Power supply circuit board and circuit board assembly

Abstract

The present disclosure provides a power supply circuit board, comprising a power supply board body, the power supply board body having a first side and a second side opposite to each other, wherein the first side is configured to face a main circuit board. The power supply circuit board further comprises: power supply connectors and power receiving connectors which are provided on the first side of the power supply board body, wherein the power supply connectors are configured to be connected to power supply interfaces of the main circuit board, the power supply connectors are connected to power supply pins of a power supply unit of the main circuit board, the power receiving connectors are configured to be connected to power receiving interfaces of the main circuit board, and the power receiving interfaces are connected to power receiving pins of a chip unit of the main circuit board; and power supply wirings connected between the power supply connectors and the power receiving connectors, wherein the power supply wirings are arranged in at least two conductive layers of the power supply board body. The present disclosure further provides a circuit board assembly.

Description

Power supply circuit board, circuit board assembly

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411565966.X, filed with the China Patent Office on November 4, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to, but is not limited to, the field of power supply technology for circuit boards. Background Technology

[0004] In a printed circuit board (PCB), power can be supplied to the chip unit via a metal busbar.

[0005] In some related technologies, the use of metal buses can limit other structural designs of the circuit board, and make it difficult to connect the metal bus to the pins of the chip unit and the power supply unit. Summary of the Invention

[0006] This disclosure provides a power supply circuit board and a circuit board assembly.

[0007] In a first aspect, embodiments of this disclosure provide a power supply circuit board, which includes a power supply board body having a first side and a second side opposite to each other, wherein the first side is disposed facing a main circuit board; the power supply circuit board further includes:

[0008] A power supply connector and a power receiving connector are provided on the first side of the power supply board; the power supply connector is used to connect to the power supply interface of the main circuit board, the power supply connector is connected to the power supply pin of the power supply unit of the main circuit board, and the power receiving connector is used to connect to the power receiving interface of the main circuit board, the power receiving interface is connected to the power receiving pin of the chip unit of the main circuit board.

[0009] A power supply trace connecting the power supply connector and the power receiving connector is disposed in at least two conductive layers of the power supply board.

[0010] Secondly, embodiments of this disclosure provide a circuit board assembly, which includes a main circuit board and any of the power supply circuit boards described in this disclosure; wherein...

[0011] The main circuit board includes a motherboard body, on which the power supply unit and the chip unit are provided. The back side of the motherboard body is provided with a power supply interface connected to the power supply pin of the power supply unit, and a power receiving interface connected to the power receiving pin of the chip unit.

[0012] The first side of the power supply board body of the power supply circuit board is disposed facing the back side of the main board body, the power supply connector is connected to the power supply interface, and the power receiving connector is connected to the power receiving interface. Attached Figure Description

[0013] In the accompanying drawings of the embodiments disclosed herein:

[0014] Figure 1 is a cross-sectional view of the main circuit board in some related technologies;

[0015] Figure 2 is a cross-sectional view of the main circuit board in some other related technologies;

[0016] Figure 3 is a cross-sectional view of a power supply circuit board provided in an embodiment of this disclosure;

[0017] Figure 4 is a cross-sectional view of a circuit board assembly provided in an embodiment of this disclosure;

[0018] Figure 5 is a cross-sectional view of another circuit board assembly provided in an embodiment of this disclosure;

[0019] Figure 6 is a cross-sectional view of another power supply circuit board provided in an embodiment of this disclosure;

[0020] Figure 7 is a cross-sectional view of another power supply circuit board provided in an embodiment of this disclosure;

[0021] Figure 8 is a cross-sectional view of another circuit board assembly provided in an embodiment of this disclosure;

[0022] Figure 9 is a cross-sectional view of another circuit board assembly provided in an embodiment of this disclosure;

[0023] Figure 10 is a cross-sectional view of another circuit board assembly provided in an embodiment of this disclosure;

[0024] Figure 11 is a cross-sectional view of another power supply circuit board provided in an embodiment of this disclosure;

[0025] Figure 12 is a cross-sectional view of another circuit board assembly provided in an embodiment of this disclosure. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solutions of this disclosure, the power supply circuit board and circuit board assembly provided in the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0027] The present disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the disclosure.

