Electronic device including antenna module

Abstract

This electronic device may comprise: a display; a back cover; a conductive sidewall defining at least a portion of a side surface, extending from an edge of the display to an edge of the back cover, of the electronic device; and an antenna module disposed between the display and the back cover. The antenna module may comprise: a substrate including a first surface facing in the direction of a conductive sidewall; and a plurality of antennas disposed on the first surface of the substrate and configured to radiate a wireless signal through a beam traveling toward the conductive sidewall. The conductive sidewall may comprise: a first portion in which a plurality of holes respectively corresponding to the plurality of antennas are formed; a second portion extending from the lower side of the first portion to the edge of the display; and a third portion extending from the upper side of the first portion to the edge of the back cover. The inner surface of the third portion of the conductive sidewall may include a region which is configured to reflect at least a portion of the wireless signal and recessed relative to the inner surface of the first portion.

Description

Electronic device including an antenna module

[0001] The present disclosure relates to an electronic device comprising an antenna module.

[0002] The electronic device may include an antenna module for wireless communication with an external device. For example, the electronic device may include an antenna module for 5G communication in a high-frequency band. The antenna module can meet the performance requirements for 5G communication in a high-frequency band through beamforming, which focuses a signal in a specific direction.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to one embodiment, an electronic device may include: a display defining at least a portion of the front surface of the electronic device; a back cover defining at least a portion of the rear surface of the electronic device; a conductive sidewall defining at least a portion of the side surface of the electronic device extending from the edge of the display to the edge of the back cover; and an antenna module disposed between the display and the back cover. The antenna module may include a substrate having a first surface facing the direction of the conductive sidewall, and a plurality of antennas disposed on the first surface of the substrate and configured to radiate a wireless signal through a beam facing the conductive sidewall. The conductive sidewall may include a first portion having a plurality of holes formed corresponding to each of the plurality of antennas; a second portion extending from the lower side of the first portion to the edge of the display; and a third portion extending from the upper side of the first portion to the edge of the back cover. The inner surface of the third portion of the conductive sidewall may include a region recessed relative to the inner surface of the first portion and configured to reflect at least a portion of the wireless signal.

[0005] According to one embodiment, an electronic device may include: a display defining at least a portion of the front surface of the electronic device; a back cover defining at least a portion of the rear surface of the electronic device; a conductive sidewall defining at least a portion of the side surface of the electronic device extending from the edge of the display to the edge of the back cover; and an antenna module disposed between the display and the back cover. The antenna module may include a substrate comprising a first surface facing the direction of the conductive sidewall, and a plurality of antennas disposed on the first surface of the substrate and configured to radiate a wireless signal through a beam facing the conductive sidewall. The inner surface of the conductive sidewall may include a region located in the direction of the back cover with respect to an imaginary line segment perpendicular to the first surface and passing through the center of the antenna module. The region may include a stepped structure recessed in the direction of the side surface of the electronic device to reflect at least a portion of the wireless signal.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0009] FIG. 3 shows the rear of an electronic device and an antenna module of an electronic device according to one embodiment.

[0010] FIGS. 4a and FIGS. 4b illustrate an antenna module according to one embodiment.

[0011] FIG. 4c is a cross-sectional view of the antenna module of FIG. 4a cut along line B-B'.

[0012] FIG. 4d is a drawing showing a plurality of antennas of an antenna module according to one embodiment.

[0013] FIG. 5a shows a cross-section of an electronic device according to one embodiment.

[0014] FIG. 5b shows a conductive portion of the sidewall of an electronic device and an antenna module according to one embodiment.

[0015] Figure 6 is a cross-section showing an electronic device according to a comparative example.

[0016] FIG. 7 shows the coverage of an antenna module of an electronic device according to a comparative example and the coverage of an antenna module of an electronic device according to one embodiment.

[0017] FIG. 8 shows a cross-section of an electronic device according to one embodiment.

[0018] FIG. 9 shows a cross-section of an electronic device according to one embodiment.

[0019] FIGS. 10a and FIGS. 10b show cross-sections of an electronic device according to one embodiment.

[0020] FIG. 11 shows a conductive part of an electronic device according to one embodiment.

[0021] FIGS. 12a and FIGS. 12b show cross-sections of an electronic device according to one embodiment.

[0022] FIGS. 13a and FIGS. 13b show cross-sections of an electronic device according to one embodiment.

[0023] FIGS. 14a and FIGS. 14b show cross-sections of an electronic device according to one embodiment.

[0024] FIG. 15 shows a cross-section of an electronic device according to one embodiment.

[0025] Identical or similar components in the drawings may be assigned the same reference numerals. Descriptions of components having the same reference numeral may be applied identically or in a corresponding manner when referring to different drawings, unless otherwise noted, and redundant descriptions of components having the same reference numeral may not be repeated. In the following descriptions referring to specific drawings, reference numerals from other drawings may be referenced.

[0026] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0028] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0029] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0030] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0034] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0035] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0036] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0040] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0042] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0045] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] FIG. 2a is a drawing illustrating an exemplary electronic device according to one embodiment. Referring to FIG. 2a, the electronic device (200) according to one embodiment may include a housing (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0050] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0051] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials.

[0052] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0053] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0054] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0055] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0056] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0057] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0058] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0059] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0060] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0061] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part area of ​​the third surface (200C) and a second microphone hole (204) formed in a part area of ​​the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0062] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0063] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0064] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0065] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0066] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0067] In one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0068] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0069] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0070] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0071] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0072] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0073] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment. Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., side bezel structure (218) of FIG. 2a), a first printed circuit board (250), a second printed circuit board (252), and a battery (270) (e.g., battery (189) of FIG. 1).

[0074] In one embodiment, the frame structure (or frame) (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be placed. The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0075] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of a metal and / or a polymer.

[0076] The frame structure (240) (or the first part (241) of the frame structure (240)) may be referred to as a lateral member or lateral structure in that it forms the side of the electronic device (200). The frame structure (240) (or the second part (243) of the frame structure (240)) may be referred to as a support member, support structure, or bracket in that it supports various parts of the electronic device (200).

[0077] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly positioned on the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned on the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0078] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0079] In one embodiment, the front plate (202) may be combined with the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0080] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0081] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0082] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0083] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., front (200A) of FIG. 2a).

[0084] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) through a connecting member (e.g., connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0085] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

[0086] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). In other words, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0087] FIG. 3 shows the rear of an electronic device and an antenna module of an electronic device according to one embodiment.

[0088] Referring to FIG. 3, in one embodiment, the electronic device (200) may include a housing (360) (e.g., the housing (210) of FIG. 2a). For example, the housing (360) may include a side wall (370) (e.g., the first part (241) of FIG. 2b), a support part (380) (e.g., the second part (243) of FIG. 2b), and a back cover (390) (e.g., the rear plate (211) of FIG. 2b).

