Generation method, shaping method, and program

Abstract

A generation method for shaping paths is a method for generating shaping paths used when shaping a shaping article using scannable processing light and a powder, wherein the position from which the powder is supplied can be changed. The shaping paths have a surface formation path of a first surface formed by arranging line formation paths for linearly shaping with the powder and a surface formation path of a second surface formed by arranging line formation paths for linearly shaping with the powder, the surface formation path of the first surface and the surface formation path of the second surface being formed in a three-dimensional space including a reference plane on the basis of shaping article model information relating to the shaping article. The generation method for shaping paths generates the shaping paths such that the distance between adjacent line formation paths in a direction orthogonal to the reference plane is different in the surface formation path of the first surface and the surface formation path of the second surface.

Description

Generation Method, Shaping Method, and Program

[0001] The present invention relates to the technical fields of a generation method, a shaping method, and a program for generating a shaping path when shaping an object.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical problems of such a processing system is to process a shaped object having an overhang shape without forming a support.

[0003] U.S. Patent Publication No. 2006 / 0003095

[0004] According to a first aspect, there is provided a generation method for generating a shaping path used when shaping a shaped object, using a scanable processing light and a powder whose supply position can be changed, wherein the shaping path is formed by arranging line formation paths for linearly shaping with the powder in a three-dimensional space including a reference plane based on shaping object model information regarding the shaping object, and includes a surface formation path of a first surface formed by arranging line formation paths for linearly shaping with the powder, and a surface formation path of a second surface formed by arranging line formation paths for linearly shaping with the powder, and the generation method generates the shaping path so that a distance between adjacent line formation paths is made different between the surface formation path of the first surface and the surface formation path of the second surface in a direction orthogonal to the reference plane.

[0005] According to a second aspect, there is provided a shaping method including: a first step of shaping a first portion in a layer formed by a scanable processing light and a powder whose supply position can be changed; a second step of irradiating and melting a second portion of the workpiece separated from the first portion with the processing light; and a third step of melting the powder supplied using the processing light to form a connecting portion connecting the first portion and the second portion.

[0006] According to a third aspect, there is provided a shaping method for shaping a shaped object using a scanable processing light and a powder whose supply position can be changed, wherein a plurality of inclined layers extending along a direction forming an acute angle with the vertical direction are formed to form a surface extending along the vertical direction of the shaped object.

[0007] According to a fourth aspect, a program is provided which is stored in a memory device and executed by a computing device to control a light source that emits scanning processing light and a powder supply device capable of supplying powder to a desired position, based on a molding path used when molding an object, wherein the molding path has a surface forming path of a first surface formed by arranging line forming paths for molding linearly with the powder in a three-dimensional space including a reference plane, based on molded object model information relating to the object, and a surface forming path of a second surface formed by arranging line forming paths for molding linearly with the powder, and the program generates control information for at least one of the light source and the powder supply device according to the molding path in which the distance between adjacent line forming paths in a direction perpendicular to the reference plane is made different between the surface forming path of the first surface and the surface forming path of the second surface.

[0008] According to a fifth embodiment, a program is provided which is stored in a memory device and executed by a computing device to control a light source that emits scanning processing light and a powder supply device capable of supplying powder to a desired position, the program which executes: a first control that controls the light source and the powder supply device in order to form a first portion by stacking layers formed by the processing light and the powder; a second control that controls the powder supply device in order to irradiate a second portion of a workpiece separated from the first portion with the processing light and melt it; and a third control that controls the light source and the powder supply device in order to form a connection portion that connects the first portion and the second portion.

[0009] According to a sixth aspect, a program is provided which is stored in a memory device and executed by a computing device to control a light source that emits scanning processing light and a powder supply device capable of supplying powder to desired positions, thereby creating a molded object by stacking layers formed by the processing light and the powder, wherein the program generates control information to control at least one of the light source and the powder supply device so that a plurality of the layers are formed along a direction in which the angle with the vertical is acute, thereby forming a vertically extending surface of the molded object.

[0010] Figure 1 is a cross-sectional view showing the configuration of the processing system of this embodiment. Figure 2 is a block diagram showing the configuration of the processing system of this embodiment. Figure 3 is a plan view showing the end face of the material nozzle. Figure 4 is a cross-sectional view showing the configuration of the irradiation optical system. Figures 5(a) to 5(c) are cross-sectional views showing the process of fabricating a three-dimensional structure. Figures 6(a) and 6(b) are cross-sectional views showing the process of fabricating a structural layer by a first fabrication operation. Figures 7(a) and 7(b) are cross-sectional views showing the process of fabricating a structural layer by a second fabrication operation. Figure 8 is a schematic diagram illustrating the fabrication path generated by the fabrication path generation operation. Figure 9 is a perspective view showing an L-shaped bank plate-shaped object formed by the fabrication method of this embodiment. Figure 10 is a side view showing an L-shaped bank plate-shaped object formed by the fabrication method of this embodiment. Figure 11 is a perspective view showing a staircase-shaped object formed by the fabrication method of this embodiment. Figure 12 is a perspective view showing the fabrication path in the staircase-shaped object. Figure 13 is a perspective view showing a staircase-shaped object formed by the molding method of this embodiment. Figure 14 is a perspective view showing a curved-shaped object formed by the molding method of this embodiment. Figure 15 is a perspective view showing a hollow L-shaped block-shaped object formed by the molding method of this embodiment. Figures 16(a) to (d) are explanatory diagrams showing the molding method for a hollow L-shaped block-shaped object. Figure 17 is a perspective view showing an inverted U-shaped object formed by the molding method of the first modified example. Figures 18(a) to (c) are schematic explanatory diagrams showing the molding method for the connecting part in the inverted U-shaped object. Figure 19 is a perspective view showing a ring-shaped object formed by the molding method of the second modified example. Figure 20 is a schematic explanatory diagram showing the molding method for the main body portion of the ring-shaped object. Figure 21 is a schematic explanatory diagram showing the molding method for the main body portion of the ring-shaped object. Figure 22 is a schematic diagram illustrating a method for fabricating a connecting portion in a ring-shaped object. Figure 23 is a perspective view showing a hollow L-shaped block-shaped object formed by the fabrication method of the third modified example. Figure 24 is a schematic diagram illustrating a method for fabricating a hollow L-shaped block-shaped object by oblique scanning.

[0011] The following describes a processing system SYS that performs additive manufacturing (additive molding) based on laser metal deposition (LMD), with reference to the drawings. Additive manufacturing based on laser metal deposition is an additive manufacturing process that creates a three-dimensional structure ST (formed object) that is integrated with the workpiece W or can be separated from the workpiece W by melting the molding material M supplied to the workpiece W with processing light EL (an energy beam in the form of light).

[0012] In other words, the SYS processing system can be described as a 3D printer that processes objects using additive manufacturing technology. Additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. Laser welding (LMD) may also be called DED (Directed Energy Deposition).

[0013] Furthermore, the following explanation describes the positional relationships of the various components that make up the machining system SYS using the XYZ Cartesian coordinate system, which is defined by the mutually orthogonal X, Y, and Z axes. For the sake of explanation, the following explanation assumes that the X-axis and Y-axis directions are horizontal (a predetermined direction in the horizontal plane), and the Z-axis direction is vertical (a direction perpendicular to the horizontal plane, essentially the up and down direction). Also, the rotational directions (inclination directions) around the X, Y, and Z axes are defined as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may also be defined as the vertical direction. Also, the XY plane may be defined as the horizontal direction.

[0014] (1) Configuration of the SYS Machining System (1-1) Overall Configuration of the SYS Machining System First, the configuration of the SYS machining system of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic cross-sectional view showing the configuration of the SYS machining system of this embodiment. Figure 2 is a block diagram showing the configuration of the SYS machining system of this embodiment.

[0015] The machining system SYS comprises a stage unit 3 on which a workpiece (object to be processed) W is placed, a machining unit 2 that performs additional machining on the workpiece W, and a control unit 7 (control device) that controls the stage unit 3 and the machining unit 2.

[0016] (1-2) Configuration of Stage Unit 3 The stage unit 3 comprises a stage 31 and a stage drive mechanism 32. The stage 31 is located in the building space inside the chamber 19 of the processing system SYS, and the workpiece W is placed on it. For this reason, the stage 31 may also be called a mounting device. Specifically, the workpiece W is placed on the stage mounting surface 311, which is one surface of the stage 31 (for example, the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may also be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of the following for holding the workpiece W: a mechanical chuck, an electrostatic chuck, and a vacuum suction chuck. The workpiece W may also be attached to a holder, and the holder to which the workpiece W is attached may be placed on the stage 31. The retaining device may also be referred to as a jig, holder, holding member, mounting member, fixing member (holding member, mounting member), or clamp.

[0017] In the processing system SYS according to this embodiment, additive processing is performed on the workpiece W to form a three-dimensional structure ST (formed object) (see Figure 5) that is integrated with the workpiece W. The workpiece W is an object, that is, a three-dimensional structure, and may be another three-dimensional structure formed by the processing system SYS, that is, an existing formed object. Furthermore, the three-dimensional structure ST formed integrally with the workpiece W may be separable from the workpiece W after formation. In addition, in the processing system SYS according to this embodiment, additive processing is performed on the workpiece W (three-dimensional structure ST) placed on the stage 31, but it is not limited to this, and the stage 31 may be considered as the workpiece W, and the additive processing may be performed on the stage 31. The workpiece W may be made of a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher, similar to the forming material M described later, and may be the same as the forming material M or different. As the material of the workpiece W, for example, metallic materials or resin materials can be used, but other materials may also be used. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel.

[0018] The stage drive mechanism 32 is a drive mechanism that includes a drive source such as a motor that makes the stage 31 movable. When the stage drive mechanism 32 moves the stage 31, the relative positional relationship between the machining head 22 (the focusing optical system 50 provided in the machining head 22), which will be described later, and the stage 31 (the workpiece W placed on the stage 31) changes. For this reason, the stage drive mechanism 32 functions as a position changing device (drive device) that can change the relative positional relationship between the stage 31 and the workpiece W and the focusing optical system 50. The stage drive mechanism 32 is configured to move the stage 31 along, for example, the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction, at least one of these directions.

[0019] (1-3) Configuration of the processing unit 2 The processing unit 2 comprises an irradiation unit 4 that irradiates the workpiece W with processing light EL, a material supply unit 6 that supplies molding material for additional processing on the workpiece W, and a head drive mechanism 23.

[0020] (1-3-1) Components of the Material Supply Unit 6 The material supply unit 6 comprises a material supply device 61, a gas supply device 62, a mixing device 63, and a material nozzle 64. The material supply device 61 is a device capable of supplying powdered molding material M. The molding material M is not limited to powder; wire-shaped molding material or gaseous molding material may also be used. The molding material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. As such a molding material M, for example, metallic materials or resin materials can be used, but other materials may also be used. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel. The gas supply device 62 is a device capable of supplying gas. The mixing device 63 is a device connected to the material supply device 61 and the gas supply device 62, and mixes the powdered molding material M supplied from the material supply device 61 with the gas supplied from the gas supply device 62. In other words, the gas supply device 62 supplies a transport gas (pressurized gas) for transporting the powdered molding material M supplied from the material supply device 61, which is mixed in the mixing device 63. As the transport gas, for example, a purge gas consisting of an inert gas such as nitrogen or argon can be used, which is injected to replace the gas in the chamber 19. In addition to a cylinder containing inert gas, the gas supply device 62 can also use a nitrogen gas generator that generates nitrogen gas from the atmosphere as a raw material if the inert gas is nitrogen gas.

[0021] The material nozzle 64 is positioned in the build space inside the chamber 19 of the processing system SYS and is capable of supplying the build material M. More specifically, the material nozzle 64 is connected to the mixing device 63 and injects (sprays, ejects, or sprays) the build material M, which has been transported by pressurized gas, onto the workpiece W. In other words, the material nozzle 64 supplies the build material M together with the transport gas. For this reason, the material nozzle 64 may also be referred to as a material supply member or supply device (material supply device).

[0022] Figure 3 is a plan view showing the end face 640 of the material nozzle 64. As shown in Figure 3, a material supply port 641 is formed on the material nozzle 64. For example, an annular material supply port 641 may be formed on the end face 640 of the material nozzle 64. In the example shown in Figure 3, the shape of the outer edge of the material supply port 641 on the plane intersecting the Z axis is circular, but it may be a different shape. For example, the shape of the outer edge of the material supply port 641 on the plane intersecting the Z axis may be elliptical or polygonal. Also, in the example shown in Figure 3, a material supply port 641 which is a continuous annular or ring-shaped opening is formed on the end face 640 of the material nozzle 64. However, in addition to annular shapes such as circular, elliptical, or rectangular, multiple material supply ports 641 which are arc-shaped openings may be formed on the end face of the material nozzle 64.

[0023] (1-3-2) Configuration of Irradiation Unit 4 As shown in Figure 2, the irradiation unit 4 comprises a light source unit 30 and an irradiation device 21. The light source unit 30 comprises two light sources 40, which are energy beam sources. The light source 40 is an energy beam source that emits at least one of infrared light, visible light, and ultraviolet light as processing light EL. However, other types of light may be used as processing light EL. The processing light EL may include multiple pulsed light (multiple pulsed beams). The processing light EL may also be laser light. In this case, the light source 40 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers and CO2 lasers. ２ At least one of the following may be used: a laser, a YAG laser, and an excimer laser. However, the processing light EL does not have to be laser light. The light source 40 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0024] The characteristics of the processing light EL#1 emitted by the light source 40#1 and the processing light EL#2 emitted by the light source 40#2 may be the same or different. Characteristics include, for example, wavelength (typically the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1), wavelength band (typically the range of wavelengths at which the intensity is above a certain value), intensity, and absorption rate (relative to the peak wavelength) at the workpiece W (or the object on which the molded surface MS becomes the surface).

[0025] In this embodiment, an example has been described in which the processing system SYS (light source unit 30) is equipped with multiple light sources 40#1, 40#2. However, it is not limited to this, and may be equipped with two or more light sources, or it may be a single light source. For example, when a single light source 40#1 that emits (supplies) light in a wide wavelength band or multiple wavelengths is used, the emitted light may be wavelength-divided to generate processing light EL#1 and processing light EL#2 of different wavelengths, or the emitted light may be amplitude-divided or polarization-divided. The irradiation device 21 is a device for emitting processing light EL and includes an irradiation optical system 41 and a focusing optical system 50. The irradiation optical system 41 is an optical system for emitting processing light EL. Specifically, the irradiation optical system 41 is optically connected to the light source 40 that emits (generates) processing light EL via an optical transmission member such as an optical fiber or a light pipe.

[0026] The processing system SYS, and by extension the light source unit 30, has two light sources 40#1 and 40#2, which are optically connected to the irradiation device 21, and by extension the irradiation optical system 41, via optical transmission members. In the following description, when it is not necessary to distinguish between the "processing light EL#1" generated by light source 40#1 and the "processing light EL#2" generated by light source 40#2, they will be referred to as "processing light EL".

