Chemical mechanical polishing tool vapor dryer tank and diffuser plate for use therein

Abstract

In one embodiment, a diffuser for semiconductor manufacturing is provided. The diffuser includes a body defining an internal cavity, a diffusion surface of the body, a plurality of diffusion apertures, a back surface opposite the diffusion surface, and a baffle. The plurality of diffusion apertures are disposed through the diffusion surface and in fluid communication with the internal cavity. The baffle is disposed between the diffusion surface and the back surface. The baffle partially defines a plenum within the internal cavity. The plenum includes a plurality of baffle apertures disposed through a portion of the baffle.

Description

PATENTAttorney Docket No.: 44024960W001CHEMICAL MECHANICAL POLISHING TOOL VAPOR DRYER TANK AND DIFFUSER PLATE FOR USE THEREINBACKGROUNDField

[0001] The present disclosure relates to chemical mechanical polishing (CMP) of a substrate, such as a semiconductor substrate, and more specifically to drying the substrate during the CMP process.Description of the Related Art

[0002] An integrated circuit is typically formed on a substrate by the sequential deposition of conductive, semi conductive, and / or insulative layers on a semiconductor substrate. A variety of fabrication processes require planarization of a layer on the substrate. For example, one fabrication step involves depositing a filler layer over a non-planar surface and planarizing the filler layer. For certain applications, the filler layer is planarized until the top surface of a patterned layer is exposed. For example, a metal layer can be deposited on a patterned insulative layer to fill trenches and holes in the insulative layer. After planarization, the remaining portions of the metal in the trenches and holes of the patterned layer form vias, plugs, and lines to provide conductive paths between integrated circuits (ICs) on the substrate. As another example, a dielectric layer can be deposited over a patterned conductive layer, and then planarized to enable subsequent photolithographic steps.

[0003] Chemical mechanical polishing (CMP) is one accepted method of planarization. This planarization method typically requires that the substrate be mounted on a carrier head. The exposed surface of the substrate, the surface with the layer deposition, is typically placed against a rotating polishing pad. The carrier head provides a controllable load on the substrate to urge it against the polishing pad. A polishing slurry with abrasive particles is typically supplied to the surface of the polishing pad and spreads in between the substrate and the polishing pad. The polishing pad and the carrier head each rotate at a constant rotational speed and the abrasive slurry removes material from one or more of the layers.PATENTAttorney Docket No.: 44024960W001

[0004] After removal the substrate is cleaned and dried. During the cleaning process a substrate is placed in a bath before it is dried and placed back into the production process. The bath may contain particulates or contaminates from a previous substrate that can become stuck to a subsequent substrate, damaging the end device. Therefore, there is a need in the art to reduce contaminants during a cleaning process of a CMP process.SUMMARY

[0005] In one embodiment, a diffuser for semiconductor manufacturing is provided. The diffuser includes a body defining an internal cavity, a diffusion surface of the body, a plurality of diffusion apertures, a back surface opposite the diffusion surface, and a baffle. The plurality of diffusion apertures are disposed through the diffusion surface and in fluid communication with the internal cavity. The baffle is disposed between the diffusion surface and the back surface. The baffle partially defines a plenum within the internal cavity. The plenum includes a plurality of baffle apertures disposed through a portion of the baffle.

[0006] In another embodiment, a drying unit for semiconductor manufacturing is provided. The drying unit includes a tank and a diffuser. The tank includes a body, an inner surface of the body that defines a cavity, and a port coupled to the body. The port is configured to provide liquid into the cavity. The diffuser is disposed on a lower surface of the cavity and over the port. The diffuser includes a diffusion surface and a plurality of diffusion apertures disposed through the diffusion surface.

[0007] In another embodiment, a drying unit for semiconductor manufacturing is provided. The drying unit includes a tank and a diffuser. The tank includes a body, an inner surface of the body that defines a cavity, and a port coupled to the body. The port is configured to provide liquid into the cavity. The diffuser is disposed on a lower surface of the cavity and over the port. The diffuser includes a diffuser body, a baffle within the diffuser body, a diffusion surface of the diffuser body, and a plurality of diffusion apertures disposed through the diffusion surface.PATENTAttorney Docket No.: 44024960W001BRIEF DESCRIPTION OF THE DRAWINGS

[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

[0009] Figure 1 depicts a schematic top view of an exemplary chemical mechanical polishing (CMP) system according to one or more embodiments described herein.

[0010] Figure 2 is a schematic view of a drying unit according to one or more embodiments described herein.

[0011] Figure 3 is an isometric view of a tank of a drying unit according to one or more embodiments described herein.

[0012] Figure 4 is an isometric view of a diffuser of a tank according to one or more embodiments described herein.

[0013] Figure 5 is a cross sectional view of a diffuser of Figure 4 according to one or more embodiments described herein.

[0014] Figure 6 is a flow map within a tank according to one or more embodiments described herein.

[0015] Figure 7 is an isometric view of a diffuser of a tank according to one or more embodiments described herein.

[0016] Figure 8 is a cross sectional view of a diffuser according to one or more embodiments described herein.

[0017] Figure 9 is a flow map within a tank according to one or more embodiments described herein.PATENTAttorney Docket No.: 44024960W001

[0018] Figure 10 is an isometric view of a diffuser of a tank according to one or more embodiments described herein

[0019] Figure 11 is an isometric view of a diffuser of a tank according to one or more embodiments described herein.

[0020] Figure 12 is a cross sectional view of a diffuser according to one or more embodiments described herein.

[0021] Figure 13 is a flow map within a tank according to one or more embodiments described herein.

