Resin supply mechanism, resin molding device, and method for manufacturing resin molded article

Abstract

This resin supply mechanism comprises a first stage, a first plate, a dispenser, and a weighing instrument. On the first stage, a first opening is formed. The first plate covers the first opening in a state of being disposed on the first stage. The weighing instrument supports the first plate from below through the first opening after the first stage moves downward. On one of the first stage and the first plate, a first positioning pin and a second positioning pin are formed, and on the other, a first insertion hole and a second insertion hole are formed. Compared to before the first stage moves downward, the shortest distance between the outer peripheral surface of the first positioning pin and the inner peripheral surface of the first insertion hole and the shortest distance between the outer peripheral surface of the second positioning pin and the inner peripheral surface of the second insertion hole are greater after the first stage moves downward.

Description

Resin supply mechanism, resin molding apparatus, and method for manufacturing a resin molded product

[0001] The present invention relates to a resin supply mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product.

[0002] Japanese Patent Application Laid-Open No. 2024-74488 (Patent Document 1) discloses a resin molding apparatus. In this resin molding apparatus, a plate is disposed on a stage having a through hole, and a release film is disposed on the plate. When the stage descends, a measuring instrument supports the plate through the through hole. The weight of the resin supplied to the release film on the plate is measured by the measuring instrument, and the release film with the desired amount of resin thereon is conveyed from the plate to a mold by a conveying mechanism.

[0003] Japanese Patent Application Laid-Open No. 2024-74488

[0004] In the resin molding apparatus disclosed in Patent Document 1 above, for example, if a displacement of the plate with respect to the stage occurs during the process of supplying resin to the release film on the plate, there may arise a problem that the conveying mechanism cannot hold the release film after the resin has been supplied to the release film.

[0005] The present invention has been made to solve such problems, and an object thereof is to provide a resin supply mechanism capable of suppressing displacement of a plate, a resin molding apparatus including the resin supply mechanism, and a method for manufacturing a resin molded product using the resin molding apparatus.

[0006] A resin supply mechanism according to a certain aspect of the present invention supplies resin onto a release film used in resin molding. The resin supply mechanism comprises a plate-shaped first stage, a first plate, a dispenser, and a weighing device. A first opening is formed in the plate-shaped first stage, and the plate-shaped first stage moves in the vertical direction. The first plate covers the first opening when positioned on the first stage. The dispenser supplies resin onto the release film placed on the first plate. After the first stage moves downward, the weighing device supports the first plate from below through the first opening and weighs the resin on the release film placed on the first plate. A first positioning pin and a second positioning pin are formed on one of the first stage and the first plate. A first insertion hole and a second insertion hole are formed on the other of the first stage and the first plate, into which the first positioning pin and the second positioning pin are inserted, respectively. Compared to before the first stage moves downward, after the first stage moves downward, the shortest distance between the outer surface of the first positioning pin and the inner surface of the first insertion hole is longer, and the shortest distance between the outer surface of the second positioning pin and the inner surface of the second insertion hole is also longer.

[0007] A resin molding apparatus according to another aspect of the present invention molds a pre-molded substrate, which has not yet been molded with resin, using resin. The resin molding apparatus comprises the resin supply mechanism and a mold. The mold performs resin molding of the pre-molded substrate using resin supplied onto a release film.

[0008] A method for manufacturing a resin molded product according to another aspect of the present invention uses the resin molding apparatus described above. The method for manufacturing a resin molded product includes placing a release film to which resin has been supplied and a substrate to be molded into a mold, and clamping the mold with the mold.

[0009] According to the present invention, it is possible to provide a resin supply mechanism capable of suppressing misalignment of a plate, a resin molding apparatus including the resin supply mechanism, and a method for manufacturing a resin molded product using the resin molding apparatus.

[0010] This is a schematic plan view of a resin molding apparatus. This is a schematic partial cross-sectional view of a part of the first transport mechanism from the side. This is a schematic front view of the release film placement section. This is a schematic plan view of the release film placement section. This is a diagram to explain the characteristics of the stage and the plate. This is a diagram to schematically show the VI-VI cross section of Figure 5. This is a diagram to schematically show the cross section of the resin molding section (before mold clamping). This is a diagram to explain an example of a problem that may occur when the plate is not positioned relative to the stage. This is a diagram to explain the relationship between the stage and the plate before the stage is lowered. This is a diagram to explain the relationship between the stage and the plate after the stage has been lowered. This is a diagram to explain the relationship between the positioning pin and the insertion hole after the stage has been lowered. This is a diagram to explain other examples of positioning pins and insertion holes. This is a diagram to schematically show another example of a positioning pin.

[0011] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding.

[0012] [1. Configuration of the Resin Molding Apparatus] Figure 1 is a schematic plan view showing a resin molding apparatus 1 according to this embodiment. The resin molding apparatus 1 is configured to manufacture a resin molded product by applying resin encapsulation to a substrate on which electronic components such as semiconductor chips are mounted. In the resin molding apparatus 1, the component mounting surface of the substrate on which the electronic components are mounted is resin-encapsulated.

[0013] Examples of substrates include semiconductor substrates such as silicon wafers, lead frames, printed circuit boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate may also be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate may or may not have wiring already installed.

[0014] As shown in Figure 1, the resin molding apparatus 1 includes a first module 10, a second module 20, a third module 30, a fourth module 40, a first transport mechanism 50, a second transport mechanism 60, and a control unit 70. The control unit 70 includes, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The control unit 70 is configured to control each of the first module 10, the second module 20, the third module 30, and the fourth module 40 according to a control program.

