Component manufacturing method and component manufacturing device

Abstract

In this component manufacturing method, one surface of a workpiece is a fixed surface and the other surface is a ground surface, and the ground surface of the workpiece is ground in a state in which the fixed surface of the workpiece is fixed to a chuck table, wherein: the chuck table has a fixing portion for fixing an outer peripheral portion of the fixed surface of the workpiece and a recessed portion surrounded by the fixing portion; the outer peripheral portion of the fixed surface of the workpiece is fixed by means of the fixing portion of the chuck table; a space formed by the fixed surface of the workpiece that has been fixed to the fixing portion and the recessed portion of the chuck table is filled with one or more fluids selected from the group consisting of liquids and pressurized gases; and the ground surface of the workpiece is ground in a state in which the fixed surface of the workpiece is in contact with the fluid.

Description

Method for manufacturing component and component manufacturing apparatus

[0001] The present invention relates to a method for manufacturing a component and a component manufacturing apparatus.

[0002] In the manufacturing process of various components, a machining process of grinding a workpiece is performed. As a grinding apparatus, a grinding apparatus including a rotatable chuck table for holding a workpiece and a grinding unit in which a grinding wheel is rotatably arranged is used. According to this grinding apparatus, while rotating the chuck table for holding the workpiece and the grinding wheel respectively, the grinding wheel is brought into contact with the grinding surface of the workpiece, and the workpiece can be ground.

[0003] On the fixed surface opposite to the grinding surface of the workpiece, an adhesive protective film may be attached for the purpose of preventing damage, contamination, etc. caused by the grinding process. In this case, the workpiece is held on the chuck table through the adhesive protective film during the grinding process, and the adhesive protective film is peeled off and removed from the fixed surface of the workpiece after the grinding process.

[0004] When peeling the adhesive protective film from the fixed surface after the grinding process, glue residue of the adhesive protective film may occur on the fixed surface of the workpiece. Further, when the adhesive protective film is attached and peeled off, the members formed on the fixed surface of the workpiece may be damaged. Therefore, studies have been conducted to suppress damage and contamination of the workpiece by the adhesive protective film.

[0005] Patent Document 1 describes a back grind tape having a base material and an ultraviolet curable adhesive layer, wherein the 25°C shear storage modulus G'1 of the ultraviolet curable adhesive layer without ultraviolet irradiation is 0.175 MPa or more, and the adhesion to silicon is 1 N / 20 mm or more, and the 25°C tensile storage modulus E'1 of the ultraviolet curable adhesive layer of the back grind tape irradiated with ultraviolet rays is 300 MPa or less, and the adhesion to silicon is 0.15 N / 20 mm or less.

[0006] Japanese Unexamined Patent Application Publication No. 2023 - 05**3919

[0007] The backgrind tape described in Patent Document 1 is said to have excellent ability to fill in unevenness and adhesiveness, and to prevent adhesive residue from remaining on the adherend when peeled off. However, from the viewpoint of improving the quality and productivity of parts, it is desirable to further suppress the occurrence of contamination and damage such as adhesive residue after grinding, while also protecting the fixed surface of the workpiece well during the grinding process.

[0008] This invention has been made in view of the above circumstances, and aims to provide a method and apparatus for manufacturing parts that can suppress contamination and damage to the fixed surface of a workpiece during and after grinding.

[0009] The present inventors have conducted studies to solve the above problems and have found that the following embodiment can solve the problems. That is, the present invention relates to the following [1] to

