Molded body and method for manufacturing molded body

Abstract

This molded body 1 comprises a support body 10, an electrically conductive wiring portion 30, and a bonding layer 20 that bonds the wiring portion 30 and the support body 10. The support body 10 includes a molded base material 11 that is molded into a three-dimensional shape, and a flexible reinforcing base material 12. The wiring portion 30 includes: a first conductor layer 31 that is bonded to the bonding layer 20, and contains a binder resin and a plurality of electrically conductive particles that are dispersed in the binder resin; and a second conductor layer 32 that is formed on the first conductor layer 31 and is composed of a first metal material.

Description

Molded article and method for manufacturing a molded article

[0001] The present invention relates to a molded article having a three-dimensional shape and a method for manufacturing a molded article. In the designated countries where incorporation by reference is permitted, the contents described in Japanese Patent Application No. 2024-189914, filed in Japan on October 29, 2024, are incorporated herein by reference and constitute part of this specification.

[0002] As a three-dimensional molded circuit board, a MID (Molded Interconnect Device) substrate is known in which a circuit pattern is directly formed on the surface of a three-dimensional structure (see, for example, Patent Document 1). This MID substrate comprises a metal three-dimensional molded body, an insulating layer formed on the surface of the metal three-dimensional molded body, and a conductive layer which is a circuit pattern formed on the surface of the insulating layer (see, for example, Patent Document 1 (paragraph

[0023] and Figure 1)).

[0003] Japanese Patent Publication No. 2019-186432

[0004] Membranes and flexible printed circuit boards (FPCs) have a tail section that is used for electrical connection to external components. This tail section needs to be flexible, and its thickness needs to be thin to accommodate connectors such as ZIF (Zero Insertion Force) connectors.

[0005] However, in the conventional MID substrate described above, the circuit pattern is formed directly on a three-dimensional structure, and since this three-dimensional structure has low flexibility and is difficult to thin, it is difficult to form the tail portion described above on this MID substrate. For this reason, there is a problem in that it is not easy to directly connect a molded substrate such as a MID substrate to the outside.

[0006] The problem that this invention aims to solve is to provide a molded body that can be easily connected to the outside.

[0007] [1] One aspect of the present invention is a molded body comprising a support, a conductive wiring portion, and a bonding layer that joins the wiring portion and the support, wherein the support includes a molded base material formed into a three-dimensional shape and a flexible reinforcing base material, and the wiring portion is bonded to the bonding layer and comprises a first conductor layer including a binder resin and a plurality of conductive particles dispersed in the binder resin, and a second conductor layer formed on the first conductor layer and composed of a first metal material.

[0008] [2] In embodiment 2 of the present invention, the molded body of embodiment 1 may have an electrical resistivity of the second conductor layer that is smaller than the electrical resistivity of the first conductor layer.

[0009] [3] Embodiment 3 of the present invention is a molded body of Embodiment 1 or 2 in which the second conductive layer covers the entire area of ​​the first conductive layer in a plan view.

[0010] [4] Embodiment 4 of the present invention is a molded body according to any of embodiments 1 to 3 in which the elongation at break of the first conductor layer is greater than the elongation at break of the second conductor layer.

[0011] [5] Embodiment 5 of the present invention is a molded body according to any of embodiments 1 to 4, wherein the wiring portion is formed in the portion of the second conductor layer corresponding to the reinforcing substrate and further includes a third conductor layer made of a second metal material different from the first metal material.

[0012] [6] Embodiment 6 of the present invention is a molded body of any of embodiments 1 to 5 in which the thickness of the reinforcing base material is thinner than the thickness of the molded base material.

[0013] [7] Embodiment 7 of the present invention is a molded body in which the Young's modulus of the reinforcing material is lower than that of the molded base material, in any of embodiments 1 to 6.

[0014] [8] Embodiment 8 of the present invention is a molded body in which, in any of embodiments 1 to 7, the elongation at break of the reinforcing material is greater than the elongation at break of the molded base material.

[0015] [9] Embodiment 9 of the present invention is a molded body according to any of embodiments 1 to 8, wherein the molded body further comprises a first insulating layer disposed in the bonding layer in a portion corresponding to the molded substrate so as to cover the second conductive layer.

[0016]

[10] Embodiment 10 of the present invention is a molded body according to any of embodiments 1 to 9, wherein the molded body further comprises a flexible second insulating layer disposed in the bonding layer in a portion corresponding to the reinforcing substrate so as to cover the second conductor layer.