[0022] Figure 14 is a cross sectional view of a tank of a drying unit according to one or more embodiments described herein.

[0023] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.DETAILED DESCRIPTION

[0024] An apparatus and methods for enhanced removal of contaminants from a tank are provided and described below. The tank has a diffuser disposed therein that provides a uniform laminar flow of liquid over the substrate when a substrate is placed therein. The liquid is continuously supplied and overflows out of the tank, carrying particulates or contaminates with it. If the flow creates significant swirling within the tank the particulates or contaminates can be prevented from leaving through the overflow.

[0025] Figure 1 is a top plan view illustrating one embodiment of a CMP system 100. The CMP system 100 includes a factory interface module 102, a cleaner 104, a polishing module 106, and a controller 190. A substrate 115, such as a silicon wafer with one or more layers deposited thereon, is processed within the CMP system 100 to polish a front surface of the substrate 115.PATENTAttorney Docket No.: 44024960W001

[0026] A wet robot 108 is provided to transfer the substrates 115 between the factory interface module 102 and the polishing module 106. The wet robot 108 may also be configured to transfer the substrates 115 between the polishing module 106 and the cleaner 104. The factory interface module 102 includes a dry robot 110 which is configured to transfer the substrates 115 between one or more cassettes 114, one or more transfer platforms 116, one or more metrology stations 117, and one or more pre-aligner stations 118 of the factory interface 102. Substrates 115 are loaded into the CMP system 100 via the cassettes 114. In one embodiment depicted in Figure 1 , four substrate storage cassettes 114 are shown. The dry robot 110 within the factory interface 102 has sufficient range of motion to facilitate transfer between the four cassettes 114 and the one or more transfer platforms 116. Optionally, the dry robot 110 may be mounted on a rail or track 112 to position the robot 110 laterally within the factory interface module 102. The dry robot 110 additionally is configured to receive the substrates 115 from the cleaner 104 and return the clean polished substrates to the substrate storage cassettes 114.

[0027] Figure 1 shows the exemplary polishing module 106 that includes a plurality of polishing stations 124 on which the substrates 115 are polished while being retained in a carrier head 130 (e.g., polishing head). Each polishing station 124 includes a conditioning assembly 132, a first fluid delivery arm 135 (e.g., a polishing fluid delivery module), and a second fluid delivery arm 160 (e.g., a hot spot treatment module). While the polishing module 106 is shown having three polishing stations 124, the polishing module 106 may have more than three polishing stations 124. For example, the polishing module 106 may have a two pairs of polishing stations 124, each pair of stations 124 processing a substrate 115 independently of the other pair. The polishing stations 124 are sized to interface with one or more carrier heads 130 to facilitate polishing the substrate 115. The carrier heads 130 are coupled to a carriage (not shown) that is mounted to an overhead track 128 that is shown in phantom in Figure 1. The overhead track 128 allows the carriage to be selectively positioned around the polishing module 106 which facilitates positioning of the carrier heads 130 selectively over the polishing stations 124 and a load cup 122. In the embodiment depicted in Figure 1 , the overhead track 128 has a circular configuration which allows the carriages retaining the carrier heads 130 to bePATENTAttorney Docket No.: 44024960W001 selectively and independently rotated over and / or clear of the load cups 122 and the polishing stations 124. Additionally, the overhead tracks 128 facilitate the carriage sweeping the rotating carrier heads 130 relative to a polishing station 124 during polishing.

[0028] Each polishing station 124 includes a polishing pad 204 having a polishing surface capable of polishing a substrate 115. Each polishing station 124 may include the conditioning assembly 132. In one embodiment, the conditioning assembly 132 may comprise a pad conditioning assembly 140 which dresses the polishing surface of the polishing pad 204 by removing polishing debris and opening the pores of the polishing pad 204 by use of a pad condition disk 133.

[0029] Each polishing station 124 includes a polishing pad 204 having a polishing surface capable of polishing a substrate 115. The polishing pad 204 is supported on a platen which rotates the polishing pad 204 during processing. Different polishing pads 204 may be used at different polishing stations 124 to control the material removal of the substrate 115. As shown, each polishing station 124 further includes a plurality of endpoint sensors 227 and an orientation sensor 250.

[0030] Each polishing station 124 includes a first fluid delivery arm 135. The first fluid delivery arm 135 may comprise a first 134 to deliver a first fluid to the polishing pad 204, such as a slurry. The first fluid disperses over the polishing surface of the polishing pad 204 to facilitate polishing. The first fluid may be one or more fluids to interact with the front surface of the substrate 115 during polishing. The one or more first fluids may be delivered to the first fluid delivery arm 135 by a fluid source 182. The one or more first fluids may be a polishing fluid and / or a relatively high pressure stream of a cleaner fluid, e.g., deionized water. One example of a first fluid can include a polishing fluid that includes, but is not limited to one or more surfactants, one or more chelating agents, one or more oxidizers, one or more corrosion inhibitors, one or more polar solvents, and deionized water. The composition may also further include one or more pH adjusting agents and / or abrasive particles. Abrasive particles which may be used in CMP compositions include, but are not limited to, alumina (AI2O3), silica (SiC>2), titania (TiC ), or ceria (CeC ) particles, or any other abrasives known in the art and used in conventional CMP compositions.PATENTAttorney Docket No.: 44024960W001

[0031] One or more of the polishing stations 124 includes the second fluid delivery arm 160 to treat a hot spot on the front surface of the substrate 115. The second fluid delivery arm 160 may comprise a second arm 162 to selectively deliver a second fluid at a radial position on the polishing surface of the pad 204 that will be rotated underneath (e.g., intersect with) the hot spot on the substrate 115 being polished on the pad 204.

