Liquid cooling structure

Abstract

An embodiment of the present invention relates to a liquid cooling structure for cooling an object to be cooled, the structure comprising: a microchannel unit for exchanging heat, by means of a cooling liquid, with an object to be cooled; a cover unit including an inlet for introducing, into the liquid cooling structure, a cooling liquid to be introduced and an outlet for discharging, from the liquid cooling structure, a cooling liquid to be discharged; and a manifold unit including an inlet pipe unit formed between the cover unit and the microchannel unit in the height direction of the liquid cooling structure to supply, from the cover unit to the microchannel unit, the cooling liquid to be introduced, and an outlet pipe unit for moving, from the microchannel unit to the cover unit, the cooling liquid to be discharged. The liquid cooling structure according to an embodiment of the present invention can effectively increase the supply amount of the cooling liquid entering the microchannel to cool the object to be cooled. To this end, the liquid cooling structure may be formed of a plurality of layers.

Description

Liquid cooling structure

[0001] The present invention relates to a liquid cooling structure, more specifically, to a structure that cools a target object, such as a semiconductor chip, through a liquid by utilizing microchannels.

[0002] A recent key topic in the technological advancement of modern industry is heat control. For instance, as the computational load on semiconductor chips increases and chip manufacturing processes shrink, power density (heat generation per unit area) is rising. Consequently, conventional air cooling methods, which have low heat transfer rates, face limitations in controlling the heat generated by semiconductor chips. In particular, air cooling methods require large-scale air conditioning equipment, presenting limitations in terms of noise and space utilization. To address these issues, cooling systems utilizing liquid cooling structures are being actively adopted. Furthermore, liquid cooling is being utilized to cool secondary batteries in electric vehicles, and research is being conducted on liquid cooling methods to control the thermal runaway phenomenon in secondary batteries, which has recently become a significant concern. As such, liquid cooling can be applied across a wide range of technological fields.

[0003] In the proposed liquid cooling structure, it is important to reduce thermal resistance between the object to be cooled and the liquid coolant. Specifically, a technology is required to increase thermal conductivity while reducing the distance between the liquid coolant and the object to be cooled.

[0004] [Prior Art Literature]

[0005] [Patent Literature]

[0006] (Patent Document 1) Republic of Korea Registered Patent Publication No. 10-2659553

[0007] The present invention aims to solve the above-mentioned problems by providing a liquid cooling structure capable of effectively cooling heat generated from a cooling target.

[0008] In addition, the present invention provides a liquid cooling structure capable of effectively supplying a cooling liquid to a microchannel formed between a liquid cooling liquid and a cooling target.

[0009] A liquid cooling structure according to one embodiment of the present invention comprises, in a liquid cooling structure for cooling a target object, a microchannel portion that exchanges heat with the target object through a cooling liquid; a cover portion including an inlet for introducing a cooling liquid into the liquid cooling structure and an outlet for discharging a cooling liquid from the liquid cooling structure; and a manifold portion formed between the cover portion and the microchannel portion in the height direction of the liquid cooling structure, comprising an inlet pipe portion for supplying the inlet cooling liquid from the cover portion to the microchannel portion and an outlet pipe portion for moving the discharged cooling liquid from the microchannel portion to the cover portion.

[0010] In a liquid cooling structure according to one embodiment of the present invention, the manifold portion may include a lower layer region adjacent to the microchannel portion and an upper layer region adjacent to the cover portion.

[0011] In a liquid cooling structure according to one embodiment of the present invention, the inlet pipe may include a microchannel contact area communicating with the microchannel in the lower layer region and a supply area formed in the upper layer region to supply the inlet cooling liquid to the microchannel contact area.

[0012] In a liquid cooling structure according to one embodiment of the present invention, the supply area may be formed as a pair to supply the incoming cooling liquid to both ends in the longitudinal direction of the microchannel contact area.

[0013] In a liquid cooling structure according to one embodiment of the present invention, the microchannel contact area may be formed such that the cross-sectional area of ​​one end and the other end in the longitudinal direction of the microchannel contact area is larger than the cross-sectional area of ​​the center in the longitudinal direction of the microchannel contact area.

[0014] In a liquid cooling structure according to one embodiment of the present invention, the cover portion may include an inlet space that is a space in which the inlet cooling liquid flows and is connected to the inlet portion and the inlet portion and an outlet space that is a space in which the discharge cooling liquid flows and is connected to the outlet portion and the discharge portion.

[0015] In a liquid cooling structure according to one embodiment of the present invention, the discharge pipe portion can move the discharged cooling liquid from the microchannel portion in the height direction across the upper layer region and the lower layer region to the discharge space.

[0016] In a liquid cooling structure according to one embodiment of the present invention, the manifold portion includes a first intermediate layer portion formed between the lower layer region and the upper layer region, and the inlet pipe portion may include a microchannel contact portion communicating with the microchannel portion in the lower layer region, a supply portion formed to penetrate the upper layer region, the first intermediate layer region, and the lower layer region to supply the inlet cooling liquid to the microchannel contact portion and formed as a pair to supply the inlet cooling liquid to both ends in the longitudinal direction of the microchannel contact portion, and a first buffer portion formed to extend from the supply portion along the longitudinal direction of the microchannel contact portion in the first intermediate layer region and communicating with the microchannel contact portion.

