Liquid cooling structure

Abstract

A liquid cooling structure for cooling an object to be cooled, according to an embodiment of the present invention, comprises: a microchannel unit for exchanging heat, by means of a cooling liquid, with an object to be cooled; a cover unit comprising an inlet for introducing the cooling liquid into the liquid cooling structure and an outlet for discharging the cooling liquid from the liquid cooling structure; and a manifold unit formed to allow the cooling liquid to flow between the cover unit and the microchannel, wherein the microchannel unit includes a plate layer in contact with the cooling liquid and a microchannel layer formed on the plate layer to have a first microchannel, in which the cooling liquid flows, formed therein. The liquid cooling structure according to the present invention allows a flow of the cooling liquid to be effectively distributed in the microchannel unit such that the object to be cooled can be uniformly cooled, thereby lowering the maximum temperature of the object to be cooled.

Description

Liquid cooling structure

[0001] The present invention relates to a liquid cooling structure, more specifically, to a structure that cools a target object, such as a semiconductor chip, through a liquid by utilizing microchannels.

[0002] A recent key topic in the technological advancement of modern industry is heat control. For instance, as the computational load on semiconductor chips increases and chip manufacturing processes shrink, power density (heat generation per unit area) is rising. Consequently, conventional air cooling methods, which have low heat transfer rates, face limitations in controlling the heat generated by semiconductor chips. In particular, air cooling methods require large-scale air conditioning equipment, presenting limitations in terms of noise and space utilization. To address these issues, cooling systems utilizing liquid cooling structures are being actively adopted. Furthermore, liquid cooling is being utilized to cool secondary batteries in electric vehicles, and research is being conducted on liquid cooling methods to control the thermal runaway phenomenon in secondary batteries, which has recently become a significant concern. As such, liquid cooling can be applied across a wide range of technological fields.

[0003] In the proposed liquid cooling structure, it is important to reduce thermal resistance between the object to be cooled and the liquid coolant. Specifically, a technology is required to increase thermal conductivity while reducing the distance between the liquid coolant and the object to be cooled.

[0004] [Prior Art Literature]

[0005] [Patent Literature]

[0006] (Patent Document 1) Republic of Korea Registered Patent Publication No. 10-2659553

[0007] The present invention aims to solve the above-mentioned problems by providing a liquid cooling structure capable of effectively cooling heat generated from a cooling target.

[0008] In addition, the present invention aims to provide a structure of a microchannel that enables a cooling liquid to effectively obtain a heat exchange effect in the microchannel.

[0009] In addition, the present invention aims to provide a method for effectively fabricating the structure of a microchannel.

[0010] A liquid cooling structure according to one embodiment of the present invention is a liquid cooling structure for cooling a target object, comprising a microchannel portion that exchanges heat with a target object through a cooling liquid, a cover portion including an inlet for introducing the cooling liquid into the liquid cooling structure and an outlet for discharging the cooling liquid from the liquid cooling structure, and a manifold portion formed to allow the cooling liquid to flow between the cover portion and the microchannel portion, wherein the microchannel portion comprises a plate layer in contact with the target object and a microchannel layer formed on the plate layer, wherein a first microchannel through which the cooling liquid flows is formed.

[0011] In a liquid cooling structure according to one embodiment of the present invention, the first microchannel may be characterized by having a plurality of channels formed in parallel and penetrating the microchannel layer in the thickness direction.

[0012] In a liquid cooling structure according to one embodiment of the present invention, the plurality of first microchannels may be characterized by having a width that becomes smaller as it approaches the center of the microchannel portion.

[0013] In a liquid cooling structure according to one embodiment of the present invention, the plate layer may include a second microchannel formed in a groove shape in the thickness direction on the upper surface of the plate layer at a position corresponding to the first microchannel so as to be in communication with the first microchannel.

[0014] In a liquid cooling structure according to one embodiment of the present invention, the aspect ratio of the width of the microchannel formed by combining the first microchannel and the second microchannel and the height in the thickness direction can be formed to be 0.5 or higher.

