High-frequency module

Abstract

The present invention provides a high-frequency module that can be miniaturized. In this high-frequency module (1), first land electrodes (10A, 10B) are provided on a first main surface (2a) of a mounting substrate (2). Second land electrodes (13A, 13B) are provided on a second main surface (2b) of the mounting substrate (2). A first surface-mounted component (3) has first electrodes (32A, 32B). A second surface-mounted component (4) has second electrodes (42A, 42B). The first surface-mounted component (3) is disposed on the first main surface (2a) of the mounting substrate 2. The second surface-mounted component (4) is disposed on the second main surface (2b) of the mounting substrate (2). The width (W1) of the first surface-mounted component (3) is greater than the length (M2) of the second surface-mounted component (4). A first longitudinal direction (Q11) of the first surface-mounted component (3) and a second longitudinal direction (Q21) of the second surface-mounted component (4) intersect each other. The second electrode (42A) of the second surface-mounted component (4) overlaps the first land electrode (10A).

Description

High-frequency module

[0001] The present invention generally relates to a high-frequency module, and more particularly to a high-frequency module in which surface-mounted components are arranged on both sides of a mounting substrate.

[0002] The high-frequency module described in Patent Document 1 includes a module substrate and a plurality of electronic components arranged on the main surfaces on both sides of the module substrate. The plurality of electronic components include an inductor. In this high-frequency module, in a plan view from the thickness direction of the module substrate, no other electronic components are arranged in the overlapping region of the main surface on the opposite side of the module substrate that overlaps with the inductor. The overlapping region is a region that overlaps with the inductor arranged on one main surface of the module substrate in a plan view from the thickness direction of the module substrate. Thereby, since the magnetic field generated by the inductor can be reduced from being affected by other electronic components, it is possible to suppress fluctuations in the characteristics of components such as filters including the inductor.

[0003] International Publication No. WO 2019 / 240096

[0004] In the high-frequency module described in Patent Document 1, since no other electronic components are arranged in the overlapping region of the main surface on the opposite side that overlaps with the inductor in a plan view, the arrangement area of the electronic components is limited. As a result, the high-frequency module becomes larger.

[0005] In view of the above problems, an object of the present invention is to provide a high-frequency module that can be miniaturized.

[0006] A high-frequency module according to one aspect of the present invention comprises a mounting substrate, a pair of first land electrodes, a pair of second land electrodes, a first surface mount component, and a second surface mount component. The mounting substrate has a first main surface and a second main surface facing each other. The pair of first land electrodes are provided on the first main surface of the mounting substrate. The pair of second land electrodes are provided on the second main surface of the mounting substrate. The first surface mount component has a pair of first electrodes provided at both ends in the first longitudinal direction. The second surface mount component has a pair of second electrodes provided at both ends in the second longitudinal direction. The first surface mount component is arranged on the first main surface of the mounting substrate with the pair of first electrodes connected to the pair of first land electrodes. The second surface mount component is arranged on the second main surface of the mounting substrate with the pair of second electrodes connected to the pair of second land electrodes. In a plan view from the thickness direction of the mounting substrate, the width of the first surface mount component in the first short direction intersecting the first longitudinal direction is greater than the length of the second surface mount component in the second longitudinal direction. In a plan view from the thickness direction of the mounting substrate, the first longitudinal direction of the first surface mount component and the second longitudinal direction of the second surface mount component intersect each other. In a plan view from the thickness direction of the mounting substrate, at least one of the pair of second electrodes of the second surface mount component overlaps with one of the pair of first land electrodes.

[0007] The high-frequency module according to the present invention has the advantage of being miniaturizable.

[0008] Figure 1 is a plan view of a high-frequency module according to Embodiment 1. Figure 2 is a cross-sectional view taken along A1-A1 of Figure 1. Figure 3 is an equivalent circuit diagram of the same high-frequency module. Figure 4 is an equivalent circuit diagram of a modified example of Embodiment 1. Figure 5 is an equivalent circuit diagram of another modified example of Embodiment 1. Figure 6 is a plan view of a high-frequency module according to Embodiment 2. Figure 7 is a cross-sectional view taken along A2-A2 of Figure 6. Figure 8 is an equivalent circuit diagram of the same high-frequency module. Figure 9 is a plan view of a high-frequency module according to Embodiment 3. Figure 10 is a cross-sectional view taken along A3-A3 of Figure 9. Figure 11 is an equivalent circuit diagram of the same high-frequency module. Figure 12 is a plan view of a high-frequency module according to Embodiment 4. Figure 13 is a cross-sectional view taken along A4-A4 of Figure 12. Figure 14 is an equivalent circuit diagram of the same high-frequency module. Figure 15 is a plan view of a high-frequency module according to Embodiment 5. Figure 16 is a cross-sectional view taken along A5-A5 of Figure 15. Figure 17 is an equivalent circuit diagram of the same high-frequency module. Figure 18 is a configuration diagram of a high-frequency module according to Embodiment 6.

[0009] (1) Embodiment 1 The high-frequency module 1 according to Embodiment 1 will be described in detail with reference to the drawings.

[0010] (1-1) As shown in the schematic diagrams 1 and 2, the high-frequency module 1 according to Embodiment 1 comprises a mounting substrate 2, a pair of first land electrodes 10A, 10B, a pair of second land electrodes 13A, 13B, a first surface mount component 3, and a second surface mount component 4. The mounting substrate 2 has a first main surface 2a and a second main surface 2b that face each other. The pair of first land electrodes 10A, 10B are provided on the first main surface 2a of the mounting substrate 2. The pair of second land electrodes 13A, 13B are provided on the second main surface 2b of the mounting substrate 2. The first surface mount component 3 has a pair of first electrodes 32A, 32B provided at both ends in the first longitudinal direction Q11. The second surface mount component 4 has a pair of second electrodes 42A, 42B provided at both ends in the second longitudinal direction Q21. The first surface mount component 3 is positioned on the first main surface 2a of the mounting substrate 2, with a pair of first electrodes 32A and 32B connected to a pair of first land electrodes 10A and 10B. The second surface mount component 4 is positioned on the second main surface 2b of the mounting substrate 2, with a pair of second electrodes 42A and 42B connected to a pair of second land electrodes 13A and 13B. In a plan view from the thickness direction D1 of the mounting substrate 2, the width W1 of the first short direction Q12 intersects (for example, is perpendicular to) the first longitudinal direction Q11 of the first surface mount component 3 is greater than the length M2 of the second longitudinal direction Q21 of the second surface mount component 4. In a plan view from the thickness direction D1 of the mounting substrate 2, the first longitudinal direction Q11 of the first surface mount component 3 and the second longitudinal direction Q21 of the second surface mount component 4 intersect (for example, are perpendicular to) each other. In a plan view from the thickness direction D1 of the mounting substrate 2, at least one of the pair of second electrodes 42A, 42B of the second surface mount component 4, one of the second electrodes 42A, overlaps with one of the pair of first land electrodes 10A, 10B, the first land electrode 10A.

[0011] With this configuration, the first surface-mount component 3 and the second surface-mount component 4 are arranged to overlap in the thickness direction D1 of the mounting substrate 2, thereby enabling miniaturization of the high-frequency module 1. Furthermore, the basic body portion of the first surface-mount component 3 (the portion between the pair of first electrodes 32A and 32B) and the second surface-mount component 4 do not overlap in the thickness direction D1 of the mounting substrate 2. Therefore, if the first surface-mount component 3 is an inductor L1, the disturbance of the magnetic field K1 generated by the first surface-mount component 3 by the second surface-mount component 4 can be suppressed.

[0012] (1-2) Detailed Description The high-frequency module 1 according to Embodiment 1 can be used, for example, mounted on a cable television receiving device such as an STB (set-top box), and can be used as a module that processes signals compliant with the CATV standard DOCSIS.

[0013] (1-2-1) Structure of the high-frequency module 1 As shown in Figure 1, the high-frequency module 1 according to Embodiment 1 comprises a mounting substrate 2, a plurality of surface-mount components (first surface-mount component 3, second surface-mount component 4, and third surface-mount component 5), a first resin layer 6 (see Figure 2), and a second resin layer 7 (see Figure 2).

[0014] The first surface-mount component 3 is, for example, an inductor L1, the second surface-mount component 4 is, for example, a capacitor C1, and the third surface-mount component 5 is, for example, a capacitor C2 (see Figure 1).

[0015] The mounting substrate 2 is a substrate on which the above-mentioned plurality of surface-mount components are arranged (mounted). The mounting substrate 2 is flat. The mounting substrate 2 is, for example, a resin multilayer substrate. However, the mounting substrate 2 is not limited to a resin multilayer substrate, and may be, for example, a printed circuit board, an LTCC (Low Temperature Co-fired Ceramics) substrate, or an HTCC (High Temperature Co-fired Ceramics) substrate.

[0016] The mounting substrate 2 is, for example, a multilayer substrate including multiple dielectric layers (insulating layers) and multiple conductive layers. Each of the multiple conductive layers is provided between the multiple dielectric layers. That is, the multiple dielectric layers and the multiple conductive layers are alternately stacked in the thickness direction D1 of the mounting substrate 2. The multiple conductive layers are formed in a predetermined pattern defined for each layer. The material of each conductive layer is, for example, copper.

[0017] The mounting substrate 2 has a first main surface 2a and a second main surface 2b. The first main surface 2a and the second main surface 2b are main surfaces that face each other in the thickness direction D1 of the mounting substrate 2.

[0018] The first main surface 2a of the mounting substrate 2 is provided with a first surface mount component 3 and a first resin layer 6.

[0019] More specifically, a pair of first land electrodes 10A and 10B are provided on the first main surface 2a of the mounting substrate 2. The pair of first land electrodes 10A and 10B are land electrodes to which the pair of first electrodes 32A and 32B of the first surface mount component 3, described later, are connected. The pair of first land electrodes 10A and 10B are spaced apart from each other. Each of the pair of first land electrodes 10A and 10B is, for example, rectangular in plan view.

[0020] The first surface mount component 3 includes a first main body portion 31 and a pair of first electrodes 32A and 32B.

[0021] The first main body portion 31 is the portion that houses the functional part of the first surface mount component 3 (for example, the wiring electrodes of an inductor). The first main body portion 31 is the portion of the first surface mount component 3 other than the pair of first electrodes 32A and 32B. The first main body portion 31 has, for example, a rectangular parallelepiped shape. The pair of first electrodes 32A and 32B are the portions that are soldered to the pair of first land electrodes 10A and 10B of the mounting substrate 2. The pair of first electrodes 32A and 32B correspond one-to-one with the pair of first land electrodes 10A and 10B and are connected to the corresponding first land electrodes 10A and 10B. The pair of first electrodes 32A and 32B are provided at both ends of the first longitudinal direction Q11 in the first main body portion 31.