[0028] The accompanying drawings of the embodiments disclosed herein are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0029] This disclosure may be described with reference to plan and / or cross-sectional views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances.

[0030] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0031] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0032] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0033] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas of an element, but are not intended to be limiting.

[0034] In some related technologies, the power supply unit 11 (such as a power converter) and the chip unit 12 (such as an integrated circuit chip) can both be located in the main circuit board 1 (such as a system motherboard), so that the power supply unit 11 can directly provide current to the chip unit 12.

[0035] For example, referring to FIG1, in some related technologies, the power supply unit 11 and the chip unit 12 may both be located on the front side 191 of the main board body 19 of the main circuit board 1, and the main board body 19 is provided with power supply leads 141, which are respectively connected (e.g., through conductive holes) to the power supply pins 111 of the power supply unit 11 and the power receiving pins 121 of the chip unit 12, so as to provide the power supply current (power) generated by the power supply unit 11 to the chip unit 12.

[0036] It should be understood that the above distinction between "power supply" and "power reception" is based on the perspective of power supply unit 11 providing power and chip unit 12 (load) receiving power, and does not represent the specific direction of the current. For example, for the positive terminal, the current flows from the power supply pin 111 into the corresponding power receiving pin 121, while for the negative terminal, the current flows from the corresponding power receiving pin 121 into the power supply pin 111.

[0037] However, as the computing power of chip unit 12 increases, the required supply current also increases, reaching the level of one thousand amps or even two thousand amps, resulting in an increase in supply voltage drop. To reduce the supply voltage drop, it is necessary to reduce the supply impedance and inductive reactance. Within the main circuit board 1, reducing the impedance of the power supply lead 141 can be achieved by increasing the thickness of the power supply lead 141 or increasing the number of layers of the power supply lead 141, but both of these will increase the overall thickness, number of layers, and cost of the main circuit board 1.

[0038] Therefore, referring to Figure 2, in some other related technologies, a metal busbar 51 can be provided on the back side 192 (the side opposite to the front side 191) of the main circuit board 1 by means of welding, crimping, etc., to connect to the power supply lead 141 (e.g., through conductive holes) to share part of the power supply current transmission; since the metal busbar 51 is attached to the outside of the main board body 19, its thickness can be large, which can reduce the power supply voltage drop without affecting the main circuit board 1.

[0039] However, the metal busbar 51 is a large conductor and conducts electricity everywhere, so other structures cannot be placed in its location on the main circuit board 1, otherwise it will cause a short circuit, making the design of the main circuit board 1 difficult. For example, referring to Figure 1, the signal pin 126 of the chip unit 12 can also be connected to the circuit device 52 located on the back side 192 of the main board body 19 through the signal lead 146; while referring to Figure 2, since the original position of the circuit device 52 on the back side 192 of the main circuit board 1 is occupied by the metal busbar 51, it is necessary to change the position of the circuit device 52 to another location (such as the front side 191 of the main circuit board 1), or it is not possible to place the circuit device there.

[0040] Meanwhile, the pins (power supply pin 111 and power receiving pin 121) of chip unit 12 and power supply unit 11 correspond to positive and negative terminals respectively. These pins must be connected to different metal buses 51 to prevent short circuits. Furthermore, chip unit 12 typically has many signal pins 126 in addition to the power receiving pin 121, and the metal bus 51 cannot be connected to these signal pins 126. Therefore, ensuring that the metal bus 51 does not form unwanted connections with other structures often presents difficulties in connecting it to the pins (power supply pin 111 and power receiving pin 121), especially when the pins corresponding to positive and negative terminals are arranged alternately, or when the power receiving pin 121 is located in the middle of chip unit 12 and surrounded by numerous signal pins 126. These problems become even more severe in these cases.

[0041] In a first aspect, referring to Figures 3 to 12, embodiments of this disclosure provide a power supply circuit board 3.

[0042] The power supply circuit board 3 of this embodiment is used to connect to the main circuit board 1 (such as the system motherboard) so as to form a circuit board assembly together with the main circuit board 1.