[0089] The support portion (380) may provide a structure for supporting or accommodating various components of the electronic device (200). For example, components of the electronic device (200), such as a first printed circuit board (250) and an antenna module (300), may be placed on the support portion (380). The side wall (370) may wrap around the edge of the support portion (380) to at least partially form (or define) the side (200C) of the electronic device (200). A back cover (390) may be seated on the side wall (370) (and / or the support portion (380)). The back cover (390) can cover the internal space of the electronic device (200) (e.g., the support portion (380) or parts of the electronic device (200) placed on the support portion (380)) and can at least partially form (or define) the rear surface (200B) of the electronic device (200).

[0090] An electronic device (200) according to one embodiment may include an antenna module (300) for wireless communication with an external electronic device (e.g., the antenna module (197) of FIG. 1).

[0091] According to one embodiment, the processor (120) (and / or wireless communication module (192)) of the electronic device (200) may be configured to communicate with an external electronic device using an antenna module (300). The antenna module (300) may be electrically and / or operationally connected to the processor (120) and the wireless communication module (192) of the electronic device (200). For example, the electronic device (200) may include a flexible printed circuit board (304) for electrically connecting the antenna module (300) to the processor (120) and the wireless communication module (192) of the electronic device (200). The flexible printed circuit board (304) may electrically connect the antenna module (300) to a first printed circuit board (250) of the electronic device (200). A processor (120) and a wireless communication module (192) may be disposed on a first printed circuit board (250) of an electronic device (200), and an antenna module (300) may be electrically connected to the processor (120) and / or the wireless communication module (192) through a flexible printed circuit board (304) and the first printed circuit board (250).

[0092] According to one embodiment, the antenna module (300) may be placed within the housing (360) of the electronic device (200). For example, the antenna module (300) may be placed adjacent to the side wall (370). For example, the antenna module (300) may be placed on the support portion (380) so as to face the inner surface of the side wall (370).

[0093] An electronic device (200) according to one embodiment may include a bracket (302) that supports and accommodates an antenna module (300). The bracket (302) is fixed to a support portion (380) in a state of accommodating the antenna module (300), thereby protecting the antenna module (300) and maintaining the position of the antenna module (300) in a fixed position. For example, the bracket (302) may include a through hole (305) through which a fastener passes. The fastener may pass through the through hole (305) and be coupled to the support portion (380). For example, the fastener may include a screw, but is not limited thereto.

[0094] According to one embodiment, the antenna module (300) may include a mmWave module (or mmWave antenna module) capable of supporting a high frequency band (e.g., a mmWave (millimeter wave) band). The mmWave module may be used to transmit and / or receive signals on a millimeter wave frequency band (not limited, for example, about 24 GHz or higher). The mmWave module can improve the communication performance of the electronic device (200) by providing high-speed data transmission and a wide bandwidth.

[0095] FIGS. 4a and 4b illustrate an antenna module according to one embodiment. FIG. 4c is a cross-sectional view of the antenna module of FIG. 4a cut along line B-B'.

[0096] FIGS. 4a and 4b illustrate an example of the structure of an antenna module (300) described with reference to FIG. 3. FIG. 4a is a perspective view of the antenna module (300) viewed from one side, and FIG. 4b is a perspective view of the antenna module (300) viewed from the other side opposite to the one side.

[0097] Referring to FIG. 4a, the antenna module (300) may include a printed circuit board (310) and a plurality of antennas (320). For example, the plurality of antennas (320) may include, but are not limited to, a first antenna element (321), a second antenna element (322), a third antenna element (323), a fourth antenna element (324), and / or a fifth antenna element (325). The plurality of antennas (320) may form an array antenna. For example, the plurality of antennas (320) may be arranged side by side on a first surface (311) of the printed circuit board (310). For example, the plurality of antennas (320) may be arranged in the Y-axis direction of FIG. 4a. Each of the first antenna element (321), the second antenna element (322), the third antenna element (323), the fourth antenna element (324), and the fifth antenna element (325) may include a conductive patch or a patch antenna.

[0098] According to one embodiment, the printed circuit board (310) may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with said plurality of conductive layers. The printed circuit board (310) may provide electrical connections between the printed circuit board (310) and / or various electronic components disposed outside the printed circuit board (310) using wirings and conductive vias formed in said conductive layers. According to one embodiment, the printed circuit board (310) may include a first surface (311) facing in one direction (e.g., -X direction) and a second surface (312) opposite to the first surface (311).

[0099] According to one embodiment, a plurality of antennas (320) may be configured to form a directional beam. The plurality of antennas (320) may be disposed on a first surface (311) of a printed circuit board (310) or inside the printed circuit board (310) adjacent to the first surface (311). The plurality of antennas (320) may all have the same shape or each may have a different shape. The plurality of antennas (320) may be arranged for the directionality of the directional beam. The antenna module (300) may be configured to form a highly directional beam through the arrangement of the plurality of antennas (320) and the polarization beam radiated from each of the plurality of antennas (320), and to communicate using the beam.

[0100] Referring to FIGS. 4b and 4c, an RFIC (401) (radio frequency integrated circuit) and a PMIC (402) (power management IC) may be placed on the second side (312) of the printed circuit board (310). For example, at least one processor of the electronic device (200) (e.g., processor (120) of FIG. 3) may generate a baseband signal. The baseband signal may be up-converted into a signal of a specified frequency band through the RFIC (401). The up-converted signal may be filtered through a radio frequency front end module (RFFE) and radiated outside the electronic device (200) through an antenna module (300). For example, a signal received from an external electronic device through the antenna module (300) may be pre-processed through the RFFE. The RFIC (401) can down-convert the pre-processed wireless signal into a baseband signal so that the signal can be processed by at least one processor. The down-converted signal can be provided to a wireless communication module (e.g., the wireless communication module (192) of FIG. 3) placed on a printed circuit board (e.g., the first printed circuit board (250) of FIG. 3) and at least one processor (e.g., the processor (120) of FIG. 3).

[0101] According to one embodiment, the RFIC (401) can up-convert an IF signal obtained from an IFIC (intermediate frequency integrated circuit) into an RF signal of a selected band during transmission. During reception, the RFIC (401) can down-convert an RF signal obtained through an antenna array into an IF signal and transmit it to the IFIC.

[0102] According to one embodiment, the PMIC (402) receives voltage from a printed circuit board (e.g., the printed circuit board (250) of FIG. 3) and can provide the necessary power to electronic components (e.g., RFIC (401)) placed on the printed circuit board (310).

[0103] According to one embodiment, the RFIC (401) and the PMIC (402) may be covered by a shielding member (403). The shielding member (403) may be placed on a second surface (312) of a printed circuit board (310) to electromagnetically shield at least one of the RFIC (401) or the PMIC (402). For example, the shielding member (403) may include a shield can surrounding the at least one of the RFIC (401) or the PMIC (402) or an epoxy molding compound (EMC) encapsulating the at least one of the RFIC (401) or the PMIC (402).

[0104] According to one embodiment, the connector (404) of the antenna module (300) may be placed on the second side (312) of the printed circuit board (310). The connector (404) may be connected to a flexible printed circuit board (e.g., the flexible printed circuit board (304) of FIG. 3) to provide an electrical connection between the printed circuit board (310) and the antenna module (300). Through the flexible printed circuit board (304) connected to the connector (404), the RFIC (401) and / or PMIC (402) of the antenna module (300) may be electrically connected to the first printed circuit board (250) of the electronic device (200).