[0032] At least one load cup 122, such as the two load cups 122 shown in Figure 1 , is near the lower right corner of the polishing module 106 between the polishing stations 124 closest to the wet robot 108. The load cups 122 may serve multiple functions, including washing the carrier head 130, receiving the substrate 115 from the wet robot 108, washing the substrate 115, and loading the substrate 115 into the carrier heads.

[0033] The substrate 115 will typically have a reference mark, such as a notch, flat edge, or other type of feature that can be used to identify crystalline orientations of the substrate 115 and note a rotational orientation of a front surface of the substrate 115 relative to a central axis. In certain embodiments, the factory interface module 102 can also include the pre-aligner 118 to position the substrate 115 in a known and desirable rotational orientation. The pre-alignment of the substrate 115 to a desired rotational orientation allows the substrate 115 to be transferred to the load cup 122 having a known rotational orientation. Thus, the carrier head 130 is able to retrieve the substrate 115 at a known rotational orientation relative to the carrier head 130. For example, the pre-aligner 118 may include a reference mark detection system, such as an optical interrupter sensor (not shown), to sense when the reference mark is at a specific angular position.

[0034] In certain embodiments, the substrate 115 is placed in the metrology station 117 by the dry robot 110 prior to placing the substrate 115 on the transfer platform 116. For example, the dry robot 110 may transfer the substrate 115 from the pre-aligner 118 to the metrology station 117. The metrology station 117 is used to measures various aspects of the substrate 115. The metrology station 117 can be used to identify the location of one or more hot spots on the surface of the substrate 115 in relation to the reference mark. The metrology station 117 may use an optical,PATENTAttorney Docket No.: 44024960W001 eddy current, resistive, or other sensors to measure the substrate 115. For example, the metrology station 117 may measure a thickness of the upper layer on the patterned surface of the substrate 115. The controller 190 receives the measurements which may be used to facilitate processing the substrate 115 within the CMP system 100. The dry robot 110 may transfer the substrate 115 to the transfer platform 116 after the substrate 115 is measured in the metrology station 117.

[0035] The wet robot 108 is configured to transfer the substrate 115 from the transfer platform 116 to one of the load cups 122. A rinsed-clean carrier head 130 is moved above the load cup 122 with the unpolished substrate 115. The unpolished substrate 115 is thereafter chucked to the carrier head 130, which then moves to a position above the pad 204 of a polishing station 124 to begin the CMP process.

[0036] The controller 190 controls aspects of the CMP system 100 during a CMP process (e.g., polishing process, polishing operation, polishing). In certain embodiments, the controller 190 is one or more programmable digital computers executing digital control software. The controller 190 can include a CPU (e.g., processor) 191 situated near the polishing apparatus, e.g., a programmable computer, such as a personal computer. The controller can include a memory 192 and support circuits 193. The controller 190 can, for example, coordinate rotation of the polishing pad 204 and the carrier head 130, as well as the position of the carrier head 130 along a sweep path, to perform the desired CMP process and to facilitate monitoring for the endpoint of the CMP process. Additionally, the controller 190 can coordinate the delivery and location of delivery of the second fluid, the rotation of the polishing pad 204 and the carrier head 130, and the position of the position of the carrier head 130 along the sweep path to treat a hot spot and to monitor the hot spot treatment.

[0037] The controller 190 also includes a hot spot encoder 198. The hot spot encoder 198 tracks the location of the hot spot relative to the reference mark of the substrate 115. The hot spot encoder 198 may receive the location of the hot spot relative to the reference mark from the metrology station 117. In some embodiments, the location of the hot spot relative to the reference mark may bePATENTAttorney Docket No.: 44024960W001 obtained by one or more end point sensors (e.g., metrology sensors) disposed in the pad 204. The controller 190 can correlate the location of the hot spot relative to the reference mark with the rotational orientation of the substrate to determine the position of the hot spot with respect to the carrier head 130.

[0038] The controller 190 is able to determine the location of the hot spot on the pad 204 based on the information from the platen encoder 195, the first head encoder 196, the second head encoder 197, and the hot spot encoder 198.

[0039] After polishing, the carrier head 130 moves the polished substrate 115 chucked thereto above a load cup 122 where the polished substrate 115 is thereafter placed into the load cup 122. The wet robot 108 transports the polished substrate 115 from the load cup 122 to a cleaning chamber in the cleaner 104, where slurry residues and other contaminants that have accumulated on the surface of the substrate 115 during polishing are removed. In the embodiment depicted in Figure 1 , the cleaner 104 includes two pre-clean modules 144, two megasonic cleaner modules 146, two brush box modules 148, two spray jet modules 150, and one or more drying units 200. Before the semiconductor process is complete, substrates are often transferred to the megasonic cleaner module 146 and then to the brush box module 148, where they are cleaned by the two spray jet modules 150. Following cleaning, the substrates are transferred to the drying unit 200. The dry robot 110 then removes the substrate 115 from the cleaner 104. In some embodiments, the dry robot 110 transfers the substrate 115 to the metrology station 117 to be measured again. In certain embodiments, the post-polish measurements can be used to adjust the polishing process parameters for a subsequent substrate. Finally, the dry robot 110 returns the substrate 115 to one of the cassettes 114.

