Light-emitting substrate, backlight module, and display apparatus

Abstract

A light-emitting substrate, a backlight module, and a display apparatus. The light-emitting substrate has a light-emitting region and a bonding region, the light-emitting region and the bonding region being arranged in a first direction. The dimension of the light-emitting region in the first direction is greater than the dimension of the light-emitting region in a second direction, and the light-emitting region comprises a plurality of light-emitting partitions arranged in the second direction. The light-emitting substrate comprises: a substrate; a first bonding electrode and a second bonding electrode disposed on the substrate, the first bonding electrode and the second bonding electrode being located in the bonding region; a plurality of light-emitting assemblies disposed in each light-emitting partition; and a plurality of first voltage lines and a plurality of second voltage lines, the first voltage lines being electrically connected to the first bonding electrode and first ends of the light-emitting assemblies, and the second voltage lines being electrically connected to the second bonding electrode and second ends of the light-emitting assemblies. The first ends of the light-emitting assemblies in at least two of the light-emitting partitions are electrically connected to a same first voltage line; and / or, the second ends of the light-emitting assemblies in at least two of the light-emitting partitions are electrically connected to a same second voltage line.

Description

Light-emitting substrate, backlight module and display device Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a light-emitting substrate, a backlight module, and a display device. Background Technology

[0002] Miniature inorganic light-emitting diodes include MiniLED and MicroLED. Using MiniLED backlight display technology, with its excellent multi-zone backlight control technology, it can achieve better brightness uniformity, higher color contrast and thinner and lighter product form, bringing better display effect to display products. It is now being used more and more in various display scenarios.

[0003] Summary of the Invention

[0004] This disclosure presents a light-emitting substrate, a backlight module, and a display device.

[0005] In a first aspect, this disclosure provides a light-emitting substrate having a light-emitting region and a bonding region located on at least one side of the light-emitting region, the light-emitting region and the bonding region being arranged along a first direction, the size of the light-emitting region in the first direction being larger than the size of the light-emitting region in a second direction, the first direction intersecting the second direction; the light-emitting region including a plurality of light-emitting partitions arranged along the second direction; the light-emitting substrate comprising:

[0006] Substrate;

[0007] A first bonding electrode and a second bonding electrode are disposed on the substrate, wherein the first bonding electrode and the second bonding electrode are located in the bonding region;

[0008] Multiple light-emitting components are disposed in each of the light-emitting zones; each light-emitting component includes: a driver chip and at least one light string electrically connected to the driver chip; each light string includes multiple light-emitting devices connected in series, the first electrode of the first light-emitting device in the light string serves as the first end of the light-emitting component, the second electrode of the last light-emitting device in the light string is electrically connected to the first signal terminal of the driver chip, and the second signal terminal of the driver chip serves as the second end of the light-emitting component;

[0009] Multiple first voltage lines and multiple second voltage lines are provided. The first voltage lines are electrically connected to the first bonding electrode and the first end of the light-emitting component, and the second voltage lines are electrically connected to the second bonding electrode and the second end of the light-emitting component.

[0010] Wherein, the first end of the light-emitting component in at least two of the light-emitting zones is electrically connected to the same first voltage line; and / or, the second end of the light-emitting component in at least two of the light-emitting zones is electrically connected to the same second voltage line.

[0011] In some embodiments, the light-emitting substrate further includes a third bonding electrode and a fourth bonding electrode located in the bonding region;

[0012] Multiple driver chips located in the same light-emitting zone are connected to form a chipset;

[0013] In the chipset, multiple driver chips are arranged sequentially in a direction away from the third bonding electrode. The data input terminal of the first driver chip is electrically connected to the third bonding electrode, and the power supply input terminal of the first driver chip is electrically connected to the fourth bonding electrode. In two adjacent driver chips, the data output terminal of the preceding driver chip is electrically connected to the data input terminal of the following driver chip, and the power supply output terminal of the preceding driver chip is electrically connected to the power supply input terminal of the following driver chip.

[0014] In the chipset, the data output terminal and power output terminal of the last driver chip are both in a floating state.

[0015] In some embodiments, the third bonding electrode, the fourth bonding electrode and the first bonding electrode are located on the same side of the light-emitting area, and a redundant electrode is provided between the third bonding electrode and the fourth bonding electrode and the first bonding electrode;

[0016] And / or,

[0017] The third binding electrode, the fourth binding electrode and the second binding electrode are located on the same side of the light-emitting area, and a redundant electrode is provided between the third binding electrode, the fourth binding electrode and the second binding electrode.

[0018] In some embodiments, the light string is electrically connected to the first voltage line via a first connecting line and electrically connected to the first signal terminal of the driver chip via a second connecting line;

[0019] In the chipset, the data input terminal of the first driver chip is electrically connected to the third bonding electrode via a third connection line, and the power input terminal of the first driver chip is electrically connected to the fourth bonding electrode via a fourth connection line; in two adjacent driver chips, the data output terminal of the preceding driver chip is electrically connected to the data input terminal of the following driver chip via a fifth connection line, and the power output terminal of the preceding driver chip is electrically connected to the power input terminal of the following driver chip via a sixth connection line;

[0020] The first connecting line, the second connecting line, the third connecting line, the fourth connecting line, the fifth connecting line, and the sixth connecting line are arranged on the same layer.

[0021] In some embodiments, the first voltage line is used to provide a first voltage signal to the light-emitting component, the second voltage line is used to provide a second voltage signal to the light-emitting component, and the fourth bonding electrode is used to provide a power supply signal to the driving chip. The voltage of the power supply signal and the voltage of the second voltage signal are both less than the voltage of the first voltage signal.

[0022] In some embodiments, for two adjacent driver chips in the chipset, the data output terminal of the preceding driver chip is electrically connected to the data input terminal of the following driver chip via a fifth connection line, and the power supply output terminal of the preceding driver chip is electrically connected to the power supply input terminal of the following driver chip via a sixth connection line.

[0023] Both the fifth and sixth connecting lines are located between the light string and the second voltage line.

[0024] In some embodiments, the plurality of light-emitting partitions in the light-emitting region constitute a plurality of light-emitting sub-regions, and each light-emitting sub-region includes at least two light-emitting partitions arranged sequentially along the second direction;

[0025] Each of the light-emitting sub-regions corresponds to at least one first voltage line, and the first end of each light-emitting component in the light-emitting sub-region is electrically connected to the corresponding first voltage line;

[0026] Each of the light-emitting zones corresponds to a second voltage line, and the second end of the light-emitting device in each of the light-emitting zones is electrically connected to the corresponding second voltage line; wherein, the last light-emitting zone in the i-th light-emitting sub-region corresponds to the same second voltage line as the first light-emitting zone in the (i+1)-th light-emitting sub-region; i is a positive integer and is less than the total number of light-emitting sub-regions.

[0027] In some embodiments, the first voltage line is located between two of the light-emitting sub-regions in the corresponding light-emitting sub-regions; the second voltage line is provided on both opposite sides of the light-emitting sub-regions along the second direction;

[0028] The second voltage line includes a main line and multiple branch lines; a first end of the main line is electrically connected to the second bonding electrode, a first end of the branch line is electrically connected to the second end of the light-emitting component, and a second end of the branch line is electrically connected to the main line; at least a portion of the extension direction of the main line intersects with the extension direction of the branch lines.

[0029] In some embodiments, the main line includes a first conductor portion and a second conductor portion, one end of the first conductor portion is electrically connected to the second bonding electrode, and the other end is electrically connected to the second conductor portion, and the plurality of branch lines are electrically connected to the second conductor portion; the extension direction of the second conductor portion intersects the extension direction of the branch lines;

[0030] The width of the first conductor portion is at least twice the width of the second conductor portion.

[0031] In some embodiments, the first conductor portion and the corresponding bonding region are arranged along the second direction, and the main line further includes a third conductor portion, which is connected between the first conductor portion and the second bonding electrode and is located on the side of the bonding region facing the light-emitting sub-region, and the width of the third conductor portion is smaller than the width of the first conductor portion.

[0032] In some embodiments, the width of the first voltage line near the first bonding electrode is greater than the width of the main line near the second bonding electrode.

[0033] The width of the end of the first voltage line away from the first bonding electrode is greater than the width of the end of the main line away from the second bonding electrode.