[0017] In a liquid cooling structure according to one embodiment of the present invention, the cover portion includes an inlet space that is a space for the inlet cooling liquid to flow through, and an outlet space that is a space for the discharge cooling liquid to flow through, and the outlet portion that is a space for the discharge cooling liquid to flow through, and the discharge pipe portion can move the discharge cooling liquid from the microchannel portion in the height direction through the upper layer region, the first intermediate layer region, and the lower layer region to the discharge space.

[0018] In a liquid cooling structure according to an embodiment of the present invention, the manifold portion includes a first intermediate layer region formed between the lower layer region and the upper layer region and a second intermediate layer region formed between the first intermediate layer region and the upper layer region, and the inlet pipe portion may include a microchannel contact region communicating with the microchannel portion in the lower layer region, an upper layer region formed to supply the inlet cooling liquid to the microchannel contact region, a second intermediate layer region formed to penetrate the second intermediate layer region and extend in the longitudinal direction of the microchannel contact region, a supply region formed as a pair on one side and the other side of the manifold portion, a second buffer region formed in the second intermediate layer region extending from the supply region along a direction perpendicular to the longitudinal direction of the microchannel contact region, and a first buffer region formed in the first intermediate layer region to communicate the second buffer region and the microchannel contact region with each other.

[0019] In a liquid cooling structure according to one embodiment of the present invention, the cover portion includes an inlet space that is a space for the inlet cooling liquid to flow through, which is a space for the inlet cooling liquid to flow through, and an outlet space that is a space for the discharge cooling liquid to flow through, which is a space for the outlet cooling liquid to flow through, which is a space for the discharge cooling liquid to flow through, and the discharge pipe portion may include a first discharge area that extends in a direction perpendicular to the length direction of the microchannel contact area, and a second discharge area that extends in a direction perpendicular to the length direction of the microchannel contact area, which moves the discharge cooling liquid from the microchannel portion to the first discharge area through the upper layer area and the first intermediate layer area.

[0020] In a liquid cooling structure according to one embodiment of the present invention, the manifold portion may be formed in a shape having a multilayer region including a lower layer region adjacent to the microchannel portion and an upper layer region adjacent to the cover portion; and the inlet pipe portion and the discharge pipe portion may be disposed in the multilayer region of the manifold portion, wherein the inlet pipe portion and the discharge pipe portion are formed so as not to communicate within the manifold portion.

[0021] A liquid cooling structure according to one embodiment of the present invention can effectively increase the supply amount of cooling liquid entering a microchannel to cool an object to be cooled. To this end, the liquid cooling structure may be formed in a plurality of layers.

[0022] In particular, the liquid cooling structure according to one embodiment of the present invention specifically derives a structure formed in the manifold portion of the liquid cooling structure to efficiently introduce the cooling liquid into the microchannel.

[0023] FIG. 1 is a conceptual diagram of a liquid cooling structure according to an embodiment of the present invention;

[0024] FIG. 2 is a detailed perspective view of the combined structure of a liquid cooling structure according to an embodiment of the present invention;

[0025] FIG. 3 is a conceptual diagram of the connection between the manifold section and the microchannel section of a liquid cooling structure according to an embodiment of the present invention;

[0026] FIGS. 4a to 4c show a manifold portion of a liquid cooling structure according to an embodiment of the present invention;

[0027] FIGS. 5a and 5b show a manifold portion of a liquid cooling structure according to an embodiment of the present invention;

[0028] FIGS. 6a and 6b show a manifold portion of a liquid cooling structure according to an embodiment of the present invention;

[0029] FIGS. 7a and 7b show a manifold portion of a liquid cooling structure according to an embodiment of the present invention;

[0030] FIGS. 8a and 8b illustrate a manifold portion of a liquid cooling structure according to an embodiment of the present invention; and

[0031] FIGS. 9a to 9 are manifold sections of a liquid cooling system according to an embodiment of the present invention.

[0032] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. The present invention is not limited to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0033] In this document, expressions such as "have," "can have," "include," or "can include" refer to the existence of the relevant feature (e.g., numerical values, functions, actions, or components, etc.) and do not exclude the existence of additional features.

[0034] In this document, expressions such as “A or B,” “at least one of A or / and B,” or “one or more of A or / and B” may include all possible combinations of items listed together. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” may refer to cases including (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0035] As used in this document, the expression "configured to" may be replaced, depending on the context, with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to."

[0036] The terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embodiments of this document.

[0037] Therefore, it should be understood that the configurations of the embodiments described in this specification are merely some of the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, and that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0038] Throughout the specification, when a part is described as “comprising” a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0039] The objects, specific advantages, and novel features of the invention described herein will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. It should be noted that in assigning reference numbers to the components of each drawing in this specification, the same components are assigned the same number whenever possible, even if they are shown in different drawings. Furthermore, terms such as "one side," "other side," "first," and "second" are used to distinguish one component from another, and the components are not limited by these terms. In the following description of the invention, detailed descriptions of related prior art that may unnecessarily obscure the essence of the invention are omitted.