[0040] Figure 2 is a schematic view of the drying unit 200 according to at least one embodiment described herein. In these embodiments, the drying unit 200 includes a drying enclosure 202 coupled to the factory interface module 102. Substrates are often stored within a cassette 216 located next to the factory interface module 102. Thereafter, the substrates are transferred to the factory interface module 102 and then to the drying enclosure 202 of the drying unit 200 where materials are deposited on the surfaces of the substrates, formingPATENTAttorney Docket No.: 44024960W001 semiconductor devices. The drying enclosure 202 includes a top portion 203. The drying enclosure 202 is coupled to a tank 300. The drying unit 200 can be a Marangoni dryer. Marangoni dryers are used to create “Marangoni flow” to dry the substrates, helping reduce the negative effects of streaking, spotting, and bath residue forming on the surface of the substrate. While the substrates, such as substrate 115, are drying in the drying unit 200, they are raised out of the tank 300 and into the top portion 203 of the drying enclosure 202, as shown by arrow 214, which will be described in more detail below.

[0041] Air flowing from fans 208 travels through the factory interface module 102 into a drying environment opening 205 as shown by the arrows 210. Embodiments described herein include a sliding door 222. The sliding door 222 has a length 224 and a width 226. In these embodiments, the length 224 is greater than the width 226. The sliding door 222 acts to block the air flow from entering the top portion 203 of the drying enclosure 202 when the sliding door 222 is raised to the closed position, as shown in Figure 2. The closed position of the sliding door 222 is such that the length 224 of the sliding door 222 extends over the entire drying environment opening 205, completely blocking the air from entering the drying enclosure 202.

[0042] The drying unit 200 includes a first dryer opening 228 and a second dryer opening 229. A substrate 115 enters the tank 300 through the first dryer opening 228 and exit the tank 300 through the second dryer opening 229. In these embodiments, the tank 300 includes a liquid 233, such as a bath liquid, which acts to rinse substrates when they enter the tank 300.

[0043] A cradle 231 and a pusher 232 are disposed in the tank 300. The cradle 231 is configured to receive substrates as they enter the tank 300. Thereafter, the cradle 231 transfers substrates to the pusher 232. The pusher 232 is configured to raise the substrates out of the liquid 233 in the tank 300 through the second dryer opening 229 above the surface of the liquid 233 and past two spray bars 235. The spray bars 235 direct a vapor flow, such an isopropyl alcohol (IPA) vapor, onto substrates 115 as they are raised out of the liquid 233. The IPA vapor is introduced to a fluid meniscus which forms as the substrate is lifted from the liquid 233 and thePATENTAttorney Docket No.: 44024960W001 liquid 233 is drained from the substrate 115. The vapor is absorbed along the surface of the liquid 233, with the concentration of the absorbed vapor causing surface tension to be lower at the tip of the meniscus than in the bulk of the liquid 233, causing the liquid 233 to flow from the drying meniscus toward the bulk of the liquid 233. Such a flow is known as “Marangoni flow”, and can be employed to achieve substrate 115 drying with reducing streaks, spotting, or bath residue on the substrate 115.

[0044] The liquid 233 is supplied from a source 237 into the tank 300. As the substrates in rinsed in the tank 300, the liquid 233 overflows out of the tank 300 by a weir 239 and is removed from the drying unit 200.

[0045] Figure 3 is an isometric view of the tank 300 of a drying unit according to one or more embodiments described herein. The drying unit may be the drying unit 200 (Figure 2). The weir 239 (Figure 2) is not shown in Figure 3 for clarity.

[0046] The tank 300 includes a body 301 and a diffuser 303. The body 301 includes an inner surface 305 that defines a cavity 307, and one or more ports 309. In some embodiments, the one or more ports 309 include a first port 311 and a second port 313.

[0047] The one or more ports 309 are coupled to the body 301 . The one or more ports 309 are configured to provide the liquid 233 into the cavity 307.

[0048] The diffuser 303 is disposed on the inner surface 305. The inner surface 305 includes a lower surface 315 of the cavity 307 with the diffuser 303 disposed thereon. The diffuser 303 is disposed on and over the one or more ports 309. The diffuser 303 includes a diffusion surface 317 and a plurality of diffusion apertures 319 disposed through the diffusion surface 317.

[0049] The lower surface 315 includes a first surface 331 , a first angled surface 333, and a second angled surface 335. The first angled surface 333 is disposed closer to an entry surface 337 of the tank 300 than the first surface 331. The entry surface 337 is the surface coupled to the drying enclosure 202 (Figure 2). In some embodiments, the diffuser 303 is coupled to the first angled surface 333. In some embodiments, the one or more ports 309 include a first port 311 and a second portPATENTAttorney Docket No.: 44024960W001313. In some embodiments, the first port 311 is disposed through the first angled surface 333 and the second port 313 is disposed through the second angled surface 335.

[0050] The inner surface 305 includes a first contour 351 extending outward from the first angled surface 333 and a second contour 353 extending outward from the second angled surface 335. The first contour 351 and second contour 353 are disposed closer to the entry surface 337 than the first angled surface 333 and the second angled surface 335.

[0051] The cavity 307 includes a cross section 360. The cross section 360 includes a first width 361 , a second width 363, and a third width 365. The cross section 360 increases from the lower surface 315 towards the entry surface 337 of the tank 300. The first width 361 corresponds to the width of the first surface 331 in the Y direction. The first angled surface 333, and the second angled surface 335 angle toward the entry surface 337 and extend the cross section 360 of the cavity 307 to the second width 363. The first contour 351 and second contour 353 extend the cross section 360 of the cavity 307 to the third width 365. The third width 365 is wider than the diffuser 303.

[0052] Figure 4 is an isometric view of a diffuser 400 according to one or more embodiments described herein. The diffuser 400 can be the diffuser 303 (Figure 3).

