Fabrication system and material supply member

Abstract

This fabrication system comprises: an irradiation unit for irradiating an object with an energy beam; and a supply unit for supplying a powdered build material to an energy beam irradiation position on the object. The supply unit has: a tube that forms a supply path for the build material and has, at one end thereof, an opening for discharging the build material; and a cover that covers the end face of the one end of the tube.

Description

Shaping device and material supply member

[0001] The present invention relates to the technical field of shaping devices and material supply members.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical problems of such a processing system is the problem that dust adheres to the nozzle for supplying the shaping material.

[0003] International Publication No. 2022 / 107238

[0004] According to a first aspect, there is provided a shaping device including an irradiation device that irradiates an object with an energy beam, and a supply device that supplies a powdery shaping material to an irradiation position of the energy beam on the object, wherein the supply device includes a tube that forms a supply path of the shaping material and has an opening that discharges the shaping material at one end, and a cover that covers an end face of the one end of the tube.

[0005] According to a second aspect, there is provided a shaping device including an irradiation device that irradiates an object with an energy beam, and a supply device that supplies a powdery shaping material to an irradiation position of the energy beam on the object, wherein the supply device includes a tube that forms a supply path of the shaping material and has an opening that discharges the shaping material at one end, and the tube is a member formed of alumina.

[0006] According to a third aspect, there is provided a material supply member including a tube that forms a supply path of a powdery shaping material and has an opening that discharges the shaping material at one end, and a cover that covers an end face of the one end of the tube.

[0007] According to a fourth aspect, there is provided a material supply member including a tube formed of alumina that forms a supply path of a powdery shaping material and has an opening that discharges the shaping material at one end.

[0008] This is a cross-sectional view showing the configuration of the processing system according to the embodiment. This is a block diagram showing the configuration of the processing system according to the embodiment. This is a cross-sectional view showing the configuration of the irradiation optical system. This is a cross-sectional view showing the process of fabricating a three-dimensional structure. This is a cross-sectional view showing the process of fabricating a structural layer by a first fabrication operation. This is a cross-sectional view showing the process of fabricating a structural layer by a second fabrication operation. This is a diagram showing a material nozzle according to the embodiment. This is a cross-sectional view showing a cross-section of the material nozzle according to the embodiment. This is an enlarged cross-sectional view showing an enlarged view of the tip of the material nozzle according to the embodiment. This is a diagram showing an example of the arrangement of the material nozzles. This is a diagram showing another example of the arrangement of the material nozzles.

[0009] The following describes a processing system SYS that performs additive manufacturing (additive molding) based on laser metal deposition (LMD), with reference to the drawings. Additive manufacturing based on laser metal deposition is an additive manufacturing process that creates a three-dimensional structure ST (formed object) that is integrated with the workpiece W or can be separated from the workpiece W by melting the molding material M supplied to the workpiece W with processing light EL (an energy beam in the form of light).

[0010] In other words, the SYS processing system can be described as a 3D printer (forming device) that processes objects using additive manufacturing technology. Additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. Laser welding (LMD) may also be called DED (Directed Energy Deposition).

[0011] Furthermore, the following explanation describes the positional relationships of the various components that make up the machining system SYS, using the XYZ Cartesian coordinate system defined by the mutually orthogonal X, Y, and Z axes. For the sake of explanation, the following explanation assumes that the X-axis and Y-axis directions are horizontal (a predetermined direction in the horizontal plane), and the Z-axis direction is vertical (a direction perpendicular to the horizontal plane, essentially the up and down direction). Also, the rotational directions (inclination directions) around the X, Y, and Z axes are defined as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may also be defined as the vertical direction. Also, the XY plane may be defined as the horizontal direction.

[0012] (1) Configuration of the SYS Machining System (1-1) Overall Configuration of the SYS Machining System First, the configuration of the SYS machining system of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic cross-sectional view showing the configuration of the SYS machining system of this embodiment. Figure 2 is a block diagram showing the configuration of the SYS machining system of this embodiment.

[0013] The machining system SYS comprises a stage unit 3 on which a workpiece (object to be processed) W is placed, a machining unit 2 that performs additional machining on the workpiece W, and a control unit 7 (control device) that controls the stage unit 3 and the machining unit 2.

[0014] (1-2) Configuration of Stage Unit 3 The stage unit 3 comprises a stage 31 and a stage drive mechanism 32. The stage 31 is located in the building space inside the chamber 8 of the processing system SYS, and the workpiece W is placed on it. For this reason, the stage 31 may also be called a mounting device. Specifically, the workpiece W is placed on the stage mounting surface 311, which is one surface of the stage 31 (for example, the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of the following for holding the workpiece W: a mechanical chuck, an electrostatic chuck, and a vacuum suction chuck. The workpiece W may also be attached to a holder, and the holder to which the workpiece W is attached may be placed on the stage 31. The retaining device may also be referred to as a jig, holder, holding member, mounting member, fixing member (holding member, mounting member), or clamp.

[0015] In the processing system SYS according to this embodiment, additional processing is performed on the workpiece W to form a three-dimensional structure ST (formed object) that is integrated with the workpiece W. The workpiece W is an object, that is, a three-dimensional structure, and may be another three-dimensional structure formed by the processing system SYS, that is, an existing formed object. Furthermore, the three-dimensional structure ST formed integrally with the workpiece W may be separable from the workpiece W after formation. In addition, in the processing system SYS according to this embodiment, additional processing is performed on the workpiece W (three-dimensional structure ST) placed on the stage 31, but it is not limited to this, and the stage 31 may be considered as the workpiece W, and additional processing may be performed on the stage 31.

[0016] The workpiece W, like the molding material M described later, may be made of a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher, and may be the same as or different from the molding material M. As the material of the workpiece W, for example, metallic materials or resin materials can be used, but other materials may also be used. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel.

[0017] The stage drive mechanism 32 is a drive mechanism that includes a drive source such as a motor that makes the stage 31 movable. When the stage drive mechanism 32 moves the stage 31, the relative positional relationship between the machining head 22 (the focusing optical system 50 provided in the machining head 22), which will be described later, and the stage 31 (the workpiece W placed on the stage 31) changes. For this reason, the stage drive mechanism 32 functions as a position changing device (drive device) that can change the relative positional relationship between the stage 31 and the workpiece W and the focusing optical system 50. The stage drive mechanism 32 is configured to move the stage 31 along, for example, the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction, at least one of these directions.

[0018] (1-3) Configuration of the processing unit 2 The processing unit 2 comprises an irradiation unit 4 that irradiates the workpiece W with processing light EL, a material supply unit 6 that supplies molding material for additional processing on the workpiece W, and a head drive mechanism 23.

[0019] (1-3-1) Components of the material supply unit 6 The material supply unit 6 comprises a material supply device 61, a gas supply device 62, a mixing device 63, and a material nozzle 64. The material supply device 61 is a device capable of supplying powdered molding material M. The molding material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, metallic materials can be used as such molding material M. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel.

[0020] The gas supply device 62 is a device capable of supplying gas. The mixing device 63 is connected to the material supply device 61 and the gas supply device 62, and mixes the powdered molding material M supplied from the material supply device 61 with the gas supplied from the gas supply device 62. In other words, the gas supply device 62 supplies a transport gas (pressurized gas) for transporting the powdered molding material M supplied from the material supply device 61, which is mixed in the mixing device 63. As the transport gas, for example, a purge gas consisting of an inert gas such as nitrogen or argon, which is injected to replace the gas in the chamber 8, can be used. In addition to a cylinder containing inert gas, the gas supply device 62 can use a nitrogen gas generator that generates nitrogen gas from the atmosphere as a raw material if the inert gas is nitrogen gas.

[0021] The material nozzle 64 is positioned in the build space inside the chamber 8 of the processing system SYS and is capable of supplying the build material M. More specifically, the material nozzle 64 is connected to the mixing device 63 and injects (releases, sprays, ejects, or blows) the build material M, which has been transported by pressurized gas, onto the workpiece W. In other words, the material nozzle 64 supplies the build material M together with the transport gas. For this reason, the material nozzle 64 may also be referred to as a material supply member or supply device (material supply device).

[0022] (1-3-2) Configuration of Irradiation Unit 4 The irradiation unit 4 comprises a light source unit 40 and an irradiation device 21 (Figure 2). The light source unit 40 comprises two light sources 40#1 and 40#2, which are energy beam sources. The light source unit 40 (light sources 40#, 40#2) is an energy beam source that emits at least one of infrared light, visible light, and ultraviolet light as processing light EL. However, other types of light may be used as processing light EL. The processing light EL may include multiple pulsed light (multiple pulsed beams). The processing light EL may also be laser light. In this case, the light source unit 40 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). As a laser light source, fiber lasers, CO2 lasers, etc. ２At least one of the following may be used: a laser, a YAG laser, and an excimer laser. However, the processing light EL does not have to be laser light. The light source unit 40 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0023] The characteristics of the processing light EL#1 emitted by light source 40#1 and the characteristics of the processing light EL#2 emitted by light source 40#2 may be the same or different. Characteristics include, for example, wavelength (typically the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1), wavelength band (typically the range of wavelengths at which the intensity is above a certain value), intensity, and absorption rate (relative to the peak wavelength) at the workpiece W (or the object on which the molded surface MS becomes the surface).

