Electronic device comprising camera

Abstract

An electronic device according to one embodiment comprises: a camera comprising a lens facing the rear side of the electronic device and an image sensor disposed on the lens; and a bracket for supporting the camera. The bracket includes a recess portion recessed from one surface of the bracket facing the camera toward the front side of the electronic device and at least partially aligned with the image sensor so as to increase a distance between the bracket and the image sensor. Various other embodiments may also be possible.

Description

Electronic device including a camera

[0001] The present disclosure relates to an electronic device including a camera.

[0002] The electronic device may include a camera. The camera may be used to capture images or videos. The camera may include a lens that acquires light reflected from a subject and an image sensor configured to convert the light acquired through the lens into an electrical signal. The camera may be placed inside the electronic device. For example, the camera may be supported by a bracket of the electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a display. The electronic device may include a rear plate opposite to the display. The electronic device may include a camera comprising a lens and an image sensor facing the rear plate of the electronic device. The electronic device may include a bracket supporting the camera. The bracket may include a recess portion that is recessed toward the display from one side of the bracket facing the camera and at least partially aligned with the image sensor, so as to increase the gap between the bracket and the image sensor.

[0005] An electronic device is disclosed. The electronic device may include a foldable housing comprising a first housing part and a second housing part. The electronic device may include a hinge assembly rotatably connecting the first housing part and the second housing part. The electronic device may include a display disposed on the foldable housing and defining the front side of the electronic device. The electronic device may include a camera disposed within the first housing part. The camera may include a lens facing the rear side of the electronic device and an image sensor disposed above the lens. The electronic device may include a bracket supporting the camera. The bracket may include a recess portion that is recessed toward the front side of the electronic device from one side of the bracket facing the camera and is at least partially aligned with the image sensor so as to increase the distance between the camera and the image sensor.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] FIG. 2 is a block diagram of a camera module according to one embodiment.

[0008] FIG. 3 is a rear view of an electronic device according to one embodiment.

[0009] Figure 4 illustrates the interior of the X region of Figure 3.

[0010] FIG. 5 is an exploded prospective view of a camera of an electronic device according to one embodiment.

[0011] Figure 6 is a drawing of the electronic device of Figure 4 with the camera omitted.

[0012] Figure 7 is a cross-sectional view of the electronic device of Figure 3 cut along A-A'.

[0013] FIGS. 8, FIGS. 9, and FIGS. 10 schematically illustrate a camera and a bracket.

[0014] FIG. 11a illustrates an example of an unfolded state of an electronic device according to one embodiment.

[0015] FIG. 11b illustrates an example of a folded state of an electronic device according to one embodiment.

[0016] FIG. 11c is an exploded view of an electronic device according to one embodiment.

[0017] FIG. 12 illustrates a folded state of an electronic device according to one embodiment.

[0018] FIG. 13 is a cross-sectional view of the electronic device of FIG. 12 cut along B-B'.

[0019] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0021] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0022] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0023] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0027] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0028] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0029] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0033] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0035] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0038] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0039] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0040] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] FIG. 2 is a block diagram of a camera module according to one embodiment.

[0043] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260).

[0044] A lens assembly (210) can collect light emitted from a subject that is the subject of image capture. The lens assembly (210) may include one or more lenses. According to one embodiment, a camera module (180) may include a plurality of lens assemblies (210). The camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties different from the lens properties of other lens assemblies. The lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0045] A flash (220) may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) may include one or more light-emitting diodes (e.g., RGB (red-green-blue) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. An image sensor (230) may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through a lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) may include one image sensor selected from image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0046] The image stabilizer (240) may move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operational characteristics of the image sensor (230) (e.g., adjusting read-out timing) in response to the movement of the camera module (180) or the electronic device (101) containing it. This allows for compensating for at least some of the negative effects caused by the movement on the image being captured. According to one embodiment, the image stabilizer (240) may detect such movement of the camera module (180) or the electronic device (101) using a gyroscope sensor (not shown) or an accelerometer sensor (not shown) placed inside or outside the camera module (180). According to one embodiment, the image stabilizer (240) may be implemented, for example, as an optical image stabilizer. The memory (250) may temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing operation. For example, if image acquisition by the shutter is delayed or multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and the corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Subsequently, when a specified condition is satisfied (e.g., user input or system command), at least a portion of the original image stored in the memory (250) may be acquired and processed, for example, by an image signal processor (260). According to one embodiment, the memory (250) may be configured as at least a portion of the memory (130) or as a separate memory that operates independently thereof.

[0047] The image signal processor (260) can perform one or more image processing operations on an image obtained through the image sensor (230) or an image stored in memory (250). The above one or more image processing methods may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softing). Additionally or generally, the image signal processor (260) may perform control (e.g., exposure time control, or readout timing control, etc.) over at least one of the components included in the camera module (180) (e.g., image sensor (230)). The image processed by the image signal processor (260) may be stored back in memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) is at least part of the processor (120). It may be configured as a separate processor that operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after additional image processing by the processor (120).

[0048] According to one embodiment, the electronic device (101) may include a plurality of camera modules, each having different attributes or functions. For example, at least one of the plurality of camera modules may be a wide-angle camera and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules may be a front camera and at least another may be a rear camera.

[0049] FIG. 3 is a rear view of an electronic device according to one embodiment. FIG. 4 illustrates the interior of the X region of FIG. 3. FIG. 5 is an exploded prospective view of a camera of an electronic device according to one embodiment. FIG. 6 is a drawing of the electronic device of FIG. 4 with the camera omitted.

[0050] Referring to FIG. 3, an electronic device (101) according to one embodiment may include cameras (310) (e.g., camera module (180) of FIG. 1) facing the rear side (e.g., -z direction) of the electronic device (101). The cameras (310) may be disposed within a housing (340) that forms the exterior of the electronic device (101).