[0053] The diffuser 400 includes a diffuser body 401 and a diffusion surface 403. In some embodiment, the body 401 includes a first body 401a and a second body 401b.

[0054] The body 401 includes a central region 421 , a first wing 431 , and a second wing 441. The first wing 431 is coupled to the central region 421. The second wing 441 is coupled to the central region 421 opposite from the first wing 431 in the Y direction.

[0055] The body 401 includes a back surface 405 opposite the diffusion surface 403. The diffusion surface 403 includes a stepped surface 407 and a plurality of diffusion apertures 409. In some embodiments and as shown, the plurality of diffusion apertures 409 are slots disposed on the stepped surface 407. The slotsPATENTAttorney Docket No.: 44024960W001 have a slot length 411 in the X direction. The slot length 411 is about 0.25 millimeters to about 10 millimeters. The slots have a slot width between about 0.25 millimeters to about 5 millimeters. While illustrated as a single slot per step, multiple slots are contemplated. In some embodiments, the slot length 411 varies between each step of the stepped surface 407. While illustrated as slot, the diffusion apertures 409 may be circular holes rectangular holes path ways formed through a porous material, elliptical holes, but other diffusion geometries are contemplated.

[0056] The diffusion surface 403 is disposed on the first wing 431 , the second wing 441 , and the central region 421. In some embodiments, the first body 401a includes the first wing 431 and a portion of the central region 421 and the second body 401b includes the second wing 441 and a portion of the central region 421 not in the first body 401a.

[0057] In some embodiments, the diffuser 400 includes an opening 451. The opening 451 is a hole through the body 401 from the diffusion surface 403 to the back surface 405 to accommodate one or more features of the tank 300 (Figure 3).

[0058] Figure 5 is a cross sectional view of the diffuser 400 according to one or more embodiments described herein. As shown, the body 401 of the diffuser 400 includes the first body 401a. The central region 421 extends away from the first wing 431 a length 535 of about 10 millimeters to about 300 millimeters.

[0059] The diffuser 400 includes a baffle 501 disposed in an internal cavity 503 defined by the body 401a. The internal cavity 503 includes a direction plenum 509 and a distribution plenum 511. The baffle 501 is disposed between the diffusion surface 403 and the back surface 405. The baffle 501 includes a thickness 533 of about 1 millimeter to about 10 millimeters.

[0060] The baffle 501 includes a direction baffle 505 and a distribution baffle 507. The direction baffle 505 of the baffle 501 partially defines the direction plenum 509.

[0061] The distribution baffle 507 of the baffle 501 includes a plurality of baffle apertures 508 disposed through the distribution baffle 507. The baffle apertures 508 include a diameter of about .05 millimeters to about 10 millimeters. The distribution baffle 507 includes about 1 to about 2000 baffle apertures 508. In somePATENTAttorney Docket No.: 44024960W001 embodiments, the plurality of baffle apertures 508 are slots with a width of about 0.25 millimeters to about 10 millimeters. In embodiments where the plurality of baffle apertures 508 are holes, there are about 1 to about 2000 baffle apertures 508. In embodiments where the plurality of baffle apertures 508 are slots there are about 1 to about 200 baffle apertures 508. The distribution baffle 507 partially defines the direction plenum 509. The direction baffle 505 includes a length 531. The length 531 is about 10 millimeters to about 200 millimeters.

[0062] The diffuser 400 further includes a connection 515. The connection 515 is an aperture configured to receive liquid through the back surface 405 from the port 309 (Figure 3). The plurality of diffusion apertures 409 are in fluid communication with the internal cavity 503. The connection 515 is in fluid communication with the plurality of diffusion apertures 409. Fluid travels from the connection 515 through the direction plenum 509, into the distribution plenum 511 , through the plurality of baffle apertures 508 of the distribution baffle 507, and the out of the plurality of diffusion apertures 409. In some embodiments, the baffle 501 does not include the distribution baffle 507 and the fluid travels around the direction baffle 505.

[0063] The baffle 501 is configured to direct a liquid from the port 309 (Figure 3) through the plurality of baffle apertures 508 before leaving the plurality of diffusion apertures 409. The baffle 501 directs liquid from the port 309 (Figure 3), towards the central region 421 before the liquid can pass through the plurality of diffusion apertures 409.

[0064] In some embodiments, the diffusion apertures 409 are directed away from the diffusion surface 403 in a uniform direction. In some embodiments, the diffusion apertures 409 are only disposed through the stepped surface 407.

[0065] The stepped surface 407 includes one or more steps 517. Each step 517 of the stepped surface 407 includes a first step surface 521 and a second step surface 525. In some embodiments, the first step surface 521 is perpendicular to the second step surface 525. In some embodiments, each step 517 of the plurality of steps 517 includes a corresponding diffusion aperture 523 of the plurality of diffusion apertures 409. Each first step surface 521 is disposed farther away from a main surface 551 of the central region 421 than the prior step surface 521 . The firstPATENTAttorney Docket No.: 44024960W001 step surface 521 has a width 539 of about 2 millimeters to about 30 millimeters. The second step surface 525 includes a height 537 of about 2 millimeters to about 30 millimeters. In some embodiments, the height 537 is about equal to the width 539.

[0066] Figure 6 is a flow map within the tank 300 according to one or more embodiments described herein. As shown, the plurality of diffusion apertures 409 of the diffuser 400 are configured to direct the liquid in a uniform direction over the substrate 115. When the liquid passes over the substrate 115 the flow is laminar and carries contaminates out of the tank 300. By having a flow profile in contrast to a pencil jet, the tank purge time and particle residence time is reduced, which reduces the likelihood for a particle to attach to the substrate. When a jet alone is used, dead zones can be created in the tank. As described above, the diffuser 400 enhances ability of the tank to purge a particle contaminant.