[0040] Hereinafter, an embodiment of the present invention will be described in detail with reference to the attached drawings, and the same reference numerals indicate the same components.

[0041]

[0042] Hereinafter, a liquid cooling structure (1) according to the present invention will be described with reference to the drawings.

[0043]

[0044] FIG. 1 is a conceptual diagram of a liquid cooling structure (1) according to an embodiment of the present invention.

[0045]

[0046] A liquid cooling structure (1) according to one embodiment of the present invention comprises, in a liquid cooling structure (1) for cooling a target object, a microchannel section (100) that exchanges heat with a target object and a cooling liquid (L), a cover section (200) including an inlet (210) for introducing an inflow cooling liquid (L1) into the liquid cooling structure (1) and an outlet (220) for discharging a discharge cooling liquid (L2) from the liquid cooling structure (1), and a manifold section (300) formed between the cover section (200) and the microchannel section (100) and including an inflow pipe section (310) for supplying the inflow cooling liquid (L1) from the cover section (200) to the microchannel section (100) and a discharge pipe section (320) for moving the discharge cooling liquid (L2) from the microchannel section (100) to the cover section (200).

[0047]

[0048] A liquid cooling structure (1) according to one embodiment of the present invention includes a microchannel section (100), a cover section (200), and a manifold section (300).

[0049] Looking at FIG. 1, it can be seen that a microchannel section (100), a manifold section (300), and a cover section (200) are formed in sequence. In a liquid cooling structure (1) according to an embodiment of the present invention, a cooling target object, such as a semiconductor chip, is formed in the direction in which the microchannel section (100) is formed. Therefore, direct heat exchange occurs between the cooling target object and the microchannel section (100). The technical details of the manifold section (300) and the cover section (200) in the present invention are designed to ensure a structure that can effectively supply cooling liquid (L) to the microchannel section (100) to effectively maintain the flow rate of the cooling liquid and increase cooling efficiency. The microchannel section (100) has many micro-sized channels formed therein, and by maximizing the contact surface between the microchannel section (100) and the cooling target object, it can perform the role of maximizing the heat exchange efficiency between the cooling liquid (L) flowing through the microchannel section (100) and the cooling target object.

[0050] The manifold section (300) refers to a member having a plurality of pipes formed therein to supply a cooling liquid (L) between the cover section (200) and the microchannel section (100). Referring to FIG. 6, the manifold section (300) may include an inlet pipe section (310) and an outlet pipe section (320). The inlet pipe section (310) allows the inlet cooling liquid (L1) to move from the cover section (200) to the microchannel section (100), and the outlet pipe section (320) allows it to move in the opposite direction from the microchannel section (100) to the cover section (200). The formation positions of the inlet pipe section (310) and the outlet pipe section (320) in FIG. 6 may change depending on the shape of the cover section (200).

[0051] The cover portion (200) includes an inlet (210) for introducing an inflow cooling liquid (L1) into the liquid cooling structure (1) and an outlet (220) for discharging an outflow cooling liquid (L2) from the liquid cooling structure (1). Accordingly, the cover portion (200) forms the largest volume of the liquid cooling structure (1) and must be equipped with an effective structure for the effective supply and discharge of cooling liquid (L) to the manifold portion (300) and the microchannel portion (100). The inlet (210) and outlet (220) of the cover portion (200) may have various arrangements.

[0052]

[0053] In a liquid cooling structure (1) according to one embodiment of the present invention, the manifold portion (300) may include a lower layer region (301) adjacent to the microchannel portion (100) and an upper layer region (302) adjacent to the cover portion (200).

[0054]

[0055] A manifold portion (300) of a liquid cooling structure (1) according to one embodiment of the present invention may include a lower region (301) and an upper region (302).

[0056]

[0057] Referring to FIG. 3 and FIG. 5a, the manifold section (300) of the liquid cooling structure (1) according to one embodiment of the present invention may include an upper region (302) and a lower region (301). The upper region (302) is located upward from the manifold section (300) and is adjacent to the cover section (200). The lower region (301) of the manifold section (300) is located downward from the manifold section (300) and is formed adjacent to the microchannel section (100). A plurality of tubes may be formed in the manifold section (300), and the plurality of tubes are intended to effectively supply cooling liquid (L) to the microchannel section (300). To this end, the plurality of tubes in the manifold section (300) are efficiently arranged in each layer of the manifold section (300).

[0058]

[0059] In a liquid cooling structure (1) according to one embodiment of the present invention, the inlet pipe portion (310) may include a microchannel contact area (311) communicating with the microchannel portion (100) in the lower region (301) and a supply area (312) formed in the upper region (302) to supply the inlet cooling liquid (L1) to the microchannel contact area (311).