[0051] According to one embodiment, the cameras (310) may include a first camera (311). The electronic device (101) may further include other cameras facing the rear side of the electronic device (101) in addition to the first camera (311). For example, the electronic device (101) may further include a second camera (312) and / or a third camera (313) as illustrated in FIG. 3, but embodiments of the present disclosure are not limited thereto. For example, the cameras (310) may each be at least one of a wide-angle camera, an ultra-wide-angle camera, or a telephoto camera. Each of the cameras (310) illustrated in FIG. 3 may be referred to as a rear camera in the view facing the rear side of the electronic device (101). A rear plate (341) defining at least a portion of the rear side of the electronic device (101) may include camera holes corresponding to the cameras (310). Each of the cameras (310) can be aligned with each of the camera holes.

[0052] In the present disclosure, for convenience of explanation, a structure related to the first camera (311) among the cameras (310) is described, but the descriptions below may be substantially applicable to the second camera (312) and / or the third camera (313) in addition to the first camera (311).

[0053] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a bracket (350). The bracket (350) may support components of the electronic device (101) that are placed inside the electronic device (101). For example, a first camera (311) may be placed on one side (351) of the bracket (350) and supported by the bracket (350). The bracket (350) may be wrapped by a side frame (360) that defines at least a portion of the lateral side of the electronic device (101). A molded portion (370) for connecting the side frame (360) and the bracket (350) may be placed between the side frame (360) and the bracket (350). As illustrated in FIG. 4, the first camera (311) may be positioned adjacent to the corner of the upper part of the bracket (350) (e.g., the side in the +y direction of the bracket (350)), but is not limited thereto. The bracket (350) and the side frame (360) may comprise a metal material, and the injection part (370) may comprise a resin.

[0054] According to one embodiment, the first camera (311) may be configured to acquire light reflected from a subject and generate an image or video. The electronic device (101) may take a photograph or video using the first camera (311). The image information or video information captured through the first camera (311) may be stored in a memory (e.g., memory (130) of FIG. 1).

[0055] Referring to FIG. 5, the first camera (311) may include a lens (410), an image sensor (420), a camera housing (430), an optical filter (440), a substrate (450), and / or a plate (460). The components of the camera illustrated in FIG. 5 are exemplary only, and the first camera (311) of the present disclosure is not limited to the components illustrated in FIG. 5.

[0056] According to one embodiment, the lens (410) may be configured to collect light reflected from a subject. For example, the lens (410) may be provided in multiple numbers. The lens (410) provided in multiple numbers may be referred to as a lens assembly. For example, the lens (410) may include a wide-angle lens and / or a telephoto lens. The first camera (311) may include a barrel (411) that encloses the lens (410) to protect the lens (410) and an actuator (not shown) for driving the lens (410). The actuator may be configured to adjust the position of the lens (410) to focus or provide optical image stabilization (OIS).

[0057] According to one embodiment, the image sensor (420) may be configured to convert light collected through the lens (410) into an electrical signal. The first camera (311) may display the electrical signal converted from the image sensor (420) on a display (e.g., the display module (160) of FIG. 1) or store it in memory. For example, the image sensor (420) may be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The image sensor (420) may be electrically connected to a substrate (450).

[0058] According to one embodiment, the camera housing (430) can protect the components of the first camera (311) (e.g., lens (410), image sensor (420), and / or optical filter (440)) by enclosing them, and can electrically shield said components. For example, the camera housing (430) can shield electromagnetic waves generated from the first camera (311) from being emitted outside the first camera (311) and shield electromagnetic waves from being transmitted from outside the first camera (311) to the components of the first camera (311). The camera housing (430) can be electrically connected to the ground layer of the substrate (450). The camera housing (430) may be referred to as a shield can in terms of shielding electromagnetic waves.

[0059] According to one embodiment, the optical filter (440) may be configured to filter light incident on the lens (410). The optical filter (440) may be configured to selectively transmit a portion of the light based on the spectrum of the light. The optical filter (440) may be placed between the lens (410) and the image sensor (420). For example, the optical filter (440) may be an infrared filter configured to block infrared light from the light passing through the lens (410). For example, in the case of a first camera (311) including a CCD or CMOS, since infrared light can cause noise or degrade chromatic aberration and resolution, the optical filter (440) may be placed between the image sensor (420) and the lens (410) to block infrared light reaching the image sensor (420). The optical filter (440) may be omitted.

[0060] According to one embodiment, the substrate (450) may be placed on the camera housing (430) (e.g., in the +z direction). For example, the substrate (450) may be a flexible printed circuit board electrically connected to the printed circuit board of the electronic device (101). For example, the substrate (450) may be configured to transmit power for driving the first camera (311), an electrical signal for controlling the first camera (311) transmitted from a processor (e.g., the processor (120) of FIG. 1), or an electrical signal converted from an image sensor (420). The substrate (450) may include a ground layer electrically connected to the ground of the electronic device (101). The camera housing (430) may be electrically connected to the ground layer of the substrate (450).

[0061] According to one embodiment, the camera housing (430) may include a first opening (432) formed on a first surface (431) of the camera housing (430) facing the rear side (e.g., -z direction) of the electronic device (101) and a second opening (e.g., the second opening (434) of FIG. 7) formed on a second surface (433) of the camera housing (430) facing the front side (e.g., +z direction) of the electronic device (101). For example, a portion of the lens barrel (411) may be disposed inside the camera housing (430), and another portion of the lens barrel (411) may be exposed outside the camera housing (430) through the first opening (432) of the camera housing (430).