[0017]

[11] Embodiment 11 of the present invention is a molded body according to any of embodiments 1 to 10, wherein the molded body comprises a main body portion molded into a three-dimensional shape and a tail portion extending from the main body portion and having a width narrower than the width of the main body portion, wherein the molded base material is arranged in the main body portion and the reinforcing base material is arranged in the tail portion.

[0018]

[12] Aspect 12 of the present invention is a method for manufacturing a molded body, comprising: a first step of preparing a film member comprising: a first conductor layer comprising a binder resin and a plurality of conductive particles dispersed in the binder resin; a bonding layer bonded to the first conductor layer; a molded base material bonded to the bonding layer; and a reinforcing base material that is bonded to the bonding layer and is flexible; a second step of molding the molded base material into a three-dimensional shape; and a third step of forming a second conductor layer made of a first metal material on the first conductor layer by electroplating.

[0019]

[13] Aspect 13 of the present invention is a method for manufacturing a molded body according to aspect 12, wherein the first step includes forming the first conductive layer and the bonding layer on a release film, and the method for manufacturing the molded body further comprises a fourth step of peeling the release film from the first conductive layer and the bonding layer.

[0020] The molded body of the present invention can utilize a flexible reinforcing base material and a first conductive layer containing a binder resin as a tail portion, thereby improving the ease of external connection.

[0021] Furthermore, in the molded body of the present invention, the wiring portion includes a second conductor layer made of a first metal material in addition to the first conductor layer, so that the increase in electrical resistance caused by the binder resin contained in the first conductor layer can be suppressed.

[0022] Furthermore, in this invention, after molding the first conductor layer, the bonding layer, and the molded base material into a three-dimensional shape, a second conductor layer is formed on the first conductor layer which has a three-dimensional shape. As a result, the second conductor layer is formed into a three-dimensional shape following the first conductor layer without being pressurized, so that the second conductor layer does not experience wire breakage caused by distortion due to pressure during molding.

[0023] Figure 1 is a cross-sectional view showing a molded body in an embodiment of the present invention. Figure 2 is a plan view showing a molded body in an embodiment of the present invention. Figure 3 is an enlarged cross-sectional view showing a wiring section in an embodiment of the present invention. Figures 4(a) to 4(f) are cross-sectional views illustrating a first method for manufacturing a molded body in an embodiment of the present invention. Figures 5(a) to 5(f) are cross-sectional views illustrating a second method for manufacturing a molded body in an embodiment of the present invention. Figures 6(a) to 6(g) are cross-sectional views illustrating a third method for manufacturing a molded body in an embodiment of the present invention. Figures 7(a) to 7(g) are cross-sectional views illustrating a method for manufacturing a modified example of a molded body in an embodiment of the present invention.

[0024] Embodiments of the present invention will be described below with reference to the drawings.

[0025] Figure 1 is a cross-sectional view showing the molded body 1 in this embodiment, and Figure 2 is a plan view showing the molded body 1 in this embodiment.

[0026] In this embodiment, the molded body 1 is a substrate that is attached to a module having a three-dimensional shape, and is molded to a three-dimensional shape corresponding to the module. The module is not particularly limited, but may be a home appliance or an in-vehicle product, etc.

[0027] As shown in Figure 1, the molded body 1 comprises a main body portion 1a and a tail portion 1b. As shown in Figure 2, the main body portion 1a in this embodiment has a rectangular shape. The main body portion 1a is a part molded into a three-dimensional shape, and the main body portion 1a in this embodiment has a three-dimensional shaped portion 1c. This three-dimensional shaped portion 1c is not particularly limited, but includes a convex shape that protrudes in the +Z direction. The three-dimensional shaped portion 1c is not particularly limited, but is formed by a molding method such as vacuum forming or press forming. Note that the shape of the three-dimensional shaped portion 1c is not limited to this and can be changed according to the module to which it is attached.

[0028] As shown in Figure 2, the tail portion 1b has a strip shape that is narrower in width (length along the Y direction in the figure) than the main body portion 1a. In this embodiment, the tail portion 1b is integrally formed with the main body portion 1a and extends from the main body portion 1a. This tail portion 1b has high flexibility and is used as a connection part to external equipment or other wiring boards.

[0029] As shown in Figure 1, the molded body 1 comprises a support 10, a bonding layer 20, a wiring section 30, and an insulating layer 40. The support 10 supports the wiring section 30 via the bonding layer 20. In this embodiment, the support 10 includes a molded base material 11 and a reinforcing base material 12.

