Substrate processing system and conveyance method

Abstract

A substrate processing system according to the present invention comprises: a processing module; a vacuum conveyance module; a load lock module; a sensor that detects a member in a conveyance path for conveying the member by a conveyance unit; and a control unit. When the control unit controls the conveyance unit to convey the member from the load lock module to a position in the vacuum conveyance module that corresponds to an opening of the load lock module, the sensor detects the member and the control unit calculates an amount of positional deviation of the member on the basis of detection information from the sensor.

Description

Substrate Processing System and Transfer Method

[0001] The present disclosure relates to a substrate processing system and a transfer method.

[0002] Patent Document 1 discloses a substrate processing system in which a member (focus ring) is transferred to a process module by a transfer robot of a vacuum transfer module. In this type of substrate processing system, when the transfer robot carries a member into the process module, a sensor (position detection sensor) provided near the process module detects the substrate held by the transfer robot, and calculates the position of the substrate based on the detection information. Then, the substrate processing system corrects the transfer of the substrate by the transfer robot based on the calculated position of the substrate, and places the member on the mounting table of the process module.

[0003] Japanese Patent Application Laid-Open No. 2018-10992

[0004] The present disclosure provides a technique capable of improving the transfer accuracy of a member.

[0005] According to one aspect of the present disclosure, there is provided a substrate processing system including a process module, a vacuum transfer module connected to the process module and having a transfer unit for transferring a member to the process module, a load lock module connected to the vacuum transfer module and capable of switching between an air atmosphere and a vacuum atmosphere, a sensor for detecting the member in a transfer path for transferring the member by the transfer unit, and a control unit. The control unit controls the transfer unit to detect the member by the sensor when transferring the member from the load lock module to a position corresponding to an opening of the load lock module in the vacuum transfer module, and calculates a misalignment amount of the member based on detection information of the sensor.

[0006] According to one aspect, the transfer accuracy of the member can be improved.

[0007] This is a schematic plan view showing the overall configuration of the substrate processing system. This is an enlarged plan view explaining the principle of detecting the substrate by the load lock module side sensor. This is a flowchart of the transport method according to the first embodiment. Figure 4(A) is the first explanatory diagram showing the transport operation of the substrate by the transport robot. Figure 4(B) is the second explanatory diagram showing the transport operation of the substrate by the transport robot. Figure 5(A) is the third explanatory diagram showing the transport operation of the substrate by the transport robot. Figure 5(B) is the fourth explanatory diagram showing the transport operation of the substrate by the transport robot. This is an enlarged plan view explaining the principle of detecting the ring by the load lock module side sensor. This is a flowchart of the transport method according to a modified example. Figure 8(A) is the first explanatory diagram showing the transport operation of the substrate according to the modified example. Figure 8(B) is the second explanatory diagram showing the transport operation of the substrate according to the modified example. This is the third explanatory diagram showing the transport operation of the substrate W according to the modified example. This is a flowchart of the transport method according to the second embodiment. Figure 11(A) is the first explanatory diagram showing the transport operation of the substrate according to the second embodiment. Figure 11(B) is the second explanatory diagram showing the transport operation of the substrate according to the second embodiment. This is a schematic cross-sectional view showing a transport unit according to a modified example. This is a schematic perspective view showing the transport unit of Figure 12.

[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] Figure 1 is a schematic plan view showing the overall configuration of the substrate processing system 1. As shown in Figure 1, the substrate processing system 1 is a multi-chamber type semiconductor manufacturing apparatus equipped with a plurality of process modules 10. Each process module 10 performs substrate processing such as film deposition, etching, and cleaning on a substrate W, which is an example of a material. In addition to each process module 10, the substrate processing system 1 also includes a vacuum transport module 20, a plurality of load lock modules 30, an atmospheric transport module 40, a load port 50, and a control device (control unit) 90.

[0010] Each process module 10 performs substrate processing on the substrate W after it is fed in from the vacuum transport module 20. The multiple process modules 10 of the substrate processing system 1 may perform the same processing on each other, or some or all of them may perform different processing. Furthermore, the substrate processing system 1 may be configured to perform plasma processing in some or all of its process modules 10.

[0011] Specifically, each process module 10 includes a process chamber 11 for housing a substrate W, and a mounting table 12 for placing the substrate W inside the process chamber 11. The mounting table 12 is equipped with a lifter (e.g., multiple pins) (not shown) for raising and lowering the substrate W, and cooperates with the transport robot 22 (described later) to receive and transfer the substrate W.

[0012] Furthermore, each process module 10 is equipped with a connecting portion 13 between the process chamber 11 and the vacuum transport module 20. The connecting portion 13 has a gate valve (not shown) inside that opens and closes the opening 11a of the process chamber 11. Each process module 10 can transport substrates W to the process chamber 11 via the connecting portion 13 by opening the gate valve, and can reduce the pressure inside the process chamber 11 to an appropriate vacuum atmosphere by closing the gate valve.

[0013] The vacuum transport module 20 includes a vacuum transport chamber 21 connected to each process module 10 and a plurality of load lock modules 30, and a transport unit that transports the substrate W within the vacuum transport chamber 21.

[0014] The transport unit according to this embodiment uses a transport robot 22 having a base 221 that is movable in the longitudinal direction of the vacuum transport chamber 21, a plurality of arms 222 that can pivot, extend and retract and move up and down relative to the base 221, and a fork (end effector) 223 provided on the end arm 222. The transport robot 22 transports the substrate W by supporting the substrate W on the upper surface of the fork 223 and appropriately operating the base 221 and each arm 222. The fork 223 may be equipped with holding means (suction, electrostatic adsorption, mechanical locking mechanism, etc.) for holding the substrate W. Although Figure 1 illustrates a transport robot 22 equipped with one fork 223, the transport robot 22 is not limited to this configuration and may be configured with a plurality (for example, two) of forks 223.

[0015] The transport robot 22, under the control of the control device 90, loads and unloads the substrate W between the target process module 10 and the vacuum transport module 20. The transport robot 22 also transports the substrate W between the target load lock module 30 and the vacuum transport module 20, under the control of the control device 90.

[0016] The two load lock modules 30 are located between the vacuum transport module 20 and the atmospheric transport module 40, and each provides a preliminary depressurization chamber 31 that can be switched between an atmospheric atmosphere and a vacuum atmosphere. The preliminary depressurization chamber 31 includes a substrate support section 32 inside. For example, the substrate support section 32 has a groove (not shown) into which the forks 223 of the transport robot 22 and the forks 423 of the transport robot 42 (described later) can enter, and the substrate W is received and transferred by the forward and backward movement and up and down movement of the forks 223 and 423. The substrate support section 32 may also be configured to include a lifter, similar to the mounting table 12 of the process module 10.

