Package for housing optical element, electronic device, and electronic module

Abstract

The present invention improves a heat dissipation property. A package (10) for housing an optical element has a metal plate (2) and a wiring board (3). The metal plate (2) includes: a mounting region (23) on which an optical element (70) is mounted; and an extension section (26) that, in plan view, extends from the wiring board (3) in a first direction. The wiring board (3) has a first base part (312) that is located in a section of the periphery of the mounting region (23) and that is open at least in the first direction when viewed from the mounting region (23).

Description

Package for housing an optical element, electronic device, and electronic module

[0001] The present disclosure relates to a package for housing an optical element, an electronic device, and an electronic module.

[0002] As a package for housing a side-emitting optical element, for example, the packages described in Patent Document 1, Patent Document 2, and Patent Document 3 are known as the prior art.

[0003] Japanese Patent Application Laid-Open No. 2004-259860 International Publication WO2017 / 183638 Japanese Patent Application Laid-Open No. 2001-119094

[0004] The package for housing an optical element according to one aspect of the present disclosure includes a metal plate having a first upper surface and a first lower surface opposite to the first upper surface, the metal plate having a mounting region on the first upper surface on which the optical element is mounted, and a wiring board having connection electrodes electrically connected to the optical element. The wiring board has a first base portion located on a part of the periphery of the mounting region on the first upper surface and having at least a first direction opened as viewed from the mounting region. The metal plate has an extending portion extending in the first direction from the wiring board in a plan view.

[0005] The electronic device according to one aspect of the present disclosure includes the package for housing an optical element, at least one optical element located in the mounting region, and an optical member that adjusts light emitted from the optical element.

[0006] The electronic module according to one aspect of the present disclosure is configured by connecting a plurality of the electronic devices.

[0007] This is a perspective view of an electronic device according to Embodiment 1. This is an exploded perspective view of a package according to Embodiment 1. This is a bottom perspective view of a wiring board according to Embodiment 1. This is a bottom view of a package according to Embodiment 1. This is a side view showing an example of mounting when the electronic device according to Embodiment 1 is mounted on a mounting board. This is a bottom perspective view of another embodiment of the wiring board according to Embodiment 1. This is an exploded perspective view of a package according to Embodiment 2. This is a top view of a package according to Embodiment 3. This is an exploded perspective view of a package according to Embodiment 4. This is a perspective view of a package according to Embodiment 5. This is a side view showing an example of mounting when the electronic device according to Embodiment 5 is mounted on a mounting board. This is a perspective view of a package according to Embodiment 6. This is an exemplary top view of a wiring board according to Embodiment 7. This is an exemplary top view of a wiring board according to Embodiment 7. This is an exemplary top view and cross-sectional view of a wiring board according to Embodiment 7. This is a perspective view of an electronic module according to Embodiment 8. This is a perspective view of an electronic device according to Embodiment 9. This is a perspective view of a package according to Embodiment 10. This is a bottom view of a package according to Embodiment 10. This is a side view showing an example of mounting when the electronic device according to Embodiment 10 is mounted on a mounting board. This is a perspective view of a package according to Embodiment 11. This is a bottom view of a package according to Embodiment 11. This is a side view showing an example of how the electronic device according to Embodiment 11 is mounted on a mounting substrate.

[0008] Optical elements tend to generate heat, so further improvements in heat dissipation are desired.

[0009] According to one aspect of this disclosure, heat dissipation can be improved.

[0010] [Embodiment 1] Hereinafter, an optical element housing package, electronic device, and electronic module according to one embodiment of the present disclosure will be described in detail with reference to the drawings. However, for the sake of convenience of explanation, the drawings referred to below may show only the components necessary for describing the embodiment in a simplified manner. Accordingly, the substrate, element housing package, and electronic device according to each embodiment may include any components not shown in the drawings referred to. Also, please note that the dimensions of the components in each drawing do not faithfully represent the dimensions of the actual components and the dimensional ratios of each component. In this specification, the term "plane" means that it is not a curved surface at a visible level, or that it does not have visible irregularities, and does not require that it be strictly flat.

[0011] The distinction between top and bottom in the following description is for convenience only and does not limit the actual orientation of the optical element housing package, electronic device, and electronic module when they are used. In this specification, in the metal plate of the optical element housing package, the surface on which the element is mounted is defined as the top surface. In the attached drawings, the X-Y plane is a plane parallel to the top or bottom surface of the metal plate, and the Z axis is an axis perpendicular to the X-Y plane. The positive X-axis direction is the emission direction of the optical element mounted on the metal plate. The positive X-axis direction is the first direction as defined in this disclosure, and the negative X-axis direction is the second direction as defined in this disclosure. The thickness direction of the optical element housing package, electronic device, and electronic module is the Z-axis direction, the length direction is the X-axis direction, and the width direction is the Y-axis direction.