[0024] In this embodiment, an example has been described in which the processing system SYS (light source unit 40) is equipped with multiple light sources 40#1 and 40#2. However, it is not limited to this, and may be equipped with two or more light sources, or it may be a single light source. For example, when using a single light source 40#1 that emits (supplies) light in a wide wavelength band or multiple wavelengths, the emitted light may be wavelength-divided to generate processing light EL#1 and processing light EL#2 of different wavelengths, or the emitted light may be amplitude-divided or polarization-divided.

[0025] The irradiation device 21 is a device for emitting processing light EL and comprises an irradiation optical system 41 and a focusing optical system 50. The irradiation optical system 41 is an optical system for emitting processing light EL. Specifically, the irradiation optical system 41 is optically connected to a light source unit 40 that emits (generates) processing light EL via an optical transmission member consisting of an optical fiber or a light pipe.

[0026] The processing system SYS, and by extension the light source unit 4, has two light sources 40#1 and 40#2, which are optically connected to the irradiation device 21, and by extension the irradiation optical system 41, via optical transmission members. In the following description, when it is not necessary to distinguish between the "processing light EL#1" generated by light source 40#1 and the "processing light EL#2" generated by light source 40#2, they will be referred to as "processing light EL".

[0027] (a) Configuration of the irradiation device 21 Next, the configuration of the irradiation device 21 will be described with reference to Figure 3. Figure 3 is a diagram showing the configuration of the irradiation optical device 21.

[0028] The irradiation device 21 includes a focusing optical system 50 that focuses light and irradiates the workpiece W (molding surface MS), and an irradiation optical system 41 that directs processing light EL#1 incident from light source 40#1 and processing light EL#2 incident from light source 40#2 into the focusing optical system 50.

[0029] The irradiation optical system 41 comprises a first optical system 41#1 into which processing light EL#1 emitted from a light source 40#1 is incident, and a second optical system 41#2 into which processing light EL#2 emitted from a light source 40#2 is incident. The first optical system 41#1 and the second optical system 41#2 have similar configurations, although they differ in that they are arranged symmetrically with respect to the irradiation device 21 (prism mirror 52, described later). The configurations of the first optical system 41#1 and the second optical system 41#2 will be described below. In the following description, the configuration of the first optical system 41#1 related to processing light EL#1 incident from the light source 40#1, and descriptions intended for those using processing light EL#1 incident from the light source 40#1, will be distinguished and described by adding "#1" to the end of the reference numeral of each configuration. Similarly, for the configuration of the second optical system 41#2 related to the processing light EL#2 incident from the light source 40#2, and for explanations intended for those using the processing light EL#2 incident from the light source 40#2, "#2" will be added to the end of the reference numerals of each configuration to distinguish and describe them. On the other hand, if the first optical system 41#1 related to the processing light EL#1 incident from the light source 40#1 and the second optical system 41#2 related to the processing light EL#2 incident from the light source 40#2 have similar configurations, and if the processing light EL#1 incident from the light source 40#1 and the processing light EL#2 incident from the light source 40#2 are similar, the explanations will be given without distinguishing between them, without adding "#1" or "#2" to the end of the reference numerals of each configuration.

[0030] (b) Configuration of the first optical system 41#1 and the second optical system 41#1 The first optical system 41#1 and the second optical system 41#2 each include a collimator lens 42 (42#1, 42#2), a beam splitter 43 (43#1, 43#2), a galvanometer scanner 44 (44#1, 44#2), and a power meter 47 (47#1, 47#2).

[0031] The processing light EL (EL#1, EL#2) emitted from the light source unit 40 (light sources 40#1, 40#2) is incident on collimator lenses 42 (42#1, 42#2), respectively. The collimator lenses 42 convert the processing light EL incident on them into parallel light. The processing light EL converted into parallel light by the collimator lenses 42 is incident on a beam splitter 43. In this embodiment, the beam splitter 43 uses a parallel planar substrate made of a light-transmitting material such as glass. The beam splitter 43 is positioned obliquely to the optical path of the processing light EL incident on the beam splitter 43. A portion of the processing light EL incident on the beam splitter 43 passes through the beam splitter 43. Another portion of the processing light EL incident on the beam splitter 43 is reflected by the beam splitter 43. Thus, the beam splitter 43 can be anything that can split the incident processing light EL, and in addition to a parallel planar substrate, a prism that reflects a portion of the incident processing light EL and transmits a portion may also be used.

[0032] The processed EL light that has passed through the beam splitter 43 is incident on the galvanoscanner 44. The galvanoscanner 44 includes a focus control optical system 45 and a galvanoscanner mirror 46. The processed EL light that has passed through the beam splitter 43 is incident on the focus control optical system 45.

[0033] The focus control optical system 45 is an optical component capable of changing the focus position CP (CP#1, CP#2) of the processing light EL. In this embodiment, the focus position CP of the processing light EL may mean the focusing position where the processing light EL is focused. The focus position CP of the processing light EL may also mean the convergence position where the processing light EL is most focused in the irradiation direction (travel direction) of the processing light EL.

[0034] Specifically, the focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction of the processing light EL emitted from the irradiation device 21. The focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction (approximately the Z-axis direction) of the processing light EL irradiated by the irradiation device 21 onto the molding surface MS (for example, the surface of the workpiece W or structural layer SL). In the example shown in Figure 4, the irradiation direction of the processing light EL is set to intersect with the molding surface MS, and the irradiation device 21 irradiates the molding surface MS with the processing light EL from above the workpiece W, so the focus control optical system 45 can change the focus position CP of the processing light EL along the direction intersect with the molding surface MS.

[0035] The focus control optical system 45 may include, for example, a plurality of optical elements (e.g., a plurality of lenses) arranged along the irradiation direction of the processing light EL. In other words, the focus control optical system 45 may include, for example, a plurality of refractive optical elements arranged along the irradiation direction of the processing light EL. In this case, the focus control optical system 45 changes the focus position CP of the processing light EL by moving at least one of the plurality of optical elements (refracting optical elements) along its optical axis. However, the focus control optical system 45 may also include a reflective optical element such as a mirror, and the focus position CP of the processing light EL may be changed by moving the reflective optical element.

[0036] When the focus control optical system 45 changes the focus position CP of the processing light EL, the positional relationship between the focus position CP of the processing light EL and the build surface MS changes. In particular, the positional relationship between the focus position CP of the processing light EL and the build surface MS changes in the irradiation direction of the processing light EL (approximately the Z-axis direction). Therefore, the focus control optical system 45 changes the positional relationship (positional relationship in the Z-axis direction) between the focus position CP of the processing light EL and the build surface MS by changing the focus position CP of the processing light EL. The focus control optical system 45 also changes the distance (distance in the Z-axis direction) between the focus position CP of the processing light EL and the build surface MS by changing the focus position CP of the processing light EL.

[0037] The processing light EL emitted from the focus control optical system 45 is incident on the galvanometer mirror 46. The galvanometer mirror 46 deflects the processing light EL, thereby changing the direction of emission of the processing light EL emitted from the galvanometer mirror 46. For this reason, the galvanometer mirror 46 may also be called a deflection optical system.

[0038] The galvano mirror 46 includes, for example, an X-scanning mirror 46MX, an X-scanning motor 46AX, a Y-scanning mirror 46MY, and a Y-scanning motor 46AY. The processing light EL emitted from the focus control optical system 45 is incident on the X-scanning mirror 46MX from the Z-axis direction. The X-scanning mirror 46MX reflects the processing light EL incident on the X-scanning mirror 46MX toward the Y-scanning mirror 46MY. The Y-scanning mirror 46MY reflects the processing light EL incident on the Y-scanning mirror 46MY toward the focusing optical system 50. Note that the X-scanning mirror 46MX and the Y-scanning mirror 46MY may each be referred to as galvano mirrors.

[0039] The X-scanning motor 46AX is capable of oscillating or rotating the X-scanning mirror 46MX around a rotation axis along the Y-axis. In other words, the angle of the X-scanning mirror 46MX with respect to the optical path of the processing light EL incident on the X-scanning mirror 46MX can be changed by the X-scanning motor 46AX, thereby changing the deflection angle of the processing light EL. For this reason, the X-scanning mirror 46MX may also be called a deflection member. In this case, the oscillation or rotation of the X-scanning mirror 46MX allows the processing light EL to be scanned along a direction perpendicular to the Y-axis (the X-axis direction of the molding surface MS).

