Power supply device

Abstract

Provided is a high-quality power supply device in which an electrode part, a wiring part, and an anisotropic conductive part are optimally arranged. A power supply device (100) is attached to an object (10) and supplies power to the object (10), and the power supply device is characterized by comprising: an electrode part (110) that is positioned on the side close to the object (10); a wiring part (120) that is positioned on the side far from the object (10); and an anisotropic conductive part (130) that is interposed between the electrode part (110) and the wiring part (120), has conductivity in the lamination direction of the electrode part (110) and the wiring part (120), and has insulating properties in the direction intersecting the lamination direction. The power supply device is also characterized in that, in a plan view, the anisotropic conductive part (130) extends toward the peripheral edge part of the wiring part (120) so as to fill the gap between the anisotropic conductive part and the peripheral edge part of the wiring part (120).

Description

Power supply device ,

[0004] ,

[0005]

[0001] The present invention relates to a power supply device.

[0002] Patent Document 1 describes a dimming device including a pair of light-transmitting members, a liquid crystal cell, a wiring member, and a light-transmitting adhesive member. The liquid crystal cell is disposed between the pair of light-transmitting members and has an electrode bonding portion, a liquid crystal portion whose light transmittance changes according to a voltage applied to the electrode bonding portion, a pair of electrode layers extending over the liquid crystal portion and the electrode bonding portion, and a pair of resin base layers supporting the pair of electrode layers. The wiring member is joined to the electrode bonding portion. The light-transmitting adhesive member fixes the liquid crystal cell to each of the pair of light-transmitting members.

[0003] The wiring member is separated from a sealing material that seals the liquid crystal of the liquid crystal portion, and a space that is sandwiched by the pair of electrode layers between the pair of base layers and in which no object exists is formed between the wiring member and the sealing material. The joint portion between the electrode bonding portion and the wiring member is covered by the pair of light-transmitting members. The above space is covered by the pair of light-transmitting members. The wiring member extends through the light-transmitting adhesive member from the side in contact with the above space. The joint portion between the electrode bonding portion and the wiring member is sealed by the light-transmitting adhesive member and is isolated from the outside through the light-transmitting adhesive member. The thickness in the stacking direction of the wiring member is larger than the interval in the stacking direction between the pair of electrode layers in the liquid crystal portion. The wiring member has a first conductive layer exposed on the surface of the wiring member and a second conductive layer exposed on the back surface of the wiring member and electrically insulated from the first conductive layer. The pair of electrode layers are joined to the first conductive layer and the second conductive layer, respectively.

[0004] Japanese Patent No. 7254436

[0005] In the prior art, including the dimming device described in Patent Document 1, a power supply device is provided to supply power to the dimming device (object). The basic configuration of this power supply device includes an electrode section (for example, a comb-shaped electrode or a comb-tooth electrode) located on the side closer to the dimming device (object), a wiring section (for example, an FPC (Flexible Printed Circuits)) located on the side further away from the dimming device (object), and an anisotropic conductive section (for example, an ACF (Anisotropic Conducting Film)) interposed between the electrode section and the wiring section, which is conductive in the direction of stacking of the electrode section and the wiring section, and insulating in the direction intersecting (for example, orthogonal to) the stacking direction of the electrode section and the wiring section.

[0006] However, through diligent research by the inventors, it has been found that conventional power supply devices, when viewed from above, suffer from malfunctions due to air gaps between the peripheral (end) portion of the wiring and the electrode portion, and between the peripheral (end) portion of the wiring and the anisotropic conductive portion.

[0007] This invention was made in view of the above-mentioned problems, and aims to provide a high-quality power supply device in which the electrode section, wiring section, and anisotropic conductive section are optimally arranged.

[0008] The power supply device of this embodiment is attached to an object and supplies power to the object, and comprises an electrode portion located on the side closer to the object, a wiring portion located on the side further away from the object, and an anisotropic conductive portion interposed between the electrode portion and the wiring portion, which is conductive in the stacking direction of the electrode portion and the wiring portion and insulated in the direction intersecting the stacking direction, wherein, when viewed from above, the anisotropic conductive portion extends toward the peripheral edge of the wiring portion so as to fill the gap between it and the peripheral edge of the wiring portion.

[0009] According to the present invention, it is possible to provide a high-quality power supply device in which the electrode section, wiring section, and anisotropic conductive section are optimally arranged.

[0010] This figure shows an example of the cross-sectional structure of a dimming device as the object. This is a plan view showing an example of the configuration of the power supply device of this embodiment. This is a cross-sectional view of the power supply device of this embodiment along the long side direction. This is a plan view focusing on the end of the power supply device of this embodiment along the long side direction. This is a cross-sectional view of the power supply device of this embodiment along the short side direction. This is a plan view focusing on the end of the power supply device of this embodiment along the short side direction. This figure shows an example of the manufacturing process of a conventional power supply device and its technical challenges. This figure shows another example of the technical challenges of a conventional power supply device. This figure shows the results of the verification experiment of numerical examples and comparative examples.