[0027] (Configuration of Irradiation Device 21) Next, the configuration of the irradiation device 21 will be explained with reference to Figure 4. Figure 4 is a diagram showing the configuration of the irradiation device 21.

[0028] The irradiation device 21 includes a focusing optical system 50 that focuses light and irradiates the workpiece W (forming surface MS), and an irradiation optical system 41 that directs processing light EL#1 incident from light source 40#1 and processing light EL#2 incident from light source 40#2 into the focusing optical system 50. The irradiation optical system 41 includes a first optical system 41#1 into which processing light EL#1 emitted from light source 40#1 is incident, and a second optical system 41#2 into which processing light EL#2 emitted from light source 40#2 is incident. The first optical system 41#1 and the second optical system 41#2 have similar configurations, although they differ in that they are arranged symmetrically with respect to the irradiation device 21 (prism mirror 51 described later). The configurations of the first optical system 41#1 and the second optical system 41#2 will be described below. In the following explanation, the configuration of the first optical system 41#1 related to the processing light EL#1 incident from the light source 40#1, and explanations intended for those using the processing light EL#1 incident from the light source 40#1, will be distinguished and described by adding "#1" to the end of the reference numeral of each component. Similarly, the configuration of the second optical system 41#2 related to the processing light EL#2 incident from the light source 40#2, and explanations intended for those using the processing light EL#2 incident from the light source 40#2, will be distinguished and described by adding "#2" to the end of the reference numeral of each component. On the other hand, if the first optical system 41#1 related to the processing light EL#1 incident from the light source 40#1 and the second optical system 41#2 related to the processing light EL#2 incident from the light source 40#2 have similar configurations, and if the processing light EL#1 incident from the light source 40#1 and the processing light EL#2 incident from the light source 40#2 are similar, the explanation will be given without distinguishing between them, without adding "#1" and "#2" to the end of the reference numerals of each configuration.

[0029] (Configuration of the first optical system 41#1 and the second optical system 41#2) The first optical system 41#1 and the second optical system 41#2 each include a collimator lens 42 (42#1, 42#2), a beam splitter 43 (43#1, 43#2), a galvanometer scanner 44 (44#1, 44#2), and a power meter 47 (47#1, 47#2).

[0030] The processing light EL (EL#1, EL#2) emitted from the light source 40 (40#1, 40#2) is incident on the collimator lenses 42 (42#1, 42#2), respectively. The collimator lenses 42 convert the processing light EL incident on them into parallel light. The processing light EL converted into parallel light by the collimator lenses 42 is incident on the beam splitter 43. In this embodiment, the beam splitter 43 uses a parallel planar substrate made of a light-transmitting material such as glass. The beam splitter 43 is positioned obliquely to the optical path of the processing light EL incident on the beam splitter 43. A portion of the processing light EL incident on the beam splitter 43 passes through the beam splitter 43. Another portion of the processing light EL incident on the beam splitter 43 is reflected by the beam splitter 43. Thus, the beam splitter 43 can be anything that can split the incident processing light EL, and in addition to a parallel planar substrate, a prism that reflects a portion of the incident processing light EL and transmits a portion may also be used.

[0031] The processed EL light that has passed through the beam splitter 43 is incident on the galvanoscanner 44. The galvanoscanner 44 includes a focus control optical system 45 (45#1, 45#2) and galvanosink mirrors 46 (46#1, 46#2). The processed EL light that has passed through the beam splitter 43 is incident on the focus control optical system 45.

[0032] The focus control optical system 45 is an optical component capable of changing the focus position CP (CP#1, CP#2) of the processing light EL. In this embodiment, the focus position CP of the processing light EL may mean the focusing position where the processing light EL is focused. The focus position CP of the processing light EL may also mean the convergence position where the processing light EL is most focused in the irradiation direction (travel direction) of the processing light EL.

[0033] Specifically, the focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction of the processing light EL emitted from the irradiation device 21. The focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction (approximately the Z-axis direction) of the processing light EL irradiated by the irradiation device 21 onto the molding surface MS (for example, the surface of the workpiece W or structural layer SL). In the example shown in Figure 4, the irradiation direction of the processing light EL is set to intersect with the molding surface MS, and the irradiation device 21 irradiates the molding surface MS with the processing light EL from above the workpiece W, so the focus control optical system 45 can change the focus position CP of the processing light EL along the direction intersect with the molding surface MS.

[0034] The focus control optical system 45 may include, for example, a plurality of optical elements (e.g., a plurality of lenses) arranged along the irradiation direction of the processing light EL. In other words, the focus control optical system 45 may include, for example, a plurality of refractive optical elements arranged along the irradiation direction of the processing light EL. In this case, the focus control optical system 45 changes the focus position CP of the processing light EL by moving at least one of the plurality of optical elements (refracting optical elements) along its optical axis. However, the focus control optical system 45 may also include a reflective optical element such as a mirror, and the focus position CP of the processing light EL may be changed by moving the reflective optical element.

[0035] When the focus control optical system 45 changes the focus position CP of the processing light EL, the positional relationship between the focus position CP of the processing light EL and the build surface MS changes. In particular, the positional relationship between the focus position CP of the processing light EL and the build surface MS changes in the irradiation direction of the processing light EL (approximately the Z-axis direction). Therefore, the focus control optical system 45 changes the positional relationship (positional relationship in the Z-axis direction) between the focus position CP of the processing light EL and the build surface MS by changing the focus position CP of the processing light EL. The focus control optical system 45 also changes the distance (distance in the Z-axis direction) between the focus position CP of the processing light EL and the build surface MS by changing the focus position CP of the processing light EL.

[0036] The processing light EL emitted from the focus control optical system 45 is incident on the galvanometer mirror 46. The galvanometer mirror 46 deflects the processing light EL, thereby changing the direction of emission of the processing light EL emitted from the galvanometer mirror 46. For this reason, the galvanometer mirror 46 may also be called a deflection optical system.

[0037] The galvanometer mirror 46 includes, for example, an X-scanning mirror 46MX (46MX#1, 46MX#2), an X-scanning motor 46AX (46AX#1, 46AX#2), a Y-scanning mirror 46MY (46MY#1, 46MY#2), and a Y-scanning motor 46AY (46AY#1, 46AY#2). The processing light EL emitted from the focus control optical system 45 is incident on the X-scanning mirror 46MX from the Z-axis direction. The X-scanning mirror 46MX reflects the processing light EL incident on the X-scanning mirror 46MX toward the Y-scanning mirror 46MY. The Y-scanning mirror 46MY reflects the processing light EL incident on the Y-scanning mirror 46MY toward the focusing optical system 50. Note that each of the X-scanning mirror 46MX and the Y-scanning mirror 46MY may also be referred to as a galvanometer mirror.

[0038] The X-scanning motor 46AX is capable of oscillating or rotating the X-scanning mirror 46MX around a rotation axis along the Y-axis. In other words, the angle of the X-scanning mirror 46MX with respect to the optical path of the processing light EL incident on the X-scanning mirror 46MX can be changed by the X-scanning motor 46AX, thereby changing the deflection angle of the processing light EL. For this reason, the X-scanning mirror 46MX may also be called a deflection member. In this case, the oscillation or rotation of the X-scanning mirror 46MX allows the processing light EL to be scanned along a direction perpendicular to the Y-axis (the X-axis direction of the molding surface MS).

[0039] The Y-scanning motor 46AY is capable of oscillating or rotating the Y-scanning mirror 46MY around a rotation axis along the X-axis. In other words, the angle of the Y-scanning mirror 46MY can be changed with respect to the optical path of the processing light EL incident on the Y-scanning mirror 46MY, thereby changing the deflection angle of the processing light EL. For this reason, the Y-scanning mirror 46MY may also be called a deflection member. In this case, the oscillation or rotation of the Y-scanning mirror 46MY allows the processing light EL to be scanned along a direction perpendicular to the X-axis (the Y-axis direction of the molding surface MS).

[0040] Here, with the relative positions of the irradiation device 21 and the build surface MS fixed (without changing them), the area in which the galvanometer mirrors 46 (46#1, 46#2) can move the irradiation area EA (EA#1, EA#2) on the build surface MS is defined as the processing unit area PUA (PUA#1, PUA#2) (see Figure 6). In other words, the processing unit area PUA represents the area (range) in which additional processing can be performed by the processing head 22 scanning the processing light EL and moving the irradiation area EA while the relative positions of the irradiation device 21 and the build surface MS are fixed. To put it another way, the processing unit area PUA is the maximum area in which the galvanometer mirrors 46 can move the target irradiation area EA on the build surface MS while the relative positions of the irradiation device 21 and the build surface MS are fixed. That is, the processing unit area PUA is a virtual area located at a position determined with respect to the processing head 22 (irradiation device 21) on the build surface MS.

[0041] When the emission direction of the processing light EL emitted from the galvanometer mirror 46 is changed, the position from which the processing light EL is emitted from the processing head 22 is changed, causing the irradiation area EA on the build surface MS to move, and the irradiation position of the processing light EL onto the build material M to move. For this reason, the galvanometer mirror 46 functions as a position changing device (irradiation position changing device) that can move the irradiation position of the processing light EL in the space between the build surface MS and the material nozzle 64, and also functions as a scanning optical system (deflection scanning optical system) that scans the processing light EL so that the irradiation position of the processing light EL moves.

[0042] The galvanometer scanner 44 does not necessarily have a focus control optical system 45. Even in this case, if the positional relationship between the irradiation optical system 41 and the build surface MS in the irradiation direction of the processing light EL changes, the positional relationship between the focus position CP of the processing light EL and the build surface MS in the irradiation direction of the processing light EL also changes. Therefore, even if the galvanometer scanner 44 does not have a focus control optical system 45, the processing system SYS can change the positional relationship between the focus position CP of the processing light EL and the build surface MS in the irradiation direction of the processing light EL. For example, the processing system SYS may change the positional relationship between the focus position CP of the processing light EL and the build surface MS in the irradiation direction of the processing light EL using a stage drive mechanism 32 or a head drive mechanism 23, which will be described later.

[0043] The processing light EL reflected by the beam splitter 43 is incident on the power meter 47. The power meter 47 is a device capable of detecting the intensity of the processing light EL (EL#1, EL#2) incident on the power meter 47. Because the beam splitter 43 (43#1, 43#2) is positioned on the optical path of the processing light EL between the light source 40 (40#1, 40#2) and the galvanometer mirror 46 (46#1, 46#2), the power meter 47 detects the intensity of the processing light EL traveling along the optical path between the light source 40 and the galvanometer mirror 46. In this case, the power meter 47 can stably detect the intensity of the processing light EL without being affected by the deflection of the processing light EL by the galvanometer mirror 46. However, the position of the power meter 47 is not limited to the example shown in Figure 4. For example, the power meter 47 may detect the intensity of the processing light EL traveling along the optical path between the galvanometer mirror 46 and the molding surface MS. The power meter 47 may detect the intensity of the processing light EL traveling along the optical path within the galvanometer mirror 46. The detection result of the power meter 47 is output to the control unit 7, which will be described later. The power meter 47 may also include, for example, a photodetector that detects the processing light EL as light. In addition, as the intensity of the processing light EL increases, the amount of energy in the processing light EL increases and the amount of heat generated by the processing light EL increases. Therefore, the power meter 47 may detect the intensity of the processing light EL by detecting the heat generated by the processing light EL. In this case, the power meter 47 may include a thermal detection element that detects the heat generated by the processing light EL.

[0044] (Configuration of the focusing optical system 50) The focusing optical system 50 comprises a prism mirror 51 and an fθ lens 52. In other words, the prism mirror 51 and the fθ lens 52 are integrated as a focusing optical system 50 so that their relative positions do not change. The processing light EL#1 emitted from the first optical system 41#1 and the processing light EL#2 emitted from the second optical system 41#2 each enter the prism mirror 51. The prism mirror 51 reflects the processing light EL#1 and EL#2 toward the fθ lens 52. The prism mirror 51 reflects the processing light EL#1 and EL#2, which enter the prism mirror 51 from different directions, toward approximately the same direction (fθ lens 52).

[0045] The fθ lens 52 is an optical system that injects the processed light EL (EL#1, EL#2) reflected by the prism mirror 51 toward the shaping surface MS. The processed light EL that has passed through the fθ lens 52 is irradiated onto the shaping surface MS. That is, the fθ lens 52 is the final optical member for irradiating the processed light EL reflected by the prism mirror 51 onto the shaping surface MS.

[0046] The fθ lens 52 is an optical element that injects the processed light EL toward the shaping surface MS and can condense the processed light EL on a condensing surface. For this reason, the fθ lens 52 may be referred to as a condensing optical system. The condensing surface of the fθ lens 52 may be set to, for example, the shaping surface MS. In this case, the condensing optical system 50 has a projection characteristic of fθ. However, the condensing optical system 50 may have a characteristic different from fθ as the projection characteristic. For example, the condensing optical system 50 may have a projection characteristic of f·tanθ, or may have a projection characteristic of f·sinθ.

[0047] The optical axis AX of the fθ lens 52 is an axis along the Z axis. For this reason, the fθ lens 52 injects the processed light EL substantially along the Z-axis direction. In this case, the irradiation direction of the processed light EL#1 and the irradiation direction of the processed light EL#2 may be the same direction. The irradiation direction of the processed light EL#1 and the irradiation direction of the processed light EL#2 may both be directions along the optical axis AX of the fθ lens 52. However, the irradiation direction of the processed light EL#1 and the irradiation direction of the processed light EL#2 do not have to be the same direction. The irradiation direction of the processed light EL#1 and the irradiation direction of the processed light EL#2 may be different from each other.

[0048] Note that when the light reflected from the prism mirror 51 can be condensed on the condensing surface, the condensing optical system 50 does not have to include the fθ lens 52. In this case, the final optical member is the prism mirror 51, and the processed light EL reflected by the prism mirror 51 is irradiated onto the shaping surface MS.

[0049] (1-4) Configuration of the head unit 20 The head unit 20 includes, in addition to the irradiation device 21 of the irradiation unit 4, a processing head 22 having a material nozzle 64 of the material supply unit 6, and a head drive mechanism 23 that makes the processing head 22 movable in the molding space inside the chamber 19 of the processing system SYS. The processing head 22, and by extension the head unit 20, may further include a light source unit 30, i.e., the irradiation unit 4, or further include a mixing device 63. The processing head 22 is configured such that the irradiation device 21 and the material nozzle 64 are located integrally, or at least within a predetermined distance range. Therefore, the processing head 22 is capable of supplying molding material M to the irradiation position of the processing light EL from the focusing optical system 50 using the material nozzle 64.