[0034] In some embodiments, at least a portion of the main line extends along the first direction, the branch lines extend along the second direction, the plurality of branch lines are arranged along the first direction, and at least one string of lights is provided between two adjacent branch lines.

[0035] In some embodiments, the branch line furthest from the second bonding electrode in the second voltage line is a distal branch line, and at least one string of lights is provided on the side of the distal branch line furthest from the second bonding electrode.

[0036] In some embodiments, the length of the first voltage line in the first direction is greater than the length of the second voltage line in the first direction.

[0037] In some embodiments, each of the driver chips is electrically connected to a plurality of the light strings, and the plurality of light strings connected to the same driver chip are distributed on opposite sides of the branch line extension line; and the plurality of light strings connected to the same driver chip are distributed on opposite sides of a first reference line, the first reference line being a straight line passing through the driver chip and extending along the first direction.

[0038] In some embodiments, the plurality of LED strings connected to each driver chip are mirror-symmetrical about the extension of the branch line, and the plurality of LED strings connected to each driver chip are mirror-symmetrical about the first reference line.

[0039] In some embodiments, the second ends of the main lines located on opposite sides of the light-emitting area are electrically connected to form a ring structure surrounding the light-emitting area.

[0040] In some embodiments, the light-emitting substrate further includes:

[0041] Multiple fifth bonding electrodes located in the bonding region;

[0042] The first electrostatic protection wire and the second electrostatic protection wire are respectively electrically connected at one end to their respective fifth binding electrodes, and the other ends of the first electrostatic protection wire and the second electrostatic protection wire are respectively electrically connected to the main lines on opposite sides of the light-emitting area.

[0043] In some embodiments, the light-emitting substrate further includes:

[0044] The fifth bonding electrode located in the bonding region;

[0045] An electrostatic protection ring is electrically connected to the fifth bonding electrode and surrounds the light-emitting area; each of the first voltage lines and each of the second voltage lines are located within the area surrounded by the electrostatic protection ring.

[0046] In some embodiments, the light-emitting component includes a plurality of the light strings, each of the light strings being electrically connected to the first voltage line via a first connecting line;

[0047] Multiple first connecting lines connected to the same light-emitting component are arranged along the first direction and distributed on opposite sides of the light-emitting component.

[0048] In some embodiments, the light-emitting sub-regions correspond one-to-one with the first voltage lines.

[0049] The first bonding electrode and the second bonding electrode are located on opposite sides of the light-emitting area;

[0050] Alternatively, the first bonding electrode and the first bonding electrode are located on the same side of the light-emitting area.

[0051] In some embodiments, each of the light-emitting sub-regions corresponds to two first voltage lines, and the first binding electrodes connected to the two first voltage lines corresponding to the same light-emitting sub-region are respectively located on opposite sides of the light-emitting region.

[0052] In some embodiments, the plurality of light-emitting partitions in the light-emitting region constitute a plurality of light-emitting sub-regions, and each light-emitting sub-region includes at least two light-emitting partitions arranged sequentially along the second direction;

[0053] The second voltage line corresponds one-to-one with the light-emitting sub-region, and the second end of each light-emitting component in the light-emitting sub-region is electrically connected to the corresponding second voltage line;

[0054] Each of the light-emitting zones corresponds to one of the first voltage lines, and the first end of the light-emitting component in each of the light-emitting zones is electrically connected to the corresponding first voltage line.

[0055] In some embodiments, the light-emitting substrate further includes:

[0056] The fifth and sixth bonding electrodes are located in the bonding region;

[0057] An electrostatic protective ring surrounds the light-emitting area, one end of which is electrically connected to the fifth bonding electrode, and the other end of which is electrically connected to the sixth bonding electrode;

[0058] Both the first voltage line and the second voltage line are located within the area enclosed by the electrostatic protection ring.

[0059] In some embodiments, the first voltage line includes a plurality of segments connected sequentially along its extension direction, wherein the segment furthest from the first bonding electrode has a resistance per unit length that is less than the segment closest to the first bonding electrode.

[0060] Secondly, this disclosure also provides a backlight module, including the aforementioned light-emitting substrate.

[0061] Thirdly, this disclosure also provides a display device including the aforementioned backlight module. Attached Figure Description

[0062] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0063] Figure 1 is a schematic diagram of the light-emitting substrate provided in some embodiments.

[0064] Figure 2 is a schematic diagram of the region division of the light-emitting substrate provided in some embodiments of this disclosure.

[0065] Figure 3 shows a partial planar portion of the light-emitting substrate provided in the first embodiment of this disclosure.

[0066] Figure 4 is a schematic diagram of the driver chip provided in some embodiments of this disclosure.

[0067] Figure 5 is a schematic diagram of a first voltage line provided in some embodiments of this disclosure.

[0068] Figure 6 shows a partial planar portion of the light-emitting substrate provided in the second embodiment of this disclosure.

[0069] Figure 7 is a partial plan view of the light-emitting substrate provided in the third embodiment of this disclosure.

[0070] Figure 8 is a partial plan view of the light-emitting substrate provided in the fourth embodiment of this disclosure.

[0071] Figure 9 is a partial plan view of the light-emitting substrate provided in the fifth embodiment of this disclosure.

[0072] Figure 10 is a partial plan view of the light-emitting substrate provided in the sixth embodiment of this disclosure.

[0073] Figure 11 is a partial plan view of the light-emitting substrate provided in some embodiments of this disclosure.

[0074] Figure 12 is an enlarged view of region A in Figure 11.

[0075] Figure 13 is a schematic diagram of the connection between the driver chip at position B in Figure 12 and each signal line.

[0076] Figure 14 is a schematic diagram of the connection between the driver chip at position C in Figure 12 and each signal line.

[0077] Figure 15 is a schematic diagram showing the connection between the binding area and each signal line in Figure 12. Detailed Implementation

[0078] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0079] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0080] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0081] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0082] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on another layer or substrate, or that there is an intermediate layer between the layer or element and another layer or substrate.

[0083] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0084] Figure 1 is a schematic diagram of a light-emitting substrate provided in some embodiments. As shown in Figure 1, the light-emitting substrate has a light-emitting region LA and a bonding region BA located on one side of the light-emitting region LA. The light-emitting region LA includes multiple light-emitting partitions DA. The light-emitting substrate has a rectangular structure, and the multiple light-emitting partitions DA are arranged along the length direction of the light-emitting substrate. Each light-emitting partition DA extends along the width direction of the light-emitting substrate, and the bonding region BA and the light-emitting region LA are arranged along the width direction of the light-emitting substrate.

[0085] The light-emitting substrate includes a substrate 10, and multiple light-emitting devices 22a and multiple driving chips 21 disposed on the substrate 10. Each light-emitting zone DA is provided with multiple light-emitting components 20. Each light-emitting component 20 includes a driving chip 21 and at least one lamp string 22 electrically connected to the driving chip 21. Each lamp string 22 includes multiple light-emitting devices 22a connected in series. Each light-emitting zone DA corresponds to a first voltage line V1 and a second voltage line V2. The first end of the lamp string 22 is electrically connected to the corresponding first voltage line V1, and the second end of the lamp string 22 is electrically connected to the first signal terminal of the driving chip 21. The second signal terminal of the driving chip 21 is electrically connected to the second voltage line V2. The first voltage line V1 is electrically connected to the first bonding electrode P1 of the bonding region BA and is used to provide a first voltage signal to the light-emitting component 20. The second voltage line V2 is electrically connected to the second bonding electrode P2 of the bonding region BA and is used to provide a second voltage signal to the light-emitting component 20. The voltage of the first voltage signal is greater than the voltage of the second voltage signal. For example, the first voltage signal is a high-level signal, and the second voltage signal is a low-level signal.

[0086] Furthermore, the driver chips 21 in a light-emitting zone DA are connected to form a chip group. Multiple driver chips 21 within the same chip group are arranged sequentially in the direction away from the bonding zone BA; that is, the driver chip 21 closest to the bonding zone BA is the first driver chip 21 in the chip group. Specifically, in each chip group, the data input terminal of the first driver chip 21 is electrically connected to the third bonding electrode P3 of the bonding zone BA via a third connection line L3, and the power input terminal of the first driver chip 21 is electrically connected to the fourth bonding electrode P4 of the bonding zone BA via a fourth connection line L4. In two adjacent driver chips 21, the data output terminal of the preceding driver chip 21 is electrically connected to the data input terminal of the following driver chip 21 via a fifth connection line L5, and the power output terminal of the preceding driver chip 21 is electrically connected to the power input terminal of the following driver chip 21 via a sixth connection line L6. The data output terminal of the last driver chip 21 in the chip group is connected to the bonding zone BA via a feedback line FB.