[0017] Each load lock module 30 is provided with a connection part 33 on the vacuum transport module 20 side and a connection part 35 on the atmospheric transport module 40 side. The connection parts 33 and 35 each have gate valves (not shown) inside that open and close the openings 31a and 31b of the preliminary depressurization chamber 31. Each load lock module 30 communicates with the vacuum transport module 20 by opening the gate valve of the connection part 33 in a vacuum atmosphere. Also, each load lock module 30 communicates with the atmospheric transport module 40 by opening the respective gate valves of the connection part 33 in an atmospheric atmosphere.

[0018] The atmospheric transport module 40 of the substrate processing system 1 maintains an atmospheric environment inside. The atmospheric transport module 40 includes an atmospheric transport chamber 41 connected to each load lock module 30 and a transport robot 42 that transports the substrates W within the atmospheric transport chamber 41. The atmospheric transport module 40 may also create a downflow of clean air inside the atmospheric transport chamber 41. The atmospheric transport module 40 is also equipped with an aligner 43 on its side for positioning the substrates W.

[0019] Furthermore, multiple load ports 50 are provided on the wall surface of the atmospheric transport module 40. A carrier C containing a substrate W or an empty carrier C is attached to each load port 50. For example, a FOUP (Front Opening Unified Pod) can be used as the carrier C. In addition, a carrier C containing a ring R (focus ring, edge ring, etc.), which is an example of a component, may be attached to each load port 50. The ring R is positioned around the substrate W on the mounting table 12 of the process module 10.

[0020] The transport robot 42, like the transport robot 22 of the vacuum transport module 20, has a base 421 that can move in the longitudinal direction of the atmospheric transport chamber 41, a plurality of arms 422 that can rotate, extend and retract, and move up and down relative to the base 421, and a fork (end effector) 423 provided on the end arm 422. The transport robot 42 supports the substrate W on the upper surface of the fork 423 and transports the substrate W by appropriately operating the base 421 and each arm 422. Although Figure 1 illustrates a transport robot 42 with one fork 423, the transport robot 42 is not limited to this configuration and may have a configuration with multiple (for example, two) forks 423.

[0021] The transport robot 42 transports the substrate W between each load lock module 30 and the atmospheric transport module 40 in accordance with the opening and closing of the gate valves of each connection part 35. The transport robot 42 also transports the substrate W between the aligner 43 and the atmospheric transport module 40. Furthermore, the transport robot 42 transports the substrate W between the carrier C attached to the load port 50 and the atmospheric transport module 40.

[0022] The control device 90 includes a control unit 91 and a user interface 92. The control unit 91 is a computer having a processor, memory, input / output interface, and communication interface (not shown). The processor is a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), and circuits consisting of multiple discrete semiconductors, and executes programs stored in memory. The memory includes a main memory device consisting of semiconductor memory, etc., and an auxiliary memory device consisting of disks and semiconductor memory (flash memory), etc.

[0023] For example, the control device 90 transports the unprocessed substrate W from the carrier C attached to the load port 50 to the aligner 43 using the transport robot 42 for position adjustment, and then transports the substrate W from the aligner 43 to one of the load lock modules 30. After depressurizing the load lock module 30 containing the substrate W, the control device 90 uses the transport robot 22 to remove the substrate W and transports it to one of the process modules 10 via the vacuum transport module 20. Subsequently, the control device 90 processes the substrate in each process module 10 into which the substrate W has been transported. After the substrate processing, the control device 90 transports the substrate W from one of the process modules 10 to the carrier C for containing the processed substrate W, in the reverse order of the above procedure.

[0024] The substrate processing system 1 described above includes a process module-side sensor 14 that detects the substrate W in order to recognize the position of the substrate W when transporting the substrate W between each process module 10 and the vacuum transport module 20. The process module-side sensor 14 is provided, for example, in the vacuum transport module 20 at a position adjacent to the opening 11a of each process module 10. The process module-side sensor 14 may be provided inside the connection part 13, or at a position adjacent to the opening 11a in the process module 10.

[0025] The process module side sensor 14 has two detectors 141 and 142. For example, each detector 141 and 142 includes a light-emitting unit that emits light for measurement and a light-receiving unit that receives the light from the light-emitting unit across the path through which the substrate W passes (neither shown). The presence of the substrate W is detected when the light for measurement is blocked based on the passage of the substrate W. The two detectors 141 and 142 are arranged perpendicular to the transport direction of the substrate W such that the distance between them is shorter than the diameter of the substrate W. The principle for calculating the position of the substrate W using the process module side sensor 14 is the same as that of the load lock module side sensor 34 of each load lock module 30 described later, and will be explained later.

[0026] Furthermore, the substrate processing system 1 includes a load lock module-side sensor 34 that detects the substrate W in order to recognize its position when transporting the substrate W between the vacuum transport module 20 and each load lock module 30. The load lock module-side sensor 34 is provided, for example, in the vacuum transport module 20 at a position adjacent to the opening 31a of each load lock module 30. The load lock module-side sensor 34 may be provided inside the connection portion 33, or at a position adjacent to the opening 31a in each load lock module 30 (see dotted line in Figure 2).

[0027] The load lock module side sensor 34, like the process module side sensor 14, has two detectors. The two detectors are positioned side by side perpendicular to the transport direction of the substrate W, such that the distance between them is less than the diameter of the substrate W.

[0028] Figure 2 is an enlarged plan view illustrating the principle of detecting the substrate W by the load lock module side sensor 34. As shown in Figure 2, when transporting the substrate W from the load lock module 30 to the vacuum transport chamber 21, the transport robot 22 moves the fork 223 supporting the substrate W in a straight line backward by the sliding motion of the end arm 222. In detail, the transport robot 22 moves the fork 223 in a straight line forward and backward between the receiving position PP where the substrate W is received or handed over in the load lock module 30, and the transport switching position CP where the transport direction of the substrate W is switched within the vacuum transport module 20.

