Thin chamber-type heat dissipation device and method for producing same

Abstract

A thin chamber-type heat dissipation device according to one aspect of the present invention may comprise: a lower plate having a chamber therein; a porous body disposed in the chamber and comprising metal foam; and an upper plate coupled to the lower plate to seal same.

Description

Thin-plate chamber type heat dissipation device and method of manufacturing the same

[0001] The present invention relates to a thin-plate chamber type heat dissipation device and a method for manufacturing the same, and more specifically, to a thin-plate chamber type heat dissipation device with improved boiling performance and a method for manufacturing the same.

[0002] Generally, portable electronic devices are equipped with circuit elements, batteries, etc., to display information on a screen, output sound, and maintain set operations, thereby providing convenience and assistance to the user's daily life.

[0003] Recent portable electronic devices generate significant heat due to the high workload caused by fast CPU / GPU processing speeds and the ability to perform various tasks; however, it is difficult to install effective cooling systems due to the slim structure of these devices.

[0004] Therefore, portable electronic devices can generate significant heat, and this excessive heat can cause discomfort and anxiety to the user.

[0005] In addition, since heat generated by portable electronic devices can damage semiconductors or cause operational errors, it is desirable to cool the device by dissipating the heat generated as quickly as possible.

[0006] Generally, a vapor chamber is installed inside a portable electronic device, and the working fluid contained within the vapor chamber can rapidly absorb heat generated inside the portable electronic device and boil (dissipate heat / cool).

[0007] In order to improve such boiling performance, conventional methods involved scratching or sanding the base material of a copper vapor chamber to increase roughness, but the expected boiling performance was not achieved.

[0008] In addition, although a groove pattern was formed on the base material, the processing cost was high and the expected boiling performance was not achieved.

[0009] The present invention provides a thin-wall chamber type heat dissipation device with improved boiling performance and a method for manufacturing the same.

[0010] A thin-plate chamber type heat dissipation device according to one aspect of the present invention may include a lower plate having a chamber inside, a porous body disposed in the chamber and comprising a metal foam, and an upper plate coupled to the lower plate to seal the lower plate.

[0011] As described above, according to one aspect of the present invention, a thin-wall chamber type heat dissipation device may include a porous body to improve the boiling performance of the working fluid.

[0012] In addition, the lower layer of the porous body is made of metal foam and has a loose form, while the upper layer is electroplated on the upper surface of the metal foam and has a denser form than the lower layer. This allows the lower layer to continuously absorb the working fluid and the upper layer to easily discharge the working fluid from the porous body as it forms bubbles and undergoes a phase change. This ensures excellent boiling performance of the thin-wall chamber type heat dissipation device.

[0013] FIG. 1 is a schematic perspective view illustrating an example of a thin-plate chamber type heat dissipation device according to one embodiment of the present invention.

[0014] FIG. 2 is an exploded perspective view schematically illustrating the thin-plate chamber type heat dissipation device of FIG. 1.

[0015] FIG. 3 is a schematic cross-sectional view illustrating an example of the AA cross-section of FIG. 1.

[0016] FIG. 4 is a cross-sectional view schematically illustrating an example of part A of FIG. 3.

[0017] FIG. 5 is a cross-sectional view schematically illustrating another example of part A of FIG. 3.

[0018] Figure 6 is a schematic plan view illustrating an example of the BB cross-section of Figure 5.

[0019] Figure 7 is a plan view schematically illustrating another example of the BB cross-section of Figure 5.

[0020] FIG. 8 is a flowchart illustrating a method for manufacturing a thin-plate chamber type heat dissipation device according to one embodiment of the present invention.

[0021] A thin-plate chamber type heat dissipation device according to one aspect of the present invention may include a lower plate having a chamber inside, a porous body disposed in the chamber and comprising a metal foam, and an upper plate coupled to the lower plate to seal the lower plate.

[0022] In this embodiment, the lower plate may further include a plurality of internal supports protruding from the upper surface of the lower plate.

[0023] In the present embodiment, the porous body may include a lower layer disposed on the upper surface of the lower plate and an upper layer located on the lower layer, having a pore size smaller than that of the lower layer.

[0024] In this embodiment, the upper layer may be an area where the pore size of the metal foam is reduced by electroplating.

[0025] In this embodiment, the lower layer may include the same material as the lower plate.

[0026] In the present embodiment, the lower layer may include a first lower layer disposed on the upper surface of the lower plate and a second lower layer disposed on the upper surface of the first lower layer.

[0027] In this embodiment, the lower layer may include a flow path between the first lower layer and the second lower layer.

[0028] In this embodiment, the Euro groove may be in the form of a straight line or a grid.

