Power conversion apparatus

Abstract

Provided in the present application is a power conversion apparatus, comprising a housing, a power device and a heat sink. The housing comprises a first cavity and a second cavity spaced apart in a first direction, and is provided with an air inlet and an air outlet which are both in communication with the second cavity. The power device is accommodated in the first cavity, and the heat sink is accommodated in the second cavity. The heat sink comprises a heat dissipation baseplate and a plurality of condensation flat tubes. The heat dissipation baseplate comprises an evaporation cavity, the plurality of condensation flat tubes are located on the side of the heat dissipation baseplate away from the power device, and the evaporation cavity is in communication with the plurality of condensation flat tubes. The plurality of condensation flat tubes are located between the air inlet and the air outlet, and are arranged at intervals to form a plurality of ventilation holes extending in a second direction. The air inlet and the air outlet extend in the second direction and are respectively located on two sides of the plurality of condensation flat tubes; or the air inlet is located on the side of the second cavity facing away from the first cavity, and the air outlet extends in the second direction and is located on at least one side of the plurality of condensation flat tubes, thereby improving the reliability of heat dissipation.

Description

Power conversion device

[0001] This application claims priority to the Chinese patent application No. 202411357184.7, filed on September 26, 2024, and entitled "Power conversion device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of electronic technology, and in particular, to a power conversion device. BACKGROUND

[0003] In the existing power conversion device, the power device is accommodated in the first cavity of the shell, and the two-phase heat sink is accommodated in the second cavity of the shell. The heat generated by the power device during operation can be transferred to the two-phase heat sink. The bottom of the shell is provided with an air inlet hole, and the top of the shell is provided with an air outlet hole. External airflow can flow into the second cavity from the air inlet hole, and then flow out of the second cavity from the air outlet hole through the two-phase heat sink, thereby achieving heat dissipation for the power device. However, since the air outlet hole is arranged at the top of the shell, foreign matter (such as dust or fallen leaves, etc.) is easy to block the air outlet hole, which results in that the external airflow cannot flow smoothly through the second cavity, and the reliability of heat dissipation for the power device is poor. SUMMARY

[0004] The present application provides a power conversion device, which aims to solve the problem of poor reliability of heat dissipation for the power device.

[0005] In a first aspect, the embodiments of the present application provide a power conversion device, which comprises a shell, at least one power device, and at least one heat sink. The shell comprises a first cavity and a second cavity, which are arranged in a spaced manner in a first direction. The shell is provided with at least one mounting hole, an air inlet hole, and at least one air outlet hole. The mounting hole is in communication with the first cavity and the second cavity. The air inlet hole and the air outlet hole are both in communication with the second cavity. The power device is accommodated in the first cavity. The heat sink is accommodated in the second cavity. Each heat sink comprises a heat dissipation substrate and a plurality of condensation flat tubes. The heat dissipation substrate comprises an evaporation cavity for accommodating a cooling working medium. The heat dissipation substrate is in contact with the power device through the mounting hole and covers the mounting hole to close the first cavity. The plurality of condensation flat tubes are located on the side of the heat dissipation substrate away from the power device, and the evaporation cavity is in communication with the plurality of condensation flat tubes. The plurality of condensation flat tubes are located between the air inlet hole and the air outlet hole, and the plurality of condensation tubes are arranged in a spaced manner to form a plurality of ventilation holes. The ventilation holes extend in a second direction. The first direction, the second direction, and the direction of gravity are perpendicular to each other. In the second direction, the air inlet hole and the air outlet hole are located on both sides of the plurality of condensation flat tubes, respectively. Alternatively, the air inlet hole extends in the first direction, and in the first direction, the air inlet hole is located on the side of the second cavity away from the first cavity. The air outlet hole extends in the second direction, and in the second direction, at least one air outlet hole is located on at least one side of the plurality of condensation flat tubes.

[0006] In the above implementation, the heat generated by the power device during operation can be transferred to the cooling working medium in the evaporation cavity and then to the plurality of condensing flat tubes. The cooling air can flow into the second cavity from the air inlet, and then flow out of the second cavity from the air outlet through the plurality of condensing flat tubes. The heat generated by the power device during operation can be transferred to the external environment by the cooling air. The heat generated by the power device during operation is transferred to the cooling working medium in the evaporation cavity, the cooling working medium in the evaporation cavity absorbs heat and boils to form cooling working medium in a gaseous state, the cooling working medium in a gaseous state flows from the evaporation cavity to the plurality of condensing flat tubes, the cooling working medium in a gaseous state releases heat and condenses in the plurality of condensing flat tubes to form cooling working medium in a liquid state, the cooling working medium in a liquid state returns to the evaporation cavity under the action of gravity, and the cooling working medium circulates in the evaporation cavity and the plurality of condensing flat tubes. The heat released by the condensation of the cooling working medium in a gaseous state is transferred to the external environment by the cooling air. The boiling heat exchange of the cooling working medium realizes rapid heat dissipation of the power device, which is beneficial to improve the heat dissipation efficiency of the power device. Rapid heat dissipation of the power device is realized.

[0007] Compared with the prior art, the air inlet and the air outlet of the power conversion device provided by the present application can have two settings. One is side air inlet and side air outlet, that is, the air inlet and at least one air outlet extend along the second direction, and in the second direction, the air inlet and the air outlet are located on both sides of the plurality of condensing flat tubes. The second is back air inlet and two-side or one-side air outlet, that is, the air inlet extends along the first direction, and in the first direction, the air inlet is located on the side of the second cavity facing away from the first cavity, and the air outlet extends along the second direction, and in the second direction, at least one air outlet is located on at least one side of the plurality of condensing flat tubes. Such design can avoid the situation that foreign matters (such as dust or fallen leaves) block the air outlet and the air inlet, ensure that the cooling air can smoothly flow through the second cavity, is beneficial to improve the reliability of heat dissipation of the power device, and is beneficial to reduce the maintenance cost of the power conversion device. Moreover, it can avoid reserving space on the top of the power conversion device, avoid the cooling air flowing out of the second cavity from the air outlet from being dispersed, cause the temperature of the air around the power conversion device to be too high, and is beneficial to reduce the installation space of the power conversion device. In addition, it can also ensure that the cooling air flowing into the second cavity from the air inlet can quickly and smoothly flow through the plurality of condensing flat tubes of the radiator from the air inlet, and then flow out of the second cavity from the air outlet, which is beneficial to increase the contact area of each condensing flat tube with the cooling air, and is beneficial to improve the efficiency of the cooling air carrying the heat generated by the power device during operation out of the second cavity, and is beneficial to improve the heat dissipation efficiency of the power device.

[0008] In a possible implementation, in the first direction, the plurality of condensing flat tubes are fixedly connected to the side of the heat dissipation substrate away from the power device, and in the direction of gravity, the plurality of condensing flat tubes are sequentially and spacedly arranged and form a plurality of ventilation holes; the heat sink further includes a communication part, the communication part includes a flow cavity, the communication part is located at the side of the plurality of condensing flat tubes away from the heat dissipation substrate, the communication part is fixedly connected with the plurality of condensing flat tubes, and the flow cavity is in communication with the plurality of condensing flat tubes.

[0009] In the implementation, the cooling working medium in the evaporation cavity absorbs heat to form gaseous cooling working medium, which flows from the evaporation cavity to the flow cavity through each condensing flat tube, and the gaseous cooling working medium releases heat to condense and form liquid cooling working medium in each condensing flat tube and in the flow cavity. Part of the liquid cooling working medium in the condensing flat tube flows from the condensing flat tube to the flow cavity, and part of the liquid cooling working medium flows back to the evaporation cavity under the action of gravity. The cooling working medium in the flow cavity flows back to the evaporation cavity through the condensing flat tube under the action of gravity. The flow cavity is located at the side of the plurality of condensing flat tubes away from the evaporation cavity, and the communication part is in contact with and fixedly connected with the plurality of condensing flat tubes, which is conducive to improving the stability of the plurality of condensing flat tubes arranged at intervals and improving the structural stability and reliability of the power conversion device.

[0010] In a possible implementation, the projection of the communication part in the first direction covers the projections of all the ventilation holes in the first direction, and the projection of the heat dissipation substrate in the first direction covers the projections of all the ventilation holes in the first direction.

[0011] In the implementation, the heat dissipation wind flowing through each ventilation hole can be guided by the communication part, the heat dissipation substrate and each adjacent two condensing flat tubes, which is conducive to improving the efficiency of the heat dissipation wind flowing through the ventilation hole, improving the efficiency of the heat dissipation wind carrying out the heat generated by the power device to the second cavity, and improving the heat dissipation efficiency of the power device.

[0012] In a possible implementation, each condensing flat tube includes a plurality of flow channels, the plurality of flow channels extend in the first direction and are sequentially arranged in the second direction, adjacent flow channels are isolated by baffles, and the plurality of flow channels are in communication with the evaporation cavity and the flow cavity.

[0013] In the implementation, dividing the condensing flat tube 324 into a plurality of flow channels can uniformly distribute the pressure generated by the gaseous working medium in each flow channel, and the baffle can also withstand a certain pressure to avoid the problem of bulging, so that the stability of the entire condensing flat tube is better.

[0014] In a possible implementation, the heat sink further includes a first communication portion and a second communication portion, the first communication portion includes a first flow-through cavity, and the second communication portion includes a second flow-through cavity; in the first direction, the first communication portion, the second communication portion, and the plurality of condensation flat tubes are located on one side of the evaporation cavity; in the direction of gravity, the first communication portion and the second communication portion are located on two sides of the plurality of condensation flat tubes; in the first direction, the plurality of condensation flat tubes are sequentially and spaced apart to form a plurality of ventilation holes; the first communication portion and the second communication portion are fixedly connected with the heat dissipation substrate and the plurality of condensation flat tubes; the first flow-through cavity and the second flow-through cavity are in communication with the plurality of condensation flat tubes; and the first flow-through cavity and the second flow-through cavity are in communication with the evaporation cavity.

[0015] In the implementation, the cooling working medium in the evaporation cavity absorbs heat to form gaseous cooling working medium, which flows from the evaporation cavity to the plurality of condensation flat tubes through the first flow-through cavity; the gaseous cooling working medium releases heat to condense and form liquid cooling working medium in the plurality of condensation flat tubes and the first flow-through cavity; and the liquid cooling working medium flows back to the evaporation cavity through the plurality of condensation flat tubes in the second flow-through cavity under the action of gravity. The heat dissipation wind flows through the condensation flat tubes, the first communication portion, and the second communication portion through the ventilation holes to transfer the heat released by the condensation of the gaseous cooling working medium to the external environment. The plurality of condensation flat tubes are in communication with the evaporation cavity through the first flow-through cavity and the second flow-through cavity, and the plurality of condensation flat tubes are in communication with the evaporation cavity in various ways, which is simple and stable in structure, easy to design, and low in processing cost.

[0016] In a possible implementation, a projection of the first communication portion in the direction of gravity and a projection of the second communication portion in the direction of gravity both cover a projection of each ventilation hole in the direction of gravity.

[0017] In the implementation, the projection of the first communication portion in the direction of gravity covers the projection of each ventilation hole in the first direction, and the projection of the second communication portion in the direction of gravity covers the projection of each ventilation hole in the first direction. The heat dissipation wind flowing through each ventilation hole can be guided through the first communication portion, the second communication portion, and each adjacent two condensation flat tubes, which is beneficial to improve the efficiency of the heat dissipation wind flowing through the ventilation holes, the efficiency of the heat dissipation wind carrying out the heat generated by the power device during operation to the second cavity, and the heat dissipation efficiency of the power device.

[0018] In a possible implementation, in the first direction, the heat dissipation substrate is spaced apart from the condensation flat tube.

[0019] In the implementation solution, the heat dissipation wind flowing into the second cavity from the air inlet hole can flow through the heat sink through the interval between the heat dissipation base plate and the condensation flat tube, and then flow out of the second cavity from the air outlet hole. The heat dissipation wind flowing through the interval between the heat dissipation base plate and the condensation flat tube can also dissipate heat for the condensation flat tube, and then transmit the heat generated by the power device during operation to the external environment, which is conducive to improving the efficiency of the heat dissipation wind in taking the heat generated by the power device during operation out of the second cavity, and conducive to improving the heat dissipation efficiency of the power device.

[0020] In a possible implementation, in the first direction, heat exchange fins are arranged between the heat dissipation base plate and the condensation flat tube, and the first heat dissipation fin is in contact with and fixedly connected to the heat dissipation base plate and the condensation flat tube.