[0011] <Definitions of Terms, etc.> In this specification, "object" is defined as any device, module, or other equipment to which the power supply device of this embodiment is attached and which operates by receiving power from the power supply device. For example, "object" may be a dimming device, dimming module, dimming device, dimming sheet, dimming film, etc., which switches between a transparent state and an opaque state by switching between an energized state and an unenhanced state by the power supply device. Alternatively, "object" may be a device, module, or other equipment that utilizes a flexible solar cell, etc. Furthermore, "object" may be a device with a flat panel display, such as a smartphone, tablet, PC (Personal Computer), or TV.

[0012] In this specification, the "electrode section" is composed of, for example, a comb-shaped electrode or a comb-tooth electrode, and has the function of supplying driving power from the driving power supply and the "wiring section" described later to a predetermined part of the object (for example, a dimming device) (for example, an outer support layer or a transparent conductive layer).

[0013] In this specification, the "wiring section" is composed of, for example, a printed circuit board (wiring board) such as an FPC (Flexible Printed Circuits), and has the function of transmitting drive power from the drive power supply to the "electrode section" described above.

[0014] In this specification, the term "anisotropic conductive part" is composed of, for example, ACF (Anisotropic Conducting Film). The term "anisotropic conductive part" may also be read as "anisotropic conductive film" or "anisotropic conductive film." The "anisotropic conductive part" is interposed between the "electrode part" and the "wiring part," and is conductive in the direction of lamination of the "electrode part" and the "wiring part," and is insulating in the direction intersecting (e.g., perpendicular to) the lamination direction of the "electrode part" and the "wiring part."

[0015] The ACF (Anisotropic Conducting Film) that constitutes the "anisotropic conductive part" is, for example, a film in which conductive particles are dispersed in a thermosetting epoxy resin. When this film is heat-pressed, the pressed area exhibits "electrical anisotropy," meaning it is conductive in the direction of pressure pressing, i.e., the vertical direction, and insulating in the direction perpendicular to the pressure pressing direction, i.e., the surface direction.

[0016] Anisotropic conductive parts (ACFs) are interposed between the electrode and wiring parts in dimming devices, and may also be used in devices with flat panel displays such as smartphones, tablets, PCs (Personal Computers), and TVs to electrically connect and physically fix electrodes on the glass substrate of a display using liquid crystal or OLED (Organic Light Emitting Diode) to electrodes on an IC (Integrated Circuit) chip, or electrodes on a flexible circuit board.

[0017] <Dimming device as an object> Figure 1 shows an example of the cross-sectional structure (laminated structure) of a dimming device (dimming module, dimming device, dimming sheet, dimming film) 10 as an object.

[0018] The dimming device 10 has a dimming layer 11. The dimming layer 11 contains a liquid crystal composition. The dimming layer 11 is composed of, for example, polymer network liquid crystal (PNLC), polymer dispersed liquid crystal (PDLC), nematic curvilinear aligned phase (NCAP), etc. For example, polymer network liquid crystal has a polymer network having a three-dimensional mesh structure, and liquid crystal molecules are held in the voids of the polymer network. The liquid crystal molecules contained in the dimming layer 11 have, for example, positive dielectric anisotropy, and the dielectric constant in the long axis direction of the liquid crystal molecule is greater than the dielectric constant in the short axis direction of the liquid crystal molecule. Examples of liquid crystal molecules include Schiff base-based, azo-based, azoxy-based, biphenyl-based, terphenyl-based, benzoic acid ester-based, tran-based, pyrimidine-based, cyclohexanecarboxylic acid ester-based, phenylcyclohexane-based, and dioxane-based liquid crystal molecules.

[0019] A pair of transparent conductive layers 12 are provided on both sides of the dimming layer 11, and a pair of transparent substrate layers 13 are provided on both sides of the pair of transparent conductive layers 12. Each pair of transparent conductive layers 12 and transparent substrate layers 13 constitute a pair of outer support layers 14. On the outside of one of the pair of outer support layers 14 (the pair of transparent substrate layers 13), an adhesive layer (not shown) may be provided for, for example, attaching (bonding, joining) the dimming device 10 to a light-transmitting member (not shown) such as glass. On the outside of the other of the pair of outer support layers 14 (the pair of transparent substrate layers 13), a functional film layer (not shown), for example, a UV cut layer, an IR cut layer, or a hard coat layer may be provided.

[0020] The pair of transparent conductive layers 12 are transparent layers that have conductivity. Examples of materials that make up the pair of transparent conductive layers 12 include polymers containing indium tin oxide (ITO), fluorine-doped tin oxide (FTO), tin oxide, zinc oxide, carbon nanotubes (CNT), poly(3,4-ethylenedioxythiophene) (PEDOT), and multilayer films containing Ag alloy thin films. The pair of transparent substrate layers 13 are layers made up of materials such as PET (Polyethylene Terephthalate).

[0021] When focusing on one end of the dimming device 10 (the first end, the left end), a first stepped portion (first half-cut portion) 15 is formed where the outer support layer 14 (transparent conductive layer 12 and transparent substrate layer 13) provided on one surface (upper surface) of the dimming layer 11 protrudes laterally (to the left) than the outer support layer 14 (transparent conductive layer 12 and transparent substrate layer 13) provided on the other surface (lower surface) of the dimming layer 11.