[0062] According to one embodiment, the substrate (450) may include a third opening (451). The third opening (451) may be at least partially aligned with the second opening (434) of the image sensor (420) and the camera housing (430). A plate (460) of the first camera (311) may cover the third opening (451). For example, the plate (460) may be formed from stainless steel, but is not limited thereto. For example, the image sensor (420) may be positioned within the third opening (451) of the substrate (450) and electrically connected to the substrate (450). The plate (460) may protect the image sensor (420) by covering the third opening (451) of the substrate (450).

[0063] Referring to FIG. 6, a bracket (350) supporting a first camera (e.g., the first camera (311) of FIG. 4) may include a recess portion (610). For example, the recess portion (610) may be recessed from one side (351) of the bracket (350) facing the first camera (311) (e.g., the side of the bracket (350) facing the -z direction) toward the front side of the electronic device (101) (e.g., toward the +z direction). By the recessed portion (610), a stepped portion (630) may be formed between the recess portion (610) and a part (620) of the bracket (350) that is different from the recess portion (610). The recess portion may be referred to as a concave portion or a recessed portion.

[0064] According to one embodiment, the recess portion (610) may be at least partially aligned with the image sensor of the first camera (311) (e.g., the image sensor (420) of FIG. 5). As the thickness of the electronic device (101) becomes slimmer, the gap between the bracket (350) and the image sensor (420) (e.g., the first gap (G1) of FIG. 7) may be reduced. For example, as the gap between one side (351) of the bracket (350) facing the first camera (311) and the image sensor (420) is reduced, a collision between the image sensor (420) and the bracket (350) due to an external impact may occur. For example, when an external impact is applied to the electronic device (101), the image sensor (420) may move toward the bracket (350) (e.g., in the +z direction). Due to the movement of the image sensor (420), a collision may occur between the one surface (351) of the bracket (350) and the image sensor (420). Due to the collision, the image sensor (420) may be damaged.

[0065] An electronic device (101) according to one embodiment can increase the gap between an image sensor (420) and a bracket (350) through a recess portion (610) of a bracket (350). As the gap increases, the collision between the image sensor (420) and the bracket (350) can be reduced. Since the collision can be reduced, damage to the image sensor (420) caused by the collision can be reduced. Hereinafter, with reference to the drawings, the structure of a bracket (350) including a recess portion is described.

[0066] Figure 7 is a cross-sectional view of the electronic device of Figure 3 cut along A-A'.

[0067] Referring to FIG. 7, an electronic device (101) according to one embodiment may include a display (710) (e.g., a display module (160) of FIG. 1). For example, the display (710) may define at least a portion of the front side of the electronic device (101). For example, the other side (352) of the bracket (350) opposite to one side (351) of the bracket (350) facing the first camera (311) may support the display (710). The electronic device (101) may include a waterproof tape (720) placed between the other side (352) of the bracket (350) and the display (710).

[0068] According to one embodiment, the camera housing (430) may include a first opening (432) and a second opening (434). For example, the first opening (432) may be formed on a first surface (431) of the camera housing (430) facing the rear side of the electronic device (101) (e.g., facing the -z direction). For example, the second opening (434) may be formed on a second surface (433) of the camera housing (430) facing the front side of the electronic device (101) (e.g., facing the +z direction). A lens (410) may protrude outside the camera housing (430) through the first opening (432). A third opening (451) of a substrate (450) on which an image sensor is placed may be at least partially aligned with the second opening (434) of the camera housing (430).

[0069] According to one embodiment, the bracket (350) may include a recessed portion (610) that is recessed toward the front side (e.g., +z direction) of the electronic device (101) from one side (351) of the bracket (350) facing the camera, so as to increase the gap (e.g., first gap (G1)) between the image sensor (420) of the first camera (311) and the bracket (350). The recessed portion (610) may be at least partially aligned with the image sensor (420). The image sensor (420) may be positioned above the lens (410) (e.g., +z direction). For example, when viewing the electronic device (101) from below (e.g., when viewing the electronic device (101) in the +z direction), the image sensor (420) may be at least partially overlapped with the recessed portion (610) of the bracket (350).

[0070] According to one embodiment, the gap between the bracket (350) and the image sensor (420) can be increased by the recess portion (610). For example, the first gap (G1) between the recess portion (610) of the bracket (350) and a virtual straight line (VL) parallel to the image sensor (420) can be larger than the second gap (G2) between the recess portion (610) of the bracket (350) and a different part (620) of the bracket (350) and the virtual line segment. Since the recess portion (610) is formed by recessing a part of the bracket (350), the recess portion (610) can be moved away from the image sensor (420).

[0071] According to one embodiment, the first thickness (T1) of the recess portion (610) of the bracket (350) may be thinner than the second thickness (T2) of a portion (620) of the bracket (350) that is different from the recess portion (610) of the bracket (350). For example, after manufacturing the bracket (350), a process of indenting one surface (351) of the bracket (350) may be performed to form the recess portion (610). For example, the recess portion (610) may be formed by polishing one surface (351) of the bracket (350), but is not limited thereto. A recessed portion (610) that is recessed from one side (351) of the bracket (350) toward the other side (352) of the bracket (350) may have a first thickness (T1) that is thinner than the second thickness (T2) of a portion (620) of the bracket (350) that is different from the recessed portion (610). Because the recessed portion (610) has a first thickness (T1) that is thinner than the second thickness (T2), the first gap (G1) between the recessed portion (610) and the imaginary straight line (VL) may be relatively large.

[0072] According to one embodiment, a waterproof tape (720) may be placed between a part (620) of the bracket (350) and the display (710). The waterproof tape (720) may be placed to form a closed loop to form a waterproof space to block the inflow of moisture. In order for waterproofing to be achieved by the waterproof tape (720), the part of the bracket (350) to which the waterproof tape (720) is attached may have a thickness greater than a predetermined thickness. In the case of the recess part (610) of the bracket (350), the waterproof tape (720) may be attached to a part (620) of the bracket (350) that is different from the recess part (610) because it is recessed to increase the gap (e.g., first gap (G1)) between the image sensor (420) and the bracket (350).