[0060]

[0061] Referring to FIGS. 3 and 4b, the inlet pipe section (310) of the liquid cooling structure (1) according to an embodiment of the present invention may include a microchannel contact area (311) and a supply area (312). As can be seen in FIG. 3, the microchannel contact area (311) is formed to communicate with the microchannel section (100) in the lower layer area (301) and is an area that allows the inlet cooling liquid (L1) to be supplied to the microchannel section (100). Additionally, the supply area (312) is formed in the upper layer area (302) and is an area that supplies the inlet cooling liquid (L1) to the microchannel contact area (311). The inlet pipe section (310) of the liquid cooling structure (1) according to an embodiment of the present invention can enable effective fluid movement in the microchannel section (100) by varying the shape or function of the areas formed in each layer of the manifold section (300).

[0062]

[0063] In a liquid cooling structure (1) according to one embodiment of the present invention, the supply area (312) may be formed as a pair to supply the incoming cooling liquid (L1) to both ends in the longitudinal direction of the microchannel contact area (311).

[0064]

[0065] Looking at FIGS. 3 and 4b, it can be seen that the supply area (312) is formed to enter both ends of the microchannel contact area (311) to supply the incoming coolant (L1) in both directions. Although the arrangement of the supply area (312) is not limited to this, when the microchannel contact area (311) is formed long in the longitudinal direction, the structure for supplying the coolant corresponding to both ends of the microchannel contact area (311) enables the incoming coolant (L1) to be supplied stably to the center of the microchannel contact area (311).

[0066]

[0067] In a liquid cooling structure (1) according to one embodiment of the present invention, the microchannel contact area (311) may be formed such that the cross-sectional area of ​​one end and the other end in the longitudinal direction of the microchannel contact area (311) is larger than the cross-sectional area of ​​the center in the longitudinal direction of the microchannel contact area (311).

[0068]

[0069] Looking at FIG. 4b, the longitudinal and widthwise cross-sections of the microchannel contact area (311) of the liquid cooling structure (1) according to one embodiment of the present invention can be seen. The microchannel contact area (311) is formed to be long in the longitudinal direction. The cross-section in direction A of FIG. 4a is illustrated in FIG. 4b. Since the microchannel contact area (311) is formed to be long in the longitudinal direction, it may be difficult for the incoming cooling liquid (L1) supplied from both ends of the microchannel contact area (311) in the longitudinal direction to be supplied to the center of the microchannel contact area (311). Therefore, since the overall flow rate in the microchannel contact area (311) is maintained constant, the flow velocity can be increased by reducing the cross-sectional area of ​​the microchannel contact area (311), thereby making it easier for the incoming cooling liquid (L1) to be supplied to the center of the microchannel contact area (311).

[0070] Looking at the AA cross-section of FIG. 4b, it can be seen that the cross-section becomes smaller as it approaches the longitudinal center of the microchannel contact area (311). The cross-section may become smaller in a stepwise manner as it approaches the longitudinal center of the microchannel contact area (311), or it may become smaller with a constant slope.

[0071] The BB cross-section of FIG. 4b is a cross-section cut along the width direction of the microchannel contact area (311). The BB cross-section of FIG. 4b is cut close to the longitudinal end of the microchannel contact area (311) in FIG. 4a. Therefore, it can be seen that the width direction cross-section of the microchannel contact area (311) in the BB cross-section of FIG. 4b is formed large in the lower layer area (301). In contrast, the CC cross-section of FIG. 4b is cut close to the longitudinal center of the microchannel contact area (311) in FIG. 4a. Therefore, it can be seen that the width direction cross-section of the microchannel contact area (311) in the CC cross-section of FIG. 4b is formed small in the lower layer area (301).

[0072] Looking at FIG. 4c, one can see that the microchannel contact area (311) of the liquid cooling structure (1) according to an embodiment of the present invention is formed in a longitudinal cross-section. The cross-sectional area can be maintained constant without forming a slope from both ends of the longitudinal direction of the microchannel contact area (311) to a certain area toward the center. The area marked 'b' in FIG. 4c is formed with a constant slope, so it can be seen that the cross-sectional area decreases steadily as it approaches the longitudinal center of the microchannel contact area (311). The area marked 'a' in FIG. 4c represents half of the microchannel contact area (311) based on the longitudinal direction. The area marked 'c' in FIG. 4c represents the height of the microchannel contact area (311), and the area marked 'd' in FIG. 4c is an area indicating that the height of the microchannel contact area (311) has decreased from the area marked 'b'. At this time, when the length of region 'a' is formed to be 10 to 12 times the height of region 'c', the length of region 'b' can be formed to be 60% to 70% of the length of region 'a'. Since it may be difficult for the cooling liquid (L) to enter the longitudinal center of the microchannel contact area (311) as the height of region 'c' is smaller, the length of region 'b' relative to region 'a' can be limited when the length of region 'a' is formed to be 10 to 12 times the height of region 'c'. When the length of region 'a' is formed to be 10 to 12 times the height of region 'c', if the length of region 'b' is formed to be less than 60% of the length of region 'a', the flow rate of the incoming cooling liquid (L1) may not be sufficiently secured, and if it exceeds 70%, the flow rate of the incoming cooling liquid (L1) may become excessively small. In region 'b', the slope of the cross-sectional area of ​​the microchannel contact region (311) can be formed to be 0.1 to 0.12, and if it is less than 0.1, the effect of increasing the flow velocity is small, and if it is greater than 0.12, a decrease in the flow rate may occur.

