Anti-vibration tilt sensor

Abstract

Anti-vibration tilt sensor (1) for determining a tilt value with respect to a reference plane of a mechanical component to which said anti-vibration tilt sensor (1) is 5 applicable, said anti-vibration tilt sensor (1) comprising: a first portion (2) extending along a longitudinal development axis (L), said first portion (2) being adapted to house therein an electronic circuitry (3) configured to determine the tilt value required of 10 said anti-vibration tilt sensor (1), said first portion (2) having a respective lower face (2a) transverse with respect to the longitudinal development axis (L) of the first portion (2); a second portion (5) extending along said longitudinal development axis (L), said second 15 portion (5) being distinct and separate from said first portion (2), said second portion (5) comprising mechanical connections (5b) configured to allow mechanical connection of the anti-vibration tilt sensor (1) to the mechanical component of which the tilt value is to be 20 determined, said second portion (5) having a respective upper face (5a) transverse with respect to the longitudinal development axis (L) of the second portion (5), the upper face (5a) of the second portion (5) being facing the lower face (2a) of the first portion (2); an 25 anti-vibration component (4) interposed, along the longitudinal development axis (L) of the first portion (2) and the second portion (5), between the first portion (2) and the second portion (5) and fixed in contact with the lower face (2a) of the first portion (2) and the upper 5 face (5a) of the second portion (5) so as to ensure a structural adhesion and a mechanical isolation to the propagation of vibrations between the first portion (2) and the second portion (5).

Description

DESCRIPTIONAnti -vibration tilt sensor

[0001] . Field of the invention

[0002] . The present invention relates to sensing techniques usable in heavy industrial and mobile hydraulic applications for measuring the tilt of a heavy vehicle and mobile hydraulics or of a mechanical component of such a vehicle, such as a telescopic arm, and in particular to an anti-vibration tilt sensor.

[0003] . Technological background of the invention

[0004] . Tilt sensors are widely used in mobile hydraulic machines such as telescopic handlers, aerial platforms, and excavators .

[0005] . In a telescopic handler, tilt sensors contribute to the anti-tip safety function by monitoring the lift angle of the telescopic boom.

[0006] . In an aerial work platform, tilt sensors control the levelling of the basket and the axle of the vehicle.

[0007] . In an excavator, tilt sensors mounted on the articulated arm allow reconstruction of the excavation profile .

[0008] . Typically, tilt sensors implement transduction principles based on gravitational acceleration. For example, tilt sensors based on accelerometers detect the gravitational acceleration (+ / — 1g) and, by means oftrigonometric formulas, produce the tilt measurement with respect to the ground, considered as zero or reference plane .

[0009] . Considering the typical movement speeds of mobile hydraulic vehicles, the passband of the gravitational acceleration signal of interest for producing the tilt angle ranges from the DC component up to the order of a few tens of Hertz.

[0010] . The most common sources of vibration associated with the typical operation of a mobile hydraulic vehicle are: onboard engine; onboard pump; movement of mechanical members operated by hydraulic cylinders such as stabilisers, telescopic or articulated arms and related accessories (forks, blades, clamps, augers, tyre removers, and so on) ; rolling of the vehicle on the ground by means of tyres or tracks; falling of rocks and debris on the vehicle.

[0011] . These vibrations can produce two types of effects: acceleration peaks in the order of hundreds of g; broadband vibrations up to a few kilohertz with an average amplitude in the order of tens of gRMs and peaks in proximity of the resonance of structures or engine orders .

[0012] . In this context, it is therefore evident that the acceleration transduced by tilt sensors( inclinometers ) based on accelerometers is composed of :

[0013] . - a first component relating to gravitational acceleration having amplitude of + / - 1g and frequency range of interest in the order of tens of Hertz , identi fied as the true measurement signal ,

[0014] . - a second broadband component acting as noise with respect to the first component , with a profile characterised by the mobile hydraulic application, and exhibiting amplitude and bandwidth two orders of magnitude higher than the signal .

[0015] . The refore , although tilt sensors based on accelerometers may appear as a poorly suited solution for application on mobile hydraulic vehicles , good practice suggests filtering techniques both at mechanical level and at the level of measurement data processing, such as to make these products suf ficiently accurate for the application in question .

[0016] . Mechanical filtering techniques provide for mounting the tilt sensor onto the element whose tilt is to be measured by decoupling the two parts by means of anti-vibration mounts .

[0017] . In this way, vibrations are prevented from reaching the accelerometer and thus from being transduced as noise with respect to the gravity signal .

[0018] . Anti-vibration mounts act well at highfrequencies, therefore it is necessary to correctly size their geometry and hardness in order to remove as much low-frequency noise component as possible.

[0019] . This sizing requires the use of very large and soft anti-vibration mounts which, on the one hand, offer better vibration isolation, reducing the amplitude of vibrations transmitted to the system and exhibiting better damping properties, dissipating the vibration energy more effectively, but on the other hand, unfortunately, may lead to more significant deformations under load, which may negatively affect the measurement accuracy.

[0020] . Moreover, such very large and soft antivibration mounts may deform and degrade more rapidly over time compared to rigid ones.

[0021] . Another aspect to be taken into consideration concerns the fact that, in order to protect the sensor from impacts with the handled material and the environment in which the mobile hydraulic vehicle operates, tilt sensors are typically installed in confined places such as inside the hollow shaft of the telescopic boom, under a metal cap when exposed outside of articulated booms, in the crossbeam under the axle.

[0022] . Generally, the available volume is just sufficient for the installation of the tilt sensor alone but is not at all compatible with the additional spacerequired by the anti-vibration mounts .

[0023] . The refore , the application of anti-vibration mounts to a finished tilt sensor requires a dedicated and additional procedure compared to the installation procedure of the tilt sensor alone , thus requiring more time for the installer and appropriate tools to tighten the fixing screws of the tilt sensor and the antivibration mount without damaging the damping material .

[0024] . For this reason, also to reduce bulk, sensors that integrate anti-vibration components within them are known in the prior art .

[0025] . In this regard, WO 2012 / 062509 Al describes an orientation sensor for a motorcycle comprising a housing within which, in addition to the orientation detection elements , an anti-vibration support is housed which is capable of attenuating the vibratory movement to which the housing is subj ected .

[0026] . Such anti-vibration support comprises an external rectangular structure , an internal rectangular structure and a plurality of bridges connecting the internal structure to the external structure , where each bridge is arranged as a beam that resists the tilting of the internal structure with respect to the external structure .