[0043] Referring to Figures 3 and 4, the power supply circuit board 3 of this embodiment includes a power supply board body 39, which has a first side 391 and a second side 392 facing each other, wherein the first side 391 is disposed facing the main circuit board 1; and the power supply circuit board 3 further includes:

[0044] A power supply connector 331 and a power receiving connector 332 are provided on the first side 391 of the power supply board body 39; the power supply connector 331 is used to connect to the power supply interface 131 of the main circuit board 1, and the power supply connector 331 is connected to the power supply pin 111 of the power supply unit 11 of the main circuit board 1; the power receiving connector 332 is used to connect to the power receiving interface 132 of the main circuit board 1, and the power receiving interface 132 is connected to the power receiving pin 121 of the chip unit 12 of the main circuit board 1.

[0045] A power supply trace 341 is connected between the power supply connector 331 and the power receiving connector 332. The power supply trace 341 is disposed in at least two conductive layers of the power supply board 39.

[0046] Referring to FIG4, in the circuit board assembly of this embodiment, the main circuit board 1 includes a power supply unit 11 and a chip unit 12, wherein the power supply unit 11 is used to provide the chip unit 12 with the current required for its operation.

[0047] For example, referring to Figure 4, the power supply unit 11 and the chip unit 12 are both located on the same side (e.g., front side 191) of the main circuit board 1 (e.g., motherboard body 19), while the other side (e.g., back side 192) of the main circuit board 1 is provided with a power supply interface 131 (e.g., pad) and a power receiving interface 132 (e.g., pad). The power supply interface 131 is connected to the power supply pin 111 of the power supply unit 11 (e.g., through a conductive hole), and the power receiving interface 132 is connected to the power receiving pin 121 of the chip unit 12 (e.g., through a conductive hole).

[0048] It should be understood that the specific locations of the power supply unit 11 and the chip unit 12 are not limited to the above examples. For example, the power supply unit 11 and / or the chip unit 12 may also be located on the back side 192 of the main circuit board 1.

[0049] It should be understood, referring to Figure 4, that if the power supply unit 11 and the power supply interface 131 are respectively located on opposite sides of the main circuit board 1, the power supply pin 111 and the power supply interface 131 can be connected through a conductive hole. Similarly, if the chip unit 12 and the power receiving interface 132 are respectively located on opposite sides of the main circuit board 1, the power receiving pin 121 and the power receiving interface 132 can be connected through a conductive hole. However, if the power supply unit 11, the chip unit 12, and their corresponding interfaces (power supply interface 131 and power receiving interface 132) are located on the same side of the main circuit board 1, then the corresponding pins and interfaces can be directly connected through leads.

[0050] Referring to FIG4, the power supply circuit board 3 of this embodiment is used to connect (e.g., surface mount) to the back side 192 of the main circuit board 1. The first side 391 of the power supply board body 39 faces the back side 192 of the main circuit board 1, so that the power supply connector 331 (e.g., solder pad) provided on the first side 391 of the power supply board body 39 can be connected (e.g., soldered) to the power supply interface 131 of the back side 192 of the main circuit board 1, while the power receiving connector 332 (e.g., solder pad) is connected (e.g., soldered) to the power receiving interface 132 of the back side 192 of the main circuit board 1.

[0051] Referring to Figure 3, the power supply circuit board 3 of this embodiment is divided into at least two layers (i.e., at least two conductive layers), and both layers are provided with power supply traces 341. The power supply traces 341 are traces connecting (e.g., through conductive vias) between the power supply connector 331 and the power receiving connector 332, thereby enabling current transmission between the power supply connector 331 and the power receiving connector 332 (that is, between the power supply interface 131 and the power receiving interface 132, that is, between the power supply pin 111 and the power receiving pin 121). Thus, at least a portion of the power supply path from the power supply unit 11 to the chip unit 12 is located in the power supply circuit board 3.