[0022] The first surface mount component 3 is positioned on the first main surface 2a of the mounting substrate 2, with a pair of first electrodes 32A and 32B connected to a pair of first land electrodes 10A and 10B by solder. In other words, the first surface mount component 3 is positioned across the pair of first land electrodes 10A and 10B.

[0023] The first resin layer 6 is provided on the first main surface 2a of the mounting substrate 2 so as to cover the electronic components (first surface mount components 3) that are placed on the first main surface 2a of the mounting substrate 2.

[0024] The second main surface 2b of the mounting substrate 2 is provided with a second surface mount component 4, a third surface mount component 5, and a second resin layer 7.

[0025] More specifically, the second main surface 2b of the mounting substrate 2 is provided with a pair of second land electrodes 13A and 13B, a pair of third land electrodes 14A and 14B, and a plurality of external terminals 15.

[0026] The pair of second land electrodes 13A and 13B are the parts to which the pair of second electrodes 42A and 42B of the second surface mount component 4, described later, are connected by solder. The pair of second land electrodes 13A and 13B are spaced apart from each other. Each of the pair of second land electrodes 13A and 13B is, for example, rectangular in plan view.

[0027] The pair of third land electrodes 14A and 14B are the parts to which the pair of third electrodes 52A and 52B of the third surface mount component 5, described later, are connected by solder. The pair of third land electrodes 14A and 14B are spaced apart from each other. Each of the pair of third land electrodes 14A and 14B is, for example, rectangular in plan view.

[0028] The multiple external terminals 15 are terminals for connecting to an external board (not shown). The multiple external terminals 15 include input terminals 15b and output terminals 15a for inputting and outputting signals to and from the external board, and a ground terminal 15c that is connected to the ground of the external board. Each of the multiple external terminals 15 is, for example, columnar. The multiple external terminals 15 are arranged, for example, along the periphery of the second main surface 2b of the mounting board 2.

[0029] The second surface mount component 4 includes a second main body portion 41 and a pair of second electrodes 42A and 42B.

[0030] The second main body portion 41 is the portion that houses the functional part (e.g., a capacitor) of the second surface mount component 4. The second main body portion 41 is the portion of the second surface mount component 4 other than the pair of second electrodes 42A and 42B. The second main body portion 41 has, for example, a rectangular parallelepiped shape. The pair of second electrodes 42A and 42B are the portions that are connected by solder to the pair of second land electrodes 13A and 13B of the mounting substrate 2. The pair of second electrodes 42A and 42B are provided at both ends of the second longitudinal direction Q21 of the second main body portion 41.

[0031] The second surface mount component 4 is positioned on the second main surface 2b of the mounting substrate 2 with a pair of second electrodes 42A and 42B connected to a pair of second land electrodes 13A and 13B by solder (i.e., one second electrode 42A is connected to one second land electrode 13A, and the remaining second electrode 42B is connected to the remaining second land electrode 13B). In other words, the second surface mount component 4 is positioned across the pair of second land electrodes 13A and 13B.

[0032] The third surface mount component 5 has a third main body portion 51 and a pair of third electrodes 52A and 52B.

[0033] The third main body portion 51 is the portion that houses the functional part (e.g., a capacitor) of the third surface mount component 5. The third main body portion 51 is the portion of the third surface mount component 5 other than the pair of third electrodes 52A and 52B. The third main body portion 51 has, for example, a rectangular parallelepiped shape. The pair of third electrodes 52A and 52B are the portions that are connected by solder to the pair of third land electrodes 14A and 14B of the mounting substrate 2. The pair of third electrodes 52A and 52B are provided at both ends of the third longitudinal direction Q31 of the third main body portion 51.

[0034] The third surface mount component 5 is positioned on the second main surface 2b of the mounting substrate 2 with a pair of third electrodes 52A and 52B connected by solder to a pair of third land electrodes 14A and 14B (i.e., one third electrode 52A is connected to one third land electrode 14A, and the remaining third electrode 52B is connected to the remaining third land electrode 14B). In other words, the third surface mount component 5 is positioned across the pair of third land electrodes 14A and 14B.

[0035] The second resin layer 7 is provided on the second main surface 2b of the mounting substrate 2 so as to cover the electronic components (second surface mount component 4 and third surface mount component 5) that are placed on the second main surface 2b of the mounting substrate 2. The second resin layer 7 is also provided on the second main surface 2b of the mounting substrate 2 so as to expose the end faces of each of the multiple external terminals 15 and cover the outer circumferential surfaces of each of the multiple external terminals 15.

[0036] The mounting substrate 2 is provided with a plurality of via electrodes B1 and B2 and a plurality of wiring electrodes H1 to H3. The plurality of wiring electrodes H1 to H3 are formed by the conductor layer described above. Via electrode B1 is provided inside the mounting substrate 2. Via electrode B1 connects one first land electrode 10A to one second land electrode 13A. Via electrode B2 is provided inside the mounting substrate 2. Via electrode B2 connects the remaining first land electrode 10B to one third land electrode 14A. Wiring electrode H1 is provided inside or on the surface of the mounting substrate 2. Wiring electrode H1 connects one second land electrode 13A to an external terminal 15 (for example, an output terminal 15a). Wiring electrode H2 is provided inside or on the surface of the mounting substrate 2. Wiring electrode H2 connects one first land electrode 10A to an external terminal 15 (for example, an input terminal 15b). Wiring electrode H3 is provided inside or on the surface of the mounting substrate 2. The wiring electrode H3 connects to the remaining third land electrode 14B and the external terminal 15 (for example, the ground terminal 15c). The wiring electrodes H1 to H3 are composed of via electrodes and conductive layers provided on the mounting substrate 2.

[0037] (1-2-2) Arrangement Relationship of the First to Third Surface Mount Components The arrangement relationship of the first to third surface mount components 3 to 5 will be explained with reference to Figures 1 and 2.

[0038] In a plan view from the thickness direction D1 of the mounting substrate 2, the width W1 of the first surface mount component 3 in the first short direction Q12 is greater than the length M2 of the second surface mount component 4 in the second long direction Q21. Here, the first short direction Q12 is the direction that intersects (for example, is perpendicular to) the first long direction Q11 of the first surface mount component 3 in the above plan view.

[0039] Furthermore, in the above plan view, the first longitudinal direction Q11 of the first surface mount component 3 and the second longitudinal direction Q21 of the second surface mount component 4 intersect each other (for example, are perpendicular).

[0040] Also, in the above plan view, at least one (both in the example of FIG. 1) of a pair of second electrodes 42A and 42B of the second surface-mounted component 4 overlaps with one of the first land electrodes 10A. That is, in the above plan view, at least one (both in the example of FIG. 1) of the pair of second land electrodes 13A and 13B is provided on the second main surface 2b of the mounting substrate 2 so as to be within the region of one of the first land electrodes 10A. In the example of FIG. 1, in the above plan view, the second surface-mounted component 4 is arranged on the second main surface 2b of the mounting substrate 2 so as to be within the region of one of the first land electrodes 10A.

[0041] Also, one of the first land electrodes 10A and one of the second land electrodes 13A are connected by a via electrode B1 provided inside the mounting substrate 2. In the above plan view, the via electrode B1 is arranged in the overlapping region between one of the first land electrodes 10A and one of the second land electrodes 13A.

[0042] Also, in the above plan view, the width W1 of the first short-side direction Q12 of the first surface-mounted component 3 is larger than the length M3 of the third longitudinal direction Q31 of the third surface-mounted component 5.

[0043] Also, in the above plan view, the first longitudinal direction Q11 of the first surface-mounted component 3 and the third longitudinal direction Q31 of the third surface-mounted component 5 intersect (for example, are orthogonal) to each other.

[0044] Also, in the above plan view, at least one (both in the example of FIG. 1) of a pair of third electrodes 52A and 52B of the third surface-mounted component 5 overlaps with the remaining first land electrode 10B. That is, in the above plan view, at least one (both in the example of FIG. 1) of the pair of third land electrodes 14A and 14B is provided on the second main surface 2b of the mounting substrate 2 so as to be within the region of the remaining first land electrode 10B. In the example of FIG. 1, in the above plan view, the third surface-mounted component 5 is arranged on the second main surface 2b of the mounting substrate 2 so as to be within the region of the remaining first land electrode 10B.

[0045] Also, the remaining first land electrode 10B and one of the third land electrodes 14A are connected by a via electrode B2 provided inside the mounting substrate 2. In the above plan view, the via electrode B2 is arranged in the overlapping region between the remaining first land electrode 10B and one of the third land electrodes 14A.

[0046] Thus, in the above plan view, at least a part (both in FIGS. 1 and 2 are the whole) of the second surface-mounted component 4 and the third surface-mounted component 5 overlaps with the first land electrodes 10A or 10B and does not protrude beyond the range between the first land electrodes 10A and 10B, and is arranged on the second main surface 2b of the mounting substrate 2.

[0047] (1-2-3) Arrangement relationship between the magnetic field of the first surface-mounted component and the second and third surface-mounted components As shown in FIG. 2, the first surface-mounted component 3 (that is, the inductor L1) generates a magnetic field K1 around it. The magnetic field K1 spreading from the first surface-mounted component 3 to the mounting substrate 2 side is limited to the range between the pair of first land electrodes 10A and 10B by, for example, a pair of first land electrodes 10A and 10B made of Cu or Au. That is, the magnetic field K1 spreading from the first surface-mounted component 3 to the mounting substrate 2 side does not exist in the range overlapping the pair of first land electrodes 10A and 10B (that is, directly below the pair of first land electrodes 10A and 10B) in the above plan view from the thickness direction D1 of the mounting substrate 2.

[0048] In Embodiment 1, as described above, the second surface-mounted component 4 and the third surface-mounted component 5 are arranged on the second main surface of the mounting substrate 2 so as not to protrude beyond the range between the pair of first land electrodes 10A and 10B (that is, the range where the magnetic field K1 exists) in the above plan view. Therefore, the magnetic field K1 generated by the first surface-mounted component 3 is not disturbed by the second surface-mounted component 4 and the third surface-mounted component 5. As a result, it is possible to suppress the characteristics of the first surface-mounted component 3 from being changed by the second surface-mounted component 4 and the third surface-mounted component 5.

