Detection assembly, electronic device and control method therefor

Abstract

Embodiments of the present application relate to the field of electronics, and provide a detection assembly, an electronic device and a control method therefor, for use in improving the anti-spoofing capability of pattern recognition. In the detection assembly, an ultrasonic pattern acquisition module is integrated with a conductive layer serving as a bioelectrode, enabling the detection assembly to have both a biometric signal acquisition function and a bioelectrical signal acquisition function. By using both a bioelectrical signal and a biometric signal to determine whether to perform fingerprint unlocking, the anti-spoofing capability of pattern recognition is improved.

Description

Detection components, electronic devices and their control methods

[0001] This application claims priority to Chinese Patent Application No. 202411458928.4, filed on October 17, 2024, entitled "Detection Component, Electronic Device and Control Method Thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronics, and more particularly to a detection component, electronic device and control method thereof. Background Technology

[0003] Biometric technology has been widely used in people's daily lives. Among them, human fingerprint information has become one of the mainstream identity recognition technologies in consumer electronics, smart homes, security and other fields due to its uniqueness, difficulty in obtaining and ease of use.

[0004] The anti-counterfeiting capability of a fingerprint module is a crucial parameter for ensuring the security of identity verification. However, current research in this field primarily focuses on optimizing the performance structure of fingerprint modules to improve fingerprint unlocking performance, with less emphasis on their anti-counterfeiting capabilities. Summary of the Invention

[0005] This application provides a detection component, electronic device, and control method thereof to improve the anti-counterfeiting capability of texture recognition.

[0006] A first aspect of this application provides a detection component, such as a detection component that combines biometric information acquisition and bioelectrical signal acquisition functions. The detection component includes an ultrasonic ripple acquisition module, a conductive layer, and a bioelectrical signal acquisition module. The ultrasonic ripple acquisition module is used to generate biometric information, and the conductive layer is stacked on one side of the ultrasonic ripple acquisition module and connected to it. The bioelectrical signal acquisition module is coupled to the conductive layer and is used to acquire signals from the conductive layer.

[0007] The detection component provided in this application integrates an ultrasonic pattern acquisition module and a conductive layer serving as a bioelectrode, enabling a single detection component to acquire both biometric and bioelectrical signals. This dual protection of bioelectrical and biometric signals determines whether fingerprint unlocking is required, enhancing the anti-counterfeiting capabilities of pattern recognition. Furthermore, applying this multifunctional detection component to electronic devices increases the integration level and reduces hardware implementation costs.

[0008] In one possible implementation, the thickness of the conductive layer is 0.35n*λ to 0.65n*λ, where λ is the wavelength of the conductive layer and n is a positive integer. By limiting the thickness of the conductive layer, the influence of the conductive layer on the ultrasonic signal in the ultrasonic texture acquisition module can be reduced, thereby improving the accuracy of texture acquisition.

[0009] In one possible implementation, the detection component further includes a connecting layer disposed between the ultrasonic pattern acquisition module and the conductive layer, connecting to both the ultrasonic pattern acquisition module and the conductive layer respectively. By providing the connecting layer, the connection between the ultrasonic pattern acquisition module and the conductive layer is facilitated, and the transmission of ultrasonic waves is also aided.

[0010] In one possible implementation, the ultrasonic texture acquisition module includes a substrate and a first electrode layer, a piezoelectric layer, and a second electrode layer sequentially stacked on the substrate; a connecting layer is disposed between the conductive layer and the substrate. This allows the substrate to be directly connected to the conductive layer, improving connection flatness and facilitating ultrasonic wave propagation.

[0011] In one possible implementation, the acoustic impedance of the connecting layer is 0.7 Z to 1.3 Z. Where Z1 is the acoustic impedance of the conductive layer, and Z2 is the acoustic impedance of the substrate connected to the connecting layer. By limiting the acoustic impedance range of the connecting layer, the connecting layer has excellent acoustic impedance matching characteristics, thereby improving the transmission effect of ultrasonic waves.

[0012] In one possible implementation, the ultrasonic texture acquisition module includes a substrate and a first electrode layer, a piezoelectric layer, and a second electrode layer sequentially stacked on the substrate; a connecting layer is disposed between the conductive layer and the second electrode layer. In this way, ultrasonic waves do not need to pass through the substrate, which can improve the ultrasonic signal strength.

[0013] In one possible implementation, the acoustic impedance of the connecting layer is 0.7 Z to 1.3 Z. Where Z1 is the acoustic impedance of the conductive layer, and Z2 is the acoustic impedance of the second electrode layer connected to the connecting layer.

[0014] In one possible implementation, the ultrasonic texture acquisition module further includes an ultrasonic texture processing module coupled to the first electrode layer; both the conductive layer and the first electrode layer are coupled to the substrate, and both the ultrasonic texture processing module and the bioelectric signal acquisition module are disposed on the substrate. This is a structurally simple implementation.

[0015] In one possible implementation, the detection component further includes a flexible circuit board. The first electrode layer is coupled to the flexible circuit board via a substrate, and the conductive layer is also coupled to the flexible circuit board. Both the ultrasonic texture processing module and the bioelectric signal acquisition module are mounted on the flexible circuit board. This is a structurally simple implementation.

[0016] In one possible implementation, the ultrasonic fingerprint processing module and the bioelectrical signal acquisition module are integrated into the same integrated circuit. This integration facilitates the reuse of some circuitry (e.g., storage components, amplifiers, filters) between the ultrasonic fingerprint processing module and the bioelectrical signal acquisition module, resulting in a more synchronized signal path between the bioelectrical signals and biometric information, thus improving the response speed of fingerprint recognition. Furthermore, this partial circuit reuse can save on the area and cost of the circuitry in the detection component.

[0017] A second aspect of this application provides an electronic device, comprising: a processor and a detection component according to any one of the first aspects, wherein the detection component is coupled to the processor. The electronic device provided in the second aspect of this application includes the detection component of the first aspect, and its beneficial effects are the same as those of the detection component, and will not be repeated here.

[0018] In one possible implementation, the electronic device further includes a frame; the frame includes an opening; the opening exposes the conductive layer of the detection component. This allows for assembly of the detection component and the frame, reducing the material requirements for the frame.

[0019] In one possible implementation, the electronic device further includes a frame; the frame includes a first conductive portion stacked with the ultrasonic texture acquisition module, the first conductive portion serving as a conductive layer of the detection component. In this way, a portion of the frame structure can be reused as a conductive layer in the detection component, reducing the component structure.