[0012] In this disclosure, the term "rectangular" is not limited to a strictly rectangular shape; for example, it may include shapes where the corners are curved, but which are visually recognizable as rectangular overall. In the drawings of this disclosure, the surface of the insulating substrate is colored gray, and dots are marked on the exposed surfaces of the wiring conductor, metal film M, conductive bonding material Bx, and bonding material By. In addition, the bonding materials used to join each component may not be shown in the illustration.

[0013] The package 10 and electronic device 100 according to Embodiment 1 will be described with reference to Figures 1 to 6. Figure 1 is a perspective view of the electronic device 100 according to Embodiment 1. Figure 2 is an exploded perspective view of the package 10 according to Embodiment 1. Figure 3 is a bottom perspective view of the wiring board 3 according to Embodiment 1. Figure 4 is a bottom view of the package 10. Figure 5 is a side view showing an example of mounting when the electronic device 100 is mounted on a mounting board. Figure 6 is a bottom perspective view of another embodiment of the wiring board 3.

[0014] As shown in Figure 1, the electronic device 100 comprises a package 10 and an element 70. The package 10 is an example of an optical element housing package according to the present disclosure. The package 10 comprises a metal plate 2 having a mounting area 23 on which the element 70 is mounted, and a wiring board 3 having a wiring conductor 32. The wiring board 3 is located in a part of the periphery of the mounting area 23. More specifically, the wiring board 3 is positioned on the metal plate 2 so as to surround the mounting area 23, but the wiring board 3 is open at least in a first direction, which is the direction in which light is emitted from the element 70. Each part will be described in detail below.

[0015] The element 70 according to this disclosure may be, for example, a light-emitting element such as an LED (Light Emitting Diode) or an LD (Laser Diode). More specifically, the element 70 may be an end-face emitting type LD element.

[0016] Package 10 is an element housing package for housing the element 70, and the electronic device 100 is a device in which the element 70 is mounted in package 10. A submount (not shown) may be located between the element 70 and the metal plate 2. The submount may be used for purposes such as improving the mountability of the element and fine-tuning its height. In this case, the submount may be made of a material with good thermal conductivity, such as aluminum nitride. In addition to the element 70, the package 10 may also contain optical components for adjusting the light emitted from the element 70, a drive circuit, a capacitor, a photodetector, and other components.

[0017] The metal plate 2 has a first upper surface 2TS and a first lower surface 2BS opposite to the first upper surface 2TS, and has a mounting area 23 on the first upper surface 2TS on which the element 70 is mounted. The mounting area 23 may be an area on the first upper surface 2TS that overlaps with the element 70 mounted on the mounting area 23. When a submount is placed between the element 70 and the metal plate 2, the mounting area 23 may be an area on the first upper surface 2TS that overlaps with the submount. Alternatively, the mounting area 23 may be located on the first upper surface 2TS and be an area enclosed by imaginary lines connecting alignment marks used when positioning the element 70 or submount to be mounted on the mounting area 23. The first lower surface 2BS is the surface that faces the mounting substrate when mounted on an external substrate.

[0018] Furthermore, as shown in Figures 1 and 2, the metal plate 2 has a main portion 25 and an extended portion 26. The main portion 25 is the part that overlaps with the substrate region 3AR, which is the virtual outer edge when the wiring board 3 is considered as a rectangle as shown in Figure 2, in a plan view. Alternatively, the main portion 25 may be the part located to the side of the second base portion 313 of the wiring board 3, which will be described later. The extended portion 26 is the part that extends from the wiring board 3 in a first direction in a plan view, in other words, the part that extends from the substrate region 3AR in a first direction (positive X-axis direction). As shown in Figures 1 and 2, the metal plate 2 may have a rectangular plate shape when viewed from above, with the X-axis direction being the longer side direction.

[0019] An optical member 71 that adjusts the light emitted from the element 70 can be arranged in the extended portion 26. Examples of optical members 71 include, but are not limited to, lenses for focusing light, prisms or mirrors for changing the direction of light, and optical fibers. Figure 1 shows an example where the optical member 71 is arranged near the element 70, but because the extended portion 26 extends, the optical member 71 can be arranged on the same plane as the mounting area 23 of the element 70 even at a position far from the element 70, as shown in Figure 17. Furthermore, the metal plate 2 can have its first upper surface 2TS made into a highly accurate plane by known metal processing techniques. Therefore, by arranging the optical member 71 on the same plane as the mounting area 23, the accuracy of the relative position between the element 70 and the optical member 71 can be improved. In other words, the optical axis of the element 70 can be precisely aligned with the optical member 71.