[0049] (1-2-4) Miniaturization of the high-frequency module As shown in Figures 1 and 2, in Embodiment 1, as described above, at least a portion of each of the second surface mount component 4 and the third surface mount component 5 is arranged on the second main surface 2b of the mounting substrate 2 such that, in a plan view from the thickness direction D1 of the mounting substrate 2, it overlaps with the first land electrode 10A or 10B. More specifically, at least a portion of the second surface mount component 4 is arranged on the second main surface 2b of the mounting substrate 2 such that, in a plan view from the thickness direction D1 of the mounting substrate 2, it overlaps with the first land electrode 10A. At least a portion of the third surface mount component 5 is arranged on the second main surface 2b of the mounting substrate 2 such that, in a plan view from the thickness direction D1 of the mounting substrate 2, it overlaps with the first land electrode 10B. In other words, the area of ​​the second main surface 2b of the mounting substrate 2 that overlaps with the pair of first land electrodes 10A and 10B (the area directly below the first land electrodes 10A and 10B) is used as the placement space for the second surface mount component 4 and the third surface mount component 5. Thus, in Embodiment 1, the area of ​​the second main surface 2b of the mounting substrate 2 that overlaps with the pair of first land electrodes 10A and 10B (i.e., the area directly below the pair of first land electrodes 10A and 10B) is used as the component placement space, which allows for miniaturization of the high-frequency module 1.

[0050] (1-2-5) As shown in the equivalent circuit diagram 3 of the high-frequency module 1, the equivalent circuit of the high-frequency module 1 includes an inductor L1 (first surface mount component 3), a capacitor C1 (second surface mount component 4), a capacitor C2 (third surface mount component 5), an output terminal 15a, an input terminal 15b, and a ground terminal 15c (see Figure 1).

[0051] The first terminal (second electrode 42B) of capacitor C1 is connected to the output terminal 15a via circuit E1. The second terminal (second electrode 42A) of capacitor C1 is connected to the input terminal 15b via circuit E2. The first terminal (first electrode 32A) of inductor L1 is connected to the second terminal (second electrode 42A) of capacitor C1 via circuit E3. The second terminal (first electrode 32B) of inductor L1 is connected to the first terminal (third electrode 52A) of capacitor C2 via circuit E4. The second terminal (third electrode 52B) of capacitor C2 is connected to ground via circuit E5.

[0052] Here, as shown in Figure 1, circuit E1 (see Figure 3) is composed of a wiring electrode H1 and a second land electrode 13B. Circuit E2 (see Figure 3) is composed of a second land electrode 13A, a via electrode B1, a first land electrode 10A, and a wiring electrode H2. Circuit E3 (see Figure 3) is composed of a first land electrode 10A, a via electrode B1, and a second land electrode 13A. Circuit E4 (see Figure 3) is composed of a first land electrode 10B, a via electrode B2, and a third land electrode 14A. Circuit E5 (see Figure 3) is composed of a third land electrode 14B and a wiring electrode H3.

[0053] In other words, the high-frequency module 1 of Embodiment 1 is applicable to circuits with the same connection relationships as the equivalent circuit in Figure 3.

[0054] (1-3) The high-frequency module 1 according to the first embodiment of the effect comprises a mounting substrate 2, a pair of first land electrodes 10A, 10B, a pair of second land electrodes 13A, 13B, a first surface mount component 3, and a second surface mount component 4. The mounting substrate 2 has a first main surface 2a and a second main surface 2b that face each other. The pair of first land electrodes 10A, 10B are provided on the first main surface 2a of the mounting substrate 2. The pair of second land electrodes 13A, 13B are provided on the second main surface 2b of the mounting substrate 2. The first surface mount component 3 has a pair of first electrodes 32A, 32B provided at both ends in the first longitudinal direction Q11. The second surface mount component 4 has a pair of second electrodes 42A, 42B provided at both ends in the second longitudinal direction Q21. The first surface mount component 3 is positioned on the first main surface 2a of the mounting substrate 2, with a pair of first electrodes 32A and 32B connected to a pair of first land electrodes 10A and 10B. The second surface mount component 4 is positioned on the second main surface 2b of the mounting substrate 2, with a pair of second electrodes 42A and 42B connected to a pair of second land electrodes 13A and 13B. In a plan view from the thickness direction D1 of the mounting substrate 2, the width W1 of the first short direction Q12 intersects (for example, is perpendicular to) the first longitudinal direction Q11 of the first surface mount component 3 is greater than the length M2 of the second longitudinal direction Q21 of the second surface mount component 4. In a plan view from the thickness direction D1 of the mounting substrate 2, the first longitudinal direction Q11 of the first surface mount component 3 and the second longitudinal direction Q21 of the second surface mount component 4 intersect (for example, are perpendicular to) each other. In a plan view from the thickness direction D1 of the mounting substrate 2, at least one of the pair of second electrodes 42A, 42B of the second surface mount component 4, one of the second electrodes 42A, overlaps with one of the pair of first land electrodes 10A, 10B, the first land electrode 10A.

[0055] With this configuration, the first surface mount component 3 and the second surface mount component 4 are arranged to overlap in the thickness direction D1 of the mounting substrate 2, thereby enabling miniaturization of the high-frequency module 1.

[0056] Furthermore, the base portion of the first surface mount component 3 (the portion between the pair of first electrodes 32A and 32B) and the second surface mount component 4 do not overlap in the thickness direction D1 of the mounting substrate 2. Therefore, when the first surface mount component 3 is an inductor L1, the disturbance of the magnetic field K1 generated by the first surface mount component 3 by the second surface mount component 4 can be suppressed. In other words, the deterioration of the Q value of the inductor L1 can be suppressed.

[0057] In the high-frequency module 1 according to Embodiment 1, the second surface-mount component 4 is positioned on the second main surface 2b of the mounting substrate 2 such that, in a plan view from the thickness direction D1 of the mounting substrate 2, it fits within the area of ​​one of the first land electrodes 10A. With this configuration, the first surface-mount component 3 and the second surface-mount component 4 completely overlap in the thickness direction D1 of the mounting substrate 2, making it possible to further miniaturize the high-frequency module 1.

[0058] In the high-frequency module 1 according to Embodiment 1, one second electrode 42A of the second surface mount component 4 is connected to one of the second land electrodes 13A and 13B. One first land electrode 10A and one second land electrode 13A are connected by a via electrode B1 provided inside the mounting substrate 2. In a plan view from the thickness direction D1 of the mounting substrate 2, the via electrode B1 is positioned in the overlapping region of one first land electrode 10A and one second land electrode 13A.

[0059] This configuration allows for a shorter wiring path (consisting only of via electrodes B1) connecting the first surface-mount component 3 and the second surface-mount component 4, thereby improving the characteristics of the circuit including the first surface-mount component 3 and the second surface-mount component 4.

[0060] The high-frequency module 1 according to Embodiment 1 further comprises a pair of third land electrodes 14A and 14B and a third surface mount component 5. The pair of third land electrodes 14A and 14B are provided on the second main surface 2b of the mounting substrate 2. The third surface mount component 5 has a pair of third electrodes 52A and 52B at both ends in the third longitudinal direction Q31. The third surface mount component 5 is arranged on the second main surface 2b of the mounting substrate 2 with the pair of third electrodes 52A and 52B connected to the pair of third land electrodes 14A and 14B. In a plan view from the thickness direction D1 of the mounting substrate 2, the width W1 of the first short direction Q12 of the first surface mount component 3 is greater than the length M3 of the third longitudinal direction Q31 of the third surface mount component 5. In a plan view from the thickness direction D1 of the mounting substrate 2, the first longitudinal direction Q11 of the first surface mount component 3 and the third longitudinal direction Q31 of the third surface mount component 5 intersect (for example, are orthogonal). In a plan view from the thickness direction D1 of the mounting substrate 2, one of the third electrodes 52A, 52B of at least one pair of third electrodes 52A, 52B of the third surface mount component 5 overlaps with the remaining first land electrode 10B of the pair of first land electrodes 10A, 10B, which is different from one of the first land electrodes 10A. With this configuration, the high-frequency module 1 can be miniaturized when further third surface mount components 5 are included.

[0061] (1-4) Modifications Below are some modifications of Embodiment 1.

[0062] (1-4-1) Modification 1 In Embodiment 1, the high-frequency module 1 is exemplified as having the equivalent circuit shown in Figure 3. However, the high-frequency module 1 of Embodiment 1 may also have the equivalent circuit shown in Figure 4 or the equivalent circuit shown in Figure 5. The equivalent circuit of Figure 4 differs from the equivalent circuit of Figure 3 in that the connection position of capacitor C1 is changed to be between the first end of inductor L1 and the input terminal 15b. In the equivalent circuit of Figure 5, inductor L1 is connected between the output terminal 15a and the input terminal 15b. Capacitor C1 is connected between the output terminal 15a and ground. Capacitor C2 is connected between the input terminal 15b and ground. The above modification can also achieve the same effects as Embodiment 1.

[0063] (1-4-2) Modification 2 In Embodiment 1, one of the second surface mount component 4 and the third surface mount component 5 may be retained while the other is omitted. The effects of Embodiment 1 can be achieved if the first surface mount component 3 and one of the second surface mount component 4 and the third surface mount component 5 are present.

[0064] (2) Embodiment 2 The high-frequency module 1 according to Embodiment 2 will be described in detail with reference to the drawings.

[0065] (2-1) As shown in the configuration diagrams 6 and 7, the high-frequency module 1 according to Embodiment 2 differs from the high-frequency module 1 according to Embodiment 1 in that the arrangement of the second surface mount component 4 is shifted from directly below the first land electrode 10A, and that it further includes a fourth surface mount component 9. In the following description, the same reference numerals are used for components that are the same as in Embodiment 1 and their descriptions are omitted, while only components that are different from Embodiment 1 are described.

[0066] In Embodiment 2, in a plan view from the thickness direction D1 of the mounting substrate 2, the second surface mount component 4 has a pair of second electrodes 42A and 42B, with one second electrode 42A overlapping the first land electrode 10A, and the remaining second electrode 42B positioned on the outer periphery side of the first surface mount component 3. Similarly, in the same plan view, of the pair of second land electrodes 13A and 13B, one second land electrode 13A connected to one second electrode 42A overlaps the first land electrode 10A, and the remaining second land electrode 13B connected to the remaining second electrode 42B is positioned on the outer periphery side of the first surface mount component 3. In the example of Figure 6, the remaining second electrode 42B and the remaining second land electrode 13B are positioned on one side of the first short-side direction Q12 of the first surface mount component 3 in the same plan view.