[0030] The molded substrate 11 is placed on the main body portion 1a of the molded body 1. The molded substrate 11 is a resin sheet having a rectangular planar shape. Examples of the resin material constituting this molded substrate 11 include thermoplastic resins that soften at temperatures of approximately 100°C to 200°C. The thermoplastic resin constituting the molded substrate 11 is not particularly limited, but examples include polycarbonate (PC), acrylonitrile butadiene styrene (ABS) resin, acrylic resin, cyclic olefin resin, polyester (PEs), or polyarylate (PAR).

[0031] The molded base material 11 in this embodiment is molded into a convex shape protruding in the +Z direction and constitutes a part of the three-dimensional shape portion 1c. The molded base material 11 is not particularly limited, but after being heated to the above-mentioned softening temperature, it is molded into a predetermined three-dimensional shape by a mold or the like, and then solidified while maintaining the three-dimensional shape by cooling. The bonding layer 20 and the first conductor layer 31 (described later) are deformed following the molded base material 11 during the molding of the molded base material 11. Then, the bonding layer 20 and the first conductor layer 31 are maintained in a three-dimensional shape following the three-dimensional shape of the molded base material 11 after solidification.

[0032] The reinforcing base material 12 is disposed in the tail portion 1b of the molded body 1 and has a strip shape having the same width as the tail portion 1b in plan view. This reinforcing member 12 is not molded and has high flexibility. The material constituting this reinforcing base material 12 is not particularly limited, but polyethylene terephthalate (PET) etc. can be exemplified.

[0033] Further, the thickness T of the reinforcing base material 12 ２ is thinner than the thickness T of the molded base material 11 １ (T ２ < T １ ). Therefore, since the reinforcing base material 12 is easier to bend than the molded base material 11, the flexibility of the tail portion 1b of the molded body 1 can be made higher than the flexibility of the main body portion 1a. Also, since the reinforcing base material 12 is thin, the thickness of the tail portion 1b can be made thin. Therefore, the thickness of the tail portion 1b can be made a thickness corresponding to a connector such as a ZIF connector.

[0034] Further, in this embodiment, the elongation at break A of the reinforcing base material 12 ２ is larger than the elongation at break A of the molded base material 11 １ (MPa·%) (A ２ > A １ ). Therefore, since the reinforcing base material 12 is strong against elongation, breakage of the tail portion 1b of the molded body 1 can be suppressed.

[0035] Incidentally, the elongation at break A １ , A ２It can be measured using a measurement method conforming to JIS K 7161-1 and JIS K 7161-2. Although not particularly limited, for example, using a tensile test apparatus in a thermostatic chamber manufactured by Shimadzu Corporation, the elongation at break of a test piece made of the same material as the molding base material 11 and the elongation at break of a test piece made of the same material as the reinforcing base material 12 may be measured in a thermostatic chamber with the ambient temperature set to 100°C.

[0036] Also, in the present embodiment, the Young's modulus E of the reinforcing base material 12 ２ is smaller than the Young's modulus E of the molding base material 11 １ (E ２ < E １ ). Generally, as the Young's modulus decreases, the rigidity decreases. Therefore, when such a relationship of the Young's modulus is satisfied, the reinforcing base material 12 is softer than the molding base material 11. For this reason, the flexibility of the tail portion 1b can be made higher than the flexibility of the main body portion 1a.

[0037] The bonding layer 20 bonds the support 10 and the wiring portion 30. The bonding layer 20 is formed on the molding base material 11 and is also formed on the reinforcing base material 12. That is, this bonding layer 20 is formed on both the main body portion 1a and the tail portion 1b. The bonding layer 20 in the present embodiment has a convex shape corresponding to the molding base material 11 on the molding base material 11 and constitutes a part of the three-dimensional shape portion 1c.

[0038] This bonding layer 20 includes an adhesive material layer 21 and a resist layer 22. The adhesive material layer 21 is in direct contact with the molding base material 11 and the reinforcing base material 12. This adhesive material layer 21 is composed of a resin material having adhesiveness. The resin material constituting the adhesive material layer 21 is not particularly limited, and examples thereof include acrylic resins.

[0039] A resist layer 22 is formed on the adhesive layer 21. This resist layer 22 is in direct contact with the wiring portion 30. This resist layer 22 is made of a resist material. The resist material constituting the resist layer 22 is not particularly limited, but examples include urethane acrylate resin, polyester resin, polyurethane resin, etc. In addition to the above resist material, the resist layer 22 may also contain talc or silica, etc.

[0040] A wiring section 30 is formed on the bonding layer 20. The wiring section 30 is a conductive circuit. In this embodiment, the wiring section 30 has a convex shape in the main body 1a that corresponds to the molded base material 11, and constitutes a part of the three-dimensional shape section 1c.

