Turntable mechanism for silicon wafer transportation
By combining a non-contact Bernoulli chuck with a photoelectric switch, the problems of inaccurate positioning and chuck marks during silicon wafer transportation were solved, achieving high-precision, mark-free silicon wafer transportation and improving battery performance.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-09-12
- Publication Date
- 2026-04-02
AI Technical Summary
Traditional silicon wafer transportation suffers from inaccurate positioning and marks left by suction cups on the wafer surface, affecting battery performance.
Silicon wafers are transported using a non-contact Bernoulli chuck and a rotating platform combined with a photoelectric switch. Non-contact adsorption is achieved through the airflow principle of the Bernoulli chuck, and positioning accuracy is provided by the photoelectric switch.
This enables precise positioning and traceless transportation of silicon wafers, improving battery performance and transportation accuracy.
Smart Images

Figure CN2025120872_02042026_PF_FP_ABST
Abstract
Description
Rotary table mechanism for silicon wafer transportation TECHNICAL FIELD
[0001] The utility model relates to photovoltaic product manufacturing technical field especially a rotary table mechanism for silicon wafer transportation. BACKGROUND
[0002] The silicon wafer used in the photovoltaic field usually experiences phosphorus diffusion treatment, passivation treatment and cell preparation links, and these links increase the easily damaged structure on the surface of the silicon wafer, the treated silicon wafer usually needs to be transferred to other conveying belts during transportation, and the conventional suction cup transposition structure is used for transfer, but the existing structure lacks positioning, the transferred silicon wafer deviates from the axis of the conveying belt, and the conventional contact causes suction cup marks on the surface of the silicon wafer, causing the performance of the cell to decrease. SUMMARY
[0003] According to the above-mentioned technical problems to be solved, a rotary table mechanism for silicon wafer transportation is provided.
[0004] To achieve the above-mentioned purpose, the utility model discloses a rotary table mechanism for silicon wafer transportation, including fixed frame, the fixed frame top installs the rotary platform, and the rotary platform bottom is connected with the drive motor, and the rotary platform top installs the rotary connecting plate, and the rotary connecting plate top is provided with the gas slip ring assembly in the position that the rotary platform output end corresponds, and the gas slip ring assembly is provided with solenoid valve assembly, and the solenoid valve assembly is fixed on the support rod on the top of gas slip ring assembly through pneumatic element panel, and the both ends of rotary connecting plate are symmetrically installed with double suction cup assembly.
[0005] Further, the gas slip ring assembly includes a fixed block fixedly connected with the rotary connecting plate, a precision gas path slip ring and a dust cover are sequentially installed on the top of the fixed block, and a support rod is fixedly arranged on the top of the dust cover.
[0006] Further, the pneumatic element panel of the solenoid valve assembly is provided with a solenoid valve and a pressure regulating valve, and a terminal plate is installed on the edge of the pneumatic element panel.
[0007] Further, the double suction cup assembly is provided with a horizontal suction cup fixing plate on the top, and the suction cup fixing plate is fixedly connected with the rotary connecting plate through a connecting piece above the suction cup fixing plate, and the double suction cup assembly is composed of two groups of parallelly arranged Bernoulli suction cups.
[0008] Further, the Bernoulli suction cup includes a suction cup connecting plate connected with the suction cup fixing plate, and the suction cup connecting plate is connected with a suction cup body below through an equal-height column, a plurality of sponge pads are arranged in the grooves on the bottom of the suction cup body, and air holes are arranged between the sponge pads.
[0009] Further, the connecting piece and the fixed position of the rotating connecting plate are provided with a linear waist-shaped groove structure for adjusting the distance between the double-suction disc assemblies, and the connecting position of the connecting piece and the suction disc fixing plate is provided with a ring-shaped waist-shaped groove structure for fine-tuning the angle of the double-suction disc assemblies.
[0010] Further, the fixed rack side close to the rotating platform is fixed with a sensor mounting seat, the outer side of the sensor mounting seat is connected with a photoelectric switch with an induction groove, and the bottom of the rotating connecting plate is provided with an induction sheet corresponding to the position of the induction groove.
[0011] Compared with the prior art, the utility model discloses a rotating disc mechanism for silicon wafer transportation, adopts a non-contact Bernoulli suction disc to avoid leaving suction disc marks on the surface of the silicon wafer, and the photoelectric switch on the side of the rotating platform provides positioning in the process of transferring the silicon wafer, thereby guaranteeing the repeated positioning accuracy of the silicon wafer transportation. BRIEF DESCRIPTION OF DRAWINGS
[0012] The utility model will be explained further in detail in connection with the drawings and specific embodiments.