[0015] Each of the first module 10, second module 20, third module 30, and fourth module 40 is detachable and interchangeable with other modules. Furthermore, in the resin molding apparatus 1, each of the first module 10, second module 20, third module 30, and fourth module 40 can be increased or decreased in number.

[0016] The first module 10 includes a release film supply unit 100. The first module 10 is configured to supply a release film. As the material for the release film, a resin material having properties such as heat resistance, release properties, flexibility, and stretchability is used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, or polyvinylidene chloride can be used.

[0017] The release film supply unit 100 includes, for example, a roll of release film, a film mounting table, a film gripper, and a cutter (none of which are shown). The film gripper pulls out a long piece of release film from the roll of release film, and the pulled-out release film is placed on the film mounting table. The release film placed on the film mounting table is cut into a desired shape (for example, a rectangle or a circle) by the cutter, thereby preparing a release film F1 (Figure 2, etc.) to be used in resin molding. A tray cover TC1 (described later) is placed on the prepared release film F1. The release film F1 and tray cover TC1 prepared in the release film supply unit 100 are transported to the second module 20 by the first transport mechanism 50.

[0018] Figure 2 is a schematic partial cross-sectional view showing a part of the first transport mechanism 50 from the side. As shown in Figure 2, the first transport mechanism 50 includes a movable part 500, a support part 510, and a holding part 511. The movable part 500 has, for example, a column shape extending in the vertical direction. The movable part 500 is configured to move along rails laid across the first module 10, the second module 20, and the third module 30. In addition, the movable part 500 is configured to move in the front-rear direction in the second module 20. The movement of the movable part 500 is achieved, for example, by a servo motor (not shown).

[0019] The support portion 510 has, for example, a plate shape. The support portion 510 is attached to the movable portion 500 and extends forward from the movable portion 500. The support portion 510 is configured to move, for example, in the vertical direction relative to the movable portion 500. The vertical movement of the support portion 510 is achieved, for example, by an air cylinder or servo motor (not shown).

[0020] The holding portion 511 is fixed below the front end of the support portion 510 and is configured to hold the tray cover TC1 and the release film F1 at their lower ends. The holding portion 511 mechanically holds the tray cover TC1 by a tray cover chuck (not shown). The holding portion 511 also holds the release film F1 by using a vacuum pump (not shown) to adsorb the release film F1 through the tray cover TC1 and by mechanically pressing the release film F1 from below upward with the release film chuck (not shown). For example, as the moving portion 500 moves in the front-rear direction in the second module 20, the holding portion 511 also moves in the front-rear direction. The tray cover TC1 is a frame-shaped member, and the size of the release film F1 is larger than the size of the space enclosed by the frame of the tray cover TC1. The shape of this space in plan view is, for example, rectangular.

[0021] Referring again to Figure 1, the second module 20 includes a release film placement section 200 and a dispenser 250. The second module 20 is configured to place liquid resin on the release film F1 by supplying liquid resin to the release film F1.

[0022] Figure 3 is a schematic front view showing the release film placement section 200. Figure 4 is a schematic top view showing the release film placement section 200. As shown in Figures 3 and 4, the release film placement section 200 includes a weighing device 230, replacement mechanisms 210 and 220, stages 212 and 222, plates 213 and 223, and rails 215 and 225. The weighing device 230 is configured to weigh the liquid resin placed on the release film F1.

[0023] The replacement mechanism 210 includes a movable part 214 and a support part 211. The movable part 214 is, for example, a rectangular block-shaped member in plan view. The movable part 214 is arranged on a rail 215 that extends in the front-rear direction and is movable on the rail 215. The movement of the movable part 214 is achieved, for example, by an air cylinder. The support part 211 is a plate-shaped member that extends upward from the movable part 214. The support part 211 moves together with the movable part 214 as the movable part 214 moves.

[0024] The stage 212 is a rectangular plate-shaped member in plan view. The stage 212 is attached to the support portion 211 and extends to the right from the support portion 211. The stage 212 is movable vertically relative to the support portion 211. The movement of the stage 212 is achieved, for example, by a servo motor. The stage 212 has a through hole (opening) H1 that penetrates vertically. The shape of the through hole H1 in plan view is, for example, rectangular. The through hole H1 is covered by a rectangular plate 213 in plan view. That is, the length of each side of the plate 213 is longer than the length of each side of the through hole H1. A release film F1 and a tray cover TC1 are placed on the plate 213. The plate 213 is simply resting on the stage 212 and is not fixed to the stage 212.

[0025] As the stage 212 moves above the weighing device 230 and then descends, the weighing device 230 passes through the through-hole H1. As a result, the plate 213 is supported from below by the weighing device 230, and the plate 213 is lifted away from the stage 212. With the plate 213 supported by the weighing device 230, liquid resin is supplied to the release film F1 on the plate 213 by the dispenser 250. The weight of the liquid resin placed on the release film F1 is measured by the weighing device 230, and an appropriate amount of liquid resin is supplied to the release film F1. Based on the weight measured by the weighing device 230, it is determined, for example, whether the amount of liquid resin supplied to the release film F1 is an appropriate amount.

[0026] The replacement mechanism 220 includes a movable part 224 and a support part 221. The movable part 224 is, for example, a rectangular block-shaped member in plan view. The movable part 224 is arranged on a rail 225 that extends in the front-rear direction and is movable on the rail 225. The movement of the movable part 224 is achieved, for example, by an air cylinder. The support part 221 is a plate-shaped member that extends upward from the movable part 224. The support part 221 moves together with the movable part 224 as the movable part 224 moves.