[0020] The metal plate 2 dissipates heat generated from the element 70 to the mounting substrate. Because the metal plate 2 has an extended portion 26 that extends from the wiring substrate 3, its area when viewed from above is larger than in the case where the extended portion 26 is not present. Since the metal plate 2 has a mounting area 23 and a large surface area, the heat generated by the element 70 can be efficiently dissipated to the mounting substrate. As a result, the package 10 can achieve very high heat dissipation performance.

[0021] The metal plate 2 may be made of a material with high thermal conductivity, such as Cu, Cu-W alloy, Fe-Ni alloy, or Fe-Ni-Co alloy as its main component. Cu has very high thermal conductivity and excellent heat dissipation properties. Cu-W alloy, Fe-Ni alloy, and Fe-Ni-Co alloy have high thermal conductivity while having a small difference in thermal expansion coefficient with ceramics. When the insulating substrate 31, which will be described later, is made of ceramics, selecting these metals can reduce the stress caused by the difference in thermal expansion.

[0022] The metal plate 2 may have one or more through holes 24 extending from the first upper surface 2TS to the first lower surface 2BS at a corner or near the outer edge of the metal plate 2. These through holes 24 can be used as screw holes when mounting the package 10 onto a mounting substrate. By having through holes 24, it is possible to fix the package 10 to the mounting substrate using screws, thereby improving the bonding strength to the mounting substrate. When fixing the package 10 to the mounting substrate with screws, it may be fixed by screws alone, or a bonding material may be further used to bond the metal plate 2 and the mounting substrate. When fixing with screws alone, a large-area ground pattern or the like may be provided on the mounting substrate side to improve heat dissipation.

[0023] The wiring board 3 comprises an insulating substrate 31 and wiring conductors 32. The wiring board 3 also has a second upper surface 3TS and a second lower surface 3BS located opposite the second upper surface 3TS.

[0024] The insulating substrate 31 has a first base portion 312. The first base portion 312 is a part of the insulating substrate 31 located on the first upper surface 2TS of the metal plate 2, within a portion of the periphery of the mounting area 23. The first base portion 312 has a shape that surrounds the mounting area 23 when viewed from above, but is open in at least the first direction (positive X-axis direction) when viewed from the mounting area 23.

[0025] Specifically, the first base portion 312 may have a shape in which, in a plan view, one of the four sides forming a rectangle, located in the first direction, is open, as shown in Figure 1. Alternatively, the first base portion 312 may be U-shaped in a plan view. In a plan view, the outer edges of the first base portion 312 corresponding to the sides other than the side located in the first direction may be located outside the outer edge of the metal plate 2.

[0026] The insulating substrate 31 may further have a second base portion 313 located below the first base portion 312 and to the side of the metal plate 2. In a wiring board 3 having the second base portion 313, the upper surface of the first base portion 312 is the second upper surface 3TS of the wiring board 3, and the lower surface of the second base portion 313 is the second lower surface 3BS of the wiring board 3. The lower surface of the first base portion 312 is a surface located on a plane that includes the first upper surface 2TS of the metal plate 2. In addition, in a package 10 having the second base portion 313, at least a portion of the side surface of the metal plate 2 is covered by the second base portion 313. The second base portion 313 may be composed of two members 313A and 313B that sandwich the metal plate 2 in the width direction (Y direction), for example, as shown in Figure 3. The second base portion 313 can restrict the relative position of the metal plate 2 with respect to the first base portion 312 in the width direction (Y direction) by sandwiching the metal plate 2 in that direction. In other words, the presence of the second base portion 313 in the insulating substrate 31 can reduce the misalignment of the relative position of the metal plate 2 with respect to the wiring board 3.

[0027] The thickness of the second base portion 313 may be the same as the thickness of the metal plate 2. In other words, as shown in Figure 5, the lower surface of the second base portion 313, i.e., the second lower surface 3BS of the wiring board 3, may be flush with the first lower surface 2BS of the metal plate 2. In this case, it is not required that the second lower surface 3BS and the first lower surface 2BS be exactly flush, and a slight misalignment is acceptable. The flushness of the second lower surface 3BS with the first lower surface 2BS facilitates surface mounting.

[0028] Alternatively, the thickness of the second base portion 313 may be thinner than the thickness of the metal plate 2. In other words, the second lower surface 3BS may be located above the first lower surface 2BS.