[0105] FIG. 4d is a drawing showing a plurality of antennas of an antenna module according to one embodiment.

[0106] Referring to FIG. 4d, the antenna module (300) can be located between the back cover (390) and the display (201).

[0107] Each of the plurality of antennas (320) of the antenna module (300) may include one or more feed points. The number of feed points of each of the plurality of antennas (320) may vary (or be determined) depending on the number of polarizations and / or frequency bands supported by the antenna module (300).

[0108] For example, the first antenna element (321) may include one or more first feed points. For example, the first antenna element (321) may be electrically connected to the RFIC (401) of the antenna module (300) at the one or more first feed points. The RFIC (401) may be configured to supply a signal to the first antenna element (321) and / or receive a signal from the first antenna element (321) through the one or more first feed points. For example, the one or more first feed points may include a first feed point (321a), a second feed point (321b), a third feed point (321c), and a fourth feed point (321d).

[0109] For example, the first feed point (321a) may be closer to the back cover (390) than the second feed point (321b). For example, a signal transmitted and / or received using the first feed point (321a) of the first antenna element (321) may have a first polarization characteristic (e.g., vertical polarization) and may be included in a first frequency band. For example, a signal transmitted and / or received using the second feed point (321b) of the first antenna element (321) may have a second polarization characteristic (e.g., vertical polarization) parallel to the first polarization characteristic and may be included in a second frequency band higher than the first frequency band. For example, a signal transmitted and / or received using the third feed point (321c) of the first antenna element (321) may have a second polarization characteristic (e.g., horizontal polarization) orthogonal to the first polarization characteristic and may be included in a third frequency band. For example, a signal transmitted and / or received using the fourth feed point (321d) of the first antenna element (321) may have a fourth polarization characteristic (e.g., horizontal polarization) orthogonal to the second polarization characteristic and may be included in a fourth frequency band.

[0110] For example, without limitation, the first frequency band and the third frequency band may be included in the same frequency band. For example, without limitation, the first frequency band may form a first sub-band within the first frequency band, and the second frequency band may form a second sub-band within the first frequency band. The first sub-band and the second sub-band may be identical, partially overlap, or separate. For example, without limitation, the first frequency band may include an n261 band comprising sub-bands with center frequencies of 27.5 GHz, 28 GHz, and 28.35 GHz.

[0111] For example, without limitation, the second frequency band and the fourth frequency band may be included in the same frequency band. For example, without limitation, the second frequency band may form a third sub-band within the second frequency band, and the fourth frequency band may form a fourth sub-band within the second frequency band. The third sub-band and the fourth sub-band may be identical, partially overlap, or separate. For example, without limitation, the second frequency band may include an n260 band comprising sub-bands with center frequencies of 37 GHz, 38.5 GHz, and 40 GHz.

[0112] For example, the second antenna element (322) may include one or more second feed points. For example, the second antenna element (322) may be electrically connected to the RFIC (401) of the antenna module (300) at the one or more second feed points. The RFIC (401) may be configured to supply a signal to the second antenna element (322) and / or receive a signal from the second antenna element (322) through the one or more second feed points. For example, the one or more second feed points may include a first feed point (322a), a second feed point (322b), a third feed point (322c), and a fourth feed point (322d). The description of the first feed point (322a), second feed point (322b), third feed point (322c), and fourth feed point (322d) of the second antenna element (322) may be applied in a substantially identical or corresponding manner to the description of the first feed point (321a), second feed point (321b), third feed point (321c), and fourth feed point (321d) of the first antenna element (321).

[0113] For example, the third antenna element (323) may include one or more third feed points. For example, the third antenna element (323) may be electrically connected to the RFIC (401) of the antenna module (300) at the one or more third feed points. The RFIC (401) may be configured to supply a signal to the third antenna element (323) and / or receive a signal from the third antenna element (323) through the one or more third feed points. For example, the one or more third feed points may include a first feed point (323a), a second feed point (323b), a third feed point (323c), and a fourth feed point (323d). The description of the first feed point (323a), second feed point (323b), third feed point (323c), and fourth feed point (323d) of the third antenna element (323) may be applied in a substantially identical or corresponding manner to the description of the first feed point (321a), second feed point (321b), third feed point (321c), and fourth feed point (321d) of the first antenna element (321).

[0114] For example, the fourth antenna element (324) may include one or more fourth feed points. For example, the fourth antenna element (324) may be electrically connected to the RFIC (401) of the antenna module (300) at the one or more fourth feed points. The RFIC (401) may be configured to supply a signal to the fourth antenna element (324) and / or receive a signal from the fourth antenna element (324) through the one or more fourth feed points. For example, the one or more fourth feed points may include a first feed point (324a), a second feed point (324b), a third feed point (324c), and a fourth feed point (324d). The description of the first feed point (324a), second feed point (324b), third feed point (324c), and fourth feed point (324d) of the fourth antenna element (324) may be applied in a substantially identical or corresponding manner to the description of the first feed point (321a), second feed point (321b), third feed point (321c), and fourth feed point (321d) of the first antenna element (321).

[0115] For example, the fifth antenna element (325) may include one or more fifth feed points. For example, the fifth antenna element (325) may be electrically connected to the RFIC (401) of the antenna module (300) at the one or more fifth feed points. The RFIC (401) may be configured to supply a signal to the fifth antenna element (325) and / or receive a signal from the fifth antenna element (325) through the one or more fifth feed points. For example, the one or more fifth feed points may include a first feed point (325a), a second feed point (325b), a third feed point (325c), and a fourth feed point (325d). The description of the first feed point (325a), second feed point (325b), third feed point (325c), and fourth feed point (325d) of the fifth antenna element (325) may be applied in a substantially identical or corresponding manner to the description of the first feed point (321a), second feed point (321b), third feed point (321c), and fourth feed point (321d) of the first antenna element (321).

[0116] FIG. 5a shows a cross-section of an electronic device according to one embodiment. FIG. 5b shows a conductive portion of a sidewall of an electronic device and an antenna module according to one embodiment. FIG. 5a may correspond to line A-A' of FIG. 3.

[0117] Referring to FIG. 5a, in one embodiment, the sidewall (370) may include a conductive portion (571), a non-conductive portion (572), and / or a non-conductive cover portion (573). For example, the sidewall (370) may include a conductive portion (571), a non-conductive portion (572), and a non-conductive cover portion (573). In another example, the sidewall (370) may include a conductive portion (571) and a non-conductive cover portion (573) and may not include a non-conductive portion (572). For example, the conductive portion (571) may be formed of a metal such as aluminum, magnesium, or titanium. The non-conductive portion (572) may be formed of a non-conductive material such as plastic. If the sidewall (370) does not include a non-conductive portion (572), the area occupied by the non-conductive portion (572) may be formed of a non-conductive material such as air. The non-conductive portion (572) may be referred to as a non-conductive area, as an area formed from a non-conductive material such as air or plastic. The non-conductive cover portion (573) may be formed of a non-conductive material such as ceramic or plastic. For example, the dielectric constant of the non-conductive cover portion (573) may be greater than the dielectric constant of the non-conductive portion (572). The conductive portion (571) of the sidewall (370) may be referred to as a conductive sidewall. The non-conductive portion (572) of the sidewall (370) may be referred to as a non-conductive sidewall.