[12] . [1] A method for manufacturing a part, wherein one surface of the workpiece is used as the fixed surface and the other surface is used as the grinding surface, and the fixed surface of the workpiece is fixed to a chuck table, and the grinding surface of the workpiece is ground, wherein the chuck table has a fixing part for fixing the outer periphery of the fixed surface of the workpiece and a recess surrounded by the fixing part, the outer periphery of the fixed surface of the workpiece is fixed by the fixing part of the chuck table, and one or more fluids selected from the group consisting of liquids and pressurized gases are filled into the space formed by the fixed surface of the workpiece fixed to the fixing part and the recess of the chuck table, and the grinding surface of the workpiece is ground while the fixed surface of the workpiece is in contact with the fluid, a method for manufacturing a part. [2] The method for manufacturing a part according to [1] above, wherein the workpiece is an electronic component. [3] The method for manufacturing a part according to [1] or [2] above, wherein the workpiece has a projection on the fixed surface. [4] The method for manufacturing a part according to [3] above, wherein the height of the projection is 3.00 mm or less. [5] The method for manufacturing a part according to any one of [1] to [4] above, wherein the depth of the recess in the chuck table is 4.00 mm or less. [6] The method for manufacturing a part according to any one of [1] to [5] above, wherein the fluid is a liquid. [7] A part manufacturing apparatus used for grinding a workpiece, comprising: a chuck table having a fixing part for fixing the outer periphery of the fixed surface of the workpiece and a recess surrounded by the fixing part; and a fluid supply mechanism for supplying one or more fluids selected from the group consisting of liquids and pressurized gases to the recess in the chuck table. [8] The part manufacturing apparatus according to [7] above, wherein the workpiece is an electronic component. [9] The part manufacturing apparatus according to [7] or [8] above, wherein the workpiece has a projection on the fixed surface.

[10] The parts manufacturing apparatus according to [9] above, wherein the height of the projection is 3.00 mm or less.

[11] The parts manufacturing apparatus according to any one of [7] to

[10] above, wherein the depth of the recess in the chuck table is 4.00 mm or less.

[12] The parts manufacturing apparatus according to any one of [7] to

[11] above, wherein the fluid is a liquid.

[0010] According to the present invention, it is possible to provide a method for manufacturing a part and a manufacturing apparatus that can suppress contamination and damage to the fixed surface of a workpiece during and after grinding.

[0011] This is a schematic plan view of a wafer, which is an example of a workpiece. This is a schematic cross-sectional view showing an example of a parts manufacturing apparatus of this embodiment. This is a schematic plan view showing an example of a chuck table provided in the parts manufacturing apparatus of this embodiment. This is a schematic cross-sectional view illustrating the process of the parts manufacturing method of this embodiment. This is a schematic cross-sectional view illustrating the process of the parts manufacturing method of this embodiment. This is a schematic cross-sectional view illustrating the process of the parts manufacturing method of this embodiment.

[0012] In this specification, the lower and upper limits described in steps for a preferred numerical range can be combined independently. For example, from the description "preferably 10 to 90, more preferably 30 to 60," the "preferred lower limit (10)" and the "more preferred upper limit (60)" can be combined to arrive at "10 to 60."

[0013] Drawings may exaggerate features by enlarging characteristic parts to make them easier to understand, and the dimensional ratios of components may not necessarily be the same as in reality.

[0014] <Parts> The parts manufactured by the manufacturing method or manufacturing apparatus of this embodiment are not particularly limited as long as they are parts manufactured by grinding a workpiece. Examples of parts include electronic components, optical instrument parts, building components, plastic product parts, and transportation equipment parts. Among these, the manufacturing method and manufacturing apparatus of this embodiment are particularly suitable for the manufacture of electronic components. Examples of electronic components include wafers, chips, circuit boards, semiconductor packages, and semiconductor devices containing these.

[0015] <Workpiece> The workpiece can be any material that is ground during the manufacturing of the above-mentioned part. The material of the workpiece is not particularly limited and examples include resin, metal, glass, ceramic, stone, wood, etc. Among these, the manufacturing method and manufacturing apparatus of this embodiment are suitable for grinding resin, metal, glass, or ceramic. The shape of the workpiece is not particularly limited, but it is preferably plate-shaped. In this specification, "plate-shaped" includes shapes in which recesses, protrusions, etc. are formed on each surface.