[0022] When we focus on another end of the dimming device 10 (the second end, the right end), the outer support layer 14 (transparent conductive layer 12 and transparent substrate layer 13) provided on the other surface (bottom surface) of the dimming layer 11 forms a second stepped portion (second half-cut portion) 16 that protrudes laterally (to the right) than the outer support layer 14 (transparent conductive layer 12 and transparent substrate layer 13) provided on one surface (top surface) of the dimming layer 11.

[0023] Furthermore, power supply devices 100 are provided on each transparent conductive layer 12 corresponding to the first stepped portion (first half-cut portion) 15 and the second stepped portion (second half-cut portion) 16 described above. By supplying driving power (driving current) from these power supply devices 100 to the pair of transparent conductive layers 12, a driving voltage is applied between the pair of transparent conductive layers 12, i.e., to the dimming layer 11. In Figure 1, the power supply devices 100 are depicted as simplified dashed blocks, but the structure of the power supply devices 100 will be explained in detail later with reference to Figures 2 to 6.

[0024] When no driving voltage is applied between the pair of transparent conductive layers 12 (the dimming layer 11), the orientation of the liquid crystal molecules in the dimming layer 11 along its long axis is irregular. As a result, light incident on the dimming layer 11 is scattered, and the dimming device 10 appears cloudy (white dimming). In other words, the dimming device 10 is opaque.

[0025] On the other hand, when a driving voltage is applied between the pair of transparent conductive layers 12 (the dimming layer 11), the liquid crystal molecules in the dimming layer 11 are oriented, and the long axis direction of the liquid crystal molecules is aligned with the electric field direction between the pair of transparent conductive layers 12. As a result, light is more easily transmitted through the dimming layer 11, and the dimming device 10 becomes transparent. In this way, the dimming device 10 functions as a normal type (normal mode).

[0026] The dimming device 10 may include a pair of alignment layers that sandwich the dimming layer 11 between the dimming layer 11 and a pair of transparent conductive layers 12. The alignment layers are layers that control the orientation of liquid crystal molecules contained in the dimming layer 11, and when no driving voltage is applied, they orient the liquid crystal molecules along the direction normal to the alignment layers. In a configuration that includes alignment layers, when a driving voltage is applied between the pair of transparent conductive layers 12 (dimming layer 11), the dimming device 10 becomes opaque, and when no driving voltage is applied between the pair of transparent conductive layers 12 (dimming layer 11), the dimming device 10 becomes transparent (functions as a reverse type (reverse mode)). Examples of materials that constitute the alignment layers include organic compounds such as polyimide, polyamide, polyvinyl alcohol, and cyanide compounds, inorganic compounds such as silicon oxide and zirconium oxide, and silicon. Examples of orientation treatments for forming the alignment layers include rubbing treatment, polarized irradiation treatment, and microfabrication treatment.

[0027] Furthermore, the dimming layer 11 may contain a dye having a predetermined color that does not hinder the movement of liquid crystal molecules in accordance with the magnitude of the voltage applied to the dimming layer 11. Additionally, a dichroic dye and a black spacer may be added to the dimming layer 11. With this configuration, a dimming device 10 having a predetermined color can be realized. In other words, black dimming and colored dimming become possible.

[0028] The dimming device 10 can be cut into a desired shape from a large sheet of multilayer material comprising the layers that make up the dimming device 10, and used for various purposes. For example, the dimming device 10 can be transparent glass under normal circumstances, but can be applied to various uses such as dimming films, office partitions, laminated glass, frosted glass, etc., to block the view from the inside and outside at specific times.

[0029] <Conventional Technical Challenges> Currently, dimmable films (dimming devices) that control transmittance using liquid crystals are used in various fields, such as windows of buildings and vehicles, or partitions for privacy protection. Dimmable films are made by sandwiching a layer having liquid crystal (dimmable layer, liquid crystal layer) between a pair of transparent substrates (outer support layers) having a conductive film. Electrodes (power supply devices) are formed on the conductive film of these transparent substrates. The conductive films are formed opposite each other, with the liquid crystal layer in between. By controlling the energization and de-energy of these electrodes (power supply devices), the liquid crystal is driven to control transmittance, and the electrodes (power supply devices) are covered with a UV-curable sealant (sealing layer). For example, when dimmable films are used in automotive applications, high reliability such as heat resistance and light resistance is required, but conventional electrodes (power supply devices) cannot be said to meet such high requirements.

[0030] Figures 7A to 7F show an example of the manufacturing process (construction process) of a conventional power supply device and its technical challenges.

[0031] In Figure 7A, an electrode portion (for example, a comb-shaped electrode or a comb-tooth electrode) made of a material such as copper (Cu) is formed on the underside of the wiring portion, which is made of a cover film such as an FPC (Flexible Printed Circuits). The electrode portion is formed only on the central side of the underside of the wiring portion, not on the entire underside of the wiring portion, and not on the peripheral side of the underside of the wiring portion.

[0032] In Figure 7B, an anisotropic conductive part such as ACF (Anisotropic Conducting Film) is crimped (temporarily crimped) to the portion of the underside of the wiring section where the electrode portion is formed. Due to its properties (function), it is common practice in conventional technology to form the anisotropic conductive part only in the portion corresponding to the electrode portion. Similar to the electrode portion, it is formed only on the central side of the underside of the wiring section, not on the entire underside of the wiring section, and not on the peripheral side of the underside of the wiring section. In other words, when viewed from above, the electrode portion and the anisotropic conductive part are arranged with a gap between them and the peripheral (end) portion of the wiring section.