[0118] In one embodiment, a non-conductive portion (572) may be arranged along a conductive portion (571). A plurality of holes (590) may be formed in the conductive portion (571). The plurality of holes (590) may correspond to a plurality of antennas of the antenna module (300) (e.g., a plurality of antennas (320) of FIG. 4d). In one embodiment, a single hole may be formed instead of a plurality of holes (590).

[0119] In one embodiment, one side of each of the plurality of holes (590) may be closed by a non-conductive portion (572). A non-conductive cover portion (573) may be disposed in each of the plurality of holes (590). The non-conductive cover portion (573) may be attached to the non-conductive portion (572) through an adhesive material (576). The adhesive material (576) may include, for example, a waterproof tape, which is not limited to. For example, the conductive portion (571) may form at least a portion of the side (200C) of the electronic device (200) extending from the edge of the display (501) to the edge of the back cover (390). For example, the conductive portion (571) and the non-conductive cover portion (573) may form at least a portion of the side (200C) of the electronic device (200).

[0120] In one embodiment, each of the plurality of holes (590) may include a first portion filled with a non-conductive portion (572) and a second portion in which a non-conductive cover portion (573) is disposed. For example, the first portion and the second portion of each of the plurality of holes (590) may have different diameters, though not limited thereto. For example, the diameter of the first portion of each of the plurality of holes (590) may be smaller than the diameter of the second portion of each of the plurality of holes (590).

[0121] In one embodiment, the antenna module (300) may be eccentric from the plurality of holes (590). For example, the center axes (L1) of the plurality of holes (590) may be placed on the XY plane (i.e., the Z-axis height of the center axes (L1) is the same), and the antenna module (300) may be eccentric upward (e.g., in the -Z direction) from the center axes (L1) of the plurality of holes (590). For example, an imaginary line segment (L2) parallel to the X-axis and passing through the center of the antenna module (300) may be above (e.g., in the -Z direction) the center axes (L1) of the plurality of holes (590).

[0122] In one embodiment, the support portion (380) may include a bottom portion (586) extending inward (e.g., in the +X direction) from the side wall (370) and a wall portion (587) extending substantially vertically (e.g., in the -Z direction) from the bottom portion (586). The wall portion (587) may be spaced apart from the side wall (370).

[0123] In one embodiment, the back cover (390) may be joined to the side wall (370). For example, the edge portion of the back side (e.g., the side facing the +Z direction) of the back cover (390) may be attached to the side wall (370) via an adhesive material (596). The adhesive material (596) may include, for example, a waterproof tape, but is not limited to.

[0124] An electronic device (200) according to one embodiment may include a display (501). An edge portion of the display (501) may be attached, for example, to a portion of the bottom portion (586) and / or a portion of the side wall (370) (e.g., via an adhesive material (507)). The adhesive material (507) may include, for example, a waterproof tape. The display (501) may include, for example, the display (201) of FIG. 2b. The display (501) may include, for example, the front plate (202) of FIG. 2b and the display (201) attached to the back surface of the front plate (202).

[0125] In one embodiment, the bracket (302) may be accommodated within a space formed by the side wall (370), the bottom portion (586), and the wall portion (587). An antenna module (300) supported by the bracket (302) may also be accommodated within the space. The antenna module (300) may be attached to the bracket (302), for example. The adhesive material for attaching the antenna module (300) to the bracket (302) may have a relatively high thermal conductivity, for example, to dissipate heat from the antenna module (300), and is not limited to.

[0126] In one embodiment, a first surface (e.g., the first surface (311) of FIG. 4c) on which a plurality of antennas (e.g., the plurality of antennas (320) of FIG. 4c) of the antenna module (300) are formed may face the direction of the side wall (370) (e.g., the -X direction). For example, the first surface (311) of the antenna module (300) may face the direction of the non-conductive portion (572) of the side wall (370) (e.g., the -X direction). For example, the first surface (311) of the antenna module (300) may face the direction of the conductive portion (571) of the side wall (370) (e.g., the -X direction). For example, the first surface (311) of the antenna module (300) may face the side wall (370) (or the inner surface of the side wall (370)). For example, the first surface (311) of the antenna module (300) may face the non-conductive portion (572) of the side wall (370). In one embodiment, the antenna module (300) may be configured to radiate a wireless signal through a beam directed toward the conductive portion (571) using a plurality of antennas (320). In one embodiment, the antenna module (300) may be configured to radiate a wireless signal through a beam directed toward the non-conductive cover portion (573) using a plurality of antennas (320). In this regard, the non-conductive cover portion (573) may be referred to as an RF transmissive window.

[0127] In one embodiment, the antenna module (300) may be located between the side wall (370) and the wall portion (587) (e.g., along the X-axis). The antenna module (300) may be located between the display (501) (or bottom portion (586)) and the back cover (390) (e.g., along the Z-axis).

[0128] In one embodiment, the conductive portion (571) may include a first portion (581) in which a plurality of holes (590) are formed, a second portion (582) extending from the lower side of the first portion (581) (e.g., the first edge of the first portion (581) facing the +Z direction) to the edge of the display (501), and a third portion (583) extending from the upper side of the first portion (581) (e.g., the second edge of the first portion (581) facing the -Z direction) to the edge of the back cover (390).

[0129] In one embodiment, the inner surface of the third part (583) of the conductive part (571) (e.g., the surface of the third part (583) facing the +X direction) may include a recessed area (R1). The recessed area (R1) may be located in the direction of the back cover (390) (e.g., the -Z direction) with respect to an imaginary line segment (L2) parallel to the central axes (L1) (or X-axis) and passing through the center of the antenna module (300).

[0130] The recessed area (R1) may be recessed relative to the inner surface of the first part (581) (e.g., recessed in the -X direction). The inner surface of the first part (581) may be, for example, a surface of the first part (581) facing the +X direction. The inner surface of the first part (581) may be, for example, a surface of the first part (581) facing the +X direction and corresponding to the periphery of the plurality of holes (590).

[0131] In one embodiment, the recessed area (R1) may be configured to reflect at least a portion of the radio signal radiated from the antenna module (300) toward the conductive portion (571), as illustrated by the dotted arrow. Accordingly, the coverage of the antenna module (300) may be extended in directions other than the -X direction (e.g., the -Z direction and the +X direction).