[0087] In Figure 1, the bonding area BA is used for electrical connection with the driver circuit board, thereby transmitting the signal provided by the driver circuit board to the light-emitting component 20. The width of the driver circuit board is typically within a certain range and will not be too large. Therefore, when the number of light-emitting zones DA is large, multiple driver circuit boards are needed to provide signals to multiple bonding areas BA. However, the design scheme of multiple bonding areas BA increases the number of driver circuit boards used, thereby increasing the cost of electronic components. Furthermore, it increases the bonding process time (i.e., the process of bonding the driver circuit board to the bonding area BA), reducing production efficiency.

[0088] Figure 2 is a schematic diagram of the region division of a light-emitting substrate provided in some embodiments of this disclosure. As shown in Figure 2, the light-emitting substrate has a light-emitting region LA and a bonding region BA located on at least one side of the light-emitting region LA. The light-emitting region LA and the bonding region BA are arranged along a first direction. The size of the light-emitting region LA in the first direction is larger than the size of the light-emitting region LA in the second direction. The first direction intersects the second direction. For example, the first direction is perpendicular to the second direction. The light-emitting region LA includes a plurality of light-emitting sub-regions DA arranged along the second direction.

[0089] Figure 3 shows a partial planar portion of the light-emitting substrate provided in the first embodiment of this disclosure. Figure 3 schematically illustrates a light-emitting component 20 in a light-emitting sub-region SA, and related structures that provide signals to the light-emitting component 20. As shown in Figures 2 and 3, the light-emitting substrate includes: a substrate 10, and a plurality of bonding electrodes, a plurality of light-emitting components 20, a plurality of first voltage lines V1, and a plurality of second voltage lines V2 disposed on the substrate 10.

[0090] In one example, substrate 10 can be a glass substrate, which has advantages such as good flatness, large product size, and good heat dissipation performance.

[0091] Multiple bonding electrodes are located in the bonding region BA, wherein the multiple bonding electrodes may include a first bonding electrode P1 and a second bonding electrode P2.

[0092] Each light-emitting zone DA is equipped with a light-emitting component 20, as shown in Figure 3. The light-emitting component 20 includes a driver chip 21 and at least one LED string 22 electrically connected to the driver chip 21. The LED string 22 includes multiple light-emitting devices 22a connected in series. The first electrode of the first light-emitting device 22a in the LED string 22 serves as the first terminal of the light-emitting component 20, thereby being electrically connected to the first voltage line V1. The second electrode of the last light-emitting device 22a in the LED string 22 is electrically connected to the first signal terminal 211 of the driver chip 21, and the second signal terminal 212 of the driver chip 21 serves as the second terminal of the light-emitting component 20, thereby being electrically connected to the second voltage line V2. For example, the first electrode of the light-emitting device 22a is the anode, and the second electrode is the cathode. The voltage of the first voltage signal is greater than the voltage of the second voltage signal. In one example, the light-emitting device 22a is a light-emitting diode, such as a MiniLED or MicroLED.

[0093] Each first voltage line V1 is electrically connected to the first bonding electrode P1 and the first end of the light-emitting component 20, and is used to provide a first voltage signal to the light-emitting component 20. Each second voltage line V2 is electrically connected to the second bonding electrode P2 and the second end of the light-emitting component 20, and is used to provide a second voltage signal to the light-emitting component 20. Specifically, the first end of the light-emitting component 20 in at least two light-emitting zones DA is electrically connected to the same first voltage line V1, and / or, the second end of the light-emitting component 20 in at least two light-emitting zones DA is electrically connected to the same second voltage line V2.

[0094] In this embodiment, the size of the light-emitting area LA in the first direction is larger than its size in the second direction. The bonding area BA and the light-emitting area LA are arranged along the first direction, that is, the bonding area BA is located at the corresponding position of the short side of the light-emitting area LA. Furthermore, multiple light-emitting sub-areas SA are arranged along the second direction, and the light-emitting sub-areas DA in the same light-emitting sub-area SA are also arranged along the second direction. Therefore, when the area of ​​the light-emitting area LA is fixed, the number of light-emitting sub-areas DA in this embodiment is less than the number of light-emitting sub-areas DA in FIG1, thereby reducing the number of signal lines and thus reducing the number of bonding electrodes. In addition, the first ends of the light-emitting components 20 of at least two light-emitting sub-areas DA are connected to the same first voltage line V1, or the second ends of the light-emitting components 20 of at least two light-emitting sub-areas DA are connected to the same second voltage line V2, or the first ends of the light-emitting components 20 of at least two light-emitting sub-areas DA are connected to the same first voltage line V1, and the second ends of the light-emitting components 20 of at least two light-emitting sub-areas DA are connected to the same second voltage line V2, thereby further reducing the number of signal lines and thus further reducing the number of bonding electrodes. Therefore, when the width of the driving circuit board is fixed, the number of bonding areas BA can be reduced, thereby reducing the cost of electronic components and improving production efficiency.

[0095] Figure 4 is a schematic diagram of the driver chip 21 provided in some embodiments of this disclosure. As shown in Figure 4, the driver chip 21 includes a first signal terminal 211, a second signal terminal 212, a data input terminal 213, a data output terminal 214, a power supply input terminal 215, and a power supply output terminal 216. It should be noted that when the light-emitting component 20 includes multiple light strings 22, the number of first terminals of the light-emitting component 20 can be multiple, with the first electrode of the first light-emitting device 22a in each light string 22 serving as one first terminal of the light-emitting component 20. When the light-emitting component 20 includes multiple light strings 22, the driver chip 21 has multiple first signal terminals 211, and different light strings 22 are electrically connected to different first signal terminals 211. The number of second signal terminals 212 of the driver chip 21 can be one or multiple.

[0096] In some embodiments, as shown in FIG3, the first electrode of the first light-emitting device 22a in the light string 22 is electrically connected to the first voltage line V1 through the first connecting line L1, and the second electrode of the last light-emitting device 22a in the light string 22 is electrically connected to the first signal terminal 211 of the driver chip 21. In two adjacent light-emitting devices 22a in the same light string 22, the second electrode of the previous light-emitting device 22a and the first electrode of the next light-emitting device 22a are electrically connected through a series trace L7.

[0097] The first connecting line L1 and the first voltage line V1 can be an integral structure. The first connecting line L1, the second connecting line L2, and the series trace L7 are located on the same layer to simplify the manufacturing process and reduce production costs.

[0098] In some embodiments, the light-emitting substrate further includes a third bonding electrode P3 and a fourth bonding electrode P4 located in the bonding region BA. Multiple driver chips 21 located in the same light-emitting partition DA are connected to form a chip group; in the chip group, the multiple driver chips 21 are arranged sequentially in a direction away from the third bonding electrode P3, with the data input terminal 213 of the first driver chip 21 electrically connected to the third bonding electrode P3, and the power supply input terminal 215 of the first driver chip 21 electrically connected to the fourth bonding electrode P4; in two adjacent driver chips 21, the data output terminal 214 of the preceding driver chip 21 is electrically connected to the data input terminal 213 of the following driver chip 21, and the power supply output terminal 216 of the preceding driver chip 21 is electrically connected to the power supply input terminal 215 of the following driver chip 21.

[0099] In some embodiments, each driver chip 21 has the same number of signal ports. In this case, in a chipset, the data output terminal 214 and power output terminal 216 of the last driver chip 21 are redundant ports and are in a floating state, no longer electrically connected to external signal lines.

[0100] For example, the data input terminal 213 of the first driver chip 21 is electrically connected to the third bonding electrode P3 via the third connection line L3, and the power supply input terminal 215 of the first driver chip 21 is electrically connected to the fourth bonding electrode P4 via the fourth connection line L4. In two adjacent driver chips 21, the data output terminal 214 of the preceding driver chip 21 is electrically connected to the data input terminal 213 of the following driver chip 21 via the fifth connection line L5, and the power supply output terminal 216 of the preceding driver chip 21 is electrically connected to the power supply input terminal 215 of the following driver chip 21 via the sixth connection line L6. The fourth bonding electrode P4 is used to provide a power supply signal to the driver chip 21 to ensure the normal operation of the drive signal 21. The voltage of the power supply signal is lower than the voltage of the first voltage signal.