[0067] Figure 7 is an isometric view of a diffuser 700 according to one or more embodiments described herein. The diffuser 700 can be the diffuser 303 (Figure 3)

[0068] The diffuser 700 includes a diffuser body 701 and a diffusion surface 703. The body 701 includes a central region 721 , a first wing 731 , and a second wing 741. The first wing 731 is coupled to the central region 721. The second wing 741 is coupled to the central region 721 opposite from the first wing 731 in the Y direction.

[0069] The body 701 includes a back surface 705 opposite the diffusion surface 703. The diffusion surface 703 includes a first wing surface 707 of the first wing 731 , a second wing surface 708 of second wing 741 , and a plurality of diffusion apertures 709. In some embodiments, the plurality of diffusion apertures 709 are configured to direct the liquid in two or more directions as the liquid leaves the diffusion apertures 709. In some embodiments, the plurality of diffusion apertures 709 arranged in a grid along the diffusion surface 703. For example, the plurality of diffusion apertures 709 arranged on the first wing surface 707 provide laminar fluid flow perpendicular to the plane of the first wing surface 707, the plurality of diffusion apertures 709 arranged on the second wing surface 708 provide laminar fluid flow perpendicular to the plane of the second wing surface 708, and the plurality ofPATENTAttorney Docket No.: 44024960W001 diffusion apertures 709 arranged on the central region 721 provide laminar fluid flow perpendicular to the plane of the diffusion surface 703 in the central region 721 .

[0070] The diffusion surface 703 is disposed on the first wing 731 , the second wing 741 , and the central region 721. In some embodiments, the diffuser 700 includes an opening 751 in the first wing 731 , the second wing 741 , and the central region 721. The opening 751 is a hole through the body 701 from the diffusion surface 703 to the back surface 705 to accommodate one or more features of the tank 300 (Figure 3).

[0071] Figure 8 is a cross sectional view of the diffuser 700 according to one or more embodiments described herein. The diffuser 700 includes a baffle 801 disposed in an internal cavity 803 defined by the body 701. The internal cavity 803 includes a direction plenum 809 and a distribution plenum 811. The baffle 801 is disposed between the diffusion surface 703 and the back surface 705. The baffle 801 includes a direction baffle 805 and a distribution baffle 807. The direction baffle 805 of the baffle 801 partially defines the direction plenum 809. The distribution baffle 807 is disposed in a central region 817 of the baffle 801 and includes a plurality of baffle apertures 808 disposed through the distribution baffle 807. The distribution baffle 807 partially defines the direction plenum 809. The central region 817 is disposed between the first wing 731 and the second wing 741 .

[0072] The diffuser 700 further includes one or more connections 815. Each connection 815 is an aperture configured to receive liquid through the back surface 705 from the port 309 (Figure 3). The plurality of diffusion apertures 709 are in fluid communication with the internal cavity 803. The connection 815 is in fluid communication with the plurality of diffusion apertures 709. Fluid travels from the connection 815 through the direction plenum 809, into the distribution plenum 811 , through the plurality of baffle apertures 808 of the distribution baffle 807, and the out of the plurality of diffusion apertures 709.

[0073] The baffle 801 is configured to direct a liquid from the port 309 (Figure 3) through the plurality of baffle apertures 808 before leaving the plurality of diffusion apertures 709. The diffusion apertures 709 include a diameter 819. The diameterPATENTAttorney Docket No.: 44024960W001819 is about 0.5 millimeters to about 10 millimeters. In some embodiments the diameter 819 is not uniform.

[0074] In some embodiments, the diffusion apertures 709 are directed away from the diffusion surface 703 in more than one direction. For example, the diffusion apertures 709 direct liquid from the central region 721 in a main direction 821 , the diffusion apertures 709 direct liquid from the first wing 731 in a first direction 831 , and the diffusion apertures 709 direct liquid from the second wing 741 in a second direction 841 .

[0075] The plurality of diffusion apertures 709 form an open area through the diffusion surface 703, the open area being between about 0.1 % to about 50% of the diffusion surface.

[0076] Figure 9 is a flow map within the tank 300 according to one or more embodiments described herein. As shown, the plurality of diffusion apertures 709 of the diffuser 700 are configured to direct the liquid in multiple directions over the substrate 115. When the liquid passes over the substrate 115 the flow is laminar and carries contaminates out of the tank 300. Further, the multiple directions of fluid flow allow for fluid movement at regions outside of the width of the diffuser 700.

[0077] Figure 10 is an isometric view of the tank 300 of a drying unit according to one or more embodiments described herein. The drying unit may be the drying unit 200 (Figure 2). The weir 239 (Figure 2) is not shown in Figure 10 for clarity.

[0078] The tank 300 includes the body 301 and a diffuser 1003. The diffuser 1003 is a multi-part diffuser with mirrored parts across the cross section 360 of the cavity 307. The diffuser 1003 includes a first body 1021 and a second body 1041 .