[0015] In a liquid cooling structure according to one embodiment of the present invention, the microchannel portion may be characterized by being formed by stacking a plurality of the microchannel layers.

[0016] In a liquid cooling structure according to another embodiment of the present invention, the microchannel layer may be characterized by being formed as a protrusion protruding in the thickness direction on the plate layer.

[0017] In a liquid cooling structure according to another embodiment of the present invention, the protrusion may include a micro-fin array in which a plurality of micro-fins are formed protruding in the thickness direction on the plate layer.

[0018] In a liquid cooling structure according to another embodiment of the present invention, the protrusion may be composed of a plurality of types of micro-fin arrays having different diameters and heights of the micro-fins.

[0019] In a liquid cooling structure according to another embodiment of the present invention, the aspect ratio of the width of the micro fin and the height in the thickness direction may be formed to be 0.5 or more and 50 or less.

[0020] A method for manufacturing a microchannel portion of a liquid cooling structure according to an embodiment of the present invention comprises the steps of: laminating a plate layer made of copper material and a microchannel layer made of stainless steel material; forming a first microchannel by pattern etching the microchannel layer; and forming a second microchannel by etching the plate layer using a sandblasting method with the first microchannel as a mask.

[0021] In a method for manufacturing a microchannel portion of a liquid cooling structure according to an embodiment of the present invention, in the step of forming the first microchannel, the pattern etching may be performed using any one of laser etching, chemical etching, and mechanical etching.

[0022] In a method for manufacturing a microchannel portion of a liquid cooling structure according to one embodiment of the present invention, the aspect ratio of the width of the microchannel formed by combining the first microchannel and the second microchannel and the height in the thickness direction can be formed to be 0.5 or higher.

[0023] A method for manufacturing a microchannel of a liquid cooling structure according to another embodiment of the present invention comprises the steps of: soldering the surface of the micro-fins made of copper material; aligning the micro-fins on the plate layer to form a micro-fin array; and melting the solder plating to bond the micro-fins onto the plate layer.

[0024] The liquid cooling structure according to the present invention allows the flow rate of the cooling liquid to be effectively distributed in the microchannel section, thereby enabling uniform cooling of the object to be cooled and lowering the maximum temperature of the object to be cooled.

[0025] The method for manufacturing a microchannel portion of a liquid cooling structure according to the present invention enables the effective manufacturing of a microchannel portion structure that uniformly and effectively cools a cooling target object, and specifically derives a method for forming microchannels in the micro-unit range.

[0026] FIG. 1 is a conceptual diagram of a liquid cooling structure according to an embodiment of the present invention;

[0027] FIG. 2 is a top view of a microchannel portion of a liquid cooling structure according to an embodiment of the present invention;

[0028] FIGS. 3 and 4 are cross-sectional side views of a microchannel portion of a liquid cooling structure according to an embodiment of the present invention;

[0029] FIGS. 5 and 6 are flowcharts of a method for manufacturing a microchannel portion of a liquid cooling structure according to an embodiment of the present invention;

[0030] FIG. 7 is a perspective view of a microchannel portion of a liquid cooling structure according to another embodiment of the present invention;

[0031] FIG. 8 is a cross-sectional side view of a microchannel portion of a liquid cooling structure according to another embodiment of the present invention;

[0032] FIG. 8 is a top view of a microchannel portion of a liquid cooling structure according to another embodiment of the present invention; and

[0033] FIG. 10 is a cross-sectional side view of a microchannel portion of a liquid cooling structure according to another embodiment of the present invention.

[0034] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. The present invention is not limited to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0035] In this document, expressions such as "have," "can have," "include," or "can include" refer to the existence of the relevant feature (e.g., numerical values, functions, actions, or components, etc.) and do not exclude the existence of additional features.

[0036] In this document, expressions such as “A or B,” “at least one of A or / and B,” or “one or more of A or / and B” may include all possible combinations of items listed together. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” may refer to cases including (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0037] As used in this document, the expression "configured to" may be replaced, depending on the context, with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to."