[0041] As shown in Figure 2, the wiring section 30 in this embodiment is not particularly limited, but includes an electrode section 30a and a lead-out section 30b. The electrode section 30a is formed on the main body section 1a. This electrode section 30a is not particularly limited, but may be a sensor electrode such as a capacitance sensor.

[0042] The lead-out portion 30b is formed on the tail portion 1b. This lead-out portion 30b is integrally formed with the electrode portion 30a. The lead-out portion 30b is connected to external equipment or other wiring boards, and electrically connects the external equipment or other wiring boards to the electrode portion 30a.

[0043] As shown in Figure 1, the wiring section 30 includes a first conductor layer 31, a second conductor layer 32, and a third conductor layer 33. The first conductor layer 31 is formed on the resist layer 22 and is formed on both the main body portion 1a and the tail portion 1b.

[0044] Figure 3 is an enlarged cross-sectional view showing the wiring section 30 in this embodiment. The first conductor layer 31 includes a plurality of conductive particles 311 and a binder resin 312. The plurality of conductive particles 311 are made of a conductive material and form current paths by contacting each other. In this way, the plurality of conductive particles 311 impart conductivity to the first conductor layer 31.

[0045] Examples of materials constituting the conductive particles 311 include metallic materials made from metals such as gold, silver, platinum, ruthenium, lead, tin, zinc, and bismuth, or alloys thereof, or non-metallic materials such as carbon. While Figure 3 illustrates the case where the conductive particles 311 are perfectly spherical, the design is not limited to this. The shape of the conductive particles may also be flaky or other shapes.

[0046] The binder resin 312 holds a plurality of conductive particles 311. The binder resin 312 is composed of a flexible resin material and imparts flexibility to the first conductive layer 31. The binder resin 312 is not particularly limited, but examples include polyester resin, phenolic resin, elastomer, etc. The elastomer is not particularly limited, but examples include acrylic rubber, urethane rubber, nitrile rubber, silicone rubber, fluororubber, etc.

[0047] Thus, since the first conductor layer 31 contains binder resin 312, the elongation at break of the first conductor layer 31 is A ３ The fracture elongation A of the second conductor layer 32 is... ４ It is larger than (A ３ > A ２ Therefore, since the first conductor layer 31 is resistant to elongation, it can follow the deformation of the molded base material 11 during molding, and the occurrence of fracture in the first conductor layer 31 can be suppressed.

[0048] Such a first conductive layer 31 is formed by curing a conductive paste. A specific example of the conductive paste is a conductive paste composed of a mixture of conductive particles 311, a binder resin 312, water or a solvent, and various additives.

[0049] Examples of solvents included in conductive pastes include butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, dipropylene glycol monobutyl ether, diethylene glycol monoethyl ether, cyclohexanone, isophorone, and terpineol.

[0050] As shown in Figure 1, the second conductor layer 32 is formed on the first conductor layer 31. The second conductor layer 32 covers the entire upper surface of the first conductor layer 31, and in a plan view, it covers the entire area of ​​the first conductor layer 31. Although not specifically shown, the second conductor layer 32 also covers the sides of the first conductor layer 31.

[0051] As shown in Figure 3, the second conductive layer 32 is made of a bulk first metallic material. This first metallic material is not particularly limited, but examples include copper, nickel, chromium, and tin. Such a second conductive layer 32 can be formed by electroplating the first conductive layer 31. Thus, the second conductive layer 32 is formed by electroplating and is made of a bulk first metallic material.

[0052] Thus, unlike the first conductor layer 31, the second conductor layer 32 is a bulk metal layer that does not contain binder resin. Therefore, the electrical resistivity ρ of the second conductor layer 32 is ２ The electrical resistivity ρ of the first conductor layer 31 is １ It is smaller than that. As a result, the second conductor layer 32 can reduce the electrical resistance of the wiring section 30 and suppress the voltage drop in the wiring section 30.

[0053] As shown in Figure 1, the third conductor layer 33 is formed on the second conductor layer 32 at the tail portion 1b. As shown in Figure 2, in this embodiment, the third conductor layer 33 is formed inside the notch 421 of the second insulating layer 42 (described later) and is exposed to the outside. This third conductor layer 33 is the part that is directly connected to an external connector or the like and protects the second conductor layer 32.

[0054] As shown in Figure 3, the third conductive layer 33 is made of a bulk second metallic material. This second metallic material is not particularly limited, but examples include gold and nickel. Such a third conductive layer 33 can be formed at the tail portion 1b by electroplating or electroless plating the second conductive layer 32.