[0052] In this embodiment, the power supply circuit board 3 is connected to the main circuit board 1 to transmit power supply current to the chip unit 12 of the main circuit board 1. Since the power supply circuit board 3 is a separate circuit board, increasing the thickness and number of layers of the power supply traces 341 therein to reduce impedance (including inductive reactance) and improve power supply efficiency and quality will not affect the thickness, number of layers, or cost of the main circuit board 1. Since the power supply circuit board 3 has multiple conductive layers, its first side 391 (facing the main circuit board 1) does not need to be provided with a conductive structure, so other structures can be provided at the contact position between the main circuit board 1 and the power supply circuit board 3, which facilitates the design of the main circuit board 1. Moreover, the different power supply traces 341 in the power supply circuit board 3 can be located in different conductive layers to isolate each other, thereby facilitating the connection between the power supply circuit board 3 and the pins (power supply pin 111 and power receiving pin 121) of the chip unit 12 and the power supply unit 11.

[0053] As one embodiment of this disclosure, referring to FIG4, the power supply interface 131 and the power receiving interface 132 can be directly connected to the power supply pin 111 and the power receiving pin 121 through conductive holes, respectively; correspondingly, the power supply connector 331 and the power receiving connector 332 are directly corresponding to the power supply pin 111 and the power receiving pin 121 in the vertical direction (perpendicular to the motherboard body 19), so that the power supply trace 341 can completely complete the transmission of power supply current in the horizontal direction (parallel to the motherboard body 19).

[0054] As another embodiment of this disclosure, referring to FIG12, at least one of the interfaces (power supply interface 131, power receiving interface 132) is connected to the corresponding pin (power supply pin 111, power receiving pin 121) through a power supply lead 141, so that at least one of the connectors (power supply connector 331, power receiving connector 332) does not directly correspond to the corresponding pin in the vertical direction. That is, the power supply trace 341 only completes the transmission of the power supply current in the horizontal direction, and the other transmission of the power supply current in the horizontal direction is completed by the power supply lead 141 in the main circuit board 1.

[0055] For example, the above method can be used when the distance between the power supply unit 11 and the chip unit 12 is far, so that the power supply circuit board 3 cannot completely cover the corresponding area, or when the main circuit board 1 only has a flow bottleneck in a local area.

[0056] As one embodiment of this disclosure, referring to FIG5, the main circuit board 1 may not have power supply leads, that is, the transmission of power supply current in the horizontal direction can be completely realized by the power supply traces 341 in the power supply circuit board 3, thereby simplifying the structure of the main circuit board 1 to the greatest extent, reducing its thickness, number of layers and cost, and facilitating the design of other structures in the main circuit board 1.

[0057] For example, the above method can be used in situations with highly interfering power signals (such as when 54V voltage is directly supplied to chip unit 12), thereby minimizing the interference of power signals on other signals in the main circuit board 1.

[0058] As another embodiment of this disclosure, referring to FIG4, the main circuit board 1 may still have some power supply leads 141, so that the transmission of power supply current in the horizontal direction is shared by the power supply leads 141 in the main circuit board 1 and the power supply traces 341 in the power supply circuit board 3.

[0059] As one embodiment of this disclosure, referring to FIG4, the power supply circuit board 3 may have "only" two conductive layers, that is, the power supply circuit board 3 has only one insulating layer, and a conductive layer is provided on each side, thereby minimizing the thickness of the power supply circuit board 3.

[0060] As another embodiment of this disclosure, referring to FIG5, the power supply circuit board 3 may also have three or more conductive layers, which makes it easier to set up the structure therein.

[0061] In some embodiments, referring to FIG5, the power supply circuit board 3 of the present disclosure embodiment further includes: a signal connector 336 disposed on the first side 391 of the power supply board body 39, the signal connector 336 being used to connect to the signal interface 136 of the main circuit board 1, and the signal interface 136 being connected to the signal pin 126 of the chip unit 12.

[0062] The signal trace 346 is connected to the signal connector 336 and is located in the conductive layer of the power supply board 39.

[0063] As one embodiment of this disclosure, referring to FIG5, the back side 192 of the main circuit board 1 may also be provided with a signal interface 136 (such as a pad), which is connected to the signal pin 126 of the chip unit 12. The first side 391 of the power supply circuit board 3 may also be provided with a signal connector 336 (such as a pad) connected to the signal interface 136 (such as soldering), which is connected to the signal trace 346. Thus, some "signals (such as ground GND signal)" in the main circuit board 1 may be transmitted in the power supply circuit board 3, which can reduce the number of signal leads 146 in the main circuit board 1, facilitate the design of the main circuit board 1, facilitate the connection between the power supply circuit board 3 and the pins, and reduce the number of layers of the main circuit board 1, thereby reducing its cost and thickness.