[0067] In Embodiment 2, the fourth surface mount component 9 is, for example, a capacitor C3. The fourth surface mount component 9 has a fourth main body portion 91 and a pair of fourth electrodes 92A and 92B.

[0068] The fourth main body portion 91 is the portion that houses the functional part (e.g., a capacitor) of the fourth surface mount component 9. The fourth main body portion 91 is the portion of the fourth surface mount component 9 other than the pair of fourth electrodes 92A and 92B. The fourth main body portion 91 has, for example, a rectangular parallelepiped shape. The pair of fourth electrodes 92A and 92B are the portions that are soldered to the pair of fourth land electrodes 16A and 16B of the mounting substrate 2, which will be described later. The pair of fourth electrodes 92A and 92B correspond one-to-one with the pair of fourth land electrodes 16A and 16B and are connected to the corresponding fourth land electrodes. The pair of fourth electrodes 92A and 92B are provided at both ends of the fourth longitudinal direction Q41 in the fourth main body portion 91.

[0069] The fourth surface mount component 9 is positioned on the first main surface 2a of the mounting substrate 2 with a pair of fourth electrodes 92A and 92B connected to a pair of fourth land electrodes 16A and 16B by solder (i.e., one fourth electrode 92A is connected to one fourth land electrode 16A, and the remaining fourth electrode 92B is connected to the remaining fourth land electrode 16B). In other words, the fourth surface mount component 9 is positioned across the pair of fourth land electrodes 16A and 16B.

[0070] The mounting substrate 2 of Embodiment 2 is further provided with a pair of fourth land electrodes 16A and 16B and a wiring electrode H4, compared to the mounting substrate 2 of Embodiment 1.

[0071] A pair of fourth land electrodes 16A and 16B are provided on the first main surface 2a of the mounting substrate 2. The fourth surface mount component 9 is positioned on the first main surface 2a of the mounting substrate 2 with a pair of fourth electrodes 92A and 92B connected to the pair of fourth land electrodes 16A and 16B by solder.

[0072] In Embodiment 2, the first end of the wiring electrode H2 is connected to one of the first land electrodes 10A, and the second end of the wiring electrode H2 is connected to one of the pair of fourth land electrodes 16A and 16B, specifically to one of the fourth land electrodes 16A.

[0073] The first end of the wiring electrode H4 is connected to the remaining fourth land electrode 16B of the pair of fourth land electrodes 16A and 16B. The second end of the wiring electrode H4 is connected to one of the multiple external terminals 15 (for example, output terminal 15a).

[0074] (2-2) Equivalent Circuit of High Frequency Module As shown in Figure 8 of the equivalent circuit of the high frequency module 1 according to Embodiment 2, the equivalent circuit of the high frequency module 1 according to Embodiment 2 is configured similarly to the equivalent circuit of Figure 3, except that a capacitor C3 has been added. In the following description, only the parts that differ from the equivalent circuit of Figure 3 will be described, and the same reference numerals will be used for the parts that are the same as those in the equivalent circuit of Figure 3, and their description will be omitted.

[0075] As shown in Figure 8, in Embodiment 2, the first end (fourth electrode 92A) of capacitor C3 is connected to the second end (second electrode 42A) of capacitor C1 via circuit E2. The second end (fourth electrode 92B) of capacitor C3 is connected to the input terminal 15b via circuit E6.

[0076] Here, circuit E2 is composed of a second land electrode 13A, a via electrode B1, a first land electrode 10A, a wiring electrode H2, and a fourth land electrode 16A. Circuit E6 is composed of a fourth land electrode 16B and a wiring electrode H4.

[0077] In other words, the high-frequency module 1 of Embodiment 2 is applicable to circuits with the same connection relationships as the equivalent circuit in Figure 4.

[0078] (2-3) In the high-frequency module 1 according to the second embodiment, in a plan view from the thickness direction D1 of the mounting substrate 2, of the pair of second electrodes 42A and 42B of the second surface mount component 4, one second electrode 42A overlaps with one of the first land electrodes 10A, and the remaining second electrode 42B is positioned on the outer circumference side of the first surface mount component 3.

[0079] With this configuration, the first surface-mount component 3 and one of the second electrodes 42A of the second surface-mount component 4 overlap in the thickness direction D1 of the mounting substrate 2, thus enabling miniaturization of the high-frequency module 1. Furthermore, since the remaining second electrode 42B of the second surface-mount component 4 is positioned on the outer periphery side of the first surface-mount component 3, the routing of the electrical circuit can be omitted for the portion of the second surface-mount component 4 that is positioned on the outer periphery side of the first surface-mount component 3.

[0080] (2-4) Modifications Below are some modifications of Embodiment 2.

[0081] Embodiment 2 illustrates a case where the fourth surface mount component 9 is arranged on the first main surface 2a of the mounting substrate 2. However, the fourth surface mount component 9 may also be arranged on the second main surface 2b of the mounting substrate 2. In this case, the pair of fourth land electrodes 16A and 16B are also arranged on the second main surface 2b of the mounting substrate 2.

[0082] (3) Embodiment 3 The high-frequency module 1 according to Embodiment 3 will be described in detail with reference to the drawings.

[0083] (3-1) As shown in the configuration diagrams 9 and 10, the high-frequency module 1 according to Embodiment 3 differs from the high-frequency module 1 according to Embodiment 1 in that the second surface mount component 4 and the third surface mount component 5 are located directly below the remaining first land electrode 10B (in the example of Figure 9, a part of the second surface mount component 4 and a part of the third surface mount component 5 are located directly below the remaining first land electrode 10B), and one end of each of the second surface mount component 4 and the third surface mount component 5 is connected to ground. In the following description, the same reference numerals are used for components that are the same as in Embodiment 1 and their descriptions are omitted, and only components that are different from Embodiment 1 are described.

[0084] In Embodiment 3, in a plan view from the thickness direction D1 of the mounting substrate 2, one second electrode 42A of the second surface mount component 4 and one third electrode 52A of the third surface mount component 5 overlap with one first land electrode 10B. In this case, in the plan view, the remaining second electrode 42B of the second surface mount component 4 and the remaining third electrode 52B of the third surface mount component 5 are located on the outer periphery side of the first surface mount component 3. More specifically, the remaining second electrode 42B and the remaining third electrode 52B protrude from the first surface mount component 3 in opposite directions in the first short-side direction Q12 of the first surface mount component.

[0085] Furthermore, in the plan view described above, of the pair of second land electrodes 13A and 13B, one second land electrode 13A overlaps with the first land electrode 10B, and the remaining second land electrode 13B is positioned on the outer periphery of the first surface mount component 3. Also, of the pair of third land electrodes 14A and 14B, one third land electrode 14A overlaps with the first land electrode 10B, and the remaining third land electrode 14B is positioned on the outer periphery of the first surface mount component 3. More specifically, the remaining second land electrode 13B and the remaining third land electrode 14B protrude from the first surface mount component 3 in opposite directions in the first short-side direction Q12 of the first surface mount component.

[0086] In Embodiment 3, the mounting substrate 2 is provided with wiring electrodes H11 to H14 and via electrodes B11 and B12.

[0087] Via electrode B11 connects the first land electrode 10B and the second land electrode 13A. Via electrode B11 is positioned in the overlapping region of the first land electrode 10B and the second land electrode 13A. Via electrode B12 connects the first land electrode 10B and the third land electrode 14A. Via electrode B12 is positioned in the overlapping region of the first land electrode 10B and the third land electrode 14A.

[0088] Wiring electrode H11 connects the second land electrode 13B to the external terminal 15 (e.g., the ground terminal 15d). Wiring electrode H12 connects the first land electrode 10A to the external terminal 15 (e.g., the input terminal 15b). Wiring electrode H13 connects the third land electrode 14B to the external terminal 15 (e.g., the ground terminal 15c). Wiring electrode H14 connects the first land electrode 10B to the external terminal 15 (e.g., the output terminal 15a). Wiring electrodes H11 to H14 are provided inside the mounting substrate 2 and are composed of via electrodes and conductor layers inside the mounting substrate 2.

[0089] (3-2) As shown in the equivalent circuit diagram 11 of the high-frequency module, the equivalent circuit of the high-frequency module 1 according to Embodiment 3 includes an inductor L1 (first surface mount component 3), a capacitor C1 (second surface mount component 4), and a capacitor C2 (third surface mount component 5).

[0090] The first end (first electrode 32A) of inductor L1 is connected to the input terminal 15b via circuit E11. The second end (first electrode 32B) of inductor L1 is connected to the output terminal 15a via circuit E12. The first end (second electrode 42A) of capacitor C1 is connected to the second end of inductor L1 via circuit E13. The second end (second electrode 42B) of capacitor C1 is connected to ground via circuit E14. The first end (third electrode 52A) of capacitor C2 is connected to the output terminal 15a via circuit E15. The second end (third electrode 52B) of capacitor C2 is connected to ground via circuit E16.

[0091] Here, as shown in Figure 9, circuit E11 (see Figure 11) is composed of a wiring electrode H12 and a first land electrode 10A. Circuit E12 (see Figure 11) is composed of a first land electrode 10B and a wiring electrode H14. Circuit E13 (see Figure 11) is composed of a first land electrode 10B, a via electrode B11 and a second land electrode 13A. Circuit E14 (see Figure 11) is composed of a second land electrode 13B and a wiring electrode H11. Circuit E15 (see Figure 11) is composed of a third land electrode 14A, a via electrode B12, a first land electrode 10B and a wiring electrode H14. Circuit E16 (see Figure 11) is composed of a third land electrode 14B and a wiring electrode H13.

[0092] In other words, the high-frequency module 1 of Embodiment 3 is applicable to circuits with the same connection relationships as the equivalent circuit in Figure 9.

[0093] (3-3) The high-frequency module 1 according to the third embodiment further comprises a pair of third land electrodes 14A and 14B and a third surface mount component 5. The pair of third land electrodes 14A and 14B are provided on the second main surface 2b of the mounting substrate 2. The third surface mount component 5 has a pair of third electrodes 52A and 52B at both ends in the third longitudinal direction Q31. The third surface mount component 5 is arranged on the second main surface 2b of the mounting substrate 2 with the pair of third electrodes 52A and 52B connected to the pair of third land electrodes 14A and 14B. In a plan view from the thickness direction D1 of the mounting substrate 2, the first longitudinal direction Q11 of the first surface mount component 3 and the third longitudinal direction Q31 of the third surface mount component 5 intersect each other (for example, are orthogonal). In a plan view from the thickness direction D1 of the mounting substrate 2, one of the second electrodes 42A of at least one pair of second electrodes 42A, 42B of the second surface mount component 4, and one of the third electrodes 52A of at least one pair of third electrodes 52A, 52B of the third surface mount component 5, overlap with one of the first land electrodes 10A, 10B of the pair of first land electrodes 10A, 10B.