[0079] The first body 1021 of the diffuser 1003 is disposed on and over the first port 311 and the second body 1041 is disposed on and over the second port 313. The diffuser 1003 includes a diffusion surface 1017 and a plurality of diffusion apertures 1019 disposed through the diffusion surface 1017. In some embodiments, the plurality of diffusion apertures 1019 are directed towards a portion of the diffusion surface 1017.PATENTAttorney Docket No.: 44024960W001

[0080] In some embodiments, first body 1021 of the diffuser 1003 is coupled to the first angled surface 333 and the second body 1041 is disposed on and over the second angled surface 335. The first body 1021 of the diffuser 1003 is disposed a distance 1005 away from the second body 1041. The distance 1005 is about 5 millimeters to about 100 millimeters. The first body 1021 and the second body 1041 of the diffuser 1003 are described in more detail below.

[0081] Figure 11 is an isometric view of the diffuser 1003 according to one or more embodiments described herein.

[0082] The first body 1021 and the second body 1041 each include the diffusion surface 1017 with the plurality of diffusion apertures 1019. The plurality of diffusion apertures 1019 include a first set of diffusion apertures 1101 and a second set of diffusion apertures 1103.

[0083] The first set of diffusion apertures 1101 are disposed on a stepped surface 1107 of the first body 1021 and the second body 1041. The first set of diffusion apertures 1101 are directed along a first axis 1110. The first set of diffusion apertures 1101 of the first body 1021 are directed towards the first set of diffusion apertures 1101 of second body 1041 .

[0084] The second set of diffusion apertures 1103 are disposed in a first direction 1123 about perpendicular to the first axis 1110. The second set of diffusion apertures 1103 are directed away from the diffusion surface 1017 in a uniform direction.

[0085] The stepped surface 1107 includes one or more steps 1109. Each step 1109 of the stepped surface 1107 includes a first step surface 1113 and a second step surface 1115. The first step surface 1113 is perpendicular to the second step surface 1115. The first set of diffusion apertures 1101 are disposed through the first step surface 1113. The second set of diffusion apertures 1103 are disposed through the second step surface 1115. In some embodiments, each step 1109 of the plurality of steps 1109 includes a corresponding diffusion aperture 1117 of the first set of diffusion apertures 1101.PATENTAttorney Docket No.: 44024960W001

[0086] Figure 12 is a cross sectional view of the diffuser 1003 according to one or more embodiments described herein. The diffuser 1003 includes the first body 1021 and the second body 1041 of the diffuser 1003. Each of the first body 1021 and the second body 1041 include a baffle 1201 disposed in an internal cavity 1203, a connection 1205 disposed through a back surface 1207.

[0087] Each internal cavity 1203 is defined by the respective first body 1021 and the second body 1041. Each internal cavity 1203 includes a turn-around region 1209. The turn-around region 1209 is disposed opposite from the second set of diffusion apertures 1103. In some embodiments, the first set of diffusion apertures 1101 are disposed between the turn-around region 1209 and the second set of diffusion apertures 1103.

[0088] Figure 13 is a flow map within the tank 300 according to one or more embodiments described herein. As shown, the first set of diffusion apertures 1101 are configured to direct the liquid toward the first set of diffusion apertures 1101 of the opposite first and second bodies. The second set of diffusion apertures 1103 direct the liquid perpendicular to the direction of the first set of diffusion apertures 1101. When the liquid passes over the substrate 115, the flow is laminar and carries contaminates out of the tank 300. Further, the fluid flow from the first set of diffusion apertures 1101 reduces swirling in the outer regions and pulls fluid from regions outside of the width of the diffuser 1003 into the center so that the liquid leaves the tank 300.

[0089] Figure 14 is a cross sectional view of a tank 1400 of a drying unit according to one or more embodiments described herein. The drying unit may be the drying unit 200 (Figure 2). The weir 239 (Figure 2) is not shown in Figure 14 for clarity.

[0090] The tank 1400 includes a body 1401 and a diffuser 1403. The body 1401 includes an inner surface 1405 that defines a cavity 1407, and a port 1409. The port 1409 is coupled to the body 1401. In some embodiments, the cavity 1407 of the tank 1400 is rectangular. The port 1409 is configured to provide the liquid 233 (Figure 2) into the cavity 1407.PATENTAttorney Docket No.: 44024960W001

[0091] The diffuser 1403 is disposed on a lower surface 1411 of the inner surface 1405 of the cavity 1407 with the diffuser 1403 disposed thereon. The diffuser 1403 is disposed on and over the port 1409. The diffuser 1403 includes a diffusion surface 1413 and a plurality of diffusion apertures 1415 disposed through the diffusion surface 1413. The cavity 1407 includes a cross section 1417. The cross section 1417 is defined by side walls 1419 of the inner surface 1405. The side walls 1419 are about perpendicular to the lower surface 1411.

[0092] The diffuser 1403 includes a diffuser body 1500, the diffusion surface 1413, and the back surface 1411 opposite the diffusion surface 1413. In some embodiments, the plurality of diffusion apertures 1415 are parallel slots. In some embodiments, the plurality of diffusion apertures 1415 are uniform ports in a rectangular grid.

[0093] The diffuser 1403 further includes a baffle 1501 disposed in an internal cavity 1503 defined by the body 1500. The baffle 1501 is disposed between the diffusion surface 1413 and the back surface 1411.

[0094] The diffuser 1403 further includes a connection 1507. The connection 1507 is an aperture configured to receive liquid through the back surface 1411 from the port 1409. The plurality of diffusion apertures 1415 are in fluid communication with the internal cavity 1503. The connection 1507 is in fluid communication with the plurality of diffusion apertures 1415. Fluid travels from the connection 1507 through a plurality of baffle apertures 1505 of the baffle 1501 , and the out of the plurality of diffusion apertures 1415.