[0033] In Figure 7C, the composite (laminated) body of the electrode section, wiring section, and anisotropic conductive section is thermocompressed (mainly compressed) onto the transparent electrode layer (electrode section of the dimming film) formed on the stepped section (half-cut section) of the dimming film (dimming device). By thermocompressing the anisotropic conductive section (ACF) between the upper and lower electrodes to connect them, conductive particles are crushed and come into contact with each other in the direction of compression, forming a conductive path. At the same time, the uncrushed particles remain dispersed in the resin, thus maintaining insulation between adjacent electrodes in the planar direction. Furthermore, as the resin heat-cures in this state, the electrodes are physically bonded, fixed, and sealed together. In this way, the power supply device consisting of the electrode section, wiring section, and anisotropic conductive section is attached to the dimming film (dimming device).

[0034] In Figure 7D, a sealant (sealing layer) is applied from above to protect the power supply device, which consists of an electrode section, a wiring section, and an anisotropic conductive section (to protect the electrode section). At that time, a gap is formed between the electrode section and the anisotropic conductive section and the peripheral (end) portion of the wiring section within the area covered by the sealant (sealing layer).

[0035] In Figure 7E, during the application of the sealant (sealing layer), the sealant (sealing layer) flows into (or attempts to flow into) the gap between the electrode portion and the anisotropic conductive portion and the peripheral portion (end) of the wiring portion. Instead, air from within the gap enters the interior of the sealant (sealing layer), generating bubbles (first bubble generation mechanism).

[0036] In Figure 7F, the sealant (sealing layer) is cured by irradiating it with UV light. During this process, the heat generated by the UV irradiation causes air bubbles inside the sealant (sealing layer) to expand. Furthermore, the heat generated by the UV irradiation causes the air in the gap between the electrode and anisotropic conductive parts and the peripheral (end) parts of the wiring to expand, forming bubbles that escape into the sealant (sealing layer). These constitute the second bubble generation mechanism.

[0037] If air bubbles form inside the sealant (sealing layer) or if these bubbles expand, the sealant (sealing layer) may not be able to perform its function, which increases the risk of electrode failure (malfunction of the power supply device). Furthermore, in areas where large air bubbles are present, the thickness of the sealant (sealing layer) decreases, reducing the strength and durability of the electrode section, which also increases the risk of electrode failure (malfunction of the power supply device).

[0038] The electrode section (power supply device) is the part that applies voltage to drive the dimming film (dimming device). However, the electrode section (power supply device) has low strength and durability against moisture such as water, so it needs to be covered with an insulating material. Covering with tape or other jigs is also possible, but currently, resin encapsulants are often used due to their advantages in airtightness and thin-film compatibility. On the other hand, during the application process (coating process) of the encapsulant (encapsulating layer), air bubbles are generated from the boundaries of the wiring section (FPC), creating a risk to the airtightness and durability of the encapsulant (encapsulating layer), and improvement is required.

[0039] Figures 8A to 8C illustrate another example of a technical problem in a conventional power supply device. In order to solve the technical problem described in Figures 7A to 7F, as shown in Figure 8A, an anisotropic conductive portion (ACF) longer than the wiring portion (FPC) is crimped to the wiring portion (FPC) (when viewed from above, the anisotropic conductive portion (ACF) protrudes significantly outward from the peripheral (end) portion of the wiring portion (FPC)). In this case, as shown in Figure 8B, the protruding portion of the anisotropic conductive portion (ACF) is double-stuck to the underside of the wiring portion (FPC), resulting in a cosmetic defect, or as shown in Figure 8C, the protruding portion of the anisotropic conductive portion (ACF) wraps around to the upper side of the wiring portion (FPC) and sticks, resulting in a cosmetic defect.

[0040] <Technical Concept of the Invention> The inventors of this invention have completed the present invention by conceiving a high-quality power supply device in which the electrode section, wiring section, and anisotropic conductive section are optimally arranged, taking the above-mentioned problems as important technical challenges.

[0041] More specifically, in the crimping process of the wiring section (FPC) and the anisotropic conductive section (ACF) of the power supply device of this embodiment, the anisotropic conductive section (ACF) is crimped to the peripheral edge (end) of the wiring section (FPC) within a specified width range. This reduces the gap between the wiring section (FPC) and the anisotropic conductive section (ACF), thereby reducing the probability of air bubble generation in the sealant (sealing layer) and the size of air bubbles if they do occur, preventing electrode failures (malfunctions of the power supply device) and improving the appearance.

[0042] In other words, the power supply device of this embodiment revises the conventional technical common sense of forming the anisotropic conductive portion (ACF) only in the portion corresponding to the electrode portion when crimping the anisotropic conductive portion (ACF) to the wiring portion (FPC), and forms the anisotropic conductive portion (ACF) so that it extends beyond the electrode portion to the peripheral portion (end) of the wiring portion (FPC) or its vicinity, or in other words, aligns the position of the peripheral portion (end) of the wiring portion (FPC) and the anisotropic conductive portion (ACF).