[0073]

[0074] In a liquid cooling structure (1) according to one embodiment of the present invention, the cover portion (200) may include an inlet space (230) in which the inlet (210) and the inlet pipe portion (310) are connected to each other and the inlet cooling liquid (L1) flows, and an outlet space (240) in which the outlet (220) and the discharge pipe portion (320) are connected to each other and the discharge cooling liquid (L2) flows.

[0075]

[0076] A cover portion (200) according to one embodiment of the present invention includes an inlet space (230) and an outlet space (240). The inlet space (230) is a space that allows communication between an inlet (210) and an inlet pipe portion (310), and an inlet pipe portion (310) may be formed corresponding to the inlet space (230). The inlet pipe portion (310) may be a pipe shape that communicates downward to a manifold portion (300) corresponding to the inlet space (230). The outlet space (240) is a space that allows communication between an outlet (220) and an outlet pipe portion (320), and an outlet pipe portion (320) may be formed corresponding to the outlet space (240). The outlet pipe portion (320) may be a pipe shape that communicates downward to a manifold portion (300) corresponding to the outlet space (240).

[0077] Since the inlet space (230) and the outlet space (240) must be formed to be connected to the inlet pipe section (310) and the outlet pipe section (320), respectively, it is desirable to spatially separate them from each other within the cover section (200).

[0078]

[0079] In a liquid cooling structure (1) according to one embodiment of the present invention, the discharge pipe portion (320) can move the discharged cooling liquid (L2) in the height direction from the microchannel portion (100) to the discharge space (240) across the upper layer region (302) and the lower layer region (301).

[0080]

[0081] The lower region (301) of FIG. 5b is a drawing obtained by cutting the lower region (301) of FIG. 5a in a plane, and the upper region (302) of FIG. 5b is a drawing obtained by cutting the upper region (302) of FIG. 5a in a plane.

[0082] Referring to FIGS. 5a and 5b, the microchannel contact area (311) is not formed in the upper region (302), so the cooling liquid (L1) is supplied through the supply area (312) formed laterally to the manifold section (300). In contrast, the discharge pipe section (320) is formed across the upper region (302) and the lower region (301), and rapidly discharges the discharged cooling liquid (L2) from the microchannel section (100) in the vertical direction of the liquid cooling structure (1). This structure is intended to spatially separate the supply or discharge of the incoming cooling liquid (L1) and the outgoing cooling liquid (L2), and increases the efficiency of the circulation system by increasing the cooling liquid discharge efficiency.

[0083]

[0084] In a liquid cooling structure (1) according to an embodiment of the present invention, the manifold portion (300) includes a first intermediate layer portion (303) formed between the lower layer region (301) and the upper layer region (302), and the inlet pipe portion (310) is formed to penetrate the upper layer region (302), the first intermediate layer portion (303), and the lower layer region (301) to supply the inlet cooling liquid (L1) to the microchannel contact portion (311), a supply portion (312) formed as a pair to supply the inlet cooling liquid (L1) to both ends in the longitudinal direction of the microchannel contact portion (311), and from the supply portion (312) along the longitudinal direction of the microchannel contact portion (311) in the first intermediate layer portion (303). It may include a first buffer region (313) that is extended and formed to be in communication with the microchannel contact region (311).

[0085]

[0086] A manifold section (300) of a liquid cooling structure (1) according to one embodiment of the present invention may include a lower layer region (301), a first intermediate layer region (303), and an upper layer region (302). By forming the manifold section (300) in multiple layers, the piping of the manifold section (300) may be formed in various structures for each layer.

[0087] The inlet pipe section (310) of the manifold section (300) of the liquid cooling structure (1) according to one embodiment of the present invention may include a microchannel contact area (311), a supply area (312), and a first buffer area (313).

[0088] The lower layer area (301) in Fig. 6b is a drawing obtained by cutting the lower layer area (301) in Fig. 6a in a plane, the upper layer area (302) in Fig. 6b is a drawing obtained by cutting the upper layer area (302) in Fig. 6a in a plane, and the first intermediate layer area (303) in Fig. 6b is a drawing obtained by cutting the first intermediate layer area (303) in Fig. 6a in a plane.

[0089] Referring to FIGS. 6a and 6b, the supply area (312) is formed to penetrate the upper layer area (302), the first intermediate layer area (303), and the microchannel contact area (311) from the outer edge of the manifold section (300), so as to supply cooling liquid to both ends in the longitudinal direction of the microchannel contact area (311) formed in the lower layer area (301).

[0090] Additionally, referring to FIGS. 6a and 6b, the first buffer region (313) is formed in the first intermediate layer region (303) and can be extended longitudinally from the supply region (312) formed in the first intermediate layer region (303). Furthermore, the first buffer region (313) is formed to communicate with the microchannel contact region (311) through the boundary between the first intermediate layer region (303) and the lower layer region (301). Thus, due to the first buffer region (314), the effect of the cross-sectional area decreasing stepwise toward the longitudinal center of the microchannel contact region (311) can be obtained without structural changes that gradually reduce the cross-sectional area of ​​the microchannel contact region (311). Therefore, through the first buffer region (314), sufficient flow rate and velocity of the incoming coolant (L1) can be secured even toward the longitudinal center of the microchannel contact region (311).