[0029] A method for manufacturing a thin-plate chamber-type heat dissipation device according to another aspect of the present invention comprises a porous body forming step of arranging a porous body on a lower plate having a chamber inside, a sealing step of sealing the lower plate by joining an upper plate to the lower plate, and an operating fluid injection step of injecting an operating fluid into the chamber, wherein the porous body may be formed by including a metal foam.

[0030] In the present embodiment, the porous body comprises a lower layer and an upper layer located on the lower layer, the upper layer having a smaller pore size than the lower layer, and the upper layer can be formed by electroplating on the upper surface of the metal foam.

[0031] In this embodiment, the porous body forming step can fix the lower surface of the lower layer to the upper surface of the lower plate.

[0032] In the present embodiment, the lower layer may include a first lower layer and a second lower layer formed sequentially.

[0033] In this embodiment, the porous body forming step may form a flow channel groove between the first lower layer and the second lower layer.

[0034] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are to be illustrated and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0035] The terms used in this invention are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this invention, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that in the accompanying drawings, identical components are indicated by the same reference numerals whenever possible. Furthermore, detailed descriptions of known functions and configurations that may obscure the essence of the present invention will be omitted. For the same reason, some components in the accompanying drawings may be exaggerated, omitted, or schematically depicted.

[0037] Hereinafter, a thin-plate chamber type heat dissipation device according to one embodiment of the present invention will be described.

[0038] FIG. 1 is a schematic perspective view illustrating an example of a thin-plate chamber type heat dissipation device according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view schematically illustrating the thin-plate chamber type heat dissipation device of FIG. 1.

[0039] Referring to FIGS. 1 and 2, a thin-wall chamber type heat dissipation device (100) according to one embodiment of the present invention may include a lower plate (110), a porous body (120), an upper plate (130), and an internal support (140).

[0040] The lower plate (110) may be made of a square plate or a circular plate, and a chamber (111) formed in the shape of a groove may be formed in the lower plate (110). The lower plate (110) may be placed on top of a hot spot such as a CPU / GPU.

[0041] The internal support (140) is formed as a structure that extends in one direction, and a plurality of internal supports (140) can be evenly distributed on the lower plate (110).

[0042] Here, the shape of the internal support (140) is not limited to this and can be made in various shapes such as a cylinder, an elliptical cylinder, a rectangular cylinder, etc.

[0043] A porous body (120) may be disposed within the chamber (111) of the lower plate (110). The porous body (120) accelerates the boiling of the working fluid and may be formed in the shape of a square plate or a disc. As an example, the porous body (120) may include metal foam.

[0044] An injection port (113) for injecting a working fluid and a welding groove (112) for welding to an upper plate (130) may be formed in the lower plate (110). The welding groove (112) supports the upper plate (130) when the lower plate (110) and the upper plate (130) are joined, and may be formed along the edge of the lower plate (110). Thus, the chamber (111) is located inside the welding groove (112). Additionally, the injection port (113) may be formed by removing a portion of the welding groove (112).

[0045] The upper plate (130) may be made of a rectangular or circular flat plate, but is not limited thereto. For example, the upper plate (130) may have a smaller size than the lower plate (120) and may be joined to the lower plate (120) with its edges supported by a welding groove (112). After the lower plate (110) and the upper plate (130) are joined, the upper plate (130) and the lower plate (110) may be joined by welding along the welding groove (112).

[0046] A weld (WL, see FIG. 1) is formed by welding the upper plate (130) and the lower plate (110), and the weld (WL) is formed along the side edge of the upper plate (130), and the upper end of the weld groove (112) and the upper plate (130) can be joined by the weld (WL).

[0047] FIG. 3 is a schematic cross-sectional view illustrating an example of the AA section of FIG. 1, and FIG. 4 is a schematic cross-sectional view illustrating an example of the A section of FIG. 3.

[0048] Referring to FIGS. 3 and 4, the porous body (120) may include a lower layer (121) and an upper layer (122) having different pore sizes, which are located in the center of the chamber (111). For example, the pore size of the lower layer (121) may be larger than the pore size of the upper layer (122), and the upper layer (122) may be located on the lower layer (121).

[0049] Such a porous body (120) can be divided into a lower layer (121) with a relatively large pore size and an upper layer (122) with a reduced pore size due to electroplating by electroplating the upper surface of the metal foam. Meanwhile, the metal foam can be fixed to the lower plate (110) by welding or rolling.

[0050] Metal foam refers to a foamed metal in which uniform nano-sized pores are formed, and it can be manufactured using the casting method, which is a representative manufacturing method.

[0051] These casting methods can be divided into the bubble generation method, in which a metal ingot is melted to create a molten metal and then a foaming agent is added to separate, expand, and grow bubbles through a chemical reaction at high temperatures, and the gas injection method, in which a gas such as hydrogen, argon, or air is directly injected into the molten metal to produce foamed metal.