[0132] For example, the recessed area (R1) may include a step structure (S1). For example, the cross-section of the recessed area (R1) may include a step shape. For example, the edge of the recessed area (R1) may include a first edge portion (E1) that is closer to the first portion (581) than the back cover (390) and a second edge portion (E2) that is closer to the back cover (390) than the first portion (581). The recessed area (R1) may include a first area (R1a) that extends from the first edge portion (E1) to increase the depth of the recessed area (R1), and a second area (R1b) that extends from the second edge portion (E2) to the first area (R1a) to increase the depth of the recessed area (R1). In one embodiment, the step structure (S1) of the recessed area (R1) may be included in the first area (R1a). For example, the step structure (S1) may include, but is not limited to, a first horizontal plane (or first horizontal portion) extending substantially parallel to the back cover (390) from the first edge portion (E1) (e.g., in the -X direction), a first vertical plane (or first vertical portion) extending substantially perpendicular to the back cover (390) from the first horizontal plane (e.g., in the -Z direction), a second horizontal plane (or second horizontal portion) extending substantially parallel to the first horizontal plane from the first vertical plane (e.g., in the -X direction), a second vertical plane (or second vertical portion) extending substantially parallel to the first vertical plane from the second horizontal plane (e.g., in the -Z direction), and a third horizontal plane (or third horizontal portion) extending substantially parallel to the second horizontal plane (e.g., in the -X direction) from the second vertical plane to the second region (R1b). For example, the number of steps in the stair structure (S1) may be greater than in the illustrated example, or, for another example, the number of steps in the stair structure (S1) may be less than in the illustrated example (e.g., Fig. 9).Additionally, although not shown, the recessed area (R1) may further include a curved surface and / or an inclined surface interposed between any two steps of the stair structure (S1).

[0133] In one embodiment, the second region (R1b) of the recessed region (R1) may include a vertical plane (F1) connected to the step structure (S1) of the first region (R1a) and an inclined plane (C1) extending from the vertical plane (F1) to a second edge portion (E2). The length of the vertical plane (F1) may be longer than the lengths of each of the vertical planes of the step structure (S1), but is not limited thereto. The horizontal distance (e.g., distance along the X-axis) from the first edge portion (E1) of the recessed region (R1) to the antenna module (300) may be smaller than the horizontal distance (e.g., distance along the X-axis) from the second edge portion (E2) of the recessed region (R1) to the antenna module (300), but is not limited thereto.

[0134] Referring to FIG. 5b, according to one embodiment, a plurality of holes (590) of a conductive portion (571) may include first to fifth holes (591, 592, 593, 594, and 595) corresponding to first to fifth antenna elements (321, 322, 323, 324, and 325) of an antenna module (300), respectively.

[0135] In one embodiment, the inner surface of the third portion (583) of the conductive portion (571) may include another recessed area (R3). For the other recessed area (R3), the description provided with reference to the recessed area (R1) of FIG. 5a may be applied substantially the same or in a corresponding manner. For example, the other recessed area (R3) may be recessed in contrast to the inner surface of the first portion (581) (e.g., in the -X direction). The other recessed area (R3) may include a stepped structure (S3) (e.g., a stepped structure (S1)). In one embodiment, the other recessed area (R3) may be configured to reflect at least a portion of the radio signal radiated from the antenna module (300) toward the conductive portion (571). Accordingly, the coverage of the antenna module (300) may be extended in directions other than the -X direction (e.g., the -Z direction and the +X direction).

[0136] In one embodiment, the inner surface of the third portion (583) of the conductive portion (571) may include a protruding area (P1). The protruding area (P1) may protrude relative to the inner surface of the first portion (581) (e.g., protruding in the +X direction). The protruding area (P1) may include a step structure (S2) comprising one or more horizontal planes (e.g., horizontal to the X-axis) and a plurality of vertical planes (e.g., vertical to the X-axis) connected through said one or more horizontal planes. For example, the cross-section of the protruding area (P1) may include a step shape. The steps of the step structure (S2) may be configured such that their height decreases as they move away from the antenna module (300) (e.g., in the -Z direction), identical or similar to the step structure (S1). In one embodiment, the protruding area (P1) may be configured to reflect at least a portion of the wireless signal radiated from the antenna module (300) toward the conductive part (571). Accordingly, the coverage of the antenna module (300) may be extended in directions other than the -X direction (e.g., the -Z direction and the +X direction). Through the protruding area (P1), a recessed area (R1) and another recessed area (R3) may be connected. For example, a protruding area (P1) may be formed between a recessed area (R1) and another recessed area (R3), and the protruding area (P1) may structurally connect these two areas. In the protruding area (P1), the third part (583) of the conductive part (571) has a relatively thick thickness, so the rigidity of the conductive part (571) can be improved. Additionally, through the protruding area (P1), the reduction in rigidity due to the reduced thickness caused by the recessed area (R1) and the other recessed area (R3) can be compensated.

[0137] In one embodiment, the protruding area (P1) may be located between the recessed area (R1) and another recessed area (R3). For example, the recessed area (R1) may be located over the first hole (591), the second hole (592), and / or the third hole (593) (e.g., in the -Z direction). For example, the other recessed area (R3) may be located over the fourth hole (594) and / or the fifth hole (595) (e.g., in the -Z direction). For example, the first part (581) of the conductive part (571) may include an area (R5) between the third hole (593) and the fourth hole (594), and the protruding area (P1) of the third part (583) may be located over the area (R5) of the first part (581) (e.g., in the -Z direction).

[0138] FIG. 6 is a cross-sectional view showing an electronic device according to a comparative example. FIG. 7 shows the coverage of an antenna module of an electronic device according to a comparative example and the coverage of an antenna module of an electronic device according to one embodiment.

[0139] Referring to FIG. 6, the conductive portion (571) of the electronic device (600) according to the comparative example does not include the recessed regions (R1 and R3) (or stepped structures (S1, S2, and S3)) of the electronic device (200) according to one embodiment. In this case, since the conductive portion (571) is formed of a metallic material, a portion of the wireless signal radiated from the antenna module (300) may be reflected by the conductive portion (571), as shown by the dotted arrow in FIG. 6, but the amount of reflected wireless signal may be smaller than in the case of the electronic device (200) according to one embodiment. Accordingly, the antenna module (300) of the electronic device (200) according to one embodiment may have coverage extended in a direction different from the direction of the beam (e.g., -X direction). For example, referring to FIG. 7, the coverage of the antenna module (300) of the electronic device (200) according to one embodiment can be extended in the -Z direction and +X direction as indicated by the dotted circle (A1), compared to the antenna module (300) of the electronic device (600) of the comparative example.

[0140] In one embodiment, the antenna module (300) may be used for, for example, 5G communication. Such 5G communication may require high frequencies, such as mmWave, to utilize a wide frequency band. However, such high frequencies may cause problems such as high signal loss and a short communication distance. To solve this, array antennas and beamforming may be used. However, this method may make it difficult to secure coverage for directions where the antenna module is not installed. To secure wide coverage, multiple antenna modules arranged in different directions may be required. For example, when the antenna module (300) is a first antenna module vertically arranged for coverage in the -X direction, a second antenna module horizontally arranged for coverage in the -Z direction and / or a third antenna module vertically arranged on the opposite side of the antenna module (300) for coverage in the +X direction may be further required. According to one embodiment, the antenna module (300) may have extended coverage through recessed regions (R1 and R3) of the conductive portion (571) comprising stepped structures (S1 and S3). Accordingly, the electronic device (200) according to one embodiment may cover at least a portion of the coverage of the second antenna module and the third antenna module without an additional antenna module by using the antenna module (300).