[0073] According to one embodiment, since the recess portion (610) is formed by being recessed from one side (351) of the bracket (350), the image sensor (420) that is at least partially aligned with the recess portion (610) can be relatively far from the bracket (350).

[0074] For example, if an external impact is applied to the electronic device (101), the image sensor (420) may be displaced. If the gap between the image sensor (420) and the bracket (350) is narrow, damage to the image sensor (420) may be caused by a collision between the image sensor (420) and the bracket (350). According to one embodiment, as the bracket (350) includes a recess portion (610) that is at least partially aligned with the image sensor (420), the gap between the image sensor (420) and the bracket (350) (e.g., a first gap (G1)) may be relatively increased. As the gap increases, the collision between the image sensor (420) and the bracket (350) may be reduced. For example, even if the image sensor (420) is moved toward the bracket (350) (e.g., in the +z direction) by an external impact, a collision between the image sensor (420) and the bracket (350) may not occur because the gap between the image sensor (420) and the bracket (350) is relatively large. As the collision between the image sensor (420) and the bracket (350) is reduced, damage to the image sensor (420) may be reduced.

[0075] According to one embodiment, the first size of the recess portion (610) may be larger than or equal to the second size of the image sensor (420). For example, if the first size of the recess portion (610) is smaller than the second size of the image sensor (420), a relatively narrow area may be formed between the image sensor (420) and one side (351) of the bracket (350) facing the first camera (311). Since a collision may occur between the image sensor (420) and the bracket (350) in the relatively narrow area, the effect of reducing damage to the image sensor (420) by the recess portion (610) may be weakened. According to one embodiment, in order to reduce the collision between the bracket (350) and the image sensor (420), the first size of the recess portion (610) may be larger than or equal to the second size of the image sensor (420). As the first size of the recess portion (610) is formed to be larger than the second size of the image sensor (420), the collision between the image sensor (420) and the bracket (350) can be reduced. As the collision is reduced, damage to the image sensor (420) can be reduced.

[0076] FIGS. 8, FIGS. 9, and FIGS. 10 schematically illustrate a camera and a bracket.

[0077] Referring to FIG. 8, the recess portion (610) of the bracket (350) may have a roughly rectangular cross-section. For example, the recess portion (610) may be formed by vertically indenting a portion of one side (351) of the bracket (350) facing the first camera (311). The recess portion (610) may be flat. If the recess portion (610) has a roughly rectangular cross-section, a step portion (630) may be formed between the recess portion (610) and a portion (620) of the bracket (350) that is different from the recess portion (610).

[0078] As described above, the gap between the image sensor (420) and the bracket (350) (e.g., a first gap (G1)) can be increased by the recess portion (610). For example, the first gap (G1) between the recess portion (610) and a virtual straight line (VL) parallel to the image sensor (420) can be larger than the second gap (G2) between the recess portion (610) and a part (620) of the bracket (350) different from the virtual line segment.

[0079] Referring to FIG. 9, the recess portion (610) of the bracket (350) may be at least partially rounded. For example, the recess portion (610) may have at least a partially rounded cross-section. The recess portion (610) may be curved. For example, a recess portion (610) having a rectangular cross-section may be formed, and then the edges of the recess portion (610) may be processed to form a rounded recess portion (610). In the event of a collision between the image sensor (420) and the bracket (350), the rounded recess portion (610) may reduce damage to the image sensor (420) caused by the collision. For example, in the case of the recess portion (610) illustrated in FIG. 8, damage to the image sensor (420) may be caused by the angled edges of the recess portion. In the case of the recess portion (610) illustrated in FIG. 9, the edges of the recess portion (610) are rounded, so damage to the image sensor (420) caused by collision can be reduced.

[0080] Referring to FIG. 10, a portion of the first camera (311) may be recessed in a direction opposite to the bracket (350). In the examples described above, the bracket (350) was described as having a recess portion, but as illustrated in FIG. 10, the first camera (311) may have a recess portion (1010). For example, the recess portion (1010) of the first camera (311) may be spaced apart from one side (351) of the bracket (350) facing the first camera (311). The recess portion (1010) may be formed to overlap with the image sensor (420), and the portion of the camera (311) that does not overlap with the image sensor (420) may support the camera (311). For example, a bridge portion (1020) around the recess portion (1010), formed by the recess portion (1010), may be placed on one side (351) of the bracket (350). By the bridge portion (1020), the image sensor (420) may be moved away from the bracket (350). For example, the height of the bridge portion (1020) is defined according to the depth of the recess portion (1010), and the image sensor (420) may be moved further away from the bracket (350) by the height of the bridge portion (1020). For example, in a camera (311) that does not include a recess portion (1010) and a bridge portion (1020), a first gap (1001) between an image sensor (420) and one side (351) of a bracket (350) may be larger than a second gap (1002) between an image sensor (420) and one side (351) of a bracket (350) in a camera that does not include a recess portion (1010) and a bridge portion (1020). The difference between the first gap (1001) and the second gap (1002) may correspond to the depth of the recess portion (1010) and the height of the bridge portion (1020). The size of the recess portion (1010) of the first camera (311) may be larger than or equal to the size of the image sensor (420).

[0081] As described above, the gap (e.g., first gap (G1)) between the image sensor (420) and the bracket (350) can be increased by the recess portion (610) of the bracket (350). The above structure can be usefully utilized in an electronic device (101) having a thin thickness. As described below, in the case of an electronic device (101) having a foldable structure, damage to the image sensor (420) can be reduced through the above structure to protect the image sensor (420) because the thickness of the electronic device (101) is relatively thin. The electronic device (101) described below may include components and structures substantially identical to the components and structures described above in relation to the first camera (311). The electronic device (101) described below may be substantially identical to the electronic device (101) described below, except for the foldable structure.