[0052] In addition, metal foam can also be manufactured by a dealloying method in which two or more different metal powders are mixed and bonded by a mechanical alloying method, and then a relatively less noble metal among the metals constituting the alloy is removed from the formed metal alloy.

[0053] Meanwhile, the lower plate (110) is made of copper, which has good thermal conductivity, and the metal foam is also made of the same material as the lower plate (110) so that thermal conductivity can be maintained and warping due to thermal expansion can be prevented.

[0054] As previously explained, the upper layer (122) of the porous body (120) is defined as an upper region in which the pore size of the metal foam is reduced by electroplating on the upper surface of the metal foam, so that the lower layer (121) has a hydrophilic structure with a loose form, and the upper layer (122) can have a hydrophobic structure with a relatively dense form compared to the lower layer (121).

[0055] Accordingly, the pore size of the lower layer (121) is formed to be larger than the pore size of the upper layer (122), and the lower layer (121) continuously absorbs the working fluid by the capillary effect, and the upper layer (122) allows the working fluid to change phase into bubbles and be easily discharged from the porous body (120), thereby ensuring that the porous body (120) can secure excellent boiling performance.

[0056] Here, boiling performance can be controlled by adjusting the thickness and PPI (pore per inch) of the metal foam and by adjusting the size of the pores formed in the upper layer (122) according to the process conditions of electroplating.

[0057] Additionally, the thickness (T1) of the lower layer (121) may be greater than the thickness (T2) of the upper layer (122). If the thickness (T1) of the lower layer (121) is greater than the thickness (T2) of the upper layer (122), the amount of fluid absorbed by the lower layer (121) is greater than the amount of fluid evaporated by the upper layer (122), so fluid can be continuously supplied to the porous body (120), and the flow of fluid can circulate smoothly within the thin-plate chamber type heat dissipation device (100), thereby improving the cooling efficiency of the thin-plate chamber type heat dissipation device (100).

[0058] FIG. 5 is a schematic cross-sectional view illustrating another example of part A of FIG. 3, FIG. 6 is a schematic plan view illustrating one example of the BB cross section of FIG. 5, and FIG. 7 is a schematic plan view illustrating another example of the BB cross section of FIG. 5.

[0059] First, referring to FIG. 5, the porous body (120') is located in the center of the chamber (111) and may include a lower layer (121') and an upper layer (122') having different pore sizes. For example, the pore size of the lower layer (121') may be larger than the pore size of the upper layer (122'), and the upper layer (122') may be located on the lower layer (121'). Additionally, the lower layer (121') may include a first lower layer (121'b) and a second lower layer (121'a).

[0060] The first lower layer (121'a) is fixed by placing the lower plate (110) on the upper surface, the second lower layer (121'b) is fixed by placing it on the upper surface of the first lower layer (121'a), and the upper layer (122) can be formed by electroplating on the upper surface of the second lower layer (121'b).

[0061] The first lower layer (121'a) and the second lower layer (121'b) can be made of the same metal foam and can be fixed by welding or rolling.

[0062] A flow channel groove (121'c) is formed on the upper surface of the first lower layer (121'a), and the working fluid can be absorbed more smoothly into the lower layer (121') through the flow channel groove (121'c), thereby increasing the boiling performance.

[0063] Figures 6 and 7 each show an example of the Euro shown in Figure 5.

[0064] Referring to FIGS. 6 and 7, the Euro groove (121'c) may be formed in a straight line (121'ca) or grid (121'cb) shape and may be connected to the chamber (111, see FIG. 5). However, the shape of the Euro groove (121'c) is not limited to this and can be modified into various shapes such as radial or zigzag.

[0065] FIG. 8 is a flowchart illustrating a method for manufacturing a thin-plate chamber type heat dissipation device according to one embodiment of the present invention.

[0066] Referring together to FIGS. 1 to 8, a method (S100) for manufacturing a thin-plate chamber type heat dissipation device according to one embodiment of the present invention may include a porous body forming step (S110), a sealing step (S120), and an operating fluid injection step (S130).

[0067] The porous body formation step (S110) may include a step of electroplating the upper surface of the metal foam. The upper region of the metal foam, in which the pore size is reduced by electroplating, becomes the upper layer (122), and the remaining region of the metal foam, which is not electroplated and has a larger pore size than the upper layer (122), may form the lower layer (121). At this time, the thickness of the lower layer (121) may be thicker than the thickness of the upper layer (122).

[0068] For example, after placing a metal foam on a lower plate (110), the upper surface of the metal foam may be electroplated to form a lower layer (121) and an upper layer (122), or electroplating may be performed first on the upper surface of the metal foam to form a lower layer (121) and an upper layer (122), and then the metal foam may be placed on the lower plate (110). The metal foam may be fixed to the upper surface of the lower plate by welding or rolling.