[0021] In the implementation solution, the design of the heat exchange fins is conducive to increasing the heat dissipation area of the condensation flat tube for the heat dissipation wind flowing through the interval between the heat dissipation base plate and the condensation flat tube, conducive to improving the heat dissipation efficiency of the condensation flat tube for the heat dissipation wind, conducive to improving the heat dissipation efficiency of the heat sink for the heat dissipation wind, and conducive to improving the heat dissipation efficiency of the power device.

[0022] In a possible implementation, heat dissipation fins are arranged between two adjacent condensation flat tubes, and the heat dissipation fin is in contact with and fixedly connected to the two adjacent condensation flat tubes.

[0023] In the implementation solution, the design of the heat dissipation fins is conducive to increasing the heat dissipation area of the multiple condensation flat tubes, conducive to improving the heat dissipation efficiency of the condensation flat tube for the heat dissipation wind, conducive to improving the heat dissipation efficiency of the heat sink for the heat dissipation wind, and conducive to improving the heat dissipation efficiency of the power device.

[0024] In a possible implementation, the number of the at least one mounting hole and the number of the at least one power device are both multiple, the multiple mounting holes correspond to the multiple power devices one by one, and the heat dissipation base plate of the heat sink is in contact with the multiple power devices through the multiple mounting holes and covers the multiple mounting holes.

[0025] In the implementation solution, the heat generated by each power device during operation can be transmitted to the multiple condensation flat tubes through the cooling working medium in the evaporation cavity of the heat sink, and the structure is simple.

[0026] In a possible implementation, the number of the at least one mounting hole and the number of the at least one power device are both multiple, the multiple mounting holes correspond to the multiple power devices one by one; the at least one heat sink includes multiple heat sinks; the at least one power device is divided into multiple groups of power devices, each group including at least one power device; and the heat dissipation base plate of each heat sink is in contact with a group of power devices through a corresponding mounting hole and covers the corresponding mounting hole.

[0027] In the above implementation, the plurality of power devices are divided into multiple groups, and each group of power devices is cooled by one heat sink. In this way, different types or different heat generating power devices can be classified and cooled according to the actual design, and heat cascade can be avoided.

[0028] In one possible implementation, the two heat sinks are arranged in sequence along the direction of gravity.

[0029] In the above implementation, in the direction of gravity, the plurality of heat sinks are arranged in sequence. This design not only ensures that the cooling air flowing into the second cavity from the air inlet hole can flow through each condensing flat tube of each heat sink from the air vent hole of each heat sink, and then flow out of the second cavity, so as to take out the heat generated by each power device during operation and achieve rapid cooling of each power device; but also avoids the situation that the cooling air flows through one heat sink and then flows through another heat sink, ensures that the air ducts where the heat sinks are located are independent, avoids temperature cascade between multiple heat sinks, and is conducive to improving the cooling efficiency of each heat sink, the cooling efficiency of each power device, and the power density of the power conversion device.

[0030] In one possible implementation, in the case where the air inlet hole extends in the first direction, the number of at least one air outlet hole is multiple, the multiple air outlet holes include a first air outlet hole and a second air outlet hole, in the second direction, the first air outlet hole and the second air outlet hole are located on both sides of the plurality of condensing flat tubes, and the plurality of condensing flat tubes are located between the air inlet hole and the first air outlet hole; and / or, the plurality of condensing flat tubes are located between the air inlet hole and the second air outlet hole.

[0031] In the above implementation, the heat generated by the power device during operation can be transferred to the plurality of first condensing flat tubes through the cooling working medium in the evaporation cavity. In the second direction, a part of the condensing flat tubes are located between the air inlet hole and the first air outlet hole, and another part of the condensing flat tubes are located between the air inlet hole and the second air outlet hole. This design ensures that the cooling air flowing into the second cavity from the air inlet hole can flow out of the second cavity from the first air outlet hole through a part of the condensing flat tubes, and the cooling air can take out the heat transferred by the power device to this part of the condensing flat tubes from the second cavity. It also ensures that the cooling air flowing into the second cavity from the air inlet hole can flow out of the second cavity from the second air outlet hole through another part of the condensing flat tubes, and the cooling air can take out the heat transferred by the power device to this part of the condensing flat tubes from the second cavity. The cooling air can cool the two parts of the condensing flat tubes respectively, and then achieve rapid cooling of the power device, which is conducive to improving the cooling efficiency of the heat sink and the cooling efficiency of the power device.

[0032] In one possible implementation, the power conversion device further includes a magnetic device, and the magnetic device is accommodated in the second cavity and located on one side of the heat sink in the direction of gravity.

[0033] In the implementation, the magnetic device is located on one side of the heat sink in the gravity direction, so that the heat dissipation air does not flow through the heat sink and then the magnetic device, or the heat dissipation air does not flow through the magnetic device and then the heat sink, the air duct where the heat sink is located is independent of the air duct where the magnetic device is located, temperature cascade between the heat sink and the magnetic device is avoided, the heat dissipation efficiency of the heat sink is improved, the heat dissipation efficiency of the power device is improved, the power density of the power conversion device is improved, and the heat dissipation efficiency of the magnetic device is improved.

[0034] In a possible implementation, the power conversion device further includes a heat exchanger, the heat exchanger is accommodated in the second cavity, and the heat exchanger is configured to exchange heat with the first cavity; in the gravity direction, the heat exchanger is located on the other side of the heat sink relative to the magnetic device.

[0035] In the implementation, the heat dissipation air flowing into the second cavity from the air inlet hole can flow through the heat exchanger and then flow out of the second cavity from the air outlet hole. The heat dissipation air can transfer heat generated by the electronic device during operation to the external environment, so that rapid heat dissipation of the electronic device is achieved, the air temperature in the first cavity is reduced, and the working performance of the electronic device in the first cavity is improved. In the gravity direction, the heat exchanger is located on one side of the heat sink, so that the heat dissipation air does not flow through the heat sink and then the heat exchanger, or the heat dissipation air does not flow through the heat exchanger and then the heat sink, the air duct where the heat exchanger is located is independent of the air duct where the heat sink is located, temperature cascade between the heat sink and the heat exchanger is avoided, the heat dissipation efficiency of the heat sink is improved, the heat dissipation efficiency of the power device is improved, the power density of the power conversion device is improved, the heat dissipation efficiency of the heat exchanger is improved, the heat dissipation efficiency of the electronic device is improved, and the air temperature in the first cavity is reduced.

[0036] In a possible implementation, the shell is provided with a matching hole, the matching hole is in communication with the first cavity and the second cavity, and the heat exchanger covers the matching hole and seals the first cavity; the heat exchanger is provided with a heat exchange portion, the heat exchange portion is arranged in the matching hole and extends into the first cavity; or the heat exchanger includes a heat exchange cavity, and the heat exchange cavity is in communication with the first cavity through the matching hole.

[0037] In the implementation scheme, heat generated by the electronic device during operation can be transferred to the heat exchanger through the air in the first cavity. The heat dissipation air flowing into the second cavity from the air inlet hole can flow through the heat exchanger and then flow back to the first cavity from the matching hole. The heat dissipation air flowing into the second cavity from the air inlet hole can flow through the heat exchanger and then flow out of the second cavity from the air outlet hole. The heat dissipation air can carry the heat generated by the electronic device and transferred to the heat exchange cavity through the airflow out of the second cavity, thereby achieving rapid heat dissipation of the electronic device and reducing the temperature of the air in the first cavity. The structure of the heat exchanger is various, and the design cost is low.

[0038] In the implementation scheme, heat generated by the electronic device during operation can be transferred to the heat exchanger through the air in the first cavity. The heat exchanger can be in contact with the heat dissipation substrate and fixedly connected to the heat dissipation substrate.

[0039] In the implementation scheme, in a possible implementation, the heat exchanger is in contact with and fixedly connected to the heat dissipation substrate.

[0040] The heat exchanger is in contact with and fixedly connected to the heat dissipation substrate, so that the heat generated by the power device and transferred to the cooling working medium in the evaporation cavity through the heat dissipation substrate can be partially transferred to the heat exchanger and then transferred to the external environment through the heat exchanger, thereby improving the heat dissipation efficiency of the power device and the power density of the power conversion device. Moreover, the integration and structural stability of the power conversion device can be improved.

[0041] In a possible implementation, the power conversion device further includes a heat dissipation fan, the heat dissipation fan is accommodated in the second cavity, and an air inlet side of the heat dissipation fan faces the air inlet hole. In some embodiments, in the second direction, the heat dissipation fan can be located on a side of the plurality of condensation flat tubes facing the air inlet hole or away from the air inlet hole.

[0042] In the implementation scheme, the heat dissipation fan can drive the heat dissipation air to flow into the second cavity from the air inlet hole and then flow out of the second cavity from the air outlet hole, thereby achieving rapid heat dissipation of the heat sink and rapid heat dissipation of the power device. Since the axis of the air inlet hole and the axis of the air outlet hole are parallel to the first direction or the second direction, the situation that rainwater flows into the second cavity from the bottom of the power conversion device in rainy weather can be avoided, and the situation that the heat dissipation fan is washed or soaked by rainwater and cannot work normally can be avoided, thereby improving the working reliability of the heat dissipation fan and prolonging the working life of the heat dissipation fan. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the accompanying drawings needed to be used in the embodiments of the present application or the background art will be described in brief.

[0044] Fig. 1 is a structural block diagram of a power conversion device cooperating with a photovoltaic module and a power grid according to an embodiment of the present application;

[0045] Fig. 2 is a perspective structural schematic diagram of the power conversion device shown in Fig. 1;

[0046] Fig. 3a is a structural schematic diagram of the power conversion device shown in Fig. 2 from another angle;

[0047] Fig. 3b is a structural schematic diagram of the power conversion device shown in Fig. 2 along the line A-A;

[0048] Fig. 4 is a structural schematic diagram of a condensing flat tube according to an embodiment of the present application;

[0049] Fig. 5 is a structural schematic diagram of the power conversion device shown in Fig. 2 along the line A-A in another embodiment;

[0050] Fig. 6 is a structural schematic diagram of the power conversion device shown in Fig. 2 along the line A-A in another embodiment;

[0051] Fig. 7 is a structural schematic diagram of the power conversion device shown in Fig. 2 along the line A-A in another embodiment;

[0052] Fig. 8 is a structural schematic diagram of the power conversion device shown in Fig. 2 along the line A-A in another embodiment;

[0053] Fig. 9 is a structural schematic diagram of the power conversion device shown in Fig. 2 along the line A-A in another embodiment;

[0054] Fig. 10 is a structural schematic diagram of another power conversion device according to an embodiment of the present application;

[0055] Fig. 11 is a structural schematic diagram of the power conversion device shown in Fig. 10 along the line B-B;

[0056] Fig. 12 is a structural schematic diagram of another power conversion device according to an embodiment of the present application;

[0057] Fig. 13 is a structural schematic diagram of the power conversion device shown in Fig. 12 along the line C-C;

[0058] Fig. 14 is a structural schematic diagram of another power conversion device according to an embodiment of the present application;

[0059] Fig. 15 is a structural schematic diagram of the power conversion device shown in Fig. 14 along the line D-D;

[0060] FIG. 16 is a structural schematic diagram of another power conversion device according to an embodiment of the present application;

[0061] FIG. 17 is a structural schematic diagram of another power conversion device according to an embodiment of the present application;

[0062] FIG. 18 is a structural schematic diagram of the power conversion device shown in FIG. 17, along the line E-E;

[0063] FIG. 19 is a structural schematic diagram of the power conversion device shown in FIG. 18, along the line F-F;

[0064] FIG. 20 is a structural schematic diagram of the power conversion device shown in FIG. 19, along the line G-G;

[0065] FIG. 21 is a structural schematic diagram of another power conversion device according to an embodiment of the present application;

[0066] FIG. 22 is a structural schematic diagram of the power conversion device shown in FIG. 21, along the line H-H;

[0067] FIG. 23 is a structural schematic diagram of the power conversion device shown in FIG. 21, along the line I-I. DETAILED DESCRIPTION

[0068] The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0069] Referring to FIG. 1, FIG. 1 is a structural block diagram of a power conversion device 100 cooperating with a photovoltaic module 200 and a power grid 300 according to an embodiment of the present application.

[0070] For example, the power conversion device 100 is a photovoltaic inverter. In other embodiments, the power conversion device 100 can also be a rectifier, a transformer, a current transformer, or other inverters, etc. electronic devices for power conversion. The power conversion device 100 is used to convert the direct current output by the photovoltaic module 200 into alternating current and supply the power grid 300. In other embodiments, the power conversion device 100 can also be used to convert the direct current output by the photovoltaic module 200 into alternating current and supply a load device. The load device can be electronic devices that use alternating current, including but not limited to motors, fans, air conditioners, etc. In other embodiments, the power conversion device 100 can also be applied to electric drive controllers. For example, the power conversion device 100 can convert the direct current output by the battery into alternating current to supply the motor.