[0055] Generally, the wettability of solder can deteriorate with respect to resin-containing portions. However, in this embodiment, the wettability is improved because the third conductive layer 33 is exposed to the outside and can be used as a connection portion with an external substrate or the like. As a result, the wiring portion 30 can be soldered.

[0056] The wiring section 30 does not necessarily have to include the third conductive layer 33. In this case, a portion of the second conductive layer 32 can be used as a connection portion to an external substrate or the like. Since this second conductive layer 32 is made of bulk metal, just like the third conductive layer 33, it has good solder wettability. Therefore, the wiring section 30 can be soldered.

[0057] As shown in Figures 1 and 2, the insulating layer 40 is formed on the bonding layer 20 so as to cover the wiring portion 30. However, the third conductor layer 33 of the wiring portion 30 is not covered by the insulating layer 40 and is exposed from the insulating layer 40. In this embodiment, the insulating layer 40 has a convex shape in the main body portion 1a corresponding to the molded base material 11 and constitutes a part of the three-dimensional shape portion 1c.

[0058] The insulating layer 40 includes a first insulating layer 41 and a second insulating layer 42. The first insulating layer 41 is formed on the bonding layer 20 in the main body portion 1a so as to cover the entire wiring portion 30. The first insulating layer 41 can be formed by applying a resin paste onto the bonding layer 20 and curing it. In this case, the material constituting the first insulating layer 41 is not particularly limited, but examples include polyester, polyurethane, acrylic, silicone, etc.

[0059] Alternatively, the first insulating layer 41 may be a housing formed by methods such as injection molding. In this case, the resin material constituting the first insulating layer 41 is not particularly limited, but examples include liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), etc.

[0060] The second insulating layer 42 is formed on the bonding layer 20 so as to cover a portion of the wiring portion 30 at the tail portion 1b. The second insulating layer 42 protects the second conductor layer 32 and also functions as a mask when the third conductor layer 33 is formed by plating. The second insulating layer 42 is made of a flexible material. The flexible material is not particularly limited, but examples include coverlay or tape.

[0061] In this embodiment, the Young's modulus E of the second insulating layer 42 ４ The Young's modulus E of the first insulating layer 41 is ３ It is smaller than (E ４ <E ３ Therefore, the flexibility of the tail portion 1b can be made higher than that of the main body portion 1a.

[0062] In this embodiment, the molded body 1 is provided with an insulating layer 40, but it is not limited to this, and it does not need to be provided with an insulating layer 40.

[0063] Next, the manufacturing method of the molded body 1 of this embodiment will be described with reference to Figures 4 to 6. The molded body 1 can be manufactured by any of the first manufacturing method, the second manufacturing method, and the third manufacturing method described below.

[0064] [First manufacturing method]

[0065] Figures 4(a) to 4(f) are cross-sectional views illustrating the first method for manufacturing the molded body 1 in this embodiment. First, as shown in Figure 4(a), a first conductive layer 31 is formed on the release film 200. The release film 200 is a resin film that has been subjected to a release treatment and is not particularly limited, but for example, a release-treated PET film can be used as the release film 200. The first conductive layer 31 can be formed by applying the conductive paste described above onto the release film 200 and curing the applied conductive paste.

[0066] Furthermore, a resist layer 22 is formed on the release film 200 so as to cover the first conductive layer 31. The resist layer 22 can be formed by applying the above-mentioned resist material onto the release film 200 and curing the applied resist material.

[0067] Next, as shown in Figure 4(b), an adhesive layer 21 is formed by laminating the above-mentioned adhesive material onto the resist layer 22. Then, the release film 200 is peeled off from the first conductor layer 31 and the resist layer 22. This step corresponds to an example of the "fourth step" in an embodiment of the present invention.

[0068] Next, as shown in Figure 4(c), the molded base material 11 is bonded to the adhesive layer 21, and the reinforcing base material 12 is bonded to the adhesive layer 21. The molded base material 11 is bonded to a position corresponding to the main body portion 1a. The reinforcing base material 12 is bonded to a position corresponding to the tail portion 1b. The laminate obtained by this process corresponds to an example of a "film member" in an embodiment of the present invention. Furthermore, the process up to this point corresponds to an example of a "first step" in an embodiment of the present invention.

[0069] Next, as shown in Figure 4(c), the molded base material 11 is molded by the molding die 300 at a position corresponding to the main body portion 1a, thereby forming the three-dimensional shape portion 1c as shown in Figure 4(d). Note that the reinforcing base material 12 is not molded at this time. This step corresponds to an example of the "second step" in the embodiment of the present invention.