[0027] . EP 3056883 Bl refers to a sensor with dampingelements comprising a housing within which sensor components are housed in such a way that there is a space between the housing and the sensor components and a material for damping vibrations arranged within said space to damp the vibrations of the sensor components with respect to the housing .

[0028] . The vibration damping material comprises damping grains , wherein each damping grain has a respective internal cavity defined by a through channel .

[0029] . Both solutions provide for the use of rather complex anti-vibration elements that increase , on the one hand, the assembly and maintenance time of the sensor, the risk of assembly errors and, on the other hand, the costs both for initial assembly and for maintenance and correction of any assembly errors .

[0030] . Summary

[0031] . The purpose of the present invention is to devise and provide an anti-vibration tilt sensor that allows at least partially overcoming the drawbacks mentioned above with reference to the known technique and that, in particular, is easy to design, has reduced assembly and maintenance time , and ensures high reliability with limited bulk and cost .

[0032] . This purpose is achieved by means of a sensor inaccordance with claim 1.

[0033] . Further advantageous embodiments are the subject of the dependent claims.

[0034] . Brief description of the figures

[0035] . Further features and advantages of the sensor according to the invention will become apparent from the description below of preferred embodiments, given by way of non-limiting example, with reference to the accompanying figures, in which:

[0036] . - Figure 1 schematically shows a perspective view of an anti-vibration tilt sensor in accordance with an embodiment of the present invention;

[0037] . - Figure 2 schematically shows a perspective exploded view of the anti-vibration tilt sensor of figure 1;

[0038] . - Figure 3 schematically shows a perspective exploded view of an anti-vibration tilt sensor in accordance with a further embodiment;

[0039] . - Figure 4 schematically shows a sectional view of an anti-vibration tilt sensor in accordance with an embodiment of the present invention;

[0040] . - Figure 5 schematically shows a sectional view of an anti-vibration tilt sensor in accordance with a further embodiment of the present invention;

[0041] . - Figure 6 schematically shows a sectional viewof an anti-vibration tilt sensor in accordance with a further embodiment of the present invention;

[0042] . - Figure 7 schematically shows , by means of a block diagram, an anti-vibration tilt sensor in accordance with an embodiment of the present invention;

[0043] . - Figure 8 schematically shows , by means of a block diagram, an anti-vibration tilt sensor in accordance with a further embodiment of the present invention;

[0044] . - Figure 9 schematically shows , by means of a block diagram, an anti-vibration tilt sensor in accordance with an embodiment of the present invention, and

[0045] . - Figure 10 schematically shows , by means of a block diagram, an anti-vibration tilt sensor in accordance with an embodiment of the present invention .

[0046] . It is noted that in the figures identical or similar elements will be indicated with the same numeric or alphanumeric references .

[0047] . Detailed description

[0048] . With reference to the aforementioned figures , there is now described an anti-vibration tilt sensor 1 in accordance with the present invention, hereinafter also referred to as tilt sensor or simply sensor, for determining a tilt value with respect to a reference plane of a mechanical component to which said anti-vibration tiltsensor 1 is applicable .

[0049] . The mechanical component (not shown in the figures ) may be part of any heavy industrial vehicle having mobile hydraulics such as a telescopic handler, a truckmounted or crawler crane, a tractor, more generally an agricultural machine , an excavator, an aerial platform, of which it is necessary to monitor the tilt of an axle of the industrial vehicle or of a telescopic boom.

[0050] . The reference plane, not shown in the figures , with respect to which the anti-vibration tilt sensor 1 is configured to determine the tilt value of the mechanical component , is for example represented by the support plane of the industrial vehicle, that is , the ground on which it rests .

[0051] . Returning generally to the present invention, with particular reference to figure 1 , the sensor 1 comprises a first portion 2 extending along a longitudinal extension axis L, shown with a dashed line in the figures .

[0052] . The first portion 2 is suitable for housing therein an electronic circuitry 3 , described in greater detail hereinafter, configured to determine the tilt value requested from said anti-vibration tilt sensor 1 .

[0053] . The first portion 2 has a respective lower face 2a transverse with respect to the longitudinal extensionaxis L of the first portion 2 .

[0054] . In accordance with the present invention, the sensor 1 further comprises a second portion 5 extending along said longitudinal extension axis L .

[0055] . The second portion 5 is distinct and separate from said first portion 2 .

[0056] . The second portion 5 comprises mechanical connections C-M configured to allow mechanical connection of the anti-vibration tilt sensor 1 to the mechanical component whose tilt value is to be determined, and electrical connections C-E configured to allow electrical connection of the anti-vibration tilt sensor 1 to a remote electronic control unit .

[0057] . The second portion 5 has a respective upper face 5a transverse with respect to the longitudinal extension axis L of the second portion 5.

[0058] . The upper face 5a of the second portion 5 faces the lower face 2a of the first portion 2 .

[0059] . In accordance with the present invention, the anti-vibration tilt sensor 1 comprises an anti-vibration component 4 interposed, along the longitudinal extension axis L of the first portion 2 and of the second portion 5, between the first portion 2 and the second portion 5 and fixed in contact with the lower face 2a of the first portion 2 and the upper face 5a of the second portion 5 so as toadvantageously ensure a structural adhesion and a mechanical isolation to the propagation of vibrations between the first portion 2 and the second portion 5.

[0060] . In one embodiment, shown in the figures , the first portion 2 , preferably made of plastic material , comprises a housing, preferably tub-shaped, delimited by a respective side wall 2 ' extending in height along the longitudinal extension axis L and by a bottom wall 2" , the outer face of which corresponds to the lower face 2a of the first portion 2 .

[0061] . Said side wall 2 ' defines a respective upper face of the first portion 2 , opposite to the respective lower face 2a, having an opening such as to facilitate the insertion of the electronic circuitry 3 (preferably, an electronic board, as shown in the figures ) inside the first portion 2 .

[0062] . In one embodiment, in combination with any of the preceding ones and shown in the figures , the first portion 2 comprises a plurality of support elements E-S for the electronic circuitry 3 extending along the longitudinal extension axis L from the lower face 2a towards the interior of the first portion 2 .

[0063] . As shown in the figures , each support element of said plurality E-S of support elements is preferably a hollow threaded cylindrical element for receiving andretaining, upon screwing, a respective screw V-T adapted to pass through a respective hole present in the electronic circuitry 3 ( for example in a corner of the electronic board) and fasten the electronic circuitry inside the first portion 2 .

[0064] . A plurality of screws V-T for fastening the electronic circuitry 3 to the first portion 2 is shown in figure 2 .