[0020] In one possible implementation, the electronic device further includes a back cover, which includes a second conductive portion stacked with the ultrasonic pattern acquisition module. This second conductive portion serves as a conductive layer for the detection component. This is a structurally simple implementation. In this way, part of the back cover structure can be reused as a conductive layer in the detection component, reducing the component structure.

[0021] A third aspect of this application provides a control method for an electronic device, the electronic device including an ultrasonic texture acquisition module, a conductive layer, and a bioelectric signal acquisition module; the control method includes: the bioelectric signal acquisition module acquiring signals from the conductive layer to generate bioelectric signals; the ultrasonic texture acquisition module generating biometric information; and generating an unlock command when both the biometric information and the bioelectric signal are successfully authenticated.

[0022] The control method for the electronic device provided in the application embodiment generates an unlock command only when both biometric information and bioelectrical signals are successfully authenticated. If the bioelectrical signal authentication fails, no unlock command is generated, and the electronic device will not attempt to unlock. This enables liveness detection and reduces the risk of unlocking electronic devices directly using fingerprints or other fingerprint patterns. Furthermore, since ultrasound is transmitted as a pressure signal within the layers, while bioelectrical signals are electrical signals, both signals can be acquired simultaneously, ensuring that the final unlocking time remains within an acceptable range.

[0023] In one possible implementation, the bioelectric signal acquisition module acquires signals from the conductive layer to generate a bioelectric signal, including: the bioelectric signal acquisition module receiving a first instruction, acquiring signals from the conductive layer, and generating a bioelectric signal lasting for a first duration; or, the bioelectric signal acquisition module receiving a second instruction, acquiring signals from the conductive layer, and generating a bioelectric signal lasting for a second duration; wherein the first duration is longer than the second duration. Depending on the application scenario, the electronic device can acquire bioelectric signals of different durations to meet different requirements such as response speed or unlocking reliability.

[0024] In one possible implementation, the first duration is greater than or equal to the period length of the bioelectrical signal, and the second duration is less than the period length of the bioelectrical signal. This is an easy-to-implement approach. Attached Figure Description

[0025] Figure 1A is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0026] Figure 1B is a schematic diagram of an application scenario of an electronic device provided in an embodiment of this application;

[0027] Figures 2A and 2B are schematic diagrams illustrating a fingerprint recognition method according to an embodiment of this application;

[0028] Figure 2C is a schematic diagram of the structure of an ultrasonic fingerprint detection component according to an embodiment of this application;

[0029] Figure 3 is a schematic diagram of a detection component provided in an embodiment of this application;

[0030] Figures 4 and 5 are schematic diagrams of another detection component provided in the embodiments of this application;

[0031] Figure 6 is a schematic diagram of another detection component provided in an embodiment of this application;

[0032] Figure 7 is a schematic diagram of another detection component provided in an embodiment of this application;

[0033] Figure 8 is a schematic diagram of a border component provided in an embodiment of this application;

[0034] Figure 9 is a schematic diagram of another border component provided in an embodiment of this application;

[0035] Figure 10 is a rear view schematic diagram of an electronic device provided in an embodiment of this application;

[0036] Figure 11 is a rear view schematic diagram of another electronic device provided in an embodiment of this application;

[0037] Figure 12 is a flowchart of a control method for an electronic device provided in an embodiment of this application;

[0038] Figure 13 is a waveform diagram of an ECG signal provided in an embodiment of this application;

[0039] Figure 14 is a flowchart of another control method for an electronic device provided in an embodiment of this application. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0041] Hereinafter, the terms "second," "first," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "second," "first," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0042] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" may be defined relative to the orientation in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly based on the orientation of the components in the accompanying drawings.

[0043] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be direct contact or indirect contact through an intermediate medium.

[0044] In this embodiment of the application, "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following associated objects have an "or" relationship.

[0045] This application provides an electronic device with sensing and detection capabilities for objects being pressed. For example, it can detect fingerprints, palm prints, or handprints. This electronic device can be, for example, a portable or mobile device such as a consumer electronics product, home electronics product, or in-vehicle electronics product with biometric detection capabilities. Consumer electronics products include terminal devices, mobile phones, tablets, laptops, desktop computers, e-readers, personal computers (PCs), personal digital assistants (PDAs), gaming devices, desktop monitors, smart wearable products (e.g., smartwatches, smart glasses, smart bracelets, smart jewelry), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, electronic databases, automobiles, bank ATMs, and bank cards with fingerprint unlocking capabilities. Home electronics products include smart door locks, televisions, remote controls, refrigerators, and rechargeable small household appliances (e.g., soymilk makers, robot vacuum cleaners). In-vehicle electronic products include in-vehicle navigation systems and in-vehicle high-density digital video discs (DVDs). The electronic device can be one with a display function or one without; this application does not limit the specific type of electronic device.

[0046] This application does not impose any special restrictions on the specific form of the above-mentioned electronic device. For the sake of convenience, the following embodiments all use mobile phones as an example for illustration.

[0047] Figure 1A is a structural schematic diagram of an electronic device provided in an embodiment of this application, and Figure 1B is a schematic diagram of an application scenario of an electronic device provided in an embodiment of this application.

[0048] Figure 1A is a schematic diagram of an electronic device 10 according to an embodiment of this application. As shown in Figure 1A, the electronic device 10 mainly includes a cover plate 11, a touch display screen 12, a frame 13, and a back cover 14. The back cover 14 and the touch display screen 12 are located on both sides of the frame 13, and the frame 13 and the touch display screen 12 are disposed inside the back cover 14. The cover plate 11 is disposed on the side of the touch display screen 12 away from the frame 13, and the display surface of the touch display screen 12 faces the cover plate 11.

[0049] For example, the touch display screen 12 can be a low-temperature poly-silicon (LTPS) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a low-temperature polycrystalline oxide (LTPO) display screen, a liquid crystal display (LCD), or a micro light-emitting diode (micro LED) display screen. Of course, this application embodiment does not limit the type of touch display screen 12; any display screen with touch display function is applicable to this application embodiment, and the above example is merely illustrative.