[0091]

[0092] In a liquid cooling structure (1) according to an embodiment of the present invention, the cover portion (200) includes an inlet space (230) in which the inlet (210) and the inlet pipe portion (310) are connected to each other and the inlet cooling liquid (L1) flows, and an outlet space (240) in which the outlet (220) and the discharge pipe portion (240) are connected to each other and the discharge cooling liquid (L2) flows, and the discharge pipe portion (320) can move the discharge cooling liquid (L2) from the microchannel portion (100) in the height direction through the upper layer region (302), the first intermediate layer region (303), and the lower layer region (301) to the discharge space (240).

[0093]

[0094] As mentioned above, the cover portion (200) of the liquid cooling structure (1) according to one embodiment of the present invention may include an inlet space (230) and an outlet space (240). In this case, looking at FIG. 6a, the outlet pipe portion (320) is formed across the upper layer region (302), the first intermediate layer region (303), and the lower layer region (301). Accordingly, the outlet pipe portion (320) can discharge the discharged cooling liquid (L2) from the microchannel portion (100) to the outlet space (240).

[0095]

[0096] In a liquid cooling structure (1) according to an embodiment of the present invention, the manifold portion (300) includes a first intermediate layer area (303) formed between the lower layer area (301) and the upper layer area (302), and a second intermediate layer area (304) formed between the first intermediate layer area (303) and the upper layer area (302); the inlet pipe portion (310) includes a microchannel contact area (311) communicating with the microchannel portion (100) in the lower layer area (301), the upper layer area (302) and the second intermediate layer area (304) formed to penetrate to supply the inlet cooling liquid (L1) to the microchannel contact area (311), and formed to extend in the longitudinal direction of the microchannel contact area (311), and a supply area (312) formed as a pair on one side and the other side of the manifold portion (300), and the second It may include a second buffer region (314) formed extending along a direction perpendicular to the longitudinal direction of the microchannel contact region (311) from the supply region (312) in the intermediate layer region (304), and a first buffer region (313) formed in the first intermediate layer region (303) to communicate the second buffer region (314) and the microchannel contact region (311) with each other.

[0097]

[0098] The lower layer area (301) of FIG. 7b is a drawing obtained by cutting the lower layer area (301) of FIG. 7a in a plane, the upper layer area (302) of FIG. 7b is a drawing obtained by cutting the upper layer area (302) of FIG. 7a in a plane, the first intermediate layer area (303) of FIG. 7b is a drawing obtained by cutting the first intermediate layer area (303) of FIG. 7a in a plane, and the second intermediate layer area (304) of FIG. 7b is a drawing obtained by cutting the second intermediate layer area (304) of FIG. 7b in a plane.

[0099] Referring to FIGS. 7a and 7b, the manifold section (300) of the liquid cooling structure (1) according to one embodiment of the present invention may include a second intermediate layer region (304). The second intermediate layer region (304) is a layer formed between the first intermediate layer region (303) and the upper layer region (302). At this time, the microchannel contact region (311) is formed extending in the longitudinal direction so as to communicate with the microchannel section (100) in the lower layer region (301). At this time, when the layers of the manifold section (300) are formed up to the second buffer region (314) and formed into four layers, the supply region (302) is formed extending in the same direction as the longitudinal direction of the microchannel contact region (311), is formed to penetrate the upper layer region (302) and the second intermediate layer region (304), and is formed on one side and the other side of the manifold section (300).

[0100] Additionally, when the layers of the manifold section (300) are formed up to the second buffer region (314) and formed into four layers, the second buffer region (314) is formed in a direction perpendicular to the longitudinal direction of the microchannel contact region (311) from the supply region (312) in the second intermediate layer region (304). At this time, the second buffer region (314) performs the role of moving the inflow cooling liquid (L1) toward the center of the manifold section (300).

[0101] Additionally, when the layers of the manifold section (300) are formed up to the second buffer area (314) to form four layers, the first buffer area (313) may be formed in the first intermediate layer area (303) to connect the second buffer area (314) and the microchannel contact area (311). At this time, since the first buffer area (313) supplies the inflow cooling liquid (L1) evenly to the center and outer edges based on the longitudinal direction of the microchannel contact area (311), it is possible to prevent problems such as the inflow cooling liquid (L1) not being supplied to the center of the microchannel contact area (311) or the flow rate and velocity decreasing. That is, as the manifold section (300) is composed of four layers, effective supply of the inflow cooling liquid (L1) can be made possible by enhancing the arrangement of the inflow pipe section (310) formed in the manifold section (300).