[0094] With this configuration, one of the first electrodes 32A of the first surface mount component 3 can be connected to one of the second electrodes 42A of the second surface mount component 4 and one of the third electrodes 52A of the third surface mount component 5, using the minimum component placement area.

[0095] (4) Embodiment 4 The high-frequency module 1 according to Embodiment 4 will be described in detail with reference to the drawings.

[0096] (4-1) As shown in the configuration diagrams 12 and 13, the high-frequency module 1 according to Embodiment 4 differs from the high-frequency module 1 according to Embodiment 1 in that it further comprises a fourth surface mount component 18 arranged on the first main surface 2a of the mounting substrate 2, and the second surface mount component 4 is arranged across the first surface mount component 3 and the fourth surface mount component 18. In the following description, the same reference numerals are used for components that are the same as in Embodiment 1 and their descriptions are omitted, and only components that are different from Embodiment 1 are described.

[0097] The high-frequency module 1 according to Embodiment 4 further comprises a fourth surface-mount component 18 in addition to the high-frequency module 1 according to Embodiment 1.

[0098] The mounting substrate 2 of Embodiment 4 is further provided with a pair of fourth land electrodes 19A and 19B compared to the mounting substrate 2 of Embodiment 1.

[0099] A pair of fourth land electrodes 19A and 19B are arranged side by side with a pair of first land electrodes 10A and 10B, as an example. One of the fourth land electrodes 19A is positioned adjacent to one of the first land electrodes 10A, and the remaining fourth land electrode 19B is positioned on the opposite side of one of the first land electrodes 10A from one of the fourth land electrodes 19A.

[0100] The fourth surface mount component 18 is, for example, an inductor L2. The fourth surface mount component 18 has a fourth main body 181 and a pair of fourth electrodes 182A and 182B.

[0101] The fourth main body portion 181 is the portion that houses the functional part (e.g., an inductor) of the fourth surface mount component 18. The fourth main body portion 181 is the portion of the fourth surface mount component 18 other than the pair of fourth electrodes 182A and 182B. The fourth main body portion 181 has, for example, a rectangular parallelepiped shape. The pair of fourth electrodes 182A and 182B are the portions that are soldered to the pair of fourth land electrodes 19A and 19B of the mounting substrate 2, which will be described later. The pair of fourth electrodes 182A and 182B correspond one-to-one with the pair of fourth land electrodes 19A and 19B and are connected to the corresponding fourth land electrodes. The pair of fourth electrodes 182A and 182B are provided at both ends of the fourth longitudinal direction Q41 of the fourth main body portion 181.

[0102] The fourth surface mount component 18 is positioned on the first main surface 2a of the mounting substrate 2 with a pair of fourth electrodes 182A and 182B connected by solder to a pair of fourth land electrodes 19A and 19B (i.e., one fourth electrode 182A is connected to one fourth land electrode 19A, and the remaining fourth electrode 182B is connected to the remaining fourth land electrode 19B). In other words, the fourth surface mount component 18 is positioned across the pair of fourth land electrodes 19A and 19B. The fourth surface mount component 18 is positioned on the first main surface 2a of the mounting substrate 2 such that one fourth electrode 182A is positioned adjacent to one first electrode 32A of the first surface mount component 3. Note that "electrode A is positioned adjacent to electrode B" means that there are no electronic components between electrode A and electrode B.

[0103] In Embodiment 4, the second surface mount component 4 is positioned on the second main surface 2b of the mounting substrate 2 such that one second electrode 42A overlaps with one first land electrode 10A, and the remaining second electrode 42B overlaps with one fourth land electrode 19A. In this case, in the plan view, of the pair of second land electrodes 13A and 13B, one second land electrode 13A overlaps with one first land electrode 10A, and the remaining second land electrode 13B overlaps with one fourth land electrode 19A.

[0104] In Embodiment 4, the mounting substrate 2 is provided with wiring electrodes H1 to H3 and via electrodes B1 to B3.

[0105] The via electrode B1 of Embodiment 4 connects the first land electrode 10A and the second land electrode 13A, similar to the via electrode B1 of Embodiment 1, and is positioned in the overlapping region of the first land electrode 10A and the second land electrode 13A. The via electrode B2 of Embodiment 4 connects the first land electrode 10B and the third land electrode 14A, similar to the via electrode B2 of Embodiment 1, and is positioned in the overlapping region of the first land electrode 10B and the third land electrode 14A. The via electrode B3 of Embodiment 4 connects the fourth land electrode 19A and the second land electrode 13B, and is positioned in the overlapping region of the fourth land electrode 19A and the second land electrode 13B.

[0106] In Embodiment 4, the wiring electrode H1 connects the fourth land electrode 19B to the external terminal 15 (for example, the input terminal 15a). In Embodiment 4, the wiring electrode H2 connects the first land electrode 10A to the external terminal 15 (input terminal 15b), similar to the wiring electrode H2 in Embodiment 1. In Embodiment 4, the wiring electrode H3 connects the third land electrode 14B to the external terminal 15 (for example, the ground terminal 15c), similar to the wiring electrode H3 of the mounting substrate 2. The wiring electrodes H1 to H3 are provided inside the mounting substrate 2 and are composed of via electrodes and conductor layers inside the mounting substrate 2.

[0107] (4-2) As shown in the arrangement diagram 13 of the first to fourth surface mount components, in Embodiment 4, the second surface mount component 4 and the third surface mount component 5 are arranged on the second main surface 2b of the mounting substrate 2 in the same way as in Embodiment 1, such that they do not extend beyond the range between the pair of first land electrodes 10A and 10B (the range where the magnetic field K1 exists) and at least a part of them overlaps with the first land electrodes 10A and 10B. Therefore, in Embodiment 4 as well as in Embodiment 1, the characteristics of the first surface mount component 3 are not disturbed by the second surface mount component 4 and the third surface mount component 5.

[0108] Furthermore, in Embodiment 4, the second surface mount component 4 is positioned on the second main surface 2b of the mounting substrate 2 such that it does not extend beyond the range between the pair of fourth land electrodes 19A and 19B (the range where the magnetic field K2 generated by the fourth surface mount component 18 exists), and at least a portion of it (the second electrode 42B) overlaps with the fourth land electrode 19A. Therefore, in Embodiment 4, the characteristics of the fourth surface mount component 18 are not disturbed by the second surface mount component 4.

[0109] Furthermore, in Embodiment 4, similar to Embodiment 1, at least a portion of the second surface mount component 4 and the third surface mount component 5 overlaps with the first land electrode 10A or 10B in the plan view, thus enabling miniaturization of the high-frequency module 1. In addition, at least a portion of the second surface mount component 4 overlaps with the fourth land electrode 19A in the plan view, thus enabling further miniaturization of the high-frequency module 1.

[0110] (4-3) As shown in the equivalent circuit diagram 14 of the high-frequency module, the equivalent circuit of the high-frequency module 1 according to Embodiment 4 includes an inductor L1 (first surface mount component 3), an inductor L2 (fourth surface mount component 18), a capacitor C1 (second surface mount component 4), and a capacitor C2 (third surface mount component 5).

[0111] The first end of inductor L2 (fourth electrode 182B) is connected to the input terminal 15b via circuit E21. The second end of inductor L2 (fourth electrode 182A) is connected to the first end of capacitor C1 (second electrode 42B) via circuit E22. The second end of capacitor C1 (second electrode 42A) is connected to the output terminal 15a via circuit E23. The first end of inductor L1 (first electrode 32A) is connected to the second end of capacitor C1 (second electrode 42A) via circuit E24. The second end of inductor L1 (first electrode 32B) is connected to the first end of capacitor C2 (third electrode 52A) via circuit E25. The second end of capacitor C2 (third electrode 52B) is connected to ground via circuit E26.

[0112] Here, as shown in Figure 12, circuit E21 (see Figure 14) is composed of the wiring electrode H1 and the fourth land electrode 19B. Circuit E22 (see Figure 14) is composed of the fourth land electrode 19A, via electrode B3 and the second land electrode 13B. Circuit E23 (see Figure 14) is composed of the second land electrode 13A, via electrode B1, the first land electrode 10A and the wiring electrode H2. Circuit E24 (see Figure 14) is composed of the first land electrode 10A, via electrode B1 and the second land electrode 13A. Circuit E25 (see Figure 14) is composed of the first land electrode 10B, via electrode B2 and the third land electrode 14A. Circuit E26 (see Figure 14) is composed of the third land electrode 14B and the wiring electrode H3.

[0113] In other words, the high-frequency module 1 of Embodiment 4 is applicable to circuits with the same connection relationships as the equivalent circuit in Figure 14.

[0114] (4-4) The high-frequency module 1 according to the 4th embodiment further comprises a pair of fourth land electrodes 19A, 19B (third land electrodes) and a fourth surface mount component 18 (third surface mount component). The pair of fourth land electrodes 19A, 19B are provided on the first main surface 2a of the mounting substrate 2. The fourth surface mount component 18 has a pair of fourth electrodes 182A, 182B (fourth electrodes) at both ends in the fourth longitudinal direction Q41 (third longitudinal direction). The fourth surface mount component 18 is arranged on the first main surface 2a of the mounting substrate 2 with the pair of fourth electrodes 182A, 182B in contact with the pair of fourth land electrodes 19A, 19B. One of the pair of fourth land electrodes 19A, 19B is arranged adjacent to one of the pair of first land electrodes 10A, 10B. In a plan view from the thickness direction D1 of the mounting substrate 2, of the pair of second electrodes 42A and 42B of the second surface mount component 4, one second electrode 42A overlaps with one first land electrode 10A, and the other second electrode 42B overlaps with one fourth land electrode 19A.

[0115] In this configuration, when viewed from the thickness direction D1 of the mounting substrate 2, the second surface-mount component 4 bridges the gap between the first surface-mount component 3 and the fourth surface-mount component 18. Therefore, when the first surface-mount component 3, the second surface-mount component 4, and the fourth surface-mount component 18 are connected in series in this order, the wiring electrodes can be made up of only via electrodes B1 and B3. Thus, the wiring electrodes can be made as short as possible.