[0050] Based on this, as shown in Figure 1A, the electronic device 10 also includes a texture recognition module 15, which is disposed on one side of the frame 13. The texture recognition module 15 is used to provide biometric recognition functionality for the electronic device 10. As shown in Figure 1B, the user performs biometric recognition (e.g., finger unlocking) by pressing the texture recognition module 15 with their finger.

[0051] In addition, those skilled in the art will understand that the structure of the electronic device 10 shown in the above figures does not constitute a limitation on the electronic device 10. The electronic device 10 may include more or fewer components than shown, or combine certain components, or have different component arrangements. For example, the electronic device 10 may also include printed circuit boards (PCBs), batteries, cameras, microphones, speakers, radio frequency circuits, input units, sensors, audio circuits, wireless fidelity (WiFi) modules, power supplies, Bluetooth modules, etc., which will not be described in detail here.

[0052] Taking fingerprint recognition as an example, as users' demand for full-screen technology continues to grow, under-display fingerprint technology is also constantly evolving. Currently, fingerprint technology mainly includes three types: capacitive fingerprint technology, optical fingerprint technology, and ultrasonic fingerprint technology.

[0053] Capacitive fingerprint technology cannot be used for under-display unlocking, has a low unlocking rate with wet fingers, and is also unsuitable for underwater unlocking. Optical fingerprint technology suffers from reduced light transmittance due to advancements in screen technology, significantly impacting its unlocking performance; foldable screens, due to their opaque support layer, have been unable to utilize it. Ultrasonic fingerprint technology, with its advantages of not relying on screen transmittance, fast unlocking speed, wet and underwater unlocking, and three-dimensional (3D) anti-counterfeiting features, is gradually becoming a new choice for major electronic devices.

[0054] As a novel technology, ultrasonic fingerprinting has currently been primarily focused on optimizing the performance and structure of fingerprint modules by those skilled in the art, with less emphasis on anti-counterfeiting considerations within fingerprint recognition technology. While ultrasonic fingerprinting possesses some anti-counterfeiting capabilities, the repeated transmission of ultrasonic waves between layers, typically involving multiple cycles, results in surface fingerprint signals remaining even during the extended echo delay. This makes it difficult to effectively distinguish between different depths, leading to unsatisfactory results in practical applications relying solely on identifying fingerprints at varying depths. Therefore, it is necessary to improve the reliability of fingerprint anti-counterfeiting measures.

[0055] Figures 2A and 2B are schematic diagrams illustrating a fingerprint recognition method according to an embodiment of this application.

[0056] In some technologies, as shown in Figure 2A, when using an ultrasonic fingerprint module for fingerprint detection, the imaging results with different echo delays are used to collect echo signals at different time intervals, thus acquiring imaging information at different depths to achieve liveness detection. As shown in Figure 2A, while fake fingerprints can replicate the surface morphology of a fingerprint, it is difficult to imitate the fingerprint information beneath the epidermis. When acquiring imaging information at different depths, as shown in Figures 2A(a), 2A(b), and 2A(c), the deeper the depth, the more blurred the fingerprint outline. As shown in Figure 2A(d), the final synthesized image cannot obtain complete fingerprint image information.

[0057] However, different depths beneath the skin of a real finger still yield different fingerprint image information, as shown in Figure 2B(a), Figure 2B(b), and Figure 2B(c). The deeper the depth, the shallower the fingerprint clarity, but complete fingerprint image information is still present. As shown in Figure 2B(d), the final synthesized image also yields clear and complete fingerprint image information.

[0058] Therefore, different echo delay images can be collected and then synthesized to achieve the effect of anti-counterfeiting. However, this method is complex and its accuracy is not ideal.

[0059] Figure 2C is a schematic diagram of the structure of an ultrasonic fingerprint detection component according to an embodiment of this application.

[0060] In some technologies, as shown in Figure 2C, the ultrasonic fingerprint recognition component includes an ultrasonic fingerprint detection unit and a liveness detection unit. The ultrasonic fingerprint detection unit is used to perform fingerprint detection, and the liveness detection unit overlaps with the ultrasonic fingerprint detection unit to perform liveness detection during the silent period of the ultrasonic fingerprint detection unit.

[0061] The liveness detection unit includes an insulating layer (not shown in the figure), a first touch electrode, and a second touch electrode, sequentially disposed above the ultrasonic fingerprint detection unit. A dielectric layer is disposed between the first and second touch electrodes, forming a capacitive structure. The silent period of the ultrasonic fingerprint detection unit can be used as the liveness detection time of the liveness detection unit. During this time, the ultrasonic fingerprint detection unit is not operating, and a pulse signal is input from the second touch electrode. Under the action of the pulse signal, the first touch electrode generates an induced charge. If the subject being detected is a living body, since living bodies are conductive, a new capacitive structure can be formed between the subject being detected and the second touch electrode, thereby reducing the capacitance between the first and second touch electrodes, and the charge on the first touch electrode flows to the subject being detected. Furthermore, because living bodies have a specific conductivity, the live body has a specific range of influence on the capacitance between the first and second touch electrodes.

[0062] Therefore, when a change in capacitance between the first and second touch electrodes is detected within the aforementioned specific range, it can be determined that the tested subject is a living being. However, this structure is complex and its accuracy is not ideal.

[0063] Figure 3 is a schematic diagram of the structure of a detection component provided in an embodiment of this application.

[0064] This application provides a detection component 20, as shown in FIG3. The detection component 20 includes an ultrasonic texture acquisition module 21, a conductive layer 22, and a bioelectric signal acquisition module 23.

[0065] A conductive layer 22 is stacked on one side of the ultrasonic pattern acquisition module 21 and connected to the ultrasonic pattern acquisition module 21. For example, the conductive layer 22 and the ultrasonic pattern acquisition module 21 form a fixed connection assembly. Alternatively, the conductive layer 22 is located on the surface of the detection assembly 20 for contact with the user.

[0066] For example, conductive layer 22 is a single-layer structure. As a biodetection electrode, the single-layer conductive layer has low impedance throughout the detection pathway and strong resistance to external interference.

[0067] Alternatively, as an example, conductive layer 22 can be a multilayer structure with stacked layers. The multilayer structure can protect conductive layer 22 and improve signal quality.

[0068] The material of the conductive layer 22 is not limited in this embodiment. The material of the conductive layer 22 may be metal, plastic doped with conductive material, glass doped with conductive material, etc.