[0016] The workpiece to be ground by the manufacturing method or apparatus of this embodiment has one side as the fixing surface and the other side as the grinding surface. The fixing surface of the workpiece may be flat or may have protrusions. When an adhesive protective film is applied to a fixing surface with protrusions, adhesive residue and damage to the protrusions tend to occur easily. However, the manufacturing method and apparatus of this embodiment make it possible to fix and grind the workpiece well without applying an adhesive protective film to the protrusions. Therefore, the manufacturing method and apparatus of this embodiment tend to be particularly effective in suppressing contamination and damage to the fixing surface of the workpiece when grinding a workpiece with protrusions on the fixing surface.

[0017] The purpose of forming the protrusions is not particularly limited. Examples of protrusions include bumps provided on the circuit surface of wafers, chips, etc., or on redistribution layers. Examples of bump shapes include spherical, ellipsoidal, and pillar-shaped. In one embodiment of this design, the height of the protrusion is preferably 3.00 mm or less, but may be 0.03 to 1.00 mm or 0.12 to 0.20 mm. The number of protrusions is not particularly limited; there may be only one or multiple protrusions. Multiple protrusions may be arranged at arbitrary intervals on the fixed surface of the workpiece, for example.

[0018] The workpiece is not particularly limited as long as it is a material used in the manufacture of the above-mentioned parts, but it is preferably an electronic component material. Examples of electronic component materials include semiconductor wafers such as silicon wafers, gallium arsenide wafers, silicon carbide wafers, gallium nitride wafers, and indium phosphate wafers; insulating wafers such as glass wafers, lithium tantalate wafers, and lithium niobate wafers; chips; cured encapsulated bodies formed by sealing chips with a curing resin; wafers or chips with a back surface protective film formed on them; circuit boards; semiconductor packages; and the like. Among these, the manufacturing method or manufacturing apparatus of this embodiment is suitable for back surface grinding of wafers.

[0019] A wafer may have circuits such as wiring, capacitors, diodes, and transistors formed on one side. Figure 1 shows a schematic plan view of a wafer 50 having bumps. Multiple devices 52 are formed on the circuit surface 50a of the wafer 50, demarcated by division lines 51. Circuits (not shown) are formed on each device 52, and multiple bumps 53, which are protrusions, are formed as shown in the enlarged view of Figure 1. The circuit surface 50a of the wafer 50 has a device region 54 in which the multiple devices 52 are arranged via the division lines 51, and a surplus region 55 which is the remaining portion when the wafer is cut into individual pieces.

[0020] Next, the parts manufacturing apparatus and manufacturing method of this embodiment will be described with reference to the drawings.

[0021] <Parts Manufacturing Apparatus 1> Figure 2 shows a schematic cross-sectional view of parts manufacturing apparatus 1, which is one embodiment of the parts manufacturing apparatus of this embodiment. Parts manufacturing apparatus 1 has a chuck table 2 and a fluid supply mechanism 3. Parts manufacturing apparatus 1 further has a fluid discharge mechanism 4 and a fixing mechanism 5. The various components of parts manufacturing apparatus 1 will be described below.

[0022] (Chuck Table 2) The chuck table 2 has a fixing portion 10 for fixing the outer periphery of the fixed surface of the workpiece, and a recess 11 surrounded by the fixing portion 10.