[0069] Accordingly, the pore size of the lower layer (121) is formed to be larger than the pore size of the upper layer (122), and the working fluid is continuously absorbed by the capillary effect of the lower layer (121), and the working fluid can be easily discharged from the porous body (120) by changing phases into bubbles in the upper layer (122).

[0070] Meanwhile, as illustrated in FIG. 5, the lower layer (121') of the porous body (120') may include a first lower layer (121'a) and a second lower layer (121'b) (see FIG. 5).

[0071] The first lower layer (121'a) and the second lower layer (121'b) can be manufactured identically, and the lower layer (121') may include a Euro groove (121'c) between the first lower layer (121'a) and the second lower layer (121'b).

[0072] For example, a straight or grid-shaped channel groove (121'c) is formed on the upper surface of the first lower layer (121'a) by cutting or etching. As another example, a channel groove may be formed on the lower surface of the second lower layer (121'b), or a channel groove may be formed together on the upper surface of the first lower layer (121'a) and the lower surface of the second lower layer (121'b).

[0073] Afterwards, a second lower layer (121'b) can be placed on the upper surface of the first lower layer (121'a) and fixed by welding or rolling, and an upper layer (122) can be formed by electroplating the upper surface of the second lower layer (121'b).

[0074] Meanwhile, the lower surface of the first lower layer (121'a) is fixed to the upper surface of the lower plate (110) by welding or rolling.

[0075] The sealing step (S120) seals the lower plate (110) by joining the upper plate (130) to the lower plate (110).

[0076] More specifically, an upper plate (130) is inserted into a welding groove (112) formed in a lower plate (110), and a weld (WL) is formed along the perimeter of the upper plate (130) on the upper surface of the upper plate (130) so that the upper end of the welding groove (112) and the side end of the upper plate (130) can be joined (see FIG. 3).

[0077] The working fluid injection step (S130) injects working fluid into the chamber (111).

[0078] More specifically, the working fluid consists of deionized water or other liquid, and the working fluid is injected through an inlet (113) formed in the lower plate (110), and the inlet (113) is sealed (see FIG. 2).

[0079] Although an embodiment of the present invention has been described above, those skilled in the art may modify and change the present invention in various ways by adding, changing, deleting, or adding components, etc., without departing from the spirit of the present invention as described in the claims, and such modifications and changes are also to be included within the scope of the rights of the present invention.

Claims

1. A lower plate having a chamber inside; A porous body disposed in the above chamber and comprising a metal foam; and A thin-wall chamber type heat dissipation device comprising: an upper plate that is combined with the lower plate and seals the lower plate.

2. In Paragraph 1, The above lower plate is a thin-plate chamber type heat dissipation device further comprising a plurality of internal supports protruding from the upper surface of the lower plate.

3. In Paragraph 1, The above porous body is, A lower layer disposed on the upper surface of the lower plate; and A thin-plate chamber type heat dissipation device comprising: an upper layer located on the lower layer and having a smaller pore size than the lower layer.

4. In Paragraph 3, The above upper layer is a thin-wall chamber type heat dissipation device in which the pore size of the metal foam is reduced by electroplating.

5. In Paragraph 3, The above lower layer is a thin-wall chamber type heat dissipation device comprising the same material as the lower plate.

6. In Paragraph 3, The above lower layer is a thin-plate chamber type heat dissipation device comprising a first lower layer disposed on the upper surface of the lower plate and a second lower layer disposed on the upper surface of the first lower layer.

7. In Paragraph 6, The above lower layer is a thin-wall chamber type heat dissipation device including a flow path between the first lower layer and the second lower layer.

8. In Paragraph 7, The above Euro groove is a thin-wall chamber type heat dissipation device in the form of a straight or grid.

9. A porous body forming step of placing a porous body on a lower plate having a chamber inside; A sealing step of sealing the lower plate by joining an upper plate to the lower plate; and A working fluid injection step for injecting a working fluid into the chamber; comprising A method for manufacturing a thin-wall chamber type heat dissipation device formed by including a metal foam in the above porous body.

10. In Paragraph 9, The above porous body comprises a lower layer and an upper layer located on the lower layer, the upper layer having a smaller pore size than the lower layer. A method for manufacturing a thin-wall chamber type heat dissipation device in which the upper layer is formed by electroplating the upper surface of the metal foam.

11. In Paragraph 10, The above porous body forming step is a method for manufacturing a thin-plate chamber type heat dissipation device that fixes the lower surface of the lower layer to the upper surface of the lower plate.

12. In Paragraph 9, A method for manufacturing a thin-plate chamber type heat dissipation device comprising a first lower layer and a second lower layer formed sequentially, wherein the above lower layer comprises a first lower layer and a second lower layer.

13. In Paragraph 12, The above porous body forming step is a method for manufacturing a thin-plate chamber type heat dissipation device that forms a flow channel groove between the first lower layer and the second lower layer.

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