[0102]

[0103] In a liquid cooling structure (1) according to an embodiment of the present invention, the cover portion (200) includes an inlet space (230) in which the inlet (210) and the inlet pipe portion (310) are connected to each other and the inlet cooling liquid (L1) flows therein, and an outlet space (240) in which the outlet (220) and the discharge pipe portion (320) are connected to each other and the discharge cooling liquid (L2) flows therein, and the discharge pipe portion (320) moves the discharge cooling liquid (L2) from the microchannel portion (100) in the height direction through the upper layer region (301) and the second intermediate layer region (304) to the discharge space (240), and extends in a direction perpendicular to the length direction of the microchannel contact region (311) to the first discharge region (321), and the discharge from the microchannel portion (100) to the first discharge region (321). The cooling liquid (L2) may be moved across the lower layer region (301) and the first intermediate layer region (303), and may include a second discharge region (322) that is formed extending in the longitudinal direction of the microchannel contact region (311).

[0104]

[0105] Referring to FIGS. 7a and 7b, when the layers of the manifold section (300) are formed up to the second buffer region (314) and formed into four layers, the discharge pipe section (320) of the liquid cooling structure (1) according to an embodiment of the present invention may include a first discharge region (321) and a second discharge region (322). The first discharge region (321) is formed across the upper layer region (302) and the second intermediate layer region (303) and is formed to extend perpendicularly to the longitudinal direction of the microchannel contact region (311). The second discharge region (321) is formed to communicate with the first discharge region (321) but is formed to extend perpendicularly to the first discharge region (321) in the longitudinal direction of the microchannel contact region (311). Additionally, the second discharge region (321) is formed across the lower layer region (301) and the first intermediate layer region (303).

[0106]

[0107] In a liquid cooling structure (1) according to one embodiment of the present invention, the manifold portion (300) may be formed in a shape having a multilayer area including a lower layer area (301) adjacent to the microchannel portion (100) and an upper layer area (302) adjacent to the cover portion (200), and the inlet pipe portion (310) and the discharge pipe portion (320) may be arranged in the multilayer area of ​​the manifold portion (300), and may be characterized in that the inlet pipe portion (310) and the discharge pipe portion (320) are formed so as not to be connected within the manifold portion (300).

[0108]

[0109] Figures 8a and 8b show that a multilayer area is formed in the manifold section (300), and that piping can be formed in various arrangements in the multilayer area.

[0110] For example, the manifold portion (300) of the liquid cooling structure (1) according to one embodiment of the present invention may include a multilayer region. The multilayer region may include the lower layer region (301), upper layer region (302), first intermediate layer region (303), and second intermediate layer region (304) mentioned above, and the multilayer region may be formed in two to four layers.

[0111] At this time, the inlet pipe section (310) and the discharge pipe section (320) are arranged in a multi-layer area, but are formed so that the inlet pipe section (310) and the discharge pipe section (320) are not connected to each other within the multi-layer area, thereby allowing the supply and discharge lines of the cooling liquid (L) to be separated in the manifold section (300).

[0112]

[0113] Looking at FIGS. 9a to 9c, it can be seen that the inlet pipe section (310) and the discharge pipe section (320) are formed in different arrangements in the manifold section (300). The inlet pipe section (310) can be supplied from both sides of the manifold section (300). Looking at FIG. 9a, the inlet pipe section (310) can be formed parallel to line AA. Looking at FIG. 9b, the inlet pipe section (310) is formed extending in one direction, and the discharge pipe section (320) is formed extending in a direction perpendicular to that one direction. The width of the discharge pipe section (320) can be formed differently for each discharge pipe section (320). Among the discharge pipe sections (320), three first discharge pipe sections (323) with the largest width can be formed, and a second discharge pipe section (324) with the second largest width can be formed between the first discharge pipe sections (323). Additionally, a third discharge pipe section (325) with the smallest width can be formed between the first discharge pipe section and the second discharge pipe section. Looking at FIG. 9c, it can be seen that various discharge pipe sections with a smaller width are formed between the first discharge pipe sections. By forming discharge pipe sections with a width smaller than the first discharge pipe section between the first discharge pipe sections in this way, the flow can be made smooth even in the central region of the manifold section (300), thereby making the internal flow rate uniform and lowering the maximum temperature of the object to be cooled. Also, looking at FIG. 9d, the cooling liquid is introduced from the inlet pipe section (310), enters the micro-inlet pipe section (315), and allows the cooling liquid to enter the micro-flow channel section (100).

[0114]

[0115] Although the present invention has been described in detail through specific embodiments, this is for the purpose of specifically explaining the invention, and the invention is not limited thereto. It will be apparent that modifications or improvements can be made by those skilled in the art within the technical scope of the invention.

[0116] All simple variations or modifications of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be clarified by the appended claims.

[0117] [Explanation of the symbol]

[0118] L: Coolant

[0119] L1: Incoming coolant

[0120] L2: Drain coolant

[0121] 1 : Liquid cooling structure

[0122] 100 : Microcircle

[0123] 200 : Cover part

[0124] 210 : Entrance

[0125] 220 : Exit

[0126] 230 : Inflow space

[0127] 240: Exhaust space

[0128] 300 : Manifold section

[0129] 301 : Lower area

[0130] 302 : Upper area

[0131] 303: 1st Intermediate Layer Region

[0132] 304: Second intermediate layer region

[0133] 310 : Inlet pipe section

[0134] 311: Microchannel contact area

[0135] 312 : Supply Area

[0136] 313: First buffer zone

[0137] 314: Second buffer zone

[0138] 320 : Discharge pipe section

[0139] 321: 1st Emission Zone

[0140] 322 : Second Emission Zone

Claims

1. In a liquid cooling structure for cooling an object to be cooled, A microchannel that exchanges heat through a cooling target and a cooling liquid; A cover portion comprising an inlet for introducing an inflow cooling liquid into the above liquid cooling structure and an outlet for discharging a discharge cooling liquid from the above liquid cooling structure; and A liquid cooling structure comprising: a manifold portion formed between the cover portion and the microchannel portion in the height direction of the liquid cooling structure, the manifold portion including an inlet pipe portion for supplying the inlet cooling liquid from the cover portion to the microchannel portion and an outlet pipe portion for moving the discharge cooling liquid from the microchannel portion to the cover portion.