[0069] In some embodiments, the conductive layer 22 is a plate-like structure, and the conductive layer 22 covers the portion of the ultrasonic texture acquisition module 21 that is connected to the conductive layer 22.

[0070] In some embodiments, the thickness of the conductive layer 22 is 0.35n*λ to 0.65n*λ. For example, the thickness of the conductive layer 22 is 0.35n*λ, 0.4n*λ, 0.45n*λ, 0.5n*λ, 0.55n*λ, 0.6n*λ, or 0.65n*λ.

[0071] Where λ is the wavelength of the conductive layer 22, λ = C1 / f, C1 is the sound velocity of the conductive layer 22, f is the operating frequency of the ultrasonic texture acquisition module 21, and n is a positive integer. Once the material of the conductive layer 22 is determined, the sound velocity C1 of the conductive layer 22 is uniquely determined. Once the structure of the ultrasonic texture acquisition module 21 is determined, the operating frequency f of the ultrasonic texture acquisition module 21 can be determined.

[0072] For example, conductive layer 22 is a single-layer structure. The thickness of the single-layer structure is in the range of 0.35n*λ to 0.65n*λ.

[0073] Alternatively, for example, the conductive layer 22 can be a multilayer stacked structure, with the sum of the thicknesses of the multiple layers ranging from 0.35n*λ to 0.65n*λ. For instance, the thickness-to-wavelength ratio of each layer in the multilayer stacked structure can satisfy the condition that d1 / λ1 + d2 / λ2 + ... + di / λi takes values ​​ranging from 0.35n to 0.65n. Here, d1 is the thickness of the first layer in the multilayer stacked structure, λ1 is the wavelength of the first layer, d2 is the thickness of the second layer, λ2 is the wavelength of the second layer, di is the thickness of the i-th layer, and λi is the wavelength of the i-th layer. By limiting the thickness of the conductive layer 22, the influence of the conductive layer 22 on the ultrasonic signal in the ultrasonic pattern acquisition module 21 can be reduced, ensuring the accuracy of pattern acquisition.

[0074] The bioelectric signal acquisition module 23 is coupled to the conductive layer 22 and is used to acquire signals from the conductive layer 22. By acquiring and processing the bioelectric information transmitted on the conductive layer 22, the bioelectric signal acquisition module 23 can obtain bioelectric signals characterizing the user's biological information. This application embodiment does not limit the method by which the bioelectric signal acquisition module 23 acquires signals from the conductive layer 22 to obtain biological information; structures from related technologies are applicable to this application embodiment.

[0075] The bioelectric signal acquisition module 23 may include, for example, an analog front end (AFE). The bioelectric signal acquisition module 23 can acquire bioelectric signals such as blood pressure, heart rate, electrocardiogram, electromyography, and blood oxygen, allowing users to better understand their own health information and helping them maintain a good health status.

[0076] The ultrasonic fingerprint acquisition module 21 is used to generate biometric information. For example, the ultrasonic fingerprint acquisition module 21 generates biometric information based on the principle of ultrasonic detection. This application embodiment does not limit the structure of the ultrasonic fingerprint acquisition module 21; ultrasonic fingerprint acquisition modules in related technologies are applicable to this application embodiment. For example, the ultrasonic fingerprint acquisition module 21 can be used to detect user fingerprints and / or palm prints. For instance, the ultrasonic fingerprint acquisition module 21 is an ultrasonic fingerprint recognition module, which identifies the user by collecting the user's fingerprint information.

[0077] The detection component 20 provided in this embodiment integrates the ultrasonic pattern acquisition module 21 and the conductive layer 22 serving as a bioelectrode, enabling a single detection component 20 to acquire both biometric and bioelectrical signals. This dual protection of bioelectrical and biometric signals determines whether fingerprint unlocking is required, enhancing the anti-counterfeiting capabilities of pattern recognition. Furthermore, applying the multifunctional detection component 20 to the electronic device 10 increases the integration level of the electronic device 10 and reduces hardware implementation costs.

[0078] Figures 4 and 5 are schematic diagrams of another detection component provided in the embodiments of this application.

[0079] In some embodiments, as shown in FIG4, the ultrasonic texture acquisition module 21 includes a substrate 211, an ultrasonic texture processing module 215, and a first electrode layer 212, a piezoelectric layer 213, and a second electrode layer 214 sequentially stacked on the substrate 211.

[0080] The ultrasonic texture acquisition module 21 operates in two phases: a transmitter (TX) phase and a receiver (RX) phase. During the transmitter phase, the first electrode layer 212 receives a high-voltage pulse signal, and the second electrode layer 214 receives a fixed-level signal. The piezoelectric layer 213 is subjected to electrostatic high voltage from its upper and lower sides, which is converted into high-frequency mechanical vibration, i.e., ultrasonic waves. These ultrasonic waves propagate through each layer to the conductive layer 22 until they encounter a pressing object (e.g., a finger) on the surface of the conductive layer 22. Some of the ultrasonic waves are reflected by the pressing object, while a small portion continues to propagate forward.

[0081] During the receiving phase, the reflected ultrasonic waves pass through the various media layers again and reach the piezoelectric layer 213. The nearly stationary piezoelectric layer 213 is driven to vibrate at high frequency by the reflected ultrasonic waves, which then converts the high-frequency vibration into a high-frequency pulse electrical signal. This electrical signal is received by the first electrode layer 212 and then transmitted to the ultrasonic texture processing module 215. The different reflectivities of the ridges and valleys of the texture will cause differences in the intensity of the reflected echo. Finally, through the pixel signal reading circuit and the processing of the ultrasonic texture processing module 215 (e.g., thickness algorithm processing), an ultrasonic imaging image of the pressed object texture is obtained.

[0082] For example, the first electrode layer 212 includes a plurality of electrodes arranged in an array, and the second electrode layer 214 is a plate-shaped electrode. Alternatively, for example, the first electrode layer includes a plurality of electrodes arranged in an array, and the second electrode layer 214 includes a plurality of electrodes arranged in an array. The structure of the ultrasonic texture acquisition module 21 illustrated in the embodiments of this application is merely illustrative and is not intended to limit the scope of the application.

[0083] In some embodiments, as shown in FIG4, the connecting layer 24 is disposed between the conductive layer 22 and the substrate 211, with the conductive layer 22 disposed on the side of the substrate 211 away from the first electrode layer 212. Alternatively, it can be understood that the ultrasonic texture acquisition module 21 is attached to the conductive layer 22 in reverse. In this way, the substrate 211 is directly connected to the conductive layer 22, which can improve the flatness of the connection and facilitate the propagation of ultrasonic waves.