[0029] The transport robot 22 moves the substrate W from the receiving position PP to the transport switching position CP, and then operates its base 221 and each arm 222 to move to another position within the vacuum transport module 20. For example, the transport robot 22 transports the substrate W to a position opposite the target process module 10. Within the vacuum transport chamber 21, the transport switching position CP is located orthogonal to the opening 31a of the load lock module 30 and adjacent to the load lock module side sensor 34. Furthermore, it is preferable that the transport switching position CP is set such that when a virtual straight line is drawn connecting the receiving position PP and the transport switching position CP, the virtual straight line passes between the pair of detectors of the load lock module side sensor 34. In other words, the transport switching position CP is the position corresponding to the opening 31a of the load lock module 30.

[0030] The load lock module side sensor 34, adjacent to the opening 31a of the load lock module 30, detects the presence or absence of the substrate W as it moves, using two detectors 341 and 342 positioned along the transport path of the substrate W. The control device 90 of the substrate processing system 1 recognizes the position (3D coordinates) of the forks 223 that directly hold the substrate W based on the movement of each arm 222 of the transport robot 22 during the transport of the substrate W by the transport robot 22. The control device 90 can detect the passage of the substrate W by detection information (a signal that switches between receiving (on) and not receiving (off) light for measurement) when the substrate W passes the load lock module side sensor 34. The two detectors 341 and 342 of the load lock module side sensor 34 detect the timing when they switch from on to off and the timing when they switch from off to on as the substrate W passes, respectively, thereby detecting two locations on the outer edge of the substrate W (see white stars in Figure 2). In other words, the load lock module side sensor 34, which has two detectors 341 and 342, can detect a total of four timings with respect to the outer edge of the substrate W.

[0031] The control device 90 calculates the positions of four points on the outer edge of the substrate W based on the position of the fork 223 recognized during operation, the position of each detector of the load lock module side sensor 34, and the timing at which detectors 341 and 342 detect the outer edge of the substrate W. Furthermore, the control device 90 can calculate the center position of the substrate W (see the black star in Figure 2) using the four calculated positions. Note that the load lock module side sensor 34 is not limited to two detectors, but may have three or more detectors. Also, the load lock module side sensor 34 is not limited to an optical sensor, but may be a camera sensor, for example. When a camera sensor is used, one camera sensor may be placed for the aperture 31a of the load lock module 30, or two or more camera sensors may be placed for the aperture 31a of the load lock module 30, similar to the optical sensor.

[0032] In the substrate processing system 1, the center position of the substrate W, which is a calculated measurement, may be misaligned with the center position of the fork 223 of the transport robot 22 (the theoretical center position for holding the substrate W). For example, when the transport robot 42 transports the substrate W to the load lock module 30, a misalignment of the substrate W may occur when the load lock module 30 is depressurized from an atmospheric environment to a vacuum environment. The misalignment of the substrate W relative to the fork 223 occurs when the transport robot 22 loads the substrate W into the process module 10 and places the substrate W on the mounting table 12. If the substrate W is placed on the mounting table 12 in a misaligned position, it may affect the substrate processing of the substrate W (e.g., uneven processing).

[0033] In particular, if the misalignment of the substrate W is large, even if the transport robot 22 is corrected using only the detection information (misalignment of the substrate W) from the process module side sensor 14 of the process module 10, it may not be possible to completely eliminate the misalignment of the substrate W. Therefore, in order to improve the transport accuracy of the substrate W, the substrate processing system 1 according to this embodiment is configured to calculate the misalignment of the substrate W using the load lock module side sensor 34 of the load lock module 30 and to perform appropriate processing according to this misalignment of the substrate W.

[0034] [First Embodiment] Next, the transport method according to the first embodiment will be described with reference to Figures 3 to 5. Figure 3 is a flowchart of the transport method according to the first embodiment. Figure 4(A) is a first explanatory diagram showing the transport operation of the substrate W by the transport robot 22. Figure 4(B) is a second explanatory diagram showing the transport operation of the substrate W by the transport robot 22. Figure 5(A) is a third explanatory diagram showing the transport operation of the substrate W by the transport robot 22. Figure 5(B) is a fourth explanatory diagram showing the transport operation of the substrate W by the transport robot 22.

[0035] The substrate processing system 1 performs steps S101 to S108 shown in Figure 3 as a transport method for transporting the substrate W to the process module 10 based on the control of the control device 90.

[0036] Specifically, the control device 90 operates the transport robot 42 to retrieve the unprocessed substrate W from the carrier C set in the load port 50 and transports the substrate W from the atmospheric transport module 40 to one of the load lock modules 30 (step S101). At this time, the control device 90 transports the substrate W retrieved from the carrier C by the transport robot 42 to the aligner 43, where the aligner 43 corrects the misalignment (eccentricity) of the substrate W and re-holds it in the transport robot 42. Then, the transport robot 42 transports the substrate W, with the misalignment corrected, to the load lock module 30. After the transport of the substrate W, the load lock module 30 reduces the pressure from an atmospheric atmosphere to a vacuum atmosphere.

[0037] Next, the control device 90 operates the transport robot 22 to transport the substrate W from the load lock module 30 to the vacuum transport module 20 (step S102). In the load lock module 30, the substrate W is transferred from the substrate support section 32 to the fork 223. Then, as shown in Figure 4(A), the transport robot 22 moves the fork 223 holding the substrate W in a straight line backward from the transfer position PP toward the transport switching position CP. As the fork 223 moves backward, the substrate W passes through the pair of detectors of the load lock module side sensor 34. When the transport robot 22 places the substrate W at the transport switching position CP, it stops moving temporarily.

[0038] During transport of the substrate W, the control device 90 continuously acquires the position of the fork 223 and detection information from the load lock module side sensor 34 to calculate the position of the outer edge of the substrate W, and further calculates the center position of the substrate W from the position of the outer edge (step S103). Furthermore, the control device 90 calculates the positional deviation of the calculated center position of the substrate W relative to the theoretical center position of the substrate W. The information on the positional deviation of the substrate W that is calculated includes the direction of the positional deviation relative to the theoretical center position of the substrate W and the amount of positional deviation (absolute value).

[0039] The control device 90 then compares the calculated displacement of the substrate W with a pre-established threshold value and determines whether the displacement of the substrate W is greater than or equal to the threshold value (step S104). This threshold value is set by conducting experiments or simulations in advance to a value that may reduce transport accuracy due to the displacement of the substrate W when the substrate W is placed on the process module 10. For example, the threshold value may be set to an appropriate value of 3 mm or more. If the displacement is greater than or equal to the threshold value (step S104: YES), it means that the substrate W is significantly misaligned with respect to the fork 223, and the process proceeds to step S105. Step S104 may also be performed while the transport robot 22 is moving the substrate W.