[0040] The Y-scanning motor 46AY is capable of oscillating or rotating the Y-scanning mirror 46MY around a rotation axis along the X-axis. In other words, the angle of the Y-scanning mirror 46MY can be changed with respect to the optical path of the processing light EL incident on the Y-scanning mirror 46MY, thereby changing the deflection angle of the processing light EL. For this reason, the Y-scanning mirror 46MY may also be called a deflection member. In this case, the oscillation or rotation of the Y-scanning mirror 46MY allows the processing light EL to be scanned along a direction perpendicular to the X-axis (the Y-axis direction of the molding surface MS).

[0041] Here, with the relative positions of the irradiation device 21 and the build surface MS fixed (without changing them), the area in which the galvanometer mirrors 46 (46#1, 46#2) can move the irradiation area EA on the build surface MS is defined as the processing unit area PUA (PUA#1, PUA#2). In other words, the processing unit area PUA represents the area (range) in which additional processing can be performed by the processing head 22 scanning the processing light EL and moving the irradiation area EA while the relative positions of the irradiation device 21 and the build surface MS are fixed. To put it another way, the processing unit area PUA is the maximum area in which the galvanometer mirrors 46 can move the target irradiation area EA on the build surface MS while the relative positions of the irradiation device 21 and the build surface MS are fixed. That is, the processing unit area PUA is a virtual area located at a position determined with respect to the processing head 22 (irradiation device 21) on the build surface MS.

[0042] When the emission direction of the processing light EL emitted from the galvanometer mirror 46 is changed, the position from which the processing light EL is emitted from the processing head 22 is changed, causing the irradiation area EA on the build surface MS to move, and the irradiation position of the processing light EL onto the build material M to move. For this reason, the galvanometer mirror 46 functions as a position changing device (irradiation position changing device) that can move the irradiation position of the processing light EL in the space between the build surface MS and the material nozzle 64, and also functions as a scanning optical system (deflection scanning optical system) that scans the processing light EL so that the irradiation position of the processing light EL moves.

[0043] Note that the galvanometer scanner 44 may not include the focus control optical system 45. Even in this case, when the positional relationship between the irradiation optical system 41 and the shaping surface MS in the irradiation direction of the processing light EL changes, the positional relationship between the focus position CP of the processing light EL and the shaping surface MS in the irradiation direction of the processing light EL changes. Therefore, even when the galvanometer scanner 44 does not include the focus control optical system 45, the processing system SYS can change the positional relationship between the focus position CP of the processing light EL and the shaping surface MS in the irradiation direction of the processing light EL. For example, the processing system SYS may change the positional relationship between the focus position CP of the processing light EL and the shaping surface MS in the irradiation direction of the processing light EL by using the stage drive mechanism 32 or the head drive mechanism 23 described later.

[0044] The processing light EL reflected by the beam splitter 43 enters the power meter 47. The power meter 47 is a device capable of detecting the intensity of the processing light EL (EL#1, EL#2) incident on the power meter 47. Since the beam splitter 43 (43#1, 43#2) is disposed on the optical path of the processing light EL between the light source unit 40 (light source 40#1, 40#2) and the galvanometer mirror 46 (46#1, 46#2), the power meter 43 detects the intensity of the processing light EL traveling on the optical path between the light source unit 40 and the galvanometer mirror 46. In this case, the power meter 47 can stably detect the intensity of the processing light EL without being affected by the deflection of the processing light EL by the galvanometer mirror 46. However, the arrangement position of the power meter 47 is not limited to the example shown in FIG. 4. For example, the power meter 47 may detect the intensity of the processing light EL traveling on the optical path between the galvanometer mirror 46 and the shaping surface MS. The power meter 47 may detect the intensity of the processing light EL traveling on the optical path in the galvanometer mirror 46. The detection result of the power meter 47 is output to the control unit 7 described later.

[0045] Note that the power meter 47 may include, for example, a light receiving element that detects the processing light EL as light. In addition, as the intensity of the processing light EL increases, the energy amount of the processing light EL increases, and the amount of heat generated by the processing light EL increases. Therefore, the power meter 47 may detect the intensity of the processing light EL by detecting the heat generated by the processing light EL. In this case, the power meter 47 may include a heat detection element that detects the heat generated by the processing light EL.

[0046] (c) Configuration of the condensing optical system 50 The condensing optical system 50 includes a prism mirror 51 and an fθ lens 52. In other words, the prism mirror 51 and the fθ lens 52 are integrated as the condensing optical system 50 so that their relative positions do not change. Each of the processing light EL#1 emitted from the first optical system 41#1 and the processing light EL#2 emitted from the second optical system 41#2 enters the prism mirror 51. The prism mirror 51 reflects each of the processing lights EL#1 and EL#2 toward the fθ lens 52. The prism mirror 51 reflects the processing lights EL#1 and EL#2 that enter the prism mirror 51 from different directions toward substantially the same direction (fθ lens 52).

[0047] The fθ lens 52 is an optical system that emits the processing light EL (EL#1, EL#2) reflected by the prism mirror 51 toward the shaping surface MS. The processing light EL that has passed through the fθ lens 52 is irradiated onto the shaping surface MS. That is, the fθ lens 52 is the final optical member for irradiating the shaping surface MS with the processing light EL reflected by the prism mirror 51.

[0048] The fθ lens 52 is an optical element that emits the processing light EL toward the shaping surface MS and can condense the processing light EL on a condensing surface. For this reason, the fθ lens 52 may be referred to as a condensing optical system. The condensing surface of the fθ lens 52 may be set, for example, as the shaping surface MS. In this case, the condensing optical system 50 has projection characteristics of fθ. However, the condensing optical system 50 may have characteristics different from fθ as the projection characteristics. For example, the condensing optical system 50 may have projection characteristics of f·tanθ or f·sinθ.

[0049] The optical axis AX of the fθ lens 52 is along the Z axis. Therefore, the fθ lens 52 emits the processing light EL almost along the Z axis. In this case, the irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#2 may be the same. The irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#2 may both be along the optical axis AX of the fθ lens 52. However, the irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#2 do not have to be the same. The irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#2 may be different from each other.

[0050] Furthermore, the focusing optical system 50 does not need to include an fθ lens 52 if the light reflected from the prism mirror 51 can be focused onto the focusing surface. In this case, the final optical component is the prism mirror 51, and the processing light EL reflected from the prism mirror 51 is irradiated onto the molding surface MS.

[0051] (1-4) Configuration of the head unit 20 The head unit 20 includes, in addition to the irradiation device 21 of the irradiation unit 4, a processing head 22 having a material nozzle 64 of the material supply unit 6, and a head drive mechanism 23 that makes this processing head 22 movable in the molding space inside the chamber 8 of the processing system SYS. The processing head 22, and by extension the head unit 20, may further include a light source unit 40, i.e., the irradiation unit 4, and may also include a mixing device 63.

[0052] The processing head 22 is configured such that the irradiation device 21 and the material nozzle 64 are located integrally, or at least within a predetermined distance range. Therefore, the processing head 22 is capable of supplying the molding material M to the irradiation position of the processing light EL from the focusing optical system 50 using the material nozzle 64.

[0053] The head drive mechanism 23 is a drive mechanism including a drive source such as a motor that enables the movement of the machining head 22, i.e., the irradiation device 21 and the material nozzle 64, under the control of the control unit 7, which will be described later. When the head drive mechanism 23 moves the machining head 22, the relative positional relationship between the machining head 22 (the focusing optical system 50 provided on the machining head 22) and the stage 31 (the workpiece W placed on the stage 31) changes, similar to when the stage drive mechanism 32 moves the stage 31. For this reason, the head drive mechanism 23 functions as a position changing device (drive device) that can change the relative positional relationship between the stage 31 and the workpiece W and the focusing optical system 50, respectively. The head drive mechanism 23 is configured to move the machining head 22 along at least one of the following directions: the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0054] (1-5) Configuration of Control Unit 7 Next, the configuration of the control unit 7 will be described. As shown in Figure 2, the control unit 7 includes an arithmetic unit 71 and a storage device 72. The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. The arithmetic unit 71, storage device 72, output device 73, input device 74, and display device 75 may be connected to each other.

[0055] The storage device 72 includes at least one memory capable of storing data. The memory may be implemented by a group of circuits (for example, at least one of an electronic circuit and an electrical circuit). For example, the storage device 72 may store a computer program 721, or temporarily store data that the arithmetic unit 71 (described later) uses temporarily when it is executing the computer program 721. The storage device 72 may also store data that the control unit 7 stores long-term. The storage device 72 may include at least one of RAM (Random Access Memory), ROM (Read Only Memory), hard disk drive, magneto-optical disk drive, SSD (Solid State Drive), and disk array device. In other words, the storage device 72 may include a non-temporary recording medium.