[0084] For example, the detection component 20 also includes a connection layer 24 disposed between the ultrasonic texture acquisition module 21 and the conductive layer 22, and the connection layer 24 is connected to both the ultrasonic texture acquisition module 21 and the conductive layer 22. For example, the connection layer 24 is connected to both the substrate 211 and the conductive layer 22 to achieve the connection between the ultrasonic texture acquisition module 21 and the conductive layer 22.

[0085] The connecting layer 24 can be an insulating connecting layer or a conductive connecting layer. For example, the connecting layer 24 can be an adhesive layer for bonding the ultrasonic texture acquisition module 21 and the conductive layer 22.

[0086] In some embodiments, the acoustic impedance of the connecting layer 24 is 0.7Z to 1.3Z. For example, the acoustic impedance of the connecting layer 24 is 0.7Z, 0.8Z, 0.9Z, 1.0Z, 1.1Z, 1.2Z or 1.3Z.

[0087] in, Z1 is the acoustic impedance of the conductive layer 22, and Z2 is the acoustic impedance of the film layer on the side of the connecting layer 24 away from the conductive layer 22. Z1 = ρ1 * C1, where ρ1 is the density of the conductive layer 22 and C1 is the sound velocity of the conductive layer 22. Z2 = ρ2 * C3, where ρ2 is the density of the film layer on the side of the connecting layer 24 away from the conductive layer 22 and C3 is the sound velocity of the film layer on the side of the connecting layer 24 away from the conductive layer 22. For example, Z2 is the acoustic impedance of the substrate 211 in Figure 4, ρ2 is the density of the substrate 211, and C3 is the sound velocity of the substrate 211.

[0088] By limiting the acoustic impedance range of the connecting layer 24, the connecting layer 24 has excellent acoustic impedance matching characteristics. That is, the acoustic impedance of the connecting layer 24 matches the acoustic impedance of the conductive layer 22 and the acoustic impedance of the substrate 211, thereby improving the transmission effect of ultrasonic waves.

[0089] In other embodiments, as shown in FIG5, the connecting layer 24 is disposed between the conductive layer 22 and the second electrode layer 214, with the conductive layer 22 disposed on the side of the second electrode layer 214 away from the piezoelectric layer 213. Alternatively, it can be understood that the ultrasonic texture acquisition module 21 is directly attached to the conductive layer 22. In this way, the ultrasonic waves do not need to pass through the substrate 211, which can improve the ultrasonic signal strength.

[0090] For example, the detection component 20 also includes a connection layer 24 disposed between the ultrasonic texture acquisition module 21 and the conductive layer 22, and the connection layer 24 is connected to both the ultrasonic texture acquisition module 21 and the conductive layer 22. For instance, the connection layer 24 is connected to both the second electrode layer 214 and the conductive layer 22 to achieve the connection between the ultrasonic texture acquisition module 21 and the conductive layer 22.

[0091] in, Z1 is the acoustic impedance of the conductive layer 22, and Z2 is the acoustic impedance of the film layer on the side of the connecting layer 24 away from the conductive layer 22. Z2 = ρ2 * C3, where ρ2 is the density of the film layer on the side of the connecting layer 24 away from the conductive layer 22, and C3 is the sound velocity of the film layer on the side of the connecting layer 24 away from the conductive layer 22. For example, Z2 is the acoustic impedance of the second electrode layer 214 in Figure 5, ρ2 is the density of the second electrode layer 214, and C3 is the sound velocity of the second electrode layer 214.

[0092] By limiting the acoustic impedance range of the connecting layer 24, the connecting layer 24 has excellent acoustic impedance matching characteristics. That is, the acoustic impedance of the connecting layer 24 matches the acoustic impedance of the conductive layer 22 and the acoustic impedance of the second electrode layer 214, thereby improving the transmission effect of ultrasound.

[0093] In some embodiments, the ultrasonic texture acquisition module 21 further includes multiple pixel signal reading circuits, which are coupled to multiple electrodes in the first conductive layer 212. After reading the echo signal on the first conductive layer 212, the pixel signal reading circuits transmit it to the ultrasonic texture processing module 215 for filtering, amplification, and other processing to obtain a bioelectrical signal. The structure and relationship between the pixel signal reading circuits and the ultrasonic texture processing module 215 can be found in the description of related technologies, and will not be repeated here. In this case, the ultrasonic texture processing module 215 can be coupled to the first electrode layer 212, for example, through the pixel signal reading circuits.

[0094] In some embodiments, the substrate 211 includes a plurality of pixel signal readout circuits arranged in an array, and the plurality of pixel signal readout circuits are correspondingly coupled to a plurality of electrodes in the first conductive layer 212. For example, the substrate 211 is a thin film transistor (TFT) substrate.

[0095] In other embodiments, the substrate 211 is a carrier substrate such as a silicon substrate or a glass substrate with leads. Multiple pixel signal readout circuits can be located in other positions.

[0096] In some embodiments, as shown in FIG5, the conductive layer 22 and the first electrode layer 212 are both coupled to the substrate 211, and the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are both disposed on the substrate 211.

[0097] For example, the conductive layer 22 is coupled to the substrate 211 via a wire, and the first electrode layer 212 is coupled to the substrate 211 via a pin on the substrate 211. In this case, the substrate 211 may include multiple pixel signal reading circuits arranged in an array, and the first electrode layer 212 is coupled to the pixel signal reading circuits on the substrate 211.

[0098] In some embodiments, the detection component 20 further includes a flexible printed circuit board (FPCB), which is coupled to the substrate 211. The ultrasonic texture processing module 215 acquires and processes the ultrasonic texture signals to generate biometric information, and the bioelectric signal acquisition module 23 acquires and processes the signals from the conductive layer 22 to generate bioelectric signals. The biometric information and bioelectric signals are transmitted to an external application processor (AP) via the FPCB.

[0099] Figure 6 is a schematic diagram of another detection component provided in an embodiment of this application.

[0100] In some other embodiments, as shown in FIG6, the detection component 20 further includes an FPCB, the first electrode layer 212 is coupled to the FPCB through the substrate 211, the conductive layer 22 is coupled to the FPCB, and the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are both disposed on the FPCB.