[0040] In step S105, the control device 90 corrects the position of the transport robot 22 based on the amount of displacement of the substrate W that has moved to the transport switching position CP, and then transports the substrate W back to the load lock module 30 (see Figure 4(B)). At this time, the transport robot 22 operates each arm 222 at the transport switching position CP to displace the position of the substrate W using a correction direction (opposite direction to the displacement direction) and a correction amount (amount of displacement) that cancels out the displacement of the substrate W. Then, the transport robot 22 moves the corrected substrate W at the transport switching position CP in a straight line by the correction distance toward the receiving position PP of the load lock module 30 and hands it over to the substrate support section 32. This allows the substrate W to be repositioned on the substrate support section 32 so that its center position aligns with the center position of the substrate support section 32. After that, the transport robot 22 temporarily moves backward to the transport switching position CP, returning the forks 223 to their theoretical positions.

[0041] Then, the control device 90 returns to step S102 and performs the process of transporting the substrate W from the load lock module 30 to the vacuum transport chamber 21 again. At this time, the transport robot 22 receives the substrate W, whose positional displacement has been sufficiently suppressed, from the substrate support portion 32 of the load lock module 30 onto the fork 223 and retracts from the load lock module 30 (see Figure 5(A)). Therefore, in step S103, the control device 90 detects the outer edge of the substrate W with the load lock module side sensor 34, and calculates the center position of the substrate W based on this detection information, thereby recognizing a substrate W with a small positional displacement relative to the theoretical center position of the substrate W.

[0042] Therefore, in step S104, the control device 90 compares the threshold value with the amount of misalignment of the substrate W and determines that the amount of misalignment is less than the threshold value. Alternatively, if the amount of misalignment becomes greater than or equal to the threshold value again (step S104: YES), the control device 90 proceeds to step S105 again to correct the position of the transport robot 22 and re-transport the substrate W to the load lock module 30, and repeats the same processing flow thereafter. If a large misalignment occurs in the substrate W even after repeating the flow of correcting the position of the substrate W, transporting it, and re-transporting it multiple times, there is a possibility that there is a problem on the vacuum transport module 20 side, including the load lock module side sensor 34. For this reason, the control device 90 may notify the user interface 92 of the problem after repeating the flow of correcting the position of the substrate W, transporting it, and re-transporting it a set number of times.

[0043] When the control device 90 determines that the amount of positional deviation is less than the threshold value (step S104: NO), it proceeds to step S106 and moves the substrate W at the transfer switching position CP to a position facing the target process module 10 (hereinafter referred to as the processing facing position OP). The processing facing position OP is located in the orthogonal direction of the opening 11a of the process module 10 and adjacent to the process module side sensor 14. Also, the processing facing position OP is set such that when a virtual straight line connecting the placement position of the placement table 12 of the process module 10 and the processing facing position OP is drawn, the virtual straight line passes through the middle of the pair of detectors 141 and 142 of the process module side sensor 14. In other words, the processing facing position OP is a position corresponding to the opening 11a of the process module 10.

[0044] Furthermore, the control device 90 controls the transfer robot 22 to move the substrate W toward the target process module 10, detects the substrate W by the process module side sensor 14, and calculates the center position of the substrate (step S107). The method of detecting the substrate W by the process module side sensor 14 is the same as the method of detecting the load lock module side sensor 34. Thereby, the control device 90 recognizes again the positional deviation of the actual center position of the substrate W with respect to the theoretical center position of the substrate W before placing the substrate W on the process module 10.

[0045] However, the positional deviation of the substrate W detected by the process module side sensor 14 is sufficiently small or zero due to the processing in the vicinity of the above-described load lock module 30. Therefore, as shown in FIG. 5(B), in the process of the transfer robot 22 loading the substrate W into the process module 10, the control device 90 may correct a small positional deviation of the substrate W or transfer the substrate W without correction.

[0046] The control device 90 calculates the correction direction and correction amount of the substrate W based on the detection information of the process module side sensor 14. Then, in step S108 shown in FIG. 3, the control device 90 corrects the movement of the transfer robot 22 in the process module 10 based on the calculated correction direction and correction amount, and places the substrate W on the placement table 12.

[0047] As a result, the substrate processing system 1 can significantly improve the transfer accuracy of the substrate W with respect to the process module 10. As a result, in the process module 10, it becomes possible to stably perform substrate processing on the substrate W.

[0048] As described above, in the substrate processing system 1 and the transfer method, the load lock module side sensor 34 is used to correct the positional deviation of the member, i.e., the substrate W. Thereby, the transfer accuracy of the substrate W is improved, and the substrate W can be accurately placed on the mounting table 12 of the process module 10. Further, the control device 90 can easily determine whether to return the substrate W to the load lock module 30 by comparing the amount of positional deviation of the substrate W with a threshold value held in advance, and can take appropriate measures. Therefore, when the positional deviation of the substrate W is small, the substrate W can be efficiently transferred to the process module 10.

[0049] Further, the control device 90 can quickly correct the substrate W by setting the correction amount of the substrate W based on the detection information when transferring the substrate W from the load lock module 30. Note that the substrate processing system 1 may set a correction amount for placing the substrate W on the load lock module 30 based on the detection information detected when transferring the substrate W from the vacuum transfer module 20 to the load lock module 30. Even in this case, the substrate W can be accurately placed on the substrate support portion 32 of the load lock module 30.

[0050] Then, when the amount of positional deviation of the substrate W is less than the threshold value, the substrate processing system 1 transfers the member to a position corresponding to the opening 11a of the process module 10 in the vacuum transfer module 20, and then transfers the substrate W to the process module 10. Thereby, the substrate W can be placed more accurately on the process module 10. Further, since the load lock module side sensor 34 is provided at a position adjacent to the opening 31a of the load lock module 30, the substrate W transferred from the load lock module 30 can be immediately detected. Note that the load lock module side sensor 34 may be provided inside the connection portion 33, thereby facilitating the maintenance of the sensor.

[0051] It should be noted that the substrate processing system 1 and the transport method are not limited to the above embodiment and can be modified in various ways. For example, in the above embodiment, the substrate W was described as the component transported by the transport robot 22, but this component is not limited to the substrate W. As an example, when the substrate processing system 1 transports a ring R, which is a component, to the process module 10 via the atmospheric transport module 40, the load lock module 30, and the vacuum transport module 20, the same transport method as above may be used. This makes it possible to improve the transport accuracy when placing the ring R on the process module 10.