[0043] When viewed from above, the anisotropic conductive portion (ACF) extends toward the peripheral edge (end) of the wiring portion (FPC) to fill the gap between it and the peripheral edge (end) of the wiring portion (FPC). Also, when viewed from above, the electrode portion is positioned with a gap between it and the peripheral edge (end) of the wiring portion (FPC), and the anisotropic conductive portion (ACF) extends beyond the peripheral edge (end) of the electrode portion toward the peripheral edge (end) of the wiring portion (FPC) to fill the gap between the peripheral edge (end) of the wiring portion (FPC) and the electrode portion.

[0044] More specifically, it is preferable that the power supply device of the present embodiment satisfies the following conditional expression (1). (1) -0.5 ≤ a ≤ 0.5 However, a: the distance (mm) between the peripheral edge (end portion) of the wiring portion (FPC) and the extending end portion of the anisotropic conductive portion (ACF), When the value of a is negative: the case where the extending end portion of the anisotropic conductive portion (ACF) is inside the peripheral edge (end portion) of the wiring portion (FPC), When the value of a is positive: the case where the extending end portion of the anisotropic conductive portion (ACF) is outside the peripheral edge (end portion) of the wiring portion (FPC), When the value of a is 0: the case where the extending end portion of the anisotropic conductive portion (ACF) coincides with the peripheral edge (end portion) of the wiring portion (FPC), respectively mean.

[0045] Even within the range that satisfies the conditional expression (1), it is preferable to satisfy the following conditional expression (1X), more preferably to satisfy the following conditional expression (1Y), and ultimately, it is preferable to satisfy the following conditional expression (1Z). (1X) -0.3 ≤ a ≤ 0.3 (1Y) -0.1 ≤ a ≤ 0.1 (1Z) a = 0

[0046] When the extending end portion of the anisotropic conductive portion (ACF) protrudes outside the peripheral edge (end portion) of the wiring portion (FPC) beyond the upper limit of the conditional expression (1), the protruding portion of the anisotropic conductive portion (ACF) on the lower side of the wiring portion (FPC) may be double-stuck and cause an appearance defect, or the protruding portion of the anisotropic conductive portion (ACF) may wrap around to the upper side of the wiring portion (FPC) and stick, resulting in an appearance defect. That is, the problems described with reference to FIGS. 8A to 8C will occur.

[0047] When the extending end portion of the anisotropic conductive portion (ACF) remains inside the peripheral edge (end portion) of the wiring portion (FPC) beyond the lower limit of the conditional expression (1), the gap between the wiring portion (FPC) and the anisotropic conductive portion (ACF) becomes too large, increasing the probability of air bubble generation in the sealing agent (sealing layer) and the size of the air bubbles when they occur, making it easy to induce electrode defects (malfunctions of the power supply device) and deteriorating the appearance. That is, the problems described with reference to FIGS. 7A to 7F will occur.

[0048] By satisfying conditional expression (1), more preferably conditional expression (1X), more preferably conditional expression (1Y), and more preferably conditional expression (1Z), the problems described with reference to FIGS. 7A to 7F and FIGS. 8A to 8C can be solved, and a high-quality power supply device with an optimal arrangement of the electrode portion, the wiring portion (FPC), and the anisotropic conductive portion (ACF) can be realized. The technical effect (critical significance) of conditional expression (1) will be described in detail in <Numerical Examples & Demonstration Experiments> described later.

[0049] <Specific Embodiment> Subsequently, the power supply device 100 of the present embodiment will be described in detail with reference to FIGS. 2 to 6. FIG. 2 is a plan view showing an example of the configuration of the power supply device 100. In FIG. 2, the horizontal direction (left-right direction) is defined as the long side direction, and the vertical direction (up-down direction) is defined as the short side direction. FIGS. 3A and 3B are cross-sectional views along the long side direction of the power supply device 100. FIG. 3A depicts the case where the value of a in conditional expression (1) is negative, and FIG. 3B depicts the case where the value of a in conditional expression (1) is positive. FIGS. 4A and 4B are plan views focusing on the end portion in the long side direction of the power supply device 100, and FIG. 4B is an enlarged view of the main part of FIG. 4A. FIGS. 5A and 5B are cross-sectional views along the short side direction of the power supply device 100. FIG. 5A depicts the case where the value of a in conditional expression (1) is negative, and FIG. 5B depicts the case where the value of a in conditional expression (1) is positive. FIGS. 6A and 6B are plan views focusing on the end portion in the short side direction of the power supply device 100, and FIG. 6B is an enlarged view of the main part of FIG. 6A.

[0050] The power supply device 100 is attached to the dimming device 10 as an object and supplies power to the dimming device 10. More specifically, the power supply device 100 has an electrode portion 110 located on the side closer to the dimming device 10 and a wiring portion 120 located on the side farther from the dimming device 10. The power supply device 100 also has an anisotropic conductive portion 130. The anisotropic conductive portion 130 is interposed between the electrode portion 110 and the wiring portion 120, has conductivity in the lamination direction of the electrode portion 110 and the wiring portion 120 (the up-down direction in FIGS. 3A, 3B, and FIGS. 5A, 5B), and has insulation in the direction intersecting (for example, orthogonal) to the lamination direction of the electrode portion 110 and the wiring portion 120 (the left-right direction in FIGS. 3A, 3B, and FIGS. 5A, 5B).