[0056] The arithmetic unit 71 is hardware that includes at least one circuit (for example, at least one of a logic circuit, an electronic circuit, and an electrical circuit). For this reason, the arithmetic unit 71 may also be referred to as a circuit group.

[0057] The arithmetic unit 71 includes at least one processor (one or more processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may also include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Integrated Circuit). The processor may be implemented by a group of circuits (for example, at least one of an electronic circuit and an electrical circuit).

[0058] The arithmetic unit 71 reads a computer program 721 which includes at least one of computer program code and computer program instructions.

[0059] For example, the arithmetic unit 71 may read a computer program 721 stored on a computer-readable and non-temporary recording medium using a recording medium reader (not shown) provided by the control unit 7. The computer program 721 read from the recording medium may be stored in the storage device 72. The recording medium for recording the computer program 721 may include equipment capable of recording the computer program 721 (for example, a general-purpose or dedicated device in which the computer program 721 is implemented in an executable state in at least one form such as software and firmware). For example, the recording medium may be at least one of the following: optical discs such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray®; magnetic media such as magnetic tape; magneto-optical disks; semiconductor memory such as USB memory; and any other medium capable of storing programs.

[0060] In addition, the arithmetic unit 71 may obtain (download or read) a computer program 721 from a device (not shown) located outside the control unit 7 via a communication device. The downloaded computer program 721 may be stored in the storage device 72.

[0061] The arithmetic unit 71 executes the loaded computer program 721. As a result, logical functional blocks for executing the processing that the control unit 7 should perform (for example, processing to control the operation of the machining system SYS) are realized within the arithmetic unit 71. Each processing and function included in the computer program 721 may be realized by logical processing blocks realized within the arithmetic unit 71 when the arithmetic unit 71 (processor) executes the computer program 721, or by hardware such as a predetermined gate array (FPGA, ASIC) provided in the arithmetic unit 71, or it may function as a controller or computer for realizing logical functional blocks for executing the processing that the control unit 7 should perform. In other words, together with at least one processor provided in the arithmetic unit 71, the memory (recording medium) provided in the storage device 72, etc., and the computer program 721 are configured so that the control unit 7 performs the processing that the control unit 7 should perform (for example, the robot control processing described above).

[0062] The arithmetic unit 71 may generate control signals to control the operation of the machining system SYS as a result of executing the computer program 721 using logical functional blocks implemented within the arithmetic unit 71. The arithmetic unit 71 may output the generated control signals to at least one of the machining units 2 (particularly the light source unit 40, irradiation device 21, material supply device 61, and gas supply device 62) and the stage unit 3 via the output device 73, which will be described later. At least one of the machining units 2 and the stage unit 3 may operate based on the control signals output (generated) by the arithmetic unit 71. In other words, the machining system SYS processes the workpiece W based on the control signals output (generated) by the arithmetic unit 71.

[0063] The computing device 71 may implement a computational model that can be constructed by machine learning when the computing device executes a computer program 721. An example of a computational model that can be constructed by machine learning is a computational model that includes a neural network (so-called artificial intelligence (AI)). In this case, the learning of the computational model may include learning the parameters of the neural network (for example, at least one of the weights and biases). The computing device 71 may use the computational model to control the operation of the processing system SYS. That is, the operation of controlling the operation of the processing system SYS may include the operation of controlling the operation of the processing system SYS using the computational model. The computing device 71 may also implement a computational model that has been constructed by offline machine learning using training data. Furthermore, the computational model implemented in the computing device 71 may be updated by online machine learning on the computing device 71. Alternatively, the arithmetic unit 71 may control the operation of the machining system SYS using, in addition to or instead of, the arithmetic model implemented in the arithmetic unit 71, an arithmetic model implemented in an external device (a device provided outside the control unit 7).

[0064] The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. Alternatively, the control unit 7 may be configured so that the arithmetic unit 71, memory device 72, output device 73, input device 74, and display device 75 are interconnected.

[0065] The output device 73 is a device that outputs arbitrary information to the outside of the control unit 7. For example, the output device 73 may output a signal indicating arbitrary information (for example, the control signal described above) to the control unit 7 and an external device (for example, the processing unit 2 (particularly the light source unit 40, irradiation device 21, material supply device 61, gas supply device 62), and the stage unit 3, or at least one of these). For example, the output device 73 may output a signal as arbitrary information via a communication network connecting the control unit 7 and an external device (for example, the processing unit 2 (particularly the light source unit 40, irradiation device 21, material supply device 61, gas supply device 62), and the stage unit 3, or at least one of these). In this case, the output device 73 includes a communication device.

[0066] The output device 73 may output arbitrary information to the outside of the control unit 7 using a medium other than a signal. For example, the output device 73 may output information as sound. In this case, the output device 73 includes an audio device (a so-called speaker) capable of outputting sound. For example, the output device 73 may output information onto paper. In this case, the output device 73 includes a printing device (a so-called printer) capable of printing the desired information onto paper.

[0067] The input device 74 is a device that receives information input to the control unit 7 from outside the control unit 7. For example, the input device 74 may include an operating device that can be operated by the user of the control unit 7 (for example, at least one of a keyboard, mouse, and touch panel). In this case, the input device 74 functions as a device that allows the user to input information. For example, the input device 74 may include a recording medium reader that can read information recorded as data on a recording medium that can be attached externally to the control unit 7.

[0068] The information input to the input device 74 may also be input to the arithmetic unit 71. In other words, the arithmetic unit 71 may acquire the information input to the input device 74. The arithmetic unit 71 may control the operation of the machining system SYS based on the information input to the input device 74. For example, the arithmetic unit 71 may generate a control signal to control the operation of the machining system SYS based on the information input to the input device 74.

[0069] As mentioned above, if the output device 73 includes a communication device, the communication device included in the output device 73 may, in addition to or instead of outputting (transmitting) information via a data bus or communication network, acquire (receive) information via a data bus or communication network. In this case, the communication device included in the output device 73 may also function as an input device to which information is input via a data bus or communication network.

[0070] The display device 75 is a display capable of displaying images. The display device 75 may display images under the control of the arithmetic unit 71. In this case, the arithmetic unit 71 may generate display control information to control the display device 75 to display a desired image. The arithmetic unit 71 may output the generated display control information to the display device 75. The display device 75 may receive the display control information generated by the arithmetic unit 71 as input. The display device 75 may display a desired image based on the display control information generated by the arithmetic unit 71. In this way, the arithmetic unit 71 may control the display device 75 to display a desired image by outputting the generated display control information to the display device 75.

[0071] Furthermore, using the control unit 7 having the above configuration, the intensity of the processing light EL may be controlled (changed) based on the detection results of the power meters 47 (47#1, 47#2) input to the control unit 7 (detection results of the intensity of the processing light EL (EL#1, EL#2)). More specifically, the control unit 7 may control the intensity of the processing light EL so that the intensity of the processing light EL becomes a desired intensity. In order to control the intensity of the processing light EL, for example, the control unit 7 may control the light source unit 40 so as to change the intensity of the processing light EL emitted from the light source unit 40 based on the detection results of the power meters 47. As a result, the processing system SYS can appropriately create an object on the build surface MS by irradiating the build surface MS with processing light EL having an appropriate intensity.

[0072] In addition, the control unit 7 may control the head drive mechanism 23, which moves the machining head 22, and the stage drive mechanism 32, which moves the stage 31, so that the machining unit area PUA moves on the build surface MS during the period when the irradiation area EA is moved within the machining unit area PUA using the galvanometer mirror 46. Specifically, for example, the control unit 7 may control at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining unit area PUA moves along a movement trajectory that intersects (or, in some cases, is orthogonal to) the movement direction (scanning direction) of the irradiation area EA within the machining unit area PUA. Conversely, the control unit 7 may control the galvanometer mirror 46 so that the irradiation area EA periodically moves along a scanning direction that intersects (or, in some cases, is orthogonal to) the movement trajectory of at least one of the head drive mechanism 23 and the stage drive mechanism 32 within the machining unit area PUA on the build surface MS.

[0073] In addition to the above, the control unit 7 may also control the processing system SYS, for example, the processing unit 2 (at least one of the processing head 22 and the head drive mechanism 2), the stage unit 3 (stage drive mechanism 32), the light source unit 40, the material supply device 61, and the gas supply device 62. More specifically, the control unit 7 may control the emission mode of the processing light EL by the irradiation device 21. The emission mode refers to, for example, the on / off state of the processing light EL, the intensity of the processing light EL, and the emission timing of the processing light EL. If the processing light EL includes multiple pulsed light beams, for example, the emission time of the pulsed light beams, the emission period of the pulsed light beams, and the ratio of the length of the emission time of the pulsed light beams to the emission period of the pulsed light beams (the so-called duty cycle) may be controlled as the emission mode. In addition, the galvanoscanner 44 may control the optical system such as the galvanoscanner 44 to change the light irradiation position, change the light focal position, or manipulate the light. Furthermore, the control unit 7 may control the movement mode of the processing head 22 by the head drive mechanism 23 and the movement mode of the stage 31 by the stage drive mechanism 32. Movement mode refers to, for example, the amount of movement, the speed of movement, the direction of movement, and the timing of movement. Furthermore, the control unit 7 may control the supply mode of the molding material M by the material nozzle 64. Supply mode refers to, for example, the amount of supply (amount of supply per unit time) and the timing of supply.