[0013] Fig. 1 is a schematic diagram of the overall structure of the utility model.
[0014] Fig. 2 is a schematic diagram of the air slip ring assembly structure of the utility model.
[0015] Fig. 3 is a schematic diagram of the Bernoulli suction disc structure of the utility model.
[0016] Fig. 4 is a schematic diagram of the double-suction disc assembly connection of the utility model.
[0017] Fig. 5 is a partial view A in Fig. 1 of the utility model.
[0018] In the drawings: 1 is a fixed rack; 2 is a rotating platform; 3 is a driving motor; 4 is a rotating connecting plate; 5 is an air slip ring assembly; 51 is a fixed block; 52 is a precision air path slip ring; 53 is a dust cover; 54 is a support rod; 6 is an electromagnetic valve assembly; 61 is a pneumatic element panel; 62 is a pressure regulating valve; 63 is an electromagnetic valve; 64 is a terminal plate; 7 is a connecting piece; 8 is a suction disc fixing plate; 9 is a double-suction disc assembly; 91 is a suction disc connecting plate; 92 is an equal-height column; 93 is a suction disc main body; 94 is a sponge pad; 10 is a sensor mounting seat; 11 is a photoelectric switch; 12 is an induction sheet. DETAILED DESCRIPTION
[0019] With reference to the drawings and embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.
[0020] In an embodiment of the present application, as shown in FIG. 1 and FIG. 2, a rotating platform 2 is installed on the top of a fixed rack 1, a driving motor 3 is connected to the bottom of the rotating platform 2, a rotating connecting plate 4 is installed on the output end of the rotating platform 2, an air slip ring assembly 5 is arranged on the top of the rotating connecting plate 4 corresponding to the position of the output end of the rotating platform 2, an electromagnetic valve assembly 6 is arranged on the air slip ring assembly 5, the electromagnetic valve assembly 6 is fixed on the support rod 54 on the top of the air slip ring assembly 5 through a pneumatic element panel 61, and double suction disc assemblies 9 are symmetrically installed on both ends of the rotating connecting plate 4. Non-contact Bernoulli suction discs are adopted to avoid leaving suction disc marks on the surface of the silicon wafer, and photoelectric switches on the side of the rotating platform provide positioning in the process of transferring the silicon wafer, so as to ensure the repeated positioning accuracy of the silicon wafer transportation.
[0021] The air slip ring assembly 5 comprises a fixed block 51 fixedly connected with the rotating connecting plate 4, a precision air path slip ring 52 and a dustproof cover 53 are sequentially installed on the top of the fixed block 51, the dustproof cover 53 is fixed with a vertically arranged support rod 54 on the top, and the precision of pneumatic control is improved.
[0022] The pneumatic element panel 61 of the electromagnetic valve assembly 6 is provided with an electromagnetic valve 63 and a pressure regulating valve 62, and a terminal plate 64 is installed on the edge of the pneumatic element panel 61 to provide power for the double suction disc assemblies 9.
[0023] A horizontal suction disc fixing plate 8 is arranged on the top of the double suction disc assembly 9, the suction disc fixing plate 8 is fixedly connected with the rotating connecting plate 4 through a connecting piece 7 above, the double suction disc assembly 9 is composed of two groups of parallel Bernoulli suction discs, the Bernoulli suction disc comprises a suction disc connecting plate 91 connected with the suction disc fixing plate 8, a suction disc main body 93 connected with the suction disc connecting plate 91 through an equal-height column 92 below, a plurality of sponge pads 94 arranged in the grooves on the bottom of the suction disc main body 93, and air holes arranged between the sponge pads 94. The Bernoulli suction disc is a non-contact suction disc working based on the Bernoulli principle. When the Bernoulli suction disc works, the external compressed air flows at high speed in the small gap between the suction disc and the surface of the object to be transported. Due to the increase of air flow velocity, the Bernoulli principle causes the air pressure flowing through the gap to drop, so that a low-pressure area is formed between the suction disc and the object. However, the surrounding air pressure is relatively high, which pushes the silicon wafer to the low-pressure area, so that the silicon wafer can be adsorbed without direct contact.