[0052] Figure 6 is an enlarged plan view illustrating the principle of detecting the ring R by the load lock module side sensor 34. When transporting the ring R from the load lock module 30 to the vacuum transport chamber 21, the transport robot 22 also moves the fork 223 supporting the ring R in a straight line backward. In detail, the transport robot 22 moves the fork 223 in a straight line back and forth between the receiving position PP where the ring R is received or handed over in the load lock module 30, and the transport switching position CP within the vacuum transport module 20 where the transport direction of the ring R is switched. After moving the substrate W from the receiving position PP to the transport switching position CP, the transport robot 22 transports the ring R to the opposite position of the target process module 10.

[0053] Then, the load lock module side sensor 34 adjacent to the opening 31a of the load lock module 30 detects the presence or absence of the ring R as it moves, using two detectors 341 and 342 positioned in the transport path of the ring R. For example, the load lock module side sensor 34 detects the inner periphery of the ring R as it passes. In this case, one load lock module side sensor 34 can detect two locations on the inner periphery of the ring R by detecting the timing when it switches from off (blocked by the ring R) to on (light begins to pass across the inner periphery of the ring R) and the timing when it switches from on to off (light is blocked by the ring R again). In other words, the load lock module side sensor 34 having two detectors 341 and 342 can detect a total of four timings with respect to the inner periphery of the ring R.

[0054] Furthermore, the substrate processing system 1 is not limited to correcting the misalignment of the substrate W detected by the load lock module side sensor 34 of the load lock module 30 by returning it to the load lock module 30, but may also correct it during transport to the process module 10. The transport method according to this modified example will be described below with reference to Figures 7 to 9. Figure 7 is a flowchart of the transport method according to the modified example. Figure 8(A) is a first explanatory diagram showing the transport operation of the substrate W according to the modified example. Figure 8(B) is a second explanatory diagram showing the transport operation of the substrate W according to the modified example. Figure 9 is a third explanatory diagram showing the transport operation of the substrate W according to the modified example.

[0055] The substrate processing system 1 shown in Figure 1 can also be applied to the modified substrate processing method. The substrate processing system 1 performs steps S111 to S117 shown in Figure 7 based on the control of the control device 90. Steps S111 to S113 of the modified substrate processing method are the same as steps S101 to S103 of the above embodiment.

[0056] In other words, the control device 90 transports the substrate W to the load lock module 30, depressurizes the load lock module 30, and then the transport robot 22 transports the substrate W from the load lock module 30 to the vacuum transport module 20 (see Figure 8(A)). During the transport of the substrate W, the control device 90 calculates the displacement of the substrate W based on the detection information from the load lock module side sensor 34. Then, in the transport method according to the modified example, after step S113, the substrate W held by the fork 223 is transported to the process module 10 without comparing the amount of displacement of the substrate W with a threshold.

[0057] In step S114, the control device 90 moves the substrate W at the transport switching position CP to the processing opposing position OP that faces the target process module 10.

[0058] Then, at the processing opposite position OP, the control device 90 corrects the position of the transport robot 22 based on the information (direction of misalignment, amount of misalignment) of the substrate W calculated in step S113 (step S115). In other words, as shown in Figure 8(B), the substrate processing system 1 displaces the position of the substrate W relative to the process module 10 according to the misalignment of the substrate W based on the detection information of the load lock module side sensor 34, before the substrate W passes the process module side sensor 14 of the process module 10. For example, Figure 8(B) shows an example in which the fork 223 is corrected in the width direction perpendicular to the forward direction based on the misalignment of the substrate W. Note that the correction of the misalignment of the substrate W calculated in step S113 may be performed while transporting from the transport switching position CP to the processing opposite position OP.

[0059] Subsequently, the control device 90 controls the transport robot 22 to move the substrate toward the target process module 10, detects the substrate W using the process module side sensor 14, and calculates the center position of the substrate W (step S116). The detection of the substrate W using the process module side sensor 14 is the same as in the case of the load lock module side sensor 34. As a result, the control device 90 recognizes the misalignment of the substrate W again before placing the substrate W onto the process module 10.

[0060] However, the displacement of the substrate W detected by the process module side sensor 14 is sufficiently small or zero due to the displacement of the substrate W at the processing opposite position OP described above. Therefore, as shown in Figure 9, during the process in which the transport robot 22 loads the substrate W into the process module 10, the control device 90 only needs to correct the small displacement of the substrate W, or transport the substrate W without making any corrections.

[0061] Therefore, the control device 90 calculates the correction direction and correction amount for the substrate W based on the detection information from the process module side sensor 14. Then, in step S117 shown in Figure 7, the control device 90 corrects the movement of the transport robot 22 within the process module 10 based on the calculated correction direction and correction amount, and places the substrate W on the mounting table 12.

[0062] As described above, even with the modified transport method, the transport accuracy of the substrate W to the process module 10 can be sufficiently improved, and substrate processing of the substrate W can be performed stably. In particular, the modified transport method does not retransport the substrate W to the load lock module 30 even if the positional displacement of the substrate W detected by the load lock module side sensor 34 of the load lock module 30 is large, thus improving the transport efficiency of the substrate W.

[0063] The substrate processing system 1 can selectively perform either the transport method shown in Figure 3 or the transport method shown in Figure 7, depending on the substrate processing status. For example, the control device 90 may determine which of the transport methods shown in Figure 3 or Figure 7 to use depending on the substrate processing status of each process module 10. For example, if there is ample time for the transport robot 22 to transport the substrate W to the process module 10, the transport method shown in Figure 3 may be used, while if there is insufficient time for the transport robot 22 to transport the substrate W to the process module 10, the transport method shown in Figure 7 may be used. Alternatively, the control device 90 may determine which of the transport methods shown in Figure 3 or Figure 7 to use depending on the amount of misalignment of the substrate W. For example, if the calculated amount of misalignment of the substrate W is large, the transport method shown in Figure 3 may be used, while if the calculated amount of misalignment of the substrate W is small, the transport method shown in Figure 7 may be used.

[0064] Furthermore, in the modified transport method, the material transported by the transport robot 22 is not limited to the substrate W; for example, a ring R may be transported as the material.

[0065] [Second Embodiment] Next, a transport method according to the second embodiment will be described with reference to Figures 10 and 11. Figure 10 is a flowchart of the transport method according to the second embodiment. Figure 11(A) is a first explanatory diagram showing the transport operation of the substrate W according to the second embodiment. Figure 11(B) is a second explanatory diagram showing the transport operation of the substrate W according to the second embodiment.