[0065] . In one embodiment, in combination with any of the preceding ones , the first portion 2 comprises a resin 7 therein, adapted to substantially fill the internal volume defined by the first portion 2 .

[0066] . Said resin 7 , for example a two-component epoxy resin, advantageously allows to protect the electronic circuitry and any other components present inside the first portion 2 from solid and liquid bodies and increases the mass of the first portion 2 contributing to reducing the amplitude of vibrations .

[0067] . In one embodiment, in combination with any of the preceding ones and shown in the figures , the second portion 5, preferably made of plastic material , comprises a housing, preferably tub-shaped, delimited by a respective side wall 5 ' extending in height along the longitudinal extension axis L and by an upper wall 5" , the outer face of which corresponds to the upper face 5a of the secondportion 5 .

[0068] . In one embodiment, in combination with the preceding one , the mechanical connections C-M of the second portion 5 comprise respective through holes defined by a specific configuration of the second portion 5.

[0069] . In more detail , the second portion 5 is shaped in such a way that said through holes have a longitudinal extension parallel to the longitudinal extension axis L and are distributed outside the base of the side wall 5 ' of the second portion 5.

[0070] . In more detail , each of said through holes is configured to receive and retain, upon screwing, a respective screw so as to mechanically connect the antivibration tilt sensor 1 to the mechanical component whose tilt value is to be determined .

[0071] . In one embodiment, in combination with any of the preceding ones , the second portion 5 comprises a resin 7 ' therein, adapted to substantially fill the internal volume defined by the second portion 5.

[0072] . Said resin 7 ' , for example a two-component epoxy resin, advantageously allows to protect the components present inside the second portion 5 from solid and liquid bodies and increases the mass of the second portion 5 contributing to reducing the amplitude of vibrations .

[0073] . In one embodiment, in combination with any of thepreceding ones , the sensor 1 comprises electrical communication components 6 operatively connected between the electronic circuitry 3 housed inside the first portion 2 and the electrical connections C-E available to the second portion 5.

[0074] . In one embodiment, in combination with the preceding one when combined with any in which the bottom wall 2" of the first portion 2 is provided and in which the upper wall 5" of the second portion 5 is provided, shown in figures 1-4 , the electrical communication components 6 comprise electrical communication cables 13 adapted to allow direct wiring between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5.

[0075] . In this embodiment , the bottom wall 2" of the first portion 2 comprises a through hole 10 placed substantially in the middle and adapted to allow the passage of said electrical communication cables 13 between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5 .

[0076] . In this embodiment, the anti-vibration component 4 comprises a respective through hole 11 placed substantially in the middle and adapted to allow the passage of the electrical communication cables 13 between the electronic circuitry 3 and the electrical connectionsC-E available to the second portion 5 .

[0077] . In this embodiment , the upper wall 5" of the second portion 5 comprises a respective through hole 12 placed substantially in the middle and adapted to allow the passage of the electrical communication cables 13 between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5.

[0078] . In one embodiment, in combination with the preceding one in which the through hole 10 is present and the resin 7 is provided inside the first portion 2 , said through hole 10 has such an interference as to prevent the resin 7 from leaking from the through hole 10 during the filling of the first portion 2 .

[0079] . In one embodiment, in combination with the preceding one in which the through hole 12 is present and the resin 7 ' is provided inside the second portion 5 , said through hole 12 has such an interference as to prevent the resin 7 ' from leaking from the through hole 12 during the filling of the second portion 5.

[0080] . According to one embodiment, in combination with any of the preceding ones , the electrical connections C-E comprise electrical connectors such as , for example , M12 connectors , standard for heavy industrial applications , or Deutsch-type connectors or a cable outlet with cable gland,typical for mobile hydraulic applications .

[0081] . According to one embodiment, as an alternative to any of the preceding ones in which the electrical communication components 6 comprise electrical communication cables 13 adapted to allow direct wiring between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5 , shown in figure 6, the second portion 5 is suitable for housing therein a further electronic circuitry 30 (preferably, an electronic board, as shown in the figures ) .

[0082] . In this embodiment, the electrical communication components 6 comprise first electrical communication cables 14 adapted to directly connect the electronic circuitry 3 housed in the first portion 2 and the further circuitry 30 housed in the second portion 5.

[0083] . In this embodiment, the first electrical communication cables 14 are adapted to pass through the through hole 10 present in the bottom wall 2" of the first portion 2 , the through hole 11 present in the antivibration component 4 , and the through hole 12 present in the upper wall 5" of the second portion 5, already described previously with reference to an embodiment referred to in figures 1-4 .

[0084] . In this embodiment, the electrical communication components 6 comprise second electrical communicationcables 15 adapted to directly connect the further electronic circuitry 30 housed in the second portion 5 and the electrical connections C-E available to the second portion 5 .

[0085] . In one embodiment, in combination with any of the preceding ones , the electronic circuitry 3 comprises a sensitive element 3a and is configured to determine the tilt value requested to said anti-vibration tilt sensor 1 based on the electrical signal provided by the sensitive element 3a .

[0086] . The sensitive element 3a will be described in greater detail hereinafter .

[0087] . In one embodiment, in combination with the preceding one when the further electronic circuitry 30 , shown for example in figure 6 and in figure 9, is provided, the further electronic circuitry 30 comprises a further sensitive element 30a which, once the sensor 1 is installed on the mechanical component whose tilt value is to be determined, is integral with the mechanical component whose tilt value is to be determined .

[0088] . The further sensitive element 30a installed on the further electronic circuitry 30 will be described in greater detail hereinafter .

[0089] . In this embodiment , the further electronic circuitry 30 is configured to determine the tilt valuerequested to said anti-vibration tilt sensor 1 based on the electrical signal provided by the further sensitive element 30a .

[0090] . In this embodiment , redundancy of electrical components ( electronic circuitry and sensitive element ) is thus provided, configured to determine the tilt value of the mechanical component in which the sensor 1 can be installed .

[0091] . This redundancy allows the possibility of determining a tilt value in the event of a failure of one of the two electronic circuits and / or sensitive elements and to obtain a more accurate tilt value derived from the combination ( for example , the average ) of the tilt values determined by the electronic circuitry 3 and by the further electronic circuitry 30 .

[0092] . According to one embodiment, in combination with the preceding one , the determination of the tilt value requested to the sensor 1 can be obtained as a combination of the tilt values determined by the electronic circuitry 3 and by the further electronic circuitry 30 .