[0071] With the increasing power of power conversion equipment, the heat generated by the circuit board assembly inside the power conversion equipment cabinet is also increasing, which leads to the increase of the temperature inside the cabinet, which is very unfavorable to the heat generating components inside the cabinet. Especially for some power modules with high heat dissipation density, the failure risk of the power module is significantly increased under the influence of continuous high temperature.

[0072] In the prior art, when the power conversion equipment is hung on the wall or placed on the ground, air enters the inverter from the bottom of the inverter and is discharged from the top of the inverter, forming a downward air duct. When the gas flows in the air duct, the flowing gas will sequentially take away the heat of the heat generating components. However, this heat dissipation path makes the heat dissipation of the heat generating components located downstream of the air duct faster, and the heat dissipation of the heat generating components located upstream of the air duct slower, and the heat of the lower components is taken into the upper components, resulting in poor heat dissipation efficiency of the upper components, so the service life and reliability of various components inside the cabinet cannot be guaranteed, which will affect the service life of the power conversion equipment as a whole.

[0073] To solve the above problems, the embodiments of the present application improve the heat dissipation mode of the power conversion equipment and the layout of the heat generating components, so as to realize effective heat dissipation of the power conversion equipment, reduce the failure risk of the power module inside the power conversion equipment, improve the use reliability of the power conversion equipment, and further improve the service life of the power conversion equipment.

[0074] For ease of description, the present application defines three mutually perpendicular directions as a first direction (i.e. the X-axis direction shown in the figure), a second direction (the Y-axis direction shown in the figure) and a third direction (i.e. the Z-axis direction shown in the figure), the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction. In this embodiment, the third direction is parallel to the direction of gravity; wherein the negative direction of the Z-axis direction indicates the direction of gravity. The first direction (i.e. the X-axis direction shown in the figure) is perpendicular to the direction of gravity. The second direction (i.e. the Y-axis direction shown in the figure) is perpendicular to the direction of gravity. That is, the first direction (the X-axis direction shown in the figure), the second direction (the Y-axis direction shown in the figure) and the direction of gravity (the Z-axis direction shown in the figure) are perpendicular to each other.

[0075] Please refer to FIG. 2, FIG. 3a, FIG. 3b, and in combination with FIG. 1, FIG. 2 is a perspective structural schematic diagram of the power conversion equipment 100 shown in FIG. 1. FIG. 3a is a structural schematic diagram of the power conversion equipment 100 shown in FIG. 2 from another angle. FIG. 3b is a structural schematic diagram of the power conversion equipment 100 shown in FIG. 2 along the A-A line. It should be understood that the above schematic diagrams are all position relationship diagrams of the power conversion equipment 100 after being hung on the wall or placed on the ground, that is, at this time the third direction in the figure is parallel to the direction of gravity.

[0076] As shown in FIG. 2, FIG. 3a and FIG. 3b, the power conversion device 100 comprises a housing 10, a power conversion circuit 20 and a heat dissipation assembly 30. The power conversion circuit 20 and the heat dissipation assembly 30 are both accommodated in the housing 10. The direct current output by the photovoltaic assembly 200 is delivered to the power conversion circuit 20. The power conversion circuit 20 is used to convert the direct current output by the photovoltaic assembly 200 into alternating current. The alternating current output by the power conversion circuit 20 is delivered to the power grid 300 for supplying the power grid 300. The heat dissipation assembly 30 is used to dissipate heat for the power conversion circuit 20.

[0077] Specifically, the housing 10 comprises a first cavity 11 and a second cavity 12. In the first direction, the first cavity 11 and the second cavity 12 are spaced apart by a partition wall 16. Specifically, the housing 10 comprises the partition wall 16, a cooperation wall 17 and a connecting wall 18. The cooperation wall 17 and the partition wall 16 jointly form the first cavity 11, and the connecting wall 18 and the partition wall 16 jointly form the second cavity 12. The first cavity 11 is a closed cavity for accommodating power devices, and the second cavity 12 is an open and ventilated heat dissipation cavity.

[0078] The second cavity 12 is provided with an air inlet hole 13 and an air outlet hole 14. The air inlet hole 13 and the air outlet hole 14 both communicate with the second cavity 12. In the embodiment of the present application, the air inlet hole 13 and the air outlet hole 14 can both extend along the second direction and be distributed on the opposite sides of the second cavity 12 in the second direction, so as to realize the effect that the power conversion device 100 takes in air from one side and discharges air from the other side. Alternatively, the air inlet hole 13 can extend along the first direction and be arranged on the side of the second cavity 12 away from the partition wall 16, and the air outlet hole 14 extends along the second direction and is arranged on at least one of the opposite sides of the second cavity 12 in the second direction, so as to realize the effect that the power conversion device takes in air from the back and discharges air from one or two sides. That is, the air outlet hole 14 of the embodiment of the present application is located on the side of the power conversion device 100, so as to avoid the problem of foreign matter blocking caused by the air outlet hole being located on the top. Meanwhile, the air inlet hole 13 can be located on the back or side of the power conversion device 100, so as to ensure that the heat dissipation assembly 30 in the second cavity can be located in the heat dissipation air duct formed by the air inlet hole 13 and the air outlet hole 14, thereby improving the heat dissipation efficiency.

[0079] As shown in FIG. 1 and FIG. 2, the power conversion circuit 20 includes the power device 22, and further includes the circuit board 21, the magnetic device 23, and the other electronic device 24. In one possible embodiment, the circuit board 21, the power device 22, and the other electronic device 24 are all accommodated in the first cavity 11, and the magnetic device 23 is accommodated in the second cavity 12. The power device 22 and the other electronic device 24 are both mounted on the circuit board 21 and electrically connected with the circuit board 21. Specifically, the circuit board 21 is mounted on the side of the power device 22 away from the second cavity 12, and the other electronic device 24 is mounted on the side of the circuit board 21 away from the power device 22. In other embodiments, the other electronic device 24 can also be mounted on the side of the circuit board 21 facing the power device 22. The magnetic device 23 is electrically connected with the circuit board 21. The power device 22 is a packaged module or device for converting the direct current output by the photovoltaic module 200 into alternating current. Exemplarily, the power device 22 can be, but is not limited to, an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip, or a Mosfet (Metal oxide places semiconductor field-effect transistor) chip, etc. The magnetic device 23 cooperates with the other electronic device 24 to filter the current transmitted in the power conversion circuit 20. Exemplarily, the magnetic device 23 is an inductor, and the other electronic device 24 is a capacitor. In other embodiments, the other electronic device 24 can also be a fuse or other switching device.

[0080] As shown in FIG. 2, FIG. 3a, and FIG. 3b, the heat dissipation assembly 30 includes the heat sink 32, and further includes the heat dissipation fan 31 and the heat exchanger 33. In one possible embodiment, the heat dissipation fan 31, the heat sink 32, and the heat exchanger 33 are all accommodated in the second cavity 12, the heat sink 32 is used for heat exchange with the power device 22, and the heat exchanger 33 is used for heat exchange with the first cavity 11. In the third direction, the heat sink 32, the heat exchanger 33, and the magnetic device 23 are sequentially arranged.

[0081] The heat sink 32 comprises a heat dissipation base plate 321 and a condensing portion 322. The condensing portion 322 is fixedly connected with the heat dissipation base plate 321. The heat dissipation base plate 321 comprises an evaporation cavity 3211. The evaporation cavity 3211 is an inner cavity of the heat dissipation base plate 321. The evaporation cavity 3211 is used for containing cooling medium. The cooling medium can be cooling fluid including but not limited to water, ethylene glycol or propylene glycol. The heat dissipation base plate 321 is used for heat exchange with the power device 22. Specifically, the partition wall 16 is provided with a mounting hole 15. The mounting hole 15 penetrates the partition wall 16 along the first direction and communicates with the first cavity 11 and the second cavity 12. The power device 22 can be mounted in the mounting hole 15. The heat dissipation base plate 321 is in contact with the power device 22 through the mounting hole 15, and covers the mounting hole 15 to close the first cavity 11. Specifically, in the third direction, the condensing portion 322 can be located above the cooling medium in the evaporation cavity 3211, that is, the condensing portion 322 is located at a position of the heat dissipation base plate 321 closer to the top of the power conversion device 100. The advantage is that after the cooling medium in the evaporation cavity 3211 is heated and evaporated, the gaseous working medium can more smoothly enter the condensing portion 322.

[0082] Specifically, the condensing portion 322 comprises a plurality of condensing flat tubes 324. The plurality of condensing flat tubes 324 are in communication with the evaporation cavity 3211. The condensing flat tubes 324 are located at a side of the heat dissipation base plate 321 away from the power device 22. The plurality of condensing flat tubes 324 are arranged at intervals to form ventilation holes 323, and the ventilation holes 323 extend along the second direction. In the embodiment of the present application, the condensing flat tube can be a flat hollow plate structure for liquid working medium flow. It should be understood that the condensing flat tube can also be other structural designs, which are not limited in the present application.

[0083] The heat generated by the power device 22 during operation can be transferred to the cooling medium in the evaporation cavity 3211 and then to the plurality of condensing flat tubes 324 through the cooling medium. The heat dissipation fan 31 can drive the heat dissipation wind to flow into the second cavity 12 from the air inlet hole 13. The heat dissipation wind can flow through the plurality of condensing flat tubes 324 from the ventilation holes 323 of the heat sink 32, and then flow out of the second cavity 12 from the air outlet hole 14, so as to transfer the heat generated by the power device 22 during operation to the external environment, thereby achieving heat dissipation of the power device 22. The heat dissipation fan 31 can also drive the heat dissipation wind to flow into the second cavity 12 from the air inlet hole 13, and then flow out of the second cavity 12 through the magnetic device 23, thereby achieving heat dissipation of the magnetic device 23. The heat generated by the electronic device 24 during operation can be transferred to the heat exchanger 33. The heat dissipation fan 31 can drive the heat dissipation wind to flow into the second cavity 12 from the air inlet hole 13, and then flow out of the second cavity 12 through the heat exchanger 33, so as to transfer the heat generated by the electronic device 24 during operation to the external environment, thereby achieving heat dissipation of the electronic device 24.

[0084] It can be seen that the power conversion device 100 provided by the application can avoid foreign matters from the outside caused by the bottom air inlet and the top air outlet in the prior art by the side air outlet in the second direction, thereby improving the reliability of heat dissipation of the power device 22. In addition, in order to cooperate with the air outlet hole design, the plurality of ventilation holes 323 formed between the plurality of condensing flat tubes 324 also extend in the second direction, so that the air between the air inlet hole 13 and the air outlet hole 14 can be dissipated to the plurality of condensing flat tubes 324 through the plurality of ventilation holes 323, thereby greatly improving the heat dissipation efficiency of the plurality of condensing flat tubes 324, and improving the heat dissipation efficiency of the power device 22. In addition, in the third direction, the heat sink 32, the heat exchanger 33 and the magnetic device 23 are sequentially arranged, and the direction of the heat dissipation air duct is extended in the second direction, that is, the heat dissipation cascade does not occur between the devices below the second cavity 12 and the devices above, and different types of devices can form their own independent heat dissipation air ducts in the second direction.

[0085] Based on the above-mentioned side air outlet concept, as long as the plurality of condensing flat tubes 324 of the heat sink 32 and the ventilation holes 323 formed by the evaporation cavity 3211 are extended in the second direction, the specific arrangement mode can be various. For example, the plurality of condensing flat tubes 324 can be arranged in the first direction, in the third direction, or in other directions (for example, arranged at an arbitrary angle with the heat dissipation substrate 321), and the application does not make specific limitations. The following exemplary embodiments are described.

[0086] Referring to FIGS. 3a and 3b, in the embodiments shown in FIGS. 3a and 3b, in the third direction, the plurality of condensing flat tubes 324 are sequentially and spacedly arranged and form a plurality of ventilation holes 323. For example, as shown in FIG. 3a, the plurality of condensing flat tubes 324 include a first condensing flat tube 324a, a second condensing flat tube 324b, a third condensing flat tube 324c, a fourth condensing flat tube 324d, a fifth condensing flat tube 324e and a sixth condensing flat tube 324f. In the third direction, the first condensing flat tube 324a, the second condensing flat tube 324b, the third condensing flat tube 324c, the fourth condensing flat tube 324d, the fifth condensing flat tube 324e and the sixth condensing flat tube 324f are sequentially and spacedly arranged and form five ventilation holes 323. In some other embodiments, the number of condensing flat tubes 324 can also be two, three or more.