[0066] The transport method according to the second embodiment is configured to detect misalignment of the substrate W when transporting the substrate W from the vacuum transport module 20 to the process module 10, and to unload and reload the substrate W if the amount of misalignment is large. The substrate processing system 1 shown in Figure 1 can also be applied to the transport method according to the second embodiment.

[0067] In the transport method shown in Figure 10, the substrate processing system 1 uses a transport robot 22 to move the substrate W from the load lock module 30 to the vacuum transport module 20, and then holds the substrate W in place on the fork 223. For example, the substrate W is located at the transport switching position CP of the vacuum transport module 20. In this state, the substrate processing system 1 performs steps S201 to S206 shown in Figure 10 based on the control of the control device 90.

[0068] First, the control device 90 operates the transport robot 22 to move the substrate W to the processing opposite position OP of the target process module 10 in the vacuum transport module 20 (step S201). As described above, the processing opposite position OP is set to be located perpendicular to the midpoint of the width direction of the opening 31a and adjacent to the process module side sensor 14. As shown in Figure 11(A), the fork 223 positioned at the processing opposite position OP can transfer the substrate W to the mounting table 12 by moving linearly under the operation of the transport robot 22.

[0069] Next, the control device 90 operates the transport robot 22 to move the substrate W toward the process module 10, detects the substrate W using the process module side sensor 14, and calculates the center position of the substrate W (step S202). The detection of the position of the substrate W using the process module side sensor 14 is the same as in the case of the load lock module side sensor 34. As a result, the control device 90 can recognize the positional deviation (direction of deviation, amount of deviation) of the current center position of the substrate W relative to the theoretical center position of the substrate W.

[0070] The control device 90 then calculates the correction direction and amount of the substrate W based on the recognized center position (position deviation) of the substrate W, corrects the movement of the transport robot 22 within the process module 10 based on the calculated correction direction and amount, and places the substrate W on the mounting table 12 (step S203). As a result, the substrate W, whose position has been corrected by the transport robot 22 within the process module 10, is placed on the mounting table 12.

[0071] However, if the current center position of the substrate W is significantly misaligned with the theoretical center position of the substrate W, it may not be possible to absorb (eliminate) this misalignment, and the substrate W may still be placed on the mounting table 12 in a misaligned state. For this reason, the control device 90 compares a pre-established threshold with the amount of misalignment of the substrate W calculated based on the detection information of the process module side sensor 14 (step S204). If the amount of misalignment is greater than or equal to the threshold, the control device 90 performs a process of temporarily removing the substrate W and then re-inserting it, as shown in Figure 11(B).

[0072] In detail, if the displacement of the substrate W is greater than or equal to a threshold (step S204: YES), the control device 90 proceeds to step S205. In step S205, the control device 90 operates the lifter of the mounting table 12 and the transport robot 22 to receive the substrate W again with the fork 223 and transport the substrate W. When the substrate W is transported, the control device 90 may again detect the position of the substrate W using the process module side sensor 14 and recognize the displacement of the substrate W. The transport robot 22 moves the substrate W backward to, for example, the processing opposite position OP of the vacuum transport module 20.

[0073] The substrate W, once removed from the process module 10, has reduced positional displacement due to the correction of the transport robot 22's position when it was initially loaded into the process module 10. In other words, even if there is some positional displacement in the substrate W, the amount of displacement is significantly smaller than the amount of displacement when the substrate W was first loaded into the process module 10. Therefore, when the control device 90 performs steps S202 and S203 again (see also Figure 11(A)), it calculates a positional displacement amount smaller than the initial displacement amount of the substrate W based on the detection information from the process module side sensor 14. The substrate processing system 1 then corrects the movement of the transport robot 22 for the substrate W with this smaller displacement.

[0074] Therefore, in step S204, the control device 90 can compare the calculated displacement amount of the substrate W with a threshold value to determine if the displacement of the substrate W is less than the threshold value. Alternatively, if the displacement amount becomes greater than or equal to the threshold value again, the control device 90 proceeds to step S205 to repeat the process flow of unloading the substrate W from the process module 10 and reloading it. If the displacement of the substrate W exceeds the threshold value even after repeating the process of correcting and loading the substrate W into the process module 10 and then unloading it multiple times, there is a possibility that there is a malfunction on the vacuum transport module 20 side, including the process module side sensor 14. For this reason, the control device 90 should proceed to a process of notifying the user interface 92 of the malfunction when the process of correcting and loading the substrate W into the process module 10 and then unloading it has been repeated a set number of times.

[0075] If the control device 90 determines that the amount of misalignment is less than a threshold (step S204: NO), it proceeds to step S206 and finishes loading the substrate W into the process module 10. At this time, the substrate W with almost no misalignment is placed on the loading table 12. Therefore, in the transport method according to the second embodiment, the transport accuracy of the substrate W can be improved in the same way as in the embodiment described above.

[0076] In the transport method according to the second embodiment, the amount of misalignment of the substrate W compared to a threshold was calculated based on the detection information of the process module side sensor 14. However, the transport method is not limited to this, and for example, the substrate W placed on the mounting table 12 may be detected by a camera (not shown) of the process module 10, and the amount of misalignment may be calculated based on the detection information.

[0077] Furthermore, in the transport method according to the second embodiment, the material transported by the transport robot 22 is not limited to the substrate W; for example, a ring R may be transported as the material.

[0078] In the first and second embodiments, the vacuum transport module 20 is a transport unit (a so-called SCARA robot) that transports substrates W and rings R using a transport robot 22 that rotates, extends, and raises a plurality of arms 222. However, the transport unit is not limited to this, and various mechanisms may be applied. For example, the vacuum transport module 20 may be a magnetic levitation transport unit 25 as shown in Figures 12 and 13. Figure 12 is a schematic cross-sectional view showing a transport unit 25 according to a modified example. Figure 13 is a schematic perspective view showing the transport unit 25 of Figure 12.

[0079] The transport unit 25 comprises a linear unit 26 and one or more transport devices 27. The linear unit 26 moves the transport devices 27 horizontally by magnetic levitation. The linear unit 26 includes a plurality of electromagnetic coils 261 arranged inside the entire bottom wall 211 of the vacuum transport chamber 21, and a linear drive unit 262 that independently supplies power (excitation current) for generating a magnetic field to each electromagnetic coil 261. The linear drive unit 262 is controlled by a control device 90 and generates a magnetic field by appropriately supplying excitation current to each electromagnetic coil 261.