[0093] . Such determination obtainable from such combination may be carried out , for example , by the electronic circuitry 3 or by the electronic circuitry 30 or by the remote control unit to which the sensor 1 is operatively connectable .

[0094] . According to a further embodiment, in combination with the preceding one when the further electronic circuitry 30 with the further sensitive element 30a is provided, shown for example in figure 10 (described in greater detail hereinafter ) , the electronic circuitry 3 is configured to determine the tilt value requested from the sensor 1 by combining the electrical signal provided by the sensitive element 3a with the electrical signal provided by the further sensitive element 30a .

[0095] . Such combination of electrical signals , as will be described in greater detail hereinafter, can preferably be obtained using a Kalman filter technique on the electrical signals .

[0096] . According to one embodiment, as an alternative to any of the preceding ones in which the electrical communication components 6 comprise electrical communication cables adapted to allow direct wiring between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5, shown in figure 5, or direct wiring between the electronic circuitry 3 and the further electronic circuitry 30 , the electrical communication components 6 comprise a first data communication antenna 16a installed on the electronic circuitry 3 .

[0097] . In this embodiment, the second portion 5 issuitable for housing therein a further electronic circuitry30 .

[0098] . In this embodiment, the electrical communication components 6 further comprise a second data communication antenna 16b installed on the further electronic circuitry 30 .

[0099] . The second data communication antenna 16b is configured to transmit electric power wirelessly to the first data communication antenna 16a .

[0100] . The first data communication antenna 16a and the second data communication antenna 16b are configured to communicate data with each other wirelessly .

[0101] . In this embodiment, the electrical communication components 6 further comprise further electrical communication cables 17 adapted to directly connect the further circuitry 30 housed in the second portion 5 and the electrical connections C-E available to the second portion 5 .

[0102] . In this embodiment, no through hole is therefore necessary in the bottom wall 2" of the first portion 2 , in the anti-vibration component 4 and in the upper wall 5" of the second portion 5 and no passage of any electrical communication cable or other mechanical component is provided between the first portion 2 , the anti-vibration component 4 and the second portion 5 along the longitudinalextension axis L .

[0103] . In this way, it is possible to obtain a further mechanical isolation of the first portion 2 with respect to the vibrations of the mechanical component whose tilt value is to be determined by the sensor 1 .

[0104] . In one embodiment, in combination with any of the preceding ones in which the further electronic circuitry 30 is provided, the second portion 5 comprises a further plurality of support elements E-S ' for the further electronic circuitry 30 extending along the longitudinal extension axis L from the upper face 5a towards the interior of the second portion 5 .

[0105] . As shown in the figures , each support element of said further plurality E-S ' of support elements is preferably a hollow threaded cylindrical element for receiving and retaining, upon screwing, a respective screw (not shown in the figures ) adapted to pass through a respective hole present in the further electronic circuitry 30 ( for example in a corner of the electronic board) and fasten the further electronic circuitry 30 inside the second portion 5.

[0106] . In one embodiment, in combination with any of the preceding ones , shown by way of example in figure 5, the sensor 1 comprises a tuned mass damping portion 9 mounted, along the longitudinal extension axis L, above the firstportion 2 , thus at the top of the sensor 1 .

[0107] . The damping portion 9 is structurally fixed to the first portion and to the resin 7 ( i f present ) .

[0108] . The tuned mass damping portion 9 comprises a mass 9a adapted to oscillate to counteract the vibrations to which the sensor 1 is subj ected .

[0109] . The tuned mass damping portion 9 further comprises a spring 9b, one fixed end of which is fastened to the base of the damping portion 9, while on a free end the mass 9a is fastened .

[0110] . The spring 9b is configured to provide the restoring force necessary to keep the mass 9a oscillating .

[0111] . The tuned mass damping portion 9 further comprises a damper 9c configured to dissipate the energy of the oscillations of the mass 9a, reducing the amplitude of the vibrations to which the sensor 1 is subj ected .

[0112] . When the mechanical component whose tilt is to be determined vibrates at a frequency close to the resonance frequency of the sensor 1 , the mass 9a of the tuned mass damping portion 9 oscillates in opposition to the vibration .

[0113] . The spring 9b of the tuned mass damping portion 9 stores elastic energy, while the tuned mass damping portion 9 dissipates kinetic energy, reducing the amplitude of the oscillations of the sensor 1 .

[0114] . In more detail , as general si zing characteristics of the tuned mass damping portion 9 , it is necessary to consider :

[0115] . - the natural frequency of the tuned mass damping portion 9, which must be tuned to the resonance frequency of the sensor 1 ;

[0116] . - the weight of the mass 9a of the tuned mass damping portion 9 , which must be sufficient to significantly influence the vibrations , but not so large as to compromise the structure of the sensor 1 ;

[0117] . - the characteristics of the spring 9b and the damper 9c, which must be selected to achieve the right balance between elasticity and damping .

[0118] . In one embodiment, in combination with any of the preceding ones , the sensor 1 further comprises a light indicator 8 , for example a LED, electrically connected to the electronic circuitry 3 so as to be facing and optically connected to the anti-vibration component 4 , for example through a respective through hole made in the bottom wall 2" of the first portion 2 .

[0119] . In this embodiment, the anti-vibration component 4 is made of transparent material to act as a guide for the light emitted by the light indicator 8 .

[0120] . This advantageously allows effective transmission of light indications outside the sensor and provides adistinctive design feature of the sensor 1 .

[0121] . In one embodiment, in combination with any of the preceding ones , the anti-vibration component 4 comprises at least one layer of silicone material .

[0122] . Said layer of silicone material is preferably shaped as a silicone pad .

[0123] . In one embodiment , as an alternative to the preceding one and in combination with any of the other preceding ones , the anti-vibration component 4 comprises a multilayer structure in which each layer is made of silicone material .

[0124] . Said multilayer structure of silicone material is preferably shaped as a silicone pad .

[0125] . According to one embodiment, as an alternative to the preceding one and in combination with any of the other preceding ones , shown for example in figure 3 , the antivibration component 4 comprises a base layer 20 made of silicone material .

[0126] . In this embodiment, the anti-vibration component 4 further comprises a plurality of anti-vibration elements 21 made of silicone material , for example discs , fastened and distributed on and extending along the longitudinal extension axis L from said base layer 20 .

[0127] . This embodiment, thanks to the plurality of antivibration elements 21 , advantageously allows obtaining,with equal size compared to the anti-vibration component 4 comprising a single anti-vibration layer or a multilayer anti-vibration structure , a less rigid anti-vibration component 4 .