[0051] The dimming device 10 has a first stepped portion (first half-cut portion) 15 and a second stepped portion (second half-cut portion) 16. The power supply device 100, that is, the assembly (laminated body) of the electrode portion 110, the wiring portion 120, and the anisotropic conductive portion 130, is fixed to the upper surface of the transparent conductive layer 12 exposed on these stepped portions (half-cut portions) 15 and 16 by thermocompression bonding. Figures 3A, 3B and 5A and 5B depict one power supply device 100 provided on one of the stepped portions (half-cut portions) 15 and 16, but in reality, a power supply device 100 is provided on each of the stepped portions (half-cut portions) 15 and 16. Since the two power supply devices 100 have a common (symmetrical) structure, only one power supply device 100 will be described below.

[0052] By heat-pressing the anisotropic conductive portion 130 between the transparent conductive layer 12, the electrode portion 110, and the wiring portion 120 (referred to as the three electrodes), conductive particles are crushed and come into contact with the electrodes (the three electrodes) in the direction of compression, forming conductive paths. At the same time, the uncrushed particles remain dispersed in the resin, thus maintaining insulation between adjacent electrodes in the planar direction. Furthermore, as the resin heat-cures in this state, the electrodes (the three electrodes) can be physically bonded, fixed, and sealed together. In this way, the power supply device 100, consisting of the electrode portion 110, the wiring portion 120, and the anisotropic conductive portion 130, is attached to the dimming device 10.

[0053] Although the power supply device 100 of this embodiment has various parameters such as the shape and size of the anisotropic conductive part 130 that differ from conventional devices, its manufacturing method can be basically the same as the steps in Figures 7A to 7F described above.

[0054] The electrode portion 110 is configured as a comb-shaped electrode or comb-tooth electrode, having a pair of short side portions 111 extending in the short side direction, a pair of long side portions 112 connecting both ends of the pair of short side portions 111, and a comb-tooth portion 113 extending parallel to the pair of short side portions 111 from one of the pair of long side portions 112 toward the other. Note that each pair of short side portions 111 and long side portions 112 does not necessarily have to consist only of straight ends, and may partially have various shapes such as irregularities or waves.

[0055] The wiring section 120 is made of a printed circuit board (wiring board), such as an FPC (Flexible Printed Circuits). The wiring section 120 has a T-shape (approximately T-shape) in plan view, with an electrode covering section 121 that extends in the direction of the longer side and covers the entire area (approximately the entire area) of the electrode section 110 and has a rectangular (approximately rectangular) shape in plan view, and an extended section 122 that extends in the direction of the shorter side from the center of the electrode covering section 121 in the direction of the longer side.

[0056] The anisotropic conductive portion 130 is made of, for example, ACF (Anisotropic Conducting Film). The anisotropic conductive portion 130 may be read as "anisotropic conductive film" or "anisotropic conductive film." The anisotropic conductive portion 130 has a rectangle (approximately a rectangle) in plan view, having a pair of short sides 111 of the electrode portion 110 and a pair of short sides 131 corresponding to the pair of short sides of the electrode covering portion 121 of the wiring portion 120, and a pair of long sides 112 of the electrode portion 110 and a pair of long sides 132 corresponding to the pair of long sides of the electrode covering portion 121 of the wiring portion 120. In Figure 2, for the sake of ease of drawing, the electrode portion 110 and wiring portion 120 are depicted separately from the anisotropic conductive portion 130 interposed between the electrode portion 110 and wiring portion 120. The figure is drawn with the image of the anisotropic conductive portion 130 being further bonded (laminated) to the combined body (laminated body) of the electrode portion 110 and wiring portion 120.

[0057] Referring to Figures 3 and 4, let's focus on the long-side end of the power supply device 100. In this case, when viewed from above, the long-side end of the electrode covering portion 121 of the wiring portion 120 includes the short-side portion 111 of the electrode portion 110 and faces it (forming a gap). The anisotropic conductive portion 130 fills the gap between the long-side end of the electrode covering portion 121 of the wiring portion 120 and the short-side portion 111 of the electrode portion 110, and extends toward the long-side end of the electrode covering portion 121 of the wiring portion 120 so as to satisfy the above-mentioned condition (1).

[0058] In Figures 4A and 4B, the installation area of ​​the anisotropic conductive part 130 is depicted in grayscale (dot pattern). The installation area of ​​the anisotropic conductive part 130 that is essential to satisfy condition (1) at the long-side end of the power supply device 100 is depicted in light gray (dots), and the range of possible values ​​for a in condition (1) (i.e., the range that satisfies -0.5 ≤ a ≤ 0.5) is depicted in dark gray (dots). In other words, at the long-side end of the power supply device 100, the anisotropic conductive part 130 is essential in the area depicted in light gray (dots), and at least a part of the area depicted in dark gray (dots) may be selectively added.