[0024] The connecting piece 7 is provided with a straight waist groove structure for adjusting the distance between the double suction disc assembly 9 at the fixed position of the rotating connecting plate 4, and the connecting piece 7 is provided with a ring-shaped waist groove structure for fine-tuning the angle of the double suction disc assembly 9 at the connecting position of the suction disc fixing plate 8, thereby improving the applicability and meeting the requirements of silicon wafer transportation under different conditions.
[0025] The sensor mounting seat 10 is fixed on the side of the fixed frame 1 close to the rotating platform 2, the photoelectric switch 11 with a sensing groove is connected to the outside of the sensor mounting seat 10, the sensing sheet 12 corresponding to the position of the sensing groove is installed at the bottom of the rotating connecting plate 4, thereby providing positioning and ensuring the repeated positioning accuracy of the silicon wafer transportation, and the stable transportation of the silicon wafer between the transmission belts arranged in a collinear or staggered manner can be realized.
[0026] The working principle of the embodiment is as follows:
[0027] The points to be explained are as follows: firstly, in the description of the present application, it is necessary to explain that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to represent the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change; secondly, in this paper, the relationship terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any actual relationship or order between the entities.
[0028] The above examples are only illustrative of the present application, and do not constitute a limitation on the protection scope of the present application, and any design identical or similar to the present application belongs to the protection scope of the present application.
[0029]
Claims
1. A turntable mechanism for silicon wafer transportation, comprising a stationary frame (1), characterized in that, The fixed rack (1) top is provided with a rotating platform (2), the rotating platform (2) bottom is connected with a drive motor (3), the rotating platform (2) top output is provided with a rotating connecting plate (4), the rotating connecting plate (4) top is provided with a gas slip ring assembly (5) corresponding to the rotating platform (2) output position, the gas slip ring assembly (5) is provided with a solenoid valve assembly (6), the solenoid valve assembly (6) is fixed on the support rod (54) on the top of the gas slip ring assembly (5) through the pneumatic element panel (61), and the rotating connecting plate (4) both ends are symmetrically provided with double suction disc assemblies (9).
2. A turntable mechanism for transporting silicon wafers as defined in claim 1, wherein The gas slip ring assembly (5) includes a fixed block (51) fixedly connected with the rotating connecting plate (4), the fixed block (51) top is provided with a precision gas path slip ring (52) and a dust cover (53) in sequence, and the dust cover (53) top is fixedly provided with a vertical support rod (54).
3. A turntable mechanism for transporting silicon wafers as defined in claim 1, wherein The pneumatic element panel (61) of the solenoid valve assembly (6) is provided with a solenoid valve (63) and a pressure regulating valve (62), and the edge of the pneumatic element panel (61) is provided with a terminal plate (64).
4. A turntable mechanism for silicon wafer transport as defined in claim 1, wherein The double suction disc assembly (9) top is provided with a horizontal suction disc fixing plate (8), and the suction disc fixing plate (8) top is fixedly connected with the rotating connecting plate (4) through a connecting piece (7); the double suction disc assembly (9) is composed of two groups of parallel Bernoulli suction discs.
5. A turntable mechanism for transporting silicon wafers as defined in claim 4, wherein The Bernoulli suction disc includes a suction disc connecting plate (91) connected with the suction disc fixing plate (8), and the suction disc connecting plate (91) is connected with a suction disc main body (93) through an equal-height column (92) below the suction disc connecting plate (91); a plurality of sponge pads (94) are arranged in the recess at the bottom of the suction disc main body (93), and air holes are arranged between the sponge pads (94).
6. A turntable mechanism for transporting silicon wafers as defined in claim 4, wherein The fixed position of the connecting piece (7) and the rotating connecting plate (4) is provided with a straight waist groove structure for adjusting the spacing of the double suction disc assembly (9), and the connecting position of the connecting piece (7) and the suction disc fixing plate (8) is provided with an annular waist groove structure for fine-tuning the angle of the double suction disc assembly (9).
7. A turntable mechanism for silicon wafer transport as defined in claim 1, wherein The fixed rack (1) side near the rotating platform (2) is fixedly provided with a sensor mounting seat (10), the sensor mounting seat (10) outer side is connected with a photoelectric switch (11) with an induction groove, and the rotating connecting plate (4) bottom is provided with an induction sheet (12) corresponding to the position of the induction groove.
Citation Information
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