[0064] For example, when the power receiving pin 121 of the chip unit 12 is located in its middle and surrounded by a large number of signal pins 126, in order to achieve signal fanout, some signal leads 146 may be located in other layers of the main circuit board 1 at the position of the power receiving pin 121 in the middle of the corresponding chip unit 12. This makes it difficult for the metal busbar 51 in the related technology to be connected to the power receiving pin 121 through the conductive hole. However, according to the embodiments of this disclosure, some signals can be fanned out through the signal traces 346 in the power supply circuit board 3, thereby "making room" for the position in the middle of the corresponding chip unit 12 in the main circuit board 1, which facilitates the connection between the power supply circuit board 3 and the power receiving pin 121.

[0065] In some embodiments, referring to FIG5, the conductive layer includes a power supply conductive layer and a signal conductive layer, wherein the thickness of the power supply conductive layer is greater than the thickness of the signal conductive layer; the power supply trace 341 is disposed in the power supply conductive layer, and the signal trace 346 is disposed in the signal conductive layer.

[0066] As one embodiment of this disclosure, referring to FIG5, the power supply trace 341 and the signal trace 346 can be respectively disposed in different conductive layers. That is, if there is a power supply trace 341 in a conductive layer, there will be no signal trace 346, and if there is a signal trace 346, there will be no power supply trace 341. Thus, by a simple setting, short circuits between the power supply trace 341 and the signal trace 346 can be completely avoided.

[0067] It should be understood that the above description only indicates that power supply traces 341 and signal traces 346 will not be located on the same conductive layer, and does not mean that all power supply traces 341 are located on one conductive layer, nor does it mean that all signal traces 346 are located on one conductive layer.

[0068] Furthermore, referring to Figure 5, the thicknesses of the power supply conductive layer and the signal conductive layer can be different. That is, the power supply conductive layer (i.e., power supply trace 341) can have a larger thickness because it carries a larger actual current. For example, a 10oz thick copper foil (1oz represents the thickness achieved when 1 ounce of copper is evenly laid on an area of ​​1 square foot, approximately 35 micrometers) can be used to significantly reduce power supply impedance and inductive reactance. On the other hand, the signal conductive layer (i.e., signal trace 346) typically carries a smaller actual current, so its thickness can be smaller. Thus, by varying the thickness of the conductive layers, this embodiment of the present disclosure can also reduce the overall thickness and cost of the power supply circuit board while meeting the transmission requirements of different signals.

[0069] It should be understood that power supply trace 341 and signal trace 346 can coexist in the same conductive layer, as long as they are located in different positions and do not come into contact.

[0070] In some embodiments, referring to FIG5, the power supply circuit board 3 of the present disclosure embodiment further includes: a circuit device 52 disposed on the second side 392 of the power supply board body 39.

[0071] As one embodiment of this disclosure, referring to FIG5, since the power supply circuit board 3 is a "circuit board", some circuit components 52 (such as capacitors, resistors, inductors, etc.) can also be mounted on the second side 392 of the power supply board body 39 by means of surface mounting, and connected to the corresponding structure in the main circuit board 1 through wiring, conductive holes, etc. Thus, it is equivalent to that some of the circuit components 52 required in the main circuit board 1 can be mounted on the power supply circuit board 3, thereby simplifying the structure of the main circuit board 1 and facilitating the design of the main circuit board 1.

[0072] It should be understood that the circuit device 52 can be connected to the signal trace 346 as shown in Figure 5 to perform the required processing on the "signal", such as coupling; or, as shown in Figure 11, the circuit device 52 (taking the filter capacitor 521 as an example in Figure 11) can also be connected to the power supply trace 341 (taking the positive power supply trace 3411 and the negative power supply trace 3412 as examples in Figure 11) to perform the required processing on the "power supply current".