[0023] Referring to Figure 2, the fixing portion 10 is a protrusion surrounding the recess 11 and is provided on the outer circumference of the chuck table 2. The fixing portion 10 has an upper surface 10a that fixes the outer circumference of the workpiece's fixing surface, an inner surface 10b that connects to the upper surface 10a and the bottom surface 11a of the recess 11, and an outer surface 10c that corresponds to a part of the side surface of the chuck table 2. A groove 12 is formed in the upper surface 10a of the fixing portion 10, and a suction hole 15 is provided at the bottom of the groove 12. The recess 11 has a bottom surface 11a formed at a lower position than the upper surface 10a of the fixing portion 10, and the inner surface 10b of the fixing portion 10 as a side wall. A fluid supply port 20 and a fluid discharge port 25 are provided in the bottom surface 11a of the recess 11. The depth of the recess 11 can be determined according to the shape of the workpiece's fixing surface. For example, if a projection is provided on the fixed surface of the workpiece, the depth of the recess 11 should be greater than the height of the projection so that the projection does not come into contact with the bottom surface 11a of the recess and cause damage. In one embodiment of this design, the depth of the recess 11 is preferably 4.00 mm or less, but may be 0.02 to 1.50 mm or 0.05 to 0.30 mm. The shape of the bottom surface 11a of the recess 11 is not limited and may be flat, or may have any irregularities, inclines, etc. For example, when filling the recess 11 with liquid, it may be shaped in a way that facilitates the discharge of the liquid from the fluid outlet 25, which will be described later.

[0024] The material of the chuck table 2 is not particularly limited and can be, for example, metal such as SUS, glass, ceramics, or resin. The chuck table 2 can be rotated around a vertical axis by a rotation mechanism (not shown).

[0025] Figure 3 shows a schematic plan view of the chuck table 2. Referring to Figure 3, the upper surface 10a of the fixing portion 10, which is an annular region with a predetermined width, is formed on the outer circumference of the circular chuck table 2, surrounding a circular recess 11. An annular groove 12 with a predetermined width is formed approximately in the center of the upper surface 10a of the fixing portion 10 in the width direction. In addition, a plurality of suction holes 15 are formed within the groove 12 at approximately equal intervals in the circumferential direction.

[0026] There are no particular restrictions on the shape of the chuck table 2 in plan view, and it can be arbitrarily selected according to the shape of the workpiece. For example, when grinding a disc-shaped workpiece, a circular chuck table may be used in plan view, and when grinding a rectangular workpiece in plan view, a rectangular chuck table may be used in plan view.

[0027] The shape of the fixing part 10 in plan view is set to correspond to the shape of the outer periphery of the workpiece on the fixing surface of the workpiece. For example, if the workpiece is a wafer 50 having the device region 54 and the excess region 55, the fixing part 10 is set to overlap with the excess region 55 of the wafer 50 placed on the chuck table 2.

[0028] The shape of the recess 11 in plan view is set to correspond to the shape of the protective area on the fixed surface of the workpiece that should be protected when grinding the surface of the workpiece. For example, if the workpiece is a wafer 50 having the device area 54 and the excess area 55, the protective area is the device area 54, so the recess 11 is set in a position that overlaps with the device area 54 of the wafer 50 placed on the chuck table 2 in plan view.

[0029] The upper surface 10a of the fixing portion 10 may be provided with a sealing member such as an O-ring for the purpose of suppressing displacement of the workpiece during grinding, increasing the suction holding force, and suppressing fluid leakage. The sealing member may be provided, for example, between the groove 12 and the outer edge of the fixing portion 10, or between the groove 12 and the inner edge of the fixing portion 10, in a plan view.

[0030] (Fluid Supply Mechanism 3) The fluid supply mechanism 3 is a mechanism that supplies one or more fluids selected from the group consisting of liquids and pressurized gases to the recess 11 of the chuck table 2. Referring to Figure 2, the fluid supply mechanism 3 consists of a fluid supply port 20 provided on the bottom surface 11a of the recess 11, a fluid supply device 21, and a fluid supply passage 22 connecting the fluid supply port 20 and the fluid supply device 21. The fluid supply device 21 can be any device that has the function of sending fluid into the fluid supply passage 22. Depending on the type of fluid, the fluid supply device 21 may be a liquid supply device or a pressurized gas supply device. The fluid supply mechanism 3 may also have a pressure adjustment mechanism for adjusting the pressure that the fluid applies to the workpiece within a predetermined range, a temperature adjustment mechanism for adjusting the temperature of the fluid, etc.