[0029] The insulating substrate 31 may be a ceramic such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. The insulating substrate 31 may include a plurality of laminated insulating layers. The first base portion 312 and the second base portion 313 may be integrally formed.

[0030] Figure 6 shows another embodiment of the wiring board 3. As shown in Figure 6, the second base portion 313 of the wiring board 3 may have a notch 313C that opens facing the side surface of the metal plate 2. The metal plate 2 and the wiring board 3 can be joined using a bonding material such as brazing material or glass. By having the notch 313C in the second base portion 313, the possibility of the bonding material located between the lower surface 312BS of the first base portion 312 and the metal plate 2 spreading toward the mounting area 23 can be reduced. When joining using brazing material, a bonding metal film M may be provided on the lower surface 312BS of the first base portion 312. The bonding metal film M may also be provided on the inner surface of the second base portion 313 and the surface facing the metal plate 2.

[0031] The wiring conductor 32 includes at least one connecting electrode 321 located on the second upper surface 3TS and electrically connected to the element 70, and a plurality of external electrodes 322 located on the outer surface of the insulating substrate 31 and connected to the terminals of the mounting board. As shown in Figure 1, the wiring conductor 32 may further have an electrode located on the second upper surface 3TS and connected to a metal plate 2 as a ground electrode. The wiring conductor 32 may further include an internal wiring layer and a through conductor as internal conductors located inside the insulating substrate 31.

[0032] In the wiring board 3 of Embodiment 1, the external electrode 322 may be located on the second lower surface 3BS, as shown in Figures 3 and 5. Because the external electrode 322 is located on the second lower surface 3BS of the wiring board 3 having the second base portion 313, the external electrode 322 and the electrode 501 of the mounting substrate 50 can be joined via a conductive bonding material Bx, such as solder, as shown in Figure 5. The metal plate 2 can be joined to the mounting substrate 50 using bonding material By. The metal plate 2 may be connected to a land 502 at ground potential on the mounting substrate 50. To facilitate the transfer of heat from the metal plate 2 to the mounting substrate 50, the bonding material By may be a resin or silver paste with good thermal conductivity. Alternatively, the conductive bonding material Bx and the bonding material By may be the same bonding material.

[0033] The electrode 501 connected to the external electrode 322 may have a shape that extends outward from a position overlapping with the external electrode 322 when viewed from above. This allows excess solder to be guided outward, reducing the possibility of a short circuit between the conductive bonding material Bx and the bonding material By.

[0034] Alternatively, in the wiring board 3 of Embodiment 1, the external electrode 322 may be located on the second upper surface 3TS. In this case, the external electrode 322 located on the second upper surface 3TS and the electrode 501 of the mounting board 50 can be connected by wire bonding or the like.

[0035] In the wiring board 3, if the thickness of the second base portion 313 is thinner than the thickness of the metal plate 2, the second lower surface 3BS of the wiring board 3 is located above the first lower surface 2BS of the metal plate 2. Alternatively, even if the wiring board 3 does not have a second base portion 313 and at least a part of the wiring board 3 is located outside the metal plate 2 when viewed from below, the second lower surface 3BS is located above the first lower surface 2BS. In these embodiments, if the height difference between the second lower surface 3BS and the first lower surface 2BS is small, the external electrode 322 can be connected to the electrode 501 of the mounting board 50 by a conductive bonding material Bx. On the other hand, if the height difference is large, a solder ball or a conductive pin may be used to connect the external electrode 322 to the terminal of the mounting board.

[0036] The metal film for joining the metal plate provided on the lower surface 312BS of the wiring conductor 32 and the first base portion 312 may be a metal powder metallized material containing, for example, tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu).

[0037] The exposed surfaces of the wiring conductor 32 and the metal film may be coated with a nickel plating layer / gold plating layer as a metal plating layer by a plating method such as electroplating or electroless plating. This effectively reduces corrosion of the wiring conductor and the like. It also improves the wettability of the bonding material, thereby improving the bonding strength. The metal plating layer is not limited to a nickel plating layer / gold plating layer, but may also include other metal plating layers such as a nickel plating layer / palladium plating layer / gold plating layer.