[0101] The first connecting line L1, the second connecting line L2, the third connecting line L3, the fourth connecting line L4, the fifth connecting line L5, and the sixth connecting line L6 are arranged on the same layer to simplify the manufacturing process and reduce production costs.

[0102] In some embodiments, as shown in FIG3, each light-emitting sub-region SA includes a plurality of light-emitting partitions DA arranged along a second direction. This disclosure describes an embodiment where each light-emitting sub-region SA includes two light-emitting partitions DA as an example.

[0103] In some embodiments, as shown in FIG3, multiple light-emitting partitions DA in the light-emitting region LA constitute multiple light-emitting sub-regions SA. The multiple light-emitting sub-regions SA are arranged sequentially along a second direction, and each light-emitting sub-region SA includes at least two light-emitting partitions DA arranged sequentially along the second direction. In this embodiment of the disclosure, each light-emitting sub-region SA includes two light-emitting partitions DA as an example for illustration.

[0104] Each light-emitting sub-region SA corresponds to at least one first voltage line V1. Figure 3 illustrates the one-to-one correspondence between light-emitting sub-regions SA and first voltage lines V1. The first end of each light-emitting component 20 in the light-emitting sub-region SA is electrically connected to the corresponding first voltage line V1. Each light-emitting section DA corresponds to one second voltage line V2, and the second end of the light-emitting device 22a in each light-emitting section DA is electrically connected to the corresponding second voltage line V2. The last light-emitting section DA in the i-th light-emitting sub-region SA corresponds to the same second voltage line V2 as the first light-emitting section DA in the (i+1)-th light-emitting sub-region SA; i is a positive integer and less than the total number of light-emitting sub-regions SA. In other words, from the second light-emitting section DA to the second-to-last light-emitting section DA in the entire light-emitting region LA, the light-emitting devices 22a in every two light-emitting sections DA are electrically connected to the same second voltage line V2, thereby reducing the number of second voltage lines V2, which in turn reduces wiring space. Furthermore, it helps to reduce the number of bonding areas BA and driving circuit boards, thus lowering the cost of electronic components.

[0105] Each first voltage line V1 is located between two light-emitting sub-regions DA in the corresponding light-emitting sub-region SA. This makes it easier to connect the first voltage line V1 to the first bonding electrode P1 without having to wind the first voltage line V1. This helps to reduce the length of the first voltage line V1 and thus reduce the voltage drop on the first voltage line V1, thereby improving the problem of uneven brightness of the light-emitting device 22a at different locations due to voltage drop.

[0106] As shown in Figure 3, a second voltage line V2 is provided on both sides of the light-emitting sub-region SA along the second direction. When a light-emitting partition DA is provided on one side of the second voltage line V2, the second voltage line V2 is electrically connected to the light-emitting component 20 in the light-emitting partition DA on one side. When light-emitting partitions DA are provided on both sides of the second voltage line V2, the second voltage line V2 is electrically connected to the light-emitting component 20 in the light-emitting partitions DA on both sides. The second voltage line V2 includes a main line V21 and multiple branch lines V22. The first end of the main line V21 is electrically connected to the second bonding electrode P2, the first end of the branch line V22 is electrically connected to the second end of the light-emitting component 20 (i.e., the second signal terminal 212 of the driver chip 21), and the second end of the branch line V22 is electrically connected to the main line V21. At least a portion of the extension direction of the main line V21 intersects the extension direction of the branch line V22. For example, at least a portion of the main line V21 extends along the first direction, the branch line V22 extends along the second direction, and the multiple branch lines V22 are arranged along the first direction.

[0107] As described above, the light-emitting component 20 includes a driver chip 21 and at least one LED string 22 electrically connected to the driver chip 21. In this case, at least one LED string 22 is provided between two adjacent branch lines V22. For example, as shown in FIG3, the light-emitting component 20 includes an LED string 22, and each LED string 22 has branch lines V22 provided on opposite sides along a first direction. In this case, the second voltage line V2 can prevent the LED string 22 from being interfered with by surrounding static electricity.

[0108] Furthermore, as shown in Figure 3, the main lines V21 on both sides of the light-emitting sub-region SA are connected into a single structure, thereby forming a ring structure around the light-emitting sub-region SA with the second voltage line V2, which can play a role in electrostatic shielding without the need for an additional electrostatic protection ring, thus facilitating the achievement of a narrow bezel.

[0109] In some embodiments, the main line V21 includes a first conductor portion V211 and a second conductor portion V212. One end of the first conductor portion V211 is electrically connected to the second bonding electrode P2, and the other end is electrically connected to the second conductor portion V212. Multiple branch lines V22 are electrically connected to the second conductor portion V212, and the extension direction of the second conductor portion V212d intersects the extension direction of the branch lines V22. The first conductor portion V211 is closer to the bonding region BA than the second conductor portion V212. Typically, the temperature rise requirements for the bonding region BA and the light-emitting region DA are different. Specifically, under the same current, the temperature rise of the light-emitting region DA is required to be less than that of the bonding region BA. For example, the temperature rise of the light-emitting region DA is required to not exceed 10 degrees Celsius, and the temperature rise of the bonding region BA is required to not exceed 20 degrees Celsius. Therefore, in this embodiment, the width of the first conductor portion V211 is at least twice the width of the second conductor portion V212 to meet the temperature rise requirements of different regions.

[0110] The relationship between the temperature rise T on the signal line and the line width W and current I is as follows:

[0111] T=I / k / {[(D / 25.4)(W / 0.0254)]^0.75}^(1 / 0.44)

[0112] Where k is a constant, typically 0.045, and D is the signal line thickness. Since the first conductor section V211 is close to the bonding area BA, and the second conductor section V212 is close to the light-emitting area DA, in practical applications, the linewidths of the first conductor section V211 and the second conductor section V212 can be designed according to the current required by each light-emitting area DA and the actual temperature rise requirements.

[0113] In one example, the widths of branch line V22 and second conductor section V212 may be equal or substantially equal.

[0114] Figure 5 is a schematic diagram of a first voltage line V1 provided in some embodiments of this disclosure. As shown in Figure 5, the first voltage line V1 includes a plurality of line segments V11 connected sequentially along its extension direction. Among the plurality of line segments V11, the resistance per unit length of the line segment V11 located at the tail end of the first voltage line V1 is less than the resistance per unit length of the line segment V11 located at the head end of the first voltage line V1. The tail end of the first voltage line V1 is the end of the first voltage line V1 that is away from the first bonding electrode P1; the head end of the first voltage line V1 is the end of the first voltage line V1 that is away from the first bonding electrode P1. For example, the width of the line segment V11 at the head end of the first voltage line V1 is greater than the width of the line segment V11 at the head end of the first voltage line V1; and / or, the thickness of the line segment V11 at the head end of the first voltage line V1 is greater than the thickness of the line segment V11 at the head end of the first voltage line V1.

[0115] Since the first voltage line V1 has a certain resistance, a certain voltage drop will occur when the voltage is transmitted on the first voltage line V1. If the width and thickness of the first voltage line V1 are uniformly distributed, there will be a large voltage difference between the end and the beginning of the first voltage line V1. In this embodiment of the present disclosure, by increasing the width and / or thickness of the end of the first voltage line V1, it is beneficial to reduce the voltage difference between the end and the beginning of the first voltage line V1 and improve the brightness uniformity of each light-emitting component 20.

[0116] In a specific example, all segments V11 in the first voltage line V1 have the same thickness, and the width of the segment V11 at the tail end of the first voltage line V1 is at least 1.5 times the width of the segment V11 at the head end of the first voltage line V1. The width at different positions on the same segment V11 can be the same or different. In this embodiment, "width of segment V11" refers to the maximum width at all positions on the segment V11.

[0117] In a specific example, the thickness of each segment V11 in the first voltage line V1 is the same, and the width of each segment V11 gradually increases from the beginning to the end of the first voltage line V1.

[0118] Similarly, in this embodiment, the widths of the multiple first connection lines L1 connected to the same first voltage line V1 can also be different. In one example, the width of the first connection line L1 connected to the tail end of the first voltage line V1 is greater than the width of the first connection line L1 connected to the head end of the first voltage line V1, thereby reducing the voltage difference received by the light-emitting device 22a at the head end of the first voltage line V1 and the light-emitting device 22a at the tail end of the first voltage line V1. For example, the width of the first connection line L1 connected to the tail end of the first voltage line V1 is at least twice the width of the first connection line L1 connected to the head end of the first voltage line V1. In one example, the width of each first connection line L1 gradually increases from the head end to the tail end of the first voltage line V1.