[0031] The number of fluid supply ports 20 may be one or multiple. The position of the fluid supply ports 20 is not particularly limited as long as it is a position that can supply fluid to the recess 11. The fluid sent from the fluid supply device 21 to the fluid supply passage 22 passes through the fluid supply passage 22 and is supplied into the recess 11 from the fluid supply ports 20 provided on the bottom surface 11a of the recess 11. The chuck table 2 may be provided with an exhaust mechanism to discharge any gas that was originally present in the space formed between the fixed surface of the workpiece and the recess 11 when the space is filled with liquid.

[0032] Examples of liquid fluids include water such as pure water and ultrapure water; and organic solvents. These liquids may be used individually or in combination of two or more. Examples of gases used as pressurized gases include air, nitrogen, argon, neon, and helium. These gases may be used individually or in combination of two or more. Among the above fluids, water such as pure water and ultrapure water is preferred from the viewpoint of ease of handling.

[0033] The fluid supplied by the fluid supply mechanism 3 may be sealed within the space formed between the fixed surface of the workpiece and the recess 11 during grinding of the workpiece, or the fluid may continue to flow within the space by operating the fluid supply mechanism 3 and the fluid discharge mechanism 4 (described later) continuously and simultaneously.

[0034] (Fluid Discharge Mechanism 4) The fluid discharge mechanism 4 is a mechanism for discharging the fluid filled in the recess 11 of the chuck table 2 from the recess 11 of the chuck table 2. Referring to Figure 2, the fluid discharge mechanism 4 consists of a fluid discharge port 25 provided on the bottom surface 11a of the recess 11, an external discharge port 26 for discharging the fluid outside the system of the parts manufacturing apparatus 1, and a fluid discharge passage 27 connecting the fluid discharge port 25 and the external discharge port 26. There may be one or more fluid discharge ports 25. The position where the fluid discharge ports 25 are formed is not particularly limited as long as it is a position from which fluid can be discharged from the recess 11.

[0035] The fluid outlet 25 may be provided separately from the fluid supply port 20, or the fluid supply port 20 may also serve as the fluid outlet 25. When discharging fluid from the fluid supply port 20, the fluid supply passage 22 can be selectively connected to the fluid supply device 21 and the external outlet 26 by a passage switching mechanism. When supplying fluid, it can be connected to the fluid supply device 21, and when discharging fluid, it can be connected to the external outlet 26.

[0036] The fluid discharged from the external outlet 26 may be supplied again to the recess 11 from the fluid supply device 21 as needed. In other words, the parts manufacturing apparatus 1 of this embodiment may also be a mechanism that circulates fluid by connecting the fluid supply mechanism 3 and the fluid discharge mechanism 4.

[0037] (Fixing Mechanism 5) Fixing mechanism 5 is a mechanism for fixing the outer periphery of the fixing surface of the workpiece to the fixing part 10. Referring to Figure 2, fixing mechanism 5 consists of a suction hole 15 provided at the bottom of the groove 12, a suction device 16, and a suction passage 17 connecting the suction hole 15 and the suction device 16. As the suction device 16, a known suction device such as an ejector can be used. When suction is applied by the suction device 16 with the workpiece placed on the upper surface 10a of the fixing part 10, the space formed between the fixing surface of the workpiece and the groove 12 provided on the upper surface 10a of the fixing part 10 is depressurized, and the workpiece is sucked to the upper surface 10a of the fixing part 10. As a result, the workpiece is held in place by suction in the fixing part 10. There are no restrictions on the number, size, spacing, etc. of the suction holes 15, and they can be appropriately determined according to the shape of the workpiece, etc.

[0038] In the parts manufacturing apparatus of this embodiment, the means for fixing the outer periphery of the fixed surface of the workpiece is not limited to suction, but any means that can fix the outer periphery of the workpiece to the fixed part may be used. Means other than suction include, for example, means of gripping using an electrostatic chuck, a magnetic chuck, a clamp, etc.