[0087] Further referring to FIG. 4, the condensing flat tube 324 can include a plurality of flow channels 3241, adjacent flow channels 3241 are separated by a baffle 3242 in the second direction, each flow channel 3241 extends along the first direction, and the plurality of flow channels 3241 are all in communication between the evaporation cavity 3211 and the flow-through cavity 3251. Dividing the condensing flat tube 324 into a plurality of flow channels can uniformly distribute the pressure generated by the gaseous working medium in each flow channel, and the baffle 3242 can also withstand a certain pressure to avoid the problem of bulging, so that the stability of the entire condensing flat tube 324 is better.

[0088] In this embodiment, the heat sink 32 also includes a communication part 325. In the first direction, the communication part 325 contacts and is fixedly connected to one side of the plurality of condensing flat tubes 324 away from the heat dissipation base plate 321. Among them, the communication part 325 includes a flow-through cavity 3251, which is the inner cavity of the communication part 325. In the first direction, the flow-through cavity 3251 is located on the side of the plurality of condensing flat tubes 324 away from the evaporation cavity 3211. That is, the communication part 325 is in contact with and fixedly connected to the plurality of condensing flat tubes 324. In the third direction, the flow-through cavity 3251 is located above the cooling working medium in the evaporation cavity 3211. The flow-through cavity 3251 is in communication with the evaporation cavity 3211 through the plurality of condensing flat tubes 324.

[0089] Further, the projection of the communication part 325 in the first direction covers the projection of each ventilation hole 323 in the first direction, and the projection of the heat dissipation base plate 321 in the first direction covers the projection of each ventilation hole 323 in the first direction. That is, by sandwiching the plurality of condensing flat tubes 324 with the board surfaces of the heat dissipation base plate 321 and the communication part 325, the heat dissipation air flow can be guided, which is conducive to improving the efficiency of the heat dissipation air flowing through the ventilation holes, and thereby improving the heat dissipation efficiency of the condensing flat tubes.

[0090] In some embodiments, the evaporation cavity 3211 includes an evaporation cavity bottom wall 3212. In the third direction, the evaporation cavity bottom wall 3212 has the same orientation as the third positive direction. In the third negative direction, the evaporation cavity bottom wall 3212 is located on one side of the plurality of condensing flat tubes 324 and the communication part 325, that is, the evaporation cavity bottom wall 3212 is located below the plurality of condensing flat tubes 324 and below the flow-through cavity 3251. Thus, in the third direction, the cooling working medium in the evaporation cavity 3211 can be located below the plurality of condensing flat tubes 324 and below the flow-through cavity 3251, which is simple in structure and convenient for design, and is conducive to reducing processing costs.

[0091] In the embodiments shown in FIGS. 3a and 3b, the air inlet hole 13 and the air outlet hole 14 both extend along the second direction, and in the second direction, the air inlet hole 13 and the air outlet hole 14 are located on both sides of the plurality of condensing flat tubes 324, that is, side air inlet and side air outlet.

[0092] Specifically, referring to FIG. 2 and FIG. 3a, the connecting wall 18 comprises a first connecting wall 18a, a second connecting wall 18b, a third connecting wall 18c, a fourth connecting wall 18d and a fifth connecting wall 18e, and the connecting wall 18 cooperates with the partition wall 16 to define the second cavity 12. The first connecting wall 18a and the second connecting wall 18b are oppositely arranged along the third direction, and the third connecting wall 18c and the partition wall 16 are oppositely arranged along the first direction. The fourth connecting wall 18d and the fifth connecting wall 18e are oppositely arranged along the second direction.

[0093] Referring to FIG. 3a and FIG. 3b, the air inlet hole 13 penetrates the fourth connecting wall 18d along the second direction, and the axis of the air inlet hole 13 is parallel to the second direction. For example, the number of the air inlet hole 13 can be multiple. The multiple air inlet holes 13 comprise a first air inlet hole 13a, a second air inlet hole 13b and a third air inlet hole 13c. In the third direction, the second air inlet hole 13b, the first air inlet hole 13a and the third air inlet hole 13c are sequentially and spacedly arranged. In some other embodiments, the air inlet hole can be multiple small holes densely distributed on the fourth connecting wall 18d. The air outlet hole 14 penetrates the fifth connecting wall 18e along the second direction, and the axis of the air outlet hole 14 is parallel to the second direction. For example, the number of the air outlet hole 14 can be multiple. The multiple air outlet holes 14 comprise a first air outlet hole 14a, a second air outlet hole 14b and a third air outlet hole 14c. In the third direction, the second air outlet hole 14b, the first air outlet hole 14a and the third air outlet hole 14c are sequentially and spacedly arranged. In some other embodiments, the air outlet hole can be multiple small holes densely distributed on the fifth connecting wall 18e.

[0094] Specifically, the air inlet side of the heat dissipation fan 31 faces the air inlet hole 13. In the second direction, the heat dissipation fan 31 can be located on the side of the heat sink 32 facing or away from the air inlet hole 13. Specifically, in the second direction, the heat dissipation fan 31 is located on the side of the multiple condensation flat tubes 324 facing the air inlet hole 13. The heat dissipation fan 31 can drive the airflow to form heat dissipation wind. The heat dissipation fan 31 can drive the heat dissipation wind to flow into the second cavity 12 from the air inlet hole 13, and then flow out of the second cavity 12 from the air outlet hole 14 through the heat sink 32.

[0095] The number of the heat dissipation fan 31 can be multiple, for example, the multiple heat dissipation fans 31 comprise a first heat dissipation fan 31a, a second heat dissipation fan 31b, a third heat dissipation fan 31c and a fourth heat dissipation fan 31d. In the third direction, the third heat dissipation fan 31c, the first heat dissipation fan 31a, the second heat dissipation fan 31b and the fourth heat dissipation fan 31d are sequentially and spacedly arranged. In some embodiments, the multiple heat dissipation fans 31 overlap with the projections of the multiple air inlet holes 13 and the multiple air outlet holes 14 in the second direction. Such design is conducive to reducing the flow resistance of the heat dissipation wind flowing through the multiple condensation flat tubes 324, increasing the air volume of the heat dissipation wind flowing through the multiple condensation flat tubes 324, and improving the heat dissipation efficiency of the heat dissipation wind on the multiple condensation flat tubes 324.

[0096] In some embodiments, the projection of the at least multiple condensing fins 324 in the second direction overlaps with the projection of the air inlet 13 in the second direction and the projection of the air outlet 14 in the second direction, so as to cover the condensing fins with the air duct, thereby improving the heat dissipation efficiency. Of course, the projection of the air inlet 13 in the second direction and the projection of the air outlet 14 in the second direction can also cover more parts of the heat sink 32 to further increase the heat dissipation area.

[0097] In the embodiments shown in FIGS. 3a and 3b, the heat generated by the power device 22 is transferred to the cooling medium in the evaporation cavity 3211 through the heat dissipation substrate 321. The cooling medium in the evaporation cavity 3211 absorbs heat to boil and form cooling medium in a gaseous state, which flows from the evaporation cavity 3211 to the flow-through cavity 3251 through each condensing fin 324. Part of the cooling medium in the liquid state in the condensing fin 324 flows from the condensing fin 324 to the flow-through cavity 3251, and part of the cooling medium directly flows back to the evaporation cavity 3211 under the action of gravity. The cooling medium in the flow-through cavity 3251 flows back to the evaporation cavity 3211 through the condensing fin 324 under the action of gravity. The heat dissipation air can flow into the second cavity 12 from the air inlet 13, and then flow out of the second cavity 12 from the air outlet 14 through the multiple condensing fins 324. The heat generated by the power device 22 during operation can be transferred to the external environment through the heat dissipation air.

[0098] Compared with the prior art, in the power conversion device 100 provided by the embodiment of the application, the axis of the air inlet hole 13 and the axis of the air outlet hole 14 are parallel to the second direction, so that the situation that foreign matters (such as dust or fallen leaves) block the air outlet hole 14 and the air inlet hole 13 can be avoided, the cooling air can flow through the second cavity 12 smoothly, the reliability of heat dissipation of the power device 22 is improved, the maintenance cost of the power conversion device 100 is reduced, the space at the top of the power conversion device 100 is avoided to be reserved, the cooling air flowing out of the second cavity 12 from the air outlet hole 14 cannot be dispersed, the temperature of the air around the power conversion device 100 is too high, the installation space of the power conversion device 100 is reduced. In addition, the design that the ventilation hole 323 extends along the second direction ensures that the cooling air flowing into the second cavity 12 from the air inlet hole 13 can quickly and smoothly flow through the plurality of condensing flat tubes 324 of the radiator from the ventilation hole 323 and then flow out of the second cavity 12 from the air outlet hole 14, the contact area of each condensing flat tube 324 with the cooling air is increased, the efficiency of the cooling air carrying the heat generated by the power device 22 out of the second cavity 12 is improved, and the heat dissipation efficiency of the power device 22 is improved. In addition, the situation that rainwater flows into the second cavity 12 from the bottom (i.e., the second connecting wall 18b) of the power conversion device 100 in rainy weather can be avoided, the situation that the rainwater washes or soaks the cooling fan 31 and the cooling fan 31 cannot work normally can be avoided, the working reliability of the cooling fan 31 is improved, and the working life of the cooling fan 31 is prolonged.

[0099] Further referring to FIG. 3a, in some embodiments, a heat dissipation fin 326 is further arranged between two adjacent condensing flat tubes 324 and spaced along the first direction. In the third direction, the heat dissipation fin 326 is fixedly connected with the two adjacent condensing flat tubes 324. That is, the heat dissipation fin 326 is accommodated in the ventilation hole 323 formed between the two adjacent condensing flat tubes 324. The design of the heat dissipation fin 326 is beneficial to increase the heat dissipation area of the plurality of condensing flat tubes 324, improve the heat dissipation efficiency of the cooling air on the plurality of condensing flat tubes 324, improve the heat dissipation efficiency of the cooling air on the radiator 32, and improve the heat dissipation efficiency of the power device 22.

[0100] In some embodiments, two of the heat sink 32, the magnetic device 23 and the heat exchanger 33 are located on two sides of the other in the third direction. Please refer to FIG. 3a, FIG. 5, FIG. 6, FIG. 7, FIG. 8 and FIG. 9, which show various possible embodiments of two of the heat sink 32, the magnetic device 23 and the heat exchanger 33 being located on two sides of the other in the third direction. In the embodiment shown in FIG. 3a, in the third direction, the magnetic device 23 is located above the heat sink 32, and the heat exchanger 33 is located below the heat sink 32. In the third direction, the magnetic device 23 and the heat exchanger 33 are both spaced apart from the heat sink 32. Specifically, the magnetic device 23 is connected to and fixed on one side of the partition wall 16 and faces away from the first cavity 11. In the second direction, the magnetic device 23 is located between the air inlet hole 13 and the air outlet hole 14. Specifically, the projection of the magnetic device 23 in the second direction overlaps the projection of the air inlet hole 13 in the second direction and the projection of the air outlet hole 14 in the second direction. For example, the number of magnetic devices 23 is multiple. In the second direction, the multiple magnetic devices 23 are sequentially and spaced apart. The embodiments shown in FIG. 5, FIG. 6, FIG. 7, FIG. 8 and FIG. 9 are similar to FIG. 3a, except that the arrangement of the heat sink 32, the magnetic device 23 and the heat exchanger 33 in the third direction can be interchanged, which will not be described here.

[0101] The design of the magnetic device 23 / heat exchanger 33 being located on one side of the heat sink 32 in the third direction can avoid the situation that the cooling air flows through the heat sink 32 and then flows through the magnetic device 23 / heat exchanger 33, or the situation that the cooling air flows through the magnetic device 23 / heat exchanger 33 and then flows through the heat sink 32, ensuring that the air duct where the heat sink 32 is located and the air duct where the magnetic device 23 / heat exchanger 33 is located are independent of each other, avoiding the temperature cascade problem between the heat sink 32 and the magnetic device 23, which is conducive to improving the heat dissipation efficiency of the power device 22 and the magnetic device 23, reducing the air temperature in the first cavity 11, and improving the working performance of the electronic device 24.

[0102] In some embodiments, in the third direction, the distribution of the multiple cooling fans 31 can correspond to the positions of the heat sink 32, the magnetic device 23 and the heat exchanger 33, for example, the multiple cooling fans 31 include a first cooling fan 31a, a second cooling fan 31b, a third cooling fan 31c and a fourth cooling fan 31d, the first cooling fan 31a and the second cooling fan 31b correspond to the heat sink 32, the third cooling fan 31c corresponds to the heat exchanger 33, and the fourth cooling fan 31d corresponds to the magnetic device 23, so as to achieve precise cooling of the main devices.