[0070] Next, as shown in Figure 4(e), a second conductive layer 32 is formed on the first conductive layer 31 by electroplating. The second conductive layer 32 is formed over the entire area of ​​the first conductive layer 31. Furthermore, in the three-dimensional shape portion 1c, the second conductive layer 32 is formed in a convex shape corresponding to the convex shape of the three-dimensional shape portion 1c. This step corresponds to an example of the "third step" in the embodiment of the present invention.

[0071] Next, as shown in Figure 4(f), the first and second insulating layers 41 and 42 are formed on the resist layer 22 so as to cover the second conductor layer 32. In this embodiment, although not particularly limited, first the second insulating layer 42 is attached to the position corresponding to the tail portion 1b. Then, the resin paste described above is applied to the position corresponding to the main body portion 1a, and the applied resin paste is cured to form the first insulating layer 41.

[0072] Next, a third conductive layer 33 is formed on the second conductive layer 32 inside the notch 421 (see Figure 2) of the second insulating layer 42. As described above, the third conductive layer 33 is formed by electroplating or electroless plating. In this way, the molded body 1 in this embodiment is manufactured.

[0073] As described above, the molded body 1 in this embodiment includes a tail portion 1b comprising a flexible reinforcing base material 12 and a first conductor layer 31 containing a binder resin 312, thereby improving the ease of external connection.

[0074] Furthermore, in the molded body 1 of this embodiment, the wiring section 30 includes a second conductor layer 32 made of a first metal material in addition to the first conductor layer 31, so that the increase in the electrical resistance value of the wiring section 30 caused by the binder resin 312 can be suppressed.

[0075] Furthermore, in the molded body 1 of this embodiment, the first conductor layer 31, the bonding layer 20, and the molded base material 11 are molded into a three-dimensional shape, and then the second conductor layer 32 is formed by electroplating. Therefore, since the second conductor layer 32 is formed into a three-dimensional shape following the first conductor layer 31 without being subjected to heat and pressure during the molding process, no wire breakage occurs in the second conductor layer 32 due to distortion that occurs during molding.

[0076] Furthermore, in the manufacturing method of the MID substrate described in Patent Document 1, a circuit pattern is formed on the surface of the three-dimensional structure by electroless plating. Since the time required for this electroless plating is longer than the time required for electrolytic plating, this manufacturing method tends to be costly. Also, since electroless plating requires a catalyst, this manufacturing method tends to be costly. Moreover, since by-products tend to accumulate in electroless plating, the environmental burden tends to be large. In contrast, in this embodiment, the second conductor layer 32 of the wiring section 30 can be formed by electrolytic plating using the first conductor layer 31 as a seed layer, so that plating can be completed in a short time without using a catalyst. For this reason, the cost required to manufacture the molded body 1 can be reduced in this embodiment. Also, in this embodiment, the generation of by-products due to plating can be suppressed, and the environmental burden can be reduced.

[0077] [Second manufacturing method]

[0078] The second manufacturing method differs from the first manufacturing method in that, after forming a resist layer 22 on the release film 200, the first conductive layer 31 is formed on the resist layer 22. In the following description, the differences between the second manufacturing method and the first manufacturing method will be mainly explained, and detailed explanations of common steps will be omitted.

[0079] Figures 5(a) to 5(f) are cross-sectional views illustrating the second method for manufacturing the molded body 1 in this embodiment. First, as shown in Figure 5(a), a resist layer 22 is formed on the release film 200, and a first conductive layer 31 is formed on the formed resist layer 22.

[0080] Next, as shown in Figure 5(b), the release film 200 is peeled off from the resist layer 22. This step corresponds to an example of the "fourth step" in an embodiment of the present invention.

[0081] Next, as shown in Figure 5(c), an adhesive layer 21 is formed on the resist layer 22. Then, the molded substrate 11 and the reinforcing substrate 12 are bonded to the resist layer 22 via the adhesive layer 21. The steps up to this point correspond to an example of the "first step" in an embodiment of the present invention.

[0082] Next, the molded base material 11 is molded by the molding die 300 at a position corresponding to the main body portion 1a, thereby forming the three-dimensional shape portion 1c as shown in Figure 5(d). This step corresponds to an example of the "second step" in the embodiment of the present invention.

[0083] Next, as shown in Figure 5(e), a second conductive layer 32 is formed on the first conductive layer 31 by electroplating. This step corresponds to an example of the "third step" in an embodiment of the present invention.