[0128] . In fact , with equal size and thickness , the plurality of anti-vibration elements 21 has a smaller contact area compared to the single anti-vibration layer or the multilayer anti-vibration structure , as the contact with the lower face 2a of the first portion 2 ( or with the upper face 5 ' of the second portion 5 ) is limited to the points where the anti-vibration elements 21 of said plurality of anti-vibration elements 21 are present, therefore the anti-vibration component 21 consequently has a lower stif fness compared to the embodiment in which the single anti-vibration layer or the multilayer antivibration structure is present, which present total contact with the lower face 2a of the first portion 2 and with the upper face 5a of the second portion 5 .

[0129] . In one embodiment, in combination with the preceding one and those in which the electrical communication components 6 comprise electrical communication cables , the base layer 20 comprises a respective through hole 20 ' , preferably located in the centre, adapted to facilitate the passage of said electrical communication cables .

[0130] . With reference now to figure 7 , an anti-vibration tilt sensor 1 is now described from the point of view of the electronic circuitry 3 , in accordance with one embodiment of the present invention .

[0131] . This embodiment is in combination with any of the preceding ones in which the electrical communication components 6 comprise electrical communication cables 13 adapted to allow direct wiring between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5 and the sensor 1 comprises the light indicator 8 .

[0132] . In this embodiment , the electronic circuitry 3 comprises the sensitive element 3a, adapted to generate electrical signals correlated to the tilt value to be measured .

[0133] . The sensitive element 3a comprises , for example , one or more capacitive or thermal MEMS accelerometers .

[0134] . According to another example, the sensitive element 3a comprises one or more inertial measurement units with six or nine degrees of freedom, composed of accelerometers , gyroscopes , and magnetometers .

[0135] . The electronic circuitry 3 further comprises a data processing unit 3b configured to perform logical- mathematical operations necessary for managing the sensitive element 3a, determining the tilt value, anddetermining the data representative of the determined tilt value to be provided through a fieldbus transmitter 3c .

[0136] . The data processing unit 3b is , for example , a microcontroller, a microprocessor, or an FPGA.

[0137] . The electronic circuitry 3 further comprises a temperature sensor element 3d, adapted to enable thermal drift compensation of the sensitive element 3a .

[0138] . The temperature sensor element 3d is , for example, a semiconductor j unction temperature sensor integrated within the chip implementing the data processing unit 3b or the same sensitive element 3a .

[0139] . According to another example, the temperature sensor element 3d comprises one or more thermistors which, being not integrable within the sensitive element 3a, are placed near the sensitive element 3a .

[0140] . The electronic circuitry 3 further comprises a power management module 3e , configured to regulate the power supply voltage coming from the electrical system of the mechanical component to which the sensor 1 is installed, through the electrical connector 5b and the electrical communication cables 13 , to power the electronic circuitry 3 , thus all components installed on it .

[0141] . The power management module 3e is , for example , a linear or switching voltage regulator .

[0142] . The electronic circuitry 3 further comprises thelight indicator 8 , operatively connected to and controlled by the data processing unit 3b so as to provide light signals on the operating status of the sensor 1 .

[0143] . As previously stated, the light indicator 8 can be , for example , a LED .

[0144] . The electronic circuitry 3 further comprises the fieldbus transmitter 3c, already introduced previously, configured to electrically interface the data processing unit 3b with the remote electronic control unit, provided for controlling the mechanical component .

[0145] . The fieldbus transmitter 3c is , for example, a CAN driver in case of CANbus digital communication, or a 4-20 mA transmitter in case of analog bus .

[0146] . With reference now to figure 8 , an anti-vibration tilt sensor 1 is now described from the point of view of the electronic circuitry 3 and the further electronic circuitry 30 , in accordance with one embodiment of the present invention .

[0147] . This embodiment is in combination with any of the preceding ones in which the electrical communication components 6 comprise the first antenna 16a located on the electronic circuitry 3 housed in the first portion 2 and the second antenna 16b located on the further electronic circuitry 30 housed inside the second portion 5, and the further electrical communication cables 17 adapted to allowdirect wiring between the further electronic circuitry 30 and the electrical connections C-E available to the second portion 5 , and the sensitive element 3a .

[0148] . The electronic circuitry 3 therefore comprises the sensitive element 3a, previously described with reference to the embodiment of figure 7 .

[0149] . The electronic circuitry 3 further comprises a data processing unit 3b which, in addition to determining the tilt value and the data representative of the determined tilt value, is configured to manage wireless communication with a further data processing unit 30b located on the further electronic circuitry 30 .

[0150] . The electronic circuitry 3 further comprises a temperature sensor element 3d, previously described with reference to the embodiment of figure 7 .

[0151] . The electronic circuitry 3 further comprises the first antenna 16a, adapted to receive , as stated previously, electrical power from the second antenna 16b present on the further electronic circuitry 30 , adapted to exchange data wirelessly with said second antenna 16b to enable data communication, wirelessly, between the electronic circuitry 3 and the further electronic circuitry 30 .

[0152] . The first antenna 16a is , for example, a wireless data communication antenna using NFC or RFID technology .

[0153] . In this embodiment , the further electronic circuitry 30 , directly connected to the electrical connections C-E available to the second portion 5 via the further electrical communication cables 17 , comprises a power management module 3e, already previously described with reference to the embodiment of figure 7 .

[0154] . Moreover, the further electronic circuitry 30 comprises a fieldbus transmitter 30c, also previously described with reference to the embodiment of figure 7 .

[0155] . The further electronic circuitry 30 comprises a data processing unit 30b configured to wirelessly communicate with the data processing unit 3b of the electronic circuitry 3 , providing the data representative of the tilt value determined via the fieldbus transmitter 30c .

[0156] . The further electronic circuitry 30 comprises the second antenna 16b, configured to transmit power to the first antenna 16a and exchange data with it .

[0157] . The second antenna 16b is , for example , a wireless data communication antenna using NFC or RFID technology .

[0158] . With reference now to figure 9, an anti-vibration tilt sensor 1 is now described from the point of view of the electronic circuitry 3 and a further electronic circuitry 30 , in accordance with one embodiment of the present invention .

[0159] . The electronic circuitry 3 of the embodiment of figure 9 is the same as the electronic circuitry 3 of the embodiment of figure 8 , to which the previous description refers without repetition here for brevity .