[0038] The terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embodiments of this document.

[0039] Therefore, it should be understood that the configurations of the embodiments described in this specification are merely some of the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, and that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0040] Throughout the specification, when a part is described as “comprising” a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0041] The objects, specific advantages, and novel features of the invention described herein will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. It should be noted that in assigning reference numbers to the components of each drawing in this specification, the same components are assigned the same number whenever possible, even if they are shown in different drawings. Furthermore, terms such as "one side," "other side," "first," and "second" are used to distinguish one component from another, and the components are not limited by these terms. In the following description of the invention, detailed descriptions of related prior art that may unnecessarily obscure the essence of the invention are omitted.

[0042] Hereinafter, an embodiment of the present invention will be described in detail with reference to the attached drawings, and the same reference numerals indicate the same components.

[0043]

[0044] Hereinafter, with reference to the drawings, a method for manufacturing a liquid cooling structure (1) and a microchannel section (100) according to the present invention is described.

[0045]

[0046] FIG. 1 is a conceptual diagram of a liquid cooling structure (1) according to an embodiment of the present invention.

[0047]

[0048] A liquid cooling structure (1) according to one embodiment of the present invention is a liquid cooling structure (1) for cooling a target object, comprising a microchannel section (100) that exchanges heat with a target object through a cooling liquid, a cover section (200) that includes an inlet (210) for introducing the cooling liquid into the liquid cooling structure (1) and an outlet (220) for discharging the cooling liquid from the liquid cooling structure (1), and a manifold section (300) formed to allow the cooling liquid to flow between the cover section (200) and the microchannel section (100). The microchannel section (100) comprises a plate layer (110) that contacts the target object and a microchannel layer (120) formed on the plate layer (110) such that a first microchannel (131) through which the cooling liquid flows is formed.

[0049]

[0050] A liquid cooling structure (1) according to one embodiment of the present invention includes a microchannel section (100), a cover section (200), and a manifold section (300).

[0051] Looking at FIG. 1, it can be seen that a microchannel section (100), a manifold section (300), and a cover section (200) are formed in sequence. In a liquid cooling structure (1) according to an embodiment of the present invention, a cooling target such as a semiconductor chip is formed in the direction in which the microchannel section (100) is formed. Therefore, direct heat exchange occurs between the cooling target and the microchannel section (100). The microchannel section (100) has many micro-sized channels formed therein, and by maximizing the contact surface between the microchannel section (100) and the cooling target, it can perform the role of maximizing the heat exchange efficiency between the cooling liquid (L) flowing through the microchannel section (100) and the cooling target.

[0052] The manifold section (300) refers to a member having a plurality of pipes formed therein to supply cooling liquid between the cover section (200) and the microchannel section (100). The manifold section (300) may include an inlet pipe section and an outlet pipe section. The inlet pipe section allows the inlet cooling liquid to move from the cover section to the microchannel section, and the outlet pipe section allows it to move in the opposite direction from the microchannel section to the cover section.

[0053] The cover portion (200) includes an inlet (210) for introducing an inflow cooling liquid into the liquid cooling structure (1) and an outlet (220) for discharging an outflow cooling liquid from the liquid cooling structure (1). Accordingly, the cover portion (200) forms the largest volume of the liquid cooling structure (1) and must be equipped with an effective structure for effective supply and discharge of cooling liquid to the manifold portion (300) and the microchannel portion (100). The inlet (210) and outlet (220) of the cover portion (200) may have various arrangements.

[0054]

[0055] A microchannel portion (100) of a liquid cooling structure (1) according to one embodiment of the present invention includes a plate layer (110) and a microchannel layer (120).

[0056] Here, the plate layer (110) may be a plate included in the liquid cooling structure (1) or may be the back surface of the object to be cooled. In the embodiments of the present invention below, the plate layer (110) is described as a layer in contact with the object to be cooled, but separately, it is obvious that the plate layer (110) itself can be the object to be cooled.