[0059] Referring to Figures 5 and 6, let's focus on the end of the power supply device 100 in the short-side direction. In this case, when viewed from above, the end of the electrode covering portion 121 of the wiring portion 120 in the short-side direction includes and faces the long-side portion 112 (comb-tooth portion 113) of the electrode portion 110 (particularly forming a gap in the comb-tooth portion 113). The anisotropic conductive portion 130 fills the gap between the end of the electrode covering portion 121 of the wiring portion 120 in the short-side direction and the long-side portion 112 (comb-tooth portion 113) of the electrode portion 110 (particularly the gap formed in the comb-tooth portion 113), and extends toward the end of the electrode covering portion 121 of the wiring portion 120 in the short-side direction, satisfying the above-described condition (1).

[0060] In Figures 6A and 6B, the installation area of ​​the anisotropic conductive part 130 is depicted in grayscale (dot pattern). The installation area of ​​the anisotropic conductive part 130 that is essential to satisfy condition (1) at the short-side end of the power supply device 100 is depicted in light gray (dots), and the range of possible values ​​for a in condition (1) (i.e., the range that satisfies -0.5 ≤ a ≤ 0.5) is depicted in dark gray (dots). In other words, at the short-side end of the power supply device 100, the anisotropic conductive part 130 is essential in the area depicted in light gray (dots), and at least a part of the area depicted in dark gray (dots) may be selectively added.

[0061] When the long and short sides are expressed together, in a plan view, the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121) faces the pair of short sides 111 of the electrode portion 110, the long side 112 (the long side 112 on which the comb teeth portion 113 is cut), and the comb teeth portion 113, forming a gap between them. The anisotropic conductive portion 130 extends toward the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121) to fill the gap between the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121), the pair of short sides 111 of the electrode portion 110, the long side 112 (the long side 112 on which the comb teeth portion 113 is cut), and the comb teeth portion 113, satisfying condition (1).

[0062] Even if the distinction between the long side direction and the short side direction is eliminated and condition (1) is not satisfied, the anisotropic conductive portion 130 only needs to extend toward the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121) so as to fill the gap between it and the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121) when viewed from above. Furthermore, the anisotropic conductive portion 130 only needs to extend beyond the peripheral edge of the electrode portion 110 (short side portion 111, long side portion 112, comb tooth portion 113) toward the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121) so as to fill the gap between the peripheral edge (end) of the wiring portion 120 (electrode covering portion 121) and the electrode portion 110 (short side portion 111, long side portion 112, comb tooth portion 113) when viewed from above.

[0063] As shown in Figures 3A, 3B and 5A, 5B, the power supply device 100 has a composite (laminated) body of electrode parts 110, wiring parts 120, and anisotropic conductive parts 130, and in particular a sealing part (sealant, sealing layer) 140 that seals the peripheral (end) of the composite (laminated) body.

[0064] In this embodiment, the anisotropic conductive portion 130 extends beyond the peripheral portion of the electrode portion 110 (short side portion 111, long side portion 112, comb tooth portion 113) toward the peripheral portion (end portion) of the wiring portion 120 (electrode covering portion 121) so as to fill the gap between the peripheral portion (end portion) of the wiring portion 120 (electrode covering portion 121) and the electrode portion 110 (short side portion 111, long side portion 112, comb tooth portion 113) and satisfy condition (1).

[0065] As a result, even if a sealing portion (sealant, sealing layer) 140 is formed on the combined body (laminated body) of the electrode portion 110, the wiring portion 120, and the anisotropic conductive portion 130, particularly on the peripheral edge (end) of the combined body (laminated body), the gap between the electrode portion 110 and the anisotropic conductive portion 130 and the peripheral edge (end) of the wiring portion 120 can be reduced. This reduces the probability of air bubbles forming in the sealing portion (sealant, sealing layer) 140 and, if air bubbles do form, reduces their size, thereby preventing electrode failure (malfunction of the power supply device 100) and improving the appearance.

[0066] <Numerical Examples & Verification Experiments> The inventors actually manufactured a power supply device of the numerical example that satisfies condition (1) and a power supply device of the comparative example that does not satisfy condition (1), using the criterion of whether or not condition (1) is satisfied. They then evaluated the quality of the appearance and the presence and size of bubbles. Figure 9 shows the results of the verification experiments for the numerical example and the comparative example.

[0067] The demonstration experiment was conducted as follows. First, an anisotropic conductive part (ACF) was attached to the wiring part (FPC), and the distance from the end of the wiring part (FPC) to the end of the anisotropic conductive part (ACF) (i.e., the value of a in conditional equation (1)) was measured using an optical microscope. When attaching the anisotropic conductive part (ACF) to the wiring part (FPC), the distance from the end of the wiring part (FPC) to the end of the anisotropic conductive part (ACF) (i.e., the value of a in conditional equation (1)) was controlled (adjusted) based on the width, length, and attachment position of the anisotropic conductive part (ACF). Next, after the wiring part (FPC) with the anisotropic conductive part (ACF) attached was pressed onto the electrode part of the light-adjusting film, a sealing layer was formed by applying a sealant made of UV-curing resin and UV curing it.