[0080] On the other hand, the transport device 27 includes a base 271 and an arm 272 extending from the base 271 in a predetermined direction. A fork 272a capable of supporting a substrate W is provided at the tip of the arm 272. A plurality of permanent magnets 28 are arranged inside the base 271. The plurality of permanent magnets 28 repel each other with the magnetic field generated by the linear unit 26, thereby magnetically levitating the transport device 27, including the base 271 and the arm 272. For example, the linear unit 26 generates a magnetic field direction that repels the permanent magnets 28 depending on the direction of the excitation current supplied from the linear drive unit 262 to each electromagnetic coil 261.

[0081] Furthermore, the linear unit 26 can independently control the excitation current supplied from the linear drive unit 262 to the electromagnetic coil 261, thereby moving the transport device 27 along the upper surface of the linear unit 26 while it is magnetically levitated, and adjusting its horizontal position. In addition, the linear unit 26 can also adjust the amount of levitation (vertical position) of the transport device 27 by controlling the excitation current from the linear drive unit 262.

[0082] As described above, the transport unit 25 can move the transport device 27 to the target three-dimensional coordinate position in the vacuum transport chamber 21 based on the control of the linear drive unit 262 by the control device 90. Furthermore, the transport unit 25 can freely adjust the linear movement, rotation, and posture of the transport device 27 based on the control of the linear drive unit 262 by the control device 90. Therefore, even in the modified transport unit 25, it is possible to move the substrate W supported by the fork 272a at an appropriate angle relative to the load lock module side sensor 34 and pass through. For this reason, the control device 90 can detect members such as the substrate W using the load lock module side sensor 34 and calculate the amount of positional displacement of the members based on the detected information.

[0083] The embodiments disclosed above include, for example, the following aspects:

[0084] [Note 1] A substrate processing system comprising: a process module; a vacuum transport module connected to the process module and having a transport unit for transporting materials to the process module; a load lock module connected to the vacuum transport module and switchable between an atmospheric atmosphere and a vacuum atmosphere; a sensor for detecting the material in a transport path through which the material is transported by the transport unit; and a control unit, wherein the control unit controls the transport unit to transport the material from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, detects the material with the sensor, and calculates the amount of displacement of the material based on the detection information of the sensor. [Note 2] The substrate processing system according to Note 1, wherein the control unit compares the amount of displacement of the material with a pre-held threshold, and if the amount of displacement of the material is greater than or equal to the threshold, controls the transport unit to correct the displacement of the material and transport the material to the load lock module, and transports the material again from the load lock module. [Note 3] The substrate processing system according to Note 2, wherein the control unit sets a correction amount for placing the member on the load lock module based on detection information detected by the sensor when transporting the member from the load lock module to a position corresponding to the opening of the load lock module in the vacuum transport module. [Note 4] The substrate processing system according to Note 2, wherein the control unit sets a correction amount for transporting the member to the load lock module based on detection information detected by the sensor when transporting the member from a position corresponding to the opening of the load lock module in the vacuum transport module to the load lock module. [Note 5] The substrate processing system according to any one of Notes 2 to 4, wherein the control unit transports the member to a position corresponding to the entrance of the process module in the vacuum transport module when the amount of misalignment of the member is less than the threshold, and then loads the member into the process module.[Note 6] The substrate processing system according to any one of Notes 1 to 5, wherein the control unit transports the member from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, then transports the member to a position in the vacuum transport module corresponding to the opening of the process module, and then, when loading the member into the process module, corrects the misalignment of the member based on detection information detected by the sensor, and transports the member to a position in the vacuum transport module corresponding to the opening of the process module. [Note 7] The substrate processing system according to any one of Notes 1 to 6, wherein the control unit can selectively execute a first pattern in which, when transporting the member from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, the control unit calculates the amount of misalignment of the member based on the detection information of the detected sensor, corrects the calculated misalignment of the member and transports the member to the load lock module, transports the member again from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, and then transports the member to a position in the vacuum transport module corresponding to the opening of the process module, and a second pattern in which the control unit corrects the calculated misalignment of the member and transports the member to a position in the vacuum transport module corresponding to the opening of the process module. [Note 8] The substrate processing system according to Note 7, wherein the control unit selects the first pattern and the second pattern based on the amount of misalignment or the time to transport the member. [Note 9] The substrate processing system according to any one of Claims 1 to 8, wherein the sensor is provided at a position adjacent to the opening of the load lock module. [Note 10] The substrate processing system according to Note 9, wherein the sensor is provided in the vacuum transport module at a position adjacent to the opening of the load lock module, or in the load lock module at a position adjacent to the opening of the load lock module.[Note 11] The substrate processing system according to any one of Notes 1 to 10, wherein the load lock module is connected to the vacuum transport module via a connection having a gate valve, and the sensor is provided at the connection. [Note 12] A substrate processing system comprising: a process module; a vacuum transport module connected to the process module and having a transport unit for transporting materials to the process module; a sensor for detecting materials in a transport path through which the transport unit transports the materials; and a control unit, wherein the control unit controls the transport unit to transport the materials into the process module from a position in the vacuum transport module corresponding to an opening in the process module, detects the materials with the sensor, calculates the displacement of the materials based on the detection information of the sensor, corrects the calculated displacement of the materials, and places the materials on the mounting table of the process module; if the amount of displacement of the materials is greater than or equal to a predetermined threshold, controls the transport unit to transport the materials out of the process module to the vacuum transport module and re-import the materials into the process module, detects the materials with the sensor at the time of re-import, calculates the amount of displacement of the materials based on the detection information of the sensor, corrects the calculated displacement of the materials, and places the materials on the mounting table of the process module. [Note 13] The substrate processing system according to Note 12, wherein the sensor is provided at a position adjacent to the opening of the process module in the vacuum transport module, or at a position adjacent to the opening of the process module in the process module. [Note 14] The substrate processing system according to Note 12, wherein the process module is connected to the vacuum transport module via a connection having a gate valve, and the sensor is provided at the connection. [Note 15] The substrate processing system according to any one of Notes 1 to 14, wherein the sensor has a plurality of detectors arranged at intervals shorter than the diameter of the member.[Note 16] The substrate processing system according to any one of Notes 1 to 15, wherein the member is a substrate to be processed in the process module, or a ring arranged around the substrate on the mounting table of the process module. [Note 17] The substrate processing system according to any one of Notes 1 to 16, wherein the transport unit is a transport robot having a base, a plurality of arms provided on the base, and an end effector provided on the end arm. [Note 18] The substrate processing system according to any one of Notes 1 to 16, wherein the transport unit is a magnetic levitation type unit including a transport device and a linear unit that moves the transport device by magnetic levitation. [Note 19] A transport method for a substrate processing system comprising: a process module; a vacuum transport module connected to the process module and having a transport unit for transporting materials to the process module; a load lock module connected to the vacuum transport module and switchable between an atmospheric atmosphere and a vacuum atmosphere; and a sensor for detecting the materials in a transport path through which the materials are transported by the transport unit, the transport method comprising: (A) controlling the transport unit to transport the materials from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module; and (B) detecting the materials being transported in step (A) using the sensor and calculating the amount of displacement of the materials based on the detection information of the sensor.