[0082] FIG. 11a illustrates an example of an unfolded state of an electronic device according to one embodiment. FIG. 11b illustrates an example of a folded state of an electronic device according to one embodiment. FIG. 11c is an exploded view of an electronic device according to one embodiment.

[0083] Referring to FIG. 11a, FIG. 11b, and FIG. 11c, an electronic device (101) according to one embodiment may include a foldable housing (1101), a display (1130), one or more cameras (1140), and a hinge assembly (1150).

[0084] According to one embodiment, the foldable housing (1101) may define the exterior surface of the electronic device (101). For example, the foldable housing (1101) may accommodate components disposed inside the electronic device (101) as the physical exterior of the electronic device (101) exposed to the outside. At least some of the components for implementing the functions of the electronic device (101) may be disposed within the foldable housing (1101). According to one embodiment, the foldable housing (1101) may include a first housing part (1110) and a second housing part (1120).

[0085] According to one embodiment, the first housing part (1110) may include a first surface (1111), a second surface (1112) opposite to the first surface (1111), and a first side (1113) (side exterior surface) that at least partially covers the edge of the first surface (1111) and the edge of the second surface (1112). For example, the first surface (1111) may be referred to as the front exterior surface of the first housing part (1110), and the second surface (1112) may be referred to as the rear exterior surface of the first housing part (1110). The first side (1113) may be connected to the periphery of the first surface (1111) and the edge of the second surface (1112). The first surface (1111), the second surface (1112), and the first side (1113) can form an internal space of the first housing part (1110). For example, at least one component may be placed within the space enclosed by the first surface (1111), the second surface (1112), and the first side (1113).

[0086] According to one embodiment, the second housing part (1120) may include a third surface (1121), a fourth surface (1122) opposite to the third surface (1121), and a second side (1123) that at least partially covers the edge of the third surface (1121) and the edge of the fourth surface (1122). For example, the third surface (1121) may be referred to as the front of the second housing part (1120), and the fourth surface (1122) may be referred to as the rear of the second housing part (1120). The second side (1123) may be connected to the edge of the third surface (1121) and the edge of the fourth surface (1122). The third surface (1121), the fourth surface (1122), and the second side (1123) may form an internal space of the second housing part (1120). For example, at least one component may be placed within the space enclosed by the third side (1121), the fourth side (1122), and the second side (1123).

[0087] According to one embodiment, the display (1130) may be configured to display visual information. For example, the display (1130) may include a display area comprising a plurality of pixels. For example, the active area may be referred to as an active area that displays visual information.

[0088] According to one embodiment, the display (1130) may include a first part (1131), a second part (1132), and a third part (1133) disposed between the first part (1131) and the second part (1132). The electronic device (101) may further include a cover display (1135) distinct from the display (1130). The cover display (1135) may be referred to as a sub-display.

[0089] According to one embodiment, a first part (1131) of the display (1130) may be supported by a first housing part (1110). A second part (1132) of the display (1130) may be supported by a second housing part (1120). The first part (1131) and the second part (1132) may be substantially flat independently of the state of the electronic device (101). A third part (1133) may be configured to bend based on the rotation of the first housing part (1110) or the second housing part (1120). For example, within the unfolded state where the first housing part (1110) and the second housing part (1120) are unfolded, the third part (1133) may be substantially flat. In a folded state or intermediate state in which the first housing part (1110) and the second housing part (1120) are folded, the third part (1133) may be bent at least partially. The display (1130) may be referred to as a flexible display including the bent third part (1133).

[0090] According to one embodiment, cameras (1140) may be configured to acquire an image based on receiving light from an object outside the electronic device (101). For example, cameras (1140) may include cameras (310) disposed within a first housing part (1110). Cameras (310) may be disposed to face the rear side of the first housing part (1110). Cameras (310) may be referred to as rear cameras. For example, cameras (1140) may include a camera (1142) disposed within a second housing part (1120). The camera (1142) may overlap with a cover display (1135). The cover display (1135) may include a hole corresponding to the camera (1142). For example, cameras (1140) may include a camera (1143) positioned within a first housing part (1110) and facing the front side of the first housing part (1110). The camera (1143) may overlap with a first part (1131) of a display (1130). The first part (1131) of the display (1130) may include a hole corresponding to the camera (1143). For example, the camera (1142) and the camera (1143) may be referred to as an under display camera (UDC).

[0091] According to one embodiment, the first housing part (1110) and the second housing part (1120) can be rotatably coupled. For example, the second housing part (1120) can be rotatably coupled to the first housing part (1110) through a hinge assembly (1150).

[0092] According to one embodiment, the hinge assembly (1150) can rotatably connect the first housing part (1110) and the second housing part (1120). The hinge assembly (1150) can be positioned between the first housing part (1110) and the second housing part (1120) of the electronic device (101) so that the electronic device (101) can be folded. The hinge assembly (1150) can change the electronic device (101) from an unfolded state to a folded state. The hinge assembly (1150) can change the electronic device (101) from a folded state to an unfolded state. For example, the hinge assembly (1150) can maintain the electronic device (101) in an intermediate state between an unfolded state and a folded state.

[0093] According to one embodiment, the unfolded state may be referred to as a state in which the first direction in which the first part (1131) faces and the second direction in which the second part (1132) faces are substantially the same. The folded state may be referred to as a state in which the first direction is substantially opposite to the second direction. When the electronic device (101) is in the folded state, the first housing part (1110) and the second housing part (1120) may be stacked or overlapped.