[0057] Referring to FIG. 3, the plate layer (110) is a layer that contacts the object to be cooled and supports the lower end of the microchannel portion (110) in the thickness direction. The microchannel layer (120) is formed on the plate layer (110), and a first microchannel (131) through which the cooling liquid flows is formed.

[0058]

[0059] In a liquid cooling structure (1) according to one embodiment of the present invention, the first microchannel (131) may be characterized by being formed in a plurality of parallels and penetrating the microchannel layer (120) in the thickness direction.

[0060]

[0061] Looking at FIGS. 1 and 2, it can be seen that a plurality of microchannels (130) are formed in a parallel straight line shape. As the cooling liquid flows along the microchannels (130), it exchanges heat with the object to be cooled through the plate layer (110).

[0062] Looking at FIGS. 3 and 4, it can be seen that the first microchannel (131) penetrates the microchannel layer (120) in the thickness direction, and the cooling liquid can flow through the straight hole formed in the thickness direction.

[0063]

[0064] In a liquid cooling structure (1) according to one embodiment of the present invention, the plurality of first microchannels (131) may be characterized in that their width becomes smaller as they get closer to the center of the microchannel section (100).

[0065]

[0066] Depending on the position of the inlet pipe section in the manifold section (300), the flow rate of the cooling liquid may vary at each position in the microchannel section (100). Preferably, the position of the inlet pipe section in the manifold section (300) may be formed in the lateral direction. In this case, the flow rate in the lateral direction increases compared to the central direction of the microchannel section (100). Therefore, in order to maintain a flow rate greater than a certain speed to maximize cooling efficiency and to increase the flow rate in the central direction of the microchannel section (100), the width of the microchannel (130) may be formed to be smaller as it gets closer to the center of the microchannel section (100). Additionally, the distance between the microchannels (130) may also be smaller as it gets closer to the center of the microchannel section (100), but is not limited thereto.

[0067] According to another embodiment of the present invention, when the position of the inlet pipe section in the manifold section (300) is formed at the center, the width of the microchannel (130) may decrease as it moves laterally toward the microchannel section (100) in order to increase the lateral flow velocity and flow rate of the microchannel section (100).

[0068]

[0069] In a liquid cooling structure (1) according to one embodiment of the present invention, the plate layer (110) may include a second microchannel (132) formed in a groove shape in the thickness direction on the upper surface of the plate layer (110) at a position corresponding to the first microchannel (131) so as to be in communication with the first microchannel (131).

[0070]

[0071] Looking at FIG. 3 (c) and (d), it can be seen that a groove is formed in the upper surface of the plate layer (110) in the direction of the second microchannel (132). The second microchannel (132) is formed to be in communication with the first microchannel (131) and is formed to correspond to the position of the first microchannel (131), so that, as can be seen in FIG. 3 (c) and (d), the first microchannel (131) and the second microchannel (132) can be formed as one microchannel (130).

[0072]

[0073] In a liquid cooling structure (1) according to one embodiment of the present invention, the aspect ratio of the width of the microchannel (130) formed by combining the first microchannel (131) and the second microchannel (132) and the height in the thickness direction can be formed to be 0.5 or higher.

[0074]

[0075] Referring to FIG. 4, a microchannel (130) according to one embodiment of the present invention is formed by combining a first microchannel (131) and a second microchannel (132), and the aspect ratio of the microchannel (130) is formed as b / a (height of the microchannel / width of the microchannel (based on maximum width)). At this time, when the aspect ratio of the microchannel (130) is formed to be 0.5 or higher, the contact area of ​​the cooling liquid with respect to the microchannel portion (100) is increased, thereby increasing cooling efficiency. However, if the aspect ratio b / a of the microchannel (130) exceeds 7, the flow of the cooling liquid in the microchannel (130) may be obstructed by capillary action, etc. More preferably, the aspect ratio b / a of the microchannel (130) may be formed to be 3 to 6.