[0085] The substrate processing system 1 and transport method according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner.

[0086] This application claims priority to Japanese Patent Application No. 2024-169086, a basic application filed with the Japan Patent Office on September 27, 2024, the entire contents of which are incorporated herein by reference.

[0087] 1. Substrate processing system 10. Process module 20. Vacuum transfer module 22. Transfer robot 30. Load lock module 34. Load lock module side sensor 90. Control device W. Substrate

Claims

1. A substrate processing system comprising: a process module; a vacuum transport module connected to the process module and having a transport unit for transporting materials to the process module; a load lock module connected to the vacuum transport module and switchable between an atmospheric atmosphere and a vacuum atmosphere; a sensor for detecting the materials in a transport path through which the materials are transported by the transport unit; and a control unit, wherein the control unit controls the transport unit to transport the materials from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, detects the materials with the sensor, and calculates the amount of displacement of the materials based on the detection information of the sensor.

2. The substrate processing system according to claim 1, wherein the control unit compares the amount of displacement of the member with a pre-established threshold, and if the amount of displacement of the member is greater than or equal to the threshold, controls the transport unit to correct the displacement of the member and transport the member to the load lock module, and then transports the member again from the load lock module.

3. The substrate processing system according to claim 2, wherein the control unit sets a correction amount for placing the member on the load lock module based on detection information detected by the sensor when transporting the member from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module.

4. The substrate processing system according to claim 2, wherein the control unit sets a correction amount for transporting the member to the load lock module based on detection information detected by the sensor when transporting the member from a position corresponding to the opening of the load lock module in the vacuum transport module to the load lock module.

5. The substrate processing system according to claim 2, wherein the control unit transports the member to a position corresponding to the opening of the process module in the vacuum transport module when the amount of displacement of the member is less than the threshold, and then loads the member into the process module.

6. The substrate processing system according to claim 1, wherein the control unit transports the member from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, then transports the member to a position in the vacuum transport module corresponding to the opening of the process module, and then, when loading the member into the process module, corrects the misalignment of the member based on detection information detected by the sensor, and transports the member to a position in the vacuum transport module corresponding to the opening of the process module.

7. The substrate processing system according to claim 1, wherein the control unit can selectively execute a first pattern in which, when transporting the member from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, the control unit calculates the amount of misalignment of the member based on the detection information of the detected sensor, corrects the calculated misalignment of the member and transports the member to the load lock module, transports the member again from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module, and then transports the member to a position in the vacuum transport module corresponding to the opening of the process module, and a second pattern in which the control unit corrects the calculated misalignment of the member and transports the member to a position in the vacuum transport module corresponding to the opening of the process module.

8. The substrate processing system according to claim 7, wherein the control unit selects the first pattern and the second pattern based on the amount of misalignment or the time for transporting the member.

9. The substrate processing system according to any one of claims 1 to 8, wherein the sensor is provided adjacent to the opening of the load lock module.

10. The substrate processing system according to claim 9, wherein the sensor is provided in the vacuum transport module at a position adjacent to the opening of the load lock module, or in the load lock module at a position adjacent to the opening of the load lock module.

11. The substrate processing system according to claim 7, wherein the load lock module is connected to the vacuum transport module via a connection having a gate valve, and the sensor is provided at the connection.

12. A substrate processing system comprising: a process module; a vacuum transport module connected to the process module and having a transport unit for transporting materials to the process module; a sensor for detecting materials in a transport path through which the transport unit transports the materials; and a control unit, wherein the control unit controls the transport unit to transport the materials into the process module from a position in the vacuum transport module corresponding to an opening in the process module, detects the materials using the sensor, calculates the displacement of the materials based on the detection information of the sensor, corrects the calculated displacement of the materials, and places the materials on the mounting table of the process module; and if the amount of displacement of the materials is greater than or equal to a predetermined threshold, controls the transport unit to transport the materials out of the process module to the vacuum transport module and re-import the materials into the process module, detects the materials using the sensor at the time of re-import, calculates the amount of displacement of the materials based on the detection information of the sensor, corrects the calculated displacement of the materials, and places the materials on the mounting table of the process module.

13. The substrate processing system according to claim 12, wherein the sensor is provided in the vacuum transport module at a position adjacent to the opening of the process module, or in the process module at a position adjacent to the opening of the process module.

14. The substrate processing system according to claim 12, wherein the process module is connected to the vacuum transport module via a connection having a gate valve, and the sensor is provided at the connection.

15. The substrate processing system according to any one of claims 1 to 8 or 12 to 14, wherein the sensor has a plurality of detectors arranged at intervals shorter than the diameter of the member.

16. The substrate processing system according to any one of claims 1 to 8 or 12 to 14, wherein the member is a substrate that is subjected to substrate processing in the process module, or a ring that is arranged around the substrate on the mounting table of the process module.

17. The substrate processing system according to any one of claims 1 to 8 or 12 to 14, wherein the transport unit is a transport robot having a base, a plurality of arms provided on the base, and an end effector provided on the end arm.

18. The substrate processing system according to any one of claims 1 to 8 or 12 to 14, wherein the transport unit is a magnetic levitation type unit including a transport device and a linear unit that moves the transport device by magnetic levitation.

19. A transport method for a substrate processing system comprising: a process module; a vacuum transport module connected to the process module and having a transport unit for transporting materials to the process module; a load lock module connected to the vacuum transport module and switchable between an atmospheric atmosphere and a vacuum atmosphere; and a sensor for detecting the materials in a transport path through which the materials are transported by the transport unit, the transport method comprising: (A) controlling the transport unit to transport the materials from the load lock module to a position in the vacuum transport module corresponding to the opening of the load lock module; and (B) detecting the materials being transported in step (A) using the sensor and calculating the amount of displacement of the materials based on the detection information of the sensor.

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