[0074] (2) Forming operations performed by the processing system SYS The forming operations performed by the processing system SYS (additional processing operations that perform additional processing on the workpiece W) will be described. As described above, the processing system SYS forms a three-dimensional structure ST by performing additional processing based on the laser cladding welding method. For this reason, the processing system SYS may form a three-dimensional structure ST by performing forming operations in accordance with the laser cladding welding method. Since the processing system SYS forms a three-dimensional structure ST, for example, the processing system SYS may be called a forming device.

[0075] The machining system SYS creates a three-dimensional structure ST on the workpiece W based on three-dimensional model data (three-dimensional model information) of the three-dimensional structure ST to be fabricated. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device installed within the machining system SYS and a three-dimensional shape measuring machine installed separately from the machining system SYS may be used. In order to fabricate the three-dimensional structure ST, the machining system SYS sequentially fabricates, for example, multiple structural layers SL arranged along the Z-axis.

[0076] The processing system SYS repeatedly performs operations to fabricate such structural layers SL based on the three-dimensional model data of the three-dimensional structure ST, under the control of the control unit 7. Specifically, first, before performing operations to fabricate the structural layers SL, the control unit 7 slices the three-dimensional model data at the layering pitch to create slice data. The processing system SYS then performs operations to fabricate the first structural layer SL-1 on the fabrication surface MS, which corresponds to the surface of the workpiece W, based on the slice data corresponding to the structural layer SL-1. Specifically, the control unit 7 acquires path information for fabricating the first structural layer SL-1, which is generated based on the slice data corresponding to the structural layer SL-1. Subsequently, the control unit 7 controls the processing unit 2 and the stage unit 3 to fabricate the first structural layer SL-1 based on the path information. As a result, the structural layer SL-1 is fabricated on the fabrication surface MS as shown in Figure 4(a). Subsequently, the machining system SYS sets the surface (top surface) of structural layer SL-1 as a new build surface MS, and then fabricates the second structural layer SL-2 on this new build surface MS. To fabricate structural layer SL-2, the control unit 7 first controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining head 22 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 to move the machining head 22 toward the +Z side and / or move the stage 31 toward the -Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface (new build surface MS) of structural layer SL-1. Subsequently, the control unit 7 controls the machining unit 2 and the stage unit 3 to fabricate structural layer SL-2 on structural layer SL-1 based on slice data corresponding to structural layer SL-2, in the same manner as the fabrication of structural layer SL-1. As a result, structural layer SL-2 is fabricated, as shown in Figure 4(b). This process is repeated until all structural layers SL constituting the three-dimensional structure ST to be fabricated on the workpiece W are fabricated. As a result, as shown in Figure 4(c), the three-dimensional structure ST is fabricated by a laminated structure composed of multiple structural layers SL.

[0077] The processing system SYS (primarily processing unit 2) selectively performs the following two processing operations to create each structural layer SL: (i) a first processing operation in which processing light EL is irradiated onto the processing surface MS to form a molten pool MP into which the processing material M is supplied to create a three-dimensional structure ST; and (ii) a second processing operation in which the processing light EL is irradiated onto the processing surface MS to melt the processing material M and supply it to the processing surface MS to create a three-dimensional structure ST. The first and second processing operations will be described in order below.

[0078] (2-1) First molding operation The first molding operation is a molding operation in which a molded object is formed on the molding surface MS by irradiating the molding surface MS with processing light EL to form a molten pool MP on the molding surface MS, and supplying molding material M to the formed molten pool MP (the position where the processing light EL was irradiated).

[0079] First, the operation of creating each structural layer SL by performing the first molding operation will be explained with reference to Figures 5(a) and 5(b). Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 22 and the stage 31 so that the processing unit area PUA is set in a desired area on the molding surface MS corresponding to the surface of the workpiece W or the surface of the molded structural layer SL. Then, the irradiation device 21 irradiates the processing unit area PUA with processing light EL. At this time, the focus position CP of the processing light EL in the Z-axis direction may coincide with the molding surface MS or may be away from the molding surface MS. As a result, as shown in Figure 5(a), molten pools MP are formed on the molding surface MS irradiated with processing light EL. Furthermore, under the control of the control unit 7, the processing system SYS supplies the molding material M from the material nozzle 64. As a result, the molding material M is supplied to the molten pool MP.

[0080] The molding material M supplied to the molten pool MP is melted by the energy from the processing light EL irradiated onto the molten pool MP. Alternatively, the molding material M supplied to the molten pool MP is melted by the heat from the molten material constituting the molten pool MP. Even when the molding material M is melted by the heat from the molten material constituting the molten pool MP, since the molten pool MP is formed by the energy of the processing light EL, the molding material M can be considered to be melted by the energy of the processing light EL that formed the molten pool MP. In other words, the molding material M is indirectly melted by the processing light EL through the molten pool MP formed by the processing light EL. In either case, the fact remains that the molding material M is melted by the energy of the processing light EL.

[0081] Furthermore, the irradiation device 21 moves the irradiation area EA (EA#1, EA#2) within the processing unit area PUA (PUA#1, PUA#2) using the galvanometer mirrors 46 (46#1, 46#2). In other words, the irradiation device 21 scans the processing light EL within the processing unit area PUA using the galvanometer mirrors 46. As the irradiation area EA moves, the processing light EL stops irradiating, and the molten molding material M cools and solidifies. In other words, as the irradiation area EA moves, the position where the molten pool MP is formed also moves. As a result, as shown in Figure 5(b), within the processing unit area PUA, as the irradiation area EA moves, the molded object composed of the solidified molding material M is deposited on the molded surface MS. In this manner, processing light EL is irradiated onto the molding surface MS to form a molten pool MP (narrow sense), then molding material M is supplied to the molten pool MP (narrow sense), the molding material M melts and forms a molten pool (broad sense) protruding from the molding surface MS, and the structure (structural layer SL) is deposited on the molding surface MS by cooling and solidifying the molten pool (broad sense).

[0082] Here, the control unit 7 may control the galvanometer mirror 46 to deflect the processing light EA so that the irradiation area EA moves within the processing unit area PUA along a single scanning direction while the processing unit area PUA is stationary (not moving) on ​​the build surface MS. In other words, the control unit 7 may deflect the processing light EA with the galvanometer mirror 46 so that the irradiation area EA moves along the main scanning direction (single scanning direction) within a coordinate system determined with respect to the processing unit area PUA. In particular, the galvanometer mirror 46 may deflect the processing light EA so that the irradiation area EA periodically reciprocates along a single scanning direction within the processing unit area PUA. In other words, the galvanometer mirror 46 may deflect the processing light EL so that within the processing unit area PUA, the irradiation area EA is scanned in the main scanning direction, then shifted in a sub-scanning direction perpendicular to the main scanning direction, and then scanned again in the main scanning direction, repeating this process. In this case, the irradiation area EA may be repeatedly scanned from one side to the other along the main scanning direction, or it may be repeatedly scanned alternately from one side to the other and from the other side to the first side along the main scanning direction. The shape of the processing unit area PUA, to which the irradiation area EA moves in this manner, may be a rectangle whose longitudinal direction is the direction of movement of the irradiation area EA.

[0083] In addition, the control unit 7 may drive the head drive mechanism 23 and the stage drive mechanism 32 to move the processing head 22 and the workpiece W relative to each other, while periodically scanning the processing light EA with the galvanometer mirror 46, thereby performing an operation (wobbling operation) to periodically move (deflect) the irradiation area EA on the molding surface MS.

[0084] In Figure 5, for the sake of explanation, the molded object composed of the molding material M solidified within the processing unit area PUA#1 and the molded object composed of the molding material M solidified within the processing unit area PUA#2 are physically separated. However, the molded object composed of the molding material M solidified within the processing unit area PUA#1 and the molded object composed of the molding material M solidified within the processing unit area PUA#2 may be integrated. In particular, if the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the molded object composed of the molding material M solidified within the processing unit area PUA#1 and the molded object composed of the molding material M solidified within the processing unit area PUA#2 may be integrated.

[0085] During the period when the irradiation areas EA#1 and EA#2 are moving within the processing unit areas PUA#1 and PUA#2, respectively, the processing system SYS may move at least one of the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 move on the build surface MS. In other words, the processing system SYS may perform the movement of the irradiation area EA#1 within the processing unit area PUA#1 and the irradiation area EA#2 within the processing unit area PUA#2, respectively, and the movement of the processing unit areas PUA#1 and PUA#2 on the build surface MS in parallel.