[0027] The stage 222 is a rectangular plate-shaped member in plan view. The stage 222 is attached to the support portion 221 and extends to the left from the support portion 221. The stage 222 is movable vertically relative to the support portion 221. The movement of the stage 222 is achieved, for example, by a servo motor. The stage 222 has a through hole (opening) H2 that penetrates vertically. The shape of the through hole H2 in plan view is, for example, rectangular. The through hole H2 is covered by a rectangular plate 223 in plan view. That is, the length of each side of the plate 223 is longer than the length of each side of the through hole H2. The release film F1 and the tray cover TC1 are placed on the plate 223. The plate 223 is simply resting on the stage 222 and is not fixed to the stage 222.

[0028] As the stage 222 moves above the weighing device 230 and then descends, the weighing device 230 passes through the through-hole H2. As a result, the plate 223 is supported from below by the weighing device 230, and the plate 223 is lifted away from the stage 222. With the plate 223 supported by the weighing device 230, liquid resin is supplied to the release film F1 on the plate 223 by the dispenser 250. The weight of the liquid resin placed on the release film F1 is measured by the weighing device 230, and an appropriate amount of liquid resin is supplied to the release film F1.

[0029] In this way, in the release film placement section 200, the plates (plate 213 or plate 223) placed on the measuring device 230 are changed by controlling the replacement mechanisms 210 and 220. As a result, liquid resin can be sequentially supplied to the release film F1 placed on plate 213 and the release film F1 placed on plate 223.

[0030] Figure 5 is a diagram illustrating the characteristics of each of the stages 212, 222 and plates 213, 223. Figure 5 shows plan views of the stages 212, 222 and plates 213, 223, as well as an enlarged view of the top surface of the positioning pin PI1.

[0031] As shown in Figure 5, positioning pins PI1 and PI2 are formed on each of the stages 212 and 222. Each of the positioning pins PI1 and PI2 extends upward from the plate-shaped main body portion of the stage 212. Similarly, each of the positioning pins PI1 and PI2 extends upward from the plate-shaped main body portion of the stage 222. Insertion holes IN1 and IN2 are formed on each of the plates 213 and 223. Each of the insertion holes IN1 and IN2 penetrates vertically through each of the plates 213 and 223, for example. Positioning pins PI1 and PI2 are inserted into insertion holes IN1 and IN2, respectively. This positions the plate 213 relative to the stage 212, and the plate 223 relative to the stage 222. The reason for this positioning will be explained in detail later. As described above, positioning pins PI1 and PI2 are formed on stages 212 and 222, respectively, and the positioning of plate 213 relative to stage 212 and plate 223 relative to stage 222 are performed individually. Therefore, compared to, for example, a case where positioning pins PI1 and PI2 are not formed on stages 212 and 222, and a common positioning pin is formed on the weighing instrument 230, the positioning of plates 213 and 223 is performed more appropriately.

[0032] Each of the positioning pins PI1 and PI2 has a base portion PD1 and a tip portion T1. The tip portion T1 is located above the base portion PD1. In a plan view, the outer circumference of the tip portion T1 is located inside the outer circumference of the base portion PD1.

[0033] As described above, each of the plates 213 and 223 has a rectangular shape in plan view and has sides S1, S2, S3, and S4. Sides S1 and S2 are parallel to each other, and sides S3 and S4 are parallel to each other. In each of the plates 213 and 223, the side closest to the insertion hole IN1 is side S1, and the second closest side is side S3. Also, in each of the plates 213 and 223, the side closest to the insertion hole IN2 is side S2, and the second closest side is side S4. In particular, in each of the plates 213 and 223, the insertion holes IN1 and IN2 are formed at positions that are point-symmetric with respect to the center of each plate. In the plates 213 and 223, the insertion holes IN1 and IN2 are formed at relatively well-balanced positions.

[0034] Figure 6 is a schematic diagram showing the VI-VI cross-section of Figure 5. Note that since positioning pin PI2 has the same shape as positioning pin PI1, positioning pin PI1 will be described as a representative example here. As shown in Figure 6, in this state, plate 213 is not supported from below by the weighing device 230, and plate 213 is not floating relative to stage 212. Also, plate 223 is not supported from below by the weighing device 230, and plate 223 is not floating relative to stage 222.

[0035] The positioning pin PI1 has a base portion PD1, a tip portion T1, and inclined portions DC1 and DC2. Each of the base portion PD1 and the tip portion T1 has a cylindrical shape, and each of the inclined portions DC1 and DC2 has a frustoconical shape. The inclined portion DC1 extends upward from the upper surface of the base portion PD1, and the tip portion T1 extends upward from the upper surface of the inclined portion DC1. That is, the inclined portion DC1 is formed at the boundary between the base portion PD1 and the tip portion T1. Also, the inclined portion DC2 extends upward from the upper surface of the tip portion T1. The diameter of the base portion PD1 is the same as the diameter of the lower surface of the inclined portion DC1. In the inclined portion DC1, the radial length decreases as it extends upward. The diameter of the upper surface of the inclined portion DC1 is the same as the diameter of the tip portion T1. That is, the diameter of the tip portion T1 is shorter than the diameter of the base portion PD1. Also, the diameter of the tip portion T1 is the same as the diameter of the lower surface of the inclined portion DC2. In the inclined section DC2, the radial length decreases as it extends upwards.

[0036] As shown in Figure 6, when plates 213 and 223 are not supported from below by the weighing device 230, the base portion PD1 of the positioning pin PI1 is located inside the insertion hole IN1. As a result, when plate 213 is not misaligned at all with respect to the stage 212, the shortest distance between the outer surface of the positioning pin PI1 and the inner surface of the insertion hole IN1 is length LE1.

