in the art. The terms “substantially” or “essentially” may also include embodiments with “entirely”, “completely”, “all”, etc. Hence, in embodiments the adjective substantially or essentially may also be removed. Where applicable, the term “substantially” or the term “essentially” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%. The term “comprise” also includes embodiments wherein the term “comprises” means “consists of’. Use of the verb "to comprise" and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise”, “comprising”, and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to”. The article "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The term “and / or” especially 2024PF80354

[0169] 33 relates to one or more of the items mentioned before and after “and / or”. For instance, a phrase “item 1 and / or item 2” and similar phrases may relate to one or more of item 1 and item 2. The term "comprising" may in an embodiment refer to "consisting of but may in another embodiment also refer to "containing at least the defined species and optionally one or more other species".

[0170] Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

[0171] The devices, apparatus, or systems may herein amongst others be described during operation. As will be clear to the person skilled in the art, the invention is not limited to methods of operation, or devices, apparatus, or systems in operation.

[0172] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

[0173] The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim, or an apparatus claim, or a system claim, enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. In yet a further aspect, the invention (thus) provides a software product, which, when running on a computer is capable of bringing about (one or more embodiments of) the method as described herein.

[0174] The invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process. Yet further, the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.

[0175] The invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and / or shown in the attached drawings. The invention further pertains to a method or process comprising one or 2024PF80354

[0176] 34 more of the characterizing features described in the description and / or shown in the attached drawings.

[0177] The various aspects discussed in this patent can be combined in order to provide additional advantages. Further, the person skilled in the art will understand that embodiments can be combined, and that also more than two embodiments can be combined. Furthermore, some of the features can form the basis for one or more divisional applications.

Claims

2024PF8035435CLAIMS:

1. A lighting assembly (1000) for application in a photoreactor assembly, comprising an optical chamber (200) and a light source arrangement (100); wherein: the light source arrangement (100) comprises a support (120) and an array (110) of solid state light sources (10) extending from the support (120), wherein the solid state light sources (10) are configured to generate light source radiation (11); the solid state light sources (10) are at least partly configured in the optical chamber (200); wherein the optical chamber (200) is at least partly defined by (i) a window element (1250) transmissive for light source radiation (11), (ii) a chamber wall (210) reflective for light source radiation (11), and (iii) a bottom part (1100) comprising the support (120); wherein the optical chamber (200) has a largest height He, between the bottom part (1100) and the window element (1250), and defined perpendicular to the window element (1250); the chamber wall (210) comprises n slit-like openings (215), wherein n>l; wherein each slit-like opening (215) has a slit height Hs selected from a range of at maximum 0.2* He; wherein the solid state light sources (10) and the n slit-like openings (215) are configured such that a virtual line parallel to the window element (1250) and through a solid state light source (10) intersects at least one of the n slit-like openings (215).

2. The lighting assembly (1000) according to claim 1, wherein the solid state light sources (10) comprise LEDs (12); wherein each LED (12) comprises a light transmissive top section (13); wherein the LEDs (12) and the n slit-like openings (215) are configured such that a virtual line parallel to the window (1250) and through a top section (13) of an LED (12) intersects at least one of the n slit-like openings (215).

3. The lighting assembly (1000) according to claim 2, wherein the light transmissive top sections (13) have maximum top section heights Ha; and wherein the slit heights Hsare selected from the range of 0.5*Ha - 2*Ha.2024PF80354364. The lighting assembly (1000) according to any one of the preceding claims 1- 3, wherein each of the n slit-like openings (215) comprise a slit perimeter (216); wherein a segment (217) of the slit perimeter (216) of at least one of the n slit-like openings (215) is defined by the bottom part (1100).

5. The lighting assembly (1000) according to any one of the preceding claims 1- 3, wherein at least one of the n slit-like openings (215) is configured at a non-zero minimal distance (Di) from the bottom part (1100).

6. The lighting assembly (1000) according to any one of the preceding claims, wherein the array (110) comprises i rows * j columns of solid state light sources (10), wherein i>5 and j>5; wherein peripherally located solid state light sources (10) define a central cross-sectional segment (128) of the support (120) having a smallest cross-sectional area enclosing all solid state light sources (10) and having a segment width W, defined by the i rows, and a segment length L, defined by the j columns; wherein the chamber wall (210) comprises four wall elements (210a, 210b, 210c, 210d), together defining the chamber wall (210), wherein two of the four wall elements (210a, 210b, 210c, 210d) are configured parallel to the i rows and another two of the four wall elements (210a, 210b, 210c, 210d) are configured parallel to the j columns; wherein n>2; wherein at least two of the wall elements (210a, 210b, 210c, 210d) each comprises one of the slit-like openings (215) comprising an elongated slit-like opening (218); and wherein one or more of the following applies: (i) a length Ls of the elongated slit-like opening (218) parallel to the i rows is selected in the range of 0.95*L - 1.05*L and (ii) a length Ls of the elongated slit-like opening (218) parallel to the j rows of solid state light source (10) is selected in the range of 0.95*W - 1.05*W.