[0039] In addition to the above-described configurations, the parts manufacturing apparatus of this embodiment may also include various mechanisms found in known grinding apparatuses, such as a grinding unit containing a grinding wheel used for grinding workpieces, and a grinding water supply mechanism for supplying grinding water to the workpiece surface.

[0040] <Method of manufacturing parts> Next, the method of manufacturing parts according to this embodiment, using the parts manufacturing apparatus 1, will be described.

[0041] Figure 4 shows the process of placing a workpiece W on the chuck table 2 of the parts manufacturing apparatus 1. The workpiece W is placed so that the outer circumference of its fixed surface Wa is supported by the upper surface 10a of the fixing part 10. When suction is applied by the suction device 16 with the workpiece W in place, the workpiece W is held in place by the fixing mechanism 5. In the state where the workpiece W is held in place by the fixing part 10, a space X is formed between the fixed surface Wa of the workpiece W and the recess 11.

[0042] Figure 5 shows a step of filling space X with one or more fluids F selected from the group consisting of liquids and pressurized gases. The fluid F is filled into space X by the fluid supply mechanism 3 described above. The fluid F comes into contact with the fixed surface Wa of the workpiece W and fills space X until the pressure from the fluid F on the workpiece W reaches a desired pressure. The pressure from the fluid F on the workpiece W is preferably set to a pressure that prevents the workpiece W from bending due to the pressure from the grinding wheel during grinding, as will be described later.

[0043] In FIGS. 4 and 5 described above, an example in which the fluid F is supplied to the concave portion 11 after the workpiece W is placed on the chuck table 2 is shown. However, the order of the steps of placing the workpiece W and supplying the fluid F is not particularly limited. For example, after supplying the fluid F to the concave portion 11, the workpiece W may be placed on the chuck table 2, or the workpiece W may be placed on the chuck table 2 while supplying the fluid F to the concave portion 11.

[0044] FIG. 6 shows a step of grinding the grinding surface Wb of the workpiece W in a state where the fixing surface Wa of the workpiece W is in contact with the fluid F. The grinding unit 30 shown in FIG. 6 is provided with a grinding wheel rotatably on the surface on the workpiece W side. By rotating the chuck table 2 and the grinding wheel while bringing the grinding wheel into contact with the grinding surface Wb of the workpiece W, the grinding surface Wb side of the workpiece W can be ground and the workpiece W can be thinned.

[0045] In the manufacturing method of the present embodiment, by bringing the fixing surface Wa of the workpiece W into contact with the fluid F, the workpiece W is suppressed from being curved by the pressure from the grinding wheel during grinding, and excellent grinding accuracy can be obtained. During grinding, it is preferable to supply grinding water such as water to the grinding surface Wb of the workpiece W by a grinding water supply means (not shown). The grinding may be performed to a predetermined thickness while detecting the thickness of the workpiece W. As described above, the fluid F in the space X may be sealed, or the fluid F may continue to flow in the space X by continuously and simultaneously operating the fluid supply mechanism 3 and the fluid discharge mechanism 4.

[0046] After grinding, the suction holding of the workpiece W is released by stopping the suction by the suction device 16, and the workpiece W is separated from the fixed part 10 of the chuck table 2. A known pickup device or the like can be used to separate the workpiece W. When separating the workpiece W from the fixed part 10 of the chuck table 2, the fluid F may be discharged in advance from the space X by the fluid discharge mechanism 4, or the workpiece may be separated while the fluid F is present in the space X. Alternatively, with the workpiece W separated from the upper surface 10a of the fixed part 10 by a predetermined distance, the fluid F may be overflowed from the recess 11 by the fluid supply mechanism 3, and the fixed surface Wa of the workpiece W may be washed with the overflowed fluid F. After that, a drying process is performed as necessary to obtain the thinned workpiece W.