[0073] In some embodiments, referring to FIG6, the power supply circuit board 3 of this disclosure embodiment further includes: a metal busbar 51 disposed on the second side 392 of the power supply board body 39, and each metal busbar 51 is connected to at least two different positions of the power supply line 341.

[0074] As one embodiment of this disclosure, referring to FIG6, a metal busbar 51 may also be provided on the second side 392 of the power supply circuit board 3. The metal busbar 51 is connected to the power supply line 341, thereby sharing part of the power supply current transmission and further reducing the power supply impedance. Moreover, since the metal busbar 51 is provided on the second side 392 of the power supply circuit board 3, rather than on the back side 192 of the main circuit board 1, it will not affect the structural design of the back side 192 of the main circuit board 1.

[0075] In some embodiments, referring to FIG7, at least a portion of the power supply trace 341 is composed of a metal sheet 3419; and / or, at least a portion of the power supply hole is composed of a metal post 3418; the power supply hole is a conductive hole in the power supply board 39 that is connected to the power supply trace 341.

[0076] As one embodiment of this disclosure, referring to FIG7, in the power supply circuit board 3, the power supply trace 341 may be in the form of a metal sheet 3419 (such as a copper sheet), and the conductive hole (power supply hole) used to transmit the power supply current may also be in the form of a metal pillar 3418 (such as a copper pillar). The conductors in the form of metal sheets 3419 and metal pillars 3418 have a large thickness, which can further reduce the power supply impedance, improve heat dissipation, and facilitate the fabrication of the power supply circuit board 3 (the metal sheets 3419 and metal pillars 3418 can be directly pressed into the power supply board body 39 without forming conductors through electroplating or other methods).

[0077] In some embodiments, referring to FIG8, the first side 391 of the power supply board 39 is provided with a receiving groove 37.

[0078] As one embodiment of this disclosure, referring to FIG8, the power supply board body 39 of the power supply board 3 has a recessed receiving groove 37 at a part of the first side 391, so that the structure (such as the circuit device 52 as shown in FIG8, or other structures such as leads) located at the corresponding position of the back side 192 of the main circuit board 1 can be accommodated therein, so as to allow the required structure to be set on the area of ​​the back side 192 of the main circuit board 1 corresponding to the power supply board 3, which facilitates the design.

[0079] In some embodiments, referring to FIG9, the power supply trace 341 includes a positive power supply trace 3411 and a negative power supply trace 3412; the positive power supply trace 3411 is used to connect to the positive power supply interface 1311 of the main circuit board 1, and the positive power supply interface 1311 is connected to the positive power supply pin 1111 of the power supply unit 11; the negative power supply trace 3412 is used to connect to the negative power supply interface 1312 of the main circuit board 1, and the negative power supply interface 1312 is connected to the negative power supply pin 1112 of the power supply unit 11; for any conductive layer provided with power supply traces 341, the power supply traces 341 therein are all positive power supply traces 3411 or all negative power supply traces 3412.

[0080] As one embodiment of this disclosure, referring to FIG9, corresponding to the positive and negative terminals respectively, the power supply pin 111 in the main circuit board 1 can be divided into positive power supply pin 1111 and negative power supply pin 1112, the power supply interface 131 can be divided into positive power supply interface 1311 and negative power supply interface 1312, the power receiving pin 121 can be divided into positive power receiving pin 1211 and negative power receiving pin 1212, the power receiving interface 132 can be divided into positive power receiving interface 1321 and negative power receiving interface 1322, and the corresponding power supply lead 141 (if present) can also be divided into positive power supply lead 1411 and negative power supply lead 1412.

[0081] Accordingly, referring to Figure 9, the power supply connector 331 in the power supply circuit board 3 can be divided into a positive power supply connector 3311 and a negative power supply connector 3312, the power receiving connector 332 can be divided into a positive power receiving connector 3321 and a negative power receiving connector 3322, and the power supply line 341 can also be divided into a positive power supply line 3411 and a negative power supply line 3412.

[0082] In this embodiment of the present disclosure, the positive power supply trace 3411 and the negative power supply trace 3412 can be respectively disposed in different conductive layers (such as the positive conductive layer and the negative conductive layer), thereby completely avoiding short circuit between the two through a simple arrangement.