[0038] (Manufacturing method for a wiring board) When the insulating substrate 31 includes multiple insulating layers made of, for example, an aluminum oxide sintered body, the insulating substrate 31 is manufactured as follows: A slurry is produced by adding and mixing a suitable organic binder and solvent to raw material powders such as aluminum oxide and silicon oxide. This slurry is formed into a sheet using a doctor blade method or a calender roll method to produce a ceramic green sheet for the insulating layer. Furthermore, the ceramic green sheet for the insulating layer is subjected to a suitable punching process to form a first base portion 312 and a second base portion 313, etc. Then, multiple ceramic green sheets for the insulating layer are stacked to produce a laminate. After that, the insulating substrate 31 is manufactured by firing the laminate at a high temperature (approximately 1300 to 1600°C).

[0039] If the wiring conductor 32 is, for example, a tungsten metallized layer, it can be formed as follows. The wiring layer is formed by printing a metal paste, made by mixing tungsten powder with an organic solvent and an organic binder, onto a predetermined position on a ceramic green sheet for the insulating layer using a method such as screen printing, and then firing the laminate. The wiring layer refers to the connecting electrode 321, the external electrode 322, the internal wiring layer of the internal conductor, etc. The through-conductor of the internal conductor is formed by making holes for the through-conductor at predetermined positions on the ceramic green sheet for the insulating layer and filling the holes for the through-conductor with metal paste. The bonding metal film provided on the lower surface 312BS of the first base portion 312 is formed by applying metal paste to the inner surface of the holes at predetermined positions on the ceramic green sheet for the insulating layer.

[0040] [Embodiment 2] Another embodiment of the present disclosure is described below. For convenience of explanation, components having the same function as those described in the above embodiments are denoted by the same reference numerals, and their descriptions are not repeated.

[0041] Figure 7 is an exploded perspective view of package 10A according to Embodiment 2. Package 10A includes a metal plate 2A and a wiring board 3. As shown in Figure 7, the length of the extended portion 26 in the width direction (Y-axis direction) of the metal plate 2A may be greater than the length of the main portion 25 in the width direction. With this configuration, the area of ​​the metal plate 2A can be increased even if the length is the same compared to the metal plate 2 of Embodiment 1, thus further improving heat dissipation. In Figure 7, the second base portion 313 is located to the side of the main portion 25, which improves the positional accuracy of the metal plate 2A relative to the wiring board 3. The metal plate 2A shown in Figure 7 may also be applied to a wiring board that does not have a second base portion 313. Even if the second base portion 313 is not located to the side of the main portion 25, heat dissipation can be improved by making the metal plate 2A such that the length of the extended portion 26 in the width direction is greater than the length of the main portion 25 in the width direction.

[0042] Furthermore, because the extension portion 26 is wider than the main portion 25, the movement of the extension portion 26 in the negative X-axis direction is restricted by the second base portion 313. This improves the accuracy of the relative position of the metal plate 2A with respect to the wiring board 3.

[0043] [Embodiment 3] Figure 8 is a plan view of package 10B according to Embodiment 3. Package 10B includes a metal plate 2B and a wiring board 3. As shown in Figure 8, package 10B may have a second extended portion 27 in a plan view that extends from the wiring board 3 in a second direction (negative X-axis direction) opposite to the first direction (positive X-axis direction). By having a second extended portion 27 in addition to the extended portion 26, the heat transfer area is expanded from the mounting area 23 to the second direction as well, further improving heat dissipation.

[0044] [Embodiment 4] FIG. 9 is an exploded perspective view of a package 10C according to Embodiment 4. The package 10C includes a metal plate 2C and a wiring board 3. As shown in the package 10C in FIG. 9, the length in the width direction of the extending portion 26 and the second extending portion 27 may be greater than the length in the width direction of the main portion 25. With this configuration, the heat dissipation performance is further improved. In FIG. 9, since the second base portion 313 is located on the side of the main portion 25, the positional accuracy of the metal plate 2C with respect to the wiring board 3 is improved. The metal plate 2C shown in FIG. 9 may be applied to a wiring board that does not have the second base portion 313. Even when the second base portion 313 is not provided on the side of the main portion 25, by using a metal plate 2C in which the length in the width direction of the extending portion 26 and the second extending portion 27 is greater than the length in the width direction of the main portion 25, the heat dissipation performance can be improved.

[0045] In addition, since the extending portion 26 and the second extending portion 27 are wider than the main portion 25, the movement of the extending portion 26 in the X-axis direction is restricted by the second base portion 313. Thereby, the accuracy of the relative position of the metal plate 2C with respect to the wiring board 3 can be improved.

[0046] [Embodiment 5] FIG. 10 is a perspective view of a package 10D according to Embodiment 5. FIG. 11 is a side view showing an example of mounting when an electronic device 100D including the package 10D is mounted on a mounting board.