[0116] (5) Embodiment 5 The high-frequency module 1 according to Embodiment 5 will be described in detail with reference to the drawings.

[0117] (5-1) As shown in the configuration diagrams 15 and 16, the high-frequency module 1 according to Embodiment 5 differs from the high-frequency module 1 according to Embodiment 1 in that the second surface mount component 4 and the third surface mount component 5 are connected in parallel to the pair of first land electrodes 10A and 10B. In the following description, the same reference numerals are used for components that are the same as in Embodiment 1 and their descriptions are omitted, while only components that are different from Embodiment 1 are described.

[0118] In Embodiment 5, the second surface mount component 4 is positioned on the second main surface 2b of the mounting substrate 2 such that one second electrode 42A overlaps with one first land electrode 10A in a plan view from the thickness direction D1 of the mounting substrate 2, and the remaining second electrode 42B protrudes from the first surface mount component 3 in the first short-side direction Q12 of the first surface mount component 3 in the plan view.

[0119] Furthermore, in Embodiment 5, the third surface mount component 5 is positioned on the second main surface 2b of the mounting substrate 2 such that, in the plan view, one of the third electrodes 52A overlaps with the remaining first land electrode 10B, and the remaining second electrode 42B protrudes from the first surface mount component 3 in the first short-side direction Q12 of the first surface mount component 3 in the plan view in the opposite direction to the protrusion direction of the remaining second electrode 42B.

[0120] In this case, one of the second land electrodes 13A overlaps with one of the first land electrodes 10A in the plan view. The remaining second land electrode 13B is positioned offset from one of the second land electrodes 13A to the outside of the first surface mount component 3 in the first short-side direction Q12 of the first surface mount component 3 in the plan view.

[0121] Furthermore, one of the third land electrodes 14A overlaps with the remaining first land electrode 10B in the plan view described above. The remaining third land electrode 14B is positioned offset from one of the third land electrodes 14A to the outside of the first surface mount component 3 in the first short-side direction Q12 of the first surface mount component 3 in the plan view described above. The remaining third land electrode 14B is positioned offset in the opposite direction to the protruding direction of the remaining second land electrode 13B.

[0122] In Embodiment 5, the mounting substrate 2 is provided with wiring electrodes H31 to H34 and via electrodes B1 and B2.

[0123] Similar to via electrode B1 in Embodiment 1, via electrode B1 connects the first land electrode 10A and the second land electrode 13A and is positioned in the overlapping region of the first land electrode 10A and the second land electrode 13A. Similar to via electrode B2 in Embodiment 1, via electrode B2 connects the first land electrode 10B and the third land electrode 14A and is positioned in the overlapping region of the first land electrode 10B and the third land electrode 14A.

[0124] Wiring electrode H31 connects the first land electrode 10A to the external terminal 15 (for example, the input terminal 15b). Wiring electrode H32 connects the first land electrode 10B to the external terminal 15 (for example, the output terminal 15a). Wiring electrode H33 connects the second land electrode 13B to the first land electrode 10B. Wiring electrode H34 connects the third land electrode 14B to the first land electrode 10A. Wiring electrodes H31 to H34 are provided inside the mounting substrate 2 and are composed of via electrodes and conductor layers inside the mounting substrate 2.

[0125] In Embodiment 5, the second electrode 42A of the second surface mount component 4 is connected to the first electrode 32A of the first surface mount component 3 via the second land electrode 13A, via electrode B1, and first land electrode 10A. The second electrode 42B of the second surface mount component 4 is connected to the first electrode 32B of the first surface mount component 3 via the wiring electrode H33 and first land electrode 10B. In other words, the second surface mount component 4 is connected in parallel with the first surface mount component 3.

[0126] Furthermore, in Embodiment 5, the third electrode 52A of the third surface mount component 5 is connected to the first electrode 32B of the first surface mount component 3 via the third land electrode 14A, via electrode B2, and first land electrode 10B. The third electrode 52B of the third surface mount component 5 is connected to the first electrode 32A of the first surface mount component 3 via the third land electrode 14B, wiring electrode H34, and first land electrode 10A. In other words, the third surface mount component 5 is connected in parallel with the first surface mount component 3.

[0127] (5-2) As shown in the equivalent circuit diagram 17 of the high-frequency module, the equivalent circuit of the high-frequency module 1 according to Embodiment 5 includes an inductor L1 (first surface mount component 3), a capacitor C1 (second surface mount component 4), and a capacitor C2 (third surface mount component 5).

[0128] The first end (first electrode 32A) of inductor L1 is connected to the input terminal 15b via circuit E31. The second end (first electrode 32B) of inductor L1 is connected to the output terminal 15a via circuit E32. The first end (second electrode 42A) of capacitor C1 is connected to the first end of inductor L1 via circuit E33. The second end (second electrode 42B) of capacitor C1 is connected to the second end of inductor L1 via circuit E34. The first end (third electrode 52B) of capacitor C2 is connected to the first end of inductor L1 via circuit E35. The second end (third electrode 52A) of capacitor C2 is connected to the second end of inductor L1 via circuit E36.

[0129] Here, as shown in Figure 15, circuit E31 (see Figure 17) is composed of a wiring electrode H31 and a first land electrode 10A. Circuit E32 (see Figure 17) is composed of a first land electrode 10B and a wiring electrode H32. Circuit E33 (see Figure 17) is composed of a second land electrode 13A and a via electrode B1. Circuit E34 (see Figure 17) is composed of a second land electrode 13B and a wiring electrode H33. Circuit E35 (see Figure 17) is composed of a third land electrode 14B and a wiring electrode H34. Circuit E36 (see Figure 17) is composed of a third land electrode 14A and a via electrode B2.

[0130] In other words, the high-frequency module 1 of Embodiment 5 is applicable to circuits with the same connection relationships as the equivalent circuit in Figure 17.

[0131] (5-3) Effect Embodiment 5: In the high-frequency module 1, of the pair of second electrodes 42A and 42B of the second surface mount component 4, one second electrode 42A overlaps with one of the pair of first land electrodes 10A and 10B in a plan view from the thickness direction D1 of the mounting substrate 2. The remaining second electrode 42B protrudes from the first surface mount component 3 in the first short-side direction Q12 of the first surface mount component 3 in a plan view from the thickness direction D1 of the mounting substrate 2. The remaining second electrode 42B is connected to the remaining first land electrode 10B of the pair of first land electrodes 10A and 10B via the first wiring electrode H33. Of the pair of third electrodes 52A and 52B of the third surface mount component 5, one third electrode 52A overlaps with the remaining first land electrode 10B in a plan view from the thickness direction D1 of the mounting substrate 2. The remaining third electrode 52B protrudes from the first surface mount component 3 in the first short-side direction Q12, in a plan view from the thickness direction D1 of the mounting substrate 2, in the opposite direction to the protrusion direction of the remaining second electrode 42B. The remaining third electrode 52B is connected to one of the first land electrodes 10A via the second wiring electrode H34.

[0132] With this configuration, the second surface mount component 4 and the third surface mount component 5 can each be connected in parallel to the first surface mount component 3. In this case, the remaining second electrode 42B protrudes from the first surface mount component 3, allowing the first wiring electrode H33 to be shortened. Also, the remaining third electrode 52B protrudes from the first surface mount component 3, allowing the second wiring electrode H34 to be shortened.

[0133] (6) Embodiment 6 The high-frequency module 1 according to Embodiment 6 will be described in detail with reference to the drawings.

[0134] (6-1) As shown in the configuration diagram 18, the high-frequency module 1 according to embodiment 6 includes a diplexer 60 that includes a plurality of inductors L11 to L15, L31 to L35 to which the inductor L1 of embodiments 1 to 5 can be applied.

[0135] The diplexer 60 is intended for use with signals in the frequency band between several tens of MHz and 1 GHz, for example. However, the diplexer 60 is not limited to being applied to signals in the above frequency band.

[0136] The diplexer 60 includes a low-pass filter 64, a high-pass filter 65, a first input / output unit 61, a second input / output unit 62, and a third input / output unit 63.

[0137] The low-pass filter 64 comprises two input / output sections 64a and 64b, a plurality of inductors L11 to L15, and a plurality of capacitors C11 to C22.

[0138] Input / output unit 64a is connected to the first input / output unit 61. Input / output unit 64b is connected to the second input / output unit 62.

[0139] Inductor L11, capacitor C13, capacitor C17, capacitor C20, and inductor L15 are connected in series between the input / output section 64a and the input / output section 64b in this order. Branch points N11 and N12 are provided in the circuit between inductor L11 and capacitor C13. Capacitor C11 is connected between branch point N11 and ground. Capacitor C12 is connected between branch point N12 and ground. Capacitor C14 and inductor L12 are connected in parallel to capacitor C13.

[0140] Branch points N13 and N14 are provided in the circuit between capacitors C13 and C17. Capacitor C15 is connected between branch point N13 and ground. Capacitor C16 is connected between branch point N14 and ground. Inductor L13 is connected in parallel to capacitor C17. Branch points N15 and N16 are provided in the circuit between capacitors C17 and C20. Capacitor C18 is connected between branch point N15 and ground. Capacitor C19 is connected between branch point N16 and ground.

[0141] Capacitor C20 has an inductor L14 connected in parallel. Branch points N17 and N18 are provided in the circuit between capacitor C20 and inductor L15. Capacitor C21 is connected between branch point N17 and ground. Capacitor C22 is connected between branch point N18 and ground.

[0142] The high-pass filter 65 comprises two input / output sections 65a and 65b, a plurality of inductors L31 to L35, and a plurality of capacitors C31 to C34.

[0143] Input / output unit 65a is connected to the first input / output unit 61. Input / output unit 65b is connected to the third input / output unit 63.

[0144] Inductor L31, capacitor C31, capacitor C32, capacitor C33, capacitor C34, and inductor L35 are connected in series between the input / output section 65a and the input / output section 65b in this order. A branch point N31 is provided in the circuit between capacitors C31 and C32. Inductor L32 and capacitor C35 are connected in series between branch point N31 and ground. A branch point N32 is provided in the circuit between capacitors C32 and C33. Inductor L33 and capacitor C36 are connected in series between branch point N32 and ground. A branch point N33 is provided in the circuit between capacitors C33 and C34. Inductor L34 and capacitor C37 are connected in series between branch point N33 and ground.