[0068] Furthermore, the quality of the appearance was judged visually and evaluated on a three-point scale as follows: ○: No overhang of the anisotropic conductive part (ACF) from the end of the wiring section (FPC) is visible at all (Pass) △: Slight overhang of the anisotropic conductive part (ACF) from the end of the wiring section (FPC) is visible (Passing grade) ×: Overhang of the anisotropic conductive part (ACF) from the end of the wiring section (FPC) is easily visible (Fail)

[0069] Furthermore, the presence and size of bubbles were measured using an optical microscope. Based on the diameter of the bubbles measured with the optical microscope, a three-stage evaluation was performed as follows: ○: No bubbles were generated, or bubbles with a diameter of 0.4 mm or less were generated (Pass) △: Bubbles with a diameter greater than 0.4 mm and less than 0.5 mm were generated (Passing grade) ×: Bubbles with a diameter greater than 0.5 mm were generated (Fail)

[0070] As shown in Figure 9, on either the long or short side of the wiring section (FPC), if the condition "-0.5 ≤ a ≤ 0.5" in equation (1) is satisfied, both the quality of the appearance and the presence and size of air bubbles are evaluated as ○ (pass). On the other hand, on either the long or short side of the wiring section (FPC), if the value falls below the lower limit of condition (1) (a < -0.5), the quality of the appearance is evaluated as ○ (pass), but the presence and size of air bubbles are evaluated as △ (passing grade) or × (fail). Also, on either the long or short side of the wiring section (FPC), if the value exceeds the upper limit of condition (1) (a > 0.5), the presence and size of air bubbles are evaluated as ○ (pass), but the quality of the appearance is evaluated as × (fail).

[0071] Furthermore, the range of "-1.0 ≤ a < -0.5" on the long and short sides of the wiring section (FPC) does not strictly satisfy condition (1) because the evaluation of appearance quality is ○ (passing grade), and the evaluation of the presence and size of air bubbles is △ (passing grade). However, to a certain extent, a high-quality power supply device with an optimal arrangement of the electrode section, wiring section (FPC), and anisotropic conductive section (ACF) has been realized. In other words, condition (1) is not an essential component of the power supply device of this embodiment, but rather is positioned as a secondary (preferred) component.

[0072] The present invention is not limited to the embodiments described above, and can be modified in various ways during implementation without departing from its essence. Furthermore, each embodiment may be combined as appropriate, and in that case, the combined effects can be obtained. Moreover, the above embodiments include various inventions, and various inventions can be extracted by selecting combinations from the multiple constituent elements disclosed. For example, if the problem can be solved and effects obtained even if some constituent elements are deleted from all the constituent elements shown in the embodiment, then the configuration with these deleted constituent elements can be extracted as an invention.

[0073] This application is based on Japanese Patent Application No. 2024-182309, filed on October 18, 2024. All of its contents are included here.

Claims

1. A power supply device that is attached to an object and supplies power to the object, comprising: an electrode portion located on the side closer to the object; a wiring portion located on the side farther from the object; and an anisotropic conductive portion interposed between the electrode portion and the wiring portion, which is conductive in the stacking direction of the electrode portion and the wiring portion and insulated in the direction intersecting the stacking direction, wherein, when viewed from above, the anisotropic conductive portion extends toward the peripheral edge of the wiring portion so as to fill the gap between it and the peripheral edge of the wiring portion.

2. The power supply device according to claim 1, characterized in that, when viewed from above, the electrode portion is arranged with a gap between it and the peripheral edge of the wiring portion, and the anisotropic conductive portion extends beyond the peripheral edge of the electrode portion toward the peripheral edge of the wiring portion so as to fill the gap between the peripheral edge of the wiring portion and the electrode portion.

3. The power supply device according to claim 1 or 2, characterized in that it satisfies the following condition (1): (1) -0.5 ≤ a ≤ 0.5 where a: distance (mm) between the peripheral edge of the wiring portion and the extended end of the anisotropic conductive portion, a is negative: the extended end of the anisotropic conductive portion is inside the peripheral edge of the wiring portion, a is positive: the extended end of the anisotropic conductive portion is outside the peripheral edge of the wiring portion, a is 0: the extended end of the anisotropic conductive portion is at the same time as the peripheral edge of the wiring portion.

4. The power supply device according to claim 3, wherein the electrode portion has a pair of short sides, a long side connecting the ends of the pair of short sides, and a comb-tooth portion extending from the long side parallel to the pair of short sides, and when viewed from above, the peripheral edge of the wiring portion includes the pair of short sides, the long side, and the comb-tooth portion of the electrode portion and faces them, and the anisotropic conductive portion extends toward the peripheral edge of the wiring portion to fill the gap between the peripheral edge of the wiring portion and the pair of short sides, the long side, and the comb-tooth portion of the electrode portion, thereby satisfying the conditional expression (1).

5. The power supply device according to claim 1 or 2, characterized in that it has a sealing portion that seals the laminate of the electrode portion, the wiring portion and the anisotropic conductive portion.

6. The object is a dimming device having a dimming layer and a pair of outer support layers provided on both sides of the dimming layer, and the dimming device switches between a transparent state and an opaque state by switching between a state of energization and a state of de-energization to the dimming layer via the pair of outer support layers using the power supply device, characterized in that the power supply device is described in claim 1 or 2.

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