[0050] The head drive mechanism 23 is a drive mechanism including a drive source such as a motor that enables the movement of the machining head 22, i.e., the irradiation device 21 and the material nozzle 64, under the control of the control unit 7, which will be described later. When the head drive mechanism 23 moves the machining head 22, the relative positional relationship between the machining head 22 (the focusing optical system 50 provided on the machining head 22) and the stage 31 (the workpiece W placed on the stage 31) changes, similar to when the stage drive mechanism 32 moves the stage 31. For this reason, the head drive mechanism 23 functions as a position changing device (drive device) that can change the relative positional relationship between the stage 31 and the workpiece W and the focusing optical system 50, respectively. The head drive mechanism 23 is configured to move the machining head 22 along at least one of the following directions: the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0051] (1-5) Configuration of the Control Unit 7 Next, the configuration of the control unit 7 will be described. As shown in Figure 2, the control unit 7 includes an arithmetic unit 71 and a storage device 72. The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. The arithmetic unit 71, storage device 72, output device 73, input device 74, and display device 75 may be connected to each other.

[0052] The storage device 72 includes at least one memory capable of storing data. The memory may be implemented by a group of circuits (for example, at least one of an electronic circuit and an electrical circuit). For example, the storage device 72 may store a computer program 721, or temporarily store data that the arithmetic unit 71 will use temporarily when the arithmetic unit 71 (described later) is executing the computer program 721. The storage device 72 may also store data that the control unit 7 will store long-term. The storage device 72 may include at least one of RAM (Random Access Memory), ROM (Read Only Memory), hard disk drive, magneto-optical disk drive, SSD (Solid State Drive), and disk array device. In other words, the storage device 72 may include a non-temporary recording medium.

[0053] The arithmetic unit 71 is hardware that includes at least one circuit (for example, at least one of a logic circuit, an electronic circuit, and an electrical circuit). For this reason, the arithmetic unit 71 may also be referred to as a circuit group.

[0054] The arithmetic unit 71 includes at least one processor (one or more processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may also include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Integrated Circuit). The processor may be implemented by a group of circuits (for example, at least one of an electronic circuit and an electrical circuit).

[0055] The arithmetic unit 71 reads a computer program 721 which includes at least one of computer program code and computer program instructions. For example, the arithmetic unit 71 may read a computer program 721 stored on a computer-readable and non-temporary recording medium using a recording medium reader (not shown) provided by the control unit 7. The computer program 721 read from the recording medium may be stored in the storage device 72. The recording medium on which the computer program 721 is recorded may include equipment capable of recording the computer program 721 (for example, a general-purpose or dedicated device on which the computer program 721 is implemented in a state in which it can be executed in at least one form such as software and firmware). For example, the recording medium may be at least one of the following: optical discs such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark); magnetic media such as magnetic tape; magneto-optical disks; semiconductor memory such as USB memory; and any other medium capable of storing a program. In addition, the arithmetic unit 71 may obtain (download or read) a computer program 721 from a device (not shown) located outside the control unit 7 via a communication device. The downloaded computer program 721 may be stored in the storage device 72.

[0056] The arithmetic unit 71 executes the loaded computer program 721. As a result, logical functional blocks for executing the processing that the control unit 7 should perform (for example, processing to control the operation of the machining system SYS) are realized within the arithmetic unit 71. Each processing and function included in the computer program 721 may be realized by logical processing blocks realized within the arithmetic unit 71 when the arithmetic unit 71 (processor) executes the computer program 721, or by hardware such as a predetermined gate array (FPGA, ASIC) provided in the arithmetic unit 71, or it may function as a controller or computer for realizing logical functional blocks for executing the processing that the control unit 7 should perform. In other words, together with at least one processor provided in the arithmetic unit 71, the memory (recording medium) provided in the storage device 72, etc., and the computer program 721 are configured so that the control unit 7 performs the processing that the control unit 7 should perform (for example, the robot control processing described above).

[0057] The arithmetic unit 71 may generate control signals to control the operation of the machining system SYS as a result of executing the computer program 721 using logical functional blocks implemented within the arithmetic unit 71. The arithmetic unit 71 may output the generated control signals to at least one of the machining units 2 (particularly the light source 40, irradiation device 21, material supply device 61, and gas supply device 62) and the stage unit 3 via an output device 73, which will be described later. At least one of the machining units 2 and the stage unit 3 may operate based on the control signals output (generated) by the arithmetic unit 71. In other words, the machining system SYS processes the workpiece W based on the control signals output (generated) by the arithmetic unit 71.

[0058] The computing device 71 may implement a computational model that can be constructed by machine learning when the computing device executes a computer program 721. An example of a computational model that can be constructed by machine learning is a computational model that includes a neural network (so-called artificial intelligence (AI)). In this case, the learning of the computational model may include learning the parameters of the neural network (for example, at least one of the weights and biases). The computing device 71 may use the computational model to control the operation of the processing system SYS. That is, the operation of controlling the operation of the processing system SYS may include the operation of controlling the operation of the processing system SYS using the computational model. The computing device 71 may also implement a computational model that has been constructed by offline machine learning using training data. Furthermore, the computational model implemented in the computing device 71 may be updated by online machine learning on the computing device 71. Alternatively, the arithmetic unit 71 may control the operation of the machining system SYS using, in addition to or instead of, the arithmetic model implemented in the arithmetic unit 71, an arithmetic model implemented in an external device (a device provided outside the control unit 7).

[0059] The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. Alternatively, the control unit 7 may be configured by connecting the arithmetic unit 71, storage device 72, output device 73, input device 74, and display device 75 to each other.

[0060] The output device 73 is a device that outputs arbitrary information to the outside of the control unit 7. For example, the output device 73 may output a signal indicating arbitrary information (for example, the control signal described above) to the control unit 7 and an external device (for example, at least one of the processing unit 2 (particularly the light source 40, irradiation device 21, material supply device 61, gas supply device 62), and the stage unit 3). For example, the output device 73 may output a signal as arbitrary information via a communication network connecting the control unit 7 and an external device (for example, at least one of the processing unit 2 (particularly the light source 40, irradiation device 21, material supply device 61, gas supply device 62), and the stage unit 3). In this case, the output device 73 includes a communication device.

[0061] The output device 73 may output arbitrary information to the outside of the control unit 7 using a medium other than a signal. For example, the output device 73 may output information as sound. In this case, the output device 73 includes an audio device (a so-called speaker) capable of outputting sound. For example, the output device 73 may output information onto paper. In this case, the output device 73 includes a printing device (a so-called printer) capable of printing the desired information onto paper.

[0062] The input device 74 is a device that receives information input to the control unit 7 from outside the control unit 7. For example, the input device 74 may include an operating device that can be operated by the user of the control unit 7 (for example, at least one of a keyboard, mouse, and touch panel). In this case, the input device 74 functions as a device that allows the user to input information. For example, the input device 74 may include a recording medium reader that can read information recorded as data on a recording medium that can be attached externally to the control unit 7.

[0063] The information input to the input device 74 may also be input to the arithmetic unit 71. In other words, the arithmetic unit 71 may acquire the information input to the input device 74. The arithmetic unit 71 may control the operation of the machining system SYS based on the information input to the input device 74. For example, the arithmetic unit 71 may generate a control signal to control the operation of the machining system SYS based on the information input to the input device 74.

[0064] As mentioned above, if the output device 73 includes a communication device, the communication device included in the output device 73 may, in addition to or instead of outputting (transmitting) information via a data bus or communication network, acquire (receive) information via a data bus or communication network. In this case, the communication device included in the output device 73 may also function as an input device to which information is input via a data bus or communication network.

[0065] The display device 75 is a display capable of displaying images. The display device 75 may display images under the control of the arithmetic unit 71. In this case, the arithmetic unit 71 may generate display control information to control the display device 75 to display a desired image. The arithmetic unit 71 may output the generated display control information to the display device 75. The display device 75 may receive the display control information generated by the arithmetic unit 71 as input. The display device 75 may display a desired image based on the display control information generated by the arithmetic unit 71. In this way, the arithmetic unit 71 may control the display device 75 to display a desired image by outputting the generated display control information to the display device 75.

[0066] Furthermore, using the control unit 7 having the above configuration, the intensity of the processing light EL may be controlled (changed) based on the detection results of the power meters 47 (47#1, 47#2) input to the control unit 7 (detection results of the intensity of the processing light EL (EL#1, EL#2)). More specifically, the control unit 7 may control the intensity of the processing light EL so that the intensity of the processing light EL becomes a desired intensity. In order to control the intensity of the processing light EL, for example, the control unit 7 may control the light source 40 so as to change the intensity of the processing light EL emitted from the light source 40 based on the detection results of the power meters 47. As a result, the processing system SYS can appropriately create an object on the build surface MS by irradiating the build surface MS with processing light EL having an appropriate intensity.

[0067] In addition, the control unit 7 may control the head drive mechanism 23, which moves the machining head 22, and the stage drive mechanism 32, which moves the stage 31, so that the machining unit area PUA moves on the build surface MS during the period when the irradiation area EA is moved within the machining unit area PUA using the galvanometer mirror 46. Specifically, for example, the control unit 7 may control at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining unit area PUA moves along a movement trajectory that intersects (or, in some cases, is orthogonal to) the movement direction (scanning direction) of the irradiation area EA within the machining unit area PUA. Conversely, the control unit 7 may control the galvanometer mirror 46 so that the irradiation area EA periodically moves along a scanning direction that intersects (or, in some cases, is orthogonal to) the movement trajectory of at least one of the head drive mechanism 23 and the stage drive mechanism 32 within the machining unit area PUA on the build surface MS.

[0068] In addition to the above, the control unit 7 may also control the processing system SYS, for example, the processing unit 2 (at least one of the processing head 22 and the head drive mechanism 23), the stage unit 3 (stage drive mechanism 32), the light source 40, the material supply device 61, and the gas supply device 62. More specifically, the control unit 7 may control the emission mode of the processing light EL by the irradiation device 21. The emission mode refers to, for example, the on / off state of the processing light EL, the intensity of the processing light EL, and the emission timing of the processing light EL. If the processing light EL includes multiple pulsed light beams, for example, the emission time of the pulsed light beams, the emission period of the pulsed light beams, and the ratio of the length of the emission time of the pulsed light beams to the emission period of the pulsed light beams (the so-called duty cycle) may be controlled as the emission mode. In addition, the galvanoscanner 44 may control the optical system such as the galvanoscanner 44 to change the light irradiation position, change the light focal position, or manipulate the light. Furthermore, the control unit 7 may control the movement mode of the processing head 22 by the head drive mechanism 23 and the movement mode of the stage 31 by the stage drive mechanism 32. Movement mode refers to, for example, the amount of movement, the speed of movement, the direction of movement, and the timing of movement. Furthermore, the control unit 7 may control the supply mode of the molding material M by the material nozzle 64. Supply mode refers to, for example, the amount of supply (amount of supply per unit time) and the timing of supply.

[0069] (2) Operation of the SYS Machining System Next, we will explain the operations performed by the SYS machining system. As described above, the SYS machining system performs a molding operation (i.e., molding of the 3D structure ST) to create a 3D structure ST by performing additional machining on the workpiece W. Furthermore, before the start of the molding operation, the SYS machining system performs a molding path generation operation to generate the molding path used when molding the 3D structure ST. Therefore, the molding operation and the molding path generation operation will be explained in order below.

[0070] (2-1) Fabrication Operation First, the fabrication operation performed by the processing system SYS (additive processing operation that performs additional processing on the workpiece W) will be explained using Figures 5 to 7. Figures 5(a) to 5(c) are cross-sectional views showing the process of fabricating a three-dimensional structure. As described above, the processing system SYS fabricates the three-dimensional structure ST by performing additional processing based on the laser cladding welding method. For this reason, the processing system SYS may fabricate the three-dimensional structure ST by performing fabrication operations in accordance with the laser cladding welding method.

[0071] As shown in Figure 5, the processing system SYS creates a three-dimensional structure ST on the workpiece W based on three-dimensional model data (three-dimensional model information) of the three-dimensional structure ST to be fabricated. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYS and a three-dimensional shape measuring machine provided separately from the processing system SYS may be used. In order to fabricate the three-dimensional structure ST, the processing system SYS sequentially fabricates, for example, a plurality of structural layers SL arranged along the Z-axis.

[0072] The processing system SYS repeatedly performs operations to fabricate such structural layers SL based on the 3D model data of the 3D structure ST, under the control of the control unit 7. Specifically, first, before performing operations to fabricate the structural layers SL, the control unit 7 slices the 3D model data at the layering pitch to create slice data. The processing system SYS then performs operations to fabricate the first structural layer SL-1 on the fabrication surface MS, which corresponds to the surface of the workpiece W, based on the slice data corresponding to the structural layer SL-1. Specifically, the control unit 7 acquires path information for fabricating the first structural layer SL-1, which is generated based on the slice data corresponding to the structural layer SL-1. Subsequently, the control unit 7 controls the processing unit 2 and the stage unit 3 to fabricate the first structural layer SL-1 based on the path information. As a result, the structural layer SL-1 is fabricated on the fabrication surface MS, as shown in Figure 5(a). Subsequently, the machining system SYS sets the surface (top surface) of structural layer SL-1 as a new build surface MS, and then fabricates the second structural layer SL-2 on this new build surface MS. To fabricate structural layer SL-2, the control unit 7 first controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining head 22 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 to move the machining head 22 toward the +Z side and / or move the stage 31 toward the -Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface (new build surface MS) of structural layer SL-1. Subsequently, the control unit 7 controls the machining unit 2 and the stage unit 3 to fabricate structural layer SL-2 on structural layer SL-1 based on slice data corresponding to structural layer SL-2, in the same manner as the fabrication of structural layer SL-1. As a result, structural layer SL-2 is fabricated, as shown in Figure 5(b). This process is repeated until all structural layers SL constituting the three-dimensional structure ST to be fabricated on the workpiece W are fabricated. As a result, as shown in Figure 5(c), the three-dimensional structure ST is fabricated by a laminated structure composed of multiple structural layers SL.

[0073] The processing system SYS (primarily processing unit 2) selectively performs two types of fabrication operations to create each structural layer SL: a first fabrication operation in which the fabrication material M is supplied to molten pools MP (MP#1, MP#2) (see Figure 1) formed by irradiating the fabrication surface MS with processing light EL to create a three-dimensional structure ST; and a second fabrication operation in which the fabrication material M, melted by irradiating the fabrication light EL, is supplied to the fabrication surface MS to create a three-dimensional structure ST. The first and second fabrication operations will be described in order below.

[0074] (2-1-1) First molding operation The first molding operation is a molding operation in which a molded object is formed on the molding surface MS by irradiating the molding surface MS with processing light EL to form a molten pool MP on the molding surface MS, and supplying molding material M to the formed molten pool MP (the position where the processing light EL was irradiated).

[0075] Figures 6(a) and 6(b) are cross-sectional views showing the process of creating structural layers by the first molding operation. First, the operation of creating each structural layer SL by performing the first molding operation will be explained with reference to Figures 6(a) and 6(b). Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 22 and the stage 31 so that the processing unit area PUA is set in a desired area on the molding surface MS corresponding to the surface of the workpiece W or the surface of the already formed structural layer SL. Then, the irradiation device 21 irradiates the processing unit area PUA with processing light EL. At this time, the focus position CP of the processing light EL in the Z-axis direction may coincide with the molding surface MS or may be away from the molding surface MS. As a result, as shown in Figure 6(a), molten pools MP are formed on the molding surface MS irradiated with processing light EL. Furthermore, under the control of the control unit 7, the processing system SYS supplies the molding material M from the material nozzle 64. As a result, the molding material M is supplied to the molten pool MP.