[0086] Alternatively, during the period when the irradiation area EA#1 is moving within the processing unit area PUA#1 and the irradiation area EA#2 is moving within the processing unit area PUA#2, the processing system SYS does not need to move the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 do not move on the build surface MS. In other words, the processing head 22 and the stage 31 may remain stationary during the period when the irradiation area EA#1 is moving within the processing unit area PUA#1 and the irradiation area EA#2 is moving within the processing unit area PUA#2. In this case, after the additional processing (forming) within the processing unit areas PUA#1 and PUA#2 is completed, the processing system SYS may move at least one of the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in different areas on the build surface MS. In other words, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the build surface MS after the additional machining (shaping) within the machining unit areas PUA#1 and PUA#2 is completed. In this case, the areas on the build surface MS where the machining unit areas PUA#1 and PUA#2 are already set (areas where additional machining has already been performed) and the areas on the build surface MS where the machining unit areas PUA#1 and PUA#2 are newly set (areas where additional machining will now be performed) may be adjacent, and these areas may partially overlap or not overlap.

[0087] The processing system SYS repeats a series of fabrication processes on the fabrication surface MS while moving the processing unit area PUA along a movement trajectory. These processes include the formation of a molten pool MP by irradiation with processing light EL within the processing unit area PUA, the supply of fabrication material M to the molten pool MP, the melting of the supplied fabrication material M, and the solidification of the molten fabrication material M. In this case, as the processing unit area PUA moves, a fabricated object is formed on the fabrication surface MS that has a width along the direction intersecting the movement trajectory (X-axis direction) and extends along the Y-axis direction.

[0088] As a result, a structural layer SL, which corresponds to the molded object and is an aggregate of the molten and solidified molding material M, is formed on the molding surface MS. In other words, a structural layer SL, which corresponds to an aggregate of molded objects formed on the molding surface MS in a pattern corresponding to the movement trajectory of the processing unit area PUA, is formed. That is, in a plan view, a structural layer SL is formed that has a shape corresponding to the movement trajectory of the processing unit area PUA.

[0089] The movement trajectory of the machining unit area PUA may also be called a machining path (toolpath). In this case, the control unit 7 may move at least one of the machining head 22 and the stage 31 on the build surface MS so that the machining unit area PUA moves along the movement trajectory based on path information (path information indicating the machining path) indicating the movement trajectory.

[0090] (2-2) Second molding operation In the first molding operation described above, the processing system SYS melts the molding material M on the molding surface MS. On the other hand, in the second molding operation, the processing system SYS melts the molding material M in the space between the material nozzle 64 and the molding surface MS before the molding material M reaches the molding surface MS. In other words, in the second molding operation, the processing system SYS irradiates the molding material M with processing light EL in the space between the material nozzle 64 and the molding surface MS to melt the molding material M. The processing system SYS then supplies the molding material M that has melted in the space between the material nozzle 64 and the molding surface MS to the molding surface MS to form a molded object on the molding surface MS. Therefore, in the second molding operation, the processing system SYS does not need to perform the operation of irradiating the molding surface MS with processing light EL to form a molten pool MP.

[0091] In the second molding operation, the machining system SYS moves at least one of the machining head 22 and the stage 31 under the control of the control unit 7 so that molten molding material M is supplied to a desired area on the molding surface MS corresponding to the surface of the workpiece W or the surface of the molded structural layer SL, thereby molding each structural layer SL. In the following description, we will use as an example a configuration in which the machining head 22 is moved so that molten molding material M is supplied to a desired area on the molding surface MS to mold a three-dimensional structure ST.

[0092] As shown in Figure 6(a), the processing system SYS emits processing light EL from the irradiation device 21 and supplies the molding material M from the material nozzle 64 under the control of the control unit 7. As a result, the processing light EL is irradiated onto the molding material M in the space between the material nozzle 64 and the molding surface MS.

[0093] Here, in the space between the material nozzle 64 and the build surface MS, the surface that intersects (is perpendicular to) the direction in which the material nozzle 64 and the build surface MS face each other (the Z-axis direction) is defined as the material supply surface PL. Of the multiple material supply surfaces PL between the material nozzle 64 and the build surface MS, the surface on which the build material M is irradiated with processing light EL is defined as the material irradiation surface ES. The processing system SYS irradiates the material irradiation surface ES with processing light EL and supplies the build material M to the material irradiation surface ES. However, since the material irradiation surface ES is not a physical surface, the processing light EL irradiated onto the material irradiation surface ES passes through the material irradiation surface ES, and the build material M supplied to the material irradiation surface ES also passes through the material irradiation surface ES. Since the build material M passes through the material supply surface PL, the material supply surface PL may also be called the material passage surface.

[0094] When the molding material M is irradiated with processing light EL on the material irradiation surface ES, the molding material M melts on the material irradiation surface ES. The molten molding material M on the material irradiation surface ES is supplied from the material irradiation surface ES to the molding surface MS. As a result, the molten molding material M on the material irradiation surface ES adheres to the molding surface MS. Subsequently, the molding material M supplied to the molding surface MS cools and solidifies. As a result, as shown in Figure 6(b), a molded object composed of the solidified molding material M is deposited on the molding surface MS.

[0095] The SYS machining system repeats a series of molding processes, including melting the molding material M on the material irradiation surface ES by irradiation with machining light EL, supplying the molten molding material M to the molding surface MS, and solidifying the molten molding material M on the molding surface MS, while moving the machining head 22 relative to the molding surface MS. In particular, the SYS machining system repeats the series of molding processes while moving the machining head 22 along at least one of the X-axis and Y-axis directions relative to the molding surface MS. In this case, as the machining head 22 moves, a molded object having a width along a direction intersecting the direction of movement of the machining head 22 is molded on the molding surface MS. As a result, a structural layer SL corresponding to a molded object, which is an aggregate of the molten and solidified molding material M, is molded on the molding surface MS. The structural layer SL corresponding to an aggregate of molded objects molded on the molding surface MS is molded in a pattern corresponding to the movement trajectory of the machining head 22. In other words, in a plan view, a structural layer SL having a shape corresponding to the movement trajectory of the machining head 22 is molded.

[0096] When such a second fabrication operation is performed, the object having the fabrication surface MS on its surface (e.g., workpiece W or structural layer SL) is hardly directly melted by the processing light EL. Therefore, the time required for the molten fabrication material M to cool and solidify is shortened. Consequently, the time required to fabricate the three-dimensional structure ST in the second fabrication operation is shorter compared to the first fabrication operation which is performed by forming a molten pool MP. In other words, the fabrication speed in the second fabrication operation is faster than the fabrication speed in the first fabrication operation, allowing for high-speed fabrication of the three-dimensional structure ST.

[0097] Thus, because the second fabrication operation can fabricate three-dimensional structures ST at high speed, the second fabrication operation may be referred to as a fabrication operation compliant with the Extreme High Speed ​​Application (EHLA). The second fabrication operation may be considered to be a fabrication operation compliant with the Extreme High Speed ​​Application (EHLA).

[0098] Even when a second molding operation is performed, the processing system SYS may deflect the processing light EL using galvanometer mirrors 41#16 and 41#26, similar to when a first molding operation is performed. In this case, the processing system SYS may move the beam passage region PA through which the processing light EL passes within a virtual material irradiation surface ES that intersects the Z-axis between the material nozzle 64 and the molding surface MS by deflecting the processing light EL using galvanometer mirrors 41#16 and 41#26.

[0099] (3) Material Nozzle Next, the material nozzle 64 will be described.

[0100] As mentioned above, a tungsten-containing material may be used as the molding material M (in other words, the material of the workpiece W). That is, a relatively hard material may be used as the molding material M. When a relatively hard material is used as the molding material M, the material nozzle 64 (for example, the part that forms the flow path for the molding material M) wears out relatively quickly.

[0101] As described above, the material nozzle 64 may inject the molding material M, which has been transported by pressurized gas, onto the workpiece W. When the material nozzle 64 is not worn, the flow of the molding material M injected from the material nozzle 64 is relatively focused. In contrast, when the material nozzle 64 is worn, the flow of the molding material M injected from the material nozzle 64 becomes relatively diffused. Therefore, when the material nozzle 64 is worn, the molding accuracy of the molded object may decrease. Accordingly, in order to maintain the desired molding accuracy, it is necessary to replace the worn material nozzle 64. Here, if the wear resistance of the material nozzle 64 is relatively low, the frequency of replacement of the material nozzle 64 may increase, potentially increasing running costs.

[0102] In view of the above circumstances, in this embodiment, the tubular portion (tube) that forms the flow path for the molding material M of the material nozzle 64 is made of ceramics. Ceramics are harder than metallic materials such as tungsten. For this reason, the material nozzle 64 having a tubular portion made of ceramics can be said to have relatively high wear resistance. For example, alumina (aluminum oxide) may be used as the ceramic that forms the tubular portion.