7. The lighting assembly (1000) according to any one of the preceding claims, further comprising a thermal conductor (2105) supporting at least part of the support (120); wherein the support (120) comprises (a) the central segment (128), as defined in claim 6, and (b) a peripheral part (126), at least partially enclosing the central segment (128); wherein at least part of the peripheral part (126) is not in thermal contact with the thermal conductor (2105) or only in thermal contact with the thermal conductor (2105) via the central segment (128).2024PF80354378. The lighting assembly (1000) according to claim 7, wherein the solid state light sources (10) have a pitch (P), wherein the central segment (128) comprises a main central segment part (125) and a peripheral central segment (127), enclosing the central segment part (125); wherein the peripheral central segment (127) has a peripheral central segment width W2, defined as shortest distance between the peripheral part (126) and the main central segment part (125), wherein the peripheral central segment width W2 is selected from the range of 0*P - 3*P, and wherein also at least part of the peripheral central segment (127) is not in thermal contact with the thermal conductor (2105) or only in thermal contact with the thermal conductor (2105) via the central segment part (125).

9. The lighting assembly (1000) according to any one of the preceding claims, wherein the solid state light sources have a pitch P as defined in claim 8, wherein a distance Dw between the chamber wall (200) and one or more peripherally configured solid state light sources (10) configured closest to the chamber wall (200) is selected from the range 0.4*P - 0.6*P.

10. A photoreactor assembly (2000) comprising the lighting assembly (1000) according to any one of the preceding claims, a photochemical reactor arrangement (400), and gas flow arrangement (500); wherein: the gas flow arrangement (500) and the lighting assembly (1000) are configured such that, in an operational mode of the photoreactor assembly (2000), a gas flow is provided along one or more of the solid state light sources (10) by providing, with the gas flow arrangement (500), a flow of gas (510) in the optical chamber (200) via at least one of the n slit-like openings (215); and the photochemical reactor arrangement (400) is configured in a radiationreceiving relationship with the solid state light sources (10) via the window element (1250).

11. The photoreactor assembly (2000) according to claim 10, wherein the n slitlike openings (215) comprise n elongated slit-like openings (218), wherein n= 2, wherein each of a set of two wall elements (210a, 210b, 210c, 210d) selected from the four wall elements (210a, 210b, 210c, 210d) configured parallel to each other, comprise one of the n elongated slit-like opening (218); wherein the gas flow arrangement (500) is configured to provide the gas (510) in the optical chamber (200) via one of the n elongated slit-like openings (218) and remove the gas (510) from the optical chamber (200) via another one of2024PF8035438 the n elongated slit-like openings (218), thereby providing the flow of gas (510) in the optical chamber (200).

12. The photoreactor assembly (200) according to any one of the claims 10-11, comprising the lighting assembly according to claim 3, wherein the slit heights Hsare selected from the range of 0.5*Ha -2*Ha; wherein the photochemical reactor arrangement (400) comprises a multi-well plate (450) comprising a plurality of reactor chambers (455) configured in a radiation-receiving relationship with the optical chamber (200) via the window element (1250); and wherein the gas flow arrangement (500) comprises a gas transport device (540) configured to provide the flow of gas (510) in the optical chamber (200) via at least one of the n slit-like openings (215).

13. The photoreactor assembly (200) according to any one of the claims 10-12, wherein the gas flow arrangement (500) comprises a gas chamber (520), wherein the gas chamber (520) is configured in fluid communication with the optical chamber (200) via at least one of the n slit-like openings (215); wherein the gas chamber (520) is configured for receiving gas (510) via the gas transport device (540), as defined in claim 12, and to evenly provide the flow of gas (510) in the optical chamber (200) via at least one of the n slit-like openings (215).

14. The photoreactor assembly (200) according to claim 13, wherein the gas chamber (520) comprises gas inlet openings (530) for receiving the gas (510) from the gas transport device (540); wherein at least one of the n slit-like openings (215) is configured directly downstream of at least two gas inlet openings (530).

15. A method for treating a fluid (20) with light source radiation (11), comprising providing the fluid (20) to be treated with the light source radiation (11) in the photochemical reactor arrangement (400) of the photoreactor assembly (2000) according to any one of the claims 11-14; and irradiating the fluid (20) with the light source radiation (11) while providing the flow of gas (510) in the optical chamber (200) via at least one of the n slit-like openings (215).

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