[0076] The molding material M supplied to the molten pool MP is melted by the energy from the processing light EL irradiated onto the molten pool MP. Alternatively, the molding material M supplied to the molten pool MP is melted by the heat from the molten material constituting the molten pool MP. Even when the molding material M is melted by the heat from the molten material constituting the molten pool MP, since the molten pool MP is formed by the energy of the processing light EL, the molding material M can be considered to be melted by the energy of the processing light EL that formed the molten pool MP. In other words, the molding material M is indirectly melted by the processing light EL through the molten pool MP formed by the processing light EL. In either case, the fact remains that the molding material M is melted by the energy of the processing light EL.

[0077] Furthermore, the irradiation device 21 moves the irradiation area EA (EA#1, EA#2) within the processing unit area PUA (PUA#1, PUA#2) using the galvanometer mirrors 46 (46#1, 46#2). In other words, the irradiation device 21 scans the processing light EL within the processing unit area PUA using the galvanometer mirrors 46. As the irradiation area EA moves, the processing light EL stops irradiating, and the molten molding material M cools and solidifies. In other words, as the irradiation area EA moves, the position where the molten pool MP is formed also moves. As a result, as shown in Figure 6(b), within the processing unit area PUA, as the irradiation area EA moves, the molded object composed of the solidified molding material M is deposited on the molded surface MS. In this manner, processing light EL is irradiated onto the molding surface MS to form a molten pool MP (narrow sense), then molding material M is supplied to the molten pool MP (narrow sense), the molding material M melts and forms a molten pool (broad sense) protruding from the molding surface MS, and the structure (structural layer SL) is deposited on the molding surface MS by cooling and solidifying the molten pool (broad sense).

[0078] Here, the control unit 7 may control the galvanometer mirror 46 to deflect the processing light EL so that the irradiation area EA moves along a single scanning direction within the processing unit area PUA while the processing unit area PUA is stationary (not moving) on ​​the build surface MS. In other words, the control unit 7 may deflect the processing light EL with the galvanometer mirror 46 so that the irradiation area EA moves along the main scanning direction (single scanning direction) within a coordinate system determined with respect to the processing unit area PUA. In particular, the galvanometer mirror 46 may deflect the processing light EL so that the irradiation area EA periodically reciprocates along a single scanning direction within the processing unit area PUA. In other words, the galvanometer mirror 46 may deflect the processing light EL so that within the processing unit area PUA, the irradiation area EA is scanned in the main scanning direction, then shifted in a sub-scanning direction perpendicular to the main scanning direction, and then scanned again in the main scanning direction, repeating this process. In this case, the irradiation area EA may be repeatedly scanned from one side to the other along the main scanning direction, or it may be repeatedly scanned alternately from one side to the other and from the other side to the first side along the main scanning direction. The shape of the processing unit area PUA, to which the irradiation area EA moves in this manner, may be a rectangle whose longitudinal direction is the direction of movement of the irradiation area EA.

[0079] In addition, the control unit 7 may drive the head drive mechanism 23 and the stage drive mechanism 32 to move the processing head 22 and the workpiece W relative to each other, while periodically scanning the processing light EL with the galvanometer mirror 46, thereby performing an operation (wobbling operation) to periodically move (deflect) the irradiation area EA on the molding surface MS.

[0080] In Figure 6, for the sake of explanation, the molded object composed of the molding material M solidified within the processing unit area PUA#1 and the molded object composed of the molding material M solidified within the processing unit area PUA#2 are physically separated. However, the molded object composed of the molding material M solidified within the processing unit area PUA#1 and the molded object composed of the molding material M solidified within the processing unit area PUA#2 may be integrated. In particular, if the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the molded object composed of the molding material M solidified within the processing unit area PUA#1 and the molded object composed of the molding material M solidified within the processing unit area PUA#2 may be integrated.

[0081] During the period when the irradiation areas EA#1 and EA#2 are moving within the processing unit areas PUA#1 and PUA#2, respectively, the processing system SYS may move at least one of the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 move on the build surface MS. In other words, the processing system SYS may perform the movement of the irradiation area EA#1 within the processing unit area PUA#1 and the irradiation area EA#2 within the processing unit area PUA#2, respectively, and the movement of the processing unit areas PUA#1 and PUA#2 on the build surface MS in parallel.

[0082] Alternatively, during the period when the irradiation area EA#1 is moving within the processing unit area PUA#1 and the irradiation area EA#2 is moving within the processing unit area PUA#2, the processing system SYS does not need to move the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 do not move on the build surface MS. In other words, the processing head 22 and the stage 31 may remain stationary during the period when the irradiation area EA#1 is moving within the processing unit area PUA#1 and the irradiation area EA#2 is moving within the processing unit area PUA#2. In this case, after the additional processing (forming) within the processing unit areas PUA#1 and PUA#2 is completed, the processing system SYS may move at least one of the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in different areas on the build surface MS. In other words, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the build surface MS after the additional machining (shaping) within the machining unit areas PUA#1 and PUA#2 is completed. In this case, the areas on the build surface MS where the machining unit areas PUA#1 and PUA#2 are already set (areas where additional machining has already been performed) and the areas on the build surface MS where the machining unit areas PUA#1 and PUA#2 are newly set (areas where additional machining will now be performed) may be adjacent to each other. These areas may partially overlap or may not overlap with each other.

[0083] The processing system SYS repeats a series of fabrication processes on the fabrication surface MS while moving the processing unit area PUA along a movement trajectory. These processes include the formation of a molten pool MP by irradiation with processing light EL within the processing unit area PUA, the supply of fabrication material M to the molten pool MP, the melting of the supplied fabrication material M, and the solidification of the molten fabrication material M. In this case, as the processing unit area PUA moves, a fabricated object is formed on the fabrication surface MS that has a width along the direction intersecting the movement trajectory (X-axis direction) and extends along the Y-axis direction.

[0084] As a result, a structural layer SL, which corresponds to the molded object and is an aggregate of the molten and solidified molding material M, is formed on the molding surface MS. In other words, a structural layer SL, which corresponds to an aggregate of molded objects formed on the molding surface MS in a pattern corresponding to the movement trajectory of the processing unit area PUA, is formed. That is, in a plan view, a structural layer SL is formed that has a shape corresponding to the movement trajectory of the processing unit area PUA.

[0085] The movement trajectory of the machining unit area PUA may also be called a machining path (toolpath). In this case, the control unit 7 may move at least one of the machining head 22 and the stage 31 on the build surface MS so that the machining unit area PUA moves along the movement trajectory based on path information (path information indicating the machining path) indicating the movement trajectory.

[0086] (2-1-2) Second molding operation In the first molding operation described above, the processing system SYS melts the molding material M on the molding surface MS. On the other hand, in the second molding operation, the processing system SYS melts the molding material M in the space between the material nozzle 64 and the molding surface MS before the molding material M reaches the molding surface MS. In other words, in the second molding operation, the processing system SYS irradiates the molding material M with processing light EL in the space between the material nozzle 64 and the molding surface MS to melt the molding material M. The processing system SYS then supplies the molding material M that has melted in the space between the material nozzle 64 and the molding surface MS to the molding surface MS to form a molded object on the molding surface MS. Therefore, in the second molding operation, the processing system SYS does not need to perform the operation of irradiating the molding surface MS with processing light EL to form a molten pool MP.

[0087] Figures 7(a) and 7(b) are cross-sectional views showing the process of creating structural layers by the second molding operation. In the second molding operation, the machining system SYS moves at least one of the machining head 22 and the stage 31 under the control of the control unit 7 so that molten molding material M is supplied to a desired area on the molding surface MS corresponding to the surface of the workpiece W or the surface of the already formed structural layer SL, thereby creating each structural layer SL. In the following description, we will take as an example a configuration in which the machining head 22 is moved so that molten molding material M is supplied to a desired area on the molding surface MS to create a three-dimensional structure ST.

[0088] As shown in Figure 7(a), the processing system SYS emits processing light EL from the irradiation device 21 and supplies the molding material M from the material nozzle 64 under the control of the control unit 7. As a result, the processing light EL is irradiated onto the molding material M in the space between the material nozzle 64 and the molding surface MS. Here, in the space between the material nozzle 64 and the molding surface MS, the surface that intersects (is perpendicular to) the direction in which the material nozzle 64 and the molding surface MS face each other (Z-axis direction) is defined as the material supply surface PL, and among the multiple material supply surfaces PL between the material nozzle 64 and the molding surface MS, the surface on which the processing light EL is irradiated onto the molding material M is defined as the material irradiation surface ES. The processing system SYS irradiates the material irradiation surface ES with processing light EL and supplies the molding material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing light EL irradiated onto the material irradiation surface ES passes through the material irradiation surface ES, and the molding material M supplied to the material irradiation surface ES also passes through the material irradiation surface ES. Furthermore, because the molding material M passes through the material supply surface PL, the material supply surface PL may also be called the material passage surface.

[0089] When the molding material M is irradiated with processing light EL on the material irradiation surface ES, the molding material M melts on the material irradiation surface ES. The molten molding material M on the material irradiation surface ES is supplied from the material irradiation surface ES to the molding surface MS. As a result, the molten molding material M on the material irradiation surface ES adheres to the molding surface MS. Subsequently, the molding material M supplied to the molding surface MS cools and solidifies. As a result, as shown in Figure 7(b), a molded object composed of the solidified molding material M is deposited on the molding surface MS.

[0090] The SYS machining system repeats a series of molding processes, including melting the molding material M on the material irradiation surface ES by irradiation with machining light EL, supplying the molten molding material M to the molding surface MS, and solidifying the molten molding material M on the molding surface MS, while moving the machining head 22 relative to the molding surface MS. In particular, the SYS machining system repeats the series of molding processes while moving the machining head 22 along at least one of the X-axis and Y-axis directions relative to the molding surface MS. In this case, as the machining head 22 moves, a molded object having a width along a direction intersecting the direction of movement of the machining head 22 is molded on the molding surface MS. As a result, a structural layer SL corresponding to a molded object, which is an aggregate of the molten and solidified molding material M, is molded on the molding surface MS. The structural layer SL corresponding to an aggregate of molded objects molded on the molding surface MS is molded in a pattern corresponding to the movement trajectory of the machining head 22. In other words, in a plan view, a structural layer SL having a shape corresponding to the movement trajectory of the machining head 22 is molded.

[0091] When such a second fabrication operation is performed, the object having the fabrication surface MS on its surface (e.g., workpiece W or structural layer SL) is hardly directly melted by the processing light EL. Therefore, the time required for the molten fabrication material M to cool and solidify is shortened. Consequently, the time required to fabricate the three-dimensional structure ST in the second fabrication operation is shorter compared to the first fabrication operation which is performed by forming a molten pool MP. In other words, the fabrication speed in the second fabrication operation is faster than the fabrication speed in the first fabrication operation, allowing for high-speed fabrication of the three-dimensional structure ST.

[0092] Thus, because the second fabrication operation can fabricate a three-dimensional structure ST at high speed, the second fabrication operation may be referred to as a fabrication operation compliant with the Extreme High Speed ​​Application (EHLA). The second fabrication operation may be considered to be a fabrication operation compliant with the Extreme High Speed ​​Application (EHLA).

[0093] Even when the second molding operation is performed, the processing system SYS may deflect the processing light EL using galvanometer mirrors 46#1 and 46#2, similar to when the first molding operation is performed. In this case, the processing system SYS may move the beam passage region PA (PA#1, PA#2) (see Figure 4) through which the processing light EL passes within a virtual material irradiation surface ES that intersects the Z-axis between the material nozzle 64 and the molding surface MS by deflecting the processing light EL using galvanometer mirrors 46#1 and 46#2.

[0094] (2-2) Forming Path Generation Operation Next, the forming path generation operation performed by the processing system SYS will be described. Figure 8 is a schematic diagram of the forming path 10 generated by the forming path generation operation. In the forming path generation operation, a forming path 10 is generated that is used when forming a three-dimensional structure ST using the processing light EL described above and a forming material M (powder) whose supply position can be changed. Based on the formed object model information relating to the three-dimensional structure ST, the forming path 10 includes at least a plurality of line forming paths 11 for forming linearly with the powder M in a three-dimensional space including a reference plane. The forming path 10 may also include a plurality of surface forming paths 12 (12-1, 12-2, 12-3, 12-4) formed by arranging the plurality of line forming paths 11 for forming linearly with the powder M. The surface forming path 12 may be a virtual surface formed by arranging the plurality of line forming paths 11 at a predetermined path interval D. The pass interval D is the distance between the centers of the line-forming paths 11 that are arranged parallel to each other, that is, the distance between the focal points of the processing light EL during fabrication. The surface-forming path 12 is, for example, the fabrication data corresponding to the structural layer SL that is fabricated during the fabrication operation. The surface-forming path 12 only needs to correspond to at least a part of the structural layer SL, and the shape of the fabrication path 10 (surface-forming path 12) and the shape of the structural layer SL may be different from each other. The fabrication path 10 may include both the line-forming path 11 and the surface-forming path 12. In the following description, when the line-forming path 11 and the surface-forming path 12 are not distinguished, they may simply be referred to as the fabrication path 10.

[0095] As shown in Figure 2, the build path generation operation is performed, for example, in the control unit 7. The control unit 7 acquires model data of the target three-dimensional structure ST via the input device 74 and generates build paths 10 based on the acquired model data. A build operation is performed based on at least a portion of the generated build paths 10. Note that a portion of the build path generation operation and a portion of the build operation may be performed in parallel. For example, the build operation may be started when the generation of the first portion of the multiple build paths 10 generated by the build path generation operation is completed. In this case, the operation to generate the remaining portion of the multiple build paths 10 and the build operation corresponding to the first portion of the build paths 10 may be performed simultaneously (in parallel).

[0096] (2-3) Fabrication of an object having an overhang shape Next, a method for fabricating an object ST1 having an overhang shape by performing the above-described fabrication path generation operation and fabrication operation will be explained using Figures 9 to 14. First, a method for fabricating an L-shaped bank plate object ST1 will be explained. Figure 9 is a perspective view showing an L-shaped bank plate object ST1 formed by the fabrication method of this embodiment. Figure 10 is a side view showing an L-shaped bank plate object ST1 formed by the fabrication method of this embodiment.