[0103] In some embodiments, the magnetic device 23 is provided with heat-conducting fins 231. Specifically, the heat-conducting fins 231 include first heat-conducting fins 231a, second heat-conducting fins 231b, and third heat-conducting fins 231c. In the third direction, the first heat-conducting fins 231a are arranged on one side of the magnetic device 23, and the second heat-conducting fins 231b are arranged on the other side of the magnetic device 23. Specifically, in the third direction, the first heat-conducting fins 231a are in contact with and fixedly connected to one side of the magnetic device 23, and the second heat-conducting fins 231b are in contact with and fixedly connected to the other side of the magnetic device 23. In the first direction, the third heat-conducting fins 231c are arranged on one side of the magnetic device 23 and face away from the first cavity 11, and the third heat-conducting fins 231c are in contact with and fixedly connected to one side of the magnetic device 23 and face away from the first cavity 11.

[0104] For example, the number of the first heat-conducting fins 231a, the number of the second heat-conducting fins 231b, and the number of the third heat-conducting fins 231c are all multiple. In the first direction, the multiple first heat-conducting fins 231a are arranged in sequence with intervals. In the first direction, the multiple second heat-conducting fins 231b are arranged in sequence with intervals. In the third direction, the multiple third heat-conducting fins 231c are arranged in sequence with intervals. In other embodiments, the number of the first heat-conducting fins 231a, the number of the second heat-conducting fins 231b, and the number of the third heat-conducting fins 231c can also be one. The design of the heat-conducting fins 231 is conducive to increasing the contact area of the magnetic device 23 with the cooling air, improving the efficiency of the cooling air transferring the heat generated by the magnetic device 23 during operation to the external environment, and improving the heat dissipation efficiency of the magnetic device 23.

[0105] In some embodiments, the shell 10 is also provided with a matching hole 19. The matching hole 19 communicates with the first cavity 11 and the second cavity 12. Specifically, the matching hole 19 penetrates the partition wall 16 in the first direction and communicates with the first cavity 11 and the second cavity 12. The heat exchanger 33 is exposed to the first cavity 11 through the matching hole 19. Specifically, in the third direction, the matching hole 19 is located on the side of the heat sink 32 facing away from the magnetic device 23, and the heat exchanger 33 covers the matching hole 19 to close the first cavity 11.

[0106] In some embodiments, the heat exchanger 33 is partially arranged in the matching hole 19 and extends into the first cavity 11. Specifically, the heat exchanger 33 comprises a heat exchange body 331, a heat exchange portion 332 and a heat dissipation portion 333. In the first direction, the heat exchange portion 332 is arranged at one side of the heat exchange body 331, and the heat dissipation portion 333 is arranged at the other side of the heat exchange body 331. Specifically, in the first direction, the heat exchange portion 332 is in contact with and fixedly connected to one side of the heat exchange body 331, and the heat dissipation portion 333 is in contact with and fixedly connected to the other side of the heat exchange body 331. In the first direction, the heat exchange body 331 is arranged at one side of the partition wall 16 and faces away from the first cavity 11, and the heat exchange body 331 is in contact with and fixedly connected to one side of the partition wall 16 and faces away from the first cavity 11. The heat exchange body 331 covers the matching hole 19 and seals the first cavity 11. The heat exchange portion 332 is arranged in the matching hole 19 and extends into the first cavity 11. The heat dissipation portion 333 faces away from the heat exchange portion 332 and is accommodated in the second cavity 12.

[0107] That is, the heat exchanger 33 is provided with the heat exchange portion 332 arranged in the matching hole 19 and extending into the first cavity 11. The side of the heat exchanger 33 facing away from the heat exchange portion 332 is further provided with the heat dissipation portion 333 accommodated in the second cavity 12. For example, the heat exchange portion 332 is provided in a plurality of numbers. In the third direction, the plurality of heat exchange portions 332 are arranged in sequence with intervals. The heat dissipation portion 333 is provided in a plurality of numbers. In the third direction, the plurality of heat dissipation portions 333 are arranged in sequence with intervals.

[0108] The heat generated by the electronic device 24 during operation is transferred to the heat exchange portion 332 of the heat exchanger 33 through the air in the first cavity 11, and then transferred to the heat dissipation portion 333 through the heat exchange body 331. The heat dissipation fan 31 can drive the heat dissipation air to flow into the second cavity 12 from the air inlet hole 13, and then flow out of the second cavity 12 from the air outlet hole 14 through the heat exchange body 331 and the heat dissipation portion 333, thereby transferring the heat generated by the second cavity 12 during operation to the external environment, achieving the reduction of the air temperature in the first cavity 11. The design of the heat exchange portion 332 is beneficial to increase the contact area of the heat exchanger 33 and the air in the first cavity 11, and is beneficial to improve the efficiency of heat transfer from the electronic device 24 during operation to the heat exchanger 33, and is beneficial to improve the heat dissipation efficiency of the electronic device 24, and is beneficial to reduce the air temperature in the first cavity 11, and is beneficial to improve the working performance of the electronic device 24. The design of the heat dissipation portion 333 is beneficial to increase the contact area of the heat exchanger 33 and the heat dissipation air, and is beneficial to improve the efficiency of heat transfer from the electronic device 24 during operation to the external environment through the heat exchanger 33, and is beneficial to improve the heat dissipation efficiency of the electronic device 24, and is beneficial to reduce the air temperature in the first cavity 11, and is beneficial to improve the working performance of the electronic device 24.

[0109] It should be understood that in some other embodiments, the above-mentioned embodiments are also applicable to the scenario of back air inlet and two-side or one-side air outlet, that is, the air inlet hole 13 extends in the first direction, and the air outlet hole 14 extends in the second direction. In the first direction, the air inlet hole is located on the side of the second cavity away from the first cavity, and in the second direction, at least one air outlet hole is located on at least one side of the plurality of condensation flat tubes. Details will be further described below.

[0110] Please refer to FIG. 10 and FIG. 11, FIG. 10 is a structural schematic diagram of another power conversion device 100 provided by the embodiments of the present application. FIG. 11 is a structural schematic diagram of the power conversion device 100 shown in FIG. 10 along the B-B line.

[0111] As shown in FIG. 10 and FIG. 11, the embodiment shown in FIG. 10 is similar to the embodiment shown in FIG. 3a in structure, and the difference between the two is that the communication mode of the plurality of condensation flat tubes 324 and the evaporation cavity 3211 is different. Specifically, in the embodiment shown in FIG. 10, the condensation part 322 includes a first communication part 325a, a second communication part 325b, and a plurality of condensation flat tubes 324. In the first direction, the first communication part 325a and the second communication part 325b are both arranged on one side of the heat dissipation substrate 321 and away from the power device 22, and are both fixedly connected to one side of the heat dissipation substrate 321 and away from the power device 22. In the third direction, the first communication part 325a and the second communication part 325b are oppositely arranged, that is, in the third direction, the first communication part 325a is located above the second communication part 325b. The plurality of condensation flat tubes 324 are arranged between the first communication part 325a and the second communication part 325b, and are fixedly connected therebetween, and in the first direction, the plurality of condensation flat tubes 324 are arranged in a spaced manner to form a plurality of ventilation holes 323. In the third direction, the first communication part 325a, the second communication part 325b, and the plurality of condensation flat tubes 324 are all located above the cooling working medium in the evaporation cavity 3211. In the first direction, the plurality of condensation flat tubes 324 are arranged in a spaced manner with the heat dissipation substrate 321, and there is a spacing hole 327 between the heat dissipation substrate 321 and the condensation flat tube 324.

[0112] The first communication part 325a comprises a first flow cavity 3251a which is an inner cavity of the first communication part 325a. The second communication part 325b comprises a second flow cavity 3251b which is an inner cavity of the second communication part 325b. The first flow cavity 3251a is in communication with the second flow cavity 3251b through the plurality of condensation flat tubes 324, and the first flow cavity 3251a and the second flow cavity 3251b are both in communication with the condensation flat tubes 324 to realize the communication between the evaporation cavity 3211 and the condensation flat tubes 324. In the embodiment shown in FIG. 10, the condensation flat tubes 324 can also comprise at least one flow channel 3241 which extends in the third direction, and the plurality of flow channels 3241 are sequentially and spacedly arranged in the second direction. Each flow channel 3241 of the condensation flat tubes 324 is in communication with the first flow cavity 3251a and the second flow cavity 3251b. The first flow cavity 3251a and the second flow cavity 3251b are both in communication with the evaporation cavity 3211.

[0113] In the embodiments shown in FIG. 10 and FIG. 11, the heat generated by the power device 22 during operation is transmitted to the cooling working medium in the evaporation cavity 3211 through the heat dissipation substrate 321. The cooling working medium in the evaporation cavity 3211 absorbs heat to boil and form cooling working medium in a gaseous state, which can flow from the evaporation cavity 3211 to the plurality of condensation flat tubes 324 through the first flow cavity 3251a. The cooling working medium in a gaseous state releases heat to condense and form cooling working medium in a liquid state in the plurality of condensation flat tubes 324 and the first flow cavity 3251a. Under the action of gravity, the cooling working medium in a liquid state flows back to the evaporation cavity 3211 from the second flow cavity 3251b through the plurality of condensation flat tubes 324. Specifically, the cooling working medium in a gaseous state formed by the cooling working medium in the evaporation cavity 3211 absorbing heat to boil can flow from the evaporation cavity 3211 to each flow channel 3241 of the plurality of condensation flat tubes 324 through the first flow cavity 3251a. The cooling working medium in a gaseous state releases heat to condense and form cooling working medium in a liquid state in each flow channel 3241 and the first flow cavity 3251a. Under the action of gravity, the cooling working medium in a liquid state in the first flow cavity 3251a flows from the first flow cavity 3251a to the second flow cavity 3251b through each flow channel 3241, and then flows back to the evaporation cavity 3211 from the second flow cavity 3251b; the cooling working medium in a liquid state in each flow channel 3241 flows back to the evaporation cavity 3211 through the second flow cavity 3251b.

[0114] Further, the projection of the first communication part 325a in the third direction and the projection of the second communication part 325b in the third direction both cover the projection of each vent hole 323 in the third direction. The heat dissipation wind flowing through each vent hole 323 can be guided by the first communication part 325a, the second communication part 325b and each adjacent two condensing flat tubes 324, which is conducive to improving the efficiency of the heat dissipation wind flowing through the vent hole 323, improving the efficiency of the heat dissipation wind carrying out the heat generated by the power device 22 when working, and improving the heat dissipation efficiency of the power device 22.

[0115] In the embodiment shown in FIG. 10, a heat dissipation fin 326 can also be arranged between the adjacent two condensing flat tubes 324, and the heat dissipation fin 326 is fixedly connected with the two adjacent condensing flat tubes 324. The heat dissipation fin 326 is accommodated in the vent hole 323 formed between the two adjacent condensing flat tubes 324, and the area of the projection of the heat dissipation fin 326 in the second direction is smaller than the area of the projection of the vent hole 323 in the second direction. For example, the number of heat dissipation fins 326 between the adjacent two condensing flat tubes 324 can be multiple. The multiple heat dissipation fins 326 are sequentially and spacedly arranged along the third direction.

[0116] In the first direction, a heat exchange fin 328 is arranged between the heat dissipation substrate 321 and the condensing flat tube 324 close to the heat dissipation substrate 321. Specifically, the heat exchange fin 328 is fixedly connected with the heat dissipation substrate 321 and the condensing flat tube 324. The heat exchange fin 328 is accommodated in the spacing hole 327, and the area of the projection of the heat exchange fin 328 in the second direction is smaller than the area of the projection of the spacing hole 327 in the second direction. For example, the number of heat exchange fins 328 can be multiple, and the multiple heat exchange fins 328 are sequentially and spacedly arranged along the third direction. The design of the heat exchange fin 328 is conducive to increasing the heat dissipation area of the condensing flat tube 324 for the heat dissipation wind flowing through the space between the wall of the evaporation cavity 3211 and the condensing flat tube 324, improving the heat dissipation efficiency of the condensing flat tube 324 for the heat dissipation wind, improving the heat dissipation efficiency of the heat dissipation device 32 for the heat dissipation wind, and improving the heat dissipation efficiency of the power device 22.