[0160] . The further electronic circuitry 30 of the embodiment of figure 9 is substantially the same as the further electronic circuitry 30 of the embodiment of figure 8 , to which the previous description refers without repetition here for brevity, except for the fact that, in this embodiment, as shown in figure 9 , the further electronic circuitry 30 further comprises a further sensitive element 30a, adapted to generate electrical signals correlated to the tilt value to be measured .

[0161] . The further sensitive element 30a comprises , for example , one or more capacitive or thermal MEMS accelerometers .

[0162] . According to another example, the further sensitive element 30a comprises one or more inertial measurement units with six or nine degrees of freedom, composed of accelerometers , gyroscopes , and magnetometers .

[0163] . With reference now to figure 10 , an anti-vibration tilt sensor 1 is now described from the point of view of the electronic circuitry 3 and a further electronic circuitry 30 , in accordance with one embodiment of the present invention .

[0164] . According to this embodiment , the electrical communication components 6 comprise electrical communication cables 14 ' adapted to allow direct wiring between the electronic circuitry 3 and the further electronic circuitry 30 , and further electrical communication cables 15 ' adapted to allow direct wiring between the electronic circuitry 3 and the electrical connections C-E available to the second portion 5.

[0165] . In this embodiment , the electronic circuitry 3 comprises the sensitive element 3a, adapted to generate electrical signals correlated to the tilt value to be measured .

[0166] . The sensitive element 3a comprises , for example , one or more capacitive or thermal MEMS accelerometers .

[0167] . According to another example, the sensitive element 3a comprises one or more inertial measurement units with six or nine degrees of freedom, composed of accelerometers , gyroscopes , and magnetometers .

[0168] . The electronic circuitry 3 further comprises a data processing unit 3b configured to perform logical- mathematical operations necessary for managing the sensitive element 3a, determining the tilt value, and determining the data representative of the determined tilt value to be provided through a fieldbus transmitter 3c .

[0169] . The data processing unit 3b is , for example , amicrocontroller, a microprocessor, or an FPGA.

[0170] . The electronic circuitry 3 further comprises a temperature sensor element 3d, adapted to enable thermal drift compensation of the sensitive element 3a .

[0171] . The temperature sensor element 3d is , for example, a semiconductor j unction temperature sensor integrated within the chip implementing the data processing unit 3b or the same sensitive element 3a .

[0172] . According to another example, the temperature sensor element 3d comprises one or more thermistors which, being not integrable into the sensitive element 3a, are placed near the sensitive element 3a .

[0173] . The electronic circuitry 3a further comprises a power management module 3e , configured to regulate the power supply voltage coming from the electrical system of the mechanical component on which the sensor 1 is installed, through the electrical connector 5b and the electrical communication cables 13 , to power the electronic circuitry 3 , and thus all components installed on it .

[0174] . The power management module 3e is , for example , a linear or switching voltage regulator .

[0175] . In this embodiment , the further electronic circuitry 30 comprises a further sensitive element 30a, adapted to generate electrical signals correlated to the tilt value to be measured .

[0176] . The further sensitive element 30a comprises , for example , one or more capacitive or thermal MEMS accelerometers .

[0177] . According to another example, the further sensitive element 30a comprises one or more inertial measurement units with six or nine degrees of freedom, composed of accelerometers , gyroscopes , and magnetometers .

[0178] . In this embodiment, the data processing unit 3b of the electronic circuitry 3 is configured to determine the tilt value by combining ( for example, applying a Kalman filter technique ) the electrical signals coming from both sensitive elements : the sensitive element 3a of the electronic circuitry 3 and the further sensitive element 30a of the further electronic circuitry 30 .

[0179] . The further electronic circuitry 30 further comprises a further temperature sensor element 30d, adapted to enable thermal dri ft compensation of the further sensitive element 30a .

[0180] . The further temperature sensor element 30d is , for example , a semiconductor j unction temperature sensor integrated within the further sensitive element 30a .

[0181] . According to another example, the further temperature sensor element 30d comprises one or more thermistors which, being not integrable into the further sensitive element 30a, are placed near the furthersensitive element 30a .

[0182] . As can be seen, the purpose of the present invention is fully achieved since the anti-vibration tilt sensor according to the present invention substantially maintains the original dimensions of the sensor once installed on the mechanical component , does not require additional time for assembling the anti-vibration component , does not require an increase in components necessary for installing the sensor itsel f ; there are therefore no additional costs and the original reliability of the sensor is not compromised, both the electrical connections C-E and the mechanical connections C-M of the sensor are mechanically decoupled and isolated from vibrations with respect to the sensitive element used for determining the tilt value of the mechanical component on which the sensor is installable .

[0183] . These advantages are obtainable because, in the anti-vibration tilt sensor, the anti-vibration component is placed, along the longitudinal extension axis of the sensor, between the first portion comprising the electronic circuitry adapted to determine the tilt value and the second portion comprising the electrical and mechanical connections to the mechanical component whose tilt value with respect to the reference plane is to be measured, thus ef fectively implementing a stacked configuration thatexploits the pendular behaviour of the structure to ef fectively filter vibrations .

[0184] . Furthermore, the anti-vibration component is advantageously a structural and indispensable component of the structure of the sensor itself .

[0185] . In fact, without the anti-vibration component the sensor could not be manufactured because the first portion and the second portion would not be j oined together .

[0186] . Moreover, the anti-vibration component may have di fferent shapes to exhibit dif ferent vibration rej ection characteristics according to the needs of the context, without having to change the overall form factor of the sensor .

[0187] . In fact , the anti-vibration component may be implemented as a single component, of different thickness and shape , having a single layer or a multilayer structure, or with a base layer and a plurality of anti-vibration elements , separated from one another, to control the overall stif fness of the anti-vibration component according to their distribution and quantity .

[0188] . Furthermore, the connection for electrical communication between the electronic circuitry housed in the first portion and the electrical connections present in the second portion of the sensor may be implemented by means of one or more soft and flexible cables adapted topass through suitable through holes provided, respectively, in the first portion, in the anti-vibration component , and in the second portion of the sensor or, to further increase the mechanical isolation between the first portion and the second portion, wirelessly, for example based on an NFC or RFID communication protocol .

[0189] . Moreover, the anti-vibration component may be made of transparent silicone material and act as a light guide to provide visual indications , of fering an appealing aesthetic feature, i f the electronic circuitry housed in the first portion also comprises a light indicator .

[0190] . Finally, one embodiment provides that the second portion also houses a further electronic circuitry comprising a further sensitive element, in addition to the sensitive element present in the electronic circuitry housed in the first portion, and that the further data processing unit present in the further electronic circuitry determines the tilt value by combining ( for example, mathematically) the electrical signals coming from both sensitive elements .