[0094] According to one embodiment, when the electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the electronic device (101) is in an intermediate state, the first direction may form an angle with respect to the second direction.

[0095] For example, the electronic device (101) may include at least one conductive portion (1114a, 224a) and at least one non-conductive portion (1114b, 224b) contained within the first side (1113) and / or the third side (1123). For example, the at least one conductive portion (1114a, 224a) may be separated from other conductive portions within the first side (1113) and / or the third side (1123) by contacting the at least one non-conductive portion (1114b, 224b). In one embodiment, the at least one conductive portion (1114a, 224a) may operate as an antenna radiator to be used for communication with an external electronic device.

[0096] Referring to FIG. 11c, the hinge assembly (1150) may include a hinge cover (1151), a first hinge plate (1152), a second hinge plate (1153), and a plurality of hinge modules (1154). The hinge cover (1151) may at least partially cover the components of the hinge assembly (1150) and form the outer surface of the hinge assembly (1150). The hinge cover (1151) may be at least partially exposed to the outside of the electronic device (101) through the space between the first housing part (1110) and the second housing part (1120) when the electronic device (101) is in a folded state. When the electronic device (101) is in an unfolded state, the hinge cover (1151) may be covered by the first housing part (1110) and the second housing part (1120) so as not to be exposed to the outside of the electronic device (101).

[0097] According to one embodiment, the first hinge plate (1152) and the second hinge plate (1153) are operatively coupled to the first housing part (1110) and the second housing part (1120), respectively, thereby allowing the first housing part (1110) and the second housing part (1120) to be rotatably connected. For example, the first hinge plate (1152) may be coupled to the first bracket (350) of the first housing part (1110), and the second hinge plate (1153) may be coupled to the second bracket (1127) of the second housing part (1120). As the first hinge plate (1152) and the second hinge plate (1153) are operatively coupled to the first bracket (350) and the second bracket (1127), respectively, the first housing part (1110) and the second housing part (1120) may be rotatable according to the rotation of the first hinge plate (1152) and the second hinge plate (1153).

[0098] According to one embodiment, a plurality of hinge modules (1154) can rotate a first hinge plate (1152) and a second hinge plate (1153). For example, the plurality of hinge modules (1154) may include gears that are rotatably engaged with each other. The first hinge plate (1152) and the second hinge plate (1153) can be rotated based on the rotational movement of the gears of the plurality of hinge modules (1154).

[0099] According to one embodiment, the first housing part (1110) may include a first bracket (350) and a rear cover (1116). The first bracket (350) may be disposed inside the first housing part (1110) and may support at least one component disposed inside the first housing part (1110). The rear cover (1116) may at least partially form a second surface (1122) of the first housing part (1110). For example, the second housing part (1120) may include a second bracket (1127). The second bracket (1127) may be disposed inside the second housing part (1120) and may support at least one component disposed inside the second housing part (1120). For example, a cover display (1135) may be disposed below (e.g., in the -z direction) the second bracket (1127). According to one embodiment, a display (e.g., the display (1130) of FIG. 11a) may define the front side of the electronic device (101), and a rear cover (1116) opposite the display may define the rear side of the electronic device (101).

[0100] An electronic device (101) according to one embodiment may include a plurality of electronic components for implementing various functions in addition to the aforementioned cameras (1140). For example, the electronic device (101) may include a first printed circuit board (1161), a second printed circuit board (1162), a flexible printed circuit board (1163), and / or a battery (189). The aforementioned electronic components are exemplary and are not limited thereto.

[0101] For example, the first printed circuit board (1161) and the second printed circuit board (1162) can each provide electrical connections between components within the electronic device (101). For example, the first printed circuit board (1161) can be placed within the first housing part (1110), and the second printed circuit board (1162) can be placed within the second housing part (1120). The first printed circuit board (1161) can provide electrical connections between electronic components placed within the first housing part (1110). The second printed circuit board (1162) can provide electrical connections between electronic components placed within the second housing part (1120). A flexible printed circuit board (1163) can electrically connect the first printed circuit board (1161) and the second printed circuit board (1162). For example, the flexible printed circuit board (1163) may extend from the first printed circuit board (1161) across the hinge assembly (1150) to the second printed circuit board (1162). For example, the flexible printed circuit board (1163) may overlap at least partially with the hinge assembly (1150).

[0102] According to one embodiment, the battery (189) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0103] According to one embodiment, the electronic device (101) may include a plurality of antennas (ANT1, ANT2, ANT3, or ANT4) to be used for communication with an external electronic device. For example, the electronic device (101) may include a main antenna (ANT1), a sub-antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna (ANT4) for short-range wireless communication. However, it is not limited thereto. For example, the main antenna (ANT1) may include one or more conductive portions forming at least a portion of the first housing part (1110) or the second housing part (1120). For example, the main antenna (ANT1) may include a plurality of conductive portions forming an edge portion of the first housing part (1110). For example, the main antenna (ANT1) may further include conductive portions forming an upper edge or a side edge of the first housing part (1110). The main antenna (ANT1) can be configured to transmit and / or receive signals of various frequency bands through each of the plurality of conductive parts or a combination of the plurality of conductive parts.

[0104] FIG. 12 illustrates a folded state of an electronic device according to one embodiment. FIG. 13 is a cross-sectional view of the electronic device of FIG. 12 cut along B-B'.

[0105] Referring to FIG. 12, the first housing part (1110) may include cameras (310). For example, the first housing part (1110) may include a first camera (311), a second camera (312), and / or a third camera (313). For example, the cameras (310) may face the rear side of the first housing part (1110). For example, a rear plate (1210) defining at least a portion of the rear side of the first housing part (1110) may include camera holes corresponding to the cameras (310). The cameras (310) disposed within the first housing part (1110) may be aligned with the camera holes of the rear plate (1210), respectively.