[0117] It should be understood that the power device 22 in the power conversion circuit 20 generally has multiple, and in the above embodiment, one power device 22 is taken as an example for description. In fact, multiple power devices 22 can be cooled by the heat dissipation device 32 in the above embodiment. Specifically, the multiple power devices 22 can be spacedly distributed, and each power device 22 is in contact with the heat dissipation device 32 through the corresponding mounting hole 15, so that one heat dissipation device 32 can cool multiple power devices 22.

[0118] In some other embodiments, the plurality of power devices 22 can also be divided into two groups, for example, the power devices 22 that implement DC-DC (direct current-direct current) conversion are divided into one group, and the power devices 22 that implement DC-AC (direct current-alternating current) conversion are divided into another group, and each group of power devices corresponds to one heat sink 32, that is, the two groups of power devices 22 are cooled by two heat sinks 32. The number of power devices 22 in each group can be one or multiple. It can be understood that the correspondence between the plurality of power devices 22 and the heat sink 32 is not limited to this, for example, more groups can also be divided, and each group is cooled by more heat sinks 32. The following embodiments mainly exemplify the scenario of two heat sinks 32.

[0119] Referring to FIG. 12 and FIG. 13, FIG. 12 is a structural schematic diagram of another power conversion device 100 provided by an embodiment of the present application. FIG. 13 is a structural schematic diagram of the power conversion device 100 shown in FIG. 12 along the C-C line.

[0120] As shown in FIG. 12 and FIG. 13, the structure of the heat sink 32 in the embodiment shown in FIG. 12 is similar to that of the embodiment shown in FIG. 3a or FIG. 10, and the difference is that the number of heat sinks 32 is different. In the embodiment shown in FIG. 12, the number of power devices 22 is multiple and is divided into two groups. In the third direction, the plurality of power devices 22 are sequentially and spacedly arranged. The plurality of power devices 22 correspond one-to-one to the plurality of mounting holes 15. The plurality of power devices 22 are one-to-one correspondingly installed in the plurality of mounting holes 15.

[0121] The number of heat sinks 32 is multiple. Specifically, the number of heat sinks 32 is two. In the third direction, the plurality of heat sinks 32 are sequentially arranged. Specifically, in the third direction, the plurality of heat sinks 32 are sequentially and spacedly arranged.

[0122] Each heat sink 32 corresponds to a group of power devices 22. The plurality of heat sinks 32 are one-to-one correspondingly in contact with each group of power devices 22. Among them, in the second direction, each heat sink 32 is located between the air inlet hole 13 and the air outlet hole 14. In the third direction, the magnetic device 23 and the heat exchanger 33 are located on both sides of the plurality of heat sinks 32, and the magnetic device 23 and the heat exchanger 33 are spacedly arranged from the plurality of heat sinks 32.

[0123] It should be noted that in other possible implementations, the plurality of heat sinks 32 can also be fixedly connected in the third direction. Specifically, in two adjacent heat sinks 32, the heat dissipation substrate 321 of one heat sink 32 is fixedly connected with the heat dissipation substrate 321 of the other heat sink 32. In this way, the heat generated by each group of power devices 22 when working can be transmitted to the external environment through the plurality of heat sinks 32, which is conducive to improving the heat dissipation efficiency of each power device 22. Moreover, the plurality of heat sinks 32 are fixedly connected in sequence in the third direction, which is conducive to improving the connection strength between the plurality of heat sinks 32 and the structural stability of the power conversion device 100.

[0124] In this embodiment, the heat generated by each group of power devices 22 when working can be transmitted to the plurality of condensation flat tubes 324 through the cooling working medium in the evaporation cavity 3211 of the corresponding heat sink 32 for heat dissipation, thereby realizing rapid heat dissipation of each group of power devices 22. At the same time, in the third direction, the plurality of heat sinks 32 are arranged in sequence, which not only ensures that the heat dissipation wind flowing into the second cavity 12 from the air inlet hole 13 can flow through each condensation flat tube 324 of each heat sink 32 from the air vent hole 323 of each heat sink 32, and then flow out of the second cavity 12 from the air outlet hole 14, so as to take out the heat generated by each power device 22 when working from the second cavity 12, thereby realizing rapid heat dissipation of each group of power devices 22; but also can avoid the situation that the heat dissipation wind flows through one heat sink 32 and then flows through another heat sink 32, so as to ensure that the air ducts where each heat sink 32 is located are independent, thereby avoiding the temperature cascade problem between the plurality of heat sinks 32, which is conducive to improving the heat dissipation efficiency of each heat sink 32, the heat dissipation efficiency of each power device 22, and the power density of the power conversion device 100.

[0125] Please refer to FIG. 14 and FIG. 15, FIG. 14 is a structural schematic diagram of another power conversion device 100 provided by the embodiment of the present application. FIG. 15 is a structural schematic diagram of the power conversion device 100 shown in FIG. 14 along the line D-D.

[0126] As shown in FIG. 14 and FIG. 15, the embodiment shown in FIG. 14 is similar to the structure of the embodiment shown in FIG. 12, and the difference between the two is that the cooperation relationship between the heat exchanger 33 and the heat sink 32 is different. In the embodiment shown in FIG. 14, the heat exchanger 33 is in contact with and fixedly connected with the heat sink 32. Specifically, the heat exchanger 33 is fixedly connected with the heat dissipation substrate 321 of the heat sink 32. Specifically, the heat exchanger body 331 can be in contact with and fixedly connected with the heat dissipation substrate 321.

[0127] In the second direction, two heat dissipation fans 31 can be respectively arranged corresponding to two heat sinks 32. Specifically, the first heat dissipation fan 31a is located between the air inlet hole 13 and one heat sink 32, and the second heat dissipation fan 31b is located between the air inlet hole 13 and the other heat sink 32. In some other embodiments, in the second direction, the first heat dissipation fan 31a can also be located between the air outlet hole 14 and one heat sink 32, and the second heat dissipation fan 31b can also be located between the air outlet hole 14 and the other heat sink 32.

[0128] Please refer to FIG. 16, and in combination with FIG. 14, FIG. 16 is a structural schematic diagram of another power conversion device 100 provided by an embodiment of the present application.

[0129] As shown in FIG. 14 and FIG. 16, the embodiment shown in FIG. 16 is similar to the embodiment shown in FIG. 14 in structure, and the difference between the two is that the structure of the heat exchanger 33 is different. In the embodiment shown in FIG. 16, the heat exchanger 33 comprises the heat exchanger body 331, the heat exchange part 332, the heat dissipation part 333, and the connecting part 334. The structure and matching relationship of the heat exchanger body 331, the heat exchange part 332, and the heat dissipation part 333 can refer to the related description of the embodiment shown in FIG. 14, which will not be repeated here. Among them, the number of the heat exchange part 332 is multiple. In the second direction, the connecting part 334 is arranged on one side of the multiple heat exchange parts 332 and faces away from the heat exchanger body 331. The design of the connecting part 334 is conducive to increasing the contact area of the heat exchange part 332 with the air in the first cavity 11, increasing the contact area of the heat exchanger 33 with the air in the first cavity 11, increasing the efficiency of the heat generated by the electronic device 24 during operation being transferred to the external environment through the heat exchanger 33, improving the heat dissipation efficiency of the electronic device 24, reducing the air temperature in the first cavity 11, and improving the working performance of the electronic device 24.

[0130] It should be understood that the structure of the heat exchanger 33 described above can also be used in any of the embodiments shown in FIG. 2-FIG. 14.

[0131] Please refer to FIG. 17, FIG. 18, FIG. 19, and FIG. 20, and in combination with FIG. 14, FIG. 17 is a structural schematic diagram of another power conversion device 100 provided by an embodiment of the present application. FIG. 18 is a structural schematic diagram of the power conversion device 100 shown in FIG. 17 along the E-E line. FIG. 19 is a structural schematic diagram of the power conversion device 100 shown in FIG. 18 along the F-F line. FIG. 20 is a structural schematic diagram of the power conversion device 100 shown in FIG. 19 along the G-G line.

[0132] As shown in FIG. 14, FIG. 17, and FIG. 18, the embodiment shown in FIG. 17 is similar to the embodiment shown in FIG. 14 in structure, and the difference between the two is that the structure of the heat sink 32 is different, and the air inlet hole 13, the air outlet hole 14, and the arrangement of the features related to the two are different.

[0133] As shown in FIG. 17, FIG. 18 and FIG. 19, in the embodiment shown in FIG. 17, in each heat sink 32, the number of condensing portions 322 of the heat sink 32 is multiple. Specifically, the multiple condensing portions 322 include a first condensing portion 322a and a second condensing portion 322b. In the first direction, the first condensing portion 322a and the second condensing portion 322b are both disposed on one side of the heat sink substrate 321 and face away from the power device 22. In the second direction, the first condensing portion 322a and the second condensing portion 322b are spaced apart. Each condensing portion 322 includes multiple condensing flat tubes 324.

[0134] Further, the number of heat radiating portions 333 of the heat exchanger 33 can also be multiple. Specifically, the multiple heat radiating portions 333 include multiple first heat radiating portions 333a and multiple second heat radiating portions 333b. In the third direction, the multiple first heat radiating portions 333a are sequentially and spaced apart, and the multiple second heat radiating portions 333b are sequentially and spaced apart. In the second direction, the multiple second heat radiating portions 333b are located on one side of each first heat radiating portion 333a and spaced apart from each first heat radiating portion 333a. In the first direction, each first heat radiating portion 333a and each second heat radiating portion 333b are both disposed on one side of the heat exchanger body 331 and face away from the first cavity 11.

[0135] As shown in FIG. 17, FIG. 18, FIG. 19 and FIG. 20, the shell 10 is provided with an air inlet hole 13 and an air outlet hole 14. The air inlet hole 13 extends along the first direction, and in the first direction, the air inlet hole 13 is located on the side of the second cavity 12 facing away from the first cavity 11. The air inlet hole 13 communicates with the second cavity 12, and the axis of the air inlet hole 13 is parallel to the first direction. The air outlet hole 14 extends along the second direction, and the air outlet hole 14 communicates with the second cavity 12, and the axis of the air outlet hole 14 is parallel to the second direction. In the second direction, the air inlet hole 13 and the air outlet hole 14 are located on both sides of the multiple condensing flat tubes 324 of each heat sink 32.

[0136] Specifically, the air inlet hole 13 penetrates the third connecting wall 18c along the first direction and communicates with the second cavity 12. In the first direction, the air inlet hole 13 is located on the side of the second cavity 12 facing away from the first cavity 11. Illustratively, the number of air inlet holes 13 is multiple, and the multiple air inlet holes 13 can be a first air inlet hole 13a, a second air inlet hole 13b, a third air inlet hole 13c and a fourth air inlet hole 13d. In the third direction, the third air inlet hole 13c, the first air inlet hole 13a, the second air inlet hole 13b and the fourth air inlet hole 13d are sequentially and spaced apart. In other embodiments, the air inlet hole 13 can be multiple small holes densely distributed on the third connecting wall 18c.

[0137] The first air inlet hole 13a can correspond to one heat sink 32, the second air inlet hole 13b can correspond to another heat sink 32, the third air inlet hole 13c can correspond to the magnetic device 23, and the fourth air inlet hole 13d can correspond to the heat exchanger 33. In the first air inlet hole 13a and the heat sink 32 corresponding to the first air inlet hole 13a, the projection of the first air inlet hole 13a and the second air inlet hole 13b in the first direction overlaps the projection of the two heat sink substrates 321 in the first direction. In the second direction, the first air inlet hole 13a and the second air inlet hole 13b are located between the first condensation part 322a and the second condensation part 322b.

[0138] The projection of the third air inlet hole 13c in the first direction overlaps the projection of the magnetic device 23 in the first direction. The projection of the fourth air inlet hole 13d in the first direction overlaps the projection of the heat exchange body 331 of the heat exchanger 33 in the first direction. In the second direction, the fourth air inlet hole 13d is located between each first heat dissipation part 333a and each second heat dissipation part 333b.

[0139] Specifically, the number of air outlet holes 14 is at least two, which are located on both sides of the heat sink 32 in the second direction. For example, the air outlet holes 14 include the first air outlet hole 14a and the second air outlet hole 14b, and further include the third air outlet hole 14c and the fourth air outlet hole 14d. The first air outlet hole 14a and the third air outlet hole 14c both penetrate the fourth connecting wall 18d along the second direction and both communicate with the second cavity 12. In the third direction, the first air outlet hole 14a and the third air outlet hole 14c are arranged at intervals. The second air outlet hole 14b and the fourth air outlet hole 14d both penetrate the fifth connecting wall 18e along the second direction and both communicate with the second cavity 12. In the third direction, the second air outlet hole 14b and the fourth air outlet hole 14d are arranged at intervals. In other embodiments, the air outlet holes 14 can be a plurality of small holes densely distributed on the fourth connecting wall 18d and the fifth connecting wall 18e.