[0119] In some embodiments, the width of the first voltage line V1 near the first bonding electrode P1 is greater than the width of the main line V21 near the second bonding electrode P2, and the width of the first voltage line V1 away from the first bonding electrode P1 is greater than the width of the main line V21 away from the second bonding electrode P2, thereby ensuring that the first voltage line V1 can withstand a larger voltage drop compared to the second voltage line V2.

[0120] In some embodiments, as shown in FIG3, the fifth connecting line L5 and the sixth connecting line L6 are both located between the lamp string 22 and the second voltage line V2. When the light-emitting sub-region SA includes two light-emitting sections DA, the first voltage line V1 is set between the two light-emitting sections DA in the corresponding light-emitting sub-region SA, and the second voltage line V2 is set on opposite sides of the light-emitting sub-region SA to supply power to the two light-emitting sections DA in the light-emitting sub-region SA. The fifth connecting line L5 and the sixth connecting line L6 used to connect two adjacent driver chips 21 are set between the lamp string 22 and the second voltage line V2. This wiring method allows all signal lines to be arranged on the same layer without the need for cross-line design, thereby reducing production costs.

[0121] In some embodiments, the distance between any one of the first connecting line L1, the second connecting line L2, the third connecting line L3, the fourth connecting line L4, the fifth connecting line L5, and the sixth connecting line L6 and the second voltage line V2 is greater than or equal to 0.1 mm to prevent signal crosstalk or coupling from occurring due to excessive proximity between the connecting lines and the second voltage line V2. Similarly, the distance between any one of the second connecting line L2, the third connecting line L3, the fourth connecting line L4, the fifth connecting line L5, and the sixth connecting line L6 and the first voltage line V1 is greater than or equal to 0.2 mm to prevent signal crosstalk or coupling from occurring due to excessive proximity between the connecting lines and the first voltage line V1.

[0122] In some embodiments, as shown in FIG3, the first binding electrode P1 and the second binding electrode P2 are located on opposite sides of the light-emitting region LA, and the third binding electrode P3 and the fourth binding electrode P4 are located on the same side of the light-emitting region LA as the first binding electrode P1. In this case, a redundant electrode DP is provided between any one of the third binding electrode P3 and the fourth binding electrode P4 and the first binding electrode P1, thereby avoiding signal interference from the first binding electrode P1 to the third binding electrode P3 and the fourth binding electrode P4. In other embodiments, the third binding electrode P3 and the fourth binding electrode P4 are located on the same side of the light-emitting region LA as the second binding electrode P2, and a redundant electrode DP can be provided between any one of the third binding electrode P3 and the fourth binding electrode P4 and the second binding electrode P2, thereby avoiding signal interference from the second binding electrode P2 to the third binding electrode P3 and the fourth binding electrode P4. In some other embodiments, the third binding electrode P3, the fourth binding electrode P4, the first binding electrode P1, and the second binding electrode P2 are all located on the same side of the light-emitting region LA. In this case, a redundant electrode DP is provided between any one of the third binding electrode P3 and the fourth binding electrode P4 and the first binding electrode P1, and a redundant electrode DP is provided between any one of the third binding electrode P3 and the fourth binding electrode P4 and the second binding electrode P2.

[0123] Figure 6 shows a partial planar portion of the light-emitting substrate provided in the second embodiment of this disclosure. Figure 6 schematically illustrates a light-emitting component 20 in a light-emitting sub-region SA, and related structures that provide signals to the light-emitting component 20. Figure 6 is similar to the embodiment shown in Figure 3, and the differences between the two will be described below.

[0124] In Figure 6, each light-emitting sub-region SA corresponds to two first voltage lines V1. The light-emitting sub-region SA is divided into two half-regions, and the light-emitting components 20 in the two half-regions are respectively connected to the two first voltage lines V1. The first bonding electrodes P1 connected to the two first voltage lines V1 are located on opposite sides of the light-emitting region LA. In the embodiment shown in Figure 6, the light-emitting components 20 in the light-emitting sub-region SA are powered from both sides of the light-emitting region LA, which reduces the current pressure on the first voltage lines V1, thereby meeting the demand for a larger current supply.

[0125] In one example, the number of light-emitting components 20 connected to the two first voltage lines V1 can be equal or substantially equal, so that the current pressure on the two first voltage lines V1 is more balanced.

[0126] In the embodiment shown in Figure 6, for one of the light-emitting sub-regions SA, the first bonding electrodes P1 connected to the two corresponding first voltage lines V1 are located on both sides of the light-emitting region LA. Part of the first bonding electrodes P1 and the second bonding electrode P2 are located on one side of the light-emitting region LA, while another part of the first bonding electrodes P1, the third bonding electrode P3, and the fourth bonding electrode P4 are located on the other side of the light-emitting region LA. In this case, a redundant electrode DP is provided between the second bonding electrode P2 and the first bonding electrode P1; a redundant electrode DP is also provided between any one of the third bonding electrode P3 and the fourth bonding electrode P4 and the first bonding electrode P1.

[0127] In the embodiment shown in Figure 6, each first voltage line V1 can also refer to the design method in Figure 5; the specific structure of the light-emitting component 20, the connection method between the second voltage line V2 and the light-emitting component 20, the shape and size of the second voltage line V2, the positional relationship between each signal line and the second voltage line V2, the distance between the signal lines, etc. in Figure 6 can all refer to the setting method in Figure 3, and will not be repeated here.

[0128] Figure 7 is a partial plan view of the light-emitting substrate provided in the third embodiment of this disclosure. Figure 7 illustrates the light-emitting components 20 in the two light-emitting sub-regions SA, and the related structures that provide signals to the light-emitting components 20. In Figure 7, the structure of the light-emitting component 20 is the same as that shown in the embodiment of Figure 3. The connection relationship between the light-emitting component 20 and the first voltage line V1 and the second voltage line V2, as well as the connection method between the light-emitting component 20 and the third bonding electrode P3 and the fourth bonding electrode P4, are the same as those shown in the embodiment of Figure 3, and will not be described again here.

[0129] In Figure 7, the first voltage line V1 can also adopt the design method shown in Figure 5 to reduce the voltage difference between the beginning and end of the first voltage line V1. In addition, the width relationship of the first connecting line L1 connected to the beginning and end of the first voltage line V1, the distance requirements between each signal line and the first voltage line V1 and the second voltage line V2, etc., can all refer to the description of Figure 3 above, and will not be repeated here. The following only explains the differences between Figure 7 and Figure 3.

[0130] As shown in Figure 7, the second voltage line V2 corresponds one-to-one with the light-emitting sub-region SA, and the second end of each light-emitting component 20 in the light-emitting sub-region SA is electrically connected to the corresponding second voltage line V2. Each light-emitting zone DA corresponds to a first voltage line V1, and the first end of the light-emitting component 20 in each light-emitting zone DA is electrically connected to the corresponding first voltage line V1, thereby reducing the number of second voltage lines V2.

[0131] In some embodiments, the last emitting partition DA in the i-th emitting sub-region SA corresponds to the same first voltage line V1 as the first emitting partition DA in the (i+1)-th emitting sub-region SA; i is a positive integer and less than the total number of emitting sub-regions SA, thereby reducing the number of first voltage lines V1.

[0132] In Figure 7, both the fifth connecting line L5 and the sixth connecting line L6 are located between the lamp string 22 and the second voltage line V2. When the position of the driver chip 21 in the light-emitting partition DA is fixed, placing the second voltage line V2 between the two light-emitting partitions DA of the light-emitting sub-region SA and placing the first voltage line V1 on opposite sides of the light-emitting sub-region SA can increase the distance between the fifth connecting line L5 and the first voltage line V1, as well as the distance between the sixth connecting line L6 and the first voltage line V1. Furthermore, it is beneficial to reduce the length of the fifth connecting line L5 and the sixth connecting line L6, thereby reducing the signal crosstalk between either the fifth connecting line L5 or the sixth connecting line L6 and the first voltage line V1.