[0037] Referring again to Figure 1, the fourth module 40 includes a substrate supply unit 410, a substrate storage unit 420, and a substrate mounting unit 430. The substrate supply unit 410 is configured to supply substrates before resin encapsulation to the substrate mounting unit 430. The substrate storage unit 420 is configured to store resin-encapsulated substrates (resin molded products). The substrate mounting unit 430 is configured to move in the front-rear direction between a position corresponding to the substrate supply unit 410 and a position corresponding to the substrate storage unit 420. The second transport mechanism 60 is configured to move in the left-right direction and the front-rear direction in the fourth module 40 and the third module 30. For example, the second transport mechanism 60 holds a substrate before resin encapsulation placed in the substrate mounting unit 430, transports the held substrate before resin encapsulation to the third module 30, and transports the resin-encapsulated substrate from the third module 30 to the fourth module 40.

[0038] The third module 30 includes a resin molding section 300. In the resin molding section 300, resin sealing (resin molding) of the component mounting surface of the substrate is performed by using a release film F1 on which liquid resin is placed. The release film F1 on which the liquid resin is placed is transported from the second module 20 to the resin molding section 300 by the first transport mechanism 50.

[0039] Figure 7 is a schematic diagram showing a cross-section of the resin molding section 300 (before mold clamping). As shown in Figure 7, the resin molding section 300 includes an outer frame member 301, a fixed platen 310, a movable platen 330, and a molding die 305. An example of the molding die 305 is a metal mold.

[0040] The outer frame member 301 is composed of tie bars (columns) or hold frames (plate members). When the outer frame member 301 is composed of tie bars, it is made up of four tie bars positioned at the four corners. Each of the four tie bars extends in the vertical direction. When the outer frame member 301 is made up of hold frames, it is made up of two hold frames positioned on the left and right sides. The wide surface of one of the two hold frames faces the wide surface of the other of the two hold frames in the left-right direction.

[0041] The fixed platen 310 is a rectangular plate-shaped member in plan view. The fixed platen 310 is fixed to the upper part of the outer frame member 301. The movable platen 330 is located inside the outer frame member 301 and below the fixed platen 310. The movable platen 330 is configured to move in the vertical direction. The movement of the movable platen 330 is achieved, for example, by a clamping mechanism (not shown). The clamping mechanism is achieved, for example, by a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a linkage mechanism.

[0042] The molding die 305 includes an upper die 320 and a lower die 340. The molding die 305 is disposed between a fixed platen 310 and a movable platen 330 inside the outer frame member 301. More specifically, the upper die 320 is fixed to the lower surface of the fixed platen 310, and the lower die 340 is fixed to the upper surface of the movable platen 330. When the movable platen 330 moves in the vertical direction, the lower die 340 also moves in the vertical direction together with the movable platen 330. When the movable platen 330 ascends, the mold clamping of the molding die 305 is performed.

[0043] The lower die 340 includes a base plate 344, a bottom member 341, a spring 343, and a side member 342. The base plate 344 is a plate-shaped member having a rectangular shape in plan view. The base plate 344 is fixed to the upper surface of the movable platen 330. The bottom member 341 is a block-shaped member having a rectangular shape in plan view. The bottom member 341 is fixed to the upper surface of the base plate 344 and is located at a substantially central portion of the base plate 344. The side member 342 is a frame-shaped member surrounding the periphery of the bottom member 341. The side member 342 is fixed to the bottom member 341 via a plurality of springs 343.

[0044] The upper surface of the side member 342 is located above the upper surface of the bottom member 341, and a recess (cavity) is formed in the upper surface of the lower die 340. A release film F1 on which the liquid resin R1 is placed is disposed in this recess. A substrate P1 is disposed on the lower surface of the upper die 320. The mold clamping of the molding die 305 is performed in a state where the release film F1 on which the liquid resin R1 is placed is disposed in the recess of the lower die 340 and the substrate P1 is disposed on the lower surface of the upper die 320, whereby the component mounting surface of the substrate is resin-sealed.

[0045] [2. Positioning of the Plates with Respect to the Stage] As described above, in this embodiment, the plate 213 is positioned relative to the stage 212 via positioning pins PI1, PI2 and insertion holes IN1, IN2, and the plate 223 is positioned relative to the stage 222 via positioning pins PI1, PI2 and insertion holes IN1, IN2. The reason for this positioning is explained below. Here, the relationship between the stage 212 and the plate 213 will be used as an example. The relationship between the stage 222 and the plate 223 is the same as the relationship between the stage 212 and the plate 213.

[0046] Figure 8 illustrates an example of a problem that may occur when the plate is not positioned relative to the stage. Referring to Figure 8, the stage 212X is not provided with positioning pins PI1 and PI2. Also, the plate 213X is not provided with insertion holes IN1 and IN2. As the stage 212X descends, the weighing device 230 passes through the through hole H1X and the plate 213X is supported from below by the weighing device 230, causing the plate 213X to lift relative to the stage 212X. In this state, the weighing device 230 is displaced in the rotational direction with the vertical direction as the axis of rotation. Subsequently, when the stage 212X rises and the plate 213X is placed on the stage 212X, the plate 213X is displaced in the rotational direction relative to the stage 212X, for example, as shown in Figure 8.