[0047] The package 10D includes a metal plate 2D and a wiring board 3D. The metal plate 2D has a rectangular shape in a plan view. The wiring board 3D is different from the wiring board 3 in that it does not have the second base portion 313 as compared with the wiring board 3 of Embodiment 1. In the package 10D, the second lower surface 3BS of the wiring board 3D is joined to the first upper surface 2TS of the metal plate 2. In the package 10D, the side surface of the metal plate 2D is not covered by the wiring board 3D.

[0048] In package 10D, the external electrode 322 may be located on the second upper surface 3TS of the wiring board 3D. The external electrode 322 located on the second upper surface 3TS and the electrode 501 of the mounting board 50 can be connected by wire bonding as shown in FIG. 11. With this configuration, since the bonding area between the metal plate 2D and the land 502 of the mounting board 50 can be increased, the bonding strength and reliability can be improved. Also, even when the package 10D is miniaturized, on the mounting board 50, the electrode 501 and the metal plate 2D (land 502) can be separated, so the possibility of a short circuit between them can be reduced.

[0049] [Embodiment 6] FIG. 12 is a perspective view of a package 10E according to Embodiment 6. The package 10E has a metal plate 2E and a wiring board 3E. The metal plate 2E may have a rectangular shape in plan view. Alternatively, as shown in FIG. 7, the metal plate 2E may have a shape in which the length in the width direction of the extension portion 26 is larger than the length in the width direction of the main portion 25. Similar to the wiring board 3D of FIG. 12, the first base portion 312 may be open not only in the first direction but also in the second direction. Also, the second base portion 313 may have a shape in which one side located in the first direction among the four sides forming a rectangle is open, or a U shape.

[0050] The element 70 may also emit light slightly in the direction opposite to the emission direction. By having a configuration in which the first base portion 312 surrounding the mounting region 23 is also open in the second direction opposite to the first direction, the light emitted in the second direction is reflected by the inner wall of the wiring board 3 and returns to the element 70, and the possibility of interference with the emitted light can be reduced. Thereby, the quality of the electronic device using the package 10E can be improved.

[0051] Also, since a part of the second base portion 313 is located in the second direction of the metal plate 2E, the movement of the metal plate 2E in the negative X-axis direction is restricted. Thereby, the accuracy of the relative position of the metal plate 2E with respect to the wiring board 3E can be improved.

[0052] [Embodiment 7] In Embodiment 7, another aspect regarding the first base portion 312 of the wiring board 3 of Embodiment 1 will be described.

[0053] Figure 13 is a plan view of the wiring board 3F1 according to Embodiment 7. Figure 14 is a plan view of the wiring board 3F2 according to Embodiment 7. Figure 15 is a plan view and a cross-sectional view of the wiring board 3F3 according to Embodiment 7. The figure indicated by reference numeral 1501 in Figure 15 is a plan view of the wiring board 3F3, and the figure indicated by reference numeral 1502 is a cross-sectional view of the wiring board 3F3 taken along the arrow.

[0054] The wiring boards 3F1 to 3F3 differ from the wiring board 3 of Embodiment 1 in the shape of the inner wall located in the second direction of the first base portion 312.

[0055] As shown in Figures 13, 14, and 15, the inner wall located in the second direction of the first base portion 312 may be inclined. For example, as shown in the wiring board 3F1 in Figure 13, the inner wall located in the second direction may be perpendicular to the second upper surface 3TS and inclined with respect to the Y-axis direction. Alternatively, as shown in the wiring board 3F2 in Figure 14, the inner wall located in the second direction may have multiple surfaces that are perpendicular to the second upper surface 3TS and inclined with respect to the Y-axis direction. Alternatively, as shown in Figure 15, the inner wall located in the second direction may be inclined with respect to the second upper surface 3TS.

[0056] Furthermore, the inner walls of the first base portion 312 in the wiring boards 3F1 to 3F3 that are located in the second direction may be flat, curved, convex, or concave. In other words, the inner wall surface located in the second direction from the element 70 does not need to be perpendicular to the second direction. Also, the portion that is not perpendicular to the second direction does not need to be the entire inner wall surface.

[0057] With this configuration, the light emitted in the second direction is reflected back to the inner wall of the wiring board 3 and returned to the element 70, reducing the possibility of interference with the emitted light. This improves the quality of the electronic device.

[0058] [Embodiment 8] Figure 16 is a perspective view of the electronic module 200 according to Embodiment 8.

[0059] The electronic module 200 is composed of multiple electronic devices 100 connected together. Each electronic device 100 may be a device that mounts one element 70. Furthermore, the elements 70 mounted on the multiple connected electronic devices 100 may each emit light of a different wavelength.