[0076] As shown in FIG. 4, the cross-sectional area of ​​the second microchannel (132) can be changed depending on the situation. That is, when the cross-sectional area of ​​the second microchannel (132) is formed as a rectangle in the design and the cross-section of the microchannel (130) is formed as a rectangle, the aspect ratio b / a exceeds 7. In this case, the cross-sectional area of ​​the second microchannel (132) can be changed to a circular shape to lower the aspect ratio, thereby facilitating the flow of the coolant.

[0077] In addition, when the aspect ratio of the microchannel (130) is b / a' (height of the microchannel / width of the microchannel (based on minimum width)), the aspect ratio can be lowered by forming the width of the cross-sectional area of ​​the second microchannel (132) to exceed a', thereby facilitating the flow of the cooling liquid. At this time, the shape of the cross-sectional area of ​​the second microchannel (132) can be formed in a circular or elliptical shape.

[0078] Conversely, if the aspect ratio b / a of the microchannel (132) is formed to be 1.5 to 3 in the design, the width of the second microchannel (132) is gradually reduced as it goes downward in the thickness direction, thereby reducing the cross-sectional area and inducing an increase in the flow rate of the cooling liquid.

[0079]

[0080] In a liquid cooling structure (1) according to one embodiment of the present invention, the microchannel portion (100) may be characterized by being formed by stacking a plurality of the microchannel layers (120).

[0081]

[0082] Looking at FIG. 3(b), it can be seen that a plurality of microchannel layers (120) according to an embodiment of the present invention can be formed and stacked. That is, a plurality of microchannel layers (120) can be stacked to design the aspect ratio b / a of the microchannel (132) to a desired range.

[0083]

[0084] A method for manufacturing a microchannel portion (100) of a liquid cooling structure (1) according to an embodiment of the present invention comprises the steps of: laminating a plate layer (110) made of copper material and a microchannel layer (120) made of stainless steel material; forming a first microchannel (131) by pattern etching the microchannel layer (120); and forming a second microchannel (132) by etching the plate layer (110) by a sandblasting method using the first microchannel (131) as a mask.

[0085] In a method for manufacturing a microchannel portion (100) of a liquid cooling structure (1) according to an embodiment of the present invention, in the step of forming the first microchannel (131), the pattern etching may be performed using any one of laser etching, chemical etching, and mechanical etching.

[0086] In a method for manufacturing a microchannel portion (100) of a liquid cooling structure (1) according to one embodiment of the present invention, the aspect ratio of the width and the height in the thickness direction of the microchannel (130) formed by combining the first microchannel (131) and the second microchannel (132) can be formed to be 1.5 or more.

[0087]

[0088] The material of the plate layer (110) has a higher hardness than the material of the microchannel layer (120), so the plate layer (110) can serve as a mask for the microchannel layer (120) during the sandblasting process. Therefore, the fletched layer (110) can be formed of a material that is harder than the microchannel layer (120).

[0089] FIG. 5 is a flowchart for manufacturing a microchannel section (100) according to an embodiment of the present invention.

[0090] First, the plate layer (110) may be made of copper and the microchannel layer (120) may be made of stainless steel. At this time, the plate layer (110) and the microchannel layer (120) are laminated, and in the lamination step, dissimilar metals are joined together using brazing technology.

[0091] Subsequently, pattern etching is performed on the microchannel layer (120) using a mask. The mask is formed with a pattern identical to the planar cross-sectional area of ​​the microchannel (130). Pattern etching can be performed using any one of laser etching, chemical etching, and mechanical etching.

[0092] Afterward, sandblasting is performed on the microchannel layer (120) to form a second microchannel (132) of the plate layer (110). At this time, the pattern of the microchannel layer (120) acts as a mask so that the microchannel layer (120), which is made of stainless steel, is not etched, while the plate layer (110), which is made of copper, is etched. In addition, when the sandblasting process is performed, the microchannel layer (120) is pressed so that the microchannel layer (120) and the plate layer (110) are strongly adhered to each other, thereby increasing the process yield of the microchannel section (100).

[0093]

[0094] As shown in FIG. 6, the order of manufacturing the microchannel portion (100) according to one embodiment of the present invention may be changed.