[0097] As shown in Figures 9 and 10, in this embodiment, the processing system SYS is capable of fabricating an L-shaped bank plate-shaped object ST1. The L-shaped bank plate-shaped object ST1 has an overhang shape with a bank angle of 90° or more in at least a portion of it. Specifically, the L-shaped bank plate-shaped object ST1 has a first surface 14 extending from the workpiece W in the Z-axis direction (direction perpendicular to the workpiece W), and a second surface 15 extending downward in the vertical direction from one end 15a connected to the upper end of the first surface 14 to the other end 15b. The first surface 14 is a surface extending in a direction corresponding to the vertical direction in three-dimensional space. The second surface 15 is a surface extending in a direction corresponding to the horizontal direction in three-dimensional space. More specifically, the second surface 15 has an overhang shape with an inclination angle θ of 90° or more with respect to the extension direction (Z-axis direction) of the first surface 14. The processing system SYS fabricates an L-shaped bank plate-shaped object ST1 without providing a support member below the second surface 15. The light source 40 is configured to irradiate processing light EL along a direction inclined by an angle α with respect to the vertical, opposite to the inclination direction of the second surface (see Figure 10). In this embodiment, the inclination angle α of the processing light EL is approximately 5°. However, the inclination angle α of the processing light EL is not limited to 5°. The processing light EL may be irradiated along the vertical direction, that is, α = 0°.

[0098] The SYS machining system fabricates the first surface 14, and then fabricates the second surface 15. The first surface 14 is fabricated by continuously fabricating a linear fabrication path 10 (line formation path 11) along the X-axis direction from bottom to top in the Z-axis direction. The distance between adjacent line formation paths 11 along the Z-axis direction on the first surface 14 is set to D1. Once the fabrication of the first surface 14 is complete, the SYS machining system begins fabricating the second surface 15. The second surface 15 is fabricated by continuously fabricating a line formation path 11 along the X-axis direction from one end 15a connected to the upper end of the first surface 14 to the other end 15b opposite to the first surface 14 in the Y-axis direction. The distance between adjacent line formation paths 11 aligned along the Y-axis direction on the second surface 15 is set to D2. The path interval D2 on the second surface 15 is smaller than the path interval D1 on the first surface 14 (D2 < D1).

[0099] Specifically, if the tilt angle α of the processing light EL is 5° and the tilt angle θ of the second surface 15 is 90°, and the diameter of the laser spot size is S mm, then the pass intervals D1 and D2 may be arbitrarily set in the range of approximately 0.01 to S / 2 mm. Furthermore, the processing system SYS may be configured to measure the temperature of the fabricated object ST1 during fabrication. In this case, at least one of the pass intervals D1 of the first surface 14 and D2 of the second surface 15 may be changed based on the temperature information of the fabricated object ST1 during fabrication.

[0100] The method for fabricating the L-shaped bank plate-shaped object ST1 described above can be included in or executed within the processing system SYS. In other words, the configuration of the processing system SYS in this embodiment can be rephrased as follows. That is, the method for generating the fabrication path 10 is a method for generating a fabrication path 10 used when fabricating an object ST1, using a scannable processing light EL and a powder M whose supply position can be changed, wherein the fabrication path 10 has a surface formation path for a first surface formed by arranging line formation paths 11 for fabricating linearly with the powder M in a three-dimensional space including a reference plane, based on the fabrication model information relating to the object ST1, and a surface formation path for a second surface formed by arranging line formation paths 11 for fabricating linearly with the powder M, and the fabrication path 10 is generated such that the distance between adjacent line formation paths 11 in a direction perpendicular to the reference plane is different for the surface formation path of the first surface 14 and the surface formation path of the second surface 15.

[0101] Furthermore, in the method for generating the molding path 10 described above, the direction perpendicular to the reference plane may correspond to the vertical direction in three-dimensional space.

[0102] Furthermore, in the method for generating the molding path 10 described above, the first surface 14 may be a surface extending in a direction corresponding to the vertical direction of three-dimensional space, and the second surface 15 may be a surface extending in a direction corresponding to the horizontal direction of three-dimensional space.

[0103] Furthermore, in the method for generating the molding path 10 described above, the second surface 15 may be a surface that extends vertically downward from one end 15a connected to the first surface 14 to the other end 15b.

[0104] Furthermore, in the method for generating the molding path 10 described above, the distance between adjacent line formation paths 11 on the second surface 15 may be made smaller than the distance between adjacent line formation paths 11 on the first surface 14.

[0105] Furthermore, in the method for generating the molding path 10 described above, the line formation path 11 may indicate a path through which the focal position of the processing light EL moves.

[0106] Furthermore, in the method for generating the molding path 10 described above, at least one of the distances between adjacent line formation paths 11 on the first surface 14 and the distances between adjacent line formation paths 11 on the second surface 15 may be changed based on the temperature information of the molded object ST1 during the molding process.

[0107] Furthermore, in the method for generating the molding path 10 described above, if the temperature obtained based on the temperature information is lower than the threshold, the distance between adjacent line formation paths 11 may be reduced compared to the case where the temperature is above the threshold.

[0108] Next, a method for fabricating a spiral staircase-shaped object ST2, in which inclined surfaces and horizontal surfaces are alternately connected, as a fabricated object having an overhang shape, will be described. Figure 11 is a perspective view showing the staircase-shaped object ST2 formed by the fabrication method of this embodiment. Figure 12 is a perspective view showing the fabrication path 10 in the staircase-shaped object ST2. As shown in Figures 11 and 12, in this embodiment, the processing system SYS is capable of fabricating a staircase-shaped object ST2 in which multiple staircases are spirally connected. The staircase-shaped object ST2 has a plurality of first surfaces 17 inclined at approximately 45° with respect to a reference surface, and a plurality of second surfaces 18 connected to the upper ends of the first surfaces 17 and extending horizontally. Specifically, in the staircase-shaped object ST2, first, a rectangular first surface 17-1 inclined at approximately 45° from the reference surface (workpiece W) is formed. Next, a rectangular second surface 18-1 parallel to the horizontal direction is formed from the upper end (upper edge) of the first surface 17-1. Then, from one of the four edges of the second surface 18-1 that is different from the edge to which the first surface 17-1 is connected (in this embodiment, the edge that is clockwise adjacent to the edge to which the first surface 17-1 is connected when viewed from above), a first surface 17-2 is formed again, inclined at approximately 45° with respect to the reference surface. The second surface 18-2 is formed on the edge located at the upper end of the first surface 17-2. In this way, a step-shaped object ST2 is fabricated by the alternating and repeated formation of multiple first surfaces 17-1, 17-2, ... and multiple second surfaces 18-1, 18-2, .... The first surface 17 has an overhang shape with an inclination angle θ of approximately 45° with respect to the reference surface (workpiece W or the second surface 18 fabricated immediately before). Similarly, the second surface 18 has an overhang shape with an inclination angle θ of approximately 45° with respect to the reference surface (the first surface 17 that was fabricated immediately beforehand) (an inclination angle of approximately 90° with respect to the vertical direction). The processing system SYS fabricates the stepped shape ST2 without providing support members below the first surface 17 and the second surface 18.

[0109] As shown in Figure 12, the SYS processing system performs fabrication along multiple line formation paths 11 when fabricating the first surface 17 and the second surface 18. In the figure, solid arrows represent the trajectory of the fabrication path (irradiation trajectory of the processing light EL) when fabrication is performed. Also in the figure, dotted arrows represent the irradiation trajectory that would be drawn by the processing light EL if it were irradiated, even though the processing light EL is not actually irradiated, and are shown as the movement of the irradiation optical system 41 (see Figure 6), so-called toolpaths. In this embodiment, the first surface 17-1 is fabricated by fabricating multiple linear fabrication paths 10 (line formation paths 11) along the Y-axis direction in a diagonal direction having a composite component in the X-axis direction and the Z-axis direction. The path spacing between adjacent line formation paths 11 on the first surface 17 is set to D3. Multiple line formation paths 11 on the first surface 17 are set to have the same scanning direction (forming direction) (in the first surface 17-1, from the -Y axis direction to the +Y axis direction). This allows for a cooling period between the formations along each line formation path 11, enabling the formed object to solidify sufficiently. Furthermore, compared to cases with folded sections, it is possible to suppress heat concentration in the folded sections and prevent meltdown.

[0110] Once the first surface 17-1 is formed, the SYS processing system begins forming the second surface 18-1. The second surface 18-1 is formed by continuously forming line formation paths 11 along the Y-axis direction in the X-axis direction, starting from the upper end of the first surface 17-1 and moving away from the first surface 17-1. On the second surface 18, the path spacing between adjacent line formation paths 11 aligned along the X-axis direction is set to D4. Here, the second surface 18 has a larger bank angle relative to the vertical direction compared to the first surface 17, and the forming conditions are more stringent. For this reason, the path spacing D4 of the second surface 18 may be set smaller than the path spacing D3 of the first surface 17 (D4 < D3).

[0111] Once the fabrication of the second surface 18-1 is complete, the processing system SYS begins fabricating the first surface 17-2. In this embodiment, the first surface 17-2 is fabricated by continuously fabricating multiple linear fabrication paths 10 (line formation paths 11) along the X-axis direction in an oblique direction having a composite component in the Y-axis and Z-axis directions. The multiple line formation paths 11 on the first surface 17-2 are set to have the same scanning direction (facing direction) (from the +X-axis direction to the -X-axis direction). This makes it possible to provide a cooling period between fabrications along each line formation path 11, similar to the first surface 17-1, allowing the fabricated object to solidify sufficiently. Note that the second surface 18-2 and subsequent surfaces are a repetition of the above, so the explanation is omitted. In addition, in the fabrication of the staircase-shaped object ST2, the light source 40 may be configured to irradiate the processing light EL along a direction inclined by a predetermined angle α (see Figure 10) with respect to the vertical direction, similar to the L-shaped bank plate-shaped object ST1 described above.

[0112] Next, a method for fabricating a spiral staircase-shaped object ST3, which has an overhang shape and consists of alternating vertical and horizontal planes, will be described. Figure 13 is a perspective view showing the staircase-shaped object ST3 formed by the fabrication method of this embodiment. As shown in Figure 13, in this embodiment, the processing system SYS is capable of fabricating a staircase-shaped object ST3 in which two mutually orthogonal planes are spirally connected. The staircase-shaped object ST3 has a plurality of first planes 29 parallel to the vertical direction and a plurality of second planes 33 connected to the upper ends of the first planes 29 and extending parallel to the horizontal direction. Specifically, in the staircase-shaped object ST3, first, a rectangular first plane 29-1 is formed extending vertically from the reference plane (workpiece W). Next, a rectangular second plane 33-1 parallel to the horizontal direction is formed from the upper end (upper edge) of the first plane 29-1. Next, a rectangular first surface 29-2 is formed extending vertically from one of the four edges of the second surface 33-1 that is different from the edge to which the first surface 29-1 is connected (in this embodiment, the edge that is clockwise adjacent to the edge to which the first surface 29-1 is connected when viewed from above). The second surface 33-2 is formed on the edge located at the upper end of the first surface 29-2. In this way, a staircase-shaped object ST3 is fabricated by the alternating and repeated formation of multiple first surfaces 29-1, 29-2, ... and multiple second surfaces 33-1, 33-2, .... The second surface 33 has an overhang shape with an inclination angle θ of approximately 90° with respect to the reference surface (the first surface 29 that was fabricated immediately before). The processing system SYS fabricates the staircase-shaped object ST3 without providing any support members, especially below the second surface 33.

[0113] In this embodiment, similar to the stepped-shaped object ST2 described above, the processing system SYS may perform molding along multiple line formation paths 11 when molding the first surface 29 and the second surface 33. For example, the first surface 29-1 may be molded by continuously molding multiple linear molding paths 10 (line formation paths 11) along the Y-axis direction in the Z-axis direction. The distance between adjacent line formation paths 11 on the first surface 29 may be set to D5. Multiple line formation paths 11 on the first surface 29 may have the same scanning direction (molding direction) (for example, on the first surface 29-1, from the -Y-axis direction to the +Y-axis direction). In this case, a cooling period is provided between molding along each line formation path 11, allowing the molded object to solidify sufficiently. Furthermore, compared to the case with folded portions, it is possible to suppress heat concentration at the folded portions and suppress meltdown.

[0114] Once the first surface 29-1 is formed, the processing system SYS may begin forming the second surface 33-1. The second surface 33-1 may be formed by continuously forming line formation paths 11 along the Y-axis direction from the upper end of the first surface 29-1 in a direction away from the first surface 29-1 (X-axis direction). On the second surface 33, the path spacing between adjacent line formation paths 11 aligned along the X-axis direction may be set to D6. In this case, the path spacing D6 of the second surface 33 may be set to be smaller than the path spacing D5 of the first surface 29 (D6 < D5). The processing system SYS may form a stepped shape ST3 by sequentially repeating the formation of the first surface 29 and the second surface 33 a predetermined number of times.

[0115] Next, a method for fabricating a curved object ST5 as an overhanging object will be described. Figure 14 is a perspective view showing the curved object ST5 formed by the fabrication method of this embodiment. As shown in Figure 14, in this embodiment, the processing system SYS is capable of fabricating a curved object ST5. In a side view, the curved object ST5 is formed in a quadratic curve shape in which the amount of increase in the Z-axis direction increases as it moves toward the X-axis direction. That is, the curved object ST5 has a curved surface 26 in which the inclination of the curve gradually changes as it moves upward from the lower end connected to the workpiece W. The processing system SYS fabricates the curved object ST5 without providing a support member below the curved surface 26.

[0116] Specifically, the curved surface 26 is fabricated by continuously fabricating a linear fabrication path 10 (line formation path 11) along the Y-axis direction from bottom to top in an oblique direction having a combined component in the Z-axis direction and the X-axis direction. The slope of the tangent to the curved surface is smaller (i.e., the bank angle θ with respect to the vertical direction is larger) towards the lower end (workpiece W) of the curved surface 26. Note that the fabrication conditions of the curved surface 26 may be different for parts located below a predetermined height in the Z-axis direction and parts located above a predetermined height. For example, if the part located below a predetermined height is designated as the first surface 26-1 and the part located above a predetermined height is designated as the second surface 26-2, the distance between adjacent line formation paths 11 in the first surface 26-1 and the second surface 26-2 may be different. In this case, the distance D9 between line formation paths 11 in the first surface 26-1 may be smaller than the distance D10 between line formation paths 11 in the second surface 26-2 (D9 < D10). The curved surface 26 may be divided into three or more surfaces in the Z-axis direction. In this case, the distance between the line-forming paths 11 may be different for each of the divided surfaces (for example, the first surface, the second surface, the third surface, etc. (not shown)).