[0133] In some examples, as shown in Figure 7, the first binding electrode P1 and the second binding electrode P2 can be distributed on opposite sides of the light-emitting area LA, while the third binding electrode P3 and the fourth binding electrode P4 are distributed on the same side of the light-emitting area LA. In this case, a redundant electrode DP is provided between either the third binding electrode P3 or the fourth binding electrode P4 and the second binding electrode P2 to reduce signal interference. It should be noted that in other examples, the first binding electrode P1 and the third binding electrode P3 and the fourth binding electrode P4 can be placed on one side of the light-emitting area LA, while the second binding electrode P2 is placed on the other side; or the first binding electrode P1, the second binding electrode P2, the third binding electrode P3, and the fourth binding electrode P4 can all be placed on the same side of the light-emitting area LA. Regardless of the arrangement, a redundant electrode DP can be provided between the first binding electrode P1 and other electrodes, and between the second binding electrode P2 and other electrodes.

[0134] In some examples, as shown in Figure 7, the light-emitting substrate further includes a fifth bonding electrode P5 and an electrostatic discharge (ESD) protection ring 40. The fifth bonding electrode P5 is located in the bonding area BA and is used to receive a reference voltage provided by the driving circuit board, for example, a ground voltage. The ESD protection ring 40 is electrically connected to the fifth bonding electrode P5 and surrounds the light-emitting area LA. Each first voltage line V1 and second voltage line V2 is located within the area surrounded by the ESD protection ring 40. The ESD protection ring 40 prevents interference from external static electricity from affecting the signal lines.

[0135] It should be noted that the electrostatic protection ring 40 in this disclosure can be a semi-closed structure. For example, as shown in Figure 7, the electrostatic protection ring 40 includes half-rings located on opposite sides of the light-emitting area, and the two ends of each half-ring are electrically connected to the fifth bonding electrode P5.

[0136] Figure 8 is a partial plan view of the light-emitting substrate provided in the fourth embodiment of this disclosure. Figure 8 illustrates the light-emitting components 20 in the two light-emitting sub-regions SA, and the related structures that provide signals to the light-emitting components 20. Figure 8 is similar to the embodiment shown in Figure 3, and the differences between the two will be described below.

[0137] As shown in Figure 8, a bonding area BA is set only on one side of the light-emitting area LA. The first bonding electrode P1, the second bonding electrode P2, the third bonding electrode P3, and the fourth bonding electrode P4 are located on the same side of the light-emitting area LA, which can reduce the number of driving circuit boards and reduce the cost of electronic components.

[0138] As shown in Figure 8, the branch line V22 furthest from the second bonding electrode P2 in the second voltage line V2 is the far-end branch line, and at least one light string 22 is provided on the side of the far-end branch line furthest from the second bonding electrode P2. For example, among the multiple light-emitting components 20 in the light-emitting zone DA, the light string 22 of the light-emitting component 20 furthest from the second bonding electrode P2 is located outside the second voltage line V2. In this case, in order to prevent the light string 22 from being affected by external static electricity, an electrostatic protection ring 40 can be provided. The electrostatic protection ring 40 is electrically connected to the fifth bonding electrode P5 in the bonding zone BA and surrounds the light-emitting zone LA. Each first voltage line V1, second voltage line V2, and light-emitting component 20 is located within the area surrounded by the electrostatic protection ring 40.

[0139] Furthermore, as shown in Figure 8, the length of the first voltage line V1 in the first direction is greater than the length of the second voltage line V2 in the first direction, so that the first voltage line V1 can provide a signal to the light-emitting component 20 that is furthest from the second bonding electrode P2.

[0140] In the embodiment shown in Figure 8, each first voltage line V1 can also refer to the design method in Figure 5; the specific structure of the light-emitting component 20, the connection method between the second voltage line V2 and the light-emitting component 20, the shape and size of the second voltage line V2, the positional relationship between each signal line and the second voltage line V2, the distance between the signal lines, etc. in Figure 8 can all refer to the setting method in Figure 8, and will not be described again here.

[0141] Figure 9 is a partial plan view of the light-emitting substrate provided in the fifth embodiment of this disclosure. Figure 9 illustrates the light-emitting components 20 in the two light-emitting sub-regions SA, and the related structures that provide signals to the light-emitting components 20. Figure 9 is similar to the embodiment shown in Figure 8, and only the differences between the two will be described below.

[0142] In the embodiment shown in Figure 9, the first end of the main line V21 is electrically connected to the second bonding electrode P2, and the second ends of the main line V21 on opposite sides of the light-emitting sub-region SA are electrically connected, forming a ring structure surrounding the light-emitting sub-region SA. The voltage on this ring structure is low, thus providing a certain electrostatic shielding effect to prevent interference from external static electricity to the light-emitting components 20. In Figure 9, since the ring structure formed by the second voltage line V2 can provide a certain electrostatic shielding effect, the electrostatic protection ring 40 shown in Figure 8 is not required, which is beneficial for the narrow bezel design.

[0143] Figure 10 is a partial plan view of the light-emitting substrate provided in the sixth embodiment of this disclosure. Figure 10 illustrates the light-emitting component 20 in a light-emitting sub-region SA, and the related structures that provide signals to the light-emitting component 20. Figure 10 is similar to the embodiment shown in Figure 9; the differences between the two will be described below.

[0144] In the embodiment shown in Figure 10, the light-emitting substrate further includes a first electrostatic discharge (ESD) shielding line 51 and a second ESD shielding line 52. One end of the first ESD shielding line 51 is electrically connected to the second voltage line V2, and the other end is electrically connected to the fifth bonding electrode P5 located in the bonding region BA. One end of the second ESD shielding line 52 is electrically connected to the second voltage line V2, and the other end is electrically connected to the fifth bonding electrode P5. The first ESD shielding line 51 and the second ESD shielding line 52 are respectively electrically connected to the second voltage line V2 located on both sides of the light-emitting region.

[0145] The fifth bonding electrode P5 is used to receive a reference voltage provided by the driving circuit board, for example, a ground voltage. By electrically connecting the second voltage lines V2 on both sides of the light-emitting area to the fifth bonding electrode P5, the voltage of the ring structure can be reduced, thereby improving the electrostatic shielding effect of the ring structure.

[0146] It should be noted that, in the various embodiments of this disclosure, the number of bonding electrodes connected to each signal line is not limited. For example, each first voltage line V1 can be connected to one first bonding electrode P1, each second voltage line V2 can be connected to one second bonding electrode P2, each third connection line L3 can be connected to one third bonding electrode P3, and each fourth connection line L4 can be connected to one fourth bonding electrode P4. Alternatively, at least one signal line can be connected to multiple bonding electrodes.

[0147] Figure 11 is a partial plan view of the light-emitting substrate provided in some embodiments of this disclosure. Figure 11 illustrates the light-emitting component 20 in a light-emitting sub-region SA, and the related structures that provide signals to the light-emitting component 20. Figure 12 is an enlarged view of region A in Figure 11. Figure 13 is a schematic diagram of the connection between the driving chip at position B in Figure 12 and each signal line. Figure 14 is a schematic diagram of the connection between the driving chip at position C in Figure 12 and each signal line. Figure 15 is a schematic diagram of the connection between the bonding area and each signal line in Figure 12. Figure 11 is similar to the embodiment shown in Figure 8. The differences between the two will only be described below.

[0148] In some examples, as shown in Figures 11, 12, and 15, the main line V21 includes a first conductor portion V211 and a second conductor portion V212, as well as a third conductor portion V213. The third conductor portion V213 connects the first conductor portion V211 and the second bonding electrode P2; that is, the first conductor portion V211 is indirectly connected to the second bonding electrode P2 through the third conductor portion V213. The first conductor portion V211 and its corresponding bonding region BA (i.e., the bonding region BA where the second bonding electrode P2 is connected to the first conductor portion V211) are arranged along a second direction. The third conductor portion V213 is located on the side of the bonding region BA facing the photon region SA, and its width is smaller than that of the first conductor portion V211. The widths of the first conductor portion V211 and the third conductor portion V213 refer to their respective dimensions in the first direction. By setting a narrower third conductor portion V213 and placing the third conductor portion V213 on the side of the bonding area BA close to the light-emitting sub-area SA, and placing the first conductor portion V211 on the side of the bonding area BA along the second direction, the wiring can be made more compact, thereby saving wiring space.