[0060] [Embodiment 9] Figure 17 is a perspective view of the electronic device 100A according to Embodiment 9. The electronic device 100A differs from the electronic device 100 of Embodiment 1 in that it has multiple elements 70 mounted on it. As with the electronic device 100A, multiple elements 70 may be mounted on a single package. This makes it possible to miniaturize the electronic device 100A.

[0061] [Embodiment 10] Figure 18 is a perspective view of the package 10G according to Embodiment 10. Figure 19 is a bottom view of the package 10G. Figure 20 is a side view showing an example of mounting when the electronic device 100G according to Embodiment 10 is mounted on a mounting substrate.

[0062] Package 10G comprises a metal plate 2G and a wiring board 3G. Unlike the wiring board 3D of Embodiment 5 shown in Figure 10, the wiring board 3G does not have a second base portion 313, and the sides of the metal plate 2G are not covered by the wiring board 3G.

[0063] Package 10G differs from package 10D shown in Figure 10 in that, in a plan view, the widthwise length of the wiring board 3G is greater than the widthwise length of the metal plate 2G. Such package 10G may have pins P for bonding to the mounting substrate 50. In this way, even when there is a large difference in height between the second lower surface 3BS of the wiring board 3G and the first lower surface 2BS of the metal plate 2G, bonding strength and reliability can be improved by mounting using conductive pins P. Furthermore, notches 29 may be provided in the metal plate 2G to accommodate the pins P. This makes it possible to miniaturize package 10G.

[0064] [Embodiment 11] Figure 21 is a perspective view of the package 10H according to Embodiment 11. Figure 22 is a bottom view of the package 10H. Figure 23 is a side view showing an example of mounting when the electronic device 100H according to Embodiment 11 is mounted on a mounting substrate.

[0065] Package 10H comprises a metal plate 2H and a wiring board 3H. Unlike the wiring board 3D of Embodiment 5 shown in Figure 10, the wiring board 3H does not have a second base portion 313, and the sides of the metal plate 2H are not covered by the wiring board 3H. Furthermore, the widthwise lengths of the wiring board 3G and the metal plate 2H are approximately the same.

[0066] The metal plate 2D of Embodiment 5 and the metal plate 2H of this embodiment differ in that the metal plate 2H has a notch or hole for passing a pin P through. The presence of a notch or hole in the metal plate 2H makes it possible to connect using a pin P.

[0067] [Summary] (1) The optical element housing package according to Embodiment 1 of the present disclosure comprises a metal plate having a first upper surface and a first lower surface opposite to the first upper surface, the first upper surface having a mounting area on which an optical element is mounted, and a wiring board having connecting electrodes electrically connected to the optical element, wherein the wiring board has a first base portion on the first upper surface located in a part of the periphery of the mounting area and is open in at least a first direction when viewed from the mounting area, and the metal plate has an extended portion in a plan view that extends from the wiring board in a first direction.

[0068] (2) In the optical element housing package according to embodiment 2 of the present disclosure, the wiring board has a second base located below the first base and to the side of the metal plate, in embodiment 1 above.

[0069] (3) In the optical element housing package according to embodiment 3 of the present disclosure, in embodiment 2, the wiring board has a second upper surface and a second lower surface opposite to the second upper surface, and an external electrode for connecting to the outside is located on the second lower surface.

[0070] (4) In the optical element housing package according to embodiment 4 of the present disclosure, in embodiment 2 or 3, the second base portion has a notch that opens facing the side surface of the metal plate.

[0071] (5) In any of the embodiments 2 to 4, the optical element housing package according to embodiment 5 of the present disclosure has a main portion located to the side of the second base, and if the width direction is defined as the direction parallel to the first upper surface and perpendicular to the first direction, the length in the width direction of the extended portion is greater than the length in the width direction of the main portion.

[0072] (6) In any of embodiments 2 to 5, the optical element housing package according to embodiment 6 of the present disclosure has a second extended portion that extends in a second direction opposite to the first direction from the wiring substrate in a plan view.

[0073] (7) In the optical element housing package according to embodiment 7 of the present disclosure, in embodiment 6, the metal plate has a main portion located to the side of the second base portion, and if the width direction is defined as the direction parallel to the first upper surface and perpendicular to the first direction, the length in the width direction of the second extension portion is greater than the length in the width direction of the main portion.

[0074] (8) In the optical element housing package according to embodiment 8 of the present disclosure, the side surface of the metal plate is not covered by the wiring board in embodiment 1.