[0191] . In a further embodiment, the first portion houses the electronic circuitry with the sensitive element, and the second portion houses a further electronic circuitry comprising a further sensitive element , and the data processing unit present in the electronic circuitry housedin the first portion determines the tilt value by combining ( for example, by applying a Kalman filter technique ) the electrical signals coming from both sensitive elements .

[0192] . For instance, combining the electrical signals in a Kalman filter can of fer significant benefits in terms of noise rej ection and response time improvement .

[0193] . The further sensitive element 30a is integral with the mechanical component whose tilt value is to be determined and therefore presents a fast response to movements of the mechanical component .

[0194] . In fact, being directly connected to the mechanical component, it captures the immediate variations of acceleration .

[0195] . On the other hand, the unfiltered vibrations of the mechanical component result in a noisier electrical signal yi .

[0196] . The sensitive element 3a instead has reduced noise, thanks to the anti-vibration component 4 adapted to filter high-frequency vibrations , producing a cleaner electrical signal y2 .

[0197] . However, its response time is slower, since the mechanical filtering introduces delays , attenuating rapid variations of acceleration .

[0198] . The di fference between the two electrical signals over time can be used to estimate the noise value e ( t )associated with the further sensitive element 30a rigidly mounted on the mechanical component: e (t) = yi (t) - y2(t)

[0199] . The difference e(t) substantially represents the noise value and the high-frequency vibrations present in the electrical signal yi(t) but not in the electrical signal y2 ( t ) .

[0200] . The measurement noise covariance matrix R reflects the uncertainties of the measurements from the sensitive elements.

[0201] . If we consider the electrical signal yi(t) and the electrical signal y2(t) as the measurements provided by the two sensitive elements, R can be defined as:noise variances for the rigidly mounted accelerometer (further sensitive element 30a) and the suspended accelerometer (sensitive element 3a) , respectively.

[0203] . Using the difference between the signals e(t) , it is possible to estimate the noise variance for the further sensitive element 30a rigidly mounted, for example by calculating the variance of the difference e(t) recorded over a significant period of time: oe2= Var (e ( t) )

[0204] . Assuming that the noise o22in the sensitiveelement 3a suspended by the anti-vibration component is negligible or known from the noise spectral density declared by the manufacturer, it is possible to approximate :Ol2= Oe2

[0205] . With the estimation of the noise variance, the measurement noise covariance matrix in the Kalman filter can be updated :

[0206] . Using the di fference between the electrical signals of the two accelerometers as an approximate measure of the noise associated with the accelerometer rigidly connected to the mechanical component is a strategy that allows for more accurate noise characterisation and for defining a more realistic measurement noise covariance matrix for the Kalman filter, thus improving the quality of the tilt value estimates .

[0207] . The application of this methodology is feasible because the tilt sensor of the present invention integrates the anti-vibration component within it , and thus has mechanical accessibility both from the second portion rigidly connected to the mechanical component whose tilt value is to be measured, and from the mechanically damped first portion, and internally integrates all sensitive and computational resources to autonomously produce anadvanced and more reliable tilt value measurement .

[0208] . Furthermore, the embodiment comprising both the sensitive element 3a and the further sensitive element 30a allows for the implementation of advanced diagnostic strategies , such as :

[0209] . constantly monitoring the magnitude of the vibrations characterising the mechanical component whose tilt is to be measured . For example, it is possible to noti fy the remote electronic control unit whether the sensor, although designed for vibration-prone applications , is effectively operating within its functional limits or whether there are application conditions for which it cannot provide measurement data in accordance with the accuracy stated in the respective datasheet ;

[0210] . - verifying the integrity of the anti-vibration component . For example , if , in the absence of vibrations and under stationary conditions , there is a difference between the tilt detected by the sensitive element 3a and that detected by the sensitive element 30a, it may indicate that the anti-vibration component has deformed or detached from the first portion 2 and / or from the second portion 5 of the sensor .

[0211] . To the embodiments of the anti-vibration tilt sensor described above , a person skilled in the art mayapply modifications , adaptations , and substitutions of elements with functionally equivalent ones , without departing from the scope of the following claims .

[0212] . Each of the features described as pertaining to a possible embodiment may be implemented independently of the other embodiments described .

Claims

CLAIMS1. An anti-vibration tilt sensor (1) for determining a tilt value with respect to a reference plane of a mechanical component to which said anti-vibration tilt sensor (1) is applicable, said anti-vibration tilt sensor (1) comprising: a first portion (2) extending along a longitudinal extension axis (L) , said first portion (2) being suitable for housing an electronic circuitry (3) therein, configured to determine the tilt value requested to said anti-vibration tilt sensor (1) , said first portion (2) having a respective lower face (2a) transverse to the longitudinal extension axis (L) of the first portion (2) ; a second portion (5) extending along said longitudinal extension axis (L) , said second portion (5) being distinct and separate from said first portion (2) , said second portion (5) comprising mechanical connections (C-M) configured to allow mechanically connecting the anti-vibration tilt sensor (1) to the mechanical component the tilt value of which is to be determined, and electrical connections (C-E) configured to allow electrically connecting the anti-vibration tilt sensor (1) to a remote electronic control unit, said second portion (5) having a respective upper face (5a) transverse to the longitudinal extension axis (L) of the secondportion (5) , the upper face (5a) of the second portion (5) facing the lower face (2a) of the first portion (2) ; an anti-vibration component (4) interposed, along the longitudinal extension axis (L) of the first portion (2) and of the second portion (5) , between the first portion (2) and the second portion (5) and fixed in contact with the lower face (2a) of the first portion (2) and the upper face (5a) of the second portion (5) so as to ensure a structural adhesion and a mechanical isolation to the propagation of vibrations between the first portion (2) and the second portion (5) .

2. The sensor (1) according to claim 1, wherein the first portion (2) comprises a housing delimited by a respective side wall (2' ) extending in height along the longitudinal extension axis (L) and by a bottom wall (2") the outer face of which corresponds to the bottom face (2a) of the first portion (2) , said side wall (2' ) defining a respective upper face of the first portion (2) , opposing the respective bottom face (2a) , having an opening such as to promote the insertion into the first portion (2) of the electronic circuitry (3) .

3. The sensor (1) according to claim 2, wherein the first portion (2) comprises a plurality of elements (E- S) supporting the electronic circuitry (3) extending along the longitudinal extension axis (L) from the bottom face(2a) towards the interior of the first portion (2) .