[0047] Also, positional deviation of the plate 213X on the stage 212X may occur even when an operator accidentally moves the plate 213X on the stage 212X. Further, when the stage 212X with the plate 213X placed thereon moves in the front-rear direction, depending on the moving speed, positional deviation of the plate 213X in the front-rear direction may occur according to the inertial force. Further, when the stage 212X is not kept horizontal and after the stage 212X descends, the plate 213X is supported from below by the measuring instrument 230, and then the stage 212X ascends and the plate 213X is placed on the stage 212X, positional deviation of the plate 213X on the stage 212X may also occur. When such positional deviation occurs, positional deviation of the tray cover TC1 also occurs along with the positional deviation of the plate 213X, so that there may arise a problem that the first transfer mechanism 50 cannot hold the release film F1 after the resin is supplied to the release film F1.

[0048] FIG. 9 is a diagram for explaining the relationship between the stage 212 and the plate 213 in a state before the stage 212 descends. Referring to FIG. 9, in this state, the release film F1 and the tray cover TC1 are delivered from the first transfer mechanism 50 to the plate 213, and the liquid resin R1 has not yet been supplied onto the release film F1. Each of the positioning pins PI1 and PI2 provided on the stage 212 is inserted into an insertion hole provided in the plate 213.

[0049] Referring again to FIG. 6, in the state shown in FIG. 9, the base portion PD1 of the positioning pin PI1 is located within the insertion hole IN1. When the plate 213 is not displaced at all with respect to the stage 212, the shortest distance between the outer peripheral surface of the base portion PD1 and the inner peripheral surface of the insertion hole IN1 is the length LE1 (see FIG. 6). Since the length LE1 is sufficiently short and the clearance between the positioning pins PI1 and PI2 and the insertion holes IN1 and IN2 is small, displacement of the plate 213 with respect to the stage 212 is suppressed.

[0050] Figure 10 is a diagram illustrating the relationship between the stage 212 and the plate 213 after the stage 212 has been lowered. Referring to Figure 10, in this state, the plate 213 is supported from below by the weighing device 230 and is floating above the stage 212. Liquid resin R1 is supplied onto the release film F1 from the dispenser 250, and the weight of the liquid resin R1 supplied onto the release film F1 is measured by the weighing device 230. Positioning pins PI1 and PI2 provided on the stage 212 are each inserted into insertion holes provided on the plate 213.

[0051] Figure 11 illustrates the relationship between the positioning pin PI1 and the insertion hole IN1 after the stage 212 has been lowered. Here, the relationship between the positioning pin PI1 and the insertion hole IN1 is used as an example. The relationship between the positioning pin PI2 and the insertion hole IN2 is the same as the relationship between the positioning pin PI1 and the insertion hole IN1.

[0052] Referring to Figure 11, in the state shown in Figure 10, the base portion PD1 and the inclined portion DC1 of the positioning pin PI1 are located outside the insertion hole IN1. Also, the tip portion T1 and the inclined portion DC2 of the positioning pin PI1 are located inside the insertion hole IN1. When the plate 213 is not misaligned at all with respect to the stage 212, the shortest distance between the outer surface of the tip portion T1 and the inner surface of the insertion hole IN1 is length LE2. Since length LE2 is sufficiently long and the clearance between the positioning pins PI1, PI2 and the insertion holes IN1, IN2 is large, there is a high probability that each positioning pin will not contact the inner surface of the insertion hole. Therefore, the weight of the resin on the release film F1 can be measured with relatively high accuracy by the weighing device 230.

[0053] Furthermore, the tip T1 of the positioning pin PI1 is cylindrical. Therefore, at any position in the vertical direction, the shortest distance between the outer surface of the tip T1 and the inner surface of the insertion hole IN1 is length LE2. Consequently, a large and stable clearance is secured between the positioning pins PI1 and PI2 and the insertion holes IN1 and IN2. As a result, the weight of the resin on the release film F1 can be measured with relatively high accuracy by the weighing device 230.

[0054] Furthermore, in the positioning pin PI1, an inclined portion DC1 is provided at the boundary between the base portion PD1 and the tip portion T1. Because the inclined portion DC1 is formed at the boundary between the base portion PD1 and the tip portion T1 in the positioning pins PI1 and PI2, the occurrence of the plate 213 getting caught on the boundary portion between the base portion PD1 and the tip portion T1 when the stage 212 moves upward again is suppressed.

[0055] [3. Features] As described above, with the second module 20 included in the resin molding apparatus 1 according to this embodiment, when the stages 212 and 222 have not moved downward, the clearance between the positioning pins PI1 and PI2 and the insertion holes IN1 and IN2 is small, so the misalignment of the plates 213 and 223 can be suppressed. Furthermore, with the second module 20, when the stages 212 and 222 have moved downward, the clearance between the positioning pins PI1 and PI2 and the insertion holes IN1 and IN2 is large, and there is a high possibility that the positioning pins PI1 and PI2 will not come into contact with the inner circumferential surface of the insertion holes, so the weight of the resin can be measured with relatively high accuracy using the weighing device 230.

[0056] Note that the second module 20 is an example of the "resin supply mechanism" in the present invention. Stage 212 is an example of the "first stage" in the present invention. Plate 213 is an example of the "first plate" in the present invention. Dispenser 250 is an example of the "dispenser" in the present invention. Measuring device 230 is an example of the "measuring device" in the present invention. Positioning pin PI1 is an example of the "first positioning pin" and "third positioning pin". Positioning pin PI2 is an example of the "second positioning pin" and "fourth positioning pin". Insertion hole IN1 is an example of the "first insertion hole" and "third insertion hole". Insertion hole IN2 is an example of the "second insertion hole" and "fourth insertion hole". Base PD1 is an example of the "base" in the present invention. Tip T1 is an example of the "tip" in the present invention. Inclined part DC1 is an example of the "inclined part" in the present invention. Stage 222 is an example of the "second stage" in the present invention. Plate 223 is an example of the "second plate" in the present invention. Resin molding apparatus 1 is an example of the "resin molding apparatus" in the present invention. Molding die 305 is an example of the "molding die" in the present invention.