[0141] FIG. 8 shows a cross-section of an electronic device according to one embodiment.

[0142] Referring to FIG. 8, unlike FIG. 5a, the first part (581) of the conductive part (571) may not include at least one of the plurality of holes (590). In this case, the side wall (570) may not include a non-conductive cover part (573) corresponding to the omitted at least one hole. The first part (581) of the conductive part (571) of FIG. 8 may be understood as a structure in which the conductive cover part is filled (e.g., completely) within the at least one of the plurality of holes (590) provided in the first part (581) of the conductive part (571) of FIG. 5a, and the conductive cover part and the conductive part (571) are integrally formed.

[0143] FIG. 9 shows a cross-section of an electronic device according to one embodiment.

[0144] Referring to FIG. 9, according to one embodiment, the third portion (583) of the conductive portion (571) may include a recessed area (R9). The step structure (S9) of the recessed area (R9) may include two horizontal planes and one vertical plane between them, unlike the aforementioned step structure (S1) which includes three horizontal planes and two vertical planes. The aforementioned step structure (S1) of the recessed area (R1) and / or the step structure (S3) of another recessed area (R3) may be replaced with the step structure (S9) of the recessed area (R9).

[0145] FIGS. 10a and FIGS. 10b show cross-sections of an electronic device according to one embodiment.

[0146] Referring to FIG. 10a, according to one embodiment, a third portion (583) of the conductive portion (571) may include a recessed area (R10). The recessed area (R10) may include a step structure (S10). The step structure (S1) may further include chamfered surface(s) (e.g., inclined surfaces) between horizontal surface(s) and vertical surface(s). At least one of the aforementioned step structures (S1, S2, S3, and S9) may include one or more chamfered surfaces connecting the vertical surface and the horizontal surface, substantially identical to the step structure (S1).

[0147] Referring to FIG. 10b, unlike FIG. 10a, the first part (581) of the conductive part (571) may not include a plurality of holes (590). In this case, the side wall (570) may not include a non-conductive cover part (573). The first part (581) of the conductive part (571) of FIG. 10b can be understood as a structure in which the conductive cover parts are filled (e.g., completely) within the plurality of holes (590) provided in the first part (581) of the conductive part (571) of FIG. 10a, and the conductive cover parts and the conductive part (571) are integrally formed.

[0148] FIG. 11 shows a conductive part of an electronic device according to one embodiment.

[0149] Referring to FIG. 11, according to one embodiment, a third portion (583) of the conductive portion (571) may include a recessed area (R11). The recessed area (R11) may include a step structure (S11) (e.g., step structures (S1, S2, S3, S9, or S10)).

[0150] Unlike the aforementioned step structures (S1, S2, S3, S9, and S10) which extend from the first edge portion (E1) of the recessed regions (R1, R2, R3, R9, and R10), the recessed region (R11) may include an inclined surface (C11) that extends from the first edge portion (E1) to the step structure (S11). In one embodiment, the inclined surface (C11) may include a curved surface. Although not illustrated, at least one of the plurality of holes (590) of the conductive portion (571) of FIG. 11 may be omitted, substantially identical to the description provided with reference to FIG. 8 and FIG. 10b.

[0151] FIGS. 12a and FIGS. 12b show cross-sections of an electronic device according to one embodiment.

[0152] Referring to FIG. 12a, according to one embodiment, a third portion (583) of the conductive portion (571) may include a recessed area (R12). The recessed area (R12) may not include the aforementioned stepped structures (S1, S2, S3, S9, S10, and S11). For example, the recessed area (R12) may include an inclined surface (C12). The inclined surface (C12) may include a flat surface. The recessed area (R12) may be understood as a structure in which the stepped structures (S1, S2, S3, S9, S10, or S11) of the aforementioned recessed areas (R1, R3, R9, R10, or R11) are replaced by the inclined surface (C12). For example, the inclined surface (C12) is not limited and can be superimposed on multiple holes (590) with respect to the X-axis.

[0153] Referring to FIG. 12b, unlike FIG. 12a, the first part (581) of the conductive part (571) may not include a plurality of holes (590). In this case, the side wall (570) may not include a non-conductive cover part (573). The first part (581) of the conductive part (571) of FIG. 12b can be understood as a structure in which the conductive cover parts are filled (e.g., completely) within the plurality of holes (590) provided in the first part (581) of the conductive part (571) of FIG. 12a, and the conductive cover parts and the conductive part (571) are integrally formed.

[0154] FIGS. 13a and FIGS. 13b show cross-sections of an electronic device according to one embodiment.

[0155] Referring to FIG. 13a, according to one embodiment, a third portion (583) of the conductive portion (571) may include a recessed area (R13). The recessed area (R13) may not include the aforementioned step structures (S1, S2, S3, S9, S10, and S11). For example, the recessed area (R13) may include an inclined surface (C13) extending from the first edge portion (E1). The inclined surface (C13) may include a curved surface. The recessed area (R13) may be understood as a structure in which the step structures (S1, S2, S3, S9, S10, or S11) of the aforementioned recessed areas (R1, R3, R9, R10, or R11) are replaced by the inclined surface (C13). Additionally, the recessed area (R13) can be understood as a structure in which the inclined surface (C12) of the aforementioned recessed area (R12) is replaced by the inclined surface (C13).

[0156] Referring to FIG. 13b, unlike FIG. 13a, the first part (581) of the conductive part (571) may not include a plurality of holes (590). In this case, the side wall (570) may not include a non-conductive cover part (573). The first part (581) of the conductive part (571) of FIG. 13b can be understood as a structure in which the conductive cover parts are filled (e.g., completely) within the plurality of holes (590) provided in the first part (581) of the conductive part (571) of FIG. 13a, and the conductive cover parts and the conductive part (571) are integrally formed.

[0157] FIGS. 14a and FIGS. 14b show cross-sections of an electronic device according to one embodiment.

[0158] Referring to FIG. 14a, according to one embodiment, a third portion (583) of the conductive portion (571) may include a recessed area (R14). The recessed area (R14) may not include the aforementioned stepped structures (S1, S2, S3, S9, S10, and S11). For example, the recessed area (R14) may include a first inclined surface (C14a) extending from a first edge portion (E1) and a second inclined surface (C14b) extending from the first inclined surface (C14a) at a slope different from that of the first inclined surface (C14a). The first inclined surface (C14a) and the second inclined surface (C14b) may include flat surfaces. The recessed region (R14) can be understood as a structure in which the step structures (S1, S2, S3, S9, S10, or S11) of the aforementioned recessed regions (R1, R3, R9, R10, or R11) are replaced by the first and second inclined surfaces (C14a and C14b). Additionally, the recessed region (R14) can be understood as a structure in which the inclined surfaces (C12 or C13) of the aforementioned recessed regions (R12 or R13) are replaced by the first and second inclined surfaces (C14a and C14b).