4. The sensor (1) according to any one of the preceding claims, wherein the first portion (2) comprises a resin (7) therein, adapted to substantially fill the inner volume defined by the first portion (2) .

5. The sensor (1) according to any one of the preceding claims, wherein the second portion (5) comprises a housing delimited by a respective side wall (5' ) extending in height along the longitudinal extension axis (L) and by an upper wall (5") the outer face of which corresponds to the upper face (5a) of the second portion (5) .

6. The sensor (1) according to claim 5, wherein the mechanical connections (C-M) of the second portion (5) comprise respective through holes defined by a set shape of the second portion (5) , the second portion (5) being shaped so that such through holes have a longitudinal extension parallel to the longitudinal extension axis (L) and are distributed outside the base of the side wall (5' ) of the second portion (5) , each of such through holes is configured to receive and retain upon screwing a respective screw so as to mechanically connect the antivibration tilt sensor (1) to the mechanical component the tilt value of which is to be determined.

7. The sensor (1) according to any one of the preceding claims, wherein the second portion (5) comprises a resin(7 ' ) therein, adapted to substantially fill the inner volume defined by the second portion (5) .

8. The sensor (1) according to any one of the preceding claims, comprising electrical communication components (6) operatively connected between the electronic circuitry (3) housed within the first portion (2) and the electrical connections (C-E) available to second portion (5) .

9. The sensor (1) according to claim 8 when dependent on claims 2 and 5, wherein the electrical communication components (6) comprise electrical communication cables (13) adapted to allow a direct wiring between the electronic circuitry (3) and the electrical connections (C-E) available to the second portion (5) , the bottom wall (2") of the first portion (2) comprising a through hole (10) placed substantially in the middle and adapted to allow the passage of said electrical communication cables (13) between the electronic circuitry (3) and the electrical connections (C-E) available to the second portion (5) , the anti-vibration component (4) comprising a respective through hole (11) placed substantially in the middle and adapted to allow the passage of the electrical communication cables (13) between the electronic circuitry (3) and the electrical connections (C-E)available to the second portion (5) , the upper wall (5") of the second portion (5) comprises a respective through hole (12) placed substantially in the middle and adapted to allow the passage of the electrical communication cables (13) between the electronic circuitry (3) and the electrical connections (C-E) available to the second portion (5) .

10. The sensor (1) according to claim 8 when dependent on claims 2 and 5, wherein the second portion (5) is suitable for housing a further electronic circuitry (30) therein, the electrical communication components (6) comprising first electrical communication cables (14) adapted to directly connect together the electronic circuitry (3) housed in the first portion (2) and the further circuitry (30) housed in the second portion (5) , the first electrical communication cables (14) being adapted to pass through a through hole (10) present in the bottom wall (2") of the first portion (2) , a through hole (11) present in the anti-vibration component (4) , and a through hole (12) present in the upper wall (5") of the second portion (5) , the electrical communication components (6) comprise second electrical communication cables (15) adapted to directly connect together the further circuitry(30) housed in the second portion (5) and the electrical connections (C-E) available to the second portion (5) .

11. The sensor (1) according to any one of the preceding claims, wherein the electronic circuitry (3) comprises a sensitive element (3a) and is configured to determine the tilt value requested to said anti-vibration tilt sensor (1) based on the electrical signal provided by the sensitive element (3a) .

12. The sensor (1) according to claim 11 when dependent on claim 10, wherein the further electronic circuitry (30) comprises a further sensitive element (30a) which, once the sensor (1) has been installed on the mechanical component the tilt value of which is to be determined, is integral with the mechanical component the tilt value of which is to be determined, the further electronic circuitry (30) being configured to determine the tilt value requested to said anti-vibration tilt sensor (1) based on the electrical signal provided by the further sensitive element (30a) .

13. The sensor (1) according to claim 12, wherein the determination of the tilt value requested to the sensor (1) is obtainable as a combination of the tilt values determined by the electronic circuitry (3) and by the further electronic circuitry (30) .

14. The sensor (1) according to claim 12, wherein theelectronic circuitry (3) is configured to determine the tilt value requested to the sensor (1) by combining the electrical signal provided by the sensitive element (3a) with the electrical signal provided by the further sensitive element (30a) .

15. The sensor (1) according to claim 8, wherein the electrical communication components (6) comprise a first data communication antenna (16a) installed on the electronic circuitry (3) , the second portion (5) being suitable for housing a further electronic circuitry (30) therein, the electrical communication components (6) further comprising a second data communication antenna (16b) installed on the further electronic circuitry (30) , the second data communication antenna (16b) being configured to transmit electric power to the first data communication antenna (16a) in a wireless mode, the first data communication antenna (16a) and the second data communication antenna (16b) being configured to communicate data with each other in a wireless mode, the electrical communication components (6) further comprise further electrical communication cables (17) adapted to directly connect together the further circuitry(30) housed in the second portion (5) and the electricalconnections (C-E) available to the second portion (5) .

16. The sensor (1) according to any one of the preceding claims, comprising a tuned mass damping portion (9) mounted, along the longitudinal extension axis (L) , above the first portion (2) , the tuned mass damping portion (9) comprising : a mass (9a) adapted to oscillate to counteract the vibrations to which the sensor (1) is subjected; a spring (9b) , a fixed end of which is fastened to the base of the damping portion (9) while, on a free end, the mass (9a) is fastened, the spring (9b) being configured to provide a booster force required to keep the mass (9a) oscillating; a damper (9c) configured to dissipate the energy of the oscillations of the mass (9a) , thus reducing the amplitude of the vibrations to which the sensor (1) is sub ected .

17. The sensor (1) according to any one of the preceding claims, further comprising a light indicator (8) electrically connected to the electronic circuitry (3) so as to face and be optically connected to the antivibration component (4) , the anti-vibration component (4) being made of transparent material to act as a guide for the light emitted by the light indicator (8) .

18. The sensor (1) according to any one of the precedingclaims, wherein the anti-vibration component (4) comprises at least one silicone material layer.

19. The sensor (1) according to any one of the preceding claims 1 to 17, wherein the anti-vibration component (4) comprises a multilayer structure in which each layer is made of silicone material.

20. The sensor (1) according to any one of the preceding claims 1 to 17, wherein the anti-vibration component (4) comprises a base layer (20) made of silicone material, the anti-vibration component (4) further comprising a plurality of anti-vibration elements (21) made of silicone material, fastened to and distributed on and extending along the longitudinal extension axis (L) from said base layer (20) .

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