[0057] [4. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.

[0058] <4-1> In the above embodiment, stepped positioning pins PI1 and PI2 are formed on each of the stages 212 and 222, and insertion holes IN1 and IN2, which are formed by cylindrical spaces, are formed on each of the plates 213 and 223. However, the shapes of the positioning pins PI1 and PI2 and the insertion holes IN1 and IN2 are not limited to these. For example, each of the positioning pins PI1 and PI2 may be made up of a single cylinder, and each of the insertion holes IN1 and IN2 may be made up of a stepped space.

[0059] Figure 12 illustrates another example of a positioning pin and an insertion hole. Referring to Figure 12, a cylindrical positioning pin PI1A is formed on the stage 212A, and an insertion hole IN1A, which is formed by a stepped space, is formed on the plate 213A. Referring to the upper view included in Figure 12, when the plate 213A is not supported from below by the weighing device 230, the shortest distance between the outer surface of the positioning pin PI1A and the inner surface of the insertion hole IN1A is length LE1A. On the other hand, referring to the lower view included in Figure 12, when the plate 213A is supported from below by the weighing device 230, the shortest distance between the outer surface of the positioning pin PI1A and the inner surface of the insertion hole IN1A is length LE2A. Length LE2A is longer than length LE1A. When the stage 212A is not moving downward (when the plate 213A is not supported from below by the weighing device 230), the clearance between the positioning pin PI1A and the insertion hole IN1A is small, thus suppressing displacement of the plate 213A. Furthermore, when the stage 212A has moved downward (when the plate 213A is supported from below by the weighing device 230), the clearance between the positioning pin PI1A and the insertion hole IN1A is large, making it highly likely that the positioning pin PI1A will not contact the inner surface of the insertion hole IN1A, thus allowing the weight of the resin to be measured with relatively high accuracy by the weighing device 230.

[0060] <4-2> In the above embodiment, positioning pins PI1 and PI2 are formed on each of the stages 212 and 222, and insertion holes IN1 and IN2 are formed on each of the plates 213 and 223. However, the locations where the positioning pins PI1 and PI2 and insertion holes IN1 and IN2 are formed are not limited to these. For example, insertion holes IN1 and IN2 may be formed on each of the stages 212 and 222, and positioning pins PI1 and PI2 may be formed on each of the plates 213 and 223.

[0061] <4-3> In addition, in the above embodiment, when the stages 212 and 222 have not moved downward, the entire base portion PD1 of the positioning pins PI1 and PI2 does not necessarily have to be located inside the insertion holes IN1 and IN2. It is sufficient that at least a part of the base portion PD1 of the positioning pins PI1 and PI2 is located inside the insertion holes IN1 and IN2, respectively. Also, when the stages 212 and 222 have moved downward, the entire tip portion T1 of the positioning pins PI1 and PI2 does not necessarily have to be located inside the insertion holes IN1 and IN2. It is sufficient that at least a part of the tip portion T1 of the positioning pins PI1 and PI2 is located inside the insertion holes IN1 and IN2, respectively.

[0062] <4-4> Furthermore, in the above embodiment, the shapes of the positioning pins PI1 and PI2 are not limited to the shapes described above. For example, the shape of the tip portion T1 can be any shape such that the shortest distance between the outer surface of the positioning pin and the inner surface of the insertion hole is longer after the stages 212 and 222 have moved downward compared to before the stages 212 and 222 have moved downward.

[0063] Figure 13 schematically shows another example of a positioning pin. As shown in Figure 13, the positioning pin PI1B includes a base portion PD1B and a tip portion T1B. The base portion PD1B has a cylindrical shape, and the tip portion T1B has a frustoconical shape. For example, the shape of each positioning pin may be such as this.

[0064] <4-5> In addition, in the above embodiment, the release film placement section 200 does not necessarily have to include both the combination of stage 212 and plate 213 and the combination of stage 222 and plate 223. The release film placement section 200 may include, for example, only one of the combinations of stage 212 and plate 213, or the combination of stage 222 and plate 223. Furthermore, the release film placement section 200 may further include other combinations of stages and other plates.

[0065] <4-6> In the above embodiment, each of the insertion holes IN1 and IN2 was a through hole. However, each of the insertion holes IN1 and IN2 does not necessarily have to be a through hole. As long as the shortest distance between the outer surface of each positioning pin and the inner surface of the insertion hole is longer in the state after the stages 212 and 222 have moved downward compared to before the stages 212 and 222 have moved downward, each of the insertion holes IN1 and IN2 does not necessarily have to be a through hole.

[0066] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0067] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0068] [5. Addendum] This specification discloses a variety of technical ideas, including at least the following technologies.