[0145] In this diplexer 60, one of the first surface-mount component 3 (inductor L1) from any of Embodiments 1 to 5 is used as either inductor L11 connected to the first input / output unit 61 or inductor L15 connected to the second input / output unit 62 among the multiple inductors L11 to L15 of the low-pass filter 64, or as either L31 connected to the first input / output unit 61 or inductor L35 connected to the third input / output unit 63 among the multiple inductors L31 to L35 of the high-pass filter 65. As a result, this diplexer 60 can achieve the effect of any one of Embodiments 1 to 5.

[0146] (6-2) The high-frequency module 1 according to the effect embodiment 6 includes a diplexer 60. The diplexer 60 has a low-pass filter 64, a high-pass filter 65, a first input / output section 61, a second input / output section 62, and a third input / output section 63. The low-pass filter 64 has two input / output sections 64a and 64b and a plurality of inductors L11 to L15. The high-pass filter 65 has two input / output sections 65a and 65b and a plurality of inductors L31 to L35. The first input / output section 61 is connected to one of the input / output sections 64a and 65a of the low-pass filter 64 and the high-pass filter 65, respectively. The second input / output section 62 is connected to the remaining input / output section 64b of the low-pass filter 64. The third input / output section 63 is connected to the remaining input / output section 65b of the high-pass filter 65. The first surface mount component 3 is one of the multiple inductors L11 to L15 of the low-pass filter 64, connected to the first input / output section 61 or the second input / output section 62, or one of the multiple inductors L31 to L35 of the high-pass filter 65, connected to the first input / output section 61 or the third input / output section 63, L31 or L35. With this configuration, when the first surface mount component 3 is one of the inductors L11, L15, L31, or L35, the same effects as any one of embodiments 1 to 5 can be achieved.

[0147] (6-3) Modifications Below are some modifications of Embodiment 6.

[0148] In the diplexer 60 of Embodiment 6, among the plurality of inductors L11 to L15 and L31 to L35, one of the first surface mount components 3 (inductor L1) from Embodiments 1 to 5 may be used for inductors other than inductors L11, L15, L31, and L35. In this case as well, the diplexer 60 can achieve one of the effects of Embodiments 1 to 5.

[0149] (Aspects) The following aspects are disclosed in this specification.

[0150] The high-frequency module (1) of the first embodiment includes a mounting substrate (2), a pair of first land electrodes (10A, 10B), a pair of second land electrodes (13A, 13B), a first surface mount component (3), and a second surface mount component (4). The mounting substrate (2) has a first main surface (2a) and a second main surface (2b) that face each other. The pair of first land electrodes (10A, 10B) are provided on the first main surface (2a) of the mounting substrate (2). The pair of second land electrodes (13A, 13B) are provided on the second main surface (2b) of the mounting substrate (2). The first surface mount component (3) has a pair of first electrodes (32A, 32B) provided at both ends in the first longitudinal direction (Q11). The second surface mount component (4) has a pair of second electrodes (42A, 42B) provided at both ends in the second longitudinal direction (Q21). The first surface mount component (3) is positioned on the first main surface (2a) of the mounting substrate (2) with a pair of first electrodes (32A, 32B) connected to a pair of first land electrodes (10A, 10B). The second surface mount component (4) is positioned on the second main surface (2b) of the mounting substrate (2) with a pair of second electrodes (42A, 42B) connected to a pair of second land electrodes (13A, 13B). In a plan view from the thickness direction (D1) of the mounting substrate (2), the width (W1) of the first short direction (Q12) intersecting the first longitudinal direction (Q11) of the first surface mount component (3) is greater than the length (M2) of the second longitudinal direction (Q21) of the second surface mount component (4). In a plan view from the thickness direction (D1) of the mounting substrate (2), the first longitudinal direction (Q11) of the first surface mount component (3) and the second longitudinal direction (Q21) of the second surface mount component (4) intersect each other. In a plan view from the thickness direction (D1) of the mounting substrate (2), one of the second electrodes (42A) of at least one pair of second electrodes (42A, 42B) of the second surface mount component (4) overlaps with one of the first land electrodes (10A, 10B) of the pair of first land electrodes (10A, 10B).

[0151] With this configuration, the first surface mount component (3) and the second surface mount component (4) are arranged to overlap in the thickness direction (D1) of the mounting substrate (2), so that the high-frequency module (1) can be miniaturized.

[0152] Furthermore, the base portion of the first surface mount component (3) (the portion between the pair of first electrodes (32A, 32B)) and the second surface mount component (4) do not overlap in the thickness direction (D1) of the mounting substrate (2). Therefore, when the first surface mount component (3) is an inductor (L1), the magnetic field (K1) generated by the first surface mount component (3) can be suppressed from being disturbed by the second surface mount component (4). In other words, the deterioration of the Q value of the inductor (L1) can be suppressed.

[0153] In the high-frequency module (1) of the second embodiment, as in the first embodiment, the second surface-mount component (4) is arranged on the second main surface (2b) of the mounting substrate (2) such that, in a plan view from the thickness direction (D1) of the mounting substrate (2), it fits within the area of ​​one of the first land electrodes (10A).

[0154] With this configuration, the first surface-mount component (3) and the second surface-mount component (4) completely overlap in the thickness direction (D1) of the mounting substrate (2), so the high-frequency module (1) can be further miniaturized.

[0155] In the third embodiment of the high-frequency module (1), in the first embodiment, in a plan view from the thickness direction (D1) of the mounting substrate (2), the second surface mount component (4) has a pair of second electrodes (42A, 42B), one of which second electrode (42A) overlaps with one of the first land electrodes (10A), and the remaining second electrode (42B) is positioned on the outer periphery side of the first surface mount component (3).

[0156] With this configuration, the first surface mount component (3) and one of the second electrodes (42A) of the second surface mount component (4) overlap in the thickness direction (D1) of the mounting substrate (2), thus enabling miniaturization of the high-frequency module (1).

[0157] Furthermore, since the remaining second electrode (42B) of the second surface mount component (4) is positioned on the outer periphery of the first surface mount component (3), the routing of the electrical circuit can be omitted for the portion of the second surface mount component (4) that is positioned on the outer periphery of the first surface mount component (3).

[0158] In the high-frequency module (1) of the fourth embodiment, in any one of the first to third embodiments, one second electrode (42A) of the second surface mount component (4) is connected to one second land electrode (13A) of a pair of second land electrodes (13A, 13B). One first land electrode (10A) and one second land electrode (13A) are connected by a via electrode (B1) provided inside the mounting substrate (2). In a plan view from the thickness direction (D1) of the mounting substrate (2), the via electrode (B1) is located in the overlapping region of one first land electrode (10A) and one second land electrode (13A).

[0159] This configuration allows for a shorter wiring path (consisting only of via electrodes (B1)) connecting the first surface-mount component (3) and the second surface-mount component (4), thereby improving the characteristics of the circuit including the first surface-mount component (3) and the second surface-mount component (4).

[0160] The fifth embodiment of the high-frequency module (1) further comprises, in any one of the first to fourth embodiments, a pair of third land electrodes (14A, 14B) and a third surface mount component (5). The pair of third land electrodes (14A, 14B) are provided on the second main surface (2b) of the mounting substrate (2). The third surface mount component (5) has a pair of third electrodes (52A, 52B) at both ends in the third longitudinal direction (Q31). The third surface mount component (5) is arranged on the second main surface (2b) of the mounting substrate (2) with the pair of third electrodes (52A, 52B) connected to the pair of third land electrodes (14A, 14B). In a plan view from the thickness direction (D1) of the mounting substrate (2), the width (W1) of the first surface mount component (3) in the first short direction (Q12) is greater than the length (M3) of the third surface mount component (5) in the third long direction (Q31). In a plan view from the thickness direction (D1) of the mounting substrate (2), the first long direction (Q11) of the first surface mount component (3) and the third long direction (Q31) of the third surface mount component (5) intersect each other. In a plan view from the thickness direction (D1) of the mounting substrate (2), one of the pair of third electrodes (52A, 52B) of the third surface mount component (5) (52A) overlaps with the other first land electrode (10B) of the pair of first land electrodes (10A, 10B), which is different from the other first land electrode (10A).

[0161] With this configuration, the high-frequency module (1) can be miniaturized when a third surface-mount component (5) is further included.

[0162] In the sixth embodiment of the high-frequency module (1), in the fifth embodiment, one of the pair of second electrodes (42A, 42B) of the second surface mount component (4), the second electrode (42A), overlaps with one of the pair of first land electrodes (10A, 10B) in a plan view from the thickness direction (D1) of the mounting substrate (2). The remaining second electrode (42B) protrudes from the first surface mount component (3) in the first short-side direction (Q12) of the first surface mount component (3) in a plan view from the thickness direction (D1) of the mounting substrate (2). The remaining second electrode (42B) is connected to the remaining first land electrode (10B) of the pair of first land electrodes (10A, 10B) via a first wiring electrode (H33). Of the pair of third electrodes (52A, 52B) of the third surface mount component (5), one third electrode (52A) overlaps with the remaining first land electrode (10B) in a plan view from the thickness direction (D1) of the mounting substrate (2). The remaining third electrode (52B) protrudes from the first surface mount component (3) in the first short-side direction (Q12) in a plan view from the thickness direction (D1) of the mounting substrate (2) in the opposite direction to the protrusion direction of the remaining second electrode (42B) in the first surface mount component (3). The remaining third electrode (52B) is connected to one of the first land electrodes (10A) via the second wiring electrode (H34).

[0163] With this configuration, the second surface mount component (4) and the third surface mount component (5) can be connected in parallel to the first surface mount component (3). In this case, the first wiring electrode (H33) can be shortened by the amount that the remaining second electrode (42B) protrudes from the first surface mount component (3). Also, the second wiring electrode (H34) can be shortened by the amount that the remaining third electrode (52B) protrudes from the first surface mount component (3).

[0164] The seventh embodiment of the high-frequency module (1) further comprises, in any one of the first to sixth embodiments, a pair of third land electrodes (14A, 14B) and a third surface mount component (5). The pair of third land electrodes (14A, 14B) are provided on the second main surface (2b) of the mounting substrate (2). The third surface mount component (5) has a pair of third electrodes (52A, 52B) at both ends in the third longitudinal direction (Q31). The third surface mount component (5) is positioned on the second main surface (2b) of the mounting substrate (2) with the pair of third electrodes (52A, 52B) connected to the pair of third land electrodes (14A, 14B). In a plan view from the thickness direction (D1) of the mounting substrate (2), the first longitudinal direction (Q11) of the first surface mount component (3) and the third longitudinal direction (Q31) of the third surface mount component (5) intersect each other. In a plan view from the thickness direction (D1) of the mounting substrate (2), one second electrode (42A) of at least one pair of second electrodes (42A, 42B) of the second surface mount component (4), and one third electrode (52A) of at least one pair of third electrodes (52A, 52B) of the third surface mount component (5), overlap with one first land electrode (10A, 10B) of the pair of first land electrodes (10A, 10B).