[0117] Next, a method for fabricating a hollow L-shaped block ST6 as a fabricated object having an overhang shape will be described. Figure 15 is a perspective view showing a hollow L-shaped block ST6 formed by the fabrication method of this embodiment. Figures 16(a) to (d) are explanatory diagrams showing the fabrication method for a hollow L-shaped block ST6. As shown in Figures 15 and 16, in this embodiment, the processing system SYS is capable of fabricating a hollow L-shaped block ST6. The hollow L-shaped block ST6 has an overhang shape in at least a part of it. Specifically, the hollow L-shaped block ST6 has a first block 27 extending from the workpiece W in the Z-axis direction (direction perpendicular to the workpiece W), and a second block 28 connected to the upper end of the first block 27 and extending along the horizontal direction, and overhanging the first block 27 in the horizontal direction (Y-axis direction in this embodiment). The first block 27 and the second block 28 are each formed in the shape of a rectangular parallelepiped. When viewed from above, a portion of the second block 28 is fabricated overlapping the upper part of the first block 27. The remaining portion of the second block 28 protrudes from the first block 27 in the -Y-axis direction. As a result, the second block 28 has an overhang shape with an inclination angle θ of 90° relative to the first block 27. The processing system SYS fabricates the hollow L-shaped block object ST6 without providing a support member below the second block 28. In the examples of Figures 15 and 16, the light source 40 is configured to irradiate processing light EL along the vertical direction, but it is not limited to this. The light source 40 may irradiate processing light EL along a direction inclined by a predetermined angle with respect to the vertical direction.

[0118] The SYS machining system fabricates the first block 27, and then fabricates the second block 28. As shown in Figure 16(a), the first block 27 is fabricated by continuously fabricating a planar fabrication path 10 (rectangular surface formation path 12) along the XY direction from bottom to top in the Z-axis direction. In other words, the first block 27 is formed by fabricating multiple fabrication surfaces (hereinafter sometimes referred to as first surfaces) that are parallel to the horizontal direction and constitute the first block 27, overlapping them in the Z-axis direction. Once the fabrication of the first block 27 is complete, the SYS machining system begins fabricating the second block 28. Specifically, as shown in Figure 16(b), the SYS machining system first fabricates the lowest second surface (hereinafter sometimes referred to as second surface) among the multiple fabrication surfaces (hereinafter sometimes referred to as second surfaces) that constitute the second block 28, which corresponds to the overhang portion of the second block 28. The fabrication surface corresponding to the overhang portion (the lowest second surface) may be carried out in the same manner as when the second surface 15 of the L-shaped bank plate-shaped fabrication object ST1 (see Figure 9) described above was fabricated. That is, the fabrication surface corresponding to the overhang portion (the lowest second surface) may be fabricated by continuously fabricating a line formation path 11 along the X-axis direction along the -Y-axis direction.

[0119] Once the fabrication of the fabrication surface corresponding to the overhang portion (the lowest second surface) is complete, the SYS fabrication system begins fabricating the remaining second block 28, as shown in Figure 16(c). The second block 28 is fabricated by continuously fabricating a planar fabrication path 10 (rectangular surface formation path 12) along the XY direction from bottom to top in the Z-axis direction. In other words, the second block 28 is formed by fabricating multiple second surfaces that constitute the second block 28, overlapping in the Z-axis direction. Finally, the SYS fabrication system forms the uppermost second surface, as shown in Figure 16(d). This creates the hollow L-shaped block object ST6.

[0120] Here, the printing conditions for printing the first block 27 and the printing conditions for printing the second block 28 may be different from each other. Alternatively, the printing conditions for the first surface constituting the first block 27 and the printing conditions for the second surface constituting the second block 28 may be different from each other. For example, the printing speed of the second surface may be set to be slower than the printing speed of the first surface. In addition, the path spacing between horizontally adjacent line-forming paths 11 when printing the second surface located at the bottom and the second surface located at the top may be set to be smaller than the path spacing between vertically adjacent first surfaces when printing the first block 27.

[0121] (3) Technical effects of the processing system SYS of this embodiment As described above, the method for generating the molding path 10 of this embodiment is a method for generating a molding path 10 used when molding molded objects ST1, ST2, ST3, ST4, ST5, ST6, using a scannable processing light EL and a powder M whose supply position can be changed, wherein the molding path 10 has a surface forming path 12 for the first surfaces 14, 17, 29, 24 and a surface forming path 12 for the second surfaces 15, 18, 33, 25, and the distance between adjacent line forming paths 11 in the Z-axis direction is made different for the surface forming path 12 for the first surfaces 14, 17, 29, 24 and the surface forming path 12 for the second surfaces 15, 18, 33, 25. By varying the distances between adjacent line formation paths 11 on the first surfaces 14, 17, 29, 24 and the second surfaces 15, 18, 33, 25, the first surfaces 14, 17, 29, 24 and the second surfaces 15, 18, 33, 25 can be suitably fabricated. In particular, if the second surfaces 15, 18, 33, 25 are in an overhang shape, and the distances D2, D4, D6, D8 between line formation paths 11 on the second surfaces 15, 18, 33, 25 are set to be smaller than the distances D1, D3, D5, D7 between line formation paths 11 on the first surfaces 14, 17, 29, 24, the second surfaces 15, 18, 33, 25 can be fabricated without providing support members below them. Therefore, it is possible to fabricate structures ST1, ST2, ST3, ST4, ST5, and ST6 that have an overhang shape without support structures.

[0122] In the fabrication of the L-shaped bank plate object ST1, the second surface 15 is a surface that slopes downward in the vertical direction from one end 15a, which is connected to the first surface 14, to the other end 15b. This makes it possible to fabricate an object ST1 with an overhang shape having a bank angle of 90° or more without supports. Thus, the degree of freedom and versatility of objects that can be fabricated by the SYS processing system can be increased.

[0123] The processing system SYS changes at least one of the distance D1 between adjacent line formation paths 11 on the first surface 14 and the distance D2 between adjacent line formation paths 11 on the second surface 15, based on the temperature information of the object ST1 during the molding process. By acquiring the temperature information of the object ST1 during the molding process, the amount of heat input to the object ST1 during the molding process can be predicted, and the distance between the line formation paths 11 can be controlled based on the magnitude of the heat input. For example, if the acquired temperature is lower than a threshold, it is expected that the amount of heat input to the object ST1 will be small, so the distance between the line formation paths 11 is reduced compared to when the temperature is higher than the threshold (i.e., when the amount of heat input to the object ST1 is large). This ensures that a sufficient amount of heat input is secured to form the molten pool MP, so that the object ST1 having an overhang shape can be suitably fabricated without forming support members.

[0124] (4) Modified Versions Next, modified versions of the SYS processing system will be described. Although the following descriptions are of modified versions of the SYS processing system, these configurations can also be applied to the above-mentioned method for generating the model path and the modeling method.

[0125] (4-1) First Modification The above-described embodiment describes a method for fabricating molded objects ST1, ST2, ST3, ST4, ST5, and ST6 having an overhang shape in at least a part of it. The first modification describes a method for fabricating molded objects that have an overhang shape in at least a part of it and further have connecting parts to which the overhang shapes are connected.

[0126] Figure 17 is a perspective view showing an inverted U-shaped object ST11 formed by the fabrication method of the first modified example. Figures 18(a) to (c) are schematic explanatory diagrams showing the fabrication method of the connecting portion 70 in the inverted U-shaped object ST11. In Figure 18, the solid line represents the trajectory of the fabrication path (irradiation trajectory of the processing light EL) when fabrication is performed. The dotted line represents the irradiation trajectory that would be drawn by the processing light EL if it were irradiated, even though the processing light EL is not actually irradiated, and is shown as the movement of the irradiation optical system 41 (see Figure 6), representing the so-called fabrication path (toolpath). As shown in Figures 17 and 18, in this modified example, the fabrication system SYS is capable of fabricating an inverted U-shaped object ST11. The inverted U-shaped object ST11 has an overhang shape with a bank angle of 90° in at least a part of it, and has a connecting portion for connecting this overhang shape to another object. Specifically, the inverted U-shaped molded object ST11 has an L-shaped first portion 77 having an overhang shape, a second portion 78 formed at a position spaced apart from the first portion 77, and a connecting portion 70 connecting the first portion 77 and the second portion 78. The first portion 77 is formed in an L-shape having a first surface 81 extending from the workpiece W in the Z-axis direction (direction perpendicular to the workpiece W), and a second surface 82 connected to the upper end of the first surface 81 and extending horizontally from the upper end of the first surface 81. The second surface 82 has an overhang shape with an inclination angle (bank angle) θ of approximately 90° with respect to the extension direction (Z-axis direction) of the first surface 81. The processing system SYS molds the first portion 77 without providing a support member below the second surface 82. The second portion 78 is formed at a position spaced apart from the first portion 77 in the extension direction of the second surface 82 in the first portion 77. The second portion 78 extends from the workpiece W in the Z-axis direction (a direction perpendicular to the workpiece W). With the first portion 77 and the second portion 78 formed on the workpiece W, the upper end of the second portion 78 and the tip of the second surface 82 of the first portion 77 are in contact with each other via the connecting portion 70. As a result, the inverted U-shaped molded object ST11 is formed in a rectangular shape when viewed from the front.

[0127] The processing system SYS fabricates an inverted U-shaped object ST11 by forming (shaping) a first part 77, a second part 78, and a connecting part 70, respectively. Specifically, the method for fabricating the inverted U-shaped object ST11 includes a first part fabrication step (first step of the claim) for fabricating the first part 77, a second part fabrication step (fourth step of the claim) for fabricating the second part 78, a melting step (second step of the claim) for melting at least a part of the second part 78, and a connecting part formation step (third step of the claim) for forming the connecting part 70. In the first part fabrication step, the first part 77 is fabricated with a layer formed by a scannable processing light EL and powder M whose supply position can be changed. The first part 77 may be formed, for example, by the same method as the L-shaped bank plate object ST1 described above. That is, after forming the first surface 81, the second surface 82 may be formed extending horizontally from the upper end of the first surface 81 without providing a support member. However, the method of forming the first part 77 is not limited to this. Next, in the second part forming step, the second part 78 is formed by stacking layers formed with a scannable processing light EL and powder M supplied in accordance with the scanning of the processing light. In this modified example, the second part 78 has the same shape and size as the first surface 81 of the first part 77, and is formed at a position spaced apart from the first surface 81 so as to face the first surface 81 of the first part 77. The order of the first part forming step and the second part forming step may be reversed. Alternatively, the first part forming step and the second part forming step may be performed alternately. Next, in the melting step, the processing light EL is irradiated onto the upper end of the second part 78, which is formed spaced apart from the first part 77, and the upper end of the second part 78 is melted. Furthermore, "melting the upper end of the second portion 78" in the melting process is not limited to completely melting the upper end of the second portion 78 (into a liquid state), but may also include, for example, applying a predetermined amount of heat to the upper end of the second portion 78 by irradiating it with processing light EL. In addition, in the connection part formation process, the supplied powder M is melted using processing light EL to form a connection part 70 that connects the first portion 77 and the second portion 78. In the connection part formation process, the connection part 70 is formed by alternately repeating the formation of a layer extending from the first portion 77 to the second portion 78 and a layer extending from the second portion 78 to the first portion 77.Specifically, as shown in Figure 18(a), the molding of the second surface 82 of the first part 77 is temporarily stopped at a predetermined distance from the second part 78. Next, as shown in Figure 18(b), the processing light EL is moved to the upper end of the second part 78 to mold and heat the upper end of the second part 78. Note that the step shown in Figure 18(b) may be part of the melting step. That is, the melting step and the connection part formation step may be performed simultaneously or alternately. As shown in Figure 18(c), once the molding (or heating) of the upper end of the second part 78 is completed, the processing light EL is immediately moved to the tip of the first part 77, and the molding of the second surface 82 of the first part 77 is performed again. In this way, in the connection part formation step, the connection part 70 is formed near the connection part between the first part 77 and the second part 78 by alternately molding the first part 77 and the second part 78. In addition, in the connection part formation process, molding with the supply of powder M may be omitted, and only irradiation with processing light EL may be performed. The first part 77 and the second part 78 may be connected by irradiating the first part 77 and the second part 78, which are placed in close proximity, with processing light EL to remelt them. In this case, since no buildup occurs near the connection part due to the formation of the connection part 70, the first part 77 and the second part 78 can be smoothly connected.

[0128] According to this modified example, the fabrication process involves a first partial fabrication step, a second partial fabrication step, a melting step, and a connection step, thereby enabling a suitable connection between a fabricated object having an overhang shape (first part 77) and another object (second part 78). In the above example, a configuration was described in which the second part 78, a three-dimensional fabricated object, is provided as the other object connected to the first part 77, but the invention is not limited to this. The other object connected to the first part 77 may be an object other than the fabricated object fabricated by the SYS processing system. In this case, the connection may be formed by alternately repeating the fabrication of the first part 77 and the heat input to the other object in the melting step and the connection step. Furthermore, according to this modified example, the connection 70 is formed near the connection between the first part 77 and the second part 78 by alternately repeating the fabrication of the first part 77 and the second part 78. As a result, the second part 78 is heated when the connecting part 70 is formed, making it easier to weld the first part 77 and the second part 78 together compared to simply stretching the first part 77 toward the second part 78 and connecting them. Therefore, the quality of the molded object can be improved. Note that the molding conditions for the first part 77 and the second part 78 may differ. Furthermore, the molding conditions for the first part 77 and the second part 78 may differ from those for the connecting part 70.

[0129] (4-2) Second Modified Example Next, a method for fabricating a ring-shaped object ST12 as a fabricated object having an overhang shape and a connecting portion will be described. Figure 19 is a perspective view showing the ring-shaped object ST12 formed by the fabrication method of the second modified example. Figures 20 and 21 are schematic explanatory diagrams showing the fabrication method of the main body portion of the ring-shaped object ST12. The dotted line in Figure 21 represents the irradiation trajectory drawn by the processing light EL when the processing light EL is irradiated, even though the processing light EL is not actually irradiated, as shown as the movement of the irradiation optical system 41 (see Figure 6), i.e., it represents the toolpath. Figure 22 is a schematic explanatory diagram showing the fabrication method of the connecting portion 80 of the ring-shaped object ST12. In Figure 22, the solid line represents the trajectory of the fabrication path when fabrication is performed (irradiation trajectory of the processing light EL). The dotted lines represent the irradiation trajectory that would be drawn by the processing light EL if it were irradiated, even though the processing light EL is not actually being irradiated. This is shown as the movement of the irradiation optical system 41 (see Figure 6) and represents the so-called machining path (toolpath). Note that in Figure 22, etc., the spacing of the trajectories of the molding path (i.e., the spacing between solid lines) is not limited to the size (width) shown in Figure 22, etc. As shown in Figures 19 to 22, in this modified example, the machining system SYS is capable of molding a ring-shaped object ST12. The ring-shaped object ST12 has a semi-circular first part 83 and a second part 84 having an overhang shape, and a connecting part 80 that connects the first part 83 and the second part 84. The first part 83 is formed in a semi-circular shape that constitutes the left half of the main body of the ring-shaped object ST12 when viewed from the front along the Y-axis. The second part 84 is formed in a shape symmetrical to the first part 83, and is formed in a semi-circular arc shape that constitutes the right half of the main body of the ring-shaped molded object ST12 when viewed from the front along the Y-axis. Support columns 85 are formed at the lower ends of the first part 83 and the second part 84. The support columns 85 extend from the workpiece W in the Z-axis direction. The first part 83 and the second part 84 are each connected to the upper end of the support columns 85 and have an overhang shape having a predetermined inclination angle (bank angle) θ with respect to the extending direction (Z-axis direction).In other words, the first portion 83 (the first surface of the claim) and the second portion 84 (the second surface of the claim) are each different parts of a single curved surface, and the tangents of the first portion 83 and the tangents of the second portion 84 intersect each other in their extending directions. The processing system SYS forms the first portion 83 and the second portion 84 without providing support members below the overhang portions of the first portion 83 and the second portion 84. With the support column 85, the first portion 83 and the second portion 84 formed on the workpiece W, the upper end of the first portion 83 and the upper end of the second portion 84 are in contact with each other via the connecting portion 80. This forms a ring-shaped object ST12 in front view.