[0159] Referring to FIG. 14b, unlike FIG. 14a, the first part (581) of the conductive part (571) may not include a plurality of holes (590). In this case, the side wall (570) may not include a non-conductive cover part (573). The first part (581) of the conductive part (571) of FIG. 14b can be understood as a structure in which the conductive cover parts are filled (e.g., completely) within the plurality of holes (590) provided in the first part (581) of the conductive part (571) of FIG. 14a, and the conductive cover parts and the conductive part (571) are integrally formed.

[0160] FIG. 15 shows a cross-section of an electronic device according to one embodiment.

[0161] Referring to FIG. 15, according to one embodiment, a third portion (583) of the conductive portion (571) may include a first recessed area (R15-1). The first recessed area (R15-1) may be one of the aforementioned recessed areas (R1, R3, R9, R10, R11, R12, R13, or R14).

[0162] In one embodiment, the second portion (582) of the conductive portion (571) may include a second recessed area (R15-2). The second recessed area (R15-2) may include a structure in which any one of the recessed areas (R1, R3, R9, R10, R11, R12, R13, and R14) included in the third portion (583) is formed substantially symmetrically with respect to the X-axis passing through the first portion (581) of the conductive portion (571), the plurality of holes (590), or the non-conductive cover portion (573). The second recessed area (R15-2) may be configured to reflect at least a portion of the signal radiated from the antenna module (300). Through the second recessed area (R15-2), coverage can be expanded in directions different from the beam direction (e.g., -X direction) of the antenna module (300) (e.g., +Z direction and +X direction).

[0163] The aforementioned recessed regions (R1, R3, R9, R10, R11, R12, R13, R14, R15-1, and R15-2) may each be referred to as reflectors. The recessed regions (R1, R3, R9, R10, and R11) including the aforementioned staircase structures (S1, S2, S3, S9, S10, and S11) may each be referred to as staircase structure reflectors.

[0164] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0165] According to one embodiment, an electronic device (101; 200) may include: a display (160; 201; 501) defining at least a portion of the front surface (200A) of the electronic device (101; 200); a back cover (211; 390) defining at least a portion of the rear surface of the electronic device (101; 200); a conductive sidewall (571) defining at least a portion of the side surface (200C) of the electronic device (101; 200) extending from the edge of the display (160; 201; 501) to the edge of the back cover (211; 390); and an antenna module (197; 300) disposed between the display (160; 201; 501) and the back cover (211; 390). The antenna module (197; 300) may include a substrate (310) having a first surface (311) facing the direction of the conductive sidewall (571), and a plurality of antennas (320) disposed on the first surface (311) of the substrate (310) and configured to radiate a wireless signal through a beam facing the conductive sidewall (571). The conductive sidewall (571) may include a first portion (581) having a plurality of holes (590) formed therein corresponding to each of the plurality of antennas (320); a second portion (582) extending from the lower side of the first portion (581) to the edge of the display (160; 201; 501); and a third portion (583) extending from the upper side of the first portion (581) to the edge of the back cover (211; 390). The inner surface of the third portion (583) of the conductive sidewall (571) may include a region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) which is recessed relative to the inner surface of the first portion (581) and configured to reflect at least a portion of the wireless signal.

[0166] In one embodiment, the cross-section of the recessed region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) may include a stepped shape (S1; S2; S3; S9; S10; S11).

[0167] In one embodiment, the edge of the recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) may include a first edge portion (E1) adjacent to the first portion (581) and a second edge portion (E2) adjacent to the edge of the back cover (211; 390). The recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) includes a first area (R1a) that extends from the first edge portion (E1) such that the depth of the recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) increases and includes the stepped shape (S1; S2; S3; S9; S10; S11); and may include a second region (R1b) that extends from the second edge portion (E2) to the first region (R1a) such that the depth of the recessed region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) is increased.

[0168] In one embodiment, the step shape (S1; S2; S3; S9; S10; S11) may include a vertical plane, a horizontal plane, and an inclined plane connecting the horizontal plane and the vertical plane.

[0169] In one embodiment, the first region (R1a) may include a curved surface connected to the step shape (S1; S2; S3; S9; S10; S11).

[0170] In one embodiment, the inner surface of the third portion (583) of the conductive sidewall (571) may include a region (P1) that is configured to reflect at least a portion of the wireless signal and protrudes relative to the inner surface of the first portion (581).

[0171] In one embodiment, the cross-section of the protruding region (P1) may include a step shape (S1; S2; S3; S9; S10; S11).

[0172] In one embodiment, the inner surface of the third portion (583) of the conductive sidewall (571) is configured to reflect at least a portion of the wireless signal and may include other recessed areas (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) that are recessed relative to the inner surface of the first portion (581).

[0173] In one embodiment, the protruding region (P1) may be located between the recessed region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) and the other recessed region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1).

[0174] In one embodiment, the plurality of antennas (320) of the antenna module (197; 300) may include a first antenna element (323) and a second antenna element (324) adjacent to the first antenna element (323). The plurality of holes (590) of the conductive sidewall (571) may include a first hole (593) corresponding to the first antenna element (323) and a second hole (594) corresponding to the second antenna element (324) and adjacent to the first hole (593). The inner surface of the first portion (581) of the conductive sidewall (571) may include an area (R5) between the first hole (593) and the second hole (594). The recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) of the third part (583) may be located over the first hole (593). The other recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) of the third part (583) may be located over the second hole (594). The protruding area (P1) of the third part (583) may be located over the area (R5) between the first hole (593) and the second hole (594) of the first part (581).

[0175] In one embodiment, the inner surface of the second portion (582) of the conductive sidewall (571) may include a region (R1; R3; R9; R10; R11; R12; R13; R14; R15-2) which is recessed relative to the inner surface of the first portion (581) and configured to reflect at least a portion of the wireless signal. The cross-section of the recessed region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) of the second portion (582) may include a stepped shape (S1; S2; S3; S9; S10; S11).

[0176] In one embodiment, the edge of the recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) may include a first edge portion (E1) adjacent to the first portion (581) and a second edge portion (E2) adjacent to the edge of the back cover (211; 390). The recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) comprises: a vertical plane; and one or more first inclined planes extending from the first edge portion to a portion of the vertical plane such that the depth of the recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) increases. and may include one or more second inclined surfaces extending from the second edge portion to another portion of the vertical plane such that the depth of the recessed area (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) increases.

[0177] In one embodiment, the one or more first inclined surfaces may include a curved surface.

[0178] In one embodiment, the conductive sidewall (571) may include a plurality of conductive portions filled within the plurality of holes (590). The plurality of conductive portions may be formed integrally with the conductive sidewall (571).

[0179] In one embodiment, the electronic device (101; 200) may include a non-conductive portion (572) attached to the inner surface of the conductive sidewall (571) to close the plurality of holes (590) of the conductive sidewall (571); and a plurality of non-conductive cover portions (573) each disposed within the plurality of holes (590) and each attached to the non-conductive portion (572).