[0084] Next, as shown in Figure 5(f), the first and second insulating layers 41 and 42 are formed on the resist layer 22 so as to cover the second conductive layer 32. Then, a third conductive layer 33 is formed on the second conductive layer 32 inside the notch 421 (see Figure 2) of the second insulating layer 42. As described above, the third conductive layer 33 is formed by electroplating or electroless plating. In this way, the molded body 1 in this embodiment is manufactured.

[0085] In this second manufacturing method, the first conductor layer 31, the bonding layer 20, and the molded substrate 11 are formed into a three-dimensional shape, and then the second conductor layer 32 is formed by electroplating. Therefore, since the second conductor layer 32 is formed into a three-dimensional shape following the first conductor layer 31 without being subjected to heat and pressure during the molding process, the second conductor layer 32 does not experience wire breakage due to distortion that occurs during molding.

[0086] [Third manufacturing method]

[0087] The third manufacturing method differs from the first manufacturing method in that the first conductive layer 31 is formed after the release film 200 is peeled off. In the following description, the differences between the third manufacturing method and the first manufacturing method will be mainly explained, and detailed explanations of common steps will be omitted.

[0088] Figures 6(a) to 6(g) are cross-sectional views illustrating the fourth method for manufacturing the molded body 1 in this embodiment. First, as shown in Figure 6(a), a resist layer 22 is formed on the release film 200.

[0089] Next, as shown in Figure 6(b), an adhesive layer 21 is formed on the resist layer 22.

[0090] Next, as shown in Figure 6(c), the molded base material 11 and the reinforcing base material 12 are bonded to the adhesive layer 21.

[0091] Next, as shown in Figure 6(d), a first conductive layer 31 is formed on the resist layer 22. The steps up to this point correspond to an example of the "first step" in an embodiment of the present invention.

[0092] Next, the molded base material 11 is molded using a molding die 300 to form a three-dimensional shape portion 1c, as shown in Figure 6(e). This step corresponds to an example of the "second step" in an embodiment of the present invention.

[0093] Next, as shown in Figure 6(f), a second conductive layer 32 is formed on the first conductive layer 31 by electroplating. The process shown in Figure 6(f) corresponds to an example of the "third step" in an embodiment of the present invention.

[0094] Next, as shown in Figure 6(g), the first and second insulating layers 41 and 42 are formed on the resist layer 22 so as to cover the second conductive layer 32. Then, a third conductive layer 33 is formed on the second conductive layer 32 inside the notch 421 (see Figure 2) of the second insulating layer 42. In this way, the molded body 1 in this embodiment is manufactured.

[0095] In this third manufacturing method, the first conductor layer 31, the bonding layer 20, and the molded substrate 11 are formed into a three-dimensional shape, and then the second conductor layer 32 is formed by electroplating. Therefore, since the second conductor layer 32 is formed into a three-dimensional shape following the first conductor layer 31 without being subjected to heat and pressure during the molding process, the second conductor layer 32 does not experience wire breakage due to distortion that occurs during molding.

[0096] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit it. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0097] For example, in the above embodiment, the reinforcing member 12 is directly bonded to the adhesive layer 21, but the invention is not limited to this. The adhesive layer 21 only needs to bond the molded substrate 11, and the reinforcing member 12 may be directly bonded to the resist layer 22. A method for manufacturing the molded body 1 in such a modified example will be described below.

[0098] [Manufacturing method for molded articles in modified examples]

[0099] This manufacturing method differs from the first manufacturing method in that, before peeling off the release film 200, the molded substrate 11 is attached to the adhesive layer 21, and the reinforcing substrate 12 is attached to the resist layer 22. The following description will mainly explain the differences between this manufacturing method and the first manufacturing method, and will omit detailed explanations of the common steps.

[0100] Figures 7(a) to 7(g) are cross-sectional views illustrating a method for manufacturing a modified example of the molded body 1 in this embodiment. First, as shown in Figure 7(a), a first conductive layer 31 is formed on the release film 200, and a resist layer 22 is formed on the release film 200 so as to cover the formed first conductive layer 31.

[0101] Next, as shown in Figure 7(b), the reinforcing substrate 12 is bonded to the resist layer 22. The reinforcing substrate 12 is bonded to the position corresponding to the tail portion 1b. Next, an adhesive layer 21 is formed on the resist layer 22.

[0102] Next, the molded substrate 11 is bonded to the adhesive layer 21. This molded substrate 11 is larger in size than the molded substrate 11 used in the first manufacturing method described above, and a portion of the molded substrate 11 overlaps with the reinforcing substrate 12.