[0103] The material nozzle 64 will be described with reference to Figures 7 to 9. Figure 7 is a diagram showing the material nozzle according to the embodiment. Figure 8 is a cross-sectional view showing the cross-section of the material nozzle according to the embodiment. Specifically, Figure 8 is a cross-sectional view of the material nozzle 64 shown in Figure 7, cut by a plane parallel to the Y-Z plane. Figure 9 is an enlarged cross-sectional view showing the tip of the material nozzle according to the embodiment.

[0104] As shown in Figure 8, the material nozzle 64 has a tip portion 64a and a main body portion 64b that holds the tip portion 64. That is, the tip portion 64a is configured to be separable from the main body portion 64b. The tip portion 64a may be held in place by the main body portion 64b by a collet chuck. As shown in Figures 8 and 9, the tip portion 64a has a tubular portion (tube) 641 that forms a flow path 643 for the powdered molding material M, and a cover portion (cover) 642 that covers the tubular portion 641. The flow path 643 may also be referred to as the supply path for the molding material M.

[0105] As shown in Figure 9, the tube portion 641 has an opening 641b for releasing the molding material M. In other words, the tube portion 641 has an end that forms the opening 641b. As shown in Figure 9, the cover portion 642 covers the end face 641a of the end of the tube portion 641 that forms the opening 641b. Therefore, the tip portion 64a is composed of a tube portion 641 having an opening 641b for releasing the molding material M, and a cover portion 642 that covers the end face 641a of the end of the tube portion 641 that forms the opening 641b.

[0106] Herein, the inventor's research has revealed the following: For example, when the entire tip of the material nozzle 64 (corresponding to the tip 64a) is formed of ceramics, debris tends to adhere to the vicinity of the opening (corresponding to the opening 641b) from which the molding material M is released. "Debris" refers to at least one of molten metal, spatter, and fumes. The inventor believes that one reason for the adhesion of debris is the relatively low thermal conductivity of ceramics.

[0107] In this embodiment, as described above, the cover portion 642 covers the end face 641a of the tubular portion 641, which is made of ceramics. Here, the cover portion 642 is made of a material (for example, metal) with a higher thermal conductivity than the ceramics forming the tubular portion 641. By configuring it in this way, in this embodiment, the adhesion of debris to the tip portion 64a can be suppressed.

[0108] As shown in Figure 9, the cover portion 642 extends in the -Z direction beyond the end of the pipe portion 641. The portion of the cover portion 642 that extends in the -Z direction beyond the end of the pipe portion 641 can be said to protrude from the end of the pipe portion 641. For this reason, this portion may be called a projection. The cover portion 642 covers the pipe portion 641 from its outer circumference. In other words, the cover portion 642 has an inner wall that surrounds the pipe portion 641. For this reason, the above portion (in other words, the projection) can be said to have a cylindrical shape. As shown in Figure 9, the inner wall of the cover portion 642 that surrounds the pipe portion 641 has a trumpet shape in which the inner diameter expands in the -Z direction (in other words, from the upstream side to the downstream side of the flow path 643 of the molding material M). In other words, the inner wall of the projection has a trumpet shape.

[0109] As described above, the inner wall of the tube portion 641, for example, is worn down by the molding material M. The trumpet shape of the inner wall of the cover portion 642 suppresses interaction between the molding material M and the inner wall of the cover portion 642. In other words, the trumpet shape of the inner wall of the cover portion 642, which expands in diameter in the -Z direction, suppresses wear of the inner wall of the cover portion 642 by the molding material M. For this reason, the material forming the cover portion 642 may be a material with lower hardness than the ceramics forming the tube portion 641. In other words, the hardness of the tube portion 641 may be higher than the hardness of the cover portion 642.

[0110] Furthermore, molten molding material M, which is affected by the processing light EL, may fly onto the cover portion 642. To prevent deformation of the cover portion 642 due to the molten molding material M, the material forming the cover portion 642 may be a material with a higher melting point than the molding material M (for example, a metal). In other words, the cover portion 642 may be formed from a material with a higher melting point than the molding material M.

[0111] An example of the size of the tip nozzle 64a will be described. The inner diameter D1 of the tube portion 641 shown in Figure 9 may be 3 to 15 times the diameter of the powdered molding material M. The length L1 of the tube portion 641 shown in Figure 9 may be 10 times or more, preferably 30 times or more, the inner diameter D1 of the tube portion 641. According to the inventor's research, it has been found that if the length L1 of the tube portion 641 is 10 times or more the inner diameter D1 of the tube portion 641, the convergence of the molding material M injected from the material nozzle 64 will be sufficient to meet the desired molding accuracy. Furthermore, it has been found that if the length L1 is 30 times or more the inner diameter D1, the convergence of the molding material M injected from the material nozzle 64 will be extremely good. In addition, the length L1 of the tube portion 641 may be 26 times or more the length L2 of the projection of the cover portion 642 (i.e., the portion of the cover portion 642 that extends in the -Z direction beyond the end of the tube portion 641). By making the length L2 sufficiently shorter than the length L1, the protrusion of the cover portion 642 can be prevented from affecting the convergence of the molding material M injected from the material nozzle 64.

[0112] As described above, the tip portion 64a of the material nozzle 64 has a cover portion 642 that covers the end face 641a of the tube portion 641, thereby suppressing the adhesion of debris to the tip portion 64a. In addition, the wear resistance of the tip portion 64a can be improved by forming the tube portion 641 from ceramics (for example, alumina). As a result, the processing system SYS equipped with a material nozzle 64 having a tip portion 64a can fabricate objects with the desired fabrication accuracy, even when using relatively hard fabrication materials M such as tungsten-containing materials.

[0113] When the tubular portion 641 of the tip portion 64a is formed of ceramics, the inner surface of the tubular portion 641 is less likely to be polished by the flowing molding material M compared to when the tubular portion 641 is formed of metal. This suppresses a decrease in the convergence of the molding material M at positions away from the opening 641b of the tubular portion 641, even when the molding material M is supplied through the tubular portion 641 for a long time. Consequently, because the inner surface of the tubular portion 641 is less likely to be polished by the flowing molding material M, when the tubular portion 641 of the tip portion 64a is formed of ceramics, it is possible to increase the pumping pressure when pumping the molding material M compared to when the tubular portion 641 is formed of metal. Therefore, by increasing the pumping pressure when pumping the molding material M, the convergence of the molding material M at positions away from the opening 641b of the tubular portion 641 can be improved. As a result, when the tube portion 641 is formed of ceramics, the distance between the material nozzle 64 and the molding surface MS or material irradiation surface ES can be made longer compared to when the tube portion 641 is formed of metal.

[0114] For example, as shown in Figure 10, when the tube portion 641 is made of metal, the distance between the material nozzle 64 and the build surface MS or material irradiation surface ES may be distance D2. For example, as shown in Figure 11, when the tube portion 641 is made of ceramics, the distance between the material nozzle 64 and the build surface MS or material irradiation surface ES may be a longer distance D3 than distance D2. In this way, by making the tube portion 641 out of ceramics, the distance between the material nozzle 64 and the build surface MS or material irradiation surface ES can be made relatively longer. As a result, the adhesion of dust to the tip portion 64a of the material nozzle 64 can be further suppressed. Figure 10 is a diagram showing an example of the arrangement of the material nozzle. Figure 11 is a diagram showing another example of the arrangement of the material nozzle.

[0115] (4) Modifications In the above description, the processing unit 2 changes the emission direction of the processing light EL using galvanometer mirrors 46#1 and 46#2. However, the processing unit 2 may change the emission direction of the processing light EL using an optical system (optical component) different from galvanometer mirrors 46#1 and 46#2. For example, the processing unit 2 may change the emission direction of the processing light EL using at least one of a polygon mirror and a resonant mirror. For example, the processing unit 2 may change the emission direction of the processing light EL using a resonant scanner that causes a mirror supported from both ends by a pair of torsion bars to vibrate resonantly. For example, the processing unit 2 may change the emission direction of the processing light EL using an acoustic optical deflector (AOD).

[0116] In the above description, the processing unit 2 is equipped with multiple galvanometer mirrors (galvanometer mirrors 46#1 and 46#2) to change the emission direction of multiple processing light ELs. However, the processing unit 2 may also have multiple processing light ELs incident on a single galvanometer mirror, thereby changing the emission direction of multiple processing light ELs collectively.