[0083] For example, referring to Figure 9, when the positive pins (positive power supply pin 1111, positive power receiving pin 1211) and negative pins (negative power supply pin 1112, negative power receiving pin 1212) are arranged alternately, they can be directly connected to different conductive layers of the power supply circuit board 3 through conductive holes, interfaces, connectors, etc., and connected to the positive power supply trace 3411 and the negative power supply trace 3412 respectively, which facilitates the connection between the power supply circuit board 3 and the pins.

[0084] It should be understood that the above description only indicates that the positive power supply trace 3411 and the negative power supply trace 3412 will not be located in the same conductive layer, and does not mean that all positive power supply traces 3411 are located in one conductive layer, nor does it mean that all negative power supply traces 3412 are located in one conductive layer.

[0085] It should be understood that positive power supply trace 3411 and negative power supply trace 3412 can coexist in the same conductive layer, as long as they are located in different positions and do not come into contact.

[0086] In some embodiments, referring to FIG10, the power supply trace 341 includes power supply traces 341 of at least two different power rails V; for any conductive layer provided with power supply traces 341, the power supply traces 341 are power supply traces 341 of the same power rail V.

[0087] As one embodiment of this disclosure, referring to FIG10, the power supply unit 11 can simultaneously provide power signals for multiple different power rails V, so that the power supply traces 341 corresponding to different power rails V in the power supply circuit board 3 are also located in different conductive layers, thereby enabling a power supply circuit board 3 to achieve multiple power supplies, and completely avoiding short circuits through simple settings.

[0088] It should be understood that the above description only indicates that the power supply traces 341 of different power rails V will not be located in the same conductive layer, and does not mean that the power supply traces 341 of each power rail V are located in a conductive layer. For example, the positive power supply trace 3411 and the negative power supply trace 3412 of a power rail V may be located in different conductive layers.

[0089] It should be understood that power supply traces 341 of different power rails V can exist simultaneously in the same conductive layer, as long as they are located in different positions and do not come into contact.

[0090] In some embodiments, referring to FIG11, the power supply trace 341 includes a positive power supply trace 3411 and a negative power supply trace 3412; the positive power supply trace 3411 is used to connect to the positive power supply interface 1311 of the main circuit board 1, and the positive power supply interface 1311 is connected to the positive power supply pin 1111 of the power supply unit 11; the negative power supply trace 3412 is used to connect to the negative power supply interface 1312 of the main circuit board 1, and the negative power supply interface 1312 is connected to the negative power supply pin 1112 of the power supply unit 11; the power supply circuit board 3 further includes a filter capacitor 521 disposed in the power supply board body 39, and the two poles of the filter capacitor 521 are respectively connected to the positive power supply trace 3411 and the negative power supply trace 3412.

[0091] As one embodiment of this disclosure, referring to FIG11, the power supply filter capacitor 521 can be "embedded" inside the power supply board body 39 of the power supply circuit board 3. That is, the two poles (pole plates) of each filter capacitor 521 are arranged at intervals and opposite to each other in the power supply circuit board 3, and are respectively connected to the positive power supply trace 3411 and the negative power supply trace 3412. In other words, the filter capacitor 521 is connected in parallel between the positive and negative poles, thereby achieving a better filtering effect and reducing the equivalent series inductance (ESL) from the filter capacitor 521 to the load, thus improving the power supply quality.

[0092] It should be understood that the filter capacitor 521 may not be embedded in the power supply board 39. For example, the filter capacitor 521 may also be located on the surface of the main circuit board 1 or the power supply circuit board 3. For example, referring to Figure 11, while the filter capacitor 521 is embedded in the power supply board 39, the second side 392 is also surface-mounted with a filter capacitor 521 (which is a type of circuit device 52).

[0093] Secondly, referring to Figures 3 to 12, embodiments of this disclosure provide a circuit board assembly, which includes a main circuit board 1 and any type of power supply circuit board 3 according to embodiments of this disclosure; wherein...

[0094] The main circuit board 1 includes a motherboard body 19, on which a power supply unit 11 and a chip unit 12 are provided. The back side 192 of the motherboard body 19 is provided with a power supply interface 131 connected to the power supply pin 111 of the power supply unit 11, and a power receiving interface 132 connected to the power receiving pin 121 of the chip unit 12.