[0095] That is, before laminating the microchannel layer (120) and the plate layer (110), the microchannel layer (120) can first be pattern-etched using a mask. After that, the lamination process and the sandblasting process can be performed.

[0096]

[0097] In a liquid cooling structure (1) according to another embodiment of the present invention, the microchannel layer (120) may be characterized by being formed as a protrusion (140) that protrudes in the thickness direction on the plate layer (110).

[0098]

[0099] According to another embodiment of the present invention, the microchannel layer (120) of the liquid cooling structure (1) may be formed as a protrusion (140) and may be formed protruding on the plate layer (110) as shown in FIG. 7. Accordingly, the first microchannel (130) may be formed as a space between the protrusions (140).

[0100]

[0101] In a liquid cooling structure (1) according to another embodiment of the present invention, the protrusion (140) may include a micro-fin array (140a) in which a plurality of micro-fins (141) are formed protruding in the thickness direction on the plate layer (110).

[0102] In a liquid cooling structure (1) according to another embodiment of the present invention, the protrusion (140) may be composed of a plurality of types of micro-fin arrays (140a) having different diameters and heights of the micro-fins (141).

[0103]

[0104] A protrusion (140) according to another embodiment of the present invention may include a micro-pin array (140a) on a plate layer (110). Here, the micro-pin array (140a) means that a plurality of micro-pins (141) of the same type are formed in a certain area on the plate layer (110).

[0105] In addition, according to another embodiment of the present invention, a protrusion (140) may be formed with a plurality of types of micro-fin arrays (140a) having different diameters and heights of the micro-fins (141). Referring to FIG. 9, a micro-fin array (140a) of different types may be formed depending on the position on the plate layer (110). For example, when the inlet pipe of the manifold section (300) enters laterally, a small flow rate may be formed at the center of the micro-channel section (100). Accordingly, a micro-fin array (140a) composed of a plurality of micro-fins (141) of a type that has a smaller diameter and a larger aspect ratio closer to the center of the plate layer (110) may be formed.

[0106]

[0107] In a liquid cooling structure (1) according to another embodiment of the present invention, the aspect ratio of the width of the micro fin (141) and the height in the thickness direction may be formed to be 0.5 or more and 50 or less.

[0108]

[0109] Referring to FIG. 10, the aspect ratio of the micro fin (141) according to one embodiment of the present invention is formed as b / a (height of the micro fin / width of the micro fin (based on maximum width)). At this time, when the aspect ratio of the micro fin (141) is formed to be 0.5 or higher, the contact area of ​​the cooling liquid with respect to the microchannel portion (100) is increased, thereby increasing the cooling efficiency. However, if the aspect ratio of the micro fin (141) exceeds 50, the flow of the cooling liquid in the first microchannel (131) may be obstructed by capillary action, etc. More preferably, the aspect ratio of the micro fin (141) may be formed to be 1.5 to 7.

[0110] Looking at FIG. 10, the cross-sectional area of ​​the micro-pin (141) can be changed depending on the situation. That is, the aspect ratio of the micro-pin (141) can be changed depending on the area where the micro-pin array (140a) is placed, and accordingly, a micro-pin (141) of a different shape can be formed as shown in FIG. 10.

[0111]

[0112] A method for manufacturing a microchannel portion (100) of a liquid cooling structure (1) according to another embodiment of the present invention comprises the steps of: solder plating (142) on the surface of the micro-fin (141) made of copper material; aligning the micro-fin (141) on the plate layer (110) to form a micro-fin array (140a); and melting the solder plating (142) to bond the micro-fin (141) onto the plate layer (110).

[0113]

[0114] As shown in FIG. 8, the surface of the micro pin (141) according to another embodiment of the present invention is soldered (142), so as to bond the micro pin (141) onto the plate layer (110).

[0115]

[0116] Although the present invention has been described in detail through specific embodiments, this is for the purpose of specifically explaining the invention, and the invention is not limited thereto. It will be apparent that modifications or improvements can be made by those skilled in the art within the technical scope of the invention.