[0149] In one example, there may be a certain gap between the third conductor portion V213 and the second bonding electrode P2, and the third conductor portion V213 may be electrically connected to the second bonding electrode P2 through conductive traces.

[0150] In some examples, as shown in Figures 11 to 14, each light-emitting component 20 includes a driver chip 21 and multiple light strings 22, with the driver chip 21 electrically connected to the multiple light strings 22. The multiple light strings 22 connected to the same driver chip 21 are distributed on opposite sides of the extension line of the branch line V22. Furthermore, the multiple light strings 22 connected to the same driver chip 21 are distributed on opposite sides of a first reference line W1, which is a straight line passing through the driver chip 21 and extending along a first direction.

[0151] In this configuration, the multiple LED strings 22 connected to each driver chip 21 are mirror-symmetrical about the extension line of the branch line V22, and the multiple LED strings 22 connected to each driver chip 21 are mirror-symmetrical about the first reference line W1, which helps to improve the uniformity of light output from the light-emitting device.

[0152] For example, in the example shown in Figure 11, the light-emitting component 20 includes eight light strings 22, each light string 22 including four light-emitting devices 22a. As shown in Figure 11, the eight light strings 22 are arranged in four rows and two columns, with the driver chip 21 approximately located at the center of the eight light strings 22. The four light-emitting devices 22a in each light string 22 are arranged in two rows and two columns. In each light string 22, the first electrode of the first light-emitting device 22a is electrically connected to the first voltage line V1 through a first connecting line L1, at least a portion of which extends along a second direction; the second electrode of the last light-emitting device 22a in the light string 22 is electrically connected to the first signal terminal 211 of the driver chip 21 through a second connecting line L2, a portion of which extends along a first direction and another portion along a second direction.

[0153] In some examples, referring to Figures 11 to 14, the light-emitting component 20 includes multiple light strings 22, each light string 22 being electrically connected to a first voltage line V1 via a first connecting line L1. Furthermore, the multiple first connecting lines L1 connecting the multiple light strings 22 of the same light-emitting component 20 are arranged along a first direction and distributed on opposite sides of the light-emitting component 20, thereby facilitating the connection of the first connecting lines L1 to their respective corresponding light strings 22. For example, the multiple first connecting lines L1 connected to the same light-emitting component 20 are evenly distributed on opposite sides of the light-emitting component 20. Further, the multiple first connecting lines L1 connected to the same light-emitting component 20 and distributed on opposite sides of the light-emitting component 20 can be symmetrically arranged about the branch line V22.

[0154] In some examples, as shown in Figures 11 to 14, the branch line V22 furthest from the second bonding electrode P2 in the second voltage line V2 is the distal branch line, and at least one LED string 22 is provided on the side of the distal branch line furthest from the second bonding electrode P2. For example, in each light-emitting zone DA, in the light-emitting component 20 furthest from the second bonding electrode P2, a portion of the LED strings 22 are located outside the second voltage line V2. In this case, to ensure that all light-emitting components 20 are not affected by electrostatic discharge, an electrostatic discharge protection ring 40 can be set around the light-emitting zone LA. The specific setting method is described in Figure 8. Alternatively, the second voltage lines V2 on both sides of the light-emitting zone LA can be electrically connected together, which will not be elaborated here.

[0155] When a string of lights 22 is provided on the side of the distal branch line away from the second binding electrode P2, as shown in Figure 11, the length of the first voltage line V1 in the first direction is greater than the length of the second voltage line V2 in the first direction, so that the string of lights 22 on the side of the distal branch line away from the second binding electrode P1 can be electrically connected to the first voltage line V1.

[0156] In some examples, as shown in Figures 11 to 15, a first voltage line V1 is electrically connected to multiple first bonding electrodes P1, a second voltage line V2 is electrically connected to multiple second bonding electrodes P2, a third connecting line L3 is electrically connected to a third bonding electrode P3, and a fourth connecting line L4 is electrically connected to multiple fourth bonding electrodes P4. Specifically, for the bonding electrodes corresponding to the same photonic region SA, multiple second bonding electrodes P2 are provided on both sides of the multiple first bonding electrodes P1 connected to the first voltage line V1 along the second direction. The third bonding electrode P3 and the fourth bonding electrode P4 are located between the first bonding electrode P1 and the second bonding electrode P2. A redundant electrode DP is provided between either the third bonding electrode P3 or the fourth bonding electrode P4 and the first bonding electrode P1, and a redundant electrode DP is also provided between either the third bonding electrode P3 or the fourth bonding electrode P4 and the second bonding electrode P2.

[0157] In some embodiments, a first marking electrode DP1 and a second marking electrode DP2 are respectively disposed at the two edges of the bonding area BA arranged along the second direction. Since alignment marks are typically provided at the edges of the bonding area BA, the first marking electrode DP1 and the second marking electrode DP2 adjacent to the alignment marks are not connected to signal lines to prevent interference with the alignment process. Furthermore, after the drive circuit board is bonded to the bonding area BA, the bonding quality between the drive circuit board and other bonding electrodes can be determined by detecting the connection status of the first marking electrode DP1, the second marking electrode DP2, and the conductive adhesive. The conductive adhesive is the bonding adhesive used to connect the drive circuit board and the bonding area BA during the bonding process.

[0158] This disclosure also provides a backlight module, including the light-emitting substrate described in the above embodiments.

[0159] In some embodiments, the backlight module further includes multiple optical films located on the light-emitting side of the light-emitting substrate. These optical films may include diffusers, prism sheets, etc. A support pillar may be disposed between the light-emitting substrate and the diffuser to support the optical films and provide a certain light mixing distance. The orthographic projection of the support pillar onto the substrate does not overlap with the orthographic projections of any of the light-emitting devices, driver chips, or signal lines onto the substrate.

[0160] This disclosure also provides a display device, including the backlight module described above, and a display panel located on the light-emitting side of the backlight module.

[0161] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A light-emitting substrate having a light-emitting region and a bonding region located on at least one side of the light-emitting region, the light-emitting region and the bonding region being arranged along a first direction, the size of the light-emitting region in the first direction being larger than the size of the light-emitting region in a second direction, the first direction intersecting the second direction; The light-emitting area includes a plurality of light-emitting partitions arranged along the second direction; The light-emitting substrate includes: Substrate; A first bonding electrode and a second bonding electrode are disposed on the substrate, wherein the first bonding electrode and the second bonding electrode are located in the bonding region; Multiple light-emitting components are disposed in each of the light-emitting zones; each light-emitting component includes: a driver chip and at least one light string electrically connected to the driver chip; each light string includes multiple light-emitting devices connected in series, the first electrode of the first light-emitting device in the light string serves as the first end of the light-emitting component, the second electrode of the last light-emitting device in the light string is electrically connected to the first signal terminal of the driver chip, and the second signal terminal of the driver chip serves as the second end of the light-emitting component; Multiple first voltage lines and multiple second voltage lines are provided. The first voltage lines are electrically connected to the first bonding electrode and the first end of the light-emitting component, and the second voltage lines are electrically connected to the second bonding electrode and the second end of the light-emitting component. Wherein, the first end of the light-emitting component in at least two of the light-emitting zones is electrically connected to the same first voltage line; and / or, the second end of the light-emitting component in at least two of the light-emitting zones is electrically connected to the same second voltage line.

2. The light-emitting substrate according to claim 1, wherein The light-emitting substrate further includes a third bonding electrode and a fourth bonding electrode located in the bonding region; Multiple driver chips located in the same light-emitting zone are connected to form a chipset; In the chipset, multiple driver chips are arranged sequentially along a direction away from the third bonding electrode, and the data input terminal of the first driver chip is electrically connected to the third bonding electrode. The power supply input terminal of the first driver chip is electrically connected to the fourth bonding electrode; in two adjacent driver chips, the data output terminal of the preceding driver chip is electrically connected to the data input terminal of the following driver chip, and the power supply output terminal of the preceding driver chip is electrically connected to the power supply input terminal of the following driver chip.

3. The light-emitting substrate of claim 2, wherein, In the chipset, the data output terminal and power output terminal of the last driver chip are both in a floating state.

4. The light-emitting substrate of claim 2, wherein, The third bonding electrode, the fourth bonding electrode and the first bonding electrode are located on the same side of the light-emitting area, and a redundant electrode is provided between the third bonding electrode and the fourth bonding electrode and the first bonding electrode; And / or, The third binding electrode, the fourth binding electrode and the second binding electrode are located on the same side of the light-emitting area, and a redundant electrode is provided between the third binding electrode, the fourth binding electrode and the second binding electrode.