[0075] (9) In any of the embodiments 1 to 8, the optical element housing package according to embodiment 9 of the present disclosure has a second upper surface and a second lower surface opposite to the second upper surface, and an external electrode for connecting to the outside is located on the second upper surface.

[0076] (10) In any of the embodiments 1 to 9, the optical element housing package according to embodiment 10 of the present disclosure has a shape in which, in a plan view, one of the four sides forming a rectangle is open and located in the first direction.

[0077] (11) In the optical element housing package according to embodiment 11 of the present disclosure, in embodiment 10, the inner wall of the first base that is located in a second direction opposite to the first direction has an inclination.

[0078] (12) An electronic device according to embodiment 12 of the present disclosure comprises an optical element housing package according to any of embodiments 1 to 11, at least one optical element located in the mounting area, and an optical member for adjusting the light emitted from the optical element.

[0079] (13) The electronic module according to embodiment 13 of the present disclosure is configured by connecting a plurality of the electronic devices of embodiment 12 above.

[0080] [Additional Notes] The inventions described in this disclosure have been explained based on the drawings and embodiments. However, the inventions described in this disclosure are not limited to the embodiments described above. That is, the inventions described in this disclosure can be modified in various ways within the scope shown in this disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the inventions described in this disclosure. In other words, it should be noted that it is easy for those skilled in the art to make various modifications or alterations based on this disclosure. Furthermore, it should be noted that these modifications or alterations are included in the scope of this disclosure.

[0081] 2, 2A, 2B, 2C, 2D, 2E, 2G, 2H Metal plate 2BS 1st lower surface 2TS 1st upper surface 23 Mounting area 24 Through hole 25 Main part 26 Extension part 27 2nd extension part 3, 3D, 3E, 3F1, 3F2, 3F3 Wiring board 3AR Board area 3BS 2nd lower surface 3TS Second upper surface 31 Insulating base 312 First base 313 Second base 32 Wiring conductor 321 Connection electrode 322 External electrode 10, 10A, 10B, 10C, 10D, 10E, 10G, 10H Package (optical element storage package) 70 Element (optical element) 71 Optical member 100, 100A, 100D, 100G, 100H Electronic device 200 Electronic module

Claims

1. An optical element housing package comprising: a metal plate having a first upper surface and a first lower surface opposite the first upper surface, the first upper surface having a mounting area on which an optical element is mounted; and a wiring board having connecting electrodes electrically connected to the optical element, wherein the wiring board has a first base portion on the first upper surface located in a part of the periphery of the mounting area and is open in at least a first direction when viewed from the mounting area, and the metal plate has an extended portion extending in a first direction from the wiring board in a plan view.

2. The optical element housing package according to claim 1, wherein the wiring board has a second base located below the first base and to the side of the metal plate.

3. The optical element housing package according to claim 2, wherein the wiring board has a second upper surface and a second lower surface opposite to the second upper surface, and external electrodes for connection to the outside are located on the second lower surface.

4. The optical element housing package according to claim 2 or 3, wherein the second base portion has a notch that opens opposite to the side surface of the metal plate.

5. The optical element housing package according to any one of claims 2 to 4, wherein the metal plate has a main portion located to the side of the second base portion, and when the width direction is defined as the direction parallel to the first upper surface and perpendicular to the first direction, the length in the width direction of the extended portion is greater than the length in the width direction of the main portion.

6. The optical element housing package according to any one of claims 2 to 5, wherein the metal plate has a second extended portion that extends in a second direction opposite to the first direction from the wiring board in a plan view.

7. The optical element housing package according to claim 6, wherein the metal plate has a main portion located to the side of the second base portion, and when the width direction is defined as the direction parallel to the first upper surface and perpendicular to the first direction, the length in the width direction of the second extension portion is greater than the length in the width direction of the main portion.

8. The optical element housing package according to claim 1, wherein the side surface of the metal plate is not covered by the wiring board.

9. The optical element housing package according to any one of claims 1 to 8, wherein the wiring board has a second upper surface and a second lower surface opposite to the second upper surface, and external electrodes for connection to the outside are located on the second upper surface.

10. The optical element housing package according to any one of claims 1 to 9, wherein the first base portion has a shape in which, in a plan view, one of the four sides forming a rectangle is open and located in the first direction.

11. The optical element housing package according to claim 10, wherein the inner wall of the first base portion located in a second direction opposite to the first direction has an inclination.

12. An electronic device comprising: an optical element housing package according to any one of claims 1 to 11; at least one optical element located in the mounting area; and an optical member for adjusting the light emitted from the optical element.

13. An electronic module configured by linking together a plurality of electronic devices as described in claim 12.

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