[0069] <Technology 1> (Configuration) A resin supply mechanism for supplying resin onto a release film used in resin molding, comprising: a plate-shaped first stage having a first opening and moving in the vertical direction; a first plate positioned on the first stage and covering the first opening; a dispenser for supplying resin onto the release film positioned on the first plate; and a weighing device that, after the first stage has moved downward, supports the first plate from below through the first opening and weighs the resin on the release film positioned on the first plate, wherein a first positioning pin and a second positioning pin are formed on one of the first stage and the first plate, and a first insertion hole and a second insertion hole are formed on the other of the first stage and the first plate, into which the first positioning pin and the second positioning pin are respectively inserted. A resin supply mechanism wherein, compared to before the first stage moves downward, the shortest distance between the outer surface of the first positioning pin and the inner surface of the first insertion hole is longer, and the shortest distance between the outer surface of the second positioning pin and the inner surface of the second insertion hole is also longer after the first stage moves downward. (Effects, etc.) With this resin supply mechanism, when the first stage is not moving downward, the clearance between each positioning pin and the insertion hole is small, so displacement of the first plate can be suppressed. Furthermore, with this resin supply mechanism, when the first stage has moved downward, the clearance between each positioning pin and the insertion hole is large, and there is a high possibility that each positioning pin will not come into contact with the inner surface of the insertion hole, so the weight of the resin can be measured with relatively high accuracy using a weighing instrument.

[0070] <Technology 2> (Configuration) The resin supply mechanism according to Technology 1, wherein the first stage has the first positioning pin and the second positioning pin formed thereon, the first plate has the first insertion hole and the second insertion hole formed thereon, each of the first positioning pin and the second positioning pin includes a base portion and a tip portion formed above the base portion, before the first stage moves downward, at least a portion of the base portion of each of the first positioning pin and the second positioning pin is located inside the first insertion hole and the second insertion hole, respectively, and after the first stage moves downward, at least a portion of the tip portion of each of the first positioning pin and the second positioning pin is located inside the first insertion hole and the second insertion hole, respectively, and the base portion of each of the first positioning pin and the second positioning pin is located outside the first insertion hole and the second insertion hole, respectively. (Effects, etc.) With this resin supply mechanism, when the first stage is not moving downward, at least a portion of the base of each positioning pin is located inside the insertion hole, and the clearance between each positioning pin and the insertion hole is small, so displacement of the first plate can be suppressed. Furthermore, with this resin supply mechanism, when the first stage is moving downward, the base of each positioning pin is located outside the insertion hole, and the clearance between each positioning pin and the insertion hole is large, making it highly likely that each positioning pin will not come into contact with the inner surface of the insertion hole, so the weight of the resin can be measured with relatively high accuracy using a weighing instrument.

[0071] <Technology 3> (Configuration) The resin supply mechanism described in Technology 2, wherein each of the base portion and the tip portion has a columnar shape, and in a plan view of each of the first positioning pin and the second positioning pin, the outer circumference of the tip portion is located inside the outer circumference of the base portion. (Effects, etc.) With this resin supply mechanism, when the first stage is moved downward, the tip portions of each positioning pin have a columnar shape, and a large and stable clearance is secured between each positioning pin and the insertion hole, so that the weight of the resin can be measured with higher precision using a weighing instrument.

[0072] <Technology 4> (Configuration) The resin supply mechanism according to Technology 2 or Technology 3, wherein each of the first positioning pin and the second positioning pin has an inclined portion formed at the boundary between the base portion and the tip portion, which is directed upward as it approaches the tip portion. (Effects, etc.) With this resin supply mechanism, since an inclined portion is formed at the boundary between the base portion and the tip portion of each positioning pin, it is possible to suppress the occurrence of the first plate getting caught at the boundary portion between the base portion and the tip portion when the first stage moves upward.

[0073] <Technology 5> (Configuration) The apparatus further comprises a plate-shaped second stage having a second opening and moving in the vertical direction, and a second plate that covers the second opening when placed on the second stage, the dispenser supplies resin onto the release film placed on the second plate, the weighing device supports the second plate from below through the second opening after the second stage has moved downward, and weighs the resin on the release film placed on the second plate, a third positioning pin and a fourth positioning pin are formed on one of the second stage and the second plate, and a third insertion hole and a fourth insertion hole are formed on the other of the second stage and the second plate into which the third positioning pin and the fourth positioning pin are respectively inserted. A resin supply mechanism according to any one of the technologies 1 to 4, wherein, compared to before the second stage moves downward, the shortest distance between the outer circumferential surface of the third positioning pin and the inner circumferential surface of the third insertion hole is longer, and the shortest distance between the outer circumferential surface of the fourth positioning pin and the inner circumferential surface of the fourth insertion hole is longer after the second stage moves downward. (Effects, etc.) With this resin supply mechanism, since positioning pins or insertion holes are formed in each of the first and second stages, for example, the misalignment of the first plate and the second plate can be suppressed more effectively compared to a case where positioning pins or insertion holes are not formed in each of the first and second stages and a common positioning pin or insertion hole is formed in the weighing instrument.

[0074] <Technology 6> (Configuration) The resin supply mechanism according to Technology 1, wherein the first plate has a rectangular shape, the side of the first plate closest to the position where the first positioning pin or the first insertion hole is formed on the first plate and the side of the first plate closest to the position where the second positioning pin or the second insertion hole is formed on the first plate are parallel to each other, and the side of the first plate second closest to the position where the first positioning pin or the first insertion hole is formed on the first plate and the side of the first plate second closest to the position where the second positioning pin or the second insertion hole is formed on the first plate are parallel to each other. (Effects, etc.) With this resin supply mechanism, since the first positioning pin and the second positioning pin are formed in relatively well-balanced positions on the first plate, the weight of the resin can be measured with relatively high accuracy using a weighing instrument.

[0075] <Technology 7> (Configuration) A resin molding apparatus for molding a pre-molded substrate that has not been molded with resin, comprising: a resin supply mechanism described in any one of Technology 1 to Technology 6; and a mold for performing resin molding of the pre-molded substrate using the resin supplied onto the release film. (Effects, etc.) With this resin molding apparatus, since the resin is appropriately supplied onto the release film by the resin supply mechanism, the resin molding of the pre-molded substrate can be performed appropriately.