[0101] In other words, the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are no longer integrated in the substrate 211, but are externally mounted on the FPCB.

[0102] For example, conductive layer 22 is coupled to FPCB via wires, and first electrode layer 212 is coupled to FPCB via conductive structures on substrate 211. In this case, substrate 211 may only have leads, which indirectly couple the first electrode layer 212 to FPCB. Alternatively, substrate 211 may have multiple pixel signal reading circuits arranged in an array, which indirectly couple the first electrode layer 212 to FPCB.

[0103] Placing the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 on the FPCB helps the ultrasonic texture processing module 215 to be close to the first electrode layer 212 and the bioelectric signal acquisition module 23 to be close to the conductive layer 22, thereby improving the accuracy of data reading.

[0104] In some embodiments, as shown in FIG6, the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are set separately and are not integrated or shared. This reduces process modifications and is easy to implement.

[0105] Figure 7 is a schematic diagram of another detection component provided in an embodiment of this application.

[0106] In some other embodiments, as shown in FIG7, the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are integrated in the same integrated circuit (IC).

[0107] The IC can be in the form of a bare chip, a packaged chip, or an integrated circuit module. This application does not limit this, as long as the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are integrated together.

[0108] As shown in Figure 7, for example, the IC can be mounted on the FPCB. Alternatively, the IC can also be mounted on substrate 211.

[0109] By integrating the ultrasonic fingerprint processing module 215 and the bioelectric signal acquisition module 23, it is possible to reuse some circuits (such as storage sections, amplifiers, filters, etc.) of the ultrasonic fingerprint processing module 215 and the bioelectric signal acquisition module 23, enabling a more synchronized signal link between the bioelectric signal and biometric information, thereby improving the response speed of fingerprint recognition. In addition, the reuse of some circuits can save the area and cost of the circuits in the detection component 20.

[0110] After the detection component 20 provided in the embodiments of this application is applied to the electronic device 10 provided in the embodiments of this application, the detection component 20 can be coupled to the processor. The processor judges and processes the signal output by the detection component 20 and finally determines whether to unlock.

[0111] Figure 8 is a schematic diagram of a border component provided in an embodiment of this application.

[0112] In some embodiments, as shown in FIG8, the frame 13 in the electronic device 10 includes a first opening that exposes part or all of the conductive layer 22 in the detection component 20. Alternatively, the size of the first opening may be greater than, equal to, or smaller than the size of the conductive layer 22.

[0113] The detection component 20 is assembled with the frame 13 as an independent button. The detection component 20 can protrude outward relative to the frame 13, or it can be recessed inward relative to the frame 13. The detection component 20 can also be flush with the frame 13.

[0114] The material of the frame 13 can be any material such as conductive material, insulating material, or semiconductor material, and the frame structure in related technologies is applicable to the embodiments of this application.

[0115] Of course, the detection component 20 can also be integrated into the electronic device 10 in other ways, as long as the user can touch the conductive layer 22.

[0116] The frame 13 may also include a third opening that exposes the volume buttons and other function buttons of the electronic device 10, allowing the user to press and control the volume, etc. The detection component 20 and the volume buttons may be located on the same side of the frame 13, or they may be located on different sides of the frame 13.

[0117] Figure 9 is a schematic diagram of another border component provided in an embodiment of this application.

[0118] In some other embodiments, as shown in FIG9, the frame 13 does not include the first opening exposing the detection component 20. The frame 13 includes a first conductive portion 131, which is stacked with the ultrasonic texture acquisition module 21. The first conductive portion 131 serves as the conductive layer 22 of the detection component 20.

[0119] The ultrasonic texture acquisition module 21 is placed inside the frame 13, which includes a first conductive portion 131 and the remaining portions. The first conductive portion 131 is ensured to be conductive, while the remaining portions may or may not be conductive. For example, the frame 13 may be made of a conductive material, and both the first conductive portion 131 and the remaining portions may be conductive. Alternatively, the frame 13 may be made of an insulating material (e.g., plastic), and the first conductive portion 131 may be formed by doping the insulating material.

[0120] Figure 10 is a rear view schematic diagram of an electronic device provided in an embodiment of this application.

[0121] In some embodiments, as shown in FIG10, the electronic device 10 further includes a rear cover 14, which includes a second opening that exposes part or all of the conductive layer 22 in the detection component 20.

[0122] The detection component 20 is assembled with the back cover 14 as an independent button. The detection component 20 can protrude outward relative to the back cover 14, or it can be recessed inward relative to the back cover 14. The detection component 20 can also be flush with the back cover 14.

[0123] The material of the back cover 14 can be any material such as conductive material, insulating material, semiconductor material, etc. The frame structure in related technologies is applicable to the embodiments of this application.

[0124] The rear cover 14 may also include a camera hole, which exposes the rear-mounted structure of the electronic device 10, such as the camera. The structure and layout of the camera hole in Figure 10 are only schematic and are not intended to limit the functionality. The camera in the electronic device 10 may include, for example, a telephoto camera, a short-focus camera, and a periscope camera.

[0125] Figure 11 is a rear view schematic diagram of another electronic device provided in an embodiment of this application.

[0126] In some other embodiments, as shown in FIG11, the electronic device 10 further includes a rear shell 14, the rear shell 14 including a second conductive portion 141, the second conductive portion 141 being stacked with the ultrasonic texture acquisition module 21, and the second conductive portion 141 serving as the conductive layer 22 of the detection component 20.

[0127] The ultrasonic texture acquisition module 21 is placed inside the rear shell 14, which includes a second conductive portion 141 and other portions. The second conductive portion 141 is ensured to be conductive, while the other portions may or may not be conductive. For example, the material of the rear shell 14 can be a conductive material, and both the second conductive portion 141 and the other portions are conductive. Alternatively, for example, the material of the rear shell 14 is an insulating material (e.g., a polymer material), the second conductive portion 141 is a conductive structure, and the other portions are an insulating structure. The second conductive portion 141 can be formed by doping the insulating material, or it can be formed by material replacement in a corresponding region.

[0128] Figure 12 is a flowchart of a control method for an electronic device provided in an embodiment of this application.

[0129] This application also provides a control method for an electronic device, wherein the electronic device 10 includes the detection component 20 described above.