[0140] In the second direction, the first air outlet hole 14a and the second air outlet hole 14b are located on both sides of each air inlet hole 13, that is, the first air outlet hole 14a and the second air outlet hole 14b are located on both sides of the air inlet hole 13. In the second direction, the third air outlet hole 14c and the fourth air outlet hole 14d are located on both sides of each air inlet hole 13, that is, the third air outlet hole 14c and the fourth air outlet hole 14d are located on both sides of the air inlet hole 13.

[0141] The projection of the first air outlet hole 14a in the second direction overlaps the projection of each heat sink 32 in the second direction. The projection of the first air outlet hole 14a in the second direction overlaps the projection of the heat exchanger 33 in the second direction. The projection of the second air outlet hole 14b in the second direction overlaps the projection of each heat sink 32 in the second direction. The projection of the second air outlet hole 14b in the second direction overlaps the projection of the heat exchanger 33 in the second direction. Among one heat sink 32, the plurality of condensing flat tubes 324 of the first condensing part 322a is located between the first air inlet hole 13a and the first air outlet hole 14a, and the plurality of condensing flat tubes 324 of the second condensing part 322b is located between the first air inlet hole 13a and the second air outlet hole 14b. In another heat sink 32, the plurality of condensing flat tubes 324 of the first condensing part 322a is located between the second air inlet hole 13b and the first air outlet hole 14a, and the plurality of condensing flat tubes 324 of the second condensing part 322b is located between the second air inlet hole 13b and the second air outlet hole 14b.

[0142] The projection of the third air outlet hole 14c in the second direction overlaps the projection of each magnetic device 23 in the first direction. The projection of the fourth air outlet hole 14d in the second direction overlaps the projection of each magnetic device 23 in the first direction. In the first direction, the plurality of magnetic devices 23 is located between the third air outlet hole 14c and the fourth air outlet hole 14d.

[0143] It can be understood that in the second direction, the plurality of condensing flat tubes 324 of the first condensing part 322a is located between the air inlet hole 13 and the first air outlet hole 14a, and the plurality of condensing flat tubes 324 of the second condensing part 322b is located between the air inlet hole 13 and the second air outlet hole 14b. In other embodiments, the second condensing part 322b can also be omitted, that is, the plurality of condensing flat tubes 324 of the heat sink 32 is located between the air inlet hole 13 and the first air outlet hole 14a. The first condensing part 322a can also be omitted, that is, the plurality of condensing flat tubes 324 of the heat sink 32 is located between the air inlet hole 13 and the second air outlet hole 14b.

[0144] In the embodiment shown in FIG. 17, the heat dissipation fan 31 is accommodated in the second cavity 12. The number of heat dissipation fans 31 is multiple, and the multiple heat dissipation fans 31 include a first heat dissipation fan 31a, a second heat dissipation fan 31b, a third heat dissipation fan 31c, and a fourth heat dissipation fan 31d. In other embodiments, the number of heat dissipation fans 31 can also be 1, 2, or more. The first heat dissipation fan 31a corresponds to one heat sink 32. The second heat dissipation fan 31b corresponds to another heat sink 32. The third heat dissipation fan 31c corresponds to the magnetic device 23. The fourth heat dissipation fan 31d corresponds to the heat exchanger 33.

[0145] In the first heat dissipation fan 31a and the heat sink 32 corresponding thereto, in the first direction, the first heat dissipation fan 31a is located between the heat sink 32 and the first air inlet hole 13a, specifically, the first heat dissipation fan 31a is located between the plurality of condensing flat tubes 324 of the condensing part 322 and the first air inlet hole 13a. In the second direction, the first heat dissipation fan 31a is located between the plurality of condensing flat tubes 324 of the first condensing part 322a and the plurality of condensing flat tubes 324 of the second condensing part 322b.

[0146] In the embodiment of the present application, the heat generated by the power device 22 corresponding to the heat sink 32 when working can be transmitted to the plurality of condensing flat tubes 324 of the first condensing part 322a and the plurality of condensing flat tubes 324 of the second condensing part 322b through the cooling working medium in the evaporation cavity 3211 respectively. The first heat dissipation fan 31a can drive the heat dissipation air to flow into the second cavity 12 from the first air inlet hole 13a. The heat dissipation air flows through the plurality of condensing flat tubes 324 of the first condensing part 322a to flow out of the second cavity 12 from the first air outlet hole 14a. The heat dissipation air flows through the plurality of condensing flat tubes 324 of the second condensing part 322b to flow out of the second cavity 12 from the second air outlet hole 14b. Thus, the rapid heat dissipation of the power device 22 is realized.

[0147] The positional relationship of the second heat dissipation fan 31b can refer to the related description of the first heat dissipation fan 31a, and will not be repeated here.

[0148] It can be understood that the heat generated by the power device 22 when working can be transmitted to the plurality of condensing flat tubes 324 of the first condensing part 322a and the plurality of condensing flat tubes 324 of the second condensing part 322b of the heat sink 32 through the cooling working medium in the evaporation cavity 3211. Since the air inlet hole 13 extends along the first direction and is located between the two condensing parts 322, the opposite two air outlet holes 14 (the first air outlet hole 14a and the second air outlet hole 14b) are arranged in the second direction to realize the back air inlet and the two-side air outlet, therefore, the heat dissipation air is equivalent to be divided, and the divided heat dissipation air is cooled by the two heat sinks respectively, so as to improve the heat dissipation efficiency.

[0149] That is, in the second direction, a part of the condensing flat tubes 324 (i.e., the plurality of condensing flat tubes 324 of the first condensing part 322a) is located between the air inlet hole 13 and the first air outlet hole 14a, and another part of the condensing flat tubes 324 (i.e., the plurality of condensing flat tubes 324 of the second condensing part 322b) is located between the air inlet hole 13 and the second air outlet hole 14b, so that the heat dissipation air flowing into the second cavity 12 from the air inlet hole 13 can flow out of the second cavity 12 from the first air outlet hole 14a through the part of the condensing flat tubes 324, and the heat dissipation air can take away the heat of the power device 22 transferred to the part of the condensing flat tubes 324 out of the second cavity 12, and the heat dissipation air flowing into the second cavity 12 from the air inlet hole 13 can flow out of the second cavity 12 from the second air outlet hole 14b through the other part of the condensing flat tubes 324, and the heat dissipation air can take away the heat of the power device 22 transferred to the other part of the condensing flat tubes 324 out of the second cavity 12. The heat dissipation air can dissipate heat from the two parts of the condensing flat tubes 324 respectively, so that the power device 22 can be quickly dissipated, which is beneficial to improve the heat dissipation efficiency of the heat sink 32 and improve the heat dissipation efficiency of the power device 22.

[0150] It should be understood that the above embodiment is mainly described in the scenario of back air inlet and two-side air outlet, that is, the air inlet hole 13 extends in the first direction, and the air outlet hole 14 extends in the second direction. In the first direction, the air inlet hole 13 is located on the side of the second cavity 12 facing away from the first cavity 11, and in the second direction, at least one air outlet hole 14 is located on at least one side of the plurality of condensing flat tubes 324. It should be understood that the above scheme can also be applied to the scenario of side air inlet and side air outlet. The scenario has been introduced in the above embodiments, which will not be described here.

[0151] Please refer to FIG. 21, FIG. 22 and FIG. 23. FIG. 21 is a structural schematic diagram of another power conversion device 100 provided by an embodiment of the present application. FIG. 22 is a structural schematic diagram of the power conversion device 100 shown in FIG. 21 along the H-H line. FIG. 23 is a structural schematic diagram of the power conversion device 100 shown in FIG. 21 along the I-I line.

[0152] As shown in FIG. 21 and FIG. 22, the embodiment shown in FIG. 21 is similar in structure to the embodiment shown in FIG. 17, and the difference between the two is that the structure of the heat exchanger 33 is different, and the cooperation relationship of the heat exchanger 33 and the related features is different. In the embodiment shown in FIG. 21, the number of the cooperation holes 19 is multiple. The multiple cooperation holes 19 include a first cooperation hole 19a, a second cooperation hole 19b, a third cooperation hole 19c and a fourth cooperation hole 19d. In the second direction, the first cooperation hole 19a, the second cooperation hole 19b, the third cooperation hole 19c and the fourth cooperation hole 19d are sequentially and spaced apart. In some other embodiments, the number of the cooperation holes 19 can also be 1, 2 or more.

[0153] As shown in FIG. 21, FIG. 22 and FIG. 23, in the embodiment shown in FIG. 21, the number of heat exchangers 33 is multiple. The multiple heat exchangers 33 include a first heat exchanger 33a and a second heat exchanger 33b. In other embodiments, the number of heat exchangers 33 can also be 1, 3 or other more. The first heat exchanger 33a and the second heat exchanger 33b are both accommodated in the second cavity 12. In the first direction, the first heat exchanger 33a and the second heat exchanger 33b are both in contact with and fixedly connected to one side of the partition wall 16 and face away from the first cavity 11. The first heat exchanger 33a covers the first fitting hole 19a and the second fitting hole 19b and closes the first cavity 11, and the second heat exchanger 33b covers the third fitting hole 19c and the fourth fitting hole 19d and closes the first cavity 11.

[0154] In the second direction, the first heat exchanger 33a is located between the fourth air inlet hole 13d (i.e. the air inlet hole 13) and the first air outlet hole 14a (i.e. the air outlet hole 14), and the first heat exchanger 33a is located between the fourth heat dissipation fan 31d (i.e. the heat dissipation fan 31) and the first air outlet hole 14a (i.e. the air outlet hole 14). In the second direction, the second heat exchanger 33b is located between the fourth air inlet hole 13d (i.e. the air inlet hole 13) and the second air outlet hole 14b (i.e. the air outlet hole 14), and the second heat exchanger 33b is located between the fourth heat dissipation fan 31d (i.e. the heat dissipation fan 31) and the second air outlet hole 14b (i.e. the air outlet hole 14).

[0155] In the third direction, the first heat exchanger 33a and the second heat exchanger 33b are both located on the side of the plurality of heat sinks 32 facing away from the magnetic device 23. The first heat exchanger 33a and the second heat exchanger 33b are both in contact with and fixedly connected to the heat sink 32. Specifically, the first heat exchanger 33a and the second heat exchanger 33b are both in contact with and fixedly connected to the heat dissipation base plate 321 (i.e. the cavity wall of the evaporation cavity 3211). In other embodiments, the first heat exchanger 33a and the second heat exchanger 33b can also be spaced apart from the heat sink 32. The heat exchange body 331 of the first heat exchanger 33a covers the first fitting hole 19a and the second fitting hole 19b and closes the first cavity 11. The heat exchange body 331 of the second heat exchanger 33b covers the third fitting hole 19c and the fourth fitting hole 19d and closes the first cavity 11.

[0156] In the embodiment shown in FIG. 21, the heat exchanger 33 includes a heat exchange cavity 330. The heat exchange cavity 330 communicates with the first cavity 11 through the fitting hole 19. In which, the heat exchange cavity 330 of the first heat exchanger 33a communicates with the first fitting hole 19a and the second fitting hole 19b, and the heat exchange cavity 330 of the first heat exchanger 33a communicates with the first cavity 11 through the first fitting hole 19a and the second fitting hole 19b. The heat exchange cavity 330 of the second heat exchanger 33b communicates with the third fitting hole 19c and the fourth fitting hole 19d, and the heat exchange cavity 330 of the second heat exchanger 33b communicates with the first cavity 11 through the first fitting hole 19a and the second fitting hole 19b.

[0157] The heat exchange body 331 includes a first heat exchange sub-cavity 3311, and the heat dissipation part 333 includes a second heat exchange sub-cavity 3331. In the first direction, the second heat exchange sub-cavity 3331 is communicated with one side of the first heat exchange sub-cavity 3311. In an example, in each heat dissipation part 333, the number of the second heat exchange sub-cavities 3331 is multiple, and the multiple second heat exchange sub-cavities 3331 are sequentially and spacedly arranged along the second direction. In other embodiments, the number of the second heat exchange sub-cavities 3331 of each heat dissipation part 333 can also be one. The first heat exchange sub-cavity 3311 and each second heat exchange sub-cavity 3331 of each heat dissipation part 333 constitute a heat exchange cavity 330. In other words, the heat exchange cavity 330 includes the first heat exchange sub-cavity 3311 and each second heat exchange sub-cavity 3331 of each heat dissipation part 333. Among them, the first heat exchange sub-cavity 3311 of the first heat exchanger 33a is communicated with the first matching hole 19a and the second matching hole 19b. The first heat exchange sub-cavity 3311 of the second heat exchanger 33b is communicated with the third matching hole 19c and the fourth matching hole 19d.