[0106] Referring to FIG. 13, the first housing part (1110) may include a first bracket (350). For example, the first bracket (350) may support a first part (1131) of the display (1130). For example, the first camera (311) may be supported by the first bracket (350). For example, the first bracket (350) may include a recessed portion (610). The recessed portion (610) may be at least partially aligned with the image sensor (420) of the first camera (311). By the recessed portion (610), the gap between the image sensor (420) of the first camera (311) and the bracket (350) may be increased. For example, the first gap (G1) between the recessed portion (610) of the bracket (350) and the virtual straight line (VL) parallel to the image sensor (420) may be larger than the second gap (G2) between the recessed portion (610) of the bracket (350), a different portion (620) of the bracket (350), and the virtual line segment. As the gap between the image sensor (420) and the bracket (350) increases, damage to the image sensor (420) caused by collision between the bracket (350) and the image sensor (420) may be reduced. According to one embodiment, the gap between the recessed portion (610) of the bracket (350) and the image sensor (420) of the first camera (311) may be about 0.5 mm or more. Since a gap of about 0.5 mm or more can be secured by the recess portion (610), collision between the image sensor (420) and the bracket (350) can be reduced.

[0107] An electronic device (101) according to one embodiment may further include a camera cover (1310) for covering a first camera (311). For example, the camera cover (1310) may be secured to a rear plate (1210) that defines at least a portion of the rear side of the electronic device (101). For example, the rear plate (1210) may include a camera hole aligned with the first camera (311). The camera cover (1310) may be coupled to the camera hole to cover the first camera (311) disposed within the first housing part (1110). For example, the camera cover (1310) may be secured to the inner surface of the rear plate (1210) that defines the camera hole. The camera cover (1310) may protrude from the rear plate (1210). The camera cover (1310) may be referred to as a camera deco or deco member in terms of covering the first camera (311).

[0108] According to one embodiment, the camera cover (1310) may include a window (1311). The window (1311) may be aligned with the first camera (311). The window (1311) may be formed of a substantially transparent material. For example, the window (1311) may be formed of a glass material, but is not limited thereto. Light reflected from an object may pass through the window (1311) formed of a substantially transparent material and be provided to the lens (410) of the first camera (311).

[0109] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0110] An electronic device (101) is disclosed. The electronic device (101) may include a camera (311) comprising a lens (410) facing the rear side of the electronic device (101) and an image sensor (420) positioned above the lens (410). The electronic device (101) may include a bracket (350) supporting the camera (311). The bracket (350) may include a recessed portion (610) that is recessed toward the front side of the electronic device (101) from one side (351) of the bracket (350) facing the camera (311) and at least partially aligned with the image sensor (420) so as to increase the gap between the bracket (350) and the image sensor (420). Because the gap between the image sensor (420) of the camera (311) and the bracket (350) can be increased by the recess portion (610), the collision between the image sensor (420) and the bracket (350) can be reduced. As the collision is reduced, damage to the image sensor (420) can be reduced. For example, the electronic device (101) may include a display (710) defining the front side and a rear plate (341) opposite to the display (710) and defining the rear side.

[0111] As a non-limiting example, the first gap (G1) between the recess portion (610) of the bracket (350) and the virtual line parallel to the image sensor (420) of the camera (311) may be larger than the second gap (G2) between the part of the bracket (350) different from the recess portion (610) of the bracket (350) and the virtual line segment.

[0112] As a non-limiting example, the first thickness (T1) of the recess portion (610) of the bracket (350) may be thinner than the second thickness (T2) of the portion of the bracket (350).

[0113] As a non-limiting example, the electronic device (101) may further include a display (710) defining the front side of the electronic device (101). The electronic device (101) may further include a waterproof tape (720) disposed between the part of the bracket (350) and the display (710).

[0114] As a non-limiting example, the first size of the recess portion (610) of the bracket (350) may be larger than or equal to the second size of the image sensor (420) of the camera (311).

[0115] As a non-limiting example, the recess portion (610) of the bracket (350) may be at least partially rounded.

[0116] As an example not limited to, the electronic device (101) may further include a foldable housing (1101) comprising a first housing part (1110) and a second housing part (1120) rotatably connected to the first housing part (1110). The camera (311) and the bracket (350) may be disposed within the first housing part (1110).

[0117] As an example not limited to, the first housing part (1110) may include a rear plate (1210) defining the rear side of the first housing part (1110) and a camera hole aligned with the camera (311), and a camera cover (1310) that covers the camera (311) which is coupled to the camera hole and disposed within the first housing part (1110).

[0118] As an example not limited to, the electronic device (101) may further include a display (1130) (e.g., a flexible display) defining at least a portion of the front side of the electronic device (101). The display (1130) may include a first portion (1131) corresponding to the first housing part (1110), a second portion (1132) corresponding to the second housing part (1120), and a third portion (1133) extending from the first portion (1131) to the second portion (1132) and configured to be at least partially bent based on the rotation of the first housing part (1110) or the rotation of the second housing part (1120).

[0119] As an example not limited to, the camera (311) may include a camera housing (430) that at least partially encloses the lens (410) and the image sensor (420). The camera housing (430) may include a first opening (432) formed on a first surface (431) of the camera housing (430) facing the rear side of the electronic device (101) and a second opening (434) formed on a second surface (433) of the camera housing (430) facing the front side of the electronic device (101). The camera (311) may include a substrate (450) that is positioned over the camera housing (430), is electrically connected to the image sensor (420), and includes a third opening (451) that is at least partially aligned with the image sensor (420) and the second opening (434) of the camera housing (430). The camera (311) may include a plate (460) that covers the third opening (451).