[0117] In the above description, the processing unit 2 irradiates the workpiece W with multiple processing lights EL (processing lights EL#1 and EL#2). However, the processing unit 2 may irradiate the workpiece W with a single processing light EL. In this case, the irradiation device 21 of the processing unit 2 may be equipped with a single galvanometer mirror (for example, a set of one X-scanning mirror and one Y-scanning mirror) to change the emission direction of the single processing light EL (and consequently change the irradiation position of the single processing light EL). In other words, the irradiation device 21 of the processing unit 2 may not be equipped with a second optical system 41#2. Alternatively, the irradiation device 21 of the processing unit 2 may not be equipped with a focusing optical system 50, or a prism mirror 51 of the focusing optical system 50, and the second optical system 41#2. In this case, the processing light EL#1 of the first optical system 41#1 is incident on the fθ lens 52 of the focusing optical system 50, or on the molding surface MS. The irradiation optical system 41 of the processing unit 2 may include either one X-scanning mirror and one Y-scanning mirror to change the emission direction of a single processing light EL, but may not include the other of the two.

[0118] In the above description, the control unit 7 controls at least one of the galvanometer mirrors 46#1 and 46#2 so that the irradiation area EA moves within the processing unit area PUA set on the build surface MS, and controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the processing unit area PUA moves on the build surface MS, thereby creating an object on the build surface MS that extends along the direction of movement of the processing unit area PUA on the build surface MS. However, the control unit 7 may also control the processing unit 2 so that an object having a desired shape pattern is created within the processing unit area PUA.

[0119] In the above description, the processing unit 2 melts the molding material M by irradiating it with processing light EL. However, the processing unit 2 may also melt the molding material M by irradiating it with any energy beam. Examples of any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of a charged particle beam include at least one of an electron beam and an ion beam.

[0120] In the above description, the processing system SYS performs additive processing. However, the processing system SYS may perform removal processing in addition to or instead of additive processing. Removal processing may include processing to remove a portion of the workpiece W by irradiating it with processing light EL. For example, the processing system SYS may perform additive processing on the workpiece W using at least one of processing light EL#1 and EL#2, and then perform removal processing on the workpiece W that has been processed with additive processing using at least one of processing light EL#1 and EL#2. As another example, the processing system SYS may perform additive processing on a first portion of the workpiece W using either processing light EL#1 or EL#2, while simultaneously performing removal processing on a second portion of the workpiece W that is different from the first portion using either processing light EL#1 or EL#2. In other words, the processing system SYS may perform additive processing and removal processing simultaneously. If the processing system SYS does not need to perform additive processing and removal processing simultaneously, the processing system SYS may perform both additive processing and removal processing using the same processing light EL.

[0121] The processing system SYS may perform a remelt process in addition to at least one of additive processing and removal processing. Remelt processing may include a process to melt the surface of the workpiece W once and reduce the flatness of the surface of the workpiece W (reduce surface roughness, make the surface closer to flat). As an example, the processing system SYS may perform at least one of additive processing and removal processing on the workpiece W using at least one of processing lights EL#1 and EL#2, and then perform a remelt process on the workpiece W (or the object formed on the workpiece W by the additive processing) using at least one of processing lights EL#1 and EL#2. As another example, the processing system SYS may perform at least one of additive processing and removal processing on a first part of the workpiece W using either processing light EL#1 or EL#2, while performing a remelt process on a second part of the workpiece W that is different from the first part using either processing light EL#1 or EL#2. In other words, the processing system SYS may perform at least one of the additive processing and removal processing and the remelt processing simultaneously. If the processing system SYS does not need to perform at least one of the additive processing and removal processing and the remelt processing simultaneously, the processing system SYS may perform at least one of the additive processing and removal processing and the remelt processing using the same processing light EL.

[0122] The processing unit 2 (processing head 22) described above may be attached to a robot (typically an articulated robot). If the processing head 22 is moved by a robot, the head drive mechanism 23 may be a robot. For example, the processing unit 2 (processing head 22) may be attached to a welding robot for welding. For example, the processing unit 2 (processing head 22) may be attached to a self-propelled mobile robot. A self-propelled mobile robot may include, for example, a self-propelled device such as an AGV (Automatic Guided Vehicle) or AMR (Autonomous Mobile Robot) and a robot arm provided on the self-propelled device.

[0123] At least some of the constituent elements of each embodiment described above can be appropriately combined with at least some other constituent elements of each embodiment described above. Some of the constituent elements of each embodiment described above may not be used. Furthermore, to the extent permitted by law, all of the published patents and U.S. patent disclosures cited in each embodiment described above shall be incorporated into the text.

[0124] The present invention is not limited to the embodiments described above, and can be modified as appropriate without contradicting the gist or idea of ​​the invention as can be read from the claims and specification as a whole. Molding apparatuses and material supply members with such modifications are also included in the technical scope of the present invention.

[0125] SYS Processing System 2 Processing Unit 3 Stage Unit 4 Irradiation Unit 6 Material Supply Unit 7 Control Unit 20 Head Unit 21 Irradiation Device 22 Processing Head 40 Light Source Unit 71 Calculation Unit 72 Memory Device W Workpiece M Molding Material MS Molding Surface EL Processing Light

Claims

1. A molding apparatus comprising: an irradiation device for irradiating an object with an energy beam; and a supply device for supplying powdered molding material to the irradiation position of the energy beam on the object, wherein the supply device comprises: a tube that forms a supply path for the molding material and has an opening at one end for releasing the molding material; and a cover that covers the end face of the one end of the tube.

2. The molding apparatus according to claim 1, wherein the hardness of the tube is higher than the hardness of the cover.

3. The molding apparatus according to claim 1 or 2, wherein the tube is a member formed of ceramics.

4. The molding apparatus according to claim 3, wherein the tube is a member formed of alumina.

5. The molding apparatus according to any one of claims 1 to 4, wherein the cover is a component made of a metal with a higher melting point than the molding material.

6. The molding apparatus according to any one of claims 1 to 5, wherein the length of the tube is 10 times or more the inner diameter of the tube.

7. The molding apparatus according to any one of claims 1 to 5, wherein the length of the tube is 30 times or more the inner diameter of the tube.

8. The molding apparatus according to any one of claims 1 to 7, wherein the inner diameter of the tube is 3 to 15 times the diameter of the molding material.

9. The molding apparatus according to any one of claims 1 to 8, wherein the cover has a projection extending in the direction in which the pipe extends beyond one end of the pipe.

10. The molding apparatus according to claim 9, wherein the projection has a cylindrical shape.

11. The molding apparatus according to claim 10, wherein the projection has a shape in which the inner diameter expands from the other end of the pipe toward the one end.

12. The molding apparatus according to claim 10 or 11, wherein the length of the tube is 26 times or more the length of the projection.

13. A molding apparatus comprising: an irradiation device for irradiating an object with an energy beam; and a supply device for supplying powdered molding material to the irradiation position of the energy beam on the object, wherein the supply device has a tube that forms a supply path for the molding material and has an opening at one end for releasing the molding material, and the tube is a member made of alumina.

14. The molding apparatus according to claim 13, wherein the length of the tube is 10 times or more the inner diameter of the tube.

15. The molding apparatus according to claim 13, wherein the length of the tube is 30 times or more the inner diameter of the tube.

16. The molding apparatus according to any one of claims 13 to 15, wherein the inner diameter of the tube is 3 to 15 times the diameter of the molding material.

17. A material supply member comprising: a tube that forms a supply path for powdered molding material and has an opening at one end for releasing the molding material; and a cover that covers the end face of the one end of the tube.

18. The material supply member according to claim 17, wherein the hardness of the pipe is higher than the hardness of the cover.

19. The material supply member according to claim 17 or 18, wherein the tube is a member formed of ceramics.

20. The material supply member according to any one of claims 17 to 19, wherein the pipe is a member formed of alumina.

21. The molding apparatus according to any one of claims 17 to 20, wherein the cover is a component made of a metal with a higher melting point than the molding material.

22. The material supply member according to any one of claims 17 to 21, wherein the length of the pipe is 10 times or more the inner diameter of the pipe.

23. The material supply member according to any one of claims 17 to 22, wherein the length of the pipe is 30 times or more the inner diameter of the pipe.

24. The material supply member according to any one of claims 17 to 23, wherein the inner diameter of the pipe is 3 to 15 times the diameter of the molding material.

25. The material supply member according to any one of claims 17 to 24, wherein the cover has a projection extending in the direction in which the pipe extends beyond the one end of the pipe.

26. The material supply member according to claim 25, wherein the projection has a cylindrical shape.

27. The material supply member according to claim 26, wherein the projection has a shape in which the inner diameter expands from the other end of the pipe toward the one end.

28. The material supply member according to claim 26 or 27, wherein the length of the pipe is 26 times or more the length of the projection.

29. A material supply member comprising a tube made of alumina, which forms a supply path for powdered molding material and has an opening at one end for discharging the molding material.

30. The material supply member according to claim 29, wherein the length of the pipe is 10 times or more the inner diameter of the pipe.

31. The material supply member according to claim 29, wherein the length of the pipe is 30 times or more the inner diameter of the pipe.

32. The material supply member according to any one of claims 29 to 31, wherein the inner diameter of the pipe is 3 to 15 times the diameter of the molding material.

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