[0117] All simple variations or modifications of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be clarified by the appended claims.

[0118] [Explanation of the symbol]

[0119] 1 : Liquid cooling structure

[0120] 100 : Microcircle

[0121] 110 : Plate layer

[0122] 120 : Microchannel layer

[0123] 130 : Microeuro

[0124] 131 : 1st microchannel

[0125] 132 : Second microchannel

[0126] 140 : Protrusion

[0127] 140a: Micro-pin array

[0128] 141 : Micro pin

[0129] 142 : Solder plating

[0130] 200 : Cover part

[0131] 210 : Entrance

[0132] 220 : Exit

[0133] 300 : Manifold section

Claims

1. In a liquid cooling structure for cooling an object to be cooled, A microchannel that exchanges heat through a cooling target and a cooling liquid; A cover portion comprising an inlet for introducing the coolant into the liquid cooling structure and an outlet for discharging the coolant from the liquid cooling structure; and It includes a manifold portion formed to allow a cooling liquid to flow between the cover portion and the microchannel portion; The above microchannel section is, A plate layer in contact with the above-mentioned object to be cooled; and A liquid cooling structure comprising: a microchannel layer formed on the plate layer above, wherein a first microchannel is formed through which the cooling liquid flows.

2. In Claim 1, The above-mentioned first microchannel is, A liquid cooling structure characterized by multiple structures being formed in parallel and penetrating the microchannel layer in the thickness direction.

3. In Claim 2, The above plurality of first microchannels are, A liquid cooling structure characterized by having a width that becomes smaller closer to the center of the microchannel.

4. In Claim 2, The above plate layer is, A liquid cooling structure comprising: a second microchannel formed in the shape of a groove in the thickness direction on the upper surface of the plate layer at a position corresponding to the first microchannel so as to be in communication with the first microchannel.

5. In Claim 4, A liquid cooling structure formed such that the aspect ratio of the width of the microchannel formed by combining the first microchannel and the second microchannel and the height in the thickness direction is 0.5 or greater.

6. In Claim 2, The above microchannel section is, A liquid cooling structure characterized by being formed by stacking a plurality of the above-mentioned microchannel layers.

7. In Claim 1, The above microchannel layer is, A liquid cooling structure characterized by being formed as a protrusion protruding in the thickness direction on the above plate layer.

8. In Claim 7, The above protrusion is, A liquid cooling structure comprising a micro-fin array in which a plurality of micro-fins are formed protruding in the thickness direction on the above-mentioned plate layer.

9. In Claim 8, The above protrusion is, A liquid cooling structure composed of an array of multiple types of micro-fins with different diameters and heights.

10. In Claim 9, A liquid cooling structure characterized by the aspect ratio of the width of the micro-fin and the height in the thickness direction being formed to be 0.5 or more and 50 or less.

11. A method for manufacturing a microchannel portion of a liquid cooling structure according to Claim 4, A step of laminating the above plate layer made of copper material and the microchannel layer made of stainless steel material; A step of forming the first microchannel by pattern etching the microchannel layer; A method for manufacturing a microchannel portion of a liquid cooling structure, comprising the step of forming the second microchannel by etching the plate layer using the first microchannel as a mask.

12. In Claim 11, In the step of forming the first microchannel, A method for manufacturing a microchannel of a liquid-cooled structure, wherein the above pattern etching is performed using any one of laser etching, chemical etching, and mechanical etching.

13. In Claim 12, A method for manufacturing a microchannel portion of a liquid cooling structure, wherein the aspect ratio of the width of the microchannel formed by combining the first microchannel and the second microchannel and the height in the thickness direction is 1.5 or greater.

14. A method for manufacturing a microchannel portion of a liquid cooling structure according to any one of claims 7 to 10, A step of solder plating the surface of the micro-pin made of copper material; A step of aligning the micro-pins on the plate layer to form the micro-pin array; A method for manufacturing a microchannel of a liquid cooling structure, comprising the step of melting the solder plating and bonding the micro-fins onto the plate layer.

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