[0130] As shown in Figure 12, the control method for the electronic device includes:

[0131] The bioelectric signal acquisition module 23 acquires signals from the conductive layer 22, generating bioelectric signals. These bioelectric signals include, for example, electrocardiogram (ECG) signals. ECG signals are generated by measuring the electrical activity of the heart using electrodes placed on the chest. These signals are recorded and used to assess the health of the heart, and can also be used to determine liveness. Liveness detection is an effective method in fingerprint anti-counterfeiting, detecting whether a pressed fingerprint belongs to a living person by detecting human liveness information such as heart rate, impedance, and ECG characteristics. ECG, as a common bioelectric signal, can be effectively combined with ultrasonic fingerprinting to achieve a better fingerprint experience and enhanced security.

[0132] The bioelectric signal acquisition module 23 can adopt bioelectric signal acquisition methods in related technologies according to the way bioelectric signals are generated by bioelectrodes, and this application embodiment does not limit this.

[0133] Figure 13 is a waveform diagram of an ECG signal provided in an embodiment of this application.

[0134] As shown in Figure 13, an ECG signal is typically a periodic waveform composed of a P wave, QRS complex, T wave, and U wave. The P wave represents atrial contraction, the QRS complex represents ventricular contraction, the T wave represents ventricular diastole, and the U wave represents the ventricular afterpotential. Depending on the application scenario, the bioelectric signal acquisition module 23 acquires bioelectric signals of different durations. For example, the bioelectric signal acquisition module 23 can acquire bioelectric signals for a complete cycle, or it can acquire bioelectric signals for a non-complete cycle.

[0135] Figure 14 is a flowchart of another control method for an electronic device provided in an embodiment of this application.

[0136] In some embodiments, as shown in FIG14, the bioelectric signal acquisition module 23 receives a first instruction, acquires the signal of the conductive layer 22, and generates a bioelectric signal lasting for a first duration.

[0137] For example, in a scenario where the electronic device 10 is operating under high security requirements, the system-on-chip (SOC) sends a first instruction to the bioelectric signal acquisition module 23. The bioelectric signal acquisition module 23 receives the first instruction and acquires the signal from the conductive layer 22, generating a complete cycle of bioelectric signal. At this point, the complete bioelectric signal is acquired, and the presence of liveness information is determined based on the complete bioelectric signal. Depending on the application scenario, one or more complete cycles of bioelectric signal can be used. That is, the first duration of the bioelectric signal can be one or more cycles.

[0138] For scenarios with high security requirements, such as payments, banking, and sensitive personal privacy information, the accuracy of detection results can be improved by detecting bioelectrical signals throughout the entire cycle.

[0139] In other embodiments, the bioelectric signal acquisition module 23 receives a second instruction, acquires the signal from the conductive layer 22, and generates a bioelectric signal lasting for a second duration. The first duration is longer than the second duration.

[0140] For example, in the current scenario where the electronic device 10 is in a normal unlocked state, the SOC sends a second command to the bioelectric signal acquisition module 23. The bioelectric signal acquisition module 23 receives the second command and acquires the signal from the conductive layer 22, generating a non-complete cycle of bioelectric signal. At this time, only a portion of the bioelectric signal is acquired, and the presence of liveness information is determined based on this partial bioelectric signal. That is, the first duration of the bioelectric signal is less than one cycle.

[0141] The typical ECG signal period is 800ms, while fingerprint unlocking time is generally 200ms. Normally, capturing a complete ECG cycle would significantly impact unlocking time; therefore, capturing a portion of the ECG signal can improve fingerprint unlocking response speed.

[0142] Depending on the application scenario, the electronic device 10 can collect bioelectrical signals of varying durations to meet different requirements such as response speed or unlocking reliability. In different application scenarios, the bioelectrical signal acquisition module 23 receives different instructions and will not receive the first instruction and the second instruction simultaneously.

[0143] As shown in Figure 12, the control method of the electronic device further includes: the ultrasonic texture acquisition module 21 generating biometric information. The method of generating biometric information by the ultrasonic texture acquisition module 21 can adopt ultrasonic technology in related technologies, and this application embodiment does not limit it.

[0144] There is no restriction on the order of the steps of generating bio-feature information by the ultrasonic texture acquisition module 21 and the steps of generating bio-electric signals by the bioelectric signal acquisition module 23; they can be performed simultaneously or sequentially.

[0145] In some embodiments, as shown in FIG12, before the ultrasonic pattern acquisition module 21 generates biometric information, the control method further includes: determining whether the bioelectrical signal is successfully authenticated; if the bioelectrical signal is successfully authenticated, the ultrasonic pattern acquisition module 21 acquires biometric information. If the bioelectrical signal is not successfully authenticated, the ultrasonic pattern acquisition module 21 does not acquire biometric information.

[0146] Determining whether the bioelectrical signal authentication is successful is essentially the process of eliminating fake fingers. After eliminating fake fingers, fingerprint recognition is then performed, which can further reduce the power consumption of the electronic device 10.

[0147] If both biometric information and bioelectrical signal authentication are successful, an unlock command is generated. If biometric information authentication fails, the unlocking process ends regardless of whether bioelectrical signal authentication is successful.

[0148] For example, when a finger touches the ultrasonic fingerprint acquisition module 21 to attempt to unlock the electronic device 10, the bioelectrical signal acquisition module 23 simultaneously activates to detect electrocardiogram (ECG) characteristics. An unlock command will only be generated if the biometric information generated by the ultrasonic fingerprint acquisition module 21 is successfully authenticated, and the bioelectrical signal generated by the bioelectrical signal acquisition module 23 is also successfully authenticated. If the biometric information acquired by the ultrasonic fingerprint acquisition module 21 is successfully authenticated, but the bioelectrical signal generated by the bioelectrical signal acquisition module 23 is not successfully authenticated, no unlock command will be generated. Similarly, if the bioelectrical signal generated by the bioelectrical signal acquisition module 23 is successfully authenticated, but the biometric information generated by the ultrasonic fingerprint acquisition module 21 is not successfully authenticated, no unlock command will be generated.

[0149] For example, the texture image generated by the ultrasonic texture acquisition module 21 is compared with a pre-stored template library image to determine if they match. If they match, the biometric information generated by the ultrasonic texture acquisition module 21 is considered successfully authenticated. If they do not match, the biometric information generated by the ultrasonic texture acquisition module 21 is considered unsuccessfully authenticated.