[0047] According to the manufacturing method of the part of this embodiment described above, the fixed surface Wa of the workpiece W, which was conventionally protected by an adhesive protective film, can be protected and supported by a fluid. As a result, good grinding accuracy can be obtained while suppressing contamination and damage caused by the application and peeling of the adhesive protective film. However, in the manufacturing method of the part of this embodiment, an adhesive protective film may be applied to the fixed surface Wa of the workpiece W as needed. Specifically, for example, an adhesive protective film may be applied to the outer periphery of the fixed surface Wa of the workpiece W in order to improve the adhesion between the upper surface 10a of the fixing part 10 and the outer periphery of the fixed surface Wa of the workpiece W.

[0048] 1. Part manufacturing equipment 2. Chuck table 3. Fluid supply mechanism 4. Fluid discharge mechanism 5. Fixing mechanism 10. Fixing part 10a. Top surface of fixing part 10 10b. Inner surface of fixing part 10 10c. Outer surface of fixing part 10 11. Recess 11a. Bottom surface of recess 11 12. Groove 15. Suction hole (fixing mechanism) 16. Suction device (fixing mechanism) 17. Suction passage (fixing mechanism) 20. Fluid supply port (fluid supply mechanism) 21. Fluid supply device (fluid supply mechanism) 22. Fluid supply passage (fluid supply mechanism) 25. Fluid discharge port (fluid discharge mechanism) 26. Out-of-system discharge port (fluid discharge mechanism) 27. Fluid discharge passage (fluid discharge mechanism) 30. Grinding unit 50. Wafer 50a. Circuit surface 51. Planned division line 52. Device 53. Bump 54. Device area 55. Excess area W Workpiece Wa Fixed surface of workpiece W Wb Processed surface of workpiece W X Space F Fluid

Claims

1. A method for manufacturing a part, wherein one side of the workpiece is designated as the fixed surface and the other side as the grinding surface, and the fixed surface of the workpiece is fixed to a chuck table, and the grinding surface of the workpiece is ground, wherein the chuck table has a fixing portion for fixing the outer periphery of the fixed surface of the workpiece and a recess surrounded by the fixing portion, the outer periphery of the fixed surface of the workpiece is fixed by the fixing portion of the chuck table, and one or more fluids selected from the group consisting of liquids and pressurized gases are filled into the space formed by the fixed surface of the workpiece fixed to the fixing portion and the recess of the chuck table, and the grinding surface of the workpiece is ground while the fixed surface of the workpiece is in contact with the fluid, 2. The method for manufacturing a component according to claim 1, wherein the workpiece is an electronic component.

3. The method for manufacturing a part according to claim 1 or 2, wherein the workpiece has a projection on the fixed surface.

4. The method for manufacturing a part according to claim 3, wherein the height of the projection is 3.00 mm or less.

5. The method for manufacturing a part according to claim 1 or 2, wherein the depth of the recess in the chuck table is 4.00 mm or less.

6. The method for manufacturing a component according to claim 1 or 2, wherein the fluid is a liquid.

7. A parts manufacturing apparatus used for grinding a workpiece, comprising: a chuck table having a fixing portion for fixing the outer periphery of the fixed surface of the workpiece and a recess surrounded by the fixing portion; and a fluid supply mechanism for supplying one or more fluids selected from the group consisting of liquids and pressurized gases to the recess of the chuck table.

8. The component manufacturing apparatus according to claim 7, wherein the workpiece is an electronic component.

9. The parts manufacturing apparatus according to claim 7 or 8, wherein the workpiece has a projection on the fixed surface.

10. The parts manufacturing apparatus according to claim 9, wherein the height of the projection is 3.00 mm or less.

11. The parts manufacturing apparatus according to claim 7 or 8, wherein the depth of the recess in the chuck table is 4.00 mm or less.

12. The parts manufacturing apparatus according to claim 7 or 8, wherein the fluid is a liquid.

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