[0103] Next, as shown in Figure 7(c), the release film 200 is peeled off from the first conductive layer 31 and the resist layer 22, and the first conductive layer 31 and the resist layer 22 are transferred to the molded substrate 11 and the reinforcing substrate 12. The steps shown in Figures 7(a) to 7(c) correspond to an example of the "first step" in an embodiment of the present invention. Furthermore, the step of peeling off the release film 200 corresponds to an example of the "fourth step" in an embodiment of the present invention.

[0104] Next, as shown in Figure 7(d), the molded base material 11 is molded using a molding die 300 to form a three-dimensional shape 1c, as shown in Figure 7(e). This step corresponds to an example of the "second step" in the embodiment of the present invention. Also, as shown in Figure 7(e), after molding, unnecessary parts of the molded base material 11 are removed by trimming or the like.

[0105] Next, as shown in Figure 7(f), a second conductive layer 32 is formed on the first conductive layer 31 by electroplating. The process shown in Figure 7(f) corresponds to an example of the "third step" in an embodiment of the present invention.

[0106] Next, as shown in Figure 7(g), the first and second insulating layers 41 and 42 are formed on the resist layer 22 so as to cover the second conductive layer 32. Then, a third conductive layer 33 is formed on the second conductive layer 32 inside the notch 421 (see Figure 2) of the second insulating layer 42. In this way, the molded body 1 according to the modified example is manufactured.

[0107] In this modified example, the first conductor layer 31, the bonding layer 20, and the molded substrate 11 are formed into a three-dimensional shape, and then the second conductor layer 32 is formed by electroplating. Therefore, since the second conductor layer 32 is formed into a three-dimensional shape following the first conductor layer 31 without being subjected to heat and pressure during the molding process, no wire breakage occurs in the second conductor layer 32 due to distortion that occurs during molding.

[0108] 1...Molded body 1a...Main body 1c...Three-dimensional shape 1b...Tail part 10...Support 11...Molding base material 12...Reinforcement base material 20...Bonding layer 21...Adhesive layer 22...Resist layer 30...Wiring part 31...First conductor layer 32...Second conductor layer 33...Third conductor layer 40...Insulating layer 41...First insulating layer 42...Second insulating layer 421...Notch 200...Release film 300...Molding die

Claims

1. A molded body comprising a support, a conductive wiring portion, and a bonding layer for bonding the wiring portion and the support, wherein the support includes a molded base material formed into a three-dimensional shape and a flexible reinforcing base material, and the wiring portion includes a first conductor layer bonded to the bonding layer and comprising a binder resin and a plurality of conductive particles dispersed in the binder resin, and a second conductor layer formed on the first conductor layer and composed of a first metal material.

2. A molded body according to claim 1, wherein the electrical resistivity of the second conductor layer is less than the electrical resistivity of the first conductor layer.

3. A molded body according to claim 1 or 2, wherein the second conductive layer covers the entire area of ​​the first conductive layer in a plan view.

4. A molded article according to any one of claims 1 to 3, wherein the elongation at break of the first conductor layer is greater than the elongation at break of the second conductor layer.

5. A molded body according to any one of claims 1 to 4, wherein the wiring portion is formed in the portion of the second conductor layer corresponding to the reinforcing substrate and further comprises a third conductor layer made of a second metal material different from the first metal material.

6. A molded body according to any one of claims 1 to 5, wherein the thickness of the reinforcing base material is thinner than the thickness of the molded base material.

7. A molded body according to any one of claims 1 to 6, wherein the molded body further comprises a first insulating layer disposed in the bonding layer in a portion corresponding to the molded substrate so as to cover the second conductive layer.

8. A molded body according to any one of claims 1 to 7, wherein the molded body further comprises a flexible second insulating layer disposed in the bonding layer in a portion corresponding to the reinforcing substrate so as to cover the second conductor layer.

9. A method for manufacturing a molded body, comprising: a first step of preparing a film member comprising: a first conductor layer comprising a binder resin and a plurality of conductive particles dispersed in the binder resin; a bonding layer bonded to the first conductor layer; a molded substrate bonded to the bonding layer; and a flexible reinforcing substrate bonded to the bonding layer; a second step of molding the molded substrate into a three-dimensional shape; and a third step of forming a second conductor layer made of a first metal material on the first conductor layer by electroplating.

10. A method for manufacturing a molded article according to claim 9, wherein the first step includes forming the first conductive layer and the bonding layer on a release film, and the method for manufacturing a molded article further comprises a fourth step of peeling the release film from the first conductive layer and the bonding layer.

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