[0180] According to one embodiment, an electronic device (101; 200) may include: a display (160; 201; 501) defining at least a portion of the front surface (200A) of the electronic device (101; 200); a back cover (211; 390) defining at least a portion of the rear surface of the electronic device (101; 200); a conductive sidewall (571) defining at least a portion of the side surface (200C) of the electronic device (101; 200) extending from the edge of the display (160; 201; 501) to the edge of the back cover (211; 390); and an antenna module (197; 300) disposed between the display (160; 201; 501) and the back cover (211; 390). The antenna module (197; 300) may include a substrate (310) comprising a first surface (311) facing the direction of the conductive sidewall (571), and a plurality of antennas (320) disposed on the first surface (311) of the substrate (310) and configured to radiate a wireless signal through a beam facing the conductive sidewall (571). The inner surface of the conductive sidewall (571) may include a region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) located in the direction of the back cover (211; 390) with respect to a virtual line segment (L2) perpendicular to the first surface (311) and passing through the center of the antenna module (197; 300). The above region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) may include a stepped structure (S1; S2; S3; S9; S10; S11) that is recessed in the direction of the side (200C) of the electronic device (101; 200) to reflect at least a portion of the wireless signal.In one embodiment, the edge of the region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) may include a first edge portion (E1) adjacent to the imaginary line segment (L2) and a second edge portion (E2) adjacent to the edge of the back cover (211; 390). The step structure (S1; S2; S3; S9; S10; S11) may extend away from the antenna module (197; 300) with respect to a direction perpendicular to the first surface (311) of the antenna module (197; 300) as it extends from the first edge portion (E1).

[0181] In one embodiment, the inner surface of the conductive sidewall (571) may include another area (P1) located in the direction of the back cover (211; 390) with respect to the imaginary line segment (L2). The other area (P1) may include a stepped structure (S1; S2; S3; S9; S10; S11) protruding in the direction of the antenna module (197; 300) to reflect at least a portion of the wireless signal.

[0182] In one embodiment, the edge of the other region (P1) may include a first edge portion adjacent to the imaginary line segment (L2) and a second edge portion adjacent to the edge of the back cover (211; 390). The protruding step structure (S1; S2; S3; S9; S10; S11) of the other region (P1) may be moved away from the antenna module (197; 300) with respect to the direction perpendicular to the first surface (311) of the antenna module (197; 300) as it extends from the first edge portion of the other region (P1).

[0183] In one embodiment, the region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) is the first region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1), and the other region (R2) may be the second region (R2). The inner surface of the conductive sidewall (571) may include a third region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) located in the direction of the back cover (211; 390) with respect to the imaginary line segment (L2). The second region (R2) may be located between the first region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) and the third region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1). The third region (R1; R3; R9; R10; R11; R12; R13; R14; R15-1) may include a stepped structure (S1; S2; S3; S9; S10; S11) that is recessed in the direction of the side (200C) of the electronic device (101; 200) to reflect at least a portion of the wireless signal.

[0184] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0185] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0186] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0187] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0188] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0189] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0190] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A display defining at least a portion of the front of the electronic device; A back cover defining at least a portion of the rear of the electronic device; A conductive sidewall defining at least a portion of the side of the electronic device extending from the edge of the display to the edge of the back cover; and It includes an antenna module positioned between the display and the back cover, The above antenna module is: A substrate comprising a first surface oriented toward the direction of the conductive sidewall, and It includes a plurality of antennas disposed on the first surface of the substrate and configured to radiate a wireless signal through a beam directed toward the conductive sidewall; The above conductive sidewall is: A first part having a plurality of holes formed, each corresponding to the plurality of antennas; A second portion extending from the lower side of the first portion to the edge of the display; and It includes a third portion extending from the upper side of the first portion to the edge of the back cover, and The inner surface of the third portion of the conductive sidewall is configured to reflect at least a portion of the wireless signal and includes a region that is recessed relative to the inner surface of the first portion. Electronic device.

2. In Claim 1, The cross-section of the above-mentioned recessed area includes a stepped shape, Electronic device.

3. In Claim 2, The edge of the recessed area includes a first edge portion adjacent to the first portion and a second edge portion adjacent to the edge of the back cover, and The above-mentioned recessed area is: A first region including the stepped shape, extending from the first edge portion such that the depth of the recessed region is increased; and A second region extending from the second edge portion to the first region such that the depth of the recessed region is increased, comprising Electronic device.

4. In Claim 3, The above-described staircase shape includes a vertical plane, a horizontal plane, and an inclined plane connecting the horizontal plane and the vertical plane. Electronic device.

5. In Claim 3, The first region above includes a curved surface connected to the step shape, Electronic device.

6. In any one of claims 1 to 5, The inner surface of the third portion of the conductive sidewall is configured to reflect at least a portion of the wireless signal and includes a region protruding relative to the inner surface of the first portion. Electronic device.

7. In Claim 6, The cross-section of the above-mentioned protruding area includes a stepped shape, Electronic device.

8. In claim 6 or claim 7, The inner surface of the third portion of the conductive sidewall is configured to reflect at least a portion of the wireless signal and includes another recessed area that is recessed relative to the inner surface of the first portion. Electronic device.

9. In Claim 8, The above protruding region is located between the above recessed region and the other recessed region, Electronic device.

10. In Claim 9, The plurality of antennas of the above antenna module include a first antenna element and a second antenna element adjacent to the first antenna element, and The plurality of holes of the conductive sidewall include a first hole corresponding to the first antenna element and a second hole corresponding to the second antenna element and adjacent to the first hole. The inner surface of the first portion of the conductive sidewall includes an area between the first hole and the second hole, The recessed area of ​​the third part is located over the first hole, and The other recessed area of ​​the third part is located above the second hole, and The protruding area of ​​the third part is located on the area between the first hole and the second hole of the first part. Electronic device.

11. In any one of claims 1 to 10, The inner surface of the second portion of the conductive sidewall is configured to reflect at least a portion of the wireless signal and includes a region (R15-2) that is recessed relative to the inner surface of the first portion, and The cross-section of the recessed area of ​​the second part above includes a stepped shape, Electronic device.

12. In Claim 1, The edge of the recessed area includes a first edge portion adjacent to the first portion and a second edge portion adjacent to the edge of the back cover, and The above-mentioned recessed area is: Vertical plane; One or more first inclined surfaces extending from the first edge portion to a portion of the vertical plane to increase the depth of the recessed area; and One or more second inclined surfaces extending from the second edge portion to another portion of the vertical plane to increase the depth of the recessed area, Electronic device.

13. In Claim 12, The above one or more first inclined surfaces include a curved surface. Electronic device.

14. In any one of claims 1 to 13, It includes a plurality of conductive portions filled within the plurality of holes of the conductive sidewall, and The plurality of conductive parts are formed integrally with the conductive sidewall. Electronic device.

15. In any one of claims 1 to 13, A non-conductive portion attached to the inner surface of the conductive sidewall to close the plurality of holes of the conductive sidewall; A plurality of non-conductive cover portions, each disposed within the plurality of holes and each attached to the non-conductive portion, Electronic device.

Images