[0130] The processing system SYS fabricates a ring-shaped object ST12 by forming (shaping) a first part 83, a second part 84, and a connecting part 80, respectively. Specifically, the method for fabricating the ring-shaped object ST12 includes a first part fabrication step (first step of the claim) for fabricating the first part 83, a second part fabrication step (fourth step of the claim) for fabricating the second part 84, and a connecting part formation step (third step of the claim) for forming the connecting part 80. In the first part fabrication step, the first part 83 is fabricated with a layer formed by a scannable processing light EL and powder M whose supply position can be changed. In the first part fabrication step, an arc-shaped surface is formed.

[0131] In the second partial fabrication step, similar to the first partial fabrication step, layers are stacked using a scannable processing light EL and powder M supplied in response to scanning of the processing light EL to fabricate the second part 84. In the second partial fabrication step, an arc-shaped surface is formed. In this modified example, the first partial fabrication step and the second partial fabrication step are performed alternately. More specifically, as shown in Figures 20 and 21, the fabrication system SYS first fabricates the lower region of the first part 83 (for example, the region corresponding to (1) in Figure 21) from the upper end of the support column 85. At this time, as shown in Figure 20, the processing light EL is scanned so that the direction of the fabrication path is constant (-Y axis direction) with each stack. In Figure 20, the solid arrows represent the trajectory of the fabrication path (irradiation trajectory of the processing light EL) when fabrication is performed, and the dotted arrows represent the irradiation trajectory that would be drawn by the processing light EL if it were irradiated, even though the processing light EL is not actually irradiated, and are shown as the movement of the irradiation optical system 41 (see Figure 6), representing the so-called fabrication path (toolpath). Next, the fabrication system SYS fabricates the lower region of the second part 84 (for example, the region corresponding to (2) in Figure 21). At this time, as shown in Figure 20, the processing light EL is scanned so that the direction of the fabrication path is constant (+Y axis direction) for each layer. Note that the direction of the fabrication path may be opposite to that of the first part 83 and the second part 84. Next, the fabrication system SYS returns to the first part 83 and fabricates the continuation of the first part 83 (for example, the region corresponding to (3) in Figure 21). Then, after the first part 83 has been formed to a predetermined height, it moves again to form the continuation of the second part 84 (for example, the area corresponding to (4) in Figure 21). By repeating the formation of the first part 83 and the second part 84 at predetermined height intervals, the main body of the ring-shaped object ST12 is formed. When the first and second part formation processes are completed, a small gap (for example, about 0.1 to 0.5 mm) is provided between the upper end of the first part 83 and the upper end of the second part 84 (see Figure 22).

[0132] Finally, in the connection part formation step, the upper end of the first part 83 and the upper end of the second part 84 are connected by forming a connection part 80 in the gap between the upper end of the first part 83 and the upper end of the second part 84. With the formation of the connection part 80, the molding of the ring-shaped object ST12 is completed. As shown by the arrow in Figure 22, in the connection part formation step of this modified example, the connection part 80 is formed by arranging multiple layers extending along the adjacent direction of the first part 83 and the second part 84 (the circumferential direction of the ring, which is along the X-axis direction) along a direction perpendicular to the adjacent direction (the Y-axis direction). More specifically, the processing system SYS molds the first part 83 and the second part 84 in a zigzag pattern as it moves from one end to the other in the width direction of the ring-shaped object ST12. This forms the connection part 80 that connects the first part 83 and the second part 84. Furthermore, this connection part formation step may include a melting step in which processing light EL is irradiated onto at least one of the adjacent molded parts (first part 83 and second part 84) to melt it. That is, by alternately molding the first part 83 and the second part 84, the connection part 80 can be formed while both the first part 83 and the second part 84 have a large amount of heat input.

[0133] According to this modified example, the molding process involves a first partial molding step, a second partial molding step, and a connection part formation step, allowing for a suitable connection between molded objects having an overhang shape (first part 83 and second part 84). This enables the creation of a ring-shaped molded object ST12. In this modified example, a gap is created between the first part 83 and the second part 84, and the connection part 80 is formed by molding through this gap. This allows for a uniform heat input to the first part 83 and the second part 84 when forming the connection part 80, thus ensuring a more reliable connection between the first part 83 and the second part 84. In this modified example, as with the first modified example described above, the molding process may be performed without supplying powder M in the connection part formation step, and only irradiation with processing light EL may be performed. In this case, since no buildup occurs near the connection part due to the formation of the connection part 80, the first part 83 and the second part 84 can be smoothly connected. This improves the appearance quality of the molded object.

[0134] (4-3) Third Modification Next, a method for fabricating a hollow L-shaped block-shaped object ST15 as a molded object having an overhang shape will be described. In the third modification, the hollow L-shaped block-shaped object ST15 is fabricated using a different fabrication method than the hollow L-shaped block-shaped object ST6 in the above-described embodiment. Figure 23 is a perspective view showing the hollow L-shaped block-shaped object ST15 formed by the fabrication method of the third modification. Figure 24 is a schematic diagram showing a method for fabricating the hollow L-shaped block-shaped object ST15 by oblique scanning. As shown in Figures 23 and 24, in this embodiment, the processing system SYS is capable of fabricating the hollow L-shaped block-shaped object ST15. The shape of the hollow L-shaped block-shaped object ST15 is equivalent to the hollow L-shaped block-shaped object ST6 (see Figure 15) in the above-described embodiment, so a detailed explanation will be omitted below. The hollow L-shaped block-shaped molded object ST15 consists of three parts: a first part 91, a second part 92, and a third part 93 (the inclined layer of the claim), each formed by a different molding method. The first part 91 is formed in the shape of a box with an open top. The second part 92 is provided above the first part 91. The second part 92 has a pair of triangular side walls in a front view that intersect with the X-axis direction and a rectangular side wall in a front view that intersects with the Y-axis direction, and is formed in the shape of a U when viewed from the Z-axis direction. The third part 93 is formed in the shape of a rectangular frame extending in the Y-axis direction from the opening of the second part 92. The third part 93 has a pair of parallelogram-shaped side walls in a front view that intersect with the X-axis direction and a pair of rectangular side walls in a front view that intersect with the Z-axis direction. Note that the dotted lines in Figure 23 and the thick lines in Figure 24 are for illustrative purposes, separating parts 91, 92, and 93 to illustrate the differences in the molding method. In the actual molded object ST15, the connections between these parts 91, 92, and 93 are smoothly joined.

[0135] The processing system SYS fabricates a hollow L-shaped block object ST15 using a scannable processing light EL and a powder M whose supply position can be changed. In the fabrication method for the hollow L-shaped block object ST15, each part 91, 92, and 93 is formed (fabricated) in the following procedure. First, the first part 91 is fabricated on the workpiece W. The first part 91 is formed by stacking rectangular frame-shaped line formation paths 11-91 parallel to the horizontal direction upward from the workpiece W in the Z-axis direction (direction perpendicular to the workpiece W). Next, the second part 92 is formed by stacking U-shaped line formation paths 11-92 parallel to the horizontal direction upward from the upper end of the first part 91 in the Z-axis direction. The line formation paths 11-92 that form the second part 92 are formed such that the length in the Y-axis direction becomes shorter as they move upward in the Z-axis direction. As a result, when all line formation paths 11-92 have been formed, the upper surface of the second portion 92 becomes a surface inclined at a predetermined angle β (β = 45° in this embodiment) with respect to the horizontal direction. Finally, the third portion 93 is formed by stacking rectangular line formation paths 11-93 parallel to the inclined upper surface of the second portion 92 along the -Y axis. The multiple line formation paths 11-93 have a uniform inclination angle throughout. As a result, the processing system SYS fabricates a hollow L-shaped block-shaped object ST15 without providing a support member below the third portion 93 which overhangs the first portion 91. The object ST15 may be fabricated above the stage 31 (see Figure 1) in the vertical direction. At this time, the direction in which the line formation paths 11-93 of the third portion 93 extend may be inclined by an angle β with respect to a surface parallel to the stage 31.

[0136] Furthermore, the SYS processing system may have different printing conditions for the first part 91, the second part 92, and the third part 93. For example, if D11 is the spacing along the Z-axis between adjacent line formation paths 11-91 that are stacked when the first part 91 is built, D12 is the spacing along the Z-axis between adjacent line formation paths 11-92 that are stacked when the second part 92 is built, and D13 is the spacing along the alignment direction between adjacent line formation paths 11-93 that are stacked when the third part 93 is built, then D1, D2, and D3 may be different values. Alternatively, D11 = D12 and D12 < D13. The printing speeds for each part 91, 92, and 93 may also be different. Alternatively, the printing speed when creating the part corresponding to the third part 93 may be set to be slower than the printing speed when creating the parts corresponding to the first part 91 and the second part 92.

[0137] According to the fabrication method of this modified example, a molded object ST15 having an overhang shape can be fabricated without providing support members or the like below the overhang portion. In the above embodiment, a configuration was described in which only the third portion 93 of the hollow L-shaped molded object ST15 has line formation paths 11-93 that are inclined with respect to the horizontal direction, but the invention is not limited to this. For example, the entire molded object ST15 may be formed by line formation paths 11 (not shown) that are inclined by β with respect to the horizontal direction. Alternatively, the first portion 91 may be formed by stacking layers parallel to the horizontal direction (i.e., β=0), and the second portion 92 may be formed by stacking line formation paths 11 that are inclined by an angle β' (≠0). In this case, β = β' or β ≠ β' may be true. Furthermore, multiple types of line formation paths 11 with different inclination angle values ​​β may be used in combination.

[0138] Furthermore, the above-described molding method and molding path generation method can be a program included in or executed within the machining system SYS. In other words, the configuration of the machining system SYS in this embodiment can be rephrased as follows. In other words, the program is stored in the storage device 72 and executed by the arithmetic unit 71 to control a light source 40 that irradiates scanning processing light EL and a material supply device 61 (powder supply device) capable of supplying powder M to desired positions, based on a molding path 10 used when molding a molded object ST. The molding path 10 has a first surface forming path 12 formed by arranging line forming paths 11 for molding linearly with powder M in a three-dimensional space including a reference plane, based on molded object model information relating to the molded object ST, and a second surface forming path 12 formed by arranging line forming paths 11 for molding linearly with powder M. The program generates control information for at least one of the light source 40 and the material supply device 61 according to a molding path in which the distance between adjacent line forming paths 11 differs between the first surface forming path 12 and the second surface forming path 12 in a direction perpendicular to the reference plane.

[0139] In the program described above, the direction perpendicular to the reference plane may be the direction corresponding to the vertical direction in three-dimensional space.

[0140] Furthermore, in the program described above, the first face may be a face extending in a direction corresponding to the vertical direction of three-dimensional space, and the second face may be a face extending in a direction corresponding to the horizontal direction of three-dimensional space.

[0141] Furthermore, in the program described above, the second face may be a face that extends vertically downwards from one end connected to the first face to the other end.

[0142] Furthermore, in the program described above, the first and second surfaces are each different parts of a single curved surface, and the directions in which the tangents to the first surface and the tangents to the second surface extend may intersect each other.

[0143] Furthermore, in the program described above, the distance between adjacent line-forming paths on the second surface may be set to a smaller value than the distance between adjacent line-forming paths on the first surface.

[0144] Furthermore, in the program described above, the line formation path 11 may indicate a path through which the focal position of the processing light EL moves.

[0145] Furthermore, the program described above may further include obtaining temperature information of the molded object ST, and based on the temperature information, it may change at least one of the distance between adjacent line formation paths on the first surface and the distance between adjacent line formation paths on the second surface.

[0146] Furthermore, in the program described above, if the temperature obtained based on the temperature information is lower than a threshold, the distance between adjacent line-forming paths may be set to a smaller value compared to the case where the temperature is above the threshold.

[0147] Alternatively, it can be rephrased as follows: The program is stored in the memory device 72 and executed by the arithmetic unit 71 to control a light source 40 that irradiates scanning processing light EL and a material supply device 61 that can supply powder M to a desired position, and executes: a first control that controls the light source 40 and the material supply device 61 in order to form a first part by stacking layers formed by the processing light EL and the powder M; a second control that controls the material supply device 61 in order to irradiate a second part separated from the first part of the workpiece with processing light EL and melt it; and a third control that controls the light source 40 and the material supply device 61 in order to form a connection part that connects the first part and the second part.

[0148] In the program described above, the third control may be a control that alternately and repeatedly creates layers extending from the first part to the second part and layers extending from the second part to the first part.

[0149] Furthermore, in the program described above, the third control may be a control that arranges multiple layers extending along the adjacent direction between the first and second parts in a direction perpendicular to the adjacent direction.

[0150] Furthermore, in the program described above, a fourth control may be performed to control the light source 40 and the material supply device 61, thereby stacking layers formed by the processing light EL and powder M to form the second part.

[0151] Alternatively, it can be rephrased as follows: The program is stored in the memory device 72 and executed by the arithmetic unit 71 to control a light source 40 that emits scanning processing light EL and a material supply device 61 that can supply powder M to desired positions, thereby creating a molded object ST by stacking layers formed by the processing light EL and powder M. The program generates control information to control at least one of the light source 40 and the material supply device 61 so that multiple layers are formed along directions in which the angle with the vertical is acute, thereby forming vertically extending surfaces on the molded object ST.

[0152] In the program described above, the program is for creating a molded object ST above the stage 31 in the vertical direction, and the vertically extending surface of the molded object ST may have a portion that is separated from the stage 31 in the vertical direction through space.

[0153] (4-4) Other Modifications In the above description, the processing unit 2 changes the emission direction of the processing light EL using galvanometer mirrors 46#1 and 46#2. However, the processing unit 2 may change the emission direction of the processing light EL using an optical system (optical component) different from that of the galvanometer mirrors 46#1 and 46#2. For example, the processing unit 2 may change the emission direction of the processing light EL using at least one of a polygon mirror and a resonant mirror. For example, the processing unit 2 may change the emission direction of the processing light EL using a resonant scanner that causes a mirror supported from both ends by a pair of torsion bars to vibrate resonantly. For example, the processing unit 2 may change the emission direction of the processing light EL using an acoustic optical deflector (AOD).

[0154] In the above description, the processing unit 2 is equipped with multiple galvanometer mirrors (galvanometer mirrors 46#1 and 46#2) to change the emission direction of multiple processing light ELs. However, the processing unit 2 may also have multiple processing light ELs incident on a single galvanometer mirror, thereby changing the emission direction of multiple processing light ELs collectively.