[0076] <Technology 8> (Configuration) A method for manufacturing a resin molded product using the resin molding apparatus described in Technology 7, comprising: placing the release film on which the resin has been supplied and the pre-molding substrate into the molding die; and clamping the mold with the molding die. (Effects, etc.) According to this method for manufacturing a resin molded product, the resin is appropriately supplied onto the release film by the resin supply mechanism, so that a resin molded product can be manufactured appropriately.

[0077] 1 Resin molding apparatus, 10 First module, 20 Second module, 30 Third module, 40 Fourth module, 50 First transport mechanism, 60 Second transport mechanism, 70 Control unit, 100 Release film supply unit, 200 Release film placement unit, 210, 220 Replacement mechanism, 211, 221, 510 Support unit, 212, 222 Stage, 213, 223 Plate, 214, 224 Moving unit, 215, 225 Rail, 230 Measuring instrument, 250 Dispenser, 300 Resin molding unit, 301 Outer frame member, 305 Molding mold, 310 Fixed platen, 320 Upper mold, 330 Movable platen, 340 Lower mold, 341 Bottom member, 342 Side member, 343 Spring, 344 Base plate, 410 Substrate supply unit, 420 430 Substrate storage section, 511 Substrate mounting section, DC1, DC2 Holding section, F1 Inclined section, H1 Release film, H2 Through hole, IN1, IN2 Insertion hole, P1 Substrate, PD1 Base section, PI1, PI2 Positioning pin, R1 Liquid resin, S1, S2, S3, S4 Edge, T1 Tip, TC1 Tray cover.

Claims

1. A resin supply mechanism for supplying resin onto a release film used in resin molding, comprising: a plate-shaped first stage having a first opening and moving in the vertical direction; a first plate positioned on the first stage and covering the first opening; a dispenser for supplying resin onto the release film positioned on the first plate; and a weighing device that, after the first stage has moved downward, supports the first plate from below through the first opening and weighs the resin on the release film positioned on the first plate, wherein a first positioning pin and a second positioning pin are formed on one of the first stage and the first plate; a first insertion hole and a second insertion hole are formed on the other of the first stage and the first plate, into which the first positioning pin and the second positioning pin are respectively inserted; and the shortest distance between the outer circumferential surface of the first positioning pin and the inner circumferential surface of the first insertion hole is longer after the first stage has moved downward compared to before the first stage has moved downward, and the shortest distance between the outer circumferential surface of the second positioning pin and the inner circumferential surface of the second insertion hole is longer.

2. The resin supply mechanism according to claim 1, wherein the first stage has a first positioning pin and a second positioning pin formed thereon, the first plate has a first insertion hole and a second insertion hole formed thereon, each of the first positioning pin and the second positioning pin includes a base portion and a tip portion formed above the base portion, before the first stage moves downward, at least a portion of the base portion of each of the first positioning pin and the second positioning pin is located within the first insertion hole and the second insertion hole, respectively, and after the first stage moves downward, at least a portion of the tip portion of each of the first positioning pin and the second positioning pin is located within the first insertion hole and the second insertion hole, respectively, and the base portion of each of the first positioning pin and the second positioning pin is located outside the first insertion hole and the second insertion hole, respectively.

3. The resin supply mechanism according to claim 2, wherein each of the base portion and the tip portion has a columnar shape, and in a plan view of each of the first positioning pin and the second positioning pin, the outer peripheral portion of the tip portion is located inside the outer peripheral portion of the base portion.

4. The resin supply mechanism according to claim 2 or 3, wherein each of the first positioning pin and the second positioning pin has a sloping portion formed at the boundary between the base portion and the tip portion, which is directed upward as it approaches the tip portion.

5. A resin supply mechanism according to any one of claims 1 to 4, further comprising: a plate-shaped second stage having a second opening and moving in the vertical direction; and a second plate that covers the second opening when positioned on the second stage, wherein the dispenser supplies resin onto the release film positioned on the second plate; the weighing device supports the second plate from below through the second opening after the second stage has moved downward and weighs the resin on the release film positioned on the second plate; a third positioning pin and a fourth positioning pin are formed on one of the second stage and the second plate; a third insertion hole and a fourth insertion hole are formed on the other of the second stage and the second plate, into which the third positioning pin and the fourth positioning pin are respectively inserted; and the shortest distance between the outer circumferential surface of the third positioning pin and the inner circumferential surface of the third insertion hole is longer after the second stage has moved downward compared to before the second stage has moved downward, and the shortest distance between the outer circumferential surface of the fourth positioning pin and the inner circumferential surface of the fourth insertion hole is longer.

6. The resin supply mechanism according to claim 1, wherein the first plate has a rectangular shape, the side of the first plate closest to the position where the first positioning pin or the first insertion hole is formed on the first plate and the side of the first plate closest to the position where the second positioning pin or the second insertion hole is formed on the first plate are parallel to each other, and the side of the first plate second closest to the position where the first positioning pin or the first insertion hole is formed on the first plate and the side of the first plate second closest to the position where the second positioning pin or the second insertion hole is formed on the first plate are parallel to each other.

7. A resin molding apparatus for molding a pre-molded substrate that has not been molded with resin using resin, comprising: a resin supply mechanism according to any one of claims 1 to 6; and a mold for performing resin molding of the pre-molded substrate using the resin supplied onto the release film.

8. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 7, comprising: placing the release film on which the resin has been supplied and the pre-molding substrate into the molding die; and clamping the mold with the molding die.

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