5. The light-emitting substrate of claim 2, wherein, The light string is electrically connected to the first voltage line via a first connecting line, and electrically connected to the first signal terminal of the driver chip via a second connecting line; In the chipset, the data input terminal of the first driver chip is electrically connected to the third bonding electrode via a third connection line, and the power input terminal of the first driver chip is electrically connected to the fourth bonding electrode via a fourth connection line; in two adjacent driver chips, the data output terminal of the preceding driver chip is electrically connected to the data input terminal of the following driver chip via a fifth connection line, and the power output terminal of the preceding driver chip is electrically connected to the power input terminal of the following driver chip via a sixth connection line; The first connecting line, the second connecting line, the third connecting line, the fourth connecting line, the fifth connecting line, and the sixth connecting line are arranged on the same layer.

6. The light-emitting substrate of claim 5, wherein, The first voltage line is used to provide a first voltage signal to the light-emitting component, the second voltage line is used to provide a second voltage signal to the light-emitting component, and the fourth bonding electrode is used to provide a power supply signal to the driving chip. The voltage of the power supply signal and the voltage of the second voltage signal are both less than the voltage of the first voltage signal.

7. The light-emitting substrate of claim 2, wherein, For two adjacent driver chips in the chipset, the data output terminal of the preceding driver chip is electrically connected to the data input terminal of the following driver chip through the fifth connection line, and the power supply output terminal of the preceding driver chip is electrically connected to the power supply input terminal of the following driver chip through the sixth connection line. Both the fifth and sixth connecting lines are located between the light string and the second voltage line.

8. The light-emitting substrate according to any one of claims 1 to 7, wherein The multiple light-emitting zones in the light-emitting area constitute multiple light-emitting sub-regions, and each light-emitting sub-region includes at least two light-emitting zones arranged sequentially along the second direction; Each of the light-emitting sub-regions corresponds to at least one first voltage line, and the first end of each light-emitting component in the light-emitting sub-region is electrically connected to the corresponding first voltage line; Each of the light-emitting zones corresponds to a second voltage line, and the second end of the light-emitting device in each of the light-emitting zones is electrically connected to the corresponding second voltage line; wherein, the last light-emitting zone in the i-th light-emitting sub-region corresponds to the same second voltage line as the first light-emitting zone in the (i+1)-th light-emitting sub-region; i is a positive integer and is less than the total number of light-emitting sub-regions.

9. The light-emitting substrate according to claim 7 or 8, wherein The first voltage line is located between two of the light-emitting sub-regions in the corresponding light-emitting sub-region; the second voltage line is provided on both sides of the light-emitting sub-region along the second direction; The second voltage line includes a main line and multiple branch lines; a first end of the main line is electrically connected to the second bonding electrode, a first end of the branch line is electrically connected to the second end of the light-emitting component, and a second end of the branch line is electrically connected to the main line; at least a portion of the extension direction of the main line intersects with the extension direction of the branch lines.

10. The light-emitting substrate of claim 9, wherein, The main line includes a first conductor section and a second conductor section. One end of the first conductor section is electrically connected to the second bonding electrode, and the other end is electrically connected to the second conductor section. The plurality of branch lines are electrically connected to the second conductor section. The extension direction of the second conductor section intersects with the extension direction of the branch lines. The width of the first conductor portion is at least twice the width of the second conductor portion.

11. The light-emitting substrate of claim 10, wherein, The first conductor portion and the corresponding bonding area are arranged along the second direction. The main line also includes a third conductor portion, which is connected between the first conductor portion and the second bonding electrode and is located on the side of the bonding area facing the light-emitting sub-region. The width of the third conductor portion is smaller than the width of the first conductor portion.

12. The light emitting substrate of claim 9, wherein, in, The width of the first voltage line near the first bonding electrode is greater than the width of the main line near the second bonding electrode; The width of the end of the first voltage line away from the first bonding electrode is greater than the width of the end of the main line away from the second bonding electrode.

13. The light-emitting substrate according to claim 9, wherein, At least a portion of the main line extends along the first direction, the branch lines extend along the second direction, the plurality of branch lines are arranged along the first direction, and at least one string of lights is provided between two adjacent branch lines.

14. The light emitting substrate of claim 9, wherein, The branch line furthest from the second bonding electrode in the second voltage line is the far-end branch line, and at least one string of lights is provided on the side of the far-end branch line furthest from the second bonding electrode.

15. The light-emitting substrate of claim 14, wherein, The length of the first voltage line in the first direction is greater than the length of the second voltage line in the first direction.

16. The light emitting substrate of claim 9, wherein, Each of the driver chips is electrically connected to a plurality of the light strings, and the plurality of light strings connected to the same driver chip are distributed on opposite sides of the branch line extension line; and the plurality of light strings connected to the same driver chip are distributed on opposite sides of a first reference line, the first reference line being a straight line passing through the driver chip and extending along the first direction.

17. The light-emitting substrate of claim 16, wherein, The multiple LED strings connected to each of the driver chips are mirror-symmetrical about the extension lines of the branch lines, and the multiple LED strings connected to each of the driver chips are mirror-symmetrical about the first reference line.

18. The light emitting substrate of claim 9, wherein, The second ends of the main lines located on opposite sides of the light-emitting area are electrically connected to form a ring structure surrounding the light-emitting area.

19. The light-emitting substrate of claim 18, wherein, The light-emitting substrate further includes: Multiple fifth bonding electrodes located in the bonding region; The first electrostatic protection wire and the second electrostatic protection wire are respectively electrically connected at one end to their respective fifth binding electrodes, and the other ends of the first electrostatic protection wire and the second electrostatic protection wire are respectively electrically connected to the main lines on opposite sides of the light-emitting area.

20. The light emitting substrate of claim 9, wherein, The light-emitting substrate further includes: The fifth bonding electrode located in the bonding region; An electrostatic protection ring is electrically connected to the fifth bonding electrode and surrounds the light-emitting area; each of the first voltage lines and each of the second voltage lines are located within the area surrounded by the electrostatic protection ring.

21. The light emitting substrate of claim 8, wherein, The light-emitting component includes a plurality of light strings, each of which is electrically connected to the first voltage line via a first connecting line; Multiple first connecting lines connected to the same light-emitting component are arranged along the first direction and distributed on opposite sides of the light-emitting component.

22. The light-emitting substrate of claim 8, wherein, Each of the light-emitting sub-regions corresponds one-to-one with the first voltage line. The first bonding electrode and the second bonding electrode are located on opposite sides of the light-emitting area; Alternatively, the first bonding electrode and the first bonding electrode are located on the same side of the light-emitting area.

23. The light emitting substrate of claim 8, wherein, Each of the light-emitting sub-regions corresponds to two first voltage lines, and the first binding electrodes connected to the two first voltage lines corresponding to the same light-emitting sub-region are respectively located on opposite sides of the light-emitting region.

24. The light-emitting substrate of any one of claims 1-7, wherein, The multiple light-emitting zones in the light-emitting area constitute multiple light-emitting sub-regions, and each light-emitting sub-region includes at least two light-emitting zones arranged sequentially along the second direction; The second voltage line corresponds one-to-one with the light-emitting sub-region, and the second end of each light-emitting component in the light-emitting sub-region is electrically connected to the corresponding second voltage line; Each of the light-emitting zones corresponds to one of the first voltage lines, and the first end of the light-emitting component in each of the light-emitting zones is electrically connected to the corresponding first voltage line.

25. The light-emitting substrate of claim 24, wherein, The light-emitting substrate further includes: The fifth and sixth bonding electrodes are located in the bonding region; An electrostatic protective ring surrounds the light-emitting area, one end of which is electrically connected to the fifth bonding electrode, and the other end of which is electrically connected to the sixth bonding electrode; Both the first voltage line and the second voltage line are located within the area enclosed by the electrostatic protection ring.

26. The light-emitting substrate of any one of claims 1-7, wherein, The first voltage line includes a plurality of segments connected sequentially along its extension direction, wherein the segment furthest from the first bonding electrode has a resistance per unit length that is less than the segment closest to the first bonding electrode.

27. A backlight module comprising a light-emitting substrate as described in any one of claims 1 to 26.

28. A display device comprising the backlight module of claim 27.

Images