[0120] As a non-limiting example, at least a portion of the lens (410) may be exposed to the outside of the camera housing (430) through the first opening (432) of the camera housing (430).

[0121] As a non-limiting example, the camera housing (430) may be supported by the bracket (350).

[0122] As a non-limiting example, the electronic device (101) may further include another camera (1143) facing the front side of the electronic device (101).

[0123] As a non-limiting example, the gap between the recess portion (610) of the bracket (350) and the image sensor (420) of the camera (311) may be 0.5 mm or more.

[0124] An electronic device (101) is disclosed. The electronic device (101) may include a foldable housing (1101) comprising a first housing part (1110) and a second housing part (1120). The electronic device (101) may include a hinge assembly (1150) that rotatably connects the first housing part (1110) and the second housing part (1120). The electronic device (101) may include a display (1130) disposed on the foldable housing (1101) and defining the front side of the electronic device (101). The electronic device (101) may include a camera (311) disposed within the first housing part (1110). The camera (311) may include a lens (410) facing the rear side of the electronic device (101) and an image sensor (420) positioned above the lens (410). The electronic device (101) may include a bracket (350) that supports the camera (311). The bracket (350) may include a recess (610) that is recessed toward the front side of the electronic device (101) from one side (351) of the bracket (350) facing the camera (311) and at least partially aligned with the image sensor (420) to increase the distance between the camera (311) and the image sensor (420). In the case of an electronic device (101) having a foldable structure, the gap between the bracket (350) and the image sensor (420) may be narrow because it has a relatively thin thickness. As the bracket (350) includes a recessed portion (610), the gap between the bracket (350) and the image sensor (420) can be increased, so damage to the image sensor (420) can be reduced.

[0125] As a non-limiting example, the first gap (G1) between the recess portion (610) of the bracket (350) and the virtual line parallel to the image sensor (420) of the camera (311) may be larger than the second gap (G2) between the part of the bracket (350) different from the recess portion (610) of the bracket (350) and the virtual line segment.

[0126] As a non-limiting example, the first thickness (T1) of the recess portion (610) of the bracket (350) may be thinner than the second thickness (T2) of the portion of the bracket (350).

[0127] As a non-limiting example, the first size of the recess portion (610) of the bracket (350) may be larger than or equal to the second size of the image sensor (420) of the camera (311).

[0128] As a non-limiting example, the recess portion (610) of the bracket (350) may be at least partially rounded.

[0129] As an example not limited to, the display (1130) may include a first part (1131) corresponding to the first housing part (1110), a second part (1132) corresponding to the second housing part (1120), and a third part (1133) extending from the first part (1131) to the second part (1132) and configured to be at least partially bent based on the rotation of the first housing part (1110) or the rotation of the second housing part (1120).

[0130] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0131] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0132] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0133] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0134] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (120) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0135] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store's server, or a relay server's memory (130).

[0136] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, display; A rear plate opposite to the above display; A camera comprising a lens and an image sensor facing the rear plate; and It includes a bracket that supports the above camera, and The bracket includes a recess portion that is recessed toward the display from one side of the bracket facing the camera and at least partially aligned with the image sensor, so as to increase the gap between the bracket and the image sensor. Electronic device.

2. In Paragraph 1, The first gap between the recess portion of the bracket and the virtual straight line parallel to the image sensor of the camera is, Larger than the second gap between the part of the bracket different from the recessed part of the bracket and the imaginary line segment Electronic device.

3. In Paragraph 2, The first thickness of the recess portion of the bracket is, Thinner than the second thickness of the above part of the bracket, Electronic device.

4. In Paragraph 2, The above electronic device is, A waterproof tape further comprising a portion of the bracket and a display disposed between the portion of the bracket and the display. Electronic device.

5. In any one of paragraphs 1 through 4, The first size of the recess portion of the above bracket is, Larger than or equal to the second size of the image sensor of the camera, Electronic device.

6. In any one of paragraphs 1 through 5, The recessed portion of the above bracket is, having at least a partially rounded cross section, Electronic device.

7. In any one of paragraphs 1 through 6, A foldable housing further comprising a first housing part and a second housing part rotatably connected to the first housing part, and The above camera and the above bracket are, disposed within the first housing part above, Electronic device.

8. In Paragraph 7, The above-mentioned first housing part is, Another rear plate defining the rear side of the first housing part, including a camera hole aligned with the camera, and A camera cover comprising a camera that covers the camera coupled to the camera hole and disposed within the first housing part, Electronic device.

9. In Paragraph 7, The above display is, It falls under flexible displays, and The above flexible display is, A first part corresponding to the first housing part above, A second part corresponding to the second housing part above, and A third part extending from the first part to the second part and configured to be at least partially bent based on the rotation of the first housing part or the rotation of the second housing part, Electronic device.

10. In Paragraph 7, A hinge assembly further comprising a hinge assembly rotatably connecting the first housing part and the second housing part, Electronic device.

11. In Paragraph 1, The above camera is, A camera housing that at least partially encloses the lens and the image sensor, wherein the camera housing comprises a first opening formed on a first surface of the camera housing facing the rear plate and a second opening formed on a second surface of the camera housing facing the display. A substrate disposed on the camera housing and electrically connected to the image sensor, and comprising a third opening that is at least partially aligned with the image sensor and the second opening of the camera housing, and A plate covering the third opening, Electronic device.

12. In Paragraph 11, At least part of the above lens, Exposed to the outside of the camera housing through the first opening of the camera housing, Electronic device.

13. In Paragraph 10, The above camera housing is, Supported by the above bracket, Electronic device.

14. In any one of paragraphs 1 through 13, including another camera facing the above display, Electronic device.

15. In any one of paragraphs 1 through 14, The gap between the recess portion of the bracket and the image sensor of the camera is, 0.5mm or larger, Electronic device.

Images