[0155] In the above description, the processing unit 2 irradiates the workpiece W with multiple processing lights EL (processing lights EL#1 and EL#2). However, the processing unit 2 may irradiate the workpiece W with a single processing light EL. In this case, the irradiation device 21 of the processing unit 2 may be equipped with a single galvanometer mirror (for example, a set of one X-scanning mirror and one Y-scanning mirror) to change the emission direction of the single processing light EL (and consequently change the irradiation position of the single processing light EL). In other words, the irradiation device 21 of the processing unit 2 may not be equipped with a second optical system 41#2. Alternatively, the irradiation device 21 of the processing unit 2 may not be equipped with a focusing optical system 50, or a prism mirror 51 of the focusing optical system 50, and the second optical system 41#2. In this case, the processing light EL#1 of the first optical system 41#1 is incident on the fθ lens 52 of the focusing optical system 50, or on the molding surface MS. The irradiation optical system 41 of the processing unit 2 may include either one X-scanning mirror and one Y-scanning mirror to change the emission direction of a single processing light EL, but may not include the other of the two.

[0156] In the above description, the control unit 7 controls at least one of the galvanometer mirrors 46#1 and 46#2 so that the irradiation area EA moves within the processing unit area PUA set on the build surface MS, and controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the processing unit area PUA moves on the build surface MS, thereby creating an object on the build surface MS that extends along the direction of movement of the processing unit area PUA on the build surface MS. However, the control unit 7 may also control the processing unit 2 so that an object having a desired shape pattern is created within the processing unit area PUA.

[0157] In the above description, the processing unit 2 melts the molding material M by irradiating it with processing light EL. However, the processing unit 2 may also melt the molding material M by irradiating it with any energy beam. Examples of any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of a charged particle beam include at least one of an electron beam and an ion beam.

[0158] In the above description, the processing system SYS performs additive processing. However, the processing system SYS may perform removal processing in addition to or instead of additive processing. Removal processing may include processing to remove a portion of the workpiece W by irradiating it with processing light EL. For example, the processing system SYS may perform additive processing on the workpiece W using at least one of processing light EL#1 and EL#2, and then perform removal processing on the workpiece W that has been processed with additive processing using at least one of processing light EL#1 and EL#2. As another example, the processing system SYS may perform additive processing on a first portion of the workpiece W using either processing light EL#1 or EL#2, while simultaneously performing removal processing on a second portion of the workpiece W that is different from the first portion using either processing light EL#1 or EL#2. In other words, the processing system SYS may perform additive processing and removal processing simultaneously. If the processing system SYS does not need to perform additive processing and removal processing simultaneously, the processing system SYS may perform both additive processing and removal processing using the same processing light EL.

[0159] The processing system SYS may perform a remelt process in addition to at least one of additive processing and removal processing. Remelt processing may include a process to melt the surface of the workpiece W once and reduce the flatness of the surface of the workpiece W (reduce surface roughness, make the surface closer to flat). As an example, the processing system SYS may perform at least one of additive processing and removal processing on the workpiece W using at least one of processing lights EL#1 and EL#2, and then perform a remelt process on the workpiece W (or the object formed on the workpiece W by the additive processing) using at least one of processing lights EL#1 and EL#2. As another example, the processing system SYS may perform at least one of additive processing and removal processing on a first part of the workpiece W using either processing light EL#1 or EL#2, while performing a remelt process on a second part of the workpiece W that is different from the first part using either processing light EL#1 or EL#2. In other words, the processing system SYS may perform at least one of the additive processing and removal processing and the remelt processing simultaneously. If the processing system SYS does not need to perform at least one of the additive processing and removal processing and the remelt processing simultaneously, the processing system SYS may perform at least one of the additive processing and removal processing and the remelt processing using the same processing light EL.

[0160] The processing unit 2 (processing head 22) described above may be attached to a robot (typically an articulated robot). If the processing head 22 is moved by a robot, the head drive mechanism 23 may be a robot. For example, the processing unit 2 (processing head 22) may be attached to a welding robot for welding. For example, the processing unit 2 (processing head 22) may be attached to a self-propelled mobile robot. A self-propelled mobile robot may include, for example, a self-propelled device such as an AGV (Automatic Guided Vehicle) or AMR (Autonomous Mobile Robot) and a robot arm provided on the self-propelled device.

[0161] At least some of the constituent elements of each embodiment and each modification described above can be appropriately combined with at least some other constituent elements of each embodiment and each modification described above. Some of the constituent elements of each embodiment and each modification described above may not be used. Furthermore, to the extent permitted by law, all of the published patents and U.S. patent disclosures cited in each embodiment and each modification described above shall be incorporated into the text.

[0162] The present invention is not limited to the embodiments described above, and can be modified as appropriate without contradicting the gist or idea of ​​the invention as can be read from the claims and specification as a whole. Processing systems, control devices, control methods, computer programs, and recording media that involve such modifications are also included in the technical scope of the present invention.

[0163] Regarding the embodiments described above, the following additional notes are disclosed. [Addendum 1] A method for fabricating an object using scannable processing light and powder whose supply position can be changed, comprising the step of generating a fabrication path used when fabricating the object, wherein the fabrication path has a first surface forming path formed by arranging line forming paths for fabricating linearly with the powder in a three-dimensional space including a reference plane, based on the fabrication model information relating to the object, and a second surface forming path formed by arranging line forming paths for fabricating linearly with the powder, wherein the step of generating the fabrication path generates the fabrication path such that the distance between adjacent line forming paths differs between the first surface forming path and the second surface forming path in a direction perpendicular to the reference plane. [Addendum 2] The fabrication method according to Addendum 1, wherein the direction perpendicular to the reference plane corresponds to the vertical direction of the three-dimensional space. [Note 3] The first surface is a surface extending in a direction corresponding to the vertical direction of the three-dimensional space, and the second surface is a surface extending in a direction corresponding to the horizontal direction of the three-dimensional space, as described in Note 1 or Note 2. [Note 4] The second surface is a surface that extends downward in the vertical direction from one end connected to the first surface to the other end, as described in any one of Notes 1 to 3. [Note 5] The first surface and the second surface are each different parts of a single curved surface, and the directions in which the tangents of the first surface and the tangents of the second surface extend intersect each other, as described in Note 1 or Note 2. [Note 6] The distance between adjacent line-forming paths on the second surface is made smaller than the distance between adjacent line-forming paths on the first surface, as described in any one of Notes 1 to 5. [Note 7] The molding method according to any one of Notes 1 to 6, wherein the line formation path indicates the path along which the focal position of the processing light moves. [Note 8] The molding method according to any one of Notes 1 to 7, wherein at least one of the distance between adjacent line formation paths on the first surface and the distance between adjacent line formation paths on the second surface is changed based on the temperature information of the molded object during the molding process.[Note 9] The molding method according to Note 8, wherein if the temperature obtained based on the temperature information is lower than a threshold, the distance between adjacent line formation paths is reduced compared to the case where the temperature is equal to or greater than the threshold.

[0164] SYS Machining System 2 Machining Unit 3 Stage Unit 4 Irradiation Unit 6 Material Supply Unit 7 Control Unit 10 Build Path 11 Line Forming Path 12 Surface Forming Path 14, 17, 24, 29, 81 First Surface 15, 18, 25, 33, 82 Second Surface 20 Head Unit 21 Irradiation Device 22 Machining Head 30 Light Source Unit 31 Stage 70, 80 Connection Unit 71 Calculation Unit 72 Memory Unit 77, 83 First Part 78, 84 Second Part 93 Third Part (Inclined Layer) D1, D2, D3, D4, D5, D6, D7, D8, D11, D12 Path Spacing (Distance between Line Forming Paths) ST, ST1, ST2, ST3, ST4, ST5, ST6, ST11, ST12, ST15 3D structure (modeled object) W Work M Modeling material (powder) MS Modeling surface EL Processing light

Claims

1. A method for generating a build path used when building a molded object, using scannable processing light and powder whose supply position can be changed, wherein the build path comprises a first surface forming path formed by arranging line forming paths for linearly building with the powder in a three-dimensional space including a reference plane, based on molded object model information relating to the molded object, and a second surface forming path formed by arranging line forming paths for linearly building with the powder, wherein the build path is generated such that the distance between adjacent line forming paths differs between the first surface forming path and the second surface forming path in a direction perpendicular to the reference plane.

2. The generation method according to claim 1, wherein the direction perpendicular to the reference plane corresponds to the vertical direction of the three-dimensional space.

3. The generation method according to claim 1 or claim 2, wherein the first surface is a surface extending in a direction corresponding to the vertical direction of the three-dimensional space, and the second surface is a surface extending in a direction corresponding to the horizontal direction of the three-dimensional space.

4. The generation method according to claim 1 or claim 2, wherein the second surface is a surface that extends vertically downward from one end connected to the first surface to the other end.

5. The generation method according to claim 1 or claim 2, wherein the first surface and the second surface are each different parts of a single curved surface, and the directions in which the tangents of the first surface and the tangents of the second surface extend intersect each other.

6. The generation method according to any one of claims 1 to 5, wherein the distance between adjacent line-forming paths on the second surface is made smaller than the distance between adjacent line-forming paths on the first surface.

7. The generation method according to any one of claims 1 to 6, wherein the line formation path indicates a path through which the focal position of the processing light moves.

8. The manufacturing method according to any one of claims 1 to 7, wherein at least one of the distance between adjacent line formation paths on the first surface and the distance between adjacent line formation paths on the second surface is changed based on the temperature information of the manufactured object during the manufacturing process.

9. The generation method according to claim 8, wherein, when the temperature obtained based on the temperature information is lower than a threshold, the distance between adjacent line-forming paths is reduced compared to when the temperature is equal to or greater than the threshold.

10. A molding method comprising: a first step of forming a first portion with a layer formed by scanning processing light and powder whose supply position can be changed; a second step of irradiating a second portion of the workpiece, separated from the first portion, with the processing light and melting it; and a third step of melting the supplied powder using the processing light to form a connecting portion that connects the first portion and the second portion.

11. The molding method according to claim 10, wherein in the third step, the molding of a layer extending from the first part to the second part and a layer extending from the second part to the first part are alternately repeated to form the connecting part.

12. The molding method according to claim 10 or claim 11, wherein in the third step, a plurality of layers extending along the adjacent direction between the first portion and the second portion are arranged along a direction perpendicular to the adjacent direction.

13. A molding method according to any one of claims 10 to 12, further comprising a fourth step of forming the second portion by stacking layers formed by the processing light and the powder supplied in response to scanning of the processing light.

14. A molding method according to any one of claims 10 to 13, wherein in the first and second steps a circular arc-shaped surface is formed, and in the third step the connecting portion is formed between the circular arc-shaped first portion and the circular arc-shaped second portion to form an annular molded object.

15. A molding method for forming an object using scannable processing light and powder whose supply position can be changed, wherein a surface extending along the vertical direction of the object is formed by forming a plurality of inclined layers extending along a direction in which the angle with the vertical direction is acute.

16. The molding method according to claim 15, wherein the molded object is formed above the stage in the vertical direction.

17. The molding method according to claim 16, wherein the direction in which the inclined layer extends is inclined with respect to a plane parallel to the stage.

18. The molding method according to claim 16 or claim 17, wherein the vertically extending surface of the molded object has a portion that is separated from the stage in the vertical direction through space.

19. The molding method according to any one of claims 16 to 18, wherein the stage extends along the horizontal direction.

20. A program stored in a memory device and executed by a computing device to control a light source that emits scanning processing light and a powder supply device capable of supplying powder to a desired position, based on a build path used when building a molded object, wherein the build path comprises a first surface forming path formed by arranging line forming paths for linearly building with the powder in a three-dimensional space including a reference plane, based on molded object model information relating to the molded object, and a second surface forming path formed by arranging line forming paths for linearly building with the powder, and generates control information for at least one of the light source and the powder supply device according to the build path in which the distance between adjacent line forming paths in a direction perpendicular to the reference plane is different between the first surface forming path and the second surface forming path.

21. The program according to claim 20, wherein the direction perpendicular to the reference plane corresponds to the vertical direction of the three-dimensional space.

22. The program according to claim 20 or claim 21, wherein the first surface is a surface extending in a direction corresponding to the vertical direction of the three-dimensional space, and the second surface is a surface extending in a direction corresponding to the horizontal direction of the three-dimensional space.

23. The program according to claim 20 or claim 21, wherein the second surface is a surface that extends vertically downward from one end connected to the first surface to the other end.

24. The program according to claim 20 or 21, wherein the first surface and the second surface are each different parts of a single curved surface, and the directions in which the tangents of the first surface and the tangents of the second surface extend intersect each other.

25. The program according to any one of claims 20 to 24, wherein the distance between adjacent line-forming paths on the second surface is made smaller than the distance between adjacent line-forming paths on the first surface.

26. The program according to any one of claims 20 to 25, wherein the line formation path indicates a path along which the focal position of the processed light moves.

27. The program according to any one of claims 20 to 26, further comprising obtaining temperature information of the molded object, and changing at least one of the distance between adjacent line formation paths on the first surface and the distance between adjacent line formation paths on the second surface based on the temperature information.

28. The program according to claim 27, wherein, if the temperature obtained based on the temperature information is lower than a threshold, the distance between adjacent line-forming paths is made smaller compared to the case where the temperature is equal to or greater than the threshold.

29. A program stored in a memory device and executed by a computing device to control a light source that emits scanning processing light and a powder supply device capable of supplying powder to a desired position, the program executing: a first control that controls the light source and the powder supply device in order to form a first portion by stacking layers formed by the processing light and the powder; a second control that controls the powder supply device in order to irradiate a second portion of a workpiece separated from the first portion with the processing light and melt it; and a third control that controls the light source and the powder supply device in order to form a connection portion connecting the first portion and the second portion.

30. The program according to claim 29, wherein the third control is a control that causes the fabrication of a layer extending from the first part to the second part and a layer extending from the second part to the first part to be repeated alternately.

31. The program according to claim 29 or 30, wherein the third control is a control that arranges a plurality of layers extending along the adjacent direction between the first part and the second part along a direction perpendicular to the adjacent direction.

32. The program according to any one of claims 29 to 31, further comprising controlling the light source and the powder supply device to perform a fourth control that forms the second portion by stacking layers formed by the processing light and the powder.

33. A program stored in a memory device and executed by a computing device, which controls a light source that emits scanning processing light and a powder supply device capable of supplying powder to desired positions, and creates a molded object by stacking layers formed by the processing light and the powder, wherein the program generates control information to control at least one of the light source and the powder supply device so that a plurality of the layers are formed along a direction in which the angle with the vertical is acute, thereby forming a vertically extending surface of the molded object.

34. A program for creating the object above the vertical direction of a stage, wherein the vertically extending surface of the object has a portion that is separated from the stage in the vertical direction through space, according to claim 33.

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