2. In Claim 1, The above manifold section is, A lower layer region adjacent to the above-mentioned microchannel; and A liquid cooling structure comprising: an upper layer region adjacent to the above-mentioned cover portion; 3. In Claim 2, The above inlet pipe section is, A microchannel contact region communicating with the microchannel portion in the lower region above; and A liquid cooling structure comprising a supply area formed in the upper layer region to supply the inflow cooling liquid to the microchannel contact region.

4. In Claim 3, The above supply area is, A liquid cooling structure formed as a pair to supply the inflow cooling liquid to both ends in the longitudinal direction of the microchannel contact area.

5. In Claim 4, The above-mentioned microchannel contact area is, A liquid cooling structure in which the cross-sectional areas of one end and the other end in the longitudinal direction of the microchannel contact area are formed to be larger than the cross-sectional area of ​​the center in the longitudinal direction of the microchannel contact area.

6. In Claim 4, The above cover part is, A liquid cooling structure comprising an inlet space in which the inlet and the inlet pipe section are connected to each other and the inlet cooling liquid flows, and an outlet space in which the outlet and the discharge pipe section are connected to each other and the discharge cooling liquid flows.

7. In Claim 6, The above discharge pipe section is, A liquid cooling structure that moves the discharged cooling liquid from the microchannel portion in the height direction across the upper region and the lower region to the discharge space.

8. In Claim 2, The above manifold section is, It includes a first intermediate layer region formed between the lower layer region and the upper layer region, and The above inlet pipe section is, A microchannel contact area communicating with the microchannel portion in the lower layer region above; A supply region formed to penetrate the upper layer region, the first intermediate layer region, and the lower layer region to supply the incoming coolant to the microchannel contact region, and formed as a pair to supply the incoming coolant to both ends in the longitudinal direction of the microchannel contact region; and A liquid cooling structure comprising: a first buffer region formed to extend along the longitudinal direction of the microchannel contact region from the supply region in the first intermediate layer region and formed to communicate with the microchannel contact region.

9. In Claim 8, The above cover part is, It includes an inlet space that is a space in which the inlet coolant flows, connecting the inlet and the inlet pipe section to each other, and an outlet space that is a space in which the discharge coolant flows, connecting the outlet and the discharge pipe section to each other. The above discharge pipe section is, A liquid cooling structure that moves the discharged cooling liquid from the above microchannel section in the height direction across the upper layer region, the first intermediate layer region and the lower layer region to the discharge space.

10. In Claim 2, The above manifold section is, A first intermediate layer region formed between the lower layer region and the upper layer region; and A second intermediate layer region formed between the first intermediate layer region and the upper layer region; comprising The above inlet pipe section is, A microchannel contact area communicating with the microchannel portion in the lower layer region above; A supply area formed to penetrate the upper layer region and the second intermediate layer region to supply the inflow cooling liquid to the microchannel contact region, and formed to extend in the longitudinal direction of the microchannel contact region, and formed as a pair on one side and the other side of the manifold portion; A second buffer region formed extending from the supply region in the second intermediate layer region along a direction perpendicular to the longitudinal direction of the microchannel contact region; A liquid cooling structure comprising: a first buffer region formed in the first intermediate layer region to communicate the second buffer region and the microchannel contact region with each other.

11. In Claim 10, The above cover part is, It includes an inlet space that is a space in which the inlet coolant flows, connecting the inlet and the inlet pipe section to each other, and an outlet space that is a space in which the discharge coolant flows, connecting the outlet and the discharge pipe section to each other. The above discharge pipe section is, A first discharge region formed by extending in a direction perpendicular to the longitudinal direction of the microchannel contact region, and moving the discharged coolant from the above microchannel portion in the height direction across the upper layer region and the second intermediate layer region to the discharge space; and A liquid cooling structure comprising: moving the discharged cooling liquid from the microchannel portion to the first discharge region across the lower layer region and the first intermediate layer region, and forming a second discharge region extending in the longitudinal direction of the microchannel contact region.

12. In Claim 1, The above manifold section is, A lower layer region adjacent to the above-mentioned microchannel; and It can be formed in a shape having a multilayer region including an upper layer region adjacent to the above-mentioned cover portion, and A liquid cooling structure characterized in that the inlet pipe section and the discharge pipe section are disposed in the multilayer region of the manifold section, and the inlet pipe section and the discharge pipe section are formed so as not to communicate within the manifold section.

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