[0158] In the embodiment shown in FIG. 21, the power conversion device 100 further includes a heat exchange fan 34. The heat exchange fan 34 is accommodated in the first cavity 11. The projection of the heat exchange fan 34 in the first direction overlaps the projection of the matching hole 19 in the first direction. In an example, the number of the heat exchange fan 34 is multiple. The multiple heat exchange fans 34 include a first heat exchange fan 34a and a second heat exchange fan 34b. The projection of the first heat exchange fan 34a in the first direction overlaps the projection of the first matching hole 19a in the first direction. The projection of the second heat exchange fan 34b in the first direction overlaps the projection of the third matching hole 19c in the first direction.

[0159] The heat generated by the electronic device 24 is transferred to the air in the first cavity 11. The first heat exchange fan 34a can drive the air in the first cavity 11 to flow, and the air in the first cavity 11 can flow into the heat exchange cavity 330 of the heat exchanger 33 through the matching hole 19, and then flow back to the first cavity 11 through the matching hole 19. Among them, the heat dissipation fan 31 can drive the heat dissipation wind to flow into the second cavity 12 from the air inlet hole 13, and then flow out of the second cavity 12 from the air outlet hole 14 through the heat exchanger 33. The heat dissipation wind can take out the heat transferred to the evaporation cavity 3211 of the electronic device 24 through the airflow to the second cavity 12, realize the rapid heat dissipation of the electronic device 24, and realize the reduction of the air temperature in the first cavity 11. That is to say, the heat generated by the electronic device 24 is transferred to the air in the first cavity 11. The air in the first cavity 11 can flow into the heat exchange cavity 330 of the heat exchanger 33 through the matching hole 19, and then flow back to the first cavity 11 through the matching hole 19. The heat dissipation wind flows into the second cavity 12 from the air inlet hole 13, and then flows out of the second cavity 12 from the air outlet hole 14 through the heat exchanger 33. The heat dissipation wind can take out the heat transferred to the heat exchange cavity 330 of the electronic device 24 through the airflow to the second cavity 12, realize the rapid heat dissipation of the electronic device 24, and realize the reduction of the air temperature in the first cavity 11. The structure of the heat exchanger 33 is various, and the design cost is low.

[0160] Specifically, the first heat exchange fan 34a can drive the air in the first cavity 11 to flow, and the air in the first cavity 11 can flow from the first matching hole 19a to each second heat exchange sub-cavity 3331 through the first heat exchange sub-cavity 3311 of the first heat exchanger 33a, and then flow back to the first cavity 11 through the second matching hole 19b. Among them, the fourth heat dissipation fan 31d can drive the heat dissipation wind to flow into the second cavity 12 from the fourth air inlet hole 13d, and then flow out of the second cavity 12 from the first air outlet hole 14a through the heat exchange body 331 and the plurality of heat dissipation parts 333 of the first heat exchanger 33a. The heat dissipation wind can take out the heat transferred to the first heat exchange sub-cavity 3311 and the second heat exchange sub-cavity 3331 of the electronic device 24 through the airflow to the second cavity 12.

[0161] The second heat exchange fan 34b can drive the air in the first cavity 11 to flow from the third matching hole 19c to each second heat exchange sub-cavity 3331 through the first heat exchange sub-cavity 3311 of the second heat exchanger 33b, and then back to the first cavity 11 from the fourth matching hole 19d through the first heat exchange sub-cavity 3311. The fourth heat dissipation fan 31d can drive the heat dissipation air to flow into the second cavity 12 from the fourth air inlet hole 13d, and then flow out of the second cavity 12 from the second air outlet hole 14b through the heat exchange body 331 and the plurality of heat dissipation portions 333 of the second heat exchanger 33b. The heat dissipation air can carry the heat of the electronic device 24 away from the second cavity 12 through the airflow. The first heat exchanger 33a and the second heat exchanger 33b together realize rapid heat dissipation of the electronic device 24, reduce the temperature of the air in the first cavity 11, improve the heat dissipation efficiency of the electronic device 24, improve the working performance of the electronic device 24, and prolong the working life of the electronic device 24.

[0162] In the second direction, the first heat exchanger 33a is located between the fourth air inlet hole 13d (air inlet hole 13) and the first air outlet hole 14a, and the second heat exchanger 33b is located between the fourth air inlet hole 13d (i.e. air inlet hole 13) and the second air outlet hole 14b. This design can avoid the situation that the heat dissipation air flows through the first heat exchanger 33a and then flows through the second heat exchanger 33b, or the situation that the heat dissipation air flows through the second heat exchanger 33b and then flows through the first heat exchanger 33a, ensures that the air ducts where the first heat exchanger 33a and the second heat exchanger 33b are located are independent, avoids temperature cascade between the first heat exchanger 33a and the second heat exchanger 33b, improves the heat dissipation efficiency of the first heat exchanger 33a and the second heat exchanger 33b, improves the heat dissipation efficiency of the electronic device 24, reduces the temperature of the air in the first cavity 11, improves the working performance of the electronic device 24, and prolongs the working life of the electronic device 24.

[0163] The heat conduction portion 335 is also provided between the two adjacent heat dissipation portions 333. In the third direction, the heat conduction portion 335 is in contact with and fixedly connected between the two heat dissipation portions 333. In the two adjacent heat dissipation portions 333, the number of heat conduction portions 335 is a plurality, and the plurality of heat conduction portions 335 are sequentially and spaced apart in the first direction. In other embodiments, the number of heat conduction portions 335 in the two adjacent heat dissipation portions 333 can also be one. The design of the heat conduction portion 335 can increase the contact area between the heat dissipation portion 333 and the heat dissipation air, improve the heat dissipation efficiency of the heat exchanger 33, improve the heat dissipation efficiency of the electronic device 24, reduce the temperature of the air in the first cavity 11, improve the working performance of the electronic device 24, and prolong the working life of the electronic device 24.

Claims

1. A power conversion device, characterized by, The application relates to a heat sink for power devices, comprising: a housing, the housing comprising a first cavity and a second cavity, the first cavity and the second cavity being spaced apart in a first direction, the housing being provided with at least one mounting hole, an air inlet hole and at least one air outlet hole, the mounting hole being in communication with the first cavity and the second cavity, the air inlet hole and the at least one air outlet hole being in communication with the second cavity; at least one power device, the at least one power device being accommodated in the first cavity; and at least one heat sink, the at least one heat sink being accommodated in the second cavity, each of the heat sinks comprising a heat dissipation substrate and a plurality of condensing flat tubes, the heat dissipation substrate comprising an evaporation cavity for accommodating a cooling working medium, the heat dissipation substrate being in contact with the power device through the mounting hole and covering the mounting hole to seal the first cavity, the plurality of condensing flat tubes being located on a side of the heat dissipation substrate away from the power device, and the evaporation cavity being in communication with the plurality of condensing flat tubes, the plurality of condensing flat tubes being located between the air inlet hole and the air outlet hole, the plurality of condensing flat tubes being spaced apart to form a plurality of ventilation holes, the ventilation holes extending in a second direction, the first direction, the second direction and a gravity direction being perpendicular to each other; wherein the air inlet hole and the at least one air outlet hole extend in the second direction, the air inlet hole and the air outlet hole being located on two sides of the plurality of condensing flat tubes in the second direction, or the air inlet hole extends in the first direction, the air inlet hole being located on a side of the second cavity away from the first cavity in the first direction, and the air outlet hole extends in the second direction, the at least one air outlet hole being located on at least one side of the plurality of condensing flat tubes in the second direction. In the first direction, the plurality of condensing flat tubes are fixedly connected to the side of the heat dissipation substrate away from the power device, and in the gravity direction, the plurality of condensing flat tubes are sequentially and spaced apart to form a plurality of ventilation holes; the heat sink further comprises a communication part, the communication part comprising a flow passage, the communication part being located on a side of the plurality of condensing flat tubes away from the heat dissipation substrate, the communication part being fixedly connected to the plurality of condensing flat tubes, and the flow passage being in communication with the plurality of condensing flat tubes.

2. The power conversion device of claim 1, wherein, A projection of the communication part in the first direction covers projections of all the ventilation holes in the first direction, and a projection of the heat dissipation substrate in the first direction covers projections of all the ventilation holes in the first direction.

3. The power conversion device of claim 2, wherein, Each of the condensing flat tubes comprises a plurality of flow channels, the plurality of flow channels extending in the first direction and being sequentially arranged in the second direction, adjacent flow channels being isolated by baffles, and the plurality of flow channels being in communication with the evaporation cavity and the flow passage.

4. The power conversion device of claim 2, wherein, The heat sink further comprises a first communication part and a second communication part, the first communication part comprising a first flow passage, the second communication part comprising a second flow passage, and in the first direction, the first communication part, the second communication part and the plurality of condensing flat tubes are located on a side of the evaporation cavity.

5. The power conversion device of claim 1, wherein, ​ The first communication part and the second communication part are located on both sides of the plurality of condensation flat tubes in the gravity direction, and the plurality of condensation flat tubes are sequentially and spaced apart in the first direction and form a plurality of ventilation holes. The first communication part and the second communication part are fixedly connected with the heat dissipation substrate and the plurality of condensation flat tubes, and the first flow passage and the second flow passage are in communication with the plurality of condensation flat tubes. The first flow passage and the second flow passage are in communication with the evaporation cavity.

6. The power conversion device of claim 5, wherein, The projections of the first communication part and the second communication part in the gravity direction cover the projections of all the ventilation holes in the gravity direction.

7. The power conversion device of claim 5, wherein, The heat dissipation substrate and the condensation flat tube are spaced apart in the first direction.

8. The power conversion device of claim 5, wherein, Each of the condensation flat tubes comprises a plurality of flow channels, which extend in the gravity direction and are sequentially arranged in the second direction. The adjacent flow channels are isolated by baffles. The plurality of flow channels are in communication with the first flow passage and the second flow passage.

9. The power conversion device according to any one of claims 1 to 8, characterized by, Heat dissipation fins are arranged between two adjacent condensation flat tubes.

10. The power conversion device according to any one of claims 1 to 9, characterized by, The number of the at least one mounting hole and the at least one power device is a plurality, and the plurality of mounting holes correspond to the plurality of power devices one by one. The heat dissipation substrate of the heat sink contacts the plurality of power devices through the plurality of mounting holes and covers the plurality of mounting holes.

11. A power conversion device according to any one of claims 1 to 9, characterized in that The number of the at least one mounting hole and the at least one power device is a plurality, and the plurality of mounting holes correspond to the plurality of power devices one by one. The at least one heat sink comprises a plurality of heat sinks. The at least one power device is divided into a plurality of groups of power devices, and each group comprises at least one power device. The heat dissipation substrate of each heat sink contacts a group of power devices through a corresponding mounting hole and covers the corresponding mounting hole.

12. The power conversion device of claim 11, wherein, The two heat sinks are sequentially arranged in the gravity direction.

13. The power conversion device of claim 1, wherein, In the case where the air inlet hole extends in the first direction, the number of the at least one air outlet hole is a plurality, the plurality of air outlet holes comprise a first air outlet hole and a second air outlet hole, in the second direction, the first air outlet hole and the second air outlet hole are located on both sides of the plurality of condensation flat tubes, and the plurality of condensation flat tubes are located between the air inlet hole and the first air outlet hole; and / or, the plurality of condensation flat tubes are located between the air inlet hole and the second air outlet hole.

14. The power conversion device of any one of claims 1 to 13, wherein, The power conversion device further comprises a magnetic device, which is accommodated in the second cavity and located on one side of the heat sink in the gravity direction.

15. The power conversion device of claim 14, wherein, The power conversion device further comprises a heat exchanger, which is accommodated in the second cavity and used for heat exchange with the first cavity. In the gravity direction, the heat exchanger is located on the other side of the heat sink relative to the magnetic device.

16. The power conversion device of claim 15, wherein, The shell is provided with a matching hole, which is communicated with the first cavity and the second cavity, and the heat exchanger covers the matching hole to close the first cavity; the heat exchanger is provided with a heat exchange part, which is sleeved in the matching hole and extends into the first cavity; or the heat exchanger comprises a heat exchange cavity, which is communicated with the first cavity through the matching hole.

17. The power conversion device of claim 15, wherein, The heat exchanger is fixedly connected with the heat dissipation substrate.

18. The power conversion device of any one of claims 1 to 17, wherein, The power conversion device further comprises a heat dissipation fan, which is accommodated in the second cavity, and an air inlet side of the heat dissipation fan faces the air inlet hole.

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