[0165] With this configuration, one first electrode (32A) of the first surface mount component (3) can be connected to one second electrode (42A) of the second surface mount component (4) and one third electrode (52A) of the third surface mount component (5) with the minimum component placement area.

[0166] The eighth aspect of the high-frequency module (1) further comprises, in the first aspect, a pair of third land electrodes (19A, 19B) and a third surface mount component (18). The pair of third land electrodes (19A, 19B) are provided on the first main surface (2a) of the mounting substrate (2). The third surface mount component (18) has a pair of third electrodes (182A, 182B) at both ends in the third longitudinal direction (Q41). The third surface mount component (18) is positioned on the first main surface (2a) of the mounting substrate (2) with the pair of third electrodes (182A, 182B) in contact with the pair of third land electrodes (19A, 19B). One of the pair of third land electrodes (19A) is positioned adjacent to one of the pair of first land electrodes (10A) of the pair of first land electrodes (10A, 10B). In a plan view from the thickness direction (D1) of the mounting substrate (2), of the pair of second electrodes (42A, 42B) of the second surface mount component (4), one second electrode (42A) overlaps with one first land electrode (10A), and the other second electrode (42B) overlaps with one third land electrode (19A).

[0167] In this configuration, when viewed from the thickness direction (D1) of the mounting substrate (2), the second surface-mount component (4) bridges the gap between the first surface-mount component (3) and the third surface-mount component (18). Therefore, when the first surface-mount component (3), the second surface-mount component (4), and the third surface-mount component (18) are connected in series in this order, the wiring electrodes can be made up only of via electrodes (B1, B3). Thus, the wiring electrodes can be made as short as possible.

[0168] The high-frequency module (1) of the ninth embodiment further comprises a diplexer (60) in any one of the first to eighth embodiments. The diplexer (60) has a low-pass filter (64), a high-pass filter (65), a first input / output section (61), a second input / output section (62), and a third input / output section (63). The low-pass filter (64) has two input / output sections (64a, 64b) and a plurality of inductors (L11 to L15). The high-pass filter (65) has two input / output sections (65a, 65b) and a plurality of inductors (L31 to L35). The first input / output section (61) is connected to one of the input / output sections (64a, 65a) of the low-pass filter (64) and the high-pass filter (65), respectively. The second input / output section (62) is connected to the remaining input / output section (64b) of the low-pass filter (64). The third input / output section (63) is connected to the remaining input / output section (65b) of the high-pass filter (65). The first surface-mount component (3) is one of the multiple inductors (L11 to L15) of the low-pass filter (64) connected to the first input / output section (61) or the second input / output section (62) (L11, L15), or one of the multiple inductors (L31 to L35) of the high-pass filter (65) connected to the first input / output section (61) or the third input / output section (63) (L31, L35).

[0169] With this configuration, the effects of the first to seventh embodiments can be achieved when the first surface mount component (3) is an inductor (L11, L15, L31, L35).

[0170] 1 High-frequency module 2 Mounting board 2a First main surface 2b Second main surface 3 First surface mount component 4 Second surface mount component 5 Third surface mount component 6 First resin layer 7 Second resin layer 9 Fourth surface mount component 10A, 10B First land electrode 13A, 13B Second land electrode 14A, 14B Third land electrode 15 External terminal 15a Output terminal 15b Input terminal 15c, 15d Ground terminal 16A, 16B Fourth land electrode 18 Fourth surface mount component (third surface mount component) 19A, 19B Fourth land electrode (third land electrode) E1-E6, E11-E16, E21-E26, E31-E36 Circuit 31 First main body 32A, 32B First electrode E34-E36 Circuit 41 Second main body 42A, 42B Second electrode 51 Third main body 52A, 52B Third electrode 60 Diplexer 61 First input / output section 62 Second input / output section 63 Third input / output section 64 Low-pass filter 64a, 64b Input / output section 65 High-pass filter 65a, 65b Input / output section 91 Fourth main body 92A, 92B Fourth electrode 181 Fourth main body 182A, 182B Fourth electrode (third electrode) B1-B3, B11, B12 Via electrodes C1-C3, C11-C22, C31-C37 Capacitor D1 Thickness direction H1-H4, H11-H14, H31-H34 Wiring electrodes K1, K2 Magnetic field L1, L2, L11-L15, L31-L35 Inductor N11-N18, N31-N33 Branching point Q11 First longitudinal direction Q12 First short direction Q21 Second longitudinal direction Q31 Third longitudinal direction Q41 Fourth longitudinal direction (Third longitudinal direction) M2, M3 Length W1 Width

Claims

A mounting substrate having a first main surface and a second main surface facing each other, A pair of first land electrodes provided on the first main surface of the mounting substrate, A pair of second land electrodes provided on the second main surface of the aforementioned mounting substrate, A first surface mount component having a pair of first electrodes provided at both ends in the first longitudinal direction, A second surface mount component having a pair of second electrodes provided at both ends in the second longitudinal direction, The first surface mount component is arranged on the first main surface of the mounting substrate with the pair of first electrodes connected to the pair of first land electrodes. The second surface mount component is arranged on the second main surface of the mounting substrate with the pair of second electrodes connected to the pair of second land electrodes. In a plan view from the thickness direction of the mounting substrate, the width of the first surface-mount component in the first short direction intersecting the first longitudinal direction is greater than the length of the second surface-mount component in the second longitudinal direction. In a plan view of the mounting substrate from the thickness direction, the first longitudinal direction of the first surface-mount component and the second longitudinal direction of the second surface-mount component intersect each other. In a plan view of the mounting substrate from the thickness direction, at least one of the pair of second electrodes of the second surface mount component overlaps with one of the pair of first land electrodes. High-frequency module. 　 In a plan view of the mounting substrate from the thickness direction, the second surface-mount component is positioned on the second main surface of the mounting substrate such that it fits within the region of the first land electrode. The high-frequency module according to claim 1. 　 In a plan view of the mounting substrate from the thickness direction, the second surface mount component is such that one of the pair of second electrodes overlaps with the one first land electrode, and the remaining second electrode is positioned on the outer periphery side of the first surface mount component. The high-frequency module according to claim 1. 　 The first second electrode of the second surface mount component is connected to one of the second land electrodes of the pair of second land electrodes. The first land electrode and the second land electrode are connected by via electrodes provided inside the mounting substrate. In a plan view of the aforementioned mounting substrate from the thickness direction, the via electrode is positioned in the overlapping region of the one first land electrode and the one second land electrode. A high-frequency module according to any one of claims 1 to 3. 　 A pair of third land electrodes provided on the second main surface of the aforementioned mounting substrate, The third surface mount component further comprises a pair of third electrodes at both ends in the third longitudinal direction, The third surface mount component is arranged on the second main surface of the mounting substrate with the pair of third electrodes connected to the pair of third land electrodes. In a plan view of the mounting substrate from the thickness direction, the width of the first surface mount component in the first short direction is greater than the length of the third surface mount component in the third long direction. In a plan view of the mounting substrate from the thickness direction, the first longitudinal direction of the first surface-mount component and the third longitudinal direction of the third surface-mount component intersect each other. In a plan view of the mounting substrate from the thickness direction, at least one of the pair of third electrodes of the third surface mount component overlaps with the remaining first land electrode of the pair of first land electrodes, which is different from the one first land electrode. A high-frequency module according to any one of claims 1 to 4. 　 Of the pair of second electrodes of the second surface mount component, One of the second electrodes, when viewed in plan from the thickness direction of the mounting substrate, overlaps with one of the pair of first land electrodes. The remaining second electrode protrudes from the first surface mount component in the first short-side direction of the first surface mount component when viewed in plan from the thickness direction of the mounting substrate, and the remaining second electrode is connected to the remaining first land electrode of the pair of first land electrodes via the first wiring electrode. Of the pair of third electrodes of the third surface mount component, One of the third electrodes overlaps with the remaining first land electrode when viewed in plan from the thickness direction of the mounting substrate. The remaining third electrode protrudes from the first surface mount component in the first short-side direction in a plan view of the mounting substrate from the thickness direction, in the direction opposite to the protrusion direction of the remaining second electrode, and the remaining third electrode is connected to one of the first land electrodes via a second wiring electrode. The high-frequency module according to claim 5. 　 A pair of third land electrodes provided on the second main surface of the aforementioned mounting substrate, The third surface mount component further comprises a pair of third electrodes at both ends in the third longitudinal direction, The third surface mount component is arranged on the second main surface of the mounting substrate with the pair of third electrodes connected to the pair of third land electrodes. In a plan view of the mounting substrate from the thickness direction, the first longitudinal direction of the first surface-mount component and the third longitudinal direction of the third surface-mount component intersect each other. In a plan view of the mounting substrate from the thickness direction, at least one second electrode of the pair of second electrodes of the second surface mount component, and at least one third electrode of the pair of third electrodes of the third surface mount component, overlap with one first land electrode of the pair of first land electrodes. A high-frequency module according to any one of claims 1 to 6. 　 A pair of third land electrodes provided on the first main surface of the mounting substrate, The third surface mount component further comprises a pair of third electrodes at both ends in the third longitudinal direction, The third surface mount component is arranged on the first main surface of the mounting substrate with the pair of third electrodes in contact with the pair of third land electrodes. One of the pair of third land electrodes is positioned adjacent to one of the pair of first land electrodes. In a plan view of the mounting substrate from the thickness direction, of the pair of second electrodes of the second surface mount component, one second electrode overlaps with the one first land electrode, and the other second electrode overlaps with the one third land electrode. The high-frequency module according to claim 1. 　 Equipped with Diplexa, The aforementioned diplexer is A low-pass filter having two input / output sections and multiple inductors, A high-pass filter having two input / output sections and multiple inductors, A first input / output unit connected to one of the input / output units of the low-pass filter and the high-pass filter, A second input / output section connected to the remaining input / output section of the low-pass filter, It has a third input / output section connected to the remaining input / output sections of the high-pass filter, The first surface-mount component is an inductor connected to the first input / output section or the second input / output section among the plurality of inductors of the low-pass filter, or an inductor connected to the first input / output section or the third input / output section among the plurality of inductors of the high-pass filter. A high-frequency module according to any one of claims 1 to 8.

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