[0095] The baffle 1501 is configured to direct a liquid from the port 1409 through the plurality of baffle apertures 1505 before leaving the plurality of diffusion apertures 1415. The baffle 1501 directs liquid from the port 1409 towards the side walls 1419 before the liquid can pass through the plurality of diffusion apertures 1415. The diffusion apertures 1415 are directed away from the diffusion surface 1413 in a uniform direction perpendicular to the major plane of the diffusion surface 1413.PATENTAttorney Docket No.: 44024960W001

[0096] The baffle apertures 1505 and the plurality of diffusion apertures 1415 are arranged so that as liquid enters the diffuser 1403, the liquid is spread through the internal cavity 1503. As the liquid translates through the internal cavity 1503, the diffusion apertures 1415 direct the liquid into the cavity 1407 of the tank 1400 and form a uniform flow that pushes contaminates out of the tank 1400 but without creating such a turbulent environment that the drying unit cannot prevent streaking on the substrate.

[0097] Benefits of the present disclosure include reduced dead zone, more uniform fluid flows out of the tank, and a reduction in resident particle times. As an example, by ensuring a constant purge, contaminants and particles are less likely to adhere to the substrate and cause defects later in manufacturing.

[0098] It is contemplated that one or more aspects disclosed herein may be combined. As an example, one or more aspects, features, components, operations and / or properties of the tank 300; the diffuser 303; the stepped surface 407; the plurality of diffusion apertures 409; the baffle 501 ; the diffuser 700; the diffuser 1003; the tank 1400; and the diffuser 1403, may be combined.

[0099] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

PATENTAttorney Docket No.: 44024960W001What is claimed is:1 . A diffuser for semiconductor manufacturing comprising: a body defining an internal cavity; a diffusion surface of the body; a plurality of diffusion apertures disposed through the diffusion surface in fluid communication with the internal cavity; a back surface opposite the diffusion surface; and a baffle disposed away from the diffusion surface, the baffle partially defining a plenum within the internal cavity, the plenum comprising a plurality of baffle apertures disposed through a portion of the baffle.

2. The diffuser of claim 1 , wherein the baffle is configured to direct a liquid from a connection through the plurality of baffle apertures before leaving the plurality of diffusion apertures.

3. The diffuser of claim 2 wherein, the plurality of diffusion apertures are configured to direct the liquid in a uniform direction.

4. The diffuser of claim 2 wherein, the plurality of diffusion apertures are configured to direct the liquid in two or more directions as the liquid leaves the diffusion apertures.

5. The diffuser of claim 1 wherein, the diffusion surface comprises a stepped surface and the plurality of diffusion apertures are slots disposed on the stepped surface.

6. The diffuser of claim 1 wherein, the plurality of diffusion apertures are directed towards a portion of the diffusion surface.

7. The diffuser of claim 1 wherein, the plurality of diffusion apertures are directed away from the diffusion surface.PATENTAttorney Docket No.: 44024960W0018. The diffuser of claim 1 wherein, the body is a first body and the diffuser further comprises a second body disposed a distance away from the first body.

9. A drying unit for semiconductor manufacturing comprising: a tank comprising: a body; an inner surface of the body that defines a cavity; and a port coupled to the body, the port configured to provide liquid into the cavity; a diffuser disposed on a lower surface of the cavity and over the port, the diffuser comprising: a diffusion surface; and a plurality of diffusion apertures disposed through the diffusion surface.

10. The drying unit of claim 9, wherein the lower surface comprises: a first surface; and a first angled surface disposed closer to an entry surface of the tank than the first surface, the diffuser coupled to the first angled surface, the port disposed through the first angled surface.11 . The drying unit of claim 9, wherein the diffuser comprises: central region; a first wing coupled to the central region; a second wing coupled to the central region and disposed opposite from the first wing, the diffusion surface disposed on the central region, the first wing, and the second wing; and a baffle disposed between the port and the diffusion surface.

12. The drying unit of claim 9, wherein the diffusion surface comprises a stepped surface comprising a plurality of steps, each step of the plurality of steps comprising a corresponding diffusion aperture of the plurality of diffusion apertures.PATENTAttorney Docket No.: 44024960W00113. The drying unit of claim 9, wherein the plurality of diffusion apertures comprises a diameter of about 1 millimeter to about 10 millimeters, the diffusion apertures arranged in a grid through the diffusion surface.

14. The drying unit of claim 9, wherein the plurality of diffusion apertures form an open area through the diffusion surface, the open area being between about 0.1 % to about 50% of the diffusion surface.

15. The drying unit of claim 9, wherein the cavity includes a cross section that increases from the lower surface towards a top of the tank.

16. A drying unit for semiconductor manufacturing comprising: a tank comprising: a body; an inner surface of the body that defines a cavity; and a port coupled to the body, the port configured to provide liquid into the cavity; a diffuser disposed on a lower surface of the cavity and over the port, the diffuser comprising: a diffuser body; a baffle within the diffuser body; a diffusion surface of the diffuser body; and a plurality of diffusion apertures disposed through the diffusion surface.

17. The drying unit of claim 16, wherein the cavity of the tank is rectangular.

18. The drying unit of claim 16, wherein the baffle directs liquid from the port towards a central region of the diffuser before the liquid can pass through the plurality of diffusion apertures.

19. The drying unit of claim 16, wherein the cavity is wider than the diffuser.PATENTAttorney Docket No.: 44024960W00120. The drying unit of claim 16, wherein the plurality of diffusion apertures comprises: a first set of diffusion apertures disposed in a first direction, the first direction facing other diffusion apertures of the first set of diffusion apertures; and a second set of diffusion apertures about perpendicular to the first direction.

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