[0095] The first side 391 of the power supply board body 39 of the power supply circuit board 3 is disposed facing the back side 192 of the main board body 19. The power supply connector 331 is connected to the power supply interface 131, and the power receiving connector 332 is connected to the power receiving interface 132.

[0096] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A power supply circuit board, comprising a power supply board body having opposing first and second sides, wherein the first side is disposed facing a main circuit board; the power supply circuit board further comprising: A power supply connector and a power receiving connector are provided on the first side of the power supply board; the power supply connector is used to connect to the power supply interface of the main circuit board, the power supply connector is connected to the power supply pin of the power supply unit of the main circuit board, and the power receiving connector is used to connect to the power receiving interface of the main circuit board, the power receiving interface is connected to the power receiving pin of the chip unit of the main circuit board. A power supply trace connecting the power supply connector and the power receiving connector is disposed in at least two conductive layers of the power supply board.

2. The power supply circuit board according to claim 1, wherein, Also includes: A signal connector is provided on the first side of the power supply board. The signal connector is used to connect to the signal interface of the main circuit board. The signal interface is connected to the signal pin of the chip unit. The signal trace connected to the signal connector is located in the conductive layer of the power supply board.

3. The power supply circuit board according to claim 2, wherein, The conductive layer includes a power supply conductive layer and a signal conductive layer, wherein the thickness of the power supply conductive layer is greater than the thickness of the signal conductive layer. The power supply traces are located in the power supply conductive layer, and the signal traces are located in the signal conductive layer.

4. The power supply circuit board according to claim 1, wherein, Also includes: Circuit devices located on the second side of the power supply board.

5. The power supply circuit board according to claim 1, wherein, At least a portion of the power supply traces are made of metal sheets; And / or, At least some of the power supply holes are made of metal pillars; the power supply holes are conductive holes in the power supply board that are connected to the power supply traces.

6. The power supply circuit board according to claim 1, wherein, The first side of the power supply board is provided with a receiving groove.

7. The power supply circuit board according to claim 1, wherein, The power supply traces include positive power supply traces and negative power supply traces; the positive power supply traces are used to connect to the positive power supply interface of the main circuit board, and the positive power supply interface is connected to the positive power supply pin of the power supply unit; the negative power supply traces are used to connect to the negative power supply interface of the main circuit board, and the negative power supply interface is connected to the negative power supply pin of the power supply unit. For any conductive layer provided with the power supply traces, the power supply traces are either all positive power supply traces or all negative power supply traces.

8. The power supply circuit board according to claim 1, wherein, The power supply routing includes power supply routing for at least two different power rails; For any conductive layer provided with the power supply trace, wherein the power supply trace is a power supply trace of the same power rail.

9. The power supply circuit board according to claim 1, wherein, The power supply traces include positive power supply traces and negative power supply traces; the positive power supply trace is used to connect to the positive power supply interface of the main circuit board, and the positive power supply interface is connected to the positive power supply pin of the power supply unit; the negative power supply trace is used to connect to the negative power supply interface of the main circuit board, and the negative power supply interface is connected to the negative power supply pin of the power supply unit; the power supply circuit board further includes: A filter capacitor is installed inside the power supply board, and the two terminals of the filter capacitor are respectively connected to the positive power supply trace and the negative power supply trace.

10. The power supply circuit board according to claim 1, wherein, Also includes: A metal busbar is provided on the second side of the power supply board, and each metal busbar is connected to at least two different locations of the power supply trace.

11. A circuit board assembly comprising a main circuit board and a power supply circuit board as described in any one of claims 1 to 10; wherein, The main circuit board includes a motherboard body, on which the power supply unit and the chip unit are provided. The back side of the motherboard body is provided with a power supply interface connected to the power supply pin of the power supply unit, and a power receiving interface connected to the power receiving pin of the chip unit. The first side of the power supply board body of the power supply circuit board is disposed facing the back side of the main board body, the power supply connector is connected to the power supply interface, and the power receiving connector is connected to the power receiving interface.

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