[0150] For example, by comparing the bioelectric signal with a preset bioelectric signal, if the matching degree meets the preset value, it is determined that the bioelectric signal generated by the bioelectric signal acquisition module 23 has been successfully authenticated.

[0151] If the prosthetic finger contact detection component 20, constructed using a rubber model, collects an abnormal bioelectrical signal that differs significantly from the preset signal, the bioelectrical signal fails to authenticate. Therefore, even if the biometric information collected by the ultrasonic texture acquisition module 21 is successfully authenticated, the electronic device 10 will not perform an unlocking operation.

[0152] The control method for the electronic device provided in the application embodiment generates an unlock command only when both biometric information and bioelectrical signals are successfully authenticated. If the bioelectrical signal authentication fails, no unlock command is generated, and the electronic device 10 will not perform an unlocking operation. This enables liveness detection and reduces the risk of unlocking the electronic device 10 directly using fingerprints or other fingerprint patterns. Furthermore, since ultrasound is transmitted as a pressure signal in the stacked layers, while bioelectrical signals are electrical signals, both signals can be collected simultaneously, ensuring that the final unlocking time is within an acceptable range.

[0153] In some embodiments, before the ultrasonic texture acquisition module 21 acquires bio-feature information and the bioelectric signal acquisition module 23 generates bioelectric signals, the control method further includes: determining whether the user touches the conductive layer 22.

[0154] When the user touches the conductive layer 22, the ultrasonic texture acquisition module 21 generates biometric information. When the user does not touch the conductive layer 22, the ultrasonic texture acquisition module 21 does not generate biometric information.

[0155] When the user touches the conductive layer 22, the bioelectric signal acquisition module 23 acquires the signal from the conductive layer 22 and generates a bioelectric signal. When the user does not touch the conductive layer 22, the bioelectric signal acquisition module 23 does not generate a bioelectric signal.

[0156] For example, the ultrasonic texture acquisition module 21 can acquire signals to determine whether the user has touched the conductive layer 22. Alternatively, for example, pressure change detection, capacitance change detection, or other methods can be used to determine whether the user has touched the conductive layer 22. All solutions in related technologies that can determine whether the user has touched the conductive layer 22 are applicable to the embodiments of this application.

[0157] Before collecting biometric information and bioelectrical signals, the system detects whether the user touches the conductive layer 22. Biometric information and bioelectrical signals are only collected after it is determined that the user has touched the conductive layer 22. If the user has not touched the conductive layer 22, biometric information and bioelectrical signals are not collected, thus reducing the power consumption of the electronic device 10.

[0158] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A detection component, characterized in that, The detection component includes: Ultrasonic texture acquisition module, used to generate biometric information; A conductive layer is stacked on one side of the ultrasonic texture acquisition module and connected to the ultrasonic texture acquisition module; A bioelectric signal acquisition module is coupled to the conductive layer and is used to acquire signals from the conductive layer.

2. The detection component according to claim 1, characterized in that, The thickness of the conductive layer is 0.35n*λ to 0.65n*λ, where λ is the wavelength of the conductive layer and n is a positive integer.

3. The detection component according to claim 1 or 2, characterized in that, The detection component further includes a connection layer, which is disposed between the ultrasonic texture acquisition module and the conductive layer, and is connected to the ultrasonic texture acquisition module and the conductive layer respectively.

4. The detection component according to claim 3, characterized in that, The ultrasonic texture acquisition module includes a substrate and a first electrode layer, a piezoelectric layer and a second electrode layer sequentially stacked on the substrate. The connecting layer is disposed between the conductive layer and the substrate; or, The connecting layer is disposed between the conductive layer and the second electrode layer.

5. The detection component according to claim 4, characterized in that, The acoustic impedance of the connecting layer is 0.7 Z to 1.3 Z. Wherein, Z1 is the acoustic impedance of the conductive layer, and Z2 is the acoustic impedance of the substrate or the second electrode layer connected to the connecting layer.

6. The detection component according to claim 5, characterized in that, The ultrasonic texture acquisition module also includes an ultrasonic texture processing module coupled to the first electrode layer. Both the conductive layer and the first electrode layer are coupled to the substrate, and both the ultrasonic texture processing module and the bioelectric signal acquisition module are disposed on the substrate. or, The detection component also includes a flexible circuit board, the first electrode layer is coupled to the flexible circuit board through the substrate, the conductive layer is coupled to the flexible circuit board, and the ultrasonic texture processing module and the bioelectric signal acquisition module are both disposed on the flexible circuit board.

7. The detection component according to claim 6, characterized in that, The ultrasonic texture processing module and the bioelectric signal acquisition module are integrated into the same integrated circuit.

8. An electronic device, characterized in that, The electronic device includes: processor; A detection component, comprising the detection component according to any one of claims 1-7, wherein the detection component is coupled to the processor.

9. The electronic device according to claim 8, characterized in that, The electronic device further includes a frame; the frame includes an opening; the opening exposes the conductive layer of the detection component.

10. The electronic device according to claim 8, characterized in that, The electronic device further includes a frame; the frame includes a first conductive portion that is stacked with the ultrasonic texture acquisition module, the first conductive portion serving as a conductive layer of the detection component.

11. The electronic device according to claim 8, characterized in that, The electronic device also includes a rear shell, which includes a second conductive portion stacked with the ultrasonic texture acquisition module, the second conductive portion serving as a conductive layer of the detection component.

12. A control method for an electronic device, characterized in that, The electronic device includes an ultrasonic texture acquisition module, a conductive layer, and a bioelectric signal acquisition module. The control method includes: The bioelectric signal acquisition module acquires the signal from the conductive layer and generates a bioelectric signal. The ultrasonic texture acquisition module generates biometric information; If both the biometric information and the bioelectrical signal are successfully authenticated, an unlocking command is generated.

13. The control method according to claim 12, characterized in that, The bioelectric signal acquisition module acquires signals from the conductive layer and generates bioelectric signals, including: The bioelectric signal acquisition module receives a first instruction, acquires the signal of the conductive layer, and generates the bioelectric signal lasting for a first duration. or, The bioelectric signal acquisition module receives a second instruction, acquires the signal of the conductive layer, and generates the bioelectric signal lasting for a second duration. Wherein, the first duration is longer than the second duration.

14. The control method according to claim 13, characterized in that, The first duration is greater than or equal to the period length of the bioelectric signal, and the second duration is less than the period length of the bioelectric signal.

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